JP2520920B2 - Manufacturing method of partially plated strip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to an improvement in a method for producing a partially plated strip used for a material for electric and electronic equipment parts and the like.

[Conventional technology]

In recent years, as metal strips used in wiring connection parts for electric and electronic equipment such as connectors, precious metals such as gold and silver or tin are required only on the surface of copper alloy for springs such as phosphor bronze and brass or stainless steel, that is, only electrical contact portions. Partial plating strips that are partially plated with solder are widely used.

Thus, the partial plating strip is conventionally wider than the width of the product manufactured through the steps such as hot rolling and cold rolling from the ingot, as shown in FIGS. 2 (a) and (b). The metal strip 6 is cut into a predetermined product width to form metal strips 61 and 62 (63 and 64 at both ends are usually treated as scraps because of poor dimensional accuracy), and then the metal strips thus obtained For each of 61 and 62, as shown in the case of the metal strip 61 in FIGS. 3 (a) to (c), a part of the metal strip, that is, a portion where plating is unnecessary, is previously coated with an adhesive on one side. It was manufactured by masking with the above-mentioned plastic tapes 2d and 2e for partial plating to obtain a predetermined partial plating layer 3a, and then mechanically peeling off the plastic tapes 2d and 2e.

[Problems to be solved by the invention]

As described above, in the conventional method for manufacturing a partially plated strip, after slitting a metal strip wider than the product width to a predetermined product width, the metal strips of the product width thus obtained are separately separated. Since partial plating was performed, the time required for plating work was long and the efficiency was poor.

In addition, the metal strip for the electric / electronic device parts material is usually 0.1 to 1 mm.
Since it is difficult to mask the side surface of the metal strip slit to the product width with a plastic tape, it is possible to attach the partial plating layer 3b to the side surface of the metal strip that does not require partial plating. There was a problem that it did.
That is, when the plating layer is a noble metal such as gold or silver, the formation of the partial plating layer 3b is extremely uneconomical, and when the plating layer is a soft substance such as solder, punching by a press in a later step. Practically unfavorable phenomena such as generation of abrasion powder due to contact with the guide during working occurred.

[Means for solving problems]

The present invention has been made as a result of earnest studies in view of the above points, and an object thereof is that the efficiency of partial plating is good, and there is no problem of unnecessary plating layer adhesion to the side surface of a metal strip, that is, inexpensive. It is to provide a method for manufacturing a partially plated strip which is practically advantageous.

That is, according to the present invention, a part of a metal strip wider than a metal strip having a product width is preliminarily plated, and at least one partially plated strip having a product width extending in the longitudinal direction of the metal strip is processed. Partial plating is carried out by masking with the above-mentioned plastic tape, and a partial plating strip wider than the product width thus obtained is slit to a predetermined product width with a part or all of the masking tape left. This is a method for manufacturing a partially plated strip, which is characterized by the fact.

Next, embodiments of the present invention will be specifically described with reference to the drawings. 1 (a) to 1 (d) are cross-sectional views showing an embodiment of the present invention, in which 1 is a metal strip wider than the product width, 1a is a copper alloy strip, 1b and 1c are gold alloys, 2a to 2c are plastic tapes, 3 are partially plated layers, 4b and 4c are partially plated strips, and 4a and 4d.
Chips 5 and partial plating strips 5 are wider than the product width. After partially masking the surface of the metal strip 1 wider than the product width of a copper alloy or the like with the plastic tapes 2a to 2c, plating is performed to obtain a partial plated strip 5 wider than the product width.
The masking tape 2c is peeled off from the surface of the partial plating strip 5 wider than the product width, and slit to a predetermined width to obtain the partial plating strips 4b and 4c having the product width. The reason why the masking tape 2c is peeled off here is to facilitate the work at the time of slitting, and the masking tape 2c may be slit while the masking tape 2c remains. Meanwhile masking tape
As for 2a and 2b, in order to prevent scratches due to a guide or the like at the time of slitting, it is necessary to slit them while leaving them. That is, in the method of the present invention, a metal strip wider than the product width is partially plated, and this is slit into a predetermined product width, so surface scratches and the like occur in the slitting step, and the yield of the product decreases. In order to prevent this, it is economically preferable to slit the masking tape in a state where the masking tape remains, particularly at a place where surface scratches are likely to occur. During the slit processing, 4a and 4d at both ends are usually treated as scraps because of poor dimensional accuracy.

The masking tapes 2a and 2b may be peeled off immediately after slitting, but in order to protect the surface of the partially-plated strip during storage and transportation, it is desirable that the masking tapes 2a and 2b remain until immediately after pressing in a subsequent step.

In particular, when the metal strip 1 wider than the product width is a so-called inlay strip in which the copper alloy strip 1a is partially clad with the gold alloys 1b, 1c, or a so-called gold strip strip in which gold is partially plated in a stripe shape is used. In the case of a composite strip, the method of the present invention is particularly advantageous in that it protects the soft gold alloy layer.
That is, these gold alloy layers are generally as thin as about 1 μm and are used as contact materials, so it is particularly important to protect the surface from contamination.

1 (a) to 1 (d) show a case of so-called two-piece production in which a metal strip having a width wider than one product is used to obtain a partial plating strip having two product widths. It is also possible to Further, in the case of a so-called single strip production in which one product width partial plating strip is obtained from the wide metal strip, the plating efficiency is about the same as the conventional method, but unnecessary plating layer on the side surface of the metal strip is removed. It has the advantage that there is no adhesion.

[Action]

In the method of the present invention, a part of the metal strip having a width wider than the product width is masked with a plastic tape in advance to carry out partial plating. With the masking tape left in place where surface scratches are likely to occur,
Since the partial plating strips are manufactured by slitting to a predetermined product width, the partial plating strips can be manufactured efficiently.
In addition, there is an advantage that unnecessary plating layer does not adhere to the side surface of the obtained partial plating strip and that the obtained product has no surface defect.

〔Example〕

Next, the present invention will be described more specifically by way of examples. As shown in FIGS. 1 (a) to (c), a part of a phosphor bronze strip (1) having a thickness of 0.2 mm and a width of 100 mm is preliminarily coated with an acrylic adhesive on one side of a polypropylene tape (2a to Masking with 2c), partial plating of 50 μm thick solder plating,
The partial plating strips 5 wider than the product width thus obtained were slit to manufacture partial plating strips 4b and 4c having a width of 45 mm. The method of the present invention, after slitting a metal strip wider than the product width to a predetermined product width, as compared with the conventional method of separately performing partial plating for each of the metal strips of the product width thus obtained, We were able to perform partial plating at about twice the plating speed. Further, since the solder plating layer is not formed on the side surface of the thus obtained partial plated strips 4b and 4c, there is no problem of generation of solder powder during the punching work by the press in the subsequent step.

〔The invention's effect〕

According to the method of the present invention, the efficiency of partial plating is improved, there is no problem of unnecessary plating layer adhesion to the side surface of the metal strip, etc., and it is possible to obtain a practically advantageous partial plating strip with high yield. It has a remarkable effect.

[Brief description of drawings]

1 (a) to 1 (d) are cross-sectional views showing an example of a method for manufacturing a partially plated strip according to the method of the present invention, and FIGS. 2 (a) to 2 (b).
3 (a) to 3 (c) are cross-sectional views showing a conventional method for producing a partially plated strip. 1 ... Wider metal strip than product width, 1a ... Copper alloy strip, 1
b, 1c …… Gold alloy, 2a ～ 2e …… Plastic tape,
3, 3a, 3b …… Partial plating layer, 4b, 4c …… Partial plating strip, 4a, 4d …… Scrap, 5 …… Partial plating strip wider than product width, 6 …… Metal wider than product width Strips, 61, 62 ... metal strips, 63, 64 ... scraps.

Claims (2)

(57) [Claims] 1. A metal strip which is wider than a metal strip having a product width is preliminarily plated, and then processed so that at least one partial strip having a product width extending in the longitudinal direction of the metal strip can be cut out. Partial plating is performed by masking with a plastic tape, and partial plating strips wider than the product width obtained in this way are slit to a predetermined product width with some or all of the masking tape left. A method for manufacturing a partially plated strip characterized by. 2. A method of slitting a partial plating strip, which is wider than the product width, to a predetermined product width, and then peeling off all or a part of the masking tape coated on the surface of the partial plating strip thus obtained. The method for producing a partially plated strip according to claim 1, which is characterized in that.