JP2515114Y2 - Temperature sensor - Google Patents

Temperature sensor

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Publication number
JP2515114Y2
JP2515114Y2 JP12416090U JP12416090U JP2515114Y2 JP 2515114 Y2 JP2515114 Y2 JP 2515114Y2 JP 12416090 U JP12416090 U JP 12416090U JP 12416090 U JP12416090 U JP 12416090U JP 2515114 Y2 JP2515114 Y2 JP 2515114Y2
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JP
Japan
Prior art keywords
heat
sensitive element
pair
temperature sensor
metal plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12416090U
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Japanese (ja)
Other versions
JPH0481023U (en
Inventor
準 神山
哲生 副田
Original Assignee
石塚電子株式会社
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Application filed by 石塚電子株式会社 filed Critical 石塚電子株式会社
Priority to JP12416090U priority Critical patent/JP2515114Y2/en
Publication of JPH0481023U publication Critical patent/JPH0481023U/ja
Application granted granted Critical
Publication of JP2515114Y2 publication Critical patent/JP2515114Y2/en
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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、被測定物に接触させて、その温度を検出す
る温度センサ、特に用紙上の未定着のトナー像を定着さ
せるために、複写機の内部に設けられた定着装置の回転
加熱定着ローラ等の被測定物に接触させて、その温度を
検出するような温度センサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a temperature sensor for detecting the temperature of an object to be measured and, in particular, for fixing an unfixed toner image on paper, copying is performed. The present invention relates to a temperature sensor for detecting the temperature of an object to be measured such as a rotating heating fixing roller of a fixing device provided inside the machine and detecting the temperature thereof.

〔従来の技術〕[Conventional technology]

従来のこの種の温度センサとしては、特開昭63-20553
0号公報記載の温度センサがある。
A conventional temperature sensor of this type is disclosed in Japanese Patent Laid-Open No. 63-20553.
There is a temperature sensor described in JP-A-0.

この温度センサは、第6図に示すように、保持体21,2
2に保持されていて、外部に接続するための外部引出部2
3a,24aを有する一対の帯状の金属板23,24の間隙に、感
熱素子25を該金属板23,24に接続して配設する。
This temperature sensor, as shown in FIG.
External drawer 2 that is held in 2 for connecting to the outside
A thermosensitive element 25 is arranged in the gap between a pair of strip-shaped metal plates 23, 24 having 3a, 24a, connected to the metal plates 23, 24.

この感熱素子25と金属板23,24の一面を薄膜シート26
で被覆すると共に、金属板23,24を前記保持体21,22に保
持させて、薄膜シート26を回転加熱定着ローラ等の被測
定物に接触させることによって被測定物の温度を感熱素
子25で測定していたものである。
A thin film sheet 26 is formed on one surface of the heat sensitive element 25 and the metal plates 23 and 24.
While being covered with, the metal plates 23, 24 are held by the holders 21, 22, and the thin film sheet 26 is brought into contact with an object to be measured such as a rotary heating fixing roller to measure the temperature of the object to be measured with the heat sensitive element 25. It was what was being measured.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

このような温度センサにおいては、回転加熱定着ロー
ラ40と接触する面の反対面は開放状態であり、感熱素子
25が薄膜シート26の面にしっかりと固定されていないた
め、感熱素子25が薄膜シート26から浮き上がる等によっ
て回転加熱定着ローラ40の熱を正確に測定できない、或
いは検知速度が遅い等の検知性能が劣っていた。
In such a temperature sensor, the surface opposite to the surface in contact with the rotary heating fixing roller 40 is in an open state, and the thermal element
Since 25 is not firmly fixed to the surface of the thin film sheet 26, the heat sensing element 25 may not be able to accurately measure the heat of the rotary heating fixing roller 40 due to the floating of the thin film sheet 26, or the detection performance such as the detection speed is slow. It was inferior.

又、このような温度センサの前述の欠点を解消すべ
く、感熱素子25と、これを金属板に接続するリード線を
シリコンゴム系の接着剤で固定することもあるが、この
方法は接着剤が熱を吸収するので、温度センサの熱応答
特性が劣化する欠点を生ずる。
Further, in order to eliminate the above-mentioned drawbacks of such a temperature sensor, the heat sensitive element 25 and the lead wire connecting it to the metal plate may be fixed with a silicone rubber-based adhesive. Absorbs heat, which causes a drawback that the thermal response characteristics of the temperature sensor deteriorate.

本考案は、従来のこの種の温度センサの前述の欠点を
解消し、感熱素子が常に確実に薄膜シートに密着し、薄
膜シートから浮き上がったり、移動したりしないように
して、被測定物の温度が確実に、且つ迅速に感熱素子に
加わるようにして、正確で、しかも熱応答特性の良好な
温度センサを提供することを目的とする。
The present invention solves the above-mentioned drawbacks of conventional temperature sensors of this type, and ensures that the heat-sensitive element is always in close contact with the thin film sheet so that it does not rise or move from the thin film sheet. It is an object of the present invention to provide a temperature sensor that is accurate and has a good thermal response characteristic by surely and quickly adding to the heat sensitive element.

〔課題を解決する為の手段〕[Means for solving the problem]

本考案は、前述の目的を達成するための温度センサの
手段に関し、外部引出線を接続するための外部引出部を
有する一対の帯状の金属板と、該一対の金属板を保持す
べく該一対の金属板の少なくとも一端に形成された保持
体と、前記一対の金属板の隙間に配設されて、該一対の
金属板に電気的に接続されている感熱素子と、該感熱素
子と金属板の上面を被覆して、被測定物に接触する薄膜
シートと、該感熱素子の周囲を囲繞する充填材と、少な
くとも該充填材と感熱素子を前記薄膜シートとの間に密
封、固定する被覆シートとによって、その目的は達成さ
れる。
The present invention relates to means of a temperature sensor for achieving the above-mentioned object, comprising a pair of strip-shaped metal plates having an outer lead portion for connecting an outer lead wire, and a pair of metal plates for holding the pair of metal plates. A holder formed on at least one end of the metal plate, a heat-sensitive element disposed in a gap between the pair of metal plates and electrically connected to the pair of metal plates, and the heat-sensitive element and the metal plate. A thin film sheet that covers the upper surface of the sheet and contacts the object to be measured, a filler that surrounds the periphery of the heat sensitive element, and a cover sheet that seals and fixes at least the filler and the heat sensitive element between the thin film sheet. The purpose is achieved by and.

〔作用〕[Action]

本考案の温度センサは、感熱素子を囲繞している充填
材を、感熱素子と一対の金属板とを被測定物に接触させ
るための薄膜シートと被覆シートとの間に密封、固定し
たので、被測定物との接触、振動等で薄膜シートから感
熱素子が離れたり、ずれたりすることがない。
In the temperature sensor of the present invention, the filler surrounding the heat sensitive element is sealed and fixed between the thin film sheet and the covering sheet for bringing the heat sensitive element and the pair of metal plates into contact with the object to be measured. The thermal element does not move away from or shift from the thin film sheet due to contact with the object to be measured or vibration.

前記の充填材の材質を、熱容量の小さいもの、充填量
等を吟味することで、感熱素子の対する熱応答特性を劣
化させることなく、常に感熱素子を薄膜シートに密着さ
せ、被測定物の温度が迅速に感熱素子に伝達されるよう
にし、正確で、良好な熱応答特性の温度センサとするこ
とができるものである。
By examining the material of the above-mentioned filling material with a small heat capacity, filling amount, etc., the thermosensitive element is always brought into close contact with the thin film sheet without deteriorating the thermal response characteristics of the thermosensitive element, and the temperature of the object to be measured is Is quickly transmitted to the heat-sensitive element, and an accurate temperature sensor having good thermal response characteristics can be obtained.

〔考案の実施例〕[Example of device]

次に、本考案の実施の一例を、第1図〜第4図につい
て説明する。
Next, an example of implementation of the present invention will be described with reference to FIGS.

第3図において、Aはコバール、ニッケル、銅等を材
料とした金属板を、エッチング等の手段で形成したリー
ドフレームで、このリードフレームAには、両側に一対
の帯状部11,11′を有すると共に、この帯状部11,11′の
それぞれから直角に延びる一対で、一組の連結部11a,11
a′と、この連結部11a,11a′よりも幅広で、且つこれと
連続している対をなす幅広部1,1′と、感熱素子3を収
容するための半円形の窪部1a,1a′が形成されている。
In FIG. 3, A is a lead frame formed by etching or the like using a metal plate made of Kovar, nickel, copper or the like. The lead frame A has a pair of strip-shaped portions 11 and 11 'on both sides. A pair of connecting portions 11a, 11 having a pair of extending portions extending perpendicularly from each of the strip portions 11, 11 '.
a ', a wide part 1,1' which is wider than the connecting parts 11a, 11a 'and is continuous with the connecting parts 11a, 11a', and semi-circular recesses 1a, 1a for accommodating the heat sensitive element 3. 'Is formed.

この窪部1a,1a′は、幅広部1,1′間の隙間を狭くする
ためのもので、この隙間を広くとれば、必ずしも必要で
はない。
The recesses 1a, 1a 'are for narrowing the gap between the wide portions 1, 1', and are not always necessary if the gap is wide.

このように形成されたリードフレームAの幅広部1,
1′の両端には、トランスファ成形等の手段で一側に保
持体4が、他側に保持体5が樹脂成形され、この保持体
4,5の樹脂成形時に取付け用の螺子孔4a,5aも成形され
る。
The wide portion 1, of the lead frame A formed in this way
At both ends of 1 ', a holding body 4 is resin-molded on one side and a holding body 5 is resin-molded on the other side by means such as transfer molding.
Screw holes 4a and 5a for mounting are also formed at the time of resin molding of 4,5.

次に、ビードサーミスタ等の感熱素子3を、窪部1a,1
a′間に収容して、そのリード線3aを幅広部1,1′に溶接
等の手段で電気的に接続する。
Next, the heat sensitive element 3 such as a bead thermistor is attached to the recesses 1a, 1
The lead wire 3a is housed between a'and electrically connected to the wide portions 1, 1'by means such as welding.

そして、幅広部1,1′の少なくとも被測定物である回
転加熱定着ローラ40に接触する部分、即ち、幅広部1,
1′の裏面の一部に、ポリイミドフィルム等の耐磨耗性
および耐熱性のある薄膜シート2を貼着する。
Then, at least a portion of the wide portion 1, 1 ′ that contacts the rotary heating fixing roller 40 that is the object to be measured, that is, the wide portion 1, 1.
A thin film sheet 2 having abrasion resistance and heat resistance, such as a polyimide film, is attached to a part of the back surface of 1 '.

更に、第2図に示すように、感熱素子3の周囲を熱伝
導性が良く、熱容量の小さいシリコングリス等の充填材
6で囲繞し、薄膜シート2と反対側の面を被覆シート7
で、充填材6と感熱素子3を密封、固定するように貼着
する。
Further, as shown in FIG. 2, the heat sensitive element 3 is surrounded by a filler 6 such as silicon grease having a good heat conductivity and a small heat capacity, and the surface opposite to the thin film sheet 2 is covered with a cover sheet 7.
Then, the filler 6 and the thermosensitive element 3 are attached so as to seal and fix.

その後、リードフレームAの帯状部11,11′を幅広部
1,1′とは反対側の端から切断し、個々の温度センサC
が得られるもので、第1図に示すように、帯状部11,1
1′は外部引出線を接続するための端子として使用され
る。
After that, the strip-shaped portions 11 and 11 'of the lead frame A are connected to the wide portion.
Cut from the end opposite to 1,1 'to obtain an individual temperature sensor C
As shown in FIG. 1, the strip-shaped portions 11,1 are obtained.
1'is used as a terminal for connecting an external lead wire.

このように、リードフレームAに保持体4,5をトラン
スファ成形機でまとめて成形すると、従来の単品毎の成
形、加工に比して、著しく作業性が向上するばかりでな
く、リードフレームAの加工精度が高いので、寸法のば
らつきによる不良品の発生率を減少できる。
As described above, when the holders 4 and 5 are collectively molded on the lead frame A by the transfer molding machine, not only the workability is remarkably improved as compared with the conventional molding and processing of individual products, but also the lead frame A Since the processing accuracy is high, the incidence of defective products due to dimensional variations can be reduced.

この保持体4,5の成形は、前述のトランスファ成形に
限定されず、予め樹脂成形された保持体4,5を用いて、
リードフレームA上で組み立てるようにしてもよい。
The molding of the holding bodies 4 and 5 is not limited to the transfer molding described above, and the holding bodies 4 and 5 which are resin-molded in advance are used.
It may be assembled on the lead frame A.

このようにして形成された温度センサCは、第4図に
示すように、感熱素子3が載置されている薄膜シート2
を、回転加熱定着ローラ40の表面に圧接されるように、
保持体4,5を図示しない複写機の定着装置内の固定部材
に螺子止めする。
As shown in FIG. 4, the temperature sensor C thus formed has the thin film sheet 2 on which the thermosensitive element 3 is mounted.
, So that it is pressed against the surface of the rotary heating fixing roller 40,
The holders 4 and 5 are screwed to a fixing member in a fixing device of a copying machine (not shown).

前記実施例の温度センサCは、保持体4,5を幅広部1,
1′の両側に設けているが、本考案は上記に限定され
ず、第3図の製造行程の最後において、帯状部11,11′
を切断する際に、第3図のD−D線で切断し、保持体4
だけの片持ち構造とすることも可能である。
In the temperature sensor C of the above-mentioned embodiment, the holders 4 and 5 are connected to the wide portion 1,
Although it is provided on both sides of 1 ', the present invention is not limited to the above, and at the end of the manufacturing process of FIG.
When cutting, the holder 4 is cut along the line D-D in FIG.
It is also possible to have a cantilever structure only.

更に、幅広部1,1′に多数の孔をメッシュ状に設け、
この幅広部11′の弾力性を調節すると共に、幅広部1,
1′の熱容量を低減することも可能である。
Furthermore, a large number of holes are provided in the wide portion 1,1 'in a mesh shape,
While adjusting the elasticity of the wide part 11 ', the wide part 1,
It is also possible to reduce the heat capacity of 1 '.

第5図は、代表的な熱応答特性を示し、同図のオーバ
ーシュート温度TOが小さい程、設定温度に到達するまで
の時間が短くなり、リップル温度Trが小さい程、制御特
性が良くなるので、オーバーシュート温度TO、リップル
温度Trによって、熱応答特性を表すことができる。
Fig. 5 shows typical thermal response characteristics. The smaller the overshoot temperature T O in the same figure, the shorter the time required to reach the set temperature, and the smaller the ripple temperature T r , the better the control characteristics. Therefore, the thermal response characteristic can be expressed by the overshoot temperature T O and the ripple temperature T r .

前述の特開昭63-205530号公報記載の温度センサは、T
O=8.8℃、Tr=2.9℃であったのに対し、前記の実施例
の温度センサでは、TO=5℃、Tr=2.9℃となり、オー
バーシュート温度の大幅な改善がみられた。
The temperature sensor described in the above-mentioned JP-A-63-205530 is
Whereas O = 8.8 ° C. and T r = 2.9 ° C., the temperature sensor of the above-described embodiment has T O = 5 ° C. and T r = 2.9 ° C., showing a significant improvement in overshoot temperature. .

〔考案の効果〕[Effect of device]

本考案は叙上のように、一対の金属板の隙間に感熱素
子を配設し、この感熱素子を電気的に一対の金属板に接
続し、更にこの感熱素子が被測定物に接触する側の一対
の金属板と感熱素子の面に、薄膜シートを設けると共
に、この感熱素子の周囲をシリコングリス等の充填材で
囲繞して、薄膜シートとは反対面を被覆シートで密封、
固定したものである。
In the present invention, as described above, a heat-sensitive element is arranged in a gap between a pair of metal plates, the heat-sensitive element is electrically connected to the pair of metal plates, and the side on which the heat-sensitive element contacts the object to be measured. A pair of metal plates and the surface of the heat sensitive element, a thin film sheet is provided, and the heat sensitive element is surrounded by a filler such as silicon grease, and the surface opposite to the thin film sheet is sealed with a covering sheet,
It is fixed.

従って、充填材として、熱伝導性に優れたものを用い
ることにより、被測定物の熱が充填材を通して感熱素子
の全面から吸収されること、および感熱面が面接触して
いることにより、熱応答特性が格段に優れたものとな
る。
Therefore, by using a filler having excellent thermal conductivity, the heat of the object to be measured is absorbed from the entire surface of the heat-sensitive element through the filler, and the heat-sensitive surface is in surface contact. The response characteristics are remarkably excellent.

又、金属板は、この金属板に感熱素子が直接に接触し
ないため、金属板を厚くしても、感熱素子から熱が逃げ
ず、その熱応答特性を低下させることがなく、従って、
被測定物に接触させる接触力を、金属板の厚さや弾性力
で調節することができ、使用目的に合った温度センサが
得られ、しかも適正な接触力が得られるため、耐久力に
富む温度センサとすることができる。
Further, in the metal plate, since the heat-sensitive element does not come into direct contact with this metal plate, even if the metal plate is thickened, heat does not escape from the heat-sensitive element, and its thermal response characteristics are not deteriorated.
The contact force to be brought into contact with the object to be measured can be adjusted by the thickness and elastic force of the metal plate, a temperature sensor suitable for the purpose of use can be obtained, and an appropriate contact force can be obtained. It can be a sensor.

更に、温度センサの被測定物に接する反対面が被覆シ
ートで断熱的に被覆されているため、周囲の気流による
熱の逃げがなくなり、感熱素子への影響を軽減すること
ができ、この点からしても優れた熱応答特性が安定した
ものとなる。
Furthermore, since the surface of the temperature sensor opposite to the object to be measured is adiabatically covered with a cover sheet, heat from the surrounding airflow does not escape, and the effect on the heat-sensitive element can be reduced. Even then, the excellent thermal response characteristics become stable.

しかも、金属板を弾性体として利用するだけでなく、
感熱素子からのリード線として利用でき、且つ保持体の
成形加工において、リードフレームの状態として、一体
成形が可能となり、加工の工数や組立工数も減少できる
と共に、組立工程における断線の予防にもなる等の効果
を有するものである。
Moreover, not only is the metal plate used as an elastic body,
It can be used as a lead wire from a heat-sensitive element, and it can be integrally molded as a lead frame in the process of molding the holder, which can reduce the processing man-hours and assembly man-hours, and also prevent disconnection in the assembly process. And so on.

【図面の簡単な説明】[Brief description of drawings]

第1図〜第4図は本考案の一実施例を示すもので、 第1図は平面図、 第2図は同上のB−B断面図、 第3図はその製造工程の平面図、 第4図は使用状態の側面図、 第5図は熱応答特性図、 第6図は従来の温度センサの平面図である。 A……リードフレーム、C……温度センサ、1,1′……
幅広部、11a,11a′……連結部、2……薄膜シート、3
……感熱素子、4,5……保持体、6充填材、7被覆シー
ト。
1 to 4 show an embodiment of the present invention. FIG. 1 is a plan view, FIG. 2 is a sectional view taken along line BB of the same, FIG. 3 is a plan view of its manufacturing process, FIG. 4 is a side view of a state of use, FIG. 5 is a thermal response characteristic diagram, and FIG. 6 is a plan view of a conventional temperature sensor. A: Lead frame, C: Temperature sensor, 1,1 '...
Wide part, 11a, 11a '... Connection part, 2 ... Thin film sheet, 3
...... Heat sensitive element, 4,5 ...... Holder, 6 filler, 7 coating sheet.

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】外部引出線を接続するための外部引出部を
有する一対の帯状の金属板と、該一対の金属板を保持す
べく該一対の金属板の少なくとも一端に形成された保持
体と、前記一対の金属板の隙間に配設されて、該一対の
金属板に電気的に接続されている感熱素子と、該感熱素
子と金属板の一面を被覆して、被測定物に接触する薄膜
シートと、該感熱素子の周囲を囲繞する充填材と、少な
くとも該充填材と感熱素子を前記薄膜シートとの間に密
封、固定する被覆シートとを備えたことを特徴とする温
度センサ。
1. A pair of strip-shaped metal plates having an external lead-out portion for connecting an external lead wire, and a holder formed on at least one end of the pair of metal plates to hold the pair of metal plates. , A heat-sensitive element disposed in the gap between the pair of metal plates and electrically connected to the pair of metal plates, and covering one surface of the heat-sensitive element and the metal plate to contact an object to be measured. A temperature sensor comprising a thin film sheet, a filler surrounding the heat sensitive element, and a cover sheet for sealing and fixing at least the filler and the heat sensitive element between the thin film sheet.
JP12416090U 1990-11-28 1990-11-28 Temperature sensor Expired - Lifetime JP2515114Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12416090U JP2515114Y2 (en) 1990-11-28 1990-11-28 Temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12416090U JP2515114Y2 (en) 1990-11-28 1990-11-28 Temperature sensor

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JPH0481023U JPH0481023U (en) 1992-07-15
JP2515114Y2 true JP2515114Y2 (en) 1996-10-30

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