JP2512837B2 - Optical disk manufacturing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk manufacturing apparatus.

[0002]

2. Description of the Related Art An optical disc is constructed by bonding two disc substrates each having a recording layer on one side. For this purpose, for example, JP-A-61-8053
As shown in Japanese Patent Laid-Open No. 4 (1999), an adhesive is sandwiched between the two disk substrates and the two disk substrates are pressed together to perform the bonding.

[0003]

However, in the above-mentioned conventional method for manufacturing an optical disk, the troublesome work of applying the adhesive to the disk substrate is required, and it is difficult to form a uniform adhesive film. Therefore, air bubbles and the like may remain at the joint. In addition, when the disk substrate is pressed, the adhesive squeezes out to generate burrs, which requires deburring work. Therefore, it has been impossible to efficiently manufacture an optical disc with an automated device. The present invention aims to solve the above problems.

[0004]

The present invention solves the above problems by configuring an optical disk manufacturing apparatus so that the step of laminating two disk substrates using a double-sided pressure-sensitive adhesive sheet can be continuously performed. . That is, the optical disc manufacturing apparatus according to the present invention is configured such that the first disc substrate (1
The double-sided adhesive sheet (17) is peeled off from the signal recording surface side of 8) and the release film (19a) on one side thereof is peeled off, and then the double-sided adhesive sheet (17) is released on the other side thereof. The optical disc (38) is manufactured by peeling off (19b) and sticking it to the signal recording surface side of the second disc substrate (28). The disc substrates (18, 28) before laminating are intended. A disk substrate storage device (21, 22) for storing the disk substrate, and a disk substrate supply device (30, 29) capable of holding and transferring the disk substrate (18, 28) and reversing the holding position.
A plurality of work positions (ST-1 to ST-6) are formed, and the first disc substrate (18) is supplied from the first disc substrate supply device (30) to the first substrate attachment position (ST-1). And a lower mold (40) arranged on the first rotary table device (12) for each work position thereof and capable of holding the first disk substrate (18).
And the second disk substrate supply device (29) supplies the second disk substrate (28) to the substrate angle alignment table (7
3) and a plurality of work positions (ST-7, ST-4) are formed, and the second disc substrate (28) is moved from the substrate angle alignment table (73) to the second substrate delivery position (ST-7). A second turntable device (14) to which the second disc substrate (28) is placed and which is arranged on the second turntable device (14) for each working position of the second turntable device (14). 49)
And the release film (19a) on one surface side from the double-sided adhesive sheet (17), and then the release film on the other surface side from the double-sided adhesive sheet (17) adhered to the first disk substrate (18). (19b) is peeled off. The peeling film peeling device (50) and the first disc substrate (1
8), a first pressure device (80) capable of press-bonding the double-sided adhesive sheet (17) from which one release film (19a) is peeled off, the first disk substrate (18) and the second disk substrate (18) A second pressure device (82) capable of pressing the disk substrates (28) together to form an optical disk (38);
An optical disk transfer device (90) capable of holding and carrying the completed optical disk (38) and reversing the holding position, and an optical disk storage device (2) for housing the optical disk (38).
2), and the first disk substrate supply device (3
0) is movable between the take-out portion of the first disc substrate storage device (20) and the first substrate mounting position (ST-1), and the second disc substrate supply device (29) is the second disc substrate feeding device (29). Substrate storage device (21) and second substrate transfer position (ST-
7) and an optical disk transfer device (9
0) is movable between the optical disk take-out position (ST-5) and the storage section of the optical disk storage device (22). The reference numerals in parentheses indicate the corresponding members of the embodiment.

[0005]

The first disk substrate is taken out from the first disk substrate storage device by the first disk substrate supply device, and at the first substrate mounting position (ST-1) on the first table of the first turntable device. It is set in the lower mold. Also, a double-sided adhesive sheet is sent out from the double-sided adhesive sheet storage box,
At a position before the first pressure position (ST-2), the release film peeling device peels the release film on the one surface side from the double-sided pressure-sensitive adhesive sheet. Next, the lower die on which the first disk substrate is set is moved from ST-1 to ST-2 by rotating a predetermined angle.
The first pressure device presses the first disk substrate on the lower mold against the pressure-sensitive adhesive surface of the double-sided pressure-sensitive adhesive sheet, and the first disk substrate and the pressure-sensitive adhesive are bonded (ST-
(The operation of setting the next first disk substrate to the next lower mold that has been rotated to 1 is performed). Further, at a position past ST-2, the release film on the other side of the double-sided pressure-sensitive adhesive sheet is peeled off. As a result, the first disk substrate and the pressure-sensitive adhesive adhered on this remain on the lower mold (the release films adhered on both sides of the pressure-sensitive adhesive are wound by the respective winding rolls). Taken). On the other hand, the second disc substrate storage device pulls out the second disc substrate by the second disc substrate supply device, and at the second substrate transfer position (ST-7) on the second turntable device side, the substrate angle adjusting table Set on. In ST-7, the angle of the second disk substrate is adjusted by the substrate angle adjusting device. Next, the second table of the second turntable device is rotated by a predetermined angle, and the upper mold of the second table is moved to S
Move to the position where it overlaps with T-7. As a result, the upper mold is placed on the second disk substrate. Next, the second disk substrate is pushed up toward the upper mold and magnetically attracted to the upper mold. Next, the lower mold having the first disc substrate with the adhesive attached at the first substrate angle alignment position (ST-3) is rotated by a predetermined angle and sent to the second pressure position (ST-4). Also, the upper mold having the second disk substrate of ST-7 attached is also sent to ST-4. As a result, the upper mold and the lower mold are in a state of overlapping each other. The upper mold and the lower mold are pressed against each other by the second pressure device. As a result, the second disc substrate is adhered to the other side of the adhesive, and an optical disc in which the disc substrates are adhered to both sides of the adhesive is completed (during this, in ST-7, the next second disc is The operation of setting the substrate on the substrate angle alignment table is performed). The optical disc placed on the lower mold after the magnetic attraction is released is sent to the take-out position (ST-5), taken out by the optical disc transfer device and stored in the optical disc storage device. Preparation position (ST-
In 6), the empty lower mold is waiting, and ST-
It is designed to rotate to 1. By repeating the above operation, the optical disc can be continuously and efficiently manufactured.

[0006]

EXAMPLES Examples of the present invention are shown in FIGS. A first rotating table device 12, a double-sided pressure-sensitive adhesive sheet storage box 16, a double-sided pressure-sensitive adhesive sheet 17 in which a release film 19 is attached to both sides of an adhesive agent 17a, which is accommodated in the frame 10, a disc before attachment. First disk substrate supply device for extracting the first disk substrate 18 from the disk substrate storage devices 20 and 21 and the first disk substrate storage device 20 in which the substrates 18 and 28 are respectively stored, and supplying the first disk substrate 18 to the first rotary base device 12. 30, the first substrate angle adjusting device 60 for adjusting the mounting angle of the first disc substrate 18 arranged on the first turntable device 12, and the second disc substrate 28 from the second disc substrate housing device 21 The second disk substrate supply device 29 set on the substrate angle alignment table 73 on the frame 10 relative to the second disk substrate 28. The second substrate angular alignment device 70 for positioning the angle, peel the film 19 from the double-sided pressure-sensitive adhesive sheet 17
The peeling film peeling device 50 for peeling off a and 19b, the first disk substrate 18 on the surface of the pressure sensitive adhesive 17a of the double-sided pressure sensitive adhesive sheet 17 from which the peeling film 19a on one side is peeled off
The second disk substrate 28 angled from the first pressure device 80 and the second substrate angle adjustment device 70 for adhering
The second pressure device 8 for adhering the second disk substrate 28 to the other surface of the second rotary base device 14 that receives the
2. The optical disc 38 completed by attaching the disc substrates 18 and 28 to both surfaces of the adhesive 17a is taken out from the first turntable device 12, and the optical disc storage device 2
The optical disk transfer device 90, etc., to be housed in No. 2 are arranged. The disk substrate targeted by the present invention includes:
As shown in FIG. 3, a disk substrate member 1 having a donut plate shape.
A center hub 18a made of a magnetic material is provided at the center of 8c, and a plurality (usually 2 to 3) of center hub adhesive flanges 18d are arranged on the circumference at equal intervals. As shown in FIG. 8, the center hub adhesive flange 18d is angled by the first substrate angle adjusting device 60 so as to be located at a predetermined relative angular position with respect to the rotation center of the first rotary base device 12. ing. In the case of the second disk substrate 28, the second substrate angle adjusting device 70 is used so that the center hub adhesive flange 28d is located at a predetermined relative position with respect to the second rotary base device 14 as shown in FIG. The angle is adjusted. In addition, as shown in FIG.
8 The double-sided adhesive sheet 17 for adhesion is a disk-shaped adhesive 17
It is apparently formed into a single long sheet by the a and the two long release films 19a and 19b sandwiching the film. The adhesive 17a is made of a transparent material and can transmit a laser beam emitted from a laser sensor 65 described later.
The double-sided adhesive sheet 17 is stored in the adhesive sheet storage box 16. The double-sided adhesive sheet 17 pulled out from the adhesive sheet storage box 16 is peeled off by the peeling film peeling device 50 to peel off the peeling film 19a on one side to expose one of the bonding surfaces, and then by the first pressure device 80. The first disk substrate 18 is adhered to the exposed adhesive surface, then the release film 19b on the other surface side is peeled off to expose the other adhesive surface, and the second pressure device 82 is applied to the exposed adhesive surface. By adhering the second disc substrate 28, the disc substrates 18 and
28 is adhered to form an optical disc 38.

(Rotating table device 12, 14) The first rotating table device 12 and the second rotating table device 14 are shown in FIG.
Inside, it is arranged on the frame 10, respectively. The first table 5 of the first turntable device 12 has a disc shape.
A rotary shaft 7 is fixed to the center of the first table 5. The lower end of the rotary shaft 7 in FIG. 1 is connected to a drive mechanism 9. By driving the drive mechanism 9, the first table 5 is intermittently rotated at regular intervals (in the embodiment, at intervals of 60 degrees) via the rotary shaft 7, and is stopped at each position. As a result, the first table 5, as shown in FIG. 2, has a first substrate mounting position (ST-1), a first pressing position (ST-2), and a first substrate angle adjusting position (ST-).
3), second pressure position (ST-4), take-out position (ST-
It is possible to take a total of 6 stop positions of 5) and the preparation position (ST-6). A lower die 40 is arranged on the first table 5 at each of the above positions. S
At T-1, the first disk substrate 18 can be attached to the lower die 40 on the first table 5.
In ST-2, the exposed surface of the adhesive 17a can be adhered to the first disk substrate 18 on the lower mold 40 by peeling off the release film 19a on the one surface side from the double-sided adhesive sheet 17. It is possible. In ST-3, the angle of the first disk substrate 18 on the lower mold 40 can be adjusted. In ST-4, the first disk substrate 18 after the angle adjustment and the second disk substrate 28 after the angle adjustment described later can be pressed by the second pressing device 82 to form the optical disk 38. is there. In ST-5, the optical disk 38 can be taken out from the first table 5 by the optical disk transfer device 90. ST-6 is a spare position where no work is done. On the other hand, as shown in FIG. 2, the second table 11 of the second turntable device 14 has a substantially rhombic shape with both ends on the acute angle side cut off.
Upper molds 49 are fixed to both ends of the mold in a downward direction in the figure. A rotary shaft 13 is fixed to the center of the second table 11. The lower end of the rotary shaft 13 in FIG. 1 is connected to the drive mechanism 15. By driving the drive mechanism 15, the second table 11 is rotated 180 degrees via the rotary shaft 13.
It is designed to rotate intermittently and stop at that position. As a result, the second table 11 can be stopped at two positions, that is, the second substrate transfer position (ST-7) and the position overlapping the ST-4 that has moved 180 degrees from the second substrate transfer position. In ST-7, it is possible to perform the angle adjustment of the second disk substrate 28 with respect to the substrate angle adjustment table 73 described later. In ST-4, as described above, the second pressure device 82 can bond the second disk substrate 28 to the other adhesive surface of the adhesive 17a to which the first disk substrate 18 is adhered. is there.

(Disc substrate storage devices 20, 21 and optical disc storage device 22) In FIG. 2, the left and right disc substrate storage devices 20, 21 are arranged.
Stores the disk substrates 18 and 28 before bonding,
In the figure, the optical disc storage device 22 at the lower center has the same structure as the optical disc 38, which is a finished product obtained by laminating two disc substrates 18 and 28, but the optical disc storage device 22 has the same structure. 20 will be described, and description of the storage devices 21 and 22 will be omitted. As shown in FIG. 3, a screw member 24 is rotatably supported by the frame member 23 bent in a “U” shape. Guide bars 27 are arranged on the left and right sides of the screw member 24 in the figure. Each end of this is fixed to the frame member 23. A box 25 is arranged above the frame member 23 in the figure. Box 25
A screw hole 25a is formed in the lower part of the figure, and guide holes 25b are formed on both the left and right sides of the figure, respectively. In the box 25, a large number of first disk substrates 18
It is possible to make them vertical and store them at equal intervals. The screw member 24 is screwed into the screw hole 25a of the box 25 and is supported by the frame member 23 so that the box 25 can be moved in the left-right direction in the drawing. A motor 26 that rotationally drives the screw member 24 is attached to the frame member 23. The guide bar 27 is fitted in the guide hole 25b of the box 25 and is supported by the frame member 23 to guide the movement of the box 25. By the first disc substrate supply device 30, one disc substrate 18 from the box 25
The motor 26 is driven each time the disk is taken out, and the box 25 is moved leftward in the figure by one pitch (the thickness of one disk substrate and the holding space) so that the disk substrate 18 on the left end side relative to the frame 10. It is possible to keep the desired extraction position constant. In the disk substrate storage device 20 (21), the disk substrate 18 (2
Each time 8) is taken out, the box 25 moves forward by one pitch, so that the disk substrate 18 (2
8) is positioned, the box 25 in the optical disk storage device 22 moves rightward in the figure by one pitch each time one optical disk 38 is stored. However, the difference is that the storage position is always emptied so that the optical disk 38 can be stored. That is, the disk substrate storage device 20 (21)
The optical disc storage device 22 and the optical disc storage device 22 are set so that the rotation directions of the motors 26 are opposite to each other.

(Disc substrate supply device 30, 29, optical disc transfer device 90) The disc substrate supply device 30 (29) removes the disc substrate 18 (28) from the disc substrate storage device 20 (21) and then the table 5 (17). However, the optical disk transfer device 90 transfers the optical disk 38 on the first table 5 to the optical disk storage device 22, but since the structure is the same, only the first disk substrate supply device 30 is supplied. However, the description of the devices 29 and 90 will be omitted. In FIG. 4, the guide member 31 is fixed to the fixed portion.
The slider 32 is supported by the slider so as to be movable left and right. Two sliders 32a are supported on the slider 32 so as to be movable in the vertical direction in the figure. The rotary actuator 33 is provided at the lower end of the slide bar 32a in the figure.
Has been fixed. A suction hand 35 is fixed to the tip of the shaft 33a. Four suction pads 34 are attached to the suction hand 35 (note that only two are visible in FIG. 4). Also, the suction hand 35 has
A hose 35 that sucks air from the suction surface of the suction pad 34
One end of is connected. The other end of the hose 35 is connected to a vacuum pump (not shown). The suction hand 35 is
By driving the slider 32 and the slide bar 32a, the slider 32 and the slide bar 32a can be moved in the left-right direction and the up-down direction in FIG. It can be rotated between a vertical position rotated by 90 degrees. By doing so, the suction pad 34 allows the disk substrate 1 to be transferred from the first disk substrate storage device 20.
The disk substrate 18 can be transferred to the lower mold 40 arranged in the first rotary base device 12 by sucking and extracting the disk 8.

(Lower mold 40, Upper mold 49) In FIG. 5, the first table 5 (of the first rotary table device 12)
A mold 41 is arranged on the top. Hole 4 in the center of mold 41
1a is formed. The center pin 4 is placed in the hole 41a.
2 are arranged. In the lower part of the center pin 42 in the figure,
The brim is formed. A ring-shaped electromagnet 43 is arranged in the space between the center pin 42 and the hole 41a. The outer peripheral portion of the electromagnet 43 is fixed to the wall surface of the hole 41a. By energizing the electromagnet 43, the disk substrate 18 conveyed by the first disk substrate supply device 30 onto the lower mold 40 is magnetized to the lower mold 40 (by attracting the magnetic material portion of the center hub 18a thereof). It is possible to adsorb. As a result, the center hole 18b of the disk substrate 18 is fitted to the tip end portion 42a of the center pin 42. A spring 44 is arranged between the electromagnet 43 and the flange of the center pin 42. The spring 44 acts to allow the center pin 42 to enter the hole 42a. In the first table 5, two through holes 5a are formed for one die 41, and pins 45 are fitted in the through holes 5a. A large diameter head portion 45a is formed at the lower end portion of the pin 45 in the drawing. Head 45a of pin 45 and first table 5
A spring 46 is arranged between and. The springs 46 act so that the pins 45 come out of the through holes 5a. Mold 41, center pin 42, electromagnet 43, spring 44, pin 45 and spring 46
The lower die 40 is configured by The lower mold 40 is arranged at six positions ST-1 to ST-6 as described above, and can receive the first disc substrate 18 from the first disc substrate supply device 30 in ST-1. is there. On the other hand, as shown in FIG. 1, in the figure of the second table 11 of the second turntable 14 device, two upper dies 49 are fixed downward on the lower surface side at 180 ° intervals in total. As shown in FIG. 10, a ring-shaped electromagnet 76 is provided at the center of the upper mold 49.
Has been fixed. Second substrate angle adjusting device 7 described later
When the piston rod of the air cylinder 71 of 0 is extended, by energizing the electromagnet 76, the center pin 74
It is possible to magnetically adsorb the second disk substrate 28 fitted to the upper die 49 by separating it from the substrate angle alignment table 73.

(Peeling Film Peeling Device 50, Double-sided Adhesive Sheet Storage Box 16) FIG. 6 shows the peeling film peeling device 50, the double-sided adhesive sheet storage box 16, the first pressing device 80, the pressing die 85 and the like. There is. Two rollers 51 are arranged on the left side in the figure. The rollers 51 are rotatably supported by supporting portions (not shown). A first winding shaft 54 is arranged below the roller 51 in the figure. The first winding shaft 54 is connected to the motor 55. The motor 55 is supported by the fixed portion. Further, two rollers 52 and one roller 53 are arranged on the right side of the drawing. The rollers 52 are rotatably supported by support frames 58, which will be described later.
The roller 53 is rotatably supported by a supporting portion (not shown). An air cylinder 59 is provided to the right of the roller 52 in the figure.
Is arranged. The air cylinder 59 is supported by the fixed portion. On these two piston rods 59a,
The support frame 58 is connected. The support frame 58 rotatably supports the two rollers 52 as described above. The second winding shaft 56 is arranged above the roller 53 in the figure. The shaft of the second winding shaft 56 is connected to the motor 57. The motor 57 is supported by the fixed portion. Roller 5
1, 52, 53, first winding shaft 54, motor 55, second winding shaft 56, motor 57, support frame 58, and air cylinder 5
The peeling film peeling device 50 is constituted by 9. By driving the motor 55, it is possible to wind the release film 19a on the lower surface side in FIG. By operating the air cylinder 59 and extending these two piston rods 59a, the double-sided pressure-sensitive adhesive sheet 17 bonded to the first disk substrate 18 on the lower mold 40 is moved to the upper side in the figure as described later. Release film 19
It is possible to remove b. By operating the motor 57, the other peeled release film 19b can be wound around the second winding shaft 56. The double-sided adhesive sheet storage box 16 is arranged on the left side of the first winding shaft 54 in the figure. The double-sided pressure-sensitive adhesive sheet storage box 16 is not a member included in the peeling film peeling device 50, but it will be described here because it is operationally related. A long double-sided adhesive sheet 17 is placed in the double-sided adhesive sheet storage box 16.
It is designed to be folded and stored. The roller 51 can guide the movement of the double-sided adhesive sheet 17 pulled out from the double-sided adhesive sheet storage box 16 described above. The lower mold 40 described above is arranged below the double-sided pressure-sensitive adhesive sheet 17 located between the rollers 51 and 52 in the figure, and this position is the first pressing position ST-2 on the first table 5. (See Figures 1 and 2). In ST-2, a double-sided pressure-sensitive adhesive sheet 17 is sandwiched, and a pressing die 85 and a first pressurizing device 80 (located below the lower die 40), which will be described later, are arranged above and below in the figure. Lower mold 40
In ST-2, air cylinders 39 and 4
By operating 8, the disc substrate 18 attached to the lower mold 40 can be pressed against the adhesive 17a surface of the peeled double-sided adhesive sheet 17 of the release film 19a. This makes it possible to adhere the adhesive 17a to the first disk substrate 18.

(First Substrate Angle Aligning Device 60, Second Substrate Angle Aligning Device 70) FIG. 8 shows the first substrate angle aligning device 60. At the first substrate angle alignment position ST-3, the bracket 61 is fixed to the portion 10a of the frame 10 below the lower mold 40. An air cylinder 62 is attached to the bracket 61. A motor 63 is fixed to the piston rod (not shown). The position shown in the drawing shows the state where the piston rod of the air cylinder 62 is most shortened. A coupling 64 is fixed to the shaft 63a of the motor 63. By extending the piston rod of the air cylinder 62, the hole of the coupling 64 can be fitted to the lower end portion 42b of the center pin 42 in the figure. By driving the motor 63 in this state,
It is possible to rotate the disk substrate 18 at a very low speed via the coupling 64. A laser sensor 65 is fixed to an upper fixed portion of the lower die 40 in the drawing. The laser sensor 65 can output a signal when the center hub adhesive flange 18d of the first disk substrate 18 described above is located at a predetermined relative angular position with respect to the first table 5. The bracket 61, the air cylinder 62, the motor 63, the coupling 64, and the laser sensor 65 constitute a first substrate angle adjusting device 60. The first substrate angle adjusting device 60 can perform the angle adjustment of the disk substrate 18 located at ST-3. That is, by driving the air cylinder 62, the coupling 64 is fitted to the end 42b of the center pin 40 of the lower mold 40, and by driving the motor 63, the disk substrate arranged on the lower mold 40. Center hub adhesive flange 1 by rotating 18 at a very low speed
By stopping the motor 63 by a signal from the laser sensor 65 when 8d is located at a predetermined relative angular position, the angle of the first disk substrate 18 can be adjusted. FIG. 10 shows the second substrate angle adjusting device 70.
Shown in At the second substrate delivery position ST-7, the air cylinder 71 is attached to the portion 10b of the frame 10 on the lower side in the drawing. A motor 72 is fixed to the piston rod (not shown). The position shown is
The state where the piston rod of the air cylinder 71 is most shortened is shown. The upper frame 10 of the motor 72 in the figure
The second substrate angle adjustment base 73 is fixed to the portion 10c. A center pin 74 is arranged in the center hole of the second substrate angle adjustment base 73. A hole is formed at the lower end of the center pin 74 in the drawing, and the shaft 72a of the motor 72 can be fitted into this hole. The second disk substrate 28 is placed on the second substrate angle alignment table 73. A center hub 18a and a center hub adhesive flange 18d are attached to the disk substrate 28.
By driving the motor 72 with the piston rod of the air cylinder 71 shortened as shown in the drawing, the disk substrate 28 can be rotated at a very low speed via the center pin 74. In the figure, the laser sensor 75 is arranged at the upper right diagonally fixed portion of the second substrate angle alignment table 73. The laser sensor 75 stops the motor 72 by a signal from this when the center hub adhesive flange 18d of the disk substrate 28 is positioned at a predetermined relative angular position with respect to the second table 11, and thereby the second disk substrate. It is possible to perform 28 angle adjustments. An electromagnet 76 is fixed to the center of the upper mold 49. By extending the piston rod of the air cylinder 71 from the shortened position shown in the figure and energizing the electromagnet 76, the second disc substrate 28 whose angle has been adjusted is moved to the upper die 4
9 can be magnetically adsorbed.

(First pressurizing device 80, pressing die 85, second
Pressure device 82) A schematic overall view of the first pressure device 80 is shown in FIG. 6 together with devices arranged around (such as the peeling film peeling device 50).
Shown in A pressing die 85 is arranged above the double-sided pressure-sensitive adhesive sheet 17 in the figure, and a lower die 40 located at ST-2 is arranged below in the figure. The first pressurizing device 80 is arranged below the lower mold 40 in the drawing. As shown in FIG. 7, a bracket 86 is fixed to the portion 10e of the frame 10. An air cylinder 81 is attached to the bracket 86. A coupling 83 is fixed to the piston rod 81a of the air cylinder 81. A hole 83a is formed at the upper end of the drawing. FIG.
The piston rod 81a is shown in a shortened state. By extending the piston rod 81a of the air cylinder 81 from the illustrated shortened position, the hole 83a is formed in the lower mold 40.
The lower die 40 can be pushed up in the figure by fitting it to the lower end of the center pin 42 in the figure (see FIG. 6). As a member related to the operation of the first pressurizing device 80, the pressing die 85 will also be described here. The air cylinder 8 is attached to the portion 10d of the frame 10.
4 is attached. This piston rod 84a
6, a pressing die 85 is fixed downward in FIG.
FIG. 7 shows a state where the piston rod 84a is shortened. The pressing die 85 can be pushed down toward the double-sided adhesive sheet 17 by extending the piston rod 84a of the air cylinder 84 from the illustrated shortened position. By extending the piston rod 84a of the air cylinder 84 and extending the piston rod 84a of the air cylinder 84 of the first pressurizing device 80, ST-2
It is possible to press the lower die 40 and the pressing die 85 located at 1 to each other toward the double-sided adhesive sheet 17. Thereby, the disk substrate 18 on the lower mold 40 can be adhered to the adhesive 17a surface of the double-sided adhesive sheet 17. Next, the second pressurizing device 82 is shown in FIG. A bracket 87 is fixed to a portion 10f of the frame 10 below the lower mold 40 located at ST-4. Bracket 87
An air cylinder 88 is attached to the. A coupling 89 is fixed to the end of the piston rod 88a. A hole 89a is formed at the upper end of the drawing. The hole 89a of the coupling 89 can be fitted to the lower end portion of the center pin 42 of the lower die 40 arranged on the first table 5 in the figure. FIG. 9 shows a state where the piston rod 88a is shortened. The lower mold 40 can be pushed upward by extending the piston rod 88a of the air cylinder 88 from the illustrated shortened position. As a result, the first disk substrate 18 on the lower die 40 located in ST-4 is moved to the upper die 4
The second optical disk 38 is pressed against the second disk substrate 28 on the optical disk 9 and integrally bonded by the double-sided adhesive sheet 17.
It is possible to In ST-4 shown in FIG. 9, the second table 11 is provided above the first table 5.
Are arranged so that one end sides of the are overlapped. A receiving board 35 is arranged on the upper portion of the second table 11 in the drawing.
When the lower die 40 is pushed upward in the drawing by the air cylinder 88 of the second pressurizing device 82 to be pushed upward and pressed against the upper die 49, the receiving board 35 causes the second table 11 to move by the pressing force. It is designed to prevent bending upward in the figure.

Next, the operation of this embodiment will be described. Figure 2
In, the rotary actuator 33 of the first disk substrate supply device 30 is in the extraction position for extracting the first disk substrate 18 of the first disk substrate storage device 20.
The suction pad 34 of the first disk substrate supply device 30 (see FIG.
(See) is decompressed by a vacuum pump (not shown),
One disk substrate 18 in the first disk substrate housing device 20 is sucked. When the slide bar 32a is retracted into the slider 32, the disk substrate 18 is extracted from the first disk substrate housing device 20 (the motor 26 shown in FIG. 3 is driven to move the box 25 in the forward direction by one pitch). . By rotating the rotary actuator 33 by 90 degrees, the surface of the disk substrate 18 is made parallel to the mounting surface of the lower die 40 of the first table 5 of the first rotary table device 12 (in FIG. 2). , Virtual line a position).

(First Substrate Attachment Position ST-1) By driving the slider 32 of the first disc substrate supply device 30, the disc substrate 18 is moved from the position of the imaginary line a to ST-1 facing the lower die 40. By driving the slide bar 32a, the first disk substrate 18 is set in the lower mold 40 of ST-1 with the signal recording surface facing upward (the center hub adhesive flange 18d facing downward) (FIG. 11a). Lower mold 40 at this time
When the electromagnet 43 of the
Are magnetically attracted to the lower mold 40. Next, the decompression of the suction pad 34 is released, and the suction pad 34 moves to the disk substrate 18
Release the vacuum adsorption of. First disk substrate supply device 30
Releases the disk substrate 18, returns to the extraction position, and waits for the next extraction of the disk substrate. Drive mechanism 9
Is driven, and the first table 5 is rotated by 1/6 rotation in the clockwise direction in FIG. 2 via the rotary shaft 7. As a result, the disk substrate 18 moves to ST-2.

(First Pressing Position ST-2) In FIG. 6, by driving the motors 55 and 57 of the peeling film peeling apparatus 50, the double-sided adhesive sheet 17 is pulled out from the double-sided adhesive sheet storage box 16, and the lower surface is shown. The side release film 19a is wound around the first winding shaft 54.
As a result, the first lower surface side of the disk-shaped adhesive 17a arranged on the double-sided adhesive sheet 17 at equal intervals is exposed. The air cylinder 84 operates and the pressing die 85 moves to the position shown in FIG.
Pressed down in the middle (Fig. 11b). Next, the first pressurizing device 8
0 operates to raise the lower mold 40 (FIG. 11C), and the first disk substrate 18 is bonded to the adhesive 17a. Next, the air cylinder 84 operates in the opposite direction to raise the pressing die 85, while the piston rod 59a of the air cylinder 59 (see FIG. 6) is protruded leftward in FIG. The release film 19b on the upper side in the figure is peeled off (FIG. 11d). Next, the first pressurizing device 8
0 operates in the opposite direction and the lower die 40 is returned to the first table 5, the drive mechanism 9 is driven, and the first table 5 is rotated by 1/6 in the clockwise direction in FIG. It only rotates. As a result, the first disk substrate 18
Moves to ST-3 with the surface of the adhesive 17a exposed.

(First Substrate Angle Alignment Position ST-3) The first disc substrate 18 with the adhesive 17a is the lower mold 4
0 and ST-3, the center hub adhesive flange 18d at the center of the disk substrate is attached to the first table 5.
The work of adjusting the angle to a predetermined relative angular position is performed. That is, the piston rod (not shown) of the air cylinder 62 of the first substrate angle adjusting device 60 (see FIG. 8) extends and the coupling 6 at the tip portion is passed through the motor 63.
4 is fitted to the lower end of the center pin 42 of the lower mold 40 in FIG. Next, the motor 63 rotates at a very low speed to gradually change the angular position of the center hub adhesive flange 18d.
The laser sensor 65 projects a laser beam from now on and transmits the adhesive 17a to detect the relative angular position of the center hub adhesive flange 18d of the disk substrate 18, and the center hub adhesive flange 18d is positioned at a predetermined relative angular position. At this time, a signal is output to stop the motor 63 of the first disc substrate angle adjusting device 60 (FIG. 11e). This completes the angle adjustment of the first disk substrate 18 with respect to the first table 5. The piston rod of the air cylinder 62 is driven in the shortening direction to return to the position shown in FIG. 8 (the coupling 64 is disengaged from the center pin 42). The drive mechanism 9 is driven again, and the first table 5 is rotated in the clockwise direction in FIG. As a result, the disk substrate 18 with the adhesive 17a moves (together with the lower mold 40) to ST-4.

On the other hand, at the position shown in FIG. 2, the rotary actuator 33 of the second disk substrate supply device 29.
Is in the extraction position for extracting the second disk substrate 28 from the second disk substrate storage device 21. The suction pad 34 (see FIG. 4) of the second disk substrate supply device 29 is decompressed by a vacuum pump (not shown) and sucks the disk substrate 28 in the second disk substrate housing device 21. When the slide bar 32a is retracted into the slider 32, the second disc substrate 28 is pulled out from the second disc substrate housing device 21 (the motor 26 shown in FIG. 3 is driven to move the box 25 forward by one pitch). . By rotating the rotary actuator 33 by 90 degrees, the surface of the disk substrate 28 moves so that the substrate angle alignment table 7 of the frame 10 moves.
It is made parallel to the mounting surface of No. 3 (position of virtual line b in FIG. 2).

(Second Substrate Delivery Position ST-7) By driving the slider 32 of the second disc substrate supply device 29, the disc substrate 28 is moved to a position facing the substrate angle alignment base 73 of ST-7 and slid. By driving the bar 32a, the second disk substrate 28 is set on the substrate angle alignment table 73 of ST-7 with the signal recording surface facing downward (the center hub adhesive flange 28d facing upward). Figure 11j). The decompression of the suction pad 34 is released, and the suction pad 34 releases the suction of the disk substrate 28. The second disk substrate supply device 29 releases the disk substrate 28, returns to the extraction position again, and stands by in preparation for the next extraction of the disk substrate.
With the second disk substrate 28 placed on the substrate angle alignment table 73 and positioned at ST-7, the work of aligning the center hub adhesive flange 28d at the center of the disk substrate to a predetermined relative angular position is performed. That is, the piston rod of the air cylinder 71 of the second substrate angle adjusting device 70 operates to fit the shaft 72a of the motor 72 at the tip end into the hole at the lower end of the center pin 74 of the substrate angle adjuster 73 in FIG. Next, the motor 72 rotates at a very low speed to gradually change the angular position of the center hub adhesive flange 28d. The laser sensor 75 projects a laser beam from now on, and the center hub adhesive flange 28 d of the disk substrate 28 is projected.
Is detected, and when the center hub adhesive flange 28d is located at a predetermined relative angular position, a signal is output and the motor 72 of the second substrate angle adjusting device 70 is stopped. Next, the piston rod of the air cylinder 71 rises, the disk substrate 28 is lifted from the substrate angle alignment table 73, and the second table 11 of the second rotary table device 14 is lifted.
The upper mold 49 is pushed toward the lower surface in the figure. At the same time, the electromagnet 76 at the center of the upper mold 49 is energized. As a result, the metal portion of the disk substrate 28 (the center hub adhesive flange 2
8) is attracted to the electromagnet 76. That is, the second disk substrate 28 is held by the upper mold 49 by magnetic force (FIG. 11h). Next, the piston rod of the air cylinder 71 is driven in the shortening direction and descends below the position shown in FIG. 10 (the shaft 72a is disengaged from the hole of the center pin 74). Next, the drive mechanism 15 of the second rotary base device 14 is driven, and the second table 11 is rotated by 1/2 rotation counterclockwise in FIG. 2 via the rotary shaft 13. As a result, the second disk substrate 28 moves to ST-4.

(Second Pressing Position ST-4) At ST-4, the first disk substrate 18 with the adhesive 17a on the first table 5 of the first rotary base device 12 is attached.
And the second disk substrate 28 on the second table 11 of the second turntable device 14 are in a state of facing each other with the signal recording surface inside with the adhesive 17a interposed therebetween (FIG. 9). ). When the air cylinder 88 of the second pressurizing device 82 is actuated, the piston rod 88a of the air cylinder 88 extends upward in the figure, and the coupling 89 at the tip end is fitted to the lower end of the center pin 42 of the lower mold 40. The piston rod 88a of the air cylinder 88 moves further upward to press the first disk substrate 18 together with the adhesive 17a against the second disk substrate 28 (FIG. 11g). As a result, the optical disc 38 having the disc substrates 18 and 28 adhered on both sides with the adhesive 17a sandwiched is completed. That is, 1
The second disk substrate 18 and the second disk substrate 28
Are adhered to each other with their signal recording surfaces inside (the center hub adhesive flange 18d and the center hub adhesive flange 28d faced outward) to form the optical disc 38. Next, the electromagnet 43 of the lower mold 40 and the electromagnet 76 of the upper mold 49 are de-energized. The air cylinder 88 is driven in the shortening direction to return the piston rod 88a thereof to the position shown in FIG. As a result, the optical disc 38 is placed on the lower die 40 of the first table 5. The drive mechanism 9 is driven again, and the first table 5 is moved through the rotary shaft 7.
, But rotates 1/6 rotation in the clockwise direction in FIG.
As a result, the optical disc 38 is located at the take-out position ST-5.

(Removal Position ST-5, Preparation Position ST-6) In FIG. 2, the rotary actuator 33 of the optical disk transfer device 90 is located at the storage position of the optical disk storage device 22. When the slider 32 of the optical disk storage device 22 is driven and the rotary actuator 33 rotates 90 degrees, the suction hand 35 (see FIG. 4) moves to S
Move to T-5. Next, the suction pad 34 is depressurized by a vacuum pump (not shown) to adsorb the optical disc 38 on the lower mold 40. The rotary actuator 33 and the slider 32 respectively return to the initial positions, and the optical disc 3
Located in a position to store 8. Next, the pressure reduction of the suction pad 34 is released, and the optical disc 38 is released. As a result, the optical disc 38 is stored at a predetermined position in the optical disc storage device 22 (the motor 26 shown in FIG.
5 moves back one pitch). The drive mechanism 9 is driven again, and the first table 5 is rotated in the clockwise direction in FIG. As a result, the empty lower mold 40 moves to ST-6. In ST-6, there is no operation and it waits to return to ST-1 again.

By repeating the above operation, the optical disk 38 can be continuously manufactured. The box 25 of the disk substrate storage device 20 (or 21) that has been emptied by exhausting the disk substrates 18 (or 28) is replaced with one containing a predetermined number of disk substrates 18 (or 28). Similarly, the box 25 of the optical disk storage device 22 which is filled with a predetermined number of optical disks 38 is replaced with an empty one.

[0023]

As described above, according to the optical disk manufacturing apparatus of the present invention, it is possible to automatically and efficiently manufacture an optical disk.

[Brief description of drawings]

FIG. 1 is a front view of an optical disc manufacturing apparatus.

FIG. 2 is a plan view of an optical disc manufacturing apparatus.

[Fig. 3] Disk substrate storage device (optical disk storage device)
It is a perspective view of.

FIG. 4 is a disk substrate supply device (optical disk transfer device).
FIG.

FIG. 5 is a cross-sectional perspective view of a lower mold.

FIG. 6 is a perspective view of a peeling film peeling device.

FIG. 7 is a perspective view of a second pressure device.

FIG. 8 is a perspective view of a first substrate angle adjusting device.

FIG. 9 is a perspective view of a first pressure device.

FIG. 10 is a perspective view of a second first substrate angle adjusting device.

FIG. 11 is an explanatory diagram of an optical disc manufacturing process.

[Explanation of symbols]

 10 frame 12,14 turntable device 17 double-sided adhesive sheet 18,28 disk substrate 20,21 disk substrate storage device 22 optical disk storage device 29,30 disk substrate supply device 38 optical disk 40 lower mold 49 upper mold 50 peeling film peeling device 60, 70 Disk Substrate Angle Alignment Device 65,75 Position Sensor 73 Substrate Alignment Platform 80,82 Pressurizing Device 85 Pressing Type 90 Optical Disc Transfer Device

Claims (9)

(57) [Claims] 1. A double-sided pressure-sensitive adhesive sheet (17) is adhered to a signal recording surface side of a first disk substrate (18) by peeling off a release film (19a) on one side thereof, and then a double-sided pressure-sensitive adhesive sheet ( In an optical disk manufacturing apparatus for manufacturing an optical disk (38), the peeling film (17) is peeled off from the release film (19b) on the other surface side of the peeling film 17) to be bonded to the signal recording surface side of the second disk substrate (28). A disk substrate storage device (21, 22) for storing the disk substrates (18, 28) before the alignment and a disk substrate supply device (30) capable of holding the disk substrates (18, 28) for transportation and reversing the holding position. , 29) and a plurality of work positions (ST-1 to ST-6) are formed, and the first disc substrate supply device (30) moves the first substrate to the first substrate mounting position (ST-1). First turntable device (12) to which the disk substrate (18) of
2) a lower mold (40) arranged at each work position thereof and capable of holding the first disk substrate (18);
A substrate angle alignment table (73) to which the second disc substrate (28) is fed from the second disc substrate supply device (29)
And a plurality of work positions (ST-7, ST-4) are formed, and the second disc substrate (28) is received from the substrate angle alignment table (73) to the second substrate transfer position (ST-7). The second rotary base device (14) and the second rotary base device (1
4) an upper mold (49) arranged at each work position thereof and capable of holding the second disk substrate (28);
Peel off the release film (19a) on one side from the double-sided adhesive sheet (17), and then remove the first disc substrate (1
Peeling film peeling device (50) for peeling the peeling film (19b) on the other side from the double-sided pressure-sensitive adhesive sheet (17) adhered to 8) and the first disc substrate (18)
A first pressure device (8) capable of pressure-bonding the double-sided pressure-sensitive adhesive sheet (17) from which one release film (19a) has been peeled off.
0) and the first disc substrate (18) and the second disc substrate (28) are pressure-bonded to each other to form an optical disc (3
8), a second pressure device (82), an optical disc transfer device (90) capable of holding and transporting the finished optical disc (38) and reversing the holding position, and an optical disc (38). Optical disk storage device (22) for storing
And a first disk substrate supply device (30)
Is the take-out portion of the first disk substrate storage device (20) and the first
The second disc substrate supply device (29) is movable between the substrate attachment position (ST-1) and the second disc substrate storage device (21) and the second substrate delivery position (ST-7). The optical disc transfer device (90) is movable between
An optical disk manufacturing apparatus, which is movable between an optical disk take-out position (ST-5) and a storage section of an optical disk storage device (22). 2. The disk substrate storage device (20, 2)
1) is a frame (23), a box (25) movably supported by the frame (25) for accommodating a large number of disk substrates (18, 28), and the box (25) is moved to the extraction section side by one pitch. 2. The optical disk according to claim 1, further comprising a drive device (24, 26) capable of performing the drive, and the drive device (24, 26) is driven each time one disk substrate (18, 28) is taken out. Manufacturing equipment. 3. The optical disk storage device (22) comprises a frame (23), a box (25) movably supported by the frame (25) for storing a large number of optical disks (38), and a box (2).
5) is composed of a drive device (24, 26) capable of moving the optical disc (38) one pitch at a time toward the storage unit side, and the drive device (2
4. The optical disk manufacturing apparatus according to claim 1, wherein the optical disk drive unit is driven by the optical disk. 4. The disk substrate supply device (30, 29) and the optical disk transfer device (90) are suction pads (34).
A suction hand (35), a reversing mechanism (33) capable of reversing the suction hand (35) by 90 degrees, and a suction hand (3
5) vertically moving mechanism (32) capable of moving vertically
The optical disk manufacturing apparatus according to claim 1, comprising a) and a horizontal movement mechanism (32) capable of moving the suction hand (35) in the horizontal direction. 5. The peeling film peeling device (50) comprises:
Roller (5) for guiding the movement of the double-sided adhesive sheet (17)
1) and a double-sided pressure-sensitive adhesive sheet (1
7) A first take-up device (54, 55) for taking off one of the release films (19a) from one side and a double-sided pressure-sensitive adhesive sheet (1) pressure-bonded to the disk substrate (18).
7) A peeling mechanism (52, 58, 59) for peeling the other release film (19b) from the other surface, and a second winding device arranged downstream of the peeling mechanism (19b) for winding the other release film (19b). The optical disk manufacturing apparatus according to claim 1, comprising (56, 57). 6. The lower mold (40) has a center pin (42) arranged at the center thereof and an electromagnet (43) arranged on the outer periphery of the center pin (42). (4
9. The optical disk manufacturing apparatus according to claim 1, wherein 9) has an electromagnet (76) arranged at the center thereof. 7. The first pressurizing device (80) comprises an air cylinder (81) fixed to a fixed part and a rod (8) thereof.
1a) and a coupling (83) connected to the lower die (3), the coupling (83) being located at the first pressurization position (ST-2) of the first rotary base device (12). The optical disk manufacturing apparatus according to claim 1, wherein the optical disk manufacturing apparatus is capable of fitting with the center pin (42) of the (40). 8. A substrate angle adjusting device (70) for adjusting the angle of a second disk substrate (28) located on the substrate angle adjusting table (73) and transferring it to the upper die (49). The optical disk manufacturing apparatus according to claim 1. 9. The second pressurizing device (82) comprises an air cylinder (88) fixed to a fixed part and a rod (8) thereof.
8a) and a coupling (89) connected to the lower mold (8), the coupling (89) being located at the second pressure position (ST-4) of the first rotary base device (12). 7. The optical disk manufacturing apparatus according to claim 6, wherein the optical disk manufacturing apparatus is capable of fitting with the center pin (42) of 40).