JP2510962B2 - Composite thin film sensor module - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air conditioner used for controlling the environment of a human living space, a clean room, etc.
The present invention relates to a composite thin film sensor module provided in an environment adjusting device such as a humidifier or an air purifier.

[0002]

2. Description of the Related Art Heretofore, there has been proposed a composite thin film sensor in which an air temperature sensor, a humidity sensor, an air flow sensor and a radiation sensor are integrally formed on a silicon semiconductor chip of, for example, about 7 mm square. Among the sensors provided on the sensor chip of this semiconductor chip, the air temperature sensor, the air flow sensor, and the radiation sensor are detection targets by detecting a change in the resistance value of the thin film resistor formed on the semiconductor chip and performing a predetermined process. The value of is calculated. The humidity sensor detects humidity by detecting a change in electrostatic capacitance between the electrode and the moisture sensitive material.

[0003]

In the case of the above-mentioned prior art, when the radiant heat or the temperature or humidity is measured while exposing the circuit board of the sensor module provided with the above-mentioned sensor to the outside and applying radiation, There has been a problem that the temperature of the circuit board and the sensor chip itself rises and the humidity of the moisture sensitive material of the humidity sensor unit decreases, making it impossible to accurately measure temperature and humidity. Also, when the sensor module is installed in a box-shaped case, the sensor chip is located in the center of the circuit board, so even if the sensor chip on the circuit board is vertically exposed to the air flow, There is also a problem that the output value becomes small by staying and weakening.

The present invention has been made in view of the above-mentioned problems of the prior art. Even when an air temperature sensor, a humidity sensor, an air flow sensor, a radiation sensor and the like are integrally formed, each measuring object is accurately detected. An object of the present invention is to provide a composite thin film sensor module that can be manufactured.

[0005]

According to the present invention, at least a radiation sensor, an air temperature sensor and a humidity sensor are provided on a substrate,
This is a composite thin film sensor module in which a cover plate covering the upper part of the substrate at a predetermined distance is attached, and openings are formed only above the respective sensor parts of the cover plate. Further, it is a composite thin film sensor module in which a side surface between the cover plate and the substrate is an open portion through which an airflow can pass.

The present invention is also a composite thin film sensor module in which at least a radiation sensor, an air temperature sensor, and a humidity sensor are provided on a substrate, and the back surface of the substrate is attached to an airflow passage portion through which an airflow flows.

[0007]

In the composite thin film sensor module of the present invention, the radiant heat radiated to the portion other than the sensor is blocked by the cover member,
The substrate provided with the sensor is cooled by an air flow to suppress the temperature rise of the substrate due to radiant heat and eliminate the measurement error of temperature and humidity. Further, the measurement airflow that has flowed in from the opening of the cover plate is made to easily flow to the side surface, and the measurement sensitivity of the airflow is improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the composite thin-film sensor module 11 of this embodiment has a structure in which the surface of the substrate 10 is
A sensor chip 12 such as a square mm silicon semiconductor is attached. On the substrate 10, a signal processing circuit 14 that processes the output signal of the sensor chip 12, and
A signal adjusting unit 16 and the like for adjusting the output signal of the sensor chip 12 processed by the signal processing circuit 14 to be output to a control device (not shown) are provided. A lead wire 17 for outputting a detection signal from the sensor chip subjected to signal processing is connected to the signal adjusting unit 16.

The sensor chip 12 includes an air temperature sensor 20 which is a thin film resistor temperature sensor and a radiation sensor 22 which is a thin film resistor temperature sensor whose surface is covered with a black body material.
Are integrally formed on a semiconductor chip, and the temperature sensor 20 and the radiation sensor 22 are covered with a transparent windshield 24. Further, the sensor chip 12 has an air flow sensor 26 which is a temperature sensor of a thin film resistor exposed to the outside air and which receives an air flow, and a humidity sensor 3 provided with a moisture sensitive material 28 on the surface.
0 and 0 are integrally provided on the semiconductor chip.

Posts 31 are erected on the four corners of the substrate 10, and a cover plate 32 having a small emissivity such as an aluminum foil or an aluminum plate is attached to the posts 31. An opening 34 having substantially the same size as the sensor chip 12 is formed in the central portion of the cover plate 32 and directly above the sensor chip 12. The space between the substrate 10 and the cover plate 34 is open to the outside air, and there are no shields other than the columns on the four side surfaces, and an open portion 36 is formed.

The sensor module 11 of this embodiment has a duct 38, which is an air flow passage for cooling air shown in FIGS.
Attached to. The duct 38 is formed with an opening 40 into which the substrate 10 of the sensor module 11 is fitted, and is fixed with a back surface of the substrate 10 exposed in the duct 40 by a fixing member (not shown).

The operation of the sensor module 11 of this embodiment will be described below. This sensor module 1
1 is attached to, for example, an air conditioner,
It is attached to a duct 38 through which the cooling air of the air conditioner passes. The sensor chip 12 can detect the temperature and the flow of air in the room in which the air conditioner is installed, and can detect the radiant heat. Are attached to the sensor chip 12 at positions where they are radiated.

In the air temperature detection by the sensor module 11, the air temperature sensor 20 detects the temperature of the air in the room as a change in the resistance value of the thin film resistor which is the temperature sensor, and the windshield 24 is provided. The temperature can be detected without being affected by the wind. In the air flow detection, the air flow sensor 26 calculates the strength of the air flow from the output value of the temperature sensor in the state where the air flow hits and the output difference between the temperature sensor in the windshield 24. further,
The radiant heat is detected by the radiation sensor 2 in the part covered with the black body material.
The intensity of the radiant heat is detected from the difference between the output of 2 and the output value of the temperature sensor with the sensor exposed. Further, the humidity is detected by detecting the humidity in the air by changing the humidity of the humidity sensitive material 28 itself depending on the humidity in the air and changing the capacitance between the electrodes. And each sensor 2
The outputs of 0, 22, 26, 30 are subjected to predetermined signal processing by the signal processing circuit 14 and the signal adjusting unit 16, and are sent to a control circuit (not shown) as data of temperature, radiant heat, air flow, and humidity.

Here, since the cover plate 32 is attached to the sensor module 11 and fixed to the duct 38, radiant heat is radiated only to the sensor chip 12, and further, the radiant heat and the heat of the circuit cause the substrate 10 to radiate. As the temperature rises, the cold air passing through the duct 38 cools the substrate 10 from the back surface, and the temperature rises of the substrate 10 and the sensor chip 12 are suppressed. In addition, the airflow in the room is the cover plate 3
2 from the opening 34 toward the sensor chip 12,
Since the air flows from the surface of the sensor chip 12 to the open portions 36 on all sides, the air flow does not stay near the surface of the sensor chip 12 and flows smoothly.

According to the composite thin film sensor module of this embodiment, radiant heat is not radiated to the parts other than the sensor chip 12 of the substrate 10, and the sensor chip 12 is also provided.
An open portion 36 is formed around the, and the airflow entering from the opening 34 smoothly flows in all directions without stagnation.
Accurate measurement is possible. In addition, attach the back side of the board to the duct 3
Since it is cooled by 8, the measurement error due to the temperature rise of the substrate 10 can be suppressed, and more accurate measurement is possible. The result of the measurement experiment of the sensor module 11 according to this example is shown in FIG. As shown here, for example, at a wind speed of 2 m / s, the output of the airflow sensor 26 with and without the cover plate 32 is such that the output of 0.8 V rises to 2.0 V. . In addition, the halogen lamp is used as a radiation light source, and
When radiant heat equivalent to 0 W / m ² is applied and the cover plate 32 is not attached, the measured value of the air temperature sensor 20 is increased by 6 degrees C in terms of temperature, but should be suppressed by 1 degree C increase. I was able to. Furthermore, under the above radiant heat, the humidity sensor 26 also measured the humidity to be 15% RH.
It was possible to suppress the decrease in RH to 5% RH. In addition, under the radiant heat, in the case where the back surface of the substrate 10 is cooled by the cool air of the duct 38 and not, in the temperature measurement result, the temperature rise of 3 ° C. can be suppressed to 1.5 ° C. 12% RH in the measurement result of
Could be suppressed to 5% RH.

The present invention is not limited to the above-mentioned embodiment, and each sensor may be integrated in a hybrid, or another sensor may be combined. Further, a cover member having an opening may be attached on the cover plate. Further, the opening of the cover plate may be at least open above the radiation sensor, and may cover the other sensors.

[0017]

In the composite thin film sensor module of the present invention, the cover plate covering the upper side of the substrate is attached, and the openings are formed only above the respective sensors of the cover plate, so that the influence of radiant heat is minimized. The measurement error can be reduced. Moreover, since the side of the sensor module is an open part, the flow of the airflow is good, and the airflow measurement accuracy can be high. Further, since the back surface of the substrate is attached so as to be exposed to the airflow passage where the airflow is formed, the temperature rise of the substrate can be suppressed and the measurement accuracy of the sensor can be further enhanced.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a composite thin film sensor module according to an embodiment of the present invention.

FIG. 2 is a perspective view of the composite thin film sensor module of this embodiment.

FIG. 3 is a perspective view showing a mounting state of the composite thin film sensor module of this embodiment.

FIG. 4 is a perspective view of a duct to which the composite thin film sensor module of this embodiment is attached.

FIG. 5 is a graph showing the relationship between the wind speed and the output voltage value of the air flow sensor of the composite thin film sensor module and the composite thin film sensor module without the cover plate of this embodiment.

[Explanation of symbols]

 10 Substrate 11 Sensor Module 12 Sensor Chip 20 Air Temperature Sensor 22 Radiation Sensor 26 Air Flow Sensor 30 Humidity Sensor 32 Cover Plate 34 Opening 36 Opening 38 Duct

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshio Egashira 2-1-1, Niihama, Arai-cho, Takasago-shi, Hyogo Mitsubishi Heavy Industries, Ltd. Takasago Research Institute (72) Inventor Mitsuru Yokoyama 3158, Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Local Hokuriku Electric Industry Co., Ltd. (72) Inventor Minoru Matsuda 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Pref. Hokuriku Electric Industrial Co., Ltd. (72) Ichiro Ishiyama 3158 Shimo-Okubo, Osawano-cho, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (72) Inventor Masaki Kato 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (72) Tatsuya Nishida 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Kogyo Co., Ltd. (56) Reference JP-A-3-262923 (JP, A)

Claims (5)

(57) [Claims] 1. A substrate is provided with at least a radiation sensor, an air temperature sensor, and a humidity sensor, and a cover plate is provided above the substrate at a predetermined distance from the substrate, and only above the respective sensor portions of the cover plate. A composite thin film sensor module comprising an opening. 2. A semiconductor chip having a radiation sensor, an air temperature sensor, a humidity sensor, and an airflow sensor formed on a substrate,
A composite thin film sensor module comprising: a cover plate which covers the substrate at a predetermined distance from the substrate, and an opening is formed only above each of the sensor portions of the cover plate. 3. The composite thin film sensor module according to claim 1, wherein the side surface between the cover plate and the substrate is an open portion through which an air flow can pass. 4. The composite thin film sensor module according to claim 1, wherein the cover plate is formed of a metal material having a low emissivity. 5. A composite thin-film sensor module, comprising at least a radiation sensor, an air temperature sensor and a humidity sensor provided on a substrate, and a back surface of the substrate exposed and attached to an airflow passage portion where an airflow is formed. .