JP2509647Y2 - ダイオ―ド - Google Patents

ダイオ―ド

Info

Publication number
JP2509647Y2
JP2509647Y2 JP4944790U JP4944790U JP2509647Y2 JP 2509647 Y2 JP2509647 Y2 JP 2509647Y2 JP 4944790 U JP4944790 U JP 4944790U JP 4944790 U JP4944790 U JP 4944790U JP 2509647 Y2 JP2509647 Y2 JP 2509647Y2
Authority
JP
Japan
Prior art keywords
silicon substrate
diode
electrode
layer
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4944790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH048451U (US20100154137A1-20100624-C00004.png
Inventor
邦夫 上村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4944790U priority Critical patent/JP2509647Y2/ja
Publication of JPH048451U publication Critical patent/JPH048451U/ja
Application granted granted Critical
Publication of JP2509647Y2 publication Critical patent/JP2509647Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Photovoltaic Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Light Receiving Elements (AREA)
JP4944790U 1990-05-11 1990-05-11 ダイオ―ド Expired - Fee Related JP2509647Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4944790U JP2509647Y2 (ja) 1990-05-11 1990-05-11 ダイオ―ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4944790U JP2509647Y2 (ja) 1990-05-11 1990-05-11 ダイオ―ド

Publications (2)

Publication Number Publication Date
JPH048451U JPH048451U (US20100154137A1-20100624-C00004.png) 1992-01-27
JP2509647Y2 true JP2509647Y2 (ja) 1996-09-04

Family

ID=31567148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4944790U Expired - Fee Related JP2509647Y2 (ja) 1990-05-11 1990-05-11 ダイオ―ド

Country Status (1)

Country Link
JP (1) JP2509647Y2 (US20100154137A1-20100624-C00004.png)

Also Published As

Publication number Publication date
JPH048451U (US20100154137A1-20100624-C00004.png) 1992-01-27

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