JP2509276B2 - Solder paste printing machine - Google Patents
Solder paste printing machineInfo
- Publication number
- JP2509276B2 JP2509276B2 JP2561888A JP2561888A JP2509276B2 JP 2509276 B2 JP2509276 B2 JP 2509276B2 JP 2561888 A JP2561888 A JP 2561888A JP 2561888 A JP2561888 A JP 2561888A JP 2509276 B2 JP2509276 B2 JP 2509276B2
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- printing machine
- solder
- printing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、はんだペースト印刷機に係り、特に良好な
印刷を得るために好適なはんだペースト印刷機に関す
る。Description: TECHNICAL FIELD The present invention relates to a solder paste printing machine, and particularly to a solder paste printing machine suitable for obtaining good printing.
〔従来の技術〕 従来のはんだペースト印刷機は、第２図に示すよう
に、印刷するパターンに従って切欠け穴を設けたメタル
マスク２が版枠３に貼られており、スキージ４を移動さ
せることにより、はんだペーストがメタルマスク２の切
欠け穴を通してプリント基板１に塗布され印刷されるも
のである。なお、はんだペースト印刷機に関連するもの
には例えば、特開昭61−238465号が挙げられる。[Prior Art] In a conventional solder paste printing machine, as shown in FIG. 2, a metal mask 2 provided with cutout holes according to a pattern to be printed is attached to a plate frame 3, and a squeegee 4 is moved. Thus, the solder paste is applied and printed on the printed circuit board 1 through the cutout holes of the metal mask 2. Note that, for example, one related to the solder paste printing machine is JP-A-61-238465.
上記従来技術は、メタルマスクの版離れの機構につい
ては特に配慮されておらず、印刷したはんだペーストが
メタルマスクの版離れ時にメタルマスクに付着して持ち
去られ、既印刷済の位置のはんだペースト量が不足し、
はんだペーストの印刷量を均一にすることが困難である
という問題があった。The above-mentioned conventional technology does not pay particular attention to the mechanism for separating the plate of the metal mask, and the printed solder paste adheres to the metal mask when the plate of the metal mask is separated and is carried away, and the amount of the solder paste at the already printed position. Out of
There is a problem that it is difficult to make the print amount of the solder paste uniform.
本発明の目的は、はんだペーストの印刷量を均一にし
たはんだペースト印刷機を提供することにある。An object of the present invention is to provide a solder paste printing machine in which the printing amount of solder paste is uniform.
上記目的は、はんだペーストを通過せしめる切欠け穴
を有する可撓性マスクと、上記可撓性マスクに押し当
て、上記可撓性マスク上を移動させることによりはんだ
ペーストを基板に印刷するはんだ塗布手段を有するはん
だペースト印刷機において、上記はんだ塗布手段の移動
に連動して移動し、可撓性マスクと基板との版離れを促
進する版離れ機構を有することを特徴とするはんだペー
スト印刷機によって達成される。The above-mentioned object is a flexible mask having a cutout hole that allows the solder paste to pass through, and a solder applying unit that presses the flexible mask and moves the flexible mask to print the solder paste on a substrate. In a solder paste printing machine having, a solder paste printing machine characterized by having a plate separating mechanism that moves in conjunction with the movement of the solder applying means and promotes plate separation between the flexible mask and the substrate. To be done.
上記版離れ機構としては、例えば可撓性マスクと基板
との間にワイヤを設け、このワイヤをはんだ塗布手段の
移動に伴い、移動方向の後方から上記移動に連動して移
動させればよい。それによって、可撓性マスクの版離れ
角度を大きくかつ常に一定にできるので、可撓性マスク
側にはんだペーストが持ち去られる量が少なくなる。As the plate separating mechanism, for example, a wire may be provided between the flexible mask and the substrate, and the wire may be moved in association with the movement of the solder coating means from the rear in the movement direction in conjunction with the movement. As a result, since the plate separation angle of the flexible mask can be made large and always constant, the amount of solder paste carried away to the flexible mask side is reduced.
本発明のはんだペースト印刷機において、印刷直後に
版離れ機構が、メタルマスク等の可撓性マスクを基板か
ら急激に引離すことで、はんだペーストと可撓性マスク
の間に急激なせん断速度を与える。はんだペーストを持
つ特性であるせん断速度に比例し、粘度が低下するとい
うチクソ性により、可撓性マスク側にはんだペーストの
持ち去られる量が少なくなる。それ故はんだペーストの
印刷量を均一にすることができる。In the solder paste printing machine of the present invention, immediately after printing, the plate separating mechanism rapidly separates the flexible mask such as a metal mask from the substrate, and thereby a rapid shear rate is generated between the solder paste and the flexible mask. give. Due to the thixotropic property that the viscosity decreases in proportion to the shear rate, which is the characteristic of the solder paste, the amount of the solder paste carried away to the flexible mask side is reduced. Therefore, the printing amount of the solder paste can be made uniform.
以下、本発明の一実施例を図を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第３図は、本発明の一実施例によるはんだペースト印
刷機の印刷機構部を示す側面図、第１図は第３図に示す
実施例の版離れ機構の詳細説明図である。FIG. 3 is a side view showing a printing mechanism portion of a solder paste printer according to an embodiment of the present invention, and FIG. 1 is a detailed explanatory view of a plate separating mechanism of the embodiment shown in FIG.
本実施例によるはんだペースト印刷機は、第３図に示
すように、プリント基板１を固定する印刷テーブル６
と、この上方にあって、メタルマスク２の版枠３を保持
し固定する版枠ガイド16と、架台９に固着されたガイド
レール10に沿ってプリント基板１と平行に移動可能なベ
ースユニット15と、これに固定されたシリンダ12及びガ
イド棒11により上下移動可能なスキージホルダー13と、
スキージ４とを主要な構成要素として構成されている。
また、ベースユニット15に固着されたブロック７にはワ
イヤ取付けアングル８が配置され、このワイヤ取付けア
ングル８の先には、ベースユニット15と同時に平行に移
動可能なワイヤ５が取付けられて、版離れ機構を構成し
ている。The solder paste printer according to this embodiment, as shown in FIG. 3, has a printing table 6 for fixing the printed circuit board 1.
A plate frame guide 16 which is above this and holds and fixes the plate frame 3 of the metal mask 2, and a base unit 15 which is movable in parallel with the printed circuit board 1 along a guide rail 10 fixed to the mount 9. And a squeegee holder 13 that can be moved up and down by a cylinder 12 and a guide rod 11 fixed to this,
The squeegee 4 is used as a main component.
Further, a wire mounting angle 8 is arranged on the block 7 fixed to the base unit 15, and a wire 5 movable in parallel with the base unit 15 is mounted at the tip of the wire mounting angle 8 to separate the plate. It constitutes the mechanism.
はんだの印刷の際は、はんだをメタルマスク上に置
き、スキージを下降させ、ベースユニット15をプリント
基板１に平行に移動させることにより、スキージ４とワ
イヤ５を移動させる。When printing the solder, the solder is placed on the metal mask, the squeegee is lowered, and the base unit 15 is moved in parallel with the printed circuit board 1 to move the squeegee 4 and the wire 5.
このような構成によるはんだペースト印刷機の印刷動
作を第１図、第２図により説明する。The printing operation of the solder paste printing machine having such a configuration will be described with reference to FIGS. 1 and 2.
従来、第２図の様にスキージが下降して形成されるメ
タルマスク２とプリント基板１の角度、すなわち版離れ
角度θ２がスキージの移動と共に一定でなく、小さくな
るが、本実施例のはんだペースト印刷機においては、ス
キージ４の移動と同時に移動可能なワイヤ５をメタルマ
スク２とプリント基板１の間に、スキージ４のやや後方
に設けることにより、版離れ角度θ１は一定かつ従来よ
り大きくすることができた。Conventionally, the angle between the metal mask 2 formed by descending the squeegee and the printed circuit board 1 as shown in FIG. 2, that is, the plate separation angle θ 2 is not constant but becomes smaller with the movement of the squeegee. In the paste printing machine, the plate separation angle θ 1 is constant and larger than the conventional one by providing the wire 5 that can be moved simultaneously with the movement of the squeegee 4 between the metal mask 2 and the printed board 1 and slightly behind the squeegee 4. We were able to.
従って、このペースト印刷機の版離れ機構によれば、
メタルマスクとはんだペーストの版離れが最も良好で、
メタルマスク側にはんだペーストを持ち去られることが
少なく、均一なはんだペースト量を保持できるので、は
んだ付けの品質を向上できるという効果がある。Therefore, according to the plate separating mechanism of this paste printing machine,
The best separation between the metal mask and the solder paste,
The solder paste is less likely to be carried away on the metal mask side, and a uniform amount of solder paste can be maintained, so that the quality of soldering can be improved.
本発明によれば、はんだペースト印刷機のメタルマス
クの版離れを促進する機構を設けたので容易にはんだペ
ーストの印刷量を均一かつ適量にすることができるとい
う効果がある。According to the present invention, since the mechanism for promoting the plate separation of the metal mask of the solder paste printing machine is provided, there is an effect that the printing amount of the solder paste can be easily made uniform and appropriate.
第１図は本発明の一実施例による版離れ機構を説明する
説明図、第２図は従来のはんだペースト印刷機の印刷機
構を説明する説明図、第３図は本発明の一実施例による
はんだペースト印刷機の印刷機構部を示す側面図であ
る。 １……プリント基板、２……メタルマスク ３……版枠、４……スキージ ５……ワイヤ、６……印刷テーブル ７……ブロック ８……ワイヤ取付けアングル ９……架台、10……ガイドレール 11……ガイド棒、12……シリンダー 13……スキージホルダー、14……ガイドピン 15……ベースユニット、16……版枠ガイドFIG. 1 is an explanatory view for explaining a plate separating mechanism according to an embodiment of the present invention, FIG. 2 is an explanatory view for explaining a printing mechanism of a conventional solder paste printer, and FIG. 3 is according to an embodiment of the present invention. It is a side view which shows the printing mechanism part of a solder paste printer. 1 ... Printed circuit board, 2 ... Metal mask, 3 ... Plate frame, 4 ... Squeegee, 5 ... Wire, 6 ... Printing table, 7 ... Block, 8 ... Wire mounting angle, 9 ... Frame, 10 ... Guide Rail 11 …… Guide rod, 12 …… Cylinder 13 …… Squeegee holder, 14 …… Guide pin 15 …… Base unit, 16 …… Plate frame guide
Claims (1)
有する可撓性マスクと、上記可撓性マスクに押し当て、
上記可撓性マスク上を移動させることによりはんだペー
ストを基板に印刷するはんだ塗布手段を有するはんだペ
ースト印刷機において、上記はんだ塗布手段の移動に連
動して移動し、可撓性マスクと基板との版離れを促進す
る版離れ機構を有することを特徴とするはんだペースト
印刷機。1. A flexible mask having a cutout hole for allowing a solder paste to pass therethrough, and pressed against the flexible mask,
In a solder paste printer having a solder applying means for printing a solder paste on a substrate by moving on the flexible mask, the solder applying means moves in conjunction with the movement of the solder applying means, and the flexible mask and the board A solder paste printer having a plate separating mechanism for promoting plate separating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2561888A JP2509276B2 (en) | 1988-02-08 | 1988-02-08 | Solder paste printing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2561888A JP2509276B2 (en) | 1988-02-08 | 1988-02-08 | Solder paste printing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01202364A JPH01202364A (en) | 1989-08-15 |
| JP2509276B2 true JP2509276B2 (en) | 1996-06-19 |
Family
ID=12170873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2561888A Expired - Lifetime JP2509276B2 (en) | 1988-02-08 | 1988-02-08 | Solder paste printing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509276B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550581A (en) * | 1991-08-20 | 1993-03-02 | Noritake Co Ltd | Screen printing machine |
| JP3557438B2 (en) * | 1994-05-16 | 2004-08-25 | 谷電機工業株式会社 | Screen printing equipment |
| JP2006198786A (en) * | 2005-01-18 | 2006-08-03 | Dainippon Printing Co Ltd | Screen printing machine and squeegee device for screen printing machine |
| JP2006198791A (en) * | 2005-01-18 | 2006-08-03 | Dainippon Printing Co Ltd | Screen printing machine and squeegee for screen printing machine |
| JP4621031B2 (en) * | 2005-01-18 | 2011-01-26 | 大日本印刷株式会社 | Screen printer and squeegee device for screen printer |
-
1988
- 1988-02-08 JP JP2561888A patent/JP2509276B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01202364A (en) | 1989-08-15 |
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