JP2504637B2 - Cream solder arrangement status identification device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention irradiates light from a low position close to the height of the surface of a substrate having a cream solder disposed on the upper surface thereof, that is, irradiates light with a large incident angle to the substrate. The present invention relates to a cream solder arrangement status identification method and an identification apparatus for identifying the arrangement status of cream solder on a substrate based on the brightness of reflected light.

[0002]

2. Description of the Related Art Conventionally, when a granular cream solder is arranged on a printed circuit board and conveyed to the next step to join parts, etc., is the cream solder properly arranged on the circuit board? It was necessary to identify whether or not.

For this reason, as shown in FIG. 6, the camera 105 installed above the substrate 103 on which the cream solder 101 is disposed, and the low position so that the substrate 103 is irradiated with light having a large incident angle. Light source 107 disposed in the
Cream Han consisting arithmetic unit 109 for binarizing the arrangement status of the cream solder on the basis of the image information from the 05
A device arrangement status identification device 100 is known.

By the light irradiation from the light source 107, the reflected light from the cream solder 101 is in a so-called irregular reflection state, while the reflected light from the substrate 103 has a large emission angle along the substrate surface. . As a result, the camera 10
In FIG. 5, a portion where the cream solder 101 is arranged is bright, and an exposed portion of the substrate 103 is dark. The arithmetic device 109 further binarizes the image captured by the camera 105 in this way to clarify the bright and dark conditions. On the basis of this two value of the result, Cree, such as the planned
It is possible to judge whether or not the situation is such that the solder is installed.

[0005]

However, since this method is premised on that the substrate 103 is smooth, the substrate 103 will also cause diffused reflection depending on the state of the surface roughness, and the boundary line must be correctly grasped. There was a problem that I could not do it.

In addition to the surface roughness, the reflectance of the substrate 103 may be changed by forming a pre-flux film for preventing oxidation on the surface of the substrate 103 or changing the material. Since the reflectance of the cream solder 101 may change depending on the type of the cream solder 101, the cream solder 1
The reflected light from 01 and the reflected light from the substrate 103 may come close to each other in brightness. Therefore, there is a problem that correct binarization information may not be obtained depending on the material and other conditions.

On the other hand, if the light source 107 is arranged at an extremely low position and the incident angle with respect to the substrate is close to "90 degrees",
The reflected light from the substrate 103 is no longer captured by the camera 105, so that the outline of the cream solder 101 can be captured clearly, and the above-described problem can be addressed. However, in this case, there is a problem in that it is impossible to identify a so-called "mushroom" in which the cream solder 101 is not arranged in the center.

Therefore, the surface roughness and material of the substrate, cream han
Cream Han on the substrate without being influenced by the material of da
You can correctly identify the arrangement status of da, and does not generate a new identification problem of defective solder paste disposed Availability
The present invention has been completed for the purpose of providing an identification device .

[0009]

DISCLOSURE OF THE INVENTION Means and Actions for Solving the Problems The knowledge of the arrangement condition of the cream solder of the present invention, which is made in order to achieve the above object
Another device illuminates light from a direction with a large incident angle with respect to the substrate.
A large-incidence-angle light irradiating means for irradiating, and arranged above the substrate.
The reflected light detecting means and the reflected light detecting means
The brightness of the reflected light detected by the light irradiation from the light irradiation means
Large incident angle reflected light reading means for reading information, and the large incident angle
Based on the information on the brightness of the reflected light read by the reflected light reading means.
When deciding the status of cream solder on the board
Situation identification device for allocating cream solder with situation determining means
Light from a direction that has a small angle of incidence with respect to the substrate.
Small incident angle light irradiating means for irradiating, and the reflected light detecting means
Is detected by light irradiation from the small incident angle light irradiation means.
Small incident angle reflected light reader that reads information about the brightness of reflected light
And the reflected light read by the small incident angle reflected light reading means.
The light and dark information is read by the large incident angle reflected light reading means.
Corrects the information on the light and darkness of the reflected light that has been included, and the boundary line between the light and darkness
Clarification of light and darkness to be given to the arrangement determination means
Means for clarifying the brightness and darkness,
Or inverts the brightness information of the hand of a small incident angle the reflected light, the other
The boundary line is obtained by superimposing the light and dark information of
The feature is to clarify .

In the cream solder identifying apparatus of the present invention, the information on the brightness of the reflected light obtained by the irradiation of light with a large incident angle is shown.
The information is the same light and dark information as obtained by the conventional identification method. That is, based on the diffuse reflection of the cream solder, although light cream solder arranged partial, substrate exposed portion is dark manifestation information. On the other hand, the information on the brightness of the reflected light obtained by irradiating the light with a small incident angle is obtained as the total reflection from the exposed portion of the substrate and the light and darkness of the reflected light obtained as the diffuse reflection from the portion where the cream solder is arranged. Unlike the case of light irradiation with a large incident angle, the exposed portion of the substrate is bright and the portion where the cream solder is arranged appears dark.
Therefore, if the former is corrected by adding the latter information, the arrangement position of the cream solder in the former can be made clearer.

According to the bright and dark clarification means adopted by the present invention
For example, the bright part of the reflected light obtained by irradiating light with a large incident angle is emphasized more and the boundary with the dark part is clarified. The large incidence angle light irradiation means and the small incidence angle light irradiation means may be separately provided, or may be realized by moving one light irradiation means up and down .

[0012]

EXAMPLES Next, in order to clarify the present invention more, illustrating the preferred embodiments. The cream solder arrangement status identification device as an example is provided in the middle of the board conveying path from the step of arranging the cream solder to the board to the next step.

As shown in FIG. 1, the cream solder arrangement status identification device 1 has a camera 7 arranged above a substrate 5 on which the cream solder 3 is placed, and a large incidence on the substrate 5. From a substantially vertical direction to the substrate through a large incident angle light source 9 composed of a ring-shaped fluorescent lamp arranged at a low position so as to irradiate a corner light, and an optical fiber arranged immediately beside the camera 7. A small incident angle light source 11 that emits light and an arithmetic unit 1 that reads image information from the camera 7 and executes various control processes
3 is provided.

As shown in FIG. 2, the arithmetic unit 13 has a CP
This is a so-called computer equipped with U, ROM, RAM, etc., and is connected not only to the camera 7 but also to the respective light sources 9 and 11 to execute control commands for turning on / off the light source, and also connected to peripheral devices such as the conveyor 15. It is configured to perform various control processes.

The arithmetic unit 13 executes the procedure shown in FIG.
Cream solder arrangement status identification processing is performed. First,
The conveyor 15 is stopped (S1), and the small incident angle light source 11 is turned on (S2). Subsequently, at this time, the image of the reflected light imaged by the camera 7 is read (S3) and converted into information B of the brightness of the reflected light (S4). As shown in FIG. 4, the exposed portion of the substrate 5 is binarized into the information in which the exposed portion of the substrate 5 is "high level" and the portion where the cream solder is arranged is "low level".

Thereafter, the small incident angle light source 11 is turned off (S
5) Instead, the large incident angle light source 9 is turned on (S6), the image of the reflected light captured by the camera 7 at this time is read (S7), and this is converted into the information A of the brightness of the reflected light (S).
8). Contrary to the previous case, the binarized information is such that the portion where the cream solder is arranged is “high level” and the exposed portion of the substrate 5 is “low level”.

Subsequently, when the small incident angle light source 11 obtained in the process of S4 is turned on, the brightness information B of the reflected light is inverted (S9), and when the large incident angle light source 9 obtained in the process of S8 is turned on. It is superposed on the brightness information A of the reflected light (S10). Then, the portion where both of them overlap each other is identified as the cream solder disposition portion (S11).

After that, the large incident angle light source 9 is turned off (S12), and the discrimination result by the processing of S11 is compared with the previously stored information to determine whether the cream solder is installed or not.
A defect is judged (S13), and the conveyor 15 is driven (S1
4) Then, the same process is repeated for the next substrate.

According to this embodiment, as shown in FIG.
The portion where the cream solder is arranged can be more emphasized and the boundary line can be made clear. In the case of the conventional example, since the light of considerable brightness is obtained as reflected light from the exposed portion of the substrate, the boundary is not clear. Further, as shown in FIG. 5, the position where the large incident angle light source 9 is arranged can be increased, and the "middle-between" state in which the cream solder is not arranged in the center of the substrate can be properly identified. You can On the other hand, according to the conventional example, in order to improve the identification performance, the light source 107 has to be lowered, so that the "middle ridge" cannot be found.

Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments and can be implemented in various modes without departing from the scope of the invention. Not . Also, a moving mechanism that moves the height up and down with one light source may be provided so that the large incident angle position and the small incident angle position can be selected.

In addition, the type of light source is not limited to that of the embodiment.

[0022]

As described above, the cream of the present invention is used.
According to the apparatus for identifying the arrangement of the binder , the surface roughness, material, and
The crack on the board is not affected by the material of the ream solder .
The contour of each arrangement of the ream solder can be correctly identified, and a new problem of misidentification does not occur .

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a cream solder arrangement status identification device according to an embodiment.

FIG. 2 is a schematic configuration diagram showing a relationship between the arithmetic unit and equipment.

FIG. 3 is a flowchart of cream solder arrangement status identification processing in the embodiment.

FIG. 4 is a schematic diagram showing an identification situation according to an embodiment in comparison with a conventional example.

FIG. 5 is a schematic diagram showing an identification situation according to an embodiment in comparison with a conventional example.

FIG. 6 is a schematic configuration diagram of a conventional cream solder arrangement status identification device.

[Explanation of symbols]

1 ... Cream solder arrangement status identification device, 3 ... Cream solder, 5 ... Board, 7 ... Camera, 9 ...
.Large incident angle light sources 9, 11 ... Small incident angle light sources, 13 ...
・ Calculator, 15 ... Conveyor.

Claims (1)

(57) [Claims] 1. A large-incidence-angle light irradiating means for irradiating a substrate, on which cream solder is arranged at a predetermined position, with light from a direction having a large incident angle in order to obtain scattered reflected light of the cream solder. A reflected light detecting means arranged above the substrate, and a large incident angle reflected light reading means for reading the information on the brightness of the reflected light detected by the light irradiation from the large incident angle light irradiating means by the reflected light detecting means. means and, based on the brightness information of the large angle of incidence reflected light reading means read the reflected light, cream solder arrangement situation identifying that a disposition state determining means for determining the arrangement status of the cream solder on the substrate In the apparatus, a small incident angle light irradiating means for irradiating the substrate with light from a direction having a small incident angle, and a reflected light detected by the reflected light detecting means by the light irradiation from the small incident angle light irradiating means. Small incidence that reads information about light and dark The reflected light reading means and the light / dark information of the reflected light read by the small incident angle reflected light reading means corrects the light / dark information of the reflected light read by the large incident angle reflected light reading means, and a boundary between the light and dark e Bei a dark clarity means to clarify the lines given to the arrangement state determining means, said dark clarity means large incident angle the reflected light or small incident angle reaction
The light and dark information of one of the incident light is inverted, and the light and dark information of the other is inverted.
Clarify the boundary line by overlapping
A device for identifying the state of arrangement of cream solder, characterized in that