JP2503659Y2 - Device mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in the following order.

A Industrial field B Outline of device C Conventional technology (Fig. 13) D Problem to be solved by device (Fig. 13) E Means for solving problem (Figs. 1 and 5) F Action (FIGS. 1 and 5) G Example (G1) First Example (FIGS. 1 to 4) (G2) Second Example (FIGS. 5 to 10) (G3) Other implementations Examples (FIGS. 11 and 12) H Effect of the Invention A Field of Industrial Application The present invention relates to a device mounting device, which is suitable for mounting, for example, a magnetically sensitive device on a substrate.

B Outline of the Invention The first invention is an element mounting device for holding a predetermined element and fixing it on a substrate, wherein a pair of engaging projections is provided.
By fixing the holder on the substrate by inserting the engaging protrusion into the mounting hole on the substrate, the element can be fixed on the substrate by a simpler configuration and a simple method.

According to a second aspect of the invention, in the element mounting device, one end is connected to the element and the signal output lead frame held by the holding member is formed by a member having a spring property, and the holding member is provided on the substrate. When fixing, the spring force of the lead frame is used to bring the output end of the lead frame into contact with the wiring pattern formed on the substrate by a predetermined contact pressure. The wiring pattern can be electrically connected and the mounting area of the substrate can be reduced.

C Conventional Technology Conventionally, for example, in a video tape recorder (VTR), a so-called FG (frequency generato) is used as a rotation speed detection device for controlling the rotation speed of a rotary system such as a capstan.
It is designed to use a frequency generator called r).

That is, as shown in FIG. 13, for example, magnetic poles (N) and (S) of N and S poles are alternately formed on the peripheral side surface 3A of the rotary rotor 3 which constitutes the housing of the motor 1 for driving a capstan, The holder 4 holding the magnetic sensitive element 12 is fixed on the substrate 5 so as to face the side surface 3A.

That is, the holder 4 includes a fixed holder 9 fixed to the substrate 5 with screws 7 and a guide 9A of the fixed holder 9.
And 9B, the movable holder 10 is slidably fitted into the inner surface 9C of the fixed holder 9.

The movable holder 10 has a magnetic sensitive element 12 made of, for example, a magnetoresistive element held and fixed on a side surface 10A facing the peripheral side surface 3A of the rotary rotor 3 in a state of being fitted in the fixed holder 9, and fitted in the fixed holder 9. The movable holder 10
By sliding in a direction orthogonal to the peripheral side surface 3A of the rotary rotor 3, the gear gap between the peripheral side surface (that is, the magnetic pole surface) 3A of the rotary rotor 3 and the magnetic sensitive element 12 of the movable holder 10 is adjusted.

Thus, by fixing the movable holder 10 adjusted to a predetermined gear to the fixed holder 9 with an adhesive, the holder 4 as a whole is fixed on the substrate 5.

The lead frame 14 connected to the magnetic sensitive element 12 is pulled out from the side surface 10B of the movable holder 10 to the outside of the substrate 5
It is soldered to a wiring pattern (not shown) formed above, so that the output signal of the magnetic sensitive element 12 is output via the lead frame 14 and the wiring pattern on the substrate 5.

Thus, the magnetic pole formed on the peripheral side surface 3A of the rotary rotor 3 and the holder 4 to which the magnetic sensitive element 12 is fixed constitute the frequency generator 16, and the rotation of the rotary rotor 3 constitutes the peripheral side surface 3A and the magnetic sensitive element 12. By detecting a change in the magnetic field generated between them, a predetermined output signal whose frequency changes according to the number of rotations of the rotating rotor 3 is obtained.

D Problems to be Solved by the Invention By the way, in an electronic device such as a video tape recorder, the structure is simplified to simplify the manufacturing process and the size is reduced as much as possible, and the holder 4 as shown in FIG. If the magnetic sensitive element 12 is to be attached by using, the first problem is that the fixed holder 9 is used, so that the number of parts increases and the overall structure becomes complicated. Secondly, the lead drawn from the movable holder 10 is used. Frame 14 to substrate 5
By being soldered to the upper wiring pattern, the respective intervals of the lead frames 14 and the wirings on the substrate 5 connected to the lead frames 14 so that adjacent lead frames are not shorted by the soldering. Since the intervals between the patterns must be widened, the substrate area required for attaching the holder 4 becomes large, and for example, the video tape recorder to which the frequency generator is attached can be made more compact as a whole. In addition, there is a problem that the manufacturing process is complicated because the soldering process is required.

The present invention has been made in view of the above points, and an object of the present invention is to propose a device mounting device which can mount a magnetically sensitive device with a simple structure and a simple method and can further reduce the substrate area. It is a thing.

E Means for Solving the Problem In order to solve the problem, in the first invention, the periphery of the rotating body 3 having the holding member 20 for holding the predetermined element 12 on the side surface 20A and arranged on the substrate 5 is provided. In the element mounting device 21 for fixing the element 12 on the substrate 5 by fixing the holding member 20 on the substrate 5 so that the side surface 20A faces the side surface 3A, it is formed by a member having a spring property. At the same time, engaging claws 20J, 20K are formed at the tip end, and are slidably formed in mounting holes 5A, 5B formed in the substrate 5 in a direction orthogonal to the peripheral side surface 3A of the rotating body 3, and the mounting holes 5A, A pair of engaging projections 20C and 20D for fixing the holding member 20 on the substrate 5 by inserting the engaging claws 20J and 20K into the mounting holes 5A and 5B by inserting the engaging claws 20J and 20K into the 5B are provided. To

In the second invention, the predetermined element 12 is attached to the side surface 30A.
The rotating body 3 having the holding member 30 held on the substrate 5 and the lead frame 35 as the signal output means held by the holding member 30 and having one end connected to the element 12 and arranged on the substrate 5.
By fixing the holding member 30 on the substrate 5 so that the side surface 30A faces the peripheral side surface 3A, the element 12 is fixed on the substrate 5 and the output end 35B side of the lead frame 35 is formed on the substrate 5. Device mounting device for connecting to the specified wiring pattern 31
In the above, the peripheral side surface of the rotating body 3 is formed on the substrate 5 by forming the engaging claw at the tip end portion while being formed by a member having a spring property.
It is slidably formed in the mounting holes 5A, 5B formed in the direction orthogonal to 3A, and is inserted into the mounting holes 5A, 5B from the tip side so that the engaging claws are engaged with the mounting holes 5A, 5B. Therefore, a pair of engaging protrusions 32A, 32B for fixing the holding member 30 on the substrate 5
And the lead frame 35 is formed of a member having a spring property, and the output end 35B of the lead frame 35 is brought into a predetermined contact with the wiring pattern by the pressing force F when fixing the holding member 30 on the substrate 5. The contact was made by pressure.

The pair of engaging projections 20C and 20D provided on the holding member 20 constituting the F-action element mounting device 21 are snap-fitted into the mounting holes 5A and 5B corresponding to the pair of engaging projections 20C and 20D. By fixing the holding member 20 on the substrate 5 with the engaging claws 20J and 20K, the element 12 can be placed on the substrate 5 with a simple structure and a simple method without using the conventional fixed holder 9. Can be fixed.

Further, the lead frame 35 is formed by a member having a spring property, and the pressing force F when fixing the holding member 30 on the substrate 5
To press the output end 35B of the lead frame 35 against the wiring pattern formed on the substrate 5, the spring force of the lead frame 35 reliably contacts the output end 35B of the lead frame 35 with the wiring pattern. As a result, the lead frame 35 and the wiring pattern can be electrically connected to each other by a simpler method without the conventional soldering, and the element mounting area of the substrate 5 can be reduced. it can.

G Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

(G1) First Embodiment In FIG. 1 in which parts corresponding to those in FIG. 13 are designated by the same reference numerals, the holder 20 as a holding member holding and fixing the magnetic sensitive element 12 to the side surface 20A is the magnetic sensitive element 12 concerned. Is fixed to the substrate 5 so as to face the peripheral side surface 3A of the rotary rotor 3 with a predetermined gear gap therebetween.

The holder 20 is made of a resin material, and as shown in FIG. 2, a pair of engaging projections 20C and 20D are provided so as to project downward.
(Hereinafter referred to as a clip) is provided integrally with the holder 20, and the clips 20C and 20D have a spring property due to the elasticity of the resin material.

Further, the board 5 is provided with penetrating mounting holes 5A and 5B provided at intervals slightly smaller than the intervals of the clips 20C and 20D, and the clips 20C and 20D are located at the positions of the mounting holes 5A and 5B, respectively. The holder 20 is temporarily held on the substrate 5 by inserting it into the mounting holes 5A and 5B while flexing inwardly.

In this state, as shown in FIG. 3, the holder 20 has the engaging claws 20J and 2J provided on the side surfaces of the clips 20C and 20D.
The inclined surfaces 20L and 20M of 0K abut on the openings of the mounting holes 5A and 5B, respectively, and a pair of clips 20C and 2 having a spring property are provided.
0D is inwardly bent, thereby generating a pressing force F for pressing the holder 20 as a whole against the substrate 5.

Therefore, by reliably holding the holder 20 to the substrate 5 in the temporary holding state, the height of the holder 20 (that is, the height of the magnetic sensitive element 12) can be held at a target value, and at the same time in the manufacturing process. The holder 20 is designed so as not to move carelessly.

Also, in the holder 20, the protrusion guide portion that protrudes downward
The inner side surfaces 20G and 20H of 20E and 20F are adapted to abut the inner side surfaces 5A1 and 5B1 of the mounting holes 5A and 5B of the board 5, and the inner side surfaces 5A1 and 5B1 are connected to the rotating rotor 3
By being formed in a direction substantially orthogonal to the peripheral side surface (that is, the magnetic pole surface) 3A of (FIG. 1), the magnetic force fixed to the side surface 20A of the holder 20 in a state where the holder 20 is temporarily held on the substrate 5. The sensitive element 12 is arranged to face the peripheral side surface (that is, the magnetic pole surface) 3A of the rotary rotor 2 substantially in parallel.

Further, as shown in FIG. 4, when the holder 20 is temporarily held, it is slid in the direction indicated by the arrow a to adjust the gears with the peripheral side surface 3A of the rotary rotor 3 by the projection guide portions 20E and 20F. It is designed to guide the holder 20.

Thus, after the holder 20 is temporarily held, gear adjustment is performed, and then an adhesive is applied to the contact portion between the holder 20 and the substrate 5, so that the holder 20 is fixedly fixed to the substrate 5 and finally fixed and pulled out from the holder 20. The lead frame 22 is soldered to the wiring pattern formed on the surface of the substrate 5.

In this way, the frequency generator 25 (FIG. 1) is configured, and it is possible to output an output signal whose frequency changes according to the rotation speed of the rotary rotor 3.

According to the above configuration, the pair of clips 20C and 20D are snap-inserted into the mounting holes 5A and 5B of the board 5, so that the conventional fixed holder 9 (Fig. 13).
The structure can be simplified without using, and the holder 20 can be mounted on the substrate 5 by a simple mounting method.

(G2) Second Embodiment FIG. 5 showing the same parts as those in FIG. 1 with the same reference numerals shows a second embodiment of the present invention, which is a holder 30 and a lead frame held by the holder 30. The element mounting device 31 is configured by 35, and the clip 32B provided on the clip 32A and the opposite side of the holder 30 and having the same shape as the clip 32A, and the projection guide portion 33A and the projection guide portion 33A provided on the opposite side have the same shape. The protrusion guide portion 33B is snap-inserted into the mounting holes 5A and 5B provided in the substrate 5 in the same manner as in the first embodiment, and the holder 30 is fixed to the substrate 5.

The holder 30 is attached such that the side surface 30A faces the peripheral side surface (that is, the magnetic pole surface) 3A of the rotating rotor 3, and
The magnetic sensitive element 12 is fixed to A.

Therefore, in FIG. 6 showing the bottom surface 30D of the holder 30, the clip 32A abuts on the end surface 5A2 of the mounting hole 5A of the substrate 5 and the clip 32B abuts on the end surface 5B2 of the mounting hole 5B, whereby the clips 32A and 32B. Thus, the holder 30 is held on the substrate 5, and the side surface of the projection guide portion 33A abuts on the end surface 5A1 of the mounting hole 5A and the side surface of the projection guide portion 33B abuts on the end surface 5B1 of the mounting hole 5B. The holder 30 can slide toward the peripheral side surface 3A of the rotary rotor 3 in the same manner as described above with reference to FIG. 4 while being held on the substrate 5.

Thus, the gear gap between the side surface 30A of the holder 30 and the peripheral side surface 3A of the rotary rotor 3 can be adjusted.

Here, as shown in FIG. 7, a lead frame 35 is connected to the lower side of the magnetic sensitive element 12 by bending one end 35A upward, and is protected by a sealant 37 and is held by the holder 30.
Is fixedly held by insert molding on the output end 35B
Forms a curved shape that is drawn out from the side surface 30B of the holder 30 and projects downward.

The lead frame 35 is made of a conductive material having a spring property, and is in a state before the holder 30 is attached to the substrate 5, as shown by a dashed line in FIG.
The cantilever spring structure is held by the holder 30 so as to project downward from the height (i.e., the height of the surface 5F of the substrate 5 when the holder 30 is attached to the substrate 5).

Therefore, when the holder 30 is mounted on the substrate 5 by a predetermined pressing force F, the output end portion 35B of the lead frame 35 is pushed upward by the surface 5F of the substrate 5, and the spring of the lead frame 35 is The output end portion 35 is
B contacts the surface 5F of the substrate 5 at the contact portion 39 by a predetermined contact pressure.

Thus, the output end 35B of the lead frame 35 can electrically and surely contact the wiring pattern (not shown) formed on the surface 5F of the substrate 5 at the contact portion 39. The obtained predetermined output signal can be output to the outside through the lead frame 35, the lead frame 35 and the contact portion 39 of the wiring pattern on the substrate 5, and the wiring pattern.

According to the above configuration, by using a material having a spring property as the lead frame 35, the lead frame 35
When the 35 is connected to the wiring pattern of the substrate 5, the holder 30 can be electrically connected by the contact pressure due to the spring property of the lead frame 35 without the conventional soldering. The lead frame 35 can be connected to the wiring pattern by a simple method of simply fixing the lead frame 35 to the wiring pattern, and the spacing between the lead frames 35 pulled out from the holder 30 by not soldering and It is possible to narrow the interval between the wiring patterns formed on the substrate 5 to be connected, which makes it possible to further reduce the substrate area.

Although the output end portion 35B of the lead frame 35 has a cantilever spring structure in the above-described embodiment, the present invention is not limited to this and may have a both end support structure.

That is, as shown in FIGS. 8 and 9 in which parts corresponding to those in FIG. 5 are designated by the same reference numerals, the lead frame 42 having one end 42A supported by the holder 40 and connected to the magnetic sensitive element 12 is connected.
The output end portion 42B is supported by the support member 42C, and the lead frame 42 is bent in the bending portion 42D in the direction indicated by the arrow b, so that the support member 42C is placed between the hook 43 of the holder 40 and the support pedestal 44. Hold.

In this state, when the holder 40 is fixed on the substrate 5 by inserting the clips 32A and 32B of the holder 40 into the mounting holes 5A and 5B of the substrate 5 as shown in FIG. The curved contact portion 46 formed on the portion 42B is pressed against the wiring pattern formed on the substrate 5 by the mounting pressure F of the holder 40.

At this time, the output end portion 42B of the lead frame 42 is brought into contact with and supported by the support surface 40C of the holder 40 and the support member 4
The lead frame 42 is supported at both ends by the output end portion 42B and the support member 42C supported by the support pedestal 44 by the 2C being brought into contact with and supported by the support pedestal 44.

Thus, the contact portion 46 of the lead frame 42 comes into contact with the substrate 5 by a more stable contact pressure.
The lead frame 42 can be electrically connected to the wiring pattern by a simple method of fixing the holder 40 on the substrate 5 without soldering the drawing) to the wiring pattern on the substrate 5.

(G3) Other Embodiments (1) In the above-mentioned embodiment, two projection guide portions 20E which are adapted to be inserted into the mounting holes 5A and 5B of the substrate 5 are provided.
And holders 20, 30 or 4 with 20F (or 33A and 33B)
Although the case where 0 is used has been described, the present invention is not limited to this, and the holder may be positioned by one protrusion guide portion.

For example, as shown in FIG. 11, a protrusion guide portion 50F is provided at a position sandwiched by the clips 50C and 50D on the bottom surface 50E of the holder 50, and the protrusion guide portion 50F is formed on the substrate 5 in correspondence therewith. It is adapted to be fitted in the guide hole 5C.

Further, as shown in FIG. 12 showing the bottom surface 50E of the holder 50, the projection guide portion 50F is formed in a flat rectangular shape, and the guide hole 5C formed in the substrate 5 is formed in the projection guide portion 50F.
The holder 50 can be slid in the direction orthogonal to the peripheral side surface 3A of the rotary rotor 3 by being formed in such a shape that the projection guide portion 50F can slide in the longitudinal direction of (i.e., the direction indicated by the arrow a). Can be guided as.

(2) In the above embodiment, the holders 20, 30, 40 and
Although the case where each of 50 is made of a resin material has been described, the present invention is not limited to this, and other materials such as a metal material may be used. Clip 20C, 20D, 32A, 32B and 50C, 50D
It is only necessary that the elastic force can be used to insert into the mounting holes 5A and 5B of the substrate 5 in a snap manner.

(3) In the above-described embodiment, the case where the magnetoresistive element is used as the magnetic sensitive element 12 has been described, but the present invention is not limited to this, and another magnetic sensitive element such as a Hall element may be used.

(4) In the above-described embodiment, the present invention is applied when fixing the magnetic sensitive element 12 on the substrate, but the present invention is not limited to this, and various other elements such as a photo-detecting element are attached. In this case, the present invention can be widely applied.

(5) In the above-mentioned embodiment, the case where the present invention is applied to the rotation speed detecting device (that is, the frequency generating device 25) of the capstan motor of the VTR is described, but the present invention is not limited to this, and for example, magnetic The present invention can be applied to a rotation speed detection device for various other motors such as a motor for rotating a magnetic disk of a disk device.

(6) In the above-described embodiment, the case where the present invention is applied to the rotation speed detection device of a motor has been described, but the present invention is not limited to this, and when detecting the rotation speed of various other rotating bodies, Furthermore, the present invention can be widely applied to mounting various other devices adapted to be mounted on a substrate.

H Effect of the Invention As described above, according to the first invention, a pair of engaging projections for attachment provided on the holding member for holding a predetermined element is attached to the board corresponding to this. Since the holding member is inserted into the hole to fix the holding member on the substrate, it is possible to realize an element mounting device that can fix a predetermined element on the substrate with a simpler configuration and a simple method.

According to the second invention, the lead frame is electrically connected to the wiring pattern formed on the substrate by using the elastic force of the lead frame connected to the element at one end and pulled out to the outside of the holding member at the other end. By connecting it,
It is possible to realize an element mounting device that can connect the lead frame to the wiring pattern by a simpler method and can further reduce the substrate area for the connection.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a device mounting apparatus according to the present invention, FIG. 2 is a schematic perspective view showing a mounting method of the device mounting apparatus, and FIG. 3 shows a structure of a clip and a projection guide portion. FIG. 4 is a rear view, FIG. 4 is a schematic side view for explaining the adjustment of the gear between the holder and the rotary rotor, FIG. 5 is a perspective view showing a second embodiment of the device mounting apparatus according to the present invention, and FIG. FIG. 7 is a bottom view showing a protrusion guide portion of a holder according to the second embodiment, FIG. 7 is a side view showing a lead frame having a cantilever spring structure according to the second embodiment, and FIG. 8 is a front view showing a lead frame having a double-end support structure. 9 and 10 are partial cross-sectional views for explaining the supporting method of the lead frame, and FIG.
FIG. 12 is a rear view showing another embodiment of the protrusion guide portion, FIG. 12 is a bottom view showing the bottom surface thereof, and FIG. 13 is a perspective view showing a conventional example. 4, 20, 30, 40, 50 ... Holder, 5 ... Substrate, 5A, 5B ...
… Mounting holes, 20C, 20D, 32A, 32B… Clips, 20E, 2
0F, 33A, 33B, 50C ...... Projection guide section, 20J, 20K ...... Engaging claws, 22, 35, 42 ...... Lead frame.

Claims (2)

(57) [Scope of utility model registration request] 1. A holding member for holding a predetermined element on a side surface thereof, wherein the holding member is fixed on the substrate such that the side surface faces a peripheral side surface of a rotating body arranged on the substrate. Therefore, in the device mounting device for fixing the device on the substrate, the device is formed by a member having a spring property and the engaging claw is formed on the tip end, and the device is orthogonal to the peripheral side surface of the rotating body on the substrate. Is formed slidably in a mounting hole drilled in the direction
A pair of engaging projections for fixing the holding member on the substrate by inserting the engaging claw into the mounting hole from the tip end side and engaging the engaging claw with the mounting hole. Device mounting device. 2. A rotation member arranged on a substrate, comprising a holding member for holding a predetermined element on a side surface and a lead frame as a signal output means held by the holding member and having one end connected to the element. By fixing the holding member on the substrate so that the side surface faces the peripheral side surface of the body, the element is fixed on the substrate and the output end side of the lead frame is formed on the substrate. In the device mounting device for connecting to the wiring pattern, the device is formed by a member having a spring property, an engaging claw is formed at the tip end, and the substrate is drilled in a direction orthogonal to the peripheral side surface of the rotating body. Slidably formed in the mounting hole,
The lead frame is provided with a pair of engaging protrusions for fixing the holding member on the substrate by inserting the engaging claws into the mounting holes from the tip end side and engaging the engaging claws with the mounting holes. The output end of the lead frame is brought into contact with the wiring pattern by a predetermined contact pressure by a pressing force when the holding member is fixed on the substrate. The element mounting device characterized in that