JPH0543504Y2 - - Google Patents

Info

Publication number
JPH0543504Y2
JPH0543504Y2 JP5100985U JP5100985U JPH0543504Y2 JP H0543504 Y2 JPH0543504 Y2 JP H0543504Y2 JP 5100985 U JP5100985 U JP 5100985U JP 5100985 U JP5100985 U JP 5100985U JP H0543504 Y2 JPH0543504 Y2 JP H0543504Y2
Authority
JP
Japan
Prior art keywords
board
lower cover
base
bracket
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5100985U
Other languages
Japanese (ja)
Other versions
JPS61168692U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5100985U priority Critical patent/JPH0543504Y2/ja
Publication of JPS61168692U publication Critical patent/JPS61168692U/ja
Application granted granted Critical
Publication of JPH0543504Y2 publication Critical patent/JPH0543504Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は着脱可能に設けられた基板を有する電
子装置における基板と装置ベース間の接地構造に
関するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a grounding structure between a substrate and a device base in an electronic device having a removably installed substrate.

(従来の技術) 従来、この種電子装置の基板接地構造は第3図
又は第4図に示されるものが知られている。図
中、 1は基板、2は装置のロワカバー、3はロワカ
バー2に装着された導電性ベース例えば金属板、
4は接続コード、5は舌状の筐体接地〔以下FG
(Frame Ground)という〕用弾性部分である。
(Prior Art) Conventionally, the substrate grounding structure of this type of electronic device is known as shown in FIG. 3 or FIG. 4. In the figure, 1 is a substrate, 2 is a lower cover of the device, and 3 is a conductive base attached to the lower cover 2, such as a metal plate.
4 is the connection cord, 5 is the tongue-shaped case ground [hereinafter FG
It is an elastic part called (Frame Ground).

第3図は従来の基板の筐体接地構造の一例を示
す斜視図であつて、装置のロワカバー2にベース
3が載置され、ロワカバー2と一体に成形された
突起状の基板ガイド3aに基板ガイド1が挿着さ
れている。そして、接続コード4を基板1とベー
ス3にその両端を固定することによつて基板1か
らベース3に接地するように構成されている。
FIG. 3 is a perspective view showing an example of a conventional board casing grounding structure, in which a base 3 is placed on a lower cover 2 of the device, and a protruding board guide 3a formed integrally with the lower cover 2 is attached to a board. Guide 1 is inserted. The connection cord 4 is configured to be grounded from the board 1 to the base 3 by fixing both ends thereof to the board 1 and the base 3.

また、第4図は他の従来例を示した側面図で、
Aは基板挿着前、Bは基板挿着後の状態を示して
いる。この場合は、装置のロワカバー2にベース
3が載置される構成は第3図の従来例と同様であ
るが、基板1の下面後端にFG用スプリング5が
固定され基板挿着後、このFG用スプリング5が
導電性ベース3に押圧されて基板1がベース3に
接地される構成になつている点が第3図の場合と
異つている。
Moreover, FIG. 4 is a side view showing another conventional example,
A shows the state before the board is inserted, and B shows the state after the board is inserted. In this case, the configuration in which the base 3 is placed on the lower cover 2 of the device is the same as the conventional example shown in FIG. The difference from the case shown in FIG. 3 is that the FG spring 5 is pressed against the conductive base 3 and the substrate 1 is grounded to the base 3.

(考案が解決しようとする問題点) しかしながら、第3図に示されるような基板の
接地構成では、接続コード4が固定されているの
で基板1の着脱が困難であり、第4図に示される
構成の場合には、基板1の着脱時にFG用スプリ
ング5を変形させたり、安定した接地を行なうこ
とが難かしいといつた欠点があつた。
(Problem to be solved by the invention) However, in the grounding configuration of the board as shown in FIG. 3, it is difficult to attach and detach the board 1 because the connection cord 4 is fixed. In the case of this structure, there were drawbacks such as deformation of the FG spring 5 when the board 1 was attached and detached, and difficulty in achieving stable grounding.

そこで、本考案は前記の従来技術が持つていた
基板着脱時の困難さ及び不安定さを除去し、基板
実装構造の優れた電子装置を提供することを目的
とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to eliminate the difficulty and instability of mounting and removing a board, which are present in the prior art, and to provide an electronic device with an excellent board mounting structure.

(問題点を解決するための手段) 上記の目的を達成するための本考案の構成を実
施例に対応する第1図について説明すると、本考
案は、着脱可能に設けられた基板とロワカバー上
に設けられた導電性ベース間に筐体接地手段を有
する電子装置において、基板11下面の一端に
FG用ブラケツト11aを設け、基板11の挿着
時に該ブラケツト11aを導電性ベース13の一
端に形成した弾性部分13aとロワカバー12間
に挿入して挟着することによつて、基板11の筐
体接地構造を形成したものである。
(Means for Solving the Problems) The structure of the present invention for achieving the above object will be explained with reference to FIG. 1 corresponding to the embodiment. In an electronic device having a case grounding means between the conductive bases provided, at one end of the bottom surface of the substrate 11
By providing the FG bracket 11a and inserting and sandwiching the bracket 11a between the elastic portion 13a formed at one end of the conductive base 13 and the lower cover 12 when the board 11 is inserted, the casing of the board 11 can be secured. It forms a grounding structure.

(作用) 本考案によれば、以上のように基板11には
FG用ブラケツト11aが垂設された他、例えば
金属製のベース13の一端にはFG用ブラケツト
11aと接合するため、先端を僅かに上向きに曲
げたガイド部13bを有する複数枚の舌片状弾性
部分13aが形成されているので、基板11を挿
着するとき、FG用ブラケツト11aが該舌片1
3aとロワカバー12間に容易かつ安定に挿入さ
れると共に、弾性部分13aの弾性によつてFG
用ブラケツト11aはベース13に密着して良好
な筐体接地効果をもたらす。これにより優れた基
板実装構造の電子装置が得られ、したがつて、前
記問題点を除去出来るのである。
(Function) According to the present invention, as described above, the substrate 11 has
In addition to the vertically disposed FG bracket 11a, a plurality of tongue-like elastic plates each having a guide portion 13b whose tip is slightly bent upward is attached to one end of the base 13 made of metal, for example, in order to connect to the FG bracket 11a. Since the portion 13a is formed, when the board 11 is inserted, the FG bracket 11a is attached to the tongue piece 1.
3a and the lower cover 12, and due to the elasticity of the elastic portion 13a, the FG
The bracket 11a is in close contact with the base 13 to provide a good grounding effect for the casing. As a result, an electronic device with an excellent board mounting structure can be obtained, and the above-mentioned problems can therefore be eliminated.

(実施例) 第1図は本考案の実施例を示す分解斜視図であ
つて、図中、11は一端にFG用ブラケツト11
aを垂設し他端に引き手11bを突設した基板、
12はプラスチツクなどで成形されたロワカバ
ー、13はこのロワカバー12上に装着された金
属性ベース板でその入端部には弾性効果が得られ
るように切り込みを入れて複数枚の舌片状の弾性
部分13aが形成され、その先端は上方に僅かに
折り曲げてガイド13bを形成している。なお、
14はロワカバー12と一体成形された突起状基
板ガイドで複数個が2列に対向して設けられ、こ
れらの対向面には基板着脱時のガイド溝が設けら
れている。
(Embodiment) Fig. 1 is an exploded perspective view showing an embodiment of the present invention, and in the figure, reference numeral 11 indicates an FG bracket 11 at one end.
a board having a vertically extending handle 11b and a puller 11b protruding from the other end;
12 is a lower cover molded from plastic or the like; 13 is a metal base plate mounted on the lower cover 12; its input end is cut into a plurality of tongue-like elastic pieces to provide an elastic effect; A portion 13a is formed, the tip of which is slightly bent upward to form a guide 13b. In addition,
A plurality of protruding board guides 14 are integrally molded with the lower cover 12 and are provided in two rows facing each other, and guide grooves for mounting and removing the board are provided on their opposing surfaces.

次に以上のように構成された実施例の基板実装
法について第2図を用いて説明すると、まず、第
1図に示す如く、基板11の引き手11bを矢印
方向に引き込むと、基板11は基板ガイド14に
案内されてベース13の方に引き入れられる。同
時に、基板11のFG用ブラケツト11aは第2
図Aに示す如く矢印方向に移動し、ロワカバー1
2とベース13の先端部に突き当り、さらに移動
を続けると第2図Bに示すように、ロワカバー1
2とベース13間に弾性部分13aの下圧力に抗
してFG用ブラケツト11aが挟着されて堅持さ
れる。したがつて、基板11はベース3に対して
良好な接地を行なうことが出来る。また、基板1
1を脱離する場合は矢印と逆方向に引き手11b
で抜き出すことによつて容易かつ安全に行なうこ
とが出来る。
Next, the board mounting method of the embodiment configured as above will be explained using FIG. 2. First, as shown in FIG. 1, when the puller 11b of the board 11 is pulled in the direction of the arrow, the board 11 is The substrate is guided by the substrate guide 14 and pulled toward the base 13. At the same time, the FG bracket 11a of the board 11 is
Move the lower cover 1 in the direction of the arrow as shown in Figure A.
2 and the tip of the base 13, and as it continues to move, as shown in FIG. 2B, the lower cover 1
The FG bracket 11a is sandwiched and firmly supported between the FG 2 and the base 13 against the downward pressure of the elastic portion 13a. Therefore, the substrate 11 can be well grounded to the base 3. In addition, substrate 1
1, pull the puller 11b in the opposite direction to the arrow.
This can be done easily and safely by pulling it out.

(考案の効果) 以上詳細に説明したように本考案によれば、基
板に垂設されたFG用ブラケツトをベースに弾性
的に設けた舌片状弾性部分とロワカバー間に挟み
込むことによつて安定した良好な接地が得られ、
装置への基板着脱が容易となり、従来のような着
脱によるFG用スプリングの変形を防止すること
が可能となつた。したがつて、基板の交換作業が
容易となり基板実装構造の優れた電子装置を安価
に提供できる効果がある。
(Effects of the invention) As explained in detail above, according to the invention, the FG bracket vertically installed on the board is stabilized by sandwiching it between the tongue-like elastic part provided elastically on the base and the lower cover. A good grounding can be obtained,
It has become easier to attach and detach the board to the device, and it has become possible to prevent the deformation of the FG spring due to attachment and detachment as in the past. Therefore, it is possible to easily replace the board, and it is possible to provide an electronic device with an excellent board mounting structure at a low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す分解斜視図、第
2図A,Bはそれぞれ本考案実施例の基板脱・着
時の側面図、第3図は従来例を示す斜視図、第4
図A,Bは従来例の基板脱・着時の側面図であ
る。 11……基板、11a……FG用ブラケツト、
11b……引き手、12……ロワカバー、13…
…ベース、13a……弾性部分、14……基板ガ
イド。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIGS. 2A and B are side views of the embodiment of the present invention when the board is removed and attached, respectively, FIG. 3 is a perspective view showing a conventional example, and FIG.
Figures A and B are side views of conventional circuit boards when they are removed and attached. 11... Board, 11a... FG bracket,
11b...Puller, 12...Lower cover, 13...
... Base, 13a ... Elastic part, 14 ... Board guide.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 着脱可能に設けられた基板と、ロワカバー上に
装着された導電性ベース間に筐体接地手段を有す
る電子装置において、前記基板下面の一端に筐体
接地用ブラケツトを垂設し、基板挿着時に該ブラ
ケツトを前記導電性ベースの一端に形成した弾性
部分と前記ロワカバー間に挿入して挟着すること
により基板の筐体接地を行なうことを特徴とする
電子装置。
In an electronic device having a case grounding means between a removably installed board and a conductive base mounted on a lower cover, a case grounding bracket is provided vertically at one end of the bottom surface of the board, and when the board is inserted, An electronic device characterized in that the substrate is grounded to the casing by inserting and sandwiching the bracket between an elastic portion formed at one end of the conductive base and the lower cover.
JP5100985U 1985-04-08 1985-04-08 Expired - Lifetime JPH0543504Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5100985U JPH0543504Y2 (en) 1985-04-08 1985-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5100985U JPH0543504Y2 (en) 1985-04-08 1985-04-08

Publications (2)

Publication Number Publication Date
JPS61168692U JPS61168692U (en) 1986-10-20
JPH0543504Y2 true JPH0543504Y2 (en) 1993-11-02

Family

ID=30569673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5100985U Expired - Lifetime JPH0543504Y2 (en) 1985-04-08 1985-04-08

Country Status (1)

Country Link
JP (1) JPH0543504Y2 (en)

Also Published As

Publication number Publication date
JPS61168692U (en) 1986-10-20

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