JP2024511771A5 - - Google Patents

Info

Publication number
JP2024511771A5
JP2024511771A5 JP2023557760A JP2023557760A JP2024511771A5 JP 2024511771 A5 JP2024511771 A5 JP 2024511771A5 JP 2023557760 A JP2023557760 A JP 2023557760A JP 2023557760 A JP2023557760 A JP 2023557760A JP 2024511771 A5 JP2024511771 A5 JP 2024511771A5
Authority
JP
Japan
Prior art keywords
housing
heat
heat pipe
thermal contact
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023557760A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024511771A (ja
Filing date
Publication date
Priority claimed from EP21187391.4A external-priority patent/EP4066746A1/en
Application filed filed Critical
Priority claimed from PCT/EP2022/056179 external-priority patent/WO2022207268A1/en
Publication of JP2024511771A publication Critical patent/JP2024511771A/ja
Publication of JP2024511771A5 publication Critical patent/JP2024511771A5/ja
Pending legal-status Critical Current

Links

JP2023557760A 2021-04-01 2022-03-10 超音波プローブの熱放散 Pending JP2024511771A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163169345P 2021-04-01 2021-04-01
US63/169,345 2021-04-01
EP21187391.4A EP4066746A1 (en) 2021-04-01 2021-07-23 Heat dissipation in ultrasound probes
EP21187391.4 2021-07-23
PCT/EP2022/056179 WO2022207268A1 (en) 2021-04-01 2022-03-10 Heat dissipation in ultrasound probes

Publications (2)

Publication Number Publication Date
JP2024511771A JP2024511771A (ja) 2024-03-15
JP2024511771A5 true JP2024511771A5 (enExample) 2025-03-07

Family

ID=80785061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023557760A Pending JP2024511771A (ja) 2021-04-01 2022-03-10 超音波プローブの熱放散

Country Status (4)

Country Link
US (1) US12357280B2 (enExample)
EP (1) EP4312788B1 (enExample)
JP (1) JP2024511771A (enExample)
WO (1) WO2022207268A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1059595S1 (en) * 2019-10-03 2025-01-28 GE Precision Healthcare LLC Medical imaging device
US20230190240A1 (en) * 2021-12-22 2023-06-22 GE Precision Healthcare LLC Passive cooling for medical imaging probes
US20240365671A1 (en) * 2023-04-28 2024-10-31 GE Precision Healthcare LLC Methods and systems for a modified backing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213103A (en) * 1992-01-31 1993-05-25 Acoustic Imaging Technologies Corp. Apparatus for and method of cooling ultrasonic medical transducers by conductive heat transfer
US5721463A (en) 1995-12-29 1998-02-24 General Electric Company Method and apparatus for transferring heat from transducer array of ultrasonic probe
DE602005011644D1 (de) * 2004-10-27 2009-01-22 Toshiba Kk Ultraschallsonde und Ultraschalldiagnosegerät
JP4851210B2 (ja) * 2006-03-15 2012-01-11 日立アロカメディカル株式会社 超音波診断装置
US8475375B2 (en) * 2006-12-15 2013-07-02 General Electric Company System and method for actively cooling an ultrasound probe
US9237880B2 (en) 2011-03-17 2016-01-19 Koninklijke Philips N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
US9730677B2 (en) 2011-05-17 2017-08-15 Koninklijke Philips Electronics N.V. Matrix ultrasound probe with passive heat dissipation
KR20140144420A (ko) 2013-06-11 2014-12-19 삼성전자주식회사 초음파 프로브 및 그 제조방법
KR20150118496A (ko) * 2014-04-14 2015-10-22 삼성전자주식회사 초음파 프로브
EP2992829B1 (en) 2014-09-02 2018-06-20 Esaote S.p.A. Ultrasound probe with optimized thermal management
KR20160075091A (ko) * 2014-12-19 2016-06-29 삼성전자주식회사 초음파 프로브
JP2018061754A (ja) * 2016-10-14 2018-04-19 キヤノンメディカルシステムズ株式会社 超音波プローブ
JP6548234B2 (ja) * 2017-11-30 2019-07-24 ゼネラル・エレクトリック・カンパニイ 超音波プローブ及び超音波画像表示装置
US11717271B2 (en) 2018-03-30 2023-08-08 Koninklijke Philips N.V. Thermally-conductive material layer and internal structure for ultrasound imaging
KR20210136133A (ko) * 2019-03-25 2021-11-16 엑소 이미징, 인크. 핸드헬드 초음파 영상 장치

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