JP2024505471A5 - - Google Patents

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Publication number
JP2024505471A5
JP2024505471A5 JP2023544408A JP2023544408A JP2024505471A5 JP 2024505471 A5 JP2024505471 A5 JP 2024505471A5 JP 2023544408 A JP2023544408 A JP 2023544408A JP 2023544408 A JP2023544408 A JP 2023544408A JP 2024505471 A5 JP2024505471 A5 JP 2024505471A5
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JP
Japan
Prior art keywords
power
integrated device
switch
core
resource
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023544408A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024505471A (ja
JP7713526B2 (ja
Filing date
Publication date
Priority claimed from US17/162,621 external-priority patent/US11764186B2/en
Application filed filed Critical
Publication of JP2024505471A publication Critical patent/JP2024505471A/ja
Publication of JP2024505471A5 publication Critical patent/JP2024505471A5/ja
Application granted granted Critical
Publication of JP7713526B2 publication Critical patent/JP7713526B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023544408A 2021-01-29 2021-12-15 共有可能な電力リソースのために構成された集積デバイスを備えるパッケージ Active JP7713526B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/162,621 US11764186B2 (en) 2021-01-29 2021-01-29 Package comprising an integrated device configured for shareable power resource
US17/162,621 2021-01-29
PCT/US2021/063630 WO2022164527A1 (en) 2021-01-29 2021-12-15 Package comprising an integrated device configured for shareable power resource

Publications (3)

Publication Number Publication Date
JP2024505471A JP2024505471A (ja) 2024-02-06
JP2024505471A5 true JP2024505471A5 (https=) 2024-11-26
JP7713526B2 JP7713526B2 (ja) 2025-07-25

Family

ID=80445787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023544408A Active JP7713526B2 (ja) 2021-01-29 2021-12-15 共有可能な電力リソースのために構成された集積デバイスを備えるパッケージ

Country Status (7)

Country Link
US (2) US11764186B2 (https=)
EP (1) EP4285410B1 (https=)
JP (1) JP7713526B2 (https=)
KR (1) KR20230137325A (https=)
CN (1) CN116711075A (https=)
BR (1) BR112023014301A2 (https=)
WO (1) WO2022164527A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11764186B2 (en) 2021-01-29 2023-09-19 Qualcomm Incorporated Package comprising an integrated device configured for shareable power resource
US11978697B2 (en) * 2021-07-16 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012031362A1 (en) 2010-09-07 2012-03-15 Corporation De L ' Ecole Polytechnique De Montreal Methods, apparatus and system to support large-scale micro- systems including embedded and distributed power supply, thermal regulation, multi-distributed-sensors and electrical signal propagation
US9064715B2 (en) 2010-12-09 2015-06-23 Taiwan Semiconductor Manufacturing Company, Ltd. Networking packages based on interposers
US9633872B2 (en) * 2013-01-29 2017-04-25 Altera Corporation Integrated circuit package with active interposer
US10334718B2 (en) 2013-11-21 2019-06-25 Zf Friedrichshafen Ag Multi-functional high-current circuit board
KR102252643B1 (ko) * 2014-10-20 2021-05-17 삼성전자주식회사 시스템 온 칩의 전원 경로 제어기
US9287208B1 (en) 2014-10-27 2016-03-15 Intel Corporation Architecture for on-die interconnect
US9935052B1 (en) * 2014-11-26 2018-04-03 Altera Corporation Power line layout in integrated circuits
US10224310B2 (en) 2015-10-29 2019-03-05 Qualcomm Incorporated Hybrid three-dimensional integrated circuit reconfigurable thermal aware and dynamic power gating interconnect architecture
US10664035B2 (en) 2017-08-31 2020-05-26 Qualcomm Incorporated Reconfigurable power delivery networks
DE112017008031T5 (de) 2017-09-13 2020-07-02 Intel Corporation Aktive silizium-brücke
US10826492B2 (en) 2018-08-31 2020-11-03 Xilinx, Inc. Power gating in stacked die structures
US11764186B2 (en) 2021-01-29 2023-09-19 Qualcomm Incorporated Package comprising an integrated device configured for shareable power resource

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