JP2024086340A - Printed board and equipment - Google Patents

Abstract

To provide a printed board that allows common use of land for multiple types of chip components with different chip sizes, and equipment having the printed board.SOLUTION: A printed board has a land 10 that can be commonly used for multiple types of chip components 30 with different chip sizes. The lands 10 have notches 11 extending from the side (first side S1) near the other land 10 of the two sides extending in the vertical direction in each land 10 when the direction of alignment of the land 10 is the horizontal direction and the direction orthogonal to the direction of alignment of the land 10 is the vertical direction.SELECTED DRAWING: Figure 1

Description

This disclosure relates to a printed circuit board having lands for soldering chip components, and a device equipped with the same.

When soldering chip components to a printed circuit board, lands are formed on the printed circuit board and the chip components are soldered onto these lands. There are recommended land patterns for solder mounting lands according to the chip size, and chip components are usually soldered to the recommended land patterns.

On the other hand, when it comes to specific chip components (hereinafter referred to as "specific components") used in the same type of product, due to factors such as parts procurement, it may not be possible to secure the required number of chip components of only one type, and several types of chip components may be used (the type of chip component may differ depending on the product). Also, the chip size may differ depending on the type of chip component.

JP 2005-277095 A

When multiple types of chip components with different chip sizes are used in a specific component, it is possible to use the land commonly for multiple types of chip components by making the land on which the specific component is mounted the recommended land pattern for components with larger chip sizes (large size components).

In this case, for large-sized components, the chip component will be mounted on the recommended land pattern, and appropriate soldering will be performed (see the top of Figure 8). On the other hand, when a component with a small chip size (small-sized component) is mounted on this land, soldering will be performed on a land that is larger than the recommended land pattern, which may result in diagonal mounting (see the bottom of Figure 8). For this reason, if the specific component is a chip component such as a side-emitting LED (Light Emitting Diode) chip, which is not compatible with the specifications when mounted at an angle, there is a problem in that the land cannot be shared.

Patent Document 1 discloses a technology for accurately positioning and mounting chip components. However, it does not anticipate mounting multiple types of chip components with different chip sizes on the same land, and does not prevent oblique mounting when mounting small-sized components on lands larger than the recommended land pattern.

This disclosure was made in consideration of the above-mentioned problems, and aims to provide a printed circuit board that allows lands to be shared among multiple types of chip components with different chip sizes, and a device equipped with the same.

In order to solve the above problems, the first aspect of the present disclosure is a printed circuit board having lands for soldering chip components, and has at least one pair of common lands that can be used for multiple types of chip components with different chip sizes, and is characterized in that, when the common lands are arranged in a horizontal direction and the direction perpendicular to the arrangement of the common lands is a vertical direction, each common land has a notch formed extending from a first side that is closer to the other common land out of two sides that extend vertically.

According to the above configuration, the common land can be divided into regions by the notches, and the chip size of the chip components can be made different when the entire common land is used to mount the chip components and when a partial region separated by the notch is used to mount the chip components. In other words, when the entire common land is used, large-sized components can be mounted without being obliquely mounted, and when a partial region of the common land is used, small-sized components can be mounted without being obliquely mounted. This makes it possible to share the land for multiple types of chip components with different chip sizes.

The printed circuit board may also be configured such that two of the notches are formed in line symmetry with each other along the vertical direction of the common land.

With the above configuration, large-sized components can be mounted using the entire common land, and small-sized components can be mounted using the area between the two notches. In this case, not only can oblique mounting be prevented for multiple types of chip components with different chip sizes, but vertical positional deviation can also be prevented.

The printed circuit board may also be configured such that the notch extends horizontally from the first side in a slit shape, and a bent portion is formed at the tip of the notch, extending vertically toward the other notch.

With the above configuration, when mounting small-sized components using the area between the two notches, the bent portion can also prevent the chip components from shifting in position in the lateral direction.

In addition, in order to solve the above problem, the device according to the second aspect of the present disclosure is characterized in that it includes the printed circuit board described above.

The printed circuit board and device disclosed herein achieve the effect of enabling the common land to be shared for multiple types of chip components with different chip sizes by separating the common land into regions with notches and using different regions for solder mounting of chip components.

5A and 5B are schematic diagrams showing the shape of a land according to the first embodiment; FIG. 2 is a schematic diagram showing a state in which a large-sized component is mounted on the land in FIG. 1 . FIG. 2 is a schematic diagram showing a state in which a small-sized component is mounted on the land in FIG. 1 . 5A to 5C are schematic diagrams showing modified examples of the lands according to the first embodiment. 11A and 11B are schematic diagrams showing the shape of a land according to the second embodiment; 6 is a schematic diagram showing a state in which a large-sized component is mounted on the land in FIG. 5 . FIG. 6 is a schematic diagram showing a state in which a small-sized component is mounted on the land in FIG. 5 . FIG. 13 is a schematic diagram showing a state in which a large-sized component and a small-sized component are mounted on a conventional land.

[First embodiment]
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. Fig. 1 is a schematic diagram showing the shape of a land (common land) 10 according to the present embodiment 1. The land 10 is for soldering a chip component 30 described later, and the printed circuit board of the present disclosure has at least one pair of the lands 10 shown in Fig. 1. The type of device on which the printed circuit board of the present disclosure is mounted is not particularly limited, and the printed circuit board of the present disclosure can be mounted on various electric devices, electronic devices, etc.

As shown in FIG. 1, the land 10 is used as a pair of lands, and for ease of explanation, the direction in which the lands are arranged is the horizontal direction (the direction of the arrow X in the figure), and the direction perpendicular to the direction in which the lands are arranged is the vertical direction (the direction of the arrow Y in the figure). Furthermore, of the two sides of the land 10 that extend vertically, the side closer to the other land 10 is referred to as the first side S1, and the side farther away is referred to as the second side S2.

In the land 10, a notch 11 is formed that extends horizontally from the first side S1 in a slit-like shape. The first side S1 is divided into partial sides S11 and S12 by the inclusion of the notch 11 in the middle. The lengths of the partial sides S11 and S12 are basically different, and here the longer side is referred to as the partial side S11, and the shorter side is referred to as the partial side S12. A pair of lands 10 are arranged so as to be symmetrical to each other along the horizontal direction.

The outer shape of the land 10 is approximately rectangular, with the vertical dimension being L1 and the horizontal dimension being L2. The dimension of the partial side S11 is L3. The land 10 is divided into regions by the inclusion of the notch 11, and here the region on the partial side S11 side in the vertical direction from the notch 11 is referred to as partial region A1.

It is assumed that multiple types of chip components 30 with different chip sizes will be used as the chip components 30 mounted on the land 10. In this example, a large-sized component 30L and a small-sized component 30S with a smaller chip size than the large-sized component 30L will be used. Furthermore, the chip components 30 are basically chip components that will affect the specifications if they are mounted at an angle. For example, if the chip components 30 are side-emitting LED chips, mounting them at an angle will cause a deviation in the beam emission angle. However, the chip components 30 are not limited to LED chips.

Figure 2 is a schematic diagram showing the state in which a large-sized component 30L is mounted on a land 10. At this time, the land 10 is formed so that the dimensions L1 and L2 match the size of the recommended land pattern of the large-sized component 30L. As shown in Figure 2, the large-sized component 30L is mounted using the entire land 10, so that it is mounted on the recommended land pattern. This allows the large-sized component 30L to be properly soldered without being mounted at an angle to the land 10.

Figure 3 is a schematic diagram showing the state in which a small-sized component 30S is mounted on a land 10. At this time, the land 10 is formed so that the dimension L3 matches the size of the recommended land pattern for the small-sized component 30S. As shown in Figure 3, the small-sized component 30S is mounted using only a partial area A1 of the land 10. This results in the small-sized component 30S being in the same state as if it were mounted on the recommended land pattern in the vertical direction, and proper soldering is possible without the small-sized component 30S being mounted at an angle to the land 10.

As described above, in the printed circuit board of the present disclosure, when multiple types of chip components 30 with different chip sizes (large size components 30L and small size components 30S) are used, the above-mentioned land 10 is used as the land for mounting them. The land 10 can prevent oblique mounting for any of the multiple types of chip components 30 with different chip sizes, making it possible to use the land in common.

In the above example, the land 10 is adapted to accommodate two chip sizes, but by increasing the number of notches 11 in the land 10, it is possible to accommodate three or more chip sizes. Figure 4 is a schematic diagram showing a land 10', which is a modification of the first embodiment, in which the number of notches 11 is reduced to two, making it possible to accommodate three chip sizes.

The land 10' shown in FIG. 4 has two notches 11 arranged vertically in the figure, where the lower notch is notch 11A and the upper notch is notch 11B. On the land 10', a large component 30L can be mounted by using the entire land 10', and a small component 30S can be mounted by using the area below notch 11A. Furthermore, by using the area below notch 11B, it is possible to mount a medium-sized chip component 30 (a chip size between the large component 30L and the small component 30S) without mounting it at an angle.

Second Embodiment
In the above-described first embodiment, a configuration in which only one notch 11 is provided per land 10 has been exemplified. In this configuration, a vertical positional deviation of the chip component 30 occurs when a large-sized component 30L is provided on the land 10 and when a small-sized component 30S is provided on the land 10. Specifically, the small-sized component 30S is disposed closer to the partial region A1 than the large-sized component 30L. Also, since the horizontal dimension L2 of the land 10 in the first embodiment is larger than that of the small-sized component 30S, it is difficult to accurately position the small-sized component 30S in the horizontal direction.

In addition to being mounted at an angle, there are also cases where the chip component 30 mounted on the land 10 is subject to in-plane misalignment during use. For example, when the chip component 30 is a surface-emitting type LED chip, such in-plane misalignment is undesirable because it causes deviation in the beam irradiation position. For this reason, in this second embodiment, a land shape that can suppress in-plane misalignment for multiple types of chip components 30 with different chip sizes is described. Figure 5 is a schematic diagram showing the shape of the land (common land) 20 according to this second embodiment.

Two notches 21 having a substantially L-shape are formed in the land 20. Each notch 21 extends horizontally from the first side S1 in a slit-like manner, and at its tip is a bent portion 211 that extends vertically toward the other notch 21. The two notches 21 are formed in one land 20 so as to be symmetrical to each other along the vertical direction. The first side S1 of the land 20 is divided into three partial sides S11 to S13 by the two notches 21 in the middle, and the partial side S11 is formed between the partial sides S12 and S13. The lengths of the partial side S11 and the partial sides S12 and S13 are basically different, and here, the partial side S11 is formed longer than the partial sides S12 and S13.

The outer shape of the land 20 is approximately rectangular, with the vertical dimension being L1 and the horizontal dimension being L2. The dimension of the partial side S11 is L3, and the horizontal dimension from the partial side S11 to the bent portion 211 of the notch 21 is L4. In the land 20, the area inside the two notches 21 is the partial area A2. This partial area A2 has a vertical dimension L3 and a horizontal dimension L4.

Figure 6 is a schematic diagram showing the state in which a large-sized component 30L is mounted on a land 20. At this time, the land 20, like the land 10 described above, is formed so that the dimensions L1 and L2 match the size of the recommended land pattern of the large-sized component 30L. As shown in Figure 6, the large-sized component 30L is mounted using the entire land 20, so that it is mounted on the recommended land pattern. This allows the large-sized component 30L to be properly soldered without being mounted at an angle to the land 20.

Figure 7 is a schematic diagram showing the state in which a small-sized component 30S is mounted on a land 20. At this time, the land 20 is formed so that the dimensions L3 and L4 in the partial area A2 match the size of the recommended land pattern of the small-sized component 30S. As shown in Figure 7, the small-sized component 30S is mounted using only the partial area A2 of the land 20. As a result, the small-sized component 30S is in the same state as if it were mounted on the recommended land pattern in the vertical and horizontal directions, and there is no diagonal mounting on the land 20, allowing for proper soldering.

In addition, in each land 20, the two notches 21 are formed so as to be line-symmetrical with respect to each other along the vertical direction. As a result, when mounting a chip component 30 on the land 20, the chip component 30 can be positioned in the vertical center position of the land 20, regardless of whether it is a large-sized component 30L or a small-sized component 30S. In other words, when multiple types of chip components 30 with different chip sizes (large-sized components 30L and small-sized components 30S) are used, the land 20 can suppress misalignment of the chip components 30 in the vertical direction.

Furthermore, by forming a bent portion 211 in the notch 21, the partial area A2 of the land 20 can be made to match the size of the recommended land pattern of the small component 30S not only in the vertical dimension but also in the horizontal dimension. This makes it easier to position the land 20 horizontally relative to the small component 30S. As a result, the printed circuit board of the present disclosure having the land 20 allows the land to be shared even for chip components 30 whose in-plane positional deviation should be suppressed.

The embodiments disclosed herein are illustrative in all respects and are not intended to be a basis for restrictive interpretation. Therefore, the technical scope of the present disclosure should not be interpreted solely by the above-described embodiments, but should be defined based on the claims. Furthermore, all modifications that are equivalent in meaning and scope to the claims are included.

10, 10', 20 Land (common land)
11, 11A, 11B, 21 Notch 211 Bending portion 30 Chip component 30L Large size component 30S Small size component S1 First side A1, A2 Partial region

Claims (4)

A printed circuit board having lands for soldering chip components,
The board has at least one pair of common lands that can be used in common for a plurality of types of chip components having different chip sizes,
A printed circuit board characterized in that, when the direction in which the common lands are arranged is the horizontal direction and the direction perpendicular to the direction in which the common lands are arranged is the vertical direction, each common land has two sides extending in the vertical direction, and a notch is formed extending from a first side that is closer to the other common land. 2. The printed circuit board according to claim 1,
The printed circuit board is characterized in that the two notches are formed in a line symmetrical manner along the vertical direction with respect to the common land. 3. The printed circuit board according to claim 2,
The printed circuit board is characterized in that the notch extends horizontally from the first side in the shape of a slit, and a bent portion is formed at its tip extending vertically toward the other notch. A device comprising a printed circuit board according to any one of claims 1 to 3.

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