JP2024085353A - Method for manufacturing a press plate, a press plate manufactured by the method, and a processing method for processing a workpiece using the press plate - Google Patents

Abstract

[Problem] To provide a method for manufacturing a pressing plate having a desired shape, in which the desired convex portions, concave portions, uneven portions, fine uneven portions, etc. have the desired shape accuracy and dimensional accuracy, and in which etching of the "areas of the plate mold substrate that should not be etched" is suppressed, using a chemical corrosive etching process that has simpler steps than conventional general-purpose chemical corrosive etching processes.
[Solution] A method for manufacturing a press processing plate, in which an inkjet resist material 2 is applied by an inkjet method to a desired area of a plate mold substrate 1 having a pre-formed uneven portion 45 formed thereon, to form a desired area inkjet resist hardened film 3, and an etching liquid is brought into contact with the surface of the plate mold substrate 1 on which the desired area inkjet resist hardened film 3 has been formed, to etch the areas of the plate mold substrate to which the desired area inkjet resist hardened film 3 is not attached, thereby forming an inkjet resist film etched second recess formation portion 121 formed in a recessed shape on the surface of the plate mold substrate.
[Selected Figure] Figure 1

Description

The present invention relates to a method for manufacturing a press processing plate used for processing workpieces such as paper, cardboard, plastic products, sheet-like transfer foil materials, metal products, and composite products of these into a predetermined shape by press processing, a press processing plate manufactured by the manufacturing method, and a processing method for processing a workpiece using the press processing plate.

The pressing plate is made of metal, plastic, resin, or rubber depending on the application, and includes a foil stamping plate, an embossing plate, a cutting blade, a processing plate that combines these, etc. The foil stamping plate is a pressing plate used to transfer and form a transfer foil material on a workpiece in accordance with a graphic and letter pattern formed in a concave-convex shape on the pressing plate. The embossing plate is a pressing plate used to transfer and form a graphic and letter pattern formed in a concave-convex shape on a workpiece in accordance with a graphic and letter pattern formed in a concave-convex shape on the embossing plate. The cutting blade is a pressing plate used to cut or punch-cut the workpiece into a predetermined shape in accordance with a graphic and letter pattern formed on the cutting blade.

A schematic diagram of a known pressing device that includes a pressing plate is shown in Fig. 16. In Fig. 16, (A) shows a flat pressing device, in which a pressing plate 100 is attached to the surface of a first base 92 that can move up and down, a receiving plate 94 is attached to a second base 93 that can move up and down at a position opposite to the first base 92, and a workpiece 108 is placed between the pressing plate 100 and the receiving plate 94. In this state, at least one of the first base 92 and the second base 93 is operated, so that the pressing plate 100 presses the workpiece 108, and a graphic character pattern that matches the graphic character pattern formed in a concave-convex shape on the pressing plate 100 is formed in the workpiece in a concave-convex shape.
In this flat plate pressing processing device, when the workpiece 108 has a belt-like shape, the workpiece 108 is intermittently supplied between the pressing processing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base 92 and the second base 93, and is processed into a predetermined uneven shape.
Also, although not shown, in the case where the workpiece is a molded product that can be placed on the receiving plate 94, etc., the workpiece 108 is placed and supplied between the pressing plate 100 and the receiving plate 94 in conjunction with the operation of at least one of the first base 92 and the second base 93, and the workpiece is pressed to obtain a processed product formed into a predetermined shape.
In this manner, a workpiece that has been machined into a predetermined uneven shape and/or a cut-out workpiece is obtained.

16B shows a roll-shaped pressing device, in which a pressing plate 100 is formed on the surface of a rotatable main roll 96 having a cylindrical or columnar shape, a rotatable counter roll 97 is formed in a position facing the main roll 96, and a workpiece 108 is placed between the main roll 96 and the counter roll 97. In this state, the main roll 96 and the counter roll 97 are operated, so that the pressing plate 100 presses the workpiece 108 to obtain a workpiece processed into a predetermined uneven shape. In this case, the pressing plate 100 can be a pressing plate 100 having a flexibility that can be attached around the main roll 96, or a pressing plate 100 with no flexibility that is fixed and installed at a predetermined position on the main roll 96 by a fixing jig is also possible.
Alternatively, the main roll 96 may have a graphic, letter, and design pattern formed in a predetermined concave-convex shape directly on the surface of the main roll 96 .
The counter roll 97 may be an anvil roll having a smooth surface with no irregularities, or a counter roll having an irregular surface formed with irregularities that can engage with the irregularities formed on the main roll.
In such a roll-shaped pressing device, a strip-shaped workpiece 108 is continuously supplied between the main roll 96 and the counter roll 97, and in this state, the main roll 96 and the counter roll 97 operate to press the workpiece 108, thereby obtaining a workpiece that has been processed into a predetermined uneven shape and/or a cut-out workpiece.

The workpieces used include various materials such as paper, various plastic materials, rubber, soft materials, flexible materials, leather, cloth, metal, and various products such as cardboard, plastic products, leather products, cloth products, metal products, emblems, and composite products made up of multiple materials such as labels, adhesive tapes, pressure sensitive adhesives, and patches.

When the pressing plate is a foil stamping plate, a graphic pattern such as a predetermined letter, number, design, pattern, design, picture, image, etc. is formed in an uneven shape on the surface of the foil stamping plate. By pressing the foil stamping plate against the workpiece via a transfer foil material, a graphic pattern formed by the transfer foil material that matches the graphic pattern formed in the uneven shape is transferred and formed on the surface of the workpiece. Almost any material can be used as the workpiece, such as paper, various plastic materials, leather, wood, cloth, metal, etc., and it is applied to various products such as packaging containers, wrapping paper, decorative items, books, labels, plastic products, leather products, cloth products, metal products, emblems, etc. A foil stamping plate having such an uneven portion formed thereon is installed in a pressing processing device having an opposing substrate such as a support plate or a receiving portion, and by driving at least one of the foil stamping plate and the opposing substrate, the foil stamping plate and the opposing substrate are pressed against each other, and a foil-transferred graphic character pattern that matches the graphic character pattern formed in the uneven shape is transferred and formed on the surface of the workpiece.

Generally, the stamping plate is made of steel, brass, copper, magnesium, stainless steel, other metals, plastics, resins, etc., and the counter substrate is made of metal, plastics, resins, rubber, etc. A predetermined graphic, letter, and picture pattern is engraved in an uneven shape on the surface of the stamping plate.
With the transfer foil material between the stamping plate and the workpiece, the stamping plate and the opposing substrate are pressed against each other, so that the entire areas of the stamping plate surface and the opposing substrate surface are simultaneously pressed into contact with each other, and a predetermined graphic, letter, and pattern formed by the transfer foil material is transferred and formed in an uneven shape onto the surface of the workpiece. At this time, a pressing system is also used in which pressing is performed using a stamping plate heated by a hot platen, and a so-called hot stamping pressing system is also used. In addition, in such a pressing system, there are cases where one stamping plate is used and cases where multiple stamping plates are used simultaneously.

When the pressing plate is an embossing plate, the embossing plate is used in a pressing system for pressing the embossing plate directly onto a processed product such as paper, plastic, leather, wood, cloth, laminate material, etc., without using a transfer foil material, to transfer the graphic, letter, and picture pattern formed in a predetermined concave-convex shape engraved on the embossing plate to the surface of the workpiece for embossing. This pressing system is composed of an embossing plate and an opposing substrate, similar to the above-mentioned foil pressing system, and the graphic, letter, and picture pattern is formed in a concave-convex shape on the surface of the embossing plate. For example, the embossing plate and the opposing substrate are pressed against each other by driving at least one of the embossing plate and the opposing substrate. When the workpiece is located between the opposing substrate and the embossing plate, the embossing plate and the opposing substrate are pressed against each other, so that the entire areas of the embossing plate surface and the opposing substrate surface are pressed against each other simultaneously through the workpiece, and the predetermined graphic, letter, and picture pattern is transferred and formed in a concave-convex shape on the workpiece. In such a pressing system, the workpieces that can be used include materials that are compressed and deformed by pressing, such as paper, paper products, soft plastic materials, leather, wood, cloth, etc. Also, there are cases where one embossing plate is used and cases where multiple embossing plates are used simultaneously.

When the pressing plate is a cutting blade, the cutting blade is used in a pressing system for cutting or punching a thin workpiece such as paper, plastic, leather, wood, cloth, laminate material, patch sheet, transfer foil material, etc. into a predetermined shape by pressing the cutting blade against the thin workpiece. A predetermined blade with a concave and convex blade shape is formed on the cutting blade, and the processed product is cut or punched in accordance with the shape of this blade. This pressing system is similar to the pressing system using the above-mentioned embossing plate or foil stamping plate, and is composed of a cutting blade and an opposing substrate, and a blade pattern with a concave and convex shape is formed on the surface of the cutting blade. For example, it is a mechanism in which at least one of the cutting blade and the opposing substrate is driven to press the cutting blade and the opposing substrate against each other. With the workpiece positioned between the opposing substrate and the cutting and cutting die, the cutting and cutting die and the opposing substrate are pressed against each other, so that the entire areas of the cutting and cutting die surface and the opposing substrate surface are simultaneously pressed against each other via the workpiece, and a predetermined area of the workpiece is cut or punched into a predetermined shape. In this type of pressing system, one cutting and cutting die may be used, or multiple cutting and cutting die may be used at the same time. In addition, the above-mentioned foil stamping or embossing may be used simultaneously with the cutting and punching.

For example, the following techniques are known for such press processing plates.
Japanese Patent Application Laid-Open No. 2002-99196 discloses a pressure transfer processing method in which a hologram transfer foil as a transfer foil material and a workpiece are placed between a hot stamp plate, which is a foil stamping plate as a pressure processing plate, and a receiving portion as an opposing substrate.
Furthermore, Japanese Utility Model Publication No. 7-55065 discloses a hot stamping transfer machine in which a hot stamping processing mold as a foil stamping plate and a support table as an opposing substrate are sandwiched between a transfer foil as a transfer foil material and an object to be transferred as a workpiece, and in particular, a processing mold is disclosed in which a rubber material is attached to the recesses formed by the unevenness of the processing mold, and the surface of the processing mold is formed so as to be flush with the protrusions.
In addition, Utility Model Registration No. 3130674 discloses a flat pressure transfer device which comprises a processing plate on which a graphic, letter, and design pattern is engraved in an uneven shape, at least one surface of which has a surface shape consisting of a curved or radiused top and a sloping surface that continuously and smoothly becomes lower as it moves away from the top, a support plate having a flat surface as an opposing substrate, a transfer foil film as a transfer foil material located between the processing plate and the support plate, and a transfer target as a processed product.

Japanese Patent Laid-Open Publication No. 8-85099 discloses a method for manufacturing a die having a high cutting edge and a low cutting edge by chemical corrosive etching, and also describes a method in which, after etching, the tip of the low cutting edge is machined to be rounded with a file or the like. Furthermore, as prior art, a method in which, after etching, the low cutting edge is formed by grinding with a grinder or the like is also disclosed.
REPRESENTATION No. 2002-53332 discloses a flexible die and a method for manufacturing a flexible die in which a flexible base and a protrusion protruding from the base are formed by etching, the side of the protrusion is cut to form a vertical protrusion, and then a double-edged or single-edged cutting edge is machined onto the tip of the vertical protrusion to form a cutting blade, thereby making it possible to make the width of the base side of the cutting blade smaller than the width of the base side of a conventional flexible die, and even when punching thick material, it is possible to reduce the dimensional difference between the top and bottom of the processed part of the material, thereby improving processing accuracy, and moreover, because the cutting edge is machined only on the tip of the vertical protrusion, less pressure is applied to the cutting blade when punching the material, improving the durability of the cutting blade and enabling productivity to be improved while reducing product costs.

When manufacturing a plate for pressing processing which has a recess and a protrusion protruding from the recess, and in which a plurality of uneven portions having a plurality of recesses and a plurality of protrusions are formed on the surface of the protrusion, conventionally, the following methods have generally been known for manufacturing a plate for pressing processing: a manufacturing method using mechanical processing, a manufacturing method using chemical corrosive etching processing, and a manufacturing method using a combination of chemical corrosive etching processing and mechanical processing.
Generally, the depth of the recess (which has the same meaning as the height of the protrusion) varies depending on the type of workpiece, but is about 0.5 mm or more. There is no particular restriction on the width of the recess or protrusion, and it may be any desired dimension.

A schematic cross-sectional view illustrating a conventional method for manufacturing a pressing plate by mechanical processing is shown in Fig. 18. In Fig. 18, (A) a plate mold substrate 1 having a thickness of about 3 mm and a non-relief portion on the surface is prepared, and (B) a desired area on the surface of the plate mold substrate 1 is mechanically cut to form a plurality of concave-shaped pre-formed multiple concave-convex portions 452, and a plurality of pre-formed multiple concave-convex portions 451 protruding from the pre-formed multiple concave-convex portions 452 are formed to form the pre-formed multiple concave-convex portions 45. In this case, the depth dimension "D1" of the pre-formed multiple concave-convex portions 452 (height dimension "D1" of the pre-formed multiple concave-convex portions 451) is, for example, about 0.9 mm.
(C) Next, the periphery of the pre-formed multiple concave-convex portion 45 consisting of the pre-formed multiple concave-convex portion concaves 452 and the pre-formed multiple concave-convex portion convexs 451 formed as described above is cut by machining to form the conventional second concave-forming portion 121a, thereby manufacturing a pressing plate having the conventional machined concave-convex portion protrusion 450 formed by conventional machining having the pre-formed multiple concave-convex portion convexs 451 and the pre-formed multiple concave-convex portion concaves 452 and the conventional second concave-forming portion 121a. In this case, the depth dimension "D12a" of the conventional second concave-forming portion 121a is, for example, about 2 mm.

FIG. 19 is a schematic cross-sectional view illustrating a manufacturing method in which a preformed multiple uneven portion 45 is formed by conventional, conventional chemical corrosion etching processing, and then the periphery of the preformed multiple uneven portion 45 is machined to form a conventional machined uneven portion protrusion 450 formed by conventional, conventional machining.
In FIG. 19, (A) a conventional resist material 20 is applied to a desired area on the surface of a plate mold substrate 1 having a thickness of about 3 mm (if a liquid resist material is used, it is further dried), (B) an exposure mask member 23 is placed covering the conventional resist material and having openings formed therein with a predetermined graphic, letter, and design pattern, and the conventional resist material attached to the plate mold substrate is exposed to ultraviolet light or the like through the exposure mask member to chemically alter the conventional resist material, and (C) the resist material in the unnecessary portion is dissolved and removed and developed to match the graphic, letter, and design pattern on the exposure mask member. (D) an etching solution is brought into contact with the surface of the plate mold substrate 100 on which the conventional resist hardened film 30 is formed, and the surface of the plate mold substrate in the region where the plate mold substrate surface to which the conventional resist material 30 is not attached is exposed, thereby forming a concave conventional conventional uneven portion concave portion 452, and (E) the conventional resist hardened film is removed, thereby forming a concave pre-formed multiple uneven portion concave portion 452 and a convex pre-formed multiple uneven portion convex portion 451, thereby forming the pre-formed uneven portion 45. In this case, the depth dimension D1 of the pre-formed multiple uneven portion concave portion 452 (height dimension D1 of the pre-formed multiple uneven portion convex portion 451) is, for example, about 0.9 mm.
(F) Furthermore, the periphery of the existing uneven portion 45 consisting of the multiple concave-shaped existing uneven portion concaves 452 and the convex-shaped existing uneven portion convex portions 451 formed as described above is cut by machining to form the conventional second concave-forming portion 121a, thereby manufacturing a pressing plate having the conventional machined uneven portion protrusion 450 formed by conventional machining having the multiple existing uneven portion convex portions 451 and the multiple existing uneven portion concaves 452, and the conventional second concave-forming portion 121a. In this case, the depth dimension "D12a" of the conventional second concave-forming portion 121a is, for example, about 2 mm.

In FIG. 19A, a conventional resist material 20 is generally a conventional liquid resist material or a conventional dry film resist material in the form of a sheet film.
Conventionally, conventional liquid resist materials are generally applied to desired areas of a plate mold substrate by conventional screen printing, spray coating, curtain coating, or the like.
The screen printing method is a method in which a liquid resist material is applied to desired areas of a plate mold substrate via a screen printing plate with a predetermined number of through holes, while the spray coating method is a method in which a liquid resist material is sprayed from a nozzle with a predetermined number of fine holes to apply to desired areas of a plate mold substrate.
Conventional dry film resist materials are adhered to the desired areas of the plate substrate by an adhesive system.
In FIGS. 19B and 19C, a method is also practiced in which a conventional resist material is chemically altered by directly irradiating it with a laser, electron beam, or the like without using an exposure mask member.

Japanese Utility Model Publication No. 7-55065 JP 2002-99196 A Utility Model Registration No. 3130674 Japanese Patent Application Laid-Open No. 8-85099 Publication No. 2002-53332

Conventionally, when manufacturing a plate for pressing processing which has a recess and a protrusion protruding from the recess, and in which a plurality of uneven portions having a plurality of recesses and a plurality of protrusions are formed on the surface of the protrusion, the following methods are generally known for manufacturing a plate for pressing processing: a manufacturing method using mechanical processing, a manufacturing method using chemical corrosive etching processing, and a manufacturing method using a combination of chemical corrosive etching processing and mechanical processing.
In the manufacturing method using mechanical processing as shown in FIG. 18 described above, and the manufacturing method using a combination of chemical corrosive etching processing and mechanical processing as shown in FIG. 19, there are problems in that mechanical processing tends to be inferior in terms of manufacturing costs and technical personnel, compared to conventional chemical corrosive etching processing, for reasons such as the need for expensive precision machining equipment and skilled machining engineers who can process with the desired precision.

Furthermore, in conventional chemical corrosive etching processes, a resist deposition film is formed using a conventional general-purpose conventional liquid resist material by a conventional resist application method such as a conventional spray coating method, screen printing method, curtain coating method or spin coating method, the resist deposition film is exposed through an exposure mask member to form a conventional hardened resist film having a desired shape, and a substrate is corroded and etched using the conventional hardened resist film as an etching mask. However, when the purpose is to form high heights or deep depths such as the height dimensions of recesses and protrusions or the depth dimensions of recesses, the processing accuracy is poor in terms of shape accuracy, dimensional accuracy, and the like.

Also, typically, conventional resist deposits are less than about 50 μm (about 0.05 mm) thick.
When the thickness of the applied or adhered conventional resist film material is about 50 μm or more, as the thickness increases, the variation in the thickness of the planar region of the conventional resist film material increases, and there is a tendency that a uniform conventional resist film cannot be formed. As a result, during exposure to ultraviolet light or the like using an exposure mask member, variation in exposure occurs, making it impossible to form a developed conventional resist hardened film having the desired shape accuracy and dimensional accuracy. As a result, when the conventional resist hardened film is used as an etching mask to corrode and etch a plate-shaped container field, it is not possible to form uneven parts having the desired shape accuracy and dimensional accuracy, resulting in a problem of poor etching processing accuracy.

In particular, when attempting to adhere a general-purpose conventional liquid resist material to the side surfaces of desired recesses or protrusions, the conventional liquid resist material applied to the side surfaces flows down to the bottom surface of the recesses, making it difficult to adhere the conventional liquid resist material to the desired areas on the side surfaces of the protrusions or recesses. When the conventional resist cured film thus formed is used as an etching mask to corrode and etch a plate mold substrate, it is impossible to form the desired recesses, protrusions, and other uneven parts, resulting in a problem of inferior processing accuracy, such as the desired shape accuracy and dimensional accuracy.
Even when an attempt is made to fill the entire recesses of the concaves of the unevenness formed on the plate mold substrate by a conventional resist coating method such as a conventional spray coating method, a screen printing method, a curtain coating method, a spin coating method, or the like, and form a conventional resist hardened film on the side surfaces of the concaves and the convexities, as described above, the thickness of the conventional resist hardened film varies greatly and a uniform conventional resist hardened film cannot be formed. As a result, exposure to ultraviolet light or the like using an exposure mask member varies, and the dimensional accuracy decreases, making it impossible to form a developed conventional resist hardened film having the desired shape accuracy and dimensional accuracy. As a result, when the conventional resist hardened film is used as an etching mask to perform corrosion etching, it is impossible to form unevenness having the desired shape accuracy and dimensional accuracy, and there is a problem that the etching processing accuracy is poor.

The corrosive etching process for forming a resist hardened film using a conventional general-purpose sheet-like conventional dry film resist material has a problem of poor processing accuracy such as shape accuracy and dimensional accuracy when forming high heights and deep depths such as the height dimensions of concaves and convexities and the depth dimensions of concaves. In particular, when a plate mold substrate having a concave-convex surface is used and a desired concave-convex portion is further formed on the plate mold substrate having the concave-convex surface, the adhesion between the plate mold substrate having the concave-convex surface and the conventional dry film resist material becomes insufficient, a gap occurs between the plate mold substrate having the concave-convex surface and the conventional dry film resist material, and etching occurs through the gap between the resist material and the substrate without the side surface and the bottom surface of the concave portion being covered by the resist material, resulting in a problem of poor processing accuracy such as desired shape accuracy and dimensional accuracy.

Furthermore, in the conventional technology, when manufacturing a pressing plate having a recess and a protrusion protruding from the recess, with multiple uneven portions having multiple recesses and multiple protrusions formed on the surface of the protrusion, there is a problem in that the side surfaces of each of the multiple recesses and multiple protrusions are etched, and as a result, it is not possible to form a protrusion having the desired unevenness.

When manufacturing a pressing plate having a recess and a protrusion protruding from the recess, with multiple projections having multiple recesses and multiple protrusions formed on the surface of the protrusion, an example of a conventional manufacturing method using chemical corrosive etching will be described with reference to Figure 20.
FIG. 20 is a schematic process diagram for producing a pressing plate by a chemical etching process using a conventional resist material.
20, (A) a plate-form substrate is prepared on which a pre-formed multiple uneven portion 45 having a plurality of pre-formed multiple uneven portion convex portions 451 and a plurality of pre-formed multiple uneven portion concave portions 452 is formed by mechanical processing or chemical etching processing using a conventional conventional resist material. The depth dimension D1 of the pre-formed multiple uneven portion concave portions 452 (same as the height dimension of the pre-formed multiple uneven portion convex portions 451) is about 0.9 mm.
(B) A conventional liquid resist material 20 is applied to the surface of the existing multiple concave-convex portions 45. In this case, the conventional liquid resist material does not adhere to the side surface of the concave portion 452 of the existing multiple concave-convex portions, and tends to fall onto the bottom surface of the existing multiple concave-convex portions 452. The thickness of the conventional liquid resist material 20 applied to the upper surface of the existing multiple convex-convex portions 451 and the bottom surface of the existing multiple concave-convex portions 452 is about 10 μm (about 0.01 mm) or more and less than about 50 μm (about 0.05 mm).
(C) A previously prepared exposure mask member 23 is placed to cover the conventional liquid resist material adhering to the surface of the existing multiple concave-convex portions 45, and then (D) exposure to ultraviolet light, etc., development, hardening, etc. are performed to form a conventional resist hardened film 30 having the desired shape.
(E) An etching solution is brought into contact with the substrate having the conventional resist hardened film 30 attached thereto, and the surface of the mold substrate in the area where the conventional resist hardened film 30 is not attached is corroded and etched to a depth of approximately 1 mm as the etching depth dimension "D3" during etching, thereby forming the second recess forming portion 121b during etching.
(F) Then, the etching is continued until the depth of the surrounding area of the existing multiple concave and convex portions 45 reaches a predetermined depth, thereby forming a conventional second concave forming portion 121a having a depth dimension "D12a" of about 2 mm.
(G) The conventional resist hardened film 30 is removed.

In this manufacturing method, in (E), the concave side of the pre-formed multiple concave-convex portion concave 452 to which the conventional resist hardened film 30 is not attached is also corroded and etched, and a side-etched portion is generated in which the side of the pre-formed multiple concave-convex portion convex 451 is corroded and etched due to the side-etching phenomenon, and a side-etched pre-formed multiple concave-convex portion convex side 451s (side-etched pre-formed multiple concave-convex portion concave side 452s) is formed, resulting in a problem that a pre-formed concave-convex portion protrusion that maintains a normal, desired concave-convex pattern shape is not formed. Note that the side of the pre-formed multiple concave-convex portion convex 451 means the same part as the side of the pre-formed multiple concave-convex portion concave 452, so the side-etched pre-formed multiple concave-convex portion convex side 451s means the same part as the side-etched pre-formed multiple concave-convex portion concave side 452s. Also, "side etching" has the same meaning as "side etching" and means a phenomenon in which the side of the convex portion of the concave portion of the concave portion or the side of the concave portion of the concave portion of the concave portion is etched.
In (F), a pressing plate is manufactured which has a recess (conventional second recess-forming portion 121a) with a depth dimension "D12a" of about 2 mm, a protrusion protruding from the recess, and a plurality of side-etched pre-formed uneven portion protrusions 455s having side-etched pre-formed multiple uneven portion protrusion side surfaces 451s and side-etched pre-formed multiple uneven portion recess side surfaces 452s formed on the surface of the protrusion. Also, the conventional second recess-forming portion 121a has the form of a side-etched corroded second recess-forming portion 121s.

As described above, in the method of manufacturing a pressing plate using the conventional liquid resist material 20, the side surfaces of the multiple pre-formed multiple concave-convex portions 451 (or the side surfaces of the multiple pre-formed multiple concave-convex portions 452) are also etched, making it impossible to maintain the initial shapes of the multiple pre-formed multiple convex portions 451 and the multiple pre-formed multiple concave-convex portions 452, and therefore there is a problem in that it is not possible to manufacture a desired normal pressing plate.

Furthermore, in the conventional technology, when manufacturing a pressing plate having a recess and a protrusion protruding from the recess, in which a pre-formed multiple fine unevenness 466 having a plurality of pre-formed multiple fine unevenness convex portions 461 and a plurality of pre-formed multiple fine unevenness concave portions 462 is formed on the surface of the protrusion, there is a problem in that the side surfaces of the pre-formed multiple fine unevenness convex portions 461 and the pre-formed multiple fine unevenness concave portions 462 are etched, and as a result, it is not possible to form a protrusion having the desired plurality of pre-formed multiple fine unevenness convex portions 461 and the plurality of pre-formed multiple fine unevenness concave portions 462.
When manufacturing a pressing plate having a recess and a protrusion protruding from the recess, on the surface of which a plurality of pre-formed multiple fine unevenness portions are formed, each having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462, an example of a conventional manufacturing method using chemical corrosive etching will be described using Figure 21.

FIG. 21 is a schematic process diagram for producing a pressing plate by a chemical etching process using a conventional resist material.
21, (A) a plate-form substrate is prepared on which a pre-formed multiple fine unevenness 46 having a plurality of pre-formed multiple fine unevenness convex portions 461 and a plurality of pre-formed multiple fine unevenness concave portions 462 is formed by machining or chemical etching using a conventionally used resist material. The depth dimension "d1" of the pre-formed multiple fine unevenness concave portions 462 (the height dimension of the pre-formed multiple fine unevenness convex portions 461) is about 0.05 mm (about 50 μm) to about 1 mm (about 1000 μm), and the width dimension of the pre-formed multiple fine unevenness concave portions 462 and the width dimension of the pre-formed multiple fine unevenness convex portions 461 are about 0.01 mm (about 10 μm) to about 1 mm (about 1000 μm).
(B) A conventional sheet-like conventional dry film resist material 20 is attached to the surface of the pre-formed multiple fine concave-convex portions 46. In this case, the sheet-like general-purpose conventional dry film resist material 20 does not completely adhere to the upper surface of the pre-formed multiple fine concave-convex portion convex portion 461, and the sheet-like conventional dry film resist material 20 does not completely adhere to the side surface and bottom surface of the pre-formed multiple fine concave-convex portion concave portion 452, and a gap tends to occur between the sheet-like conventional dry film resist material 30 and the pre-formed multiple fine concave-convex portions 45. The thickness dimension of the sheet-like conventional dry film resist material 30 is about 0.02 mm to 0.04 mm (about 20 μm to about 40 μm).
(C) A previously prepared exposure mask member 23 is placed to cover the conventional dry film resist material adhered to the surface of the existing multiple fine concave-convex portions 46, and then (D) exposure to ultraviolet light, etc., development, hardening, etc. are performed to form a conventional resist hardened film 30 having the desired shape.
(D) An etching solution is brought into contact with the substrate having the conventional resist hardened film 30 attached thereto, and the surface of the mold substrate in the area where the conventional resist hardened film 30 is not attached is corroded and etched to a depth of approximately 1 mm such that the etching depth dimension "d3" during etching is the surrounding area of the pre-formed multiple fine concave and convex portions 46, thereby forming the second concave forming portion 121b during etching.
(E) Then, the etching is continued until the depth of the surrounding area of the existing multiple fine concave and convex portions 46 reaches a predetermined depth, thereby forming a conventional corroded second concave forming portion 121a having a depth dimension "d12a" of approximately 2 mm.
(F) The conventional resist hardened film 30 is removed.

In this manufacturing method, in (E), the concave side of the pre-formed multiple fine concave-convex portion concave 462 to which the conventional resist hardened film 30 is not attached is also corroded and etched, and a side-etched portion is generated in which the side of the pre-formed multiple fine concave-convex portion convex 461 is corroded and etched due to the side-etching phenomenon, and a side-etched pre-formed multiple fine concave-convex portion convex side 461s (side-etched pre-formed multiple fine concave-convex portion concave side 462s) is formed, resulting in a problem that a pre-formed multiple fine concave-convex portion protrusion that maintains the normal shape of the desired multiple fine concave-convex pattern is not formed. Note that the side of the pre-formed multiple fine concave-convex portion convex 461 means the same part as the side of the pre-formed multiple fine concave-convex portion concave 462, so the side-etched pre-formed multiple fine concave-convex portion convex side 461s means the same part as the side of the pre-formed multiple fine concave-convex portion concave 462s.
(F) A pressing plate is manufactured which has a recess (conventional second recess-forming portion 121a) with a depth dimension "D12a" of about 2 mm, a protrusion protruding from the recess, and a side-etched pre-formed multiple fine recess-forming portion protrusion 466s having a side-etched pre-formed multiple fine recess-forming portion protrusion side 461s and a side-etched pre-formed multiple fine recess-forming portion recess side 462s on the surface of the protrusion. Also, the conventional second recess-forming portion 121a has the form of a side-etched corroded second recess-forming portion 121s.

As described above, in the method of manufacturing a pressing plate using the conventional dry film resist material 20, the side surfaces of the pre-formed multiple fine unevenness convex portions 461 (or the side surfaces of the pre-formed multiple fine unevenness concave portions 462) are also etched, making it impossible to maintain the initial shapes of the pre-formed multiple fine unevenness convex portions 461 and the pre-formed multiple fine unevenness concave portions 462, and therefore it is not possible to manufacture a pressing plate having the desired shape accuracy and dimensional accuracy.

In the method for manufacturing a pressing plate described above using Figure 21, although not shown, instead of the process of (B) "adhering a conventional dry film resist material 30", a process of "adhering a conventional conventional liquid resist material 20 to the surface of the existing multiple fine concave-convex portions 46" similar to the process of using the conventional conventional liquid resist material 20 in Figure 20 described above, followed by processes of (C) development and resist hardened film formation (installation of an exposure mask member, exposure, development), (D) corrosive etching, (E) continued corrosive etching, (F) removal of the resist hardened film, etc., is carried out to manufacture a pressing plate, but even in this case, there is a problem that a pressing plate having the desired shape accuracy and dimensional accuracy cannot be manufactured.
That is, even in this case, a pressing plate is manufactured which has a recess (conventional second recess forming portion 121a) having a depth dimension "d12a" of approximately 2 mm of the corroded second recess forming portion 121a and a protrusion protruding from the recess, and on the surface of the protrusion, a side-etched pre-formed multiple fine unevenness protrusion portion 466s is formed which has a side-etched pre-formed multiple fine unevenness convex portion side surface 461s and a side-etched pre-formed multiple fine unevenness concave portion side surface 462s, but the side surface of the pre-formed multiple fine unevenness convex portion 461 (or the side surface of the pre-formed multiple fine unevenness concave portion 462) is also etched, and the initial shapes of the pre-formed multiple fine unevenness convex portion 461 and the pre-formed multiple fine unevenness concave portion 462 cannot be maintained, resulting in the problem that a pressing plate having the desired shape accuracy and dimensional accuracy cannot be manufactured.

When a workpiece is processed using a press processing plate having the desired shape accuracy and dimensional accuracy, there is a problem in that the workpiece cannot have the desired shape accuracy and dimensional accuracy.

The method for manufacturing a press processing plate of the present invention solves the above-mentioned conventional problems, and is a method for manufacturing a press processing plate for processing a workpiece into a predetermined shape by pressing, and provides a method for manufacturing a press processing plate having the desired shape such as a desired convex portion, a desired concave portion, a desired uneven portion, a desired fine uneven portion, etc., by using a process including chemical corrosive etching which has a simpler process than the conventional general-purpose chemical corrosive etching process, and having the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched."

The pressing plate of the present invention has the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., and provides a pressing plate with the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched."

The present invention provides a method for processing a workpiece, which can prepare a workpiece having a desired shape, such as a desired convex portion, a desired concave portion, a desired uneven portion, a desired fine uneven portion, etc., and having the desired shape accuracy and dimensional accuracy, from a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molded product, or a laminate of these.

The method for producing a pressing plate of the present invention comprises the steps of:
A method for manufacturing a press plate for processing a workpiece into a predetermined shape by pressing the workpiece, comprising the steps of:
(A) a plate mold substrate supplying step of supplying a plate mold substrate (1) having a plate mold substrate first area surface (11) and a plate mold substrate second area surface (12);
(B) a desired area inkjet resist deposition film formation step of depositing an inkjet resist material (2) on a desired area of the first area surface (11) of the plate mold substrate (1) by an inkjet method to form a desired area inkjet resist deposition film; and
a desired area inkjet resist cured film forming step of curing the desired area inkjet resist deposited film to form a desired area inkjet resist cured film (3);
(C) a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch the surface of the plate mold substrate on which the desired region inkjet resist cured film (3) is not attached;
As a result, a recessed portion formed by etching the inkjet resist film is formed in a recessed shape on the surface of the plate mold substrate (1),
as well as,
(D) a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film;
The present invention is characterized in that it comprises:

Preferably,
In the step (A),
The second region surface (12) of the plate mold substrate has one or more non-irregular portions,
The first area surface (11) of the plate mold substrate has one or more preformed projections and recesses (4),
(i) the second region surface (12) of the plate mold substrate has one non-irregular portion,
When the first area surface (11) of the plate mold substrate has one preformed uneven portion (4),
The non-relief portion is located in the surrounding area of the existing relieving portion (4),
The preformed uneven portion (4) is
(a) A prefabricated multiple concave-convex portion (45) having a plurality of prefabricated multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of prefabricated multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
Or,
(B) A pre-formed multiple fine concave-convex portion (46) having a plurality of pre-formed multiple fine concave-convex portion convex portions (461) formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine concave-convex portion concave portions (462) formed with a plurality of fine concave shapes;
(ii) the second region surface (12) of the plate mold substrate has a plurality of non-irregular portions,
When the first region surface (11) of the plate mold substrate has a plurality of preformed concave-convex portions (4),
Each of the plurality of non-relief portions is located in a peripheral region of each of the plurality of pre-formed recessed and protruding portions (4),
Each of the plurality of pre-formed uneven portions (4) is
(a) A prefabricated multiple concave-convex portion (45) having a plurality of prefabricated multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of prefabricated multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
and/or
(B) A pre-formed multiple fine concave-convex portion (46) having a plurality of pre-formed multiple fine concave-convex portion convex portions (461) formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine concave-convex portion concave portions (462) formed with a plurality of fine concave shapes;
In the step (B),
a desired area inkjet resist deposition film forming step of depositing an inkjet resist material (2) by an inkjet method to cover the existing uneven portion (4) on the first area surface (11) of the plate mold substrate (1) to form a desired area inkjet resist deposition film;
as well as,
and a desired area inkjet resist cured film forming step of curing the desired area inkjet resist deposited film to form a desired area inkjet resist cured film (3),
In the step (C),
a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch the plate mold substrate second region surface (12) on which the desired region inkjet resist cured film is not attached, thereby etching the plate mold substrate second region surface (12) without etching the existing uneven portion (4), and forming an inkjet resist film etched second recessed portion 121 formed in a recess shape, wherein the inkjet resist film etched second recessed portion 121 corresponds to the inkjet resist film etched recessed portion;
In the step (D),
a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film (3),
As a result, the second region surface (12) of the plate mold substrate is etched without etching the existing uneven portion (4), forming an inkjet resist film etched second recessed portion (121) formed in a recessed shape, and forming the existing uneven portion (4) into a protruding shape protruding from the inkjet resist film etched second recessed portion 121.
It is characterized by:

The plate for press processing of the present invention is a plate for press processing manufactured by the manufacturing method for a plate for press processing of the present invention.

The method for processing a workpiece of the present invention includes the steps of:
(S-a) a step of supplying a press processing plate (10) manufactured by the method for manufacturing a press processing plate of the present invention;
(S-b) preparing a pressing device having a first base (92) and a second base (93) facing each other;
(S-d) a step of placing a predetermined receiving plate (94) on the second base (93) of the pressing device;
(S-e) a step of driving at least one of the first base (92) and the second base (93) while a workpiece (108) is positioned between the pressing plate (10) and the receiving plate (94), so that the pressing plate (10) and the receiving plate (94) press the workpiece;
As a result, a workpiece unevenness forming portion having an uneven shape that matches the uneven shape of the existing uneven portion (4) is formed on the surface of the workpiece (108),
as well as,
(S-f) a step of driving at least one of the bases of the pressing plate (10) and the receiving plate (94) to move the pressing plate (10) and the receiving plate (94) away from each other, thereby releasing the pressing force on the workpiece;
As a result, a workpiece is prepared in which the workpiece unevenness forming portion is formed on the surface of the workpiece (108) in a form having an uneven shape that matches the uneven shape of the existing unevenness portion (4).
The present invention is characterized in that it comprises:

The method for manufacturing a plate for pressing according to the present invention can achieve the effect of (manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist) making it possible to manufacture a plate for pressing having the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., by using a process including chemical corrosive etching which has a simpler process than the conventional general-purpose chemical corrosive etching process, and which has the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched").

In particular, the manufacturing method for a pressing plate of the present invention can achieve the effect of (manufacturing method effect A-a: effect of being able to form a pre-formed uneven portion of desired dimensions having a protruding shape using inkjet resist) which is a chemical corrosive etching process that forms a pre-formed multiple uneven portion having a concave portion, a protrusion protruding from the concave portion, and a pre-formed multiple fine uneven portion having a plurality of pre-formed multiple uneven portion concave portions and a plurality of pre-formed multiple fine uneven portion convex portions on the surface of the protrusion, and/or a pre-formed multiple fine uneven portion having a plurality of pre-formed multiple fine uneven portion convex portions and a plurality of pre-formed multiple fine uneven portion concave portions, while suppressing corrosive etching of the "areas of the plate mold substrate that should not be etched" to produce a pressing plate having a desired shape.

The pressing plate of the present invention can provide [pressing plate configuration effect I: the effect of obtaining a pressing plate having the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., and having the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of the "areas of the plate mold substrate that must not be etched."]

The method for processing a workpiece of the present invention can provide the effect of preparing a processed product by processing a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molding, or a laminate of these, which has the desired shape, such as a desired convex portion, a desired concave portion, a desired uneven portion, or a desired fine uneven portion, and which has the desired shape accuracy and dimensional accuracy.

1A to 1C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to an embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. FIG. 2 is a schematic diagram for explaining a plurality of preformed fine concave-convex portions formed on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 1 is a schematic diagram for explaining a graphic, letter, and picture pattern shape formed by projections and recesses on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention; FIG. 1 is a schematic diagram for explaining a graphic, letter, and picture pattern shape formed by projections and recesses on a pressing plate in a method for manufacturing a pressing plate according to one embodiment of the present invention; FIG. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 5A to 5C are schematic diagrams illustrating the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A is a schematic diagram of a known pressing device that is used to form a pressing plate, and that can also be used for the pressing plate of the present invention, where (A) is a processing device that is used to form a flat pressing plate, and (B) is a roll-shaped pressing device. FIG. 2 is a schematic diagram of a known pressing device that constitutes a pressing plate and that can also be used for the pressing plate of the present invention. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing. 1A to 1C are schematic diagrams illustrating the manufacturing steps of a conventional method for manufacturing a plate for pressing.

<About the method for producing the pressing plate of the present invention>
[Basic configuration 1]
The method for producing a press plate of the present invention has the following configuration.
A method for manufacturing a press processing plate for processing a workpiece into a predetermined shape by pressing, comprising: (A) a plate mold substrate supplying step of supplying a plate mold substrate 1 having a plate mold substrate first region surface 11 and a plate mold substrate second region surface 12; (B) a desired region inkjet resist adhered film forming step of adhering an inkjet resist material 2 to a desired region of the plate mold substrate first region surface 11 of the plate mold substrate 1 by an inkjet method to form a desired region inkjet resist adhered film, and a desired region inkjet resist hardened film forming step of hardening the desired region inkjet resist adhered film to form a desired region inkjet resist hardened film 3; (C) a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 has been formed, to etch the surface of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 has not been attached, thereby forming a corrosion recess formation portion formed in a recess shape on the surface of the plate mold substrate 1; and (D) a desired region inkjet resist hardened film removal step of removing the desired region inkjet resist hardened film 3.
In this manner, a pressing plate having a desired uneven surface shape is manufactured.

In addition, in the above process (A), the "mold substrate supplying process of supplying the mold substrate 1" can also be implemented as the "mold substrate supplying process of preparing the mold substrate 1", and "supply" and "preparation" have similar meanings.
In addition, the first region surface 11 of the plate mold substrate is a virtual first region surface of the plate mold substrate, and the second region surface 12 of the plate mold substrate is a virtual second region surface of the plate mold substrate. That is, the first region surface 11 of the plate mold substrate is a virtual first region surface of the plate mold substrate, and the second region surface 12 of the plate mold substrate is a virtual second region surface of the plate mold substrate.
In addition, a configuration in which the first area surface 11 of the mold substrate and the second area surface 12 of the mold substrate are located on adjacent area surfaces, and/or a configuration in which the second area surface 12 of the mold substrate is located on the surrounding area surface of the first area surface 11 of the mold substrate, and/or a configuration in which the first area surface 11 of the mold substrate is located on the surrounding area surface of the second area surface 12 of the mold substrate, are preferably implemented.
As will be explained in the "subordinate configuration 4" and "subordinate configuration 7" described later, the existing multiple uneven portion 45 having the existing multiple uneven portion convex portion 451 and the existing multiple uneven portion concave portion 452 can preferably be a desired graphic character pattern formed with at least one uneven shape selected from the group consisting of (a) letters, (b) symbols, (c) figures, (d) pictures, and (e) designs, or a desired fine graphic character pattern formed with a fine uneven shape of these graphic character patterns.

The method for manufacturing a plate for pressing according to the present invention can achieve the effect of (manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist) making it possible to manufacture a plate for pressing having the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., by using a process including chemical corrosive etching which has a simpler process than the conventional general-purpose chemical corrosive etching process, and which has the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched").

There is no particular limitation on the plate mold substrate 1. For example, a plate mold substrate 1 made of metal, plastic, resin, or the like, which is commonly used as a plate for pressing, can be used.
Particularly preferably, the plate mold substrate 1 can be made of metals such as stainless steel, brass, copper, magnesium, duralumin, etc., and steels such as iron, cemented carbide (GM MF), powder high speed steel (YXM), high speed steel (high speed steel, SKH, HSS), die steel (SKD), alloy tool steel (SKT, SKS), carbon tool steel (SK), etc.
The cemented carbide has hard properties and is not particularly limited, but for example, it is a composite material in which a carbide of a metal of group IVa, Va, or VIa of the wear-resistant periodic table (for example, tungsten carbide, WC) is sintered with an iron-based metal such as Fe, Co, or Ni, and is a steel material with excellent mechanical properties and least likely to break or be scratched, and cemented carbide such as WC-Co, WC-TiC-Co, WC-TaC-Co, WC-TiC-TaC-Co, WC-Ni, or WC-Ni-Cr can be used. As the cemented carbide, for example, a cemented carbide having a hardness of HRA90 or more, such as GM30 (hardness HRA90) or MF20 (hardness HRA91), or a hardness of HRC70 or more can be preferably used.
High speed steel is tough and has excellent toughness, high resistance, high heat resistance, etc., and contains 3 to 10% molybdenum-based components. For example, steel materials of SKH51 (hardness HRC 62 to 64), DC53 (hardness HRC 59 to 61), and SKD (hardness HRC 59 to 61) can be preferably used.
Powdered high speed steel has strong toughness, wear resistance, and a hardness greater than that of high speed steel. It contains 4.7 to 5.3% of molybdenum-based components, and a steel material having a hardness of HRC 64 to 67, such as YXM1, can be preferably used.
The die steel has resistance to heat and physical impact, and steel materials such as SKD11, KD21, KD11, DC53, D2, etc., with a hardness of HRC 59 to 61 can be preferably used.

Thus, cemented carbide has a hardness harder than high speed steel, die steel, alloy tool steel, and carbon tool steel. The types and properties of these steel materials can be selected as desired from the steel materials described in the Japanese Industrial Standards (JIS). The hardness symbols HRA, HRC, etc. indicate Rockwell hardness according to the Japanese Industrial Standards (JIS).
In the present invention, metals containing at least iron are defined as steel.
Furthermore, metals such as iron, copper, magnesium, duralumin, etc. refer to metals containing these metals as the main component, or metals containing these metals as the main component with other metals added thereto.
For the pressing plate, a plate mold substrate made of metal, plastic, resin, or rubber is selected as desired, and a plate mold substrate having a desired size and shape is used.

As a desired area inkjet resist film forming step of forming a desired area inkjet resist film by applying the inkjet resist material 2 to a desired area of the first area surface 11 of the plate mold substrate 1 by an inkjet method, for example, a step of applying the inkjet resist material 2 to a desired area of the plate mold substrate by an inkjet method using an apparatus similar to an inkjet printing system apparatus commonly used in the fields of wiring boards for electronic components and printing can be carried out. For example, an on-demand inkjet printing system apparatus is used to discharge the inkjet resist material 2 from a discharge nozzle having a predetermined number of fine holes, and is controlled by CAD data to move relative to the plate mold substrate, so that the inkjet resist material 2 is landed in a desired fine droplet state on the desired area of the plate mold substrate surface with high precision and applied separately, thereby forming a desired area inkjet resist film that is applied with high precision to the desired area of the plate mold substrate 1.
As the ejection nozzle, for example, an inkjet printing system device equipped with a nozzle head having a large number (about 1,000 to about 10,000) of ejection nozzles with minute apertures can be used.
The inkjet printing system device is not particularly limited, but examples thereof include on-demand inkjet printing system devices manufactured by MicroCraft, Fujifilm, Ishii Omokki, Keyence, SSI Japan, or devices manufactured by other companies that are similar to these inkjet printing system devices, and inkjet printing system devices that have been modified to meet the desired specifications, such as the desired ejection frequency, resolution, droplet volume, and number of nozzles, can be used.
In the examples described below, an on-demand inkjet printing system manufactured by Microcraft was used to inkjet-apply the inkjet resist material to the plate substrate.

Preferably, an inkjet printing system having the following specifications is preferred:
The amount of inkjet resist material droplets ejected from the ejection nozzle is 3 pl to 15 pl, the horizontal resolution is 360 dpi, 720 dpi, 1080 dpi, 1440 dpi, or 600 dpi, 900 dpi, 1200 dpi, 1500 dpi, or 2400 dpi, the vertical resolution is 720 dpi, 1440 dpi, 2160 dpi, or 1200 dpi, or 2400 dpi, the standard resolution is 720 dpi to 1200 dpi, and the minimum line width when the inkjet resist deposition film in the desired area is linear is 40 μm to 90 μm.
The thickness of the inkjet resist film in the desired area is not particularly limited, but for example, the thickness of the inkjet resist cured film in the desired area after curing is preferably in the range of about 5 μm to about 100 μm, and more preferably, the thickness of the inkjet resist film in the desired area is in the range of about 5 μm to about 50 μm.

When a conventional liquid resist material is used, the thickness is about 50 μm or more, and as the thickness increases, the variation in thickness of the planar region of the conventional resist deposition film material increases, and it tends to be impossible to form a uniform conventional resist deposition film. As a result, during exposure to ultraviolet light, etc. using an exposure mask member, variation in exposure occurs, making it impossible to form a developed conventional resist hardened film having the desired shape accuracy and dimensional accuracy. As a result, when the conventional resist hardened film is used as an etching mask to corrode and etch a plate substrate, it tends to be impossible to form uneven portions having the desired shape accuracy and dimensional accuracy.

In contrast, when a desired area inkjet resist deposited film is formed, it can be deposited to a thickness of about 100 μm, which is thicker than when a conventional liquid resist material is used, and since the desired area inkjet resist deposited film is directly exposed to light without development using an exposure mask member to form a desired area inkjet resist cured film, it is possible to form a desired area inkjet resist cured film having a desired shape even for a desired area inkjet resist deposited film of about 50 μm or more. As a result, when a plate mold substrate is corroded and etched using the desired area inkjet resist cured film as an etching mask, unevenness having the desired shape accuracy and dimensional accuracy can be formed.
However, when an inkjet resist material is used, a desired area inkjet resist deposition film in the range of about 5 μm to about 50 μm is preferably achieved.

The inkjet resist material 2 is not particularly limited, but may be, for example, a conventional general-purpose liquid inkjet resist material used in the fields of manufacturing wiring boards for electronic components, photolithography technology, etc., and having the desired viscosity, photosensitive reactivity, temperature reactivity, etc. The inkjet resist material is a resist material used for partial protection during chemical corrosive etching, i.e., as a corrosive etching mask against etching during chemical corrosive etching, and an etching resist material 2 having resistance to dissolution in etching solutions, such as alkali resistance or acid resistance, is selected as desired and used according to the etching treatment chemicals used during the corrosive etching of the plate mold substrate.
For example, a general-purpose conventional inkjet resist material 2, which is a type of negative photoresist that is a fluid material mainly composed of an organic polymer material with a two-dimensional chemical structure and has the property of being crosslinked in chemical structure and changing to a crosslinked organic polymer state with a three-dimensional chemical structure and curing by ultraviolet irradiation, electron beam irradiation, laser irradiation, or heating, can be used. Particularly preferably, a general-purpose inkjet resist material that chemically reacts and crosslinks by ultraviolet irradiation or exposure to ultraviolet light can be preferably implemented. Note that, after curing into a crosslinked organic polymer state with a three-dimensional chemical structure, it can also be preferably implemented by further heating at a temperature of 80°C to 150°C to form a further matured cured film.
The inkjet resist hardened film 3 thus formed provides partial protection during chemical corrosive etching, that is, functions as a corrosive etching mask during corrosive etching.

There is no particular limitation on the viscosity of the inkjet resist material 2. For example, the inkjet resist material 2 preferably has a viscosity of 5 mPa·s to 100 mPa·s (25° C.), and more preferably has a viscosity of 10 mPa·s to 50 mPa·s (25° C.).
The thickness of the inkjet resist deposition film tends to be thinner as the viscosity of the inkjet resist material 2 decreases, and the thickness of the inkjet resist deposition film tends to be thicker as the viscosity of the inkjet resist material 2 increases. An inkjet resist material having a viscosity capable of forming an inkjet resist deposition film of a desired thickness required for the function as a corrosive etching mask is selected and used. Using the inkjet resist material 2 having the optimum viscosity, an inkjet resist deposition film having a desired graphic, letter, or picture pattern shape with high accuracy is formed in a desired area on the surface of the plate mold substrate.

When the above-mentioned inkjet resist material 2 is used on a plate mold substrate having an uneven portion formed thereon, an inkjet resist film can be formed in a desired area without the inkjet resist material dripping onto the side of the concave or convex portions of the uneven portion.
The desired area inkjet resist cured film (3) formed by curing the desired area inkjet resist deposited film is used as a mask for corrosive etching and acts as a partial protective film for the side of the unevenness of the unevenness of the plate mold substrate when etching the unevenness, thereby exerting a remarkable effect of being able to etch only the desired area with corrosive etching of the side of the unevenness suppressed.

The specific material of the inkjet resist material is not particularly limited, and for example, a general-purpose inkjet resist material used for corroding and etching metals on printed wiring boards in the field of electronic components can be used. For example, inkjet resist materials having a wide variety of physical properties are commercially available and supplied by companies such as Taiyo Ink Mfg. Co., Ltd., Mitsui Chemicals, Inc., GOO Chemical Industry Co., Ltd., JNC Corporation, Nikko Materials Co., Ltd., Asahi Kasei Corporation, Nippon Agfa Lewald AG, Tokyo Ohka Kogyo Co., Ltd., and the like. An inkjet resist material having a desired viscosity that undergoes a chemical reaction upon exposure to ultraviolet light to become insoluble and form a hardened resist film can be selected as desired and used.

There is no particular limitation on the etching solution used to etch the desired area of the mold substrate 1, and any general-purpose etching solution generally used in the manufacture of pressing dies can be selected and used as desired. The etching solution is not particularly limited, but for example, a general-purpose "aqueous solution of ferric chloride" is preferably used.
For example, when the plate mold substrate 1 is made of copper, brass, magnesium alloy, iron, or steel, an aqueous solution of ferric chloride is used to bring an etching solution into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, and the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is not attached is etched.
For example, when the plate mold substrate is made of resin, plastic, or rubber, a liquid capable of dissolving the resin, plastic, or rubber is used to bring an etching solution into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, and the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is not attached is etched.

The method for contacting the surface of the plate mold substrate 1 with the etching solution is not particularly limited, and for example, a method of contacting the surface of the plate mold substrate 1 on which the desired area inkjet resist hardened film 3 has been formed with the etching solution by a shower method, a method of immersing the plate mold substrate 1 on which the desired area inkjet resist hardened film 3 has been formed in an etching solution container containing the etching solution, a paddle blowing method, or other contact methods can be preferably used.
The etching depth of the plate mold substrate increases as the time that the etching solution is in contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist cured film 3 is formed increases. Therefore, the etching time is controlled to perform etching so as to obtain the desired etching depth.

The resist removal method for removing the inkjet resist cured film in the desired region is not particularly limited, and may be such that a liquid agent capable of chemically decomposing the inkjet resist cured film, such as an aqueous sodium hydroxide solution, is used, and the aqueous sodium hydroxide solution is brought into contact with the inkjet resist cured film to chemically decompose, decompose and dissolve, swell and/or peel off the inkjet resist cured film, thereby removing the inkjet resist cured film from the plate mold substrate with the desired region etched.

Thereafter, through processes such as washing with water and drying, a corroded recess is formed in the surface of the plate mold substrate 1 in a recessed shape.
As described above, the area covered by the desired area inkjet resist hardened film 3 remains without being etched, and a corroded protrusion-forming portion having a shape protruding from the bottom surface of the concave shape of the corroded recess-forming portion is formed as a convex shape.
In this manner, a pressing plate having an uneven surface shape is manufactured.

[Subordinate configuration 2]
In the method for producing a press plate of the present invention described above in [Basic Configuration 1], it is possible to preferably implement a method for producing a press plate having the following configuration.
In the step (A) of [Basic Configuration 1], the second region surface 12 of the plate mold substrate has one or more non-relief portions without any irregularities, and the first region surface 11 of the plate mold substrate has one or more pre-formed irregular portions 4 .
(i) When the second region surface 12 of the substrate for the mold has one uneven portion without any irregularities and the first region surface 11 of the substrate for the mold has one pre-formed uneven portion 4, the uneven portion is located in the surrounding region of the pre-formed uneven portion (4), and the pre-formed uneven portion 4 has (a) a pre-formed multiple uneven portion 45 having a plurality of pre-formed multiple uneven portion convex portions 45 formed with a plurality of convex shapes and a plurality of pre-formed multiple uneven portion concave portions 452 formed with a plurality of concave shapes, or (b) a pre-formed multiple fine uneven portion 46 having a plurality of pre-formed multiple fine uneven portion convex portions 461 formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine uneven portion concave portions 462 formed with a plurality of fine concave shapes.
(ii) when the second region surface 12 of the substrate for the mold has a non-irregular portion without multiple irregularities and the first region surface 11 of the substrate for the mold has a multiple pre-formed uneven portion 4, each of the multiple non-irregular portions is located in the surrounding region of each of the multiple pre-formed uneven portions 4, and each of the multiple pre-formed uneven portions 4 has (a) a pre-formed multiple uneven portion 45 having a multiple pre-formed multiple uneven portion convex portions 451 formed with a multiple convex shapes and a multiple pre-formed multiple uneven portion concave portions 452 formed with a multiple concave shapes, and/or (b) a pre-formed multiple fine uneven portion 46 having a multiple pre-formed multiple fine uneven portion convex portions 461 formed with a multiple fine convex shapes and a multiple pre-formed multiple fine uneven portion concave portions 462 formed with a multiple fine concave shapes.

The process (B) of [Basic Configuration 1] includes a desired area inkjet resist deposition film formation process in which an inkjet resist material 2 is deposited by an inkjet method to cover the existing uneven portion 4 on the plate mold substrate first area surface 11 of the plate mold substrate 1 to form a desired area inkjet resist deposition film, and a desired area inkjet resist hardened film formation process in which the desired area inkjet resist deposition film is hardened to form a desired area inkjet resist hardened film 3.

The step (C) of [Basic Configuration 1] includes a step of etching the plate mold substrate by contacting an etching solution with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, and etching the plate mold substrate second region surface 12 on which the desired region inkjet resist hardened film is not attached. This etches the plate mold substrate second region surface 12 without etching the existing uneven portion 4, and forms the inkjet resist film etched second recess formation portion 121 formed in a recess shape.
Here, the "inkjet resist film etched second recessed portion 121" formed in a recessed shape corresponds to the "etched recessed portion" formed in a recessed shape of the "basic configuration 1" described above.
The step (D) of [Basic Configuration 1] includes a desired area inkjet resist hardened film removal step of removing the desired area inkjet resist hardened film 3.

As a result, the second area surface 12 of the mold substrate is etched without etching the existing uneven portion 4, thereby forming the inkjet resist film etched second recessed portion 121 formed in a recessed shape, and the existing uneven portion 4 is formed into a protruding shape protruding from the inkjet resist film etched second recessed portion 121.
In this manner, a pressing plate is manufactured.
It should be noted that the “inkjet resist film etching second recess forming portion 121 ” in this subordinate configuration 2 corresponds to the “etched recess forming portion” in the basic configuration 1 described above.

In this configuration, as described above, there is no particular limitation on the viscosity of the inkjet resist material 2. For example, the inkjet resist material 2 preferably has a viscosity of 5 mPa·s to 100 mPa·s (25° C.), and more preferably has a viscosity of 10 mPa·s to 50 mPa·s (25° C.).
There is a tendency that the thickness of the inkjet resist deposited film becomes thinner as the viscosity of the inkjet resist material 2 becomes lower, and the thickness of the inkjet resist deposited film becomes thicker as the viscosity of the inkjet resist material 2 becomes higher. An inkjet resist material having a viscosity capable of forming an inkjet resist deposited film of a desired thickness required for functioning as a corrosive etching mask is selected and used.
By using the inkjet resist material 2 having an optimal viscosity, it is possible to form a desired thickness and a desired inkjet resist attached film with high accuracy in a desired region on the surface of the plate mold substrate. Furthermore, for example, when a plate mold substrate having a plurality of pre-formed concave and convex portions 4 is used, the inkjet resist material attached to each side of the pre-formed convex portions 451 formed with a plurality of convex shapes and the pre-formed concave portions 452 formed with a plurality of concave shapes, and/or the pre-formed fine convex portions 461 formed with a plurality of fine convex shapes and the pre-formed fine concave portions 462 formed with a plurality of fine concave shapes forms a desired region inkjet resist attached film on each side without dripping.
Furthermore, the desired area inkjet resist deposition film acts as a partial protective film for the side surfaces of the multiple pre-formed multiple concave-convex portions 451 and the multiple pre-formed multiple concave-convex portions 452, and/or the multiple pre-formed multiple fine concave-convex portions 461 and the multiple pre-formed multiple fine concave-convex portions 462 of the concave-convex portion during corrosive etching of the plate mold substrate, thereby suppressing corrosive etching of the side surfaces of the multiple pre-formed multiple concave-convex portions 451 and the multiple pre-formed multiple concave-convex portions 452, and/or the multiple pre-formed multiple fine concave-convex portions 461 and the multiple pre-formed multiple fine concave-convex portions 462, and significantly exhibiting the effect of being able to etch only the desired area around the pre-formed concave-convex portions 4.

The configuration of the present invention provides the aforementioned "(Manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist)" and, in particular, provides the effect of "(Manufacturing method effect A-a: effect of being able to form a pre-formed uneven portion of desired dimensions having a protruding shape using inkjet resist) an effect of being able to manufacture a pressing plate having a desired shape by chemical corrosive etching processing, in which a pre-formed multiple uneven portion having a concave portion and a protrusion protruding from the concave portion, and a pre-formed multiple fine uneven portion having a plurality of pre-formed multiple uneven portion concave portions and a plurality of pre-formed multiple fine uneven portion convex portions and a plurality of pre-formed multiple fine uneven portion concave portions is formed on the surface of the protrusion, and/or a pre-formed multiple fine uneven portion having a plurality of pre-formed multiple fine uneven portion convex portions and a plurality of pre-formed multiple fine uneven portion concave portions, and in which corrosive etching of the 'areas of the plate mold substrate that must not be etched' is suppressed."

The method for manufacturing a pressing plate of the present invention will be described below with reference to the drawings. The drawings do not accurately show the shapes, sizes, dimensions, etc. of the pressing plate and components, but show a schematic outline for explaining the features such as the shapes, configurations, systems, and effects.

[Subordinate structure 3]
In the manufacturing method of a press plate of the present invention having the above-mentioned [Basic Configuration 1], it is possible to preferably implement a manufacturing method of a press plate having the following "Sub-Configuration 3".
FIG. 1 and FIG. 2 are schematic diagrams for explaining the manufacturing steps of a method for manufacturing a press plate according to one embodiment of the present invention;
In Figures 1 and 2, (A-b), (B-b), (C-b), and (D-b) are schematic plan views, and (A), (B), (C), and (D) are schematic cross-sectional views taken along line A-A of the schematic plan views.
FIG. 3 is a schematic diagram for explaining the manufacturing steps of a method for manufacturing a press processing plate according to another embodiment of the present invention, and (A), (B), (C), and (D) of FIG. 3 are schematic cross-sectional views.

In step (A) of the aforementioned subordinate configuration 2, as shown in Fig. 1, Fig. 2(A), (A-b), and Fig. 3(A), the second region surface 12 of the plate mold substrate has a non-relief portion without any irregularities, the first region surface 11 of the plate mold substrate has a pre-formed irregular portion 4, and the second region surface 12 of the plate mold substrate is located in the peripheral region of the first region surface 11 of the plate mold substrate. The pre-formed irregular portion 4 has a plurality of pre-formed irregular portions 45.
(i) The preformed multiple uneven portion 45 has a plurality of preformed multiple uneven portion convex portions 451 formed with a plurality of convex shapes and a plurality of preformed multiple uneven portion concave portions 452 formed with a plurality of concave shapes, the plurality of preformed multiple uneven portion convex portions 451 have a plurality of preformed multiple uneven portion convex portion upper surfaces 451a and a plurality of preformed multiple uneven portion convex portion side surfaces 451b, and the plurality of preformed multiple uneven portion concave portions 452 have a plurality of preformed multiple uneven portion concave portion bottom surfaces 452c and a plurality of preformed multiple uneven portion concave portion side surfaces 452b.
Here, the multiple convex portion side surfaces 451b of the existing multiple concave-convex portions and the multiple concave-convex portion side surfaces 452b of the existing multiple concave-convex portions correspond to the same side surface region.

1, 2B, 2B-b, and 3B, the step (B) of the subordinate configuration 2 includes an inkjet resist film forming step of applying an inkjet resist material 2 by an inkjet method to cover the convex portion top surfaces 451a, the convex portion side surfaces 451b, and the concave portion bottom surfaces 452c of the pre-formed multiple concave-convex portions to form an inkjet resist convex portion top surface adhering film, an inkjet resist convex portion side surface adhering film, and an inkjet concave portion bottom surface adhering film, as shown in FIG. 1, FIG. 2B, (B-b), and FIG. 3B. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate mold substrate located in the peripheral region of the pre-formed multiple concave-convex portions 45.
The process (B) further includes a desired region inkjet resist hardened film formation process, in which the film adhered to the top surface of the inkjet resist convex portion, the film adhered to the side surface of the inkjet resist convex portion, and the film adhered to the bottom surface of the inkjet recess portion are hardened to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist convex portion top surface hardened film 3a, a desired region inkjet resist convex portion side surface hardened film 3b, and a desired region inkjet resist recess bottom surface hardened film 3c.
In this manner, a desired region inkjet resist hardened film 3 is formed, which has a desired region inkjet resist convex portion top surface hardened film 3a, a desired region inkjet resist convex portion side surface hardened film 3b, and a desired region inkjet resist concave portion bottom surface hardened film 3c.

Here, since the multiple pre-formed multiple concave-convex portion convex side surfaces 451b and the multiple pre-formed multiple concave-convex portion concave side surfaces 452b correspond to the same side surface region, the inkjet resist convex portion side adhered film and the inkjet concave portion side adhered film correspond to the same adhered film, and the desired area inkjet resist convex portion side surface hardened film 3b means the same hardened film as the desired area inkjet resist concave portion side surface hardened film.

The step (C) of the aforementioned subordinate configuration 2 includes a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate 1 on which the desired region inkjet resist convex portion top surface hardened film 3a, the desired region inkjet resist convex portion side surface hardened film 3b, and the desired region inkjet resist concave portion bottom surface hardened film 3c are formed, to etch the plate mold substrate second region surface 12 on which the desired region inkjet resist hardened film 3 is not attached, as shown in Figs. 1, 2(C), (C-b), and 3(C).
As a result, the second area surface 12 of the plate mold substrate is etched without etching the pre-formed multiple concave-convex portions 45, thereby forming an inkjet resist film etched second concave formation portion 121 having an etched concave shape, and the pre-formed multiple concave-convex portions 45 are formed into the form of an inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the inkjet resist film etched second concave formation portion 121.

The step (D) of the aforementioned subordinate configuration 2 includes a resist hardened film removal step of removing the hardened film 3a on the top surface of the desired region inkjet resist convex portion, the hardened film 3b on the side surface of the desired region inkjet resist convex portion, and the hardened film 3c on the bottom surface of the desired region inkjet resist, as shown in Figs. 1, 2(D), (D-b), and 3(D).

As a result, the second region surface 12 of the plate mold substrate is etched to form an inkjet resist film corrosion second recess formation portion 121 without etching the pre-formed multiple uneven portions 45, and the first region surface 11 of the plate mold substrate having a pre-formed multiple uneven portion 45 having a plurality of pre-formed multiple uneven portion convex portions 451 and a plurality of pre-formed multiple uneven portion concave portions 452 is formed in the form of an inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
As shown in Figures 1, 2(D), (D-b), and 3(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "D12", and the depth dimensions of the multiple existing multiple uneven portion convex portions 451 and the multiple existing multiple uneven portion concave portions 452 each maintain the initial depth dimension "D1".
In this manner, a pressing plate is manufactured.

This configuration provides the aforementioned "(Manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist)" and, in particular, provides the effect of "(Manufacturing method effect A-a: effect of being able to form a pre-formed uneven portion of desired dimensions with a protruding shape using inkjet resist) an effect of being able to manufacture a pressing processing plate having a desired shape by chemical corrosive etching processing, in which a concave portion and a protrusion protruding from the concave portion, and a pre-formed multiple uneven portion having a plurality of pre-formed multiple uneven portion concave portions and a plurality of pre-formed multiple uneven portion convex portions on the surface of the protrusion, are formed, and corrosive etching of the "areas of the plate mold substrate that must not be etched" is suppressed."
In other words, the inkjet resist film is etched to form a second recessed portion 121, and the effect of "making it possible to manufacture a pressing plate having a desired shape by suppressing the etching of the convex portion side 451b of the multiple pre-formed multiple concave-convex portions (the same side as the concave portion side 452b of the multiple pre-formed multiple concave-convex portions) which is an area of the plate mold substrate that must not be etched" is obtained.

The manufacturing processes for the pressing plate shown in FIGS. 1, 2 and 3 are different from each other in the following respects.

In the manufacturing process of the pressing plate shown in Figure 1, in process (A), the concave portion 452 of the pre-formed multiple uneven portion 45 of Figure 1 (A) has a depth "D1", and the second area surface 12 of the plate mold substrate has a shape having the same height as the upper surface 451a of the convex portion of the pre-formed multiple uneven portion 45 of the pre-formed multiple uneven portion 45.
In step (B), as shown in FIG. 1(B), an inkjet resist hardened film 3 is formed covering all areas of the convex portion side surface 451b of the existing multiple concave-convex portions, the concave bottom surfaces 452c of the existing multiple concave-convex portions, and the concave side surfaces 452b of the existing multiple concave-convex portions.
In step (C), as shown in FIG. 1(C), a region where the inkjet resist hardened film 3 is not formed in the desired region is etched to form an inkjet resist film etched second recess forming portion 121.
In step (D), as shown in FIG. 1(D), the inkjet resist hardened film 3 in the desired region is removed, whereby the pre-formed multiple concave-convex portions 45 are formed into inkjet film etched pre-formed multiple concave-convex portion protrusions 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second concave forming portion 121.
That is, as shown in FIG. 1(D), the surrounding area of the existing multiple unevenness portion 45 maintains the initial depth "D1" of the existing multiple unevenness portion recess bottom surface 452c, and an inkjet resist film etched second recess formation portion 121 having a depth "D12" is formed in the surrounding area, so that an inkjet film etched existing multiple unevenness portion protrusion portion 455 having a shape protruding from the inkjet resist film etched second recess formation portion 121 is formed.

In the manufacturing process of the pressing plate shown in Fig. 2, in step (A), the pre-formed multiple concave-convex portion concave 452 of the pre-formed multiple concave-convex portion 45 in Fig. 2(A) has a depth "D1", and the plate mold substrate second region surface 12 has the same height shape as the bottom surface of the pre-formed multiple concave-convex portion concave 452c of the pre-formed multiple concave-convex portion 45. The height shape of this plate mold substrate second region surface 12 is different from the height shape of the plate mold substrate second region surface 12 in Fig. 1(A).
In step (B), as shown in FIG. 2(B), a desired region inkjet resist hardened film 3 is formed by covering all of the regions of the convex portion side surface 451b of the existing multiple concave-convex portions, the concave bottom surfaces 452c of the existing multiple concave-convex portions, and the concave side surfaces 452b of the existing multiple concave-convex portions.
In step (C), as shown in FIG. 2(C), a region where the inkjet resist hardened film 3 is not formed in the desired region is etched to form an inkjet resist film etched second recess forming portion 121.
In step (D), as shown in FIG. 2(D), the inkjet resist hardened film 3 in the desired area is removed, whereby the pre-formed multiple concave-convex portions 45 are formed into inkjet film etched pre-formed multiple concave-convex portion protrusions 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second concave forming portion 121.
That is, as shown in FIG. 2(D), the surrounding area of the existing multiple unevenness portion 45 forms an inkjet resist film etched second recess formation portion 121 having a depth "D12", and the existing multiple unevenness portion 45 is formed into an inkjet film etched existing multiple unevenness portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second recess formation portion 121.

In the manufacturing process for the pressing plate shown in Figure 3, in step (A), as shown in Figure 3 (A), the second area surface 12 of the plate mold substrate has a non-irregular portion having multiple irregularities, and the first area surface 11 of the plate mold substrate has a multiple preformed irregular portions 4.
Each of the multiple pre-formed uneven portions 4 has a pre-formed multiple uneven portion 45, and the pre-formed multiple uneven portion concave portion 452 of the pre-formed multiple uneven portion 45 has a depth (the same as the height of the pre-formed multiple uneven portion convex portion 451) of "D1".
The surface of each non-relief portion of the second region surface 12 of the mold substrate has the same height as the upper surface 451 a of the convex portion of the existing multiple concave-convex portion 45 .
3B, the desired area inkjet resist hardened film 3 is formed covering all areas of the convex portion side surface 451b of each of the preformed multiple concave-convex portions, the concave bottom surface 452c of each of the preformed multiple concave-convex portions, and the concave side surface 452b of each of the preformed multiple concave-convex portions. Furthermore, the desired area inkjet resist hardened film 3 is also formed in the area of the plate mold substrate second area surface 12 only in the peripheral area of the preformed multiple concave-convex portions 45. In this case, the desired area inkjet resist hardened film 3 is not formed in the central area of the plate mold substrate second area surface 12 located between the preformed multiple concave-convex portions 45 adjacent to each other.
In step (C), as shown in FIG. 3(C), a region where the inkjet resist cured film 3 is not formed in the desired region is etched to form an inkjet resist film etched second recess forming portion 121.
In step (D), as shown in FIG. 3(D), the inkjet resist hardened film 3 in the desired region is removed, thereby forming a plurality of inkjet resist film etched second recessed formation portions 121, and the pre-formed multiple uneven portions 45 are formed in the form of inkjet film etched pre-formed multiple uneven portion protrusions 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second recessed formation portion 121.
That is, as shown in FIG. 3(D), a plurality of inkjet resist film corrosion second recess formation portions 121 having a depth "D12" are formed, and a plurality of inkjet film corrosion existing multiple uneven portion protrusion portions 455 are formed in which the existing multiple uneven portions 45 maintain the initial depth "D1" of the existing multiple uneven portion recess bottom surfaces 452c.

In addition, in Figures 1, 2, and 3, "D1" indicates the height dimension of the existing multiple unevenness portion convex portion 451 and the depth dimension of the existing multiple unevenness portion concave portion 452, and since the depth of the existing multiple unevenness portion concave portion 452 means the same area as the height of the existing multiple unevenness portion convex portion 451, the depth dimension of the existing multiple unevenness portion concave portion 452 has the same "D1" as the height dimension of the existing multiple unevenness portion convex portion 451.
"W1" indicates the width dimension of the convex portion 451 of the existing multiple concave-convex portion, and "W2" indicates the width dimension of the concave portion 452 of the existing multiple concave-convex portion.

[Subordinate structure 4]
In the method for manufacturing a press plate according to the above-mentioned [subordinate configuration 3], it is preferable to implement a method for manufacturing a press plate having the following configuration.
In the process (A), the existing multiple uneven portion 45 having the existing multiple uneven portion convex portion 451 and the existing multiple uneven portion concave portion 452 forms a graphic character picture pattern formed with at least one uneven shape selected from the group consisting of (a) letters, (b) symbols, (c) figures, (d) pictures, and (e) designs.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect of being able to form a concave-convex surface shape of desired dimensions using inkjet resist)" and (Manufacturing method effect A-a: Effect of being able to form a pre-formed concave-convex portion of desired dimensions having a protruding shape using inkjet resist), and in particular, "(Manufacturing method effect A-ab: Effect of being able to manufacture a pressing plate having a surface formed of concaves, convex portions, and/or concave-convex portions having a desired graphic, letter, or picture pattern shape) Effect of being able to manufacture a pressing plate having a desired size and shape, and capable of forming (A) letters, (B) symbols, (C) figures, (D) pictures, etc. and (e) it is possible to manufacture a pressing plate having a surface formed of recesses, protrusions, and/or uneven portions having a desired graphic, letter, design, pattern, etc., and corrosive etching of areas that should not be etched is suppressed, thereby making it possible to manufacture a pressing plate having the desired shape and desired size dimensions, such as the desired height dimensions of the protrusions, the desired depth dimensions of the recesses, the desired height dimensions and depth dimensions of the uneven portions, etc.
In particular, "side etching" in which "the side surfaces of the convex portions 451b of the existing multiple concave-convex portions and the side surfaces of the concave portions 452b of the existing multiple concave-convex portions" which are regions that should not be etched are corroded and etched is suppressed.

[Subordinate structure 5]
In the manufacturing method of a pressing plate of the above-mentioned [subordinate configuration 3] and/or [subordinate configuration 4], the respective shape dimensions are not particularly limited. For example, a manufacturing method of a pressing plate having the following configuration can be desirably implemented.
In the step (A) of the above-mentioned [dependent structure 3] and/or [dependent structure 4], the height dimension "D1" of each of the preformed multiple uneven portion convex portions 451 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm.
The width dimension "W1" of each of the preformed multiple concave-convex portions of the multiple preformed multiple concave-convex portions 451 is not particularly limited.
The depth dimension "D1" of each of the preformed multiple uneven portion concaves of the plurality of preformed multiple uneven portion concaves 452 is not particularly limited, but is preferably 0.1 mm or more, more preferably 0.1 mm to 3.0 mm, more preferably 0.3 mm to 2.0 mm, and even more preferably 0.5 mm to 1.0 mm.
The width dimension "W2" of each of the preformed multiple concave-convex portions of the plurality of preformed multiple concave-convex portions 452 is not particularly limited.
Here, the depth of the existing multiple uneven portion concave portion 452 means the same portion as the height of the existing multiple uneven portion convex portion 451, and the depth dimension "D1" of the existing multiple uneven portion concave portion 452 is the height dimension "D1" of the existing multiple uneven portion convex portion 451.
If the depth dimension "D1" of the preformed multiple uneven portion concave portion 452 (height dimension "D1" of the preformed multiple uneven portion convex portion 451) is less than 0.1 mm, when a pressing plate on which the preformed multiple uneven portions 45 are formed is used to press a workpiece, it tends not to be possible to obtain a workpiece processed into an uneven shape having the preformed multiple uneven portion concave portion 452 of the desired depth and the preformed multiple uneven portion convex portion 451 of the desired height.

Generally, as a flat pressure type pressing device, a plate mold substrate having a thickness of, for example, 7 mm is generally used in accordance with the operable stroke of the base of the rated flat plate type pressing device. Then, taking into consideration the thickness of the workpiece to be processed and the depth of the unevenness, a pressing plate having a depth dimension "D1" of the preformed multiple uneven portion concaves 452 is manufactured. From this viewpoint, the depth dimension "D1" of the preformed multiple uneven portion concaves 452 is preferably 0.1 mm to 3 mm.

The depth dimension "D12" of the inkjet resist film etching second recess formation portion 121 is not particularly limited, but is a depth dimension larger than the depth dimension "D1" of the recess of the existing multiple uneven portion, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 3 mm.
If the depth dimension "D12" of the inkjet resist film corrosion second recess forming portion 121 is a depth dimension smaller than the depth dimension "D1" of the existing multiple uneven portion concave portion 452, when a pressing plate on which the existing multiple uneven portions 45 are formed is used to press a workpiece, the area of the existing multiple uneven portions 45 of the pressing plate tends to be unable to press the surface of the workpiece to the desired depth, and it tends not to be possible to obtain a workpiece processed into an uneven shape having the existing multiple uneven portion concave portion 452 of the desired depth and the existing multiple uneven portion convex portion 451 of the desired height.

Generally, in the conventional technology, if the dimensions of each portion of the preformed multiple concave-convex portions 45 are not within the above range, there is a tendency that the workpiece cannot be machined into the desired shape. However, in the present invention, the present invention can be carried out even if the dimensions are not within the above range, but if the dimensions are not within the above range, there is a tendency that the workpiece having the desired shape is not obtained as compared to the case where the dimensions are within the above range.

FIG. 8 is a schematic diagram for explaining a graphic, letter, and picture pattern formed by projections and recesses on a press plate in a method for producing a press plate according to one embodiment of the present invention.
In the present invention, a pressing plate having a plurality of inkjet film etched preformed uneven portions 455 can also be implemented, for example, a pressing plate having a plurality of inkjet film etched preformed uneven portions 455 as shown in Fig. 8A can be implemented. In Fig. 8, the "ABCDE pattern", "heart pattern", and "star pattern" shown in black are pressing plates formed as inkjet film etched preformed uneven portions 455.

[Subordinate structure 6]
In the manufacturing method of a press plate of the present invention having the above-mentioned [Basic configuration 1], it is possible to preferably implement a manufacturing method of a press plate having the following "Sub-configuration 6".
4 and 6 are schematic diagrams for explaining the manufacturing steps of the method for manufacturing a pressing plate according to one embodiment of the present invention.
In FIG. 4, (A-b), (B-b), (C-b), and (D-b) are schematic plan views, and (A), (B), (C), and (D) are schematic cross-sectional views taken along line B-B of the schematic plan views.
In addition, in FIG. 4, the schematic plan view and the schematic cross-sectional view do not show the same uneven shapes. For example, the "heart pattern" in the schematic plan view is intended to explain a configuration formed by a plurality of minute unevennesses as shown in the schematic cross-sectional view, which together form a heart pattern, and the number of unevennesses in the schematic cross-sectional view is not shown to match the number of unevennesses that form the "heart pattern" in the schematic cross-sectional view. In reality, the number of concaves and convexities in the schematic cross-sectional view is significantly greater than the number shown.

4A and 4B, in the step (A) of the aforementioned subordinate configuration 2, the plate mold substrate 1 has a plate mold substrate first region surface 11 and a plate mold substrate second region surface 12, the plate mold substrate second region surface 12 has a non-relief portion without any unevenness, and the plate mold substrate first region surface 11 has a preformed uneven portion 4. The plate mold substrate second region surface 12 is located in the peripheral region of the plate mold substrate first region surface 11.
In FIG. 4, the first region surface 11 of the plate mold substrate has one preformed uneven portion 4 .
(b) The existing uneven portion 4 has existing multiple fine uneven portions 46, the existing multiple fine uneven portion 46 has existing multiple fine uneven portion convex portions 461 and existing multiple fine uneven portion concave portions 462, the existing multiple fine uneven portion convex portions 461 have existing multiple fine uneven portion convex portion top surfaces 461a and existing multiple fine uneven portion convex portion side surfaces 461b, and the existing multiple fine uneven portion concave portions 462 have existing multiple fine uneven portion concave portion bottom surfaces 462c and existing multiple fine uneven portion concave portion side surfaces 462b.
Here, the multiple convex portion side surfaces 461b of the preformed multiple fine concave-convex portions and the multiple concave-convex portion side surfaces 462b of the preformed multiple fine concave-convex portions correspond to the same side surface region.
As shown in Fig. 4A, the thickness dimension of the plate mold substrate 1 is "h", the depth dimension of each of the multiple pre-formed multiple fine unevenness concaves 462 is "d1", and the width dimension is "w2". Also, the height dimension of each of the multiple pre-formed multiple fine unevenness convex parts 461 is "d1", and the width dimension is "w1". Here, the depth of the pre-formed multiple fine unevenness concaves 462 indicates the same area as the height of the pre-formed multiple fine unevenness convex parts 461, and the depth dimension "d1" of the pre-formed multiple fine unevenness concaves 462 has the same dimension as the height dimension "d1" of the pre-formed multiple fine unevenness convex parts 461.

4B and 4B-b, the process (B) includes an inkjet resist film formation process for covering the upper surfaces 461a of the preformed fine concave-convex portions, the side surfaces 461b of the preformed fine concave-convex portions, and the bottom surfaces 462c of the preformed fine concave-convex portions by applying an inkjet resist material 2 by an inkjet method to form an inkjet resist fine convex portion upper surface attachment film, an inkjet resist fine convex portion side surface attachment film, and an inkjet fine concave portion bottom surface attachment film. Here, the inkjet resist material 2 is not attached to the second region surface 12 of the plate mold substrate located in the peripheral region of the preformed fine concave-convex portions 46.
The method further includes an inkjet resist hardened film formation step of hardening the film attached to the top surface of the inkjet resist fine convex portion, the film attached to the side surface of the inkjet resist fine convex portion, and the film attached to the side surface of the inkjet resist fine recess portion to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist fine convex portion top surface hardened film 3e, a desired region inkjet resist fine convex portion side surface hardened film 3f, and a desired region inkjet resist fine recess portion bottom surface hardened film 3g.
In this manner, a desired region inkjet resist hardened film 3 is formed, which has a desired region inkjet resist fine convex portion top surface hardened film 3e, a desired region inkjet resist fine convex portion side surface hardened film 3f, and a desired region inkjet resist fine recess portion bottom surface hardened film 3g.

Here, since the multiple pre-formed fine multiple concave-convex portion convex portion side surfaces 461b and the multiple pre-formed fine multiple concave-convex portion concave portion side surfaces 462b correspond to the same side surface region, the inkjet resist fine convex portion side adhesive film and the inkjet fine concave portion side adhesive film correspond to the same adhesive film, and the desired area inkjet resist fine convex portion side surface hardened film 3f means the same hardened film as the desired area inkjet resist fine concave portion side surface hardened film.

As shown in (C) and (C-b) of FIG. 4, the process (C) includes a plate mold substrate etching process in which an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired area inkjet resist fine convex portion top surface hardened film 3e, the desired area inkjet resist fine convex portion side surface hardened film 3f, and the desired area inkjet resist fine concave portion bottom surface hardened film 3g are formed, to etch the plate mold substrate second area surface 12 on which the desired area inkjet resist hardened film 3 is not attached.
As a result, the second area surface 12 of the plate mold substrate is corroded and etched until the depth dimension becomes "d12" without etching the pre-formed multiple fine concave-convex portions 46, thereby forming an inkjet resist film corroded second concave forming portion 121 having an etched concave shape, and the pre-formed multiple fine concave-convex portions 46 are formed into inkjet film corroded pre-formed multiple fine concave-convex portion protrusion portions 466 having a protruding shape protruding from the inkjet resist film corroded second concave forming portion 121.

As shown in (D) and (D-b) of FIG. 4, the process (D) includes a resist hardened film removal process for removing the hardened film 3e on the top surface of the inkjet resist fine convex portion in the desired region, the hardened film 3f on the side surface of the inkjet resist fine convex portion in the desired region, and the hardened film 3g on the bottom surface of the inkjet resist fine concave portion in the desired region.
As a result, the pre-formed multiple fine unevenness portions 46 are not etched, and the second inkjet resist film corrosion recessed portion 121 is formed by etching the second area surface 12 of the plate mold substrate, and the first area surface 11 of the plate mold substrate having the pre-formed multiple fine unevenness portions 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462 is formed in the form of an inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the second inkjet resist film corrosion recessed portion 121.
As shown in FIG. 4(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d12", and the depth dimensions of the multiple pre-formed multiple fine unevenness portion convex portions 461 and the multiple pre-formed multiple fine unevenness portion concave portions 462 each maintain the initial depth dimension "d1".
In this manner, a pressing plate is manufactured.

This configuration provides the aforementioned "(Manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist)" and, in particular, provides the effect of "(Manufacturing method effect A-b: effect of being able to form pre-formed multiple fine uneven portions of desired dimensions with protruding shapes using inkjet resist) an effect of being able to manufacture a pressing processing plate having a desired shape by chemical corrosive etching processing, in which a pre-formed multiple fine uneven portion having a recess and a protrusion protruding from the recess, and a plurality of pre-formed multiple fine uneven portion recesses and a plurality of pre-formed multiple fine uneven portion protrusions on the surface of the protrusion, is formed, and corrosive etching of the "areas of the plate mold substrate that must not be etched" is suppressed."
In other words, the inkjet resist film is etched to form a second recessed portion 121, and the effect of "making it possible to manufacture a pressing plate having a desired shape by suppressing the etching of the convex portion side 461b of the multiple pre-formed multiple fine concave-convex portions (the same side as the concave portion side 462b of the multiple pre-formed multiple fine concave-convex portions) which is an area of the plate mold substrate that must not be etched" is obtained.
In particular, "side etching" in which the "sides of the convex portion 461b of each of the existing multiple fine concave-convex portions and the side surfaces of the concave portion 462b of each of the existing multiple fine concave-convex portions" which are areas that should not be etched are corroded and etched is suppressed.

In the above-mentioned “sub-structure 6”, a structure in which the first area surface 11 of the plate mold substrate has a plurality of preformed uneven portions 4 can also be implemented.
In FIG. 6, (A-b), (B-b), (C-b), and (D-b) are schematic plan views, and (A), (B), (C), and (D) are schematic cross-sectional views taken along line B-B of the schematic plan views.
In the (A) step of the aforementioned "subordinate structure 2", the mold substrate 1 has a first region surface 11 of the mold substrate and a second region surface 12 of the mold substrate, the second region surface 12 of the mold substrate has a non-irregular portion having no irregularities, and the first region surface 11 of the mold substrate has a plurality of preformed irregular portions 4.
In FIG. 6, the first region surface 11 of the plate mold substrate has a plurality of preformed irregularities 4 .
(b) Each of the multiple preformed uneven portions 4 has a preformed multiple fine uneven portions 46, the preformed multiple fine uneven portions 46 have a plurality of preformed multiple fine uneven portion convex portions 461 and a plurality of preformed multiple fine uneven portion concave portions 462, the plurality of preformed multiple fine uneven portion convex portions 461 have a plurality of preformed multiple fine uneven portion convex portion top surfaces and a plurality of preformed multiple fine uneven portion convex portion side surfaces, and the plurality of preformed multiple fine uneven portion concave portions 462 have a plurality of preformed multiple fine uneven portion concave portion bottom surfaces and a plurality of preformed multiple fine uneven portion concave portion side surfaces.
Here, the plurality of convex portion side surfaces of the preformed plurality of fine concave-convex portions and the plurality of concave portion side surfaces of the preformed plurality of fine concave-convex portions correspond to the same side surface region.

6(B) and (B-b), the process (B) includes an inkjet resist film formation process for covering the upper surfaces of the convex portions of the multiple pre-formed multiple fine concave-convex portions, the side surfaces of the multiple pre-formed multiple fine concave-convex portions (side surfaces of the multiple pre-formed multiple fine concave-convex portions), and the bottom surfaces of the multiple pre-formed multiple fine concave-convex portions by applying an inkjet resist material 2 by an inkjet method to form an inkjet resist fine convex portion upper surface attachment film, an inkjet resist fine convex portion side surface attachment film, and an inkjet fine concave portion bottom surface attachment film. Here, the inkjet resist material 2 is not attached to the second region surface 12 of the plate mold substrate located in the peripheral region of the pre-formed multiple fine concave-convex portions 46.
The method further includes a desired region inkjet resist hardened film formation step of hardening the film adhered to the top surface of the inkjet resist fine convex portion, the film adhered to the side surface of the inkjet resist fine convex portion, and the film adhered to the bottom surface of the inkjet resist fine concave portion to form a desired region inkjet resist fine convex portion top surface hardened film 3e, a desired region inkjet resist fine convex portion side surface hardened film 3f, and a desired region inkjet resist fine concave portion bottom surface hardened film 3g.

As shown in (C) and (C-b) of FIG. 6, the process (C) includes a plate mold substrate etching process in which an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine concave portion bottom surface hardened film 3g are formed, to etch the plate mold substrate second region surface 12 on which the desired region inkjet resist hardened film is not attached.
As a result, the second area surface 12 of the plate mold substrate is corroded and etched until the depth dimension becomes "d12" without etching the multiple pre-formed multiple fine concave-convex portions 46, thereby forming an inkjet resist film corroded second concave forming portion 121 having an etched concave shape, and the multiple pre-formed multiple fine concave-convex portions 46 are formed into the form of an inkjet film corroded pre-formed multiple fine concave-convex portion protrusion portion 466 having a protruding shape protruding from the inkjet resist film corroded second concave forming portion 121.

As shown in (D) and (D-b) of FIG. 6, the process (D) includes a resist hardened film removal process for removing the hardened film 3e on the top surface of the inkjet resist fine convex portion in the desired region, the hardened film 3f on the side surface of the inkjet resist fine convex portion in the desired region, and the hardened film 3g on the bottom surface of the inkjet resist fine concave portion in the desired region.
As a result, the second region surface 12 of the plate mold substrate is etched without etching the multiple pre-formed multiple fine unevenness portions 46, thereby forming an inkjet resist film corrosion second recess formation portion 121, and the first region surface 11 of the plate mold substrate having pre-formed multiple fine unevenness portions 46 each having a multiple pre-formed multiple fine unevenness portion convex portions 461 and a multiple pre-formed multiple fine unevenness portion concave portions 462 is formed in the form of an inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
As shown in FIG. 6(D), the depth dimension of the inkjet resist film corrosion second recess formation portion 121 is "d13", and the depth dimensions of the multiple pre-formed multiple fine unevenness portion convex portions 461 and the multiple pre-formed multiple fine unevenness portion concave portions 462 each maintain the initial depth dimension "d1".
In this manner, a pressing plate is manufactured.

This configuration makes it possible to obtain the aforementioned "(Manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist)" and, in particular, to obtain the aforementioned "(Manufacturing method effect A-b: effect of being able to form multiple prefabricated fine uneven portions of desired dimensions having protruding shapes using inkjet resist)"

[Subordinate structure 9]
In the method for manufacturing a press plate of the present invention described above in [subordinate configuration 6], it is possible to preferably implement a method for manufacturing a press plate having the following "subordinate configuration 10".
Fig. 5 is a schematic diagram for explaining a plurality of preformed fine concave-convex portions formed on a pressing plate in a method for manufacturing a pressing plate according to an embodiment of the present invention, in which (A-b) of Fig. 5 is a schematic plan view, (A-a) is a schematic cross-sectional view taken along line B-B of the schematic plan view, and (B) of Fig. 5 is a schematic enlarged view of the area surrounded by a circle in (A-b) of Fig. 5. (A-a) of Fig. 5 corresponds to (D) of Fig. 4, and (A-b) of Fig. 5 corresponds to (D-b) of Fig. 4.
4 and 5, a plurality of previously formed fine unevenness protrusions 466 are formed by etching the inkjet film in a form protruding from the inkjet resist film corrosion second concave forming portion 121 having an etched concave shape. A plurality of previously formed fine unevenness protrusions 461 and a plurality of previously formed fine unevenness concaves 462 are formed on the surface of the previously formed fine unevenness protrusions 466 by etching the inkjet film.
However, in Figures 4 and 5, the shapes of the multiple pre-formed multiple fine unevenness convex portions 461 and the multiple pre-formed multiple fine unevenness concave portions 462 of the inkjet film corrosion pre-formed multiple fine unevenness protrusion portions 466 do not indicate the exact shapes and dimensions, but rather indicate a schematic outline shape for explaining the shape configuration.

The height dimension "d1" of each of the preformed multiple fine unevenness convex portions 461 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm.
The width dimension "w1" of each of the multiple preformed multiple fine unevenness convex portions 461 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm.

The depth dimension "d1" of each of the multiple preformed multiple fine unevenness recesses 462 is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.05 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.08 mm to 0.3 mm.
In addition, the depth of the concave portion of the existing multiple fine unevenness portion means the same area as the height of the convex portion of the existing multiple fine unevenness portion, and the height dimension "d1" of the convex portion of the existing multiple fine unevenness portion is the same dimension as the depth dimension "d1" of the concave portion of the existing multiple fine unevenness portion.
The width dimension "w2" of each of the preformed multiple fine unevenness recesses 462 is not particularly limited, but is preferably 0.0005 mm to 1 mm, more preferably 0.05 mm to 0.5 mm, and even more preferably 0.05 mm to 0.1 mm.
If the depth dimension "d1" of the concave portions of the preformed multiple fine unevenness portions (height dimension "d1" of the convex portions of the preformed multiple fine unevenness portions) is less than 0.05 mm, when a workpiece is pressed using a pressing plate on which the preformed multiple fine unevenness portions are formed, it tends not to be possible to obtain a workpiece that has an uneven shape having preformed multiple fine unevenness portion concave portions of the desired depth and preformed multiple fine unevenness portion convex portions of the desired height.
As the depth dimension "d1" of the concave portions of the preformed multiple fine unevenness portions (height dimension "d1" of the convex portions of the preformed multiple fine unevenness portions) becomes larger, when a pressing plate on which multiple preformed multiple fine unevenness portions are formed is used to press a workpiece, it becomes possible to obtain a workpiece having the desired excellent dimensional accuracy of the fine uneven shape.As "d1" exceeds 1 mm, for example, when foil stamping is performed using a sheet-like foil material, there is a tendency for inconveniences such as the sheet-like foil material tearing during pressing to occur more frequently.

A plurality of these pre-formed multiple fine concave-convex portion convex portions 461 and pre-formed multiple fine concave-convex portion concave portions 462 are gathered together to form the inkjet film corrosion pre-formed multiple fine concave-convex portion protrusion portion 466. The number of the pre-formed multiple fine concave-convex portion convex portions 461 and the pre-formed multiple fine concave-convex portion concave portions 462 is not particularly limited, but is, for example, 10 to 10,000.

The depth dimension "d12" of the inkjet resist film etching second recess formation portion 121 is not particularly limited, but is a depth dimension larger than the depth dimension "d1" of the recess of the existing multiple fine unevenness portion, and is preferably 1.0 mm or more, more preferably 1.5 mm to 5 mm, and even more preferably 1.8 mm to 2 mm.
If the depth dimension "d12" of the inkjet resist film corrosion second recess forming portion 121 is a depth dimension smaller than the depth dimension "d1" of the existing multiple fine unevenness portion concave portion 462, when a pressing plate on which the existing multiple fine unevenness portions 46 are formed is used to press a workpiece, the area of the existing multiple fine unevenness portions 46 of the pressing plate tends to be unable to press the surface of the workpiece to the desired depth, and it tends not to be possible to obtain a workpiece processed into an uneven shape having the existing multiple fine unevenness portion concave portion 462 of the desired depth and the existing multiple fine unevenness portion convex portions 461 of the desired height.

FIG. 8 is a schematic diagram for explaining a graphic, letter, and picture pattern formed by projections and recesses on a press plate in a method for manufacturing a press plate according to one embodiment of the present invention.
For example, a pressing plate having a plurality of inkjet film etching preformed multiple fine concave-convex protrusions 466 as shown in Fig. 8B and 8D can be produced. In Fig. 8B and 8D, inkjet film etching preformed multiple fine concave-convex protrusions 466 of "ABCDE pattern", "heart pattern", and "star pattern" are formed, and the surface of each pattern is formed with a plurality of preformed multiple fine concave-convex protrusions and a plurality of preformed multiple fine concave-convex recesses.

[Subordinate structure 7]
In the method for manufacturing a press plate according to the above-mentioned [subordinate configuration 6], it is preferable to implement a method for manufacturing a press plate having the following configuration.
In the process (A), the pre-formed multiple fine unevenness 46 having a plurality of pre-formed multiple fine unevenness convex portions 461 and a plurality of pre-formed multiple fine unevenness concave portions 462 forms a fine graphic character pattern formed with at least one multiple fine uneven shape selected from the group consisting of (F) a fine dot pattern, a fine pattern pattern, a fine picture pattern, and/or a fine lattice pattern, (G) a fine line pattern, (H) a fine stripe pattern, and (I) a latent image pattern that displays different graphic character patterns when viewed from different directions.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect of being able to form a concave-convex surface shape of desired dimensions using inkjet resist)" and (Manufacturing method effect A-b: Effect of being able to form a plurality of pre-fabricated fine concave-convex portions of desired dimensions having protruding shapes using inkjet resist), and in particular, "(Manufacturing method effect A-bb: Effect of being able to manufacture a pressing plate having a surface formed with fine concave-convex portions having a desired fine graphic, letter, and picture pattern shape) having a desired size and shape, (F) a fine dot pattern, a fine pattern pattern, a fine picture pattern, and/or a fine lattice pattern, (G) "It is possible to manufacture a pressing plate having a surface on which a fine graphic character pattern is formed, such as a fine line pattern, a fine stripe pattern, or a latent image pattern which shows different graphic character patterns when viewed from different directions, and corrosive etching of areas which should not be etched is suppressed, thereby making it possible to manufacture a pressing plate having the desired shape and size dimensions, such as the height, depth, width, etc. of each of the pre-formed multiple fine unevenness portions 46) having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462."
In particular, the "side etching phenomenon" in which the "sides of the convex portion 461b of each of the existing multiple concave-convex portions and the side surfaces of the concave portion 462b of each of the existing multiple concave-convex portions" which are regions that should not be etched are corroded and etched is suppressed.

The "fine line pattern" includes a fine line pattern formed by straight lines, dashed lines, dotted lines, dashed lines, etc. The "fine stripe pattern" includes a fine stripe pattern formed by a curve of a desired shape, and a fine stripe pattern formed by a wavy curve of a desired shape.
"(R) A latent image pattern which displays different pictorial character patterns when viewed from different directions" means, in other words, a pictorial character pattern which is recognized as being different from each other when viewed from different directions.

[Subordinate structure 8]
In the method for manufacturing a press plate according to the above-mentioned [subordinate configuration 6] or [subordinate configuration 7], it is possible to implement a method for manufacturing a press plate having the following configuration.
FIG. 9 is a schematic outline diagram for explaining the shape of a graphic, letter, and design pattern formed by projections and recesses on a press processing plate in a method for manufacturing a press processing plate according to one embodiment of the present invention, and is a schematic plan view.
(A-a) and (A-b) in Fig. 9 are plan views for explaining the shape of a plurality of pattern cells that are divided into a predetermined shape and arranged with regularity, and (A-a) shows a plurality of pattern cells divided into an approximately square shape. (B-a), (B-b), (B-c), (B-d), (B-e), and (B-f) in Fig. 9 are schematic enlarged views showing an example of the shape of a concave-convex pattern formed by the concave-convex shape formed in the plurality of pattern cells shown in (A-a) and (A-b) in Fig. 9, where (B-a) shows fine left diagonal lines, (B-b) shows fine right diagonal lines, (B-c) shows a fine horizontal line pattern, (B-d) shows a fine vertical parallel line pattern, (B-e) shows a fine stripe pattern, and (B-f) shows a fine dot pattern. (C) in Fig. 9 shows the form of an example of a concave-convex pattern formed in each pattern cell of the plurality of pattern cells in a concave-convex shape. FIGS. 9(Da), (Db), and (Dc) show a plurality of types of concave-convex pattern cells formed in FIG. 9(C).

As shown in (A-a) and (A-b) of Figure 9, in the (A) step of the above-mentioned [subordinate structure 6] or [subordinate structure 7], the pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462 is formed by a combination of multiple types of unevenness pattern cells that are engraved with fine unevenness shapes, divided into predetermined shapes, and arranged with regularity.
As shown in (Ba) to (B-f) of Figure 9, each of the multiple types of concave-convex pattern cells forms a fine graphic, letter, and picture pattern formed of at least two or more types of fine concave-convex shapes selected from the group consisting of a fine dot pattern, a fine design pattern, a fine picture pattern, a fine line pattern, and a fine stripe pattern.
The fine line pattern includes a fine line pattern formed by straight lines, dashed lines, dotted lines, dashed lines, etc. The fine stripe pattern includes a fine stripe pattern formed by a curve of a desired shape, and a fine stripe pattern formed by a wavy curve of a desired shape.
As shown in Figure 9 (C) and Figures 9 (D-a) to (D-c), a plurality of fine graphic character picture patterns of one type among two or more types of fine graphic character picture patterns are gathered together to form a first image, and a plurality of fine graphic character picture patterns of a second type different from the one type among the two or more types of fine graphic character picture patterns are gathered together to form another image.
In this manner, a pressing plate is manufactured.

Preferably, in the above configuration, a configuration in which a first image is recognized when viewed from one direction and another image is recognized when viewed from another direction different from the one direction is preferably feasible.
In other words, a configuration in which a plurality of fine graphic character patterns of one type among two or more types of fine graphic character patterns are gathered together to form one image, and a plurality of fine graphic character patterns of the other type are gathered together to form another image, and when viewed from different directions, different images appear and are recognized.

For example, in Figure 9 showing an embodiment, the fine left diagonal line patterns in Figure 9 (C) come together to form the "H" letter image 46a in Figure 9 (D-a), the fine right diagonal line patterns in Figure 9 (C) come together to form the "T" letter image 46b in Figure 9 (D-b), and the fine horizontal line patterns in Figure 9 (C) come together to form the "Z" letter image 46c in Figure 9 (D-c), and these letters are formed so that different image characters are recognized when viewed from different directions.
In this manner, a pressing plate is manufactured.

FIG. 9 shows a schematic form of the surface of a pressing plate. When a workpiece is pressed using this pressing plate, the workpiece is processed into a form having a concave-convex shape that matches the concave-convex shape formed on the pressing plate used, and is formed so that different image characters can be recognized when viewed from different directions.

In FIG. 9, the "multiple types of concave-convex pattern cells divided into predetermined shapes and arranged with regularity" have boundaries between each of the pattern cells divided into the predetermined shapes, but this configuration is not limited to this, and it is also possible to implement a configuration in which no boundaries are formed between each of the pattern cells and each pattern cell has a fine graphic, letter, and picture pattern formed by a concave-convex shape.

This configuration provides the aforementioned "(Manufacturing method effect A: Effect of being able to form an uneven surface shape of desired dimensions using inkjet resist)" and, in particular, the effect of "(Manufacturing method effect A-b: Effect of being able to form pre-formed multiple fine unevenness of desired dimensions having a protruding shape using inkjet resist) an effect of making it possible to manufacture a pressing plate having a desired shape by chemical corrosive etching, in which a pre-formed multiple fine unevenness is formed having a recess, a protrusion protruding from the recess, and a plurality of pre-formed multiple fine unevenness recesses and a plurality of pre-formed multiple fine unevenness protrusions on the surface of the protrusion, and in which corrosive etching of "areas of the plate mold substrate that should not be etched" is suppressed, and when this pressing plate is used to press a workpiece, the workpiece is processed and formed into a shape having an uneven shape that matches the uneven shape formed on the pressing plate used, and a pressing plate formed so that different image characters are recognizable when viewed from different directions" is obtained.
In other words, the inkjet resist film is etched to form a second recessed portion 121, and the effect of "making it possible to manufacture a pressing plate having a desired shape by suppressing the etching of the convex portion side 461b of the multiple pre-formed multiple fine concave-convex portions (the same side as the concave portion side 462b of the multiple pre-formed multiple fine concave-convex portions) which is an area of the plate mold substrate that must not be etched" is obtained.
In particular, the "side etching phenomenon" in which the "sides of the convex portion 461b of each of the existing multiple fine concave-convex portions and the side surfaces of the concave portion 462b of each of the existing multiple fine concave-convex portions," which are areas that should not be etched, are corroded and etched is suppressed.

[Subordinate structure 10]
In the method for manufacturing a press plate according to the above-mentioned [subordinate configuration 1], it is preferable to implement a method for manufacturing a press plate having the following configuration.
FIG. 7 is a schematic diagram for explaining the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention.

7(A), in the step (A) of the above-mentioned [Subordinate Structure 1], the second region surface 12 of the plate mold substrate has a plurality of non-relief portions without any unevenness, and the first region surface 11 of the plate mold substrate has a plurality of pre-formed uneven portions 4. The second region surface 12 of the plate mold substrate is located in the peripheral region of the first region surface 11 of the plate mold substrate.
One of the multiple preformed uneven portions 4 has a preformed multiple uneven portion 45 having (i) a plurality of preformed multiple uneven portion convex portions 451 formed with a plurality of convex shapes and a plurality of preformed multiple uneven portion concave portions 452 formed with a plurality of concave shapes.
Another of the multiple preformed uneven portions 4 has (b) a preformed multiple fine uneven portion 46 having a plurality of preformed multiple fine uneven portion convex portions 461 formed with a plurality of fine convex shapes, and a plurality of preformed multiple fine uneven portion concave portions 462 formed with a plurality of fine concave shapes.
The multiple preformed multiple uneven portion convex portions 451 have multiple preformed multiple uneven portion convex portion upper surfaces 451a and multiple preformed multiple uneven portion convex portion side surfaces 451b, and the multiple preformed multiple uneven portion concave portions 452 have multiple preformed multiple uneven portion concave portion bottom surfaces 452c and multiple preformed multiple uneven portion concave portion side surfaces 452b.
Here, the multiple convex portion side surfaces 451b of the existing multiple concave-convex portions and the multiple concave-convex portion side surfaces 452b of the existing multiple concave-convex portions correspond to the same side surface region.
The multiple preformed multiple fine unevenness portion convex portions 461 have multiple preformed multiple fine unevenness portion convex portion top surfaces 461a and multiple preformed multiple fine unevenness portion convex portion side surfaces 461b, and the multiple preformed multiple fine unevenness portion concave portions 462 have multiple preformed multiple fine unevenness portion concave portion bottom surfaces 462c and multiple preformed multiple fine unevenness portion concave portion side surfaces 462b.
Here, the multiple convex portion side surfaces 461b of the already formed multiple fine concave-convex portions and the multiple concave-convex portion side surfaces 456b of the already formed multiple fine concave-convex portions correspond to the same side surface region.

In the step (B) of the above-mentioned [Subordinate Configuration 1], the inkjet resist material 2 is applied by an inkjet method to cover the plurality of pre-formed multiple concave-convex portion convex upper surfaces 451a, the plurality of pre-formed multiple concave-convex portion convex side surfaces 451b, the plurality of pre-formed multiple concave-convex portion concave bottom surfaces 452c, and the plurality of pre-formed multiple fine concave-convex portion convex upper surfaces 461a, the plurality of pre-formed multiple fine concave-convex portion convex side surfaces 461b, and the plurality of pre-formed multiple fine concave-convex portion concave bottom surfaces 462c, thereby forming an inkjet resist convex upper surface attachment film, an inkjet resist convex side surface attachment film, an inkjet concave bottom surface attachment film, and an inkjet resist fine convex upper surface attachment film, an inkjet resist fine convex side surface attachment film, and an inkjet fine concave bottom surface attachment film. Here, the inkjet resist material 2 is not attached to the second region surface 12 of the plate mold substrate located in the peripheral region of the pre-formed multiple concave-convex portions 45.
The process (B) further includes a desired region inkjet resist hardened film formation step of hardening the inkjet resist convex portion top surface adhered film, the inkjet resist convex portion side surface adhered film, and the inkjet resist concave portion bottom surface adhered film, and the inkjet resist fine convex portion top surface adhered film, the inkjet resist fine convex portion side surface adhered film, and the inkjet resist fine convex portion bottom surface adhered film, to form the desired region inkjet resist hardened film 3 having the desired region inkjet resist convex portion top surface hardened film 3a, the desired region inkjet resist convex portion side surface hardened film 3b, the desired region inkjet resist concave portion bottom surface hardened film 3c, the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine convex portion bottom surface hardened film 3g.

The process (C) of the aforementioned [Subordinate Configuration 1] includes a plate mold substrate etching process of contacting an etching solution with a surface of the plate mold substrate 1 on which the desired region inkjet resist convex portion top surface hardened film 3a, the desired region inkjet resist convex portion side surface hardened film 3b, and the desired region inkjet resist concave portion bottom surface hardened film c), and the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine concave portion bottom surface hardened film 3g are formed, to etch the plate mold substrate second region surface 12 to which the desired region inkjet resist hardened film is not attached.
As a result, the second area surface 12 of the mold substrate is etched without etching the pre-formed multiple uneven portions 45 and the pre-formed multiple fine uneven portions 46, thereby forming an inkjet resist film corrosion second recess formation portion 121 having an etched recess shape, and the pre-formed multiple uneven portions 45 are formed into an inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 having a protruding shape protruding from the inkjet resist film corrosion second recess formation portion 121, and the pre-formed multiple fine uneven portions 46 are formed into the form of an inkjet film corrosion pre-formed multiple fine uneven portion protrusion portion 466 having a protruding shape protruding from the inkjet resist film corrosion second recess formation portion 121.

The process (D) of the aforementioned [Subordinate Configuration 1] includes a resist hardened film removal process for removing the desired region inkjet resist hardened film 3, whereby the second region surface 12 of the plate mold substrate is etched without etching the existing uneven portion 4 to form the inkjet resist film etched second recessed formation portion 121, and the existing uneven portion is formed into an inkjet film etched existing uneven portion protrusion portion having a protruding shape protruding from the inkjet resist film etched second recessed formation portion 121.
That is, the method includes a resist hardened film removal step of removing the desired region inkjet resist convex portion top surface hardened film 3a, the desired region inkjet resist convex portion side surface hardened film 3b, the desired region inkjet resist bottom surface hardened film 3c, as well as the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g.
As a result, the inkjet resist film corrosion second recess formation portion 121 is formed by etching the second region surface 12 of the plate mold substrate without etching the pre-formed multiple uneven portions 45 and the pre-formed multiple fine uneven portions 46, and the pre-formed multiple uneven portions 45 having a pre-formed multiple uneven portion convex portions 451 and a pre-formed multiple uneven portion concave portions 452, and the pre-formed multiple fine uneven portions 46 having a pre-formed multiple fine uneven portion convex portions 461 and a pre-formed multiple fine uneven portion concave portions 462 are formed in the form of an inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 and an inkjet film corrosion pre-formed multiple fine uneven portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
In this manner, a pressing plate is manufactured.

With this configuration, the above-mentioned (Manufacturing method effect A-a: effect of being able to form pre-formed uneven portions of desired dimensions having protruding shapes using inkjet resist) can be obtained, as well as (Manufacturing method effect A-b: effect of being able to form pre-formed multiple fine uneven portions of desired dimensions having protruding shapes using inkjet resist)).
In other words, the inkjet resist film is etched to form a second recessed portion 121, and the effect of "making it possible to manufacture a pressing plate having a desired shape by suppressing the etching of the 'side surfaces of the convex portions of the multiple pre-formed multiple concave-convex portions (the same sides as the concave side surfaces of the multiple pre-formed multiple concave-convex portions)' and the 'side surfaces of the convex portions of the multiple pre-formed multiple fine concave-convex portions (the same sides as the concave side surfaces of the multiple pre-formed multiple fine concave-convex portions)' which are areas of the plate mold substrate that must not be etched" is obtained.

FIG. 8 is a schematic diagram for explaining a graphic, letter, and picture pattern formed by projections and recesses on a press plate in a method for producing a press plate according to one embodiment of the present invention.
As an embodiment of a pressing plate manufactured by this manufacturing method, a pressing plate having both inkjet film etched pre-formed multiple concave-convex protrusions 455 and inkjet film etched pre-formed multiple fine concave-convex protrusions 466 can be realized, as shown in Figures 8(C), (E), and (F).

[Subordinate structure 11]
In the method for manufacturing a press plate of the above [Basic Configuration 1], it is possible to preferably implement a method for manufacturing a press plate having the following configuration.
FIG. 10 is a schematic diagram for explaining the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention.
(A), (B), (C), and (D) of Fig. 10 are schematic cross-sectional views for explaining a method for manufacturing a pressing plate. (A-a), (B-a), (C-a), and (D-a) of Fig. 10 are schematic plan views corresponding to (A), (B), (C), and (D), which are a method for manufacturing a pressing plate having a desired graphic, letter, and design pattern formed by concaves and convexes, and (A-b), (B-b), (C-b), and (D-b) of Fig. 10 are schematic plan views corresponding to (A), (B), (C), and (D), which are a method for manufacturing a pressing plate having a desired fine graphic, letter, and design pattern formed by concaves and convexes.

10(A), the plate mold substrate first region surface 11 has a pre-formed convex portion 47, and the plate mold substrate second region surface 12 has a pre-formed concave portion 48. The plate mold substrate first region surface 11 is located in the peripheral region of the plate mold substrate second region surface 12. The pre-formed convex portion 47 has a pre-formed convex portion top surface 47a and a pre-formed convex portion side surface 47b, and the pre-formed concave portion 48 has a pre-formed concave portion bottom surface 48c and a pre-formed concave portion side surface 48b. Here, the pre-formed convex portion side surface 47b and the pre-formed concave portion side surface 48b correspond to the same side surface.

As shown in FIG. 10(B), in the step (B) of the aforementioned [Basic configuration 1], a desired area inkjet resist deposition film formation step is provided in which an inkjet resist material 2 is applied to an existing convex upper surface 47a by an inkjet method while covering the existing convex side surface 47b, the existing concave side surface 48b, and the existing concave bottom surface 48c, to form a desired area inkjet resist deposition film having (a) a desired graphic/character pattern, or (b) a desired fine graphic/character pattern, and a desired area inkjet resist hardened film formation step is provided in which the desired area inkjet resist deposition film is hardened to form a desired area inkjet resist hardened film 3.
For example, as shown in Figures 10 (B), (Ba), and (B-b), an "ABCDE pattern" or a "heart pattern formed with a fine graphic character picture pattern" is formed on the upper surface 47a of the existing convex portion by a desired area inkjet resist hardened film, and a desired area inkjet resist attached film is not formed in the area other than the "ABCDE pattern" or the "heart pattern formed with a fine graphic character picture pattern."

As shown in FIG. 10(C), the step (C) of the above-mentioned [Basic Configuration 1] includes a step of etching a plate mold substrate, in which an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, to etch away the region on the existing convex portion upper surface 47a where the desired region inkjet resist hardened film is not attached.
This allows etching of the desired area on the existing convex portion top surface 47a where the inkjet resist hardened film is not attached, without etching the existing convex portion side surface 47b, the existing concave portion side surface 48b, and the existing concave portion bottom surface 48c, thereby forming the existing convex portion top surface uneven portion 477 having multiple concave portions and multiple convex portions.
Here, in the case where the desired region inkjet resist cured film 3 has (a) a desired graphic, letter, or picture pattern, as shown in FIG. 10 (C-a), the existing convex portion upper surface uneven portion 477 is (a) an existing convex portion upper surface multiple uneven portion 477a including an existing convex portion upper surface multiple uneven portion concave portion 472a formed with a plurality of concave shapes corresponding to the desired graphic, letter, or picture pattern, and an existing convex portion upper surface multiple uneven portion convex portion 471a formed with a plurality of convex shapes.
Alternatively, in the case where the desired region inkjet resist cured film 3 has (b) a desired fine graphic, letter, and picture pattern, as shown in FIG. 10 (C-b), the existing convex portion upper surface uneven portion 477 is an existing convex portion upper surface multiple fine uneven portion 477b including (b) a existing convex portion upper surface multiple fine uneven portion concave portion 472b formed with a plurality of fine concave shapes corresponding to the desired fine graphic, letter, and picture pattern, and an existing convex portion upper surface multiple fine uneven portion convex portion 471b formed with a plurality of fine convex shapes.

As shown in FIG. 10(D), the step (D) of the above-mentioned [Basic Configuration 1] includes a desired area inkjet resist hardened film removal step of removing the desired area inkjet resist hardened film 3.
As a result, when the desired region inkjet resist cured film 3 has (i) a desired graphic, letter, or picture pattern, multiple existing convex upper surface uneven portions 477a are formed on the existing convex upper surface 47a as the existing convex upper surface uneven portion 477, as shown in Figure 10 (D-a).
Alternatively, when the desired region inkjet resist cured film 3 has (b) a desired fine graphic, letter, and pattern pattern, as shown in Figure 10 (D-b), a plurality of fine uneven portions 477b on the upper surface of the existing convex portion are formed on the upper surface 47a of the existing convex portion as the upper surface uneven portion 477 of the existing convex portion.
In this way, a pressing plate is manufactured which has a preformed recess 48 and a preformed protrusion 47, and on the upper surface of the preformed protrusion 47, multiple preformed protrusion upper surface uneven portions 477a as the preformed protrusion upper surface uneven portion 477, or multiple preformed protrusion upper surface fine uneven portions 477b as the preformed protrusion upper surface uneven portion 477.

In this configuration, the height dimension of each of the pre-formed convex portion upper surface multiple uneven portion convex portions 471a of the pre-formed convex portion upper surface multiple uneven portion convex portions (the same as the depth dimension of each of the pre-formed convex portion upper surface multiple uneven portion concave portions 472a of the pre-formed convex portion upper surface multiple uneven portion concave portions) is not particularly limited, but a depth dimension that is, for example, 0.1 mm or more and smaller (shorter, shallower) than the depth dimension of the pre-formed concave portion 48 is preferably implemented.
In addition, the height dimension of each of the multiple fine unevenness portions on the upper surface of the pre-formed convex portion, which are formed with multiple fine unevenness shapes, (same as the depth dimension of the multiple fine unevenness portions on the upper surface of the pre-formed convex portion, concave portion 472b) is not particularly limited, but a depth dimension that is, for example, 0.05 mm or more and smaller (shorter, shallower) than the depth dimension of the pre-formed concave portion 48 is preferably implemented.
In addition, the width dimension of each of the multiple fine unevenness portions on the upper surface of the existing convex portion, which are formed with a plurality of fine unevenness shapes, the convex portion 471b of the multiple fine unevenness portions on the upper surface of the existing convex portion, and the concave portion 472b of the multiple fine unevenness portions on the upper surface of the existing convex portion are not particularly limited, but a width dimension of, for example, 0.0005 mm to 1 mm is preferably usable.

This method of manufacturing a plate for pressing can achieve the effect of (manufacturing method effect A: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist) making it possible to manufacture a plate for pressing having the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., by using a process including chemical corrosive etching which has a simpler process than the conventional general-purpose chemical corrosive etching process, and which has the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched").
In other words, it is possible to form a pre-formed convex upper surface unevenness portion 477, such as a desired unevenness portion, a desired fine unevenness portion, etc., on the pre-formed convex upper surface 47a without etching the areas that must not be etched (the pre-formed convex side surface 47b, the pre-formed recess side surface 48b, and the pre-formed recess bottom surface 48c).

[Subordinate structure 12]
In the method for manufacturing a press plate of the above [Basic Configuration 1], it is possible to preferably implement a method for manufacturing a press plate having the following configuration.
FIG. 11 is a schematic diagram for explaining the manufacturing steps of a method for manufacturing a pressing plate according to another embodiment of the present invention.
(A), (B), (C), and (D) of Fig. 11 are schematic cross-sectional views for explaining a method for manufacturing a pressing plate. (A-a), (B-a), (C-a), and (D-a) of Fig. 11 are schematic plan views corresponding to (A), (B), (C), and (D), which are a method for manufacturing a pressing plate having a desired graphic, letter, and design pattern formed by concaves and convexes, and (A-b), (B-b), (C-b), and (D-b) of Fig. 11 are schematic plan views corresponding to (A), (B), (C), and (D), which are a method for manufacturing a pressing plate having a desired fine graphic, letter, and design pattern formed by concaves and convexes.

11A, the plate mold substrate first region surface 11 has a pre-formed convex portion 47, and the plate mold substrate second region surface 12 has a pre-formed concave portion 48. The plate mold substrate first region surface 11 is located in the peripheral region of the plate mold substrate second region surface 12.
The existing convex portion 47 has an existing convex portion upper surface 47a and an existing convex portion side surface 47b, and the existing concave portion 48 has an existing concave portion bottom surface 48c and an existing concave portion side surface 48b.
Here, the existing convex side surface 47b and the existing concave side surface 48b correspond to the same side surface.

As shown in FIG. 11(B), in the step (B) of the aforementioned [Basic configuration 1], a desired area inkjet resist deposition film formation step is provided in which an inkjet resist material 2 is applied by an inkjet method to cover existing convex side surface 47 b, existing concave side surface 48 b, and existing convex upper surface 47 a, and to an existing concave bottom surface 48 c, to form a desired area inkjet resist deposition film having (a) a desired graphic/character pattern, or (b) a desired fine graphic/character pattern, and a desired area inkjet resist hardened film formation step is provided in which the desired area inkjet resist deposition film is hardened to form a desired area inkjet resist hardened film 3.
For example, as shown in Figures 11 (B), (Ba), and (B-b), a desired area inkjet resist deposition film is not formed in the area of the "ABCDE pattern" or "heart pattern formed with fine graphic character picture pattern" on the bottom surface 48c of the existing recess, and a desired area inkjet resist hardened film is formed in the area excluding the "ABCDE pattern" or "heart pattern formed with fine graphic character picture pattern."

As shown in FIG. 11(C), in step (C) of the above-mentioned [Basic Configuration 1], a plate mold substrate etching step is provided in which an etching liquid is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, to etch the region on the existing recess bottom surface 48c where the desired region inkjet resist hardened film is not attached, thereby forming a pre-formed recess bottom surface uneven portion 488 having a plurality of recesses and a plurality of protrusions, by etching the region on the existing recess bottom surface 48c where the desired region inkjet resist hardened film is not attached, without etching the existing protrusion side surface 47b, the existing recess side surface 48b, and the existing protrusion top surface 47a.
Here, in the case where the desired region inkjet resist cured film (3) has (a) a desired graphic character pattern, as shown in FIG. 11 (C-a), the existing recess bottom surface uneven portion 488 is (a) an existing recess bottom surface multiple uneven portion 488a having an existing recess bottom surface multiple uneven portion concave portion 482a formed with a plurality of concave shapes corresponding to the desired graphic character pattern, and an existing recess bottom surface multiple uneven portion convex portion 481a formed with a plurality of convex shapes.
Alternatively, in the case where the desired region inkjet resist cured film 3 has (b) a desired fine graphic character pattern, as shown in FIG. 11 (C-b), the existing recess bottom surface unevenness 488 is (b) an existing recess bottom surface multiple fine unevenness 488b having an existing recess bottom surface multiple fine unevenness concaves 482b formed with a plurality of fine concave shapes corresponding to the desired fine graphic character pattern, and an existing recess bottom surface multiple fine unevenness convex portions 481b formed with a plurality of fine convex shapes.

As shown in FIG. 11(D), the (D) step of the above-mentioned [Basic Configuration 1] includes a desired area inkjet resist hardened film removal step of removing the desired area inkjet resist hardened film 3.
As a result, when the desired region inkjet resist cured film 3 has (i) a desired graphic, letter, and design pattern, a pre-formed recess bottom surface multiple uneven portions 488a are formed as pre-formed recess bottom surface uneven portions 488 on the pre-formed recess bottom surface 48c, as shown in Figure 11 (D-a).
Alternatively, in the case where the desired region inkjet resist cured film 3 has (b) a desired fine graphic, letter, and pattern pattern, as shown in FIG. 11 (D-b), a plurality of fine uneven portions 488b on the bottom surface of the existing recess are formed as the uneven portion 488 on the bottom surface of the existing recess 48c.
In this way, a pressing plate is manufactured which has a preformed recess 48 and a preformed protrusion 47, and on the bottom surface of the preformed recess 48, a preformed recess bottom surface multiple uneven portions 488a as the preformed recess bottom surface uneven portion 488, or a preformed recess bottom surface multiple fine uneven portions 488b as the preformed recess bottom surface uneven portion 488.

In this configuration, the height dimension of each of the pre-formed recess bottom surface multiple uneven portion convex portions 481a of the pre-formed recess bottom surface multiple uneven portion convex portions 488 (the same as the depth dimension of the pre-formed recess bottom surface multiple uneven portion concave portions 482a) is not particularly limited, but a depth dimension that is, for example, 0.1 mm or more and smaller (shorter, shallower) than the depth dimension of the pre-formed recess 48 is preferably implemented.
In addition, the height dimension of each of the pre-formed recess bottom surface multiple unevenness portions 481a of the pre-formed recess bottom surface multiple unevenness portions 488b formed with a plurality of fine uneven shapes (the same as the depth dimension of the pre-formed recess bottom surface multiple unevenness portions 482a) is not particularly limited, but a depth dimension that is, for example, 0.05 mm or more and smaller (shorter, shallower) than the depth dimension of the pre-formed recess 48 is preferably implemented.
In addition, the width dimension of each of the pre-formed recess bottom surface multiple unevenness portions 481a of the pre-formed recess bottom surface multiple unevenness portions 488b formed with a plurality of fine uneven shapes (the same as the width dimension of the pre-formed recess bottom surface multiple unevenness portions 482a of the pre-formed recess bottom surface multiple unevenness portions) is not particularly limited, but a value of, for example, 0.0005 mm to 1 mm is preferably usable.

This manufacturing method for pressing plates can provide the effect of (manufacturing method effect I: effect of being able to form an uneven surface shape of desired dimensions using inkjet resist) making it possible to manufacture pressing plates having the desired shapes, such as desired convex portions, desired concave portions, desired uneven portions, desired fine uneven portions, etc., by using a process involving chemical corrosive etching which has simpler steps than conventional general-purpose chemical corrosive etching processes, and which have the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of "areas of the plate mold substrate that should not be etched."
In other words, without etching the areas that must not be etched (the existing convexity side surface 47b, the existing concave-convexity side surface 48b, and the existing concave-convexity bottom surface 48c), a desired concave-convexity portion, a desired fine concave-convexity portion, or the like can be formed on the existing concave-convexity bottom surface 48c.

[Subordinate structure 13]
In the method for manufacturing a press plate according to the above-mentioned [subordinate configuration 2] to [subordinate configuration 12], it is preferable to implement a method for manufacturing a press plate having the following configuration.
In [Subordinate Structure 2] to [Subordinate Structure 10], in the step (A), the first region surface 11 of the plate mold substrate is subjected to a process such as (a) chemical corrosion etching using an inkjet resist hardened film formed using an inkjet resist material as a corrosive etching mask, and/or (b) chemical corrosion etching using a resist hardened film formed using a conventional liquid resist material as a corrosive etching mask, and/or (c) chemical corrosion etching using a resist hardened film formed using a conventional sheet-like dry film resist material as a corrosive etching mask, and/or (d) mechanical processing using a conventional mechanical processing device, to form the pre-formed uneven portion 4.
For example, a substrate for a plate mold having a pre-formed uneven portion 4 having pre-formed multiple uneven portions 45 and/or pre-formed multiple fine uneven portions 46 as shown in Figures 1, 2, 3, 6, and 7 can be produced by chemical corrosive etching processing using a resist hardened film made of (a) an inkjet resist material, (b) a conventional liquid resist material, (c) a conventional sheet-type dry film resist material, etc., as a corrosive etching mask, and/or (d) conventional mechanical processing, etc.

(a) Chemical corrosive etching using the inkjet resist hardened film formed by using the inkjet resist material as a corrosive etching mask is a process in which the inkjet resist material used in the manufacturing method of the pressing plate of the present invention is adhered to the surface of the plate mold substrate by the inkjet method to form an inkjet resist adhered film, the inkjet resist adhered film is hardened to form an inkjet resist hardened film, and the plate mold substrate is chemically corroded and etched using an etching solution with the inkjet resist hardened film as a corrosive etching mask to form a pre-formed concave-convex portion 4. In the chemical corrosive etching process using the inkjet resist material, the processing method can be similar to or the same as that explained in the above-mentioned "Basic Configuration 1".

The inkjet resist material is not particularly limited, and as explained in the above-mentioned "Basic Configuration 1", for example, inkjet resist material 2 manufactured by companies supplying general-purpose resist materials, such as Taiyo Ink Mfg. Co., Ltd., Mitsui Chemicals, Inc., GOO Chemical Industry Co., Ltd., JNC Corporation, Nikko Materials Co., Ltd., Asahi Kasei Corporation, Nippon Agfa Lewald AG, Tokyo Ohka Kogyo Co., Ltd., and having the desired viscosity of 5 mPa·s to 100 mPa·s (25° C.), preferably 10 mPa·s to 50 mPa·s (25° C.), which is chemically reacted upon exposure to ultraviolet light to become insoluble and form a hardened resist, can be used.

The thickness of the inkjet resist deposition film tends to become thinner as the viscosity of the inkjet resist material 2 decreases, and the thickness of the inkjet resist deposition film tends to become thicker as the viscosity of the inkjet resist material 2 increases. An inkjet resist material having a viscosity capable of forming an inkjet resist deposition film of the desired thickness required for the function as a corrosive etching mask is selected and used. By using an inkjet resist material 2 having an optimal viscosity, it becomes possible to form an inkjet resist deposition film in a desired area having a desired graphic, letter, or picture pattern shape with high precision in a desired area on the surface of the plate mold substrate.

(b) Chemical corrosive etching processing using a resist hardened film formed from a conventional liquid resist material as a corrosive etching mask is a processing in which a conventional liquid resist material is adhered to the surface of a plate mold substrate by a conventional screen printing method, spray coating method, curtain coating method, spin coating method, or other conventional adhesion method, the liquid resist material is dried to form a resist adhered film, the resist adhered film is exposed to ultraviolet light or the like through an exposure mask member having desired through holes, and a resist hardened film is formed through processes such as development and baking, and the surface of the plate mold substrate is chemically corroded and etched using an etching solution with the resist hardened film as a corrosive etching mask to form a pre-formed uneven portion 4 having an uneven shape.

The conventional liquid resist material is not particularly limited, and for example, an inkjet resist material that is a conventional general-purpose liquid resist material used in the photolithography technology field and has the desired viscosity, photoreactivity, temperature reactivity, etc. can be used. For example, a general-purpose liquid resist material 2 can be used, which is a type of negative photoresist that is a fluid material mainly composed of an organic polymer material with a two-dimensional chemical structure and has the property of being crosslinked in chemical structure and cured into a crosslinked organic polymer state with a three-dimensional chemical structure by irradiation with ultraviolet rays, electron beams, laser irradiation, or heating.
In addition, the viscosity of the conventional liquid resist material is not particularly limited, but it is preferable to use a conventional liquid resist material having a viscosity of 1 mPa·s (25° C.) or more to form a conventional resist hardened film having a thickness of less than about 50 μm (about 0.05 mm).
The thickness of the deposited resist film decreases as the viscosity of the resist material 2 decreases. By using a liquid resist material 2 having an optimal viscosity, a hardened resist film can be formed with a desired thickness.

The specific material of the liquid resist material is not particularly limited, and for example, a general-purpose liquid resist material used for corroding and etching the metal of a plate mold substrate can be used. For example, a liquid resist material having a desired viscosity that undergoes a chemical reaction when irradiated with ultraviolet light to become insoluble and form a hardened resist can be preferably used, the liquid resist material being manufactured by a company that supplies general-purpose resist materials, such as Tokyo Ohka Kogyo Co., Ltd., Mitsui Chemicals, Inc., Taiyo Ink Mfg. Co., Ltd., JNC Corporation, Nikko Materials Co., Ltd., Asahi Kasei Corporation, Sumitomo Chemical, Nippon Agfa Lewald, etc.

In addition, in the processing method using this conventional liquid resist material, it is also possible to implement a method in which, without using an exposure mask member, the resist material is chemically altered by irradiating a conventional resist-adhered film or a resist-hardened film with a laser or electron beam, etc., and then developed to form a corrosive etching mask having a desired shape, and then using this as the corrosive etching mask to chemically corrode and etch the plate mold substrate using an etching solution, thereby forming a pre-formed uneven portion 4 with an uneven shape.

(c) Chemical corrosive etching processing using a resist hardened film formed from a conventional sheet-like dry film resist material as a corrosive etching mask is a processing method in which a conventional sheet-like dry film resist material is attached to the surface of a plate mold substrate, the sheet-like dry film resist material is exposed to ultraviolet light or the like through an exposure mask member having desired through holes, and a resist hardened film is formed through processes such as development and baking, and the surface of the plate mold substrate is chemically corroded and etched using an etching solution with the resist hardened film as a corrosive etching mask to form a pre-formed uneven portion 4 having an uneven shape.
It is also possible to carry out this processing method without using an exposure mask member by chemically modifying a conventional sheet-like dry film resist material by irradiating it with a laser or electron beam, developing it, and forming a corrosive etching mask having a desired shape, and then using this as a corrosive etching mask to chemically corrode and etch the plate mold substrate using an etching solution to form the preformed concave-convex portion 4 having a concave-convex shape. There are no particular limitations on the laser exposure device, and for example, a laser exposure device manufactured by Taishin Sangyo Co., Ltd. can be used.

In addition, in this processing method, instead of "attaching the conventional sheet-like dry film resist material to the surface of the plate mold substrate," it is also possible to use "a resist-attached plate mold substrate in which a sheet-like dry film resist material is adhered to the surface of a commonly manufactured plate mold substrate."
The specific material for the sheet-like dry film resist material is not particularly limited, and for example, general-purpose sheet-like dry film resist materials supplied by Tokyo Ohka Kogyo Co., Ltd., Mitsui Chemicals, Inc., Taiyo Ink Mfg. Co., Ltd., JNC Corporation, Nikko Materials Co., Ltd., Asahi Kasei Corporation, Nippon Agfa Lewald Aktiengesellschaft, etc. can be used.

(d) Mechanical processing using conventional machining equipment is processing for forming a pre-formed uneven portion 4 having an uneven shape by conventional NC processing, cutting processing, polishing processing, and other general-purpose machining.

In this step, the thickness of the cured film of a conventional liquid resist material, sheet-like dry film resist material, etc. is not particularly limited, but is preferably less than about 50 μm (about 0.05 mm), for example.
When the thickness of the applied or adhered conventional resist film material is about 50 μm or more, as the thickness increases, the variation in the thickness of the planar region of the conventional resist film material increases, and there is a tendency that a uniform conventional resist film cannot be formed. As a result, during exposure to ultraviolet light or the like using an exposure mask member, variation in exposure occurs, making it impossible to form a developed conventional resist hardened film having the desired shape accuracy and dimensional accuracy. As a result, when the conventional resist hardened film is used as an etching mask to corrode and etch a plate-shaped container field, it is not possible to form uneven parts having the desired shape accuracy and dimensional accuracy, resulting in a problem of poor etching processing accuracy.

[Subordinate structure 14]
In the manufacturing method of the pressing plate of the above [Basic Configuration 1] to [Subordinate Configuration 13], although not particularly limited, a plate mold substrate 1 made of metal, plastic, resin, or the like, which is commonly used as a pressing plate, can be used.
In particular, it is possible to carry out a method for manufacturing a press plate having the following configuration.
A manufacturing method for a pressing plate, in which the plate mold substrate 1 is made of iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powdered high speed steel, high speed steel, die steel, alloy tool steel, carbon tool steel, or steel.
Regarding such iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powdered high speed steel, high speed steel, die steel, alloy tool steel, carbon tool steel, or steel, those described in detail in the above description of [Basic Configuration 1] can be preferably implemented.

[Subordinate structure 15]
In the manufacturing method of a pressing plate having the above-mentioned [Basic configuration 1] to [Subordinate configuration 14], it is preferable to implement a manufacturing method of a pressing plate having at least one of the following forms (i) to (g).
(i) A flat plate mold configured in a flat pressure processing device having flat plate shapes facing each other.
(b) A roll plate configured in a roll-type processing device having roll shapes facing each other.
(c) A flexible plate that is constructed by wrapping and fixing around a cylindrical or columnar roll, or a flexible plate that is constructed by contacting and fixing to the surface of a plate-shaped substrate for a plate mold.
(ii) An embossing plate for processing the workpiece into a specified uneven shape.
(e) A foil stamping plate for foil stamping onto processed items.
(e) A cutting/cutting plate for cutting and/or cutting a workpiece into a specified shape.
(g) A embossing/foil stamping/cutting plate for embossing or foil stamping the workpiece into a specified uneven shape and cutting and/or cutting it.
The above (A), (B), and (C) are classifications based on the shape of the pressing plate, while (D), (E), (F), and (G) are classifications based on the purpose and application of the plate.

FIG. 17 is a schematic diagram for explaining the configuration of a press processing plate in the method for producing a press processing plate of the present invention.
FIG. 17 is a schematic diagram of a conventional, ordinary flat plate or roll type pressing device, showing the state in which the pressing plate of the present invention is mounted on this conventional pressing device.

As shown in Figure 17 (A), with a sheet-like workpiece substrate 108a and a sheet-like foil material 108b positioned between the pressing plate 10, which has a fine graphic, letter, and design pattern formed with a predetermined uneven shape, and a receiving plate 94, at least one of the pressing plate 10 and the receiving plate 94 is pressed against each other, a graphic, letter, and design pattern formed with an uneven shape that matches the pressing plate 10 is formed on the sheet-like workpiece substrate 108a, and a foil-transferred uneven graphic, letter, and design pattern formed by transferring the sheet-like foil material 108b is transferred and formed.
This pressing plate 10 corresponds to (e) a foil stamping plate for stamping a workpiece with foil.

As shown in Figure 17 (B), a sheet-like workpiece 108 is positioned between the pressing plate 10, which has a graphic, letter, design, pattern shape formed with a predetermined concave-convex shape, and the receiving plate 94, and at least one of the pressing plate 100 and the receiving plate 94 presses against each other, so that a graphic, letter, design, pattern shape formed with a concave-convex shape that matches the pressing plate 10 is formed on the sheet-like workpiece 108.
This pressing plate 10 corresponds to (iv) an embossing plate for processing a workpiece into a predetermined concave-convex shape.
The embossing plate is also called the embossing plate.

As shown in Figure 17 (C), in a state where a sheet-like workpiece 108 is positioned between the pressing plate 10 on which a plurality of fine graphic character pattern forms formed with a predetermined uneven shape and the graphic character pattern forms formed with a predetermined uneven shape are formed, and the receiving plate 94, at least one of the pressing plate 10 and the receiving plate 94 is pressed against each other, so that a graphic character pattern form formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108.
In addition, although not shown, it is also possible to use a pressing plate 100 that does not have a fine graphic, letter, or picture pattern, but only has a pressing plate 10 that has one or more predetermined concave and convex shapes. This pressing plate 10 corresponds to (e) a foil stamping plate for foil stamping a workpiece.
This pressing plate 10 is applied to the pressing plates of the above-mentioned "subordinate structure 3 to subordinate structure 5" and "subordinate structure 6 to subordinate structure 9", for example.

As shown in Figure 17 (D), with a sheet-like workpiece 108 positioned between a graphic, letter, and design pattern formed with a predetermined uneven shape and a receiving plate 94 on which a graphic, letter, and design pattern formed with a predetermined uneven shape is formed, at least one of the pressing plate 10 and the receiving plate 94 is pressed against each other, so that a graphic, letter, and design pattern formed with an uneven shape that matches the pressing plate 10 and the receiving plate 94 is formed on the sheet-like workpiece 108.
This pressing plate 10 corresponds to (iv) an embossing plate for processing a workpiece into a predetermined concave-convex shape.

As shown in Figure 17 (E), with a sheet-like workpiece 108 positioned between the blade pattern formed in a predetermined shape and the receiving plate 94, at least one of the pressing plate 10 and the receiving plate 94 is pressed against each other, so that the sheet-like workpiece 108 is cut or cut out in a shape that matches the pressing plate 10 and the receiving plate 94.
This pressing plate 10 corresponds to (f) a cutting plate for cutting and/or punching a workpiece into a predetermined shape.

Although not shown in the figure, a sheet-like workpiece is positioned between a pressing plate and a receiving plate, which have a graphic, letter, design, pattern shape formed with a predetermined concave-convex shape, and at least one of the pressing plate and the receiving plate press against each other, thereby forming a graphic, letter, design, pattern shape on the sheet-like workpiece, which is formed with a concave-convex shape that matches the pressing plate, and is also cut or formed into the predetermined shape.

Although not shown in the figure, a sheet-like workpiece substrate and a sheet-like foil material are positioned between a pressing plate forming a graphic, letter, and pattern form formed with a predetermined uneven shape, and a receiving plate 94 forming a graphic, letter, and pattern form formed with a predetermined uneven shape. At least one of the pressing plate and the receiving plate press against each other, so that a graphic, letter, and pattern form formed with uneven shapes that match the pressing plate and the receiving plate is formed on the sheet-like workpiece substrate, and the foil transferred uneven graphic, letter, and pattern form formed by transferring the sheet-like foil material is transferred and formed.
This pressing plate corresponds to (e) a foil stamping plate for stamping a workpiece with foil.

In the pressing plate of the present invention, the flat plate mold configured in the flat pressure processing device having the above-mentioned (a) flat plate shapes facing each other is used as a flat plate mold configured in the flat pressure processing device having (a) a first base 92 and a second base 93, as shown in Figure 16 (A), and having a pressing plate 10 and a receiving plate 94 installed opposite each other on each base.

In the press processing plate of the present invention, the roll plate configured in the roll-type processing device having mutually opposing roll shapes as described above (b) is a roll device equipped with a main roll 96 and a counter roll 97 having mutually opposing roll shapes such as cylindrical or cylindrical shapes, as shown in Figure 16 (B), and is used as a roll plate configured on the surface of each roll.
The following roll plates can be used as the roll plate:
(Ro-a) A roll plate formed by directly engraving and forming concave and convex shapes at desired positions on the surface of a roll.
(B-b) A roll plate having a flat plate-shaped substrate having uneven portions on its flat surface, which is fixed at a desired position on the surface of a roll.
(B-c) A roll plate having a curved plate plate substrate having uneven portions on its curved surface, which is fixed at a desired position on the surface of a roll.

The aforementioned (c) flexible plate configured by wrapping, installing and fixing around a cylindrical or columnar roll has a degree of flexibility that allows it to be curved, and is applied and used by wrapping it around the surface of the roll.
For example, the peripheral surface of the roll is configured to be magnetic, and the flexible plate is made of a magnetic metal such as iron or iron-containing steel, has a roughly sheet-like shape formed with a thickness large enough to be bent, and is installed and fixed in a state where it is attracted to the peripheral surface of the roll by magnetic force and is then used.
The flexible plate, which is configured to be placed and fixed on the surface of a plate-shaped substrate, is used by being placed and fixed on the surface of a substrate having a desired thickness and a flat shape of a flat pressure processing device.

In a pressing device using a pressing plate, it is also possible to implement a configuration in which a heating mechanism such as a heater for heating is provided on at least one of the first base 92, the second base 93, the pressing plate 100, and the receiving plate 94. In such a device equipped with a heating mechanism, (e) in a pressing device configured with a foil stamping plate for foil stamping a workpiece, when a sheet-like workpiece 108 consisting of a sheet-like workpiece substrate 108a and a sheet-like foil material 108b is used, foil stamping is formed on the sheet-like foil material 108b in a heated state.

<Regarding the press processing plate manufactured by the press processing plate manufacturing method of the present invention>
[Subordinate structure 16]
The pressing plate of the present invention is a pressing plate manufactured by at least one of the above-mentioned "basic configuration 1", "subordinate configuration 2" to "subordinate configuration 15".
For example, the press processing plate of the present invention is a press processing plate manufactured by the manufacturing method of "subordinate configuration 1." That is, the press processing plate of the present invention is a manufacturing method of a press processing plate for processing a workpiece into a predetermined shape by pressing, and has the following configuration.
(A) A plate mold substrate supplying step of supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12.
(B) a desired area inkjet resist deposition film formation process in which an inkjet resist material 2 is deposited on a desired area of the plate mold substrate first area surface 11 of the plate mold substrate 1 by an inkjet method to form a desired area inkjet resist deposition film, and a desired area inkjet resist hardened film formation process in which the inkjet resist deposition film is hardened to form an inkjet resist hardened film 3.
(C) A plate mold substrate etching process in which an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, and the surface of the plate mold substrate to which the desired region inkjet resist hardened film 3 is not attached is etched, thereby forming a corroded recess formed in a concave shape on the surface of the plate mold substrate.
(D) A resist cured film removal step for removing the inkjet resist cured film from a desired area.

In addition, the pressing plate of the present invention is not limited to the above, and it is also possible to implement a pressing plate manufactured by at least one of the pressing plate manufacturing methods of the above-mentioned "subordinate structure 2" to "subordinate structure 13".

The pressing plate of the present invention has the effect of obtaining a pressing plate having the desired shape, such as the desired convex portion, the desired concave portion, the desired uneven portion, the desired fine uneven portion, etc., and also having the desired shape accuracy and dimensional accuracy by suppressing corrosive etching of the "areas of the plate mold substrate that should not be etched."

<Method of processing workpiece according to the present invention>
[Subordinate structure 17]
The method for processing a workpiece of the present invention is a method for processing a workpiece, characterized in that the workpiece is processed using a pressing plate manufactured by at least one of the above-mentioned "basic configuration 1", "subordinate configuration 2" to "subordinate configuration 15" for manufacturing a pressing plate, to produce a workpiece that has been processed into a predetermined shape.

The workpiece that can be used in the above-mentioned method for processing a workpiece is not particularly limited, but preferably includes paper, corrugated cardboard, plastic films, plastic boards, plastic molded products, leather, wood, cloth, soft metals, and laminates thereof.
Also, a method for processing a workpiece, in which the workpiece is processed into a predetermined shape by at least one process selected from the group consisting of embossing, foil stamping, cutting, and cutout, can be preferably carried out.

[Subordinate structure 18]
The method for processing a workpiece of the present invention is a method for processing a workpiece, characterized in that a pressing plate manufactured by the method for manufacturing a pressing plate described in any one of "Basic configuration 1" and "Subordinate configuration 2" to "Subordinate configuration 15" above is a flat plate having a flat shape, and the pressing plate having a flat shape is used to process the workpiece to produce a workpiece that has been processed into a predetermined shape, and has the following configuration.
(Sa) A step of supplying a pressing plate 10 manufactured by a method for manufacturing a pressing plate according to any one of the above-mentioned "Basic configuration 1", "Subordinate configuration 2" to "Subordinate configuration 15".
(Sb) A step of preparing a pressing device having a first base 92 and a second base 93 facing each other.
(Sd) A process of placing a predetermined receiving plate 94 on the second base 93 of the pressing device.
(S-e) A process of positioning a workpiece 108 between the pressing plate 10 and the receiving plate 94, and driving at least one of the first base 92 and the second base 93, so that the pressing plate 10 and the receiving plate 94 press the workpiece.
As a result, a workpiece unevenness forming portion having an uneven shape that matches the uneven shape of the existing uneven portion 4 is formed on the surface of the workpiece 108.
(Sf) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to move the pressing plate 10 and the receiving plate 94 away from each other, thereby releasing the pressing force on the workpiece.
This prepares a workpiece having a workpiece unevenness portion formed on the surface of the workpiece 108, the workpiece unevenness portion being transferred and formed in a form having an uneven shape that matches the uneven shape of the existing unevenness portion 4.

In the above-mentioned (S-d) step of placing a specified receiving plate 94 on the second base 93 of the pressing processing device, a method for processing a workpiece can be carried out using a receiving plate 94 having a smooth surface and no uneven shape, as shown in Figure 17 (A).
Furthermore, the receiving plate 94 is not limited to the above, and a method for processing a workpiece using a receiving plate 94 having an uneven surface manufactured using the inkjet resist material of the present invention or a conventional resist material, as shown in Figure 17 (D), can also be implemented.

In this method of processing a workpiece, the aforementioned (i) flat plate mold as a pressing plate configured in a flat pressure processing device having mutually opposing flat plate shapes, and (ii) a embossing plate for processing the workpiece into a predetermined uneven shape are applied.

The method for processing a workpiece of the present invention can provide the effect of preparing a processed product from a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molding, or a laminate of these, which has a desired shape such as a desired convex portion, a desired concave portion, a desired uneven portion, or a desired fine uneven portion, and which has the desired shape accuracy and dimensional accuracy.

[Subordinate structure 19]
Another method for processing a workpiece of the present invention is a method for processing a workpiece, characterized in that a pressing plate manufactured by the method for manufacturing a pressing plate described in any one of "Basic configuration 1" and "Subordinate configuration 2" to "Subordinate configuration 15" above is a flat plate having a flat shape, and the pressing plate having a flat shape is used to foil stamp the workpiece to produce a workpiece that has been foil stamped into a predetermined shape, and has the following configuration.
(Sa) A step of supplying a pressing plate 10 manufactured by a method for manufacturing a pressing plate according to any one of "Basic Configuration 1", "Subordinate Configuration 2" to "Subordinate Configuration 13".
(Sb) A step of preparing a pressing device having a first base 92 and a second base 93 facing each other.
(Sd) A process of placing a predetermined receiving plate 94 on the second base 93 of the pressing device.
(S-e) A process in which, with the workpiece substrate 108a and the sheet-like foil material 108b positioned between the pressing plate 10 and the receiving plate 94, at least one of the first base 92 and the second base 93 is driven so that the pressing plate 10 and the receiving plate 94 press the workpiece.
As a result, the sheet-like foil material 108b is transferred onto the surface of the workpiece base material 108a to form a workpiece foil stamping transfer formation portion having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion 4.
(Sf) A step of driving at least one of the bases of the pressing plate 10 and the receiving plate 94 to move the pressing plate 10 and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This prepares a workpiece in which a workpiece foil stamping transfer formation portion is formed on the surface of the workpiece base material 108a by transferring the sheet-shaped foil material 108b in a form having a shape that matches the uneven shape of the existing uneven portion 4.

In this method of processing a workpiece, the above-mentioned (i) flat plate mold configured in a flat pressure processing device having mutually opposing flat plate shapes, and (e) a flat plate mold used as a foil stamping plate for foil stamping the workpiece are applied.
In addition, in this foil stamping method, it is also possible to preferably implement a configuration in which the foil stamping is performed in a state in which at least one of the first base 92, the second base 93, the pressing plate 10, and the receiving plate 94 is heated. By heating, a desired area of the sheet-like foil material 108b is transferred to and bonded to the surface of the workpiece, forming a foil stamping transfer formation portion of the workpiece.

The method for processing a workpiece of the present invention can provide "effect B of the method for processing a workpiece: the effect of being able to prepare a processed product by foil stamping a workpiece such as paper, corrugated cardboard, plastic film, plastic board, plastic molding, or a laminate of these, into a shape formed with recesses, protrusions, and/or uneven parts having a desired graphic, letter, pattern, or picture pattern form, such as a desired character, desired symbol, desired figure, desired picture, desired lattice pattern, and desired fine multiple concave-convex pattern, with excellent shape and dimensional precision."
In particular, "the effect of being able to prepare a workpiece formed by stamping with excellent shape and dimensional accuracy" is obtained. In particular, when "a pressing plate formed by assembling a plurality of types of fine graphic and letter patterns to form mutually different images" manufactured by "subordinate configuration 8" is used, "a workpiece formed so that mutually different images can be seen when viewed from mutually different directions" is stamped by the foil processing, and therefore it is possible to prepare a significantly excellent stamped workpiece.

[Subordinate structure 20]
Another method for processing a workpiece of the present invention is a method for processing a workpiece, characterized in that a press processing plate manufactured by the method for manufacturing a press processing plate described in any one of the above ``Basic configuration 1'' and ``Subordinate configuration 2'' to ``Subordinate configuration 15'' is placed in a roll device, the workpiece is processed, and a workpiece is produced that has been processed into a predetermined shape, and has the following configuration.
(Sa) A step of supplying a pressing plate 10 manufactured by a method for manufacturing a pressing plate according to any one of "Basic Configuration 1", "Subordinate Configuration 2" to "Subordinate Configuration 13".
(Sb) A step of preparing a pressing device having a main roll 96 and a counter roll 97 opposed to each other.
(Sc) A process of placing the pressing plate 10 on the main roll 96.
(Sd) A step of placing a predetermined receiving plate 94 on the pair of rolls 97 of the pressing device.
(S-e) A process of driving the main roll 96 and the counter roll 97 while supplying a workpiece between the main roll 96 and the counter roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece.
As a result, a workpiece uneven shape portion having an uneven shape that matches the uneven shape of the existing uneven portion 4 is formed on the surface of the workpiece 108.
(Sf) A process in which the workpiece is separated from between the main roll 96 and the counter roll 97, and the pressure on the workpiece is released.
This prepares a workpiece having a workpiece transfer portion formed on the surface of the workpiece 108 in a form having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion 4 .

In this method of processing the workpiece, the above-mentioned (b) roll plate configured in a roll-type processing device having mutually opposing roll shapes and configured by installing and fixing at a predetermined position on the roll, or (c) a flexible plate configured by wrapping around a cylindrical or columnar roll of a roll device and installing and fixing, is applied.

According to the method for processing a workpiece of the present invention, the above-mentioned effect "Effect A of the method for processing a workpiece" can be obtained.
In particular, "the effect of being able to prepare a processed product that is processed with excellent shape and dimensional accuracy" can be obtained.

[Subordinate structure 21]
Another method for processing a workpiece of the present invention is a method for processing a workpiece, characterized in that a press processing plate manufactured by the method for manufacturing a press processing plate described in any one of the above ``Basic configuration 1'' and ``Subordinate configuration 2'' to ``Subordinate configuration 15'' is placed in a roll device, the workpiece is processed, and a workpiece is produced that is foil-stamped and processed into a predetermined shape, and has the following configuration.
(Sa) A step of supplying a pressing plate 10 manufactured by a method for manufacturing a pressing plate according to any one of "Basic Configuration 1", "Subordinate Configuration 2" to "Subordinate Configuration 13".
(Sb) A step of preparing a pressing device having a main roll 96 and a counter roll 97 opposed to each other.
(Sc) A process of placing the pressing plate 10 on the main roll 96.
(Sd) A process of placing a predetermined receiving plate 94 on the roll 97 of the pressing device.
(S-e) A process in which the main roll 96 and the counter roll 97 are driven, and the workpiece substrate 108a and the sheet-like foil material 108b are supplied between the main roll 96 and the counter roll 97, so that the pressing plate 10 and the receiving plate 94 press the workpiece.
As a result, the sheet-like foil material 108b is transferred onto the surface of the workpiece base material 108a to form a workpiece foil stamping transfer formation portion having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion 4.
(Sf) A process in which the workpiece is separated from between the main roll 96 and the counter roll 97, and the pressure on the workpiece is released.
This prepares a workpiece having a workpiece transfer formation portion formed on the surface of the workpiece 108 by transferring the sheet-shaped foil material 108b in a form having an uneven shape that matches the uneven shape of the existing uneven portion 4.

In this method of processing the workpiece, the aforementioned (b) roll plate configured in a roll-type processing device having mutually opposing roll shapes, and (c) a flexible plate configured by wrapping, installing and fixing around a cylindrical or cylindrical roll of a circular roll device are applied.
In addition, in this foil stamping method, it is also possible to preferably implement a configuration in which foil stamping is performed in a state in which at least one of the main roll 96, the counter roll 97, and the pressing plate 10 is heated. By heating, a desired area of the sheet-like foil material 108b is transferred to and bonded to the surface of the workpiece, forming a foil stamping transfer formation portion on the workpiece.

According to the method for processing a workpiece of the present invention, the above-mentioned effect "Effect B of the method for processing a workpiece" can be obtained.
In particular, "the effect of being able to prepare a workpiece formed by stamping with excellent shape and dimensional accuracy" is obtained. In particular, when "a pressing plate formed by assembling a plurality of types of fine graphic and letter patterns to form mutually different images" manufactured by "subordinate configuration 8" is used, "a workpiece formed so that mutually different images can be seen when viewed from mutually different directions" is stamped with foil, and therefore it is possible to prepare a significantly excellent stamped workpiece.

[Subordinate structure 22]
In the method for processing a workpiece according to any one of the above-mentioned "sub-configuration 17" to "sub-configuration 21," a method for processing a workpiece having the following configuration can be preferably implemented.
"A method for processing a workpiece, wherein the workpiece is at least one workpiece selected from the group consisting of paper, corrugated cardboard, plastic film, plastic board, plastic molded product, leather, wood, cloth, soft metal, and laminates thereof."
This configuration provides the aforementioned "Workpiece Processing Method Effect A" and "Workpiece Processing Method Effect B," and in particular the "effect of being able to prepare a workpiece that has been processed with excellent shape and dimensional accuracy."

Typical examples of the manufacturing method of a press processing plate of the present invention, the press processing plate manufactured by the manufacturing method of a press processing plate, and the processing method of a workpiece in which the press processing plate manufactured by the manufacturing method of a press processing plate is used to process the workpiece into a predetermined shape will be described below. In the drawings, the shapes, sizes, dimensions, etc. of the components are not shown accurately, but are shown as a schematic outline to explain the features such as the shapes, configurations, and effects.

<Example 1A (Production of flat plate mold/embossing plate as pressing plate A)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 3", and is a method for manufacturing a pressing plate shown in Fig. 1, in which a graphic pattern of "ABCDE" is formed in a convex shape on the surface of a convex portion protruding from a concave portion. This pressing plate is used as a flat plate and an embossing plate.
In this embodiment, a conventional resist material is used to form pre-formed multiple concave-convex portions 45, and an inkjet resist material is used to form inkjet resist film etched second concave-forming portion 121 on the surface of the plate mold substrate on which the pre-formed multiple concave-convex portions 45 are formed, and the pre-formed multiple concave-convex portions 45 are prepared to be formed into inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the bottom surface of inkjet resist film etched second concave-forming portion 121.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a preformed multiple concave and convex portions 45.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of stainless steel and has a generally flat plate shape with a thickness "h" of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, (i) a general-purpose conventional liquid resist material having the property of undergoing a chemical reaction when irradiated with ultraviolet light and crosslinking into a three-dimensional chemical structure (a general-purpose conventional liquid resist material that is generally used for plate making and etching of printed circuit boards, and a desired conventional liquid resist material is selected from among commercially available general-purpose conventional liquid resist materials) was used on a desired area of the first region surface 11 of the plate mold substrate 1, and applied to the desired area by a conventional spray coating method to a thickness of about 0.02 mm to about 0.04 mm, and dried by a prescribed method to form a resist application film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member having through holes for light transmission and forming a desired pictorial pattern (ABCDE pattern), and then unnecessary resist film in the area not irradiated with ultraviolet light was removed using a commercially available general-purpose conventional developer (aqueous sodium carbonate solution). Then, the resist film was aged by heating and baking in a predetermined conventional manner. In this way, a resist cured film having the desired pictorial pattern (ABCDE pattern) was formed.

Next, a commercially available general-purpose conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film had been formed, and the surface of the plate mold substrate to which the resist hardened film had not been attached was etched until the depth "D1" reached 0.9 mm, thereby forming a plurality of pre-formed multiple concave-convex portions 452 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple convex portions 451 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose conventional resist remover (aqueous caustic soda solution).
In this manner, a plurality of preformed multiple convex portions 451 formed in a convex shape and a plurality of preformed multiple concave portions 452 formed in a concave shape were formed.
In addition, a diagram explaining the process of forming a preformed multiple uneven portion 45 having a plurality of preformed multiple uneven portion convex portions 451 formed in the above-mentioned convex shape and a plurality of preformed multiple uneven portion concave portions 452 formed in a concave shape is not shown in Figure 1.

That is, the second region surface 12 of the plate mold substrate has a non-relief portion without any irregularities, the first region surface 11 of the plate mold substrate has a pre-formed irregular portion 4 , and the pre-formed irregular portion 4 has a plurality of pre-formed irregular portions 45 .
The preformed multiple uneven portion 45 has a plurality of preformed multiple uneven portion convex portions 451 formed with a plurality of convex shapes, and a plurality of preformed multiple uneven portion concave portions 452 formed with a plurality of concave shapes, the plurality of preformed multiple uneven portion convex portions 451 have a plurality of preformed multiple uneven portion convex portion upper surfaces 451a and a plurality of preformed multiple uneven portion convex portion side surfaces 451b, and the plurality of preformed multiple uneven portion concave portions 452 have a plurality of preformed multiple uneven portion concave portion bottom surfaces 452c and a plurality of preformed multiple uneven portion concave portion side surfaces 452b.
In this manner, a plate-form substrate having a plurality of preformed concave-convex portions 45 as the preformed concave-convex portion 4 was prepared.
The plurality of already formed concave-convex side surfaces 451b of the multiple already formed concave-convex portions and the plurality of already formed concave-convex side surfaces 452b of the multiple already formed concave-convex portions correspond to the same side surface region.
The height dimension "D1" of the etched pre-formed convex portion 451 corresponds to the depth dimension "D1" of the pre-formed concave portion, which is 0.9 mm. The width dimension "W1" of the pre-formed convex portion 451 and the width dimension "W2" of the pre-formed concave portion 452 had the desired dimensions as shown in FIG. 1 (A-b).
In this manner, a plate mold substrate 1 having a graphic letter pattern (ABCDE pattern) formed of preformed multiple concave-convex portions 451 shown in black in (A-b) of Figure 1 and multiple preformed multiple concave-convex portions 452 shown in white was prepared and supplied.

(B) Step of forming a hardened inkjet resist film in a desired area.
Using the plate mold substrate 1 prepared by the above process (A), as shown in Fig. 1 (B), the inkjet resist material 2 was applied by the inkjet method to cover the multiple already formed multiple concave-convex portion convex portion upper surfaces 451a, the multiple already formed multiple concave-convex portion convex portion side surfaces 451b, the multiple already formed multiple concave-convex portion concave bottom surfaces 452c, and the multiple already formed multiple concave-convex portion concave side surfaces 452b, thereby forming an inkjet resist convex portion upper surface attachment film, an inkjet resist concave portion side surface attachment film, and an inkjet concave portion bottom surface attachment film. Here, the inkjet resist material 2 was not attached to the plate mold substrate second region surface 12 located in the peripheral region of the already formed multiple concave-convex portions 45.
Thereafter, the film adhered to the top surfaces of the inkjet resist convex portions, the film adhered to the side surfaces of the inkjet resist concave portions, and the film adhered to the bottom surface of the inkjet resist concave portions are hardened to form cured films 3a on the top surfaces of the inkjet resist convex portions in the desired region, cured films 3b on the side surfaces of the inkjet resist convex portions in the desired region, and cured films 3c on the bottom surfaces of the inkjet resist concave portions in the desired region, thus forming cured films 3 on the desired region inkjet resist.
The cured film on the side surface of the convex portion of the desired region inkjet resist and the cured film on the side surface of the concave portion of the desired region inkjet resist correspond to the same lateral surface cured film.

In addition, in the desired area inkjet resist hardened film formation step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, a material that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected and used, and the inkjet resist material was attached to the plate mold substrate under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist adhesion film formed on the plate mold substrate was irradiated with ultraviolet light to chemically react the inkjet resist material, and then, heating and burning were performed at 120°C for 10 minutes to form the hardened desired area inkjet resist convex upper surface hardened film 3a, the desired area inkjet resist convex side surface hardened film 3b, and the desired area inkjet resist concave bottom surface hardened film 3c. In this way, the desired area inkjet resist hardened film 3 was formed.
The thickness of the cured inkjet resist film in the desired area ranged from about 0.03 mm to about 0.05 mm.

In this process, the inkjet resist material adheres well to the convex portion side surface 451b (concave portion side surface 452b) of the pre-formed multiple uneven portions without flowing off from the pre-formed multiple uneven portion convex portion side surface 451b (concave portion side surface 452b of the pre-formed multiple uneven portion), and also adheres well to the convex portion upper surfaces 451a of the pre-formed multiple uneven portions and the concave bottom surfaces 452c of the pre-formed multiple uneven portions; further, it was confirmed that a hardened film 3a of the desired region inkjet resist convex portion upper surface, a hardened film 3b of the side surface of the desired region inkjet resist convex portion, and a hardened film 3c of the desired region inkjet resist concave portion bottom surface were formed in the desired region.

(C) Corrosive Etching Process.
As shown in FIG. 1C , an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1, on which the desired region inkjet resist convex portion top surface hardened film 3a, the desired region inkjet resist convex portion side surface hardened film 3b, and the desired region inkjet resist concave portion bottom surface hardened film 3c were formed, by using a paddle blow-up method, and the plate mold substrate second region surface 12, on which the desired region inkjet resist hardened film was not attached, was etched until the depth dimension (D12) became approximately 1.9 mm.
As a result, the second area surface 12 of the plate mold substrate is etched without etching the pre-formed multiple concave-convex portions 45, thereby forming an inkjet resist film etched second concave-forming portion 121 having an etched concave shape, and the pre-formed multiple concave-convex portions 45 are formed into the form of an inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the inkjet resist film etched second concave-forming portion 121.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 1 (D-b), the cured film 3a on the top surface of the inkjet resist convex portion in the desired region, the cured film 3b on the side surface of the inkjet resist convex portion in the desired region, and the cured film 3c on the bottom surface of the inkjet resist concave portion in the desired region were removed using a commercially available general-purpose conventional resist remover (caustic soda solution or sodium hydroxide solution).

In this manner, the second concave-convex portion 121 is formed by etching the second region surface 12 of the substrate for the mold without etching the pre-formed multiple concave-convex portion 45 formed in an uneven shape, and the first region surface 11 of the substrate for the mold having the pre-formed multiple concave-convex portion 45 having a plurality of pre-formed multiple concave-convex portion convex portions 451 and a plurality of pre-formed multiple concave-convex portion concave portions 452 is formed in the form of the inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the second concave-convex portion 121 of the inkjet resist film etched.

1D, the depth dimension "D12" of the inkjet resist film etching second recess forming portion 121 is 1.9 mm, and the height dimension "D1" of the multiple existing multiple concave-convex portions 451 and the depth dimension "D1" of the multiple existing multiple concave-convex portions 452 indicate the same area, and each initial dimension is maintained, being 0.9 mm. In this way, the pressing plate was manufactured.

As described above, in this embodiment, a conventional resist material was used to prepare a plate mold substrate 1 having a pre-formed multiple uneven portion 45 formed on the plate mold substrate first area surface 11 of the plate mold substrate, the pre-formed multiple uneven portion 45 having a pre-formed multiple uneven portion convex portion 451 with a height dimension "D1" and a pre-formed multiple uneven portion concave portion 452 with a depth dimension "D1". The plate mold substrate 1 having the pre-formed multiple uneven portion 45 formed thereon was used together with an inkjet resist material to perform corrosion etching to form an inkjet resist film corrosion second concave forming portion 121, thereby preparing a form in which the pre-formed multiple uneven portions 45 having an "ABCDE pattern" formed in an uneven shape are formed into inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second concave forming portion 121.

In addition, in this embodiment, it was confirmed that the desired inkjet film corrosion pre-formed multiple uneven portions 45 having the desired shape accuracy and dimensional accuracy were formed, and the desired inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121 was formed.
Furthermore, it was confirmed that the side surface 451b of the convex portion of the pre-formed multiple concave-convex portion (side surface 452b of the pre-formed multiple concave-convex portion) does not suffer from the side etching phenomenon in which the portion is etched in a recessed state, and has the desired shape accuracy and dimensional accuracy.

<Example 1B (Production of flat plate mold/embossing plate as pressing plate B)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 3", and is a method for manufacturing a pressing plate shown in Fig. 2, in which a graphic picture pattern of "ABCDE pattern" is formed in a convex shape on the surface of the convex portion protruding from the concave portion. This pressing plate is used as a flat plate and an embossing plate.
In this embodiment, an inkjet resist material is used to form pre-formed multiple concave-convex portions 45, and an inkjet resist film etched second concave-forming portion 121 is formed on the surface of the plate mold substrate on which the pre-formed multiple concave-convex portions 45 are formed, using an inkjet resist material, and the pre-formed multiple concave-convex portions 45 are formed into inkjet film etched pre-formed multiple concave-convex portion protrusions 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second concave-forming portion 121.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a preformed multiple concave and convex portions 45.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of brass and has a generally flat plate shape with a thickness "h" of 7 mm, a width of 125 mm, and a length of 90 mm.

Next, an inkjet resist material was applied to the surface of the plate mold substrate 1 by an inkjet method to form an inkjet resist film having an "ABCD graphic letter pattern."
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials, the same inkjet resist material used in the step (B) of the above-mentioned Example 1A was selected and used, which has the property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material used in the step (B) of the above-mentioned Example 1A), and was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed and attached to the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a cured inkjet resist film having a desired ABCDE pattern and a pattern design.
In this manner, an inkjet resist film having an ABCD graphic pattern was formed. The thickness of the inkjet resist film ranged from about 0.03 to about 0.05 mm.

A commercially available conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist cured film had been formed, and the surface of the plate mold substrate to which the resist cured film had not been attached was etched until the depth "D1" reached approximately 0.9 mm, thereby forming a pre-formed multiple concave-convex portion 45 having a plurality of pre-formed multiple concave-convex portion convex portions 451 and a plurality of pre-formed multiple concave-convex portion concave portions 452 on the plate mold substrate.

The hardened inkjet resist film was then removed using a conventional commercially available resist remover.
It should be noted that the diagrams for explaining the process of forming the preformed multiple concave-convex portions 45 described above are not shown in FIG.

In this manner, a preformed multiple uneven portion 45 having a plurality of preformed multiple uneven portion convex portions 451 and a plurality of preformed multiple uneven portion concave portions 452 was formed on the first region surface 11 of the plate mold substrate 1 as shown in Figure 2 (A).
The depth "D1" of each of the existing multiple concave-convex portions 452 was approximately 0.9 mm, and the height of the existing multiple concave-convex portions 451 was approximately 0.9 mm, which corresponds to the depth of the existing multiple concave-convex portions 452.
In this manner, a plate mold substrate 1 having a graphic character design (ABCDE pattern) shown in black in FIG. 2 (A-b) and a plurality of preformed concave portions 452 shown in white was prepared and supplied.

(B) Step of forming a hardened inkjet resist film in a desired area.
2B, the inkjet resist material 2 is applied by the inkjet method to cover the multiple previously formed multiple concave-convex portion convex portion top surfaces 451a, the multiple previously formed multiple concave-convex portion convex portion side surfaces 451b, the multiple previously formed multiple concave-convex portion concave bottom surfaces 452c, and the multiple previously formed multiple concave-convex portion concave side surfaces 452b, forming an inkjet resist convex portion top surface attachment film, an inkjet resist convex portion side surface attachment film, and an inkjet concave portion bottom surface attachment film. Here, the inkjet resist material 2 is not applied to the second region surface 12 of the plate mold substrate located in the peripheral region of the previously formed multiple concave-convex portions 45.
Thereafter, the film adhered to the top surfaces of the inkjet resist convex portions, the film adhered to the side surfaces of the inkjet resist convex portions, and the film adhered to the bottom surface of the inkjet resist concave portions were hardened to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist top surface hardened film 3a, a desired region inkjet resist side surface hardened film 3b, and a desired region inkjet resist bottom surface hardened film 3c.
The cured film 3b on the side surface of the convex portion of the desired region inkjet resist and the cured film on the side surface of the concave portion of the desired region inkjet resist correspond to the same lateral surface cured film.

An on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials, the inkjet resist material used in the step (B) of the above-mentioned Example 1A was selected and used, which has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure, and has a viscosity of 10 mPa to 20 mPa·s (25°C) (the same inkjet resist material used in the step (B) of the above-mentioned Example 1A and the step (A) of this Example 2B), and was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist adhesion film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a hardened film 3a on the top surface of the inkjet resist convex portion in the desired area, a hardened film 3b on the side surface of the inkjet resist convex portion in the desired area, and a hardened film 3c on the bottom surface of the inkjet resist concave portion in the desired area.
The thickness of the desired area inkjet resist cured film 3 was in the range of about 0.03 to about 0.05 mm.

In this process, the inkjet resist material adheres well to the convex portion side surface 451b (concave portion side surface 452b) of the pre-formed multiple uneven portions without flowing off from the pre-formed multiple uneven portion convex portion side surface 451b (concave portion side surface 452b of the pre-formed multiple uneven portion), and also adheres well to the convex portion upper surfaces 451a of the pre-formed multiple uneven portions and the concave bottom surfaces 452c of the pre-formed multiple uneven portions; further, it was confirmed that a hardened film 3a of the desired region inkjet resist convex portion upper surface, a hardened film 3b of the side surface of the desired region inkjet resist convex portion, and a hardened film 3c of the desired region inkjet resist concave portion bottom surface were formed in the desired region.

(C) Corrosive Etching Process.
As shown in FIG. 2C , a commercially available conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1, on which the desired region inkjet resist convex portion top surface cured film 3a, the desired region inkjet resist convex portion side surface cured film 3b, and the desired region inkjet resist concave portion bottom surface cured film 3c were formed, using a paddle blow-up method to etch the plate mold substrate second region surface 12, on which the desired region inkjet resist cured film was not attached, until the depth dimension "D12" became approximately 1.9 mm.
As a result, the second area surface 12 of the plate mold substrate is etched without etching the pre-formed multiple concave-convex portions 45, thereby forming an inkjet resist film etched second concave-forming portion 121 having an etched concave shape, and the pre-formed multiple concave-convex portions 45 are formed into the form of an inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the inkjet resist film etched second concave-forming portion 121.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 2 (D-b), the cured film 3a on the top surface of the inkjet resist convex portion in the desired region, the cured film 3b on the side surface of the inkjet resist convex portion in the desired region, and the cured film 3c on the bottom surface of the inkjet resist concave portion in the desired region were removed using a commercially available conventional resist remover (aqueous caustic soda solution or aqueous sodium hydroxide solution).

In this manner, the second concave-convex portion 121 formed by etching the second region surface 12 of the substrate for the mold is formed without etching the pre-formed multiple concave-convex portion 45 having the "ABCDE pattern" formed in an uneven shape, and the first region surface 11 of the substrate for the mold having the pre-formed multiple concave-convex portion 45 having a plurality of pre-formed multiple concave-convex portion convex portions 451 and a plurality of pre-formed multiple concave-convex portion concave portions 452 is formed into an inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the second concave-convex portion 121 of the inkjet resist film etched.

As shown in FIG. 2(D), the depth dimension "D12" of the inkjet resist film etched second recess formation portion 121 is 1.9 mm, and the height dimension "D1" of the multiple existing multiple uneven portion convex portions 451 and the depth dimension of the multiple existing multiple uneven portion concave portions 452 indicate the same area, and each maintains its initial dimension, being 0.9 mm.
In this manner, a pressing plate was produced.

As described above, in this embodiment, an inkjet resist material is used to prepare a plate mold substrate 1 on which a pre-formed multiple uneven portion 45 having a pre-formed multiple uneven portion convex portion 451 with a height dimension D1 and a pre-formed multiple uneven portion concave portion 452 with a depth dimension D is formed on the plate mold substrate first area surface 11 of the plate mold substrate. The plate mold substrate 1 on which the pre-formed multiple uneven portions 45 are formed is used together with an inkjet resist material to perform corrosion etching to form an inkjet resist film corrosion second concave formation portion 121, thereby preparing a form in which "the pre-formed multiple uneven portions 45 are formed into inkjet film corrosion pre-formed multiple uneven portion protrusion portions 455 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second concave formation portion 121."

In addition, in this embodiment, it was confirmed that the desired pre-formed multiple uneven portions 45 having the desired shape accuracy and dimensional accuracy were formed, and the desired inkjet film etched pre-formed multiple uneven portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second recess formation portion 121 was formed.
In addition, it was confirmed that the side etching phenomenon in which the desired convex portion side surface 451 b of the already-formed multiple concave-convex portion (the concave portion side surface 452 b of the already-formed multiple concave-convex portion) was etched in a recessed state did not occur, and that the desired shape accuracy and dimensional accuracy were obtained.

<Example 1B-a (Processing of workpiece using the pressing plate of Example 1B)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned embodiment 1B is used as the embossing plate 10 of a flat pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the preformed uneven portion 4 formed thereon, which was manufactured in Example 1B.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface without irregularities was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 having a thickness of approximately 1.5 mm was positioned as the workpiece 108 between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
As a result, a workpiece unevenness-forming portion having an uneven shape that matches the uneven shape of the existing uneven portion 4 was formed on the surface of the workpiece 108.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which a paper sheet 108 serving as the workpiece 108 was embossed with a concave-convex shape of approximately 0.9 mm depth having a graphic character pattern that matched the graphic character pattern formed in a concave-convex shape on the existing concave-convex portion 4.

In the embodiment of the method for processing the workpiece, a workpiece was obtained in which a graphic picture pattern of "ABCDE pattern" formed with a concave-convex shape having the desired shape accuracy and dimensional accuracy was formed on the paper sheet 108 as the workpiece 108 without any abnormality. It was confirmed that the graphic picture pattern of "ABCDE pattern" formed on the workpiece was formed with concave-convex shapes having a step of about 0.9 mm as desired without any abnormality.

Comparative Example 1A (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a method for manufacturing a press processing plate using a conventional liquid resist material instead of the inkjet resist material in the "(B) Desired area inkjet resist hardened film forming step" of Example 1A above.
12 and 13 are schematic diagrams illustrating the manufacturing process of this comparative example.
12 and 13 are schematic diagrams for explaining the manufacturing steps of a conventional method for manufacturing a pressing plate.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a preformed multiple concave and convex portions 45.
As shown in FIG. 12A, the material and shape of the plate mold substrate were the same as those of Example 1A. A plate mold substrate was prepared which was made of stainless steel and had an approximately flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
As shown in FIG. 12B, by the same method as in step (A) of Example 1A described above, a conventional general-purpose common liquid resist material (the same liquid resist material used in step (A) of Example 1A described above, a common liquid resist material generally used for plate making and etching of printed circuit boards) was applied to a thickness of about 0.02 mm to about 0.04 mm by a spray coating method, dried to form a resist deposition film, irradiated with ultraviolet rays through a desired exposure mask member having through holes for light transmission, and by steps such as after-baking and development, a resist hardened film having a desired pictorial pattern (ABCDE pattern) was formed.
Thereafter, the plate-form substrate on which the hardened resist film was formed was corroded and etched with an etching solution to form a preformed multiple concave-convex portion 45 having a preformed multiple concave-convex portion convex portion 451 and a preformed multiple concave-convex portion concave portion 452 .
In this manner, a plate mold substrate having a plurality of preformed projections and recesses 45 formed on the first region surface 11 of the plate mold substrate as shown in FIG. 12(B) was prepared.
The material and shape of the prepared plate mold substrate were the same as those in Example 1A, and the height dimension D1 (depth dimension D1 of the preformed concave portions 452 of the multiple concave and convex portions) was 0.9 mm, the same as in Example 1.
The second area surface 12 of the substrate for the mold has a non-irregular portion with no irregularities, and the first area surface 11 of the substrate for the mold has a pre-formed irregular portion 4, and the pre-formed irregular portion 4 has pre-formed multiple irregular portions 45, and the pre-formed multiple irregular portion 45 has a plurality of pre-formed multiple irregular portion convex portions 451 formed with a plurality of convex shapes and a plurality of pre-formed multiple irregular portion convex portions 451 formed with a plurality of concave shapes, and the plurality of pre-formed multiple irregular portion convex portions 451 have a plurality of pre-formed multiple irregular portion convex portion top surfaces 451a and a plurality of pre-formed multiple irregular portion convex portion side surfaces 451b, and the plurality of pre-formed multiple irregular portion concave portions 452 have a plurality of pre-formed multiple irregular portion concave portion bottom surfaces 452c and a plurality of pre-formed multiple irregular portion concave portion side surfaces 452b.
In addition, the multiple convex portion side surfaces 451b of the existing multiple concave-convex portions and the multiple concave-convex portion side surfaces 452b of the existing multiple concave-convex portions refer to the same side surfaces.

(B) A conventional liquid resist hardened film forming process.
The surface of the plate mold substrate 1, on which multiple pre-formed multiple concave-convex portion convex top surfaces 451a, multiple pre-formed multiple concave-convex portion convex side surfaces 451b (multiple pre-formed multiple concave-convex portion concave side surfaces 452b), and multiple pre-formed multiple concave-convex portion concave bottom surfaces 452c were formed, was covered with a conventional liquid resist material 20 (the same liquid resist material as used in process (A) of this Comparative Example 1A, which has the property of chemically reacting when exposed to ultraviolet light and crosslinking into a three-dimensional chemical structure, and is a conventional liquid resist material that is widely used for plate making and corrosive etching of printed circuit boards) by a conventional spray coating method to form a liquid resist adhesion film.
Then, the plate was exposed to ultraviolet light through a desired shape of exposure mask member (an exposure mask member having through holes in the area corresponding to the "ABCDE pattern" area formed on the plate substrate first area surface 11 of the plate substrate when the exposure mask member is placed on the surface of the plate substrate), and then developed by removing the resist film in the area not irradiated with ultraviolet light using a developer (aqueous sodium carbonate solution), and then hardening the attached conventional resist film by a conventional method such as after-baking to form a conventional resist hardened film 30 having a conventional resist convex upper surface hardened film 30a and a conventional resist concave bottom surface hardened film 30c as shown in FIG. 12(C). However, the conventional resist material attached to the existing multiple concave-convex convex side surface 451b (existing multiple concave-convex concave side surface 452b) flowed down to the bottom surface of the existing multiple concave-convex concave, and a conventional resist concave side surface hardened film was not formed.
The thickness of the conventional resist hardened film 30 ranged from about 0.02 mm to about 0.04 mm.

In this case, the cured resist film was formed in such a form that no cured resist film was formed in the peripheral region of the plate mold substrate, and a conventional cured resist film was formed in the inner region.
In addition, the conventional liquid resist material was well adhered to the convex upper surfaces 451a of the existing multiple uneven portions and the concave bottom surfaces 452c of the existing multiple uneven portions, forming a conventional resist convex upper surface hardened film 30a and a conventional resist concave bottom surface hardened film 30c that were hardened in the desired areas; however, the conventional liquid resist material flowed down from the convex side surfaces 451b of the existing multiple uneven portions (concave side surfaces 452b of the existing multiple uneven portions), and no hardened film was formed on the convex side surfaces 451b of the existing multiple uneven portions (concave side surfaces 452b of the existing multiple uneven portions).

(C) Corrosive Etching Process.
As shown in Fig. 13D, an etching solution (aqueous ferric chloride solution) was applied to the surface of the plate mold substrate 1 on which the conventional resist convex upper surface hardened film 30a and the conventional resist concave bottom surface hardened film 30c were formed, by using a paddle blow-up method, and the plate mold substrate second region surface 12 on which the conventional resist hardened film was not attached was etched until the depth dimension (D3) was about 1.0 mm. In this case, slight side etching occurred on the side surface 451b of the convex portion of the existing multiple concave portions (side surface 452b of the existing multiple concave portions of the concave portions).

As shown in FIG. 13(E), the etching was continued further to etch the second region surface 12 of the plate mold substrate until the depth dimension (D12a) became about 1.9 mm.
As a result, the second area surface 12 of the mold substrate was etched to form a conventional second recess forming portion 121a having an etched recess shape, and the pre-formed multiple recesses 45 were formed in a shape protruding from the conventional second recess forming portion 121a.

(D) Conventional resist hardened film removal process.
As shown in FIG. 13F, the hardened film 30a on the top surface of the conventional resist protrusions and the hardened film 30c on the bottom surface of the conventional resist recesses were removed using a general-purpose resist remover (caustic soda solution or sodium hydroxide solution).

In the above-mentioned "(C) corrosion etching step", the already-formed multiple concave-convex portion side surface 451b (already-formed multiple concave-convex portion concave side surface 452b) on which no hardened film was attached was also corroded and etched, resulting in the side-etched already-formed multiple concave-convex portion convex side surface 451s (a plurality of side-etched already-formed multiple concave-convex portion concave side surfaces 452s) as shown in Fig. 13(D). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex side surfaces 451s of pre-formed multiple concave-convex portions (multiple side-etched concave side surfaces 452s of pre-formed multiple concave-convex portions) are not the desired shape but are undesirable shapes, and when a pressing mold having such side-etched concave-convex portions formed therein is used to process a workpiece, there is a problem that a workpiece processed into the desired concave-convex shape cannot be obtained, which is undesirable.
In addition, side etching refers to a shape in which the convex side surface 451b of the existing multiple uneven portions or the concave side surface 452b of the existing multiple uneven portions is etched in a recessed state toward the inner surface of the side surface, and this shape is not preferable for a pressing processing plate.

<Comparative Example 1Ab (Production of a pressing plate using a conventional dry film resist material)>
Another comparative example to Example 1A will be described below.
Comparative Example 1Ab is a method for producing a press processing plate in which a conventional dry film resist material is used in place of the inkjet resist material in step (B) of Example 1A.
Although no drawings are shown to explain the series of steps in this comparative example, some components are similar to those in the above-mentioned comparative example 1A, and some components will be described by using the reference numerals of those components.
(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a preformed multiple concave and convex portions 45.
Using the same method as in step (A) of the aforementioned Example 1A, using a conventional liquid resist material, a plate mold substrate was prepared and prepared in which the second region surface 12 of the plate mold substrate has a non-relief portion with no recesses or projections, the first region surface 11 of the plate mold substrate has a pre-formed recessed portion 4, and the pre-formed recessed portion 4 has a pre-formed multiple recessed portion 45, (a) the pre-formed multiple recessed portion 45 has a plurality of pre-formed multiple recessed portion convex portions 451 formed with a plurality of convex shapes and a plurality of pre-formed multiple recessed portion concave portions 452 formed with a plurality of concave shapes, the plurality of pre-formed multiple recessed portion convex portions 451 have a plurality of pre-formed multiple recessed portion convex portion top surfaces 451a and a plurality of pre-formed multiple recessed portion convex portion side surfaces 451b, and the plurality of pre-formed multiple recessed portion concave portions 452 have a plurality of pre-formed multiple recessed portion concave bottom surfaces 452c and a plurality of pre-formed multiple recessed portion concave side surfaces 452b.
The material and shape of the plate mold substrate are the same as those of Example 1A, that is, it is made of stainless steel and has a generally flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm. The height dimension D1 of the convex portion 451 of the existing multiple concave-convex portion (the depth dimension D1 of the concave portion 452 of the existing multiple concave-convex portion) is 0.9 mm, the same as in Example 1A.

(B) Conventional resist hardened film forming process.
A conventional dry film resist material (having a thickness of about 0.02 mm to about 0.04 mm) was attached to the surface of the plate mold substrate on which the pre-formed multiple concave-convex portions 45 were formed. In this case, the dry film resist material did not come into contact with the multiple pre-formed multiple concave-convex portion convex portion side surfaces 451b (pre-formed multiple concave-convex portion concave portion side surfaces 452b) of the pre-formed multiple concave-convex portions 45 formed on the plate mold substrate, and a gap was generated between the multiple pre-formed multiple concave-convex portion concave portion bottom surfaces 452c. As the dry film resist material, a sheet-shaped dry film resist material having a desired "thickness of about 0.02 mm to about 0.04 mm" was selected from commercially available conventional sheet-shaped dry film resist materials and used.
The plate mold substrate with the conventional dry film resist material attached thereto was irradiated with conventional ultraviolet light via an exposure mask member (an exposure mask member which, when the exposure mask member is placed on the surface of the plate mold substrate, has through holes in areas corresponding to the ^" ABCDE pattern" area formed on the plate mold substrate first area surface 11 of the plate mold substrate and has light-blocking areas in the surrounding areas), and then subjected to conventional processes such as development, to form a resist hardened film.
In this case, the hardened resist film was not formed in the peripheral region of the plate mold substrate, and the hardened resist film was formed in the form of a conventional resist film covering the "ABCDE pattern" region formed by the concave-convex shape in the inner region of the plate mold substrate. In addition, in the hardened resist film formed in the inner region, the conventional resist film was not in contact with the convex portion side surface 451b of the existing multiple concave-convex portions (the concave portion side surface 452b of the existing multiple concave-convex portions) and the concave portion bottom surface 452c of the existing multiple concave-convex portions, and the conventional resist hardened film was not attached and formed.

(C) Corrosive Etching Process.
Next, an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the conventional resist hardened film had been formed, and the plate mold substrate second region surface 12 on which the conventional resist hardened film had not been attached was etched until the depth dimension "D3" reached approximately 1.0 mm, and then further etched until the depth dimension "D12a" reached approximately 1.9 mm.
As a result, the second area surface 12 of the mold substrate was etched to form a conventional second recess forming portion 121a having an etched recess shape, and the pre-formed multiple recesses 45 forming the "ABCDE pattern" were formed in a shape protruding from the conventional second recess forming portion 121a.

(C) Conventional resist hardened film removal step.
The conventional resist hardened film was then removed using a resist remover (aqueous caustic soda or aqueous sodium hydroxide solution).

In such a "corrosive etching step", the side surface 451b of the convex portion of the pre-formed multiple concave-convex portions (the side surface 452b of the pre-formed multiple concave-convex portions) on which no hardened film was attached was also corrosively etched, resulting in a side-etched side surface 451s of the pre-formed multiple concave-convex portions (a plurality of side-etched side surfaces 452s of the pre-formed multiple concave-convex portions). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex side surfaces 451s of the pre-formed multiple concave-convex portions (multiple side-etched concave side surfaces 452s of the pre-formed multiple concave-convex portions) are not the desired shape but are an undesirable shape, and when a workpiece is pressed using a pressing mold on which such side-etched concave-convex portions are formed, there is a problem that a workpiece processed into the desired concave-convex shape cannot be obtained, which is undesirable.
This side etching phenomenon occurs when a conventional resist material (having a thickness of approximately 0.02 mm to approximately 0.04 mm) is applied to the surface of a plate mold substrate on which the pre-formed multiple uneven portions 45 are formed, and gaps are generated between the multiple pre-formed multiple uneven portion convex portion side surfaces 451 b (pre-formed multiple uneven portion concave portion side surfaces 452 b) and the pre-formed multiple uneven portion concave portion bottom surfaces 452 c because the dry film resist material does not come into contact with them, and a conventional resist hardened film is not formed on the pre-formed multiple uneven portion convex portion side surfaces 451 b (pre-formed multiple uneven portion concave portion side surfaces 452 b) and the pre-formed multiple uneven portion concave portion bottom surfaces 452 c, resulting in etching of these sides and bottom surfaces.

<Comparative Example 1A-a (Processing of workpiece using the pressing plate of Comparative Example 1A)>
In this comparative example, the pressing plate 10 manufactured in the above "Comparative Example 1A" is used as the embossing plate 10 of a flat pressure processing device to emboss a paper sheet 108 as the workpiece 108.
In this comparative example, instead of the pressing plate 10 constructed in the aforementioned "Example 1A-a", the pressing plate 10 constructed in the aforementioned "Comparative Example 1A" is used, and the other configurations include the same processes as those of the aforementioned "Example 1B-a".
That is, the workpiece was embossed by the following steps.
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the preformed uneven portion 4 formed thereon, which was manufactured in Comparative Example 1A.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 having a thickness of approximately 1.5 mm was positioned as the workpiece 108 between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
As a result, a workpiece unevenness-forming portion having an uneven shape that matches the uneven shape of the existing uneven portion 4 was formed on the surface of the workpiece 108.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
In this manner, a processed product was prepared in which the paper sheet 108 as the workpiece 108 was embossed with a concave-convex shape having a graphic character pattern that matches the graphic character pattern formed in a concave-convex shape on the existing concave-convex portion 4.

In this case, disturbances were found in the graphic, letter, and picture patterns formed with the uneven shape, and the processed product did not have the desired shape and dimensional accuracy. In addition, during repeated pressing, the workpiece 108 was partially driven to separate from the pressing plate while being stuck or caught on the pressing plate.
In other words, due to the shape of the side-etched convex portion side surface 451s of the pre-formed multiple concave-convex portions (multiple side-etched concave portion side surfaces 452s of the pre-formed multiple concave-convex portions) of the pressing processing plate, a workpiece having a graphic, letter, or picture pattern with the desired shape accuracy and dimensional accuracy could not be obtained due to the shape of the side etching.

<Example 2A (Production of flexible plate/foil stamping plate as pressing processing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 6", and is a method for manufacturing a pressing plate shown in Fig. 4, in which a "heart pattern formed of fine unevenness" is formed on the surface of the protrusions protruding from the recesses. This pressing plate is used as a flexible plate or foil stamping plate that is wound around the surface of a roll and used.
In this embodiment, a conventional resist material is used to form the pre-formed multiple fine concave-convex portions 46, and then an inkjet resist material is applied to the surface of the plate mold substrate on which the pre-formed multiple fine concave-convex portions 46 are formed, followed by processes such as hardening, corrosive etching, etc. to form the inkjet resist film etched second recessed portion 121, and the pre-formed multiple fine concave-convex portions 46 are formed into the inkjet film etched pre-formed multiple fine concave-convex portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second recessed portion 121.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed fine concave and convex portions 46.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first area surface 11 having a planar surface shape and a plate mold substrate second area surface 12 having a planar surface shape. The plate mold substrate 1 is made of steel, and has a flexible, generally flat plate shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm.
Next, (i) a general-purpose conventional liquid resist material having the property of undergoing a chemical reaction when irradiated with ultraviolet light and crosslinking into a three-dimensional chemical structure (a general-purpose conventional liquid resist material that is widely used for plate making and etching of printed circuit boards, and a desired general-purpose conventional liquid resist material is selected from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material as used in step (A) of Example 1A described above) was used on a desired region of the first region surface 11 of the plate mold substrate 1, and applied to the desired region by a conventional method such as spray coating to a thickness of about 0.02 mm to about 0.04 mm, and then dried by a prescribed method to form a resist application film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member having through holes and having the desired fine graphic and letter pattern (heart pattern) formed thereon for light transmission, and the resist film in unnecessary regions was removed using a developer in a manner similar to that of Example 1A. After baking, a hardened resist film having the desired fine graphic and letter pattern (heart pattern) was formed.

A commercially available general-purpose etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film was formed, and the surface of the plate mold substrate to which the resist hardened film was not attached was etched until the depth "d1" reached 0.1 mm, thereby forming a plurality of pre-formed multiple fine unevenness concave portions 462 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple fine unevenness convex portions 461 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose resist remover (aqueous caustic soda solution).
In this way, a plurality of preformed multiple fine unevenness convex portions 461 formed in a convex shape and a plurality of preformed multiple fine unevenness concave portions 462 formed in a concave shape were formed, and in this way, a preformed multiple fine unevenness portion 46 was formed.
In addition, an explanatory diagram for forming the preformed multiple fine unevenness portion 46 having the above-mentioned preformed multiple fine unevenness portion convex portions 461 and the preformed multiple fine unevenness portion concave portions 462 formed in a concave shape is not shown in Figure 4.

That is, a substrate for a plate mold was prepared in which the second area surface 12 of the substrate for the plate mold has a non-irregular portion with no irregularities, the first area surface 11 of the substrate for the plate mold has a pre-formed irregular portion 4, the pre-formed irregular portion 4 has pre-formed multiple fine irregular portions 46, the pre-formed multiple fine irregular portions 46 have a plurality of pre-formed multiple fine irregular portion convex portions 461 formed with a plurality of convex shapes and a plurality of pre-formed multiple fine irregular portion concave portions 462 formed with a plurality of concave shapes, the plurality of pre-formed multiple fine irregular portion convex portions 461 have a plurality of pre-formed multiple fine irregular portion convex portion top surfaces 461a and a plurality of pre-formed multiple fine irregular portion convex portion side surfaces 461b, and the plurality of pre-formed multiple fine irregular portion concave portions 462 have a plurality of pre-formed multiple fine irregular portion concave portion bottom surfaces 462c and a plurality of pre-formed multiple fine irregular portion concave portion side surfaces 462b.
The plurality of preformed fine concave-convex portion side surfaces 461b and the plurality of preformed fine concave-convex portion side surfaces 462b correspond to the same side surface region.

In this manner, a preformed multiple fine concave-convex portion 46 having a plurality of preformed multiple fine concave-convex portion convex portions (461) and a plurality of preformed multiple fine concave-convex portion concave portions 462 was formed on the plate mold substrate as shown in Figure 4 (A).
The depth "d1" of each of the preformed multiple fine unevenness concaves 462 was about 0.1 mm, and the height of the preformed multiple fine unevenness convex parts (461) was about 0.1 mm, which corresponds to the depth of the preformed multiple fine unevenness concaves 462. The width "w1" of each of the preformed multiple fine unevenness concaves 462 was about 0.05 mm (50 μm), and the width "w2" of the preformed multiple fine unevenness convex parts 461 was about 0.05 mm (50 μm).
In this manner, a plate mold substrate 1 having a plurality of preformed multiple fine concave-convex portions 46 shown in the fine pattern of a "heart pattern" formed in the concave-convex shape of Figure 4 (A-b) was prepared and supplied.

(B) Step of forming a hardened inkjet resist film in a desired area.
4(B), an inkjet resist material 2 was applied by an inkjet method to form a pre-formed multiple fine unevenness inkjet resist-adhered film covering the pre-formed multiple fine unevenness portions 46 of the pre-formed multiple fine unevenness portions convex portions 461 and the pre-formed multiple fine unevenness portions concave portions 462 of the plate mold substrate 1. In this case, it was confirmed that the inkjet resist material was adhered to the pre-formed multiple fine unevenness portions convex portion top surfaces 461a, the pre-formed multiple fine unevenness portions convex portion side surfaces 461b), the pre-formed multiple fine unevenness portions concave portion side surfaces 462b, and the pre-formed multiple fine unevenness portions concave bottom surfaces 462c.
In addition, the plurality of preformed fine concave-convex upper surfaces 461a and the plurality of preformed fine concave-convex side surfaces 462b refer to the same side surfaces.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material as that used in step (B) of the above-mentioned Example 1A) having a property of chemically reacting with ultraviolet light to crosslink into a three-dimensional chemical structure and having a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected and used from among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, and was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the above-mentioned inkjet resist attached film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a hardened desired area inkjet resist fine convex upper surface hardened film 3e, desired area inkjet resist fine convex side surface hardened film 3f, and desired area inkjet resist fine concave bottom surface hardened film 3g. The thickness of each of the desired area inkjet resist hardened films was in the range of about 0.03 mm to about 0.05 mm. In this manner, the inkjet resist cured film 3 was formed in each desired area.

(C) Corrosive Etching Process.
Next, as shown in FIG. 4(C), an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g are formed, and the plate mold substrate second region surface 12 of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 is not attached is etched to a depth of about 0.3 mm, thereby forming the inkjet resist film etched second recess formation portion 121 having an etched recess shape, and also forming the previously formed multiple fine recesses 46 in the form of the inkjet film etched previously formed multiple fine recesses protruding from the inkjet resist film etched second recess formation portion 121.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 4(D), the inkjet resist hardened film 3 was removed from the desired area.
This forms an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion 466 having a pre-formed multiple fine unevenness portion 46 (heart pattern) having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462.

The depth "d1" of the existing multiple fine unevenness portion concave portion 462 was about 0.1 mm (100 μm), and the height "d1" of the existing multiple fine unevenness portion convex portion 461 was about 0.1 mm (100 μm), which corresponds to the depth "d1" of the existing multiple fine unevenness portion concave portion 462. The width "w2" of the existing multiple fine unevenness portion concave portion 462 was about 0.05 mm (about 50 μm), and the width "w1" of the existing multiple fine unevenness portion convex portion 461 was about 0.05 mm (about 50 μm).
The depth "d12" of the inkjet resist film etched second recess formation portion 121 was about 0.3 mm.

Furthermore, it was confirmed that no side etching phenomenon occurred on the side of the inkjet resist film etched second recess formation portion 121, and that the side of the inkjet resist film etched second recess formation portion 121 has a smooth, desired inclined side from the bottom surface of the inkjet resist film etched second recess formation portion 121 toward the inkjet film etched pre-formed multiple fine unevenness portion protrusion portion 466.
It was also confirmed that the side surfaces of the multiple pre-formed multiple fine unevenness concave portions 462 in Figure 4 (D) (corresponding to the side surfaces of the multiple pre-formed multiple fine unevenness convex portions 461) were not etched and maintained the normal desired shape shown in Figure 4 (A).
In this way, a "flexible embossing plate having enough flexibility to be deformed to match the spherical surface of the roll" was produced, in which multiple fine unevenness protrusions 466 formed by etching the inkjet film in a "heart pattern" with fine unevenness were formed.

In addition, in this embodiment, it was confirmed that the desired pre-formed multiple fine unevenness portions 46 were formed as normal, and the desired inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portions 466 were formed having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that the side surface 461b of the convex portion of the pre-formed multiple fine concave-convex portions (side surface 462b of the pre-formed multiple fine concave-convex portions) does not suffer from the side etching phenomenon in which the portion is etched in a recessed state, and that the desired shape accuracy and dimensional accuracy are obtained.

<Example 2B (Production of flexible plate/foil stamping plate as pressing processing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 6", and is a method for manufacturing a pressing plate shown in Fig. 4, in which a "heart pattern formed of fine unevenness" is formed on the surface of the protrusions protruding from the recesses. This pressing plate is used as a flexible plate or foil stamping plate that is wound around the surface of a roll and used.
In the above-mentioned Example 2A, the pre-formed multiple fine unevenness portions 46 are formed by a process including a step of adhering the pre-formed multiple fine unevenness portions 46 by a spray coating method using a conventional liquid resist material. Instead, this example is an example in which a substrate for a mold having pre-formed multiple fine unevenness portions 46 formed thereon is prepared by a process including a step of adhering the pre-formed multiple fine unevenness portions 46 by an inkjet method using an inkjet resist material.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed fine concave and convex portions 46.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, a length of 90 mm, is flexible, and has a substantially flat plate shape.

Next, a fine graphic and letter pattern of a "heart pattern" was applied to the surface of the plate mold substrate 1 using an inkjet resist material by the inkjet method, and the inkjet resist material was hardened to form an inkjet resist hardened film.
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material as that used in step (B) of the above-mentioned Example 1A) having a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and having a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected from among commercially available inkjet resist materials and used, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a cured inkjet resist cured film 3 having a desired heart pattern and a fine pattern design. The thickness of the inkjet resist cured film was in the range of about 0.03 mm to about 0.05 mm.

Next, an etching liquid was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist hardened film was formed, and the surface of the plate mold substrate to which the resist hardened film was not attached was etched until the depth "d1" reached approximately 0.1 mm (100 μm), thereby forming a pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462 on the plate mold substrate.

Next, the cured inkjet resist film was removed using a resist remover.
In this manner, a preformed multiple fine concave-convex portion 46 having a "heart pattern" and having multiple preformed multiple fine concave-convex portions 461 and multiple preformed multiple fine concave-convex portions 462 was formed on the mold substrate as shown in Figure 4 (A).
The depth "d1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.1 mm, and the height of the preformed multiple fine unevenness portion convex parts 461 was about 0.1 mm corresponding to the depth of the preformed multiple fine unevenness portion concaves 462. The width "w1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.05 mm (about 50 μm), and the width "w2" of the preformed multiple fine unevenness portion convex parts 461 was about 0.05 (about 50 μm).

(B) Step of forming a hardened inkjet resist film in a desired area.
4B, the inkjet resist material 2 was applied by an inkjet method to form a pre-formed multiple fine unevenness inkjet resist applied film by covering the pre-formed multiple fine unevenness portions 46 of the pre-formed multiple fine unevenness portions convex portions 461 and the pre-formed multiple fine unevenness portions concave portions 462 of the plate mold substrate 1. In this case, it was confirmed that the inkjet resist material was applied to the pre-formed multiple fine unevenness portions convex portion top surfaces 461a, the pre-formed multiple fine unevenness portions convex portion side surfaces 461b, the pre-formed multiple fine unevenness portions concave portion side surfaces 462b, and the pre-formed multiple fine unevenness portions concave bottom surfaces 462c.
In addition, the multiple convex portion side surfaces 461b of the preformed multiple fine concave-convex portions and the multiple concave portion side surfaces 462b of the preformed multiple fine concave-convex portions refer to the same region.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material as used in the step (B) of the above-mentioned Example 1A and the step (A) of this embodiment) that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected from among commercially available inkjet resist materials and used, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, by a method similar to the step (B) of the above-mentioned Example 1A, the inkjet resist adhesion film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a hardened desired area inkjet resist fine convex upper surface hardened film 3e, desired area inkjet resist fine convex side surface hardened film 3f, and desired area inkjet resist fine concave bottom surface hardened film 3g. The thickness of each of the desired area inkjet resist cured films was in the range of about 0.03 mm to about 0.05 mm. In this manner, each of the desired area inkjet resist cured films 3 was formed.

(C) Corrosive Etching Process.
Next, as shown in FIG. 4(C), an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g are formed, and the plate mold substrate second region surface 12 of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 is not attached is etched to a depth of about 0.3 mm, thereby forming the inkjet resist film etched second recess formation portion 121 having an etched recess shape, and also forming the previously formed multiple fine recesses 46 in the form of the inkjet film etched previously formed multiple fine recesses protruding from the inkjet resist film etched second recess formation portion 121.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 4(D), the inkjet resist hardened film 3 was removed from the desired area.
This forms an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-formed multiple fine unevenness protrusion portion 466 having a pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462.

The depth "d1" of the existing multiple fine unevenness portion concave portion 462 was about 0.1 mm (100 μm), and the height "d1" of the existing multiple fine unevenness portion convex portion 461 was about 0.1 mm (about 100 μm), which corresponds to the depth "d1" of the existing multiple fine unevenness portion concave portion 462. The width "w2" of the existing multiple fine unevenness portion concave portion 462 was about 0.05 mm (about 50 μm), and the width "w1" of the existing multiple fine unevenness portion convex portion 461 was about 50 μm.
The depth "d12" of the inkjet resist film etched second recess formation portion 121 was about 0.3 mm.

Furthermore, it was confirmed that no side etching phenomenon occurred on the side of the inkjet resist film etched second recess formation portion 121, and that the side of the inkjet resist film etched second recess formation portion 121 has a smooth, desired inclined side from the bottom surface of the inkjet resist film etched second recess formation portion 121 toward the inkjet film etched pre-formed multiple fine unevenness portion protrusion portion 466.
It was also confirmed that the side surfaces of the multiple pre-formed multiple fine unevenness concave portions 462 in Figure 4 (D) (corresponding to the side surfaces of the multiple pre-formed multiple fine unevenness convex portions 461) were not etched and maintained the normal desired shape shown in Figure 4 (A).
In this way, a "flexible embossing plate having enough flexibility to be deformed to match the spherical surface of the roll" was produced, in which multiple fine unevenness protrusions 466 formed by etching the inkjet film in a "heart pattern" with fine unevenness were formed.

In addition, in this embodiment, it was confirmed that the desired pre-formed multiple fine unevenness portions 46 were formed as normal, and the desired inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portions 466 were formed having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that the side surface 461b of the convex portion of the pre-formed multiple fine concave-convex portion (side surface 462b of the pre-formed multiple fine concave-convex portion) does not suffer from the side etching phenomenon in which the portion is etched in a recessed state, and that the desired shape accuracy and dimensional accuracy are obtained.

<Example 2B-a (Processing of a workpiece using the pressing plate of Example 2B installed in a roll device)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned embodiment 2B is placed in a roll-type processing device and used as the foil stamping plate 10 for foil stamping.
The workpiece was stamped using the following process.
(Sa) A foil stamping plate 10 was prepared as a pressing plate 10 having a plurality of preformed fine concave-convex portions 46 formed thereon as the preformed concave-convex portion 4 produced in Example 2B and was supplied.
(Sb) A pressing device having a main roll 96 and a counter roll 97 facing each other was prepared.
(Sc) A foil stamping plate as the pressing plate 10 was wrapped around the main roll 96. In this case, a magnetic member that generates a magnetic force is configured inside the main roll 96, and the foil stamping plate 10 as the flexible pressing plate 10 is wrapped around the main roll 96 by the magnetic force.
(Sd) A predetermined receiving plate 94 was placed on the paired roll 97 of the pressing device.
In this embodiment, as the counter roll 97, a separately prepared stainless steel anvil roll 97 having a smooth spherical surface was prepared and installed.
(S-e) The main roll 96 and the counter roll 97 were driven, and the workpieces, which were a 1 mm thick paper sheet serving as the workpiece substrate 108a and a thin gold sheet-like foil material 108b having a thickness of approximately 30 μm, were continuously supplied between the main roll 96 and the counter roll 97 in a mutually parallel state, and the pressing plate 10 and the receiving plate 94 were rotated to continuously press the workpieces.
This resulted in a sheet-like foil material having a fine uneven shape that matches the uneven shape of the pre-formed multiple fine uneven portions 46 as the pre-formed uneven portion 4 being transferred onto the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation portion.
(Sf) As the rolls rotated, the workpiece was separated from between the main roll 96 and the counter roll 97, and the pressure on the workpiece was released.
This resulted in the preparation of a workpiece having a workpiece transfer formation portion formed on the surface of the workpiece 108 in a form having a fine uneven shape that matches the uneven shape of the pre-formed multiple fine uneven portions 46 as the pre-formed uneven portion 4.
In this manner, a workpiece was prepared in which the metal foil having a heart pattern and a plurality of fine concave-convex patterns was transferred onto the surface of the paper sheet 108a serving as the workpiece 108.

In this case, no abnormalities occurred in the paper sheet 108a and metal foil sheet 108b serving as the workpiece 108, and a workpiece was obtained in which the paper sheet 108a serving as the workpiece 108 was in a normal state, with multiple fine uneven patterns formed by transferring the metal foil and having the desired shape and dimensional accuracy.

Comparative Example 2A (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a manufacturing method of a pressing plate in which a conventional liquid resist material is used instead of the inkjet resist material in step (B) of Example 2A described above to form the inkjet resist film etched second recess forming portion 121.
Schematic diagrams for explaining the manufacturing process of this comparative example are shown in Figures 14 and 15. Figures 14 and 15 are schematic diagrams for explaining the manufacturing process of a conventional method for producing a pressing plate.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed concave and convex portions 46.
14(A) and (B), a plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first area surface 11 having a planar surface shape and a plate mold substrate second area surface 12 having a planar surface shape. The plate mold substrate 1 is made of steel, and has a generally flat plate shape with a thickness "h" of 0.5 mm, a width of 125 mm, and a length of 90 mm.
Next, in the same manner as in step (A) of Example 2A, a conventional liquid resist material (a conventional liquid resist material which has the property of undergoing a chemical reaction upon exposure to ultraviolet light and crosslinking into a three-dimensional chemical structure and is widely used for plate making and etching of printed circuit boards, and which is a desired conventional liquid resist material selected from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material as that used in step (A) of Example 1A described above) was applied to the surface of the plate mold substrate 1 including the first region surface 11 of the plate mold substrate 1 by a conventional spray coating method to a thickness in the range of about 0.02 mm to about 0.04 mm, and then dried in a prescribed manner to form a resist deposition film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member on which the desired fine graphic and letter pattern (heart pattern) for light blocking was formed, and a hardened resist film having the desired fine graphic and letter pattern (heart pattern) was formed by developing, after-baking, developing, etc.

An etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film was formed, and the surface of the plate mold substrate on which the resist hardened film was not attached was etched until the depth "d1" reached approximately 0.1 mm (100 μm), thereby forming a plurality of pre-formed multiple fine unevenness concave portions 462 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple fine unevenness convex portions 461 formed in a convex shape.
Next, the hardened resist film was removed using a resist remover (aqueous caustic soda solution).
In this manner, as shown in FIG. 14(B), a plurality of preformed multiple fine unevenness convex portions 461 formed in a convex shape and a plurality of preformed multiple fine unevenness concave portions 462 formed in a concave shape were formed.

In this way, a plate mold substrate was prepared in which the second area surface 12 of the plate mold substrate has a non-irregular portion with no irregularities, the first area surface 11 of the plate mold substrate has a pre-formed irregular portion 4, the pre-formed irregular portion 4 has pre-formed multiple fine irregular portions 46, the pre-formed multiple fine irregular portions 46 have a plurality of pre-formed multiple fine irregular portion convex portions 461 formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine irregular portion concave portions 462 formed with a plurality of fine concave shapes, the plurality of pre-formed multiple fine irregular portion convex portions 461 have a plurality of pre-formed multiple fine irregular portion convex portion top surfaces 461a and a plurality of pre-formed multiple fine irregular portion convex portion side surfaces 461b, and the plurality of pre-formed multiple fine irregular portion concave portions 462 have a plurality of pre-formed multiple fine irregular portion concave portion bottom surfaces 462c and a plurality of pre-formed multiple fine irregular portion concave portion side surfaces 462b.
In addition, the multiple convex portion side surfaces 461b of the preformed multiple fine concave-convex portions and the multiple concave portions 462 of the preformed multiple fine concave-convex portions are the same side surface area and refer to the same side surface.
The material and shape of the plate mold substrate are the same as those of Example 2A, that is, it is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, a length of 90 mm, is flexible, and has a substantially flat plate shape.
Further, the depth "d1" of each of the existing multiple fine unevenness portion concaves 462 was about 0.1 mm (about 100 μm), and the height "d1" of the existing multiple fine unevenness portion convex parts 461 was about 0.1 mm (about 100 μm) corresponding to the depth of the existing multiple fine unevenness portion concaves 462. The width "w1" of each of the existing multiple fine unevenness portion concaves 462 was about 0.05 mm (about 50 μm), and the width "w2" of the existing multiple fine unevenness portion convex parts 461 was about 0.05 mm (about 50 μm).

(B) A conventional resist hardened film forming process.
As shown in (C) of Figure 14, the multiple pre-formed multiple fine concave-convex portion convex upper surfaces 461a, the multiple pre-formed multiple fine concave-convex portion convex side surfaces 461b, the multiple pre-formed multiple fine concave-convex portion concave bottom surfaces 462c, and the multiple pre-formed multiple fine concave-convex portion concave side surfaces 462b were covered on the surface of the plate mold substrate 1, and a conventional liquid resist material (a conventional liquid resist material which has the property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and is generally used for plate making and corrosive etching of printed circuit boards, and which is a desired conventional liquid resist material from among commercially available general-purpose conventional liquid resist materials, the same conventional liquid resist material as that used in the above step (A) of this Example 2A) was used to adhere the liquid resist adhesion film by a conventional conventional spray coating method.

Thereafter, the liquid resist film was cured by conventional methods such as ultraviolet light exposure, development, and after-baking through a desired shape of exposure mask member (an exposure mask member having a through hole in the portion corresponding to the "heart pattern" region formed on the first region surface 11 of the plate mold substrate when the exposure mask member is placed on the surface of the plate mold substrate and having a light blocking portion in the surrounding region) to form a conventional resist cured film 30 that forms a conventional resist fine convex upper surface cured film 30e and a conventional resist fine concave bottom surface cured film 30g as shown in FIG. 14(C). However, the conventional resist material that was attached to the existing multiple fine concave convex portion convex portion side surface 461b (existing multiple fine concave convex portion concave side surface 462b) flowed down to the bottom surface of the existing multiple fine concave convex portion concave, and a conventional resist fine concave side surface cured film (conventional resist fine convex side surface cured film) was not formed.
The thickness of the conventional resist hardened film 30 ranged from about 0.02 mm to about 0.04 mm.

In this step, a cured resist film was formed in such a manner that no cured resist film was formed in the peripheral region of the plate mold substrate, and a conventional cured resist film was formed in the inner region.
Furthermore, in the internal region, the conventional liquid resist material was well adhered to the convex portion upper surfaces 461a of the preformed multiple fine unevenness portions and the concave portion bottom surfaces 462c of the preformed multiple fine unevenness portions, and well formed the conventional resist fine convex portion upper surface hardened film 30e and the conventional resist fine concave portion bottom surface hardened film 30g which were hardened in the desired region; however, the conventional liquid resist material flowed down from the convex portion side surfaces 461b of the preformed multiple fine unevenness portions (convex portion side surfaces 462b of the preformed multiple fine unevenness portions), and the conventional resist hardened film was not formed on the convex portion side surfaces 461b of the preformed multiple fine unevenness portions (convex portion side surfaces 462b of the preformed multiple fine unevenness portions).

(C) Corrosive Etching Process.
As shown in Fig. 15(D), an etching solution (aqueous ferric chloride solution) was applied to the surface of the plate mold substrate 1 on which the conventional resist fine convex upper surface hardened film 30e and the conventional resist fine concave bottom surface hardened film 30g were formed, and the plate mold substrate second region surface 12 on which the conventional resist hardened film was not attached was etched until the depth dimension "d3" was about 0.1 mm, forming the etching second concave forming portion 121b. In this case, slight side etching was generated on the side surface 461b of the convex portion of the existing fine concave portion (side surface 462b of the existing fine concave portion).

As shown in FIG. 15(E), the etching was continued further to etch the second region surface 12 of the plate mold substrate until the depth dimension "d12a" became about 0.3 mm.
As a result, the second area surface 12 of the mold substrate is etched to form a conventional corroded second recess formation portion 121s having an etched recess shape, and the pre-formed multiple fine recess and protrusion portions 46 are formed in a shape protruding from the conventional corroded second recess formation portion 121s.

(D) Conventional resist hardened film removal step.
As shown in FIG. 15F, the conventional resist fine convex upper surface hardened film 30e and the conventional resist fine concave bottom surface hardened film 30g were removed using a resist remover (caustic soda solution or sodium hydroxide solution).

In the above-mentioned "(C) corrosion etching step", the side surface 461b of the convex portion of the already-formed multiple fine concave-convex portions (side surface 462b of the already-formed multiple fine concave-convex portions) on which no cured film was attached was also corroded and etched, resulting in the side-etched side surface 461s of the already-formed multiple fine concave-convex portions (side-etched side surfaces 462s of the already-formed multiple fine concave-convex portions) as shown in Fig. 15(D). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex portion side surfaces 461s of pre-formed multiple fine concave-convex portions (multiple side-etched concave-convex portion side surfaces 462s of pre-formed multiple fine concave-convex portions) do not have the desired shape precision or dimensional precision, and are undesirable shapes. When a workpiece is processed using a pressing mold on which such side-etched fine concave-convex portions are formed, there is a problem that a workpiece processed into the desired concave-convex shape cannot be obtained, which is undesirable.
In addition, side etching refers to a shape in which the convex side surface 461b of the existing multiple fine unevenness portion or the concave side surface 462b of the existing multiple fine unevenness portion is etched in a recessed state toward the inner surface of the side surface, and this shape is not preferable for a pressing processing plate.

<Comparative Example 2Ab (Production of a pressing plate using a conventional dry film resist material)>
Another comparative example to Example 2A above is described below.
This comparative example is a method for manufacturing a plate for pressing processing using a conventional liquid resist material in the same process as step (A) of Example 2A above, and using a plate mold substrate 1 having a plate mold substrate second area surface 12 having a non-irregular portion with no irregularities and a plate mold substrate first area surface 11 having pre-formed multiple fine irregularities 46 as pre-formed irregularities 4, and then, in step (B), using a conventional dry film resist material instead of the inkjet resist material.
The diagrams illustrating this comparative example are shown in (B) to (F) of FIG.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed minute concave and convex portions 46.
Using the same method as process (A) of Example 2A described above, a plate mold substrate was prepared in which the second region surface 12 of the plate mold substrate has a non-relief portion with no recesses or projections, the first region surface 11 of the plate mold substrate has a pre-formed recessed portion 4, the pre-formed recessed portion 4 has pre-formed multiple fine recessed portions 46, (b) the pre-formed multiple fine recessed portions 46 have a plurality of pre-formed multiple fine recessed portion convex portions 461 formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine recessed portion concave portions 462 formed with a plurality of fine concave shapes, the plurality of pre-formed multiple fine recessed portion convex portions 461 have a plurality of pre-formed multiple fine recessed portion convex portion top surfaces 461a and a plurality of pre-formed multiple fine recessed portion convex portion side surfaces 461b, and the plurality of pre-formed multiple fine recessed portion concave portions 462 have a plurality of pre-formed multiple fine recessed portion concave bottom surfaces 462c and a plurality of pre-formed multiple fine recessed portion concave side surfaces 462b.
The material and shape of the plate mold substrate are the same as those of Example 2A, that is, it is made of steel and has a flexible, generally flat plate shape with a thickness of 0.5 mm, a width of 125 mm and a length of 90 mm.
Further, the depth "d1" of the preformed multiple fine concave-convex portion concave 462 was about 0.1 mm (about 100 μm), and the height "d1" of the preformed multiple fine concave-convex portion convex 461 was about 0.1 mm (about 100 μm), which corresponds to the depth of the preformed multiple fine concave-convex portion concave 462. The width "w1" of each preformed multiple fine concave-convex portion concave 462 was about 0.05 mm (about 50 μm), and the width "w2" of each preformed multiple fine concave-convex portion convex 461 was about 0.05 mm (about 50 μm). In this manner, a plate mold substrate as shown in FIG. 21(A) was prepared and prepared.
In addition, in Figure 21 (A), the symbols 461a, 461b, 462c, and 462b are not shown, but are similar to the symbols shown in Figure 14 (B), and the multiple pre-formed multiple fine unevenness portion convex portions 461 have multiple pre-formed multiple fine unevenness portion convex portion top surfaces 461a and multiple pre-formed multiple fine unevenness portion convex portion side surfaces 461b, and the multiple pre-formed multiple fine unevenness portion concave portions 462 have multiple pre-formed multiple fine unevenness portion concave portion bottom surfaces 462c and multiple pre-formed multiple fine unevenness portion concave portion side surfaces 462b.

(B) Conventional resist hardened film forming step.
21(B), a conventional dry film resist material 20 (having a thickness of about 0.02 mm to about 0.04 mm) was attached by a conventional method to the surface of the plate-form substrate on which the preformed multiple fine concave-convex portions 46 were formed. As the conventional dry film resist material 20, a sheet-form dry film resist material (having a thickness of about 0.02 mm to about 0.04 mm) was selected from among conventional sheet-form dry film resist materials available on the market.
In this case, gaps were generated between the multiple pre-formed multiple fine unevenness convex portion side surfaces 461b (pre-formed multiple fine unevenness concave portion side surfaces 462b) and the pre-formed multiple fine unevenness concave portion bottom surfaces 462c of the pre-formed multiple fine unevenness portions 46 formed on the mold substrate, without the conventional dry film resist material coming into contact with them.
Next, as shown in Figure 21 (C), the plate mold substrate with the conventional dry film resist material attached was irradiated with ultraviolet light through an exposure mask member (an exposure mask member which, when the exposure mask member is placed on the surface of the plate mold substrate, has a through hole in a portion corresponding to the "heart pattern" area formed on the plate mold substrate first area surface 11 of the plate mold substrate and has a light-blocking portion in the surrounding area), and subjected to conventional processes such as development to form a resist hardened film.
In this case, the hardened resist film was not formed in the peripheral region of the plate mold substrate, and the hardened resist film was formed in the form of having a conventional hardened resist film in the inner region. Also, the conventional hardened resist film was not formed on the side surface 461b of the convex portion of the existing multiple fine concave-convex portions (side surface 462b of the existing multiple fine concave-convex portions) and the bottom surface 462c of the concave portion of the existing multiple fine concave-convex portions.

(C) Corrosive Etching Process.
Next, as shown in FIG. 21(D), an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the mold substrate 1 on which the conventional resist hardened film had been formed, and the mold substrate second region surface 12 on which the conventional resist hardened film had not been attached was etched until the depth dimension "d3" reached approximately 0.1 mm, thereby forming a second recessed portion 121b that had been etched in the middle of the etching process.
In this case, slight side etching occurred on the convex portion side surface 461b of the existing multiple fine unevenness portions (concave portion side surface 462b of the existing multiple fine unevenness portions), and furthermore, the concave portion bottom surface 462c of the existing multiple fine unevenness portions was also corroded and etched.

Furthermore, as shown in FIG. 21(E), the etching was continued to etch the second region surface 12 of the plate mold substrate until the depth dimension "d12a" became about 0.3 mm.
As a result, the second area surface 12 of the mold substrate is etched to form a conventional corroded second recess formation portion 121s having an etched recess shape, and the pre-formed multiple fine recess and protrusion portions 46 are formed in a shape protruding from the conventional corroded second recess formation portion 121s.

(D) Conventional resist hardened film removal step.
Next, as shown in FIG. 21(F), the conventional resist hardened film was removed using a resist remover (aqueous caustic soda solution or aqueous sodium hydroxide solution).

In the above-mentioned "corrosive etching step", the side surface 461b of the convex portion of the already-formed multiple fine concave-convex portions (the side surface 462b of the already-formed multiple fine concave-convex portions) on which the cured film was not attached was also corrosively etched, resulting in the side-etched side surface 461s of the already-formed multiple fine concave-convex portions (the side-etched side surfaces 462s of the already-formed multiple fine concave-convex portions). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex side surfaces 461s of pre-formed multiple fine concave-convex portions (multiple side-etched concave side surfaces 462s of pre-formed multiple fine concave-convex portions) are not the desired shape but are an undesirable shape, and when a workpiece is processed using a pressing mold on which such side-etched fine concave-convex portions are formed, there is a problem that a workpiece processed into the desired concave-convex shape cannot be obtained, which is undesirable.
This side etching phenomenon occurs when a conventional, conventional dry film resist material is applied to the surface of a plate mold substrate on which the pre-formed multiple fine unevenness portions 46 are formed, and gaps are generated between the pre-formed multiple fine unevenness portion convex portion side surfaces 461b (pre-formed multiple fine unevenness portion concave portion side surfaces 462b) and the pre-formed multiple fine unevenness portion concave portion bottom surfaces 462c without the conventional dry film resist material coming into contact with each other, and a conventional resist hardened film is not formed on the pre-formed multiple fine unevenness portion convex portion side surfaces 461b (pre-formed multiple fine unevenness portion concave portion side surfaces 462b) and the pre-formed multiple fine unevenness portion concave portion bottom surfaces 462c, resulting in etching of these side surfaces and bottom surfaces.

<Comparative Example 2A-a (Processing of a workpiece using the pressing plate of Comparative Example 2A installed in a roll device)>
In this comparative example, the pressing plate 10 manufactured in the above comparative example 2A is placed in a roll-type processing device and used as the foil stamping plate 10 for foil stamping.
The workpiece was stamped using the following process.
(Sa) A foil stamping plate 10 was prepared as a pressing plate 10 having a plurality of preformed fine concave-convex portions 46 formed thereon as the preformed concave-convex portion 4 produced in Comparative Example 2A and was supplied.
(Sb) A pressing device having a main roll 96 and a counter roll 97 facing each other was prepared.
(Sc) A foil stamping plate serving as the pressing plate 10 was wound around the periphery of a main roll 96 having a magnetic surface.
(Sd) A predetermined receiving plate 94 was placed on the paired roll 97 of the pressing device.
In this embodiment, as the counter roll 97, a separately prepared stainless steel anvil roll 97 having a smooth spherical surface was prepared and installed.
(S-e) The main roll 96 and the counter roll 97 were driven, and the workpieces 108, consisting of a 1 mm thick paper sheet as the workpiece substrate 108a and a thin gold sheet-like foil material 108b having a thickness of approximately 30 μm, were continuously supplied between the main roll 96 and the counter roll 97 in a mutually parallel state, and the workpieces were continuously pressed while the pressing plate 10 and the receiving plate 94 were rotating.
This resulted in a sheet-like foil material having a fine uneven shape that matches the uneven shape of the pre-formed multiple fine uneven portions 46 as the pre-formed uneven portion 4 being transferred onto the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation portion.
(Sf) As the rolls rotated, the workpiece was separated from between the main roll 96 and the counter roll 97, and the pressure on the workpiece was released.
This resulted in the preparation of a workpiece having a workpiece transfer formation portion formed on the surface of the workpiece 108 in a form having a fine uneven shape that matches the uneven shape of the pre-formed multiple fine uneven portions 46 as the pre-formed uneven portion 4.
In this manner, a workpiece was prepared in which the metal foil having a heart pattern and a plurality of fine concave-convex patterns was transferred onto the surface of the paper sheet 108a serving as the workpiece 108.

That is, using the stamping plate as the pressing plate produced in Comparative Example 2A, stamping was performed by a processing method similar to that of Example 2A described above.

In this case, disturbances were found in the fine graphic pattern formed by the fine concave-convex shape, and the processed product could not have the desired shape accuracy and dimensional accuracy. In addition, during repeated pressing, the paper sheet and the sheet-like foil material 108b were partially driven to separate from the pressing plate while being stuck or caught on the pressing plate.
In other words, due to the shape of the side-etched pre-formed multiple fine unevenness convex portion side surface 461s (multiple side-etched pre-formed multiple fine unevenness concave portion side surfaces 462s) of the pressing processing plate, a workpiece having a fine graphic, letter, and pattern with the desired shape accuracy and dimensional accuracy could not be obtained due to the shape of the side etching.

<Example 3A (Production of a foil stamping plate as a pressing processing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 8", and is a method for manufacturing a pressing plate shown in Fig. 9 (A-a), Fig. 9 (B-a), (B-b), (B-c), and Fig. 9 (C), in which "a fine graphic character pattern formed by a combination of multiple types of concave-convex pattern cells engraved with fine concave-convex shapes, partitioned into predetermined shapes, and arranged with regularity" is formed on the surface of the convex parts protruding from the concave parts. This pressing plate is used as a foil stamping mold plate or an embossing plate.
In this embodiment, the pre-formed multiple fine concave-convex portions 46 are formed by a process including a process using an inkjet resist material, and then the inkjet resist film etched second recessed formation portion 121 is formed by a process including a process using an inkjet resist material, and the pre-formed multiple fine concave-convex portions 46 are formed into the inkjet film etched pre-formed multiple fine concave-convex portion protrusions 466 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second recessed formation portion 121.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed fine concave and convex portions 46.
A plate mold substrate 1 having a planar surface shape was prepared and supplied, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of copper and has a substantially flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, an inkjet resist material was applied to the surface of the mold substrate 1 by an inkjet method to form an inkjet resist applied film, which was then cured to form an inkjet resist cured film. In this way, an inkjet resist cured film formed with a fine concave-convex shape as shown in Fig. 9(C) was formed.
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials, the same inkjet resist material used in the step (B) of the above-mentioned Example 1A was selected from among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, and that have the property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure, and an inkjet resist material with a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected for use, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed for 10 minutes at 120°C to form a cured inkjet resist cured film 3 having a fine pattern design. The thickness of the inkjet resist cured film was in the range of about 0.03 mm to about 0.05 mm.
A commercially available conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist cured film had been formed, and the surface of the plate mold substrate on which the resist cured film had not been attached was etched until the depth "d1" reached 0.1 mm, thereby forming a plurality of pre-formed multiple fine concave-convex portions 462 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple fine concave-convex portions 461 formed in a convex shape.

Next, the hardened resist film was removed using a commercially available conventional resist remover (aqueous caustic soda solution).
In this manner, a plurality of preformed multiple fine concave-convex portions 461 formed in a convex shape and a plurality of preformed multiple fine concave-convex portions 462 formed in a concave shape were formed.

That is, the second region surface 12 of the plate mold substrate has a non-relief portion without any irregularities, and the first region surface 11 of the plate mold substrate has a pre-formed irregularity portion 4, and the pre-formed irregularity portion 4 has a pre-formed multiple fine irregularity portions 46 formed in a fine irregularity shape as shown in Fig. 9(C). The pre-formed multiple fine irregularity portions 46 have a plurality of pre-formed multiple fine irregularity portion convex portions 461 formed in a plurality of convex shapes and a plurality of pre-formed multiple fine irregularity portion concave portions 462 formed in a plurality of concave shapes, the plurality of pre-formed multiple fine irregularity portion convex portions 461 have a plurality of pre-formed multiple fine irregularity portion convex portion upper surfaces 461a and a plurality of pre-formed multiple fine irregularity portion convex portion side surfaces 461b, and the plurality of pre-formed multiple fine irregularity portion concave portions 462 have a plurality of pre-formed multiple fine irregularity portion concave portion bottom surfaces 462c and a plurality of pre-formed multiple fine irregularity portion concave portion side surfaces 462b.
A plate-form substrate having a plurality of preformed minute concave-convex portions 46 formed in a minute concave-convex shape as shown in FIG. 9(C) was prepared.
The plurality of preformed fine concave-convex portion side surfaces 461b and the plurality of preformed fine concave-convex portion side surfaces 462b correspond to the same side surface region.
In addition, in Figure 9, the respective symbols of the multiple pre-formed multiple fine unevenness portions convex portions 461, the multiple pre-formed multiple fine unevenness portions concave portions 462, the multiple pre-formed multiple fine unevenness portions convex portion top surfaces 461a, the multiple pre-formed multiple fine unevenness portions convex portion side surfaces 461b, the multiple pre-formed multiple fine unevenness portions concave portion bottom surfaces 462c, and the multiple pre-formed multiple fine unevenness portions concave portion side surfaces 462b are not shown, but each symbol is similar to the symbols shown in Figure 4.

In this manner, a preformed multiple fine unevenness portion 46 having a plurality of preformed multiple fine unevenness portion convex portions 461 and a plurality of preformed multiple fine unevenness portion concave portions 462 was formed on the plate mold substrate as shown in Figure 9 (C).
The depth "d1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.1 mm, and the height of the preformed multiple fine unevenness portion convex parts 461 was about 0.1 mm corresponding to the depth of the preformed multiple fine unevenness portion concaves 462. The width "w1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.05 mm (about 50 μm), and the width "w2" of the preformed multiple fine unevenness portion convex parts 461 was about 0.05 mm (about 50 μm).
In this manner, the plate mold substrate 1 having a plurality of preformed fine concave-convex portions 46 was prepared and supplied.

(B) Inkjet resist hardened film formation step for forming an inkjet resist hardened film 3 in a desired area.
Using the plate mold substrate 1 having the plurality of pre-formed multiple fine concave-convex portions 46 prepared as described above, the inkjet resist material 2 was adhered by an inkjet method to form a pre-formed multiple fine concave-convex portion inkjet resist adhered film covering the pre-formed multiple fine concave-convex portions 46 of the plate mold substrate 1, which are the plurality of pre-formed multiple fine concave-convex portion convex portions 461 and the plurality of pre-formed multiple fine concave-convex portion concave portions 462. In this case, it was confirmed that the inkjet resist material was adhered to the plurality of pre-formed multiple fine concave-convex portion convex portion top surfaces 461a, the plurality of pre-formed multiple fine concave-convex portion convex portion side surfaces 461b), the plurality of pre-formed multiple fine concave-convex portion concave portion side surfaces 462b, and the plurality of pre-formed multiple fine concave-convex portion concave bottom surfaces 462c.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, the inkjet resist material used in the above-mentioned step (B) of Example 1A (the same inkjet resist material used in (A) of this Example 3) was selected and used, which has the property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C), and was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the above-mentioned inkjet resist adhesion film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form the hardened desired area inkjet resist fine convex upper surface cured film 3e, desired area inkjet resist fine convex side surface cured film 3f, and desired area inkjet resist fine concave bottom surface cured film 3g. The thickness of each of the desired area inkjet resist cured films was in the range of 0.03 mm to 0.05 mm. In this manner, each of the desired area inkjet resist cured films 3 was formed.

(C) A step of etching the plate mold substrate, which etches the second region surface 12 of the plate mold substrate to which the desired region inkjet resist cured film 3 is not attached.
Next, an etching liquid is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g are formed, and the plate mold substrate second region surface 12 of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 is not attached is etched to a depth of approximately 1.9 mm, thereby forming an inkjet resist film etched second recess formation portion 121 having an etched recess shape, and also forming an inkjet film etched pre-formed multiple fine recess protrusion portion 466 in which the pre-formed multiple fine recesses 46 protrude from the inkjet resist film etched second recess formation portion 121.

(D) Step of removing the hardened inkjet resist film from the desired area.
The inkjet resist cured film 3 was removed from the desired area.
This forms an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-formed multiple fine unevenness protrusion portion 466 having a pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462.

The depth "d1" of the existing multiple fine unevenness portion concave portion 462 was about 0.1 mm (100 μm), and the height "d1" of the existing multiple fine unevenness portion convex portion 461 was about 0.1 mm (100 μm), which corresponds to the depth "d1" of the existing multiple fine unevenness portion concave portion 462. The width "w2" of the existing multiple fine unevenness portion concave portion 462 was about 0.05 mm (50 μm), and the width "w1" of the existing multiple fine unevenness portion convex portion 461 was about 0.05 mm (about 50 μm).
The depth "d12" of the inkjet resist film etched second recess formation portion 121 was about 1.9 mm.

Furthermore, it was confirmed that no side etching phenomenon occurred on the side of the inkjet resist film etched second recess formation portion 121, and that the side of the inkjet resist film etched second recess formation portion 121 has a smooth, desired inclined side from the bottom surface of the inkjet resist film etched second recess formation portion 121 toward the inkjet film etched pre-formed multiple fine unevenness portion protrusion portion 466.
It was also confirmed that the side surfaces of the multiple preformed multiple fine unevenness concave portions 462 (corresponding to the side surfaces of the multiple preformed multiple fine unevenness convex portions 461) were not etched and maintained the normal desired shape.
In this manner, a foil stamping plate was produced having preformed multiple fine uneven portions 46a, 46b, 46c as shown in Figure 9(C), with each of the preformed multiple fine uneven portions 46a, 46b, 46c forming preformed multiple fine uneven portions as shown in Figures 9(D-a), (D-b), and (D-c).

In addition, in this embodiment, it was confirmed that the pre-formed multiple fine unevenness portions 46 have the normal desired shape accuracy and dimensional accuracy, and the desired inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion 466 has a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Furthermore, it was confirmed that the side surface 461b of the convex portion of the pre-formed multiple fine concave-convex portions (side surface 462b of the pre-formed multiple fine concave-convex portions) does not suffer from the side etching phenomenon in which the portion is etched in a recessed state, and that the desired shape accuracy and dimensional accuracy are obtained.

<Example 3B (Production of a foil stamping plate as a pressing processing plate)>
This embodiment includes a process for forming the "pre-formed multiple fine uneven portions 46" in the "manufacturing of a foil stamping plate as a plate for pressing processing" of the above-mentioned Example 3A using a process that uses an inkjet resist material, instead of the process for forming the "pre-formed multiple fine uneven portions 46" using an inkjet resist material, and includes a process for forming the "pre-formed multiple fine uneven portions 46" using a process that uses a conventional conventional sheet-like dry film resist material, and the other processes are similar to those of the above-mentioned Example 3A.
That is, this embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 8", and is a method for manufacturing a pressing plate as shown in Fig. 9 (A-a), Fig. 9 (B-a), (B-b), (B-c), and Fig. 9 (C), in which "a fine graphic character pattern formed by a combination of multiple types of concave-convex pattern cells engraved with fine concave-convex shapes, partitioned into predetermined shapes, and arranged with regularity" is formed on the surface of the convex parts protruding from the concave parts. This pressing plate is used as a foil stamping mold plate or an embossing plate.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed fine concave and convex portions 46.
A plate mold substrate 1 having a planar surface shape was prepared and supplied, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of copper and has a substantially flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, a conventional sheet-like dry film resist material was attached to the surface of the mold substrate 1. As the conventional sheet-like dry film resist material, a sheet-like dry film resist material having a thickness of about 0.02 mm to about 0.04 mm was selected from commercially available sheet-like dry film resist materials and used.
This sheet-like dry film resist material was attached to the plate substrate, and the dry film resist material was irradiated with ultraviolet light through an exposure mask member having through holes and a desired fine graphic, letter, and picture pattern for light transmission. The resist film in unnecessary areas was removed using a commercially available conventional developer, and after-baking was performed to form a hardened resist film having a fine graphic, letter, and picture pattern as shown in Figure 9 (C).
A commercially available conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film had been formed, and the surface of the plate mold substrate on which the resist hardened film had not been attached was etched until the depth "d1" reached 0.1 mm, thereby forming a plurality of pre-formed multiple fine unevenness concave portions 462 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple fine unevenness convex portions 461 formed in a convex shape.
Next, the hardened resist film was removed using a resist remover (aqueous caustic soda solution).
In this manner, a plurality of preformed multiple fine unevenness convex portions 461 formed in an uneven shape and a plurality of preformed multiple fine unevenness concave portions 462 formed in a concave shape were formed by chemical corrosive etching processing using a resist hardened film formed using a conventional sheet-like dry film resist material as a corrosive etching mask.

That is, the second region surface 12 of the plate mold substrate has a non-relief portion without any irregularities, and the first region surface 11 of the plate mold substrate has a pre-formed irregularity portion 4, and the pre-formed irregularity portion 4 has a pre-formed multiple fine irregularity portions 46 formed in a fine irregularity shape as shown in Fig. 9(C). The pre-formed multiple fine irregularity portions 46 have a plurality of pre-formed multiple fine irregularity portion convex portions 461 formed in a plurality of convex shapes and a plurality of pre-formed multiple fine irregularity portion concave portions 462 formed in a plurality of concave shapes, the plurality of pre-formed multiple fine irregularity portion convex portions 461 have a plurality of pre-formed multiple fine irregularity portion convex portion upper surfaces 461a and a plurality of pre-formed multiple fine irregularity portion convex portion side surfaces 461b, and the plurality of pre-formed multiple fine irregularity portion concave portions 462 have a plurality of pre-formed multiple fine irregularity portion concave portion bottom surfaces 462c and a plurality of pre-formed multiple fine irregularity portion concave portion side surfaces 462b.
A plate-form substrate having a plurality of preformed minute concave-convex portions 46 formed in a minute concave-convex shape as shown in FIG. 9(C) was prepared.
The plurality of preformed fine concave-convex portion side surfaces 461b and the plurality of preformed fine concave-convex portion side surfaces 462b correspond to the same side surface region.
In addition, in Figure 9, the respective symbols of the multiple preformed multiple fine unevenness portions convex portions 461, the multiple preformed multiple fine unevenness portions concave portions 462, the multiple preformed multiple fine unevenness portions convex portion top surfaces 461a, the multiple preformed multiple fine unevenness portions convex portion side surfaces 461b, the multiple preformed multiple fine unevenness portions concave portion bottom surfaces 462c, and the multiple preformed multiple fine unevenness portions concave portion side surfaces 462b are not shown, and each symbol is similar to the symbols shown in Figure 4.

In this manner, a preformed multiple fine unevenness portion 46 having a plurality of preformed multiple fine unevenness portion convex portions 461 and a plurality of preformed multiple fine unevenness portion concave portions 462 was formed on the plate mold substrate as shown in Figure 9 (C).
The depth "d1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.1 mm, and the height of the preformed multiple fine unevenness portion convex parts 461 was about 0.1 mm corresponding to the depth of the preformed multiple fine unevenness portion concaves 462. The width "w1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.05 mm (about 50 μm), and the width "w2" of the preformed multiple fine unevenness portion convex parts 461 was about 0.05 mm (about 50 μm).
In this manner, the plate mold substrate 1 having a plurality of preformed fine concave-convex portions 46 was prepared and supplied.

(B) A process of forming a hardened inkjet resist film 3 in a desired area.
Using the plate mold substrate 1 having the plurality of pre-formed multiple fine concave-convex portions 46 prepared as described above, the inkjet resist material 2 was adhered by an inkjet method to form a pre-formed multiple fine concave-convex portion inkjet resist adhered film covering the pre-formed multiple fine concave-convex portions 46 of the plate mold substrate 1, which are the plurality of pre-formed multiple fine concave-convex portion convex portions 461 and the plurality of pre-formed multiple fine concave-convex portion concave portions 462. In this case, it was confirmed that the inkjet resist material was adhered to the plurality of pre-formed multiple fine concave-convex portion convex portion top surfaces 461a, the plurality of pre-formed multiple fine concave-convex portion convex portion side surfaces 461b), the plurality of pre-formed multiple fine concave-convex portion concave portion side surfaces 462b, and the plurality of pre-formed multiple fine concave-convex portion concave bottom surfaces 462c.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material as used in step (B) of the above-mentioned Example 1A) having a property of chemically reacting with ultraviolet light to crosslink into a three-dimensional chemical structure and having a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected and used from among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, and was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the above-mentioned inkjet resist attached film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a hardened desired area inkjet resist fine convex upper surface hardened film 3e, desired area inkjet resist fine convex side surface hardened film 3f, and desired area inkjet resist fine concave bottom surface hardened film 3g. The thickness of each desired area inkjet resist hardened film was in the range of 0.03 mm to 0.05 mm.
In this manner, the inkjet resist cured film 3 was formed in each desired area.

(C) A step of etching the plate mold substrate, which etches the second region surface 12 of the plate mold substrate to which the desired region inkjet resist cured film 3 is not attached.
Next, an etching liquid is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist fine convex portion top surface hardened film 3e, the desired region inkjet resist fine convex portion side surface hardened film 3f, and the desired region inkjet resist fine recess bottom surface hardened film 3g are formed, and the plate mold substrate second region surface 12 of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 is not attached is etched to a depth of approximately 1.9 mm, thereby forming an inkjet resist film etched second recess formation portion 121 having an etched recess shape, and also forming an inkjet film etched pre-formed multiple fine recess protrusion portion 466 in which the pre-formed multiple fine recesses 46 protrude from the inkjet resist film etched second recess formation portion 121.

(D) Step of removing the hardened inkjet resist film from the desired area.
The inkjet resist cured film 3 was removed from the desired area.
This forms an etched inkjet resist film corrosion second recess formation portion 121, and also forms an inkjet film corrosion pre-formed multiple fine unevenness protrusion portion 466 having a pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462.

The depth "d1" of the existing multiple fine unevenness portion concave portion 462 was about 0.1 mm (100 μm), and the height "d1" of the existing multiple fine unevenness portion convex portion 461 was about 0.1 mm (100 μm), which corresponds to the depth "d1" of the existing multiple fine unevenness portion concave portion 462. The width "w2" of the existing multiple fine unevenness portion concave portion 462 was about 0.05 mm (50 μm), and the width "w1" of the existing multiple fine unevenness portion convex portion 461 was about 0.05 mm (about 50 μm).
The depth "d12" of the inkjet resist film etched second recess formation portion 121 was about 1.9 mm.

Furthermore, it was confirmed that no side etching phenomenon occurred on the side of the inkjet resist film etched second recess formation portion 121, and that the side of the inkjet resist film etched second recess formation portion 121 has a smooth, desired inclined side from the bottom surface of the inkjet resist film etched second recess formation portion 121 toward the inkjet film etched pre-formed multiple fine unevenness portion protrusion portion 466.
It was also confirmed that the side surfaces of the multiple preformed multiple fine unevenness concave portions 462 (corresponding to the side surfaces of the multiple preformed multiple fine unevenness convex portions 461) were not etched and maintained the normal desired shape.
In this manner, a foil stamping plate was produced having preformed multiple fine uneven portions 46a, 46b, 46c as shown in Figure 9(C), with each of the preformed multiple fine uneven portions 46a, 46b, 46c forming preformed multiple fine uneven portions as shown in Figures 9(D-a), (D-b), and (D-c).

In addition, in this embodiment, it was confirmed that the desired pre-formed multiple fine unevenness portions 46 having the desired shape accuracy and dimensional accuracy were formed, and the desired inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portions 466 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121 were formed.
Furthermore, it was confirmed that the side surface 461b of the convex portion of the pre-formed multiple fine concave-convex portions (side surface 462b of the pre-formed multiple fine concave-convex portions) does not suffer from the side etching phenomenon in which the portion is etched in a recessed state, and that the desired shape accuracy and dimensional accuracy are obtained.

<Example 3A-a (Processing of workpiece using the pressing plate of Example 3A)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned Example 3A is used as the embossing plate 10 of a flat pressure processing device to perform foil stamping on a workpiece 108 consisting of a 1 mm thick paper sheet as the workpiece base material 108a and a thin gold sheet-like foil material 108b having a thickness of approximately 30 μm.
The workpiece was stamped using the following process.
(Sa) A foil stamping plate 10 was prepared as the pressing plate 10 having the preformed uneven portion 4 formed thereon, which was manufactured in Example 3A.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108a with a thickness of approximately 1 mm and a golden-colored sheet-like foil material with a thickness of approximately 30 μm were positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness portion in which the gold sheet-like foil material 108b was transferred onto the surface of the paper sheet 108a in an uneven shape that matched the uneven shape of the existing unevenness portion 4.
(S-f) At least one of the bases of the pressing plate 10 (foil stamping plate) and the receiving plate 94 was driven to move the pressing plate 10 (foil stamping plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which a graphic pattern formed in an uneven shape with a depth of about 0.1 mm was stamped and transferred onto the paper sheet 108a using the sheet-like foil material 108b.

In this case, no abnormalities occurred in the workpiece 108, such as the paper sheet 108a and the sheet-like foil material 108b, and a workpiece was obtained in which a graphic, letter, and picture pattern formed in an uneven shape with the desired shape accuracy and dimensional accuracy was formed by foil stamping.

In the workpiece prepared as described above, it was confirmed that when the workpiece was viewed from different directions, the letters "H," "T," and "Z" were clearly visible compared to other letters in each different direction.

Comparative Example 3B (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a manufacturing method of a pressing plate in which a conventional liquid resist material is used instead of the inkjet resist material in step (B) of Example 3B described above to form the inkjet resist film etched second recess forming portion 121.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a plurality of preformed concave and convex portions 46.
A plate mold substrate 1 having a planar surface shape was prepared and supplied using the same process as process (A) of Example 3B described above, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 was made of copper and had a generally flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
Next, the same conventional sheet-like dry film resist material as that used in step (A) of Example 3B above was attached to the surface of the mold substrate 1. The conventional sheet-like dry film resist material was a commercially available sheet-like dry film resist material having a thickness of about 0.02 mm to about 0.04 mm.
This sheet-like dry film resist material was attached to a plate substrate, and ultraviolet light was irradiated onto the dry film resist material in a conventional manner through an exposure mask member having through holes and forming the desired fine graphic, letter, and picture pattern for light transmission. A developer was then used to remove the resist film from unnecessary areas, thereby forming a hardened resist film having a fine graphic, letter, and picture pattern.
Then, using a conventional method, the mold substrate was corroded and etched using the resist hardened film as a corrosive etching mask to form a preformed multiple fine concave-convex portion 46 having a plurality of preformed multiple fine concave-convex portion convex portions 461 and a plurality of preformed multiple fine concave-convex portion concave portions 462.
The depth "d1" of each of the preformed multiple fine unevenness concaves 462 was about 0.1 mm, and the height of the preformed multiple fine unevenness convex parts (461) was about 0.1 mm, which corresponds to the depth of the preformed multiple fine unevenness concaves 462. The width "w1" of each of the preformed multiple fine unevenness concaves 462 was about 0.05 mm (50 μm), and the width "w2" of the preformed multiple fine unevenness convex parts 461 was about 0.05 mm (50 μm).
In this manner, the plate mold substrate 1 having a plurality of preformed fine concave-convex portions 46 was prepared and supplied.

(B) A conventional resist hardened film forming process.
Using a plate mold substrate 1 having a plurality of preformed multiple fine concave-convex portions 46, the plurality of preformed multiple fine concave-convex portion convex portion top surfaces 461a, the plurality of preformed multiple fine concave-convex portion convex portion side surfaces 461b, the plurality of preformed multiple fine concave-convex portion concave bottom surfaces 462c, and the plurality of preformed multiple fine concave-convex portion concave side surfaces 462b were covered with a conventional liquid resist material 2 (a conventional liquid resist material that is generally used for plate making and corrosive etching of printed circuit boards, and a desired conventional liquid resist material (the same conventional liquid resist material as used in step (A) of the above-mentioned Example 1A) from among commercially available general-purpose conventional liquid resist materials) by a conventional spray coating method to form a liquid resist adhesion film, and the film was dried by a conventional method to form a resist adhesion film.
The liquid resist material 2 is not applied to the second region surface 12 of the mold substrate located in the surrounding area of the preformed multiple fine projections and recesses 46 .
Thereafter, the attached resist film was hardened by conventional methods such as ultraviolet light exposure, development, and after-baking through a member of a desired shape (an exposure mask member having through holes in the area corresponding to the "multiple pre-formed multiple fine concave-convex portions 46" area formed on the first region surface 11 of the plate mold substrate when the member is placed on the surface of the plate mold substrate and having a light-shielding portion in the surrounding area) to form a conventional resist hardened film 30 that forms a conventional resist fine convex portion top surface hardened film 30e and a conventional resist fine concave portion bottom surface hardened film 30g. However, the conventional resist material attached to the pre-formed multiple fine concave-convex portion convex portion side surface 461b (pre-formed multiple fine concave-convex portion concave portion side surface 462b) flowed down to the bottom surface of the pre-formed multiple fine concave-convex portion concave portion, and a conventional resist fine concave portion side surface hardened film (conventional resist fine convex portion side surface hardened film) was not formed.
The thickness of the conventional resist hardened film 30 ranged from about 0.02 mm to about 0.04 mm.

In this process, the conventional liquid resist material was well adhered to the convex portion upper surfaces 461a of the existing multiple fine unevenness portions and the concave portion bottom surfaces 462c of the existing multiple fine unevenness portions, and well formed the conventional resist fine convex portion upper surface hardened film 30e and the conventional resist fine concave portion bottom surface hardened film 30g which were hardened in the desired regions; however, the conventional liquid resist material flowed down from the convex portion side surfaces 461b of the existing multiple fine unevenness portions (concave portion side surfaces 462b of the existing multiple fine unevenness portions), and no hardened film was formed on the convex portion side surfaces 461b of the existing multiple fine unevenness portions (concave portion side surfaces 462b of the existing multiple fine unevenness portions).

(C) Corrosive Etching Process.
The surface of the plate mold substrate 1 on which the conventional resist fine convex upper surface hardened film 30e and the conventional resist fine concave bottom surface hardened film 30g were formed was contacted with an etching solution (aqueous ferric chloride solution) by a paddle blowing method, and the plate mold substrate second region surface 12 on which the conventional resist hardened film was not attached was etched until the depth dimension was about 0.1 mm, forming the second concave forming portion 121b corroded during etching. In this case, slight side etching occurred on the convex portion side surface 461b of the already formed multiple fine concave portions (the concave portion side surface 462b of the already formed multiple fine concave portions). In addition, the concave bottom surface 462c of the already formed multiple fine concave portions was also corroded and etched.

Etching was continued further to etch the second region surface 12 of the plate mold substrate until the depth dimension reached about 1.9 mm.
As a result, the second area surface 12 of the mold substrate is etched to form a conventional corroded second recess formation portion 121s having an etched recess shape, and the pre-formed multiple fine recess and protrusion portions 46 are formed in a shape protruding from the conventional corroded second recess formation portion 121s.

(D) Conventional resist hardened film removal step.
The conventional resist fine convex upper surface hardened film 30e and the conventional resist fine concave bottom surface hardened film 30g were removed using a resist remover (caustic soda solution or sodium hydroxide solution).

In the above-mentioned "(C) corrosion etching step", the side surface 461b of the convex portion of the already-formed multiple fine concave-convex portions (side surface 462b of the already-formed multiple fine concave-convex portions) on which no hardened film was attached was also corroded and etched, resulting in side-etched side surfaces 461s of the already-formed multiple fine concave-convex portions (side-etched side surfaces 462s of the already-formed multiple fine concave-convex portions). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex side surfaces 461s of pre-formed multiple fine concave-convex portions (multiple side-etched concave side surfaces 462s of pre-formed multiple fine concave-convex portions) are not the desired shape but are an undesirable shape, and when a workpiece is processed using a pressing mold on which such side-etched fine concave-convex portions are formed, there is a problem that a workpiece processed into the desired concave-convex shape cannot be obtained, which is undesirable.

<Comparative Example 3B-a (Processing of workpiece using the pressing plate of Comparative Example 3B)>
In this comparative example, the pressing plate 10 manufactured in the above comparative example 3B is used as the embossing plate 10 of a flat pressure processing device, and foil stamping is performed on a workpiece 108 consisting of a 1 mm thick paper sheet as the workpiece base material 108a and a thin gold sheet-like foil material 108b having a thickness of approximately 30 μm.
The workpiece was stamped using the following process.
(Sa) A foil stamping plate 10 was prepared as the pressing plate 10 having the preformed uneven portion 4 formed thereon, which was manufactured in Comparative Example 3A.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108a with a thickness of approximately 1 mm and a gold sheet-like foil material with a thickness of approximately 30 μm were positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness portion in which the gold sheet-like foil material 108b was transferred onto the surface of the paper sheet 108a in an uneven shape that matched the uneven shape of the existing unevenness portion 4.
(S-f) At least one of the bases of the pressing plate 10 (foil stamping plate) and the receiving plate 94 was driven to move the pressing plate 10 (foil stamping plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which a graphic pattern formed in an uneven shape with a depth of about 0.1 mm was stamped and transferred onto the paper sheet 108a using the sheet-like foil material 108b.

In this case, disturbances were observed in the fine graphic pattern formed by the fine uneven shape, and the processed product could not have the desired shape accuracy and dimensional accuracy. In addition, during repeated pressing, a phenomenon was observed in which the workpiece 108, which is the workpiece base material 108a and the sheet-like foil material 108b, was driven to separate from the pressing plate while being stuck or caught on the pressing plate.
In other words, due to the shape of the side-etched pre-formed multiple fine unevenness convex portion side surface 461s (multiple side-etched pre-formed multiple fine unevenness concave portion side surface 462s) of the pressing processing plate, the shape of the side etching did not allow for the production of a workpiece having a fine graphic, letter, and pattern with the desired shape accuracy and dimensional accuracy.

<Example 4A (Production of a foil stamping plate as a pressing processing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 10", and is a method for manufacturing a pressing plate as shown in Figures 7 and 8 (F), which has a plurality of recesses and a plurality of protrusions protruding from the recesses, with a "fine graphic character pattern formed in a fine uneven shape" on the surface of one of the protrusions, and with "graphic character pattern formed in an uneven shape" on each of the other two protrusions. This pressing plate is used as a foil stamping mold plate or an embossing plate.
In this embodiment, pre-formed multiple uneven portions 45 and pre-formed multiple fine uneven portions 46 are formed by a process including a process using an inkjet resist material, and the mold substrate on which the pre-formed multiple uneven portions 45 and pre-formed multiple fine uneven portions 46 are formed is subjected to a process including a process using an inkjet resist material to form an inkjet resist film corrosion second recess formation portion 121, and the pre-formed multiple uneven portions 45 and the pre-formed multiple fine uneven portions 46 are formed into inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 and inkjet film corrosion pre-formed multiple fine uneven portion protrusion portion 466 having protruding shapes protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121.
Fig. 7 is a schematic diagram for explaining the manufacturing process of a method for manufacturing a press plate according to an embodiment of the present invention. Fig. 8 is a schematic plan view of a schematic diagram for explaining a graphic character pattern formed by projections and recesses on a press plate in a method for manufacturing a press plate according to an embodiment of the present invention. This embodiment is a foil stamping plate shown in Fig. 8(F).
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having a preformed multiple concave-convex portion 45 and a preformed multiple fine concave-convex portion 46.
(A-a) A plate mold substrate 1 having a planar surface shape was prepared and supplied, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 was made of brass and had a generally flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm (not shown).

Next, on the surface of the plate mold substrate 1, a resist hardened film was formed using an inkjet resist material to cover only the "heart-shaped fine graphic character picture pattern" among the patterns shown in FIG. 8(F).
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components, the inkjet resist material used in the step (B) of the above-mentioned Example 1A was selected and used, which has the property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure, and "an inkjet resist material with a viscosity of 10 mPa·s to 20 mPa·s (25°C)" was selected and used, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed to form a cured inkjet resist film having a desired heart pattern and a fine pattern design. The thickness of the inkjet resist cured film was within the range of about 0.03 mm to about 0.05 mm.

An etching liquid was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist hardened film was formed, and the surface of the plate mold substrate to which the resist hardened film was not attached was etched until the depth "d1" reached approximately 0.1 mm, thereby forming a pre-formed multiple fine unevenness portion 46 having a plurality of pre-formed multiple fine unevenness portion convex portions 461 and a plurality of pre-formed multiple fine unevenness portion concave portions 462 on the plate mold substrate.
Next, the cured inkjet resist film was removed using a resist remover.
In this manner, a plurality of preformed minute concave-convex portions 46 in a heart pattern were formed.
The depth "d1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.1 mm (100 μm), and the height "d1" of the preformed multiple fine unevenness portion convex parts 461 was about 0.1 mm (100 μm) corresponding to the depth of the preformed multiple fine unevenness portion concaves 462. The width "w1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.05 mm (50 μm), and the width "w2" of the preformed multiple fine unevenness portion convex parts 461 was about 0.05 mm (50 μm).
Although the symbols "d1", "w1", and "w2" are not shown in FIG. 7, these symbols mean the same depth, height, and width as the symbols explained in the description of FIG. 4 and FIG. 5(B) above.

(A-b) Next, a resist hardened film was formed on the above-mentioned plate mold substrate 1 having a pre-formed multiple fine unevenness 46 having a plurality of pre-formed multiple fine unevenness convex portions 461 and a plurality of pre-formed multiple fine unevenness concave portions 462, covering the top and side surfaces of the above-mentioned pre-formed multiple fine unevenness convex portions 461 and the side surfaces (the same areas as the side surfaces of the pre-formed multiple fine unevenness convex portions 461) and bottom surface of the pre-formed multiple fine unevenness concave portions 462, and forming the "B pattern" and "crosspiece pattern" of the patterns shown in Figure 8 (F) using an inkjet resist material similar to that of (A-a) above.
Thereafter, an etching liquid was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist hardened film had been formed, and the surface of the plate mold substrate to which the resist hardened film had not been attached was etched until the depth "D1" reached approximately 0.9 mm, thereby forming a pre-formed multiple concave-convex portion 45 having a plurality of pre-formed multiple concave-convex portion convex portions 451 and a plurality of pre-formed multiple concave-convex portion concave portions 452 on the plate mold substrate.
Next, the cured inkjet resist film was removed using a resist remover.
In this manner, a substrate for a mold was prepared having a "fine graphic and letter pattern in the shape of a heart formed with a fine concave-convex shape," a "second pattern formed with a concave-convex shape," and a "crosspiece pattern formed with a concave-convex shape," as shown in FIG. 7(A).
Although the reference symbol "D1" is not shown in FIG. 7, the reference symbol "D1" is the same as the reference symbol explained in the explanation of FIGS. 1, 2, and 3 and means the depth "D1".

(B) Step of forming a hardened inkjet resist film in a desired area.
As shown in (B) of FIG. 7 , inkjet resist material 2 was applied by an inkjet method to cover upper surfaces 461a, convex portions 461b, bottom surfaces 462c, and side surfaces 462b of the existing multiple fine uneven portions of the "heart-shaped fine graphic character picture pattern", upper surfaces 451a, convex portions 451b, bottom surfaces 452c, and side surfaces 452b of the existing multiple fine uneven portions of the "pattern B formed with an uneven shape", and upper surfaces 451a, convex portions 451b, bottom surfaces 452c, and side surfaces 452b of the existing multiple uneven portions of the "barrel pattern formed with an uneven shape", to form respective inkjet resist applied films. Here, the inkjet resist material 2 is not attached to the surrounding areas of the pre-formed multiple fine concave-convex portions 46 and the second area surface 12 of the plate-form substrate located in the surrounding areas of each of the pre-formed multiple concave-convex portions 45 .
Thereafter, the inkjet resist deposited film was hardened to form an inkjet resist hardened film 3 which forms a hardened film 3e on the top surface of the inkjet resist fine convex portion in the desired region, a hardened film 3f on the side surface of the inkjet resist fine convex portion in the desired region, a hardened film 3g on the bottom surface of the inkjet resist fine concave portion in the desired region, and a hardened film 3a on the top surface of the inkjet resist convex portion in the desired region, a hardened film 3b on the side surface of the inkjet resist convex portion in the desired region, and a hardened film 3c on the bottom surface of the inkjet resist concave portion in the desired region.

An on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, "an inkjet resist material that is the same as that used in the step (A) of this Example 4A among commercially available inkjet resist materials that are widely used in the manufacture of metal wiring boards as electronic components (the same as the inkjet resist material used in the step (A) of this Example 4A), has a property of crosslinking into a three-dimensional chemical structure by chemical reaction upon irradiation with ultraviolet light, and has a viscosity of 10 mPa·s to 20 mPa·s (25°C)" was selected and used, and the inkjet resist material was attached under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed for 10 minutes at 120°C to form inkjet resist cured films in the desired areas.
The thickness of the cured inkjet resist film in the desired area ranged from about 0.03 mm to about 0.05 mm.

In this process, the inkjet resist material adheres well to the pre-formed multiple fine unevenness convex portion side surface 461b (pre-formed multiple fine unevenness concave portion side surface 462b) and the pre-formed multiple unevenness convex portion side surface 451b (pre-formed multiple unevenness concave portion side surface 452b) without flowing off the pre-formed multiple fine unevenness convex portion side surface 461b (pre-formed multiple fine unevenness concave portion side surface 462b) and the pre-formed multiple unevenness convex portion side surface 451b (pre-formed multiple unevenness concave portion side surface 452b), and is also well adhered to the pre-formed multiple fine unevenness convex portion upper surface 461a, the multiple pre-formed multiple fine unevenness concave portion bottom surfaces 462c, the pre-formed multiple unevenness convex portion upper surfaces 451a, and the multiple pre-formed multiple unevenness concave bottom surfaces 452c.
It was also confirmed that the following were formed in the desired regions: hardened film 3e on the top surface of the inkjet resist fine convex portion, hardened film 3f on the side surface of the inkjet resist fine convex portion, hardened film 3g on the bottom surface of the inkjet resist fine concave portion in the desired region, hardened film 3a on the top surface of the inkjet resist convex portion in the desired region, hardened film 3b on the side surface of the inkjet resist convex portion in the desired region, and hardened film 3c on the bottom surface of the inkjet resist concave portion in the desired region.

(C) Corrosive Etching Process.
As shown in FIG. 7C , a commercially available general-purpose conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which each of the desired region inkjet resist cured films 3 was formed, using a paddle blow-up method, and the plate mold substrate second region surface 12 on which the desired region inkjet resist cured film was not attached was etched until the depth dimension “D12” became approximately 1.9 mm.
As a result, the second area surface 12 of the plate mold substrate is etched without etching the pre-formed multiple fine unevenness portions 46 and the pre-formed multiple unevenness portions 45, thereby forming an inkjet resist film corrosion second recess formation portion 121 having an etched recess shape, and the pre-formed multiple fine unevenness portions 46 and the pre-formed multiple unevenness portions 45 are formed into inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion 466 and inkjet film corrosion pre-formed multiple unevenness portion protrusion portion 455, which have shapes protruding from the inkjet resist film corrosion second recess formation portion 121.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 7(Db), the inkjet resist hardened film 3 in each desired area was removed using a commercially available conventional resist remover (aqueous caustic soda solution or aqueous sodium hydroxide solution).

In this way, the second concave-convex portion 121 formed by etching the second region surface 12 of the plate mold substrate is formed without etching the pre-formed multiple fine concave-convex portions 46 and the pre-formed multiple concave-convex portions 45, and the plate mold substrate first region surface 11 having the pre-formed multiple fine concave-convex portions 46 having a plurality of pre-formed multiple fine concave-convex portions convex portions 461 and a plurality of pre-formed multiple fine concave-convex portions concave portions 462 is formed into an inkjet film etched pre-formed multiple fine concave-convex portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second concave-formation portion 121, and the other first region surface 11 of the plate mold substrate having the pre-formed multiple concave-convex portions 45 having a plurality of pre-formed multiple concave-convex portions convex portions 451 and a plurality of pre-formed multiple concave-convex portions concave portions 452 is formed into an inkjet film etched pre-formed multiple concave-convex portion protrusion portion 455 having a protruding shape protruding from the bottom surface of the inkjet resist film etched second concave-formation portion 121.

In addition, in this embodiment, it was confirmed that the pre-formed multiple uneven portions 45 and the pre-formed multiple fine uneven portions 46 have the normal desired shape accuracy and dimensional accuracy, and that the desired inkjet film corrosion pre-formed multiple uneven portion protrusion portion 455 and the desired inkjet film corrosion pre-formed multiple fine uneven portion protrusion portion 466 having a protruding shape protruding from the bottom surface of the inkjet resist film corrosion second recess formation portion 121 are formed.
Furthermore, it was confirmed that the side surface 451b of the convex portion of the desired pre-formed multiple uneven portions (side surface 452b of the concave portion of the pre-formed multiple uneven portions) and the side surface 461b of the convex portion of the desired pre-formed multiple fine uneven portions (side surface 462b of the concave portion of the pre-formed multiple fine uneven portions) do not suffer from the side etching phenomenon in which they are etched in a recessed state, and that they have the desired shape accuracy and dimensional accuracy.

<Example 4A-a (Processing of workpiece using the pressing plate of Example 4A)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned Example 4A is used as the embossing plate 10 of a flat pressure processing device to emboss a gold-colored glossy paper sheet 108 having a gold-colored surface as the workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the preformed uneven portion 4 formed thereon, which was manufactured in Example 4A.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface was placed on the second base 93 of the pressing device.
(S-e) In this state, a "gold-colored glossy paper sheet 108" with a thickness of approximately 1.5 mm and a gold-colored surface was positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
As a result, a workpiece unevenness-forming portion having an uneven shape that matches the uneven shape of the existing uneven portion 4 was formed on the surface of the workpiece 108.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product formed on a paper sheet 108 as the workpiece 108, with an embossed uneven shape having a "fine graphic heart pattern matching the existing multiple fine uneven portions 46" and a "Z pattern and checkerboard pattern matching the existing multiple fine uneven portions 45".

In this case, no abnormalities occurred in the "gold colored glossy paper sheet 108" serving as the workpiece 108, and a workpiece was obtained having a "fine graphic and letter pattern" and a "graphic and letter pattern" formed in an uneven shape with the desired shape accuracy and dimensional accuracy.

Comparative Example 4A (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a manufacturing method for a pressing processing plate in which, in the step of forming pre-formed multiple fine uneven portions 46 in step (A) of Example 4A above, a conventional liquid resist material is used instead of an inkjet resist material to form pre-formed multiple fine uneven portions 46, and further, in the step of forming pre-formed multiple uneven portions 45 on the plate mold substrate on which the pre-formed multiple fine uneven portions 46 have been formed, a conventional liquid resist material is used instead of an inkjet resist material to form pre-formed multiple uneven portions 45 on the plate mold substrate.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 and a plate mold substrate second area surface 12 having preformed multiple concave-convex portions 45 and preformed multiple fine concave-convex portions 46.
(Aa) Step of forming multiple preformed minute concave-convex portions 46.
(A-a-a) A plate mold substrate 1 having a half surface shape was prepared and supplied, which had a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 was made of brass and had a generally flat plate shape with a thickness of 7.0 mm, a width of 125 mm, and a length of 90 mm.
(not shown)
(A-a-b) Next, (i) a conventional liquid resist material (a conventional liquid resist material which has the property of reacting chemically with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and is generally used for plate making and etching of printed circuit boards, and which is a desired conventional liquid resist material selected from commercially available general-purpose conventional liquid resist materials, such as the same conventional liquid resist material used in step (A) of Example 1A) was applied to a desired region of the surface 11 of the first region of the plate mold substrate 1 by a conventional spray coating method to a thickness in the range of about 0.02 mm to about 0.04 mm, and then dried by a prescribed method to form a resist-adhered film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member having a desired light-blocking graphic pattern (heart pattern), and a hardened resist film having the desired graphic pattern (heart pattern) was formed by conventional processes such as development and after-baking.
(A-a-c) An etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film was formed, and the surface of the plate mold substrate on which the resist hardened film was not attached was etched until the depth "d1" reached approximately 0.1 mm (100 μm), thereby forming a plurality of pre-formed multiple fine unevenness concave portions 462 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple fine unevenness convex portions 461 formed in a convex shape.
(Aad) Next, the hardened resist film was removed using a resist remover (aqueous caustic soda solution).

In this way, a preformed multiple fine unevenness portion 46 (a fine graphic letter pattern with a heart shape) was formed, which includes a plurality of preformed multiple fine unevenness portion convex portions 461 having a plurality of preformed multiple fine unevenness portion convex portion upper surfaces 461a formed in a convex shape and a plurality of preformed multiple fine unevenness portion convex portion side surfaces 461b, and a plurality of preformed multiple fine unevenness portion concave portions 462 having a plurality of preformed multiple fine unevenness portion concave bottom surfaces 462c formed in a concave shape and a plurality of preformed multiple fine unevenness portion concave side surfaces 462b.
The depth "d1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.1 mm (100 μm), and the height "d1" of the preformed multiple fine unevenness portion convex parts 461 was about 0.1 mm (100 μm) corresponding to the depth of the preformed multiple fine unevenness portion concaves 462. The width "w1" of each of the preformed multiple fine unevenness portion concaves 462 was about 0.05 mm (50 μm), and the width "w2" of the preformed multiple fine unevenness portion convex parts 461 was about 0.05 mm (50 μm).

(A-b) Step of forming preformed multiple concave-convex portions 45.
(A-b-b) A conventional liquid resist material (the same conventional liquid resist material as that used in the above-mentioned "A-a-b" process) was applied to the surface of the plate mold substrate on which the above-mentioned pre-formed multiple fine concave-convex portions 46 was formed, using a conventional spray coating method, to a thickness in the range of about 0.02 mm to about 0.04 mm, and then dried in a prescribed manner to form a resist deposition film.
The resist film was then irradiated with ultraviolet light through an exposure mask member on which the desired light-blocking graphic pattern (the "Z pattern" and the "crossbar pattern") was formed, and a hardened resist film having the desired graphic pattern (the "Z pattern" and the "crossbar pattern") was formed by conventional processes such as development and after-baking.
In this case, when the liquid resist material was applied, the liquid resist material adhering to the convex portion side surface 461b of the existing multiple fine unevenness portions (same as the concave portion side surface 462b of the existing multiple fine unevenness portions) flowed down to the concave bottom surface 462c of the existing multiple fine unevenness portions, and no resist adhesion film was formed on the convex portion side surface 461b of the existing multiple fine unevenness portions (same as the concave portion side surface 462b of the existing multiple fine unevenness portions) of the existing multiple fine unevenness portions 46.
(A-b-c) An etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film was formed, and the surface of the plate mold substrate on which the resist hardened film was not attached was etched to a depth of approximately 0.9 mm, thereby forming a plurality of pre-formed multiple concave-convex portions 452 formed in a concave shape on the plate mold substrate, and a plurality of pre-formed multiple convex portions 451 formed in a convex shape.
(Abd) Next, the hardened resist film was removed using a resist remover (aqueous caustic soda solution).

In this way, the desired graphic pattern ("Z pattern" and "crosspiece pattern") was formed using pre-formed multiple uneven portions 45 including pre-formed multiple uneven portion convex portion 451 having pre-formed multiple uneven portion convex portion top surface 451a formed in a convex shape and pre-formed multiple uneven portion convex portion side surface 451b, and pre-formed multiple uneven portion concave portion 452 having pre-formed multiple uneven portion concave bottom surface 452c formed in a concave shape and pre-formed multiple uneven portion concave portion side surface 452b.
However, slight side etching occurred on the convex portion side surface 461b (concave portion side surface 462b) of the existing multiple fine concave-convex portions 46 (fine heart-shaped graphic character design).
The side surface 461b of the convex portion of the already formed multiple fine concave-convex portions (side surface 462b of the already formed multiple fine concave-convex portions) on which the hardened resist film was not attached was also corroded and etched, resulting in a side-etched side surface 461s of the already formed multiple fine concave-convex portions of the already formed multiple fine concave-convex portions (side-etched side surfaces 462s of the already formed multiple fine concave-convex portions) similar to that shown in Fig. 15(D). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such side-etched convex portion side surfaces 461s of pre-formed multiple fine concave-convex portions (multiple side-etched concave-convex portion side surfaces 462s of pre-formed multiple fine concave-convex portions) are not the desired shape but are undesirable shapes, and there is a problem that when a workpiece is processed using a pressing processing mold on which such side-etched fine concave-convex portions are formed, a workpiece having the desired shape accuracy, dimensional accuracy, etc. cannot be obtained.

(B) Using the mold substrate having the preformed multiple fine uneven portions 46 (fine graphic and letter pattern in a heart shape) and the preformed multiple uneven portions 45 (graphic and letter pattern "Z pattern" and "crosspiece pattern") prepared as described above, it was planned to form recesses and form preformed multiple fine uneven portion protrusions and preformed multiple uneven portion protrusions having a shape protruding from the recesses by processes such as applying resist, hardening the resist, corrosive etching, and removing the etching solution. However, since preformed multiple fine uneven portions 46 having the desired uneven shape could not be formed in the above process (A), the subsequent processes were discontinued.

<Example 5A (Production of a foil stamping plate as a pressing processing plate)>
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 11," and is a method for manufacturing a pressing plate shown in Fig. 10 (A) to (D), (A-b) to (D-b), which forms a "fine graphic character pattern formed with a fine concave-convex shape" on the upper surface of a pre-formed convex portion 47 of a plate mold substrate having a pre-formed convex portion 47 and a pre-formed concave portion 48. This pressing plate is used as a foil stamping mold plate or an embossing plate.
In this embodiment, a pre-formed uneven portion 47 and a pre-formed recess 48 were formed by a process including a process using an inkjet resist material, and a plate mold substrate on which the pre-formed convex portion 47 and the pre-formed recess 48 were formed was prepared by a process including a process using an inkjet resist material to form "multiple fine uneven portions 477, 477b on the upper surface of the pre-formed convex portion formed with a plurality of fine concave shapes corresponding to a fine graphic character pattern formed with the fine uneven shapes" on the upper surface of the pre-formed convex portion 47, thereby preparing a plate for pressing processing.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of steel, has a thickness "h" of 0.5 mm, a width of 125 mm, a length of 90 mm, is flexible, and has a substantially flat plate shape.

Next, an inkjet resist material was applied by an inkjet method to the first region surface 11 of the plate mold substrate 1 in a substantially rectangular pattern, and the inkjet resist material was then hardened to form an inkjet resist hardened film.
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material as that used in step (B) of the above-mentioned Example 1A) having a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and having a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected from among commercially available inkjet resist materials and used, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a cured inkjet resist cured film 3 having a desired heart pattern and a fine pattern design. The thickness of the inkjet resist cured film was in the range of about 0.03 mm to about 0.05 mm.

Next, an etching solution was brought into contact with the surface of the plate mold substrate 1 on which the inkjet resist cured film was formed, and the surface of the plate mold substrate on which the resist cured film was not attached was etched to a depth of about 0.3 mm (300 μm), forming a pre-formed convex portion 47 and a pre-formed concave portion 48 on the plate mold substrate. The pre-formed convex portion 47 has a pre-formed convex upper surface 47a and a pre-formed convex side surface 47b, and the pre-formed concave portion 48 has a pre-formed concave bottom surface 48c and a pre-formed concave side surface 48b. The pre-formed convex side surface 47b and the pre-formed concave side surface 48b refer to the same side surface region.

Next, the cured inkjet resist film was removed using a resist remover.
In this manner, a pre-formed concave-convex portion having a pre-formed convex portion 47 and a pre-formed concave portion 48 was formed on the plate mold substrate as shown in FIGS. 10(A) and (Ab).
The depth of the existing recess 48 was about 0.3 mm, and the height of the existing protrusion 47 was about 0.3 mm, which corresponds to the depth of the existing recess 48 .

(B) Step of forming a hardened inkjet resist film in a desired area.
Next, as shown in Fig. 10(B) and (B-b), the inkjet resist material 2 was applied by the inkjet method to cover the entire surfaces of the existing convex side 47b, the existing concave side 48b, and the existing concave bottom 48c of the plate mold substrate 1, and the inkjet resist material (2) was applied by the inkjet method to the upper surface of the existing convex top 47a to form a desired area inkjet resist applied film having the desired fine graphic and letter picture pattern of a fine heart pattern as shown in Fig. 10(B-b). In this case, it was confirmed that the inkjet resist material was applied to the existing convex side 47b and the existing concave side 48b.
The existing convex side surface 47b and the existing concave side surface 48b refer to the same region.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material used in step (B) of Example 1A and step (A) of this example) that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25° C.) was selected from among commercially available inkjet resist materials and used, and the inkjet resist deposition film was formed by deposition under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, by a method similar to the process (B) of Example 1A described above, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burned at 120° C. for 10 minutes to form a cured desired area inkjet resist cured film 3 on the entire surface of the existing convex side 47b, the entire surface of the existing concave side 48b, and the entire surface of the existing concave bottom 48c, and also formed a cured desired area inkjet resist cured film 3 with a fine graphic pattern (fine heart pattern) on the upper surface of the existing convex upper surface 47a. The thickness of each of the desired area inkjet resist cured films was in the range of about 0.03 mm to about 0.05 mm. In this manner, each of the desired area inkjet resist cured films 3 was formed.

(C) Corrosive Etching Process.
Next, as shown in Fig. 10(C) and (C-b), an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist cured film 3 was formed, and the plate mold substrate second region surface 12 of the plate mold substrate 1 on which the desired region inkjet resist cured film 3 was not attached was etched to a depth of about 0.1 mm (100 µm), thereby forming a pre-formed convex portion upper surface multiple fine unevenness 477b having a pre-formed convex portion upper surface multiple fine unevenness concave portion 472b formed with a plurality of fine concave shapes corresponding to the desired fine graphic character pattern and a pre-formed convex portion upper surface multiple fine unevenness convex portion 471b formed with a plurality of fine convex shapes. Note that the pre-formed convex portion upper surface multiple fine unevenness 477b corresponds to the pre-formed convex portion upper surface unevenness 477.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 10(D) and (Db), the inkjet resist hardened film 3 was removed from the desired area using a commercially available general-purpose conventional resist remover (aqueous caustic soda solution).
In this way, multiple fine unevenness portions 477b were formed on the upper surface of the existing convex portion 47a, comprising multiple fine unevenness portion concave portions (472b) on the upper surface of the existing convex portion formed with multiple fine concave shapes and multiple fine unevenness portion convex portions 471b on the upper surface of the existing convex portion formed with multiple fine convex shapes.

The depth dimension of the multiple fine unevenness recesses 472b on the upper surface of the existing convex portion (the height dimension of the multiple fine unevenness protrusions 471b on the upper surface of the existing convex portion) was about 0.1 mm (100 μm). The width dimension of the multiple fine unevenness recesses 472b on the upper surface of the existing convex portion was about 0.05 mm (about 50 μm), and the width dimension of the multiple fine unevenness recesses 472b on the upper surface of the existing convex portion was about 50 μm.
The depth dimension of the existing recess 48 (the height dimension of the existing protrusion 47) was 0.3 mm.

It was also confirmed that the side surface of the existing convex portion 47 in Figures 10(D) and (D-b) (corresponding to the side surface of the existing concave portion 48) was not etched and maintained the normal desired shape shown in Figure 10(D).
In this way, a "flexible embossing plate (pressing processing plate 10)" was produced, which has a pre-formed convex portion 47 and a pre-formed concave portion 48, and has multiple fine concave-convex portions 477b on the upper surface of the pre-formed convex portion 47 in a "heart pattern" formed in a fine concave-convex shape on the upper surface of the pre-formed convex portion. The "flexible embossing plate (pressing processing plate 10)" has a flexibility sufficient to enable it to be deformed to conform to the spherical surface of the roll.

In addition, in this embodiment, it was confirmed that the pre-formed convex portion 47 and the pre-formed concave portion 48 have normal desired shape accuracy and dimensional accuracy, and that the pre-formed convex portion 47 has multiple fine uneven portions 477b formed on the upper surface of the pre-formed convex portion 477 having normal desired shape accuracy and dimensional accuracy.
It was also confirmed that the side surface of the existing convex portion 47 (corresponding to the existing concave portion 48) was not etched in a concave state due to the side etching phenomenon, and the desired shape precision was obtained.

<Example 5A-a (Processing of a workpiece using the pressing plate of Example 5A installed in a roll device)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned embodiment 5A is placed in a roll-type processing device and used as the foil stamping plate 10 for foil stamping.
The workpiece was stamped using the following process.
(Sa) A foil stamping plate 10 as the pressing processing plate 10 manufactured in Example 5A was prepared and supplied.
(Sb) A pressing device having a main roll 96 and a counter roll 97 facing each other was prepared.
(Sc) A foil stamping plate as the pressing plate 10 was wrapped around the main roll 96. In this case, a magnetic member that generates a magnetic force is configured inside the main roll 96, and the foil stamping plate 10 as the flexible pressing plate 10 is wrapped around the main roll 96 by the magnetic force.
(Sd) A predetermined receiving plate 94 was placed on the paired roll 97 of the pressing device.
In this embodiment, as the counter roll 97, a separately prepared stainless steel anvil roll 97 having a smooth spherical surface was prepared and installed.
(S-e) The main roll 96 and the counter roll 97 were driven, and the workpieces, which were a 1 mm thick paper sheet serving as the workpiece substrate 108a and a thin silver sheet-like foil material 108b having a thickness of approximately 30 μm, were continuously supplied between the main roll 96 and the counter roll 97 in a mutually parallel state, and the workpieces were continuously pressed while the pressing plate 10 and the receiving plate 94 were rotated.
As a result, a sheet-like foil material having a fine uneven shape that matches the uneven shape of the multiple fine uneven portions 477b on the upper surface of the existing convex portion 47 formed in the existing convex portion 47 was transferred to the surface of the workpiece substrate 108a, thereby transferring and forming the workpiece foil stamping transfer formation portion.
(Sf) As the rolls rotated, the workpiece was separated from between the main roll 96 and the counter roll 97, and the pressure on the workpiece was released.
This resulted in the preparation of a workpiece having a workpiece transfer formation portion formed on the surface of the workpiece 108, which has a fine uneven shape that matches the uneven shape of the multiple fine uneven portions 477b on the upper surface of the existing convex portion 47 formed on the existing convex portion 47.
In this manner, a workpiece was prepared in which a foil material having a "heart pattern" and a plurality of fine concave-convex patterns was transferred onto the surface of the paper sheet 108a serving as the workpiece 108.

In this case, no abnormalities occurred in the paper sheet 108a and metal foil sheet 108b serving as the workpiece 108, and a workpiece was obtained in which the paper sheet 108a serving as the workpiece 108 had multiple fine uneven patterns of "heart patterns" formed by transferring metal foil and having the desired shape and dimensional accuracy, all in a smooth state.

Example 5B (Production of embossing plate as pressing plate)
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 11," and is a method for manufacturing a pressing plate shown in (A) to (D) and (A-a) to (D-a) of Fig. 10, which forms a "graphical character pattern formed in a concave-convex shape" on the upper surface of a pre-formed convex portion 47 of a plate mold substrate having a pre-formed convex portion 47 and a pre-formed concave portion 48. This pressing plate is used as an embossing plate.
In this embodiment, a pre-formed uneven portion 47 and a pre-formed recess 48 were formed by a process including a process using a conventional general-purpose liquid resist material, and a plate mold substrate on which the pre-formed convex portion 47 and the pre-formed recess 48 were formed was prepared by a process including a process using an inkjet resist material to form "multiple pre-formed convex portion upper surface uneven portions 477, 477a formed with a plurality of uneven shapes corresponding to a graphic, letter, and picture pattern formed with uneven shapes" on the upper surface of the pre-formed convex portion 47, thereby preparing a plate for pressing processing.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of copper and has a substantially flat plate shape with a thickness "h" of 7 mm, a width of 125 mm, and a length of 90 mm.

Next, a conventional general-purpose liquid resist material (a general-purpose liquid resist material that is generally used for plate making and etching of printed circuit boards, and a desired general-purpose liquid resist material is selected from commercially available general-purpose general-purpose liquid resist materials, such as the general-purpose liquid resist material used in step (A) of Example 1A described above) was applied to the entire surface of the mold substrate 1 by a conventional spray coating method to a thickness of about 0.02 mm to about 0.04 mm, and then dried by a prescribed method to form a resist coating film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member having through holes for light transmission formed on the first region surface 11 of the plate mold substrate, and then unnecessary resist film was removed from the region not irradiated with ultraviolet light using a commercially available general-purpose conventional developer (aqueous sodium carbonate solution). Then, the resist film was aged by heating and baking in a predetermined conventional manner. In this way, a resist cured film having a desired approximately rectangular shape was formed.

Next, a commercially available general-purpose conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film had been formed, and the surface of the plate mold substrate on which the resist hardened film had not been attached was etched until the depth dimension reached 1.9 mm, thereby forming a pre-formed recess 48 formed in a concave shape on the plate mold substrate, and a pre-formed protrusion 47 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose conventional resist remover (aqueous caustic soda solution).
In this manner, a pre-formed convex portion 47 formed in a convex shape and a pre-formed concave portion 48 formed in a concave shape were formed on the plate mold substrate as shown in FIGS. 10(A) and (Aa).
The depth of the existing recess 48 was about 1.9 mm, and the height of the existing protrusion 47 was about 1.9 mm, which corresponds to the depth of the existing recess 48 .

(B) Step of forming a hardened inkjet resist film in a desired area.
Next, as shown in Figures 10(B) and (B-a), the inkjet resist material 2 was applied by the inkjet method to cover the entire surfaces of the existing convex side 47b, the existing concave side 48b, and the existing concave bottom 48c of the plate mold substrate 1, and the inkjet resist material (2) was applied by the inkjet method to the upper surface of the existing convex top 47a to form a desired region inkjet resist applied film having the desired graphic letter pattern of "ABCDE pattern" as shown in Figure 10(B-a). In this case, it was confirmed that the inkjet resist material was applied to the existing convex side 47b and the existing concave side 48b.
The existing convex side surface 47b and the existing concave side surface 48b refer to the same region.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material used in the above-mentioned step (B) of Example 1A, step (A) of this Example 5, and step (B) of this Example 5) that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25° C.) was selected from among commercially available inkjet resist materials and used, and the inkjet resist deposition film was formed by deposition under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, by a method similar to the process (B) of Example 1A described above, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burned at 120° C. for 10 minutes to form a cured desired area inkjet resist cured film 3 on the entire surface of the existing convex side 47b, the entire surface of the existing concave side 48b, and the entire surface of the existing concave bottom 48c, and also formed a cured desired area inkjet resist cured film 3 with a graphic character pattern (ABCDE pattern) on the upper surface of the existing convex upper surface 47a. The thickness of each of the desired area inkjet resist cured films was in the range of about 0.03 mm to about 0.05 mm. In this manner, each of the desired area inkjet resist cured films 3 was formed.

(C) Corrosive Etching Process.
10(C) and (C-a), an etching solution was brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist cured film 3 was formed, and etching was performed until the depth reached about 0.9 mm on the upper surface of the existing convex portion upper surface 47a of the plate mold substrate 1 to which the desired region inkjet resist cured film 3 was not attached, thereby forming a pre-existing convex portion upper surface multiple convex/concave portion 472a formed with multiple concave shapes corresponding to the desired graphic character pattern, and a pre-existing convex portion upper surface multiple convex/concave portion 471a formed with multiple convex shapes. The pre-existing convex portion upper surface multiple convex/concave portion 477a corresponds to the pre-existing convex portion upper surface multiple convex/concave portion 477.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 10(D) and (Da), the inkjet resist hardened film 3 was removed from the desired area.
In this way, a pre-formed convex portion upper surface multiple uneven portion 477a was formed on the upper surface of the pre-formed convex portion 47a, comprising a pre-formed convex portion upper surface multiple uneven portion concave portion 472a formed with multiple concave shapes and a pre-formed convex portion upper surface multiple uneven portion convex portion 471a formed with multiple convex shapes.

The depth dimension of the concave portion 472a of the multiple uneven portions on the upper surface of the existing convex portion (the height dimension of the convex portion 471a of the multiple uneven portions on the upper surface of the existing convex portion) was approximately 0.9 mm.
The depth dimension of the existing recess 48 (the height dimension of the existing protrusion 47) was 1.9 mm.

It was also confirmed that the side surface of the existing convex portion 47 in Figures 10(D) and (Da) (corresponding to the side surface of the existing concave portion 48) was not etched and maintained the normal desired shape shown in Figure 10(D).
In this way, a pressing processing plate 10 was manufactured having a preformed convex portion 47 and a preformed concave portion 48, and having multiple preformed convex portion upper surface uneven portions 477a formed in an uneven shape on the upper surface of the preformed convex portion 47 in an "ABCDE pattern."

In addition, in this embodiment, it was confirmed that the pre-formed convex portion 47 and the pre-formed concave portion 48 have the normal desired shape accuracy and dimensional accuracy, and that the pre-formed convex portion 47 has multiple normal and desired uneven portions 477a formed on the upper surface of the pre-formed convex portion.
It was also confirmed that the side surface of the existing convex portion 47 (corresponding to the existing concave portion 48) was not etched in a concave state due to the side etching phenomenon, and the desired shape precision was obtained.

<Example 5B-a (Processing of workpiece using the pressing plate of Example 5B)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned embodiment 5B is used as the embossing plate 10 of a flat pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the previously formed convex portions and previously formed concave portions manufactured in Example 5B.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface without irregularities was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 having a thickness of approximately 1.5 mm was positioned as the workpiece 108 between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness formation portion on the surface of the workpiece 108 having an uneven shape that matches the uneven shape of the multiple uneven portions 477a on the upper surface of the existing convex portion 47 of the mold substrate.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a workpiece 108 made of a paper sheet 108 having an embossed uneven shape of about 0.9 mm depth having a graphic character pattern that matches the graphic character pattern formed in an uneven shape on the multiple uneven portions 477a on the upper surface of the existing convex portion formed on the upper surface of the existing convex portion 47 of the plate mold substrate.

In the embodiment of the method for processing the workpiece, a workpiece was obtained in which a graphic picture pattern of "ABCDE pattern" formed with a concave-convex shape having the desired shape accuracy and dimensional accuracy was formed on the paper sheet 108 as the workpiece 108 without any abnormality. It was confirmed that the graphic picture pattern of "ABCDE pattern" formed on the workpiece was formed with concave-convex shapes having a step of about 0.9 mm as desired without any abnormality.

Comparative Example 5B (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a manufacturing method for a pressing processing plate in which a plurality of uneven portions 477a are formed on the upper surface of a pre-formed convex portion 47 in steps (B), (C), and (D) of Example 5B described above, using a conventional liquid resist material instead of an inkjet resist material.

This comparative example will be described in detail below.
FIG. 22 is a schematic diagram for explaining the manufacturing steps of a conventional method for manufacturing a pressing plate.
(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
Using the same method as in Example 5B described above, a copper mold substrate having an approximately flat plate shape with a thickness of 7 mm, a width of 125 mm and a length of 90 mm was used to form a pre-formed convex portion 47 formed in a convex shape on the first region surface 11 of the mold substrate, and a pre-formed concave portion 48 formed in a concave shape on the second region surface 12 of the mold substrate, as shown in Figures 22 (A) and (A-a).
The depth of the existing recess 48 was about 1.9 mm, and the height of the existing protrusion 47 was about 1.9 mm, which corresponds to the depth of the existing recess 48 .

(B) A conventional liquid resist hardened film forming process.
As shown in Figures 22 (B) and (B-a), the entire surface of the plate mold substrate having the existing convex portion 47 and the existing concave portion 48 formed thereon was covered with a conventional liquid resist material 20 (the same liquid resist material as that used in step (A) of this Comparative Example 5B, step (A) of Example 5B, and step (A) of Example 1A, which has the property of chemically reacting when irradiated with ultraviolet light and crosslinking into a three-dimensional chemical structure, and which is a conventional liquid resist material that is widely used for plate making and corrosive etching of printed circuit boards) by a conventional spray coating method to form a liquid resist deposition film.
In this case, the conventional liquid resist material formed a liquid resist film on the top surface of the existing convex portion and the bottom surface of the existing concave portion, but no liquid resist film was formed on the side surface of the existing convex portion (side surface of the existing concave portion).
Thereafter, the plate was exposed to ultraviolet light through an exposure mask member of a desired shape (an exposure mask member having through holes of an "ABCDE pattern" in the area corresponding to the area of the existing convex portion 47 formed on the plate substrate first region surface 11 of the plate substrate when the exposure mask member is placed on the surface of the plate substrate), and having a light blocking portion in the surrounding area), and then a developer (aqueous sodium carbonate solution) was used to remove and develop the resist film in the area not irradiated with ultraviolet light, and then the attached conventional resist film was hardened by a conventional method such as after-baking to form a hardened film on the bottom surface of the existing concave portion as shown in (C) and (C-a) of FIG. 22, and a conventional resist hardened film 30 having the desired "ABCDE pattern" was formed on the upper surface of the existing convex portion. The thickness of the conventional resist hardened film 30 was in the range of about 0.02 mm to about 0.04 mm.

(C) Corrosive Etching Process.
As shown in FIG. 22(D), an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the conventional resist hardened film 30 was formed, using a paddle blow-up method, and the area on which the conventional resist hardened film was not attached was etched to a depth dimension of about 0.9 mm.
As a result, the upper surface of the existing convex portion 47 was etched to form a pre-formed convex portion upper surface multiple uneven portion 477a having a pre-formed convex portion upper surface multiple uneven portion concave portion 472a formed with multiple concave shapes and a pre-formed convex portion upper surface multiple uneven portion convex portion 471a formed with multiple convex shapes.
In this case, side etching in the form of a depression was generated on the side surface of the existing convex portion (the side surface of the existing concave portion).

(D) Conventional resist hardened film removal process.
As shown in FIG. 22E, the conventional resist hardened film 30 was removed using a general-purpose resist remover (caustic soda solution or sodium hydroxide solution).

In the above-mentioned "(C) Corrosive Etching Step", the side surface of the existing convex portion 47 (side surface of the existing concave portion 48) on which the cured film was not attached was also corroded and etched, resulting in side etching as shown in Figures 22(D) and (E). In other words, a pressing plate having the desired shape accuracy and dimensional accuracy was not obtained.
Such a side-etched shape is not the desired shape but is an undesirable shape, and when a pressing mold having such a side-etched uneven portion formed therein is used to process a workpiece, there is a problem that a workpiece processed into the desired uneven shape cannot be obtained, which is undesirable.

<Comparative Example 5B-a (Processing of workpiece using the press processing plate of Comparative Example 5B)>
In this comparative example, the pressing plate 10 manufactured in "Comparative Example 5B" above is used as the embossing plate 10 of a flat pressure processing device to emboss a paper sheet 108 as the workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 manufactured in Comparative Example 5B.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface was placed on the second base 93 of the pressing device.
(S-e) In this state, a 1.5 mm thick paper sheet 108 serving as the workpiece 108 was positioned between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness formation portion on the surface of the workpiece 108 having an uneven shape that matches the uneven shape of the multiple uneven portions 477a on the upper surface of the existing convex portion 47 of the mold substrate.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
In this manner, a processed product was prepared in which the paper sheet 108 as the workpiece 108 was embossed with a concave-convex shape having a graphic character pattern that matches the graphic character pattern formed in a concave-convex shape on the multiple concave-convex portions 477a on the upper surface of the existing convex portion 47 of the plate mold substrate.

In this case, when the pressing process was repeated, the workpiece 108 was partially driven to separate from the pressing plate while being stuck or caught on the pressing plate. That is, due to the shape of the side of the side-etched existing convex portion (the side of the multiple side-etched existing concave portions) of the pressing plate, the workpiece 108 was partially driven to stick or catch on the pressing plate due to the shape of the side etching. As a result, a workpiece having a desired concave-convex shape was not obtained.

Example 6A (Production of embossing plate as pressing plate)
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 12", and is a method for manufacturing a pressing plate shown in (A) to (D) and (A-b) to (D-b) in Fig. 11, which forms a "graphical character pattern formed in a concave-convex shape" on the bottom surface of a pre-formed concave portion 48 of a plate mold substrate having a pre-formed convex portion 47 and a pre-formed concave portion 48. This pressing plate is used as an embossing plate.
In this embodiment, a pre-formed uneven portion 47 and a pre-formed recess 48 were formed by a process including a process using a conventional general-purpose conventional dry film resist material, and a plate mold substrate on which the pre-formed protrusion 47 and the pre-formed recess 48 were formed was then treated by a process including a process using an inkjet resist material to form "pre-formed recess bottom surface multiple uneven portions 488, 488b formed with multiple uneven shapes corresponding to a graphic, letter, and picture pattern formed with uneven shapes" on the bottom surface of the pre-formed recess 48, thereby preparing a plate for pressing processing.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of brass and has a generally flat plate shape with an "h" of 7 mm, a width of 125 mm, and a length of 90 mm.

Next, a conventional general-purpose conventional dry film resist material (a desired conventional dry film resist material (the same conventional dry film resist material as used in step (A) of Example 3B, with a thickness of about 0.02 mm to about 0.04 mm) was selected from among commercially available general-purpose conventional dry film resist materials) and used to adhere to the entire surface of the plate mold substrate 1, forming a resist-attached film.
Then, the resist film was irradiated with ultraviolet light through an exposure mask member having through holes for light transmission formed on the first region surface 11 of the plate mold substrate, and then unnecessary resist film was removed from the region not irradiated with ultraviolet light using a commercially available general-purpose conventional developer (aqueous sodium carbonate solution). Then, the resist film was aged by heating and baking in a predetermined conventional manner. In this way, a resist cured film having a desired rectangular shape was formed.

Next, a commercially available general-purpose conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film had been formed, and the surface of the plate mold substrate on which the resist hardened film had not been adhered was etched until the depth dimension reached approximately 1.0 mm, thereby forming a pre-formed recess 48 formed in a concave shape on the plate mold substrate, and a pre-formed protrusion 47 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose conventional resist remover (aqueous caustic soda solution).
In this manner, a pre-formed convex portion 47 formed in a convex shape and a pre-formed concave portion 48 formed in a concave shape were formed on the plate mold substrate as shown in FIGS. 11(A) and (Ab).
The depth of the existing recess 48 was about 1.0 mm, and the height of the existing protrusion 47 was about 1.0 mm, which corresponds to the depth of the existing recess 48 .

(B) Step of forming a hardened inkjet resist film in a desired area.
Next, as shown in Figures 11(B) and (B-b), the inkjet resist material 2 was applied by the inkjet method to cover the existing convex side surface 47b, the existing concave side surface 48b, and the existing convex upper surface 47a of the plate mold substrate 1, and the inkjet resist material 2 was also applied by the inkjet method to the bottom surface of the existing concave bottom surface 48c, thereby forming (a) an inkjet resist applied film in a desired area having the desired graphic and letter pattern of a "heart pattern" as shown in Figure 11(B-b). In this case, it was confirmed that the inkjet resist material was applied to the existing convex side surface 47b and the existing concave side surface 48b.
The existing convex side surface 47b and the existing concave side surface 48b refer to the same region.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material used in the step (B) of the above-mentioned Example 1A) that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25°C) was selected and used from among the inkjet resist materials available on the market, and the inkjet resist deposition film was formed by deposition under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, by a method similar to the step (B) of the above-mentioned Example 1A, the inkjet resist deposition film formed and deposited on the plate mold substrate was irradiated with ultraviolet light, and then burning was performed at 120°C for 10 minutes to form a cured desired area inkjet resist cured film 3 on the existing convex side surface 47b, the existing concave side surface 48b, and the existing convex upper surface 47a, and a cured desired area inkjet resist cured film 3 with a graphic character pattern (heart pattern) was formed on the bottom surface of the existing concave bottom surface 48c. The thickness of each of the desired area inkjet resist cured films was in the range of about 0.03 mm to about 0.05 mm. In this manner, each of the desired area inkjet resist cured films 3 was formed.

(C) Corrosive Etching Process.
11(C) and (C-b), an etching solution is brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 is formed, and etching is performed until the depth reaches about 0.1 mm at the bottom surface of the existing recess bottom surface 48c of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 is not attached, thereby forming an existing recess bottom surface multiple fine unevenness 488b having an existing recess bottom surface multiple fine unevenness concave 482b formed with multiple concave shapes corresponding to the desired graphic character pattern and an existing recess bottom surface multiple fine unevenness convex 481b formed with multiple convex shapes. Note that the existing recess bottom surface multiple fine unevenness 488b corresponds to the existing recess bottom surface unevenness 488.

(D) Removal process of hardened inkjet resist film from desired area.
As shown in FIG. 11(D) and (Da), the inkjet resist hardened film 3 was removed from the desired area.
In this way, a pre-formed recess bottom surface multiple fine unevenness portion 488b was formed on the bottom surface of the pre-formed recess bottom surface 48c, comprising a pre-formed recess bottom surface multiple fine unevenness portion concave portion 482b formed with a plurality of concave shapes and a pre-formed recess bottom surface multiple fine unevenness portion convex portion 481b formed with a plurality of convex shapes.

The depth dimension of the concave portions 482b of the multiple fine concave-convex portions on the bottom surface of the existing recess (the height dimension of the convex portions 481b of the multiple fine concave-convex portions on the bottom surface of the existing recess) was approximately 0.1 mm.
The depth dimension of the existing recess 48 (the height dimension of the existing protrusion 47) was about 1.9 mm.

It was also confirmed that the side surfaces of the existing recesses 48 in Figures 11(D) and (D-b) (corresponding to the side surfaces of the existing protrusions 47) were not etched and maintained the normal desired shape shown in Figure 11(D).
In this way, a pressing plate 10 was manufactured having a preformed convex portion 47 and a preformed concave portion 48, and having multiple fine concave-convex portions 488b on the bottom surface of the preformed concave portion 48 formed in a "heart pattern" with an uneven shape on the bottom surface of the preformed concave portion.

In addition, in this embodiment, it was confirmed that the pre-formed convex portion 47 and the pre-formed concave portion 48 have the normal desired shape accuracy and dimensional accuracy, and that the pre-formed concave portion 47 has multiple normal and desired fine concave and convex portions 488b formed on the bottom surface of the pre-formed concave portion.
It was also confirmed that the side surface of the existing recess 48 (corresponding to the existing protrusion 47) was not etched in a recessed state due to the side etching phenomenon, and the desired shape precision was achieved.

<Example 6A-a (Processing of workpiece using the pressing plate of Example 6A)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned Example 6A is used as the embossing plate 10 of a flat pressure processing device to emboss a paper sheet 108 having a silvery glossy surface as the workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the previously formed convex portions and previously formed concave portions manufactured in Example 6A.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface without irregularities was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 having a thickness of approximately 1.5 mm and a silvery glossy surface was positioned between the pressing plate 10 (embossing plate) and the receiving plate 94 as the workpiece 108, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness formation portion on the surface of the workpiece 108 having an uneven shape that matches the uneven shape of the multiple uneven portions 488b on the bottom surface of the pre-formed recess 47 of the mold substrate.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which the paper sheet 108 serving as the workpiece 108 was embossed with a concave-convex shape approximately 0.1 mm deep and having a "heart pattern" graphic pattern that matches the graphic pattern of the multiple concave-convex portions 488b on the bottom surface of the pre-formed recess 47 of the plate mold substrate.

In the embodiment of the method for processing the workpiece, a workpiece was obtained in which a "heart pattern" graphic picture pattern was formed with a concave-convex shape having the desired shape accuracy and dimensional accuracy without any abnormality occurring on the paper sheet 108 as the workpiece 108. It was confirmed that the "heart pattern" graphic picture pattern formed on the workpiece was formed without any abnormality and with fine concave-convex shapes having the desired step difference of about 0.1 mm.

Comparative Example 6A (Production of a press-processing plate using a conventional liquid resist material)
This comparative example is a manufacturing method for a pressing plate in which a plurality of concave-convex portions 488a are formed on the bottom surface of a pre-formed recess 48 by using a conventional liquid resist material instead of an inkjet resist material in the steps (B), (C), and (D) of Example 6A described above, in which a plurality of concave-convex portions 488a are formed on the bottom surface of the pre-formed recess 48.

This comparative example will be described in detail below.
FIG. 23 is a schematic diagram for explaining the manufacturing steps of a conventional method for manufacturing a plate for pressing.
(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
Using the same method as in Example 6A described above, a plate-shaped, brass plate-shaped substrate with a thickness of 7 mm, a width of 125 mm and a length of 90 mm and a conventional dry film resist material were used to form a pre-formed convex portion 47 formed in a convex shape on the plate-shaped substrate first area surface 11 of the plate-shaped substrate, and a pre-formed concave portion 48 formed in a concave shape on the plate-shaped substrate second area surface 12, as shown in Figures 23 (A) and (A-b).
The depth of the existing recess 48 was about 1.0 mm, and the height of the existing protrusion 47 was about 1.0 mm, which corresponds to the depth of the existing recess 48 .

(B) A conventional liquid resist hardened film forming process.
As shown in Figures 23(B) and (B-b), the entire surface of the plate mold substrate on which the pre-formed convex portion 47 and the pre-formed concave portion 48 were formed was covered with a conventional liquid resist material 20 (the same liquid resist material as that used in step (A) of the above-mentioned Example 1A, which has the property of reacting chemically when irradiated with ultraviolet light and crosslinking into a three-dimensional chemical structure, and which is a conventional liquid resist material that is widely used for plate making and corrosive etching of printed circuit boards) by a conventional spray coating method to form a liquid resist adhesion film.
In this case, the conventional liquid resist material formed a liquid resist film on the upper surface of the existing convex portion and the bottom surface of the existing concave portion, however, no liquid resist film was formed on the existing convex portion side surface 47b (existing concave portion side surface 48b).
Thereafter, the plate was exposed to ultraviolet light through an exposure mask member of a desired shape (an exposure mask member having a through hole of a "heart E pattern" in a portion corresponding to the region of the existing recess 48 formed on the plate mold substrate first region surface 11 of the plate mold substrate when the exposure mask member is placed on the surface of the plate mold substrate, and having a light blocking portion in the surrounding region, and then a developer (aqueous sodium carbonate solution) was used to remove and develop the resist deposition film in the region not irradiated with ultraviolet light, and then the deposited conventional resist deposition film was hardened by a conventional method such as after-baking to form a hardened film on the upper surface of the existing protrusion 47 as shown in FIG. 23(C) and (C-b), and a conventional resist hardened film 30 having a desired "heart pattern" was formed on the bottom surface of the existing recess. The thickness of the conventional resist hardened film 30 was in the range of about 0.02 mm to about 0.04 mm.
However, no cured film was formed on the side surfaces of the existing recessed portion (side surfaces of the existing protruding portion).

(C) Corrosive Etching Process.
As shown in FIG. 23(D), an etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the conventional resist hardened film 30 was formed, using a paddle blow-up method, and the area on which the conventional resist hardened film was not attached was etched to a depth dimension of about 0.1 mm.
As a result, the bottom surface of the existing recess 48 was etched to form a pre-formed recess bottom surface multiple unevenness portion 488b having a pre-formed recess upper bottom surface multiple unevenness portion concave portion 482b formed with multiple concave shapes and a pre-formed recess bottom surface multiple unevenness portion convex portion 481b formed with multiple convex shapes.
In this case, side etching in the form of a depression was generated on the side surface of the existing concave portion (the side surface of the existing convex portion).

(D) Conventional resist hardened film removal process.
As shown in FIG. 23E, the conventional resist hardened film 30 was removed using a general-purpose resist remover (caustic soda solution or sodium hydroxide solution).

In the above-mentioned "(C) Corrosive Etching Process", the side surface of the existing recess 48 (the side surface of the existing protrusion 47) on which no hardened film was attached was also corrosively etched, resulting in side etching as shown in Figures 23(D) and (E).
In addition, the graphic picture pattern (heart pattern) of the bottom surface of the existing recess 48 formed in a concave-convex shape on the bottom surface of the existing recess 48 was unclear, and the graphic picture pattern (heart pattern) of the desired shape and dimensions could not be formed. This is thought to be due to the fact that in the process of exposing the resist-adhered film through the exposure mask member, the exposure mask member is not in close contact with the resist-adhered film, and therefore a conventional resist hardened film having the desired shape and dimensions could not be formed. In other words, a pressing plate having the desired shape and size accuracy was not obtained.

Example 6B (Production of embossing plate as pressing plate)
This embodiment is a method for manufacturing a pressing plate similar to the above-mentioned "subordinate configuration 12", and is a method for manufacturing a pressing plate shown in (A) to (D) and (A-a) to (D-a) of Fig. 11, which forms a "graphical character pattern formed in a concave-convex shape" on the bottom surface of a pre-formed concave portion 48 of a plate mold substrate having a pre-formed convex portion 47 and a pre-formed concave portion 48. This pressing plate is used as an embossing plate.
In this embodiment, a pre-formed uneven portion 47 and a pre-formed recess 48 were formed by a process including a process using an inkjet resist material, and a plate mold substrate on which the pre-formed protrusion 47 and the pre-formed recess 48 were formed was prepared by a process including a process using an inkjet resist material to form "pre-formed recess bottom surface multiple uneven portions 488, 488a formed with multiple uneven shapes corresponding to a graphic, letter, and picture pattern formed with uneven shapes" on the bottom surface of the pre-formed recess 48, thereby preparing a plate for pressing processing.
This embodiment will be described in detail below.

(A) A step of preparing and supplying a plate mold substrate 1 having a plate mold substrate first area surface 11 having a preformed convex portion 47 and a plate mold substrate second area surface 12 having a preformed concave portion 48.
A plate mold substrate 1 having a planar surface shape was prepared, which includes a plate mold substrate first region surface 11 having a planar surface shape and a plate mold substrate second region surface 12 having a planar surface shape. The plate mold substrate 1 is made of brass and has a generally flat plate shape with a thickness "h" of 7 mm, a width of 125 mm, and a length of 90 mm.

Next, in order to form a rectangular area in the central region of the mold substrate where no inkjet resist material was attached, an inkjet resist material was used to attach to the peripheral region of the surface of the mold substrate 1 using an inkjet method, forming an inkjet resist attachment film in the peripheral region of the mold substrate.
In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, among commercially available inkjet resist materials, an inkjet resist having a property of chemically reacting with ultraviolet irradiation to crosslink into a three-dimensional chemical structure and having a viscosity of 10 mPa·s to 20 mPa·s (25°C) (the same inkjet resist material as that used in step (B) of the above-mentioned Example 1A) was selected and used, and the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet rays, and then burning was performed at 120°C for 10 minutes to form a resist cured film having a desired approximately rectangular shape.
The thickness of the cured inkjet resist film ranged from about 0.03 to about 0.05 mm.

Next, a commercially available general-purpose conventional etching solution (aqueous ferric chloride solution) was brought into contact with the surface of the plate mold substrate 1 on which the resist hardened film had been formed, and the surface of the plate mold substrate on which the resist hardened film had not been attached was etched until the depth dimension reached approximately 0.4 mm, thereby forming a pre-formed recess 48 formed in a concave shape on the plate mold substrate, and a pre-formed protrusion 47 formed in a convex shape.
Next, the hardened resist film was removed using a commercially available general-purpose conventional resist remover (aqueous caustic soda solution).
In this manner, a pre-formed convex portion 47 formed in a convex shape and a pre-formed concave portion 48 formed in a concave shape were formed on the plate mold substrate as shown in FIGS. 11(A) and (Aa).
The depth of the existing recess 48 was about 0.4 mm, and the height of the existing protrusion 47 was about 0.4 mm, which corresponds to the depth of the existing recess 48 .

(B) Step of forming a hardened inkjet resist film in a desired area.
Next, as shown in Fig. 11(B) and (B-a), the inkjet resist material 2 was applied by the inkjet method to cover the existing convex side surface 47b, the existing concave side surface 48b, and the existing convex upper surface 47a of the plate mold substrate 1, and the inkjet resist material 2 was applied by the inkjet method to the bottom surface of the existing concave bottom surface 48c, forming a desired region inkjet resist applied film having the desired graphic character pattern of "ABCDE pattern" as shown in Fig. 11(B-b). In this case, it was confirmed that the inkjet resist material was applied to the existing convex side surface 47b and the existing concave side surface 48b.
The existing convex side surface 47b and the existing concave side surface 48b refer to the same region.

In this step, an on-demand inkjet printing system device manufactured by Microcraft was used. As the inkjet resist material, an inkjet resist material (the same inkjet resist material used in step (B) of Example 1A and step (A) of this example) that has a property of chemically reacting with ultraviolet light irradiation to crosslink into a three-dimensional chemical structure and has a viscosity of 10 mPa·s to 20 mPa·s (25° C.) was selected from among commercially available inkjet resist materials and used, and the inkjet resist deposition film was formed by deposition under the condition that the amount of droplets discharged from the discharge nozzle was 2 pl to 15 pl. Then, by a method similar to the process (B) of Example 1A described above, the inkjet resist film formed on the plate mold substrate was irradiated with ultraviolet light, and then burned at 120° C. for 10 minutes to form a desired area inkjet resist cured film 3 cured on the entire surface of the existing convex side 47b, the existing concave side 48b, and the existing convex top surface 47a, and also formed a desired area inkjet resist cured film 3 cured with a graphic pattern (ABCDE pattern) on the bottom surface of the existing concave bottom surface 48c. The thickness of each desired area inkjet resist cured film was in the range of about 0.03 mm to about 0.05 mm. In this manner, each desired area inkjet resist cured film 3 was formed.

(C) Corrosive Etching Process.
11(C) and (C-a), an etching solution was brought into contact with the surface of the plate mold substrate 1 on which the desired region inkjet resist hardened film 3 was formed, and etching was performed until the depth reached about 0.6 mm at the bottom surface of the existing recess bottom surface 48c of the plate mold substrate 1 to which the desired region inkjet resist hardened film 3 was not attached, thereby forming an existing recess bottom surface multiple uneven portion 488a having an existing recess bottom surface multiple uneven portion concave portion 482a formed with multiple concave shapes corresponding to the desired graphic character pattern of the "ABCDE pattern" and an existing recess bottom surface multiple uneven portion convex portion 481a formed with multiple convex shapes. Note that the existing recess bottom surface multiple uneven portion 488a corresponds to the existing recess bottom surface uneven portion 488.

(D) Step of removing the hardened inkjet resist film from the desired area.
As shown in FIGS. 11(D) and (Db), the inkjet resist hardened film 3 was removed from the desired area.
In this way, a pre-formed recess bottom surface multiple uneven portion 488a was formed on the bottom surface of the pre-formed recess bottom surface 48c, comprising a pre-formed recess bottom surface multiple uneven portion concave portion 482a formed with multiple concave shapes and a pre-formed recess bottom surface multiple uneven portion convex portion 481a formed with multiple convex shapes.

The depth dimension of the pre-formed recess 48 (height dimension of the pre-formed protrusion 47) was about 0.4 mm, and the depth dimension of the pre-formed recess bottom surface multiple uneven portion concaves 482a of the "ABCDE pattern" formed on the bottom surface of the pre-formed recess 48 (height dimension of the pre-formed recess bottom surface multiple uneven portion convex portions 481a) was about 0.6 mm. In other words, the distance from the surface of the plate mold substrate to the bottom surface of the pre-formed recess bottom surface multiple uneven portion concaves 482a was about 1.0 mm.

It was confirmed that the side surface of the existing recess 48 in Figures 11(D) and (Da) (corresponding to the side surface of the existing protrusion 47) was not etched and maintained the normal desired shape shown in Figure 11(D).
In this way, a pressing processing plate 10 was manufactured having a preformed convex portion 47 and a preformed concave portion 48, and also having multiple preformed concave-convex portions 488a on the bottom surface of the preformed concave portion bottom surface 48 formed in an uneven shape with an "ABCDE pattern."

In this embodiment, it was confirmed that the preformed convex portion 47 and the preformed concave portion 48 have normal desired shape accuracy and dimensional accuracy, and that the preformed concave portion 47 has multiple preformed concave and convex portions 488a formed on the bottom surface of the preformed concave portion 47 having normal desired shape accuracy and dimensional accuracy.
It was also confirmed that the side surface of the existing recess 48 (corresponding to the existing protrusion 47) was not etched in a recessed state due to the side etching phenomenon, and the desired shape precision was achieved.

<Example 6B-a (Processing of workpiece using the pressing plate of Example 6B)>
In this embodiment, the pressing plate 10 manufactured in the above-mentioned embodiment 6B is used as the embossing plate 10 of a flat pressure type processing device to emboss a paper sheet 108 as a workpiece 108.
The workpiece was embossed according to the following steps:
(Sa) An embossing plate 10 was prepared as the pressing plate 10 having the previously formed convex portions and previously formed concave portions manufactured in Example 6B.
(Sb) As shown in FIG. 16(A), a pressing device having a first base 92 and a second base 93 facing each other was prepared.
(Sd) A separately prepared stainless steel receiving plate 94 having a smooth flat surface without irregularities was placed on the second base 93 of the pressing device.
(S-e) In this state, a paper sheet 108 having a thickness of approximately 1.5 mm was positioned as the workpiece 108 between the pressing plate 10 (embossing plate) and the receiving plate 94, and in this state, at least one of the first base 92 and the second base 93 was driven by a conventional driving method, so that the pressing plate 10 and the receiving plate 94 pressed the workpiece 108.
This resulted in the formation of a workpiece unevenness formation portion on the surface of the workpiece 108 having an uneven shape that matches the uneven shape of the multiple uneven portions 488a on the bottom surface of the pre-formed recess 48 of the mold substrate.
(S-f) At least one of the bases of the pressing plate 10 (embossing plate) and the receiving plate 94 was driven to move the pressing plate 10 (embossing plate) and the receiving plate 94 away from each other, thereby releasing the pressure on the workpiece.
This resulted in the preparation of a processed product in which the paper sheet 108 serving as the workpiece 108 was embossed with an uneven "ABCDE pattern" having a pictorial pattern that matches the multiple uneven portions 488a (pictorial pattern formed in an uneven shape) on the bottom surface of the pre-formed recess 48 of the plate mold substrate.

In the embodiment of the present method for processing a workpiece, a workpiece was obtained in which a graphic picture pattern of "ABCDE pattern" was formed in an uneven shape having the desired shape accuracy and dimensional accuracy without any abnormality occurring on the paper sheet 108 as the workpiece 108. It was confirmed that the graphic picture pattern of "ABCDE pattern" formed on the workpiece was formed in an uneven shape having the desired uneven step without any abnormality.

According to the method for producing a plate for pressing of the present invention, a chemical etching process is carried out,
It is possible to manufacture a press processing plate having the desired shape, in which the desired graphic character pattern, such as a desired letter, a desired symbol, a desired design, a desired picture, etc., or a desired fine graphic character pattern, is formed with convex portions, concave portions, uneven portions, and/or fine uneven portions, has the desired shape accuracy and dimensional accuracy, and corrosive etching of "areas of the plate mold substrate that should not be etched" is suppressed.

By using the pressing plate of the present invention,
A press processing plate is obtained which has the desired graphic character pattern, such as a desired letter, a desired symbol, a desired design, a desired picture, or a desired fine graphic character pattern, and which has the desired shape precision and dimensional precision formed by convex portions, concave portions, uneven portions, and/or fine uneven portions, while the corrosive etching of the "areas of the plate mold substrate which should not be etched" is suppressed.

The method for processing a workpiece of the present invention can be used to prepare processed products by processing and shaping workpieces such as paper, corrugated cardboard, plastic films, plastic boards, plastic moldings, and laminates thereof into shapes having the desired shape precision and dimensional precision, and having recesses, protrusions, and/or uneven parts having the desired graphic or letter pattern, or the desired fine graphic or letter pattern.

1 Plate mold substrate 10 Pressing plate 11 Plate mold substrate first region surface 12 Plate mold substrate second region surface 121 Inkjet resist film corroded second recessed portion 121a Conventional conventional second recessed portion 121b Corroded second recessed portion 121s during etching Side-etched corroded second recessed portion 2 Inkjet resist material 20 Conventional resist material, conventional liquid resist material, conventional dry film resist material 23 Exposure mask member 3 Desired area inkjet resist hardened film 3a Desired area inkjet resist convex portion upper surface hardened film 3b Desired area inkjet resist convex portion side surface hardened film 3c Desired area inkjet resist concave bottom surface hardened film 3e Desired area inkjet resist fine convex portion upper surface hardened film 3f Desired area inkjet resist fine convex portion side surface hardened film 3g Desired area inkjet resist fine convex portion bottom surface hardened film 30 Conventional resist hardened film 30a Conventional resist convex portion upper surface hardened film,
30c Conventional resist recess bottom hardened film,
30e: Hardened film on top of conventional resist fine convex portion 30g; Hardened film on bottom of conventional resist fine concave portion 4; Pre-formed concave portion 41; Pre-formed convex portion 411; Inkjet film corrosion; Pre-formed convex portion protrusion 42; Pre-formed concave portion 45; Pre-formed multiple concave portions 450; Conventional conventional machining concave portion protrusion 451 formed by conventional conventional machining; Pre-formed multiple concave portions convex portion 451a; Multiple pre-formed multiple concave portions convex portion upper surface 451b; Multiple pre-formed multiple concave portions convex portion side surface 451s; Multiple side-etched pre-formed multiple concave portions convex portion side surface 452; Multiple pre-formed multiple concave portions concave portion 452b; Multiple pre-formed multiple concave portions concave portion side surface 452c; Multiple pre-formed multiple concave portions concave portion bottom surface 452s; Multiple side-etched pre-formed multiple concave portions concave portion side surface 455; Inkjet film corrosion; Pre-formed multiple concave portions protrusion portion 455s; Multiple side-etched pre-formed multiple concave portions protrusion portion 46 Preformed multiple fine unevenness portions 46b Preformed multiple fine unevenness portion side surface,
461 A plurality of previously formed multiple fine unevenness convex portions 461a A plurality of previously formed multiple fine unevenness convex portion upper surfaces 461b A plurality of previously formed multiple fine unevenness convex portion side surfaces 461s A plurality of side-etched previously formed multiple fine unevenness convex portion side surfaces 462 A plurality of previously formed multiple fine unevenness concave portions 462b A plurality of previously formed multiple fine unevenness concave portion side surfaces 462c A plurality of previously formed multiple fine unevenness concave portions bottom surfaces 462s A plurality of side-etched previously formed multiple fine unevenness concave portions side surfaces 466 Inkjet film corrosion previously formed multiple fine unevenness protrusion portions 466s A plurality of side-etched previously formed multiple fine unevenness protrusion portions 47 Previously formed convex portion 47a Previously formed convex portion upper surface 47b Previously formed convex portion side surface 471a Previously formed convex portion upper surface multiple unevenness convex portion 471b Previously formed convex portion upper surface multiple fine unevenness convex portion 472a Previously formed convex portion upper surface multiple unevenness concave portion 472b Pre-formed convex portion upper surface multiple fine unevenness concave portion 477 Pre-formed convex portion upper surface uneven portion 477a Pre-formed convex portion upper surface multiple uneven portion 477b Pre-formed convex portion upper surface multiple fine uneven portion 48 Pre-formed concave portion 48b Pre-formed concave portion side surface 48c Pre-formed concave portion bottom surface 481a Pre-formed concave portion bottom surface multiple uneven portion convex portion 481b Pre-formed concave portion bottom surface multiple fine uneven portion convex portion 482a Pre-formed concave portion bottom surface multiple uneven portion concave portion 482b Pre-formed concave portion bottom surface multiple fine uneven portion concave portion 488 Pre-formed concave portion bottom surface uneven portion 488a Pre-formed concave portion bottom surface multiple uneven portion 488b Pre-formed concave portion bottom surface multiple fine uneven portion 92 First base 93 Second base 94 Support plate 96 Main roll 97 Counter roll 100 Conventional pressing plate 108 Workpiece 108a Workpiece substrate 108b Sheet-like foil material D1 Height dimension of the convex part of the existing multiple concave-convex part, depth dimension D3 of the concave part of the existing multiple concave-convex part Etching depth D12 during etching Depth dimension D12a of the second concave part formed by etching of the inkjet resist film Depth dimension d1 of the conventional second concave part Height dimension of the convex part of the existing multiple fine concave-convex part, depth dimension d3 of the concave part of the existing multiple fine concave-convex part Etching depth d12 during etching Depth dimension d12a of the second concave part formed by etching of the inkjet resist film Depth dimension W1 of the conventional second concave part Width dimension W2 of the convex part of the existing multiple concave-convex part Width dimension w1 of the concave part of the existing multiple fine concave-convex part Width dimension w2 of the concave part of the existing multiple fine concave-convex part Width dimension h of the concave part of the existing multiple fine concave-convex part Thickness dimension of the substrate for the plate mold

Claims (22)

A method for manufacturing a press plate for processing a workpiece into a predetermined shape by pressing the workpiece, comprising the steps of:
(A) a plate mold substrate supplying step of supplying a plate mold substrate (1) having a plate mold substrate first area surface (11) and a plate mold substrate second area surface (12);
(B) a desired area inkjet resist deposition film formation step of depositing an inkjet resist material (2) on a desired area of the first area surface (11) of the plate mold substrate (1) by an inkjet method to form a desired area inkjet resist deposition film; and
a step of forming a cured inkjet resist film in a desired area by curing the inkjet resist film;
(C) a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is not attached;
As a result, a recessed portion formed by etching the inkjet resist film is formed in a recessed shape on the surface of the plate mold substrate (1),
as well as,
(D) a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film (3);
A method for manufacturing a press plate, comprising: In the step (A),
The second region surface (12) of the plate mold substrate has one or more non-irregular portions,
The first area surface (11) of the plate mold substrate has one or more preformed projections and recesses (4),
(i) the second region surface (12) of the plate mold substrate has one non-irregular portion,
When the first area surface (11) of the plate mold substrate has one preformed uneven portion (4),
The non-relief portion is located in the surrounding area of the existing relieving portion (4),
The preformed uneven portion (4) is
(a) A prefabricated multiple concave-convex portion (45) having a plurality of prefabricated multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of prefabricated multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
Or,
(B) A pre-formed multiple fine concave-convex portion (46) having a plurality of pre-formed multiple fine concave-convex portion convex portions (461) formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine concave-convex portion concave portions (462) formed with a plurality of fine concave shapes;
(ii) the second region surface (12) of the plate mold substrate has a plurality of non-irregular portions,
When the first region surface (11) of the plate mold substrate has a plurality of preformed concave-convex portions (4),
Each of the plurality of non-relief portions is located in a peripheral region of each of the plurality of pre-formed recessed and protruding portions (4),
Each of the plurality of pre-formed uneven portions (4) is
(a) A prefabricated multiple concave-convex portion (45) having a plurality of prefabricated multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of prefabricated multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
and/or
(B) A pre-formed multiple fine concave-convex portion (46) having a plurality of pre-formed multiple fine concave-convex portion convex portions (461) formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine concave-convex portion concave portions (462) formed with a plurality of fine concave shapes;
In the step (B),
a desired area inkjet resist deposition film forming step of depositing an inkjet resist material (2) by an inkjet method to cover the existing uneven portion (4) on the first area surface (11) of the plate mold substrate (1) to form a desired area inkjet resist deposition film;
as well as,
and a desired area inkjet resist cured film forming step of curing the desired area inkjet resist deposited film to form a desired area inkjet resist cured film (3),
In the step (C),
a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch the plate mold substrate second region surface (12) on which the desired region inkjet resist cured film is not attached, thereby etching the plate mold substrate second region surface (12) without etching the existing uneven portion (4), and forming an inkjet resist film etched second recessed portion 121 formed in a recess shape, wherein the inkjet resist film etched second recessed portion 121 corresponds to the inkjet resist film etched recessed portion;
In the step (D),
a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film (3),
As a result, the second region surface (12) of the plate mold substrate is etched without etching the pre-formed uneven portion (4), forming a concave-shaped inkjet resist film etching second concave-forming portion (121), and forming the pre-formed uneven portion (4) into a protruding shape protruding from the inkjet resist film etching second concave-forming portion 121.
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The second area surface (12) of the plate mold substrate has a non-irregular portion having no irregularities,
The first area surface (11) of the plate mold substrate has a preformed uneven portion (4),
The second surface (12) of the plate mold substrate is located in the peripheral area of the first surface (11) of the plate mold substrate;
The preformed uneven portion (4) has a preformed multiple uneven portion (45),
(a) the preformed multiple concave-convex portion (45) has a plurality of preformed multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of preformed multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
The plurality of preformed uneven portion convex portions (451) have a plurality of preformed uneven portion convex portion upper surfaces (451a) and a plurality of preformed uneven portion convex portion side surfaces (451b),
The plurality of preformed concave portions (452) have a plurality of preformed concave portion bottom surfaces (452c) and a plurality of preformed concave portion side surfaces (452b),
Here, the plurality of already-formed multiple uneven portion convex portion side surfaces (451b) and the plurality of already-formed multiple uneven portion concave portion side surfaces (452b) correspond to the same side surface area,
In the step (B),
an inkjet resist film forming process for covering the upper surfaces (451a) of the convex portions of the multiple pre-formed concave-convex portions, the side surfaces (451b) of the multiple pre-formed concave-convex portions, and the bottom surfaces (452c) of the multiple pre-formed concave-convex portions by applying an inkjet resist material (2) by an inkjet method to form an inkjet resist convex portion upper surface adhering film, an inkjet resist convex portion side surface adhering film, and an inkjet concave portion bottom surface adhering film, in which the inkjet resist material (2) is not adhered to the second region surface (12) of the plate mold substrate located in the peripheral region of the multiple pre-formed concave-convex portions (45); and
a desired region inkjet resist hardened film forming step of hardening the inkjet resist convex top surface adhered film, the inkjet resist convex side surface adhered film, and the inkjet resist concave bottom surface adhered film to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist convex top surface hardened film (3a), a desired region inkjet resist convex side surface hardened film (3b), and a desired region inkjet resist concave bottom surface hardened film (3c),
In the step (C),
a plate mold substrate etching step of contacting an etching solution with a surface of the plate mold substrate (1) on which the desired area inkjet resist convex portion top surface hardened film (3a), the desired area inkjet resist convex portion side surface hardened film (3b), and the desired area inkjet resist concave portion bottom surface hardened film (3c) are formed, to etch the plate mold substrate second area surface (12) on which the desired area inkjet resist hardened film 3 is not attached,
As a result, the second region surface (12) of the plate mold substrate is etched without etching the existing multiple concave and convex portions (45), and an inkjet resist film etching second concave forming portion (121) having an etched concave shape is formed,
The preformed multiple concave-convex portion (45) is formed into an inkjet film etched preformed multiple concave-convex portion protrusion portion (455) having a protruding shape protruding from the inkjet resist film etched second concave forming portion (121);
In the step (D),
a desired region inkjet resist cured film removal step of removing the desired region inkjet resist convex portion top surface cured film (3a), the desired region inkjet resist convex portion side surface cured film (3b), and the desired region inkjet resist bottom surface cured film (3c);
As a result, the pre-formed multiple concave and convex portions (45) are not etched, and the second region surface (12) of the plate mold substrate is etched to form the inkjet resist film etching second concave forming portion (121);
The first area surface (11) of the plate mold substrate having the pre-formed multiple concave-convex portion (45) having the pre-formed multiple concave-convex portion convex portions (451) and the pre-formed multiple concave-convex portion concave portions (452) is formed in the form of an inkjet film etched pre-formed multiple concave-convex portion protrusion portion (455) having a protruding shape protruding from a bottom surface of the inkjet resist film etched second concave forming portion (121).
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The preformed multiple concave-convex portion (45) having the preformed multiple concave-convex portion convex portion (451) and the preformed multiple concave-convex portion concave portion (452) is
(a) Characters,
(b) symbol,
(c) Figures,
(D) Design, and
(E) Pattern,
A graphic character pattern is formed by at least one uneven shape selected from the group consisting of:
The method for producing a pressing plate according to claim 3 . In the step (A),
The height dimension of each of the plurality of preformed multiple concave-convex portions (451) is 0.1 mm or more;
The depth dimension of each of the plurality of preformed concave-convex portions (452) is 0.1 mm or more;
The depth dimension of the inkjet resist film etching second recess formation portion (121) is the same as the depth dimension of the recess of the existing multiple unevenness portion, or is a depth dimension larger than the depth dimension of the recess of the existing multiple unevenness portion.
5. The method for producing a pressing plate according to claim 3 or 4. In the step (A),
The plate mold substrate (1) has a plate mold substrate first area surface (11) and a plate mold substrate second area surface (12),
The second area surface (12) of the plate mold substrate has a non-irregular portion having no irregularities,
The first area surface (11) of the plate mold substrate has a preformed uneven portion (4),
The second surface (12) of the plate mold substrate is located in the peripheral area of the first surface (11) of the plate mold substrate;
(b) the preformed uneven portion (4) has a preformed multiple fine uneven portions (46);
The preformed multiple fine concave-convex portion (46) has a plurality of preformed multiple fine concave-convex portion convex portions (461) and a plurality of preformed multiple fine concave-convex portion concave portions (462),
The plurality of previously formed fine concave-convex portions (461) have a plurality of previously formed fine concave-convex portion convex upper surfaces (461a) and a plurality of previously formed fine concave-convex portion convex side surfaces (461b),
The plurality of pre-formed fine concave/convex portions (462) have a plurality of pre-formed fine concave/convex portion concave bottom surfaces (462c) and a plurality of pre-formed fine concave/convex portion concave side surfaces (462b),
Here, the plurality of already-formed fine concave-convex portion convex side surfaces (461b) and the plurality of already-formed fine concave-convex portion concave side surfaces (462b) correspond to the same side surface region,
In the step (B),
an inkjet resist film forming process for covering the plurality of previously formed multiple fine concave-convex portion convex portion top surfaces (461a), the plurality of previously formed multiple fine concave-convex portion convex portion side surfaces (461b), and the plurality of previously formed multiple fine concave-convex portion concave bottom surfaces (462c) by applying an inkjet resist material (2) by an inkjet method to form an inkjet resist fine convex portion top surface attachment film, an inkjet resist fine convex portion side surface attachment film, and an inkjet fine concave portion side surface attachment film, wherein the inkjet resist material (2) is not attached to the second region surface (12) of the plate mold substrate located in the peripheral region of the previously formed multiple fine concave-convex portions (46); and
an inkjet resist hardened film forming step of hardening the inkjet resist fine convex upper surface adhered film, the inkjet resist fine convex side surface adhered film, and the inkjet resist fine recess side surface adhered film to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist fine convex upper surface hardened film (3e), a desired region inkjet resist fine convex side surface hardened film (3f), and a desired region inkjet resist fine recess bottom surface hardened film (3g);
In the step (C),
a plate mold substrate etching step of contacting an etching solution with a surface of the plate mold substrate (1) on which the desired area inkjet resist fine convex portion top surface hardened film (3e), the desired area inkjet resist fine convex portion side surface hardened film (3f), and the desired area inkjet resist fine concave portion bottom surface hardened film (3g) are formed, to etch the plate mold substrate second area surface (12) on which the desired area inkjet resist hardened film 3 is not attached;
As a result, the second region surface (12) of the plate mold substrate is etched without etching the pre-formed multiple fine concave and convex portions (46), and an inkjet resist film etching second concave forming portion (121) having an etched concave shape is formed,
The preformed multiple fine concave-convex portions (46) are formed in the form of inkjet film etching preformed multiple fine concave-convex portions protruding from the inkjet resist film etching second concave forming portion (121);
In the step (D),
a resist hardened film removing step of removing the hardened film (3e) on the top surface of the inkjet resist fine convex portion in the desired area, the hardened film (3f) on the side surface of the inkjet resist fine convex portion in the desired area, and the hardened film (3g) on the bottom surface of the inkjet resist fine concave portion in the desired area;
As a result, the pre-formed multiple fine concave and convex portions (46) are not etched, and the second region surface (12) of the plate mold substrate is etched to form the inkjet resist film etching second concave forming portion (121);
The first area surface (11) of the plate mold substrate having the pre-formed multiple fine unevenness portions (46) having the plurality of pre-formed multiple fine unevenness portion convex portions (461) and the plurality of pre-formed multiple fine unevenness portion concave portions (462) is formed in the form of an inkjet film corrosion pre-formed multiple fine unevenness portion protrusion portion (466) having a protruding shape protruding from a bottom surface of the inkjet resist film corrosion second concave forming portion (121).
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The preformed multiple fine concave-convex portion (46) having the preformed multiple fine concave-convex portion convex portions (461) and the preformed multiple fine concave-convex portion concave portions (462) is
(F) Fine dot patterns, fine pattern patterns, fine picture patterns, and/or fine lattice patterns,
(G) Fine line pattern,
(H) Fine stripes, and
(R) A latent image pattern that shows different pictorial patterns when viewed from different angles;
A fine graphic pattern is formed by forming at least one fine uneven shape selected from the group consisting of:
The method for producing a pressing plate according to claim 6 . In the step (A),
The preformed multiple fine unevenness portion (46) having the preformed multiple fine unevenness portion convex portions (461) and the preformed multiple fine unevenness portion concave portions (462) is formed by a combination of multiple types of unevenness pattern cells engraved with a fine uneven shape, partitioned into a predetermined shape, and arranged with regularity,
Each of the plurality of types of concave-convex pattern cells forms a fine graphic, letter, and picture pattern formed with at least two or more types of fine concave-convex shapes selected from the group consisting of a fine dot pattern, a fine design pattern, a fine picture pattern, a fine line pattern, and a fine stripe pattern;
A plurality of fine graphic character patterns of one type among the two or more types of fine graphic character patterns are gathered together to form a first image;
A second type of fine graphic character picture patterns different from the one type among the two or more types of fine graphic character picture patterns are gathered together to form another image.
The method for producing a pressing plate according to claim 6 or 7. In the step (A),
The height dimension of each of the plurality of preformed fine concave-convex portions (461) is 0.05 mm or more;
The width dimension of each of the plurality of preformed fine concave-convex portions (461) is 0.0005 mm to 1 mm;
The depth dimension of each of the plurality of preformed fine concave-convex concave portions (462) is 0.05 mm or more;
The width dimension of each of the plurality of preformed fine concave-convex concave portions (462) is 0.0005 mm to 1 mm;
The depth dimension of the inkjet resist film etching second recess formation portion (121) is a depth dimension larger than the depth dimension of the recess of the existing multiple fine unevenness portion.
9. The method for producing a press plate according to claim 6, wherein the pressing plate is made of a resin. In the step (A),
The second region surface (12) of the plate mold substrate has a plurality of non-irregular portions,
The first area surface (11) of the plate mold substrate has a plurality of preformed projections and recesses (4),
Each of the plurality of second region surfaces (12) of the plate mold substrate is located in a peripheral region of each of the plurality of first region surfaces (11) of the plate mold substrate,
One of the plurality of pre-formed uneven portions (4) is
(a) A prefabricated multiple concave-convex portion (45) having a plurality of prefabricated multiple concave-convex portion convex portions (451) formed with a plurality of convex shapes and a plurality of prefabricated multiple concave-convex portion concave portions (452) formed with a plurality of concave shapes;
Another one of the plurality of pre-formed uneven portions (4) is
(B) A pre-formed multiple fine concave-convex portion (46) having a plurality of pre-formed multiple fine concave-convex portion convex portions (461) formed with a plurality of fine convex shapes and a plurality of pre-formed multiple fine concave-convex portion concave portions (462) formed with a plurality of fine concave shapes;
The plurality of preformed uneven portion convex portions (451) have a plurality of preformed uneven portion convex portion upper surfaces (451a) and a plurality of preformed uneven portion convex portion side surfaces (451b),
The plurality of preformed concave portions (452) have a plurality of preformed concave portion bottom surfaces (452c) and a plurality of preformed concave portion side surfaces (452b),
Here, the plurality of already-formed multiple uneven portion convex portion side surfaces (451b) and the plurality of already-formed multiple uneven portion concave portion side surfaces (452b) correspond to the same side surface area,
The plurality of previously formed fine concave-convex portions (461) have a plurality of previously formed fine concave-convex portion convex upper surfaces (461a) and a plurality of previously formed fine concave-convex portion convex side surfaces (461b),
The plurality of pre-formed fine concave/convex portions (462) have a plurality of pre-formed fine concave/convex portion concave bottom surfaces (462c) and a plurality of pre-formed fine concave/convex portion concave side surfaces (462b),
Here, the plurality of already-formed fine concave-convex portion convex side surfaces (461b) and the plurality of already-formed fine concave-convex portion concave side surfaces (456b) correspond to the same side surface region,
In the step (B),
an inkjet resist film forming step of covering the plurality of pre-formed multiple concave-convex portion convex portion upper surfaces (451a), the plurality of pre-formed multiple concave-convex portion convex portion side surfaces (451b), the plurality of pre-formed multiple concave-convex portion concave bottom surfaces (452c), and the plurality of pre-formed multiple fine concave-convex portion convex portion upper surfaces (461a), the plurality of pre-formed multiple fine concave-convex portion convex portion side surfaces (461b), and the plurality of pre-formed multiple fine concave-convex portion concave bottom surfaces (462c) by applying an inkjet resist material (2) by an inkjet method to form an inkjet resist convex portion upper surface attachment film, an inkjet resist convex portion side surface attachment film, and an inkjet concave portion bottom surface attachment film, and an inkjet resist fine convex portion upper surface attachment film, an inkjet resist fine convex portion side surface attachment film, and an inkjet fine concave portion bottom surface attachment film, wherein the inkjet resist material (2) is not attached to the second region surface (12) of the plate mold substrate located in the peripheral region of the pre-formed multiple concave-convex portions (45); and
an inkjet resist hardened film forming step of applying the inkjet resist material (2) by an inkjet method, and hardening the inkjet resist convex portion top surface attached film, the inkjet resist convex portion side surface attached film, and the inkjet resist concave portion bottom surface attached film, and the inkjet resist fine convex portion top surface attached film, the inkjet resist fine convex portion side surface attached film, and the inkjet resist fine convex portion bottom surface attached film, to form a desired region inkjet resist hardened film 3 having a desired region inkjet resist convex portion top surface hardened film (3a), a desired region inkjet resist convex portion side surface hardened film (3b), a desired region inkjet resist concave portion bottom surface hardened film (3c), and a desired region inkjet resist fine convex portion top surface hardened film (3e), a desired region inkjet resist fine convex portion side surface hardened film (3f), and a desired region inkjet resist fine convex portion bottom surface hardened film (3g);
In the step (C),
a plate mold substrate etching step of contacting an etching solution with a surface of the plate mold substrate (1) on which the desired region inkjet resist convex portion upper surface hardened film (3a), the desired region inkjet resist convex portion side surface hardened film (3b), the desired region inkjet resist concave portion bottom surface hardened film (3c), the desired region inkjet resist fine convex portion upper surface hardened film (3e), the desired region inkjet resist fine convex portion side surface hardened film (3f), and the desired region inkjet resist fine concave portion bottom surface hardened film (3g) are formed, thereby etching the plate mold substrate second region surface (12) to which the desired region inkjet resist hardened film 3 is not attached,
As a result, the second region surface (12) of the plate-form substrate is etched without etching the pre-formed multiple concave-convex portions (45) and the pre-formed multiple fine concave-convex portions (46), thereby forming an inkjet resist film etching second concave-forming portion (121) having an etched concave shape, and
The preformed multiple concave-convex portion (45) is formed into a shape of an inkjet film etched preformed multiple concave-convex portion protrusion portion (455) having a protruding shape protruding from the inkjet resist film etched second concave forming portion (121);
The previously formed multiple fine concave-convex portions (46) are formed into inkjet film etched previously formed multiple fine concave-convex portions protruding from the inkjet resist film etched second concave forming portion (121);
In the step (D),
a resist cured film removing step of removing the inkjet resist cured film (3) from the desired area,
As a result, the second region surface (12) of the plate mold substrate is etched without etching the pre-formed uneven portion (4) to form an inkjet resist film etched second recessed portion (121), and the pre-formed uneven portion is formed into the form of an inkjet film etched pre-formed uneven portion protrusion having a protruding shape protruding from the inkjet resist film etched second recessed portion 121;
a resist hardened film removing step of removing the desired region inkjet resist convex portion top surface hardened film (3a), the desired region inkjet resist convex portion side surface hardened film (3b), the desired region inkjet resist inkjet resist bottom surface hardened film (3c), and the desired region inkjet resist fine convex portion top surface hardened film (3e), the desired region inkjet resist fine convex portion side surface hardened film (3f), and the desired region inkjet resist fine recess portion bottom surface hardened film (3g);
As a result, the pre-formed multiple concave and convex portions (45) are not etched, and the second region surface (12) of the plate mold substrate is etched to form the inkjet resist film etching second concave forming portion (121);
the preformed multiple concave-convex portion (45) having the preformed multiple concave-convex portion convex portions (451) and the preformed multiple concave-convex portion concave portions (452), and the preformed multiple fine concave-convex portion (46) having the preformed multiple fine concave-convex portion convex portions (461) and the preformed multiple fine concave-convex portion concave portions (462) are formed in the form of an inkjet film etched preformed multiple concave-convex portion protrusion portion (455) having a protruding shape protruding from a bottom surface of the inkjet resist film etched second concave forming portion (121), and an inkjet film etched preformed multiple fine concave-convex portion protrusion portion (466);
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The first area surface (11) of the plate mold substrate has a preformed convex portion (47),
The second area surface (12) of the plate mold substrate has a preformed recess (48);
The second surface (12) of the plate mold substrate is located in the peripheral area of the first surface (11) of the plate mold substrate;
The preformed convex portion (47) has a preformed convex portion upper surface (47a) and a preformed convex portion side surface (47b),
The preformed recess (48) has a preformed recess bottom surface (48c) and a preformed recess side surface (48b),
Here, the already-formed convex side surface (47b) and the already-formed concave side surface (48b) correspond to the same side surface,
In the step (B),
a desired region inkjet resist deposition film formation step of covering the existing convex portion side surface (47b), the existing concave portion side surface (48b), and the existing concave portion bottom surface (48c) and depositing an inkjet resist material (2) on the existing convex portion upper surface (47a) by an inkjet method to form a desired region inkjet resist deposition film having (a) a desired graphic/letter picture pattern, or (b) a desired fine graphic/letter picture pattern;
as well as,
and a desired area inkjet resist cured film forming step of curing the desired area inkjet resist deposited film to form a desired area inkjet resist cured film (3),
In the step (C),
a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch a region on the upper surface (47a) of the existing convex portion to which the desired region inkjet resist cured film is not attached,
As a result, without etching the existing convex side surface (47b), the existing concave side surface (48b), and the existing concave bottom surface (48c), the desired area on the existing convex upper surface (47a) to which the inkjet resist hardened film is not attached is etched to form an existing convex upper surface uneven portion (477) having a plurality of concave portions and a plurality of convex portions;
Here, when the desired region inkjet resist cured film (3) has (a) a desired graphic character pattern, the existing convex portion upper surface uneven portion (477) is (a) an existing convex portion upper surface multiple uneven portion (477a) having an existing convex portion upper surface multiple uneven portion concave portion (472a) formed with a plurality of concave shapes corresponding to the desired graphic character pattern, and an existing convex portion upper surface multiple uneven portion convex portion (471a) formed with a plurality of convex shapes,
In the case where the desired region inkjet resist cured film (3) has (b) a desired fine graphic, letter, and picture pattern, the existing convex portion upper surface uneven portion (477) is (b) an existing convex portion upper surface multiple fine unevenness portion (477b) having an existing convex portion upper surface multiple fine unevenness portion concave portion (472b) formed with multiple fine concave shapes corresponding to the desired fine graphic, letter, and picture pattern, and an existing convex portion upper surface multiple fine unevenness portion convex portion (471b) formed with multiple fine convex shapes,
In the step (D),
a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film (3),
As a result, the pre-formed convex upper surface uneven portion (477) is formed on the pre-formed convex upper surface (47a).
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The first area surface (11) of the plate mold substrate has a preformed convex portion (47),
The second area surface (12) of the plate mold substrate has a preformed recess (48);
The first area surface (11) of the plate mold substrate is located in a peripheral area of the second area surface (12) of the plate mold substrate,
The preformed convex portion (47) has a preformed convex portion upper surface (47a) and a preformed convex portion side surface (47b),
The preformed recess (48) has a preformed recess bottom surface (48c) and a preformed recess side surface (48b),
Here, the already-formed convex side surface (47b) and the already-formed concave side surface (48b) correspond to the same side surface,
In the step (B),
a desired region inkjet resist deposition film formation step of covering the existing convex side surface (47b), the existing concave side surface (48b), and the existing convex upper surface (47a) and adhering an inkjet resist material (2) to the existing concave bottom surface (48c) by an inkjet method to form a desired region inkjet resist deposition film having (a) a desired graphic/letter picture pattern, or (b) a desired fine graphic/letter picture pattern;
as well as,
and a desired area inkjet resist cured film forming step of curing the desired area inkjet resist deposited film to form a desired area inkjet resist cured film (3),
In the step (C),
a plate mold substrate etching step of contacting an etching solution with the surface of the plate mold substrate (1) on which the desired region inkjet resist cured film (3) is formed, to etch a region of the bottom surface (48c) of the existing recess (48c) on which the desired region inkjet resist cured film is not attached,
As a result, without etching the existing convex portion side surface (47b), the existing concave portion side surface (48b), and the existing convex portion upper surface (47a), the desired area on the existing concave portion bottom surface (48c) to which the inkjet resist hardened film is not attached is etched to form an existing concave portion bottom surface uneven portion (488) having a plurality of concave portions and a plurality of convex portions;
Here, when the desired region inkjet resist cured film (3) has (a) a desired graphic character pattern, the existing recess bottom surface uneven portion (488) is (a) an existing recess bottom surface multiple uneven portion (488a) having an existing recess bottom surface multiple uneven portion concave (482a) formed with a plurality of concave shapes corresponding to the desired graphic character pattern, and an existing recess bottom surface multiple uneven portion convex portion (481a) formed with a plurality of convex shapes,
In the case where the desired region inkjet resist cured film (3) has a desired fine graphic character picture pattern (b), the existing recess bottom surface uneven portion (488) is a existing recess bottom surface multiple fine uneven portion (488b) having an existing recess bottom surface multiple fine uneven portion concave (482b) formed with a plurality of fine concave shapes corresponding to the desired fine graphic character picture pattern and an existing recess bottom surface multiple fine uneven portion convex portion (481b) formed with a plurality of fine convex shapes,
In the step (D),
a desired area inkjet resist cured film removal step of removing the desired area inkjet resist cured film (3),
As a result, the pre-formed recess bottom surface uneven portion (488) is formed on the pre-formed recess bottom surface (48c).
The method for manufacturing a pressing plate according to claim 1 . In the step (A),
The first area surface (11) of the plate mold substrate is
(a) Chemical etching using an inkjet resist cured film formed using an inkjet resist material as a mask for etching;
and/or
(b) Chemical etching using a cured resist film formed using a conventional liquid resist material as a mask for etching;
and/or
(c) Chemical etching using a cured resist film formed using a conventional sheet-like dry film resist material as a mask for etching;
and/or
(d) mechanical machining using conventional machining equipment;
The preformed uneven portion (4) is formed by the processing of
The method for manufacturing a pressing plate according to any one of claims 2 to 12. The method for manufacturing a pressing plate according to any one of claims 1 to 13, characterized in that the plate mold substrate (1) is formed from iron, stainless steel, brass, copper, magnesium steel, duralumin, cemented carbide, powdered high speed steel, high speed steel, die steel, alloy tool steel, carbon tool steel, or steel. The pressing plate is
(A) A flat plate mold configured in a flat pressure processing device having flat plate shapes facing each other;
(B) a roll plate configured in a roll-type processing device having roll shapes facing each other;
(c) A flexible plate configured by wrapping and fixing around a cylindrical or columnar roll, or a flexible plate configured by fixing on the surface of a plate-shaped substrate.
(D) an embossing plate for processing a workpiece into a predetermined uneven shape;
(e) a stamping plate for stamping a workpiece with foil;
(F) A cutting plate for cutting and/or cutting a workpiece into a predetermined shape;
as well as,
(G) a stamping/cutting plate for stamping or stamping a workpiece into a predetermined uneven shape and cutting and/or cutting the workpiece;
A pressing plate having at least one form selected from the group consisting of:
The method for manufacturing a pressing plate according to any one of claims 1 to 14. A plate for pressing process manufactured by the method for manufacturing a plate for pressing process according to any one of claims 1 to 15. A method for processing a workpiece, comprising the steps of: processing the workpiece using a pressing plate manufactured by the method for manufacturing a pressing plate according to any one of claims 1 to 15; and producing a workpiece that has been processed into a predetermined shape. (S-a) a step of supplying a press processing plate (10) manufactured by the method for manufacturing a press processing plate according to any one of claims 1 to 15;
(S-b) preparing a pressing device having a first base (92) and a second base (93) facing each other;
(S-d) a step of placing a predetermined receiving plate (94) on the second base (93) of the pressing device;
(S-e) a step of driving at least one of the first base (92) and the second base (93) while a workpiece (108) is positioned between the pressing plate (10) and the receiving plate (94), so that the pressing plate (10) and the receiving plate (94) press the workpiece;
As a result, a workpiece unevenness forming portion having an uneven shape that matches the uneven shape of the existing uneven portion (4) is formed on the surface of the workpiece (108),
as well as,
(S-f) a step of driving at least one of the bases of the pressing plate (10) and the receiving plate (94) to move the pressing plate (10) and the receiving plate (94) away from each other, thereby releasing the pressing force on the workpiece;
As a result, a workpiece is prepared in which a workpiece transfer formation portion is formed on the surface of the workpiece (108) in a form having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion (4).
A method for processing a workpiece, comprising: (S-a) a step of supplying a press processing plate (10) manufactured by the method for manufacturing a press processing plate according to any one of claims 1 to 15;
(S-b) preparing a pressing device having a first base (92) and a second base (93) facing each other;
(S-d) a step of placing a predetermined receiving plate (94) on the second base (93) of the pressing device;
(S-e) a step of driving at least one of the first base (92) and the second base (93) while a workpiece substrate (108a) and a sheet-like foil material (108b) are positioned between the pressing plate (10) and the receiving plate (94), so that the pressing plate (10) and the receiving plate (94) press the workpiece;
As a result, the sheet-like foil material (108b) is attached to the surface of the workpiece substrate (108a) to form a workpiece foil stamping transfer forming portion having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion (4);
as well as,
(S-f) a step of driving at least one of the bases of the pressing plate (10) and the receiving plate (94) to move the pressing plate (10) and the receiving plate (94) away from each other, thereby releasing the pressing force on the workpiece;
This prepares a workpiece in which the workpiece stamping transfer formation portion is formed on the surface of the workpiece base material (108a) by transfer of the sheet-like foil material (108b) in a form having a shape that matches the uneven shape of the existing uneven portion (4).
A method for processing a workpiece, comprising: (S-a) a step of supplying a press processing plate (10) manufactured by the method for manufacturing a press processing plate according to any one of claims 1 to 15;
(S-b) preparing a pressing device having a main roll (96) and a counter roll (97) facing each other;
(Sc) a step of placing the pressing plate (10) on the main roll (96);
(S-d) a step of placing a predetermined receiving plate (94) on the pair roll (97) of the pressing device;
(S-e) a step of driving the main roll (96) and the counter roll (97) and supplying a workpiece between the main roll (96) and the counter roll (97) so that the pressing plate (10) and the receiving plate (94) press the workpiece;
As a result, a workpiece uneven shape portion having an uneven shape that matches the uneven shape of the existing uneven portion (4) is formed on the surface of the workpiece (108),
as well as,
(S-f) a step of releasing the pressure on the workpiece by separating the workpiece from between the main roll (96) and the counter roll (97);
As a result, a workpiece is prepared in which a workpiece unevenness forming portion is formed on the surface of the workpiece (108) in a form having an uneven shape that matches the uneven shape of the existing uneven portion (4).
A method for processing a workpiece, comprising: (S-a) a step of supplying a press processing plate (10) manufactured by the method for manufacturing a press processing plate according to any one of claims 1 to 15;
(S-b) preparing a pressing device having a main roll (96) and a counter roll (97) facing each other;
(Sc) a step of placing the pressing plate (10) on the main roll (96);
(S-d) a step of placing a predetermined receiving plate (94) on the pair roll (97) of the pressing device;
(S-e) a step of driving the main roll (96) and the counter roll (97) and supplying a workpiece substrate (108a) and a sheet-like foil material (108b) between the main roll (96) and the counter roll (97) so that the pressing plate (10) and the receiving plate (94) press the workpiece;
As a result, the sheet-like foil material (108b) is transferred onto the surface of the workpiece substrate (108a) to form a workpiece foil stamping transfer formation portion having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion (4);
as well as,
(S-f) a step of releasing the pressure on the workpiece by separating the workpiece from between the main roll (96) and the counter roll (97);
This allows the preparation of a workpiece having a workpiece transfer formation portion formed by transferring the sheet-like foil material (108b) on the surface of the workpiece (108) in a form having a concave-convex shape that matches the concave-convex shape of the existing concave-convex portion (4).
A method for processing a workpiece, comprising: The workpiece is at least one workpiece selected from the group consisting of paper, cardboard, plastic film, plastic board, plastic molded product, leather, wood, cloth, soft metal, and laminates thereof.
22. A method for processing a workpiece according to claim 17, further comprising the step of: