JP2024075592A - Transfer film, laminate manufacturing method, touch sensor, and printed wiring board manufacturing method - Google Patents

Abstract

The present invention provides a transfer film that can suppress the occurrence of defective formation of conductive thin lines when used to form narrow conductive thin lines, a method for manufacturing a laminate, a method for manufacturing a printed wiring board, and a touch sensor.
[Solution] A transfer film having a temporary support and a photosensitive composition layer disposed on the temporary support, in which the number of foreign matter particles having a diameter of 1 μm or more in the photosensitive composition layer is 10 pieces/ ^mm2 or less.
[Selection diagram] None

Description

The present invention relates to a transfer film, a method for manufacturing a laminate, a touch sensor, and a method for manufacturing a printed wiring board.

Because the number of steps required to obtain a desired pattern is small, a method in which a photosensitive composition layer is provided on a substrate of choice using a transfer film, exposed through a mask, and then developed is widely used.

For example, Patent Document 1 discloses a photosensitive transfer material (transfer film) having a predetermined structure, which has a photosensitive layer, an adhesive layer, and a temporary support in that order on a cover film, in which the photosensitive layer contains particles.

JP 2019-128445 A

When a conductive thin wire (a thin-line conductive layer) is produced using a transfer film having a photosensitive composition layer, it is required that the conductive thin wire is unlikely to have a formation defect. Specifically, when a photosensitive composition layer of a transfer film is used to form a pattern (resist pattern) on a conductive layer, and the conductive layer in an area where the pattern is not arranged is etched to form a conductive thin wire, it is required that the conductive thin wire is not defectively formed, such as a defect in the conductive thin wire (for example, a chip called a mouse bite), a break (open) in the conductive thin wire, or a short circuit in the conductive thin wire.

On the other hand, in recent years, there has been a demand for even finer conductive wires. In other words, there has been a demand for finer wiring. Specifically, there has been a demand for the formation of conductive wires with a line width of 8 μm or less.
The present inventors have investigated the formation of narrow conductive thin lines using the transfer film described in Patent Document 1 and have found that the conductive thin lines are prone to formation defects. If such formation defects occur in the conductive thin lines, there is a concern that the failure rate of electronic devices including the conductive thin lines will increase.

In view of the above-mentioned circumstances, an object of the present invention is to provide a transfer film that can suppress the occurrence of defective formation of conductive thin lines when used to form conductive thin lines with a narrow line width.
Another object of the present invention is to provide a method for producing a laminate using the above-mentioned transfer film, a method for producing a printed wiring board using the above-mentioned transfer film, and a touch sensor.

As a result of thorough investigation into the above-mentioned problems, the inventors have discovered that the above-mentioned problems can be solved by the following configuration.

[1] A transfer film having a temporary support and a photosensitive composition layer disposed on the temporary support, wherein the number of foreign matter particles having a diameter of 1 μm or more in the photosensitive composition layer is 10 pieces/ ^mm2 or less.
[2] The transfer film according to [1], wherein the thickness of the photosensitive composition layer is 20 μm or less.
[3] The transfer film according to [1] or [2], wherein the number of foreign particles having a diameter of 1 μm or more in the temporary support is 10 pieces/ ^mm2 or less.
[4] The transfer film according to any one of [1] to [3], wherein the thickness of the temporary support is 30 μm or less.
[5] The transfer film according to any one of [1] to [4], wherein the photosensitive composition layer contains a polymerizable compound, and the content of the polymerizable compound is 10.00 to 50.00 mass% relative to the total mass of the photosensitive composition layer.
[6] The transfer film according to any one of [1] to [5], wherein the photosensitive composition layer contains a polymerization initiator, and the content of the polymerization initiator is 0.10 to 10.00 mass% relative to the total mass of the photosensitive composition layer.
[7] The transfer film according to any one of [1] to [6], wherein the ratio of the mass of components contained in the photosensitive composition layer having a molecular weight of 100,000 or more to the mass of components contained in the photosensitive composition layer having a molecular weight of 10,000 or less is 0.10 or less.
[8] The transfer film according to any one of [1] to [7], wherein the photosensitive composition layer contains a polymerization inhibitor, and the content of the polymerization inhibitor is 0.10 to 5.00 mass% relative to the total mass of the photosensitive composition layer.
[9] The transfer film according to any one of [1] to [8], wherein the photosensitive composition layer contains a residual solvent and the content of the residual solvent is 2 to 15 mg/ ^m2 .
[10] a lamination step of contacting and laminating the photosensitive composition layer on the temporary support of the transfer film according to any one of [1] to [9] with a substrate having a conductive layer to obtain a substrate with a photosensitive composition layer having a substrate, a conductive layer, a photosensitive composition layer, and a temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
an etching step for etching the conductive layer in areas where no pattern is arranged to obtain conductive thin lines;
A removing step of removing the pattern,
The method for producing a laminate further comprises a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer between the laminating step and the exposure step, or between the exposure step and the development step.
[11] The method for producing a laminate according to [10], wherein the conductive thin wire has a line width of 8 μm or less.
[12] A touch sensor comprising a laminate manufactured by the manufacturing method according to [10] or [11].
[13] a seed layer forming step of forming a seed layer on a substrate;
a lamination step of contacting and laminating the photosensitive composition layer on the temporary support of the transfer film according to any one of [1] to [9] with a substrate having a seed layer to obtain a substrate with a photosensitive composition layer having a substrate, a seed layer, a photosensitive composition layer, and a temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
a metal plating layer forming step of forming a metal plating layer by plating on the seed layer in an area where no pattern is arranged;
a protective layer forming step of forming a protective layer on the metal plating layer;
a pattern removing step of removing the pattern;
a seed layer removing step of removing the exposed seed layer to obtain conductive thin lines;
The method for producing a printed wiring board further comprises a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer between the laminating step and the exposure step, or between the exposure step and the development step.

According to the present invention, it is possible to provide a transfer film that can suppress the occurrence of defective formation of conductive thin wires when used to form conductive thin wires with a narrow line width.
Furthermore, according to the present invention, it is possible to provide a method for producing a laminate using the above-mentioned transfer film, a method for producing a printed wiring board using the above-mentioned transfer film, and a touch sensor.

The present invention will be described in detail below.
In this specification, a numerical range expressed using "to" means a range that includes the numerical values before and after "to" as the lower and upper limits.
In the present specification, in the numerical ranges described stepwise, the upper limit or lower limit described in a certain numerical range may be replaced with the upper limit or lower limit of another numerical range described stepwise. In addition, in the numerical ranges described in the present specification, the upper limit or lower limit described in a certain numerical range may be replaced with a value shown in the examples.

In this specification, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved.

In this specification, the term "transparent" means that the average transmittance of visible light having a wavelength of 400 to 700 nm is 80% or more, and preferably 90% or more.
In this specification, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd.

In this specification, unless otherwise specified, the content ratio of each structural unit of a polymer is a molar ratio.
In this specification, unless otherwise specified, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are values converted using polystyrene as a standard substance measured with a gel permeation chromatography (GPC) analyzer using a TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all of which are product names manufactured by Tosoh Corporation) as a column, THF (tetrahydrofuran) as an eluent, a differential refractometer as a detector, and polystyrene as a standard substance.
In this specification, unless otherwise specified, the molecular weight of a compound having a molecular weight distribution is the weight average molecular weight (Mw).
In this specification, unless otherwise specified, the content of metal elements is a value measured using an inductively coupled plasma (ICP) spectroscopic analyzer.
In this specification, unless otherwise specified, the content of the residual solvent is a value measured using a GC/MS (Gas Chromatography Mass spectrometry) analyzer.
In this specification, unless otherwise specified, the refractive index is a value measured using an ellipsometer at a wavelength of 550 nm.
In this specification, unless otherwise specified, the hue is a value measured using a color difference meter (CR-221, manufactured by Minolta Co., Ltd.).

In this specification, "(meth)acrylic" is a concept that includes both acrylic and methacrylic, and "(meth)acryloxy group" is a concept that includes both acryloxy group and methacryloxy group.

A characteristic feature of the transfer film of the present invention is that the number of foreign particles having a diameter of 1 μm or more in the photosensitive composition layer described below is 10 pieces/mm ² or less.
The present inventors have studied the problems of the prior art and found that, while a conductive thin wire having a wide line width is unlikely to be defectively formed when a conductive thin wire having a narrow line width is produced using a conventional transfer film, a conductive thin wire is likely to be defectively formed when a conductive thin wire having a narrow line width is produced. The present inventors have studied the reason for this and found that the above problem is caused by foreign matter of a certain size contained in the photosensitive composition layer. When a conductive thin wire having a wide line width is formed, the exposed area of the photosensitive composition layer is large compared to the foreign matter, so that the formation of the conductive thin wire is hardly affected. On the other hand, when a conductive thin wire having a narrow line width is formed, the exposed area of the photosensitive composition layer itself is narrowed, and the ratio of the size of the foreign matter to the size of the exposed area becomes large, and the ratio of the area where the exposure of the photosensitive composition layer is hindered by the foreign matter becomes large. As a result, the pattern itself is formed and, when the conductive layer is etched based on such a pattern, an area where etching proceeds excessively occurs, which results in a defective formation of the conductive thin wire.
As described above, the present inventors have found that the desired effect can be obtained by controlling the number of foreign particles of a predetermined size in order to prevent exposure damage caused by foreign particles.

The transfer film of the present invention has a temporary support and a photosensitive composition layer disposed on the temporary support.
Each of the components constituting the transfer film will be described in detail below.

<Temporary Support>
The transfer film has a temporary support.
The temporary support is a member that supports a photosensitive composition layer, which will be described later, and is ultimately removed by a peeling treatment.

The number of foreign matters having a diameter of 1 μm or more (hereinafter, simply referred to as "first foreign matter") in the temporary support is not particularly limited, but is preferably 10 pieces/ ^mm2 or less, more preferably less than 5 pieces/ ^mm2 , and even more preferably less than 1 piece/ ^mm2 . The lower limit is not particularly limited, but may be 0 pieces/ ^mm2 .
The first foreign matter is a part (lump) that can be recognized as optically different from other parts of the temporary support when the temporary support is observed using an optical microscope. The first foreign matter may be either an organic matter or an inorganic matter. The first foreign matter may be a component derived from a component constituting the temporary support, or may be a component derived from a component other than the component constituting the temporary support. Note that the first foreign matter does not include air bubbles.

Examples of the first foreign matter include aggregates, unmelted matter, inorganic matter, gelled matter, attached foreign matter, and colored foreign matter. More specifically, examples include synthesis defects or aggregates that occur during the production of the temporary support, foreign matter derived from additives, impurities such as additives, dust that is mixed in during the production process, metal particles, and metal pieces.

The size of the first foreign matter may be 1 μm or more in diameter. The upper limit is not particularly limited, but it is preferably 10,000 μm or less. As described below, when the shape of the first foreign matter observed when observing the temporary support using an optical microscope is not a perfect circle, the longest side (major axis) is taken as the diameter.
The temporary support may contain foreign matter having a diameter of less than 1 μm, but preferably does not contain any foreign matter.

One method for measuring the number of first foreign matters in the temporary support is to visually observe the temporary support using an optical microscope. Specifically, five random regions (1 mm x 1 mm) on the surface of the temporary support are visually observed using an optical microscope from the normal direction of the surface of the temporary support, the number of first foreign matters in each region is measured, and the arithmetic average is calculated as the number of first foreign matters.

As a method for reducing the first foreign matter in the temporary support, for example, when the temporary support is made of a resin, a method of producing a temporary support using resin from which foreign matter has been removed can be mentioned.

The temporary support may have a single-layer structure or a multi-layer structure.
The temporary support is preferably a film, more preferably a resin film. As the temporary support, a film having flexibility and not significantly deforming, shrinking, or stretching under pressure or under pressure and heat can be used.
Examples of the film include a polyethylene terephthalate film (eg, a biaxially oriented polyethylene terephthalate film), a cellulose triacetate film, a polystyrene film, a polyimide film, and a polycarbonate film.
Among these, the temporary support is preferably a biaxially oriented polyethylene terephthalate film.
Moreover, it is preferable that the film used as the temporary support is free from deformation such as wrinkles and scratches.

The temporary support preferably has high transparency since pattern exposure can be performed through the temporary support, and the transmittance at 365 nm is preferably 60% or more, and more preferably 70% or more.
From the viewpoints of pattern formability during pattern exposure through the temporary support and transparency of the temporary support, it is preferable that the haze of the temporary support is small. Specifically, the haze value of the temporary support is preferably 2% or less, more preferably 0.5% or less, and even more preferably 0.1% or less.

The temporary support preferably has high transparency, with a transmittance of 60% or more at 365 nm, and more preferably 70% or more.

The thickness of the temporary support is not particularly limited, but is preferably 150 μm or less, more preferably 50 μm or less, even more preferably 30 μm or less, and particularly preferably 16 μm or less, in terms of suppressing poor formation of the conductive thin wires (hereinafter, also simply referred to as "the point where the effect of the present invention is better"). The lower limit is not particularly limited, but is preferably 5 μm or more in terms of handling.
The thickness of the temporary support is calculated as the average value of any five points measured by observing a cross section with a SEM (Scanning Electron Microscope).

Preferred forms of the temporary support are described, for example, in paragraphs [0017] to [0018] of JP 2014-085643 A, paragraphs [0019] to [0026] of JP 2016-027363 A, paragraphs [0041] to [0057] of WO 2012/081680 A, and paragraphs [0029] to [0040] of WO 2018/179370 A, the contents of which are incorporated herein by reference.

<Photosensitive Composition Layer>
The transfer film has a photosensitive composition layer.
After the photosensitive composition layer is transferred onto a receiving material, it is exposed to light and developed, thereby forming a pattern on the receiving material.
As the photosensitive composition layer, a known photosensitive composition layer can be used, and a negative type is preferable. Note that the negative type photosensitive composition layer is a photosensitive composition layer in which the solubility of the exposed part in the developer is reduced by exposure. When the photosensitive composition layer is a negative type photosensitive composition layer, the pattern formed corresponds to a cured layer.

[Number of foreign matters in the photosensitive composition layer]
The number of foreign matters having a diameter of 1 μm or more (hereinafter, simply referred to as "second foreign matters") in the photosensitive composition layer is 10 pieces/ ^mm2 or less. In addition, in terms of better effects of the present invention, it is more preferable that the number is less ^than 5 pieces/mm2. There is no particular lower limit, but an example of the number is 0 pieces/ ^mm2 .
The second foreign matter is a part (lump) that can be recognized as being optically different from other parts of the photosensitive composition layer when the photosensitive composition layer is observed using an optical microscope. The second foreign matter may be either an organic matter or an inorganic matter. The second foreign matter may be a component derived from the components constituting the photosensitive composition layer, or may be a component derived from other than the components constituting the photosensitive composition layer. The second foreign matter does not include air bubbles.

Examples of the second foreign matter include aggregates, unmelted matter, inorganic matter, gelled matter, attached foreign matter, and colored foreign matter. More specifically, examples of the second foreign matter include synthesis defects or aggregates that occur during the production of the photosensitive composition layer, foreign matter derived from additives, impurities such as additives, dust, metal particles, and metal pieces that are mixed in during the production process.

The size of the second foreign matter may be 1 μm or more in diameter. The upper limit is not particularly limited, but it is preferably 10,000 μm or less. As described below, when the shape of the second foreign matter observed when observing the photosensitive composition layer using an optical microscope is not a perfect circle, the longest side (major axis) is taken as the diameter.
The photosensitive composition layer may contain foreign matter having a diameter of less than 1 μm, but preferably does not contain any foreign matter.

The method for measuring the number of the second foreign matters in the photosensitive composition layer includes a method of visually observing the photosensitive composition layer using an optical microscope.Specifically, from the normal direction of the surface of the photosensitive composition layer, any five regions (1 mm x 1 mm) on the surface of the photosensitive composition layer are visually observed using an optical microscope, the number of the second foreign matters in each region is measured, and the number of the second foreign matters is calculated as the arithmetic average.
In addition, when calculating the number of the second foreign matter in the photosensitive composition layer on the temporary support using an optical microscope, the first foreign matter in the temporary support may be observed at the same time as the second foreign matter in the photosensitive composition layer. In such a case, first, the transfer film itself including the temporary support and the photosensitive composition layer is observed with an optical microscope, and the number of foreign matters observed with a diameter of 1 μm or more is calculated by the above method. Next, after removing the photosensitive composition layer in the observed transfer film, the number of the first foreign matter in the remaining temporary support is calculated by the above method. Then, the number of the second foreign matter in the photosensitive composition layer can also be calculated by subtracting the number of the first foreign matter in the temporary support from the number of foreign matters calculated when observing the transfer film.

As a method for reducing the second foreign matter in the photosensitive composition layer, a method of subjecting the photosensitive composition used to form the photosensitive composition layer to a filtration process, as described below, is given. Details are given later.

The components contained in the photosensitive composition layer (particularly the negative photosensitive composition layer) are described in detail below.

[Polymerizable compound]
The photosensitive composition layer may contain a polymerizable compound.
The polymerizable compound is a compound having a polymerizable group. Examples of the polymerizable group include a radical polymerizable group and a cationic polymerizable group, and the radical polymerizable group is preferable.

The polymerizable compound preferably contains a radically polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as an "ethylenically unsaturated compound").
The ethylenically unsaturated group is preferably a (meth)acryloxy group.

The ethylenically unsaturated compound preferably includes a difunctional or higher ethylenically unsaturated compound. "Difunctional or higher ethylenically unsaturated compound" means a compound having two or more ethylenically unsaturated groups in one molecule.

As the ethylenically unsaturated compound, a (meth)acrylate compound is preferred.
The ethylenically unsaturated compound preferably contains a difunctional ethylenically unsaturated compound (preferably a difunctional (meth)acrylate compound) and a tri- or higher functional ethylenically unsaturated compound (preferably a tri- or higher functional (meth)acrylate compound), for example, from the viewpoint of film strength after curing.

Examples of bifunctional ethylenically unsaturated compounds include tricyclodecane dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate.

Commercially available bifunctional ethylenically unsaturated compounds include, for example, ethoxylated bisphenol A dimethacrylate [product name: NK Ester BPE-200, manufactured by Shin-Nakamura Chemical Co., Ltd.], ethoxylated bisphenol A dimethacrylate [product name: NK Ester BPE-500, manufactured by Shin-Nakamura Chemical Co., Ltd.], polypropylene glycol diacrylate [product name: NK Ester M-270, manufactured by Toagosei Co., Ltd.], tricyclodecane dimethanol diacrylate [product name: NK Ester A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.], tricyclodecane dimethanol dimethacrylate [product name: NK Ester DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.], 1,9-nonanediol diacrylate [product name: NK Ester A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.], 1,10-decanediol diacrylate [product name: NK Ester A-DOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.] and 1,6-hexanediol diacrylate [product name: NK Ester A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.].

Examples of trifunctional or higher ethylenically unsaturated compounds include dipentaerythritol (tri/tetra/penta/hexa)(meth)acrylate, pentaerythritol (tri/tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and glycerin tri(meth)acrylate.

The term "(tri/tetra/penta/hexa)(meth)acrylate" encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate. Additionally, the term "(tri/tetra)(meth)acrylate" encompasses tri(meth)acrylate and tetra(meth)acrylate.
As the tri- or higher functional ethylenically unsaturated compound, there is no particular upper limit on the number of functional groups, but for example, 20 or less functional groups are preferable, and 15 or less functional groups are more preferable.

Commercially available trifunctional or higher ethylenically unsaturated compounds include, for example, trimethylolpropane triacrylate (trade name: A-TMPT, Shin-Nakamura Chemical Co., Ltd.), trimethylolpropane EO adduct triacrylate (trade name: SR 454, ARKEMA Co., Ltd.), trimethylolpropane EO adduct triacrylate (trade name: SR 502, ARKEMA Co., Ltd.), ε-caprolactone-modified tris-(2-acryloxyethyl) isocyanurate (trade name: A-9300-1CL, Shin-Nakamura Chemical Co., Ltd.), and dipentaerythritol hexaacrylate (trade name: KAYARAD DPHA, Shin-Nakamura Chemical Co., Ltd.).

The ethylenically unsaturated compound more preferably includes 1,9-nonanediol di(meth)acrylate or 1,10-decanediol di(meth)acrylate and dipentaerythritol (tri/tetra/penta/hexa)(meth)acrylate.

Examples of ethylenically unsaturated compounds include caprolactone-modified (meth)acrylate compounds (trade name: KAYARAD (registered trademark) DPCA-20, manufactured by Nippon Kayaku Co., Ltd., and trade name: A-9300-1CL, etc., manufactured by Shin-Nakamura Chemical Co., Ltd.), alkylene oxide-modified (meth)acrylate compounds (trade name: KAYARAD (registered trademark) RP-1040, manufactured by Nippon Kayaku Co., Ltd., trade name: ATM-35E or A-9300, manufactured by Shin-Nakamura Chemical Co., Ltd., and trade name: EBECRYL (registered trademark) 135, etc., manufactured by Daicel-Allnex Corporation), and ethoxylated glycerin triacrylate (trade name: NK Ester A-GLY-9E, etc., manufactured by Shin-Nakamura Chemical Co., Ltd.).

The ethylenically unsaturated compound may also be a urethane (meth)acrylate compound. As the urethane (meth)acrylate compound, a trifunctional or higher urethane (meth)acrylate compound is preferred. Examples of trifunctional or higher urethane (meth)acrylate compounds include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), NK Ester UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and NK Ester UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).

From the viewpoint of improving developability, it is preferable that the ethylenically unsaturated compound contains an ethylenically unsaturated compound having an acid group.

Examples of acid groups include phosphate groups, sulfonic acid groups, and carboxy groups. Among these, carboxy groups are preferred as the acid group because they provide a superior effect of the present invention.

Examples of ethylenically unsaturated compounds having an acid group include tri- to tetrafunctional ethylenically unsaturated compounds having an acid group [compounds having carboxy groups introduced into a pentaerythritol tri- and tetraacrylate (PETA) skeleton (acid value: 80 to 120 mg KOH/g)] and penta- to hexafunctional ethylenically unsaturated compounds having an acid group (compounds having carboxy groups introduced into a dipentaerythritol penta- and hexaacrylate (DPHA) skeleton (acid value: 25 to 70 mg KOH/g)]. Tri- or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with difunctional ethylenically unsaturated compounds having an acid group, if necessary.

As the ethylenically unsaturated compound having an acid group, at least one compound selected from the group consisting of difunctional or higher ethylenically unsaturated compounds having a carboxy group and their carboxylic acid anhydrides is preferred, in that it provides improved developability and film strength.

Examples of difunctional or higher ethylenically unsaturated compounds having a carboxy group include ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and ARONIX (registered trademark) M-510 (manufactured by Toagosei Co., Ltd.).

As the ethylenically unsaturated compound having an acid group, the polymerizable compound having an acid group described in paragraphs [0025] to [0030] of JP-A-2004-239942 can be preferably used, and the contents of this publication are incorporated herein by reference.

The molecular weight of the polymerizable compound (preferably an ethylenically unsaturated compound) is preferably 200 to 3,000, more preferably 250 to 2,600, even more preferably 280 to 2,200, and particularly preferably 300 to 2,200.

Among the polymerizable compounds (preferably ethylenically unsaturated compounds), the content of polymerizable compounds having a molecular weight of 300 or less is preferably 35.00% by mass or less, more preferably 30.00% by mass or less, and even more preferably 25.00% by mass or less, based on the content of all polymerizable compounds contained in the photosensitive composition layer.

The photosensitive composition layer may contain one type of polymerizable compound alone, or may contain two or more types of polymerizable compounds.

The content of the polymerizable compound (preferably an ethylenically unsaturated compound) is preferably 1.00 to 70.00% by mass, more preferably 10.00 to 70.00% by mass, even more preferably 10.00 to 60.00% by mass, and particularly preferably 10.00 to 50.00% by mass, based on the total mass of the photosensitive composition layer.

When the photosensitive composition layer contains a difunctional or higher ethylenically unsaturated compound, it may further contain a monofunctional ethylenically unsaturated compound.

When the photosensitive composition layer contains a difunctional or higher ethylenically unsaturated compound, it is preferable that the difunctional or higher ethylenically unsaturated compound is the main component of the ethylenically unsaturated compound contained in the photosensitive composition layer.

When the photosensitive composition layer contains a difunctional or higher ethylenically unsaturated compound, the content of the difunctional or higher ethylenically unsaturated compound is preferably 10.00 to 100.00% by mass, more preferably 20.00 to 100.00% by mass, and even more preferably 40.00 to 100.00% by mass, based on the content of all ethylenically unsaturated compounds contained in the photosensitive composition layer.

When the photosensitive composition layer contains an ethylenically unsaturated compound having an acid group (preferably a difunctional or higher ethylenically unsaturated compound having a carboxy group or a carboxylic acid anhydride thereof), the content of the ethylenically unsaturated compound having an acid group is preferably 1.00 to 70.00% by mass, more preferably 10.00 to 70.00% by mass, even more preferably 10.00 to 60.00% by mass, and particularly preferably 10.00 to 50.00% by mass, based on the total mass of the photosensitive composition layer.

[Polymerization initiator]
The photosensitive composition layer may contain a polymerization initiator.
The polymerization initiator is preferably a photopolymerization initiator.
Examples of the photopolymerization initiator include a photopolymerization initiator having an imidazole structure (hereinafter also referred to as an "imidazole-based photopolymerization initiator"), a photopolymerization initiator having an oxime ester structure (hereinafter also referred to as an "oxime-based photopolymerization initiator"), a photopolymerization initiator having an α-aminoalkylphenone structure (hereinafter also referred to as an "α-aminoalkylphenone-based photopolymerization initiator"), a photopolymerization initiator having an α-hydroxyalkylphenone structure (hereinafter also referred to as an "α-hydroxyalkylphenone-based polymerization initiator"), a photopolymerization initiator having an acylphosphine oxide structure (hereinafter also referred to as an "acylphosphine oxide-based photopolymerization initiator"), and a photopolymerization initiator having an N-phenylglycine structure (hereinafter also referred to as an "N-phenylglycine-based photopolymerization initiator").

The photopolymerization initiator preferably contains at least one selected from the group consisting of imidazole-based photopolymerization initiators, oxime-based photopolymerization initiators, α-aminoalkylphenone-based photopolymerization initiators, α-hydroxyalkylphenone-based photopolymerization initiators, and N-phenylglycine-based photopolymerization initiators, more preferably contains at least one selected from the group consisting of imidazole-based photopolymerization initiators, oxime-based photopolymerization initiators, α-aminoalkylphenone-based photopolymerization initiators, and N-phenylglycine-based photopolymerization initiators, and even more preferably contains an imidazole-based photopolymerization initiator.

Examples of the imidazole-based photopolymerization initiator include 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-methylphenyl)biimidazole.
Among these, 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-biimidazole is preferred in terms of superior effects of the present invention.

As the photopolymerization initiator, for example, the polymerization initiators described in paragraphs [0031] to [0042] of JP2011-095716A and paragraphs [0064] to [0081] of JP2015-014783A may be used.

Commercially available photopolymerization initiators include, for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (trade name: B-CIM, manufactured by Kurogane Kasei Co., Ltd.), 1-[4-(phenylthio)]phenyl-1,2-octanedione-2-(O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-01, manufactured by BASF Corporation), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: IRGACURE (registered trademark) OXE-02, manufactured by BASF Corporation], 8-[5-(2,4,6-trimethylphenyl)-11-(2-ethylhexyl)-11H-benzo[a]carbazoyl][2-(2,2,3,3-tetrafluoropropoxy)phenyl]methanone-(O-acetyloxime) [trade name: IRGACURE (registered trademark) OXE-03, manufactured by BASF Corporation], 1-[4-[4-(2-benzofuranylcarbonyl)phenyl]thio]phenyl-4-methyl-1-pentanone-1-(O-acetyloxime) [trade name: IRGACURE (registered trademark) OXE-04, manufactured by BASF Corporation], 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone [trade name: IRGACURE (registered trademark) 379EG, manufactured by BASF Corporation], 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one [trade name: IRGACURE (registered trademark) 907, manufactured by BASF Corporation], 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)benzyl]phenyl}-2-methylpropan-1-one [trade name: IRGACURE (registered trademark) 127, manufactured by BASF Corporation], 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 [trade name: IRGACURE (registered trademark) 369, manufactured by BASF Corporation], 2-hydroxy-2-methyl-1-phenyl-propan-1-one [trade name: IRGACURE (registered trademark) 1173, manufactured by BASF], 1-hydroxycyclohexyl phenyl ketone [trade name: IRGACURE (registered trademark) 184, manufactured by BASF], 2,2-dimethoxy-1,2-diphenylethan-1-one [trade name: IRGACURE 651, manufactured by BASF], and oxime ester compounds [trade name: Lunar (registered trademark) 6, manufactured by DKSH Japan Co., Ltd.].

The photosensitive composition layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators.

The content of the polymerization initiator is preferably 0.10 to 50.00% by mass, more preferably 0.10 to 30.00% by mass, and even more preferably 0.10 to 10.00% by mass, based on the total mass of the photosensitive composition layer.

[Alkali-soluble resin]
The photosensitive composition layer may contain an alkali-soluble resin.
When the photosensitive composition layer contains an alkali-soluble resin, the solubility of the photosensitive composition layer (non-exposed area) in a developer is improved.

In this specification, the term "alkali soluble" refers to a dissolution rate determined by the following method of 0.01 μm/sec or more.
A propylene glycol monomethyl ether acetate solution containing a target compound (e.g., a resin) at a concentration of 25% by mass is applied onto a glass substrate, and then heated for 3 minutes in an oven at 100° C. to form a coating film (thickness 2.0 μm) of the target compound. The coating film is immersed in a 1% by mass aqueous solution of sodium carbonate (liquid temperature 30° C.) to determine the dissolution rate (μm/sec) of the coating film.
If the target compound is not soluble in propylene glycol monomethyl ether acetate, the target compound is dissolved in an organic solvent other than propylene glycol monomethyl ether acetate having a boiling point of less than 200° C. (e.g., tetrahydrofuran, toluene, or ethanol).

The alkali-soluble resin is preferably an alkali-soluble acrylic resin.
The alkali-soluble acrylic resin will be described in detail below.

The content of the alkali-soluble resin is preferably 10.00 to 100.00% by mass, more preferably 30.00 to 100.00% by mass, even more preferably 40.00 to 100.00% by mass, and particularly preferably 50.00 to 90.00% by mass, based on the total mass of the photosensitive composition layer.

There are no limitations on the alkali-soluble acrylic resin, so long as it is an acrylic resin having alkali solubility as described above. Here, "acrylic resin" means a resin that contains at least one of a structural unit derived from (meth)acrylic acid and a structural unit derived from a (meth)acrylic acid ester.

The total proportion of the structural units derived from (meth)acrylic acid and the structural units derived from (meth)acrylic acid esters in the alkali-soluble acrylic resin is preferably 30.0 mol% or more, more preferably 50.0 mol% or more. There is no particular upper limit, but it is preferably 100.0 mol% or less, more preferably 80.0 mol% or less.

In this specification, when the content of a "structural unit" is specified by mole fraction (molar ratio), the "structural unit" is synonymous with the "monomer unit" unless otherwise specified. In addition, in this specification, when a resin or polymer has two or more specific structural units, the content of the specific structural units represents the total content of the two or more specific structural units unless otherwise specified.

From the viewpoint of developability, it is preferable that the alkali-soluble acrylic resin has a carboxy group. As a method for introducing a carboxy group into the alkali-soluble acrylic resin, for example, a method of synthesizing the alkali-soluble acrylic resin using a monomer having a carboxy group can be mentioned. By the above method, the monomer having a carboxy group is introduced into the alkali-soluble acrylic resin as a structural unit having a carboxy group. Examples of the monomer having a carboxy group include acrylic acid and methacrylic acid.

The alkali-soluble acrylic resin may have one carboxy group, or may have two or more carboxy groups. In addition, the structural unit having a carboxy group in the alkali-soluble acrylic resin may be of one type alone, or of two or more types.

The content of the structural unit having a carboxy group is preferably 10.0 to 100.0 mol %, more preferably 30.0 to 100.0 mol %, and even more preferably 50.0 to 100.0 mol %, based on the total amount of the alkali-soluble acrylic resin.

From the viewpoint of moisture permeability and strength after curing, the alkali-soluble acrylic resin preferably contains a structural unit having an aromatic ring. The structural unit having an aromatic ring is preferably a structural unit derived from a styrene compound.
Examples of monomers that form structural units having an aromatic ring include monomers that form structural units derived from styrene compounds and benzyl (meth)acrylate.

Examples of monomers that form the structural units derived from the styrene compound include styrene, p-methylstyrene, α-methylstyrene, α,p-dimethylstyrene, p-ethylstyrene, p-t-butylstyrene, t-butoxystyrene, and 1,1-diphenylethylene.
Among these, in terms of obtaining superior effects of the present invention, the monomer is preferably styrene or α-methylstyrene, and more preferably styrene.

The aromatic ring-containing structural unit in the alkali-soluble acrylic resin may be of one type alone or of two or more types.
When the alkali-soluble acrylic resin has a structural unit having an aromatic ring, the content of the structural unit having an aromatic ring is preferably 10.0 to 100.0 mol %, more preferably 20.0 to 90.0 mol %, and even more preferably 30.0 to 90.0 mol %, based on the total amount of the alkali-soluble acrylic resin.

The alkali-soluble acrylic resin may contain a structural unit having an aliphatic cyclic skeleton from the viewpoint of tackiness and strength after curing. The structural unit having an aliphatic cyclic skeleton may be monocyclic or polycyclic.

Examples of the aliphatic ring in the aliphatic cyclic skeleton include a dicyclopentane ring, a cyclohexane ring, an isoborone ring, and a tricyclodecane ring. Among the above, the tricyclodecane ring is preferred as the aliphatic ring in the aliphatic cyclic skeleton.

Examples of monomers that form structural units having an aliphatic cyclic skeleton include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate.

The alkali-soluble acrylic resin may contain one or more types of structural units having an aliphatic cyclic skeleton.

When the alkali-soluble acrylic resin has a structural unit having an aliphatic cyclic skeleton, the content of the structural unit having an aliphatic cyclic skeleton is preferably 5.0 to 90.0 mol %, more preferably 10.0 to 80.0 mol %, and even more preferably 10.0 to 60.0 mol %, based on the total amount of the alkali-soluble acrylic resin.

It is preferable that the alkali-soluble acrylic resin has a reactive group in terms of tackiness and strength after curing.

As the reactive group, a radically polymerizable group is preferable, and an ethylenically unsaturated group is more preferable. Furthermore, when the alkali-soluble acrylic resin has an ethylenically unsaturated group, the alkali-soluble acrylic resin preferably has a structural unit having an ethylenically unsaturated group in a side chain.

In this specification, the term "main chain" refers to the relatively longest bond chain in the molecule of the polymer compound that constitutes the resin, and the term "side chain" refers to an atomic group that branches off from the main chain.

As the ethylenically unsaturated group, a (meth)acrylic group or a (meth)acryloxy group is preferred, and a (meth)acryloxy group is more preferred.

The constituent unit having an ethylenically unsaturated group in the alkali-soluble acrylic resin may be of one type alone or of two or more types.

When the alkali-soluble acrylic resin has a structural unit having an ethylenically unsaturated group, the content of the structural unit having an ethylenically unsaturated group is preferably 10.0 to 100.0 mol%, more preferably 20.0 to 90.0 mol%, and even more preferably 30 to 90 mol%, based on the total amount of the alkali-soluble acrylic resin.

Methods for introducing reactive groups into alkali-soluble acrylic resins include, for example, reacting hydroxyl groups, carboxyl groups, primary amino groups, secondary amino groups, acetoacetyl groups, sulfonic acids, etc. with epoxy compounds, blocked isocyanate compounds, isocyanate compounds, vinyl sulfone compounds, aldehyde compounds, methylol compounds, carboxylic acid anhydrides, etc.

A preferred example of a method for introducing reactive groups into an alkali-soluble acrylic resin is, for example, a method for synthesizing an alkali-soluble acrylic resin having a carboxy group by polymerization reaction, and then reacting some of the carboxy groups of the alkali-soluble acrylic resin with glycidyl (meth)acrylate by polymerization reaction to introduce (meth)acryloxy groups into the alkali-soluble acrylic resin. By the above method, an alkali-soluble acrylic resin having a (meth)acryloxy group in the side chain can be obtained.

The polymerization reaction is preferably carried out at a temperature of 70 to 100°C, and more preferably at a temperature of 80 to 90°C. The polymerization initiator used in the polymerization reaction is preferably an azo-based initiator, and more preferably V-601 (product name) or V-65 (product name) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., for example. The polymerization reaction is preferably carried out at a temperature of 80 to 110°C. In the polymerization reaction, it is preferable to use a catalyst such as an ammonium salt.

The weight average molecular weight (Mw) of the alkali-soluble acrylic resin is preferably 10,000 or more, more preferably 10,000 to 100,000, and even more preferably 15,000 to 70,000.

From the viewpoint of developability, the acid value of the alkali-soluble acrylic resin is preferably 50 mgKOH/g or more, more preferably 60 mgKOH/g or more, even more preferably 70 mgKOH/g or more, and particularly preferably 80 mgKOH/g or more. In this specification, the acid value of the alkali-soluble acrylic resin is a value measured according to the method described in JIS K0070:1992.
The upper limit of the acid value of the alkali-soluble acrylic resin is preferably 200 mgKOH/g or less, and more preferably 150 mgKOH/g or less, from the viewpoint of preventing dissolution in a developer.

From the viewpoint of patterning property and reliability, the content of the residual monomer of each constituent unit of the alkali-soluble resin in the photosensitive composition layer is preferably 1000 ppm by mass or less, more preferably 500 ppm by mass or less, and even more preferably 100 ppm by mass or less, based on the total mass of the alkali-soluble resin. There is no particular lower limit, and it is preferably 0.1 ppm by mass or more, and more preferably 1 ppm by mass or more.

Specific examples of alkali-soluble acrylic resins are shown below. The content ratio (molar ratio) of each constituent unit in the alkali-soluble acrylic resins below can be set appropriately depending on the purpose.

The photosensitive composition layer may contain a single type of alkali-soluble resin, or may contain two or more types of alkali-soluble resins.

[Polymer containing a structural unit having a carboxylic acid anhydride structure]
The photosensitive composition layer may further contain a polymer containing a structural unit having a carboxylic acid anhydride structure (hereinafter, also referred to as "polymer B") as a binder. When the photosensitive composition layer contains polymer B, the developability and strength after curing can be improved.

The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, with a cyclic carboxylic acid anhydride structure being preferred.
The ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5- or 6-membered ring, and even more preferably a 5-membered ring.

The structural unit having a carboxylic acid anhydride structure is preferably a structural unit containing a divalent group in the main chain obtained by removing two hydrogen atoms from a compound represented by the following formula P-1, or a structural unit in which a monovalent group in the main chain obtained by removing one hydrogen atom from a compound represented by the following formula P-1 is bonded directly or via a divalent linking group to the main chain.

In formula P-1, R ^A1a represents a substituent, n ^1a R ^A1a may be the same or different, Z ^1a represents a divalent group forming a ring containing -C(=O)-O-C(=O)-, and n ^1a represents an integer of 0 or more.

An example of the substituent represented by R ^A1a is an alkyl group.

Z ^1a is preferably an alkylene group having 2 to 4 carbon atoms, more preferably an alkylene group having 2 or 3 carbon atoms, and even more preferably an alkylene group having 2 carbon atoms.

n ^1a represents an integer of 0 or more. When Z ^1a represents an alkylene group having 2 to 4 carbon atoms, n ^1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and further preferably 0.

When n ^1a represents an integer of 2 or more, the multiple R ^A1a may be the same or different. In addition, the multiple R ^A1a may be bonded to each other to form a ring, but it is preferable that they are not bonded to each other to form a ring.

As a structural unit having a carboxylic acid anhydride structure, a structural unit derived from an unsaturated carboxylic acid anhydride is preferable, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferable, a structural unit derived from an unsaturated aliphatic cyclic carboxylic acid anhydride is even more preferable, a structural unit derived from maleic anhydride or itaconic anhydride is particularly preferable, and a structural unit derived from maleic anhydride is most preferable.

The structural unit having a carboxylic acid anhydride structure in polymer B may be of one type alone or of two or more types.

The content of the structural unit having a carboxylic acid anhydride structure relative to the total amount of polymer B is preferably from 0 to 60 mol %, more preferably from 5 to 40 mol %, and even more preferably from 10 to 35 mol %.
The photosensitive composition layer may contain one kind of polymer B alone, or may contain two or more kinds of polymer B.

From the viewpoint of patterning property and reliability, the content of the residual monomers of each structural unit of polymer B in the photosensitive composition layer is preferably 1000 ppm by mass or less, more preferably 500 ppm by mass or less, and even more preferably 100 ppm by mass or less, based on the total mass of polymer B. There is no particular lower limit, but 0.1 ppm by mass or more is preferable, and 1 ppm by mass or more is more preferable.

When the photosensitive composition layer contains polymer B, the content of polymer B is preferably 0.1 to 30% by mass, more preferably 0.2 to 20% by mass, even more preferably 0.5 to 20% by mass, and particularly preferably 1 to 20% by mass, based on the total mass of the photosensitive composition layer, in terms of developability and strength after curing.

[Blocked isocyanate compound]
The photosensitive composition layer may contain a blocked isocyanate compound.
The blocked isocyanate compound contributes to improving the strength of the pattern to be formed.
Since the blocked isocyanate compound reacts with a hydroxyl group and a carboxyl group, for example, when at least one of the binder polymer and the radical polymerizable compound having an ethylenically unsaturated group has at least one of a hydroxyl group and a carboxyl group, the hydrophilicity of the film formed tends to decrease and the function as a protective film tends to be enhanced. Note that the blocked isocyanate compound means "a compound having a structure in which the isocyanate group of an isocyanate is protected (so-called masked) with a blocking agent."

The dissociation temperature of the blocked isocyanate compound is preferably 100 to 160°C, and more preferably 110 to 150°C.

In this specification, the "dissociation temperature of a blocked isocyanate compound" means the temperature of the endothermic peak associated with the deprotection reaction of a blocked isocyanate compound when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter. As a differential scanning calorimeter, for example, a differential scanning calorimeter (model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited to the above-mentioned differential scanning calorimeter.

Examples of blocking agents with a dissociation temperature of 100 to 160°C include active methylene compounds (malonic acid diesters (dimethyl malonate, diethyl malonate, di-n-butyl malonate, di-2-ethylhexyl malonate, etc.)) and oxime compounds (formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, cyclohexanone oxime, and other compounds having a structure represented by -C(=N-OH)- in the molecule). Of the above, oxime compounds are preferred as blocking agents with a dissociation temperature of 100 to 160°C from the viewpoint of storage stability.

The blocked isocyanate compound preferably has an isocyanurate structure in order to improve the brittleness of the film or to improve adhesion to the transfer target. A blocked isocyanurate compound having an isocyanurate structure can be obtained, for example, by protecting hexamethylene diisocyanate through isocyanuration.

As a blocked isocyanate compound having an isocyanurate structure, a compound having an oxime structure in which an oxime compound is used as a blocking agent is preferred, since it is easier to set the dissociation temperature in a preferred range and to reduce development residues compared to a compound not having an oxime structure.

From the viewpoint of the strength of the pattern formed, the blocked isocyanate compound preferably has a polymerizable group, and more preferably has a radically polymerizable group.

Examples of the polymerizable group include ethylenically unsaturated groups such as (meth)acryloxy groups, (meth)acrylamide groups, and styryl groups, as well as groups having an epoxy group such as glycidyl groups. Among the above, ethylenically unsaturated groups are preferred as the polymerizable group, and (meth)acryloxy groups are more preferred, from the standpoint of the surface condition of the resulting pattern, development speed, and reactivity.

As the blocked isocyanate compound, commercially available products can be used. Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) AOI-BP, Karenz (registered trademark) MOI-BP, etc. (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, manufactured by Asahi Kasei Chemicals Corporation).

The photosensitive composition layer may contain one type of blocked isocyanate compound alone, or may contain two or more types of blocked isocyanate compounds.

When the photosensitive composition layer contains a blocked isocyanate compound, the content of the blocked isocyanate compound is preferably 1 to 50% by mass, and more preferably 5 to 30% by mass, based on the total mass of the photosensitive composition layer.

[Polymerization inhibitor]
The photosensitive composition layer may contain a polymerization inhibitor.
The polymerization inhibitor means a compound having a function of delaying or inhibiting a polymerization reaction. As the polymerization inhibitor, for example, a known compound used as a polymerization inhibitor can be used.

When the photosensitive composition layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 10.00% by mass, more preferably 0.05 to 5.00% by mass, and even more preferably 0.10 to 3.00% by mass, based on the total mass of the photosensitive composition layer.

Examples of the polymerization inhibitor include phenothiazine compounds such as phenothiazine, bis-(1-dimethylbenzyl)phenothiazine, and 3,7-dioctylphenothiazine; bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylenebis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl), 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, and pentaerythritol tetrakis 3-(3,5-di-te rt-butyl-4-hydroxyphenyl)propionate and other hindered phenol compounds; 4-nitrosophenol, N-nitrosodiphenylamine, N-nitrosocyclohexylhydroxylamine, and N-nitrosophenylhydroxylamine and other nitroso compounds or salts thereof; methylhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, and 4-benzoquinone and other quinone compounds; 4-methoxyphenol, 4-methoxy-1-naphthol, and t-butylcatechol and other phenol compounds; and metal salt compounds such as copper dibutyldithiocarbamate, copper diethyldithiocarbamate, manganese diethyldithiocarbamate, and manganese diphenyldithiocarbamate.
Among these, in terms of more excellent effects of the present invention, the polymerization inhibitor preferably contains at least one selected from the group consisting of a phenothiazine compound, a nitroso compound or a salt thereof, and a hindered phenol compound, and more preferably phenothiazine, bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylene bis(oxyethylene)]2,4-bis[(laurylthio)methyl]-o-cresol, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl), and N-nitrosophenylhydroxylamine aluminum salt.

The photosensitive composition layer may contain one type of polymerization inhibitor alone, or may contain two or more types of polymerization inhibitors.

[Hydrogen donor compound]
The photosensitive composition layer may contain a hydrogen donor compound.
The hydrogen donor compound has the effect of further improving the sensitivity of the photopolymerization initiator to actinic rays and suppressing the polymerization inhibition of the polymerizable compound caused by oxygen.

Examples of hydrogen donor compounds include amines and amino acid compounds.

Examples of amines include compounds described in M. R. Sander et al., Journal of Polymer Society, Vol. 10, p. 3173 (1972), JP-B-44-020189, JP-A-51-082102, JP-A-52-134692, JP-A-59-138205, JP-A-60-084305, JP-A-62-018537, JP-A-64-033104, and Research Disclosure No. 33825. More specific examples include 4,4'-bis(diethylamino)benzophenone, tris(4-dimethylaminophenyl)methane (also known as leuco crystal violet), triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline.
Among these, in terms of obtaining superior effects of the present invention, the amine is preferably at least one selected from the group consisting of 4,4'-bis(diethylamino)benzophenone and tris(4-dimethylaminophenyl)methane.

Examples of the amino acid compound include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.
Among these, N-phenylglycine is preferred as the amino acid compound in that it provides a more excellent effect of the present invention.

Other examples of hydrogen donor compounds include organometallic compounds (such as tributyltin acetate) described in JP-B-48-042965, hydrogen donors described in JP-B-55-034414, and sulfur compounds (such as trithiane) described in JP-A-6-308727.

The photosensitive composition layer may contain a single hydrogen donor compound, or may contain two or more hydrogen donor compounds.

When the photosensitive composition layer contains a hydrogen donor compound, the content of the hydrogen donor compound is preferably 0.01 to 10.00% by mass, more preferably 0.03 to 8.00% by mass, and even more preferably 0.10 to 5.00% by mass, based on the total mass of the photosensitive composition layer, from the viewpoint of improving the curing speed by balancing the polymerization growth rate and chain transfer.

[Heterocyclic compounds]
The photosensitive composition layer may contain a heterocyclic compound.
The heterocycle contained in the heterocyclic compound may be either a monocyclic or polycyclic heterocycle.
Examples of heteroatoms contained in the heterocyclic compound include a nitrogen atom, an oxygen atom, and a sulfur atom. The heterocyclic compound preferably contains at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom, and a sulfur atom, and more preferably contains a nitrogen atom.

Examples of heterocyclic compounds include triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, benzoxazole compounds, and pyrimidine compounds.
Among the above, the heterocyclic compound is preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, triazine compounds, rhodanine compounds, thiazole compounds, benzimidazole compounds, and benzoxazole compounds, and more preferably at least one compound selected from the group consisting of triazole compounds, benzotriazole compounds, tetrazole compounds, thiadiazole compounds, thiazole compounds, benzothiazole compounds, benzimidazole compounds, and benzoxazole compounds.

Preferred specific examples of heterocyclic compounds are shown below. Examples of triazole compounds and benzotriazole compounds include the following compounds.

Examples of tetrazole compounds include the following compounds:

Examples of thiadiazole compounds include the following compounds:

Examples of triazine compounds include the following compounds:

Examples of rhodanine compounds include the following:

Examples of thiazole compounds include the following:

Examples of benzothiazole compounds include the following compounds:

Examples of benzimidazole compounds include the following compounds:

Examples of benzoxazole compounds include the following compounds:

The photosensitive composition layer may contain a single type of heterocyclic compound, or may contain two or more types of heterocyclic compounds.

When the photosensitive composition layer contains a heterocyclic compound, the content of the heterocyclic compound is preferably 0.01 to 20.00% by mass, more preferably 0.10 to 10.00% by mass, even more preferably 0.30 to 8.00% by mass, and particularly preferably 0.50 to 5.00% by mass, based on the total mass of the photosensitive composition layer.

[Aliphatic thiol compounds]
The photosensitive composition layer may contain an aliphatic thiol compound.
When the photosensitive composition layer contains an aliphatic thiol compound, the aliphatic thiol compound undergoes an ene-thiol reaction with the radical polymerizable compound having an ethylenically unsaturated group, thereby suppressing the cure shrinkage of the film to be formed and alleviating stress.

As the aliphatic thiol compound, a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (i.e., a bifunctional or higher aliphatic thiol compound) is preferred.

Among the above, polyfunctional aliphatic thiol compounds are preferred as the aliphatic thiol compounds from the viewpoint of the adhesion of the pattern to be formed (particularly the adhesion after exposure).

In this specification, "polyfunctional aliphatic thiol compound" means an aliphatic compound having two or more thiol groups (also called "mercapto groups") in the molecule.

As the polyfunctional aliphatic thiol compound, a low molecular weight compound having a molecular weight of 100 or more is preferable. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and even more preferably 150 to 1,000.

The number of functional groups of the polyfunctional aliphatic thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from the viewpoint of the adhesion of the pattern to be formed.

Examples of polyfunctional aliphatic thiol compounds include trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, pentaerythritol tetrakis(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolethane tris(3-mercaptobutyrate), tris[(3-mercaptopropionyloxy)ethyl]isocyanurate, trimethylolpropane tris(3-mercaptopropione ester), pentaerythritol tetrakis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,4-bis(3-mercaptobutyryloxy)butane, 1,2-ethanedithiol, 1,3-propanedithiol, 1,6-hexamethylenedithiol, 2,2'-(ethylenedithio)diethanethiol, meso-2,3-dimercaptosuccinic acid, and di(mercaptoethyl)ether.

Among the above, the polyfunctional aliphatic thiol compound is preferably at least one compound selected from the group consisting of trimethylolpropane tris(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, and 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

Examples of monofunctional aliphatic thiol compounds include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.

The photosensitive composition layer may contain a single aliphatic thiol compound, or may contain two or more aliphatic thiol compounds.

When the photosensitive composition layer contains an aliphatic thiol compound, the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5 to 50% by mass, even more preferably 5 to 30% by mass, and particularly preferably 8 to 20% by mass, based on the total mass of the photosensitive composition layer.

[Surfactant]
The photosensitive composition layer may contain a surfactant.
Examples of the surfactant include those described in paragraph [0017] of Japanese Patent No. 4,502,784 and paragraphs [0060] to [0071] of JP-A-2009-237362.

As the surfactant, a fluorosurfactant or a silicon-based surfactant is preferred, and a fluorosurfactant is more preferred. Examples of commercially available fluorosurfactants include Megafac (registered trademark) F552 (manufactured by DIC Corporation) and Megafac (registered trademark) F551A (manufactured by DIC Corporation). Examples of commercially available silicon-based surfactants include DOWSIL (registered trademark) 8032 Additive.

Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F- 568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorad FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Ftergent Examples of such products include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation).
Also suitable for use as the fluorosurfactant are acrylic compounds that have a molecular structure with a functional group containing a fluorine atom, and when heat is applied, the functional group containing the fluorine atom is cleaved and the fluorine atom volatilizes. Examples of such fluorosurfactants include the Megafac DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Business Daily (February 23, 2016)), for example, Megafac DS-21.
As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.
Furthermore, as the fluorosurfactant, a block polymer can also be used.
In addition, as the fluorine-based surfactant, a fluorine-containing polymer compound containing a constituent unit derived from a (meth)acrylate compound having a fluorine atom and a constituent unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups, propyleneoxy groups) can also be preferably used.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used, such as Megafac RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

From the viewpoint of improving environmental compatibility, the fluorine-based surfactant is preferably a surfactant derived from an alternative material to a compound having a linear perfluoroalkyl group having 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS).
Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic (registered trademark) L10, L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), and Solsperse. 20000 (all manufactured by Lubrizol Nippon Co., Ltd.), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), Paionin D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), and the like.

Silicone surfactants include linear polymers consisting of siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or ends.

Specific examples of silicone surfactants include Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, and KF-355. A, KF-945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicones Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie), etc.

The photosensitive composition layer may contain one type of surfactant alone, or may contain two or more types of surfactants.

When the photosensitive composition layer contains a surfactant, the content of the surfactant is preferably 0.01 to 3.00% by mass, more preferably 0.05 to 1.00% by mass, and even more preferably 0.10 to 0.80% by mass, based on the total mass of the photosensitive composition layer.

[Metal ions]
The photosensitive composition layer may contain metal ions.
The photosensitive composition layer preferably contains a metal ion in terms of adhesion between the photosensitive composition layer and the support. The metal element constituting the metal ion may be a metal element or a metalloid element. The metal ion may be a peroxide ion. The valence of the metal ion is not particularly limited, but may be monovalent or divalent or more.

When the photosensitive composition layer contains metal ions, the content of the metal ions in the photosensitive composition layer is preferably 500 ppm by mass or less, more preferably 0.01 to 200 ppm by mass, and even more preferably 0.01 to 100 ppm by mass, relative to the total mass of the photosensitive composition layer.

Examples of metal ions include alkali metal ions, alkaline earth metal ions, typical metal ions, and transition metal ions, and more specifically, sodium ions, potassium ions, magnesium ions, calcium ions, iron ions, manganese ions, permanganates, copper ions, aluminum ions, titanium ions, chromium ions, chromate ions, cobalt ions, nickel ions, zinc ions, and tin ions.
In particular, it is preferable that the sodium ion and potassium ion contents are within the above ranges, since this will result in a more excellent effect of the present invention.

Examples of metalloid element ions include silicate ions, silicon ions, boron ions, germanium ions, arsenic ions, antimony ions, and tellurium ions.

The metal ion content can be quantified using known methods, such as ICP atomic emission spectrometry.

The photosensitive composition layer may contain one type of metal ion alone, or may contain two or more types of metal ions.

[Residual Solvent]
The photosensitive composition layer may contain a residual solvent.
The residual solvent means a solvent contained in the photosensitive composition layer. The solvent may be derived from the photosensitive composition or may be derived from other sources.

When the photosensitive composition layer contains a surfactant, the content of the residual solvent in the photosensitive composition layer is preferably 50 mg/ ^m2 or less, more preferably 1 to 50 mg/ ^m2 , more preferably 1 to 20 mg/ ^m2 , and even more preferably 2 to 15 mg/ ^m2 , in terms of better effects of the present invention.

The method for measuring the residual solvent is as follows.
First, a sample piece of 1 cm x 1 cm is punched out from a transfer film having a temporary support and a photosensitive composition layer. Next, the sample piece is placed in a vial with 1 mL of tetrahydrofuran and shaken for 1 hour to extract the residual solvent in the photosensitive composition layer. The resulting solution is subjected to GC-MS (Gas Chromatography-Mass spectrometry) measurement to measure the amount of the residual solvent.

Examples of residual solvents include organic solvents contained in the photosensitive composition described below. Other examples include benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane.

[Other ingredients]
The photosensitive composition layer may contain components other than the components already described (hereinafter, also referred to as "other components"). Examples of the other components include colorants, antioxidants, and particles (e.g., metal oxide particles). Examples of the other components include other additives described in paragraphs [0058] to [0071] of JP-A-2000-310706.

Examples of colorants include brilliant green, eosin, ethyl violet, erythrosine B, methyl green, crystal violet, basic fuchsin, phenolphthalein, 1,3-diphenyltriazine, alizarin red S, thymolphthalein, methyl violet 2B, quinaldine red, rose bengal, metanil yellow, thymolsulfophthalein, xylenol blue, methyl orange, orange IV, diphenylthyrocarbazone, 2,7-dichlorofluorescein, paramethyl red, Congo red, benzopurpurin 4B, α-naphthyl red, Nile blue A, phenacetin, methyl violet, malachite green, parafuchsin, rhodamine B, and rhodamine 6G.
Among these, brilliant green is preferred as the colorant in that it provides a more excellent effect of the present invention.

When the photosensitive composition layer contains a colorant, the content of the colorant is preferably 0.01% by mass or more, more preferably 0.01 to 5.00% by mass, and even more preferably 0.01 to 1.00% by mass, based on the total mass of the photosensitive composition layer.

Examples of the antioxidant include 3-pyrazolidones such as 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorohydroquinone; paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, and paraphenylenediamine.
Among these, 3-pyrazolidones are preferred as the antioxidant, and 1-phenyl-3-pyrazolidone is more preferred, in terms of the superior effect of the present invention.

When the photosensitive composition layer contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and even more preferably 0.01% by mass or more, based on the total mass of the photosensitive composition layer. There is no particular upper limit, but it is preferably 1% by mass or less.

[Thickness of Photosensitive Composition Layer]
The thickness of the photosensitive composition layer is not particularly limited, but is often 30 μm or less, and is preferably 20 μm or less, more preferably 15 μm or less, even more preferably 10 μm or less, and particularly preferably 5 μm or less, in terms of superior effects of the present invention. The lower limit is not particularly limited, but is preferably 0.05 μm or more.
The thickness of the photosensitive composition layer can be calculated, for example, as the average value of any five points measured by cross-sectional observation using a scanning electron microscope (SEM).

[Refractive Index of Photosensitive Composition Layer]
The refractive index of the photosensitive composition layer is preferably from 1.47 to 1.56, and more preferably from 1.49 to 1.54.

[Color of Photosensitive Composition Layer]
The photosensitive composition layer is preferably achromatic. In the L ^* a ^* b ^* color system, the a ^* value of the photosensitive composition layer is preferably −1.0 to 1.0, and the b ^* value of the photosensitive composition layer is preferably −1.0 to 1.0.

[Component ratio]
The ratio of the mass of the components having a molecular weight of 100,000 or more contained in the photosensitive composition layer to the mass of the components having a molecular weight of 10,000 or less contained in the photosensitive composition layer (mass of components having a molecular weight of 100,000 or more/mass of components having a molecular weight of 50,000 or less) is not particularly limited, but is preferably 0.10 or less in terms of superior effects of the present invention. The lower limit of the ratio is not particularly limited, but may be 0.
The above ratio can be calculated by preparing a sample in which the photosensitive composition layer is dissolved, performing GPC measurement, and comparing the area of the region having a molecular weight of 10,000 or less with the area of the region having a molecular weight of 100,000 or more in the obtained GPC chart.

<Other demographics>
The transfer film may include layers other than the temporary support and the photosensitive composition layer described above.
Examples of the other layers include a protective film and an antistatic layer.

The transfer film may have a protective film for protecting the photosensitive composition layer on the surface opposite to the temporary support.
The protective film is preferably a resin film, and a resin film having heat resistance and solvent resistance can be used.
Examples of the protective film include polyolefin films such as polypropylene films and polyethylene films. Alternatively, a resin film made of the same material as the above-mentioned temporary support may be used as the protective film.

The thickness of the protective film is preferably 1 to 100 μm, more preferably 5 to 50 μm, even more preferably 5 to 40 μm, and particularly preferably 15 to 30 μm. The thickness of the protective film is preferably 1 μm or more in terms of excellent mechanical strength, and is preferably 100 μm or less in terms of being relatively inexpensive.

The transfer film may include an antistatic layer.
By having an antistatic layer in a transfer film, the generation of static electricity when peeling off a film or the like placed on the antistatic layer can be suppressed, and the generation of static electricity due to rubbing with equipment or other films, etc. can also be suppressed, thereby preventing malfunctions in electronic devices, for example.
The antistatic layer is preferably disposed between the temporary support and the photosensitive composition layer.

The antistatic layer is a layer having antistatic properties and contains at least an antistatic agent. There are no particular limitations on the antistatic agent, and any known antistatic agent can be used.

<Method of manufacturing transfer film>
The method for producing the transfer film of the present invention is not particularly limited, and any known method can be used.
Among these, a method in which a photosensitive composition is coated on a temporary support, and if necessary, a drying treatment is performed to form a photosensitive composition layer (hereinafter, this method is also referred to as a "coating method") is preferred from the viewpoint of excellent productivity.
In the coating method, in order to reduce the number of foreign matters in the photosensitive composition layer, a method in which the photosensitive composition used to form the photosensitive composition layer is subjected to a filtration treatment can be mentioned.
First, the filtration process will be described in detail below.

As described above, the number of foreign matters in the photosensitive composition layer can be adjusted by subjecting the photosensitive composition used to form the photosensitive composition layer to a filtration treatment. More specifically, the photosensitive composition can be filtered through a filter.
When the photosensitive composition is filtered through a filter, it is preferable to perform filter filtration two or more times (hereinafter, also referred to as "multi-stage filtration"). The number of times of filter filtration in the multi-stage filtration is preferably two or more times, more preferably three or more times, and even more preferably four or more times. There is no particular upper limit, but from the viewpoint of economy, it is preferably 10 times or less.
In the case of multi-stage filtration, the same or different types of filters may be connected in series or in parallel. The multi-stage filtration step may be a circulating filtration step.
When multiple types of filters are used, filters having different pore sizes and/or materials may be used in combination.

The filter pore size is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 1 μm or less, particularly preferably 0.2 μm or less, and most preferably 0.1 μm or less. There is no particular lower limit, but a size of 0.01 μm or more is preferred.
In the case of multi-stage filtration using multiple types of filters, it is preferable to use filters with gradually smaller pore sizes as the number of times of filtration increases. For example, it is preferable to use a filter with a pore size of 5 μm, a filter with a pore size of 3 μm, a filter with a pore size of 1 μm, a filter with a pore size of 0.2 μm, and a filter with a pore size of 0.1 μm in this order.

The filter is preferably a polytetrafluoroethylene filter, a polyethylene filter, or a nylon filter, and among these, a polytetrafluoroethylene filter is more preferred.
As the filter, for example, one having reduced elution as disclosed in JP-A-2016-201426 is preferable.

In addition to the above-mentioned filter filtration, foreign matter may be removed using an adsorbent, or a combination of filter filtration and an adsorbent may be used. As the adsorbent, for example, a known adsorbent may be used, such as an inorganic adsorbent such as silica gel or zeolite, or an organic adsorbent such as activated carbon. As an example of a metal adsorbent, the one disclosed in JP 2016-206500 A may be used.

Methods for reducing foreign matter include selecting raw materials with a low metal content as the raw materials for the various materials, filtering the raw materials for the various materials, or lining the inside of the apparatus with Teflon (registered trademark) to perform distillation under conditions that suppress contamination as much as possible. The preferred conditions for filtering the raw materials for the various materials are the same as those for filtering described above.

The photosensitive composition used in the coating method preferably contains the above-mentioned components constituting the photosensitive composition layer (e.g., a polymerizable compound, an alkali-soluble resin, a photopolymerization initiator, etc.) and a solvent.
The solvent is preferably an organic solvent. Examples of the organic solvent include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, and 2-propanol. The solvent is preferably a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether acetate, or a mixed solvent of diethylene glycol ethyl methyl ether and propylene glycol monomethyl ether acetate.

As the solvent, an organic solvent having a boiling point of 180 to 250° C. (high boiling point solvent) can also be used, if necessary.
The photosensitive composition may contain one type of solvent alone, or may contain two or more types of solvents.

When the photosensitive composition contains a solvent, the total solid content of the photosensitive composition is preferably 5 to 80% by mass, more preferably 5 to 40% by mass, and even more preferably 5 to 30% by mass, based on the total mass of the photosensitive composition.

When the photosensitive composition contains a solvent, the viscosity of the photosensitive composition at 25°C is, for example, preferably 1 to 50 mPa·s, more preferably 2 to 40 mPa·s, and even more preferably 3 to 30 mPa·s, from the viewpoint of coatability. The viscosity is measured using a viscometer. As the viscometer, for example, a viscometer manufactured by Toki Sangyo Co., Ltd. (product name: VISCOMETER TV-22) can be suitably used. However, the viscometer is not limited to the above-mentioned viscometer.

When the photosensitive composition contains a solvent, the surface tension of the photosensitive composition at 25°C is, for example, preferably 5 to 100 mN/m, more preferably 10 to 80 mN/m, and even more preferably 15 to 40 mN/m, from the viewpoint of coatability. The surface tension is measured using a surface tensiometer. As a surface tensiometer, for example, a surface tensiometer manufactured by Kyowa Interface Science Co., Ltd. (product name: Automatic Surface Tensiometer CBVP-Z) can be suitably used. However, the surface tensiometer is not limited to the above-mentioned surface tensiometer.

Examples of methods for applying the photosensitive composition include printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (i.e., slit coating).

Examples of the drying method include natural drying, heat drying, and reduced pressure drying. The above-mentioned methods can be applied alone or in combination.
In this disclosure, "drying" means removing at least a portion of the solvent contained in the composition.

When the transfer film has a protective film, the transfer film can be produced by laminating the protective film to the photosensitive composition layer.
The method for attaching the protective film to the photosensitive composition layer is not particularly limited, and any known method can be used.
Examples of a device for laminating the protective film to the photosensitive composition layer include known laminators such as a vacuum laminator and an autocut laminator.
The laminator is preferably equipped with any heatable roller, such as a rubber roller, and is capable of applying pressure and heat.

<Method of manufacturing laminate>
By using the above-mentioned transfer film, the photosensitive composition layer can be transferred to a receiving material.
In particular, the transfer film of the present invention is preferably used for producing a laminate having conductive thin wires.
Among them, the method for producing a laminate of the present invention includes a lamination step of contacting and laminating a photosensitive composition layer on a temporary support of a transfer film with a substrate having a conductive layer to obtain a substrate with a photosensitive composition layer having a substrate, a conductive layer, a photosensitive composition layer, and a temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
an etching step for etching the conductive layer in areas where no pattern is arranged to obtain conductive thin lines;
A removing step of removing the pattern,
Furthermore, a method for producing a laminate (hereinafter also referred to as "production method A") is preferred, which includes a peeling step of peeling off the temporary support from the substrate with the photosensitive composition layer between the lamination step and the exposure step, or between the exposure step and the development step.
The steps of the above process will be described in detail below.

[Lamination process]
The lamination process is a process in which the photosensitive composition layer on the temporary support of the transfer film is brought into contact with and laminated to a substrate having a conductive layer to obtain a substrate with a photosensitive composition layer having a substrate, a conductive layer, a photosensitive composition layer, and a temporary support in that order.

The exposed photosensitive composition layer on the temporary support of the transfer film is brought into contact with and laminated to a substrate having a conductive layer, and the photosensitive composition layer and the temporary support are disposed on the substrate having a conductive layer by this lamination.
In the lamination, the conductive layer and the surface of the photosensitive composition layer are pressure-bonded so as to be in contact with each other. In the above embodiment, the pattern obtained after exposure and development can be suitably used as an etching resist when etching the conductive layer.
The method of the pressure bonding is not particularly limited, and known transfer methods and lamination methods can be used. Among them, it is preferable to perform the pressure bonding by superposing the surface of the photosensitive composition layer on a substrate having a conductive layer, and applying pressure and heat with a roll or the like.
For lamination, a known laminator such as a vacuum laminator or an autocut laminator can be used.

The substrate having a conductive layer has a conductive layer on a substrate, and may have an optional layer formed thereon, i.e., the substrate having a conductive layer is a conductive substrate having at least a substrate and a conductive layer disposed on the substrate.
Examples of the substrate include a resin substrate, a glass substrate, and a semiconductor substrate.
A preferred embodiment of the substrate is described, for example, in paragraph 0140 of International Publication No. 2018/155193, the contents of which are incorporated herein by reference.

As the conductive layer, from the viewpoints of electrical conductivity and fine line formability, at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer is preferable.
Furthermore, only one conductive layer may be disposed on the substrate, or two or more conductive layers may be disposed on the substrate. When two or more conductive layers are disposed, it is preferable that the conductive layers are made of different materials.
A preferred embodiment of the conductive layer is described, for example, in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein by reference.

[Exposure process]
The exposure step is a step of pattern-exposing the photosensitive composition layer.
Here, the term "pattern exposure" refers to a form of exposure in a pattern, that is, exposure in a form in which exposed areas and non-exposed areas exist.
The positional relationship between the exposed and unexposed regions in the pattern exposure is not particularly limited, and is appropriately adjusted so as to obtain conductive thin lines as described below.

A light source for pattern exposure can be appropriately selected and used as long as it can irradiate light at least in a wavelength range capable of curing the photosensitive composition layer (e.g., 365 nm or 405 nm). In particular, the dominant wavelength of the exposure light for pattern exposure is preferably 365 nm. The dominant wavelength is the wavelength with the highest intensity.

Examples of light sources include various lasers, light-emitting diodes (LEDs), ultra-high pressure mercury lamps, high pressure mercury lamps, and metal halide lamps.
The exposure dose is preferably from 5 to 200 mJ/ ^cm2 , and more preferably from 10 to 200 mJ/ ^cm2 .

Preferred embodiments of the light source, exposure dose, and exposure method used for exposure are described, for example, in paragraphs [0146] to [0147] of WO 2018/155193, the contents of which are incorporated herein by reference.

[Peeling process]
The peeling step is a step of peeling off the temporary support from the substrate with the photosensitive composition layer between the laminating step and the exposure step, or between the exposure step and the development step described below.
The peeling method is not particularly limited, and a mechanism similar to the cover film peeling mechanism described in paragraphs [0161] to [0162] of JP-A-2010-072589 can be used.

[Development process]
The development step is a step of developing the exposed photosensitive composition layer to form a pattern.
The photosensitive composition layer can be developed using a developer.
The developer is preferably an alkaline aqueous solution. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide).

Examples of development methods include paddle development, shower development, spin development, and dip development.

The developer suitably used in the present disclosure may be, for example, the developer described in paragraph [0194] of WO 2015/093271, and the development method suitably used may be, for example, the development method described in paragraph [0195] of WO 2015/093271.

The detailed arrangement and specific size of the pattern formed are not particularly limited, but a pattern is formed that will result in the conductive fine wires described below. The spacing between the patterns is preferably 8 μm or less, and more preferably 6 μm or less. There is no particular lower limit, but it is often 2 μm or more.

The pattern (cured film of the photosensitive composition layer) formed by the above procedure is preferably achromatic. Specifically, in the L ^* a ^* b ^* color system, the a ^* value of the pattern is preferably −1.0 to 1.0, and the b ^* value of the pattern is preferably −1.0 to 1.0.

[Etching process]
The etching step is a step in which the conductive layer in the obtained laminate in the region where no pattern is arranged is etched to obtain conductive thin wires.
In the etching step, the conductive layer is etched using the pattern formed from the photosensitive composition layer in the developing step as an etching resist.
As the etching method, the method described in paragraphs [0209] to [0210] of JP-A-2017-120435, the method described in paragraphs [0048] to [0054] of JP-A-2010-152155, and the like, known methods such as dry etching methods such as plasma etching can be applied.

The line width of the conductive thin wire formed is preferably 8 μm or less, and more preferably 6 μm or less. There is no particular lower limit, but it is often 2 μm or more.

[Removal process]
The removing step is a step of removing the pattern.
The method for removing the pattern is not particularly limited, but examples include a method of removing the pattern by chemical treatment, and it is preferable to use a removing liquid.
As a method for removing the pattern, a method may be mentioned in which the laminate having the pattern is immersed in a stirring remover solution preferably at 30 to 80° C., more preferably at 50 to 80° C., for 1 to 30 minutes.

Examples of the removal liquid include removal liquids obtained by dissolving an inorganic alkaline component such as sodium hydroxide or potassium hydroxide, or an organic alkaline component such as a primary amine compound, a secondary amine compound, a tertiary amine compound, or a quaternary ammonium salt compound in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof.
Alternatively, a removal solution may be used to remove the residue by a spray method, a shower method, a paddle method, or the like.

[Other steps]
The method for producing a laminate of the present invention may include any step (other step) other than those described above.

The method for producing the laminate may include a step of exposing the pattern obtained by the developing step (a post-exposure step) and/or a step of heating the pattern (a post-bake step).
When both a post-exposure step and a post-bake step are included, it is preferable to carry out post-bake after post-exposure.

Examples of other processes include the process of reducing the visible light reflectance described in paragraph [0172] of WO 2019/022089, and the process of forming a new conductive layer on the insulating film described in paragraph [0172] of WO 2019/022089.

The laminate produced by the laminate producing method of the present invention can be applied to various applications. For example, the laminate can be applied to a touch sensor. In other words, the device including the laminate is preferably a touch panel, more preferably a capacitive touch panel. The input device can be applied to a display device such as an organic electroluminescence display device and a liquid crystal display device.
In particular, the conductive thin wire prepared as described above is preferably used as a sensor electrode or lead wiring of a touch sensor, and more preferably used as a lead wiring.

<Method of Manufacturing Printed Wiring Board>
The transfer film of the present invention is preferably used in a method for producing a printed wiring board.
The method for manufacturing a printed wiring board includes the steps of:
a seed layer forming step of forming a seed layer on the substrate;
a lamination step of contacting and laminating the photosensitive composition layer on the temporary support of the transfer film of the present invention with a substrate having a seed layer to obtain a substrate with a photosensitive composition layer having a substrate, a seed layer, a photosensitive composition layer, and a temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
a metal plating layer forming step of forming a metal plating layer by plating on the seed layer in an area where no pattern is arranged;
a protective layer forming step of forming a protective layer on the metal plating layer;
a pattern removing step of removing the pattern;
a seed layer removing step of removing the exposed seed layer to obtain conductive thin lines;
Furthermore, between the laminating step and the exposure step, or between the exposure step and the development step, there is a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer.
The steps of the above process will be described in detail below.

[Seed layer formation process]
The seed layer forming step is a step of forming a seed layer on a substrate.
The substrate used in this step includes the substrate used in the above-mentioned <Laminate manufacturing method>.

(Seed Layer)
The metal contained in the seed layer is not particularly limited, and any known metal can be used.
Examples of the main component (so-called main metal) contained in the seed layer include copper, chromium, lead, nickel, gold, silver, tin, and zinc. The main component refers to the metal contained in the seed layer with the largest content.

The thickness of the seed layer is not particularly limited, but is preferably 50 nm or more, and more preferably 100 nm or more. There is no particular upper limit, but it is preferably 2 μm or less.

The method for forming the seed layer is not particularly limited, and examples include a method of applying a dispersion liquid containing dispersed metal particles and sintering the coating film, a sputtering method, and a vapor deposition method.

The procedures for the lamination process, exposure process, and development process in the method for manufacturing the printed wiring board can be the same as those described in the process for manufacturing the laminate above.

[Metal plating layer forming process]
The metal plating layer forming step is a step of forming a metal plating layer by plating on the seed layer in the area where no pattern is arranged.
The plating treatment may be performed by electrolytic plating or electroless plating, with electrolytic plating being preferred from the viewpoint of productivity.

The metal contained in the metal plating layer is not particularly limited, and any known metal can be used.
The metal plating layer may include metals such as, for example, copper, chromium, lead, nickel, gold, silver, tin, and zinc, as well as alloys of these metals.
In particular, the metal plating layer preferably contains copper or an alloy thereof, in that the conductive thin wire has better conductivity. Also, in that the conductive thin wire has better conductivity, the main component of the metal plating layer is preferably copper.

The thickness of the metal plating layer is not particularly limited, but is preferably 0.1 to 1 μm, and more preferably 0.3 to 1 μm.

[Protective layer forming process]
The protective layer lamination step is a step of forming a protective layer on the metal plating layer.
The material of the protective layer is preferably a material that is resistant to the removing solution or etching solution in the removing step or the conductive portion forming step. Examples of the material include metals such as nickel, chromium, tin, zinc, magnesium, gold, and silver, alloys thereof, and resins. Among them, the material of the protective layer is preferably nickel or chromium.

Methods for forming the protective layer include, for example, electroless plating and electroplating, with electroplating being preferred.

The thickness of the protective layer is not particularly limited, but is preferably 0.3 μm or more, and more preferably 0.5 μm or more. There is no particular upper limit, but is preferably 3.0 μm or less, and more preferably 2.0 μm or less.

The steps of the pattern removal process in the above-mentioned method for manufacturing a printed wiring board can be the same as those described in the removal process performed in the above-mentioned <method for manufacturing a laminate>.

[Seed layer removal process]
The seed layer removal step is a step of removing the exposed seed layer to obtain conductive thin lines.
The method for removing the part of the seed layer is not particularly limited, but a known etching solution can be used.
Examples of known etching solutions include ferric chloride solution, cupric chloride solution, ammonia alkali solution, sulfuric acid-hydrogen peroxide mixture, and phosphoric acid-hydrogen peroxide mixture.

The line width of the conductive thin wire formed is preferably 8 μm or less, and more preferably 6 μm or less. There is no particular lower limit, but it is often 2 μm or more.

The procedure for the peeling step in the manufacturing method for the printed wiring board can be the same as that described in the process for manufacturing the laminate above.

The present disclosure will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing contents, and processing procedures shown in the following examples can be changed as appropriate without departing from the spirit of the present disclosure. Therefore, the scope of the present disclosure is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are based on mass. Furthermore, the composition ratio in the polymer is a molar ratio unless otherwise specified.

<Synthesis of Polymer A-1>
Propylene glycol monomethyl ether acetate (Showa Denko K.K.) (116.5 parts) was placed in a three-neck flask and heated to 90 ° C. under a nitrogen atmosphere. Styrene (FUJIFILM Wako Pure Chemical Industries, Ltd.) (32.0 parts), methacrylic acid (FUJIFILM Wako Pure Chemical Industries, Ltd.) (28.0 parts), methyl methacrylate (FUJIFILM Wako Pure Chemical Industries, Ltd.) (40.0 parts), dimethyl-2,2'-azobis (2-methylpropionate) (FUJIFILM Wako Pure Chemical Industries, Ltd.) (4.0 parts), and propylene glycol monomethyl ether acetate (Showa Denko K.K.) (116.5 parts) were added dropwise to the three-neck flask solution maintained at 90 ° C. ± 2 ° C. over 2 hours. After the dropwise addition, the mixture was stirred at 90 ° C. ± 2 ° C. for 2 hours to synthesize polymer A-1 (solid content concentration 30.0%) shown in Table 1.

In Table 1, the descriptions represent the following:
St: styrene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MAA: Methacrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MMA: Methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
BZMA: benzyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
PGMEA: Propylene glycol monomethyl ether acetate (manufactured by Showa Denko K.K.)
V-601: Dimethyl-2,2'-azobis(2-methylpropionate) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

<Synthesis of Polymers A-2 and A-3>
The components were mixed according to Table 1, and polymers A-2 and A-3 were synthesized in the same manner as in the above synthesis method.

<Preparation of Photosensitive Composition 1>
According to Tables 2 and 3, each component was added to a mixed solvent of methyl ethyl ketone (manufactured by Sankyo Chemical Industry Co., Ltd.) (60 parts) and propylene glycol monomethyl ether acetate (manufactured by Showa Denko K.K.) (40 parts) so that the solid content concentration of the photosensitive composition 1 was 13 mass % to obtain a mixed solution. Thereafter, the obtained mixed solution was subjected to multi-stage filtration using a polytetrafluoroethylene filter having a pore size of 5.0 μm, a polytetrafluoroethylene filter having a pore size of 3.0 μm, a polytetrafluoroethylene filter having a pore size of 1.0 μm, a polytetrafluoroethylene filter having a pore size of 0.2 μm, and a polytetrafluoroethylene filter having a pore size of 0.1 μm in this order, thereby preparing the photosensitive composition 1.

Example 1
Photosensitive composition 1 was applied onto a 16 μm-thick polyethylene terephthalate (PET) film serving as a temporary support using a slit nozzle, and the film was passed through a drying zone at 80° C. for 40 seconds to form a photosensitive composition layer 1 having a thickness of 5 μm.
Next, a PET film having a thickness of 16 μm was laminated as a protective film on the photosensitive composition layer to obtain a transfer film of Example 1.

<Examples 2 to 19>
Transfer films of Examples 2 to 19 were obtained in the same manner as in Example 1, except that the types and amounts of the various components were changed according to Tables 1 to 3.

<Comparative Examples 1 and 2>
The transfer films of Comparative Examples 1 and 2 were obtained in the same manner as in Example 1, except that each component was adjusted according to Tables 1 and 3, and instead of multi-stage filtration, filtration was performed only once (single-stage filtration) using a polytetrafluoroethylene filter having a pore size of 0.2 μm.

<Test evaluation>
[Residual Solvent]
The protective film was peeled off from the transfer film obtained in the Examples and Comparative Examples, and a laminate consisting of a photosensitive composition layer and a temporary support was produced. A sample piece of 1 cm x 1 m was punched out from the obtained laminate, and the obtained sample piece was placed in a vial, and 1 mL of tetrahydrofuran was added to the vial and shaken for 1 hour to extract the residual solvent in the photosensitive composition layer. Using the obtained solution, GC-MS measurement was performed to measure the amount of residual solvent.

[Component B / Component A]
The component contained in each photosensitive composition layer and having a molecular weight of 10,000 or less was defined as component A, and the component contained in each photosensitive composition layer and having a molecular weight of 100,000 or more was defined as component B, and the mass ratio of component B to component A (mass of component B/mass of component A) was calculated.
The above ratio (component B/component A) was determined by preparing a solution in which each photosensitive composition layer was dissolved, performing GPC measurement under the following conditions, and calculating the above mass ratio from the obtained GPC chart as the ratio of the area of the region with a molecular weight of 1,000,000 or more to the area of the region with a molecular weight of 10,000 or less.
Specifically, the GPC measurement was performed under the following conditions, and the values were calculated in terms of polystyrene: First, about 20 mg of the photosensitive composition layer was dissolved in 4 mL of tetrahydrofuran (THF), and the solution was filtered through a 0.5 μm membrane filter to obtain a sample solution.
In addition, a calibration curve was prepared by preparing a THF solution of standard polystyrene (standard polystyrene manufactured by Tosoh Corporation, described below), filtering the solution through a 0.5 μm membrane filter, and injecting the solution into a separation column under the conditions described below to determine the relationship between elution time and molecular weight.
(Preparation of THF solution of standard polystyrene)
F-128 (Mw = 1,090,000, 0.05 g), F-40 (Mw = 427,000, 0.05 g), F-20 (Mw = 190,000, 0.05 g), F-4 (Mw = 37,900, 0.05 g), F-1 (Mw = 10,200, 0.05 g), A-2500 (Mw = 2,550, 0.05 g), and A-500 (Mw = 590, 0.05 g) were placed in a 50 mL measuring flask and diluted with THF to a predetermined concentration.
(GPC measurement conditions)
Apparatus: Tosoh high-speed GPC apparatus HLC-8220GPC (product name), manufactured by Tosoh Corporation
Guard column: Tosoh Corporation, HZ-L
Separation column: Three columns of TSK gel Super HZM-N (product name) manufactured by Tosoh Corporation connected in series Measurement temperature: 40°C
Eluent: THF
Flow rate: sample pump 0.35 mL/min, reference pump 0.20 mL/min Injection volume: 10 μL
Detector: Differential refractometer

[Number of foreign objects]
Using an optical microscope, five random areas (1 mm x 1 mm) of the transfer film were visually observed from the normal direction of the surface of the transfer film on the photosensitive composition layer side, and the number of foreign particles with a diameter of 1 μm or more in each area was counted. The number of foreign particles in the transfer film was calculated by arithmetic average.
Next, five random areas (1 mm x 1 mm) of the temporary support used in the transfer film were visually observed using an optical microscope from the direction of the surface of the temporary support, and the number of foreign particles with a diameter of 1 μm or more in each area was measured. The number of foreign particles in the temporary support was calculated by arithmetically averaging these.
Next, the number of foreign particles having a diameter of 1 μm or more in the photosensitive composition layer was calculated by subtracting the number of foreign particles in the temporary support from the number of foreign particles in the transfer film obtained above.
The calculated number of foreign matters having a diameter of 1 μm or more in the photosensitive composition layer was evaluated according to the following criteria.
(Evaluation Criteria for Photosensitive Composition Layer)
A: The number of foreign objects in the photosensitive composition layer is less than 5/ ^mm2 . B: The number of foreign objects in the photosensitive composition layer is 5/ ^mm2 or more and 10/ ^mm2 or less. C: The number of foreign objects in the photosensitive composition layer is more than 10/ ^mm2 (evaluation criteria for temporary support).
A: The number of foreign objects in the temporary support is less than 1/ ^mm2 . B: The number of foreign objects in the temporary support is 1/ ^mm2 or more and 10/mm2 or ^less . C: The number of foreign objects in the temporary support is more than 10/ ^mm2 .

[Evaluation of Conductive Wire Formation Defects]
A copper layer having a thickness of 200 nm was formed by vapor deposition on a PET substrate having a thickness of 0.1 mm to prepare a glass substrate with a copper layer.
After peeling off the protective film from the prepared transfer film, the film was laminated onto the above-mentioned glass substrate with the copper layer so that the copper layer and the photosensitive composition layer were in contact with each other under lamination conditions of a roll temperature of 100° C., a linear pressure of 1.0 MPa, and a linear speed of 4.0 m/min.
Next, using a photomask having a line/space pattern of 6 μm/6 μm, exposure was performed from the temporary support side at 90 mJ/cm ² , and then the temporary support was peeled off and removed.
Next, shower development was carried out with a 1% aqueous solution of sodium carbonate at a liquid temperature of 25° C., followed by rinsing with water to form a predetermined pattern on the copper.
For the PET substrate on which the pattern was placed, the copper layer located in the area on which the pattern was not placed was removed using an etching solution.
Next, the pattern was removed from the obtained laminate using a remover to obtain a laminate having conductive thin wires.
(Evaluation criteria)
A: Less than 10 chips/ ^mm2 in the pattern shape, and 0 breaks and short circuits/ ^mm2
B: 10 or more chips in the pattern shape/ ^mm2 , and 0 breaks and short circuits/ ^mm2
C: The number of chips in the pattern shape is 10 or more per ^mm2 , and the number of breaks and short circuits is less than 5 per ^mm2. D: The number of chips in the pattern shape is 10 or more per ^mm2 , and the number of breaks and short circuits is 5 or more per ^mm2.

In Tables 4 and 5, PET films of different thicknesses were used as temporary supports. As shown in the above tables, the number of foreign particles having a diameter of 1 μm or more in each PET film was less than 1 piece/ ^mm2 .

<Results>
As shown in Table 4, it was confirmed that the desired effects were obtained when the transfer film of the present invention was used.
From a comparison of Examples 1 to 3, it was confirmed that a more excellent effect was obtained when the thickness of the photosensitive composition layer was 20 μm or less.
From a comparison between Example 1 and Example 6, it was confirmed that a more excellent effect was obtained when the thickness of the temporary support was 30 μm or less.
From a comparison between Example 1 and Example 8, it was confirmed that the effect is better when the content of the polymerizable compound in the photosensitive composition layer is 10.00 to 50.00 mass % relative to the total mass of the photosensitive composition layer.
From a comparison between Example 1 and Example 9, it was confirmed that the effect was more excellent when the content of the polymerization initiator in the photosensitive composition layer was 0.10 to 10.00% by mass with respect to the total mass of the photosensitive composition layer.
From a comparison between Example 1 and Example 7, it was confirmed that the effect is better when the ratio of the mass of components contained in the photosensitive composition layer having a molecular weight of 100,000 or more to the mass of components contained in the photosensitive composition layer having a molecular weight of 10,000 or less is 0.10 or less.
From a comparison between Example 1 and Example 10, it was confirmed that the effect is better when the content of the polymerization inhibitor in the photosensitive composition layer is 0.10 to 5.00 mass % relative to the total mass of the photosensitive composition layer.
From a comparison between Example 1 and Example 11, it was confirmed that when the photosensitive composition layer contains a residual solvent and the content of the residual solvent is 2 to 15 mg/ ^m2 , the effect is more excellent.

<Example 20>
The photosensitive composition 10 was applied onto a 16 μm-thick PET film (16QS71, manufactured by Toray Industries, Inc.) using a slit nozzle, and the film was passed through a drying zone at 80° C. for 40 seconds to form a 15 μm-thick photosensitive composition layer 20.
Next, a PP film (Torayfan, manufactured by Toray Industries, Inc.) having a thickness of 12 μm was laminated as a protective film on the photosensitive composition layer to obtain a transfer film of Example 20.
The transfer film thus obtained was used as a resist pattern forming material in paragraph 0050 of JP-A-2019-121740 to carry out the printed wiring board manufacturing method disclosed in the above-mentioned patent publication. A substrate having good wiring without erosion was obtained.
It has been confirmed that the transfer film according to the present disclosure is also suitable for obtaining a resist pattern for a semi-additive process.

Claims (13)

A temporary support and a photosensitive composition layer disposed on the temporary support,
A transfer film, wherein the number of foreign matters having a diameter of 1 μm or more in the photosensitive composition layer is 10 pieces/mm2 or ^less . The transfer film according to claim 1, wherein the thickness of the photosensitive composition layer is 20 μm or less. The transfer film according to claim 1 or 2, wherein the number of foreign particles having a diameter of 1 μm or more in the temporary support is 10 pieces/mm ² or less. The transfer film according to any one of claims 1 to 3, wherein the thickness of the temporary support is 30 μm or less. the photosensitive composition layer contains a polymerizable compound,
The transfer film according to any one of claims 1 to 4, wherein the content of the polymerizable compound is 10.00 to 50.00% by mass with respect to the total mass of the photosensitive composition layer. the photosensitive composition layer contains a polymerization initiator,
The transfer film according to any one of claims 1 to 5, wherein the content of the polymerization initiator is 0.10 to 10.00% by mass with respect to the total mass of the photosensitive composition layer. The transfer film according to any one of claims 1 to 6, wherein the ratio of the mass of components contained in the photosensitive composition layer having a molecular weight of 100,000 or more to the mass of components contained in the photosensitive composition layer having a molecular weight of 10,000 or less is 0.10 or less. the photosensitive composition layer contains a polymerization inhibitor,
The transfer film according to any one of claims 1 to 7, wherein the content of the polymerization inhibitor is 0.10 to 5.00% by mass with respect to the total mass of the photosensitive composition layer. the photosensitive composition layer contains a residual solvent,
The transfer film according to any one of claims 1 to 8, wherein the content of the residual solvent is 2 to 15 mg/ ^m2 . A lamination process of contacting and laminating the photosensitive composition layer on the temporary support of the transfer film according to any one of claims 1 to 9 to a substrate having a conductive layer, thereby obtaining a substrate with a photosensitive composition layer having the substrate, the conductive layer, the photosensitive composition layer, and the temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
an etching step of etching the conductive layer in areas where the pattern is not arranged to obtain conductive thin lines;
A removing step of removing the pattern,
The method for producing a laminate further comprises a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer between the laminating step and the exposure step, or between the exposure step and the development step. The method for manufacturing a laminate according to claim 10, wherein the conductive thin wire has a line width of 8 μm or less. A touch sensor comprising a laminate manufactured by the manufacturing method according to claim 10 or 11. a seed layer forming step of forming a seed layer on the substrate;
A lamination step of contacting and laminating the photosensitive composition layer on the temporary support of the transfer film according to any one of claims 1 to 9 to a substrate having a seed layer to obtain a substrate with a photosensitive composition layer having the substrate, the seed layer, the photosensitive composition layer, and the temporary support in this order;
an exposure step of pattern-exposing the photosensitive composition layer;
a developing step of developing the exposed photosensitive composition layer to form a pattern;
a metal plating layer forming step of forming a metal plating layer by plating on the seed layer in an area where the pattern is not arranged;
a protective layer forming step of forming a protective layer on the metal plating layer;
a pattern removing step of removing the pattern;
a seed layer removing step of removing the exposed seed layer to obtain a conductive thin line,
The method for producing a printed wiring board further comprises a peeling step of peeling the temporary support from the substrate with the photosensitive composition layer between the laminating step and the exposure step, or between the exposure step and the development step.