JP2024058762A - Inertial measurement device and method of manufacturing the same - Google Patents

Abstract

To provide an inertial measurement device capable of suppressing deterioration of inertial sensor device characteristics, and a method of manufacturing the same.SOLUTION: An inertial measurement device is provided, comprising: an inertial sensor module 100 including a first substrate having inertial sensor devices 10 mounted thereon, a housing for accommodating the first substrate together with the inertial sensor devices 10, and a filling member filling the space between the inertial sensor devices 10 and the housing; and a second substrate 22 having mounted thereon a processing circuit 20 for processing signals from the inertial sensor devices 10.SELECTED DRAWING: Figure 2

Description

The present invention relates to an inertial measurement unit and a method for manufacturing an inertial measurement unit.

Patent document 1 discloses the configuration of a sensor unit in which an inertial sensor and a control IC such as a processing circuit are arranged on a single substrate.

JP 2017-20829 A

However, the technology described in Patent Document 1 has the problem that because the inertial sensor and control IC are placed on the same board, noise generated by the control IC may be transmitted to the inertial sensor and affect the characteristics of the inertial sensor.

The inertial measurement device includes an inertial sensor module having a first substrate on which an inertial sensor device is mounted, a housing that houses the inertial sensor device together with the first substrate, and a filler material filled between the inertial sensor device and the housing, and a second substrate on which a processing circuit that processes signals from the inertial sensor device is mounted.

A method for manufacturing an inertial measurement device includes the steps of: placing an inertial sensor device on a first substrate in a space between the first substrate and a housing, and filling the space with a filling material; preparing a second substrate having a processing circuit mounted thereon for processing signals from the inertial sensor device; and electrically connecting the first substrate and the second substrate.

FIG. 1 is a perspective view showing a configuration of an inertial measurement unit. FIG. 2 is an exploded perspective view showing the configuration of an inertial measurement unit. FIG. 2 is a perspective view showing a configuration of an inertial sensor module. FIG. 2 is a plan view showing a configuration of a portion of the inertial sensor module. FIG. 2 is a perspective view showing the configuration of the back side of the inertial sensor module. FIG. 4 is a plan view showing the configuration of a second substrate on which a processing circuit is mounted. FIG. 4 is a perspective view showing the configuration of the front surface of a second substrate. 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; 1 is a perspective view showing a manufacturing method of an inertial measurement unit; FIG. 13 is a perspective view showing the configuration of a modified inertial measurement unit. FIG. 13 is a perspective view showing a configuration of a processing substrate according to a modified example. FIG. 11 is a plan view showing a configuration of an inertial sensor device according to a modified example. FIG. 13 is a side view showing the configuration of an inertial sensor device according to a modified example. FIG. 13 is a side view showing the configuration of an inertial sensor device according to a modified example. FIG. 13 is a perspective view showing a configuration of an inertial sensor device according to a modified example.

In the following figures, three mutually orthogonal axes will be described as the X-axis, Y-axis, and Z-axis. The direction along the X-axis will be referred to as the "X-direction", the direction along the Y-axis as the "Y-direction", and the direction along the Z-axis as the "Z-direction", with the arrow direction being the + direction and the direction opposite the + direction being the - direction. Note that the +Z direction is sometimes referred to as "upper" or "upper side" or "front side", and the -Z direction as "lower" or "lower side" or "back side", and the view from the +Z direction and -Z direction is also referred to as a planar view or planar. Additionally, the surface on the +Z side will be described as the "upper surface" or "front side", and the opposite surface on the -Z side will be described as the "lower surface" or "back side".

First, the configuration of the inertial measurement unit 1000 will be described with reference to Figures 1 and 2.

As shown in FIG. 1, the inertial measurement unit 1000 is an inertial measurement unit that detects the attitude and behavior of a moving body such as an automobile, agricultural machinery, construction machinery, a robot, or a drone. The inertial measurement unit 1000 includes an inertial sensor module 100 having an inertial sensor device 10, a second board 22 on which a processing circuit 20 that processes signals from the inertial sensor device 10 is mounted, and a base 300 that houses the processing circuit 20. The processing circuit 20 and the second board 22 are collectively referred to as the processing board 200. The processing board 200 may include an external connector 21, which will be described later.

As shown in FIG. 2, the second substrate 22 of the inertial measurement unit 1000 has a processing circuit 20 and an external connector 21 arranged on the back surface 200b as a connector for electrically connecting to an external device.

The base 300 is provided with a recess 31 for housing the processing circuit 20 and a through hole 32 for housing the external connector 21. In this way, by providing the base 300, it is possible to protect the processing circuit 20 from the outside, and damage to the processing circuit 20 can be suppressed. Furthermore, the base 300 can suppress damage to the external connector 21, and is configured to be connectable to an external device via the through hole 32.

Next, the configuration of the inertial sensor module 100 will be described with reference to Figs. 3 to 5. Fig. 4 is a plan view showing the inertial sensor module 100 shown in Fig. 3 with the housing 12 removed. Fig. 5 is a perspective view of the first substrate 11 shown in Fig. 4 as seen from the rear surface 11b side.

As shown in Figures 3 and 4, the inertial sensor module 100 has a first substrate 11 on which the inertial sensor device 10 is mounted, a housing 12 that houses the inertial sensor device 10 together with the first substrate 11, and a filling member 400 (see Figure 9) filled between the inertial sensor device 10 and the housing 12.

As shown in FIG. 4, the inertial sensor device 10 has a first sensor device 10a, a second sensor device 10b, and a third sensor device 10c. The inertial sensor device 10 is, for example, a gyro sensor that detects angular velocity.

For example, the first sensor device 10a is an X-axis gyro sensor device that detects angular velocity around the X-axis, the second sensor device 10b is a Y-axis gyro sensor device that detects angular velocity around the Y-axis, and the third sensor device 10c is a Z-axis gyro sensor device that detects angular velocity around the Z-axis. In this case, the first sensor device 10a is arranged perpendicular to the X-axis, the second sensor device 10b is arranged perpendicular to the Y-axis, and the third sensor device 10c is arranged perpendicular to the Z-axis.

Here, as in FIG. 22 described later, the vibration gyro sensor element provided in the first sensor device 10a may be arranged so as to be perpendicular to the extension direction of the X-axis which is the detection axis, the vibration gyro sensor element provided in the second sensor device 10b may be arranged so as to be perpendicular to the extension direction of the Y-axis which is the detection axis, or the vibration gyro sensor element provided in the third sensor device 10c may be arranged so as to be perpendicular to the extension direction of the Z-axis which is the detection axis. The first sensor device 10a may be an X-axis acceleration sensor device which detects acceleration in the X-axis direction, the second sensor device 10b may be a Y-axis acceleration sensor device which detects acceleration in the Y-axis direction, and the third sensor device 10c may be a Z-axis acceleration sensor device which detects acceleration in the Z-axis direction. The first sensor device 10a, the second sensor device 10b, and the third sensor device 10c may be sensor devices which correspond to different detection axes.

The first sensor device 10a, the second sensor device 10b, and the third sensor device 10c may each be any one of an X-axis gyro sensor device that detects angular velocity around the X-axis, a Y-axis gyro sensor device that detects angular velocity around the Y-axis, a Z-axis gyro sensor device that detects angular velocity around the Z-axis, an X-axis acceleration sensor device that detects acceleration in the X-axis direction, a Y-axis acceleration sensor device that detects acceleration in the Y-axis direction, and a Z-axis acceleration sensor device that detects acceleration in the Z-axis direction.

For example, the first sensor device 10a may be an X-axis acceleration sensor device that detects acceleration in the X-axis direction, the second sensor device 10b may be a Y-axis acceleration sensor device that detects acceleration in the Y-axis direction, and the third sensor device 10c may be a Z-axis gyro sensor device that detects angular velocity around the Z-axis. Furthermore, the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c may have multiple detection axes.

For example, at least one of the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c may be a gyro sensor device that detects angular velocity around the X-axis and angular velocity around the Y-axis, or may be a gyro sensor device that detects angular velocity around the X-axis, angular velocity around the Y-axis, and angular velocity around the Z-axis.

Furthermore, for example, at least one of the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c may be an acceleration sensor device that detects acceleration in the X-axis direction and the Y-axis direction, or may be an acceleration sensor device that detects acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The first sensor device 10a and the second sensor device 10b are, for example, arranged perpendicular to the first substrate 11 (see FIG. 8) and are covered with a filling member 400. In this way, since the inertial sensor device 10 is covered with the filling member 400, it is possible to suppress changes in the sensor characteristics of the inertial sensor device 10.

The filling member 400 is, for example, a thermosetting epoxy resin material that has a heat resistance of about 260°C. Note that the filling member 400 is not limited to an epoxy resin material, and a urethane resin may also be used. It is preferable that the hardness of the filling member 400 after curing is 80D or more as a type D durometer in the durometer hardness test of JIS 7215-1986.

Note that the inertial sensor device 10 is not limited to a gyro sensor device or an acceleration sensor device, and may be, for example, a sensor device that detects speed, pressure, displacement, attitude, gravity, etc.

The housing 12 is made of, for example, aluminum (Al). This makes the container sufficiently hard. In addition, it is not limited to aluminum, and other metals or ceramics may be used. By providing the housing 12, the inertial sensor device 10 can be protected from, for example, dust, dirt, moisture, ultraviolet rays, impacts, and the like.
Furthermore, when the linear expansion coefficient of the first substrate 11 is a, the linear expansion coefficient of the filling member 400 is b, and the linear expansion coefficient of the housing 12 is c, it is preferable that the linear expansion coefficients of the three satisfy the relationship expressed by formula (1).

a ≒ b >> c ……… Equation (1).

In this way, since materials with a small thermal expansion coefficient are used for the housing 12 and the filling member 400, the thermal expansion and contraction of the first substrate 11 is also small, and the characteristics of the inertial measurement unit 1000 can be improved.
For example, in the materials in the above preferred example, the first substrate 11 is a glass epoxy substrate with a linear expansion coefficient a of 40 ppm/°C, the filling member 400 is an epoxy adhesive with a linear expansion coefficient a of 41 ppm/°C, and the housing 12 is made of aluminum with a linear expansion coefficient a of 23 ppm/°C, and it can be seen that these satisfy the relationship expressed by formula (1).

As shown in FIG. 5, a plurality of first connection terminals 13 for transmitting and receiving data between the inertial sensor device 10 and the processing substrate 200 are arranged on the back surface 11b of the first substrate 11, in other words, on the surface of the first substrate 11 opposite to the front surface 11a on which the inertial sensor device 10 is mounted. The inertial sensor device 10 is connected to the first connection terminals 13 by wiring (not shown) provided on the first substrate 11.

Next, the configuration of the processing substrate 200 will be described with reference to Figures 6 and 7. Figure 6 is a plan view of the processing substrate 200 shown in Figure 2, as viewed from the rear surface 200b side. Figure 7 is a perspective view of the processing substrate 200 shown in Figure 2, as viewed from the front surface 200a side.

As shown in FIG. 6, a processing circuit 20 for processing signals from the inertial sensor device 10 and an external connector 21 for transmitting and receiving data to and from external devices are arranged on the rear surface 200b side of the second substrate 22.

The processing circuit 20 receives the detection signal output from the inertial sensor device 10 and outputs measurement data based on the detection signal from the external connector 21 to another device. The processing circuit 20 controls the driving of the inertial sensor device 10 and each part of the inertial measurement device 1000. The processing circuit 20 is, for example, an MCU (Micro Controller Unit) and has a built-in storage unit including a non-volatile memory. Furthermore, the processing circuit 20 may perform calculations to calculate the attitude, speed, angle, etc. of the inertial sensor module 100 based on the detection signal from the inertial sensor device 10.

7, a plurality of second connection terminals 23 for transmitting and receiving data between the inertial sensor module 100 and the processing circuit 20 are arranged on the surface 200a side of the second substrate 22. Therefore, the second connection terminals 23 are provided on the surface 200a side, which is one surface of the second substrate 22, and the external connector 21 is provided on the back surface 200b side, which is the other surface of the second substrate 22. That is, the second connection terminals 23 and the external connector 21 are provided on different surfaces of the second substrate 22. The processing circuit 20 is connected to the second connection terminals 23 by wiring (not shown) provided on the second substrate 22. In addition, a slit 24 penetrating from the surface 200a to the back surface 200b is provided on the end side of the second substrate 22. The slit 24 is used as a guide groove when fixing the inertial sensor module 100 to the second substrate 22.

As described above, since the second substrate 22 on which the processing circuit 20 is mounted is configured separately from the first substrate 11 on which the inertial sensor device 10 is mounted, even if noise is generated from the processing circuit 20, the noise can be prevented from being transmitted to the first substrate 11 and the inertial sensor device 10 mounted thereon. In addition, since the inertial sensor device 10 is filled with the filling material 400 between the first substrate 11 and the housing 12, the sensor characteristics can be prevented from changing. Therefore, the characteristics of the inertial sensor device 10 can be prevented from deteriorating. In addition, when a driving vibration is generated from the inertial sensor device 10, since the inertial sensor device 10 is filled with the filling material 400 between the first substrate 11 and the housing 12, the driving vibration from the inertial sensor device 10 can be prevented from being transmitted to the second substrate 22, the processing circuit 20 mounted thereon, and even to the outside of the inertial measurement device 1000.

Next, a method for manufacturing the inertial measurement unit 1000 will be described with reference to Figures 8 to 16.

First, in the process shown in FIG. 8, a first substrate 11 on which sensor devices 10a, 10b, and 10c are mounted is prepared.

Next, in the process shown in FIG. 9, a filling member 400 is supplied into the housing 12. The housing 12 is also provided with a claw 12a for fitting into the slit 24 of the second substrate 22.

Here, if the length of the tab 12a is L, the thickness of the first substrate 11 is t1 (see FIG. 8), and the thickness of the second substrate 22 is t2 (see FIG. 13), it is desirable to determine the length L so that the formula 1.3×t1<L<t1+t2 holds. By setting the length L in this way, the tab 12a of the housing can be fitted into the second substrate 22 and can be contained within the thickness t2 of the second substrate 22.

The filling member 400 is, for example, a thermosetting epoxy resin material having a heat resistance of about 260°C. The filling member 400 is not limited to an epoxy resin material, and a urethane resin may be used. By filling the space between the first substrate 11 and the housing 12 with the filling member 400, the inertial sensor device 10 has a structure that is almost not affected by external stress, and the sensor characteristics are hardly changed.

Next, in the process shown in FIG. 10, the first substrate 11 on which the sensor devices 10a, 10b, and 10c are mounted is aligned with the housing 12 containing the filling member 400.

In addition, the first substrate 11 has recesses 15a in two locations on opposing sides into which the tabs 12a of the housing 12 fit. In addition, the first substrate 11 has recesses 15b in two locations on opposing sides in a different direction from the recesses 15a to provide a gap between the housing 12 and the first substrate 11.

Here, if the recess amount of the recess 15b of the first substrate 11 is W1 and the thickness of the housing 12 is R, it is desirable to determine the recess amount W1 so that the formula W1 ≧ 2R holds. By setting the recess amount W1 in this way, a gap W2 can be provided between the first substrate 11 and the housing 12. Therefore, gas generated when the filling member 400 is thermally cured can be discharged from inside the housing 12 to the outside.

The first substrate 11 is inserted into the housing 12 filled with the filling material 400, with the recesses 15a of the first substrate 11 fitted into the tabs 12a of the housing 12. The filling material 400 is then thermally cured in a constant temperature bath. At this time, by providing a gap W2 between the first substrate 11 and the housing 12, the generated gas can be efficiently exhausted.

As a result of the above, as shown in FIG. 11, the inertial sensor module 100 is completed in which the space between the first substrate 11 and the housing 12 is filled with the filling material 400. Note that since materials with a small thermal expansion coefficient are used for the housing 12 and the filling material 400, the thermal expansion and contraction of the first substrate 11 is also small, and vibration leakage of the inertial sensor device 10 can be suppressed. Furthermore, when an acceleration sensor device is used for the inertial sensor device 10, the hysteresis characteristics can be reduced.

Next, as shown in FIG. 12, the characteristics of the multiple inertial sensor devices 10 are inspected collectively. Specifically, the first connection terminal 13 provided on the first substrate 11 is brought into contact with a socket (not shown) provided on the inspection substrate 500, and, for example, the temperature characteristics and noise characteristics of the inertial sensor devices 10 are inspected.

In this way, the characteristics of the inertial sensor device 10 are inspected, so that defects in the inertial sensor device 10 can be removed before the inertial measurement unit 1000 is completed.

Next, as shown in FIG. 13, a second substrate 22, i.e., a processing substrate 200, on which a processing circuit 20 and an external connector 21 are mounted is prepared.

Next, as shown in FIG. 14, the first substrate 11 and the second substrate 22 are electrically connected. Specifically, the inertial sensor module 100 and the processing substrate 200 are aligned while fitting the claws 12a into the slits 24. Then, the first connection terminal 13 provided on the first substrate 11 and the second connection terminal 23 provided on the second substrate 22 are electrically connected by, for example, solder mounting.

Next, as shown in FIG. 15, the processing board 200 on which the inertial sensor module 100 is mounted is bonded to the base 300 using an adhesive. This completes the inertial measurement unit 1000 as shown in FIG. 16.

As described above, the inertial measurement device 1000 of this embodiment includes an inertial sensor module 100 having a first substrate 11 on which an inertial sensor device 10 is mounted, a housing 12 that houses the inertial sensor device 10 together with the first substrate 11, and a filling member 400 filled between the inertial sensor device 10 and the housing 12, and a second substrate 22 on which a processing circuit 20 that processes signals from the inertial sensor device 10 is mounted.

According to this configuration, the inertial sensor device 10 is mounted on the first substrate 11, the processing circuit 20 is mounted on the second substrate 22, and further, a filler material 400 is filled between the first substrate 11 having the inertial sensor device 10 and the housing 12. Therefore, even if noise is generated from the processing circuit 20, the noise can be prevented from being transmitted to the inertial sensor device 10. Therefore, the characteristics of the inertial sensor device 10 can be prevented from deteriorating.

Furthermore, in the inertial measurement device 1000 of this embodiment, it is preferable that the inertial sensor device 10 has a first sensor device 10a, a second sensor device 10b, and a third sensor device 10c.

According to this configuration, the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c are covered with the filling member 400, so that the sensor characteristics of the inertial sensor device 10 can be prevented from changing. In addition, since the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c are covered with the filling member 400, the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c can be fixed in a predetermined positional relationship. The first sensor device 10a may be an X-axis gyro sensor device that detects an angular velocity around the X-axis, the second sensor device 10b may be a Y-axis gyro sensor device that detects an angular velocity around the Y-axis, and the third sensor device 10c may be a Z-axis gyro sensor device that detects an angular velocity around the Z-axis.

Note that the inertial sensor device 10 may have two sensor devices by omitting one of the first sensor device 10a, the second sensor device 10b, and the third sensor device 10c, or may have four or more sensor devices by adding one or more sensor devices. In this case, for example, the first sensor device 10a and the second sensor device 10b are covered with the filling member 400, so that the sensor characteristics of the inertial sensor device 10 can be suppressed from changing. For example, the first sensor device 10a may be a Z-axis gyro sensor device that detects angular velocity around the Z axis, and the second sensor device 10b may be an acceleration sensor device that detects acceleration in the X-axis direction, acceleration in the Y-axis direction, and acceleration in the Z-axis direction, or the first sensor device 10a may be a Z-axis gyro sensor device that detects angular velocity around the Z axis, angular velocity around the Y-axis, and angular velocity around the Z axis, and may be an acceleration sensor device that detects acceleration in the X-axis direction, acceleration in the Y-axis direction, and acceleration in the Z-axis direction.

Furthermore, in the inertial measurement device 1000 of this embodiment, the first sensor device 10a and the second sensor device 10b are preferably arranged vertically to the first substrate 11 and covered with the filling member 400. With this configuration, since the first sensor device 10a and the second sensor device 10b are arranged vertically to the first substrate 11 and covered with the filling member 400, it is possible to suppress changes in the sensor characteristics of the inertial sensor device 10. Even if the first sensor device 10a and the second sensor device 10b have a shape that is longer in the vertical direction than in the horizontal direction to the first substrate 11, they can be firmly fixed by the filling member 400.

In the inertial measurement device 1000 of this embodiment, the inertial sensor device 10 preferably has an acceleration sensor device. With this configuration, since it has an acceleration sensor device, it can detect acceleration. As a result, the inertial sensor unit 1 can calculate and output not only acceleration, but also the magnitude of gravity, movement, vibration, impact, etc.

Furthermore, in the inertial measurement device 1000 of this embodiment, it is preferable that the first substrate 11 has a first connection terminal 13 on the surface opposite to the surface on which the inertial sensor device 10 is mounted, and the second substrate 22 has a second connection terminal 23 connected to the first connection terminal 13. According to this configuration, the first substrate 11 and the second substrate 22 are connected via the first connection terminal 13 and the second connection terminal 23, so that the signal from the inertial sensor device 10 can be processed by the processing circuit 20.

In the inertial measurement device 1000 of this embodiment, the second board 22 preferably includes an external connector 21 that is connected to an external device. With this configuration, since the second board 22 includes the external connector 21, data can be sent and received from the external device. Furthermore, by providing the second board 22 that is different from the first board 11 on which the inertial sensor device 10 is mounted, it is possible to suppress the influence of vibrations applied to the external connector 21 on the inertial sensor module 100.

The inertial measurement unit 1000 of this embodiment preferably includes a base 300 having a recess 31 for housing the processing circuit 20. With this configuration, the inertial measurement unit 1000 includes a base 300, which makes it possible to protect the processing circuit 20 from the outside, and thus makes it possible to prevent damage to the processing circuit 20.

The manufacturing method of the inertial measurement device 1000 of this embodiment includes the steps of placing the inertial sensor device 10 on the first substrate 11 in the space between the first substrate 11 and the housing 12 and filling the space with a filling material 400, preparing a second substrate 22 on which a processing circuit 20 for processing signals from the inertial sensor device 10 is mounted, and electrically connecting the first substrate 11 and the second substrate 22.

According to this method, the inertial sensor device 10 is arranged on the first substrate 11, the processing circuit 20 is arranged on the second substrate 22, and the space between the first substrate 11 and the housing 12 is filled with the filling material 400. Therefore, even if noise is generated from the processing circuit 20, the noise can be prevented from being transmitted to the inertial sensor device 10. This makes it possible to prevent the characteristics of the inertial sensor device 10 from deteriorating.

The manufacturing method of the inertial measurement unit 1000 of this embodiment preferably includes a step of inspecting the characteristics of the inertial sensor device 10 using the first connection terminal 13 provided on the first substrate 11 before the step of electrically connecting the first substrate 11 and the second substrate 22. According to this method, since the characteristics of the inertial sensor device 10 are inspected, defects in the inertial sensor device 10 or the inertial sensor module 100 can be removed before the inertial measurement unit 1000 is completed.

Below, we will explain some variations of the above embodiment.

The configuration of the inertial measurement unit 1000 is not limited to the above-described embodiment, and may be, for example, the configuration shown in Figs. 17 and 18. Fig. 17 is a perspective view showing the configuration of a modified inertial measurement unit 1000A. Fig. 18 is a perspective view showing the configuration of the processing board 200A of the inertial measurement unit 1000A shown in Fig. 17.

As shown in FIG. 17, the modified inertial measurement device 1000A includes two inertial sensor modules 100A and 100B. In other words, it functions as a so-called multi-IMU (Inertial Measurement Unit) that uses multiple inertial sensor devices 10. The configuration of each of the inertial sensor modules 100A and 100B is similar to that of the inertial sensor module 100 described above. The processing board 200A has a similar configuration to that of the processing board 200, although the planar size of the second board 22 is larger and the number of terminals is increased.

With this modified inertial measurement device 1000A, it is possible to average the sensor characteristics based on the measurement values obtained from the two inertial sensor modules 100A, 100B, and reduce sensor noise. Note that the number of inertial sensor modules 100A, 100B is not limited to two, and three or more may be arranged.

The processing circuit 20 processes signals from the inertial sensor modules 100A and 100B. The processing circuit 20 has a calculation unit that performs calculations using each measurement value of the inertial sensor modules 100A and 100B. The processing circuit 20 also controls the drive of each part of the inertial measurement device 1000A, in particular the two inertial sensor modules 100A and 100B. The calculation unit of the processing circuit 20 calculates the average value of the inertial data as each measurement value obtained from the inertial sensor modules 100A and 100B. The calculated inertial data may be angular velocity or acceleration.

Note that signals output by the inertial sensor modules 100A and 100B generally have misalignments with respect to multiple detection axes due to misalignments during assembly, etc. For this reason, the inertial measurement unit 1000A may perform misalignment correction by applying a correction coefficient, such as a predetermined rotation matrix, to the signals of the inertial sensor modules 100A and 100B. At this time, the signals for the detection axes of the inertial sensor modules 100A and 100B may be converted to become signals of three mutually orthogonal axes. Here, the three mutually orthogonal axes may be set with respect to the external shape of the inertial measurement unit 1000A.

As described above, it is preferable that the modified inertial measurement unit 1000A includes two or more inertial sensor modules 100A, 100B. With this configuration, since it includes two or more inertial sensor modules 100A, 100B, it can function as a so-called multi-IMU that outputs one characteristic using multiple inertial sensor devices.

As described above, the first sensor device 10a and the second sensor device 10b are disposed vertically by themselves on the first substrate 11. The method of disposing them vertically may be as shown in FIGS.
The sensor devices 1010a and 1010b of an inertial measurement unit 1000B (inertial sensor module 100C) of a modified example shown in FIGS. 19 to 21 are mounted on relay substrates 1500a and 1500b and are disposed on a first substrate 11.

Specifically, as shown in FIG. 20, the first relay board 1500a is a rectangular board that is slightly larger than the first sensor device 1010a, and is disposed perpendicular to the first board 11. A rigid board such as a glass epoxy board is used as the first relay board 1500a. The first sensor device 1010a is mounted on the surface of the first relay board 1500a.

Multiple pin headers 1041 are mounted on the back surface of the first relay board 1500b (see FIG. 21). The pin headers 1041 are metal bar-shaped parts for connecting two boards, and the ends of the pins are inserted into via holes in the first board 11 and soldered. The first relay board 1500b is mounted in an upright position on the first board 11 by the multiple pin headers 1041.

The multiple pin headers 1041 also serve as electrical wiring between the first relay board 1500a and the first board 11. In more detail, the drive voltage and detection signals of the first sensor device 1010a are transmitted to and received from the first board 11 via the multiple pin headers 1041. In other words, the first sensor device 1010a is electrically connected to the first board 11 via the first relay board 1500a.

Thus, in the inertial measurement unit 1000B of the modified example, the first sensor device 1010a is arranged vertically on the first substrate 11 via the first relay substrate 1500a, the second sensor device 1010b is arranged vertically on the first substrate 11 via the second relay substrate 1500b, and the third sensor device 10c is preferably mounted parallel to the first substrate 11. According to this configuration, the first and second sensor devices 1010a and 1010b are arranged vertically on the first substrate 11 via the relay substrates 1500a and 1500b. For example, the first sensor device 1010a is an X-axis gyro sensor that detects angular velocity around the X-axis, the second sensor device 1010b is a Y-axis gyro sensor device that detects angular velocity around the Y-axis, and the third sensor device 1010c is a Z-axis gyro sensor device that detects angular velocity around the Z-axis. In this case, the first sensor device 1010a and the first relay board 1500a are arranged perpendicular to the X-axis, the second sensor device 1010b and the second relay board 1500b are arranged perpendicular to the Y-axis, and the third sensor device 1010c is arranged perpendicular to the Z-axis. Here, as in FIG. 22 described later, the vibration gyro sensor element provided in the first sensor device 1010a may be arranged so as to be perpendicular to the extension direction of the X-axis which is the detection axis, the vibration gyro sensor element provided in the second sensor device 1010b may be arranged so as to be perpendicular to the extension direction of the Y-axis which is the detection axis, or the vibration gyro sensor element provided in the third sensor device 1010c may be arranged so as to be perpendicular to the extension direction of the Z-axis which is the detection axis.

As described above, the arrangement of the sensor devices 10a, 10b, 1010a, and 1010b on the first substrate 11 is not limited, and may be as shown in FIG. 22. FIG. 22 is a perspective view showing the configuration of a modified first sensor device 1037a. As shown in FIG. 22, the modified first sensor device 1037a is a first sensor device 1037a equipped with a vertical package.

As shown in FIG. 22, the first sensor device 1037a of the modified example has, for example, a vibration gyro sensor element 1050 arranged vertically. The vertical direction means that the vibration gyro sensor element 1050 is arranged perpendicular to the extension direction of the X-axis, which is the detection axis. A plurality of mounting terminals 1044 are provided on the mounting surface 1043 of the first sensor device 1037a. The second sensor device 1037b (not shown) may also have the same configuration as the first sensor device 1037a.

10... inertial sensor device, 10a... first sensor device, 10b... second sensor device, 10c... third sensor device, 11... first substrate, 11a... front surface, 11b... rear surface, 12... housing, 12a... claw, 13... first connection terminal, 15a, 15b... recess, 20... processing circuit, 21... external connector, 22... second substrate, 23... second connection terminal, 24... slit, 31... recess, 32... through hole, 100, 100A... inertial sensor module, 200... processing substrate, 200a... front surface surface, 200b...rear surface, 200A...processing substrate, 300...base, 400...filling member, 500...inspection substrate, 1000, 1000A...inertial measurement device, 1010a...first sensor device, 1010b...second sensor device, 1037a...first sensor device, 1037b...second sensor device, 1041...pin header, 1043...mounting surface, 1044...mounting terminal, 1050...vibration gyro sensor element, 1500a...first relay board, 1500b...second relay board.

Claims (12)

an inertial sensor module including a first substrate on which an inertial sensor device is mounted, a housing that houses the inertial sensor device together with the first substrate, and a filler material filled between the inertial sensor device and the housing;
a second substrate on which a processing circuit for processing a signal from the inertial sensor device is mounted;
An inertial measurement unit comprising: 2. The inertial measurement device of claim 1,
The inertial measurement unit includes an inertial sensor device and a second sensor device. 2. The inertial measurement device of claim 1,
The inertial measurement unit includes an inertial sensor device having a first sensor device, a second sensor device, and a third sensor device. 4. The inertial measurement device according to claim 3,
The first sensor device and the second sensor device are disposed perpendicular to the first substrate and covered by the filler member. 5. The inertial measurement device according to claim 4,
the first sensor device is disposed vertically on the first substrate via a first relay substrate;
the second sensor device is disposed vertically on the first substrate via a second relay substrate;
The third sensor device is mounted parallel to the first substrate. 2. The inertial measurement device of claim 1,
The inertial measurement unit, wherein the inertial sensor device comprises an acceleration sensor device. 2. The inertial measurement device of claim 1,
the first substrate has a first connection terminal on a surface opposite to a surface on which the inertial sensor device is mounted;
The second substrate has a second connection terminal connected to the first connection terminal. 2. The inertial measurement device of claim 1,
The second board is provided with a connector for connecting to an external device. 2. The inertial measurement device of claim 1,
An inertial measurement unit comprising a base having a recess for housing the processing circuitry. 2. The inertial measurement unit of claim 1,
An inertial measurement unit comprising two or more of the inertial sensor modules. a step of disposing an inertial sensor device on a first substrate in a space between the first substrate and a housing, and filling the space with a filling member;
preparing a second substrate having a processing circuit mounted thereon for processing a signal from the inertial sensor device;
electrically connecting the first substrate and the second substrate;
A method for manufacturing an inertial measurement device comprising the steps of: A method for manufacturing an inertial measurement system according to claim 11, comprising the steps of:
A method for manufacturing an inertial measurement device, comprising a step of inspecting characteristics of the inertial sensor device using a first connection terminal provided on the first substrate before a step of electrically connecting the first substrate and the second substrate.

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