JP2024050128A - Light emitting device manufacturing method and light emitting device - Google Patents

Abstract

[Problem] To provide a manufacturing method for a light emitting device that can improve yield. [Solution] A manufacturing method for a light emitting device according to an embodiment of the present disclosure includes the steps of preparing an intermediate body having a light emitting element, an upper surface having an element arrangement region in which the light emitting element is arranged and an optical member support region surrounding the element arrangement region, a lower surface opposite to the upper surface, and a side surface between the upper surface and the lower surface, the optical member support region and/or the side surface being provided with a resin stopper, placing an uncured adhesive member in the optical member support region between the element arrangement region and the resin stopper, and pressing the uncured adhesive member with the optical member in the optical member support region to move the uncured adhesive member toward the resin stopper portion and cure it, thereby adhering the optical member to the substrate via the adhesive member. [Selected Figure] Figure 2A

Description

This disclosure relates to a method for manufacturing a light-emitting device and a light-emitting device.

Light-emitting devices are known in which a lens is bonded to a substrate on which light-emitting elements are arranged (see, for example, Patent Document 1). There is a demand for further improvement in the yield of such light-emitting devices.

JP 2017-516314 A

The light emitting device manufacturing method and the light emitting device according to the embodiment of the present disclosure aim to provide a light emitting device manufacturing method and a light emitting device that can improve yield.

A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes the steps of preparing an intermediate body having a light-emitting element, an upper surface having an element arrangement region in which the light-emitting element is arranged and an optical member support region surrounding the element arrangement region, a lower surface opposite the upper surface, and a side surface between the upper surface and the lower surface, and a substrate having a resin stopper provided on the optical member support region and/or the side surface; placing an uncured adhesive member between the element arrangement region and the resin stopper in the optical member support region; and pressing the uncured adhesive member with an optical member in the optical member support region to move the uncured adhesive member toward the resin stopper and cure it, and adhering the optical member to the substrate via the adhesive member.

A light emitting device according to an embodiment of the present disclosure includes a substrate having a light emitting element, an upper surface including an element arrangement region in which the light emitting element is arranged and an optical member support region surrounding the element arrangement region, a lower surface opposite to the upper surface and having lower surface wiring, a first side surface connected to the upper surface, a second side surface connected to the lower surface, and a resin stopper portion arranged between the first side surface and the second side surface, an optical function portion arranged above the element arrangement region, and a support portion supporting the optical function portion, the support portion being bonded to the optical member support region via an adhesive member, the adhesive member covering the optical member support region and the first side surface, and being spaced apart from the lower surface wiring.

The manufacturing method of a light emitting device and the light emitting device according to an embodiment of the present disclosure can provide a manufacturing method of a light emitting device and a light emitting device that can improve yield.

FIG. 1 is a schematic plan view illustrating an example of a light emitting device according to an embodiment. 2 is a schematic cross-sectional view of the light-emitting device of FIG. 1 taken along line 2A-2A. 2B is a schematic cross-sectional view showing an enlarged view of a portion 2B surrounded by a dashed line in FIG. 2A. 2 is a schematic plan view showing the light emitting device of FIG. 1 in a state where optical members are omitted. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. 2B , which is a schematic cross-sectional view similar to FIG. 2B and shows another example of the light-emitting device according to the embodiment. FIG. 2C is a schematic cross-sectional view similar to FIG. 2B showing an example of a light-emitting device according to another embodiment. 4 is a flowchart of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic plan views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment. 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a light emitting device according to an embodiment.

Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. Note that the manufacturing method of the light emitting device and the light emitting device according to the present disclosure described below are for embodying the technical idea of the present disclosure, and unless otherwise specified, the present disclosure is not limited to the following.
In each drawing, the same reference numerals may be used for components having the same function. In consideration of the explanation or ease of understanding of the main points, the embodiments may be shown separately for convenience, but partial replacement or combination of the configurations shown in different embodiments is possible. In the embodiments described below, the description of matters common to the above will be omitted, and the differences will be described. The same action and effect due to the same configuration will not be mentioned in each embodiment. The size and positional relationship of the components shown in each drawing may be exaggerated to clarify the explanation. As a cross-sectional view, an end view showing only the cut surface may be used. In this specification, "plan view" refers to viewing from above or below. In addition, the terms "cover" and "cover" are not limited to cases where the components are in direct contact, and unless otherwise specified, they also include cases where the components are indirectly covered (for example, via another component). In addition, in this specification, "perpendicular" or "orthogonal" includes cases where two straight lines, sides, faces, etc. are in the range of about 90° to ±10°, unless otherwise specified.

1. Embodiment <Light-emitting device>
As shown in Figures 2A and 2B, the light-emitting device 1 of this embodiment includes a substrate 2, a light-emitting element 13a arranged on the upper surface of the substrate 2, and an optical member 5 arranged on the substrate 2 so as to cover the light-emitting element 13a.
In this embodiment, the substrate 2 has an upper surface 21 including an element arrangement region 21a in which the light emitting element 13a is arranged and an optical member support region 21b surrounding the element arrangement region 21a, a lower surface 22 opposite to the upper surface 21 and having a lower surface wiring 4b, a first side surface 23a connected to the upper surface 21, a second side surface 23b connected to the lower surface 22, and a resin stopper 30 arranged between the first side surface 23a and the second side surface 23b. The optical member 5 includes an optical function section 6 arranged above the element arrangement region 21a and a support section 7 supporting the optical function section 6. The support section 7 of the optical member 5 is bonded to the optical member support region 21b of the substrate 2 via an adhesive member 40. The lower surface 22 of the substrate 2 constitutes the lower surface of the light emitting device 1, and the lower surface wiring 4b of the substrate 2 constitutes an external connection electrode of the light emitting device 1. In the light emitting device 1, the adhesive member 40 covers the optical member support region 21b and the first side surface 23a, and is disposed at a distance from the underside wiring 4b. In the light emitting device 1, the substrate 2 is provided with a resin stopper 30, so that the adhesive member 40 can be disposed at a distance from the external connection electrode (i.e., the underside wiring 4b). Each component of the light emitting device 1 will be described in detail below.

(substrate)
1, the substrate 2 is a member on which the light emitting element 13a and the electronic component 11 are disposed. The substrate 2 is enclosed within the optical member 5 in a plan view.

2A and 2B , the substrate 2 has an upper surface 21, a lower surface 22 opposite to the upper surface 21, and a side surface 23 between the upper surface 21 and the lower surface 22. The substrate 2 is, for example, in a flat plate shape. The substrate 2 is, for example, in a circular shape in a plan view. The substrate 2 is provided with a resin stopper portion 30 on the side surface 23.
As shown in Fig. 2A, the substrate 2 includes a base 3 and wiring 4. The wiring 4 includes positive and negative lower wiring 4b arranged on the lower surface 22, and positive and negative upper wiring 4a arranged on the upper surface 21. The lower wiring 4b and the upper wiring 4a are electrically connected to each other via inner layer wiring such as vias. The wiring 4 is wiring that supplies power to the light emitting element 13a, and is patterned into a predetermined shape on the upper and lower surfaces of the base 3. The lower wiring 4b constitutes an external connection electrode of the light emitting device 1.

Examples of the substrate 3 include ceramics such as aluminum nitride and silicon nitride, metals such as aluminum and copper, and resins such as glass epoxy. Metal materials can be used for the wiring 4, and for example, single metals such as gold (Au), silver (Ag), aluminum (Al), nickel (Ni), rhodium (Rh), copper (Cu), titanium (Ti), platinum (Pt), palladium (Pd), molybdenum (Mo), chromium (Cr), and tungsten (W) or alloys containing these metals can be suitably used. More preferably, single metals such as silver (Ag), aluminum (Al), platinum (Pt), and rhodium (Rh) that have excellent light reflectivity or alloys containing these metals can be used. When a metal member is used as the substrate 3, it is preferable to place an insulating film such as an epoxy resin between the wiring 4 and the substrate 3 to prevent short circuits.

As shown in FIG. 3, the upper surface 21 of the substrate 2 includes an element placement region 21a in which the light emitting element 13a is placed, and an optical member support region 21b surrounding the element placement region 21a. In FIG. 3, to facilitate understanding of the drawing, the boundary between the element placement region 21a and the optical member support region 21b is indicated by a virtual two-dot chain line. In this specification, "surround" is not limited to surrounding the periphery of the surrounded object in a continuous ring shape, but includes surrounding the periphery of the surrounded object intermittently. The upper surface 21 is, for example, circular in plan view.

The element arrangement region 21a is, for example, a region located in the center of the upper surface 21 in a planar view. The element arrangement region 21a is, for example, a circular region having a diameter that is 75% to 90%, preferably 80% to 85%, of the diameter of the upper surface 21 in a planar view.
As shown in Fig. 2A, positive and negative top surface wirings 4a are arranged in the element arrangement region 21a. As shown in Fig. 3, a light emitting element 13a and an electronic component 11 are arranged in the element arrangement region 21a. The electronic component 11 is, for example, a light receiving element, a protection element, a capacitor, a thermistor, etc. A plurality of electronic components 11 may be provided.

As shown in FIG. 3, the optical element support region 21b is located outside the element placement region 21a. The optical element support region 21b is, for example, a region located on the outer periphery of the upper surface 21 in a planar view. The optical element support region 21b is, for example, a ring-shaped region in a planar view. The element placement region 21a and the optical element support region 21b may be separated from each other or may be continuous.

2A, the lower surface 22 is the opposite surface to the upper surface 21. Hereinafter, the direction from the upper surface 21 toward the lower surface 22, or the direction from the lower surface 22 toward the upper surface 21, is also referred to as the thickness direction Z. The lower surface 22 has the positive and negative lower surface wiring 4b arranged thereon. As shown in FIG. 3, the lower surface 22 has a shape that is approximately similar to the upper surface 21 in a plan view, for example, and has a larger outer shape than the upper surface 21. In other words, the outer edge of the lower surface 22 is located outside the outer edge of the upper surface 21 in a plan view. In a plan view, the outer shape of the lower surface 22 is, for example, 100% to 104% of the area of the upper surface 21, and preferably 100% to 102%.

As shown in FIG. 2B, in the light-emitting device 1, the side surface 23 of the substrate 2 includes a first side surface 23a that is continuous with the upper surface 21, and a second side surface 23b that is located outside the first side surface 23a and is continuous with the lower surface 22.

2B, the first side surface 23a includes a region indicated by a straight line perpendicular to the upper surface 21 in a cross section along the thickness direction Z. Therefore, the first side surface 23a substantially coincides with the outer edge of the upper surface 21 in a plan view perpendicular to the thickness direction Z as shown in FIG.
As another example, as shown in FIGS. 4E and 4F, the first side surfaces 523a, 623a may have a region indicated by a curve in a cross section along the thickness direction Z.

As shown in FIG. 2B, for example, the second side surface 23b includes an area indicated by a straight line perpendicular to the lower surface 22 in a cross section along the thickness direction Z. Therefore, as shown in FIG. 3, the second side surface 23b substantially coincides with the outer edge of the lower surface 22 in a plan view perpendicular to the thickness direction Z.

Furthermore, the side surface 23 of the substrate 2 may have a third side surface 23c between the first side surface 23a and the second side surface 23b, for example, as shown in FIG. 2B.
The third side surface 23c includes, for example, a region indicated by a straight line intersecting the thickness direction Z in a cross section along the thickness direction Z. For example, the third side surface 23c may be a plane parallel to the lower surface 22. The third side surface 23c may be a plane that moves away from the lower surface 22 as it moves from the inside to the outside of the substrate 2. That is, the angle between the third side surface 23c and the first side surface 23a may be an acute angle. The third side surface 23c may be a plane that moves closer to the lower surface 22 as it moves from the inside to the outside of the substrate 2. That is, the angle between the third side surface 23c and the first side surface 23a may be an obtuse angle.

In the light emitting device 1, the substrate 2 has a resin stopper 30. The resin stopper 30 is provided to prevent the adhesive member 40, which bonds the substrate 2 and the optical member 5, from spreading onto the lower surface 22 of the substrate 2 before hardening. In other words, the substrate 2 of the light emitting device 1 has the resin stopper 30, so that the adhesive member 40 can be disposed away from the lower surface 22. This improves the adhesion between the bonding member such as solder and the light emitting device when the light emitting device is secondarily mounted. Here, the resin stopper 30 is provided between the first side surface 23a and the second side surface 23b. When the substrate 2 has the third side surface 23c, the resin stopper 30 may include the third side surface 23c, or the resin stopper 30 may be the third side surface 23c.

Hereinafter, other examples of the resin stop portion 30 in this embodiment will be described with reference to FIGS. 4A to 4F.
For example, as shown in Fig. 4A, the resin stop portion 130 may be provided between the first side surface 23a and the second side surface 23b, on the side closer to the upper surface 21. The resin stop portion 130 may include the third side surface 123c, or may be the third side surface. In this manner, the resin stop portion 30 may be disposed on the side of the substrate closer to the lower surface 22 as shown in Fig. 2B, or may be disposed on the side closer to the upper surface 21 as shown in Fig. 4A.
When the resin stopping portion is positioned closer to the lower surface 22, the distance from the upper surface 21 to the resin stopping portion can be increased, and in the manufacturing method of the light-emitting device 1 described later, the uncured adhesive material 40a can be reduced from spreading onto the lower surface 22 before curing.

The resin stopping portion 30 is not limited to the above shape, and may have any shape that can reduce the spreading of the uncured adhesive member 40a onto the lower surface 22 when the uncured adhesive member 40a is placed on the upper surface 21 during the manufacturing process.
4B , the resin stop portion 230 may include a third side surface 223c that is shown by a curve in a cross section taken along the thickness direction Z. The third side surface 223c is shown by a curve that is concave toward the upper surface 21 in a cross section taken along the thickness direction Z, for example.

4C, 4D, and 4E, the resin stop portion 330, 430, 530 may include a recess 350, 450, 550 provided in the third side surface 323c, 423c, 523c. In this case, the third side surface 323c, 423c, 523c having the recess 350, 450, 550 may be a side surface shown by a curve in a cross section along the thickness direction Z, or may be a side surface shown by a straight line in a cross section along the thickness direction Z, as shown in FIG.
The recesses 350, 450, 550 are defined by the side surfaces 350a, 450a, 550a. The recesses may be provided at any position of the third side surface, for example, as shown in FIG. 4C, they may be provided apart from the first side surface 23a and the second side surface 23b. Also, as shown in FIG. 4D and FIG. 4E, the recesses 450, 550 may be provided continuously with the first side surface 23a, 523a. In this case, the first side surface 23a, 523a may constitute the side surface 450a, 550a of the recesses 450, 550. Furthermore, the first side surface 23a, 523a constituting the side surface 450a, 550a of the recesses 450, 550 may be the first side surface 23a shown as a straight line as shown in FIG. 4D in a cross section along the thickness direction Z, or may be the first side surface 523a shown as a curve as shown in FIG. 4E.
4F, the resin stopper portion may be a third side surface 623c that is continuous with the first side surface 623a shown by a curve in a cross section along the thickness direction Z. In this case, it is preferable that the curvature of the third side surface 623c is smaller than the curvature of the first side surface 623a in a cross section along the thickness direction Z. This can further reduce the wetting and spreading of the uncured adhesive member 40a from the upper surface 21 to the lower surface 22 during the manufacturing process.

(light source)
As shown in FIG. 2A, in the light emitting device 1, the light emitting element 13a is arranged in the element arrangement region 21a as the light source 13 including the light emitting element 13a. The light source 13 includes at least one light emitting element 13a. Here, the light source 13 includes the light emitting element 13a, a covering member 15 that covers the side surface of the light emitting element 13a, and a light-transmitting member 14 that is arranged on the upper surface of the light emitting element 13a. The upper surface of the light-transmitting member 14 is exposed from the covering member 15 as the light emitting surface of the light source 13. As an example, the light source 13 has a substantially rectangular parallelepiped shape, has a light emitting surface on the upper surface, and has positive and negative electrodes 13b on the lower surface. The light source 13 is electrically connected to the upper surface wiring 4a of the substrate 2 via a bonding member 12 known in the art, such as solder or bump. Here, two light sources 13 having a substantially rectangular parallelepiped shape are arranged on the substrate 2 with their side surfaces connected to the light emitting surfaces facing each other.

(Light emitting element)
The light emitting element 13a includes a light-transmitting support substrate such as sapphire and a semiconductor structure. The semiconductor structure includes an n-side semiconductor layer, a p-side semiconductor layer, and an active layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The active layer may have a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including a plurality of well layers. The semiconductor structure includes a plurality of semiconductor layers made of nitride semiconductors. The nitride semiconductor includes all compositions of semiconductors in which the composition ratios x and y are changed within the respective ranges in the chemical formula of In _x Al _y Ga _1-x-y N (0≦x, 0≦y, x+y≦1). The emission peak wavelength of the active layer can be appropriately selected according to the purpose. The active layer is configured to be able to emit, for example, visible light or ultraviolet light.
The semiconductor structure may include a plurality of light emitting sections including an n-side semiconductor layer, an active layer, and a p-side semiconductor layer. When the semiconductor structure includes a plurality of light emitting sections, each light emitting section may include well layers having different emission peak wavelengths, or may include well layers having the same emission peak wavelength. The same emission peak wavelength includes a case where the emission peak wavelengths vary by about several nm. The combination of emission peak wavelengths of the plurality of light emitting sections can be appropriately selected. For example, when the semiconductor structure includes two light emitting sections, the combination of light emitted by each light emitting section may include combinations of blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. For example, when the semiconductor structure includes three light emitting sections, the combination of light emitted by each light emitting section may include combinations of blue light, green light, and red light. Each light emitting section may include one or more well layers having emission peak wavelengths different from other well layers.
The planar shape of the light emitting element 13a is, for example, a rectangular shape, but may be a polygonal shape such as a circle, an ellipse, a triangle, a hexagon, etc. The light emitting element 13a preferably has positive and negative electrodes on the same side, which allows it to be flip-chip mounted on the substrate 2.

(Light-transmitting member)
The light-transmitting member 14 is a plate-like member having a substantially rectangular shape in plan view, and is disposed on the light-emitting element 13a so as to cover the upper surface of the light-emitting element 13a. The light-transmitting member 14 may be made of a light-transmitting resin or an inorganic material such as ceramics or glass. The resin may be a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenolic resin. In addition, a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin may be used. Among them, a silicone resin or a modified resin thereof having excellent light resistance and heat resistance may be preferably used. The light-transmitting property here refers to a property that allows 60% or more of the light from the light-emitting element 13a to be transmitted. Furthermore, the light-transmitting member 14 may contain a light diffusing member or a phosphor that converts the wavelength of at least a part of the light from the light-emitting element 13a. Examples of the light-transmitting member 14 containing a phosphor include the above-mentioned resin material, ceramics, glass, etc., which contain a phosphor, and a sintered body of a phosphor.

Examples of phosphors include yttrium aluminum garnet phosphors (e.g., _Y3 ( _Al ,Ga) _5O12 :Ce), lutetium aluminum garnet phosphors (e.g., _Lu3 (Al,Ga _{)5O12 :} Ce), terbium aluminum garnet phosphors (e.g., _Tb3 (Al, _{Ga)5O12 :} Ce), CCA phosphors (e.g., _Ca10 ( _PO4 ) _6Cl2 :Eu), SAE phosphors (e.g. _{, Sr4Al14O25 :} Eu), chlorosilicate phosphors (e.g. _{, Ca8MgSi4O16Cl2 :} Eu), β- _sialon phosphors (e.g., (Si,Al) ₃ (O,N _{) 4} oxynitride phosphors such as Ca(Si,Al) ₁₂ (O,N) _{16:Eu) or α-sialon phosphors (for example, Ca(Si,Al)12(O,N)16 :} Eu); nitride phosphors such as SLA phosphors (for example, _SrLiAl3N4 :Eu), CASN phosphors (for example, _CaAlSiN3 :Eu), SCASN phosphors (for example, (Sr,Ca) _AlSiN3 : _{Eu )} or BSESN phosphors (( _Ba ,Sr) _{2Si5N8 )} ; KSF phosphors (for example, _{K2SiF6 :} Mn), KSAF phosphors (for example, _{K2Si0.99Al0.01F5.99} : _Mn ) or MGF phosphors ₍ for example, _{3.5MgO.0.5MgF2.GeO2} Fluoride-based phosphors such as CsPb(F,Cl,Br,I)3, phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I) ₃ ), or quantum dot phosphors (e.g., CdSe, InP, _{AgInS2, AgInSe2, AgInGaS2} , or _CuAgInS2 ) can be used.

For example, a blue light emitting element can be used as the light emitting element 13a, and the light transmissive member 14 can contain a yellow phosphor to form the light source 13 that emits white light.
The light diffusing material contained in the light-transmitting member 14 may be, for example, titanium oxide, barium titanate, aluminum oxide, silicon oxide, or the like.
The light-transmitting member 14 may have a laminated structure including a light-transmitting layer containing a phosphor and/or a light-transmitting layer containing a light diffusing member.

(Covering material)
The covering member 15 is a member that protects the side surface of the light emitting element 13a, and covers the side surface of the light emitting element 13a directly or indirectly. The covering member 15 may further cover the side surface of the light-transmitting member 14. The upper surface of the light-transmitting member 14 is exposed from the covering member 15 and constitutes the light emitting surface (i.e., the main light extraction surface) of the light source 13. From the viewpoint of light extraction efficiency, it is preferable that the covering member 15 has high light reflectivity. For example, a resin containing a light-reflecting substance can be used for the covering member 15. Examples of the light-reflecting substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, aluminum nitride, boron nitride, zinc oxide, and mullite. It is preferable that the resin is a resin mainly composed of a thermosetting resin such as an epoxy resin, a silicone resin, a silicone-modified resin, or a phenolic resin, as the base material. In addition, the covering member 15 can also be composed of a member that is transparent to visible light, as necessary. Furthermore, the covering member 15 may contain, in addition to the light reflecting material, a light absorbing material such as carbon, a pigment, or the above-mentioned phosphor, as necessary.

(Optical components)
The optical member 5 is a member for emitting light emitted from the light source 13 in a predetermined direction. As shown in Fig. 2A, the optical member 5 includes an optical function part 6 arranged above the element arrangement region 21a, and a support part 7 that supports the optical function part 6. As shown in Fig. 2B, the support part 7 is adhered to the optical member support region 21b of the substrate 2 via an adhesive member 40.
The optical function part 6 mainly transmits light emitted from the light source 13. The support part 7 is arranged to extend laterally from the outer edge of the optical function part 6 and surround the optical function part 6. Here, the upper surface of the optical function part 6 is flat, and the upper surface of the support part 7 is arranged to be at the same height as the upper surface of the optical function part 6.

1, the optical function unit 6 is, for example, a lens having a circular shape in plan view. The optical function unit 6 is arranged at a position overlapping at least the light source 13 in plan view. Here, a Fresnel lens is used as an example of the optical function unit 6. As shown in FIG. 2A, the Fresnel lens is arranged so that the lower surface on which the unevenness is arranged faces the light source 13 side, and the light emitted from the light source 13 is incident and emitted from the flat upper surface. By using a Fresnel lens as the optical function unit 6, the thickness of the optical function unit 6 can be made thin. This allows the light emitting device 1 to be made smaller. In addition, by making the optical function unit 6 thin, it becomes easier to arrange an air layer between the optical function unit 6 and the light source 13. By arranging the air layer, the spread of the light from the light source 13 can be adjusted. Note that the optical function unit 6 may have multiple lens units according to the number of light sources 13. As an example, when the optical function unit 6 has two light sources 13, it is a compound eye lens having two lenses composed of Fresnel lenses.

2A , the support portion 7 is continuous with the optical function portion 6. In the optical member 5, the optical function portion 6 and the support portion 7 may be separate bodies, but it is preferable that the optical function portion 6 and the support portion 7 are integrated. This allows the alignment of the optical function portion 6 and the light source 13 with high precision.
2B, the support portion 7 is bonded to the substrate 2. The support portion 7 is bonded to at least the optical member supporting region 21b of the upper surface 21 of the substrate 2 and the first side surface 23a via an adhesive member 40.
The support portion 7 has a step portion 8 continuing to the lower surface 7a. The step portion 8 is, for example, a recess shaped to fit into the optical member supporting region 21b and the side surface 23. At least the optical member supporting region 21b and the first side surface 23a are arranged in the step portion 8, and the step portion 8, the optical member supporting region 21b, and the first side surface 23a are joined via an adhesive member 40. This fixes the optical member 5 and the substrate 2.

(Adhesive member)
2B, the adhesive member 40 covers the optical member support region 21b and the first side surface 23a, and is disposed at a distance from the underside wiring 4b. The adhesive member 40 may further cover the resin stopper portion 30. That is, the adhesive member 40 may cover the third side surface 23c. In this case, too, the adhesive member 40 is disposed at a distance from the underside wiring 4b. By disposing the adhesive member 40 at a distance from the underside wiring 4b in this manner, it is possible to reduce the surface of the underside wiring 4b being covered by the adhesive member 40.
Specifically, in the manufacturing process of the light emitting device, after the process of arranging the uncured adhesive member 40a, through the process of arranging the optical member 5, and before the process of curing the uncured adhesive member 40a, it is possible to reduce the spread of the uncured adhesive member 40a to the lower surface. For example, by providing the resin stopper 30 on the substrate 2, the path from the upper surface 21 to the lower surface 22 becomes longer, making it difficult for the uncured adhesive member 40a to reach the lower surface. In addition, when the resin stopper 30 includes a recess, it is possible to accommodate the excess adhesive member 40, so that it is possible to further reduce the uncured adhesive member 40a reaching the lower surface. As a result, in the manufacturing process of the light emitting device 1, it is possible to reduce the decrease in yield due to contamination of the lower surface wiring 4b. In other words, it is possible to improve the yield of the light emitting device 1.

For example, resin materials such as thermosetting resin, thermoplastic resin, and ultraviolet curing resin can be used as the adhesive member 40. Specific examples include acrylic resin, polycarbonate resin, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, and hybrid silicone resin.

5, a light emitting device according to another embodiment differs from the light emitting device 1 according to the embodiment in that a resin stopper 730 is provided on an upper surface 721 of a substrate 702. In addition, the light emitting device according to the other embodiment differs from the light emitting device 1 according to the first embodiment in that an adhesive member 40 is not disposed on a side surface 723.

The resin stopper 730 is provided in the optical member support region 21b, spaced apart from the side surface 723 of the substrate 702. The resin stopper 730 is, for example, a groove provided in the optical member support region 21b. In a plan view, the resin stopper 730 is provided in the optical member support region 21b, for example, so as to surround the element arrangement region 21a. The distance between the outer periphery of the resin stopper 730 and the outer periphery of the upper surface 721 is, for example, 5 um to 20 um, and preferably 5 um to 10 um.
Furthermore, the resin stopping portion 730 may include, for example, a plurality of grooves provided on the upper surface of the substrate 702. That is, the resin stopping portion 730 may be a plurality of grooves that surround the element arrangement region 21a and are arranged in the radial direction.

The adhesive member 40 covers the optical element support region 21b between the element placement region 21a and the resin stopper 730 on the upper surface 721 of the substrate 702, and is disposed away from the lower surface wiring 4b. The adhesive member 40 may also cover the side surface of the groove that constitutes the resin stopper 730.

Even in a light-emitting device configured in this manner, the adhesive member 40 and the underside wiring 4b can be arranged at a distance.

In another embodiment, as shown in FIG. 5, the side surface 723 may be composed of a single surface. However, in the second embodiment, as in the first embodiment, the side surface may include the first to third side surfaces, and a resin stopper may also be provided on the side surface. In other words, the light emitting device according to the present disclosure may include both a resin stopper provided on the upper surface of the substrate and a resin stopper provided on the side surface of the substrate.

3. First Manufacturing Method The manufacturing method of the light emitting device according to the embodiment (hereinafter also referred to as the first manufacturing method) includes the steps of:
(1) a light-emitting element;
a substrate including a top surface having an element placement region in which a light emitting element is placed and an optical member support region surrounding the element placement region, a bottom surface opposite the top surface, and a side surface between the top surface and the bottom surface, the side surface being provided with a resin stopper;
A step S1 of preparing an intermediate having
(2) a step S2 of arranging an uncured adhesive member between the element arrangement region and the resin stopper in the optical member support region;
(3) a step S3 of pressing the uncured adhesive member in the optical member support region with the optical member to move the uncured adhesive member toward the resin stopper portion and cure the uncured adhesive member, thereby adhering the optical member to the substrate via the adhesive member;
including.

(1) Step S1 of preparing an intermediate
7A, in this step, an intermediate 810 is prepared, which includes a light emitting element 13a and a substrate 2 in which the light emitting element 13a is arranged in an element arrangement region 21a. In the intermediate 810, other electronic components such as a protective element may be further arranged in the element arrangement region 21a of the substrate 2 in addition to the light emitting element 13a. In the intermediate 810, the light emitting element 13a is arranged on the substrate 2 as a light source 13 including the light emitting element 13a, a covering member 15 that covers the side surface of the light emitting element 13a, and a light-transmitting member 14 that is arranged on the upper surface of the light emitting element 13a.
The substrate 2 in the intermediate body 810 is provided with a resin stopper 30 on the side surface 23. In the example shown in Fig. 7A, the resin stopper 30 includes a third side surface 23c between the first side surface 23a and the second side surface 23b. However, the shape of the resin stopper 30 may be any shape that can suppress the uncured resin member from wetting and spreading from the upper surface 21 to the lower surface 22 during the period from step S2 of arranging the uncured adhesive member to step S3 of adhering the optical member to the substrate, which will be described later.

The step S1 of preparing an intermediate body may be, for example, as shown in FIG.
An aggregate substrate preparation step S1-1 of preparing an aggregate substrate including at least one substrate portion that will become a substrate for each light emitting device after singulation and a frame portion continuous with the substrate portion;
a first irradiation step S1-2 of scanning and irradiating a laser beam along an outer periphery of an upper surface of a substrate portion of the collective substrate to form a first side surface;
a second irradiation step S1-3 of irradiating a laser beam along the first side surface between the first side surface and the frame portion to form a resin stopping portion;
a third irradiation step S1-4 of irradiating a laser beam along the resin stopper portion between the resin stopper portion and the frame portion to form a second side surface and separate the substrate portion from the collective substrate;
may include:
Through these steps, the resin stopper 30 can be formed on the side surface 23 of the substrate 2 .

(1-1) Substrate assembly preparation process S1-1
Fig. 8A is a plan view of an aggregate substrate 800 prepared in an aggregate substrate preparation step S1-1. As shown in Fig. 8A, the aggregate substrate 800 includes a plurality of substrate portions 802 and a frame portion 801. The substrate portions 802 are a portion that will be separated from the aggregate substrate 800 in a later third irradiation step S1-4, and correspond to an intermediate body 810. The plurality of substrate portions 802 are disposed spaced apart from each other via the frame portion 801. In the aggregate substrate preparation step S1-1, the substrate portions 802 are a part of the aggregate substrate 800, and the substrate portions 802 and the frame portion 801 are continuous with each other.

The circular two-dot chain line shown in FIG. 8A is the outer periphery C1 of the upper surface of the substrate portion 802. The outer periphery C1 of the upper surface is a contour line that is set as the outer periphery of the upper surface of the substrate portion 802 (i.e., the intermediate body 810) after separation. In the first irradiation step S1-2 described below, the laser light LZ is irradiated along the outer periphery C1 of the upper surface.

In addition, in Figures 8A to 8D, in order to make the figures easier to understand, the light source 13, electronic components 11, etc. are shown in a simplified rectangular shape to simplify the areas in which they are arranged.

The frame portion 801 is the region between the multiple substrate portions 802 that are spaced apart from one another in the collective substrate 800. The frame portion 801 is made of the same material as the substrate portions 802. For ease of explanation, below, one substrate portion 802 and the region of the frame portion 801 that surrounds the one substrate portion 802 will be referred to as a unit region 820.

As shown in FIG. 8A, the collective substrate 800 includes a plurality of unit areas 820, each of which includes one substrate portion 802 and a frame portion 801 continuous with the substrate portion 802. The plurality of unit areas 820 are arranged, for example, in a matrix of n rows and m columns (n is an integer of 2 or more, and m is an integer of 2 or more). The unit areas 820 are, for example, rectangular in plan view. The boundaries of each unit area in the collective substrate 800 can be set as virtual lines passing through approximate centers between adjacent substrate portions 802. In FIG. 8A, the boundaries of the unit areas 820 are indicated by straight, two-dot chain lines.

In the above-mentioned collective substrate preparation process S1, a collective substrate 800 is prepared in which light sources 13 and electronic components 11, etc. are arranged on each substrate portion 802. However, the collective substrate preparation process may also include a process of preparing a collective substrate 800 in which light sources 13 and electronic components 11 are not arranged on each substrate portion 802, and a process of arranging light sources 13 and electronic components, etc. on each substrate portion 802 of the collective substrate 800. The collective substrate may also be prepared by acquisition, including purchase.

(1-2) First irradiation step S1-2
FIG. 8B is a diagram showing one step of irradiating laser light onto collective substrate 800, and collective substrate 800 is shown in a part of a cross section taken along line 8B-8B in FIG. 8A.
8B, in the first irradiation step S1-2, a laser beam LZ is scanned and irradiated along an upper surface periphery C1 of a substrate portion 802 in an aggregate substrate 800 to form a first side surface 23a. Note that in Figs. 8B to 9B, the positions of the upper surface periphery C1, a periphery C2 of a first side surface 23a described below, and a periphery C3 of a resin stopper portion 30 described below are indicated by arrows, respectively.

When the laser beam LZ is irradiated perpendicularly to the upper surface of the substrate portion 802 along the outer periphery C1 of the upper surface of the substrate portion 802, a first side surface 23a extending in the thickness direction Z can be formed.
The first irradiation step S1-2 may include a single cycle of irradiation multiple times in which the laser light LZ is scanned and irradiated once around the outer periphery C1 of the upper surface of the substrate part 802. The single cycle of irradiation can also be said to be irradiation of the laser light LZ around the outer periphery C1 of the upper surface once around the outer periphery C1 of the upper surface.

For example, when one cycle of irradiation is performed multiple times, the first side surface 23a extending in the thickness direction Z can be formed by irradiating the same irradiation position along the outer periphery C1 of the upper surface of the substrate portion 802 with the laser light LZ. The number of times one cycle of irradiation to the same irradiation position is set to a number of times (a predetermined number) at which the substrate portion 802 is not separated from the collective substrate 800. The predetermined number of times depends on the material of the collective substrate and the above-mentioned irradiation conditions, but is, for example, 1 to 20 times.

Furthermore, by shifting the position at which the laser light LZ is irradiated from the inside to the outside (or from the outside to the inside) of the substrate portion 802, a first side surface that is inclined with respect to the thickness direction Z or a curved first side surface can be formed.
For example, as the preceding irradiation, one cycle of irradiation is performed a predetermined number of times along the upper surface outer periphery C1. Then, the irradiation position of the following irradiation is shifted to the outside of the substrate portion 802 from the irradiation position of the preceding irradiation, and one cycle of irradiation is performed a predetermined number of times greater than the predetermined number of the preceding irradiation. Then, the irradiation position of the following irradiation is further shifted to the outside of the substrate portion 802 from the irradiation position of the following irradiation, and one cycle of irradiation is performed a predetermined number of times greater than the predetermined number of the following irradiation. By repeating such irradiation, a first side surface that is a plane inclined with respect to the thickness direction Z or a first side surface that is curved in the thickness direction Z can be formed. Specifically, by increasing the number of irradiations of one cycle of irradiation at a constant rate while shifting the irradiation position to the outside of the substrate portion 802, a first side surface that is a plane inclined with respect to the thickness direction Z can be formed. In addition, by appropriately changing the rate at which the number of irradiations of one cycle of irradiation is increased while shifting the irradiation position to the outside of the substrate portion 802, a first side surface that is curved in the thickness direction Z can be formed.

The first side surface of a plane inclined with respect to the thickness direction Z, or the first side surface curved in the thickness direction Z, can also be formed by shifting the irradiation position of the subsequent irradiation to the outside of the substrate portion 802 from the preceding irradiation, and increasing the irradiation intensity of the subsequent irradiation to be stronger than the irradiation intensity of the preceding irradiation. By repeating such irradiation, the first side surface of a plane inclined with respect to the thickness direction Z, or the first side surface curved in the thickness direction Z can be formed. Specifically, the first side surface of a plane inclined with respect to the thickness direction Z can be formed by increasing the irradiation intensity of one cycle of irradiation at a constant rate while shifting the irradiation position to the outside of the substrate portion 802. The first side surface curved in the thickness direction Z can also be formed by appropriately changing the rate at which the irradiation intensity of one cycle of irradiation is increased while shifting the irradiation position to the outside of the substrate portion 802.

In addition, the number of irradiations in one cycle and the irradiation intensity in one cycle may be appropriately changed while shifting the irradiation position to the outside of the substrate portion 802 to form a first side surface that is flat and inclined with respect to the thickness direction Z, or a first side surface that is curved in the thickness direction Z.

The laser light LZ is, for example, a pulsed laser light. The pulse width P of the pulsed laser light is, for example, 15 picoseconds or more and 90 nanoseconds or less, and preferably 5 nanoseconds or more and 75 nanoseconds or less. The frequency F of the pulsed laser light is, for example, 300 kHz or more and 500 kHz or less. The intensity of the pulsed laser light is, for example, 4 W or more and 10 W or less.

8B, in the first irradiation step S1-2, the lower surface of the collective substrate 800 is supported by an collective substrate supporting member 830. Specifically, the collective substrate 800 is supported by the collective substrate supporting member 830 including a substrate supporting portion 831 arranged below the substrate portion 802 and a frame supporting portion 832 arranged below the frame portion 801. The collective substrate supporting member 830 may include a base portion 834 continuing to the lower portion of the substrate supporting portion 831 and the lower portion of the frame supporting portion 832. For example, the substrate supporting portion 831 and the frame supporting portion 832 are each a plurality of protrusions arranged on a flat base portion.
Furthermore, in the first irradiation step S1-2, the upper surface side of the collective substrate 800 is preferably fixed by a pressing jig 840. The pressing jig 840 exposes the upper surface periphery C1 of the substrate portion 802 and a partial area of the upper surface of the frame portion 801 along the upper surface periphery C1 (i.e., the area irradiated with the laser light LZ), and fixes the upper surface of the frame portion 801.

(1-3) Second irradiation step S1-3
Fig. 8C is a cross-sectional view showing a schematic example of a method for manufacturing a light emitting device according to an embodiment. Specifically, Fig. 8C is a cross-sectional view showing a schematic example of a step of irradiating laser light to an assembly substrate 800, and shows an enlarged view of a portion 8C surrounded by a dashed line in Fig. 8B.
As shown in Fig. 8C, in the second irradiation step S1-3, the laser light is scanned and irradiated along the outer periphery C2 of the first side surface 23a to form the resin stopping portion 30 including the third side surface 23c. In the example shown in Fig. 8C, since the first side surface 23a is formed as a surface extending in the thickness direction Z, the outer periphery C2 of the first side surface 23a is the same as the outer periphery C1 of the upper surface.
For example, by shifting the position where the laser light LZ is irradiated from the inside to the outside of the substrate portion 802, the third side surface 23c can be formed as a plane perpendicular to the thickness direction Z. Specifically, as the preceding irradiation, one cycle of irradiation is performed a predetermined number of times along the outer periphery C2 of the first side surface 23a. Thereafter, the irradiation position of the succeeding irradiation is shifted toward the outside of the substrate portion 802 from the irradiation position of the preceding irradiation, and the laser light is irradiated the same number of times as the predetermined number of times of the preceding irradiation. By such irradiation, the third side surface 23c can be formed as a plane perpendicular to the thickness direction Z.
Furthermore, as described above, by appropriately changing the number of times of one cycle of irradiation and/or the irradiation intensity while shifting the irradiation position to the outside of the substrate portion 802, it is possible to form a third side surface that is a plane inclined with respect to the thickness direction Z, a third side surface that is curved in the thickness direction Z, or a third side surface that has a recess.

(1-4) Third irradiation step S1-4
Fig. 8D is a cross-sectional view showing an example of a method for manufacturing a light-emitting device according to an embodiment. Specifically, Fig. 8D is a cross-sectional view showing a step of irradiating a laser beam onto an assembly substrate 800, and shows a region corresponding to part 8C in Fig. 8B in a third irradiation step S1-4.
8D, in the third irradiation step S1-4, a laser beam is scanned and irradiated along the outer periphery C3 of the resin stopper portion 30 between the resin stopper portion 30 and the frame portion 801 to form the second side surface 23b and separate the substrate portion 802 from the frame portion 801. In this case, the outer periphery C3 of the resin stopper portion 30 in a plan view substantially coincides with the outer periphery of the third side surface 23c.

For example, laser light LZ is irradiated in the thickness direction Z along the outer periphery C3 of the resin stopper portion 30 to separate the substrate portion 802 from the collective substrate 800. This allows the second side surface 23b extending in the thickness direction Z to be formed.
Furthermore, as described above, by shifting the irradiation position to the outside of the substrate portion 802 and appropriately changing the number of times of irradiation in one cycle and/or the irradiation intensity, a second side surface that is a plane inclined with respect to the thickness direction Z or a second side surface that is curved in the thickness direction Z can be formed.

(2) Step S2 of placing uncured adhesive member
7B is a cross-sectional view showing an example of a manufacturing method of a light-emitting device according to an embodiment. Specifically, it is a cross-sectional view showing a step S2 of arranging an uncured adhesive member. As shown in FIG. 7B, in the step S2 of arranging an uncured adhesive member, an uncured adhesive member 40a is arranged in the optical member support region 21b of the substrate 2 of the intermediate body 810. The uncured adhesive member 40a is arranged in a ring shape in the optical member support region 21b in a plan view. The uncured adhesive member 40a is arranged in order on a plurality of intermediate bodies 810 prepared from the above-mentioned collective substrate 800, for example. The uncured adhesive member 40a can be applied by, for example, transfer using a stamp pin, potting using a dispenser, or the like.

Here, in the manufacturing process, a plurality of intermediate bodies 810 are treated as one lot, and the plurality of intermediate bodies 810 flow between each process for each lot. At this time, in each lot, the uncured adhesive member 40a is arranged in sequence on the plurality of intermediate bodies 810. Therefore, in the same lot, the intermediate body 810 to which the uncured adhesive member 40a is applied first will wait for a relatively longer time until proceeding to the next process than the intermediate body 810 to which the uncured adhesive member 40a is applied last. In such a case, there is a risk that the uncured adhesive member 40a will spread wetly or the liquid component of the uncured adhesive member 40a, such as oil, will seep out and reach the lower surface 22 during waiting. In contrast, since the light-emitting device of this embodiment is provided with a resin stopper 30, the resin stopper 30 can stop the seepage of the uncured adhesive member 40a and/or the liquid component of the uncured adhesive member 40a, such as oil, as shown in FIG. 7C. As a result, the uncured adhesive member 40a is less likely to come into contact with the external connection electrode, and in the manufactured light-emitting device 1, the underside wiring 4b of the substrate 2, which is the external connection electrode of the light-emitting device 1, can be separated from the adhesive member 40. This reduces the reduction in yield due to contamination of the underside wiring 4b during the manufacturing process of the light-emitting device 1. In other words, the yield of the light-emitting device 1 can be improved.

(2) Step S3 of bonding the optical member to the substrate
7D is a cross-sectional view that illustrates an example of a method for manufacturing a light emitting device according to an embodiment, specifically, a cross-sectional view that illustrates step S3 of bonding an optical member to a substrate.
In step S3 of adhering the optical member 5 to the substrate, the optical member 5 is disposed on the substrate 2 via the uncured adhesive member 40a disposed in the optical member support region 21b. The optical member 5 is disposed, for example, by pressing the uncured adhesive member 40a in the thickness direction Z from the upper surface 21 to the lower surface 22 of the substrate 2. The pressing may be performed by the weight of the optical member 5. The pressed uncured adhesive member 40a moves toward the resin stopper 30. That is, at least a part of the uncured adhesive member 40a moves from the inside to the outside of the substrate 2. A part of the moved uncured adhesive member 40a covers the first side surface 23a. Then, the flow of the uncured adhesive member 40a can be suppressed by the pinning effect of the resin stopper 30 between the first side surface 23a and the second side surface 23b. The moved uncured adhesive member 40a may cover the third side surface 23c. 7D, uncured adhesive member 40a is disposed between optical member support region 21b and support portion 7 of optical member 5, and between first side surface 23a of substrate 2 and support portion 7 of optical member 5. Furthermore, uncured adhesive member 40a may be disposed between third side surface 23c of substrate 2 constituting resin stopper portion 30 and support portion 7 of optical member 5. Thereafter, uncured adhesive member 40a is cured, and optical member 5 is bonded to substrate 2 via adhesive member 40. In this manner, light emitting device 1 is obtained in which cured adhesive member 40 is disposed apart from external connection electrodes (i.e., underside wiring 4b).

As shown in FIG. 7D, in step S3 of adhering the optical member to the substrate, the optical member 5 (specifically, the optical function part of the optical member) is disposed above the light emitting element 13a on the substrate 2. The side surface 23 of the substrate 2 and the optical member 5 can be adhered via an adhesive member 40. The optical member 5 can be aligned by fitting the outer periphery of the upper surface 21 and the second side surface 23b of the substrate 2 to the step portion 8 of the support portion 7.

4. Second Manufacturing Method In the manufacturing method of the light emitting device 701 according to another embodiment (hereinafter also referred to as the second manufacturing method), the step S1A of preparing an intermediate body is different from the step S1 of preparing an intermediate body in the first manufacturing method. Furthermore, the step S2A of disposing an uncured adhesive member in the second manufacturing method is different from the step S2 of disposing an uncured adhesive member in the first manufacturing method in terms of the region to which the adhesive member 40a is applied.

The step S1A of preparing an intermediate in the second production method includes, for example,
A collective substrate preparation process S1A-1;
a fourth irradiation step S1A-2 of scanning and irradiating a laser beam along an outer periphery of an upper surface of the substrate portion of the collective substrate to form the resin stopping portion;
a fifth irradiation step S1A-3 of scanning and irradiating the laser light along the outer periphery of the upper surface to the outside of the resin stopper portion to separate the substrate portion from the frame portion;
including.

The assembly substrate preparation step S1A-1 in the second manufacturing method may be the same as the assembly substrate preparation step S1-1 in the first manufacturing method.

9A, in the fourth irradiation step S1A-2, the upper surface of the substrate portion 802 is irradiated with laser light LZ along the upper surface outer periphery C1 of the substrate portion 802, inside the upper surface outer periphery C1 of the substrate portion 802 that will become the substrate of each light emitting device after singulation. As a result, a groove is formed on the upper surface of the substrate portion 802. The groove constitutes the resin stopper portion 730. The groove may be formed by performing one cycle of irradiation multiple times at the same irradiation position. The groove may also be formed by changing the number of irradiations and/or irradiation intensity of one cycle of irradiation while shifting the irradiation position of the laser light LZ from the inside to the outside (or from the outside to the inside) of the substrate portion 802. Furthermore, multiple grooves may be formed along the direction from the inside to the outside (or from the outside to the inside) of the substrate portion 802.

Fig. 9B is a cross-sectional view showing an example of the second manufacturing method, specifically, Fig. 9B is a cross-sectional view showing a step of irradiating a laser beam onto an aggregate substrate, and shows an enlarged view of a portion 9B surrounded by a dashed line in Fig. 9A.
As shown in FIG. 9B, in the fifth irradiation step S1A-3, a laser beam is scanned and irradiated along the upper surface outer periphery C1 outside the resin stopping portion 730 of the substrate 702 to separate the substrate portion 802 from the frame portion 801.
Furthermore, by replacing the fifth irradiation step S1A-3 with the first irradiation step S1-2, the second irradiation step S1-3, and the third irradiation step S1-4 of the first manufacturing method, a light emitting device having resin stopping portions on the upper surface 721 and the side surface 723 of the substrate 702 can be manufactured.

As shown in FIG. 9C, in step S2A of placing the uncured adhesive member, the uncured adhesive member 40a is applied to the optical element support region 21b between the resin stopper 730 and the element placement region 21a. The uncured adhesive member 40a is arranged, for example, in a ring shape in a plan view.

Step S3A of adhering the optical member to the substrate in the second manufacturing method may be the same as step S3 of adhering the optical member to the substrate in the first manufacturing method.
The uncured adhesive member 40a pressed by the optical member 5 moves toward the resin stopper 730. The moved uncured adhesive member 40a remains on the resin stopper 730. It can also be said that the moved uncured adhesive member 40a covers the inner surface of the resin stopper 730. As a result, the uncured adhesive member 40a is disposed between the optical member support region 21b located between the resin stopper 730 and the element placement region 21a and the support portion 7 of the optical member 5. Thereafter, the uncured adhesive member 40a is cured, so that the cured adhesive member 40 is disposed apart from the external connection electrode (i.e., the lower surface wiring 4b).

9. Other Configurations Furthermore, for example, the present disclosure may have the following configurations.
Item (1)
Providing an intermediate, comprising:
A light-emitting element;
a substrate including an upper surface having an element placement region in which the light emitting element is placed and an optical member support region surrounding the element placement region, a lower surface opposite to the upper surface, and a side surface between the upper surface and the lower surface, the substrate having a resin stopper provided in the optical member support region and/or the side surface;
providing an intermediate having
placing an uncured adhesive member between the element placement region and the resin stopper in the optical member support region;
a step of pressing the uncured adhesive member with an optical member in the optical member support region, thereby moving the uncured adhesive member toward the resin stopper portion and curing the uncured adhesive member, and adhering the optical member to the substrate via the adhesive member;
A method for manufacturing a light emitting device, comprising:
Item (2)
2. The method for manufacturing a light emitting device according to item 1, wherein, in a plan view, the resin stopping portion is a groove provided in the optical member support region away from the side surface.
Item (3)
The side surface includes a first side surface connected to the upper surface and a second side surface located outside the first side surface and connected to the lower surface,
2. The method for manufacturing a light emitting device according to item 1, wherein the resin stopping portion is provided between the first side surface and the second side surface.
Item (4)
The side surface has a third side surface between the first side surface and the second side surface,
4. The method for manufacturing a light emitting device according to claim 3, wherein the resin stopping portion includes a recess provided on the third side surface.
Item (5)
Item 5. The method for manufacturing a light emitting device according to item 3 or 4, wherein the resin stopper portion is located closer to the lower surface than the upper surface.
Item (6)
5. The method for manufacturing a light emitting device according to item 4, wherein the first side surface constitutes an inner side surface of the recess.
Item (7)
Item 7. The method for manufacturing a light emitting device according to any one of items 3 to 6, wherein the first side surface includes a curved surface.
Item (8)
8. The method for manufacturing a light emitting device according to any one of items 1 to 7, wherein, in a plan view, the resin stopper portion surrounds the element arrangement region.
Item (9)
The step of preparing the intermediate comprises:
a collective substrate preparation step of preparing a collective substrate including at least one substrate portion that will become the substrate after singulation and a frame portion continuous with the substrate portion;
a first irradiation step of scanning and irradiating a laser beam along an outer periphery of an upper surface of the substrate portion of the collective substrate to form the resin stopping portion;
a second irradiation step of scanning and irradiating the laser light along an outer periphery of the upper surface to an outside of the resin stopper portion to separate the substrate portion from the frame portion;
Item 3. A method for producing the light-emitting device according to item 1 or 2, comprising:
Item (10)
The step of preparing the intermediate comprises:
a collective substrate preparation step of preparing a collective substrate including at least one substrate portion that will become the substrate after singulation and a frame portion continuous with the substrate portion;
a first irradiation step of irradiating a laser beam along an outer periphery of an upper surface of the substrate portion of the collective substrate to form the first side surface;
a second irradiation step of irradiating a laser beam along the first side surface between the first side surface and the frame portion to form the resin stopping portion;
a third irradiation step of irradiating a laser beam along the resin stopper portion between the resin stopper portion and the frame portion to form the second side surface and separate the substrate portion from the collective substrate;
Item 8. A method for producing the light-emitting device according to any one of Items 3 to 7, comprising:
Item (11)
A light-emitting element;
a substrate having an upper surface including an element placement region in which the light emitting element is placed and an optical member support region surrounding the element placement region, a lower surface opposite to the upper surface and having lower surface wiring, a first side surface connected to the upper surface, a second side surface connected to the lower surface, and a resin stopper portion arranged between the first side surface and the second side surface;
an optical member including an optical function portion disposed above the element arrangement region and a support portion supporting the optical function portion, the support portion being bonded to the optical member support region via an adhesive member;
The adhesive member covers the optical member support region and the first side surface, and is disposed apart from the lower surface wiring.
Item (12)
the substrate has a third side between the first side and the second side,
Item 12. The light emitting device according to item 11, wherein the resin stopper portion is a recess disposed on the third side surface.
Item (13)
Item 13. The light emitting device according to item 11 or 12, wherein the resin stopper portion surrounds the optical member support region in a plan view.

Although the embodiments of the present disclosure and other forms of the collective substrate support member and the clamping jig have been described above, the disclosed contents may vary in the details of the configuration, and changes in the combination and order of elements in the embodiments and other forms of the collective substrate support member and the clamping jig may be realized without departing from the scope and concept of the claimed disclosure.

1 Light emitting device 2 Substrate 21 Upper surface 21a Element arrangement region 21b Optical member support region 22 Lower surface 23 Side surface 23a First side surface 23b Second side surface 23c Third side surface 3 Base body 4 Wiring 4a Upper surface wiring 4b Lower surface wiring 5 Optical member 6 Optical function section 7 Support section 7a Lower surface 8 Step section 11 Electronic component 12 Joining member 13 Light source 13a Light emitting element 13b Electrode 14 Translucent member 15 Covering member 30 Resin stopper section 40, 40a Adhesive member 800 Collective substrate 801 Frame section 802 Substrate section 810 Intermediate body 820 Unit region 830 Collective substrate support member 831 Substrate section support section 832 Frame section support section 840 Holding jig C1 Upper surface outer periphery C2 Outer periphery C3 Outer periphery LZ Laser light

Claims (13)

Providing an intermediate, comprising:
A light-emitting element;
a substrate including an upper surface having an element placement region in which the light emitting element is placed and an optical member support region surrounding the element placement region, a lower surface opposite to the upper surface, and a side surface between the upper surface and the lower surface, the substrate having a resin stopper provided in the optical member support region and/or the side surface;
providing an intermediate having
placing an uncured adhesive member between the element placement region and the resin stopper in the optical member support region;
a step of pressing the uncured adhesive member with an optical member in the optical member support region, thereby moving the uncured adhesive member toward the resin stopper portion and curing the uncured adhesive member, and adhering the optical member to the substrate via the adhesive member;
A method for manufacturing a light emitting device, comprising: The method for manufacturing a light-emitting device according to claim 1, wherein, in a plan view, the resin stopper is a groove provided in the optical member support area away from the side surface. The side surface includes a first side surface connected to the upper surface and a second side surface located outside the first side surface and connected to the lower surface,
The method for manufacturing a light emitting device according to claim 1 , wherein the resin stopping portion is provided between the first side surface and the second side surface. The side surface has a third side surface between the first side surface and the second side surface,
The method for manufacturing a light emitting device according to claim 3 , wherein the resin stopping portion includes a recess provided in the third side surface. The method for manufacturing a light-emitting device according to claim 3 or 4, wherein the resin stopper is located closer to the lower surface than the upper surface. The method for manufacturing a light-emitting device according to claim 4, wherein the first side surface constitutes the inner side surface of the recess. The method for manufacturing a light-emitting device according to claim 3 or 4, wherein the first side surface includes a curved surface. The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein the resin stopper surrounds the element arrangement area in a plan view. The step of preparing the intermediate comprises:
a collective substrate preparation step of preparing a collective substrate including at least one substrate portion that will become the substrate after singulation and a frame portion continuous with the substrate portion;
a first irradiation step of scanning and irradiating a laser beam along an outer periphery of an upper surface of the substrate portion of the collective substrate to form the resin stopping portion;
a second irradiation step of scanning and irradiating the laser light along an outer periphery of the upper surface to an outside of the resin stopper portion to separate the substrate portion from the frame portion;
A method for manufacturing the light emitting device according to claim 1 or 2, comprising: The step of preparing the intermediate comprises:
a collective substrate preparation step of preparing a collective substrate including at least one substrate portion that will become the substrate after singulation and a frame portion continuous with the substrate portion;
a first irradiation step of scanning and irradiating a laser beam along an outer periphery of an upper surface of the substrate portion of the collective substrate to form the first side surface;
a second irradiation step of irradiating a laser beam along the first side surface between the first side surface and the frame portion to form the resin stopping portion;
a third irradiation step of irradiating a laser beam along the resin stopper portion between the resin stopper portion and the frame portion to form the second side surface and separate the substrate portion from the collective substrate;
A method for manufacturing the light emitting device according to claim 3 or 4, comprising: A light-emitting element;
a substrate having an upper surface including an element placement region in which the light emitting element is placed and an optical member support region surrounding the element placement region, a lower surface opposite to the upper surface and having lower surface wiring, a first side surface connected to the upper surface, a second side surface connected to the lower surface, and a resin stopper portion disposed between the first side surface and the second side surface;
an optical member including an optical function portion disposed above the element arrangement region and a support portion supporting the optical function portion, the support portion being bonded to the optical member support region via an adhesive member;
The adhesive member covers the optical member support region and the first side surface, and is disposed apart from the lower surface wiring. the substrate has a third side between the first side and the second side,
The light emitting device according to claim 11 , wherein the resin stopper portion is a recess disposed on the third side surface. The light-emitting device according to claim 11 or 12, wherein the resin stopper surrounds the optical member support area in a plan view.

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