JP2024047837A - CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER - Google Patents

Abstract

[Problem] To provide a curable resin composition that is highly developable and capable of producing a cured product having high heat resistance, high elastic modulus, and excellent dielectric properties. [Solution] The curable resin composition contains an active ester resin (A) and a resin (B) having an acid group and a polymerizable unsaturated group, and is characterized in that the active ester resin (A) contains as essential reaction raw materials an aromatic compound (a) having two hydroxyl groups at adjacent positions on an aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof (c). [Selected Figure] None

Description

The present invention relates to a curable resin composition, a cured product, an insulating material, and a resist member.

Conventionally, solder resist has been widely used as a material to prevent solder from adhering to areas other than the mounting area when mounting and soldering electronic components on a printed wiring board, and to form a coating that semi-permanently prevents oxidation and corrosion of wiring. One technique for forming such solder resist patterns is the photoresist method, which can accurately form fine patterns, and among these, the alkaline development type liquid photoresist method is the mainstream, especially due to environmental considerations.

For example, as an alkali-soluble photosensitive resin used in an alkali-developing liquid photoresist method, a reaction product (acid pendant epoxy acrylate) obtained by reacting a novolac epoxy resin with an unsaturated monocarboxylic acid and then adding a polybasic acid anhydride is widely used, and a solder resist film is formed from a curable resin composition containing this alkali-soluble photosensitive resin (see, for example, Patent Document 1).

Japanese Patent Publication No. 1-54390

On the other hand, printed wiring boards are becoming finer, more multi-layered, and more one-board in order to achieve higher density, and the mounting method is also shifting to surface mount technology (SMT). Therefore, there is an increasing demand for finer solder resist films, higher Tg (high heat resistance), higher resolution, and higher precision.
Furthermore, with the demand for smaller and thinner printed wiring boards, there is a demand for solder resist films that exhibit high elasticity.
Furthermore, as transmission signals become faster, high frequencies (gigahertz band) are being used, and from the standpoint of reducing time delays, there is a demand for solder resist films that exhibit low dielectric constants and low dielectric loss tangents.

In response to these demands, conventional curable resin compositions containing alkali-soluble photosensitive resins have insufficient developability, and the cured products obtained by curing the curable resin compositions have poor elastic modulus and dielectric properties, leaving room for improvement.

Therefore, an object of the present invention is to solve the above-mentioned problems of the conventional technology and to provide a curable resin composition which is capable of giving a cured product having high developability, high heat resistance, high elastic modulus, and excellent dielectric properties (low dielectric constant and low dielectric tangent).
Another object of the present invention is to provide a cured product, an insulating material, and a resist member that have high heat resistance, a high elastic modulus, and excellent dielectric properties.

As a result of intensive research to solve the above problems, the present inventors discovered that by blending a specific active ester resin (A) and a resin (B) having an acid group and a polymerizable unsaturated group into a curable resin composition, the developability of the curable resin composition is improved, and the cured product obtained by curing such a curable resin composition has high heat resistance, a high elastic modulus, and excellent dielectric properties, and thus completed the present invention.

That is, the present invention relates to a curable resin composition, a cured product made of the curable resin composition, an insulating material, and a resist member, which contains an active ester resin (A) and a resin (B) having an acid group and a polymerizable unsaturated group, and is characterized in that the active ester resin (A) contains, as essential reaction raw materials, an aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof (c).

According to the present invention, it is possible to provide a curable resin composition which is capable of giving a cured product having high developability, high heat resistance, high elastic modulus, and excellent dielectric properties (low dielectric constant and dielectric tangent).
Furthermore, according to the present invention, it is possible to provide a cured product, an insulating material, and a resist member that have high heat resistance, a high elastic modulus, and excellent dielectric properties.

The curable resin composition, cured product, insulating material, and resist member of the present invention are described in detail below with reference to the embodiments.

(Explanation of terms)
Unless otherwise specified in this specification, the following definitions of terms apply.

In this specification, examples of "alkyl group" include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, tert-pentyl group, neopentyl group, 1,2-dimethylpropyl group, n-hexyl group, isohexyl group, (n-)heptyl group, (n-)octyl group, (n-)nonyl group, (n-)decyl group, (n-)undecyl group, (n-)dodecyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, and cyclononyl group.

In this specification, examples of the "aryl group" include a phenyl group, a naphthyl group, a phenalenyl group, a phenanthrenyl group, an anthryl group, an azulenyl group, an indenyl group, an indanyl group, and a tetralinyl group. In addition, the hydrogen atom of the aromatic ring in the "aryl group" may be substituted with, for example, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom.

In this specification, examples of "aralkyl groups" include benzyl groups, diphenylmethyl groups, biphenyl groups, and naphthylmethyl groups.

In this specification, examples of "alkoxy groups (alkyloxy groups)" include methoxy groups, ethoxy groups, propoxy groups, isopropoxy groups, butoxy groups, pentyloxy groups, hexyloxy groups, 2-ethylhexyloxy groups, octyloxy groups, and nonyloxy groups.

In this specification, examples of "halogen atoms" include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

In this specification, examples of "alkylene group" include methylene group, ethylene group, propylene group, 1-methylmethylene group, 1,1-dimethylmethylene group, 1-methylethylene group, 1,1-dimethylethylene group, 1,2-dimethylethylene group, propylene group, butylene group, 1-methylpropylene group, 2-methylpropylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, undecylene group, dodecylene group, etc.

In this specification, examples of the "monovalent hydrocarbon group" include the above-mentioned alkyl groups, and one or more -CH ₂ - in the alkyl group may be substituted with -O- or -S- so that they are not adjacent to each other, or one or more -CH ₂ -CH ₂ - in the alkyl group may be substituted with -CH═CH- so that they are not adjacent to each other.

As used herein, examples of a "divalent hydrocarbon group" include the above-mentioned alkylene groups, and one or more -CH ₂ - in the alkylene group may be replaced with -O- or -S- so that they are not adjacent to each other, or one or more -CH ₂ -CH ₂ - in the alkylene group may be replaced with -CH═CH- so that they are not adjacent to each other.

In this specification, "(meth)acrylate" means acrylate and/or methacrylate. In addition, in this specification, "(meth)acryloyl" means acryloyl and/or methacryloyl. In addition, in this specification, "(meth)acrylic" means acrylic and/or methacrylic.

<Curable resin composition>
The curable resin composition of the present embodiment contains an active ester resin (A) and a resin (B) having an acid group and a polymerizable unsaturated group. The active ester resin (A) in the curable resin composition of the present embodiment is characterized in that it contains, as essential reaction raw materials, an aromatic compound (a) having two hydroxyl groups at adjacent positions on an aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof (c).

The curable resin composition of the present embodiment contains the resin (B) having an acid group and a polymerizable unsaturated group, and therefore exhibits high photosensitivity and high developability.
The developability is related to the contrast between the exposed and unexposed parts, and "high developability" refers to the contrast being sufficiently high. One of the causes of low developability is that when the curable resin composition applied to the substrate is dried and then exposed to light, the unexposed part remains after (alkali) development due to heating or the like accompanying drying, thereby reducing the contrast. Therefore, in this specification, the developability is evaluated by the drying control width (min), as described in the examples below. The drying control width specifies the range of drying conditions (drying time) in which development defects are unlikely to occur due to coating film drying or the like. Therefore, if development residues are unlikely to occur even if the drying time is extended (i.e., if the drying control width is large), it is considered that high developability is exhibited.

In addition, in the curable resin composition of this embodiment, by using an active ester resin (A) made of an aromatic compound (a) having two hydroxyl groups at adjacent positions on an aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or its acid halide or ester (c) as reaction raw materials, the heat resistance is high, the elastic modulus is moderately high, the dielectric constant and dielectric tangent are reduced, and the dielectric characteristics are improved. The reason why such characteristics are obtained is not necessarily clear, but by using an aromatic compound (a) (e.g., catechol) having two hydroxyl groups at adjacent positions on the aromatic ring as a raw material for the active ester, ester groups based on the two hydroxyl groups of the aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring are formed at adjacent positions on the aromatic ring (e.g., benzene ring), and the crosslinking points of the cured product are adjacent, and the molecular motion is inhibited by the steric hindrance, resulting in high heat resistance and high elastic modulus.

(Active Ester Resin (A))
The curable resin composition of the present embodiment contains an active ester resin (A). The active ester resin (A) is
Aromatic compounds (a) having two hydroxyl groups at adjacent positions on the aromatic ring;
(b) an aromatic monohydroxy compound, and (c) an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof.
are essential reaction raw materials.

[Aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring]
The activated ester of the present invention is characterized in that it is obtained by reacting an aromatic compound (a) having two hydroxyl groups at adjacent positions on an aromatic ring (hereinafter, sometimes referred to as "aromatic compound (a)"). Note that the "two hydroxyl groups at adjacent positions on an aromatic ring" means "two hydroxyl groups bonded to two adjacent carbon atoms on an aromatic ring".

In addition, in the active ester of the present invention, it is preferable that the aromatic compound (a) is at least one compound selected from the group consisting of the following general formulas (1) to (3). Since the hydroxyl groups in the compound are adjacent to each other on the aromatic ring, the ester groups contained in the obtained active ester are also adjacent to each other, and the crosslinking points of the cured product obtained using the active ester are adjacent to each other, and the steric hindrance inhibits molecular motion, which is preferable, thereby enabling the development of high heat resistance and high elastic modulus.

In the above formulas (1) to (3), each R is preferably independently a hydrocarbon group having 1 to 10 carbon atoms, and examples of the hydrocarbon group include a methyl group, an ethyl group, a propyl group, a butyl group, an allyl group, and a benzyl group. From the viewpoint of high heat resistance and a low dielectric tangent, it is preferable that the R is unsubstituted, and from the viewpoint of a low dielectric constant, it is preferable that the R is a butyl group.

In the above formulas (1) to (3), n is preferably an integer from 0 to 4, and more preferably an integer from 0 to 1. Having n within the above range is preferable because it results in high heat resistance, low dielectric tangent, and low dielectric constant.

In the above formulas (1) to (3), m is preferably an integer of 0 to 2, and more preferably an integer of 0 to 1. Having m within the above range is preferable because it results in high heat resistance, low dielectric tangent, and low dielectric constant.

In addition, it is preferable to use a compound containing a catechol skeleton (catechol compound) as the aromatic compound (a), and more preferably, a catechol compound such as catechol or tertiary butyl catechol. The resulting cured product is preferable because it has high heat resistance, low dielectric properties (low dielectric constant, low dielectric tangent), and high elastic modulus. By introducing a catechol skeleton based on the aromatic compound (a) into the active ester, the ester groups in the active ester form a structure adjacent to each other on the same aromatic ring, which increases steric hindrance and suppresses molecular motion compared to conventional designs, and the resulting cured product has low dielectric properties (low dielectric constant, low dielectric tangent) and can have a high elastic modulus.

The catechol is a dihydroxybenzene having hydroxyl groups at the 1st and 2nd positions, and may be a catechol compound having an alkyl group such as a methyl group as a substituent on the aromatic ring of the catechol.

In addition, from the viewpoint of imparting high heat resistance, it is preferable to use a catechol compound that does not have a substituent on the aromatic ring (for example, catechol). In addition, from the viewpoint of low dielectric properties, it is preferable to use a catechol compound in which the alkyl group has 4 to 10 carbon atoms, such as catechol having a tertiary butyl group (tertiary butyl catechol). If the number of carbon atoms is 4 or more, the low dielectric properties can be sufficiently obtained, and if the number of carbon atoms is 10 or less, it is preferable because a decrease in reactivity during the synthesis of active ester due to steric hindrance can be prevented.

The aromatic compound (a) may be used alone or in combination with multiple compounds having different positions of alkyl groups such as methyl groups.

[Aromatic monohydroxy compound (b)]
The present invention is characterized in that the active ester is obtained by reacting an aromatic monohydroxy compound (b). By using the aromatic monohydroxy compound (b), the aromatic monohydroxy compound (b) acts as an end-capping agent during the synthesis of the active ester, thereby controlling the molecular weight distribution and optimizing the viscosity of the active ester.

The aromatic monohydroxy compound (b) is not particularly limited, but examples thereof include alkylphenols such as phenol, o-cresol, m-cresol, p-cresol, 2,4-xylenol, 2,6-xylenol, and tertiary butylphenol; aralkylphenols such as o-phenylphenol, p-phenylphenol, 2-benzylphenol, 4-benzylphenol, styrenated phenol, and 4-(α-cumyl)phenol; and naphthol compounds such as α-naphthol (1-naphthol) and β-naphthol (2-naphthol). These may be used alone or in combination of two or more kinds. Among these, tertiary butylphenol and α-naphthol are preferred because they give a cured product with excellent heat resistance and dielectric properties (low dielectric properties).

[Aromatic compound having two or more carboxyl groups and/or its acid halide or ester (c)]
The present invention is characterized in that it is obtained by reacting an aromatic compound having two or more carboxyl groups and/or its acid halide or ester (c) (hereinafter, sometimes referred to as "aromatic compound (c)"). By using the aromatic compound (c), a cured product having excellent heat resistance can be obtained, which is preferable.

The aromatic compound (c) is not particularly limited, but examples thereof include compounds having two or more carboxyl groups on a substituted or unsubstituted aromatic ring. The term "carboxyl group" refers to a carboxyl group; a halogenated acyl group such as an acyl fluoride group, an acyl chloride group, or an acyl bromide group; an alkyloxycarbonyl group such as a methyloxycarbonyl group or an ethyloxycarbonyl group; and an aryloxycarbonyl group such as a phenyloxycarbonyl group or a naphthyloxycarbonyl group. When the aromatic compound has a halogenated acyl group, the aromatic compound is an acid halide, and when the aromatic compound has an alkyloxycarbonyl group or an aryloxycarbonyl group, the aromatic compound can be an ester. Of these, the aromatic compound preferably has a carboxyl group, a halogenated acyl group, or an aryloxycarbonyl group, more preferably has a carboxyl group or a halogenated acyl group, and even more preferably has a carboxyl group, an acyl chloride group, or an acyl bromide group.

The aromatic ring is not particularly limited, but examples thereof include a monocyclic aromatic ring, a condensed aromatic ring, an aromatic ring consisting of a ring assembly, and an aromatic ring connected by an alkylene chain.

Examples of the aromatic compounds (c) include, but are not limited to, benzene dicarboxylic acids such as isophthalic acid, terephthalic acid, 5-allyl isophthalic acid, and 2-allyl terephthalic acid; benzene tricarboxylic acids such as trimellitic acid and 5-allyl trimellitic acid; naphthalene dicarboxylic acids such as naphthalene-1,4-dicarboxylic acid, naphthalene-1,5-dicarboxylic acid, naphthalene-2,3-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, 3-allylnaphthalene-1,4-dicarboxylic acid, and 3,7-diallylnaphthalene-1,4-dicarboxylic acid; pyridine tricarboxylic acids such as 2,4,5-pyridine tricarboxylic acid; triazine carboxylic acids such as 1,3,5-triazine-2,4,6-tricarboxylic acid; and acid halides and esters thereof. Of these, benzenedicarboxylic acid and benzenetricarboxylic acid are preferred, isophthalic acid, terephthalic acid, isophthalic acid chloride, terephthalic acid chloride, 1,3,5-benzenetricarboxylic acid, and 1,3,5-benzenetricarbonyl trichloride are more preferred, and bis(chlorocarbonyl)benzenes such as isophthalic acid chloride and terephthalic acid chloride, and 1,3,5-benzenetricarbonyl trichloride are even more preferred.

Among the above, from the viewpoints of the heat resistance and dielectric properties of the resulting cured product, ease of industrial availability of raw materials, and workability, aromatic compounds having a monocyclic aromatic ring, aromatic compounds having a condensed aromatic ring, etc. are preferred, benzenedicarboxylic acid, benzenetricarboxylic acid, naphthalenedicarboxylic acid, and acid halides thereof are preferred, benzenedicarboxylic acid, naphthalenedicarboxylic acid, and acid halides thereof are more preferred, and isophthalic acid, terephthalic acid, naphthalene-1,5-dicarboxylic acid, naphthalene-2,3-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, 1,3,5-benzenetricarboxylic acid, and acid halides thereof are even more preferred. The above-mentioned aromatic compounds (c) may be used alone or in combination of two or more.

As described above, the active ester resin (A) used in the present invention contains, as essential reaction raw materials, an aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof (c). However, as an optional reaction raw material, an aromatic compound having multiple hydroxyl groups on the aromatic ring (excluding the aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring) may also be used. Examples of aromatic compounds having multiple hydroxyl groups on the aromatic ring include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol AD, bisphenol Z, tetrabromobisphenol A, dihydroxydiphenyl ether, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, polyhydroxynaphthylene ether, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinone, and benzenetriol. These compounds may be used alone or in combination of two or more.

The active ester of the present invention functions as a curing agent for epoxy resins and the like, and can impart high heat resistance, low dielectric properties (low dielectric constant, low dielectric tangent), and high elastic modulus to the cured product obtained by using the active ester, which is a preferred embodiment.

By using the active ester of the present invention, a cured product having low dielectric properties, high heat resistance, and high elastic modulus can be obtained, which is a preferred embodiment. The reason for this is not necessarily clear, but by introducing a catechol skeleton based on the aromatic compound (a) into the active ester, the ester groups in the active ester form a structure adjacent to each other on the same aromatic ring, which increases steric hindrance compared to conventional designs and suppresses molecular motion, resulting in a cured product with low dielectric properties (low dielectric constant, low dielectric tangent) and a high elastic modulus.

From the viewpoint of providing a better balance between the handleability when preparing the curable resin composition described below and the heat resistance and dielectric properties of the cured product, the softening point of the active ester is preferably 200°C or less, more preferably 180°C or less, even more preferably 160°C or less, and particularly preferably 140°C or less.

The reaction between the aromatic compound (a), the aromatic monohydroxy compound (b), and the aromatic compound (c) (hereinafter sometimes referred to as "raw material compound") is not particularly limited, but for example, the aromatic compound (a) and the aromatic monohydroxy compound (b) are mixed and dissolved, and then the aromatic compound (c) is mixed and dissolved, and the reaction can be carried out in the presence of an alkali catalyst at a temperature of 60°C or less for a reaction time of 1 to 24 hours. Examples of the alkali catalyst that can be used here include sodium hydroxide, potassium hydroxide, triethylamine, pyridine, etc. These may be used alone or in combination of two or more. Among these, sodium hydroxide or potassium hydroxide is preferred because of its high reaction efficiency. These catalysts may be used as an aqueous solution of 3 to 30% by mass. In addition, in order to increase the reaction efficiency, a phase transfer catalyst may be used at this time. Examples include alkyl ammonium salts, crown ethers, etc. These may be used alone or in combination of two or more.

The above reaction is preferably carried out in an organic solvent, since this makes it easier to control the reaction. Examples of the organic solvent used here include hydrocarbon solvents such as pentane and hexane, ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone, ether solvents such as diethyl ether and tetrahydrofuran, acetate ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate, carbitol solvents such as cellosolve and butyl carbitol, aromatic hydrocarbon solvents such as toluene and xylene, dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. These may be used alone or in the form of a mixed solvent of two or more of them.

The reaction ratio of the raw material compounds can be changed as appropriate depending on the desired molecular design, but from the viewpoint of reducing excess reaction raw materials while reducing unreacted ends, the aromatic compound (a) is preferably in the range of 0.5 to 5 moles per mole of the aromatic monohydroxy compound (b), more preferably 1 to 4 moles, and even more preferably 2 to 3 moles. Also, the aromatic compound (c) is preferably in the range of 0.5 to 5 moles per mole of the aromatic monohydroxy compound (b), more preferably 1 to 4 moles, and even more preferably 2 to 3 moles.

After the reaction is complete, if an aqueous solution is used in the presence of an alkaline catalyst, the reaction solution is allowed to stand and separated to remove the aqueous layer, and the remaining organic layer is washed with water. This washing is repeated until the aqueous layer becomes nearly neutral (pH of about 7), thereby reducing the content of inorganic salts that adversely affect the insulating properties, and the activated ester of the present invention can be obtained. After the reaction is complete, the raw material compound is dried under heating and reduced pressure to remove excess raw material compounds, and a high-purity activated ester can be obtained.

When the total number of aromatic ester groups in the active ester structure is taken as the number of functional groups of the active ester, the functional group equivalent of the active ester of the present invention is preferably in the range of 100 to 500 g/equivalent, more preferably in the range of 110 to 400 g/equivalent, and even more preferably in the range of 120 to 300 g/equivalent, since a cured product having excellent curability and low dielectric constant and dielectric tangent (low dielectric properties) can be obtained.

The number average molecular weight (Mn) of the active ester of the present invention is preferably 500 to 3000, and more preferably 600 to 2000. A number average molecular weight (Mn) of 500 or more is preferable because it provides excellent dielectric properties and heat resistance. On the other hand, a number average molecular weight (Mn) of 3000 or less is preferable because it provides excellent moldability.

--Content--
The content of the active ester resin (A) in the total amount (100 mass%) of the curable resin composition of the present embodiment, in terms of solids (non-volatile content), from the viewpoint of improving the developability and dielectric properties in a well-balanced manner while increasing the elastic modulus, is preferably 3 mass% or more, more preferably 5 mass% or more, and even more preferably 10 mass% or more, and is preferably 80 mass% or less, more preferably 60 mass% or less, and even more preferably 40 mass% or less.

(Resin (B) Having an Acid Group and a Polymerizable Unsaturated Group)
The curable resin composition of the present embodiment contains a resin (B) having an acid group and a polymerizable unsaturated group. The resin (B) may have an acid group and a polymerizable unsaturated group, and other specific structures, molecular weights, etc. are not particularly limited, and a wide variety of resins can be used.

Examples of the acid group contained in the resin (B) include a carboxyl group, a sulfonic acid group, and a phosphoric acid group. Among these, a carboxyl group is preferred as the acid group because it exhibits excellent alkaline developability.

Examples of the polymerizable unsaturated groups contained in the resin (B) include (meth)acryloyl groups, allyl groups, isopropenyl groups, 1-propenyl groups, styryl groups, styrylmethyl groups, maleimide groups, and vinyl ether groups.

The resin (B) having an acid group and a polymerizable unsaturated group may, for example, be the following [1] to [6]:
[1] an epoxy resin (B1) having an acid group and a polymerizable unsaturated group;
[2] Urethane resin having an acid group and a polymerizable unsaturated group (B2)
[3] an acrylic resin (B3) having an acid group and a polymerizable unsaturated group;
[4] Amide-imide resin (B4) having an acid group and a polymerizable unsaturated group,
[5] Acrylamide resin (B5) having an acid group and a polymerizable unsaturated group,
[6] Ester resin (B6) having an acid group and a polymerizable unsaturated group,
etc.
Among these, the epoxy resin (B1) having an acid group and a polymerizable unsaturated group, the acrylic resin (B3) having an acid group and a polymerizable unsaturated group, the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group, the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group, and the ester resin (B6) having an acid group and a polymerizable unsaturated group are preferred, the epoxy resin (B1) having an acid group and a polymerizable unsaturated group, and the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group are more preferred, and a combination of the active ester resin (A) with the epoxy resin (B1) having an acid group and a polymerizable unsaturated group and/or the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group is particularly preferred in terms of achieving the effects of the present invention.

--Epoxy resin having an acid group and a polymerizable unsaturated group (B1)--
Examples of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group include an epoxy (meth)acrylate resin having an acid group, which has an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), and a polybasic acid anhydride (b1-3) as essential reaction raw materials; and an epoxy (meth)acrylate resin having an acid group and a urethane bond, which has an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), a polybasic acid anhydride (b1-3), a polyisocyanate compound (b1-4), and a (meth)acrylate compound (b1-5) having a hydroxyl group as reaction raw materials.

The specific structure of the epoxy resin (b1-1) is not particularly limited as long as it has a plurality of epoxy groups in the resin. Examples of the epoxy resin (b1-1) include bisphenol type epoxy resin, hydrogenated bisphenol type epoxy resin, biphenol type epoxy resin, hydrogenated biphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol novolac type epoxy resin, naphthol novolac type epoxy resin, naphthol-phenol co-condensed novolac type epoxy resin, naphthol-cresol co-condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, dihydroxybenzene type epoxy resin, trihydroxybenzene type epoxy resin, oxazolidone type epoxy resin, etc. The epoxy resin (b1-1) may be used alone or in combination of two or more.

Examples of the bisphenol type epoxy resin include bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin.
Examples of the hydrogenated bisphenol type epoxy resin include hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol B type epoxy resin, hydrogenated bisphenol E type epoxy resin, hydrogenated bisphenol F type epoxy resin, and hydrogenated bisphenol S type epoxy resin.
Examples of the biphenol type epoxy resin include 4,4'-biphenol type epoxy resin, 2,2'-biphenol type epoxy resin, tetramethyl-4,4'-biphenol type epoxy resin, and tetramethyl-2,2'-biphenol type epoxy resin.
Examples of the hydrogenated biphenol type epoxy resin include hydrogenated 4,4'-biphenol type epoxy resin, hydrogenated 2,2'-biphenol type epoxy resin, hydrogenated tetramethyl-4,4'-biphenol type epoxy resin, and hydrogenated tetramethyl-2,2'-biphenol type epoxy resin.

Examples of the unsaturated monobasic acid (b1-2) include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, α-cyanocinnamic acid, β-styrylacrylic acid, and β-furfurylacrylic acid. Acid halides and esters of the unsaturated monobasic acids can also be used. Furthermore, examples of the unsaturated monobasic acid (b1-2) include those represented by the following general formula (4):

［上記一般式（４）中、Ｘ^４１は、炭素数１～１０のアルキレン鎖、ポリオキシアルキレン鎖、（ポリ）エステル鎖、芳香族炭化水素鎖、又は（ポリ）カーボネート鎖を表し、Ｘ^４１の構造中の水素原子がハロゲン原子又はアルコキシ基に置換されてもよく、Ｙ^４１は、水素原子又はメチル基である。］で表される化合物等を用いることもできる。上記一般式（４）で表される化合物の分子量は、１００～５００の範囲が好ましく、１５０～４００の範囲がより好ましい。前記不飽和一塩基酸（ｂ１－２）は、１種単独で用いてもよく、２種以上を組み合わせて用いてもよい。

[In the above general formula (4), X ⁴¹ represents an alkylene chain, polyoxyalkylene chain, (poly)ester chain, aromatic hydrocarbon chain, or (poly)carbonate chain having 1 to 10 carbon atoms, a hydrogen atom in the structure of X ⁴¹ may be substituted with a halogen atom or an alkoxy group, and Y ⁴¹ represents a hydrogen atom or a methyl group.] and the like can also be used. The molecular weight of the compound represented by the above general formula (4) is preferably in the range of 100 to 500, more preferably in the range of 150 to 400. The unsaturated monobasic acid (b1-2) may be used alone or in combination of two or more.

Examples of the polyoxyalkylene chain include a polyoxyethylene chain and a polyoxypropylene chain.
The (poly)ester chain may be, for example, a compound represented by the following general formula (5):

［上記一般式（５）中、Ｒ^５１及びＲ^５２は、炭素原子数１～１０のアルキレン基を表し、ｎ^５１は１～５の整数を表す。］で表される（ポリ）エステル鎖が挙げられる。
前記芳香族炭化水素鎖としては、例えば、フェニレン鎖、ナフチレン鎖、ビフェニレン鎖、フェニルナフチレン鎖又はビナフチレン鎖等が挙げられる。また、部分構造として、ベンゼン環、ナフタレン環、アントラセン環、フェナントレン環等の芳香環を有する炭化水素鎖も用いることができる。
前記（ポリ）カーボネート鎖としては、例えば、下記一般式（６）：

In the above general formula (5), R ⁵¹ and R ⁵² each represent an alkylene group having 1 to 10 carbon atoms, and n ⁵¹ represents an integer of 1 to 5.
Examples of the aromatic hydrocarbon chain include a phenylene chain, a naphthylene chain, a biphenylene chain, a phenylnaphthylene chain, a binaphthylene chain, etc. In addition, a hydrocarbon chain having an aromatic ring such as a benzene ring, a naphthalene ring, an anthracene ring, or a phenanthrene ring as a partial structure can also be used.
The (poly)carbonate chain may be, for example, a compound represented by the following general formula (6):

［上記一般式（６）中、Ｒ^６１は、炭素原子数１～１０のアルキレン基を表し、ｎ^６１は１～５の整数を表す。］で表される（ポリ）カーボネート鎖が挙げられる。

In the above general formula (6), R ⁶¹ represents an alkylene group having 1 to 10 carbon atoms, and n ⁶¹ represents an integer of 1 to 5.

Examples of the polybasic acid anhydride (b1-3) include aliphatic polybasic acid anhydrides, alicyclic polybasic acid anhydrides, aromatic polybasic acid anhydrides, acid halides of aliphatic polybasic acid anhydrides, acid halides of alicyclic polybasic acid anhydrides, and acid halides of aromatic polybasic acid anhydrides.

Examples of the aliphatic polybasic acid anhydride include anhydrides of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, etc. In addition, the aliphatic polybasic acid anhydride may have an aliphatic hydrocarbon group of either a straight-chain type or a branched type, and may have an unsaturated bond in the structure.
In the present specification, the alicyclic polybasic acid anhydride refers to an acid anhydride having an acid anhydride group bonded to an alicyclic structure, and the presence or absence of an aromatic ring in other structural portions is not important. Examples of the alicyclic polybasic acid anhydride include an acid anhydride of tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane-2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, and 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid.
Examples of the aromatic polybasic acid anhydride include anhydrides of phthalic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalene tricarboxylic acid, naphthalene tetracarboxylic acid, biphenyl dicarboxylic acid, biphenyl tricarboxylic acid, biphenyl tetracarboxylic acid, and benzophenone tetracarboxylic acid.

The polybasic acid anhydride (b1-3) may be used alone or in combination of two or more. Among these, tetrahydrophthalic anhydride, succinic anhydride, and cyclohexanedicarboxylic anhydride are preferred from the viewpoint of more effectively improving photosensitivity, developability, and adhesion.

Examples of the polyisocyanate compound (b1-4) include aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; alicyclic diisocyanate compounds such as norbornane diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, and hydrogenated diphenylmethane diisocyanate; aromatic diisocyanate compounds such as tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-diisocyanato-3,3'-dimethylbiphenyl, and o-tolidine diisocyanate; and compounds represented by the following general formula (7):

［上記一般式（７）中、Ｒ^７２及びＲ^７３はそれぞれ独立して、水素原子又は炭素原子数１～６の一価の炭化水素基のいずれかを表し、Ｒ^７１はそれぞれ独立して、炭素原子数１～４のアルキル基を表し、ｋ^７１は０又は１～３の整数であり、ｎ^７１は１以上の整数である。］で表される繰返し構造を有するポリメチレンポリフェニルポリイソシアネート；これらのイソシアヌレート変性体、ビウレット変性体、アロファネート変性体等が挙げられる。前記ポリイソシアネート化合物（ｂ１－４）は、１種単独で用いてもよく、２種以上を組み合わせて用いてもよい。

[In the above general formula (7), R ⁷² and R ⁷³ each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, R ⁷¹ each independently represent an alkyl group having 1 to 4 carbon atoms, k ⁷¹ is 0 or an integer of 1 to 3, and n ⁷¹ is an integer of 1 or more.]; isocyanurate modified products, biuret modified products, allophanate modified products, etc. of these. The polyisocyanate compound (b1-4) may be used alone or in combination of two or more.

Examples of the (meth)acrylate compound (b1-5) having a hydroxyl group include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, trimethylolpropane (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol (meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane (meth)acrylate, ditrimethylolpropane di(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, etc. In addition, (poly)oxyalkylene modified compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain is introduced into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds, and lactone modified compounds in which a (poly)lactone structure is introduced into the molecular structure of the various hydroxyl group-containing (meth)acrylate compounds can also be used. Among these, compounds having a molecular weight of 1,000 or less are preferred from the viewpoint of more effectively improving photosensitivity, developability, and adhesion. In addition, when the hydroxyl group-containing (meth)acrylate compound (b1-5) is an oxyalkylene modified compound or a lactone modified compound, it is preferred that the weight average molecular weight (Mw) is 1,000 or less. The hydroxyl group-containing (meth)acrylate compound (b1-5) may be used alone or in combination of two or more.

The method for producing the epoxy resin (B1) having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used, but it is preferable to use epoxy resin (b1-1), unsaturated monobasic acid (b1-2), and polybasic acid anhydride (b1-3) as essential reaction raw materials, or to use epoxy resin (b1-1), unsaturated monobasic acid (b1-2), polybasic acid anhydride (b1-3), polyisocyanate compound (b1-4), and (meth)acrylate compound (b1-5) having a hydroxyl group as reaction raw materials. Here, the epoxy resin (B1) may be produced by a method in which all of the reaction raw materials are reacted at once, or may be produced by a method in which the reaction raw materials are reacted sequentially. Among them, the method in which the epoxy resin (b1-1) is reacted with the unsaturated monobasic acid (b1-2) first, and then the polybasic acid anhydride (b1-3) is reacted is preferable because it is easy to control the reaction. The reaction can be carried out, for example, by reacting the epoxy resin (b1-1) with the unsaturated monobasic acid (b1-2) in the presence of a basic catalyst at a temperature range of 100 to 150° C., then adding the polybasic acid anhydride (b1-3) to the reaction system and reacting at a temperature range of 80 to 140° C. The production of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent as necessary, and a basic catalyst may be used as necessary.

The reaction ratio of the epoxy resin (b1-1) and the unsaturated monobasic acid (b1-2) is preferably in the range of 0.9 to 1.1 moles of the unsaturated monobasic acid (b1-2) per mole of epoxy groups in the epoxy resin (b1-1). The reaction ratio of the polybasic acid anhydride (b1-3) is preferably in the range of 0.2 to 1.0 moles per mole of epoxy groups in the epoxy resin (b1-1).

Examples of the organic solvent include hydrocarbon solvents such as toluene, xylene, heptane, hexane, and mineral spirits; ketone solvents such as methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, cyclohexanone, and dimethylacetamide; cyclic ether solvents such as tetrahydrofuran and dioxolane; ester solvents such as methyl acetate, ethyl acetate, and butyl acetate; aromatic solvents such as toluene, xylene, and solvent naphtha; alicyclic solvents such as cyclohexane and methylcyclohexane; carbitol, cellosolve, methanol, ethanol, propanol, isopropanol, butanol, and cyclohexanol. Examples of the organic solvent include alcohol solvents such as propylene glycol monomethyl ether, propyl ether, methyl cellosolve, cellosolve, butyl cellosolve, methyl carbitol, and other ether solvents, glycol ether solvents such as alkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether acetate, and other vegetable oils and fats such as soybean oil, linseed oil, rapeseed oil, safflower oil, and other vegetable oils and fats, methoxypropanol, cyclohexanone, methyl cellosolve, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, and the like. These organic solvents may be used alone or in combination of two or more.
In addition, commercially available products can also be used as the organic solvent. Examples of commercially available products include "No. 1 Spindle Oil", "No. 3 Solvent", "No. 4 Solvent", "No. 5 Solvent", "No. 6 Solvent", "Naphthesol H", "Alkene 56NT", "AF Solvent No. 4", "AF Solvent No. 5", "AF Solvent No. 6", and "AF Solvent No. 7" manufactured by ENEOS Corporation; "Diadol 13" and "Dialen 168" manufactured by Mitsubishi Chemical Corporation; "F Oxocol" and "F Oxocol 180" manufactured by Nissan Chemical Industries, Ltd.; "Supersol LA35" and "Supersol LA38" manufactured by Idemitsu Kosan Co., Ltd.; and "Supersol LA35" and "Supersol LA38" manufactured by ExxonMobil. Examples of such products include Exxor D80, Exxor D110, Exxor D120, Exxor D130, Exxor D160, Exxor D100K, Exxor D120K, Exxor D130K, Exxor D280, Exxor D300, and Exxor D320 manufactured by Exxor Chemical Co., Ltd.
The amount of the organic solvent used is preferably within the range of about 0.1 to 5 times the total mass of the reaction raw materials, since this improves the reaction efficiency.

Examples of the basic catalyst include N-methylmorpholine, pyridine, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), 1,4-diazabicyclo[2.2.2]octane (DABCO), tri-n-butylamine or dimethylbenzylamine, butylamine, octylamine, monoethanolamine, diethanolamine, triethanolamine, imidazole, 1-methylimidazole, 2,4-dimethylimidazole, 1,4-diethylimidazole, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(N-phenyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropylmethyldimethoxysilane, and amine compounds such as tetramethylammonium hydroxide; trioctylmethylammonium chloride, tri Examples of the quaternary ammonium salts include octylmethylammonium acetate; phosphines such as trimethylphosphine, tributylphosphine, and triphenylphosphine; phosphonium salts such as tetramethylphosphonium chloride, tetraethylphosphonium chloride, tetrapropylphosphonium chloride, tetrabutylphosphonium chloride, tetrabutylphosphonium bromide, trimethyl(2-hydroxypropyl)phosphonium chloride, triphenylphosphonium chloride, and benzylphosphonium chloride; organic tin compounds such as dibutyltin dilaurate, octyltin trilaurate, octyltin diacetate, dioctyltin diacetate, dioctyltin dineodecanoate, dibutyltin diacetate, tin octylate, and 1,1,3,3-tetrabutyl-1,3-dodecanoyldistannoxane; organic metal compounds such as zinc octylate and bismuth octylate; inorganic tin compounds such as tin octanoate; and inorganic metal compounds. In addition, alkaline earth metal hydroxides, alkali metal carbonates, and alkali metal hydroxides can also be used. The basic catalyst may be used alone or in combination of two or more kinds.
The amount of the basic catalyst added is preferably within a range of 0.001 to 5 parts by mass per 100 parts by mass of the total of the reaction raw materials.

The acid value of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group is preferably in the range of 30 to 150 mgKOH/g, more preferably in the range of 40 to 120 mgKOH/g, from the viewpoint of more effectively improving photosensitivity, developability, and adhesion. In this specification, the acid value of the resin (B) having an acid group and a polymerizable unsaturated group is a value measured by the neutralization titration method of JIS 0070 (1992).

--Urethane resin having an acid group and a polymerizable unsaturated group (B2)--
Examples of the urethane resin (B2) having an acid group and a polymerizable unsaturated group include a resin obtained by reacting a polyisocyanate compound (b1-4), a hydroxyl group-containing (meth)acrylate compound (b1-5), a carboxyl group-containing polyol compound (b2-1), and, if necessary, a polybasic acid anhydride (b1-3) and a polyol compound (b2-2) other than the carboxyl group-containing polyol compound (b2-1); ) acrylate compound (b1-5) with a polybasic acid anhydride (b1-3) and, if necessary, with a polyol compound (b2-2) other than the carboxyl group-containing polyol compound (b2-1); or a resin obtained by reacting an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), a polybasic acid anhydride (b1-3), a polyisocyanate compound (b1-4) and a hydroxyl group-containing (meth)acrylate compound (b1-5).

Examples of the carboxyl group-containing polyol compound (b2-1) include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, and 2,2-dimethylolvaleric acid. The carboxyl group-containing polyol compound can be used alone or in combination of two or more kinds.

Examples of the polyol compound (b2-2) other than the carboxyl group-containing polyol compound (b2-1) include aliphatic polyol compounds such as ethylene glycol, propylene glycol, butanediol, hexanediol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol; aromatic polyol compounds such as biphenol and bisphenol; (poly)oxyalkylene modified products in which (poly)oxyalkylene chains such as (poly)oxyethylene chains, (poly)oxypropylene chains, and (poly)oxytetramethylene chains are introduced into the molecular structure of the various polyol compounds; lactone modified products in which (poly)lactone structures are introduced into the molecular structure of the various polyol compounds. The polyol compounds other than the carboxyl group-containing polyol compounds can be used alone or in combination of two or more.

The method for producing the urethane resin (B2) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the urethane resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent as necessary, and a basic catalyst may be used as necessary.

As the organic solvent, the same organic solvents as those described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the organic solvents can be used alone or in combination of two or more kinds.
As the basic catalyst, the same basic catalyst as described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the basic catalyst can be used alone or in combination of two or more kinds.

--Acrylic resin having an acid group and a polymerizable unsaturated group (B3)--
Examples of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group include a reaction product obtained by polymerizing an acrylic resin intermediate obtained by polymerizing, as an essential component, a (meth)acrylate compound (α) having a reactive functional group such as a hydroxyl group, a carboxyl group, an isocyanate group, or a glycidyl group, and then reacting the resulting acrylic resin intermediate with a (meth)acrylate compound (β) having a reactive functional group capable of reacting with the functional group, thereby introducing a (meth)acryloyl group; and a resin obtained by reacting a polybasic acid anhydride (b1-3) with a hydroxyl group in the reaction product.

The acrylic resin intermediate may be a copolymer of the (meth)acrylate compound (α) and other polymerizable unsaturated group-containing compounds as necessary. Examples of the other polymerizable unsaturated group-containing compounds include (meth)acrylic acid alkyl esters such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; alicyclic structure-containing (meth)acrylates such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, and dicyclopentanyl (meth)acrylate; aromatic ring-containing (meth)acrylates such as phenyl (meth)acrylate, benzyl (meth)acrylate, and phenoxyethyl acrylate; silyl group-containing (meth)acrylates such as 3-methacryloxypropyltrimethoxysilane; and styrene derivatives such as styrene, α-methylstyrene, and chlorostyrene. The other polymerizable unsaturated group-containing compounds may be used alone or in combination of two or more.

The (meth)acrylate compound (β) is not particularly limited as long as it can react with the reactive functional group of the (meth)acrylate compound (α), but the following combinations are preferable from the viewpoint of reactivity. That is, when a hydroxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use an isocyanate group-containing (meth)acrylate as the (meth)acrylate compound (β). When a carboxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a glycidyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When an isocyanate group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a hydroxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When a glycidyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a carboxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). The (meth)acrylate compound (β) can be used alone or in combination of two or more kinds.

The method for producing the acrylic resin (B3) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent as necessary, and a basic catalyst may be used as necessary.

As the organic solvent, the same organic solvents as those described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the organic solvents can be used alone or in combination of two or more kinds.
As the basic catalyst, the same basic catalyst as described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the basic catalyst can be used alone or in combination of two or more kinds.

The acid value of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group is preferably in the range of 30 to 150 mgKOH/g, more preferably in the range of 40 to 120 mgKOH/g, from the viewpoint of more effectively improving photosensitivity, developability, and adhesion.

--Amide-imide resin having an acid group and a polymerizable unsaturated group (B4)--
Examples of the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group include those obtained by reacting an amide-imide resin (b4-1) having an acid group and/or an acid anhydride group with a (meth)acrylate compound (b1-5) having a hydroxyl group and/or a (meth)acrylate compound (b4-2) having an epoxy group, and, if necessary, a compound having one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxyl group, an isocyanate group, a glycidyl group, and an acid anhydride group. The compound having a reactive functional group may or may not have a (meth)acryloyl group.

The amide-imide resin (b4-1) having an acid group and/or an acid anhydride group may have only an acid group or an acid anhydride group, or may have both. From the viewpoint of reactivity and reaction control with a (meth)acrylate compound (b1-5) having a hydroxyl group or an epoxy compound having a (meth)acryloyl group, the amide-imide resin (b4-1) preferably has an acid anhydride group, and more preferably has both an acid group and an acid anhydride group. The solid content acid value of the amide-imide resin (b4-1) is preferably in the range of 60 to 350 mg KOH/g measured under neutral conditions, i.e., conditions in which the acid anhydride group is not ring-opened. On the other hand, it is preferably in the range of 61 to 360 mg KOH/g measured under conditions in which the acid anhydride group is ring-opened, such as in the presence of water.

The amide-imide resin (b4-1) can be, for example, one obtained by reacting a polyisocyanate compound (b1-4) with a polybasic acid anhydride (b1-3) as reaction raw materials. In addition, the amide-imide resin (b4-1) can also be produced by using a polybasic acid as a reaction raw material in addition to the polyisocyanate compound (b1-4) and the polybasic acid anhydride (b1-3), if necessary.

As the polybasic acid, any compound having two or more carboxyl groups in one molecule can be used. For example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane-2,3 -dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalene tricarboxylic acid, naphthalene tetracarboxylic acid, biphenyl dicarboxylic acid, biphenyl tricarboxylic acid, biphenyl tetracarboxylic acid, benzophenone tetracarboxylic acid, etc. In addition, as the polybasic acid, for example, a copolymer of a conjugated diene vinyl monomer and acrylonitrile, which has a carboxyl group in the molecule, can also be used. The polybasic acid can be used alone or in combination of two or more kinds.

The (meth)acrylate compound (b4-2) having an epoxy group is not particularly limited in its specific structure as long as it has a (meth)acryloyl group and an epoxy group in its molecular structure, and a wide variety of compounds can be used. For example, glycidyl group-containing (meth)acrylate monomers such as glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, and epoxycyclohexylmethyl (meth)acrylate, and mono(meth)acrylates of diglycidyl ether compounds such as hydroxybenzene diglycidyl ether, dihydroxynaphthalene diglycidyl ether, biphenol diglycidyl ether, and bisphenol diglycidyl ether can be used. The (meth)acrylate compound having an epoxy group can be used alone or in combination of two or more types.

The specific structure or manufacturing method of the amide-imide resin (b4-1) having an acid group and/or an acid anhydride group is not particularly limited, and a wide variety of general amide-imide resins can be used. The amide-imide resin (b4-1) having an acid group and/or an acid anhydride group is preferably obtained by reacting a polyisocyanate compound (b1-4) and a polybasic acid anhydride (b1-3) as raw materials.

As the polyisocyanate compound (b1-4), an alicyclic diisocyanate compound or a modified product thereof, or an aliphatic diisocyanate compound or a modified product thereof is preferable, since a curable resin composition having high solvent solubility can be obtained, and an alicyclic diisocyanate or an isocyanurate modified product thereof, or an aliphatic diisocyanate or an isocyanurate modified product thereof is more preferable.
The proportion of the total mass of the alicyclic diisocyanate compound or its modified product and the aliphatic diisocyanate compound or its modified product in the total mass of the polyisocyanate compound (b1-4) is preferably 70 mass% or more, and more preferably 90 mass% or more.
In addition, when an alicyclic diisocyanate compound or a modified product thereof is used in combination with an aliphatic diisocyanate compound or a modified product thereof, the mass ratio of the two (alicyclic diisocyanate compound or a modified product thereof/aliphatic diisocyanate compound or a modified product thereof) is preferably in the range of 30/70 to 70/30.

The amide-imide resin (B4) having an acid group and a polymerizable unsaturated group can be prepared by using other reaction raw materials in addition to the reaction raw materials of the amide-imide resin (b4-1) having an acid group and/or an acid anhydride group, the hydroxyl group-containing (meth)acrylate compound (b1-5) and/or the (meth)acrylate compound (b4-2) having an epoxy group, depending on the desired resin performance, etc. In this case, the ratio of the total mass of the components (b4-1) to (b4-2) in the total mass of the reaction raw materials of the resin (B4) having an acid group and a polymerizable unsaturated group is preferably 80 mass% or more, and more preferably 90 mass% or more.

The method for producing the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. For example, the amide-imide resin (B4-1) having an acid group and/or an acid anhydride group, and the reaction raw materials including the hydroxyl group-containing (meth)acrylate compound (b1-5) and/or the epoxy group-containing (meth)acrylate compound (b4-2) may be reacted all at once, or the reaction raw materials may be reacted sequentially. In addition, for example, the reaction between the amide-imide resin (b4-1) having an acid group and/or an acid anhydride group and the hydroxyl group-containing (meth)acrylate compound (b1-5) can be carried out by heating and stirring in the presence of a suitable basic catalyst under a temperature condition of about 80 to 140°C. The production of the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent as necessary, and a basic catalyst or an acid catalyst may be used as necessary.

As the organic solvent, the same organic solvents as those described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the organic solvents can be used alone or in combination of two or more kinds.
As the basic catalyst, the same basic catalyst as described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the basic catalyst can be used alone or in combination of two or more kinds.
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, organic acids such as methanesulfonic acid, paratoluenesulfonic acid, and oxalic acid, and Lewis acids such as boron trifluoride, anhydrous aluminum chloride, and zinc chloride. In addition, solid acid catalysts having a strong acid such as a sulfonyl group can also be used. These acid catalysts can be used alone or in combination of two or more.

The acid value of the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group is preferably in the range of 30 to 150 mgKOH/g, more preferably in the range of 40 to 120 mgKOH/g, from the viewpoint of more effectively improving photosensitivity, developability, and adhesion.

--Acrylamide resin having an acid group and a polymerizable unsaturated group (B5)--
Examples of the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group include a resin obtained by reacting the following reactive raw materials: a phenolic hydroxyl group-containing compound (b5-1), an alkylene carbonate (b5-2a) or an alkylene oxide (b5-2b), an N-alkoxyalkyl (meth)acrylamide compound (b5-3), a polybasic acid anhydride (b1-3), and, if necessary, an unsaturated monobasic acid (b1-2).

The phenolic hydroxyl group-containing compound (b5-1) refers to a compound having at least one phenolic hydroxyl group in the molecule. Examples of the phenolic hydroxyl group-containing compound (b5-1) include a compound represented by any one of the following general formulas (8.1) to (8.5), a reaction product in which an aromatic polyhydroxy compound (b5-4) and a compound represented by any one of the following general formulas (9.1) to (9.5) are used as essential reaction raw materials, and a novolac-type phenolic resin in which one or more of the aromatic polyhydroxy compound (b5-4) or other compounds (b5-5) having one phenolic hydroxyl group in the molecule are used as reaction raw materials.

［上記一般式（８．１）～（８．５）中、Ｒ^８１～Ｒ^８４及びＲ^８７はそれぞれ独立して、炭素原子数１～２０のアルキル基、炭素原子数１～２０のアルコキシ基、アリール基又はハロゲン原子のいずれかを表し、Ｒ^８５及びＲ^８６はそれぞれ独立して、水素原子又はメチル基を表し、ｊ^８１～ｊ^８４及びｊ^８７はそれぞれ独立して、０又は１以上の整数を表し、好ましくは０又は１～３の整数であり、より好ましくは０又は１である。ｋ^８１～ｋ^８４及びｋ^８７はそれぞれ独立して、１以上の整数を表し、好ましくは、２又は３である。］
なお、上記一般式（８．１）～（８．５）における芳香環上の置換基の位置については、任意であり、例えば、一般式（８．２）のナフタレン環においてはいずれの環上の水素原子と置換してもよく、一般式（８．３）では、ビフェニル１分子中に存在するベンゼン環のいずれの水素原子に置換してもよく、一般式（８．４）では、アラルキル１分子中に存在するベンゼン環のいずれかの水素原子と置換してもよく、一般式（８．５）では、１分子中に存在するベンゼン環のいずれの水素原子と置換していてもよいことを示し、１分子中における置換基の個数がｊ^８１～ｊ^８４、ｊ^８７及びｋ^８１～ｋ^８４、ｋ^８７であることを示している。

[In the above general formulas (8.1) to (8.5), R ⁸¹ to R ⁸⁴ and R ⁸⁷ each independently represent an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group or a halogen atom; R ⁸⁵ and R ⁸⁶ each independently represent a hydrogen atom or a methyl group; j ⁸¹ to j ⁸⁴ and j ⁸⁷ each independently represent an integer of 0 or 1 or more, preferably 0 or an integer of 1 to 3, more preferably 0 or 1; k ⁸¹ to k ⁸⁴ and k ⁸⁷ each independently represent an integer of 1 or more, preferably 2 or 3.]
The positions of the substituents on the aromatic rings in the above general formulae (8.1) to (8.5) are arbitrary. For example, in the naphthalene ring of general formula (8.2), any hydrogen atom on the ring may be substituted; in general formula (8.3), any hydrogen atom on the benzene ring present in one biphenyl molecule may be substituted; in general formula (8.4), any hydrogen atom on the benzene ring present in one aralkyl molecule may be substituted; and in general formula (8.5), any hydrogen atom on the benzene ring present in one molecule may be substituted; and the numbers of substituents in one molecule are j ⁸¹ to j ⁸⁴ , j ⁸⁷ and k ⁸¹ to k ⁸⁴ , k ⁸⁷ .

［上記一般式（９．１）～（９．５）中、ｈ^９１は、０又は１を表し、Ｒ^９１～Ｒ^９６はそれぞれ独立して、一価の脂肪族炭化水素基、アルコキシ基、ハロゲン原子、アリール基、アリールオキシ基又はアラルキル基のいずれかを表し、ｋ^９１～ｋ^９６はそれぞれ独立して、０又は１～４の整数を表し、Ｚ^９１～Ｚ^９６はそれぞれ独立して、ビニル基、ハロメチル基、ヒドロキシメチル基又はアルキルオキシメチル基のいずれかを表し、Ｙ^９１は、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子又はカルボニル基のいずれかを表し、ｎ^９１は１～４の整数を表す。］
上記一般式（９．１）～（９．５）で表される化合物は、１種単独で用いることも、２種以上を併用することもできる。

[In the above general formulas (9.1) to (9.5), h ⁹¹ represents 0 or 1; R ⁹¹ to R ⁹⁶ each independently represent a monovalent aliphatic hydrocarbon group, an alkoxy group, a halogen atom, an aryl group, an aryloxy group, or an aralkyl group; k ⁹¹ to k ⁹⁶ each independently represent 0 or an integer from 1 to 4; Z ⁹¹ to Z ⁹⁶ each independently represent a vinyl group, a halomethyl group, a hydroxymethyl group, or an alkyloxymethyl group; Y ⁹¹ represents an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom, or a carbonyl group; and n ⁹¹ represents an integer from 1 to 4.]
The compounds represented by the above general formulas (9.1) to (9.5) can be used alone or in combination of two or more.

Examples of the aromatic polyhydroxy compound (b5-4) include dihydroxybenzene, trihydroxybenzene, tetrahydroxybenzene, dihydroxynaphthalene, trihydroxynaphthalene, tetrahydroxynaphthalene, dihydroxyanthracene, trihydroxyanthracene, tetrahydroxyanthracene, biphenol, tetrahydroxybiphenyl, bisphenol, and other compounds having one or more substituents on the aromatic nucleus. Examples of the substituent on the aromatic nucleus include monovalent aliphatic hydrocarbon groups such as methyl, ethyl, vinyl, propyl, butyl, pentyl, hexyl, cyclohexyl, heptyl, octyl, and nonyl; alkoxy groups such as methoxy, ethoxy, propyloxy, and butoxy; halogen atoms such as fluorine, chlorine, and bromine; aryl groups such as phenyl, naphthyl, and anthryl, and aryl groups having the aliphatic hydrocarbon groups, alkoxy groups, and halogen atoms substituted on these aromatic nuclei; phenyloxy, naphthyloxy, and aryloxy groups having the aliphatic hydrocarbon groups, alkoxy groups, and halogen atoms substituted on these aromatic nuclei; phenylmethyl, phenylethyl, naphthylmethyl, and naphthylethyl, and aralkyl groups having the aliphatic hydrocarbon groups, alkoxy groups, and halogen atoms substituted on these aromatic nuclei. These aromatic polyhydroxy compounds can be used alone or in combination of two or more. Among these, compounds that do not contain halogens are preferred because they can produce resins that have acid groups and polymerizable unsaturated groups with high insulation reliability.

The other compound (b5-5) having one phenolic hydroxyl group in the molecule may be any aromatic compound having one hydroxyl group on the aromatic nucleus, such as phenol or a phenol compound having one or more substituents on the aromatic nucleus of phenol, naphthol or a naphthol compound having one or more substituents on the aromatic nucleus of naphthol, anthracenol or anthracenol compound having one or more substituents on the aromatic nucleus of anthracenol, etc. Examples of the substituent on the aromatic nucleus include monovalent aliphatic hydrocarbon groups, alkoxy groups, halogen atoms, aryl groups, aryloxy groups, aralkyl groups, etc., and specific examples of each are as described above. These compounds having one phenolic hydroxyl group can be used alone or in combination of two or more types.

The novolac type phenolic resin may be, for example, a resin obtained by reacting one or more compounds having one phenolic hydroxyl group in the molecule with an aldehyde compound in the presence of an acid catalyst.
Examples of the aldehyde compound include formaldehyde; alkyl aldehydes such as acetaldehyde, propyl aldehyde, butyl aldehyde, isobutyl aldehyde, pentyl aldehyde, and hexyl aldehyde; hydroxybenzaldehydes such as salicylaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, 2-hydroxy-4-methylbenzaldehyde, 2,4-dihydroxybenzaldehyde, and 3,4-dihydroxybenzaldehyde; 2-hydroxy-3-methoxybenzaldehyde, 3-hydroxy-4-methoxybenzaldehyde, and the like. Examples of the aldehyde compound include benzaldehydes having both a hydroxy group and an alkoxy group, such as 4-hydroxy-3-methoxybenzaldehyde, 3-ethoxy-4-hydroxybenzaldehyde, and 4-hydroxy-3,5-dimethoxybenzaldehyde; alkoxybenzaldehydes, such as methoxybenzaldehyde and ethoxybenzaldehyde; hydroxynaphthaldehydes, such as 1-hydroxy-2-naphthaldehyde, 2-hydroxy-1-naphthaldehyde, and 6-hydroxy-2-naphthaldehyde; and halogenated benzaldehydes, such as bromobenzaldehyde. The aldehyde compounds can be used alone or in combination of two or more.

Examples of the alkylene carbonate (b5-2a) include ethylene carbonate, propylene carbonate, butylene carbonate, and pentylene carbonate. Among these, ethylene carbonate or propylene carbonate is preferred from the viewpoint of providing a curable resin composition with higher photosensitivity and developability, and of providing a cured product (cured coating film) with better adhesion. The alkylene carbonate (b5-2a) can be used alone or in combination of two or more kinds.

Examples of the alkylene oxide (b5-2b) include ethylene oxide, propylene oxide, butylene oxide, and pentylene oxide. Among these, ethylene oxide or propylene oxide is preferred from the viewpoint of the curable resin composition exhibiting higher photosensitivity and developability, and of the resulting cured product (cured coating film) exhibiting better adhesion. The alkylene oxide (b5-2b) can be used alone or in combination of two or more kinds.

Examples of the N-alkoxyalkyl (meth)acrylamide compound (b5-3) include N-methoxymethyl (meth)acrylamide, N-ethoxymethyl (meth)acrylamide, N-butoxymethyl (meth)acrylamide, N-methoxyethyl (meth)acrylamide, N-ethoxyethyl (meth)acrylamide, and N-butoxyethyl (meth)acrylamide. Among these, N-methoxymethyl (meth)acrylamide is preferred from the viewpoint of the curable resin composition exhibiting higher photosensitivity and developability, and of the resulting cured product (cured coating film) exhibiting better adhesion. The N-alkoxyalkyl (meth)acrylamide compound (b5-3) can be used alone or in combination of two or more types.

When the N-alkoxyalkyl (meth)acrylamide compound (b5-3) is used as a reaction raw material for the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group, the equivalent ratio of the N-alkoxyalkyl (meth)acrylamide compound (b5-3) to the polybasic acid anhydride (b1-3) [(b5-3)/(b1-3)] is preferably in the range of 0.2 to 7, more preferably in the range of 0.25 to 6.7, from the viewpoint of the curable resin composition exhibiting higher photosensitivity and developability, and of the resulting cured product (cured coating film) exhibiting better adhesion.

The method for producing the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. For example, the resin may be produced by a method in which all of the reaction raw materials are reacted at once, or the reaction raw materials are reacted sequentially. Among these, a method in which a phenolic hydroxyl group-containing compound (b5-1) is reacted with an alkylene carbonate (b5-2a) or an alkylene oxide (b5-2b) first (for example, in the presence of a basic catalyst, at a temperature range of 100 to 200°C), and then an unsaturated monobasic acid (b1-2) and/or an N-alkoxyalkyl (meth)acrylamide compound (b5-3) is reacted (for example, in the presence of an acid catalyst, at a temperature range of 80 to 140°C), and then a polybasic acid anhydride (b1-3) is reacted (for example, at a temperature range of 80 to 140°C) is reacted, is preferred, because this method makes it easier to control the reaction.

The acrylamide resin (B5) having an acid group and a polymerizable unsaturated group is a resin obtained from the above-mentioned reaction raw materials. For example, the acrylamide resin (B5) may be a resin having a resin structure in which the structural portion (I) represented by the following general formula (10.1) and the structural portion (II) represented by the following general formula (10.2) are repeated as structural units, or a resin having a resin structure in which the structural portion (III) represented by the following formula (10.3) and the structural portion (IV) represented by the following formula (10.4) are repeated as structural units.

［上記式（１０．１）又は（１０．２）中、Ｒ^ｂ２及びＲ^ｂ８はそれぞれ独立して、水素原子又は炭素原子数１～４の一価の炭化水素基を表し、Ｒ^ｂ３及びＲ^ｂ９はそれぞれ独立して、水素原子、炭素原子数１～４の炭化水素基、炭素原子数１～４のアルコキシ基又はハロゲン原子のいずれかを表し、ｎ^１及びｎ^２はそれぞれ独立して、１又は２を表し、Ｒ^ｂ４及びＲ^ｂ１０はそれぞれ独立して、メチレン基又は下記一般式（１１．１）～（１１．５）のいずれかで表される構造部位を表し、Ｒ^ｂ５及びＲ^ｂ６はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^ｂ５とＲ^ｂ６とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^ｂ１１は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^ｂ１２は、水素原子又はメチル基を表し、Ｒ^ｂ１及びＲ^ｂ７はそれぞれ独立して、前記Ｒ^ｂ３及び前記Ｒ^ｂ９で表される基、あるいは、式（１０．１）で表される構造部位（Ｉ）又は式（１０．２）で表される構造部位（ＩＩ）が、＊印が付されたＲ^ｂ４又はＲ^ｂ１０を介して連結する結合点である。］

[In the above formula (10.1) or (10.2), R ^b2 and R ^b8 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 4 carbon atoms, R ^b3 and R ^b9 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom, n ¹ and n ² each independently represent 1 or 2, R ^b4 and R ^b10 each independently represent a methylene group or a structural moiety represented by any of the following general formulas (11.1) to (11.5), R ^b5 and R ^b6 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, with the proviso that R ^b5 and R ^b6 may be linked to form a saturated or unsaturated ring, R ^b11 represents a divalent hydrocarbon group having 1 to 12 carbon atoms, R ^b12 represents a hydrogen atom or a methyl group, R ^b1 and R ^b7 each independently represent a bonding point at which the group represented by R ^b3 and R ^b9 , or the structural moiety (I) represented by formula (10.1) or the structural moiety (II) represented by formula (10.2) is linked via R ^b4 or R ^b10 marked with an asterisk.

［上記一般式（１０．３）又は（１０．４）中、Ｒ^ｂ２及びＲ^ｂ８はそれぞれ独立して、水素原子又は炭素原子数１～４の炭化水素基を表し、Ｒ^ｂ３及びＲ^ｂ９はそれぞれ独立して、水素原子、炭素原子数１～４の炭化水素基、炭素原子数１～４のアルコキシ基又はハロゲン原子のいずれかを表し、ｎ^３及びｎ^４はそれぞれ独立して、１又は２を表し、Ｒ^ｂ４及びＲ^ｂ１０はそれぞれ独立して、メチレン基又は下記式（１１．１）～（１１．５）のいずれかで表される構造部位を表し、Ｒ^ｂ５及びＲ^ｂ６はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^ｂ５とＲ^ｂ６とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^ｂ１１は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^ｂ１２は、水素原子又はメチル基を表し、Ｒ^ｂ１及びＲ^ｂ７はそれぞれ独立して、前記Ｒ^ｂ３及び前記Ｒ^ｂ９で表される基、あるいは、一般式（１０．３）で表される構造部位（ＩＩＩ）又は一般式（１０．４）で表される構造部位（ＩＶ）が、＊印が付されたＲ^ｂ４又はＲ^ｂ１０を介して連結する結合点である。］

[In the above general formula (10.3) or (10.4), R ^b2 and R ^b8 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms, R ^b3 and R ^b9 each independently represent any of a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom, n ³ and n ⁴ each independently represent 1 or 2, R ^b4 and R ^b10 each independently represent a methylene group or a structural moiety represented by any of the following formulas (11.1) to (11.5), R ^b5 and R ^b6 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, with the proviso that R ^b5 and R ^b6 may be linked to form a saturated or unsaturated ring, R ^b11 represents a divalent hydrocarbon group having 1 to 12 carbon atoms, R ^b12 represents a hydrogen atom or a methyl group, R ^b1 and R ^b7 are each independently a bond point at which the group represented by R ^b3 and the group represented by R ^b9 , or the structural moiety (III) represented by general formula (10.3) or the structural moiety (IV) represented by general formula (10.4) is linked via R ^b4 or R ^b10 marked with an asterisk.]

［上記一般式（１１．１）～（１１．５）中、ｈ^９１は、０又は１を表し、Ｒ^９１～Ｒ^９６はそれぞれ独立して、一価の脂肪族炭化水素基、アルコキシ基、ハロゲン原子、アリール基又はアラルキル基のいずれかを表し、ｋ^９１～ｋ^９６はそれぞれ独立して、０又は１～４の整数を表し、Ｙ^９１は、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子又はカルボニル基のいずれかを表し、ｎ^９１は１～４の整数を表し、Ｒ^１１１～Ｒ^１１５はそれぞれ独立して、水素原子又はメチル基を表し、Ｗは、下記式（１２．１）又は（１２．２）を表す。］

[In the above general formulas (11.1) to (11.5), h ⁹¹ represents 0 or 1, R ⁹¹ to R ⁹⁶ each independently represent a monovalent aliphatic hydrocarbon group, an alkoxy group, a halogen atom, an aryl group, or an aralkyl group, k ⁹¹ to k ⁹⁶ each independently represent 0 or an integer from 1 to 4, Y ⁹¹ represents an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom, or a carbonyl group, n ⁹¹ represents an integer from 1 to 4, R ¹¹¹ to R ¹¹⁵ each independently represent a hydrogen atom or a methyl group, and W represents the following formula (12.1) or (12.2)]

［上記式（１２．１）又は（１２．２）中、Ｒ^１２１及びＲ^１２４はそれぞれ独立して、水素原子又は炭素原子数１～４の炭化水素基を表し、Ｒ^１２２及びＲ^１２３はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^１２２とＲ^１２３とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^１２５は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^１２６は、水素原子又はメチル基を表す。］

[In the above formula (12.1) or (12.2), R ¹²¹ and R ¹²⁴ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms, R ¹²² and R ¹²³ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, provided that R ¹²² and R ¹²³ may be linked to form a saturated or unsaturated ring, R ¹²⁵ represents a divalent hydrocarbon group having 1 to 12 carbon atoms, and R ¹²⁶ represents a hydrogen atom or a methyl group.]

The acid value of the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group is preferably in the range of 30 to 150 mgKOH/g, more preferably in the range of 40 to 120 mgKOH/g, from the viewpoint of the curable resin composition exhibiting higher photosensitivity and developability, and of the resulting cured product (cured coating film) exhibiting better adhesion.

--Ester resin having an acid group and a polymerizable unsaturated group (B6)--
Examples of the ester resin (B6) having an acid group and a polymerizable unsaturated group include a resin obtained by reacting a phenolic hydroxyl group-containing compound (b5-1), an alkylene oxide (b5-2b) or an alkylene carbonate (b5-2a), an unsaturated monobasic acid (b1-2), and a polybasic acid anhydride (b1-3).

As the alkylene oxide (b5-2b), the same alkylene oxides as those described in the above section "Acrylamide resin having an acid group and a polymerizable unsaturated group (B5)" can be used. Among these, ethylene oxide or propylene oxide is preferred from the viewpoint of more effectively improving photosensitivity, developability, and adhesion. The alkylene oxide (b5-2b) can be used alone or in combination of two or more kinds.

As the alkylene carbonate (b5-2a), the same alkylene carbonates as those described in the above section "Acrylamide resin having an acid group and a polymerizable unsaturated group (B5)" can be used. Among these, ethylene carbonate or propylene carbonate is preferred from the viewpoint of more effectively improving photosensitivity, developability, and adhesion. The alkylene carbonate (b5-2a) can be used alone or in combination of two or more kinds.

The method for producing the ester resin (B6) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the ester resin having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent as necessary, and a basic catalyst and an acid catalyst may be used as necessary.

As the organic solvent, the same organic solvents as those described in the above section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the organic solvents can be used alone or in combination of two or more kinds.
As the basic catalyst, the same basic catalyst as described in the above-mentioned section "Epoxy resin (B1) having an acid group and a polymerizable unsaturated group" can be used, and the basic catalyst can be used alone or in combination of two or more kinds.
In addition, as the acid catalyst, the same acid catalyst as described in the above section "Amide-imide resin having an acid group and a polymerizable unsaturated group (B4)" can be used, and the acid catalyst can be used alone or in combination of two or more kinds.

--Content--
The content of the resin (B) having an acid group and a polymerizable unsaturated group in the total amount (100 mass%) of the curable resin composition of the present embodiment is, from the viewpoint of improving developability, adhesion, and dielectric properties in a balanced manner while increasing the elastic modulus, preferably 20 mass% or more, more preferably 30 mass% or more, and even more preferably 40 mass% or more, as solids (non-volatile content), and is preferably 99 mass% or less, more preferably 90 mass% or less, more preferably 80 mass% or less, and even more preferably 70 mass% or less.

In addition, in the curable resin composition of this embodiment, the mass ratio [(A)/(B)] of the solid contents (non-volatile contents) of the active ester resin (A) and the resin having an acid group and a polymerizable unsaturated group (B) is preferably 5/95 to 50/50, and more preferably 10/90 to 30/70, from the viewpoint of improving the developability, heat resistance, and dielectric properties in a well-balanced manner while increasing the elastic modulus.

The curable resin composition of the present embodiment may be composed only of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group, but may further contain a photopolymerization initiator, a curing agent, etc., which will be described later.
The total content of solids (non-volatile contents) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group in the total amount (100 mass%) of the curable resin composition of the present embodiment is, from the viewpoint of improving the developability, heat resistance, and dielectric properties in a balanced manner while increasing the elastic modulus, preferably 40 mass% or more, more preferably 50 mass% or more, and is preferably 95 mass% or less, more preferably 90 mass% or less, and even more preferably 85 mass% or less.

(Photopolymerization initiator)
The curable resin composition of the present embodiment preferably further contains a photopolymerization initiator. By containing the photopolymerization initiator in the curable resin composition, the curing reaction (polymerization) by light is easily initiated. The photopolymerization initiator may be used alone or in combination of two or more.

The photopolymerization initiator can be selected appropriately depending on the type of active energy rays to be irradiated. It may also be used in combination with a photosensitizer such as an amine compound, a urea compound, a sulfur-containing compound, a phosphorus-containing compound, a chlorine-containing compound, or a nitrile compound. The photopolymerization initiator is preferably a radical polymerization initiator.

Specific examples of the photopolymerization initiator include alkylphenone-based photopolymerization initiators such as 1-hydroxycyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, and 1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; acylphosphine oxide-based photopolymerization initiators such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide; and intramolecular hydrogen abstraction type photopolymerization initiators such as benzophenone compounds. Further, specific examples of the photopolymerization initiator include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, thioxanthone and thioxanthone derivatives, 2,2'-dimethoxy-1,2-diphenylethan-1-one, diphenyl(2,4,6-trimethoxybenzoyl)phosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, and the like.
Commercially available products of the photopolymerization initiator include, for example, "Omnirad-1173", "Omnirad-184", "Omnirad-127", "Omnirad-2959", "Omnirad-369", "Omnirad-379", "Omnirad-907", "Omnirad-4265", "Omnirad-1000", "Omnirad-651", "Omnirad-TPO", "Omnirad-819", "Omnirad-2022", "Omnirad-2100", "Omnirad-754", "Omnirad-784", "Omnirad-500", "Om Examples of such compounds include "nirad-81" (manufactured by IGM), "Kayacure-DETX", "Kayacure-MBP", "Kayacure-DMBI", "Kayacure-EPA", "Kayacure-OA" (manufactured by Nippon Kayaku Co., Ltd.), "Baicure-10", "Baicure-55" (manufactured by Stouffer Chemical Co., Ltd.), "Trigonal P1" (manufactured by Akzo), "Sandray 1000" (manufactured by Sandoz Co., Ltd.), "Deep" (manufactured by Upjohn), "Quantacure-PDO", "Quantacure-ITX", "Quantacure-EPD" (manufactured by Ward Blenkinsop Co., Ltd.), and "Runtecure-1104" (manufactured by Runtec).

When the photopolymerization initiator is used, the content of the photopolymerization initiator in the curable resin composition of this embodiment is preferably 0.1 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the total solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group.

(Hardening agent)
The curable resin composition of the present embodiment preferably further contains a curing agent. When the curable resin composition contains a curing agent, the curability of the curable resin composition is improved.
Examples of the curing agent include epoxy resins and other curing agents (amine curing agents, acid anhydride curing agents, phenolic resin curing agents, etc.), and among these, epoxy resins are preferred.

The epoxy resin is not particularly limited, but is preferably a curable resin that contains two or more epoxy groups in a molecule and can be cured by forming a crosslinked network with the epoxy groups. The epoxy resin is not particularly limited, but may be a novolac type epoxy resin such as a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, an α-naphthol novolac type epoxy resin, a β-naphthol novolac type epoxy resin, a bisphenol A novolac type epoxy resin, or a biphenyl novolac type epoxy resin; an aralkyl type epoxy resin such as a phenol aralkyl type epoxy resin, a naphthol aralkyl type epoxy resin, or a phenol biphenyl aralkyl type epoxy resin; a bisphenol type epoxy resin such as a bisphenol A type epoxy resin, a bisphenol AP type epoxy resin, a bisphenol AF type epoxy resin, a bisphenol B type epoxy resin, a bisphenol BP type epoxy resin, a bisphenol C type epoxy resin, a bisphenol E type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, or a tetrabromobisphenol A type epoxy resin; a bisphenol type epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, or a tetrabromobisphenol A type epoxy resin; biphenyl-type epoxy resins such as phenyl-type epoxy resins, tetramethylbiphenyl-type epoxy resins, and epoxy resins having a biphenyl skeleton and a diglycidyloxybenzene skeleton; naphthalene-type epoxy resins; binaphthol-type epoxy resins; binaphthyl-type epoxy resins; dicyclopentadiene-type epoxy resins such as dicyclopentadienephenol-type epoxy resins; glycidylamine-type epoxy resins such as tetraglycidyldiaminodiphenylmethane-type epoxy resins, triglycidyl-p-aminophenol-type epoxy resins, and diaminodiphenylsulfone-type glycidylamine-type epoxy resins; diglycidyl ester-type epoxy resins such as 2,6-naphthalenedicarboxylic acid diglycidyl ester-type epoxy resins and hexahydrophthalic anhydride glycidyl ester-type epoxy resins; and benzopyran-type epoxy resins such as dibenzopyran, hexamethyldibenzopyran, and 7-phenylhexamethyldibenzopyran. Among these epoxy resins, so-called glycidyl ether type epoxy resins obtained by epoxidizing a phenolic compound are preferred, and among them, novolac type epoxy resins, aralkyl type epoxy resins, and dicyclopentadiene type epoxy resins are more preferred from the viewpoint of dielectric properties. The above-mentioned epoxy resins may be used alone or in combination of two or more types.

The epoxy equivalent of the epoxy resin is preferably 120 to 400 g/eq, and more preferably 150 to 300 g/eq. When the epoxy equivalent of the epoxy resin is 120 g/eq or more, the dielectric properties of the resulting cured product are more excellent, and when the epoxy equivalent of the epoxy resin is 400 g/eq or less, the balance between the heat resistance and the dielectric tangent of the resulting cured product is excellent.
The softening point of the epoxy resin is preferably from 20 to 200° C., and more preferably from 40 to 150° C., from the viewpoint of improving photosensitivity, developability, dielectric properties and adhesion in a well-balanced manner.

The amine curing agent is not particularly limited, but examples thereof include aliphatic amines such as diethylenetriamine (DTA), triethylenetetramine (TTA), tetraethylenepentamine (TEPA), dipropylenediamine (DPDA), diethylaminopropylamine (DEAPA), N-aminoethylpiperazine, menthenediamine (MDA), isophoronediamine (IPDA), 1,3-bisaminomethylcyclohexane (1,3-BAC), piperidine, N,N-dimethylpiperazine, and triethylenediamine; and aromatic amines such as m-xylenediamine (XDA), methanephenylenediamine (MPDA), diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS), benzylmethylamine, 2-(dimethylaminomethyl)phenol, and 2,4,6-tris(dimethylaminomethyl)phenol.
Examples of the acid anhydride curing agent include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, glycerol tristrimellitate, maleic anhydride, tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, endomethylene tetrahydrophthalic anhydride, methyl endomethylene tetrahydrophthalic anhydride, methylbutenyl tetrahydrophthalic anhydride, dodecenyl succinic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride, and methylcyclohexene dicarboxylic anhydride.
Examples of the phenol resin curing agent include phenol novolac resin, cresol novolac resin, naphthol novolac resin, bisphenol novolac resin, biphenyl novolac resin, dicyclopentadiene-phenol addition type resin, phenol aralkyl resin, naphthol aralkyl resin, triphenol methane type resin, tetraphenol ethane type resin, and aminotriazine modified phenol resin.
The above-mentioned other curing agents may be used alone or in combination of two or more.

When the curing agent is used, the content of the curing agent in the curable resin composition of this embodiment is preferably 10 to 40 parts by mass per 100 parts by mass of the total amount of the solids (non-volatile contents) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group. If the content is 10 parts by mass or more, the heat resistance and curability can be further improved, and if the content is 40 parts by mass or less, a lower dielectric tangent and higher flexibility can be achieved.

(Optionally Added Ingredients)
The curable resin composition of the present embodiment may further contain optional additives within the scope of the purpose. Examples of optional additives include various additives such as compounds having a polymerizable unsaturated group, curing accelerators, other resins, organic solvents, polymerization inhibitors, antioxidants, flame retardants, fillers, pigments, defoamers, viscosity adjusters, leveling agents, ultraviolet stabilizers, and storage stabilizers.

--Compound having a polymerizable unsaturated group--
Examples of the compound having a polymerizable unsaturated group include (meth)acrylate compounds. Specific examples of the compound include aliphatic mono(meth)acrylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and octyl (meth)acrylate; alicyclic mono(meth)acrylate compounds such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, and adamantyl mono(meth)acrylate; heterocyclic mono(meth)acrylate compounds such as glycidyl (meth)acrylate and tetrahydrofurfuryl acrylate; benzyl (meth)acrylate, phenyl (meth)acrylate, and phenylbenzyl (meth)acrylate. mono(meth)acrylate compounds such as aromatic mono(meth)acrylate compounds such as phenoxy(meth)acrylate, phenoxyethyl(meth)acrylate, phenoxyethoxyethyl(meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, phenoxybenzyl(meth)acrylate, benzylbenzyl(meth)acrylate, and phenylphenoxyethyl(meth)acrylate; (poly)oxyalkylene-modified mono(meth)acrylate compounds in which a polyoxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain has been introduced into the molecular structure of the various mono(meth)acrylate monomers mentioned above; lactone-modified mono(meth)acrylate compounds in which a (poly)lactone structure has been introduced into the molecular structure of the various mono(meth)acrylate compounds mentioned above;
Aliphatic di(meth)acrylate compounds such as ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, hexanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate; alicyclic di(meth)acrylate compounds such as 1,4-cyclohexanedimethanol di(meth)acrylate, norbornane di(meth)acrylate, norbornane dimethanol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, and tricyclodecane dimethanol di(meth)acrylate; (Meth)acrylate compounds; aromatic di(meth)acrylate compounds such as biphenol di(meth)acrylate and bisphenol di(meth)acrylate; polyoxyalkylene-modified di(meth)acrylate compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain or a (poly)oxytetramethylene chain has been introduced into the molecular structure of the various di(meth)acrylate compounds mentioned above; lactone-modified di(meth)acrylate compounds in which a (poly)lactone structure has been introduced into the molecular structure of the various di(meth)acrylate compounds mentioned above;
aliphatic tri(meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate and glycerin tri(meth)acrylate; (poly)oxyalkylene-modified tri(meth)acrylate compounds in which a (poly)oxyalkylene chain such as a (poly)oxyethylene chain, a (poly)oxypropylene chain or a (poly)oxytetramethylene chain has been introduced into the molecular structure of the aliphatic tri(meth)acrylate compound; lactone-modified tri(meth)acrylate compounds in which a (poly)lactone structure has been introduced into the molecular structure of the aliphatic tri(meth)acrylate compound;
aliphatic poly(meth)acrylate compounds having 4 or more functional groups, such as pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.; (poly)oxyalkylene-modified poly(meth)acrylate compounds having 4 or more functional groups, in which a (poly)oxyalkylene chain, such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain, has been introduced into the molecular structure of the aliphatic poly(meth)acrylate compound; and lactone-modified poly(meth)acrylate compounds having 4 or more functional groups, in which a (poly)lactone structure has been introduced into the molecular structure of the aliphatic poly(meth)acrylate compound.
Hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, trimethylolpropane (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol (meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate (meth)acrylate compounds having a hydroxyl group, such as ditrimethylolpropane (meth)acrylate, ditrimethylolpropane di(meth)acrylate, and ditrimethylolpropane tri(meth)acrylate; (poly)oxyalkylene modified compounds obtained by introducing a (poly)oxyalkylene chain, such as a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a (poly)oxytetramethylene chain, into the molecular structure of the (meth)acrylate compounds having a hydroxyl group; lactone modified compounds obtained by introducing a (poly)lactone structure into the molecular structure of the (meth)acrylate compounds having a hydroxyl group;
(meth)acrylate compounds having an isocyanate group, such as 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate, and 1,1-bis(acryloyloxymethyl)ethyl isocyanate;
Examples of the monomer include (meth)acrylate monomers having a glycidyl group, such as glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, and epoxycyclohexylmethyl (meth)acrylate; and (meth)acrylate compounds having an epoxy group, such as mono(meth)acrylates of diglycidyl ether compounds, such as hydroxybenzene diglycidyl ether, dihydroxynaphthalene diglycidyl ether, biphenol diglycidyl ether, and bisphenol diglycidyl ether.
The compound having a polymerizable unsaturated group may be used alone or in combination of two or more kinds.

--Curing accelerator--
The curing accelerator is not particularly limited, and examples thereof include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, urea-based curing accelerators, etc. The curing accelerators may be used alone or in combination of two or more.

Examples of the phosphorus-based curing accelerator include organic phosphine compounds such as triphenylphosphine, tributylphosphine, tri-para-tolylphosphine, diphenylcyclohexylphosphine, and tricyclohexylphosphine; organic phosphite compounds such as trimethyl phosphite and triethyl phosphite; and phosphonium salts such as ethyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, butylphosphonium tetraphenylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylphosphine triphenylborane, tetraphenylphosphonium thiocyanate, tetraphenylphosphonium dicyanamide, butylphenylphosphonium dicyanamide, and tetrabutylphosphonium decanoate.
Examples of the amine curing accelerator include triethylamine, tributylamine, N,N-dimethyl-4-aminopyridine (DMAP), 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5,4,0]-undecene-7 (DBU), and 1,5-diazabicyclo[4,3,0]-nonene-5 (DBN).
Examples of the imidazole-based hardening accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methyl ... Examples of the compound include ethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, and 2-methylimidazoline.
Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-butylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, and 1-phenylbiguanide.
Examples of the urea-based hardening accelerator include 3-phenyl-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, chlorophenylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, and 3-(3,4-dichlorophenyl)-1,1-dimethylurea.
Of the above-mentioned curing accelerators, it is preferable to use 2-ethyl-4-methylimidazole and N,N-dimethyl-4-aminopyridine (DMAP).

When the curing accelerator is used, the content of the curing accelerator in the curable resin composition of this embodiment is preferably 0.01 to 5 parts by mass relative to 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group. When the content of the curing accelerator is 0.01 parts by mass or more, the curability can be more reliably improved. On the other hand, when the content of the curing accelerator is 5 parts by mass or less, the insulation reliability can be sufficiently well maintained. From the same viewpoint, the content of the curing accelerator is more preferably 0.1 parts by mass or more, and more preferably 5 parts by mass or less, relative to 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group.

--Other resins--
The other resins are not particularly limited, but include maleimide resins, polyphenylene ether resins, polyimide resins, cyanate ester resins, benzoxazine resins, triazine-containing cresol novolac resins, cyanate ester resins, styrene-maleic anhydride resins, allyl group-containing resins such as diallyl bisphenol and triallyl isocyanurate, polyphosphate esters, phosphate ester-carbonate copolymers, etc. These other resins may be used alone or in combination of two or more.
When the other resin is used, the content of the other resin in the curable resin composition of the present embodiment is preferably 50 mass % or less of the total.

--Organic solvent--
The organic solvent can have a function of adjusting the viscosity of the curable resin composition. Specific examples of the organic solvent include, but are not limited to, ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as diethyl ether and tetrahydrofuran; ester-based solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene, xylene, ethylbenzene, mesitylene, 1,2,3-trimethylbenzene, and 1,2,4-trimethylbenzene; and amide-based solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. The organic solvent may be used alone or in combination of two or more.
When the organic solvent is used, the content of the organic solvent in the curable resin composition of the present embodiment is preferably 90% by mass or less, more preferably 10 to 90% by mass, and even more preferably 20 to 80% by mass, based on the total amount (100% by mass) of the curable resin composition. When the content of the organic solvent is 10% by mass or more, it is preferable because of excellent handleability. On the other hand, when the content of the organic solvent is 90% by mass or less, it is preferable from the viewpoint of economy.

--Polymerization inhibitor--
The polymerization inhibitor is not particularly limited, but may be a phenolic compound such as p-methoxyphenol (methoquinone), p-methoxycresol, 4-methoxy-1-naphthol, 4,4'-dialkoxy-2,2'-bi-1-naphthol, 3-(N-salicyloyl)amino-1,2,4-triazole, N'1,N'12-bis(2-hydroxybenzoyl)dodecane dihydrazide, styrenated phenol, N-isopropyl-N'-phenylbenzene-1,4-diamine, 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinoline, etc.; a quinone compound such as hydroquinone, methylhydroquinone, p-benzoquinone, methyl-p-benzoquinone, 2,5-diphenylbenzoquinone, 2-hydroxy-1,4-naphthoquinone, anthraquinone, diphenoquinone, etc.;
Amine compounds such as melamine, p-phenylenediamine, 4-aminodiphenylamine, N,N'-diphenyl-p-phenylenediamine, N-i-propyl-N'-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N'-phenyl-p-phenylenediamine, diphenylamine, 4,4'-dicumyl-diphenylamine, 4,4'-dioctyl-diphenylamine, poly(2,2,4-trimethyl-1,2-dihydroquinoline), styrenated diphenylamine, reaction products of styrenated diphenylamine and 2,4,4-trimethylpentene, and reaction products of diphenylamine and 2,4,4-trimethylpentene;
Thioether compounds such as phenothiazine, distearyl thiodipropionate, 2,2-bis({[3-(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl bis[3-(dodecylthio)propionate], and ditridecan-1-yl 3,3'-sulfanediyl dipropanoate;
N-nitrosodiphenylamine, N-nitrosophenylnaphthylamine, p-nitrosophenol, nitrosobenzene, p-nitrosodiphenylamine, α-nitroso-β-naphthol, N,N-dimethyl-p-nitrosoaniline, p-nitrosodiphenylamine, p-nitrosodimethylamine, p-nitroso-N,N-diethylamine, N-nitrosoethanolamine, N-nitrosodi-n-butylamine, N-nitroso-N-n-butyl-4-butanolamine, N-nitroso-diisopropanolamine, N-nitroso-N-ethyl-4-butanolamine, 5-nitroso-8-hydroxy nitroso compounds such as shiquinoline, N-nitrosomorpholine, N-nitroso-N-phenylhydroxylamine ammonium salt, nitrosobenzene, N-nitroso-N-methyl-p-toluenesulfonamide, N-nitroso-N-ethylurethane, N-nitroso-N-n-propylurethane, 1-nitroso-2-naphthol, 2-nitroso-1-naphthol, 1-nitroso-2-naphthol-3,6-sodium sulfonate, 2-nitroso-1-naphthol-4-sodium sulfonate, 2-nitroso-5-methylaminophenol hydrochloride, and 2-nitroso-5-methylaminophenol hydrochloride;
Phosphite compounds such as esters of phosphoric acid and octadecan-1-ol, triphenyl phosphite, 3,9-dioctadecan-1-yl-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, trisnonylphenyl phosphite, phosphorous acid-(1-methylethylidene)-di-4,1-phenylenetetra-C12-15-alkyl ester, 2-ethylhexyl=diphenyl=phosphite, diphenylisodecyl phosphite, triisodecyl=phosphite, and tris(2,4-di-tert-butylphenyl)phosphite;
Zinc compounds such as bis(dimethyldithiocarbamato-κ(2)S,S′)zinc, zinc diethyldithiocarbamate, and zinc dibutyldithiocarbamate;
Nickel compounds such as bis(N,N-dibutylcarbamodithioato-S,S')nickel;
Examples of sulfur compounds include 1,3-dihydro-2H-benzimidazole-2-thione, 4,6-bis(octylthiomethyl)-o-cresol, 2-methyl-4,6-bis[(octan-1-ylsulfanyl)methyl]phenol, dilauryl thiodipropionate, and distearyl 3,3'-thiodipropionate.
The polymerization inhibitors may be used alone or in combination of two or more.

--Antioxidant--
The antioxidant is not particularly limited, and the same compounds as those exemplified as the polymerization inhibitor can be used. The antioxidant may be used alone or in combination of two or more kinds.

Commercially available examples of the polymerization inhibitor and antioxidant include "Q-1300" and "Q-1301" manufactured by Wako Pure Chemical Industries, Ltd., and "Sumilizer BBM-S" and "Sumilizer GA-80" manufactured by Sumitomo Chemical Co., Ltd.

--Flame retardants--
The flame retardant is not particularly limited, and examples thereof include inorganic phosphorus-based flame retardants, organic phosphorus-based flame retardants, halogen-based flame retardants, etc. The flame retardants may be used alone or in combination of two or more.

The inorganic phosphorus-based flame retardant is not particularly limited, but examples thereof include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; and phosphoric acid amides.
The organic phosphorus flame retardant is not particularly limited, but examples thereof include methyl acid phosphate, ethyl acid phosphate, isopropyl acid phosphate, dibutyl phosphate, monobutyl phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, bis(2-ethylhexyl) phosphate, monoisodecyl acid phosphate, lauryl acid phosphate, tridecyl acid phosphate, and stearyl acid phosphate. , isostearyl acid phosphate, oleyl acid phosphate, butyl pyrophosphate, tetracosyl acid phosphate, ethylene glycol acid phosphate, (2-hydroxyethyl) methacrylate acid phosphate and other phosphate esters; 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, diphenylphosphines such as diphenylphosphine oxide; 10-(2,5-dihydroxyphenyl)-10H-9-oxa phosphorus-containing phenols such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(1,4-dioxynaphthalene)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, diphenylphosphinylhydroquinone, diphenylphosphinyl-1,4-dioxynaphthalene, 1,4-cyclooctylenephosphinyl-1,4-phenyldiol, and 1,5-cyclooctylenephosphinyl-1,4-phenyldiol; cyclic phosphorus compounds such as 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,7-dihydroxynaphthyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, etc.; and compounds obtained by reacting the above-mentioned phosphoric acid esters, the above-mentioned diphenylphosphine, or the above-mentioned phosphorus-containing phenols with epoxy resins, aldehyde compounds, or phenol compounds.
The halogen-based flame retardant is not particularly limited, but examples thereof include brominated polystyrene, bis(pentabromophenyl)ethane, tetrabromobisphenol A bis(dibromopropyl ether), 1,2-bis(tetrabromophthalimide), 2,4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine, and tetrabromophthalic acid.

When the flame retardant is used, the amount of the flame retardant used in the resin composition of this embodiment is preferably 0.1 to 50 parts by mass per 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group. When the content of the flame retardant is 0.1 parts by mass or more, flame retardancy can be more reliably imparted. On the other hand, when the content of the flame retardant is 50 parts by mass or less, flame retardancy can be imparted while maintaining dielectric properties. From the same viewpoint, the content of the flame retardant is more preferably 1 part by mass or more, and more preferably 30 parts by mass or less, per 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group.

--filler--
Examples of the filler include organic fillers and inorganic fillers. Organic fillers have the function of improving elongation and mechanical strength. Inorganic fillers have the function of reducing the thermal expansion coefficient and imparting flame retardancy. The above-mentioned fillers may be used alone or in combination of two or more.

The organic filler is not particularly limited, but examples thereof include polyamide particles.
The inorganic filler is not particularly limited, but may include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate phosphate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, carbon black, etc. Among these, it is preferable to use silica. In this case, as the silica, amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, etc. may be used.

The filler may be surface-treated as necessary. In this case, the surface treatment agent that can be used is not particularly limited, but may be an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, an organosilazane compound, a titanate coupling agent, or the like. Specific examples of the surface treatment agent include 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and hexamethyldisilazane. The above-mentioned fillers may be used alone or in combination of two or more.

When the filler is used, the amount of the filler used in the resin composition of this embodiment is preferably 0.5 to 95 parts by mass relative to 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group. When the content of the filler is 0.5 parts by mass or more, the effect of the filler can be sufficiently imparted. On the other hand, when the content of the filler is 95 parts by mass or less, the viscosity of the blend increases, and deterioration of moldability can be suppressed. From the same viewpoint, the content of the filler is more preferably 5 parts by mass or more, and more preferably 80 parts by mass or less, relative to 100 parts by mass of the total amount of the solid content (non-volatile content) of the active ester resin (A) and the resin (B) having an acid group and a polymerizable unsaturated group.

The method for producing the curable resin composition of this embodiment is not particularly limited, and the composition can be produced by kneading the various components described above using a kneader such as a roll.

<Cured Product>
The cured product of the present embodiment is characterized by being obtained by curing the above-mentioned curable resin composition. The cured product of the present embodiment has a high elastic modulus, high adhesion to adjacent members, and excellent dielectric properties, and can function suitably as an insulating material or a resist member.
The cured product of the present embodiment is preferably obtained by curing the curable resin composition by irradiating it with active energy rays.

Examples of the active energy rays include ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays. When ultraviolet rays are used as the active energy rays, irradiation may be performed in an inert gas atmosphere such as nitrogen gas, or in an air atmosphere in order to efficiently carry out the curing reaction by ultraviolet rays.

Specific examples of sources of ultraviolet light include ultraviolet lamps such as low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, gallium lamps, and metal halide lamps, as well as sunlight and LEDs. Of these, ultraviolet lamps are commonly used from the standpoint of practicality and economy.

The cumulative light amount of the active energy rays is not particularly limited, but is preferably 0.1 to 50 kJ/ ^m2 , and more preferably 0.5 to 10 kJ/ ^m2 . When the cumulative light amount is within the above range, the occurrence of uncured parts can be sufficiently prevented or suppressed. The irradiation of the active energy rays may be performed in one step, or may be performed in two or more steps.

Another method for obtaining a cured product by subjecting the curable resin composition to a curing reaction is, for example, heat curing. The heating temperature during heat curing is not particularly limited, but is preferably 100 to 300°C, and the heating time is preferably 1 to 24 hours.

Applications for which the curable resin composition or cured product of this embodiment is used include printed wiring board materials, resin compositions for flexible wiring boards, interlayer insulating materials for build-up boards, insulating materials for circuit boards such as adhesive films for build-up, resin casting materials, adhesives, semiconductor encapsulation materials, semiconductor devices, prepregs, conductive pastes, build-up films, build-up boards, fiber-reinforced composite materials, and molded products obtained by curing the above composite materials. Among these various applications, in the applications for printed wiring board materials, insulating materials for circuit boards, and adhesive films for build-up, the composition can be used as an insulating material for so-called electronic component-embedded boards in which passive components such as capacitors and active components such as IC chips are embedded in the board. Furthermore, among the above, taking advantage of the characteristics of the cured product having excellent heat resistance and coating appearance, the curable resin composition or cured product of this embodiment can be suitably applied to semiconductor encapsulation materials, semiconductor devices, prepregs, flexible wiring boards, circuit boards, build-up films, build-up boards, multilayer printed wiring boards, fiber-reinforced composite materials, and molded products obtained by curing the above composite materials.

<Insulating materials>
The insulating material of the present embodiment is characterized by being composed of the above-mentioned curable resin composition. The insulating material of the present embodiment is preferably obtained by curing the above-mentioned curable resin composition by irradiation with active energy rays. The insulating material of the present embodiment has a high elastic modulus, high adhesion to adjacent members, and excellent dielectric properties.

Examples of the insulating material include the above-mentioned interlayer insulating material for build-up boards, insulating materials for circuit boards such as adhesive films for build-up, insulating materials for circuit boards, and insulating materials for boards with built-in electronic components. For example, a method for producing a build-up board from the above-mentioned curable resin composition includes a method consisting of the following three steps. The first step is a step of applying the above-mentioned curable resin composition, which is appropriately blended with rubber, fillers, etc., to a circuit board on which a circuit is formed using a spray coating method, a curtain coating method, etc., and then curing it. The second step is a step of subsequently drilling a predetermined through-hole portion or the like as necessary, treating it with a roughening agent, washing the surface with hot water to form unevenness, and plating a metal such as copper. The third step is a step of repeating such operations in sequence as desired to alternately build up a resin insulating layer and a conductor layer of a predetermined circuit pattern. It is preferable to drill the through-hole portion after forming the outermost resin insulating layer. The first step can be performed not only by the above-mentioned solution application, but also by laminating a build-up film that has been applied to a desired thickness and dried in advance. The build-up board of the present invention can also be manufactured by forming a roughened surface and omitting the plating process by heating and pressing the resin-coated copper foil, which is made by semi-curing the resin composition on the copper foil, onto a wiring board on which a circuit has been formed, at 170 to 250°C.

<Resist Material>
The resist member of this embodiment is characterized by being made of the above-mentioned curable resin composition. The resist member can be obtained, for example, by applying the above-mentioned curable resin composition onto a substrate, drying it appropriately at a temperature range of about 60 to 100° C., exposing it to active energy rays through a photomask having a desired pattern formed thereon, developing the unexposed areas with an alkaline aqueous solution, and further heating and curing it at a temperature range of about 140 to 180° C. The resist member (resist film) of this embodiment has high heat resistance, high elasticity, and excellent dielectric properties.

The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples. In the examples, "parts" and "%" are based on mass unless otherwise specified. The GPC measurement conditions in the examples are as follows.

[GPC measurement conditions]
Measurement device: "HLC-8320 GPC" manufactured by Tosoh Corporation,
Column: Guard column "HXL-L" manufactured by Tosoh Corporation
+ Tosoh Corporation "TSK-GEL G4000HXL"
+ Tosoh Corporation "TSK-GEL G3000HXL"
+ Tosoh Corporation "TSK-GEL G2000HXL"
+ Tosoh Corporation "TSK-GEL G2000HXL"
Detector: RI (differential refractometer)
Data processing: Tosoh Corporation's "GPC Workstation EcoSEC-WorkStation"
Measurement conditions: Column temperature 40°C
Developing solvent: Tetrahydrofuran
Flow rate: 1.0 mL/min. Standard: The following monodisperse polystyrene with known molecular weight was used in accordance with the measurement manual for "GPC-8320".
(Polystyrene used)
"A-500" manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
"F-1" manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
"F-4" manufactured by Tosoh Corporation
"F-10" manufactured by Tosoh Corporation
"F-20" manufactured by Tosoh Corporation
"F-40" manufactured by Tosoh Corporation
"F-80" manufactured by Tosoh Corporation
"F-128" manufactured by Tosoh Corporation
Sample: A tetrahydrofuran solution (1.0% by mass, calculated as resin solid content) filtered through a microfilter (50 μL).

(Synthesis Example 1)
Synthesis of active ester (A-1) 220 parts by mass (2.0 mol) of catechol, 144 parts by mass (1.0 mol) of α-naphthol, and 2061 parts by mass of toluene were charged into a flask equipped with a thermometer, a dropping funnel, a cooling tube, a fractionating tube, and a stirrer, and the inside of the system was substituted with nitrogen under reduced pressure to dissolve. Then, 505 parts by mass (2.5 mol) of isophthalic acid chloride was charged, and the inside of the system was substituted with nitrogen under reduced pressure to dissolve. Then, 1.0 part by mass of tetrabutylammonium bromide was dissolved, and while purging with nitrogen gas, the inside of the system was controlled to 60°C or less, and 1030 parts by mass of a 20% by mass aqueous sodium hydroxide solution was dropped over 3 hours. Then, stirring was continued for 1 hour under these conditions. After the reaction was completed, the mixture was left to stand and separated, and the aqueous layer was removed. Furthermore, water was added to the toluene phase in which the reactants were dissolved, and the mixture was stirred and mixed for about 15 minutes, and the aqueous layer was left to stand and separated to remove. This operation was repeated until the pH of the aqueous layer reached 7. Thereafter, the mixture was dried under reduced pressure with heating to obtain 652 parts by mass of an active ester (A-1) represented by the following structural formula.
This active ester (A-1) had an ester group equivalent of 137 g/equivalent, a softening point of 118° C., and a theoretical average number of repeating units n based on the charging ratio of the raw materials of 4.
The number of repeating units n is preferably 1 to 10, more preferably 2 to 8, and further preferably 3 to 5. When the number of repeating units n is within the above range, high heat resistance, low dielectric constant, and low dielectric tangent are obtained, which is preferable.

(Synthesis Example 2)
Synthesis of Active Ester (A-2) 759 parts by mass of active ester (A-2) was obtained in the same manner as in Example 1, except that 220 parts by mass (2.0 mol) of catechol in Example 1 was changed to 332 parts by mass (2.0 mol) of tert-butylcatechol.
This active ester (A-2) had an ester group equivalent of 160 g/equivalent, a softening point of 128° C., and a theoretical average number of repeating units n based on the charging ratio of the raw materials of 4.

(Synthesis Example 3)
Synthesis of Active Ester (A-3) 765 parts by mass of active ester (A-3) was obtained in the same manner as in Example 1, except that the 220 parts by mass (2.0 mol) of catechol in Example 1 was changed to 332 parts by mass (2.0 mol) of tert-butylcatechol and the 144 parts by mass (1.0 mol) of α-naphthol was changed to 150 parts by mass (1.0 mol) of para-tert-butylphenol.
This active ester (A-3) had an ester group equivalent of 161 g/equivalent, a softening point of 124° C., and a theoretical average number of repeating units n based on the charging ratio of the raw materials of 4.

(Synthesis Example 4)
Synthesis of active ester (C-1) 165 parts by mass of a dicyclopentadiene and phenol weighted addition reaction resin (hydroxyl equivalent: 165 g/equivalent, softening point 85° C.), 72 parts by mass (0.5 mol) of α-naphthol, and 630 parts by mass of toluene were charged into a flask equipped with a thermometer, a dropping funnel, a cooling tube, a fractionating tube, and a stirrer, and the system was purged with nitrogen under reduced pressure to dissolve. Next, 152 parts by mass (0.75 mol) of isophthalic acid chloride was charged, and the system was purged with nitrogen under reduced pressure to dissolve. Thereafter, 0.6 parts by mass of tetrabutylammonium bromide was dissolved, and while purging with nitrogen gas, the system was controlled to 60° C. or less, and 315 parts by mass of a 20% by mass aqueous sodium hydroxide solution was dropped over 3 hours. Then, stirring was continued for 1 hour under these conditions. After the reaction was completed, the mixture was left to stand for liquid separation, and the aqueous layer was removed. Further, water was added to the toluene layer in which the reactant was dissolved, and the mixture was stirred and mixed for about 15 minutes, and then the mixture was allowed to stand and separated to remove the aqueous layer. This operation was repeated until the pH of the aqueous layer reached 7. Thereafter, the mixture was dried under reduced pressure with heat to synthesize the active ester (C-1).
The active ester (C-1) had an ester group equivalent of 223 g/equivalent and a softening point of 150°C.

(Synthesis Example 5: Synthesis of Resin (B-1) Having Acid Group and Polymerizable Unsaturated Group)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 123 parts by mass of diethylene glycol monoethyl ether acetate was placed, and 214 parts by mass of orthocresol novolac type epoxy resin "EPICLON N-680" (manufactured by DIC Corporation, softening point 86 ° C., epoxy equivalent: 214 g / eq,) was dissolved. After adding 0.9 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methoquinone, 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and the reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 72 parts by mass of diethylene glycol monoethyl ether acetate and 76 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110 ° C. for 3 hours to obtain a resin (B-1) having an acid group and a polymerizable unsaturated group. The non-volatile content of this resin (B-1) having an acid group and a polymerizable unsaturated group was 65% by mass, and the solid acid value was 80 mg KOH / g. The acid value is a value measured based on the neutralization titration method of JIS K 0070 (1992).

(Synthesis Example 6: Synthesis of Resin (B-2) Having Acid Group and Polymerizable Unsaturated Group)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 499.7 parts by mass of diethylene glycol monoethyl ether acetate was placed, 244.3 parts by mass of isocyanurate modified isophorone diisocyanate (EVONIK Corporation's "VESTANAT T-1890/100", NCO% = 17.2%) and 192.0 parts by mass of trimellitic anhydride were dissolved, and 1.0 parts by mass of dibutylhydroxytoluene was added. The mixture was reacted at 160 ° C. for 6 hours under a nitrogen atmosphere, and it was confirmed that the NCO% was 0.1 or less. Next, 0.4 parts by mass of methoquinone was added as a thermal polymerization inhibitor, and then 147.6 parts by mass of a pentaerythritol polyacrylate mixture (Toa Gosei Co., Ltd.'s "Aronix M-306", hydroxyl value: 159.7 mg KOH / g) and 3.5 parts by mass of triphenylphosphine were added, and the reaction was carried out at 110 ° C. for 5 hours while blowing in air. Thereafter, 165.0 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Next, 110.4 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours to obtain a resin (B-2) having an acid group and a polymerizable unsaturated group. The non-volatile content of this resin (B-2) having an acid group and a polymerizable unsaturated group was 62% by mass, and the solid content acid value was 80 mgKOH/g.

(Examples 1 to 6, Comparative Example 1)
Curable resin compositions (1) to (12) and (C1) to (C2) were obtained by mixing the components in the ratios shown in Tables 1 and 2. In Tables 1 and 2, the amounts of resins (B-1) and (B-2) having an acid group and a polymerizable unsaturated group are the amounts as non-volatile content (solid content).
The obtained curable resin composition was subjected to the following tests.

[Evaluation of Alkaline Developability]
The curable resin composition obtained in each Example and Comparative Example was applied to a glass substrate using an applicator to a film thickness of 50 μm, and then dried at 80° C. for 50 minutes, 60 minutes, 70 minutes, 80 minutes, 90 minutes, and 100 minutes, respectively, to prepare samples with different drying times. These were developed with a 1% by mass aqueous sodium carbonate solution (alkaline aqueous solution) at 30° C. for 180 seconds, and the drying time at 80° C. of the sample that did not leave any residue on the substrate was evaluated as the drying control width (minutes). The longer the drying control width (minutes), the higher the developability.

[Method for evaluating heat resistance]
The curable resin composition obtained in each Example and Comparative Example was applied to a copper foil (electrolytic copper foil "F2-WS" 18 μm, manufactured by Furukawa Sangyo Co., Ltd.) using an applicator so as to have a film thickness of 50 μm, and dried at 80 ° C. for 30 minutes. Next, after irradiating with ultraviolet light of 10 kJ / m ² using a metal halide lamp, it was heated at 160 ° C. for 1 hour to obtain a cured coating film. Next, the cured coating film was peeled off from the copper foil to obtain a cured product (test piece 1). A test piece of 6 mm x 35 mm was cut out from the cured product, and the temperature at which the change in elastic modulus was maximum was evaluated as the glass transition temperature using a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device "RSAII" manufactured by Rheometrics Co., Ltd., tensile method: frequency 1 Hz, heating rate 3 ° C. / min). Note that a higher glass transition temperature indicates better heat resistance.

[Method of evaluating elasticity]
The elasticity was evaluated by measuring the elastic modulus through a tensile test.

<Tensile test>
The test piece 1 was cut into a size of 10 mm x 80 mm, and a tensile test was performed on the test piece under the following measurement conditions using a precision universal testing machine "AG-IS" manufactured by Shimadzu Corporation. The elastic modulus (MPa) until the test piece broke was measured and evaluated according to the following criteria.

Measurement conditions: Temperature 23°C, humidity 50%, gauge length 20 mm, support length 20 mm, tensile speed 10 mm/min

[Method of measuring dielectric constant]
The curable resin composition obtained in each Example and Comparative Example was applied to a glass substrate using an applicator to a film thickness of 50 μm, and dried at 80° C. for 30 minutes. Then, after irradiating ultraviolet rays of 10 kJ/m ² using a metal halide lamp, the mixture was heated at 160° C. for 1 hour to obtain a cured coating film. Then, the cured coating film was peeled off from the glass substrate to obtain a cured product. Then, the product was stored in a room at a temperature of 23° C. and a humidity of 50% for 24 hours as a test piece, and the dielectric constant of the test piece at 1 GHz was measured by a cavity resonance method using a "Network Analyzer E8362C" manufactured by Agilent Technologies, Inc.

[Method of measuring dielectric tangent]
The curable resin composition obtained in each Example and Comparative Example was applied to a glass substrate using an applicator to a film thickness of 50 μm, and dried at 80° C. for 30 minutes. Then, after irradiating ultraviolet rays of 10 kJ/m ² using a metal halide lamp, the mixture was heated at 160° C. for 1 hour to obtain a cured coating film. Then, the cured coating film was peeled off from the glass substrate to obtain a cured product. Then, the product was stored in a room at a temperature of 23° C. and a humidity of 50% for 24 hours as a test piece, and the dielectric loss tangent of the test piece at 1 GHz was measured by a cavity resonance method using a "Network Analyzer E8362C" manufactured by Agilent Technologies, Inc.

In Tables 1 and 2, the following were used:
Hardener: orthocresol novolac type epoxy resin, manufactured by DIC Corporation, product name "EPICLON N-680", epoxy equivalent: 214 g/eq
Organic solvent: diethylene glycol monoethyl ether acetate Photopolymerization initiator: product name "Omnirad 907" manufactured by IGM Resins

From Table 1, it can be seen that the curable resin compositions of Examples 1 to 6 according to the present invention have higher developability than the curable resin composition of Comparative Example 1, which uses active ester resin (C-1) that does not use aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring as a reaction raw material.

In addition, Table 2 shows that the cured products obtained by curing the curable resin compositions of Examples 7 to 12 according to the present invention have superior heat resistance, high elastic modulus, and excellent dielectric properties (low dielectric constant and dielectric dissipation factor) compared to the cured product of Comparative Example 2, which uses active ester resin (C-1) that does not use aromatic compound (a) having two hydroxyl groups at adjacent positions on the aromatic ring as a reaction raw material.

The curable resin composition and cured product of the present invention can be used as insulating materials, resist materials, etc.

Claims (7)

The composition comprises an active ester resin (A) and a resin (B) having an acid group and a polymerizable unsaturated group,
The curable resin composition is characterized in that the active ester resin (A) contains, as essential reaction raw materials, an aromatic compound (a) having two hydroxyl groups at adjacent positions on an aromatic ring, an aromatic monohydroxy compound (b), and an aromatic compound having two or more carboxyl groups and/or an acid halide or ester thereof (c). The curable resin composition according to claim 1, wherein the aromatic compound (a) is at least one compound selected from the group consisting of the following general formulas (1) to (3):

(In the above formula, each R independently represents a hydrocarbon group having 1 to 10 carbon atoms, n represents an integer of 0 to 4, and m represents an integer of 0 to 2.) The curable resin composition according to claim 1 or 2, further comprising a photopolymerization initiator. The curable resin composition according to claim 1 or 2, further comprising a curing agent. A cured product obtained by curing the curable resin composition according to claim 1 or 2. An insulating material comprising the curable resin composition according to claim 1 or 2. A resist member comprising the curable resin composition according to claim 1 or 2.