JP2023037523A - Resin composition having acid group and polymerizable unsaturated group, curable resin composition, cured product, insulating material, and resist member - Google Patents

Abstract

To provide a resin composition which has high photosensitivity and allows a cured product obtained therefrom to exhibit excellent elongation, low elasticity, heat resistance and low dielectric characteristics.SOLUTION: A resin composition having an acid group and a polymerizable unsaturated group contains an aromatic ester compound (A) and a resin (B) having an acid group and a polymerizable unsaturated group. The aromatic ester compound (A) is a compound using an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol compound (a3) as essential reaction raw materials. The polyhydric alcohol compound (a3) has a hydroxyl equivalent of 270 g/eq or more.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a resin composition having an acid group and a polymerizable unsaturated group, a curable resin composition, a cured product, an insulating material, and a resist member.

To prevent solder from adhering to parts other than the mounting part when mounting and soldering electronic parts on a printed wiring board, and to form a film that semi-permanently prevents oxidation or corrosion of wiring. Solder resist is widely used as an insulating material for this purpose. As a technique for forming such a solder resist pattern, there is a photoresist method that can accurately form a fine pattern. Law prevails.

In recent years, printed wiring boards have become increasingly finer, multi-layered, and single-board in order to achieve higher density of electronic components, and the mounting method is also shifting to surface mounting technology (SMT). is transitioning. Therefore, solder resist films are also required to be finer, have higher Tg, higher resolution, higher precision, and higher reliability. Furthermore, along with the increase in the speed of transmission signals, there is a demand in the solder resist market for technology exhibiting a low dielectric constant and a low dielectric loss tangent that reduces time delay for the use of high frequencies (gigahertz band).

A composition containing a reaction product (acid pendant type epoxy acrylate) obtained by reacting an unsaturated monocarboxylic acid with a novolac type epoxy resin and further adding a polybasic acid anhydride to such an alkali-developable liquid photoresist. products are widely used (see Patent Document 1). However, epoxy acrylate is known to have a high dielectric constant due to the formation of hydroxyl groups when the epoxy resin and unsaturated monocarboxylic acid are reacted.

As a technique that can deal with this point, for example, in Patent Document 2, by using a photosensitive resin composition containing an active ester curing agent and a carboxyl group-containing radically polymerizable compound, while improving heat resistance, It is disclosed that properties such as dissipation factor can be improved.

Japanese Patent Publication No. 1-54390 JP 2013-214057 A

However, in Patent Documents 1 and 2, no consideration is given to the elongation and low elasticity of the cured product formed from the composition, and the compositions described in Patent Documents 1 and 2 have these points. There was room for improvement.

Accordingly, an object of the present invention is to provide a resin composition that exhibits high photosensitivity and can exhibit excellent elongation, low elasticity, heat resistance and low dielectric properties in the resulting cured product. . Another object of the present invention is to provide a curable resin composition containing the resin composition, and a cured product, an insulating material, and a resist member obtained using the curable resin composition.

In order to solve the above problems, the present inventors have made intensive studies and found that a composition containing a specific aromatic ester compound and a resin having a specific acid group and a polymerizable unsaturated group exhibits high light intensity. The present inventors have completed the present invention based on the finding that the cured product exhibits sensitivity and exhibits excellent elongation, low elasticity, heat resistance and low dielectric properties.

The resin composition of the present invention is a resin composition having an acid group and a polymerizable unsaturated group containing an aromatic ester compound (A) and a resin (B) having an acid group and a polymerizable unsaturated group. hand,
The aromatic ester compound (A) comprises an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol compound (a3). is a compound that uses , as an essential reaction raw material,
The hydroxyl equivalent of the polyhydric alcohol compound (a3) is 270 g/eq or more.
It is characterized by

［上記一般式（１）中、Ｑ^１１及びＱ^１２はそれぞれ独立して、前記芳香族多価カルボン酸、その酸ハロゲン化物及び／又はそのエステル化物（ａ１）由来の基を表し、Ａｒ^１１及びＡｒ^１２はそれぞれ独立して、前記モノヒドロキシ芳香族化合物（ａ２）由来の基を表し、Ａはそれぞれ独立して、前記多価アルコール化合物（ａ３）由来の基を表し、ｐ^１１は、０．０１以上の平均繰り返し数を表す。］で表される化合物であることが好ましい。 In this embodiment, the aromatic ester compound (A) has the following general formula (1):

[In the above general formula (1), Q ¹¹ and Q ¹² each independently represent a group derived from the aromatic polycarboxylic acid, its acid halide and/or its ester (a1), and Ar ¹¹ and Each Ar ¹² independently represents a group derived from the monohydroxy aromatic compound (a2), each A independently represents a group derived from the polyhydric alcohol compound (a3), p ¹¹ represents 0.0. It represents the average number of repetitions of 01 or more. ] It is preferable that it is a compound represented by.

［上記一般式（２）及び一般式（３）中の＊は、上記一般式（１）中のＡｒ^１１又はＡｒ^１２と結合する酸素原子との結合手を表し、
Ｒ^２１及びＲ^３１はそれぞれ独立して、ハロゲン原子、アルキル基、アルケニル基、アルコキシ基、アリール基又はアラルキル基を表し、ｋ^２１は、０～７の整数を表し、ｋ^３１は、０～５の整数を表す。］で示される構造を表すことが好ましい。 In the present embodiment, in the general formula (1), each A independently represents a linear or branched alkylene group or a linear or branched alkylene ether group,
Q ¹¹ and Q ¹² each independently represent a divalent aromatic group, p ¹¹ represents an average repeating number of 0.01 or more,
Ar ¹¹ and Ar ¹² are each independently represented by the following general formula (2) or (3):

[* in the above general formulas (2) and (3) represents a bond with the oxygen atom that binds to Ar ¹¹ or Ar ¹² in the above general formula (1),
R ²¹ and R ³¹ each independently represent a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group, k ²¹ represents an integer of 0 to 7, k ³¹ is 0 to 5 represents an integer of ] is preferred.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a resin composition that exhibits high photosensitivity and can exhibit excellent elongation, low elasticity, heat resistance and low dielectric properties in the resulting cured product. Moreover, according to the present invention, it is possible to provide a curable resin composition containing the resin composition, and a cured product, an insulating material, and a resist member obtained using the curable resin composition.

1 is a GPC chart of a diphenyl isophthalate derivative (a'-1) obtained in an example.

Hereinafter, embodiments of the present invention (sometimes referred to as "present embodiments") will be described in detail, but the present invention is not limited to the following description, and various modifications are made within the scope of the gist can be implemented by

[Resin Composition Having Acid Group and Polymerizable Unsaturated Group]
The resin composition having an acid group and a polymerizable unsaturated group of the present embodiment comprises an aromatic ester compound (A) (hereinafter also referred to as component (A)) and a resin having an acid group and a polymerizable unsaturated group (B) (hereinafter also referred to as component (B)), and a resin composition having an acid group and a polymerizable unsaturated group. The aromatic ester compound (A) comprises an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol compound (a3). is an essential reaction raw material. Moreover, the hydroxyl group equivalent of the polyhydric alcohol compound (a3) is 270 g/eq or more.
A resin composition having such an acid group and a polymerizable unsaturated group exhibits high photosensitivity and can give a cured product excellent in elongation, low elasticity, heat resistance and low dielectric properties.

The content of the aromatic ester compound (A) in the total amount (100% by mass) of the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment is photosensitivity, elongation, low elasticity, heat resistance and low From the viewpoint of improving the dielectric properties in a well-balanced manner, it is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, preferably 80% by mass or less, and more preferably 50% by mass or less. 30% by mass or less is more preferable.
In addition, the content of the resin (B) having an acid group and a polymerizable unsaturated group in the total amount (100% by mass) of the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment is the photosensitivity, elongation From the viewpoint of improving hardness, low elasticity, heat resistance and low dielectric properties in a well-balanced manner, the content is preferably 20% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, and preferably 99% by mass or less. , 90% by mass or less, and even more preferably 80% by mass or less.

In the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment, the mass ratio of solids between the aromatic ester compound (A) and the resin (B) having an acid group and a polymerizable unsaturated group [(A)/(B)] is preferably in the range of 5/95 to 50/50 from the viewpoint of improving photosensitivity, elongation, low elasticity, heat resistance and low dielectric properties in a well-balanced manner. From the same point of view, the mass ratio [(A)/(B)] is more preferably 10/90 or more, and more preferably 40/60 or less.

The resin composition having an acid group and a polymerizable unsaturated group of this embodiment may further contain an optional additive component as an optional component. Moreover, the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment may be substantially composed only of components (A), (B) and optional additive components. The resin composition having an acid group and a polymerizable unsaturated group of the present embodiment may be composed only of component (A) and component (B). In addition, the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment, in addition to the components (A), (B) and optional additives, is unavoidable as long as the effects of the present disclosure are not impaired. May contain impurities.
The total content of the components (A) and (B) in the total amount (100% by mass) of the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment is photosensitivity, elongation, low elasticity, heat resistance From the viewpoint of improving properties and low dielectric properties in a well-balanced manner, it is preferably 40% by mass or more, more preferably 50% by mass or more, and preferably 95% by mass or less, more preferably 90% by mass or less, and 85% by mass or less. More preferred.

Hereinafter, after explaining the main terms described in the present specification, the aromatic ester compound (A), which is each component contained in the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment , the resin (B) having an acid group and a polymerizable unsaturated group, and an optional additive component.

(Explanation of terms)
Unless otherwise stated herein, the following terms are applicable.

The "aromatic group" used herein preferably has an aromatic ring with 3 to 30 carbon atoms. The "aromatic group" used herein means that the hydrogen atom of the aromatic ring in the aromatic group is a substituent such as an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. It may be substituted by a group or a halogen atom.

Types of the aromatic ring include, for example, monocyclic aromatic rings, condensed aromatic rings, and ring-assembled aromatic rings. Examples of the monocyclic aromatic rings include benzene, furan, pyrrole, thiophene, imidazole, pyrazole, oxazole, isoxazole, thiazole, isothiazole, pyridine, pyrimidine, pyridazine, pyrazine and triazine. Examples of the condensed aromatic ring include naphthalene, anthracene, phenalene, phenanthrene, quinoline, isoquinoline, quinazoline, phthalazine, pteridine, coumarin, indole, benzimidazole, benzofuran, and acridine. Examples of the ring-assembled aromatic ring include biphenyl, binaphthalene, bipyridine, bithiophene, phenylpyridine, phenylthiophene, terphenyl, diphenylthiophene, and quaterphenyl.

In addition, a monovalent aromatic group refers to a group in which one hydrogen atom is removed from the "aromatic group", and a divalent aromatic group refers to a group in which two hydrogen atoms are removed from the "aromatic group". A trivalent to hexavalent aromatic group refers to a group from which 3 to 6 hydrogen atoms are removed from the "aromatic group".

The "aryl group" used herein includes, for example, phenyl group, naphthyl group, phenalenyl group, phenanthrenyl group, anthryl group, azulenyl group, indenyl group, indanyl group, tetralinyl group and the like. In addition, the "aryl group" is a hydrogen atom of an aromatic ring in the aryl group, for example, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom. good too.

As used herein, the "aralkyl group" includes, for example, a benzyl group, a diphenylmethyl group, a biphenyl group, a naphthylmethyl group and the like.

"Alkyl group" as used herein includes, for example, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, tert-pentyl group, neopentyl group, 1,2-dimethylpropyl group, n-hexyl group, isohexyl group, (n-) heptyl group, (n-) octyl group, (n-) nonyl group, (n-) decyl (n-) undecyl, (n-) dodecyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, or cyclononyl groups.

The "alkenyl group" used herein includes ethynyl, 1-propynyl, 2-propynyl, 2-butynyl, pentynyl, hexynyl, vinyl, allyl, and isopropenyl groups.

The "alkoxy group" used herein includes, for example, methoxy, ethoxy, propoxy, isopropoxy, butoxy, pentyloxy, hexyloxy, 2-ethylhexyloxy, octyloxy, nonyloxy, and the like. mentioned.

The "halogen atom" as used herein includes, for example, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like.

The "linear or branched alkylene group" used herein includes, for example, methylene group, ethylene group, propylene group, 1-methylmethylene group, 1,1-dimethylmethylene group, 1-methylethylene group, 1 , 1-dimethylethylene group, 1,2-dimethylethylene group, propylene group, butylene group, 1-methylpropylene group, 2-methylpropylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group , undecylene group, dodecylene group, and the like.

The "linear or branched alkylene ether group" used herein is, for example, an oxymethylene group, an oxyethylene group, an oxypropylene group, an oxy(1-methylmethylene) group, an oxy(1,1-dimethylmethylene) ) group, oxy (1-methylethylene) group, oxy (1,1-dimethylethylene) group, oxy (1,2-dimethylethylene) group, oxybutylene group, oxy (1-methylpropylene) group, oxy (2 -methylpropylene) group, oxypentylene group, oxyhexylene group, oxyheptylene group, oxyoctylene group, oxynonylene group, oxydecylene group, oxyundecylene group, oxydecylene group and the like.

As used herein, a "monovalent hydrocarbon group" is an alkyl group (eg, the alkyl group described above), and one or more -CH ₂ - in the alkyl group are not adjacent to each other, and -O- or It may be substituted with -S-, or one or more -CH ₂ -CH ₂ - in the alkyl group may be substituted with -CH=CH- such that they are not adjacent to each other. Further, the hydrocarbon group may be linear or branched, and may be an alkyl group having 1 to 20 carbon atoms.

As used herein, the “divalent hydrocarbon group” is an alkylene group (eg, the linear or branched alkylene group described above), and one or more —CH ₂ — in the alkylene group are may be substituted with —O— or —S— so as not to be adjacent, or one or more —CH ₂ —CH ₂ — in the alkylene group are substituted with —CH═CH ₂ — such that they are not adjacent to each other; may Further, the hydrocarbon group may be linear or branched, and may be an alkylene group having 1 to 20 carbon atoms.

As used herein, the term "trivalent to hexavalent hydrocarbon group" refers to a group obtained by removing two to five hydrogen atoms at arbitrary positions from an alkyl group (for example, the linear or branched alkyl group described above). and one or more —CH ₂ — in the alkyl group may be substituted with —O— or —S— so that they are not adjacent to each other, or one or more —CH ₂ —CH in the alkyl group ₂ - may be replaced with -CH=CH- so that they are not adjacent to each other. Also, the hydrocarbon group may be linear or branched and may have 1 to 20 carbon atoms.

As used herein, "(meth)acrylate" means acrylate and/or methacrylate. Moreover, in this specification, "(meth)acryloyl" means acryloyl and/or methacryloyl. Furthermore, in this specification, "(meth)acryl" means acryl and/or methacryl.

(Aromatic ester compound (A))
The aromatic ester compound (A) is one of the essential components in the resin composition having an acid group and a polymerizable unsaturated group of this embodiment. In addition, this aromatic ester compound (A) includes an aromatic polycarboxylic acid, an acid halide and/or an ester thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol compound (a3 ) is obtained as an essential reaction raw material.
In addition, the reaction raw material is an aromatic polycarboxylic acid, its acid halide and / or its esterified product (a1), or a compound showing reactivity with the monohydroxy aromatic compound (a2) (e.g., polyhydroxy It may further contain an aromatic compound (a4)). That is, the aromatic ester compound (A) of the present embodiment comprises an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol A compound used as a reaction raw material containing the compound (a3) and the polyhydric hydroxyaromatic compound (a4) may be used.
In principle, the aromatic ester compound (A) obtained from the reaction raw materials has no or almost no hydroxyl groups in its molecule. However, the aromatic ester compound (A) may contain a compound having a hydroxyl group as a by-product of the reaction product within a range that does not impair the effects of the present disclosure.

In the present specification, "aromatic polycarboxylic acid, its acid halide and/or its ester (a1)" may hereinafter be abbreviated as "aromatic polycarboxylic acid (a1)".

Hereinafter, before describing the aromatic polycarboxylic acid (a1), the monohydroxy aromatic compound (a2), and the polyhydric alcohol compound (a3), which are reaction raw materials, the structure of the aromatic ester compound (A) and The characteristics will be explained in detail.

<Structure of aromatic ester compound (A)>
In terms of structure, the aromatic ester compound (A) of the present embodiment is an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (aromatic polycarboxylic acids) (a1) and , the residue of the monohydroxy aromatic compound (a2) and the residue of the polyhydric alcohol compound (a3).

From the viewpoint of another structure, the aromatic ester compound (A) of the present embodiment is an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (aromatic polycarboxylic acids) (a1). a residue of a monohydroxyaromatic compound (a2), a residue of a polyhydric alcohol compound (a3), and a residue of a polyhydric hydroxyaromatic compound (a4).

Further, the aromatic ester compound (A) of the present embodiment includes a carboxylic acid (or an acid halide thereof, an ester thereof) in the aromatic polycarboxylic acids (a1) and a hydroxyl group in the monohydroxy aromatic compound (a2). can have a structure in which an ester bond derived from and is formed.
Similarly, the aromatic ester compound (A) of the present embodiment includes a carboxylic acid (or an acid halide thereof, an ester thereof) in the aromatic polycarboxylic acids (a1) and a hydroxyl group in the polyhydric alcohol compound (a3). can have a structure in which an ester bond derived from and is formed.
Furthermore, the aromatic ester compound (A) of the present embodiment is a carboxylic acid (or acid halide thereof, esterified product thereof) in the aromatic polycarboxylic acids (a1) and a polyvalent hydroxy aromatic compound (a4) can have a structure in which an ester bond derived from the hydroxyl group in is formed.

In the present specification, "aromatic polycarboxylic acid, its acid halide and/or its ester (a1)" is an atomic group containing a carbonyl group (-C (= O) -X (X is It is a compound having an aromatic group in which two or more hydrogen atoms, halogen atoms, hydroxyl groups or monovalent hydrocarbon groups)) are bonded.
In the present specification, the "residue of an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1)" refers to an aromatic ester compound (A) produced by reaction or polymerization. , the partial structure of the aromatic polycarboxylic acid, its acid halide and/or its esterified product (a1) remaining in the aromatic ester compound (A) molecule due to the reaction or polymerization, and the reaction or polymerization It is composed of the formed chemical bond and groups other than the chemical bond, derived from the aromatic polycarboxylic acid, its acid halide and/or its esterified product (a1).
In addition, the term "derived group" as used herein refers to a partial structure other than the chemical bond structure involved in the reaction or polymerization in the product compound formed by the reaction or polymerization. Therefore, "aromatic polycarboxylic acid, its acid halide and / or its esterified product (a1) derived group", aromatic polycarboxylic acid, its acid halide and / or its esterified product from (a1) A divalent or higher group excluding a carbonyl group-containing atomic group (-C(=O)-X (X is a hydrogen atom, a halogen atom, a hydroxyl group or a monovalent hydrocarbon group)), for example, a divalent It may be an aromatic group as described above.

The aromatic polycarboxylic acid, its acid halide and/or its ester (a1) has the following general formula (a1):

で表すことができるが、この場合、Ｑ^ａ１が、芳香族多価カルボン酸、その酸ハロゲン化物及び／又はそのエステル化物（ａ１）由来の基を表し、Ｘが、水素原子、ハロゲン原子、水酸基又は一価の炭化水素基を表し、ｎ^ａ１は２以上６以下の整数を表し、破線部分が、芳香族多価カルボン酸、その酸ハロゲン化物及び／又はそのエステル化物（ａ１）の残基を表す。

In this case, Q ^a1 represents a group derived from an aromatic polyvalent carboxylic acid, its acid halide and / or esterified product (a1), X is a hydrogen atom, a halogen atom, a hydroxyl group or represents a monovalent hydrocarbon group, n ^a1 represents an integer of 2 or more and 6 or less, and the dashed line part represents the residue of the aromatic polyvalent carboxylic acid, its acid halide and / or its esterified product (a1) show.

で表すことができるが、この場合、Ａｒ^ａ２が、モノヒドロキシ芳香族化合物（ａ２）由来の基を表し、モノヒドロキシ芳香族化合物（ａ２）から水酸基又は水酸基を除いた一価の基であり、破線部分が、モノヒドロキシ芳香族化合物（ａ２）の残基を表す。 The term "residue of the monohydroxy aromatic compound (a2)" as used herein refers to a monovalent group obtained by removing a hydrogen atom or a hydroxyl group from the monohydroxy aromatic compound (a2). The "monohydroxy aromatic compound (a2)" has the following general formula (a2):

In this case, Ar ^a2 represents a group derived from the monohydroxy aromatic compound (a2), and is a hydroxyl group or a monovalent group obtained by removing the hydroxyl group from the monohydroxy aromatic compound (a2), The dashed line portion represents the residue of the monohydroxy aromatic compound (a2).

で表すことができるが、この場合、Ａ^ａ３が、多価アルコール化合物（ａ３）由来の基を表し、多価アルコール化合物（ａ３）から水素原子又は水酸基を除いたｎ^ａ３価の基であり、ｎ^ａ３は２以上６以下の整数を表す。ｎ^ａ３は、２であることが好ましい。
なお、多価ヒドロキシ芳香族化合物（ａ４）は、芳香族基中の芳香族環の２以上６以下の水素原子のみが水酸基に置換された化合物であるのに対して、多価アルコール化合物（ａ３）は、当該多価ヒドロキシ芳香族化合物（ａ４）以外の多価アルコール類である。 The term "residue of the polyhydric alcohol compound (a3)" used herein refers to a divalent or higher polyvalent group obtained by removing two or more hydrogen atoms or hydroxyl groups from the polyhydric alcohol compound (a3). The "polyhydric alcohol compound (a3)" has the following general formula (a3):

In this case, A ^a3 represents a group derived from the polyhydric alcohol compound (a3), and is an na trivalent group obtained by removing a hydrogen atom or a hydroxyl group ^from the polyhydric alcohol compound (a3), n ^a3 represents an integer of 2 or more and 6 or less. n ^a3 is preferably two.
The polyhydric hydroxy aromatic compound (a4) is a compound in which only 2 to 6 hydrogen atoms of the aromatic ring in the aromatic group are substituted with hydroxyl groups, whereas the polyhydric alcohol compound (a3 ) is a polyhydric alcohol other than the polyhydric hydroxyaromatic compound (a4).

で表すことができるが、この場合、Ａｒ^ａ４が、多価ヒドロキシ芳香族化合物（ａ４）由来の基を表し、多価ヒドロキシ芳香族化合物（ａ４）からｎ^ａ４個の水素原子又は水酸基を除いたｎ価の基であり、ｎ^ａ４は２～６の整数を表す。ｎ^ａ４は、２であることが好ましい。
なお、多価ヒドロキシ芳香族化合物（ａ４）は、芳香族基中の芳香族環の２以上６以下の水素原子のみが水酸基に置換された化合物である。 The term "residue of the polyvalent hydroxyaromatic compound (a4)" used herein refers to a divalent or higher polyvalent group obtained by removing a hydrogen atom or a hydroxyl group from the polyvalent hydroxyaromatic compound (a4). The "polyhydric hydroxyaromatic compound (a4)" has the following general formula (a4):

In this case, Ar ^a4 represents a group derived from the polyvalent hydroxy aromatic compound (a4), and na4 hydrogen atoms or hydroxyl groups are removed from the polyvalent hydroxy aromatic compound ( ^a4 ) It is an n-valent group, and n ^a4 represents an integer of 2-6. n ^a4 is preferably two.
The polyvalent hydroxyaromatic compound (a4) is a compound in which only 2 to 6 hydrogen atoms in the aromatic ring in the aromatic group are substituted with hydroxyl groups.

The values such as “monovalent” and “bivalent” used herein simply indicate the number of bonds, and correspond to the number of ester bonds contributed by one molecule of each compound.

Further, the groups derived from the aromatic polycarboxylic acids (a1) in the aromatic ester compound (A) may be divalent to hexavalent. In other words, in the aromatic ester compound (A), 2 to 6 carboxylic acids (or acid halides thereof, esters thereof) contained in one molecule of the aromatic polycarboxylic acids (a1) are converted into an ester It may have a structure that contributes to binding.
Similarly, the group derived from the polyhydric alcohol compound (a3) in the aromatic ester compound (A) may be divalent to hexavalent. In other words, in the aromatic ester compound (A), 2 to 6 hydroxyl groups contained in one molecule of the polyhydric alcohol compound (a3) may have a structure that contributes to an ester bond.

More specifically, the aromatic ester compound (A) of the present embodiment has a partial structure represented by the following general formula (i), in which identical or different aromatic rings are linked via an ester bond, Residues of the polyhydric alcohol compound (a3) (e.g., divalent to hexavalent hydrocarbon groups having at least carbon and hydrogen in the molecule of the polyhydric alcohol compound (a3) (as examples of divalent to hexavalent hydrocarbon groups is an alkylene chain or an alkylene ether chain (wherein the —CH ₂ — group in the alkylene chain or the alkylene ether chain may be substituted with a divalent aromatic group)), and an optional polyvalent and the residue of the hydroxy aromatic compound (a4) are linked together.

（上記一般式（ｉ）中、Ａｒ^ｉ１は一価の芳香族基を表し、Ａｒ^ｉ２は、二価の芳香族基を表し、上記一般式（ｉ）中の破線は他の原子との結合手を表す。）

(In general formula (i) above, Ar ⁱ¹ represents a monovalent aromatic group, Ar ⁱ² represents a divalent aromatic group, and the dashed line in general formula (i) represents a bond with another atom. represents a hand.)

The same or different aromatic rings correspond to aromatic rings in the molecule of the aromatic polycarboxylic acids (a1) or the monohydroxy aromatic compound (a2). More specifically, the monovalent aromatic group Ar ⁱ¹ in the general formula (i) corresponds to an aromatic ring in the molecule of the monohydroxy aromatic compound (a2), The divalent aromatic group Ar ⁱ² in the above corresponds to aromatic polyvalent carboxylic acids (a1).

According to the above, the aromatic ring, which is a rigid mesogenic skeleton, and the alkylene chain, which is a flexible segment, coexist in the same molecule of the aromatic ester compound (A) with a certain regularity (repeating unit). , a cured product can be formed as an excellent insulating material due to low dielectric properties and elongation.

［上記一般式（１）中、Ｑ^１１及びＱ^１２はそれぞれ独立して、芳香族多価カルボン酸、その酸ハロゲン化物及び／又はそのエステル化物（ａ１）由来の基を表し、Ａｒ^１１及びＡｒ^１２はそれぞれ独立して、モノヒドロキシ芳香族化合物（ａ２）由来の基を表し、Ａはそれぞれ独立して、多価アルコール化合物（ａ３）由来の基を表し、ｐ^１１は、０．０１以上の平均繰り返し数を表す。］で表される化合物であることが好ましい。
なお、上記「由来の基」は、説明の便宜上、一般式（１）中の記号と各原料成分との対応関係を表す用語であって、反応によって芳香族エステル化合物（Ａ）内に残る各反応原料由来の構造部位を全て表すものではない。 The aromatic ester compound (A) of the present embodiment has the following general formula (1):

[In the above general formula (1), Q ¹¹ and Q ¹² each independently represent a group derived from an aromatic polycarboxylic acid, its acid halide and/or its ester (a1), and Ar ¹¹ and Ar ¹² each independently represents a group derived from the monohydroxy aromatic compound (a2), each A independently represents a group derived from the polyhydric alcohol compound (a3), and p ¹¹ is 0.01 or more. represents the average number of repetitions. ] It is preferable that it is a compound represented by.
In addition, for convenience of explanation, the above-mentioned "derived group" is a term representing the correspondence between the symbol in the general formula (1) and each raw material component, and each remaining in the aromatic ester compound (A) due to the reaction It does not represent all structural sites derived from reactants.

Q ¹¹ and Q ¹² in the general formula (1) are each independently a group derived from an aromatic polyvalent carboxylic acid, an acid halide thereof and/or an ester thereof (a1) (hereinafter referred to as an aromatic polyvalent Also referred to as a group derived from carboxylic acids (a1)). The group derived from the aromatic polycarboxylic acids (a1) is, for example, preferably a divalent aromatic group, more preferably an unsubstituted divalent aromatic group. Q ¹¹ and Q ¹² in the general formula (1) are preferably divalent aromatic groups. Examples of the divalent aromatic group include groups obtained by removing two hydrogen atoms from the above examples of aromatic rings having 3 to 30 carbon atoms. Among them, Q ¹ and Q ² are more preferably phenylene group, naphthalenediyl group or anthracenediyl group. Also, Q ¹¹ and Q ¹² may be the same as or different from each other. Among them, Q ¹¹ and Q ¹² are more preferably phenylene groups from the viewpoint of industrial availability of raw materials and solubility.

A in the general formula (1) represents a group derived from the polyhydric alcohol compound (a3), and is a hydrocarbon bond (divalent to hexavalent hydrocarbon group), carbonate bond, ester bond, ether bond, urethane It may also contain at least one bond structure selected from the group consisting of a bond and a siloxane bond.

The group derived from the polyhydric alcohol compound (a3) preferably has 2 to 20 carbon atoms, more preferably 4 to 18 carbon atoms. When the number of carbon atoms of A corresponding to the flexible segment in the general formula (1) is within the above range, the aromatic ester compound (A) has excellent compatibility, which is a preferred embodiment. Moreover, the residue of the polyhydric alcohol compound (a3) is preferably linear or branched, more preferably linear.
Furthermore, the group derived from the polyhydric alcohol compound (a3) is a linear or branched alkylene group or a linear or branched alkylene ether group, and the alkylene group or alkylene —CH ₂ — in the ether group may be substituted with —O— or —S— so that they are not adjacent to each other, or one or more —CH ₂ —CH ₂ — in the alkylene group are not adjacent to each other , may be substituted with at least one selected from the group consisting of -CH=CH-, a carbonate bond, an ester bond, an ether bond, a urethane bond, and a siloxane bond.

［上記一般式（２）及び一般式（３）中の＊は、上記一般式（１）中のＡｒ^１１又はＡｒ^１２と結合する酸素原子との結合手を表し、
Ｒ^２１及びＲ^３１はそれぞれ独立して、ハロゲン原子、アルキル基、アルケニル基、アルコキシ基、アリール基又はアラルキル基を表し、ｋ^２１は、０～７の整数を表し、ｋ^３１は、０～５の整数を表す。］で表されることが好ましい。 Ar ¹¹ and Ar ¹² in the above general formula (1) each independently represent a group derived from the monohydroxy aromatic compound (a2), and the following general formula (2) or (3):

[* in the above general formulas (2) and (3) represents a bond with the oxygen atom that binds to Ar ¹¹ or Ar ¹² in the above general formula (1),
R ²¹ and R ³¹ each independently represent a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group, k ²¹ represents an integer of 0 to 7, k ³¹ is 0 to 5 represents an integer of ] is preferably represented.

In general formula (1) above, Ar ¹¹ is preferably a group having a structure represented by general formula (3) above. In general formula (1) above, Ar ¹² is preferably a group having a structure represented by general formula (3) above.

R ²¹ in the general formula (2) is preferably a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group. from the viewpoint of flexibility, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a benzyl group, an aralkyl group such as a diphenylmethyl group or a naphthylmethyl group, or a phenyl group, a naphthyl group, An arylene group such as a phenalenyl group, a phenanthrenyl group or an anthryl group is more preferred.

R ³¹ in the general formula (3) is preferably a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group. from the viewpoint of flexibility, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a benzyl group, an aralkyl group such as a diphenylmethyl group or a naphthylmethyl group, or a phenyl group, a naphthyl group, An arylene group such as a phenalenyl group, a phenanthrenyl group or an anthryl group is more preferred.

k ²¹ in the general formula (2) represents an integer of 0 to 7, but from the viewpoint of reactivity or flexibility of the resulting cured product, it is more preferably an integer of 0 to 5, and 0 to 4 is more preferably an integer of In addition, k ³¹ in the general formula (3) represents an integer of 0 to 5, and more preferably an integer of 0 to 4 from the viewpoint of reactivity or flexibility of the resulting cured product.

p ¹¹ in the general formula (1) is an average number of repetitions of 0.01 or more, and among them, from the viewpoint of workability and flexibility of the resulting cured product, the average number of repetitions is 0.1 to 5. is more preferable, and an average repetition number of 0.2 to 5 is even more preferable.

The average repetition number p ¹ of the aromatic ester compound (A) is calculated from the charge ratio by the following formula (1).
Formula (1): (Average repeating number p ¹ in the obtained aromatic ester compound (A)) = (Number of moles of hydroxyl groups in the polyhydric alcohol compound (a3)) / [(Active ester produced from the reaction raw material Number of moles of active ester groups in the group-containing intermediate (a′))−(number of moles of hydroxyl groups in (a3) in the polyhydric alcohol compound)]
The active ester group-containing intermediate product (a') reacts an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1) with a monohydroxy aromatic compound (a2). It is a reaction product used as a raw material.

［上記一般式（１’）中、Ｑ^１１、Ｑ^１２及びＱ^１３はそれぞれ独立して、芳香族多価カルボン酸、その酸ハロゲン化物及び／又はそのエステル化物（ａ１）由来の基を表し、Ａｒ^１１及びＡｒ^１２はそれぞれ独立して、モノヒドロキシ芳香族化合物（ａ２）由来の基を表し、Ａｒ^１３は、多価ヒドロキシ芳香族化合物（ａ４）由来の基を表し、Ａはそれぞれ独立して、多価アルコール化合物（ａ３）由来の基を表し、ｐ^１１は、０．０１以上の平均繰り返し数である。］で示される化合物であることが好ましい。 Another form of the aromatic ester compound (A) of the present embodiment is the following general formula (1′):

[In the above general formula (1′), Q ¹¹ , Q ¹² and Q ¹³ each independently represent a group derived from an aromatic polycarboxylic acid, an acid halide thereof and/or an ester thereof (a1), Ar ¹¹ and Ar ¹² each independently represent a group derived from the monohydroxy aromatic compound (a2), Ar ¹³ represents a group derived from the polyhydric hydroxy aromatic compound (a4), and A each independently represents , represents a group derived from the polyhydric alcohol compound (a3), and p ¹¹ is an average repeating number of 0.01 or more. ] is preferable.

<Reactive raw material for aromatic ester compound (A)>
The raw materials for the aromatic ester compound (A) are described below.

-Aromatic polycarboxylic acid, its acid halide and/or ester (a1)-
In the present embodiment, the aromatic polycarboxylic acid, its acid halide and/or esterified product (a1) (compound having a partial structure represented by ^Q11 and/or ^Q12 in the general formula (1)) is , carboxylic acids having two or more carboxyl groups, or derivatives thereof, specifically carboxylic oxides, acid halides or esters. the aromatic polycarboxylic acids (a1), and a monohydroxy aromatic compound (a2) described later) (a compound having a partial structure represented by Ar ¹¹ and/or Ar ¹² in the general formula (1)); By using a polyhydric alcohol compound (a3) (a compound having a partial structure represented by A in the general formula (1)) as a reaction raw material, in the structure of the aromatic ester compound (A), the poly A structural site having flexibility derived from the functional alcohol compound (a3) (e.g., A in the general formula (1)) and an aromatic ring having high curability at the end (e.g., Q ¹¹ in the general formula (1) and/or an ester group (specifically, a polyaryloxycarbonyl structure) having Q ¹² and Ar ¹¹ and/or Ar ¹² ), and high reaction activity. have

Aromatic polycarboxylic acids (a1) are typically compounds in which at least two carboxyl groups or the like are bonded to a substituted or unsubstituted aromatic ring. However, the portion such as the carboxyl group, other than the carboxyl group, acyl halide group such as acyl fluoride group, acyl chloride group, acyl bromide group; alkyloxycarbonyl group such as methyloxycarbonyl group, ethyloxycarbonyl group an aryloxycarbonyl group such as a phenyloxycarbonyl group and a naphthyloxycarbonyl group; That is, when the portion such as the carboxyl group is a halogenated acyl group, the aromatic polyvalent carboxylic acid (a1) is an acid halide. Similarly, when the portion such as the carboxyl group is an alkyloxycarbonyl group or an aryloxycarbonyl group, the aromatic polycarboxylic acids (a1) are esterified products. The aromatic polycarboxylic acids (a1) preferably have a carboxyl group, a halogenated acyl group, and an aryloxycarbonyl group, and more preferably have a carboxyl group and a halogenated acyl group, and a carboxyl group and an acyl chloride. It is more preferred to have an acyl bromide group.

Moreover, the aromatic ring is not particularly limited, but includes a monocyclic aromatic ring, a condensed ring aromatic ring, a ring-aggregated aromatic ring, and an aromatic ring linked by an alkylene chain. The aromatic ring is preferably a monocyclic aromatic ring or a condensed aromatic ring from the viewpoints of the flexibility of the resulting cured product, the ease of industrial availability of raw materials, and workability.

The valence (number) of the carboxyl groups in the aromatic polycarboxylic acids (a1) is preferably divalent to tetravalent, more preferably divalent.

Specific examples of aromatic polycarboxylic acids (a1) include benzenedicarboxylic acids such as isophthalic acid, terephthalic acid, 5-allylisophthalic acid, and 2-allylterephthalic acid; trimellitic acid, 5-allyltrimellitic acid, and the like. benzenetricarboxylic acid of; naphthalene-1,4-dicarboxylic acid, naphthalene-1,5-dicarboxylic acid, naphthalene-2,3-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, naphthalenedicarboxylic acids such as 3-allylnaphthalene-1,4-dicarboxylic acid and 3,7-diallylnaphthalene-1,4-dicarboxylic acid; pyridinetricarboxylic acids such as 2,4,5-pyridinetricarboxylic acid; triazinecarboxylic acids such as 5-triazine-2,4,6-tricarboxylic acid; and acid halides and esters thereof.

Among the above-mentioned examples, the aromatic polycarboxylic acids (a1) include benzenedicarboxylic acid, benzenetricarboxylic acid, and naphthalene from the viewpoint of the flexibility of the resulting cured product, the ease of industrial availability of raw materials, and workability. Dicarboxylic acids, preferably acid halides thereof, isophthalic acid, terephthalic acid, naphthalene-1,5-dicarboxylic acid, naphthalene-2,3-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2 ,7-dicarboxylic acid and 1,3,5-benzenetricarboxylic acid. Acid halides thereof are more preferred, and isophthaloyl chloride and terephthaloyl chloride are even more preferred.
The aromatic polycarboxylic acids (a1) may be used singly or in combination of two or more.

-Monohydroxy aromatic compound (a2)-
The monohydroxy aromatic compound (a2) is an aromatic compound having one aromatic hydroxyl group. Specific examples of the monohydroxyaromatic compound (a2) include alkylphenols such as phenol, o-cresol, m-cresol, p-cresol, 2,4-xylenol, 2,6-xylenol, and tertiary butylphenol; o- Aralkylphenols such as phenylphenol, p-phenylphenol, 2-benzylphenol, 4-benzylphenol, styrenated phenol and 4-(α-cumyl)phenol; and naphthol compounds such as 1-naphthol and 2-naphthol. Among these, o-cresol and naphthol are preferable as the monohydroxy aromatic compound (a2) from the viewpoint of better dielectric properties.
The monohydroxy aromatic compound (a2) may be used singly or in combination of two or more.

- Polyhydric alcohol compound (a3) -
In the present embodiment, the polyhydric alcohol compound (a3) is a compound having at least two hydroxyl groups and belongs to a group of compounds also called polyols. Moreover, the polyhydric alcohol compound (a3) in the present embodiment needs to have a hydroxyl equivalent of 270 g/eq or more. By setting the hydroxyl equivalent to 270 g/eq or more, the properties derived from the polyhydric alcohol compound (a3) are likely to be exhibited, and the flexibility of the cured product can be improved. From the same point of view, the hydroxyl equivalent of the polyhydric alcohol compound (a3) is preferably 300 g/eq or more. Moreover, the hydroxyl group equivalent of the polyhydric alcohol compound (a3) is not particularly limited, but can be 10000 g/eq or less. In addition, the said hydroxyl-group equivalent is a value measured based on JISK0070.

The valence (number) of hydroxyl groups in the polyhydric alcohol compound (a3) is preferably divalent to hexavalent, more preferably divalent.

The polyhydric alcohol compound (a3) may or may not contain an aromatic ring. The polyhydric hydroxy aromatic compound (a4), which is an optional component, is a compound in which only 2 to 6 hydrogen atoms of the aromatic ring in the aromatic group are substituted with hydroxyl groups, whereas the polyhydric alcohol compound (a3) contains a polyol other than the polyhydric hydroxyaromatic compound (a4).
Moreover, the polyhydric alcohol compound (a3) is preferably a polyol having an aliphatic hydroxyl group. A segment derived from a polyol having an aliphatic hydroxyl group has low polarity and is more flexible, so that it can effectively improve the low dielectric properties and flexibility of the resulting aromatic ester compound (A).
The polyhydric alcohol compound (a3) may be used singly or in combination of two or more.

Examples of polyols having aliphatic hydroxyl groups include hydrocarbon-based polyols (a3-1), polycarbonate polyols (a3-2), polyester polyols (a3-3), polyether polyols (a3-4), and polyurethane polyols. (a3-5) and polysiloxane polyol (a3-6). Among them, polyols having an aliphatic hydroxyl group include, from the viewpoint of flexibility and heat resistance, hydrocarbon-based polyols (a3-1), polycarbonate polyols (a3-2), polyester polyols (a3-3), poly Ether polyol (a3-4) and polysiloxane polyol (a3-6) are preferred.

-- Hydrocarbon polyol (a3-1) --
The hydrocarbon polyol (a3-1) includes, for example, a hydrocarbon monomer polyol containing a hydrocarbon monomer such as ethylene, propylene, butadiene, or styrene as an essential constituent monomer; a diol compound synthesized from a dimer acid; are mentioned. Among these, the hydrocarbon-based polyol (a3-1) is preferably a hydrocarbon-monomer-based polyol, more preferably a butadiene-based polyol containing a butadiene monomer as an essential constituent monomer, from the viewpoint of flexibility.

The hydrocarbon monomer-based polyol may be one obtained by copolymerizing other polymerizable monomers. Examples of other polymerizable monomers include aliphatic monoolefin compounds such as butylene, pentene, 2-methyl-1-pentene, hexene, 3-methyl-1-hexene, and 3-methyl-2-hexene; Alicyclic monoolefin compounds; styrene compounds such as 4-methylstyrene and α-methylstyrene; methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl Acrylic acid ester compounds such as (meth)acrylate and 2-(dimethylamino)ethyl (meth)acrylate; Vinyl ester compounds such as vinyl acetate and vinyl propionate; Vinyl ether compounds such as vinyl methyl ether and vinyl ethyl ether; Vinyl methyl ketone , vinyl ketone compounds such as methyl isopropenyl ketone; acrylic acid, methacrylic acid, maleic acid, maleic anhydride, itaconic acid, ethylenically unsaturated carboxylic acids such as itaconic anhydride; (meth) acrylonitrile, (meth) acrylamide, vinylpyridine , nitrogen atom-containing compounds such as vinylpyrrolidone; and halogen atom-containing compounds such as vinyl chloride, vinylidene chloride and vinyl fluoride. These other polymerizable monomers may be used singly or in combination of two or more.

A commercially available product may be used as the hydrocarbon monomer-based polyol. Commercially available products include, for example, G series manufactured by Nippon Soda Co., Ltd. (“G-1000” number average molecular weight (Mn) 1400, hydroxyl value 68 to 78 mgKOH/g, “G-2000” number average molecular weight (Mn) 1900, hydroxyl value of 35 to 55 mgKOH/g, "G-3000" number average molecular weight (Mn) of 3000, hydroxyl value of 27 mgKOH/g or more, all of which are hydroxyl-terminated polybutadiene), and the like.

A commercially available diol compound may be used as the diol compound synthesized from the dimer acid. Examples of commercially available products include Pripol 2033 (hydroxyl value: 202 to 212 mgKOH/g) manufactured by Croda Japan.

The number average molecular weight (Mn) of the hydrocarbon-based polyol (a3-1) is preferably from 500 to 10,000, more preferably from 700 to 6,000, even more preferably from 900 to 4,000. When the number average molecular weight is within the above range, the dielectric properties and workability of the obtained aromatic ester compound (A) can be further improved.
In addition, in this specification, the number average molecular weight (Mn) adopts the value published by the manufacturer or the value obtained by measuring by gel permeation chromatography (GPC).

-- Polycarbonate polyol (a3-2) --
Polycarbonate polyols (a3-2) include, for example, polyols obtained by imparting hydroxyl groups to the terminals of reaction products of carbonate esters and/or phosgene and low-molecular-weight polyols.

Carbonic esters include, for example, methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclocarbonate, diphenyl carbonate and the like.

The number of carbon atoms in the low-molecular-weight polyol is preferably 2 to 20, more preferably 4 to 18, from the viewpoint of imparting flexibility. Specific examples of low-molecular-weight polyols include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 1,2-propanediol, 1,3-propanediol, dipropylene glycol, tripropylene glycol, 1 , 2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,5-hexanediol, 1,6-hexanediol, 2, 5-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, 2-methyl -1,3-propanediol, neopentyl glycol, 2-butyl-2-ethyl-1,3-propanediol, 3-methyl-1,5-pentanediol, 2-ethyl-1,3-hexanediol, 2 -methyl-1,8-octanediol, 1,4-cyclohexanedimethanol, hydroquinone, resorcinol, bisphenol A, bisphenol F, 4,4'-biphenol and the like.

Polycarbonate polyols (a3-2) include aliphatic polycarbonate polyols and alicyclic polycarbonate polyols (for example, those obtained by reacting cyclohexanedimethanol and its derivatives). Among these, aliphatic polycarbonate polyols are preferred as the polycarbonate polyol (a3-2) from the viewpoint of flexibility.

The number average molecular weight (Mn) of the polycarbonate polyol (a3-2) is preferably 500-5000, more preferably 800-3000. When the number average molecular weight is within the above range, the workability of the obtained aromatic ester compound (A) can be further improved.

A commercially available product may be used as the polycarbonate polyol (a3-2). Examples of commercially available products include Kuraray polyol series "C-2090" and "PHC" manufactured by Kuraray Co., Ltd., and polycarbonate diol "Duranol" manufactured by Asahi Kasei Corporation.

--Polyester polyol (a3-3)--
Examples of the polyester polyol (d-3) include dibasic acids such as terephthalic acid, isophthalic acid, adipic acid, azelaic acid and sebacic acid, dialkyl esters thereof, or mixtures thereof, ethylene glycol, propylene glycol, diethylene glycol, butylene glycol, neopentyl glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,6-hexanediol, 3-methyl-1,5- Polyester polyols obtained by reacting glycols such as pentanediol, 3,3'-dimethylolheptane, polyoxyethylene glycol, polyoxypropylene glycol, polytetramethylene ether glycol, or mixtures thereof; polycaprolactone, polyvalero polyester polyols obtained by ring-opening polymerization of lactones such as lactones and poly(β-methyl-γ-valerolactone);

The number average molecular weight (Mn) of the polyester polyol (a3-3) is preferably 500-5000, more preferably 800-3000. When the number average molecular weight is within the above range, the dielectric properties and workability of the obtained aromatic ester compound (A) can be further improved.

Commercially available products may be used as the polyester polyol (a3-3). Commercially available products include, for example, Polylight series manufactured by DIC.

--Polyether polyol (a3-4)--
Examples of the polyether polyol (a3-4) include oxirane compounds such as ethylene oxide, propylene oxide, butylene oxide and tetrahydrofuran, water or low molecular weight polyols such as ethylene glycol, propylene glycol, trimethylolpropane, glycerin and bisphenol A. and a polyether polyol obtained by polymerization using as an initiator.

The number average molecular weight (Mn) of the polyether polyol (a3-4) is preferably 500-5000, more preferably 800-3000. When the number average molecular weight is within the above range, the dielectric properties and workability of the obtained aromatic ester compound (A) can be further improved.

A commercially available product may be used as the polyether polyol (a3-4). Commercially available products include, for example, SANNIX GP-400, GP-600, GP-1000, GP-1500, GP-3000, GP-4000V, GA-5000S, FA-908, FA-961, manufactured by Sanyo Kasei Co., Ltd. FA-921, FA-703, FA-757; Actcole G-28, MN-5000, MN-4000, P-31, MN-1500 manufactured by Mitsui Chemicals, Inc.; Exenol 1030, 4030, 5030 manufactured by AGC Corporation, 230, 828, 837, Preminol 3005, 3010, 3015, 3020, 7001, 7006, 7012, Preminol S3006, 3011, Preminol 7021 (tetrafunctional);

-- Polyurethane polyol (a3-5) --
Polyurethane polyols (a3-5) include, for example, polyurethane polyols obtained by reacting various polyols described above with polyisocyanate at an NCO/OH ratio of less than 1. The NCO/OH ratio is more preferably 0.9 or less.

Examples of the polyisocyanate include aromatic polyisocyanates such as tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, and triphenylmethane triisocyanate; 1,6-hexamethylene diisocyanate, isophorone diisocyanate, 4 ,4′-methylenebis(cyclohexyl isocyanate), lysine diisocyanate, trimethylhexamethylene diisocyanate, 1,3-(isocyanatomethyl)aliphatic polyisocyanates such as cyclohexane; biuret forms of these aromatic or aliphatic polyisocyanates, or Derivatives (modified products) of polyisocyanates such as isocyanurate derivatives of these aromatic or aliphatic polyisocyanates, adducts obtained by modifying these aromatic or aliphatic polyisocyanates with trimethylolpropane, and the like.

The number average molecular weight (Mn) of the polyurethane polyol (a3-5) is preferably 500-5000, more preferably 800-3000. When the number average molecular weight is within the above range, the dielectric properties and workability of the obtained aromatic ester compound (A) can be further improved.

A commercially available product may be used as the polyurethane polyol (a3-5).

-- Polysiloxane polyol (a3-6) --
Examples of the polysiloxane polyol (a3-6) include hydroxyl-terminated dimethylpolysiloxane and hydroxyl-terminated methylphenylpolysiloxane.

The number average molecular weight (Mn) of the polysiloxane polyol (a3-6) is preferably 500-5000, more preferably 800-3000. When the number average molecular weight is within the above range, the dielectric properties and workability of the obtained aromatic ester compound (A) can be further improved.

A commercially available product may be used as the polysiloxane polyol (a3-6). Commercial products include, for example, Shin-Etsu Chemical Co., Ltd. "KF-6000", "KF-6001", "KF-6002", "KF-6003", "X-22-176DX", "X-22- 176F", "X-22-176-GX-A", "Silaplane FM-4411", "Silaplane FM-4421", and "Silaplane FM-4425" manufactured by JNC Corporation.

-Compound showing reactivity with aromatic polycarboxylic acids (a1) or monohydroxy aromatic compound (a2)-
The starting material for the aromatic ester compound (A) may optionally further contain a compound that exhibits reactivity with the aromatic polycarboxylic acids (a1) or the monohydroxyaromatic compound (a2). Such compounds include polyvalent hydroxyaromatic compounds (a4), specifically dihydroxyaromatic compounds, trihydroxyaromatic compounds, tetrahydroxyaromatic compounds, pentahydroxyaromatic compounds or hexahydroxyaromatic compounds compound and the like. Preferred polyvalent hydroxyaromatic compounds (a4) include m-dihydroxybenzene, 2,4-toluenediol, 3,5-toluenediol, p-xylene-2,6-diol, m-xylene-4,6- Diol, p-dihydroxybenzene, 2,5-toluenediol, p-xylene-2,5-diol and the like.
The polyhydric hydroxyaromatic compound (a4) may be used singly or in combination of two or more.

［上記一般式（１）中、Ａはそれぞれ独立して、直鎖状若しくは分岐鎖状のアルキレン基、又は直鎖状若しくは分岐鎖状のアルキレンエーテル基を表し、
Ｑ^１１及びＱ^１２はそれぞれ独立して、二価の芳香族基を表し、
Ａｒ^１１及びＡｒ^１２はそれぞれ独立して、下記一般式（２）又は（３）：

［上記一般式（２）及び一般式（３）中の＊は、上記一般式（１）中のＡｒ^１１又はＡｒ^１２と結合する酸素原子との結合手を表し、
Ｒ^２１及びＲ^３１はそれぞれ独立して、ハロゲン原子、アルキル基、アルケニル基（アリル基等）、アルコキシ基、アリール基又はアラルキル基を表し、ｋ^２１は、０～７の整数を表し、ｋ^３１は、０～５の整数を表す。］で示される構造を表し、
ｐ^１１は、０．０１以上の平均繰り返し数を表す。］で表されることが好ましい。 <Preferred Form of Aromatic Ester Compound (A)>
The aromatic ester compound (A) of the present embodiment has the following general formula (1):

[In the above general formula (1), each A independently represents a linear or branched alkylene group or a linear or branched alkylene ether group,
Q ¹¹ and Q ¹² each independently represent a divalent aromatic group,
Ar ¹¹ and Ar ¹² are each independently represented by the following general formula (2) or (3):

[* in the above general formulas (2) and (3) represents a bond with the oxygen atom that binds to Ar ¹¹ or Ar ¹² in the above general formula (1),
R ²¹ and R ³¹ each independently represent a halogen atom, an alkyl group, an alkenyl group (such as an allyl group), an alkoxy group, an aryl group or an aralkyl group; k ²¹ represents an integer of 0 ^to 7; represents an integer from 0 to 5. ] Represents a structure represented by
p ¹¹ represents the average repetition number of 0.01 or more. ] is preferably represented.

The aromatic ester compound (A) represented by the general formula (1) contains a chain alkylene group or alkylene ether group having a plurality of ester bonds and relatively low polarity, so that the flexible segment It becomes easy to function as, and it is possible to obtain a cured product excellent in flexibility or low dielectric properties, which is useful.

An example of a more preferable form of the aromatic ester compound (A) of the present embodiment is represented by the general formula (1), in which each A is independently linear or branched represents a linear alkylene group (alkylene group having 1 to 30 carbon atoms) or a linear or branched alkylene ether group (alkylene ether group having 1 to 30 carbon atoms), and Q ¹¹ and Q ¹² are each independently represents a 1,3-phenylene group or a 1,4-phenylene group, p ¹¹ represents an average repeating number of 0.01 or more and 10 or less,
Ar ¹¹ and Ar ¹² each independently represent a structure represented by the general formula (2) or (3);
* in the general formulas (2) and (3) represents a bond with the oxygen atom that bonds to Ar ¹¹ or Ar ¹² in the general formula (1),
R ²¹ and R ³¹ each independently represent a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group, k ²¹ represents an integer of 0 to 7, k ³¹ is Represents an integer from 0 to 5. ] is preferably represented.

A in the general formula (1) is preferably a linear or branched alkylene group or a linear or branched alkylene ether group, a linear alkylene group or a linear A chain alkylene ether group is more preferred, and from the viewpoint of thermal decomposition resistance, a linear alkylene ether group is even more preferred.

<Another Preferred Form of the Aromatic Ester Compound (A)>
As another preferable form of the aromatic ester compound (A) of the present embodiment, the ester compound (a') (also referred to as intermediate product (a')) is reacted with the polyhydric alcohol compound (a3). The reaction product used as the raw material (I), wherein the ester compound (a') is an aromatic polyvalent carboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), and a monohydroxy aromatic compound ( It can be a reaction product using a2) and the reaction raw material (II).

An ester compound (a') having an ester bond is obtained by reacting the aromatic polycarboxylic acid (a1) with the monohydroxy aromatic compound (a2). On the other hand, by reacting the ester compound (a′) and the polyhydric alcohol compound (a3), an ester exchange reaction occurs, and a group containing an aromatic ring at the end (eg, an aryloxycarbonyl group) is contained. An aromatic ester compound (A) can be obtained.
Therefore, the aromatic ester compound (A) of the present embodiment is, for example, the reaction product of the aromatic polycarboxylic acid (a1) and the monohydroxy aromatic compound (a2), the polyhydric alcohol compound (a3) (For example, a compound having two or more hydroxyl groups and a linear or branched alkylene chain or a linear or branched alkylene ether chain). is preferred.

In the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment, by using the aromatic ester compound (A), it has a low dielectric loss tangent, and more elongation, low elasticity, and excellent heat resistance. A cured product is obtained, which is a preferred embodiment. Although the reason is not necessarily clear, the aromatic ester compound (A) contains an aryloxycarbonyl group (for example, the partial structure represented by the above general formula (i), more specifically, the Since it contains an ester structure having Q ¹¹ and/or Q ¹² and Ar ¹¹ and/or Ar ¹² at the terminal, it exhibits high reactivity with the epoxy group or the like possessed by the component (B) or the curing agent, which will be described later. Then, due to this high reactivity, for example, it is possible to prevent or suppress the generation of hydroxyl groups caused by ring-opening of epoxy groups, which is a preferred embodiment. Then, in the structure of the aromatic ester compound (A) obtained by using a polyhydric alcohol compound (a3) having a flexible segment structure (for example, A in the general formula (1)), the polyhydric alcohol An alkylene chain (for example, a divalent aliphatic hydrocarbon group) or an alkylene ether chain (oxyalkylene group) derived from compound (a3) can be introduced. As a result, it is possible to impart flexibility to the cured product obtained using the aromatic ester compound (A), and furthermore, since a structure with low polarity is introduced, excellent low dielectric properties are obtained. becomes.

In addition, as described above, the aromatic ester compound (A) does not have or substantially does not have a hydroxyl group in the molecule, so the cured product obtained by reacting the aromatic ester compound (A) Among them, it does not have or substantially does not have a hydroxyl group derived from the aromatic ester compound (A). According to such an aromatic ester compound (A), generation of hydroxyl groups during curing can be prevented or suppressed. In this respect, hydroxyl groups are generally known to have high polarity and increase the dielectric loss tangent. However, by using the aromatic ester compound (A) of the present embodiment, it is possible to achieve a low dielectric loss tangent in the cured product.
Furthermore, since the aromatic ester compound (A) has two or more ester bonds having reaction activity, the crosslink density of the cured product is increased, and the heat resistance can be improved.

<Characteristics of aromatic ester compound (A)>
When the aromatic active ester group in the aromatic ester compound (A) is used as the functional group, the functional group equivalent weight of the aromatic ester compound (A) is preferably in the range of 160 to 3000 g/eq. In this case, a cured product having even better curability and a lower dielectric constant and dielectric loss tangent (low dielectric properties) can be obtained. From the same point of view, the functional group equivalent of the aromatic ester compound (A) is more preferably 180 g/eq or more, still more preferably 200 g/eq or more, and 2800 g/eq or less. More preferably, it is 2600 g/eq or less.

The number average molecular weight (Mn) of the aromatic ester compound (A) is preferably 320-6000. When the number average molecular weight (Mn) is 320 or more, the dielectric loss tangent can be made more excellent, and when it is 6000 or less, the moldability can be improved. From the same viewpoint, the number average molecular weight (Mn) of the aromatic ester compound (A) is more preferably 360 or more, more preferably 400 or more, and more preferably 5600 or less, It is more preferably 5200 or less.

As the aromatic ester compound (A) of the present embodiment, the aromatic The softening point of the group ester compound (A) is preferably 200°C or lower, more preferably 180°C or lower.

The aromatic ester compound (A) of the present embodiment has a flexible segment such as an alkylene chain or an alkylene ether chain and does not have or substantially does not have a hydroxyl group, so it has a low polarity structure. It is a curable resin that can express excellent flexibility (elongation), low elasticity, heat resistance, adhesion to copper foil due to flexibility, and low dielectric properties in the resulting cured product. A composition (for example, an epoxy resin composition containing an epoxy resin), and a semiconductor sealing material, a semiconductor device, a prepreg, a circuit board, a build-up film, etc. using the curable resin composition are provided. be able to.

<Synthesis of aromatic ester compound (A)>
As a method for synthesizing the above-described aromatic ester compound (A), the above-described aromatic polycarboxylic acids (a1), the monohydroxy aromatic compound (a2), and the polyhydric alcohol compound (a3) are reacted as raw materials. There are no particular restrictions other than allowing However, in the synthesis of the aromatic ester compound (A) described above,
(1) A first reaction step of reacting an aromatic polycarboxylic acid (a1) with a monohydroxy aromatic compound (a2) to obtain an intermediate product (a'), and
(2) a second reaction step of reacting the intermediate product (a') with the polyhydric alcohol compound (a3) to obtain an aromatic ester compound (A) as the reaction product;
It is preferred to use a method comprising This is because the aromatic ester compound (A) can be obtained relatively easily.
In this case, in the first reaction step, an ester compound in which an ester bond is formed is obtained as an intermediate product (a′), and in the subsequent second reaction step, a transesterification reaction occurs to form an aryloxycarbonyl group at the terminal. An aromatic ester compound (A) containing the structure can be obtained.

The conditions for the first reaction step are not particularly limited, but for example, the reaction can be carried out in the presence of an alkali catalyst at a temperature of 60° C. or less for a reaction time of 1 to 24 hours. Examples of the alkali catalyst include sodium hydroxide, potassium hydroxide, triethylamine, pyridine and the like. These alkali catalysts may be used singly or in combination of two or more. Among these, sodium hydroxide or potassium hydroxide is preferable as the alkali catalyst because of its high reaction efficiency. The alkali catalyst may be used as a 3-30% aqueous solution. Moreover, in this case, an interlayer transfer catalyst may be used in order to increase the reaction efficiency. Examples of interlayer transfer catalysts include alkylammonium salts and crown ethers. These interlayer transfer catalysts may be used singly or in combination of two or more.

The first reaction step is preferably carried out in an organic solvent because it facilitates reaction control. Examples of the organic solvent include hydrocarbon solvents such as pentane and hexane, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, ether solvents such as diethyl ether and tetrahydrofuran, ethyl acetate, butyl acetate and cellosolve acetate. , propylene glycol monomethyl ether acetate, carbitol acetate and other acetate solvents, cellosolve, butyl carbitol and other carbitol solvents, toluene, xylene and other aromatic hydrocarbon solvents, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and other amide-based solvents. These organic solvents may be used individually by 1 type, and may be used in combination of 2 or more type.

The reaction ratio of the aromatic polycarboxylic acids (a1) and the monohydroxyaromatic compound (a2) can be appropriately changed according to the desired molecular design. However, from the viewpoint of improving photosensitivity, elongation, low elasticity, heat resistance and low dielectric properties in a well-balanced manner, the ratio of the monohydroxy aromatic compound (a2) to 1 mol of the aromatic polycarboxylic acids (a1) is 2. 0 to 5.0 mol, more preferably 2.0 to 4.0 mol, even more preferably 2.0 to 3.0 mol.

After completion of the reaction in the first reaction step, when an aqueous solution is used in the presence of an alkali catalyst, the reaction solution is allowed to stand for liquid separation to remove the aqueous layer, the remaining organic layer is washed with water, and the aqueous layer is removed. It is preferable to repeat washing with water until the pH becomes approximately neutral (approximately pH 7). This makes it possible to reduce the inorganic salt content that adversely affects the insulating properties in the obtained intermediate product (a').

Next, in the second reaction step, the intermediate product (a') obtained in the first reaction step is reacted with the polyhydric alcohol compound (a3). The conditions for the second reaction step are not particularly limited, but for example, stirring and reaction can be carried out at a temperature of 50 to 250° C. for 1 to 24 hours. In the second reaction step, alkali catalysts, especially amine catalysts (alkylamines such as triethylamine, triphenylamine, etc. and arylamines, condensed ring amines such as DBU and DBN, heterocyclic amines such as imidazole and pyridine) are used. The addition can promote the reaction.

During the reaction in the second reaction step, an antioxidant may be used in order to prevent deterioration due to inclusion of a trace amount of oxygen. Specific examples of antioxidants include p-methoxyphenol, p-methoxycresol, 4-methoxy-1-naphthol, 4,4′-dialkoxy-2,2′-bi-1-naphthol, 3-(N -salicyloyl)amino-1,2,4-triazole, N'1,N'12-bis(2-hydroxybenzoyl)dodecane dihydrazide, styrenated phenol, N-isopropyl-N'-phenylbenzene-1,4-diamine , 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinoline, “4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-1 ,6-di-tert-butylphenol and other phenolic compounds, hydroquinone, methylhydroquinone, p-benzoquinone, methyl-p-benzoquinone, 2,5-diphenylbenzoquinone, 2-hydroxy-1,4-naphthoquinone, anthraquinone, diphenoquinone and the like. quinone compounds, melamine, p-phenylenediamine, 4-aminodiphenylamine, N.N'-diphenyl-p-phenylenediamine, Ni-propyl-N'-phenyl-p-phenylenediamine, N-(1.3- dimethylbutyl)-N'-phenyl-p-phenylenediamine, diphenylamine, 4,4'-dicumyl-diphenylamine, 4,4'-dioctyl-diphenylamine, poly(2,2,4-trimethyl-1,2-dihydroquinoline ), amine compounds such as styrenated diphenylamine, reaction products of styrenated diphenylamine and 2,4,4-trimethylpentene, reaction products of diphenylamine and 2,4,4-trimethylpentene, phenothiazine, distearyl thiodipropionate , 2,2-bis({[3-(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl bis[3-(dodecylthio)propionate], ditridecan-1-yl 3,3′-sulfur Thioether compounds such as fandiyl dipropanoate, N-nitrosodiphenylamine, N-nitrosophenylnaphthylamine, p-nitrosophenol, nitrosobenzene, p-nitrosodiphenylamine, α-nitroso-β-naphthol, etc., N,N-dimethyl p- Nitrosoaniline, p-Nitrosodiphenylamine, p-Nitrondimethylamine, p-Nitron-N, N-diethylamine, N-Nitrosoethanolamine, N-Nitrosodi-n-butylamine, N-Nito loso-Nn-butyl-4-butanolamine, N-nitroso-diisopropanolamine, N-nitroso-N-ethyl-4-butanolamine, 5-nitroso-8-hydroxyquinoline, N-nitrosomorpholine, N- Nitroso N-phenylhydroxylamine ammonium salt, Nitrosobenzene, N-nitroso-N-methyl-p-toluenesulfonamide, N-nitroso-N-ethylurethane, N-nitroso-Nn-propylurethane, 1- Nitroso-2-naphthol, 2-nitroso-1-naphthol, sodium 1-nitroso-2-naphthol-3,6-sulfonate, sodium 2-nitroso-1-naphthol-4-sulfonate, 2-nitroso-5- Nitroso compounds such as methylaminophenol hydrochloride and 2-nitroso-5-methylaminophenol hydrochloride, esters of phosphoric acid and octadecan-1-ol, triphenylphosphite, 3,9-dioctadecan-1-yl-2 ,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, trisnonylphenyl phosphite, phosphorous acid-(1-methylethylidene)-di-4,1-phenylenetetra-C12-15 -alkyl esters, 2-ethylhexyl-diphenyl-phosphite, diphenylisodecylphosphite, triisodecyl-phosphite, tris(2,4-di-tert-butylphenyl)phosphite and other phosphite compounds, bis(dimethyldithiocarba Zinc compounds such as mato-κ(2)S,S') zinc, zinc diethyldithiocarbamate, and zinc dibutyl-dithiocarbamate, nickel compounds such as bis(N,N-dibutylcarbamodithioato-S,S') nickel , 1,3-dihydro-2H-benzimidazole-2-thione, 4,6-bis(octylthiomethyl)-o-cresol, 2-methyl-4,6-bis[(octan-1-ylsulfanyl)methyl ] sulfur compounds such as phenol, dilaurylthiodipropionate, and distearyl 3,3′-thiodipropionate. These antioxidants can be used alone or in combination of two or more.
Commercially available products of the antioxidant include, for example, "Q-1300" and "Q-1301" manufactured by Wako Pure Chemical Industries, Ltd., "Sumilizer BBM-S" and "Sumilizer GA-80" manufactured by Sumitomo Chemical Co., Ltd. is mentioned.

In the second reaction step, the same solvent as used in the first reaction step can be used.

The reaction ratio of the intermediate product (a') and the polyhydric alcohol compound (a3) can be appropriately changed according to the desired molecular design. However, from the viewpoint of obtaining an aromatic ester compound (A) having excellent workability and flexibility, the hydroxyl group equivalent of the polyhydric alcohol compound (a3) with respect to 1 equivalent of the active ester group in the intermediate product (a') is 0. It is preferably in the range of 0.01 to 0.9 mol, more preferably in the range of 0.05 to 0.9 mol, even more preferably in the range of 0.1 to 0.8 mol.

After completion of the reaction in the second reaction step, atmospheric distillation or vacuum distillation (for example, 0.9 to 0.01 atm) is preferably carried out in order to remove excess monohydroxy aromatic compound (a2). Thereby, the purity of the obtained aromatic ester compound (A) can be increased.

(Resin (B) Having Acid Group and Polymerizable Unsaturated Group)
The resin (B) having an acid group and a polymerizable unsaturated group is one of the essential components in the resin composition having an acid group and a polymerizable unsaturated group of this embodiment. The component (B) only needs to have an acid group and a polymerizable unsaturated group, and other specific structures, molecular weights, etc. are not particularly limited, and a wide variety of resins can be used.

In this embodiment, examples of the acid group contained in the resin (B) having an acid group and a polymerizable unsaturated group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group. Among these, a carboxyl group is preferred because it exhibits excellent alkali developability. Examples of the polymerizable unsaturated group contained in the resin (B) having an acid group and a polymerizable unsaturated group include (meth)acryloyl group, allyl group, isopropenyl group, 1-propenyl group, styryl group, A styrylmethyl group, a maleimide group, a vinyl ether group, and the like can be mentioned.

Examples of the resin (B) having an acid group and a polymerizable unsaturated group in the present embodiment include the following [1] to [6]:
[1] an epoxy resin (B1) having an acid group and a polymerizable unsaturated group,
[2] Urethane resin (B2) having an acid group and a polymerizable unsaturated group
[3] an acrylic resin (B3) having an acid group and a polymerizable unsaturated group,
[4] an amideimide resin (B4) having an acid group and a polymerizable unsaturated group,
[5] an acrylamide resin (B5) having an acid group and a polymerizable unsaturated group,
[6] an ester resin (B6) having an acid group and a polymerizable unsaturated group,
and the like. The epoxy resin (B1) to the ester resin (B6) will be described in order below.

<Epoxy Resin (B1) Having Acid Group and Polymerizable Unsaturated Group>
Examples of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group of the present embodiment include epoxy resin (b1-1), unsaturated monobasic acid (b1-2), and polybasic acid anhydride ( Epoxy (meth)acrylate resins having an acid group with b1-3) as essential reaction raw materials, epoxy resins (b1-1), unsaturated monobasic acids (b1-2), polybasic acid anhydrides (b1- 3), a polyisocyanate compound (b1-4), and an epoxy (meth)acrylate resin having an acid group and a urethane bond using a (meth)acrylate compound (b1-5) having a hydroxyl group as reaction raw materials.

The specific structure of the epoxy resin (b1-1) is not particularly limited as long as it has a plurality of epoxy groups in the resin. Examples of the epoxy resin (b1-1) include bisphenol type epoxy resin, hydrogenated bisphenol type epoxy resin, biphenol type epoxy resin, hydrogenated biphenol type epoxy resin, phenylene ether type epoxy resin, naphthylene ether type epoxy resin, Biphenyl-type epoxy resin, triphenylmethane-type epoxy resin, phenol novolak-type epoxy resin, cresol novolac-type epoxy resin, bisphenol novolac-type epoxy resin, naphthol novolak-type epoxy resin, naphthol-phenol co-condensation novolak-type epoxy resin, naphthol-cresol co- Condensed novolac type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, dihydroxybenzene type epoxy resin , trihydroxybenzene-type epoxy resins, oxazolidone-type epoxy resins, and the like. These epoxy resins can be used alone or in combination of two or more.

Examples of the bisphenol type epoxy resin include bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin. Resin etc. are mentioned.
Examples of the hydrogenated bisphenol type epoxy resin include hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol B type epoxy resin, hydrogenated bisphenol E type epoxy resin, hydrogenated bisphenol F type epoxy resin, and hydrogenated bisphenol S type epoxy resin. Resin etc. are mentioned.
Examples of the biphenol type epoxy resin include 4,4'-biphenol type epoxy resin, 2,2'-biphenol type epoxy resin, tetramethyl-4,4'-biphenol type epoxy resin, tetramethyl-2,2' - Biphenol-type epoxy resin and the like.
Examples of the hydrogenated biphenol type epoxy resin include hydrogenated 4,4′-biphenol type epoxy resin, hydrogenated 2,2′-biphenol type epoxy resin, and hydrogenated tetramethyl-4,4′-biphenol type epoxy resin. , hydrogenated tetramethyl-2,2'-biphenol type epoxy resin, and the like.
The epoxy resin (b1-1) can be used alone or in combination of two or more.

［上記一般式（４）中、Ｘ^４１は、炭素数１～１０のアルキレン鎖、ポリオキシアルキレン鎖、（ポリ）エステル鎖、芳香族炭化水素鎖、又は（ポリ）カーボネート鎖を表し、Ｘ^４１の構造中の水素原子がハロゲン原子又はアルコキシ基に置換されてもよく、Ｙ^４１は、水素原子又はメチル基である。］で表される化合物等も用いることができる。 Examples of unsaturated monobasic acids (b1-2) include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, α-cyanocinnamic acid, β-styrylacrylic acid, β-furfurylacrylic acid and the like. Acid halides and esters of the above unsaturated monobasic acids can also be used. Furthermore, the following general formula (4):

[In the above general formula (4), X ⁴¹ represents an alkylene chain having 1 to 10 carbon atoms, a polyoxyalkylene chain, a (poly)ester chain, an aromatic hydrocarbon chain, or a (poly)carbonate chain, and X ⁴¹ A hydrogen atom in the structure of may be substituted with a halogen atom or an alkoxy group, and Y ⁴¹ is a hydrogen atom or a methyl group. ] can also be used.

［上記一般式（５）中、Ｒ^５１及びＲ^５２は、炭素原子数１～１０のアルキレン基を表し、ｎは１～５の整数を表す。］で表される（ポリ）エステル鎖が挙げられる Examples of the polyoxyalkylene chain include polyoxyethylene chain and polyoxypropylene chain.
Examples of the (poly)ester chain include the following general formula (5):

[In the above general formula (5), R ⁵¹ and R ⁵² represent an alkylene group having 1 to 10 carbon atoms, and n represents an integer of 1 to 5. ] The (poly) ester chain represented by

［上記一般式（６）中、Ｒ^６１は、炭素原子数１～１０のアルキレン基を表し、ｎ^６１は１～５の整数を表す。］で表される（ポリ）カーボネート鎖が挙げられる。 Examples of the aromatic hydrocarbon chains include phenylene chains, naphthylene chains, biphenylene chains, phenylnaphthylene chains, binaphthylene chains, and the like. A hydrocarbon chain having an aromatic ring such as a benzene ring, naphthalene ring, anthracene ring, or phenanthrene ring can also be used as a partial structure.
Examples of the (poly)carbonate chain include the following general formula (6):

[In the general formula (6), R ⁶¹ represents an alkylene group having 1 to 10 carbon atoms, and n ⁶¹ represents an integer of 1 to 5. ] and a (poly)carbonate chain represented by

The molecular weight of the compound represented by formula (4) is preferably in the range of 100-500, more preferably in the range of 150-400.

The unsaturated monobasic acid (b1-2) may be used alone or in combination of two or more.

Examples of polybasic acid anhydrides (b1-3) include aliphatic polybasic acid anhydrides, alicyclic polybasic acid anhydrides, aromatic polybasic acid anhydrides, and acid halogens of aliphatic polybasic acid anhydrides. acid halides, alicyclic polybasic acid anhydride acid halides, aromatic polybasic acid anhydride acid halides, and the like.

Examples of the aliphatic polybasic acid anhydrides include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, citraconic acid, and itaconic acid. acids, glutaconic acid, acid anhydrides of 1,2,3,4-butanetetracarboxylic acid, and the like. The aliphatic polybasic acid anhydride may have an aliphatic hydrocarbon group of either a straight chain type or a branched type, and may have an unsaturated bond in its structure.

As the above-mentioned alicyclic polybasic acid anhydride, in the present invention, an alicyclic polybasic acid anhydride in which an acid anhydride group is bonded to an alicyclic structure, and an aromatic ring in other structural sites It does not matter whether or not Examples of the alicyclic polybasic acid anhydride include tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane-2, 3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene- Examples include acid anhydrides of 1,2-dicarboxylic acids.

Examples of the aromatic polybasic acid anhydride include phthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, An acid anhydride of benzophenonetetracarboxylic acid and the like can be mentioned.

The polybasic acid anhydrides (b1-3) may be used singly or in combination of two or more. Among these, tetrahydrophthalic anhydride, succinic anhydride, and cyclohexanedicarboxylic anhydride are preferred from the viewpoint of more effectively improving photosensitivity, elongation, low elasticity, heat resistance and/or low dielectric properties.

［上記一般式（７）中、Ｒ^７２及びＲ^７３はそれぞれ独立して、水素原子又は炭素原子数１～６の一価の炭化水素基のいずれかを表し、Ｒ^７１はそれぞれ独立して、炭素原子数１～４のアルキル基を表し、ｋ^７１は０又は１～３の整数であり、ｎ^７１は１以上の整数である。］ Examples of the polyisocyanate compound (b1-4) include aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; norbornane diisocyanate , isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate and other alicyclic diisocyanate compounds; - Aromatic diisocyanate compounds such as diisocyanato-3,3'-dimethylbiphenyl and o-tolidine diisocyanate; polymethylene polyphenyl polyisocyanate having a repeating structure represented by the following general formula (7); Examples include biuret-modified products and allophanate-modified products.
The polyisocyanate compound (b1-4) can be used alone or in combination of two or more.

[In the above general formula (7), R ⁷² and R ⁷³ each independently represent either a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R ⁷¹ each independently represents an alkyl group having 1 to 4 carbon atoms, k ⁷¹ is an integer of 0 or 1 to 3, and n ⁷¹ is an integer of 1 or more. ]

The (meth)acrylate compound (b1-5) having a hydroxyl group includes, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, trimethylolpropane (meth)acrylate, trimethylolpropane di(meth)acrylate, penta Erythritol (meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol (meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipenta Erythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ditrimethylolpropane(meth)acrylate, ditrimethylolpropane di(meth)acrylate, ditrimethylolpropane tri(meth)acrylate and the like. In addition, (poly)oxyalkylene chains such as (poly)oxyethylene chains, (poly)oxypropylene chains, and (poly)oxytetramethylene chains are introduced into the molecular structures of the (meth)acrylate compounds having various hydroxyl groups. A (poly)oxyalkylene modified product, a lactone modified product obtained by introducing a (poly)lactone structure into the molecular structure of the above various hydroxyl group-containing (meth)acrylate compounds, and the like can also be used.

Among these, those having a molecular weight of 1,000 or less are preferable from the viewpoint of more effectively improving photosensitivity, elongation, low elasticity, heat resistance and/or low dielectric properties. Further, when the (meth)acrylate compound (b1-5) having a hydroxyl group is an oxyalkylene-modified compound or a lactone-modified compound, the weight average molecular weight (Mw) is preferably 1,000 or less.
The (meth)acrylate compound (b1-5) having a hydroxyl group can be used alone or in combination of two or more.

The method for producing the epoxy resin (B1) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

A method for producing an epoxy resin (B1) having an acid group and a polymerizable unsaturated group includes an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), and a polybasic acid anhydride (b1-3). is an essential reaction raw material, or an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), a polybasic acid anhydride (b1-3), a polyisocyanate compound (b1-4), and a hydroxyl group-containing (meth)acrylate compound (b1-5) as a reaction raw material. For example, the epoxy resin (B1) may be produced by a method of reacting all of the reaction raw materials at once, or may be produced by a method of sequentially reacting the reaction raw materials. Among them, since the reaction is easy to control, the epoxy resin (b1-1) is first reacted with the unsaturated monobasic acid (b1-2), and then the polybasic acid anhydride (b1-3). is preferably reacted. The reaction is performed, for example, by reacting an epoxy resin (b1-1) and an unsaturated monobasic acid (b1-2) in the presence of a basic catalyst at a temperature range of 100 to 150° C., followed by It can be carried out by a method of adding polybasic acid anhydride (b1-3) and reacting at a temperature range of 80 to 140°C.

In the present embodiment, the reaction ratio between the epoxy resin (b1-1) and the unsaturated monobasic acid (b1-2) is the unsaturated monobasic acid per mole of epoxy groups in the epoxy resin (b1-1). (b1-2) is preferably used in the range of 0.9 to 1.1 mol. Also, the reaction ratio of the polybasic acid anhydride (b1-3) is preferably in the range of 0.2 to 1.0 mol per 1 mol of epoxy groups in the epoxy resin (b1-1).

Examples of the organic solvent include hydrocarbon solvents such as toluene, xylene, heptane, hexane, and mineral spirits; ketone solvents such as methyl ethyl ketone, acetone, dimethylformamide, methyl isobutyl ketone, cyclohexanone, and dimethylacetamide; Cyclic ether solvents; ester solvents such as methyl acetate, ethyl acetate and butyl acetate; aromatic solvents such as toluene, xylene and solvent naphtha; alicyclic solvents such as cyclohexane and methylcyclohexane; carbitol, cellosolve, methanol, ethanol and propanol , isopropanol, butanol, cyclohexanol, propylene glycol monomethyl ether and other alcohol solvents; propyl ether, methyl cellosolve, cellosolve, butyl cellosolve, methyl carbitol and other ether solvents; alkylene glycol monoalkyl ether, dialkylene glycol monoalkyl ether, di Glycol ether solvents such as alkylene glycol monoalkyl ether acetate; vegetable oils and fats such as soybean oil, linseed oil, rapeseed oil and safflower oil; methoxypropanol, cyclohexanone, methyl cellosolve, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like be done. These organic solvents can be used alone or in combination of two or more.

In addition, as the organic solvent, a commercial product can also be used, and examples of the commercial product include "No. 1 spindle oil", "No. 3 solvent", "No. 4 solvent" and "No. 5 Solvent", "Solvent No. 6", "Naphthesol H", "Alkene 56NT", "AF Solvent No. 4", "AF Solvent No. 5", "AF Solvent No. 6", "AF Solvent No. 7", manufactured by Mitsubishi Chemical Corporation "Diadol 13", "Dialen 168"; Nissan Chemical Co., Ltd. "F Oxocol", "F Oxocol 180"; Idemitsu Kosan Co., Ltd. "Supersol LA35", "Supersol LA38"; ExxonMobil Chemical Co., Ltd. "Exsol D80" ”, “Exsol D110”, “Exsol D120”, “Exsol D130”, “Exsol D160”, “Exsol D100K”, “Exsol D120K”, “Exsol D130K”, “Exsol D280”, “Exsol D300”, “Exsol D320 "; and the like.
The above organic solvents can be used alone or in combination of two or more. Further, in the present embodiment, the amount of the organic solvent used is preferably in the range of about 0.1 to 5 times the total mass of the reaction raw materials, since the reaction efficiency is improved.

Basic catalysts include, for example, N-methylmorpholine, pyridine, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), 1,4-diazabicyclo[2.2.2]octane (DABCO), tri-n-butylamine or dimethylbenzylamine, butylamine, octylamine, monoethanolamine, diethanolamine, triethanolamine, imidazole, 1- methylimidazole, 2,4-dimethylimidazole, 1,4-diethylimidazole, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(N-phenyl)aminopropyltrimethoxysilane, 3-(2 -aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropylmethyldimethoxysilane, amine compounds such as tetramethylammonium hydroxide; quaternary compounds such as trioctylmethylammonium chloride and trioctylmethylammonium acetate; ammonium salts; phosphines such as trimethylphosphine, tributylphosphine and triphenylphosphine; tetramethylphosphonium chloride, tetraethylphosphonium chloride, tetrapropylphosphonium chloride, tetrabutylphosphonium chloride, tetrabutylphosphonium bromide, trimethyl(2-hydroxylpropyl)phosphonium chloride , triphenylphosphonium chloride, benzylphosphonium chloride, and other phosphonium salts; , 1,3,3-tetrabutyl-1,3-dodecanoyldistannoxane; organometallic compounds such as zinc octoate and bismuth octylate; inorganic tin compounds such as tin octoate; are mentioned. Alkaline earth metal hydroxides, alkali metal carbonates, alkali metal hydroxides and the like can also be used.
The above basic catalysts may be used alone or in combination of two or more. Moreover, the amount of the basic catalyst to be added is preferably in the range of 0.001 to 5 parts by mass with respect to the total of 100 parts by mass of the reaction raw materials.

The acid value of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group is such that the resin composition exhibits higher photosensitivity, and the obtained cured product has superior elongation, low elasticity, heat resistance and low acid value. From the viewpoint of expressing dielectric properties, the range is preferably 30 to 150 mgKOH/g, more preferably 40 to 120 mgKOH/g. In addition, in the present disclosure, the acid value of the epoxy resin (B1) having an acid group and a polymerizable unsaturated group is a value measured by the neutralization titration method of JIS 0070 (1992).

<Urethane resin (B2) having an acid group and a polymerizable unsaturated group>
Examples of the urethane resin (B2) having an acid group and a polymerizable unsaturated group include a polyisocyanate compound (b1-4), a hydroxyl group-containing (meth)acrylate compound (b1-5), a carboxyl group-containing polyol compound (b2- 1), and optionally polybasic acid anhydride (b1-3), a resin obtained by reacting with a polyol compound (b2-2) other than the carboxyl group-containing polyol compound (b2-1); polyisocyanate A compound (b1-4), a hydroxyl group-containing (meth)acrylate compound (b1-5), a polybasic acid anhydride (b1-3), and a polyol compound other than the carboxyl group-containing polyol compound (b2-1) ( b2-2), a resin obtained by reacting; or an epoxy resin (b1-1), an unsaturated monobasic acid (b1-2), a polybasic acid anhydride (b1-3), and a poly Examples thereof include resins obtained by reacting an isocyanate compound (b1-4) with a hydroxyl group-containing (meth)acrylate compound (b1-5).

Examples of the carboxyl group-containing polyol compound (b2-1) include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, 2,2-dimethylolvaleric acid and the like. The carboxyl group-containing polyol compounds can be used alone or in combination of two or more.

Examples of the polyol compound (b2-2) other than the carboxyl group-containing polyol compound (b2-1) include ethylene glycol, propylene glycol, butanediol, hexanediol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, di Aliphatic polyol compounds such as pentaerythritol; aromatic polyol compounds such as biphenol and bisphenol; (poly)oxyethylene chains, (poly)oxypropylene chains, and (poly)oxytetramethylene chains in the molecular structures of the various polyol compounds (poly)oxyalkylene modified products into which a (poly)oxyalkylene chain is introduced such as; and lactone modified products in which a (poly)lactone structure is introduced into the molecular structure of the above various polyol compounds. The polyol compounds other than the carboxyl group-containing polyol compound can be used alone or in combination of two or more.

The method for producing the urethane resin (B2) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the urethane resin having an acid group and a polymerizable unsaturated bond may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.

As the organic solvent, the same organic solvent as described in the section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group> can be used. It is also possible to use two or more kinds in combination. As the basic catalyst, the same basic catalyst as described in the section <Epoxy resin having an acid group and a polymerizable unsaturated group (B1)> can be used. can be used alone or in combination of two or more.

<Acrylic resin (B3) having an acid group and a polymerizable unsaturated group>
The acrylic resin (B3) having an acid group and a polymerizable unsaturated group in the present embodiment includes, for example, a (meth)acrylate compound (α) having a reactive functional group such as a hydroxyl group, a carboxyl group, an isocyanate group, or a glycidyl group. (Meth)acryloyl group by further reacting a (meth)acrylate compound (β) having a reactive functional group capable of reacting with these functional groups to the acrylic resin intermediate obtained by polymerizing as an essential component. A reaction product obtained by introduction, or a resin obtained by reacting a hydroxyl group in the reaction product with a polybasic acid anhydride (b1-3).

In the present embodiment, the acrylic resin intermediate may be obtained by copolymerizing the (meth)acrylate compound (α) and, if necessary, other polymerizable unsaturated group-containing compounds. The other polymerizable unsaturated group-containing compounds are, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate (meth) Alkyl acrylic ester; Alicyclic structure-containing (meth)acrylates such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate; phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxy aromatic ring-containing (meth)acrylates such as ethyl acrylate; silyl group-containing (meth)acrylates such as 3-methacryloxypropyltrimethoxysilane; styrene derivatives such as styrene, α-methylstyrene, and chlorostyrene;
Other polymerizable unsaturated group-containing compounds can be used alone or in combination of two or more.

The (meth)acrylate compound (β) is not particularly limited as long as it can react with the reactive functional group of the (meth)acrylate compound (α). is preferred. That is, when a hydroxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use an isocyanate group-containing (meth)acrylate as the (meth)acrylate compound (β). When a carboxyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a glycidyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When an isocyanate group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a hydroxyl group-containing (meth)acrylate as the (meth)acrylate compound (β). When a glycidyl group-containing (meth)acrylate is used as the (meth)acrylate compound (α), it is preferable to use a carboxyl group-containing (meth)acrylate as the (meth)acrylate compound (β).
The (meth)acrylate compound (β) can be used alone or in combination of two or more.

The method for producing the acrylic resin (B3) having an acid group and a polymerizable unsaturated group in the present embodiment is not particularly limited, and any method may be used. The production of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent if necessary, and a basic catalyst may be used if necessary.
As the organic solvent, the same organic solvent as described in the section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group> can be used, and the organic solvent is used alone. It is also possible to use two or more kinds in combination.
As the basic catalyst, the same basic catalyst as described in the section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group> can be used. Using independently can also use 2 or more types together.

The acid value of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group in the present embodiment is such that the resin composition exhibits higher photosensitivity, and the obtained cured product has superior elongation, low elasticity, From the viewpoint of developing heat resistance and low dielectric properties, the range is preferably 30 to 150 mgKOH/g, more preferably 40 to 120 mgKOH/g. In the present invention, the acid value of the acrylic resin (B3) having an acid group and a polymerizable unsaturated group is a value measured by the neutralization titration method of JIS K 0070 (1992).

<Amidoimide resin (B4) having an acid group and a polymerizable unsaturated group>
In the present embodiment, the amideimide resin (B4) having an acid group and a polymerizable unsaturated group includes, for example, an amideimide resin (b4-1) having an acid group and/or an acid anhydride group, and an amideimide resin (b4-1) having a hydroxyl group (meth ) an acrylate compound (b1-5) and/or a (meth)acrylate compound having an epoxy group, and optionally a hydroxyl group, a carboxyl group, an isocyanate group, a glycidyl group, and 1 selected from the group consisting of an acid anhydride group Examples include those obtained by reacting compounds having at least one reactive functional group. The compound having a reactive functional group may or may not have a (meth)acryloyl group.
The amide imide resin (b4-1) having an acid group and/or an acid anhydride group may have either an acid group or an acid anhydride group, or both. The amide imide resin (b4-1) has an acid anhydride group from the viewpoint of reactivity and reaction control with the (meth)acrylate compound (1-5) having a hydroxyl group or an epoxy compound having a (meth)acryloyl group. and more preferably have both an acid group and an acid anhydride group. The solid content acid value of the amide imide resin (b4-1) is preferably in the range of 60 to 350 mgKOH/g as measured under neutral conditions, that is, under conditions where the acid anhydride group is not ring-opened. On the other hand, it is preferable that the measured value under the condition that the acid anhydride group is ring-opened, such as in the presence of water, is in the range of 61 to 360 mgKOH/g.

In addition to the polyisocyanate compound (b1-4) and the polybasic acid anhydride (b1-3), the amide imide resin (b4-1) can also be used in combination with a polybasic acid as a reaction raw material, if necessary. .

Any compound having two or more carboxyl groups in one molecule can be used as the polybasic acid. For example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, hexahydro phthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo[2.2.1]heptane- 2,3-dicarboxylic acid, methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid, 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydro naphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid, and the like. be done. As the polybasic acid, for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used.
The above polybasic acids can be used alone or in combination of two or more.

As the (meth)acrylate compound having an epoxy group, other specific structures are not particularly limited as long as they have a (meth)acryloyl group and an epoxy group in the molecular structure, and a wide variety of compounds can be used. can. For example, glycidyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate glycidyl ether, glycidyl group-containing (meth)acrylate monomers such as epoxycyclohexylmethyl (meth)acrylate, hydroxybenzene diglycidyl ether, dihydroxynaphthalenediglycidyl ether , biphenol diglycidyl ether, and mono(meth)acrylated products of diglycidyl ether compounds of bisphenol diglycidyl ether.
The epoxy group-containing (meth)acrylate compounds may be used alone or in combination of two or more.

Further, the specific structure or production method of the amideimide resin (b4-1) having an acid group and/or an acid anhydride group is not particularly limited, and general amideimide resins and the like can be widely used. The amide imide resin (b4-1) of the present embodiment is preferably obtained by reacting, for example, a polyisocyanate compound (b1-4) and a polybasic acid anhydride (b1-3).
Further, in the present embodiment, as the polyisocyanate compound (b1-4), since a resin composition having an acid group and a polymerizable unsaturated group having high solvent solubility is obtained, an alicyclic diisocyanate compound or its Modified products, aliphatic diisocyanate compounds or modified products thereof are preferred, and alicyclic diisocyanates or modified isocyanurate compounds thereof, aliphatic diisocyanates or modified isocyanurate compounds thereof are more preferred.
In the present embodiment, in the total mass of the polyisocyanate compound (b1-4), the ratio of the total mass of the alicyclic diisocyanate compound or modified product thereof and the aliphatic diisocyanate compound or modified product thereof is 70% by mass or more. It is preferable that there is, and it is preferable that it is 90 mass % or more.
Further, when the alicyclic diisocyanate compound or its modified form and the aliphatic diisocyanate compound or its modified form are used in combination, the mass ratio of both (alicyclic diisocyanate compound or its modified form/aliphatic diisocyanate compound or its modified form) is preferably in the range of 30/70 to 70/30.

The method for producing the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent, if necessary, and a basic catalyst may be used, if necessary.
As the basic catalyst, the same basic catalyst as described in the section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group> can be used. Using independently can also use 2 or more types together.
As the organic solvent, the same organic solvent as described in the section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group> can be used. can also be used in combination of two or more.

The amideimide resin (B4) having an acid group and a polymerizable unsaturated group may be an amideimide resin (b4-1) having an acid group and/or an acid anhydride group, a hydroxyl group-containing (meth) In addition to the reaction raw materials for the acrylate compound (b1-5) and/or the epoxy group-containing (meth)acrylate compound (b4-2), other reaction raw materials may be used in combination. In this case, the ratio of the total mass of the components (b4-1) to (b4-2) in the total mass of the reaction raw materials of the resin (B4) having an acid group and a polymerizable unsaturated group is 80% by mass or more. is preferred, and 90% by mass or more is more preferred.

The method for producing the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. For example, all reaction raw materials containing an amide imide resin (b4-1), a hydroxyl group-containing (meth)acrylate compound (b1-5) and/or an epoxy group-containing (meth)acrylate compound (b4-2) are reacted together. It may be produced by a method in which the reaction raw materials are reacted sequentially. Further, for example, the reaction between the amide imide resin (b4-1) and the hydroxyl group-containing (meth)acrylate compound (b1-5) is carried out by heating and stirring at a temperature of about 80 to 140° C. in the presence of a suitable basic catalyst. can be done by The production of the amide imide resin (B4) having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent if necessary, and if necessary a basic catalyst or an acidic catalyst may be used. .

The basic catalyst can be the same as the acidic catalyst and basic catalyst described in the above section <Epoxy resin (B1) having an acid group and a polymerizable unsaturated group>, and they can be used alone. can also be used in combination of two or more.
Examples of the acidic catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid; organic acids such as methanesulfonic acid, paratoluenesulfonic acid, and oxalic acid; and Lewis acids such as boron trifluoride, anhydrous aluminum chloride, and zinc chloride. etc. A solid acid catalyst having a strong acid such as a sulfonyl group can also be used. These acidic catalysts can be used alone or in combination of two or more.

The acid value of the amide-imide resin (B4) having an acid group and a polymerizable unsaturated group has high photosensitivity and is capable of forming a cured product having excellent heat resistance and dielectric properties. The range of 30 to 150 mgKOH/g is preferable, and the range of 40 to 120 mgKOH/g is more preferable, since a resin composition having the above is obtained. The acid value of the amideimide resin (B4) having an acid group and a polymerizable unsaturated group in the present disclosure is a value measured by the neutralization titration method of JIS K 0070 (1992).

<Acrylamide resin (B5) having an acid group and a polymerizable unsaturated group>
The acrylamide resin (B5) having an acid group and a polymerizable unsaturated group of the present embodiment includes, for example, a phenolic hydroxyl group-containing compound (b5-1), an alkylene carbonate (b5-2a) or an alkylene oxide (b5-2b ), an N-alkoxyalkyl (meth)acrylamide compound (b5-3), a polybasic acid anhydride (b1-3), and optionally an unsaturated monobasic acid (b1-2) as reaction raw materials, Examples thereof include resins obtained by reacting the reaction raw materials.

（上記一般式（８．１）～（８．４）中、Ｒ^８１～Ｒ^８４はそれぞれ独立して、炭素原子数１～２０のアルキル基、炭素原子数１～２０のアルコキシ基、アリール基又はハロゲン原子のいずれかを表し、Ｒ^８５及びＲ^８６はそれぞれ独立して、水素原子又はメチル基を表し、ｊ^８１～ｊ^８４はそれぞれ独立して、０又は１以上の整数を表し、好ましくは０又は１～３の整数であり、より好ましくは０又は１である。ｋ^８１～ｋ^８４はそれぞれ独立して、１以上の整数を表し、好ましくは、２又は３である。）
なお、上記一般式（８．１）～（８．４）における芳香環上の置換基の位置については、任意であり、例えば、一般式（８．２）のナフタレン環においてはいずれの環上の水素原子と置換していてもよく、一般式（８．３）では、ビフェニル１分子中に存在するベンゼン環のいずれの水素原子に置換していてもよく、一般式（８．４）では、アラルキル１分子中に存在するベンゼン環のいずれかの水素原子と置換していてもよいことを示し、１分子中における置換基の個数がｊ^８１～ｊ^８４及びｋ^８１～ｋ^８４であることを示している。

（上記一般式（９．１）～（９．５）中、ｈ^９１は、０又は１を表し、Ｒ^９１～Ｒ^９６はそれぞれ独立して、一価の脂肪族炭化水素基、アルコキシ基、ハロゲン原子、アリール基、アリールオキシ基又はアラルキル基のいずれかを表し、ｋ^９１～ｋ^９６はそれぞれ独立して、０又は１～４の整数を表し、Ｚ^９１～Ｚ^９６はそれぞれ独立して、ビニル基、ハロメチル基、ヒドロキシメチル基又はアルキルオキシメチル基のいずれかを表し、Ｙ^９１は、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子又はカルボニル基のいずれかを表し、ｎ^９１は１～４の整数を表す。）
上記一般式（９．１）～（９．５）で表される化合物は、単独で用いることも２種以上を併用することもできる。 In the present embodiment, the phenolic hydroxyl group-containing compound (b5-1) refers to a compound having at least one phenolic hydroxyl group in the molecule. Examples of the phenolic hydroxyl group-containing compound (b5-1) include compounds represented by any of the following general formulas (8.1) to (8.4), aromatic polyhydroxy compounds (b5-4) and the following A reaction product with a compound represented by any of the general formulas (9.1) to (9.5) as an essential reaction raw material, or an aromatic polyhydroxy compound (b5-4) or other phenol in the molecule A novolac-type phenolic resin containing one or more of the compounds (b5-5) having one hydroxyl group as a reaction raw material can also be used.

(In the above general formulas (8.1) to (8.4), R ⁸¹ to R ⁸⁴ are each independently an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group or a halogen atom, R ⁸⁵ and R ⁸⁶ each independently represent a hydrogen atom or a methyl group, j ⁸¹ to j ⁸⁴ each independently represent an integer of 0 or 1 or more, preferably an integer of 0 or 1 to 3, more preferably 0 or 1. Each of k ⁸¹ to k ⁸⁴ independently represents an integer of 1 or more, preferably 2 or 3.)
The position of the substituent on the aromatic ring in the general formulas (8.1) to (8.4) is arbitrary. For example, in the naphthalene ring of the general formula (8.2), In general formula (8.3), any hydrogen atom of a benzene ring present in one molecule of biphenyl may be substituted, and in general formula (8.4) , indicates that any hydrogen atom of a benzene ring present in one aralkyl molecule may be substituted, and the number of substituents in one molecule is j ⁸¹ to j ⁸⁴ and k ⁸¹ to k ⁸⁴ is shown.

(In general formulas (9.1) to (9.5) above, h ⁹¹ represents 0 or 1, R ⁹¹ to R ⁹⁶ each independently represent a monovalent aliphatic hydrocarbon group, an alkoxy group, represents a halogen atom, an aryl group, an aryloxy group or an aralkyl group, k ⁹¹ to k ⁹⁶ each independently represent an integer of 0 or 1 to 4, Z ⁹¹ to Z ⁹⁶ each independently represents either a vinyl group, a halomethyl group, a hydroxymethyl group or an alkyloxymethyl group, Y ⁹¹ represents any of an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom or a carbonyl group, n ⁹¹ represents an integer from 1 to 4.)
The compounds represented by the general formulas (9.1) to (9.5) can be used alone or in combination of two or more.

Examples of aromatic polyhydroxy compounds (b5-4) include dihydroxybenzene, trihydroxybenzene, tetrahydroxybenzene, dihydroxynaphthalene, trihydroxynaphthalene, tetrahydroxynaphthalene, dihydroxyanthracene, trihydroxyanthracene, tetrahydroxyanthracene, biphenol, In addition to tetrahydroxybiphenyl, bisphenol and the like, compounds having one or more substituents on their aromatic nuclei are also included. Examples of substituents on the aromatic nucleus include methyl group, ethyl group, vinyl group, propyl group, butyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group, octyl group, nonyl group and the like. monovalent aliphatic hydrocarbon group; alkoxy group such as methoxy group, ethoxy group, propyloxy group, butoxy group; fluorine atom, chlorine atom, halogen atom such as bromine atom; phenyl group, naphthyl group, anthryl group, and The aliphatic hydrocarbon group, the alkoxy group, the aryl group substituted with a halogen atom or the like on these aromatic nuclei; a phenyloxy group, a naphthyloxy group; An alkoxy group, an aryloxy group substituted with a halogen atom, etc.; An aralkyl group substituted with an atom or the like can be mentioned. These aromatic polyhydroxy compounds can be used alone or in combination of two or more. Among these, a halogen-free compound is preferable because a resin having an acid group and a polymerizable unsaturated group with high insulation reliability can be obtained.

Examples of the novolak-type phenolic resin include resins obtained by reacting one or more compounds having one phenolic hydroxyl group in the molecule with an aldehyde compound in the presence of an acidic catalyst.

The other compound (b5-5) having one phenolic hydroxyl group in the molecule may be any aromatic compound having one hydroxyl group on the aromatic nucleus, such as phenol or the aromatic nucleus of phenol. Phenolic compounds having one or more substituents thereon, Naphthol compounds having one or more substituents on the naphthol or naphthol aromatic nucleus, Anthracenol or one or more on the anthracenol aromatic nucleus and an anthracenol compound having a substituent of. Examples of substituents on the aromatic nucleus include monovalent aliphatic hydrocarbon groups, alkoxy groups, halogen atoms, aryl groups, aryloxy groups, aralkyl groups, etc. Specific examples of each are as described above. is. These compounds having one phenolic hydroxyl group can be used alone or in combination of two or more.

Examples of the above aldehyde compounds include formaldehyde; alkyl aldehydes such as acetaldehyde, propylaldehyde, butyraldehyde, isobutyraldehyde, penthylaldehyde, and hexylaldehyde; salicylaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, 2-hydroxy-4 -hydroxybenzaldehyde such as methylbenzaldehyde, 2,4-dihydroxybenzaldehyde, 3,4-dihydroxybenzaldehyde; 2-hydroxy-3-methoxybenzaldehyde, 3-hydroxy-4-methoxybenzaldehyde, 4-hydroxy-3-methoxybenzaldehyde, 3 - benzaldehydes having both hydroxy and alkoxy groups such as ethoxy-4-hydroxybenzaldehyde, 4-hydroxy-3,5-dimethoxybenzaldehyde; alkoxybenzaldehydes such as methoxybenzaldehyde and ethoxybenzaldehyde; 1-hydroxy-2-naphthaldehyde, hydroxynaphthaldehyde such as 2-hydroxy-1-naphthaldehyde and 6-hydroxy-2-naphthaldehyde; halogenated benzaldehyde such as brombenzaldehyde;

Examples of the alkylene carbonate (b5-2a) include ethylene carbonate, propylene carbonate, butylene carbonate, pentylene carbonate and the like. Among these, ethylene carbonate or propylene carbonate is preferable from the viewpoint that the resin composition exhibits higher photosensitivity and that the resulting cured product exhibits superior elongation, low elasticity, heat resistance and low dielectric properties. The alkylene carbonates can be used alone or in combination of two or more.

Examples of the alkylene oxide (b5-2b) include ethylene oxide, propylene oxide, butylene oxide, pentylene oxide and the like. Among these, ethylene oxide or propylene oxide is preferable from the viewpoint that the resin composition exhibits higher photosensitivity and the resulting cured product exhibits superior elongation, low elasticity, heat resistance and low dielectric properties. The alkylene oxides can be used alone or in combination of two or more.

N-alkoxyalkyl(meth)acrylamide compounds (b5-3) include, for example, N-methoxymethyl(meth)acrylamide, N-ethoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-methoxyethyl (Meth)acrylamide, N-ethoxyethyl(meth)acrylamide, N-butoxyethyl(meth)acrylamide and the like. Among these, N-methoxymethyl (meth)acrylamide is used from the viewpoint that the resin composition exhibits higher photosensitivity, and the resulting cured product exhibits superior elongation, low elasticity, heat resistance and low dielectric properties. is preferred.
The N-alkoxyalkyl(meth)acrylamide compounds (b5-3) can be used alone or in combination of two or more.

In the present embodiment, when the N-alkoxyalkyl(meth)acrylamide compound (b5-3) is used as a reaction raw material for the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group, the N-alkoxyalkyl(meth)acrylamide The equivalent ratio [(b5-3)/(b1-3)] between the compound (b5-3) and the polybasic acid anhydride (b1-3) allows the resin composition to exhibit higher photosensitivity and obtain The range is preferably 0.2 to 7, more preferably 0.25 to 6.7, from the viewpoint of exhibiting superior elongation, low elasticity, heat resistance and low dielectric properties in the cured product.

In the present embodiment, the method for producing the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. For example, it may be produced by a method of reacting all of the reaction raw materials at once, or may be produced by a method of sequentially reacting the reaction raw materials. Among them, since the reaction is easy to control, the phenolic hydroxyl group-containing compound (b5-1) is first reacted with an alkylene carbonate (b5-2a) or an alkylene oxide (b5-2b) (for example, reaction in the presence of a basic catalyst in the temperature range of 100 to 200° C.), then unsaturated monobasic acid (b1-2) and/or N-alkoxyalkyl (meth)acrylamide compound (b2-3b). (for example, reaction in the presence of an acidic catalyst in a temperature range of 80 to 140°C), and then polybasic acid anhydride (b1-3) is reacted (for example, reaction in a temperature range of 80 to 140°C). A method is preferred.

［上記式（１０．１）又は（１０．２）中、Ｒ^ｂ２及びＲ^ｂ８はそれぞれ独立して、水素原子又は炭素原子数１～４の一価の炭化水素基を表し、Ｒ^ｂ３及びＲ^ｂ９はそれぞれ独立して、水素原子、炭素原子数１～４の炭化水素基、炭素原子数１～４のアルコキシ基又はハロゲン原子のいずれかを表し、ｎ^１及びｎ^２はそれぞれ独立して、１又は２を表し、Ｒ^ｂ４及びＲ^ｂ１０はそれぞれ独立して、メチレン基又は下記一般式（１１．１）～（１１．５）のいずれかで表される構造部位を表し、Ｒ^ｂ５及びＲ^ｂ６はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^ｂ５とＲ^ｂ６とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^ｂ１１は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^ｂ１２は、水素原子又はメチル基を表し、Ｒ^ｂ１及びＲ^ｂ７はそれぞれ独立して、前記Ｒ^ｂ３及び前記Ｒ^ｂ９で表される基、或いは、式（１０．１）で表される構造部位（Ｉ）又は式（１０．２）で表される構造部位（ＩＩ）が、＊印が付されたＲ^ｂ４又はＲ^ｂ１０を介して連結する結合点である。］

［上記一般式（１０．３）又は（１０．４）中、Ｒ^ｂ２及びＲ^ｂ８はそれぞれ独立して、水素原子又は炭素原子数１～４の炭化水素基を表し、Ｒ^ｂ３及びＲ^ｂ９はそれぞれ独立して、水素原子、炭素原子数１～４の炭化水素基、炭素原子数１～４のアルコキシ基又はハロゲン原子のいずれかを表し、ｎ^３及びｎ^４はそれぞれ独立して、１又は２を表し、Ｒ^ｂ４及びＲ^ｂ１０はそれぞれ独立して、メチレン基又は下記式（１１．１）～（１１．５）のいずれかで表される構造部位を表し、Ｒ^ｂ５及びＲ^ｂ６はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^ｂ５とＲ^ｂ６とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^ｂ１１は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^ｂ１２は、水素原子又はメチル基を表し、Ｒ^ｂ１及びＲ^ｂ７はそれぞれ独立して、前記Ｒ^ｂ３及び前記Ｒ^ｂ９で表される基、或いは、一般式（１０．３）で表される構造部位（ＩＩＩ）又は一般式（１０．４）で表される構造部位（ＩＶ）が、＊印が付されたＲ^ｂ４又はＲ^ｂ１０を介して連結する結合点である。］

［上記一般式（１１．１）～（１１．５）中、ｈ^９１は、０又は１を表し、Ｒ^９１～Ｒ^９６はそれぞれ独立して、一価の脂肪族炭化水素基、アルコキシ基、ハロゲン原子、アリール基又はアラルキル基のいずれかを表し、ｎ^９１～ｎ^９６はそれぞれ独立して、０又は１～４の整数を表し、Ｙ^９１は、炭素原子数１～４のアルキレン基、酸素原子、硫黄原子又はカルボニル基のいずれかを表し、ｎ^９１は１～４の整数を表し、Ｒ^１１１～Ｒ^１１６はそれぞれ独立して、水素原子又はメチル基を表し、Ｗは、下記式（１２．１）又は（１２．２）を表す。］

［上記式（１２．１）又は（１２．２）中、Ｒ^１２１及びＲ^１２４はそれぞれ独立して、水素原子又は炭素原子数１～４の炭化水素基を表し、Ｒ^１２２及びＲ^１２３はそれぞれ独立して、水素原子又は炭素原子数１～２０の炭化水素基を表し、但し、Ｒ^１２２とＲ^１２３とが、連結して飽和又は不飽和の環を形成してもよく、Ｒ^１２５は、炭素原子数１～１２の二価の炭化水素基を表し、Ｒ^１２６は、水素原子又はメチル基を表す。］ The acrylamide resin (B5) having an acid group and a polymerizable unsaturated group in the present embodiment is a resin obtained from the reaction raw materials described above. For example, the acrylamide resin (B5) has a structure in which the structural site (I) represented by the following general formula (10.1) and the structural site (II) represented by the following general formula (10.2) are repeated. A resin having a resin structure as a unit, or a structural moiety (III) represented by the following formula (10.3) and a structural moiety (IV) represented by the following formula (10.4) are used as repeating structural units. A resin having a resin structure is mentioned.

[In the above formula (10.1) or (10.2), R ^b2 and R ^b8 each independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 4 carbon atoms, and R ^b3 and R ^b9 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms or a halogen atom; n ¹ and n ² each independently 1 or 2, R ^b4 and R ^b10 each independently represent a methylene group or a structural moiety represented by any of the following general formulas (11.1) to (11.5), R ^b5 and R ^b6 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, provided that R ^b5 and R ^b6 may be linked to form a saturated or unsaturated ring; ^b11 represents a divalent hydrocarbon group having 1 to 12 carbon atoms, R ^b12 represents a hydrogen atom or a methyl group, R ^b1 and R ^b7 each independently represent R ^b3 and R ^b9 ; or the structural moiety (I) represented by formula (10.1) or the structural moiety (II) represented by formula (10.2) is marked with an asterisk R ^b4 or R It is a connection point that connects via ^b10 . ]

[In the above general formula (10.3) or (10.4), R ^b2 and R ^b8 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms, and R ^b3 and R ^b9 are each independently represents a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms or a halogen atom; n ³ and n ⁴ each independently represent 1 or 2, R ^b4 and R ^b10 each independently represent a methylene group or a structural moiety represented by any of the following formulas (11.1) to (11.5), and R ^b5 and R ^b6 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, provided that R ^{b5 and} R ^b6 may be linked to form a saturated or unsaturated ring; represents a divalent hydrocarbon group having 1 to 12 carbon atoms, R ^b12 represents a hydrogen atom or a methyl group, R ^b1 and R ^b7 are each independently represented by R ^b3 and R ^b9 group, or the structural moiety (III) represented by the general formula (10.3) or the structural moiety (IV) represented by the general formula (10.4) is R ^b4 or R ^b10 marked with * is a connection point that connects via ]

[In the above general formulas (11.1) to (11.5), h ⁹¹ represents 0 or 1, and R ⁹¹ to R ⁹⁶ each independently represent a monovalent aliphatic hydrocarbon group, an alkoxy group, represents either a halogen atom, an aryl group or an aralkyl group, n ⁹¹ to n ⁹⁶ each independently represents an integer of 0 or 1 to 4, Y ⁹¹ is an alkylene group having 1 to 4 carbon atoms, oxygen represents either an atom, a sulfur atom or a carbonyl group, n ⁹¹ represents an integer of 1 to 4, R ¹¹¹ to R ¹¹⁶ each independently represents a hydrogen atom or a methyl group, W represents the following formula (12 .1) or (12.2). ]

[In the above formula (12.1) or (12.2), R ¹²¹ and R ¹²⁴ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms, and R ¹²² and R ¹²³ each independently represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, provided that R ¹²² and R ¹²³ may combine to form a saturated or unsaturated ring, and R ¹²⁵ is represents a divalent hydrocarbon group having 1 to 12 carbon atoms, and R ¹²⁶ represents a hydrogen atom or a methyl group; ]

The acid value of the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group is such that the resin composition exhibits higher photosensitivity, and the obtained cured product has superior elongation, low elasticity, heat resistance and low acid value. From the viewpoint of expressing dielectric properties, the range is preferably 30 to 150 mgKOH/g, more preferably 40 to 120 mgKOH/g. The acid value of the acrylamide resin (B5) having an acid group and a polymerizable unsaturated group in the present disclosure is a value measured based on the neutralization titration method of JIS K 0070 (1992).

<Ester Resin (B6) Having Acid Group and Polymerizable Unsaturated Group>
Examples of the ester resin (B6) having an acid group and a polymerizable unsaturated group include a phenolic hydroxyl group-containing compound (b5-1), an alkylene oxide (b5-2b) or an alkylene carbonate (b5-2a), and an unsaturated A resin obtained by reacting a saturated monobasic acid (b1-2) with a polybasic acid anhydride (b1-3) is exemplified.

As the alkylene oxide (b5-2b), the same alkylene oxide (b5-2b) as exemplified above can be used. Among these, ethylene oxide or propylene oxide is preferred from the viewpoint that the resin composition exhibits higher photosensitivity and that the resulting cured product exhibits superior elongation, low elasticity, heat resistance and low dielectric properties.
Alkylene oxide (b5-2b) can be used alone or in combination of two or more.

As the alkylene carbonate (b5-2a), the same alkylene carbonate (b5-2a) as exemplified above can be used. Among these, ethylene carbonate or propylene carbonate is preferable from the viewpoint that the resin composition exhibits higher photosensitivity and that the resulting cured product exhibits superior elongation, low elasticity, heat resistance and low dielectric properties.
Alkylene carbonate (b5-2a) can be used alone or in combination of two or more.

The method for producing the ester resin (B6) having an acid group and a polymerizable unsaturated group is not particularly limited, and any method may be used. The production of the ester resin having an acid group and a polymerizable unsaturated group may be carried out in an organic solvent if necessary, and if necessary, a basic catalyst and an acidic catalyst may be used.

As the organic solvent, the same organic solvents as those exemplified above can be used, and the organic solvents can be used alone or in combination of two or more. As the basic catalyst, the same basic catalyst as exemplified above can be used, and the basic catalyst can be used alone or in combination of two or more. As the acidic catalyst, the same ones as those exemplified above as the acidic catalyst can be used, and the acidic catalyst can be used alone or in combination of two or more kinds.

The above are the details of the essential components contained in the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment.

(Optional additive component)
In addition, the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment may contain various known additives such as ultraviolet stabilizers and storage stabilizers in addition to the compounds or resins described above. can.

The method for producing the resin composition having an acid group and a polymerizable unsaturated group of the present embodiment is not particularly limited, and can be produced by kneading the various components described above using a kneader such as rolls. can.

[Curable resin composition]
The curable resin composition of the present embodiment is characterized by containing at least the above resin composition having an acid group and a polymerizable unsaturated group, and a photopolymerization initiator. In other words, the curable resin composition of the present embodiment comprises at least the aromatic ester compound (A) described above, the resin (B) having an acid group and a polymerizable unsaturated group described above, and a photopolymerization initiator. It is characterized by containing A photoinitiator may be used individually by 1 type, and may be used in combination of 2 or more type.

(Photoinitiator)
A suitable photopolymerization initiator can be selected and used depending on the type of active energy rays to be irradiated. Further, it may be used in combination with a photosensitizer such as an amine compound, a urea compound, a sulfur-containing compound, a phosphorus-containing compound, a chlorine-containing compound and a nitrile compound. Also, the photopolymerization initiator is preferably a radical polymerization initiator. Specific examples of such photopolymerization initiators include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 1,2-(dimethylamino )-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other alkylphenone photoinitiators; 2,4,6-trimethylbenzoyl-diphenyl - acylphosphine oxide photopolymerization initiators such as phosphine oxide; intramolecular hydrogen abstraction type photopolymerization initiators such as benzophenone compounds;

Furthermore, specific examples of photopolymerization initiators include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl -1-propan-1-one, thioxanthone and thioxanthone derivatives, 2,2′-dimethoxy-1,2-diphenylethan-1-one, diphenyl(2,4,6-trimethoxybenzoyl)phosphine oxide, bis(2 ,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one and the like.

Commercially available photopolymerization initiators include, for example, "Omnirad-1173", "Omnirad-184", "Omnirad-127", "Omnirad-2959", "Omnirad-369", "Omnirad-379", "Omnirad -907", "Omnirad-4265", "Omnirad-1000", "Omnirad-651", "Omnirad-TPO", "Omnirad-819", "Omnirad-2022", "Omnirad-2100", "Omnirad-754" ”, “Omnirad-784”, “Omnirad-500”, “Omnirad-81” (manufactured by IGM), “Kayacure-DETX”, “Kayacure-MBP”, “Kayacure-DMBI”, “Kayacure-EPA”, “ Kayacure-OA” (manufactured by Nippon Kayaku Co., Ltd.), “Vicure-10”, “Vicure-55” (manufactured by Stouffer Chemical), “Trigonal P1” (manufactured by Akzo), “Sunray 1000” (manufactured by Sands) ), “Deep” (manufactured by Upjohn), “Quantacure-PDO”, “Quantacure-ITX”, “Quantacure-EPD” (manufactured by Ward Blenkinsop), “Runtecure-1104” (manufactured by Runtec) etc.

The content of the photopolymerization initiator in the curable resin composition of the present embodiment is based on a total of 100 parts by mass of the aromatic ester compound (A) and the resin (B) having an acid group and a polymerizable unsaturated group, It is preferably 0.1 parts by mass or more and 10 parts by mass or less.

(Other various additives)
The curable resin composition of the present embodiment may optionally contain a curing agent, curing accelerator, other resin, organic solvent, flame retardant, filler, pigment, antifoaming agent, viscosity Appropriate amounts of various additives such as adjusting agents, leveling agents, and storage stabilizers can also be included.

<Curing agent>
Examples of curing agents include epoxy resins and other curing agents (amine curing agents, acid anhydride curing agents, phenolic resin curing agents, etc.), with epoxy resins being preferred.

Although the epoxy resin is not particularly limited, it is preferably a curable resin that contains two or more epoxy groups in the molecule and can be cured by forming a crosslinked network with the epoxy groups. Epoxy resins are not particularly limited, but include phenol novolak type epoxy resin, cresol novolak type epoxy resin, α-naphthol novolak type epoxy resin, β-naphthol novolak type epoxy resin, bisphenol A novolak type epoxy resin, and biphenyl novolak type epoxy resin. Novolac type epoxy resin such as;
Aralkyl-type epoxy resins such as phenol aralkyl-type epoxy resins, naphthol aralkyl-type epoxy resins, and phenol biphenyl aralkyl-type epoxy resins;
Bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol type epoxy resin such as tetrabromobisphenol A type epoxy resin;
Biphenyl-type epoxy resins such as biphenyl-type epoxy resins, tetramethylbiphenyl-type epoxy resins, and epoxy resins having a biphenyl skeleton and a diglycidyloxybenzene skeleton;
Naphthalene type epoxy resin;
Binaphthol-type epoxy resin; Binaphthyl-type epoxy resin;
Dicyclopentadiene type epoxy resin such as dicyclopentadiene phenol type epoxy resin;
Glycidylamine type epoxy resins such as tetraglycidyldiaminodiphenylmethane type epoxy resins, triglycidyl-p-aminophenol type epoxy resins, diaminodiphenylsulfone glycidylamine type epoxy resins;
diglycidyl ester type epoxy resins such as 2,6-naphthalenedicarboxylic acid diglycidyl ester type epoxy resins and hexahydrophthalic anhydride glycidyl ester type epoxy resins;
Examples include benzopyran-type epoxy resins such as dibenzopyran, hexamethyldibenzopyran, and 7-phenylhexamethyldibenzopyran.
Among these epoxy resins, so-called glycidyl ether type epoxy resins obtained by epoxidizing phenolic compounds are preferred. is more preferable from the viewpoint of The epoxy resins described above may be used alone or in combination of two or more.

The epoxy equivalent of the epoxy resin is preferably 120-400 g/eq, more preferably 150-300 g/eq. When the epoxy equivalent of the epoxy resin is 120 g/eq or more, it is preferable because the dielectric properties of the resulting cured product are excellent. It is preferable because it has an excellent balance between the properties and the dielectric loss tangent.

The softening point of the epoxy resin is 20 to 200° C. from the viewpoint of exhibiting higher photosensitivity of the resin composition and exhibiting superior elongation, low elasticity, heat resistance and low dielectric properties in the resulting cured product. It is preferably 40 to 150°C, more preferably 40 to 150°C.

Regarding the amount of epoxy resin used, when the ester group in the aromatic ester compound (A) and the acid group in the resin (B) having an acid group and a polymerizable unsaturated group are (total) functional groups , The functional group equivalent ratio to the amount of epoxy resin used ((aromatic ester compound (A) + resin (B) having an acid group and a polymerizable unsaturated group) / epoxy resin) is 0.2 to 2. is more preferable, and 0.4 to 1.5 is more preferable. It is preferable that the functional group equivalent ratio is 0.2 or more because the resulting cured product can have a lower dielectric loss tangent and a higher flexibility. If the functional group equivalent ratio exceeds 2, the heat resistance and curability deteriorate, so it is preferable to use it within the above range.

Amine curing agents include, but are not limited to, diethylenetriamine (DTA), triethylenetetramine (TTA), tetraethylenepentamine (TEPA), dipropylenediamine (DPDA), diethylaminopropylamine (DEAPA), and N-aminoethylpiperazine. , mensenediamine (MDA), isophorone diamine (IPDA), 1,3-bisaminomethylcyclohexane (1,3-BAC), piperidine, N,N,-dimethylpiperazine, triethylenediamine, and other aliphatic amines; m - xylenediamine (XDA), methanephenylenediamine (MPDA), diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS), benzylmethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylamino and aromatic amines such as methyl)phenol.

Acid anhydride curing agents include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bis trimellitate, glycerol tri trimellitate, maleic anhydride, tetrahydro phthalic anhydride, methyl Tetrahydrophthalic anhydride, Endomethylenetetrahydrophthalic anhydride, Methylendomethylenetetrahydrophthalic anhydride, Methylbutenyltetrahydrophthalic anhydride, Dodecenylsuccinic anhydride, Hexahydrophthalic anhydride, Methylhexahydrophthalic anhydride, Succinic anhydride, Methyl cyclohexenedicarboxylic acid anhydride and the like.

Phenol resin curing agents include phenol novolak resin, cresol novolak resin, naphthol novolak resin, bisphenol novolak resin, biphenyl novolak resin, dicyclopentadiene-phenol addition type resin, phenol aralkyl resin, naphthol aralkyl resin, triphenolmethane type resin, A tetraphenol ethane type resin, an aminotriazine-modified phenol resin, and the like can be mentioned.
Any of the other curing agents mentioned above may be used alone or in combination of two or more.

Regarding the amount of other curing agents (amine curing agent, acid anhydride curing agent, phenolic resin curing agent) used, the ester group in the aromatic ester compound (A), and the resin having an acid group and a polymerizable unsaturated group When the acid groups in (B) are defined as (total) functional groups, the functional group equivalent ratio with respect to the amount of the other curing agent used ((aromatic ester compound (A) + acid groups and polymerizable unsaturated groups (Resin (B))/other curing agent) is more preferably from 0.2 to 2, more preferably from 0.4 to 1.5. It is preferable that the functional group equivalent ratio is 0.2 or more because the resulting cured product can have a lower dielectric loss tangent and a higher flexibility. If the functional group equivalent ratio exceeds 2, the heat resistance and curability deteriorate, so it is preferable to use it within the above range.

<Curing accelerator>
The curing accelerator is not particularly limited, but includes phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, urea-based curing accelerators, and the like. The above curing accelerators may be used singly or in combination of two or more.

Examples of the phosphorus-based curing accelerator include organic phosphine compounds such as triphenylphosphine, tributylphosphine, tripparatolylphosphine, diphenylcyclohexylphosphine and tricyclohexylphosphine; organic phosphine compounds such as trimethylphosphite and triethylphosphite; ethyltriphenyl phosphonium bromide, benzyltriphenylphosphonium chloride, butylphosphonium tetraphenylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylphosphine triphenylborane, tetraphenylphosphonium thiocyanate, tetraphenylphosphonium dicyanamide, Examples include phosphonium salts such as butylphenylphosphonium dicyanamide and tetrabutylphosphonium decanoate.

Examples of the amine curing accelerator include triethylamine, tributylamine, N,N-dimethyl-4-aminopyridine (DMAP), 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5, 4,0]-undecene-7 (DBU), 1,5-diazabicyclo[4,3,0]-nonene-5 (DBN) and the like.

Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl -4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl -4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-phenylimidazole isocyanuric acid adduct , 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2 -methyl-3-benzylimidazolium chloride, 2-methylimidazoline and the like.

Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1, 5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide , 1-ethylbiguanide, 1-butylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide and the like.

Examples of the urea curing accelerator include 3-phenyl-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, chlorophenylurea, 3-(4-chlorophenyl)-1,1 -dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea and the like.

Among the curing accelerators mentioned above, 2-ethyl-4-methylimidazole and N,N-dimethyl-4-aminopyridine (DMAP) are preferably used.

The content of the curing accelerator in the curable resin composition of the present embodiment can be adjusted as appropriate to obtain desired curability. , 0.01 to 5 parts by mass. When the content of the curing accelerator is 0.01 parts by mass or more, the curability can be enhanced more reliably. On the other hand, when the content of the curing accelerator is 5 parts by mass or less, sufficiently good insulation reliability can be maintained. From the same point of view, the content of the curing accelerator is more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the total amount of the components (A) and (B). Part or less is more preferable.

<Other resins>
Other resins include, but are not particularly limited to, maleimide resins, bismaleimide resins, polymaleimide resins, polyphenylene ether resins, polyimide resins, cyanate ester resins, benzoxazine resins, triazine-containing cresol novolak resins, cyanate ester resins, styrene- Examples include maleic anhydride resins, allyl group-containing resins such as diallyl bisphenol and triallyl isocyanurate, polyphosphate esters, and phosphate-carbonate copolymers. These other resins may be used alone or in combination of two or more.

The content of other resins in the curable resin composition of the present embodiment is preferably 50% by mass or less of the total.

<Organic solvent>
The curable resin composition of the present embodiment may contain an organic solvent or may be solvent-free. The organic solvent has a function of adjusting the viscosity of the curable resin composition.

Specific examples of organic solvents include, but are not limited to, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether solvents such as diethyl ether and tetrahydrofuran; ethyl acetate, butyl acetate, cellosolve acetate, and propylene glycol monomethyl. ester solvents such as ether acetate and carbitol acetate; carbitols such as cellosolve and butyl carbitol; toluene, xylene, ethylbenzene, mesitylene, 1,2,3-trimethylbenzene and 1,2,4-trimethylbenzene Examples include aromatic hydrocarbons, amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone. These organic solvents may be used alone or in combination of two or more.

The content of the organic solvent in the curable resin composition of the present embodiment is preferably 0 to 90% by mass in the total amount (100% by mass) of the curable resin composition, and 10 to 90% by mass. is more preferred, and 20 to 80% by mass is even more preferred. When the content of the organic solvent is 10% by mass or more, it is preferable because the handleability is excellent. On the other hand, a solvent content of 90% by mass or less is preferable from the viewpoint of economy.

<Flame retardant>
The flame retardant is not particularly limited, but includes inorganic phosphorus flame retardants, organic phosphorus flame retardants, halogen flame retardants, and the like. The flame retardants described above may be used singly or in combination of two or more.

Examples of the inorganic phosphorus-based flame retardant include, but are not limited to, red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; and amide phosphoric acid.

The organic phosphorus flame retardant is not particularly limited, but methyl acid phosphate, ethyl acid phosphate, isopropyl acid phosphate, dibutyl phosphate, monobutyl phosphate, butoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, bis(2-ethylhexyl) phosphate, monoisodecyl acid phosphate, lauryl acid phosphate, tridecyl acid phosphate, stearyl acid phosphate, isostearyl acid phosphate, oleyl acid phosphate, butylpyrophosphate, tetracosyl acid phosphate, ethylene glycol acid phosphate, (2-hydroxyethyl ) Phosphate esters such as methacrylate acid phosphate; 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, diphenylphosphine oxide and the like diphenylphosphine; 9-oxa-10-phosphaphenanthrene-10-oxide, 10-(1,4-dioxynaphthalene)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, diphenylphosphinylhydroquinone, diphenylphosphine Phosphorus-containing phenols such as phenyl-1,4-dioxynaphthalene, 1,4-cyclooctylenephosphinyl-1,4-phenyldiol and 1,5-cyclooctylenephosphinyl-1,4-phenyldiol 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, 10 Cyclic phosphorus compounds such as -(2,7-dihydroxynaphthyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide; Aldehyde compounds, compounds obtained by reacting with phenol compounds, and the like.

The halogen-based flame retardant is not particularly limited, but brominated polystyrene, bis(pentabromophenyl)ethane, tetrabromobisphenol A bis(dibromopropyl ether), 1,2, -bis(tetrabromophthalimide), 2, 4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine, tetrabromophthalic acid and the like.

The amount of the flame retardant used in the curable resin composition of the present embodiment is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass as the total amount of components (A) and (B). When the content of the flame retardant is 0.1 parts by mass or more, flame retardancy can be more reliably imparted. On the other hand, when the content of the flame retardant is 50 parts by mass or less, flame retardancy can be imparted while maintaining dielectric properties. From the same point of view, the content of the flame retardant is more preferably 1 part by mass or more with respect to 100 parts by mass of the total amount of the components (A) and (B), and is 30 parts by mass or less. It is more preferable to have

<Filler>
Examples of fillers include organic fillers and inorganic fillers. The organic filler has a function of improving elongation, a function of improving mechanical strength, and the like. Inorganic fillers have functions such as reducing the coefficient of thermal expansion and imparting flame retardancy. The fillers described above may be used singly or in combination of two or more.

Examples of the organic filler include, but are not particularly limited to, polyamide particles.

The inorganic filler is not particularly limited, but silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, nitride Boron, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate , calcium zirconate, zirconium phosphate, zirconium tungstate phosphate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, carbon black and the like. Among these, it is preferable to use silica. At this time, as silica, amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, and the like can be used.

Moreover, the said filler may be surface-treated as needed. At this time, the surface treatment agent that can be used is not particularly limited, but aminosilane-based coupling agents, epoxysilane-based coupling agents, mercaptosilane-based coupling agents, silane-based coupling agents, organosilazane compounds, titanate-based cups. A ring agent or the like may be used. Specific examples of surface treatment agents include 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, hexamethyldimethoxysilane, silazane and the like. In addition, the above fillers may be used alone or in combination of two or more.

The amount of filler used in the curable resin composition of the present embodiment is preferably 0.5 to 95 parts by mass with respect to 100 parts by mass as the total amount of components (A) and (B). When the content of the filler is 0.5 parts by mass or more, the effect of the filler can be sufficiently imparted. On the other hand, when the content of the filler is 95 parts by mass or less, it is possible to suppress deterioration of moldability due to increase in the viscosity of the compound. From the same point of view, the content of the filler is more preferably 5 parts by mass or more and 80 parts by mass or less with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable to have

The method for producing the curable resin composition of the present embodiment is not particularly limited, and can be produced by kneading the various components described above using a kneader such as rolls.

[Cured product]
The cured product of this embodiment is a cured product of the curable resin composition described above. In other words, the cured product of the present embodiment is obtained by irradiating the curable resin composition described above with an active energy ray to cure it. Such a cured product of the present embodiment can function as an insulating material excellent in elongation, low elasticity, heat resistance and low dielectric properties.

Examples of active energy rays include ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays. When ultraviolet rays are used as active energy rays, irradiation may be performed in an atmosphere of an inert gas such as nitrogen gas, or in an air atmosphere, in order to efficiently perform a curing reaction using ultraviolet rays.

Specific examples of ultraviolet light sources include ultraviolet lamps such as low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, xenon lamps, gallium lamps, and metal halide lamps, sunlight, and LEDs. From the point of view of efficiency and economy, ultraviolet lamps are commonly used.

The integrated amount of active energy rays is not particularly limited, but is preferably 0.1 to 50 kJ/m ² , more preferably 0.5 to 10 kJ/m ² . When the cumulative amount of light is within the above range, it is possible to sufficiently prevent or suppress the occurrence of uncured portions. Irradiation with active energy rays may be performed in one step or in two or more steps.

Another method for obtaining a cured product by curing reaction of the curable resin composition includes, for example, heat curing. The heating temperature for heat curing is not particularly limited, but it is preferably 100 to 300° C., and the heating time is preferably 1 to 24 hours.

Applications in which the curable resin composition or cured product of the present embodiment is used include printed wiring board materials, resin compositions for flexible wiring boards, interlayer insulating materials for build-up boards, and circuit boards such as build-up adhesive films. insulating materials, resin casting materials, adhesives, semiconductor sealing materials, semiconductor devices, prepregs, conductive pastes, build-up films, build-up substrates, fiber-reinforced composite materials, molded products made by curing the above composite materials, etc. mentioned. Among these various applications, printed wiring board materials, insulating materials for circuit boards, and adhesive film applications for build-ups are used for so-called electronic component built-in substrates in which passive components such as capacitors and active components such as IC chips are embedded in the substrate. can be used as an insulating material for Furthermore, among the above, taking advantage of the characteristics that the cured product has excellent flexibility, adhesion, low dielectric properties, heat resistance, etc., the curable resin composition of the present invention is a semiconductor sealing material, a semiconductor device , prepregs, flexible wiring boards, circuit boards, build-up films, build-up boards, multilayer printed wiring boards, fiber-reinforced composite materials, and moldings obtained by curing the above composite materials.

[Insulating material]
The insulating material of this embodiment is made of the curable resin composition described above. Preferably, the insulating material of the present embodiment is obtained by irradiating the curable resin composition described above with an active energy ray to cure it. The insulating material of this embodiment is excellent in elongation, low elasticity, heat resistance and low dielectric properties.

Examples of the insulating material include the above-described interlayer insulating material for buildup boards, insulating material for circuit boards such as buildup adhesive film, insulating material for circuit boards, and insulating material for electronic component built-in boards. For example, as a method for producing a build-up substrate from the curable resin composition, there is a method comprising the following three steps. The first step is a step of applying the above-mentioned curable resin composition appropriately blended with rubber, filler, etc. to a circuit board having a circuit formed thereon by using a spray coating method, a curtain coating method, or the like, and then curing the composition. In the second step, after that, after drilling a predetermined through-hole portion etc. as necessary, it is treated with a roughening agent, and the surface is washed with hot water to form unevenness, and a metal such as copper is formed. The third step is a step of sequentially repeating such operations as desired to alternately build up resin insulating layers and conductor layers of a predetermined circuit pattern. It should be noted that it is preferable to form the through-hole portion after forming the outermost resin insulating layer. The first step can also be carried out by laminating a build-up film that has been previously coated to a desired thickness and dried, in addition to the solution application method described above. In addition, the build-up board of the present invention is obtained by heat-pressing a resin-coated copper foil obtained by semi-curing the resin composition on a copper foil onto a wiring board on which a circuit is formed at 170 to 250 ° C. It is also possible to manufacture a build-up substrate by omitting the steps of forming a hardened surface and plating.

[Resist material]
The resist member of this embodiment is made of the curable resin composition described above. The resist member is formed, for example, by applying the curable resin composition on a substrate, appropriately drying the organic solvent at a temperature range of about 60 to 100 ° C., and then passing it through a photomask having a desired pattern. It can be obtained by exposing to active energy rays, developing the unexposed areas with an alkaline aqueous solution, and further heat-curing in a temperature range of about 140 to 180°C. The resist member of this embodiment is excellent in low dielectric properties and elongation.

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples.

GPC was measured under the following conditions.

(GPC measurement)
Measurement was performed using the following measurement apparatus and measurement conditions, and GPC charts of diphenyl isophthalate derivatives and aromatic ester compounds obtained in Synthesis Examples, Examples, etc. shown below were obtained. From the results of the GPC chart, it was confirmed that the target products (diphenyl isophthalate derivative and aromatic ester compound) were produced from the reduction and disappearance of the raw material peaks.
Measuring device: "HLC-8320 GPC" manufactured by Tosoh Corporation
Column: guard column "HXL-L" manufactured by Tosoh Corporation + "TSK-GEL G2000HXL" manufactured by Tosoh Corporation + "TSK-GEL G2000HXL" manufactured by Tosoh Corporation + "TSK-GEL G3000HXL" manufactured by Tosoh Corporation + Tosoh Corporation Made by "TSK-GEL G4000HXL"
Detector: RI (differential refractometer)
Data processing: "GPC Workstation EcoSEC-WorkStation" manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40°C
Developing solvent Tetrahydrofuran
Flow rate 1.0 ml/min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of the "GPC Workstation EcoSEC-WorkStation".
(Polystyrene used)
"A-500" manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
"F-1" manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
"F-4" manufactured by Tosoh Corporation
"F-10" manufactured by Tosoh Corporation
"F-20" manufactured by Tosoh Corporation
"F-40" manufactured by Tosoh Corporation
"F-80" manufactured by Tosoh Corporation
"F-128" manufactured by Tosoh Corporation
Sample: A solution (50 μl) obtained by filtering a tetrahydrofuran solution of 1.0% by mass in terms of solid content of the diphenyl isophthalate derivative and the aromatic ester compound obtained in Synthesis Examples and Examples with a microfilter was used.

(Synthesis Example 1): Synthesis of Diphenyl Isophthalate Derivative (a′-1) Isophthalyl chloride 808 as component (a1) was added to a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube, and a stirrer. 0 parts by mass and 4140.0 parts by mass of toluene were charged, and the inside of the system was replaced with nitrogen under reduced pressure and dissolved. Then, 864.0 parts by mass of o-cresol as the component (a2) was added, and the inside of the system was replaced with nitrogen and dissolved. After that, 2.07 parts by mass of tetrabutylammonium bromide was dissolved, and while purging with nitrogen gas, the inside of the system was controlled at 60°C or less, and 1648.0 parts by mass of a 20% sodium hydroxide aqueous solution was added dropwise over 3 hours. . Stirring was then continued under these conditions for 1 hour. After completion of the reaction, the mixture was allowed to stand still for liquid separation, and the aqueous layer was removed. Further, water was added to the toluene layer in which the reactants were dissolved, and the mixture was stirred and mixed for about 15 minutes, and the mixture was allowed to stand still for liquid separation to remove the aqueous layer. This operation was repeated until the pH of the aqueous layer reached 7. Thereafter, water and toluene were removed by decanter dehydration to obtain a diphenyl isophthalate derivative (a'-1) as a crystalline compound (intermediate product (a')). FIG. 1 shows a GPC chart of the obtained diphenyl isophthalate derivative (a'-1).

(Synthesis Example 2): Synthesis of aromatic ester compound (A-1) In a flask equipped with a thermometer, a dropping funnel, a condenser, a fractionating tube, and a stirrer, hydroxyl groups were added to both ends as component (a3). Polybutadiene (manufactured by Nippon Soda Co., Ltd.: trade name: G-1000, hydroxyl value: 74.2 mgKOH / g, hydroxyl equivalent: 756 g / eq) 200 parts by mass, intermediate product (a') obtained in Synthesis Example 1 91.5 parts by mass of diphenyl isophthalate derivative (a'-1) as , 0.29 parts by mass of 1,8-diazabicyclo[5,4,0]-undecene-7 (hereinafter abbreviated as "DBU") , 4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-1,6-di-tert-butylphenol (manufactured by BASF Japan Ltd., trade name: IRGANOX 565 ) was charged, and the inside of the system was replaced with nitrogen under reduced pressure, the temperature was raised to 180°C, and the mixture was stirred until the reaction was completed. The termination time of the reaction was confirmed by GPC. Thereafter, o-cresol was removed by distillation under reduced pressure to obtain an aromatic ester compound (A-1). The functional group equivalent of the obtained aromatic ester compound (A-1) was 995 g/eq from the charge ratio, and the average repetition number p ¹¹ (see general formula (1) above) was 1 from the charge ratio. . The structure of the obtained aromatic ester compound (A-1) was as shown below.

(Synthesis Example 3): Synthesis of Aromatic Ester Compound (A-2) In Synthesis Example 2, except for IRGANOX 565, instead of G-1000, polycarbonate polyol (Kuraray Co., Ltd., trade name: C-2090, hydroxyl value : 56.8 mg KOH / g, hydroxyl equivalent: 988 g / eq) to 200.0 parts by mass, and the amount of the diphenyl isophthalate derivative (a'-1) obtained in Synthesis Example 1 was changed from 91.5 parts by mass to 70.0 parts by mass. An aromatic ester compound (A-2) was obtained in the same manner as in Synthesis Example 2, except that 0 parts by mass and DBU was changed from 0.29 parts by mass to 0.27 parts by mass. The functional group equivalent weight of this aromatic ester compound (A-2) was 1194 g/eq based on the charge ratio, and the average repetition number p ¹¹ (see general formula (1) above) was 1 based on the charge ratio. The structure of the obtained aromatic ester compound (A-2) was a structure satisfying the general formula (1).

(Synthesis Example 4): Synthesis of aromatic ester compound (A-3) In Synthesis Example 2, except for IRGANOX 565, instead of G-1000, polyester polyol (manufactured by Croda Japan Co., Ltd., trade name: PRILAST 1837LQGD, hydroxyl group 110 mg KOH/g, hydroxyl equivalent: 510 g/eq) to 50.0 parts by mass, and the amount of the diphenyl isophthalate derivative (a′-1) obtained in Synthesis Example 1 was changed from 91.5 parts by mass to 34.0 parts by mass. An aromatic ester compound (A-3) was obtained in the same manner as in Synthesis Example 2, except that the amount of DBU was changed from 0.29 parts by mass to 0.084 parts by mass. The functional group equivalent weight of this aromatic ester compound (A-3) was 748 g/eq based on the charge ratio, and the average repetition number p ¹¹ (see general formula (1) above) was 1 based on the charge ratio. The structure of the obtained aromatic ester compound (A-3) was a structure satisfying the general formula (1).

(Synthesis Example 5: Production of Resin (B-1) Having Acid Group and Polymerizable Unsaturated Group)
A flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 123 parts by mass of diethylene glycol monoethyl ether acetate, and ortho-cresol novolac type epoxy resin "EPICLON N-680" (manufactured by DIC Corporation, softening point 86°C, Epoxy equivalent: 214 g/eq,) 214 parts by mass are dissolved, 0.9 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methoquinone are added, and then 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine are added. Then, the reaction was carried out at 120° C. for 10 hours while blowing air. Then, 72 parts by mass of diethylene glycol monoethyl ether acetate and 76 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110° C. for 3 hours to obtain a resin (B-1) having an acid group and a polymerizable unsaturated group. The resin (B-1) having an acid group and a polymerizable unsaturated group had a non-volatile content of 65% by mass and a solid content acid value of 80 mgKOH/g. The acid value is a value measured based on the neutralization titration method of JIS K 0070 (1992).

(Synthesis Example 6: Production of resin (B-2) having acid group and polymerizable unsaturated group)
A flask equipped with a thermometer, a stirrer, and a reflux condenser was charged with 499.7 parts by mass of diethylene glycol monoethyl ether acetate, and an isocyanurate modified form of isophorone diisocyanate (manufactured by EVONIK "VESTANAT T-1890/100", NCO %=17.2%) and 192.0 parts by mass of trimellitic anhydride were dissolved, and 1.0 part by mass of dibutylhydroxytoluene was added as an antioxidant. After reacting at 160° C. for 6 hours in a nitrogen atmosphere, it was confirmed that the NCO% was 0.1 or less. Then, after adding 0.4 parts by mass of methoquinone, 147.6 parts by mass of pentaerythritol polyacrylate mixture ("Aronix M-306" manufactured by Toagosei Co., Ltd., hydroxyl value: 159.7 mgKOH/g) and triphenylphosphine3. 5 parts by mass was added, and the reaction was carried out at 110° C. for 5 hours while blowing air. After that, 165.0 parts by mass of glycidyl methacrylate was added and reacted at 110° C. for 6 hours. Next, 110.4 parts by mass of succinic anhydride was added and reacted at 110° C. for 5 hours to obtain a resin (B-2) having an acid group and a polymerizable unsaturated group. The resin (B-2) having an acid group and a polymerizable unsaturated group had a non-volatile content of 62% by mass and a solid content acid value of 80 mgKOH/g.

(Comparative Synthesis Example 1): Synthesis of phenolic hydroxyl group-containing resin (a'-2) In a flask equipped with a thermometer and a stirrer, diglycidyl ether of 1,6-hexanediol (manufactured by DIC Corporation: trade name: SR -16HL, epoxy equivalent: 127 g/eq) 127 parts by mass and 228 parts by mass of bisphenol A (hydroxyl equivalent: 114 g/eq) were charged, and the temperature was raised to 140°C over 30 minutes. Next, 1.8 parts by mass of a 4% sodium hydroxide aqueous solution was charged into the flask, the temperature inside the flask was raised to 150° C. over 30 minutes, and the reaction was continued at 150° C. for 5 hours. Then, a neutralizing amount of sodium phosphate was added to the flask to obtain a phenolic hydroxyl group-containing resin (a'-2). From the GPC chart (no drawing), it was confirmed that the phenolic hydroxyl group-containing resin (a'-2) was produced and that the hydroxyl group equivalent of the resin (a'-2) was 300 g/eq.

(Comparative Synthesis Example 2): Synthesis of Aromatic Ester Compound (A-4) The phenolic 300 parts by mass of a hydroxyl group-containing resin (a'-2) (hydroxyl equivalent: 300 g/eq) and 1212 parts by mass of methyl isobutyl ketone (hereinafter abbreviated as "MIBK") were charged, and the system was decompressed and replaced with nitrogen. , to dissolve the phenolic hydroxyl group-containing resin (a'-2). Next, 140.5 parts by mass (1.0 mol) of benzoyl chloride was charged into the flask, and then, while purging with nitrogen gas, the inside of the system was controlled at 60°C or less, and 216 parts by mass of a 20% sodium hydroxide aqueous solution was added. was added dropwise over 3 hours, and stirring was continued for 1 hour under the above conditions. After completion of the reaction, the mixture was allowed to stand still for liquid separation, and the aqueous layer was removed. After that, water was added to the MIBK phase in which the reactants were dissolved, and the mixture was stirred and mixed for about 10 minutes, and the mixture was allowed to stand still to separate the layers, and the aqueous layer was removed. This operation was repeated until the pH of the aqueous layer became 7. Thereafter, water was removed by decanter dehydration, and then MIBK was removed by dehydration under reduced pressure to obtain an aromatic ester compound (A-4). The functional group equivalent weight of the obtained aromatic ester (A-4) was 404 g/eq based on the charging ratio.

(Example 1: Preparation of curable resin composition (1))
15 parts by mass of the aromatic ester compound (A-1) obtained in Synthesis Example 2, and 100 masses of the resin (B-2) having an acid group and a polymerizable unsaturated group having a nonvolatile content of 62% by mass obtained in Synthesis Example 6 parts (62 parts by mass as solid content) were mixed to obtain a resin composition (1) having an acid group and a polymerizable unsaturated group. For this resin composition, 22.7 parts by weight of ortho-cresol novolac type epoxy resin (“EPICLON N-680” manufactured by DIC Corporation, epoxy equivalent: 214) as a curing agent and 12.0 parts by weight of diethylene glycol monoethyl ether acetate as an organic solvent. 2 parts by mass, a photopolymerization initiator (IGM Resins "Omnirad 907") 3.9 parts by mass, 0.5 parts by mass of 2-ethyl-4-methylimidazole, and 7.7 parts by mass of dipentaerythritol hexaacrylate parts and 0.5 parts by mass of phthalocyanine green to obtain a curable resin composition (1).

(Examples 2 to 8: Preparation of curable resin compositions (2) to (8))
In the same manner as in Example 1 at the blending ratio shown in Table 1, an aromatic ester compound selected from (A-1) to (A-4) and from (B-1) to (B-2) A resin having a selected acid group and a polymerizable unsaturated group is mixed to obtain resin compositions (2) to (8) having an acid group and a polymerizable unsaturated group, and a curable resin composition (2 ) to (8) were obtained.

(Comparative Example 1: Preparation of curable resin composition (R1))
100 parts by mass of the resin (B-1) having an acid group and a polymerizable unsaturated group and having a nonvolatile content of 65% by mass obtained in Synthesis Example 5 (65 parts by mass as a solid content), and an ortho-cresol novolac-type epoxy resin as a curing agent. ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214) 25.3 parts by mass, 13.6 parts by mass of diethylene glycol monoethyl ether acetate as an organic solvent, and a photopolymerization initiator ("Omnirad" manufactured by IGM Resins 907”) 3.3 parts by mass, 0.5 parts by mass of 2-ethyl-4-methylimidazole, 6.5 parts by mass of dipentaerythritol hexaacrylate, and 0.5 parts by mass of phthalocyanine green are mixed and cured. A flexible resin composition (R1) was obtained.

(Comparative Example 2: Preparation of curable resin composition (R2))
15 parts by mass of the aromatic ester compound (A-4) obtained in Comparative Synthesis Example 2, and a resin (B-2) 100 having an acid group and a polymerizable unsaturated group having a nonvolatile content of 62% by mass obtained in Synthesis Example 6 Parts by mass (62 parts by mass as solid content) were mixed to obtain a resin composition (R1). For this resin composition, 22.7 parts by mass of an ortho-cresol novolac type epoxy resin (“EPICLON N-680” manufactured by DIC Corporation, epoxy equivalent: 214) as a curing agent, and 12.7 parts by mass of diethylene glycol monoethyl ether acetate as an organic solvent. 2 parts by mass, a photopolymerization initiator (“Omnirad 907” manufactured by IGM Resins) 3.9 parts by mass, 0.5 parts by mass of 2-ethyl-4-methylimidazole, and 7.7 parts by mass of dipentaerythritol hexaacrylate parts and 0.5 parts by mass of phthalocyanine green were mixed to obtain a curable resin composition (R2).

The following evaluations were performed using the curable resin compositions (1) to (8), (R1) and (R2) obtained in the above Examples and Comparative Examples.

[Method for evaluating photosensitivity]
The curable resin composition obtained in each example and comparative example was applied to a glass substrate using an applicator so as to have a film thickness of 50 μm, and then dried at 80° C. for 30 minutes. Next, Kodak Step Tablet No. 2 was irradiated with ultraviolet rays of 5 kJ/m ² using a metal halide lamp. This was developed with a 1% by mass sodium carbonate aqueous solution for 180 seconds, and the number of remaining steps was evaluated. Note that the photosensitivity is higher as the number of remaining steps is larger.

The compositions and evaluation results of the curable resin compositions (1) to (8) prepared in Examples 1 to 8 and the curable resin compositions (R1) and (R2) prepared in Comparative Examples 1 and 2 are shown in Table 1. shown in

(Example 9: Preparation of curable resin composition (9))
15 parts by mass of the aromatic ester compound (A-1) obtained in Synthesis Example 2, and 100 masses of the resin (B-2) having an acid group and a polymerizable unsaturated group having a nonvolatile content of 62% by mass obtained in Synthesis Example 6 (62 parts by mass as solid content) were mixed to obtain a resin composition (9) having an acid group and a polymerizable unsaturated group. For this resin composition, 22.7 parts by weight of ortho-cresol novolac type epoxy resin (“EPICLON N-680” manufactured by DIC Corporation, epoxy equivalent: 214) as a curing agent and 12.0 parts by weight of diethylene glycol monoethyl ether acetate as an organic solvent. 2 parts by mass, a photopolymerization initiator (“Omnirad 907” manufactured by IGM Resins) 3.9 parts by mass, and 0.3 parts by mass of 4-dimethylaminopyridine are mixed to obtain a curable resin composition (9). Obtained.

(Examples 10 to 16: Preparation of curable resin compositions (10) to (16))
In the same manner as in Example 9 at the blending ratio shown in Table 2, an aromatic ester compound selected from (A-1) to (A-4) and from (B-1) to (B-2) A resin having an acid group and a polymerizable unsaturated group is mixed to obtain resin compositions (10) to (16) having an acid group and a polymerizable unsaturated group, and a curable resin composition (10 ) to (16) were obtained.

(Comparative Example 3: Preparation of curable resin composition (R3))
100 parts by mass of the resin (B-1) having an acid group and a polymerizable unsaturated group and having a nonvolatile content of 65% by mass obtained in Synthesis Example 5 (65 parts by mass as a solid content), and an ortho-cresol novolak-type epoxy resin as a curing agent. ("EPICLON N-680" manufactured by DIC Corporation, epoxy equivalent: 214) 25.3 parts by mass, 13.6 parts by mass of diethylene glycol monoethyl ether acetate as an organic solvent, and a photopolymerization initiator ("Omnirad" manufactured by IGM Resins 907") and 3.3 parts by mass to obtain a curable resin composition (R3).

(Comparative Example 4: Preparation of curable resin composition (R4))
A curable resin composition (R4) was obtained in the same manner as in Comparative Example 3 with the compounding ratio shown in Table 2.

The following evaluations were performed using the curable resin compositions obtained in the above Examples and Comparative Examples.

[Heat resistance evaluation method]
The curable resin composition obtained in each example and comparative example is applied to a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) using an applicator so that the film thickness is 50 μm. and dried at 80° C. for 30 minutes. Then, after irradiating with ultraviolet rays of 10 kJ/m ² using a metal halide lamp, it was heated at 160° C. for 1 hour to obtain a cured coating film. Then, the cured coating film was peeled off from the copper foil to obtain a cured product. A test piece of 6 mm × 35 mm was cut out from the cured product, and a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device “RSA II” manufactured by Rheometric Co., Ltd., tensile method: frequency 1 Hz, temperature increase rate 3 ° C./min) was used. , the temperature at which the change in elastic modulus becomes maximum was evaluated as the glass transition temperature. In addition, it shows that it is excellent in heat resistance, so that a glass transition temperature is high.

[Method for measuring elongation]
Elongation measurements were based on tensile tests.
<Production of test piece 1>
The curable resin compositions obtained in Examples and Comparative Examples were applied on a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator, and 10 kJ / using a metal halide lamp. After being irradiated with UV light of ^m2 , it was heated at 160°C for 1 hour. The cured product was peeled off from the copper foil to obtain test piece 1 (cured product).

<Tensile test>
The test piece 1 was cut into a size of 10 mm × 80 mm, and a tensile test was performed on the test piece 1 under the following measurement conditions using a precision universal testing machine Autograph "AG-IS" manufactured by Shimadzu Corporation. The elongation (%) until the test piece breaks was measured.

Measurement conditions: temperature 23° C., humidity 50%, distance between gauge lines 20 mm, distance between fulcrums 20 mm, tensile speed 10 mm/min.

[Method for measuring elastic modulus]
Using the same test piece 1 (cured material) as above, the elastic modulus was measured under the condition of 2 mm/min in accordance with JIS K7181. A smaller value indicates a lower elasticity.

[Method of measuring dielectric constant]
The curable resin composition obtained in each example and comparative example was applied onto a glass substrate using an applicator so as to have a film thickness of 50 μm, and dried at 80° C. for 30 minutes. Then, after irradiating with ultraviolet rays of 10 kJ/m ² using a metal halide lamp, it was heated at 160° C. for 1 hour to obtain a cured coating film. Then, the cured coating film was peeled off from the glass substrate to obtain a cured product. Next, a test piece was stored in a room at a temperature of 23 ° C. and a humidity of 50% for 24 hours, and the dielectric constant of the test piece at 1 GHz was measured by the cavity resonance method using "Network Analyzer E8362C" manufactured by Agilent Technologies. It was measured.

[Method of measuring dielectric loss tangent]
The curable resin composition obtained in each example and comparative example was applied onto a glass substrate using an applicator so as to have a film thickness of 50 μm, and dried at 80° C. for 30 minutes. Then, after irradiating with ultraviolet rays of 10 kJ/m ² using a metal halide lamp, it was heated at 160° C. for 1 hour to obtain a cured coating film. Then, the cured coating film was peeled off from the glass substrate to obtain a cured product. Next, a test piece was stored in a room at a temperature of 23 ° C. and a humidity of 50% for 24 hours, and the dielectric loss tangent of the test piece at 1 GHz was measured by the cavity resonance method using "Network Analyzer E8362C" manufactured by Agilent Technologies. It was measured.

The compositions and evaluation results of the curable resin compositions (9) to (16) obtained in Examples 9 to 16 and the curable resin compositions (R3) and (R4) obtained in Comparative Examples 3 and 4 were evaluated. Table 2 shows.

From Tables 1 and 2, the resin compositions of Examples exhibited higher photosensitivity than Comparative Examples, and the obtained cured products exhibited excellent elongation, low elasticity, heat resistance, and low dielectric properties. I know there is.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a resin composition that exhibits high photosensitivity and can exhibit excellent elongation, low elasticity, heat resistance and low dielectric properties in the resulting cured product. Moreover, according to the present invention, it is possible to provide a curable resin composition containing the resin composition, and a cured product, an insulating material, and a resist member obtained using the curable resin composition.

Claims (10)

A resin composition having an acid group and a polymerizable unsaturated group containing an aromatic ester compound (A) and a resin (B) having an acid group and a polymerizable unsaturated group,
The aromatic ester compound (A) comprises an aromatic polycarboxylic acid, an acid halide thereof and/or an esterified product thereof (a1), a monohydroxy aromatic compound (a2), and a polyhydric alcohol compound (a3). is a compound that uses , as an essential reaction raw material,
The hydroxyl equivalent of the polyhydric alcohol compound (a3) is 270 g/eq or more.
A resin composition having an acid group and a polymerizable unsaturated group, characterized by: The aromatic ester compound (A) has the following general formula (1):

[In the above general formula (1), Q ¹¹ and Q ¹² each independently represent a group derived from the aromatic polycarboxylic acid, its acid halide and/or its ester (a1), and Ar ¹¹ and Each Ar ¹² independently represents a group derived from the monohydroxy aromatic compound (a2), each A independently represents a group derived from the polyhydric alcohol compound (a3), and p ¹¹ represents 0.0. It represents the average number of repetitions of 01 or more. ], The resin composition having an acid group and a polymerizable unsaturated group according to claim 1. Ar ¹¹ and Ar ¹² in the general formula (1) are each independently represented by the following general formula (2) or (3):

[* in the above general formulas (2) and (3) represents a bond with the oxygen atom that binds to Ar ¹¹ or Ar ¹² in the above general formula (1),
R ²¹ and R ³¹ each independently represent a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or an aralkyl group, k ²¹ represents an integer of 0 to 7, k ³¹ is 0 to 5 represents an integer of ], The resin composition having an acid group and a polymerizable unsaturated group according to claim 2. The resin composition having an acid group and a polymerizable unsaturated group according to any one of claims 1 to 3, wherein the polyhydric alcohol compound (a3) is a polyol having an aliphatic hydroxyl group. The polyol having an aliphatic hydroxyl group is at least one selected from the group consisting of hydrocarbon polyols, polycarbonate polyols, polyester polyols, polyether polyols, polyurethane polyols, and polysiloxane polyols. A resin composition having an acid group and a polymerizable unsaturated group as described. The solid content mass ratio [(A)/(B)] between the aromatic ester compound (A) and the resin (B) having an acid group and a polymerizable unsaturated group is 5/95 to 50/50. The resin composition having an acid group and a polymerizable unsaturated group according to any one of claims 1 to 5, which is in the range of A curable resin composition comprising the resin composition having an acid group and a polymerizable unsaturated group according to any one of claims 1 to 6 and a photopolymerization initiator. A cured product of the curable resin composition according to claim 7 . An insulating material comprising the curable resin composition according to claim 7 . A resist member comprising the curable resin composition according to claim 7 .

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