JP2024043944A - Wiring bodies, display devices, and antennas - Google Patents

Abstract

[Problem] To provide a wiring body, a display device, and an antenna capable of improving connectivity with an external connection terminal while ensuring flatness. [Solution] An electrode 21 has a first conductor layer 55 in a first trench 60, and a terminal 22 has a second conductor layer 56 in a second trench 64. Of these, the terminal 22 is connected to an external connection terminal and electrically connects the connection terminal and the electrode 21. Since the second conductor layer 56 of the terminal 22 is formed in the second trench 64, flatness of the wiring body 200 can be ensured compared to when it is formed on the surface 7b of the insulating resin part 7A. In addition, the surface 56c of the second conductor layer 56 is located at a position farther away than the surface 7b of the insulating resin part 7A. Therefore, compared to when the surface 56c of the second conductor layer 56 is located at the same height as the surface 7b of the insulating resin part 7A, the external connection terminal is better connected to the surface 56c of the second conductor layer 56. [Selected Figure] FIG.

Description

The present disclosure relates to a wiring body, a display device, and an antenna.

Conventionally, a wiring body is known that includes an electrode, a terminal, and a resin layer provided on a substrate (for example, Patent Document 1). The conductor layer of the terminal is disposed on the surface of the resin layer and is connected to the electrode including the mesh structure via a contact.

Specific Publication No. 2021-518071

Here, in the above-mentioned wiring body, since the conductor layer of the terminal is arranged on the surface of the resin layer, there is a problem that a level difference corresponding to the thickness of the conductor layer occurs, and the flatness of the wiring body is impaired. On the other hand, if a protective layer is provided on the resin layer to cover the periphery of the conductor layer of the terminal, the thickness of the wiring body will increase and the surface of the conductor layer of the terminal will not be connected to the external connection terminal. There is a problem that connectivity deteriorates.

The present disclosure therefore aims to provide a wiring body, a display device, and an antenna that can improve connectivity with external connection terminals while ensuring flatness.

A wiring body according to one aspect of the present disclosure includes an electrode, a terminal connected to the electrode, and a resin layer provided on a substrate, the resin layer having a first trench corresponding to the electrode and a second trench corresponding to the terminal, the electrode having a first conductor layer in the first trench, the terminal having a second conductor layer in the second trench, and the surface of the second conductor layer being disposed at a position farther from the substrate than the surface of the resin layer.

A display device according to one aspect of the present disclosure includes the above wiring body.

An antenna according to one aspect of the present disclosure includes the wiring body described above.

According to one aspect of the present disclosure, it is possible to provide a wiring body, a display device, and an antenna that can improve connectivity with an external connection terminal while ensuring flatness.

FIG. 1 is a plan view showing an embodiment of a conductive film including a wiring body. 2 is a cross-sectional view taken along line II-II in FIG. It is a sectional view showing an electroconductive film concerning a modification. FIG. 1 is a cross-sectional view showing an embodiment of a display device. FIG. 2 is a plan view of an antenna having a wiring body. FIG. 6 is an enlarged cross-sectional view taken along line VI-VI in FIG. 5 . FIG. 11 is an enlarged cross-sectional view of a wiring body according to a modified example.

Several embodiments of the present disclosure are described in detail below. However, the present disclosure is not limited to the following embodiments.

FIG. 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. The conductive film 20 has an antenna 300, and the antenna 300 includes a wiring body 200. The conductive film 20 shown in FIGS. 1 and 2 includes a film-like light-transmitting base material 1 (base material) and a conductive layer 5 provided on one main surface 1S of the light-transmitting base material 1. and a light-transparent resin layer 7B provided on one main surface 1S of the light-transparent base material 1. The conductive layer 5 includes a conductor portion 3 including a portion having a pattern that extends in a direction along the main surface 1S of the light-transmitting substrate 1 and includes a plurality of openings 3a, and fills the inside of the opening 3a of the conductor portion 3. It has an insulating resin part 7A. In FIG. 2, the conductive layer 5 is shown in a deformed state, and the width of the conductor portion 3 is shown in an emphasized state. The thickness of each layer is also shown in a deformed state. Details of the thickness of each layer will be described later. Further, in the example shown in FIG. 1, the conductive layer 5 is formed near one short side of the conductive film 20, but the position where the conductive layer 5 is formed is not particularly limited, and is formed near the long side. A conductive layer 5 may also be formed.

The light-transmitting base material 1 has a level of light-transmitting property required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate 1 may be 90 to 100%. The haze of the light-transmitting substrate 1 may be 0 to 5%.

The light-transmitting substrate 1 may be, for example, a transparent resin film, and examples thereof include polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide. (PI) film is mentioned. Alternatively, the light-transmissive base material 1 may be a glass substrate.

For example, as shown in FIG. 3, the light-transmitting substrate 1 is a laminate including a light-transmitting support film 11, and an intermediate resin layer 12 and a base layer 13 provided in this order on the support film 11. Good too. The support film 11 may be the transparent resin film described above. The base layer 13 is a layer provided to form the conductor portion 3 by electroless plating or the like. When forming the conductor portion 3 by another method, the base layer 13 does not necessarily need to be provided. The intermediate resin layer 12 may not be provided between the support film 11 and the base layer 13.

The thickness of the light-transmitting substrate 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.

By providing the intermediate resin layer 12, the adhesion between the support film 11 and the base layer 13 can be improved. When the base layer 13 is not provided, the intermediate resin layer 12 is provided between the support film 11 and the light-transparent resin layer 7B, thereby improving the adhesion between the support film 11 and the light-transparent resin layer 7B. It can be improved.

The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is an acrylic resin. An example of the inorganic filler is silica.

The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, or 10 μm or less, 5 μm or less, or 2 μm or less.

The base layer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of curable resins contained in the curable resin composition include amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, and ketones. Resin, furan resin, COPNA resin, silicone resin, dichloropentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, as well as unsaturated double bond, cyclic ether, and ultraviolet curing resins containing a functional group that causes a polymerization reaction with ultraviolet light, such as vinyl ether.

The catalyst contained in the base layer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be used alone or in combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.

The content of the catalyst in the base layer 13 may be 3% by mass or more, 4% by mass or more, or 5% by mass or more, and 50% by mass or less, 40% by mass or less, or It may be 25% by mass or less.

The thickness of the base layer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.

The light-transmitting substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. By providing the protective layer, scratches on the support film 11 are suppressed. The protective layer may be a layer similar to the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

The conductor portion 3 constituting the conductive layer 5 includes a portion having a pattern including an opening 3a. The pattern including the openings 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear portions that intersect with each other. The conductor portion 3 having a mesh-like pattern can function well as a radiation conductor and a feed line of the antenna 300, for example. Further, the conductor portion 3 includes a planar pattern without an opening 3a. The conductor portion 3 having a planar pattern functions as a terminal and a ground pad portion, which will be described later. Note that details of the structure of the pattern of the conductor portion 3 in the conductive layer 5 will be described later.

The conductor portion 3 may contain metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, and may also contain copper. The conductor portion 3 may be metal plated by a plating method. The conductor portion 3 may further contain a nonmetallic element such as phosphorus within a range where appropriate conductivity is maintained.

The conductor portion 3 may be a laminate composed of multiple layers. The conductor portion 3 may also have a blackened layer as a surface layer on the side opposite the light-transmitting substrate 1. The blackened layer may contribute to improving the visibility of a display device in which the conductive film is incorporated.

The insulating resin part 7A is made of a resin having light transmittance, and is provided to fill the opening 3a of the conductor part 3. Usually, the insulating resin part 7A and the conductor part 3 form a flat surface. has been done.

The light-transmitting resin layer 7B is formed from a resin having light transmittance. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.

The difference between the refractive index of the light-transmissive base material 1 (or the refractive index of the support film constituting the light-transparent base material 1) and the refractive index of the light-transparent resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflection spectroscopic film thickness meter. From the viewpoint of uniformity of optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.

The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and/or the light-transmitting resin layer 7B includes a curable resin, and examples thereof include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, and epoxy resin. Resin, oxetane resin, polyester, allyl resin, phenolic resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dichloropentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, poly Examples include azomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet curable resins containing functional groups that cause a polymerization reaction with ultraviolet rays, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

The resin forming the insulating resin part 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin part 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the optical path length passing through the conductive film 20 can be further improved. When the resin forming the insulating resin part 7A and the resin forming the light-transmitting resin layer 7B are the same, the insulating resin part 7A and the light-transmitting resin layer 7B can be easily formed together, for example, by forming a pattern from a single curable resin layer using an imprinting method or the like.

The conductive film 20 can be manufactured, for example, by a method including pattern formation using an imprint method. An example of a method for manufacturing the conductive film 20 is to prepare a light-transmitting base material 1 having a support film and a base layer containing an intermediate resin layer and a catalyst provided on one main surface of the support film. In addition, a curable resin layer is formed on the main surface 1S of the light-transmitting substrate 1 on the base layer side, and a trench in which the base layer is exposed is formed by an imprint method using a mold having a convex portion. and forming the conductor portion 3 filling the trench by an electroless plating method in which metal plating is grown from a base layer. By curing the curable resin layer with the mold pushed into the curable resin layer, the insulating resin part 7A and the light-transmitting resin layer 7B having a pattern including openings having an inverted shape of the convex parts of the mold are formed. Formed all at once. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to the imprint method, and any method such as photolithography can be applied.

The conductive film exemplified above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic EL display device. FIG. 4 is a cross-sectional view showing one embodiment of a display device incorporating a conductive film. The display device 100 shown in FIG. 4 includes an image display section 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are laminated in this order from the image display section 10 side on the image display area 10S side of the image display section 10. The configuration of the display device is not limited to the form shown in FIG. 4, and can be modified as necessary. For example, the polarizing plate 30 may be provided between the image display section 10 and the conductive film 20. The image display section 10 may be, for example, a liquid crystal display section. As the polarizing plate 30 and the cover glass 40, those commonly used in display devices can be used. The polarizing plate 30 and the cover glass 40 do not necessarily need to be provided. Light for image display emitted from the image display area 10S of the image display section 10 passes through a path including the conductive film 20 and having a highly uniform optical path length. Thereby, it is possible to display a good image with high uniformity in which moire is suppressed.

Next, with reference to FIG. 5, the configuration of the antenna 300 including the wiring body 200 according to the embodiment of the present disclosure will be described in detail. Antenna 300 is configured to include the above-described conductive layer 5. FIG. 5 is a plan view of antenna 300. FIG. 5 shows a part of the antenna 300 including the wiring body 200 in an enlarged manner. Note that in the following description, the XY coordinates are set on a plane parallel to the main surface 1S. The Y-axis direction is a direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to a direction perpendicular to the side portions of the conductive film 20. The center side of the conductive film 20 is defined as the positive side in the Y-axis direction, and the outer peripheral side of the conductive film 20 is defined as the negative side in the Y-axis direction. The X-axis direction is a direction perpendicular to the Y-axis direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to the direction in which the side portion 20a of the conductive film 20 extends. One side on which the side portion 20a of the conductive film 20 extends is defined as the positive side in the X-axis direction, and the other side is defined as the negative side in the X-axis direction.

The conductive layer 5 of the antenna 300 has an electrode 21, power supply lines 25A and 25B, terminals 22A and 22B, and ground pad portions 24A, 24B, and 24C (terminals). The antenna 300 has a configuration that is axisymmetric with respect to a center line CL that is parallel to the Y-axis direction.

The electrode 21 is a region that radiates a signal as an antenna 300. The electrode 21 has a circular shape. The center of the electrode 21 is placed on the center line CL. The electrode 21 is arranged at a position spaced apart from the side 20a of the conductive film 20 toward the positive side in the Y-axis direction. The electrode 21 has a diameter R.

The power supply lines 25A and 25B are lines that supply power to the electrode 21. In other words, the antenna 300 functions as a dual-polarized antenna. For example, a diagonally polarized signal in the direction in which the inclined portion 25b of the power supply line 25A extends can be supplied via the power supply line 25A, and a diagonally polarized signal in the direction in which the inclined portion 25b of the power supply line 25B extends can be supplied via the power supply line 25B. The power supply lines 25A and 25B have a vertical portion 25a that extends perpendicular to the side portion 20a of the conductive film 20, and a vertical portion 25b that is inclined with respect to the Y-axis direction. The vertical portion 25a of the power supply line 25A extends from the terminal 22A formed on the side portion 20a side of the conductive film 20 to the positive side in the Y-axis direction. The vertical portion 25a of the power supply line 25A extends parallel to the center line CL (i.e., the Y-axis direction) at a position spaced from the center line CL to the negative side in the X-axis direction.

The inclined portion 25b of the power supply line 25A is arranged so that it approaches the center line CL side (i.e., the positive side in the X-axis direction) as it goes from the positive end in the Y-axis direction of the vertical portion 25a toward the positive side in the Y-axis direction. tilt. The positive end of the inclined portion 25b in the Y-axis direction is connected to the outer peripheral edge 21a of the electrode 21. The feed line 25A has a constant width W1 in the vertical portion 25a and the inclined portion 25b. Further, the feed line 25A has a line length L1 that is the total length of the vertical portion 25a and the inclined portion 25b. Here, the width dimension W1 is a dimension in the in-plane direction of the planar antenna 300 in a direction perpendicular to the extending direction of the vertical portion 25a and the inclined portion 25b, and the line length L1 is the dimension in the in-plane direction of the planar antenna 300. This is the dimension along the extending direction of the vertical portion 25a and the inclined portion 25b in the inward direction.

In the example shown in FIG. 5, the vertical portion 25a of the power supply line 25A is disposed at a position farther away from the negative end of the electrode 21 in the X-axis direction in the negative direction. The positive end of the vertical portion 25a of the power supply line 25A in the Y-axis direction (i.e., the connection portion with the inclined portion 25b) is disposed at a position farther away from the negative end of the electrode 21 in the Y-axis direction in the negative direction in the negative direction. However, the arrangement and shape of the vertical portion 25a and the inclined portion 25b are not particularly limited. The power supply line 25B has a structure that is line-symmetrical with respect to the power supply line 25A and the center line CL. In this embodiment, the inclined portion 25b of the power supply line 25A and the inclined portion 25b of the power supply line 25B are connected to the outer periphery 21a of the electrode 21 so that the virtual line extending the inclined portion 25b of the power supply line 25A and the virtual line extending the inclined portion 25b of the power supply line 25B are perpendicular to each other. In other words, the angle between the imaginary line extending the inclined portion 25b of the power supply line 25A and the imaginary line extending the inclined portion 25b of the power supply line 25B is 90 degrees.

Terminals 22A and 22B are terminals connected to power supply lines 25A and 25B, respectively. Terminals 22A and 22B are connected to external input/output terminals to supply power to electrode 21 via power supply lines 25A and 25B. Terminals 22A and 22B are arranged near side portion 20a of conductive film 20. Terminals 22A and 22B extend from the negative end of vertical portion 25a of power supply lines 25A and 25B in the Y-axis direction to side portion 20a toward the negative side in the Y-axis direction. Terminals 22A and 22B extend in the Y-axis direction with a constant width dimension W2. Terminals 22A and 22B extend in the Y-axis direction with a length dimension L2. Here, the width dimension W2 is the dimension perpendicular to the extension direction of the terminals 22A and 22B in the in-plane direction of the planar antenna 300, and the length dimension L2 is the dimension along the extension direction of the terminals 22A and 22B in the in-plane direction of the planar antenna 300.

The ground pad portions 24A, 24B, and 24C are areas that are electrically grounded. The ground pad portions 24A, 24B, and 24C are connected to a ground terminal (not shown). The ground pad portions 24A, 24B, and 24C are insulated from the terminals 22A and 22B by being arranged with a gap GP between them. The ground pad portion 24A is formed to extend in the X-axis direction along the side portion 20a in the region between the terminals 22A and 22B. The ground pad portion 24B is formed to extend in the X-axis direction along the side portion 20a in the negative side region of the terminal 22A in the X-axis direction. The ground pad portion 24C is formed to extend in the X-axis direction along the side portion 20a in a region on the positive side of the terminal 22B in the X-axis direction. The ground pad portions 24A, 24B, and 24C extend in a band shape in the X-axis direction with a constant width dimension in the Y-axis direction. The width dimension of the ground pad portions 24A, 24B, 24C is the same as the length dimension L2 of the terminals 22A, 22B.

As described above, terminal 22A, which is a signal line, has a structure surrounded by ground pad portions 24A and 24B on both sides in the X-axis direction. Terminal 22B, which is a signal line, has a structure surrounded by ground pad portions 24A and 24C on both sides in the X-axis direction. In this way, terminals 22A and 22B are coplanar lines.

As shown in FIG. 5, the antenna 300 has a mesh-like conductor pattern 50 as the conductor portion 3. As shown in FIG. Among the components of the antenna 300, the electrode 21 and the feed lines 25A and 25B have the mesh-like conductor pattern 50. The mesh-like conductor pattern 50 includes a first conductive line 51 and a plurality of second conductive lines 52. The first conductive wire 51 is a linear conductor portion 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged so as to be spaced apart from each other in the X-axis direction. The plurality of first conductive wires 51 are arranged at equal pitches and spaced apart from each other. The second conductive wire 52 is a linear conductor portion 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged so as to be spaced apart from each other in the Y-axis direction. The plurality of second conductive wires 52 are arranged at equal pitches and spaced apart from each other. The thickness of the conductive lines 51 and 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. Furthermore, the pitch between the conductive lines 51 and 52 is not particularly limited, but may be set to, for example, 100 to 300 μm. Note that the first conductive wire 51 does not need to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not need to be parallel to the Y-axis direction as long as it extends in the X-axis direction. It does not have to be parallel to the direction.

In this embodiment, the electrode 21 and the power supply lines 25A and 25B have end conductive lines that form the outer periphery. The shape of the electrode 21 formed by these end conductive lines is circular. Note that the circular electrode 21 is not limited to a strict perfect circle shape, and includes variations caused by manufacturing errors and the like. The end conductive lines that form the outer periphery of the electrode 21 may not only be composed of curves, but may also include straight lines, wavy lines, and the like. Furthermore, the electrode 21 and the power supply lines 25A and 25B may not include end conductive lines. In this case, it is sufficient that the shape of the first conductive line 51 or the second conductive line 52 included in the mesh-shaped conductor pattern 50 connected at the tips is circular.

The terminal 22 has a second conductor layer 56 that spreads in a planar manner over substantially the entire area of the terminal 22. When referring to the "terminal 22", the terminal 22A and the terminal 22B are not distinguished from each other and both are referred to. In FIG. 5, the second conductor layer 56 is formed over the entire area of the terminal 22, but the area of the second conductor layer 56 is not particularly limited. For example, the area of the second conductor layer 56 may be 95% or more of the area of the entire terminal 22. The conductor pattern 50 may be present in the areas of the terminal 22 other than the second conductor layer 56. The ground pad portions 24A, 24B, and 24C also have the second conductor layer 56. However, the ground pad portions 24A, 24B, and 24C may have a mesh-shaped conductor pattern 50.

Next, the cross-sectional structure of the wiring body 200 will be described with reference to FIG. 6. FIG. 6 is an enlarged cross-sectional view taken along line VI-VI shown in FIG. 5. As shown in FIG. 6, the wiring body 200 further includes the aforementioned light-transmitting substrate 1 on which the electrodes 21 and terminals 22 are provided, and the aforementioned insulating resin portion 7A (resin layer) provided on the light-transmitting substrate 1.

The insulating resin part 7A has a first trench 60 corresponding to the electrode 21 and a second trench 64 corresponding to the terminal 22. The insulating resin part 7A has a mesh-shaped first trench 60. The first trench 60 is configured by a pattern of grooves 61 between the insulating resin part 7A and an adjacent insulating resin part 7A. The grooves 61 are formed in a pattern corresponding to the mesh structure of the conductor pattern 50 of the electrode 21. Therefore, the mesh pattern of the first trench 60 and the conductor pattern 50 of the electrode 21 match. The bottom of the grooves 61 reaches the surface of the underlayer 67 described below.

The second trench 64 is formed by a groove portion 65 having a shape and size corresponding to the terminal 22. The dimension of the second trench 64 in the planar direction (the direction in which the XY plane extends) is larger than the width W1 of the mesh-shaped first trench 60. The dimension W2 of the second trench 64 in the Y-axis direction is larger than the width W1 of the first trench 60. The dimension (not shown) of the second trench 64 in the X-axis direction is larger than the width W1 of the first trench 60. The dimension W2 of the second trench 64 in the Y-axis direction may be approximately equal to the length of the short side 56a (see FIG. 5) of the rectangular second conductor layer 56. The dimension of the second trench 64 in the X-axis direction may be approximately equal to the length of the long side 56b (see FIG. 5) of the rectangular second conductor layer 56. The width W1 of the first trench 60 may be approximately equal to the length of the second conductive line 52 in the direction perpendicular to the extension direction (X-axis direction). The bottom 65a of the groove 65 is positioned above and spaced apart from the back surface 7a of the insulating resin part 7A.

The electrode 21 has a first conductor layer 55 in the first trench 60. The terminal 22 has a second conductor layer 56 in the second trench 64. The first conductor layer 55 of the electrode 21 is composed of the conductive lines 51 and 52 of the mesh-shaped conductor pattern 50. The second conductive line 52 is formed by filling a conductive material into the groove portion 61 of the first trench 60 that extends in the X-axis direction. The first conductive line 51 is also formed by filling a conductive material into the groove portion 61 (not shown) of the trench 60 that extends in the Y-axis direction. The surface 55a of the first conductor layer 55 is located at approximately the same height as the surface 7b of the insulating resin portion 7A.

The second conductor layer 56 is formed by filling the groove portion 65 of the second trench 64 with a conductive material. The material of the second conductor layer 56 is not particularly limited, and the same material as the conductor pattern 50 may be used, or a different material may be used. The surface 56c of the second conductor layer 56 is located farther from the light-transmitting base material 1 than the surface 7b of the insulating resin portion 7A. The amount of protrusion H2 of the second conductor layer 56 from the surface 7b of the insulating resin portion 7A is smaller than the thickness H1 of the second conductor layer 56 within the second trench 64. Although the thickness H1 is not particularly limited, the protrusion amount H2 may be set such that the ratio of the protrusion amount H2 to the thickness H1 (H2/H1) is 0.05 to 0.35. Note that the surface 56c of the second conductor layer 56 may include a portion located closer to the light-transmitting base material 1 than the surface 7b of the insulating resin portion 7A.

The wiring body 200 has a resin film 66 made of the resin of the insulating resin part 7A between the light-transmitting substrate 1 and the second conductor layer 56. The resin film 66 is formed between the bottom 65a of the groove part 65 of the second trench 64 and the surface of the underlayer 67 described below.

The wiring body 200 has a base layer 67 between the back surface 7a of the insulating resin portion 7A and the main surface 1S of the light-transmitting base material 1. The base layer 67 is formed at a position corresponding to both the electrode 21 and the terminal 22. The wiring body 200 has a base layer 68 between the second conductor layer 56 and the resin film 66. The base layer 68 is arranged on the bottom 65a of the groove 65. Although the materials of the base layers 67 and 68 are not particularly limited, for example, the same material as the base layer 13 may be used.

Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

According to the wiring body 200 of this embodiment, the electrode 21 has the first conductor layer 55 in the first trench 60, and the terminal 22 has the second conductor layer 56 in the second trench 64. have Among these, the terminal 22 is connected to an external connection terminal and electrically connects the connection terminal and the electrode 21. Since the second conductor layer 56 of the terminal 22 is formed within the second trench 64, the flatness of the wiring body 200 is ensured compared to the case where the second conductor layer 56 is formed on the surface 7b of the insulating resin portion 7A. can. Further, the surface 56c of the second conductor layer 56 is located farther from the light-transmitting base material 1 than the surface 7b of the insulating resin portion 7A. Therefore, compared to the case where the surface 56c of the second conductor layer 56 is arranged at the same height as the surface 7b of the insulating resin part 7A, the external connection terminal can be connected to the surface of the second conductor layer 56 more easily. 56c. As described above, connectivity with external connection terminals can be improved while ensuring flatness.

The protrusion amount H2 of the second conductor layer 56 from the surface 7b of the insulating resin portion 7A may be smaller than the thickness H1 of the second conductor layer 56 within the second trench 64. In this case, the second conductor layer 56 can be prevented from protruding more than necessary from the surface 7b of the insulating resin portion 7A, and the flatness of the wiring body 200 can be ensured.

The wiring body 200 may have a resin film 66 made of the resin of the insulating resin part 7A between the light-transmitting substrate 1 and the second conductor layer 56. In this case, by ensuring the insulation of the bottom side of the second conductor layer 56 in the terminal 22, it is possible to suppress loss due to current flowing to the base layer side.

The electrode may have a mesh-like conductor pattern. In this case, the electrode can achieve high transparency while ensuring conductivity.

The planar dimension of the second trench may be greater than the width of the mesh-shaped first trench. In this case, by increasing the planar size of the second conductor layer, connectivity with an external connection terminal can be ensured.

A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.

According to the above-mentioned display device 100, the same operation and effect as the above-mentioned wiring body 200 can be obtained.

An antenna 300 according to one aspect of the present disclosure includes the wiring body 200 described above.

According to the antenna 300 described above, the same actions and effects as the wiring body 200 described above can be obtained.

The present disclosure is not limited to the embodiments described above.

For example, a wiring body 200 shown in FIG. 7 may be adopted. The wiring body 200 shown in FIG. 7 has a base layer 67 containing a plurality of fine particles 69 between the resin film 66 and the light-transmitting base material 1. In this embodiment, the base layer 67 functions as a particle-containing layer containing fine particles 69. In this case, the adhesion between the resin film 66 and the light-transmissive base material 1 can be improved.

A plurality of fine particles 69 are disposed between the second conductor layer 56 and the resin film 66. The fine particles 69 are contained in the underlayer 68. In this case, the adhesion between the second conductor layer 56 and the resin film 66 can be improved. Note that the material of the fine particles 69 contained in the underlayers 67 and 68 may be, for example, the same material as the catalyst contained in the underlayer 13 described above. Furthermore, the diameter of the fine particles 69 may be 2 nm or more and 50 nm or less.

The surface roughness of the second conductor layer may be set to a predetermined value. For example, the maximum height of the surface roughness of the surface 56c of the second conductor layer 56 may be 1 μm or less, and the arithmetic mean height may be 0.5 μm or less. In this case, the connectivity of the second conductor layer with the external connection terminal can be ensured. The arithmetic mean height is, for example, one of the surface roughness parameters specified in ISO 25178, and is the arithmetic mean height Sa expressed as the average value of the absolute values of the peak height and valley depth on the measured surface. The maximum height is, for example, one of the surface roughness parameters specified in ISO 25178, and is the maximum height Sz expressed as the distance from the highest point to the lowest point on the measured surface. The arithmetic mean height Sa and the maximum height Sz can be measured in a non-contact manner, for example, using a VK-250X (Keyence Corporation).

The second conductor layer 56 may have a deposited portion 56d protruding from the edge 64a of the second trench 64 to a portion of the surface 7b of the insulating resin portion 7A. In this case, peeling of the second conductor layer 56 can be suppressed.

For example, the configuration shown in FIG. 5 is merely one example of the configuration of the conductive layer 5, and the shapes of the electrode 21, terminal 22, and ground portion 23 may be changed as appropriate.

FIG. 1 is only an example of the overall structure of the conductive film, and the conductive layer may be formed in any range and shape in the conductive film.

Although a display device is illustrated as an example of a device to which the conductive film is applied, the conductive film may be applied to other devices. For example, the conductive film may be applied to the glass of buildings, automobiles, etc.

In the embodiments described above, terminal 22 had second conductor layer 56 within second trench 64 . In addition, the same configuration as the second trench 64 and the second conductor layer 56 may be adopted for the ground pad portions 24A, 24B, and 24C connected to an external ground terminal. That is, the second conductor layer 56 may be formed in the second trench 64 and spread in a planar manner for the ground pad portions 24A, 24B, and 24C. Thereby, the same functions and effects as those in the above-described embodiment can be obtained for the ground pad portions 24A, 24B, and 24C. The wiring body may have only the second conductor layer 56 for the terminal 22, may have only the second conductor layer 56 for the ground pad portions 24A, 24B, 24C, or may have only the second conductor layer 56 for the terminal 22. It may have both layer 56 and conductor layer 56 for ground pad portions 24A, 24B, 24C. The ground pad portions 24A, 24B, and 24C may also correspond to "terminals" in the claims.

In the above embodiment, a wiring body used as an antenna is illustrated, but the use of the wiring body structure is not limited, and it may be applied to, for example, a touch sensor.

The technology disclosed herein includes, but is not limited to, the following configuration examples:

A wiring body according to one aspect of the present disclosure includes an electrode, a terminal, and a resin layer provided on a substrate, the resin layer having a first trench corresponding to the electrode and a second trench corresponding to the terminal, the electrode having a first conductor layer in the first trench, the terminal having a second conductor layer in the second trench, and the surface of the second conductor layer being disposed at a position farther from the substrate than the surface of the resin layer.

According to the above-mentioned wiring body, the electrode has a first conductor layer in the first trench, and the terminal has a second conductor layer in the second trench. Of these, the terminal is connected to an external connection terminal and electrically connects the connection terminal and the electrode. Since the second conductor layer of the terminal is formed in the second trench, the flatness of the wiring body can be ensured compared to when it is formed on the surface of the resin layer. In addition, the surface of the second conductor layer is located farther than the surface of the resin layer. Therefore, the external connection terminal is well connected to the surface of the second conductor layer compared to when the surface of the second conductor layer is located at the same height as the surface of the resin layer. As a result, it is possible to improve the connectivity with the external connection terminal while ensuring flatness.

The amount of protrusion of the second conductor layer from the surface of the resin layer may be smaller than the thickness of the second conductor layer within the second trench. In this case, the second conductor layer can be prevented from protruding more than necessary from the surface of the resin layer, and the flatness of the wiring body can be ensured.

The wiring body may have a resin film made of the resin of the resin layer between the substrate and the second conductor layer. In this case, by ensuring the insulation of the bottom side of the second conductor layer in the terminal, loss due to current flowing to the base layer side can be suppressed.

The wiring body may have a particle-containing layer containing a plurality of fine particles between the resin film and the substrate. In this case, the adhesion between the resin film and the substrate can be improved.

A plurality of fine particles may be disposed between the second conductor layer and the resin film. In this case, the adhesion between the second conductor layer and the resin film can be improved.

The maximum height of the surface roughness of the second conductor layer may be 1 μm or less, and the arithmetic mean height may be 0.5 μm or less. In this case, the connectivity of the second conductor layer with the external connection terminal can be ensured.

The second conductor layer may have a deposited portion protruding from the edge of the second trench to a portion of the surface of the resin layer. In this case, connectivity of the second conductor layer with external connection terminals can be ensured.

The electrode may have a mesh-like conductor pattern. In this case, the amount of conductor in the electrode can be reduced.

The planar dimension of the second trench may be greater than the width of the mesh-shaped first trench. In this case, by increasing the planar size of the second conductor layer, connectivity with an external connection terminal can be ensured.

A display device according to one aspect of the present disclosure includes the above wiring body.

According to the above-mentioned display device, the same operation and effect as the above-mentioned wiring body can be obtained.

[Form 1]
An electrode;
The terminals and
A resin layer provided on the substrate,
the resin layer has a first trench corresponding to the electrode and a second trench corresponding to the terminal;
the electrode has a first conductor layer in the first trench;
the terminal has a second conductor layer in the second trench;
A wiring body, wherein a surface of the second conductor layer is disposed at a position farther from the base material than a surface of the resin layer.
[Form 2]
2. The wiring body according to claim 1, wherein the amount of protrusion of the second conductor layer from the surface of the resin layer is smaller than a thickness of the second conductor layer within the second trench.
[Form 3]
3. The wiring body according to embodiment 1 or 2, further comprising a resin film formed of the resin of the resin layer between the base material and the second conductor layer.
[Form 4]
4. The wiring body according to embodiment 3, further comprising a particle-containing layer containing a plurality of fine particles between the resin film and the base material.
[Form 5]
5. The wiring body according to embodiment 3 or 4, wherein a plurality of fine particles are disposed between the second conductor layer and the resin film.
[Form 6]
6. The wiring body according to any one of embodiments 1 to 5, wherein the second conductor layer has a surface roughness whose maximum height is 1 μm or less and whose arithmetic mean height is 0.5 μm or less.
[Form 7]
The wiring body according to any one of the first to sixth aspects, wherein the second conductor layer has a deposit portion extending from an edge of the second trench onto a portion of the surface of the resin layer.
[Form 8]
The wiring body according to any one of the first to seventh embodiments, wherein the electrode has a mesh-shaped conductor pattern.
[Mode 9]
The wiring body according to any one of the first to eighth embodiments, wherein the dimension of the second trench in a planar direction is greater than the width of the mesh-shaped first trench.
[Form 10]
A display device comprising the wiring body according to any one of aspects 1 to 9.
[Form 11]
An antenna comprising the wiring body according to any one of aspects 1 to 9.

DESCRIPTION OF SYMBOLS 1... Light-transmissive base material (base material), 1S... Main surface of base material, 7A... Insulating resin part (resin layer), 21... Electrode, 22... Terminal, 50... Conductor pattern, 55... First conductor layer , 56... Second conductor layer, 60... First trench, 64... Second trench, 67... Base layer (particle-containing layer), 68... Base layer, 69... Fine particles, 100... Display device, 200... Wiring Body, 300...Antenna.

Claims (11)

electrode and
terminal and
A resin layer provided on a base material,
The resin layer has a first trench corresponding to the electrode and a second trench corresponding to the terminal,
the electrode has a first conductor layer within the first trench;
The terminal has a second conductor layer within the second trench,
In the wiring body, the surface of the second conductor layer is arranged at a position farther from the base material than the surface of the resin layer. The wiring body according to claim 1, wherein the amount of protrusion of the second conductor layer from the surface of the resin layer is smaller than the thickness of the second conductor layer in the second trench. The wiring body according to claim 1, having a resin film made of the resin of the resin layer between the substrate and the second conductor layer. The wiring body according to claim 3, which has a particle-containing layer containing a plurality of fine particles between the resin film and the substrate. The wiring body according to claim 3, wherein a plurality of fine particles are disposed between the second conductor layer and the resin film. The wiring body according to claim 1, wherein the maximum height of the surface roughness of the surface of the second conductor layer is 1 μm or less, and the arithmetic mean height is 0.5 μm or less. The wiring body according to claim 1, wherein the second conductor layer has a deposit portion that protrudes from the edge of the second trench onto a portion of the surface of the resin layer. The wiring body according to claim 1, wherein the electrode has a mesh-like conductor pattern. The wiring body according to claim 1, wherein the dimension of the second trench in the planar direction is greater than the width of the mesh-shaped first trench. A display device comprising the wiring body according to any one of claims 1 to 9. An antenna comprising the wiring body according to any one of claims 1 to 9.

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