TW202209065A - Touch panel, manufacturing method of touch panel, and touch display device - Google Patents

Abstract

A touch panel includes a substrate, a periphery trace, and a touch sensing electrode. The substrate has a visible area and a periphery area. The periphery trace is disposed on the periphery area of the substrate. The touch sensing electrode is disposed on the visible area of the substrate and electrically connected to the periphery trace, and has a mesh-like pattern interlaced by a plurality of thin lines. The periphery trace and the touch sensing electrode each includes a plurality of conductive nanostructures and a film layer added onto the conductive nanostructures, and an interface between the conductive nanostructures and the film layer substantially has a covering structure.

Description

Touch panel, manufacturing method of touch panel and device thereof

The present disclosure relates to a touch panel, a manufacturing method of the touch panel, and a device including the above touch panel.

In recent years, transparent conductors are often used in many display or touch related devices because they can simultaneously transmit light and provide proper conductivity. In general, transparent conductors can be films made of various metal oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), or aluminum doped zinc oxide (AZO) films. However, these metal oxide films cannot meet the flexibility requirements of display devices. Therefore, a variety of flexible transparent conductors have been developed, such as transparent conductors made of nanoscale materials.

However, there are still many problems to be solved in the process technology of the above-mentioned nano-scale materials. For example, when using nanowires to fabricate the touch electrodes, the touch electrodes and the wires made of metal in the peripheral area must be overlapped, and the overlapping area will cause the size of the peripheral area to be unable to be reduced, which will lead to the loss of the peripheral area. The width is large and cannot meet the narrow border requirements of the display. For another example, the touch electrodes made of nanowires often have a large resistive capacitive loading (RC loading) in consideration of optical effects and the like, which is not conducive to general application.

According to some embodiments of the present disclosure, a touch panel includes a substrate, peripheral leads, and first touch sensing electrodes. The substrate has a display area and a peripheral area. The peripheral leads are arranged in the peripheral area of the substrate. The first touch sensing electrodes are arranged in the display area of the substrate and are electrically connected to the peripheral leads, and have a grid-like pattern formed by a plurality of first thin lines. The peripheral leads and the first touch sensing electrodes each include a plurality of conductive nanostructures and a film layer applied to the conductive nanostructures, and the interface between the conductive nanostructures and the film layer substantially has a cladding structure.

In some embodiments, the cladding structure includes a plating layer, and the plating layer completely covers the interface between the conductive nanostructure and the film layer.

In some embodiments, a film layer is filled between adjacent conductive nanostructures, and the film layer does not have a separate cladding structure.

In some embodiments, the conductive nanostructures may include metal nanowires, and the coating structure completely covers the interface between the metal nanowire and the film layer, and forms a uniform coating on the interface between the metal nanowire and the film layer layer.

In some embodiments, the cladding structure is a layered structure, an island-like protrusion structure, a point-like protrusion structure, or a combination thereof made of conductive materials.

In some embodiments, the conductive material includes alloys of silver, gold, copper, nickel, platinum, iridium, rhodium, palladium, osmium, or combinations thereof.

In some embodiments, the cladding structure is a single-layer structure made of a single metal material or alloy material, or a two-layer or multi-layer structure made of two or more metal materials or alloys.

In some embodiments, the cladding structure is an electroless copper layer, an electroless copper layer, an electroless copper nickel layer, an electroless copper silver layer, or a combination thereof.

In some embodiments, the conductive nanostructure, the film layer, and the capping structure are located in the first thin line.

In some embodiments, the line width of the first thin lines is between 1 μm and 10 μm, and the line spacing of the adjacent first thin lines is between 1 μm and 10 μm.

In some embodiments, the substrate has an opposite first surface and a second surface, the first touch sensing electrodes are disposed on the first surface of the substrate, and the touch panel further includes second touch sensing electrodes disposed on the first surface of the substrate. Two surfaces and a display area, wherein the second touch sensing electrode has a grid-like pattern formed by a plurality of second thin lines interlaced.

In some embodiments, the second touch sensing electrode includes a conductive nanostructure and a film layer applied to the conductive nanostructure, and an interface between the conductive nanostructure and the film layer substantially has a cladding structure.

In some embodiments, the grid-like pattern of interlacing the first thin lines does not completely overlap the grid-like pattern interlacing the second thin lines.

According to other embodiments of the present disclosure, a method for fabricating a touch panel includes: providing a substrate having a display area and a peripheral area; disposing a plurality of conductive nanostructures in the display area and the peripheral area to form a conductive layer; adding a film layer on the conductive layer layer, and make the film layer reach a pre-cured or incompletely cured state; perform a patterning step; and perform a modification step, so that the cladding structure is formed on the surface of the conductive nanostructures located in the display area and the peripheral area, so that the conductive nanostructures are formed. The interface between the rice structure and the film layer essentially has a cladding structure. The patterning step includes: patterning the conductive layer and the film layer in the display area to form a touch sensing electrode with a grid pattern composed of a plurality of thin lines; and patterning the conductive layer and the film layer in the peripheral area , to form perimeter leads.

In some embodiments, the patterning step is performed before or after the modifying step.

In some embodiments, the patterning of the conductive layer and the film layer in the display area and the peripheral area is performed in the same process.

In some embodiments, the modifying step includes: immersing the film layer and the conductive nanostructures in an electroless plating solution, and the electroless plating solution penetrates into the film layer and contacts the conductive nanostructures, so that metal is precipitated on the surface of the conductive nanostructures.

In some embodiments, the cladding structure is formed along the surface of the conductive nanostructure and is located at the interface between the conductive nanostructure and the film layer.

In some embodiments, applying a film layer on the conductive layer includes: coating a polymer on the conductive layer; and controlling curing conditions so that the polymer reaches a pre-cured or incompletely cured state.

In some embodiments, applying a film layer on the conductive layer includes: coating a polymer on the conductive layer; and controlling curing conditions so that the polymer reaches a pre-cured or incompletely cured state, wherein the pre-cured or incompletely cured state of The film layer has a first layer region and a second layer region, and the curing state of the second layer region is higher than that of the first layer region.

In some embodiments, in the first layer region, the capping structure is formed along the surface of the conductive nanostructure and is located at the interface of the conductive nanostructure and the film layer.

In some embodiments, controlling the curing conditions may include introducing a gas and controlling the respective concentrations of the gas in the first layer region and the second layer region.

In some embodiments, the modifying step includes an electroless plating step, an electroplating step, or a combination thereof.

According to other embodiments of the present disclosure, the device includes the aforementioned touch panel.

In some embodiments, the device may include a display, a portable phone, a tablet computer, a wearable device, a vehicle device, a notebook computer, or a polarizer.

According to the above-mentioned embodiments of the present disclosure, in the touch panel of the present disclosure, since the peripheral leads located in the peripheral area and the touch sensing electrodes located in the display area are both formed by the modified metal nanowires, it can effectively The surface resistance of the touch panel is reduced to improve the conductivity of the touch panel, and can effectively reduce the resistive capacitive loading (RC loading) of the touch panel. On the other hand, since the touch sensing electrodes in the display area have a grid-like pattern formed by a plurality of fine lines interlaced, the modified metal nanowires can prevent the light transmittance of the display area from being affected by the modified metal nanowires, thereby making the touch The display area of the panel has good optical properties. In addition, since the peripheral leads and the touch sensing electrodes of the touch panel of the present disclosure are all made of the modified metal nanowires, the modification can be performed on the entire surface of the touch panel during the manufacturing process of the touch panel. step, so as to omit the use of the mask, thereby avoiding the alignment error caused by the use of the mask. In other words, since the peripheral leads and the touch sensing electrodes of the present disclosure do not need to be aligned during the modification step, there is no need to reserve an alignment error space. In this way, the width of the peripheral area of the touch panel can be reduced, thereby meeting the requirement of a narrow frame of the display.

Several embodiments of the present disclosure will be disclosed in the following drawings, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is to say, in some embodiments of the present disclosure, these practical details are unnecessary, and therefore should not be used to limit the present disclosure. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. In addition, for the convenience of the reader, the size of each element in the drawings is not drawn according to the actual scale.

Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

In addition, with regard to "about", "approximately" or "approximately" as used herein, the error or range of the index value is generally within twenty percent, preferably within ten percent, more preferably is within five percent. Unless explicitly stated in the text, the numerical values mentioned are considered to be approximations, that is, with errors or ranges such as "about", "approximately" or "approximately".

It should be understood that the term "conductive nanostructures" as used herein generally refers to a layer or film composed of nanostructures, the sheet resistance of which can be less than about 500 ohms/square, and preferably can be Less than about 200 ohms/square, and more preferably less than about 100 ohms/square; and the above-mentioned "nanostructure" generally refers to a structure with nanometer dimensions, such as at least one dimension (such as wire diameter, length, width or thickness) are nanoscale linear structures, columnar structures, sheet-like structures, grid-like structures, tubular structures, or combinations thereof.

The present disclosure provides a method for modifying conductive nanostructures (eg, metal nanowires), and a touch panel and a device fabricated by using the modified conductive nanostructures. For the sake of clarity and convenience of description, in this paper, the modification method of the conductive nanostructure will be described first, and a metal nanowire will be used as an example.

1A to 1C are schematic cross-sectional views of different steps of a method for modifying metal nanowires according to some embodiments of the present disclosure. Please refer to FIG. 1A first. First, a substrate 110 is provided, and metal nanowires 122 are coated on the surface of the substrate 110 to form a metal nanowire layer 120 . The metal nanowire layer 120 can be, for example, but not limited to, a nanosilver wire layer, a nanogold wire layer, or a nanocopper wire layer. In some embodiments, the dispersion or slurry containing the metal nanowires 122 may be coated on the substrate 110 and then cured/dried, so that the metal nanowires 122 are attached to the surface of the substrate 110, and then formed into a The metal nanowire layer 120 is disposed on the substrate 110 . After the above-mentioned curing/drying step, substances such as the solvent in the dispersion or slurry will volatilize, and the metal nanowires 122 may be randomly distributed on the surface of the substrate 110; or preferably, the metal nanowires 122 may be solidified The metal nanowire layer 120 is formed on the surface of the substrate 110 without falling off, and the metal nanowires 122 in the metal nanowire layer 120 can be in contact with each other to provide a continuous current path, thereby forming a conductive network (conductive network), that is, the metal nanowires 122 are in contact with each other at intersecting (overlapping) positions to form a path for transferring electrons. Taking silver nanowires as an example, one silver nanowire and another silver nanowire will form a direct contact state at the intersection position, so a low-resistance path for transferring electrons can be formed. In some embodiments, a region or a structure is considered electrically insulating when the sheet resistance is greater than about 10 ⁸ ohms/square, preferably greater than about 10 ⁴ ohms/square, about 3000 ohms/square, About 1000 ohms/square, about 350 ohms/square, or about 100 ohms/square. In some embodiments, the sheet resistance of the silver nanowire layer formed from the silver nanowire is less than about 100 ohms/square.

Please refer to FIG. 1B . Next, a film layer 130 is disposed to cover the metal nanowires 122 , and the curing degree of the film layer 130 is controlled. In some embodiments, a suitable polymer can be coated on the metal nanowires 122, so that the polymer with a flow state/property can penetrate into the metal nanowires 122 to form fillers, thereby making the metal nanowires 122. The rice noodles 122 are embedded in the film layer 130 to form the composite structure 220 . On the other hand, the conditions of polymer coating or curing (eg, controlling temperature and/or photocuring parameters) can be controlled to render the polymer in a pre-cured or incompletely cured state, or to further enable the film layer 130 to have different degrees of curing. For example, the curing degree of the film layer 130 in the lower region (ie, the region close to the substrate 110 ) can be adjusted to be greater than the curing degree of the film layer 130 in the upper region (ie, the region far from the substrate 110 ), while the upper region exhibits the aforementioned preset Cured or incompletely cured state. In other words, in this step, the polymer coating layer 130 is applied on the metal nanowires 122, and the metal nanowires 122 are embedded in the precured or incompletely cured film layer 130 to form Composite structure 220 .

In some embodiments, the membrane layer 130 may include, for example, an insulating material. For example, the insulating material may be a non-conductive resin or other organic material, such as, but not limited to, polyacrylate, epoxy, polyurethane, polysilane, polysiloxane, poly(silicon-acrylic) , polyethylene, polypropylene, polyvinyl butyral, polycarbonate, acrylonitrile-butadiene-styrene copolymer, poly(3,4-ethylenedioxythiophene), poly(styrenesulfonic acid) ) or ceramic materials. In some embodiments, the film layer 130 may be formed by spin coating, spray coating, printing, or a combination thereof. In some embodiments, the thickness of the film layer 130 may be between about 20 nanometers to about 10 micrometers, between about 50 nanometers and about 200 nanometers, or between about 30 nanometers and about 100 nanometers, such as a film layer The thickness of 130 may be, for example, about 90 nanometers or about 100 nanometers. It should be understood that, in order to express the content of the present disclosure concisely and clearly, FIG. 1B simply draws the metal nanowire layer 120 and the film layer 130 as an integral structural layer, but the present disclosure is not limited to this. The wire layer 120 and the film layer 130 may also form other types of structural layers (eg, a structure stacked on top of each other).

In some embodiments, the method of controlling the curing degree of the polymer may be performed by using curing conditions of different energies, so that the film layer 130 can reach a pre-cured or incompletely cured state. The curing degree of the film layer can be judged by the bonding change of the film layer during curing, that is to say, the curing degree of the film layer can be defined as the ratio of the bonding strength of the film layer to the bonding strength of the fully cured film layer ( In this embodiment, it is expressed as a percentage). For example, for a film layer material of a commercial product, it was originally required to use a light energy of about 500 mJ in a low oxygen environment for about 4 minutes to achieve complete curing, but this embodiment uses a light energy of about 500 mJ in a low oxygen environment. After being irradiated for about 2 minutes, the bond strength measured by infrared spectroscopy is about 95% of the bond strength of the fully cured film layer, representing the degree of curing at which the film layer reaches about 95% of the total curing amount. , and thus define the cured state of the film layer obtained under the curing conditions to be about 95% of the total cured amount.

In some embodiments, the controllable film layer 130 has different curing states at different depths (ie, thicknesses). Specifically, gas can be introduced into the film layer 130 during curing, so that the gas concentrations at the top and bottom of the film layer 130 are different, thereby promoting the curing reaction on the top of the film layer 130 to produce a gas barrier curing phenomenon, causing the film layer 130 A first layer region and a second layer region with different degrees of curing. For example, the second layer region can be located at the bottom of the film layer 130 and is a more cured region, while the first layer region can be located at the top of the film layer 130 and is a less cured region. In some embodiments, the concentration of gas (eg, oxygen) introduced and/or the curing energy given during curing can be controlled, so that the film layer 130 has different curing states at different depths. In some embodiments, the concentration of the gas may be, for example, about 20%, about 10%, about 3%, or less than about 1%, and the curing energy may be selected according to the material of the film layer 130, for example, between about 250 mJ to about UV light energy between 1000mJ. In some embodiments, the greater the concentration of the gas, the more pronounced the oxygen-barrier curing phenomenon that occurs on the top of the film layer 130 , resulting in the greater the thickness of the first layer region and the greater the thickness of the second layer region. Small. For example, the concentration of the passing gas corresponding to the thickness of the first layer region from large to small is about 20%, about 10%, about 3% and less than about 1% in sequence. In some embodiments, when oxygen is introduced at a concentration of about 20% and given a curing energy of about 500 mJ, the first layer region is about 60% cured and has a thickness of about 23.4 nanometers (i.e. about 12% of the total thickness of the layer 130); and the second layer region has a degree of cure between about 99% and about 100% and a thickness of about 168.1 nm (ie, about 168.1 nm of the total thickness of the film layer 130). 88%). In some embodiments, the thickness of the first layer region is about 8.8 nanometers (ie, about 5% of the total thickness of the film layer 130 , when oxygen is introduced at a concentration of about 20% and given a curing energy of about 1000 mJ). ); and the thickness of the second layer region is about 195.9 nm (ie, about 95% of the total thickness of the film layer 130 ).

It should be noted that the present disclosure focuses on the discussion of the film layer 130 applied to the metal nanowires 122 , and the capping structure 140 (not shown in FIG. 1B , the cladding structure 140 (not shown in FIG. For the specific structure, please refer to FIG. 1C first.) It can be grown along the surface of the metal nanowire 122 to form the interface between the metal nanowire 122 and the film layer 130 (this part will be described in detail below). In the aforementioned coating step of the dispersion or slurry containing the metal nanowires 122 , the dispersion or slurry may also contain polymers and the like, but this is not the focus of the present disclosure. In some embodiments, the curing degree of the film layer 130 can be controlled at about 0%, about 30%, about 60%, about 75%, about 95%, about 98%, about 0% to about 95%, about 0% to a state of about 98%, about 95% to about 98%, about 60% to about 98%, or about 60% to about 75%. As mentioned above, "pre-cured or incompletely cured" referred to in the present disclosure can be defined as the bonding strength of the film layer is different from that of the fully cured film layer, that is, the ratio of the two is not 100%, fall within the scope of this disclosure.

Referring to FIG. 1C , then, a modification step is performed to form a metal nanowire layer 120 including a plurality of modified metal nanowires 122 . In detail, after the modification, at least a part of the original metal nanowire 122 is modified to form the cladding structure 140 on the surface thereof, thereby forming the modified metal nanowire 122 . It should be understood that, in FIG. 1B and FIG. 1C, different dots are used to represent the metal nanowires 122 before and after modification, and in the subsequent drawings, those in FIG. 1B and FIG. 1C will be directly used. The dots represent the metal nanowires 122 before and after modification, respectively. In some embodiments, the cladding structure 140 may be formed by electroless plating/electrolysis, and the cladding structure 140 may be, for example, a layered structure including a conductive material, an island-shaped protrusion structure, a dot-shaped protrusion structure, or a combination thereof. In some embodiments, the conductive material may include silver, gold, platinum, nickel, copper, iridium, rhodium, palladium, osmium, alloys including or not including the foregoing. In some embodiments, the coverage of the cladding structure 140 may be greater than about 80%, about 90% to about 95%, about 90% to about 99%, or about 90% to about 90% of the total surface area of the metal nanowire 122 about 100%. It should be understood that when the coverage ratio of the cladding structure 140 is 100%, the surface of the initial metal nanowire 122 is not exposed at all. In some embodiments, the cladding structure 140 can be a single-layer structure made of a single conductive material, such as an electroless copper layer, an electroless copper layer, or an electroless copper-nickel alloy layer; or the cladding structure 140 can also be made of For a two-layer or multi-layer structure made of two or more conductive materials, for example, an electroless copper plating layer is formed first, followed by an electroless silver plating layer.

In some embodiments, an electroless copper plating solution (including a copper ion solution, a chelating agent, an alkali agent, a reducing agent buffer, a stabilizer, etc.) can be prepared, and the metal nanowires 122 and the film layer 130 can be immersed in the electroless copper plating solution middle. The electroless copper plating solution can penetrate into the pre-cured or incompletely cured film layer 130, and use the capillary phenomenon to contact the surface of the metal nanowires 122, and at the same time use the metal nanowires 122 as catalytic points or nucleation points to facilitate copper Then, an electroless copper plating layer is deposited on the metal nanowire 122 to form the capping structure 140 . The cladding structure 140 is generally grown according to the initial state of the metal nanowire 122 , and a structure covering the metal nanowire 122 is formed as the modification time increases. On the other hand, in the composite structure 220 where there is no metal nanowire 122, there is no copper precipitation. That is to say, after good control, the cladding structure 140 is formed between the metal nanowire 122 and the film layer 130. On the interface, the film layer 130 does not have the cladding structure 130 that does not contact the surface of the metal nanowire 122 and exists alone. Therefore, after the modification step, the metal nanowires 122 in the conductive network are covered by the cladding structure 140 , and the cladding structure 140 is located on the interface formed by the metal nanowires 122 and the film layer 130 . In other words, the cladding structure 140 is spaced between the metal nanowire 122 and the film layer 130 . The cladding structure 140 and the metal nanowires 122 covered by it can be regarded as a whole, and the gap between the whole is still occupied by the material of the film layer 130 .

In some embodiments, the film layer 130 and the electroless plating solution/electrolytic solution can be made of compatible materials. For example, a non-alkali-resistant polymer can be used to make the film layer 130, and the electroless plating solution can be made of an alkaline solution. Therefore, in this step, in addition to using the pre-cured or incompletely cured state of the aforementioned film layer 130, the pre-cured or incompletely cured film layer 130 can be attacked (similar to etching) by an electroless plating solution, so as to facilitate the aforementioned modification. step.

The principle of the modification step is described below, but is not intended to limit the present disclosure. In the initial stage when the metal nanowires 122 and the film layer 130 are immersed in the electroless plating solution/electrolytic solution, the solution will attack the pre-cured or incompletely cured film layer 130 first. When the solution contacts the metal nanowires 122, metal ions (eg copper ions) will start to grow using the metal nanowires 122 (eg, nanosilver nanowires) as seeds, and grow into the aforementioned cladding structure 140 on the surface of the metal nanowires 122 as the soaking time increases. On the other hand, the film layer 130 can be used as a control layer or a confinement layer in the above reaction process, so as to limit the growth reaction of the cladding structure 140 to the interface between the metal nanowire 122 and the film layer 130 , so that the cladding structure 140 controlled and uniform growth. In this way, the modified metal nanowires 122 of the present disclosure can have better consistency when sensing/transmitting signals.

In some embodiments, a curing step may be followed to fully cure the film layer 130 using light, heat, or other means. In the aforementioned modification step, the cladding structure 140 is formed on the surface of each metal nanowire 122 , and covers the entire surface of each metal nanowire 122 and grows outward. In some embodiments, a highly conductive material can be used to fabricate the cladding structure 140 , for example, copper is used as the material of the cladding structure 140 to cover the surface of the silver nanowires, and the cladding structure 140 is located between the silver nanowires and the film. Interface between layers 130 . It is worth noting that although the conductivity of silver metal material is higher than that of copper metal material, the overall conductivity of the silver nanowire layer is relatively low due to factors such as the size of the silver nanowires and their mutual contact patterns. (But the resistance is still low enough to transmit electrical signals), and after the modification step, the conductivity of the silver nanowires covered with the capping structure 140 (ie, the modified metal nanowires 122 ) is higher than that of the unmodified metal nanowires high-quality silver nanowires. In other words, the modified metal nanowire layer 120 can form a low-resistance conductive layer, and compared with the unmodified metal nanowire layer 120 , the surface of the modified metal nanowire layer 120 The resistance can be reduced by a factor of about 100 to about 10,000. The above conductive layers can be used to fabricate electrode structures with various uses, such as conductive substrates in the flexible field, wireless charging coils or antenna structures. Specifically, the electrode structure may include at least the metal nanowires 122 and a film layer 130 additionally covering the metal nanowires 122 , and at least a part or all of the surface of the metal nanowires 122 (ie the metal nanowires 122 and the The interface corresponding to the film layer 130) has a cladding structure 140 (ie, a cladding layer). By introducing the coating layer, the conductivity of the metal nanowire layer 120 can be improved. In some embodiments, since the copper metal material grows along the surface of the metal nanowire 122 (ie, the interface corresponding to the metal nanowire 122 and the film layer 130 ), after plating, the observed copper The shape will be quite similar to the initial shape of the metal nanowire 122 (eg, wire-like structure), and the copper will grow uniformly to form an outer layer structure of similar size (eg, thickness).

The aforementioned method of the present disclosure can be applied to fabricating a touch panel, such as, but not limited to, a touch panel used in conjunction with a display. More specifically, please refer to FIGS. 2A and 2B, wherein FIG. 2A is a schematic top view of the touch panel 100 according to some embodiments of the present disclosure, and FIG. 2B is a schematic diagram of a touch panel 100 according to some embodiments of the present disclosure. 2A is a schematic cross-sectional view of the touch panel 100 taken along the line segment 2B-2B. In some embodiments, the touch panel 100 may include a substrate 110 , peripheral leads 150 and touch sensing electrodes 170 . The substrate 110 is configured to carry the peripheral leads 150 and the touch sensing electrodes 170 , and can be, for example, a rigid transparent substrate or a flexible transparent substrate. In some embodiments, the material of the substrate 110 includes, but is not limited to, glass, acrylic, polyvinyl chloride, polypropylene, polystyrene, polycarbonate, cycloolefin polymers, cycloolefin copolymers, polyterephthalic acid Glycol ester, polyethylene naphthalate, colorless polyimide and other transparent materials or their combination. In some embodiments, pre-treatment steps may be performed on the surface of the substrate 110 , such as performing a surface modification process or additionally coating an adhesive layer or a resin layer on the surface of the substrate 110 to enhance the gap between the substrate 110 and the metal nanowires 122 of adhesion. In some embodiments, the substrate 110 has a display area VA and a peripheral area PA, and the peripheral area PA is disposed on a side of the display area VA. For example, the peripheral area PA may be a frame-shaped area disposed around the display area VA (ie, covering the right side, the left side, the upper side and the lower side). For another example, the peripheral area PA may also be an L-shaped area disposed on the left side and the lower side of the display area VA.

In some embodiments, the peripheral leads 150 are generally located in the peripheral area PA, and the touch sensing electrodes 170 are generally located in the display area VA, and the peripheral leads 150 and the touch sensing electrodes 170 are approximately at the junction of the display area VA and the peripheral area PA. The contacts are electrically connected to each other to form an electron transfer path across the display area VA and the peripheral area PA. In some embodiments, the touch sensing electrodes 170 are in a single-layer configuration, and the touch panel 100 can obtain the touch position by detecting the change in the capacitance value of each touch sensing electrode 170 itself, and the peripheral leads 150 can be connected with The external controller is connected for touch or other signal transmission. In some embodiments, the touch sensing electrodes 170 are arranged in a non-staggered manner. For example, the touch sensing electrodes 170 may be elongated electrodes extending along the first direction D1, and a plurality of elongated electrodes may be arranged at equal distances along the second direction D2, wherein the first direction D1 and the second The directions D2 are perpendicular to each other. However, the shape and arrangement of the touch sensing electrodes 170 are not limited thereto, and in other embodiments, the touch sensing electrodes 170 may also have other suitable shapes and arrangements.

In some embodiments, the peripheral leads 150 and the touch sensing electrodes 170 are formed of the modified metal nanowires 122 (the “modified metal nanowires 122” referred to herein include the metal nanowires 122 and a coating structure 140 covering its surface). In detail, the peripheral lead 150 and the touch sensing electrode 170 each include a metal nanowire 122 and a film layer 130 applied to the metal nanowire 122 , and the interface between each metal nanowire 122 and the film layer 130 is substantially It has a cladding structure 140 . Specifically, the aforementioned modified metal nanowires 122 and the film layer 130 applied to the modified metal nanowires 122 are patterned to form peripheral leads 150 and touch sensing electrodes 170 . In this way, electrons can be transferred in the peripheral leads 150 , in the touch sensing electrodes 170 , and transferred from the touch sensing electrodes 170 to the peripheral leads 150 via the modified metal nanowires 122 adjacent to each other. Or transmitted to the touch sensing electrodes 170 by the peripheral leads 150 . By forming the cladding structure 140 on the interface between the metal nanowire 122 and the film layer 130, the modified metal nanowire 122 is formed, and the modified metal nanowire 122 is used to fabricate a touch control The peripheral leads 150 and the touch sensing electrodes 170 of the panel 100 can effectively reduce the sheet resistance of the touch panel 100 to improve the conductivity of the touch panel 100 and effectively reduce the resistive load value of the touch panel 100 capacitive loading, RC loading). In some embodiments, the resistive-capacitive load value of the touch sensing electrodes 170 made of the modified metal nanowires 122 is compared with that of the unmodified metal nanowires 122 (ie, without coating The resistive-capacitive load value of the touch sensing electrodes 170 formed by the metal nanowires 122) on the surface of the structure 140 is reduced by about 10% to about 50%.

In some embodiments, the touch sensing electrodes 170 have a grid-like pattern formed by a plurality of thin lines L interlaced. In detail, the modified metal nanowires 122 and the film layer 130 applied to the modified metal nanowires 122 are patterned to form a grid pattern formed by a plurality of thin lines L interlaced, and the The formed grid pattern is the electrode pattern of the touch sensing electrode 170 . In other words, the modified metal nanowires 122 and the film layer 130 applied to the modified metal nanowires 122 are present in each thin line L of the grid pattern of the touch sensing electrode 170 . It is worth noting that since the modified metal nanowire 122 has the cladding structure 140, it has a lower light transmittance (ie, the wavelength is about 400 nm to about 700nm visible light transmittance) and higher haze, and by patterning the touch sensing electrodes 170 to form a grid pattern formed by a plurality of fine lines L interlaced, the modified metal nanometers can be avoided. The lines 122 affect the light transmittance and haze of the touch sensing electrodes 170 , so that the display area VA of the touch panel 100 can maintain good optical properties. Specifically, the touch sensing electrodes 170 with the grid pattern of the present disclosure can make the display area VA of the touch panel 100 have a transmittance greater than about 88%, which meets the needs of users. On the other hand, the touch sensing electrodes 170 with the grid pattern of the present disclosure can make the display area VA of the touch panel 100 have a haze less than about 3.0, preferably less than about 2.5, about 2.0 or about 1.5 .

In some embodiments, the line width W1 of each thin line L is between about 1 μm and about 10 μm, so as to provide better light transmittance of the touch sensing electrode 170 and facilitate patterning. In detail, when the line width W1 of each thin line L is greater than about 10 μm, the touch sensing electrode 170 may have poor light transmittance, thereby affecting the optical properties exhibited by the display area VA of the touch panel 100 ; However, when the line width W1 of each thin line L is less than about 1 micrometer, the difficulty of patterning may be increased, thereby causing inconvenience in the manufacturing process. In some embodiments, the distance X1 between adjacent thin lines L (ie, the line distance X1) is between about 1 micrometer and about 10 micrometers, so as to provide better light transmittance and conductivity of the touch sensing electrodes 170 . In detail, when the line distance X1 is greater than about 10 μm, the arrangement of the grid-like patterns may be too sparse, resulting in insufficient electron transfer paths, thereby causing the touch sensing electrodes 170 to have too high sheet resistance and too low conductivity; and when When the line spacing X1 is less than about 1 μm, the grid pattern may be arranged too closely, resulting in too low light transmittance of the touch sensing electrodes 170 , thereby affecting the optical properties exhibited by the display area VA of the touch panel 100 . In some embodiments, the thin lines L may be arranged in an equidistant manner, for example, that is, each grid may have the same dimensions (eg, length and width). In some embodiments, the shape of each grid may be, for example, a rectangle, square, diamond, or other suitable shape. With the above arrangement, the touch sensing electrode 170 of the present disclosure can not only have good light transmittance, but also have good conductivity. Specifically, the touch sensing electrodes 170 with the grid pattern of the present disclosure can make the sheet resistance of the display area VA of the touch panel 100 range from about 8 ohms/square to about 42 ohms/square, which is relatively The sheet resistance of the display area VA of the touch panel formed by the unmodified metal nanowires 122 is reduced by about 20% to about 30%.

In some embodiments, the line width W2 of the peripheral lead 150 is between about 8 micrometers and about 10 micrometers, so that the peripheral lead 150 has good conductivity and facilitates patterning. In detail, when the line width W2 of the peripheral lead 150 is less than about 8 μm, the sheet resistance of the peripheral lead 150 may be too large and the conductivity may be too low, which may increase the difficulty of patterning, thereby causing inconvenience in the process. In some embodiments, the line width W2 of the peripheral lead 150 can be designed to be the same as the line width W1 of each thin line L in the touch sensing electrode 170 . In some embodiments, the distance X2 between adjacent peripheral leads 150 (ie, the line distance X2) is between about 5 micrometers to about 20 micrometers, or preferably between 3 micrometers and about 20 micrometers, so that the Compared with the conventional touch panel, the touch panel 100 of the present disclosure reduces the frame size (eg, the width of the peripheral area PA) by about 20% or more, thereby meeting the narrow frame requirement of the display. Specifically, the width of the peripheral area PA of the touch panel 100 of the present disclosure may be less than about 2 mm. With the above arrangement, the peripheral lead 150 of the present disclosure can have good conductivity. Specifically, the peripheral lead 150 of the present disclosure can enable the sheet resistance of the peripheral area PA of the touch panel 100 to be between about 0.10 ohm/square to about 0.13 ohm/square, which is compared with the unmodified metal nanowire The sheet resistance of the peripheral area PA of the touch panel formed by the rice wires 122 is reduced by about 20% to about 50%.

Please refer to FIGS. 3A to 3D , which are schematic cross-sectional views at different steps of the manufacturing method of the touch panel 100 according to some embodiments of the present disclosure, and the cross-sectional positions are the same as those of FIG. 2B . The manufacturing method of the touch panel 100 includes steps S10 to S16 , and the steps S10 to S16 may be performed in sequence. In step S10 , a substrate 110 having a predefined peripheral area PA and a display area VA is provided, and unmodified metal nanowires 122 are disposed on the substrate 110 to form metal nanowires in the peripheral area PA and the display area VA Line layer 120 . In step S12 , the film layer 130 is disposed on the unmodified metal nanowires 122 , so that the film layer 130 covers the unmodified metal nanowires 122 , and the film layer 130 is in a pre-cured or incompletely cured state. In step S14, a patterning step is performed to form the metal nanowire layer 120 with a pattern, wherein the metal nanowire layer 120 in the peripheral area PA is patterned to form the peripheral wiring 150, and the metal nanowire layer 120 in the display area VA is patterned The nanowire layer 120 is patterned to form the touch sensing electrodes 170 . In step S16, a modification step is performed to form the cladding structure 140 on the metal nanowire 122, so that the peripheral leads 150 in the peripheral area PA and the touch sensing electrodes 170 in the display area VA are both modified The latter metal nanowires 122 are formed. In the following, the above steps will be described in more detail.

Referring to FIG. 3A first, a metal nanowire layer 120 (such as a nanosilver layer, a nanogold layer or a nanocopper layer) containing at least metal nanowires 122 is coated on the peripheral area of the substrate 110 PA and display area VA. In some embodiments, the dispersion or slurry with the metal nanowires 122 can be formed on the substrate 110 by coating, and then cured/dried, so that the metal nanowires 122 can be attached to the surface of the substrate 110 , and then formed into a metal nanowire layer 120 disposed on the substrate 110 . After the above-mentioned curing/drying step, substances such as the solvent in the dispersion or slurry will volatilize, and the metal nanowires 122 may be randomly distributed on the surface of the substrate 110; or preferably, the metal nanowires 122 may be solidified The metal nanowire layer 120 is formed on the surface of the substrate 110 without falling off, and the metal nanowires 122 in the metal nanowire layer 120 can be in contact with each other to provide a continuous current path, thereby forming a conductive network . In other words, the metal nanowires 122 are in contact with each other at intersecting positions to form a path for transferring electrons. Taking silver nanowires as an example, a silver nanowire and another silver nanowire will form a direct contact state at the intersection position (ie, the silver-silver contact interface), so it can form a low-resistance electron transfer The following modification steps will not affect or change the low-resistance structure of the above-mentioned “silver-silver contact”, and the surface of the metal nanowire 122 will be coated with a high-conductivity cladding structure 140. Therefore, The electrical characteristics of the end product can be improved.

In some embodiments, the dispersion or slurry includes a solvent to uniformly disperse the metal nanowires 122 therein. Specifically, the solvent is, for example, water, alcohols, ketones, ethers, hydrocarbons, aromatic solvents (benzene, toluene, xylene, etc.) or any combination thereof. In some embodiments, the dispersion may further include additives, surfactants and/or binders, so as to improve the compatibility between the metal nanowires 122 and the solvent and the stability of the metal nanowires 122 in the solvent. Specifically, additives, surfactants and/or binders can be, for example, carboxymethyl cellulose, hydroxyethyl cellulose, hypromellose, fluorosurfactants, sulfosuccinate sulfonates, Sulfate, phosphate, disulfonate, or a combination thereof. The dispersion or slurry containing the metal nanowires 122 can be formed on the surface of the substrate 110 in any manner, such as but not limited to processes such as screen printing, spray coating or roller coating. In some embodiments, a roll-to-roll process may be employed to apply the dispersion or slurry including the metal nanowires 122 to the surface of the continuously supplied substrate 110 .

It should be understood that "metal nanowires" as used herein is a collective term that refers to a collection of metal wires comprising a plurality of metal elements, metal alloys or metal compounds (including metal oxides), and which contain The number of metal nanowires mentioned above does not affect the scope of protection claimed in this disclosure. In some embodiments, the cross-sectional dimension (eg, the diameter of the cross-section) of a single metal nanowire may be less than 500 nm, preferably less than 100 nm, and more preferably less than 50 nm. In some embodiments, the metal nanowires have a large aspect ratio (ie, length:diameter of the cross-section). Specifically, the aspect ratio of the metal nanowires may be between 10 and 100,000. In more detail, the aspect ratio of the metal nanowire may be greater than 10, preferably greater than 50, and more preferably greater than 100. In addition, other terms such as silk, fiber or tube have the above-mentioned cross-sectional dimensions and aspect ratios, and are also covered by the present disclosure.

In some embodiments, the metal nanowires 122 may be further post-processed to improve the contact characteristics (eg, increase the contact area) of the metal nanowires 122 at the intersections, thereby increasing the electrical conductivity thereof. Post-treatment may include, but is not limited to, steps such as heating, plasma, corona discharge, ultraviolet light, ozone, or pressure, for example. Specifically, after curing/drying to form the metal nanowire layer 120, a roller may be used to apply pressure thereon. In some embodiments, one or more rollers may be used to apply pressure to the metal nanowire layer 120 . In some embodiments, the applied pressure may be between about 50 psi and about 3400 psi, preferably between about 100 psi and about 1000 psi, between about 200 psi and about 800 psi, or between about 300 psi and about 500 psi between psi. In some embodiments, the metal nanowires 122 may be post-treated with the heating and pressing steps at the same time. For example, a pressure of about 10 psi to about 500 psi (or preferably a pressure of about 40 psi to about 100 psi) can be applied through the roller while heating the roller to about 70°C to about 200°C (or preferably about 100°C) °C to about 175 °C) to improve the conductivity of the metal nanowires 122 . In some embodiments, the metal nanowires 122 may be exposed to a reducing agent for post-treatment. For example, the metal nanowires 122 composed of silver nanowires may preferably be exposed to a silver reducing agent for post-treatment. In some embodiments, the silver reducing agent may include a borohydride such as sodium borohydride, a boron nitrogen compound such as dimethylaminoborane, or a gaseous reducing agent such as hydrogen. In some embodiments, the exposure time may be between about 10 seconds and about 30 minutes, preferably between about 1 minute and about 10 minutes. Through the above post-processing steps, the contact strength or area of the metal nanowires 122 at the intersections can be enhanced, thereby ensuring that the contact surfaces of the metal nanowires 122 at the intersections are not affected by the modification treatment.

Next, referring to FIG. 3B , the film layer 130 is disposed on the unmodified metal nanowires 122 , so that the film layer 130 covers the unmodified metal nanowires 122 . In some embodiments, the polymer in the film layer 130 after coating can penetrate between the metal nanowires 122 to form fillers, and the metal nanowires 122 are embedded in the film layer 130 to form the composite structure 220 . In other words, the unmodified metal nanowires 122 are embedded in the film layer 130 to form the composite structure 220 . In some embodiments, the membrane layer 130 may include an insulating material, such as a non-conductive resin or other organic material. In some embodiments, the film layer 130 may be formed by spin coating, spray coating, or printing. In some embodiments, the thickness of the film layer 130 may be between about 20 nanometers and about 10 micrometers, between about 50 nanometers and about 200 nanometers, or between about 30 nanometers and about 100 nanometers. In order to effectively carry out the subsequent modification steps, the polymer (ie, the film layer 130 ) will be in a pre-cured or incompletely cured state. For details, please refer to the foregoing description.

Then, referring to FIG. 3C, a patterning step is performed so that the composite structure 220 in the peripheral area PA and the display area VA can be patterned to form conductive structures in the peripheral area PA and the display area VA. In some embodiments, the patterned composite structure 220 fabricated in the peripheral area PA can form the peripheral lead 150 , and the patterned composite structure 220 fabricated in the display area VA can form the touch sensing electrode 170 , and The peripheral leads 150 and the touch sensing electrodes 170 can be electrically connected to each other for signal transmission between the peripheral area PA and the display area VA. In some embodiments, the composite structure 220 located in the display area VA may be patterned into a grid-like pattern formed by a plurality of thin lines L interlaced, so that the display area VA has good light transmittance. After the patterning step, the peripheral leads 150 and the touch sensing electrodes 170 may at least include the metal nanowire layer 120 formed by the unmodified metal nanowires 122 .

In some embodiments, the patterning of the composite structure 220 may be performed by etching. In some embodiments, the composite structure 220 in the peripheral area PA and the display area VA can be etched at the same time, and an etching mask (such as a photoresist) can be used to manufacture the peripheral area PA and the display area VA at one time in the same process. A composite structure 220 with a pattern is produced. In some embodiments, when the metal nanowire layer 120 in the composite structure 220 is a silver nanowire layer, the etching solution can select a component that can etch silver, for example, the main component of the etching solution can be H ₃ PO ₄ (ratio about 55% to about 70%) and _HNO3 (about 5% to about 15%) to remove the silver metal material in the same process. In other embodiments, the main components of the etching solution may be ferric chloride/nitric acid or phosphoric acid/hydrogen peroxide or the like.

Next, referring to FIG. 3D , a modification step is performed to form a metal nanowire layer 120 composed of a plurality of modified metal nanowires 122 . In detail, after the modification step, at least a part of the metal nanowires 122 in the metal nanowire layer 120 in the peripheral area PA and the display area VA is modified to form the cladding structure 140 on the surface thereof, thereby forming The modified metal nanowires 122 . In some embodiments, the cladding structure 140 can be formed by electroless plating, that is, the electroless plating solution is used to infiltrate the pre-cured or incompletely cured film layer 130, so that the reactive metal ions in the electroless plating solution can be oxidized by The reduction reaction results in precipitation on the surface of the metal nanowire 122 to form the capping structure 140 . The covering structure 140 can be a layered structure made of conductive materials, an island-shaped protrusion structure, a dot-shaped protrusion structure or a combination thereof; or the covering structure 140 can be a single-layer or multi-layer structure made of a single material or multiple materials Alternatively, the cladding structure 140 may be a single-layer or multi-layer structure made of alloyed materials.

It should be noted that, since the modification step is performed along the surface of the metal nanowire 122 , the shape of the cladding structure 140 will generally grow according to the shape of the metal nanowire 122 . In the modification step, the growth conditions of the cladding structure 140 (eg, the electroless plating time and/or the concentration of the electroless plating solution) can be controlled, so that the cladding structure 140 is not overgrown, but only covers the metal nanowires 122 . s surface. In addition, as mentioned above, the pre-cured or incompletely cured film layer 130 can also play the role of limiting and controlling. In this way, the cladding structure 140 formed through the modification step will not separate out/grow in the film layer 130 without contacting the metal nanowires 122 , and will be formed on the surface of the metal nanowires 122 and the metal nanowires 122 . between the film layers 130 . In some embodiments, the film layer 130 is still filled between adjacent metal nanowires 122 . On the other hand, the cladding structure 140 formed by electroless plating/electrolytic plating has high density. Compared with the size of the thin line L of the peripheral lead 150 and the touch sensing electrode 170 (for example, the line width of about 10 microns), the cladding structure 140 has a higher density. The defect size of the cladding structure 140 is about 0.01 to about 0.001 times the size of the peripheral lead 150 and the thin line L of the touch sensing electrode 170 , so even if the cladding structure 140 is defective, it will not cause the peripheral lead 150 and the touch sensing electrode. 170 The problem of disconnection occurs. In some embodiments, a curing step may be further included after the modification step, so that the pre-cured or incompletely cured film layer 130 reaches a fully cured state.

After the above steps, the touch panel 100 as shown in FIG. 2A can be formed. Overall, the peripheral leads 150 in the peripheral area PA may at least include the metal nanowire layer 120 formed by the modified metal nanowires 122 , and the touch sensing electrodes 170 in the display area VA may also include at least the metal nanowire layer 120 . The metal nanowire layer 120 formed by the modified metal nanowires 122 , that is, the metal nanowires 122 in the peripheral leads 150 and the touch sensing electrodes 170 are all covered with a cladding structure 140 , wherein the cladding structure 140 is covered. The structures 140 and the metal nanowires 122 may have the same or similar structural appearance, and the film layer 130 is filled between the adjacent metal nanowires 122 .

In some variant embodiments, different process sequences may be used to fabricate the touch panel 100 of the present disclosure. Specifically, the order of step S14 and step S16 in the aforementioned manufacturing method of the touch panel 100 can be reversed. In detail, another manufacturing method of the touch panel 100 includes steps S20 to S26. In step S20, a substrate 110 with a predefined peripheral area PA and a display area VA is provided, and unmodified metal nanowires 122 are disposed on the substrate 110 to form metal nanowires in the peripheral area PA and the display area VA Line layer 120 . In step S22, the film layer 130 is disposed on the unmodified metal nanowires 122, so that the film layer 130 covers the unmodified metal nanowires 122, and the film layer 130 is in a pre-cured or incompletely cured state. In step S24, a modification step is performed to form the cladding structure 140 on the metal nanowires 122, so that the metal nanowire layers 120 in the peripheral area PA and the display area VA are all made of the modified metal nanowires It is composed of rice noodles 122. In step S26, a patterning step is performed to form the metal nanowire layer 120 with a pattern, wherein the metal nanowire layer 120 in the peripheral area PA is patterned to form the peripheral wiring 150, and the metal nanowire layer 120 in the display area VA is patterned The nanowire layer 120 is patterned to form the touch sensing electrodes 170 . In the following description, only the adjusted steps will be described, and for the remaining omitted parts, reference may be made to the descriptions of the foregoing embodiments.

In step S24 and step S26, since the modification step is performed first and then the patterning step is performed, the modification step is performed for the entire composite structure 220 (including the metal nanowire layer 120 and the film layer 130), and also That is to say, the cladding structure 140 formed by the modification step is formed on the entire surface of the interface between the metal nanowires 122 and the film layer 130 in the peripheral area PA and the display area VA. On the other hand, in the case where the metal nanowires 122 are silver nanowires, and the surface of the silver nanowires has a cladding structure 140 made of copper, the etching solution used in the patterning step can be selected The components of copper and silver can be etched. For example, the main components of the etching solution can be H ₃ PO ₄ (ratio of about 55% to about 70%) and HNO ₃ (ratio of about 5% to about 15%), so that in the same process Remove the silver metal material and the copper metal material. In other embodiments, the main components of the etching solution may be ferric chloride/nitric acid or phosphoric acid/hydrogen peroxide or the like. After the above steps, the touch panel 100 of the present disclosure can also be formed, and the specific structure is as described above, which will not be repeated here.

Since the display area VA and the peripheral area PA of the touch panel 100 of the present disclosure are made of the same material (including the formed modified metal nanowires 122 ), during the fabrication process of the touch panel 100 , The steps of coating, patterning, and modification can be performed on the entire surface, so as to save the use of a mask, thereby avoiding the alignment error caused by the use of the mask and the contact between the peripheral leads 150 and the touch sensing electrodes 170. Lap tolerance. In other words, since the peripheral leads 150 and the touch sensing electrodes 170 of the present disclosure are integrally formed from the same structural layer, no overlap is required, and there is no overlap tolerance, and there is no need to adjust the alignment during the modification step. bit, so there is no need to reserve the alignment error space. In this way, the width of the peripheral area of the touch panel can be reduced, thereby meeting the requirement of a narrow frame of the display. Specifically, using the manufacturing method of the touch panel 100 of the present disclosure can reduce the alignment error by about 0.2 mm. In this way, the width of the peripheral area PA of the touch panel 100 can be reduced, thereby meeting the narrow frame requirement of the display. On the other hand, since the present disclosure can perform the steps of coating, patterning, and modification on the entire surface, it can reduce many tedious process steps (such as the setting and removal of masks), and can flexibly according to actual needs Adjust the sequence of process steps to improve process convenience.

Please go back to Figure 2A and Figure 2B. In some embodiments, there may be non-conductive regions 180 between adjacent peripheral leads 150 located in the peripheral area PA and between adjacent touch sensing electrodes 170 located in the display area VA to electrically block adjacent ones The peripheral leads 150 and the adjacent touch sensing electrodes 170 . In some embodiments, the non-conductive region 180 can be substantially a gap. In some embodiments, the above-mentioned etching method can be used to form the gaps between the peripheral leads 150 and between the touch sensing electrodes 170 .

In some embodiments, the touch panel may further include a protective layer. Specifically, please refer to FIG. 4 , which is a schematic cross-sectional view of the touch panel 100 a according to other embodiments of the present disclosure, and its cross-sectional position is the same as that of FIG. 2B . The touch panel 100a includes a protective layer 190, and the material of the protective layer 190 can refer to the material of the film layer 130 described above. In some embodiments, the protective layer 190 covers the entire surface of the touch panel 100 , that is, the protective layer 190 covers the peripheral leads 150 and the touch sensing electrodes 170 . The protective layer 190 can be filled in the non-conductive region 180 between the adjacent peripheral leads 150 to electrically isolate the adjacent peripheral leads 150; or the protective layer 190 can be filled in the adjacent touch sensing electrodes 170 The non-conductive region 180 between the adjacent touch sensing electrodes 170 is electrically isolated.

FIG. 5A is a schematic top view of the touch panel 100b according to other embodiments of the present disclosure. FIG. 5B is a schematic cross-sectional view of the touch panel 100b of FIG. 5A taken along the line 5B- 5B according to some embodiments of the present disclosure. Please refer to FIGS. 5A and 5B at the same time, the touch panel 100b is a double-sided single-layer touch panel 100b, and for the sake of clarity and convenience of description, in the embodiments of FIGS. 5A and 5B, The configuration of the touch sensing electrodes is described with the first touch sensing electrodes 172 and the second touch sensing electrodes 174 . The first touch sensing electrodes 172 are arranged on the first surface (eg, the upper surface) of the substrate 110 , and the second touch sensing electrodes 174 are arranged on the second surface (eg, the lower surface) of the substrate 110 , so as to enable the first touch sensing The electrodes 172 and the second touch sensing electrodes 174 are electrically insulated from each other. In some embodiments, the first touch sensing electrodes 172 are a plurality of elongated electrodes extending along the second direction D2, and the plurality of elongated electrodes can be arranged at equal distances along the first direction D1, and the second The touch sensing electrodes 174 are a plurality of elongated electrodes extending along the first direction D1, and the plurality of elongated electrodes can be arranged at equal distances along the second direction D2, wherein the first direction D1 and the second direction D2 are mutually vertical. In other words, the extending directions of the first touch sensing electrodes 172 and the second touch sensing electrodes 174 are different and staggered. The first touch sensing electrodes 172 and the second touch sensing electrodes 174 can transmit control signals and receive touch sensing signals, respectively. In this way, the touch position can be obtained by detecting the signal change (eg capacitance change) between the first touch sensing electrode 172 and the second touch sensing electrode 174 .

In some embodiments, the first touch sensing electrodes 172 and the second touch sensing electrodes 174 each have a grid-like pattern formed by a plurality of fine lines L interlaced, and each includes a modified metal nanowire 122 The formed metal nanowire layer 120 . As mentioned above, the modified metal nanowires 122 and the film layer 130 applied to the modified metal nanowires 122 are patterned to form a grid pattern formed by a plurality of thin lines L interlaced, and The formed grid pattern is the electrode pattern of the first touch sensing electrodes 172 and the second touch sensing electrodes 174 . In some embodiments, the thin lines L in the first touch sensing electrodes 172 and the thin lines L in the second touch sensing electrodes 174 do not completely overlap with each other. Specifically, when viewed from the top view angle (ie, the view angle of FIG. 5A ), the intersection of the two thin lines L in the second touch sensing electrodes 174 can be located in the first touch sensing electrodes 172 by the thin lines L. On the other hand, the intersection of the two thin lines L in the first touch sensing electrodes 172 can also be located at the exact center of the grid formed by the thin lines L in the second touch sensing electrodes 174 . However, the present disclosure is not limited thereto, and in other embodiments, the thin lines L in the first touch sensing electrodes 172 and the thin lines L in the second touch sensing electrodes 174 may also completely overlap. The first touch sensing electrodes 172 are electrically connected to their corresponding peripheral leads 150 , and the second touch sensing electrodes 174 are also electrically connected to their corresponding peripheral leads 150 . Like the foregoing embodiments, the peripheral leads 150 , the first touch sensing electrodes 172 and the second touch sensing electrodes 174 all include the modified metal nanowires 122 and the film layer 130 . In other words, the peripheral lead 150 , the first touch sensing electrode 172 and the second touch sensing electrode 174 can all form the capping structure 140 on the surface of the metal nanowire 122 according to the aforementioned method. On the other hand, the line width W1 and line spacing X1 of the respective thin lines L in the first touch sensing electrode 172 and the second touch sensing electrode 174 and the line width W2 and line spacing X2 of the peripheral lead 150 may refer to the foregoing description. It will not be repeated here.

The manufacturing method of the double-sided single-layer touch panel 100b shown in FIGS. 5A and 5B includes steps S30 to S36. In step S30 , a substrate 110 having a predefined peripheral area PA and a display area VA is provided, and unmodified metal nanowires 122 are disposed on two opposite surfaces of the substrate 110 to form metal nanowire layers 120 respectively. The peripheral area PA and the display area VA on two opposite surfaces of the substrate 110 . In step S32, the film layer 130 is disposed on the unmodified metal nanowires 122, so that the film layer 130 covers the unmodified metal nanowires 122 on two opposite surfaces of the substrate 110 and the film layer 130 is pre-cured or Incompletely cured state. In step S34 , a double-sided patterning step is performed to form a patterned metal nanowire layer 120 , wherein the metal nanowire layer 120 located in the peripheral area PA on the two opposite surfaces of the substrate 110 is patterned to form peripheral leads 150 , and the metal nanowire layers 120 in the display area VA on the opposite surfaces of the substrate 110 are patterned to form the touch sensing electrodes 170 . In step S36 , a double-sided modification step is performed to form the cladding structure 140 on the metal nanowires 122 located on the opposite surfaces of the substrate 110 , so that the peripheral leads 150 located in the peripheral area PA on the opposite surfaces of the substrate 110 and the touch sensing electrodes 170 of the display area VA are all formed of the modified metal nanowires 122 . As in the aforementioned embodiments, the order of step S34 and step S36 in the manufacturing method of the touch panel 100b can also be reversed, and the manufacturing method of the double-sided single-layer touch panel 100b can refer to the single-sided manufacturing method described above. The manufacturing method of the touch panel 100 of this type will not be repeated here.

The method for modifying metal nanowires disclosed in the present disclosure can also be applied to fabrication of sensing electrodes that do not need to consider light transmittance, such as but not limited to touch panels of notebook computers, antenna structures, and coils for wireless charging. In some embodiments, the sensing electrodes can be connected to traces and then connected to external circuits to transmit signals. In some embodiments, the traces may be equivalent to the aforementioned peripheral leads, and are also formed of modified metal nanowires.

The touch panel of the present disclosure can be assembled with other electronic devices, such as a display with touch function. For example, the substrate can be attached to a display element (such as a liquid crystal display element or an organic light emitting diode display element), and optical glue or other adhesives can be used for lamination between the two, and the touch sensing electrodes are also The optical glue can be used for bonding with the outer cover layer (such as protective glass). The touch panel and antenna of the present disclosure can be applied to electronic devices such as portable phones, tablet computers, and notebook computers, and can also be applied to flexible products. The touch panel of the present disclosure can also be applied to a polarizer. The electrodes of the present disclosure can be applied to wearable devices (such as watches, glasses, smart clothes and smart shoes, etc.) and automotive devices (such as instrument panels, driving recorders, car mirrors, and car windows, etc.).

According to the above-mentioned embodiments of the present disclosure, since in the touch panel of the present disclosure, the peripheral leads located in the peripheral area and the touch sensing electrodes located in the display area are both formed by the modified metal nanowires, so it can effectively The surface resistance of the touch panel is reduced to improve the conductivity of the touch panel, and the resistance-capacitance load value of the touch panel can be reduced. On the other hand, since the touch sensing electrodes in the display area have a grid-like pattern formed by a plurality of fine lines interlaced, the modified metal nanowires can prevent the light transmittance of the display area from being affected by the modified metal nanowires, thereby making the touch The display area of the panel has good optical properties. In addition, since the peripheral leads and the touch sensing electrodes of the touch panel of the present disclosure are all made of the same material (including the formed modified metal nanowires), during the fabrication of the touch panel , can be implemented on the whole surface, so as to save the use of a mask, thereby avoiding the alignment error caused by the use of the mask and the overlap tolerance between the peripheral leads and the touch sensing electrodes. In other words, since the peripheral leads and the touch sensing electrodes of the present disclosure are integrally formed from the same structural layer, no overlapping is required, there is no overlapping tolerance, and no alignment is required during the modification step. Therefore, it is not necessary to reserve the alignment error space. In this way, the width of the peripheral area of the touch panel can be reduced, thereby meeting the requirement of a narrow frame of the display.

Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure protects The scope shall be determined by the scope of the appended patent application.

100, 100a, 100b, 100c: Touch Panel 110: Substrate 120: Metal Nanowire Layer 122: Metal Nanowires 130: film layer 140: Coated Structure 150: Peripheral lead 170: Touch Sensing Electrode 172: The first touch sensing electrode 174: Second touch sensing electrode 180: Non-conductive area 190: Protective Layer 220: Composite Structures PA: Surrounding area VA: Display area L: thin line W1,W2: Line width X1, X2: line spacing D1: first direction D2: Second direction 2B-2B, 5B-5B: line segment

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: 1A to 1C are schematic cross-sectional views of different steps of a method for modifying metal nanowires according to some embodiments of the present disclosure; FIG. 2A is a schematic top view of a touch panel according to some embodiments of the present disclosure; FIG. 2B is a schematic cross-sectional view of the touch panel of FIG. 2A according to some embodiments of the present disclosure, taken along the line segment 2B-2B; FIGS. 3A to 3D are schematic cross-sectional views at different steps of a manufacturing method of a touch panel according to some embodiments of the present disclosure; FIG. 4 is a schematic cross-sectional view of a touch panel according to other embodiments of the present disclosure; FIG. 5A is a schematic top view of a touch panel according to other embodiments of the present disclosure; and FIG. 5B is a schematic cross-sectional view of the touch panel of FIG. 5A according to some embodiments of the present disclosure, taken along a line segment 5B- 5B.

Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without

100: touch panel

110: Substrate

150: Peripheral lead

170: Touch Sensing Electrode

PA: Surrounding area

VA: Display area

L: thin line

D1: first direction

D2: Second direction

2B-2B: Line segment

Claims (25)

A touch panel, comprising: a substrate having a display area and a peripheral area; a peripheral lead disposed in the peripheral region of the substrate; and a first touch sensing electrode disposed in the display area of the substrate, wherein the first touch sensing electrode is electrically connected to the peripheral lead, and has a grid-like pattern formed by a plurality of first thin lines interlaced, Wherein the peripheral lead and the first touch sensing electrode each include a plurality of conductive nanostructures and a film layer applied to each of the conductive nanostructures, and each of the conductive nanostructures and the film layer An interface substantially has a cladding structure. The touch panel of claim 1, wherein the cladding structure includes a plating layer, and the plating layer completely covers the interface between each of the conductive nanostructures and the film layer. The touch panel according to claim 1, wherein the film layer is filled between the adjacent conductive nanostructures, and the film layer does not have the covering structure that exists alone. The touch panel of claim 1, wherein each of the conductive nanostructures comprises a metal nanowire, and the cladding structure completely covers an interface between the metal nanowire and the film layer, The interface between the metal nanowire and the film layer forms a uniform coating layer. The touch panel of claim 1, wherein the cladding structure is a layered structure made of a conductive material, an island-shaped protrusion structure, a point-shaped protrusion structure, or a combination thereof. The touch panel of claim 5, wherein the conductive material comprises alloys of silver, gold, copper, nickel, platinum, iridium, rhodium, palladium, osmium, or a combination thereof. The touch panel of claim 1, wherein the cladding structure is a single-layer structure made of a single metal material or alloy material, or a two-layer structure made of two or more metal materials or alloys, or Multilayer structure. The touch panel of claim 1, wherein the cladding structure is an electroless copper plating layer, an electroless copper plating layer, an electroless copper nickel plating layer, an electroless copper silver plating layer or a combination thereof. The touch panel of claim 1, wherein each of the conductive nanostructures, the film layer and the cladding structure is located in each of the first thin lines. The touch panel of claim 1, wherein the line width of each of the first thin lines is between 1 micrometer and 10 micrometers, and the line spacing of each of the adjacent first thin lines is between 1 micrometer to 10 microns. The touch panel of claim 1, wherein the substrate has a first surface and a second surface opposite to each other, the first touch sensing electrodes are disposed on the first surface of the substrate, and the touch panel is further include: A second touch sensing electrode is disposed on the second surface of the substrate and the display area, wherein the second touch sensing electrode has a grid pattern formed by a plurality of second thin lines interlaced. The touch panel of claim 11, wherein the second touch sensing electrode comprises the conductive nanostructures and the film layer applied to each of the conductive nanostructures, and each of the conductive nanostructures An interface between the structure and the film layer substantially has the cladding structure. The touch panel of claim 11, wherein the grid-like pattern formed by the interlacing of the first thin lines and the grid-like pattern formed by the interlacing of the second thin lines do not completely overlap. A manufacturing method of a touch panel, comprising: providing a substrate with a display area and a peripheral area; disposing a plurality of conductive nanostructures in the display area and the peripheral area to form a conductive layer; Add a film layer on the conductive layer, and make the film layer reach a pre-cured or incompletely cured state; Perform patterning steps, including: patterning the conductive layer and the film layer in the display area to form a touch sensing electrode with a grid pattern formed by a plurality of fine lines interlaced; and patterning the conductive layer and the film layer in the peripheral region to form a peripheral lead; and A modification step is performed to form a cladding structure on a surface of each of the conductive nanostructures located in the display area and the peripheral area, so that an interface between each of the conductive nanostructures and the film layer is substantially with the cladding structure on it. The manufacturing method of a touch panel as claimed in claim 14, wherein the patterning step is performed before or after the modification step. The method for fabricating a touch panel according to claim 14, wherein the patterning of the conductive layer and the film layer located in the display area and the peripheral area is performed in the same process. The manufacturing method of a touch panel as claimed in claim 14, wherein the modifying step comprises: The film layer and the conductive nanostructures are immersed in an electroless plating solution, and the electroless plating solution penetrates into the film layer and contacts the conductive nanostructures, so that a metal is precipitated out of each of the conductive nanostructures the surface. The method for fabricating a touch panel as claimed in claim 17, wherein the cladding structure is formed along the surface of each of the conductive nanostructures and is located between each of the conductive nanostructures and the film layer interface. The method for manufacturing a touch panel as claimed in claim 14, wherein applying the film layer on the conductive layer comprises: coating a polymer on the conductive layer; and The curing conditions are controlled so that the polymer reaches a pre-cured or incompletely cured state. The method for manufacturing a touch panel as claimed in claim 14, wherein applying the film layer on the conductive layer comprises: coating a polymer on the conductive layer; and Control the curing conditions so that the polymer reaches a precured or incompletely cured state, wherein the film layer in the precured or incompletely cured state has a first layer region and a second layer region, and the second layer region is The cured state is higher than that of the first layer region. The manufacturing method of a touch panel as claimed in claim 20, wherein in the first layer region, the cladding structure is formed along the surface of each of the conductive nanostructures, and is located at each of the conductive nanostructures The interface between the rice structure and the film layer. The manufacturing method of a touch panel as claimed in claim 20, wherein the controlled curing conditions include: A gas is introduced and the respective concentrations of the gas in the first layer region and the second layer region are controlled. The manufacturing method of a touch panel according to claim 14, wherein the modifying step comprises an electroless plating step, an electroplating step or a combination thereof. A device comprising the touch panel of claim 1. The device of claim 24, wherein the device comprises a display, a portable phone, a tablet computer, a wearable device, a vehicle device, a notebook computer, or a polarizer.

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