JP2024043036A - multilayer device - Google Patents

Abstract

The present invention provides a multilayer device that can form a stopband according to required specifications.
A multilayer device 300A includes a dielectric 310, a signal line 320 provided inside the dielectric 310, a ground electrode 330 provided inside or on the outside of the dielectric 310, and a signal line 320 provided inside the dielectric 310. A plurality of planar electrodes 340 are provided inside the dielectric 310 and are arranged parallel to the ground electrode 330 and along the first direction d1 from the input side to the output side of the signal line 320. A plurality of connection electrodes 350 connecting the plane electrode 340 and the ground electrode 330, a plurality of signal terminals 360 provided on the outer surface of the dielectric 310 and connected to the signal line 320, and a plurality of signal terminals 360 provided on the outer surface of the dielectric 310, A plurality of ground terminals 370 connected to the ground electrode 330 are provided. The connection electrode 350 has a coil shape or a meander shape at least in part.
[Selection diagram] Figure 5A

Description

This disclosure relates to multilayer devices.

2. Description of the Related Art Functional boards that control the passage characteristics of high-speed digital signals and high-frequency signals (hereinafter referred to as high-speed/high-frequency signals) are conventionally known. As an example of this type of functional board, Patent Document 1 includes a mushroom structure constituted by a conductor element (plane electrode) and a through via (connection electrode), and a conductor (ground electrode) that functions as a ground. A functional substrate is disclosed. This functional board has a structure in which mushroom structures are arranged periodically, and can suppress passage of a signal of a specific frequency among high-speed/high-frequency signals.

International Publication No. 2011/111311

However, with conventional functional boards, it is possible to block the passage of specific frequency signals among high-speed, high-frequency signals, but depending on the required specifications for multilayer devices, a stop band is formed that blocks the passage of high-speed, high-frequency signals. It may not be possible to do so.

The present disclosure aims to provide a multilayer device that can form a stopband according to required specifications.

A multilayer device according to an aspect of the present disclosure includes a dielectric, a signal line provided inside the dielectric such that a portion thereof is exposed on an outer surface of the dielectric, and a signal line that is at least partially exposed on the outer surface of the dielectric. a ground electrode provided on the inside or outside of the dielectric so as to be exposed to the outside; and a ground electrode provided inside the dielectric, parallel to the ground electrode, and extending from the input side to the output side of the signal line. a plurality of planar electrodes arranged along a first direction toward the dielectric; a plurality of connection electrodes provided inside the dielectric and connecting the plurality of planar electrodes and the ground electrode; and a plurality of connection electrodes provided on the outer surface of the dielectric. a plurality of signal terminals connected to the signal line; and a plurality of ground terminals provided on the outer surface of the dielectric body and connected to the ground electrode, and the connection electrode includes a coil at least in part. having a meandering shape or meandering shape.

A multilayer device according to one aspect of the present disclosure includes a signal line for transmitting a signal, a ground electrode set to ground potential, a plurality of planar electrodes parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line, a dielectric provided between each of the signal line, the plurality of planar electrodes, and the ground electrode, and a plurality of connection electrodes located between the plurality of planar electrodes and the ground electrode and connecting the plurality of planar electrodes and the ground electrode, and at least a portion of the connection electrodes has a coil shape or a meander shape.

According to the multilayer device of the present disclosure, a stop band can be formed according to required specifications.

FIG. 1 is a perspective view showing an example of a multilayer device. 2 is a diagram showing an example of an equivalent circuit of the multilayer device shown in FIG. 1. FIG. 1 is an external view of a multilayer device according to a first embodiment; FIG. 3 is a diagram showing a signal line, a plane electrode, a ground electrode, and a connection electrode of the multilayer device according to the first embodiment. FIG. 2 is a plan view of signal lines and the like of the multilayer device according to the first embodiment, viewed from above. 5A is a cross-sectional view of the multilayer device according to Embodiment 1 taken along the line VB-VB shown in FIG. 5A. FIG. 1 is a bottom view of the multilayer device according to Embodiment 1. FIG. 1 is a diagram showing an example of a manufacturing process of a multilayer device according to Embodiment 1. FIG. FIG. 7 is a diagram showing connection electrodes and the like of the multilayer device according to Modification 1 of Embodiment 1; FIG. 3 is a diagram illustrating transmission characteristics of the multilayer device of Embodiment 1 and Modification 1. FIG. 7 is a diagram showing a signal line, a plane electrode, a ground electrode, and a connection electrode of a multilayer device according to a second modification of the first embodiment. FIG. 11 is a plan view showing signal lines and the like of a multilayer device according to a second modification of the first embodiment, as viewed from above. FIG. 10A is a cross-sectional view of the multilayer device according to Modification 2 of Embodiment 1 taken along the line XB-XB shown in FIG. 10A. FIG. FIG. 7 is a bottom view of a multilayer device according to Modification 2 of Embodiment 1; 7 is a diagram showing a signal line, a plane electrode, a ground electrode, and a connection electrode of a multilayer device according to a third modification of the first embodiment. FIG. 1A and 1B are diagrams illustrating signal lines, planar electrodes, ground electrodes, and connection electrodes of a multilayer device in a reference example. FIG. 7 is a diagram showing transmission characteristics of multilayer devices according to Modification 2, Modification 3, and Reference Example of Embodiment 1. FIG. 3 is an external view of a multilayer device according to a second embodiment. FIG. 3 is a diagram showing a signal line, a plane electrode, a ground electrode, and a connection electrode of a multilayer device according to a second embodiment. FIG. 7 is a diagram showing a signal line, a plane electrode, a ground electrode, and a connection electrode of a multilayer device according to Modification 1 of Embodiment 2;

(Circumstances leading to this disclosure)
The circumstances leading to the present disclosure will be explained with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing an example of a multilayer device 1. FIG.

As shown in FIG. 1, the multilayer device 1 includes a signal line 20 for transmitting high-speed/high-frequency signals, a ground electrode 30 set to a ground potential, and a plurality of planar electrodes 40 arranged along the signal line 20. A ground electrode 30 and a plurality of connection electrodes 50 connecting the plurality of plane electrodes 40 are provided. The signal line 20, the ground electrode 30, the plane electrode 40, and the connection electrode 50 are provided inside or on the surface of a dielectric (not shown). The connection electrode 50 is an example of a via electrode.

This multilayer device 1 has a structure in which a plurality of mushroom structures each consisting of a plane electrode 40 and a connection electrode 50 are arranged at sufficiently small intervals relative to the wavelength of electromagnetic waves. A structure in which a plurality of mushroom structures are arranged at sufficiently small intervals with respect to the wavelength of electromagnetic waves is also called an EBG (Electromagnetic Band Gap) structure. In the multilayer device 1 having the EBG structure, it is possible to make the effective permittivity and magnetic permeability in the medium negative values.

FIG. 2 is a diagram showing an example of an equivalent circuit of the multilayer device 1 shown in FIG. 1.

The equivalent circuit shown in FIG. 2 is configured by an inductive component L20 of the signal line 20 and a parallel circuit (parallel resonant circuit) provided between the path connecting the signal line 20 and the ground electrode 30. The parallel circuit is composed of a capacitive component C40 based on the signal line 20 and the planar electrode 40, an inductive component L50 due to the connection electrode 50, and a capacitive component C20 based on the signal line 20 and the ground electrode 30.

In the multilayer device 1, by arranging a plurality of mushroom structures shown in FIG. 1, it is possible to control the admittance of the parallel circuit shown in FIG. 2 and make the dielectric constant a negative value. In a band where the dielectric constant is negative, high-speed, high-frequency signals cannot propagate on the signal line, and the multilayer device 1 functions as a band rejection filter.

The multilayer device of this embodiment has the configuration shown below in order to make it possible to form a stopband that blocks passage of high-speed, high-frequency signals according to required specifications.

Hereinafter, embodiments will be described in more detail with reference to the drawings.

Note that each of the embodiments described below represents a specific example of the present disclosure. Numerical values, shapes, materials, components, arrangement positions of components, connection forms, steps, order of steps, etc. shown in the following embodiments are merely examples, and do not limit the present disclosure. Further, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims will be described as arbitrary constituent elements.

In addition, in this specification, terms that indicate relationships between elements such as parallel, terms that indicate the shape of elements such as rectangular parallelepiped, and numerical ranges are not expressions that express only strict meanings, but substantially This expression means that it includes an equivalent range, for example, a difference of several percent.

In addition, each figure is a schematic diagram in which emphasis, omissions, or adjustments to the ratio have been made as appropriate to illustrate the present disclosure, and is not necessarily an exact illustration, and may differ from the actual shape, positional relationship, and ratio. In each figure, the same reference numerals are used for substantially the same configuration, and duplicate explanations may be omitted or simplified.

In addition, in this specification, the terms "top surface" and "bottom surface" in the configuration of a multilayer device refer to the top surface (vertically upward surface) and the bottom surface (vertically downward surface) in absolute spatial recognition. It is used as a term defined by the relative positional relationship of the components of a multilayer device.

(Embodiment 1)
[Multi-layer device configuration]
The configuration of multilayer device 300A according to Embodiment 1 will be described with reference to the drawings.

Figure 3 is an external view of the multilayer device 300A according to the first embodiment. Figure 4 is a diagram showing the signal line 320, planar electrodes 341, 342, 343, ground electrode 330, and connection electrodes 351, 352, 353 of the multilayer device 300A. Figure 5A is a plan view of the signal line 320 and the like of the multilayer device 300A as viewed from above. Figure 5B is a cross-sectional view of the multilayer device 300A as viewed from the line VB-VB shown in Figure 5A. Figure 5C is a bottom view of the multilayer device 300A.

Figure 4 shows the multilayer device 300A without the signal terminals 361, 362, the ground terminals 371, 372, 373, 374, and the dielectric 310. In Figure 5A, the signal line 320 is shown by a solid line. In Figure 5C, the signal line, planar electrodes, and connection electrodes are not shown.

The multilayer device 300A shown in FIGS. 3, 4, and 5A to 5C includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of plane electrodes 341, 342, and 343, a plurality of connection electrodes 351, 352 and 353. The multilayer device 300A also includes a plurality of signal terminals 361 and 362 and a plurality of ground terminals 371, 372, 373 and 374.

Hereinafter, some or all of the plurality of plane electrodes 341 to 343 may be referred to as a plane electrode 340, and some or all of the plurality of connection electrodes 351 to 353 may be referred to as a connection electrode 350. Further, some or all of the plurality of signal terminals 361 and 362 may be referred to as a signal terminal 360, and some or all of the plurality of ground terminals 371 to 374 may be referred to as a ground terminal 370.

For example, the signal line 320, the ground electrode 330, the plane electrode 340, and the connection electrode 350 are formed of a metal material such as silver or copper. Note that the signal line 320, the ground electrode 330, the plane electrode 340, and the connection electrode 350 may be formed of the same material or the same composition ratio, or may be formed of different materials or different composition ratios.

The dielectric 310 is formed, for example, by laminating a plurality of dielectric layers. The dielectric 310 is formed of a dielectric material such as low temperature co-fired ceramics (LTCC), for example. In order to downsize the multilayer device 300A, it is desirable to use a material with a high dielectric constant as the dielectric 310. The dielectric 310 is provided between the signal line 320, the ground electrode 330, and the plane electrode 340, respectively. Further, the dielectric 310 is formed to cover the outer circumferential surface of the signal line 320 excluding both end surfaces, the outer circumferential surface of the ground electrode 330 excluding both end surfaces, and the electrode structure consisting of the plane electrode 340 and the connection electrode 350. There is.

The dielectric 310 has a rectangular parallelepiped shape, and includes a bottom surface 316, a top surface 317 facing the bottom surface 316, and a plurality of side surfaces 311, 312, 313, and 314 connecting the bottom surface 316 and the top surface 317. have. The plurality of side surfaces 311 to 314 have side surfaces 311 and 312 that are opposite to each other, and side surfaces 313 and 314 that are orthogonal to both the side surfaces 311 and 312. Bottom surface 316 and top surface 317 are parallel to each other, side surfaces 311 and 312 are parallel to each other, and side surfaces 313 and 314 are parallel to each other. A corner portion (edge line portion) where each surface of the dielectric 310 intersects may be rounded.

Here, the direction in which the side surfaces 311 and 312 are opposite to each other is referred to as a first direction d1, the direction in which the side surfaces 313 and 314 are opposite to each other is referred to as a second direction d2, and the direction in which the bottom surface 316 and the top surface 317 are opposite to each other is referred to as a second direction d2. The direction in which the object is directed is called a third direction d3. Further, hereinafter, the minus side of the first direction d1 may be referred to as one side, and the plus side opposite to the minus side may be referred to as the other side.

The signal line 320 is linear and provided along the first direction d1. The signal line 320 is provided inside the dielectric 310 so that both ends, which are part of the signal line 320, are exposed on the outer surface (side surfaces 311 and 312) of the dielectric 310. The signal line 320 is strip-shaped and arranged parallel to the plane electrode 340 and the ground electrode 330. In a state where the multilayer device 300A is mounted on an electronic device, a high speed/high frequency signal is input/output to/from the signal line 320 via the signal terminal 360.

The signal terminals 360 are provided on side surfaces 311 and 312, which are the outer surfaces of the dielectric 310. One of the two signal terminals 361 and 362 is provided on the side surface 311, and the other signal terminal 362 is provided on the side surface 312. One end of the signal line 320 is connected to one signal terminal 361, and the other end of the signal line 320 is connected to the other signal terminal 362.

The ground electrode 330 is provided inside the dielectric 310 so that a part of the ground electrode 330 is exposed on the outer surface (side surfaces 311 and 312) of the dielectric 310. The ground electrode 330 has rectangular notches 331 at both ends in the first direction d1 so as not to contact the signal terminal 360, and is arranged at a predetermined distance from the signal terminal 360. Further, the ground electrode 330 is arranged at a predetermined distance from the side surfaces 313 and 314 so as not to be exposed to the side surfaces 313 and 314. Note that the ground electrode 330 may be provided on the bottom surface 316 of the dielectric 310 instead of inside the dielectric 310. Further, the ground electrode 330 may have a structure having an opening pattern, for example, a mesh structure instead of a solid pattern. By making the ground electrode 330 have a mesh structure, the dielectric materials 310 can be bonded to each other and the bonding strength can be increased.

When the multilayer device 300A is mounted on an electronic device, the ground electrode 330 is set to the ground potential via the ground terminal 370.

The ground terminal 370 is provided on side surfaces 311 and 312, which are the outer surfaces of the dielectric 310. Among the four ground terminals 371 to 374, one of the ground terminals 371 and 373 is provided on the side surface 311, and the other ground terminals 372 and 374 are provided on the side surface 312. One end of the ground electrode 330 is connected to one of the ground terminals 371 and 373, and the other end of the ground electrode 330 is connected to the other ground terminals 372 and 374. One ground terminal 371, 373 is arranged on both sides of one signal terminal 361 in the second direction d2. Further, the other ground terminals 372 and 374 are arranged on both sides of the other signal terminal 362 in the second direction d2. In other words, one signal terminal 361 is arranged between two ground terminals 371 and 373, and the other signal terminal 362 is arranged between two ground terminals 372 and 374.

Note that the number of ground terminals 370 is not limited to four, and may be two. One ground terminal 370 may be provided on each of the side surfaces 311 and 312 or the side surfaces 313 and 314 of the dielectric 310. For example, one ground terminal 370 may be provided on each side surface 311 and 312. In that case, it is desirable to arrange the ground terminals 370 diagonally so that there is no need to consider the mounting direction. Moreover, the ground terminal 370 may be provided not only on the side surfaces 311 and 312 but also on the side surfaces 313 and 314. Moreover, the ground terminal 370 may be provided only on the side surfaces 313 and 314. In that case, a part of the ground electrode 330 may be exposed to the side surfaces 313 and 314, and the ground terminal 370 may be connected to the exposed ground electrode 330.

The planar electrode 340 is provided inside the dielectric 310 so as to be located between the signal line 320 and the ground electrode 330 in the third direction d3. The planar electrode 340 is arranged parallel to the signal line 320 and the ground electrode 330. The gap between the planar electrode 340 and the signal line 320 is smaller than the gap between the ground electrode 330 and the signal line 320. The gap between the planar electrode 340 and the signal line 320 in this embodiment is, for example, 0.1 to 0.5 times the gap between the ground electrode 330 and the signal line 320, but the size of this gap is appropriately set according to the stop band required for the multilayer device 300A. The multiple planar electrodes 340 are planar electrodes having a rectangular shape. Note that the shape of the planar electrode 340 is not limited to a rectangle, and may be a square, a polygon, a circle, or an ellipse. The multiple planar electrodes 341, 342, and 343 are arranged at equal intervals in this order along the first direction d1. Each of the planar electrodes 341, 342, and 343 has the same shape and size. The gap between each of the planar electrodes 341, 342, and 343 and the signal line 320 is the same.

The connection electrode 350 is a conductor that connects the planar electrodes 340 and the ground electrode 330, and is provided inside the dielectric 310. The connection electrode 350 is located between the planar electrodes 340 and the ground electrode 330. The connection electrodes 351, 352, and 353 are arranged at equal intervals in this order along the first direction d1. The connection electrodes 351, 352, and 353 have the same shape and size. The connection electrodes 351 to 353 are provided along the first direction d1 so as to correspond one-to-one to the planar electrodes 341 to 343. Specifically, the connection electrode 351 is provided to connect the planar electrode 341 and the ground electrode 330, the connection electrode 352 is provided to connect the planar electrode 342 and the ground electrode 330, and the connection electrode 353 is provided to connect the planar electrode 343 and the ground electrode 330.

The connection electrode 350 has a coil shape at least in part. The connection electrode 350 shown in FIG. 4 has a rectangular coil shape. The coil shape is not limited to a rectangular shape, but may be circular. Further, the connection electrode 350 may have a meander shape at least in part. The meander shape is a meandering shape. Note that the meander shape may be a square wave shape, a triangular wave shape, a sine wave shape, or a circular arc wave shape. The meander shape may be provided in a patterning electrode 350p, which will be described later.

The connection electrode 350 includes a plurality of via electrodes 350v and one or more patterning electrodes 350p. FIG. 5B shows eight via electrodes as an example of the plurality of via electrodes 350v, and seven patterning electrodes 350p as an example of one or more patterning electrodes 350p.

Each via electrode 350v has a cylindrical shape and is formed to penetrate the dielectric layer. The via diameter of the via electrode 350v is, for example, 50 μm. Each via electrode 350v is located between the plane electrode 340 and the ground electrode 330. As shown in FIG. 5A, each via electrode 350v is arranged at a corner of the outer peripheral end of each plane electrode 340 when viewed from the third direction d3 perpendicular to the plane electrode 340. The plurality of via electrodes 350v are arranged alternately at diagonal corners of the planar electrode 340 in the third direction d3 from the ground electrode 330 toward the planar electrode 340. The plurality of via electrodes 350v are not directly connected to each other but are connected via patterning electrodes 350p.

One or more patterning electrodes 350p are provided between multiple dielectric layers, and electrically connect multiple via electrodes 350v that are scattered in the third direction d3. The width of the patterning electrodes 350p is, for example, 100 μm. Each patterning electrode 350p is L-shaped and has a pattern shape consisting of 0.5 turns.

Thus, the connection electrode 350 has a 3.5-turn spiral coil shape formed by eight via electrodes 350v and seven patterning electrodes 350p. The connection electrode 350 is not limited to a spiral coil, and may have a spiral coil shape. In this case, the ends of the via electrodes 350v and the patterning electrodes 350p may be disposed at the outer peripheral end and center of each planar electrode 340, respectively. Land patterns for connecting to the via electrodes 350v may be formed on both ends of the patterning electrodes 350p. The inductive component L50 (see FIG. 2) in the multilayer device 300A is generated by this connection electrode 350.

In this embodiment, the connection electrode 350 of the multilayer device 300A has at least a portion of a coil shape or a meander shape. Therefore, the connection electrode 350 can generate the inductive component L50 according to the coil shape or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil shape, and the inductance value can be lowered by decreasing the coil diameter or the number of turns of the coil shape. Since the value of the inductive component L50 can be changed by changing the inductance value, the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to required specifications.

In addition, although the example in which the multilayer device 300A is a mounted chip component mounted on a printed circuit board or the like has been shown above, the multilayer device 300A is not limited thereto. For example, the multilayer device 300A may have a configuration in which the dielectric 310, the signal line 320, the ground electrode 330, the planar electrode 340, and the connection electrode 350 are provided inside the printed circuit board as part of the printed circuit board.

[Multilayer device manufacturing method]
FIG. 6 is a diagram showing an example of the manufacturing process of the multilayer device 300A.

First, one or more green sheets without an electrode pattern are laminated to form a lower layer sheet. The green sheet is a dielectric sheet that becomes a dielectric layer after sintering. Next, a green sheet having a ground electrode pattern is laminated on the lower sheet. The ground electrode pattern is a printed pattern that becomes the ground electrode 330 after sintering. Next, a plurality of green sheets having a via electrode pattern and a plurality of green sheets having patterned electrode patterns are stacked on the green sheet having a ground electrode pattern. The via electrode pattern and the patterned electrode pattern are printed patterns that become connection electrodes 350 (see FIG. 6(a)) after sintering. Next, a green sheet having a via electrode pattern and a planar electrode pattern is laminated on the plurality of laminated green sheets. The planar electrode pattern is a printed pattern that becomes a planar electrode 340 (see FIG. 6(b)) after sintering. Next, a green sheet having a signal line pattern is laminated on the green sheet having the via electrode pattern and the planar electrode pattern. The signal line pattern is a printed pattern that becomes a signal line 320 (see (c) in FIG. 6) after sintering. Next, one or more green sheets having no electrode pattern are laminated on the green sheet having the signal line pattern to form an upper layer sheet.

The thus laminated sheet group is pressed to form a mother laminate. Next, the mother laminate is cut into pieces, and the separated laminate is sintered. Then, a signal terminal 360 and a ground terminal 370 are formed on the side surface of the sintered laminate. In this way, the multilayer device 300A described above is manufactured.

[Modification 1 of Embodiment 1]
The configuration of multilayer device 300B according to Modification 1 of Embodiment 1 will be described. In Modification 1, an example will be described in which the width of patterning electrode 350p is narrower than in Embodiment 1.

The multilayer device 300B according to the first modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connection electrodes 350. The multilayer device 300B also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the signal line 320, the ground electrode 330, the plurality of planar electrodes 340, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300B are the same as those of the first embodiment.

FIG. 7 is a diagram showing connection electrodes 350 and the like of a multilayer device 300B according to Modification 1. A ground electrode 330 is also shown in the figure.

As shown in FIG. 7, the width of the patterning electrode 350p of the first modification is narrower than the width of the patterning electrode 350p of the first embodiment. The width of patterning electrode 350p in Modification 1 shown in the figure is 25 μm, and as a result, the inductance value of connection electrode 350 in Modification 1 is higher than the inductance value of connection electrode 350 in Embodiment 1. ing.

Also in Modification 1, the connection electrode 350 of the multilayer device 300B has a coil shape at least in part. For example, by increasing the width of the patterning electrode 350p of the connection electrode 350, the inductance value of the connection electrode 350 can be decreased, and by decreasing the width of the patterning electrode 350p, the inductance value can be increased. Since the value of the inductive component L50 can be changed by changing the inductance value, the frequency of the stopband of the multilayer device 300B can be changed. This makes it possible to form a stop band according to required specifications.

[Effects of Embodiment 1 and Modification 1]
The effects of the multilayer devices 300A and 300B having the above configuration will be explained with reference to FIG. 8.

Note that the design conditions of the multilayer devices 300A and 300B are as shown below.

External dimensions of multilayer device: length 0.8 mm, width 0.6 mm, height 0.45 mm
Width of signal line 320: 0.05mm
Width of plane electrode 340 (length in second direction d2): 0.5 mm
Length of planar electrode 340 (length in first direction d1): 0.2 mm
Spacing between adjacent planar electrodes 340 in the first direction d1: 0.05 mm
Number of turns of connection electrode 350: 3.5 turns Via diameter of via electrode 350v: 100 μm
Width of patterning electrode 350p of multilayer device 300A: 100 μm
Width of patterning electrode 350p of multilayer device 300B: 25 μm
Each thickness of the signal line 320, ground electrode 330, and plane electrode 340: 10 μm
Thickness of dielectric 310 below ground electrode 330: 35 μm
Distance between ground electrode 330 and plane electrode 340: 320 μm
Distance between plane electrode 340 and signal line 320: 25 μm
Thickness of dielectric 310 above signal line 320: 70 μm
Relative permittivity of dielectric 310: 4.1
Dielectric loss tangent of dielectric 310: 0.015

The transmission characteristics of the multilayer device under these design conditions will be explained.

FIG. 8 is a diagram showing the transmission characteristics of the multilayer device according to the first embodiment and the first modification. The vertical axis of the figure shows the S parameter (S21).

As shown in FIG. 8, the multilayer device 300A of the first embodiment has an attenuation pole near a frequency of 20.5 GHz, and the insertion loss is greatest at this attenuation pole. The multilayer device 300A is capable of blocking passage of a signal with a frequency of 20.5 GHz. The multilayer device 300B of the first modification has an attenuation pole near a frequency of 11 GHz, which is lower than the stop band of the multilayer device 300A, and the insertion loss is greatest at this attenuation pole. The multilayer device 300B is capable of blocking passage of a signal with a frequency of 11 GHz.

By changing the coil shape of the connection electrode 350 as in these multilayer devices 300A and 300B, the frequency of the stop band of the multilayer device can be changed. This makes it possible to form a stop band according to required specifications.

[Modification 2 of Embodiment 1]
The configuration of a multilayer device 300C according to a second modification of the first embodiment will be described. In modification 2, an example in which the signal line 320 has a meander shape will be described.

The multilayer device 300C according to the second modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of planar electrodes 340, and a plurality of connection electrodes 350. The multilayer device 300C also includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the ground electrode 330, the plurality of planar electrodes 340, the plurality of connection electrodes 350, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300C are the same as those of the first embodiment.

FIG. 9 is a diagram showing a signal line 320, a plane electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300C according to modification 2. FIG. 10A is a top plan view of the signal line 320 and the like of the multilayer device 300C. FIG. 10B is a cross-sectional view of the multilayer device 300C taken along the line XB-XB shown in FIG. 10A. FIG. 10C is a bottom view of multilayer device 300C.

Figure 9 shows the multilayer device 300C without the signal terminals 361, 362, the ground terminals 371, 372, 373, 374, and the dielectric 310. In Figure 10A, the signal line 320 is shown with a solid line, and the planar electrodes, connection electrodes, and ground electrodes are omitted. In Figure 10C, the signal line, planar electrodes, and connection electrodes are omitted.

The signal line 320 of Modification 2 has a meander shape at least in part. The meander shape is a meandering shape. The signal line 320 shown in FIG. 9 has a meandering square wave shape. Note that the meander shape is not limited to a square wave shape, and may be a triangular wave shape, a sine wave shape, or an arcuate wave shape. Further, the meander shape may be a pulse wave shape that is convex or concave in the second direction d2.

The signal line 320 has meander line portions 321, 322, and 323, which are meander-shaped areas. The meander line sections 321, 322, and 323 are arranged in this order along the first direction d1 from the input side to the output side of the signal line 320. The meander line portions 321, 322, 323 are provided in one-to-one correspondence with the planar electrodes 341, 342, 343. Specifically, the meander line portion 321 corresponds to the planar electrode 341, the meander line portion 322 corresponds to the planar electrode 342, and the meander line portion 323 corresponds to the planar electrode 343.

In other words, the meander line portions 321, 322, and 323 are provided at positions facing the planar electrodes 341, 342, and 343, respectively. That is, when viewed from the direction perpendicular to the plane electrode 340, that is, the third direction d3, the meander line section 321 overlaps the plane electrode 341, the meander line section 322 overlaps the plane electrode 342, and the meander line section 323 overlaps the plane electrode 343. It overlaps with In this example, the length of each meander line portion 321-323 in the second direction d2 is the same as the length of each planar electrode 341-343 in the second direction d2. The length of each meander line portion 321 to 323 in the first direction d1 is shorter than the length of each of the planar electrodes 341 to 343 in the first direction d1. Capacitive component C40 (see FIG. 2) in multilayer device 300C is generated in areas where meander line portions 321, 322, 323 and planar electrodes 341, 342, 343 face each other.

Further, the signal line 320 has a plurality of connecting line sections 326, 327, 328, and 329 each having a linear shape. The connecting line section 326 connects the signal terminal 361 and the meander line section 321. The connecting line portion 327 connects the meander line portions 321 and 322 adjacent to each other in the first direction d1. The connecting line portion 328 connects the meander line portions 322 and 323 adjacent to each other in the first direction d1. The connecting line section 329 connects the meander line section 323 and the signal terminal 362. The meander line sections 321 to 323 are connected in series by connection line sections 326 to 329.

In the second modification, the connection electrode 350 of the multilayer device 300C also has at least a portion that is coil-shaped or meander-shaped. Therefore, the connection electrode 350 can generate an inductive component L50 that corresponds to the coil shape or meander shape. For example, the value of the inductive component L50 can be changed by changing this inductance value, and therefore the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stop band according to the required specifications.

Furthermore, in Modification 2, the signal line 320 of the multilayer device 300C has a meander shape at least in part. Therefore, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 according to the meander shape. For example, by increasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased, and by decreasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased. can be reduced. Since the value of the capacitive component C40 can be changed by changing the opposing area, the frequency of the stopband of the multilayer device 300C can be changed. This makes it possible to form a stop band according to required specifications.

[Third Modification of First Embodiment]
A description will be given of the configuration of a multilayer device 300D according to Modification 3 of the first embodiment. In Modification 3, an example will be described in which the width of a patterned electrode 350p is narrower than that of Modification 2.

A multilayer device 300D according to modification 3 includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of plane electrodes 340, and a plurality of connection electrodes 350. Furthermore, the multilayer device 300D includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the signal line 320, the ground electrode 330, the plurality of plane electrodes 340, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300D are the same as in the second modification.

FIG. 11 is a diagram showing a signal line 320, a plane electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300D according to Modification Example 3.

As shown in FIG. 11, the width of the patterning electrode 350p of the third modification is narrower than the width of the patterning electrode 350p of the second modification. The width of the patterning electrode 350p in Modification 3 shown in the figure is 25 μm, and the inductance value of the connection electrode 350 in Modification 3 is consequently higher than the inductance value of the connection electrode 350 in Modification 2. There is.

In the third modification, the connection electrode 350 of the multilayer device 300D also has at least a portion that is coil-shaped. For example, by widening the width of the patterned electrode 350p of the connection electrode 350, the inductance value of the connection electrode 350 can be reduced, and by narrowing the width of the patterned electrode 350p, the inductance value can be increased. By changing the inductance value, the value of the inductive component L50 can be changed, and therefore the frequency of the stop band of the multilayer device 300D can be changed. This makes it possible to form a stop band according to the required specifications.

[Effects of Modification 2 and Modification 3, etc.]
In order to confirm the effects of Modifications 2 and 3, a multilayer device 300Z, which is a reference example, will be described. In the multilayer device 300Z of the reference example, the connection electrode 350 is not a coil shape but a straight via conductor.

Figure 12 is a diagram showing the signal line 320, planar electrode 340, ground electrode 330, and connection electrode 350Z of the multilayer device 300Z in the reference example.

The connection electrode 350Z of the reference example is a via conductor that connects the plurality of plane electrodes 340 and the ground electrode 330, and is provided inside the dielectric 310 (not shown). The connection electrode 350Z has a columnar shape and is formed to penetrate the dielectric 310 located between the plurality of plane electrodes 340 and the ground electrode 330. Each connection electrode 350Z has the same shape and size. The connection electrodes 350Z are arranged at equal intervals in this order along the first direction d1 so as to correspond one-to-one to each plane electrode 340.

The effects of the multilayer devices 300C, 300D, and 300Z having the above configuration will be explained with reference to the drawings.

Note that the design conditions of the multilayer devices 300C, 300D, and 300Z are as shown below.

External dimensions of multilayer device: length 0.8 mm, width 0.6 mm, height 0.45 mm
Width of signal line 320: 0.05mm
Meander L/S: 0.025mm/0.025mm
Length of each connecting line portion 326, 329: 0.0625mm
Length of each connecting line portion 327, 328: 0.1 mm
Width of plane electrode 340 (length in second direction d2): 0.5 mm
Length of planar electrode 340 (length in first direction d1): 0.2 mm
Spacing between adjacent planar electrodes 340 in the first direction d1: 0.05 mm
Number of turns of connection electrode 350: 3.5 turns Via diameter of via electrode 350v: 100 μm
Width of patterning electrode 350p of multilayer device 300C: 100 μm
Width of patterning electrode 350p of multilayer device 300D: 25 μm
Each thickness of the signal line 320, ground electrode 330, and plane electrode 340: 10 μm
Thickness of dielectric 310 below ground electrode 330: 35 μm
Distance between ground electrode 330 and plane electrode 340: 320 μm
Distance between plane electrode 340 and signal line 320: 25 μm
Thickness of dielectric 310 above signal line 320: 70 μm
Relative permittivity of dielectric 310: 4.1
Dielectric loss tangent of dielectric 310: 0.015

The transmission characteristics of the multilayer device under these design conditions will be explained.

FIG. 13 is a diagram showing transmission characteristics of multilayer devices according to Modification 2, Modification 3, and Reference Example of Embodiment 1. The vertical axis of the figure shows the S parameter (S21).

As shown in FIG. 13, the multilayer device 300C of the second modification has attenuation poles at a frequency near 14 GHz, which is lower than the stopband of the multilayer device 300Z of the reference example, and at a frequency near 29 GHz, which is higher. Furthermore, the multilayer device 300C has a larger attenuation amount at the attenuation pole than the multilayer device 300Z. The multilayer device 300C is capable of blocking signals with frequencies of 14 GHz and 29 GHz from passing through.

The multilayer device 300D of Modification 3 has an attenuation pole near a frequency of 7.5 GHz, which is lower than the stopband of the multilayer device 300C, and the insertion loss is greatest at this attenuation pole. The multilayer device 300D has a larger amount of attenuation at the attenuation pole than the multilayer device 300Z. The multilayer device 300D is capable of blocking passage of a signal with a frequency of 7.5 GHz.

Even when the signal line 320 has a meander shape as in these multilayer devices 300C and 300D, the frequency of the stop band of the multilayer device can be changed by changing the coil shape of the connection electrode 350. This makes it possible to form a stop band according to required specifications. Further, since the connection electrodes 350 of the multilayer devices 300C and 300D have a coil shape, the amount of attenuation at the attenuation pole can be increased compared to the reference example multilayer device 300Z.

(Embodiment 2)
[Multi-layer device configuration]
The configuration of multilayer device 300E according to Embodiment 2 will be described with reference to FIGS. 14 and 15. In the second embodiment, an example in which multilayer device 300E is a common mode filter will be described.

FIG. 14 is an external view of a multilayer device 300E according to the second embodiment. FIG. 15 is a diagram showing the signal line 320, plane electrode 340, ground electrode 330, and connection electrode 350 of the multilayer device 300E.

The multilayer device 300E shown in FIG. 14 and FIG. We are prepared. The multilayer device 300E also includes a plurality of signal terminals 361, 362, 363, and 364, and a plurality of ground terminals 371, 372, 373, and 374. The configurations of dielectric 310, ground electrode 330, planar electrode 340, connection electrode 350, and ground terminals 371 to 374 of multilayer device 300E are the same as in the first embodiment.

The signal line 320 of the second embodiment is a differential line configured by two parallel signal lines 320a and 320b provided inside the dielectric 310. Each signal line 320a, 320b is linear and provided along the first direction d1. Each signal line 320a, 320b is strip-shaped and arranged parallel to the plane electrode 340 and the ground electrode 330. When the multilayer device 300E is mounted on an electronic device, differential signals are transmitted to the two signal lines 320a and 320b.

Four signal terminals 361 to 364 are provided on side surfaces 311 and 312 of dielectric 310. Among the four signal terminals 361 to 364, one signal terminal 361, 363 is provided on the side surface 311, and the other signal terminal 362, 364 is provided on the side surface 312. One end of a signal line 320a is connected to one signal terminal 361, and one end of a signal line 320b is connected to one signal terminal 363. The other signal terminal 362 is connected to the other end of the signal line 320a, and the other signal terminal 364 is connected to the other end of the signal line 320b. One signal terminal 361, 363 is arranged between two ground terminals 371, 373, and the other signal terminal 362, 364 is arranged between two ground terminals 372, 374.

Also in the second embodiment, the connection electrode 350 of the multilayer device 300E has at least a portion of the coil shape or meander shape. Therefore, the connection electrode 350 can generate the inductive component L50 according to the coil shape or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil shape, and the inductance value can be lowered by decreasing the coil diameter or the number of turns of the coil shape. Since the value of the inductive component L50 can be changed by changing the inductance value, the frequency of the stop band of the multilayer device 300E can be changed. This makes it possible to form a stop band according to required specifications.

[First Modification of the Second Embodiment]
A description will be given of the configuration of a multilayer device 300F according to a first modification of the second embodiment. In this first modification, an example will be described in which the signal line 320 has a meandering shape.

The multilayer device 300F according to the first modification includes a dielectric 310, a signal line 320, a ground electrode 330, a plurality of plane electrodes 340, and a plurality of connection electrodes 350. Moreover, the multilayer device 300F includes a plurality of signal terminals 360 and a plurality of ground terminals 370. The configurations of the dielectric 310, the ground electrode 330, the plurality of plane electrodes 340, the plurality of connection electrodes 350, the plurality of signal terminals 360, and the plurality of ground terminals 370 of the multilayer device 300F are the same as in the second embodiment.

FIG. 16 is a diagram showing a signal line 320, a plane electrode 340, a ground electrode 330, and a connection electrode 350 of a multilayer device 300F according to Modification 1.

The signal line 320 is a differential line configured by two parallel signal lines 320a and 320b provided inside the dielectric 310. Each signal line 320a, 320b has a meander shape at least in part. Each signal line 320a, 320b is arranged parallel to the plane electrode 340 and the ground electrode 330. When the multilayer device 300F is mounted on an electronic device, differential signals are transmitted to the two signal lines 320a and 320b.

In the first modification of the second embodiment, the signal line 320 of the multilayer device 300F has at least a portion having a meander shape. Therefore, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 according to the meander shape. For example, the opposing area between the signal line 320 and the planar electrode 340 can be increased by increasing the area formed by the meander shape, and the opposing area between the signal line 320 and the planar electrode 340 can be reduced by decreasing the area formed by the meander shape. Since the value of the capacitive component C40 can be changed by changing the opposing area, the frequency of the stop band of the multilayer device 300F can be changed. This makes it possible to form a stop band according to the required specifications.

(summary)
A multilayer device 300A according to the present embodiment includes a dielectric 310, a signal line 320 provided inside the dielectric 310 so that a portion is exposed on the outer surface of the dielectric 310, and a signal line 320 that is at least partially made of the dielectric. A ground electrode 330 provided inside or on the outside of the dielectric 310 so as to be exposed on the outside of the dielectric 310; A plurality of planar electrodes 340 arranged along the first direction d1 toward the output side, a plurality of connection electrodes 350 provided inside the dielectric 310 and connecting the plurality of planar electrodes 340 and the ground electrode 330, and a dielectric It includes a plurality of signal terminals 360 provided on the outer surface of the body 310 and connected to the signal line 320, and a plurality of ground terminals 370 provided on the outer surface of the dielectric 310 and connected to the ground electrode 330. The connection electrode 350 has a coil shape or a meander shape at least in part.

Because the connection electrode 350 has at least a portion in a coil shape or a meander shape, the connection electrode 350 can generate an inductive component L50 according to the coil shape or meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter of the coil shape or the number of turns, and the inductance value can be decreased by decreasing the coil diameter of the coil shape or the number of turns. Since the value of the inductive component L50 can be changed by changing the inductance value, the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications required of the multilayer device 300A.

Further, when forming an electrode structure consisting of the signal line 320, the ground electrode 330, the plane electrode 340, and the connection electrode 350 inside the printed circuit board, the printed circuit board needs to have a multilayer structure. On the other hand, instead of forming the electrode structure inside the printed circuit board, the multilayer device 300A including the electrode structure described above is used as an electronic component to be mounted on the printed circuit board. The number of layers on the circuit board can be reduced. Thereby, it is possible to suppress an increase in the cost of the printed circuit board.

The connection electrode 350 may also be composed of a plurality of via electrodes 350v located between the planar electrode 340 and the ground electrode 330, and one or more patterned electrodes 350p that electrically connect the plurality of via electrodes 350v.

According to this, a coil shape can be formed by the connection electrode 350 constituted by the via electrode 350v and the patterning electrode 350p. Therefore, the connection electrode 350 can generate the inductive component L50 according to the coil shape. For example, by changing the coil diameter or the number of turns of the coil shape, the value of the inductive component L50 can be changed, so the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications for the multilayer device 300A.

Further, the dielectric 310 provided between the plurality of plane electrodes 340 and the ground electrode 330 is formed of a plurality of dielectric layers, the via electrode 350v penetrates the dielectric layer, and the patterning electrode 350p has a plurality of dielectric layers. It may be provided between dielectric layers.

According to this, a spiral coil shape can be formed by the connection electrode 350. Therefore, the connection electrode 350 can generate the inductive component L50 according to the coil shape. For example, by changing the coil diameter or the number of turns of the coil shape, the value of the inductive component L50 can be changed, so the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications for the multilayer device 300A.

Moreover, the signal line 320 may have a meander shape at least in part.

Since the signal line 320 has a meander shape in this way, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 according to the meander shape. For example, by increasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased, and by decreasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased. can be reduced. Since the value of the capacitive component C40 can be changed by changing the opposing area, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stop band according to the required specifications for the multilayer device 300C.

Further, the signal line 320 may include a meander line portion (for example, 321) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 341).

In this way, by arranging the meander line portion (e.g., 321) in a position opposite the planar electrode (e.g., 341), the meander line portion 321 and the planar electrode 341 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stop band according to the required specifications required of the multilayer device 300C.

Furthermore, the signal line 320 may be configured by two parallel lines provided on the dielectric 310.

According to this, it becomes possible to use the multilayer device 300E as a common mode filter.

Furthermore, the two parallel lines may be differential lines through which differential signals are transmitted.

According to this, it is possible to provide a multilayer device 300E having the function of a common mode filter.

The multilayer device 300A according to the present embodiment includes a signal line 320 that transmits a signal, a ground electrode 330 that is set to the ground potential, and a line that is parallel to the ground electrode 330 and extends from the input side to the output side of the signal line 320. A plurality of planar electrodes 340 arranged along the first direction d1, a dielectric 310 provided between each of the signal line 320, a plurality of planar electrodes 340 and a ground electrode 330, and a plurality of planar electrodes 340 and A plurality of connection electrodes 350 are located between the ground electrodes 330 and connect the plurality of plane electrodes 340 and the ground electrodes 330. The connection electrode 350 has a coil shape or a meander shape at least in part.

In this way, since the connection electrode 350 has at least a portion of the coil shape or the meander shape, the connection electrode 350 can generate the inductive component L50 according to the coil shape or the meander shape. For example, the inductance value of the connection electrode 350 can be increased by increasing the coil diameter or the number of turns of the coil shape, and the inductance value can be lowered by decreasing the coil diameter or the number of turns of the coil shape. Since the value of the inductive component L50 can be changed by changing the inductance value, the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications for the multilayer device 300A.

Further, the connection electrode 350 may include a plurality of via electrodes 350v located between the plane electrode 340 and the ground electrode 330, and one or more patterning electrodes 350p that electrically connect the plurality of via electrodes 350v. .

According to this, a coil shape can be formed by the connection electrode 350 constituted by the via electrode 350v and the patterning electrode 350p. Therefore, the connection electrode 350 can generate the inductive component L50 according to the coil shape. For example, by changing the coil diameter or the number of turns of the coil shape, the value of the inductive component L50 can be changed, so the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications for the multilayer device 300A.

Further, the dielectric 310 provided between the plurality of plane electrodes 340 and the ground electrode 330 is formed of a plurality of dielectric layers, the via electrode 350v penetrates the dielectric layer, and the patterning electrode 350p has a plurality of dielectric layers. It may be provided between dielectric layers.

This allows the connection electrode 350 to form a spiral coil shape. Therefore, the connection electrode 350 can generate an inductive component L50 according to the coil shape. For example, the value of the inductive component L50 can be changed by changing the coil diameter or number of turns of the coil shape, and therefore the frequency of the stop band of the multilayer device 300A can be changed. This makes it possible to form a stop band according to the required specifications required for the multilayer device 300A.

Moreover, the signal line 320 may have a meander shape at least in part.

Since the signal line 320 has a meander shape in this way, the signal line 320 and the planar electrode 340 can generate a capacitive component C40 according to the meander shape. For example, by increasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased, and by decreasing the area formed by the meander shape, the area where the signal line 320 and the plane electrode 340 face each other is increased. can be reduced. Since the value of the capacitive component C40 can be changed by changing the opposing area, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stopband according to the required specifications required for the multilayer device 300C.

Further, the signal line 320 may include a meander line portion (for example, 321) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 341).

By providing the meander line portion (for example, 321) at a position facing the plane electrode (for example, 341) in this way, the meander line portion 321 and the plane electrode 341 generate a capacitive component C40 according to the meander shape. can be generated. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 300C can be changed. This makes it possible to form a stopband according to the required specifications required for the multilayer device 300C.

(Other embodiments, etc.)
Although the multilayer device and the like according to the embodiment and each modification of the present disclosure have been described above, the present disclosure is not limited to the above embodiment and each modification. Unless departing from the gist of the present disclosure, various modifications that can be thought of by those skilled in the art may be made to the embodiment and each modification, and another constructed by combining some of the components of the embodiment and each modification. forms are also within the scope of this disclosure.

In the first embodiment, an example was shown in which the three planar electrodes 341 to 343 and the three connection electrodes 351 to 353 are arranged along the first direction d1, but the present invention is not limited thereto. The number of sets of one planar electrode and one connection electrode may be two, or four or more. That is, the multilayer device may have a configuration in which four or more planar electrodes and four or more connection electrodes are each arranged along the first direction d1.

In the first embodiment, an example is shown in which each of the connection electrodes 351, 352, and 353 has the same shape and the same size, but the size of each of the connection electrodes 351, 352, and 353 may be changed depending on the required specifications. You may. For example, by changing the diameter or length of the via electrode 350v to change the inductive component L50, the frequency of the stop band can be widened. For example, by changing the width or length of the patterning electrode 350p to change the inductive component L50, it is possible to widen the frequency of the stop band.

In the first embodiment, an example is shown in which the planar electrodes 341, 342, and 343 have the same shape and the same size. However, the size of each of the planar electrodes 341, 342, and 343 may be changed depending on the required specifications. You may. For example, by changing the capacitive component C40 generated in the opposing area of the signal line 320 and the plane electrode 340, the frequency of the stop band can be widened.

In Embodiment 1, an example is shown in which the gaps between each of the planar electrodes 341, 342, 343 and the signal line 320 are the same. The gap between the line 320 and the line 320 may be changed. For example, by changing the gap between the plane electrode 341 and the signal line 320, the gap between the plane electrode 342 and the signal line 320, and the gap between the plane electrode 343 and the signal line 320 to change the capacitive component C40, the frequency of the stop band can be changed. can be made broadband.

The multilayer device according to the present disclosure is useful as a multilayer device used in various electronic devices and communication systems.

1, 300A, 300B, 300C, 300D, 300E, 300F Multilayer device 310 Dielectric 311, 312, 313, 314 Side surface 316 Bottom surface 317 Top surface 320, 320a, 320b Signal line 321, 322, 323 Meander line section 326, 327, 328, 329 Connection line section 330 Ground electrode 331 Notch 340, 341, 342, 343 Plane electrode 350, 351, 352, 353 Connection electrode 350p Patterning electrode 350v Via electrode 360, 361, 362, 363, 364 Signal terminal 370, 371 , 372, 373, 374 Ground terminal d1 First direction d2 Second direction d3 Third direction

Claims (12)

dielectric and
a signal line provided inside the dielectric so that a portion thereof is exposed on the outer surface of the dielectric;
a ground electrode provided on the inside or outside of the dielectric so that at least a portion thereof is exposed on the outside of the dielectric;
a plurality of planar electrodes provided inside the dielectric, parallel to the ground electrode, and arranged along a first direction from the input side to the output side of the signal line;
a plurality of connection electrodes provided inside the dielectric and connecting the plurality of plane electrodes and the ground electrode;
a plurality of signal terminals provided on the outer surface of the dielectric and connected to the signal line;
a plurality of ground terminals provided on the outer surface of the dielectric and connected to the ground electrode;
Equipped with
The connection electrode has a coil shape or a meander shape at least in part. A multilayer device. The multilayer device according to claim 1 , wherein the connection electrodes are composed of a plurality of via electrodes located between the planar electrode and the ground electrode, and one or more patterned electrodes electrically connecting the plurality of via electrodes. The dielectric provided between the plurality of plane electrodes and the ground electrode is formed of a plurality of dielectric layers,
the via electrode penetrates the dielectric layer,
The patterning electrode is provided between the plurality of dielectric layers,
Multilayer device according to claim 2. The multilayer device according to claim 1, wherein at least a portion of the signal line has a meandering shape. the signal line includes a meander line portion having the meander shape,
The multilayer device according to claim 4 , wherein the meander line portion is provided at a position facing the planar electrode. 6. The multilayer device according to claim 1, wherein the signal line is composed of two parallel lines provided in the dielectric. The multilayer device according to claim 6, wherein the two parallel lines are differential lines through which differential signals are transmitted. A signal line that transmits signals,
a ground electrode set to ground potential;
a plurality of planar electrodes parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line;
a dielectric provided between each of the signal line, the plurality of plane electrodes, and the ground electrode;
a plurality of connection electrodes located between the plurality of plane electrodes and the ground electrode and connecting the plurality of plane electrodes and the ground electrode;
Equipped with
The connection electrode has a coil shape or a meander shape at least in part. A multilayer device. The connection electrode is configured by a plurality of via electrodes located between the plane electrode and the ground electrode, and one or more patterning electrodes that electrically connect the plurality of via electrodes. Multilayer device. The dielectric provided between the plurality of plane electrodes and the ground electrode is formed of a plurality of dielectric layers,
the via electrode penetrates the dielectric layer,
The patterning electrode is provided between the plurality of dielectric layers,
Multilayer device according to claim 9. The multilayer device according to any one of claims 8 to 10, wherein at least a portion of the signal line has a meandering shape. The signal line includes a meander line portion having the meander shape,
The multilayer device according to claim 11, wherein the meander line portion is provided at a position facing the planar electrode.

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