JP2024041036A - Multilayer substrate and antenna module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease a difference between a radiation pattern of a first high frequency signal and a radiation pattern of a second high frequency signal and to suppress inclination of the radiation direction of the first high frequency signal and a radiation direction of the second high frequency signal from a normal direction of a principal surface of a radiation conductor layer.

SOLUTION: A first wiring layer is electrically connected to a first radiation conductor layer at a first feeding point located nearest a first straight line of a first outer edge and crosses a first straight line not at right angles seen in a Z axis direction. The second wiring layer is electrically connected to a first radiation conductor layer at a second feeding point positioned nearest the second straight line of the first outer edge, and crosses the second straight line not at right angles seen from the Z axis direction.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a multilayer substrate including a radiation conductor layer and an antenna module.

As an invention related to a conventional multilayer board, an antenna module described in Patent Document 1 is known. This antenna module includes a radiation conductor layer, a first feeding point, and a second feeding point. The first high frequency signal is input to the radiation conductor layer via the first feeding point. The radiation conductor layer radiates the first high frequency signal. The second high frequency signal is input to the radiation conductor layer via the second feeding point. The radiation conductor layer radiates the second high frequency signal. The direction of polarization of the first high frequency signal is different from the direction of polarization of the second high frequency signal.

JP2021-83121A

By the way, in the field of the antenna module described in Patent Document 1, it is desired to reduce the difference between the radiation pattern of the first high frequency signal and the radiation pattern of the second high frequency signal, and also to reduce the difference between the radiation direction of the first high frequency signal and the radiation direction of the second high frequency signal. There is a desire to suppress tilting of the radiation direction from the normal direction of the main surface of the radiation conductor layer.

Therefore, an object of the present invention is to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and to form a structure in which the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are arranged in a radiation conductor layer. An object of the present invention is to provide a multilayer substrate and an antenna module that can suppress tilting from the normal direction of the main surface of the antenna module.

A multilayer substrate according to one embodiment of the present invention includes:
A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
a ground provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer, and overlapping with the first radiation conductor layer when viewed in the Z-axis direction; a conductor layer;
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a first feeding point located closest to the first straight line, and is not perpendicular to the first straight line when viewed in the Z-axis direction. The first wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a second feeding point located closest to the second straight line, and is not orthogonal to the second straight line when viewed in the Z-axis direction. The second wiring layer intersects as shown in FIG.
It is equipped with

An antenna module according to one embodiment of the present invention includes:
a first substrate;
a second substrate having flexibility;
It is equipped with
The first substrate is
a first laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the first laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
is provided in the first laminate, is located on the negative side of the Z-axis from the first radiation conductor layer, and is located closest to the first straight line within the first outer edge. a first wiring layer that is electrically connected to the first radiation conductor layer at a first feeding point located at a first feeding point, and that intersects the first straight line in a non-perpendicular manner when viewed in the Z-axis direction; ,
Provided in the first laminate, located on the negative side of the Z axis from the first radiation conductor layer, and located closest to the second straight line within the first outer edge. a second wiring layer that is electrically connected to the first radiation conductor layer at a second feeding point that is connected to the second line and that intersects the second straight line in a non-perpendicular manner when viewed in the Z-axis direction; and,
It contains
The second substrate is
a second laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a seventh wiring layer provided in the second laminate and electrically connected to the first wiring layer;
an eighth wiring layer provided in the second laminate and electrically connected to the second wiring layer;
The first layer is provided in the second laminate, is located on the negative side of the Z-axis from the seventh wiring layer and the eighth wiring layer, and is located on the negative side of the Z-axis when viewed in the Z-axis direction. a radiation conductor layer, a ground conductor layer overlapping with the seventh wiring layer and the eighth wiring layer;
It contains
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction,
The second substrate is located on the negative side of the Z-axis from the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.

According to the present invention, it is possible to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are the main directions of the radiation conductor layer. It is possible to suppress tilting from the normal direction of the surface.

FIG. 1 is an exploded perspective view of the multilayer substrate 10. FIG. 2 is a diagram of the multilayer substrate 10 seen from above. FIG. 3 is a cross-sectional view of the multilayer substrate 10. FIG. 4 is a cross-sectional view of the multilayer substrates 10 and 110. FIG. 5 is a top view of the multilayer substrate 110. FIG. 6 is a cross-sectional view of the multilayer substrate 110. FIG. 7 is a top view of the multilayer substrate 10a. FIG. 8 is a top view of the multilayer substrate 10b. FIG. 9 is a top view of the multilayer substrate 10c. FIG. 10 is a top view of the multilayer substrate 10d. FIG. 11 is an exploded perspective view of the multilayer substrate 10e. FIG. 12 is a top view of the multilayer substrate 10e. FIG. 13 is a top view of the multilayer substrate 10f. FIG. 14 is an exploded perspective view of the multilayer substrate 10g. FIG. 15 is a cross-sectional view of the multilayer substrate 10g. FIG. 16 is an exploded perspective view of the multilayer substrate 10h. FIG. 17 is a cross-sectional view of the multilayer substrate 10h. FIG. 18 is a top view of the multilayer substrate 10i. FIG. 19 is a top view of the multilayer substrate 10j. FIG. 20 is a top view of the multilayer substrate 10k. FIG. 21 is a cross-sectional view of the antenna module 100. FIG. 22 is an exploded perspective view of the multilayer substrate 210. FIG. 23 is a cross-sectional view of the antenna module 100a.

(Embodiment)
[Structure of multilayer substrate 10]
The structure of a multilayer substrate 10 according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of the multilayer substrate 10. FIG. 2 is a diagram of the multilayer substrate 10 seen from above. FIG. 3 is a cross-sectional view of the multilayer substrate 10. FIG. 3 is a cross-sectional view taken along line AA in FIG.

Below, the lamination direction of the laminated body 12 is defined as the up-down direction. The up-down direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z axis. The downward direction is the negative direction of the Z axis. When looking at the stacked body 12 in the vertical direction, the two directions in which the sides of the stacked body 12 extend are defined as the left-right direction and the front-back direction, respectively. The left-right direction is perpendicular to the up-down direction. The front-rear direction is orthogonal to the up-down direction and the left-right direction. The left-right direction coincides with the X-axis direction. The right direction is the positive direction of the X axis. The left direction is the negative direction of the X axis. The front-back direction coincides with the Y-axis direction. The forward direction is the positive direction of the Y axis. The rear direction is the negative direction of the Y axis. Therefore, the X, Y, and Z axes are orthogonal to each other. Note that the definition of direction in this specification is an example. Therefore, the direction in which the multilayer substrate 10 is actually used does not need to match the direction in this specification. Further, the vertical direction may be reversed in each drawing. Similarly, the left and right directions may be reversed in each drawing. The front and rear directions may be reversed in each drawing.

The multilayer substrate 10 is used, for example, in a wireless communication terminal such as a smartphone. As shown in FIG. 1, the multilayer substrate 10 includes a laminate 12, a first radiation conductor layer 16, a first wiring layer 20, a second wiring layer 22, external electrodes 24, 26, a ground conductor layer 28, and an annular ground conductor layer. 30 and interlayer connection conductors v1 to v8. Each of the first radiation conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24, 26, the ground conductor layer 28, the annular ground conductor layer 30, and the interlayer connection conductors v1 to v8 are connected to the laminate 12. It is provided.

The laminate 12 has a plate shape. As shown in FIG. 1, the laminate 12 has a rectangular shape when viewed in the vertical direction. The laminate 12 has a structure in which insulator layers 14a to 14e and protective layers 15a and 15b are stacked in the vertical direction (Z-axis direction). The protective layer 15a, the insulator layers 14a to 14e, and the protective layer 15b are arranged in this order from top to bottom. The material of the insulator layers 14a to 14e is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 12 has flexibility. The protective layers 15a and 15b will be described later.

The first radiation conductor layer 16 radiates and/or receives a first high frequency signal. In this embodiment, the first radiation conductor layer 16 is located on the upper main surface of the insulator layer 14a. As shown in FIG. 1, the first radiation conductor layer 16 has a rectangular shape when viewed in the vertical direction. As shown in FIG. 1, the first radiation conductor layer 16 has a rhombus shape with diagonal lines extending in the front-rear direction and the left-right direction when viewed in the vertical direction.

Specifically, as shown in FIG. 2, the first radiation conductor layer 16 has a first straight line E1, a second straight line E2, and straight lines E101 and E102 (seventh straight line and It has a first outer edge EE1 including an eighth straight line). Further, the first portion EP1 is a portion of the first outer edge EE1 excluding the first straight line E1 and the second straight line E2. That is, the first portion EP1 is straight lines E101 and E102.

The first straight line E1 and the straight line E102 are parallel to each other. The second straight line E2 and the straight line E101 are parallel to each other. The second straight line E2 is perpendicular to the first straight line E1 when viewed in the vertical direction (Z-axis direction). The straight line E101 is orthogonal to the straight line E102 when viewed in the vertical direction (Z-axis direction). The right rear end (the end on the positive side of the X-axis) of the first straight line E1 is connected to the front right end (the end on the positive side of the X-axis) of the second straight line E2. The left front end of the first straight line E1 is connected to the right front end of the straight line E101. The left rear end of the second straight line E2 is connected to the right rear end of the straight line E102. The left rear end of the straight line E101 is connected to the left front end of the straight line E102.

The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are equal to each other. The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are, for example, 1/2 of the wavelength of the first high-frequency signal.

As shown in FIGS. 1 and 3, the ground conductor layer 28 is located below the first radiation conductor layer 16 (on the negative side of the Z axis). The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14e. As shown in FIG. 1, the ground conductor layer 28 has a rectangular shape when viewed in the vertical direction. The long side of the ground conductor layer 28 extends in the left-right direction. The short side of the ground conductor layer 28 extends in the front-back direction. The ground conductor layer 28 overlaps with the first radiation conductor layer 16 when viewed in the vertical direction. Ground conductor layer 28 is connected to ground potential.

As shown in FIGS. 1 and 3, the annular ground conductor layer 30 is located above the ground conductor layer 28 (on the positive side of the Z-axis). In this embodiment, the vertical position of the annular ground conductor layer 30 is the same as the vertical position of the first radiation conductor layer 16. Therefore, the annular ground conductor layer 30 is located on the upper main surface of the insulator layer 14a.

Further, the annular ground conductor layer 30 has a ring shape surrounding the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction). The outer edge and inner edge of the annular ground conductor layer 30 have a rectangular shape with two sides extending in the front-rear direction and two sides extending in the left-right direction. The annular ground conductor layer 30 is connected to a ground potential.

Here, as shown in FIG. 2, distances L1 to L4 are defined as described below. Distance L1 (first distance), distance L2 (second distance), distance L3 (third distance), and distance L4 (fourth distance) are equal to each other.
Distance L1: Distance from the center of the first straight line E1 to the annular ground conductor layer 30 in the direction perpendicular to the first straight line E1
Distance L2: Distance from the center of the second straight line E2 to the annular ground conductor layer 30 in the direction perpendicular to the second straight line E2
Distance L3: Distance from the center of the straight line E101 (seventh straight line) to the annular ground conductor layer 30 in the direction perpendicular to the straight line E101 (seventh straight line)
Distance L4: Distance from the center of the straight line E102 (eighth straight line) to the annular ground conductor layer 30 in the direction perpendicular to the straight line E102 (eighth straight line). It is located below the radiation conductor layer 16 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). In this embodiment, the first wiring layer 20 is located on the upper main surface of the insulator layer 14d. The first wiring layer 20 has a linear shape extending in the horizontal direction when viewed in the vertical direction. The left end of the first wiring layer 20 overlaps with the first radiation conductor layer 16 when viewed in the vertical direction. The right end of the first wiring layer 20 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction. Thereby, the first wiring layer 20 intersects the first straight line E1 so as not to be orthogonal to the first line E1 when viewed in the vertical direction (Z-axis direction). In this embodiment, the angle θ1 formed by the first wiring layer 20 and the first straight line E1 is 45 degrees. However, the angle θ1 is not limited to 45 degrees, but may be greater than 0 degrees and smaller than 90 degrees. The angle θ1 is, for example, 45 degrees ±22.5 degrees.

Further, as shown in FIG. 2, the area through which the first straight line E1 passes when the first straight line E1 is moved in a direction orthogonal to the first straight line E1 when viewed in the vertical direction (Z-axis direction) is One area is defined as A1. The first wiring layer 20 straddles the first region A1 and a region outside the first region A1 when viewed in the vertical direction (Z-axis direction). The left end of the first wiring layer 20 is located in the first area A1 when viewed in the vertical direction. The right end of the first wiring layer 20 is located outside the first area A1 when viewed in the vertical direction.

The second wiring layer 22 is located below the first radiation conductor layer 16 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). In this embodiment, the second wiring layer 22 is located on the upper main surface of the insulator layer 14d. Further, the second wiring layer 22 is located after the first wiring layer 20 when viewed in the vertical direction. The second wiring layer 22 has a linear shape extending in the horizontal direction when viewed in the vertical direction. Therefore, the second wiring layer 22 is parallel to the first wiring layer 20. The left end of the second wiring layer 22 overlaps with the first radiation conductor layer 16 when viewed in the vertical direction. The right end of the second wiring layer 22 does not overlap with the first radiation conductor layer 16 when viewed in the vertical direction. Thereby, the second wiring layer 22 intersects the second straight line E2 so as not to be orthogonal to the second straight line E2 when viewed in the vertical direction (Z-axis direction). In this embodiment, the angle θ2 formed by the second wiring layer 22 and the second straight line E2 is 45 degrees. However, the angle θ2 is not limited to 45 degrees, but may be greater than 0 degrees and smaller than 90 degrees. The angle θ2 is, for example, 45 degrees ±22.5 degrees.

Further, as shown in FIG. 2, when the second straight line E2 is moved in a direction perpendicular to the second straight line E2 when viewed in the vertical direction (Z-axis direction), the area through which the second straight line E2 passes is the second straight line E2. Two areas are defined as A2. The second wiring layer 22 straddles the second region A2 and a region outside the second region A2 when viewed in the vertical direction (Z-axis direction). The left end of the second wiring layer 22 is located in the second area A2 when viewed in the vertical direction. The right end of the second wiring layer 22 is located outside the second area A2 when viewed in the vertical direction.

As shown in FIG. 1, the external electrodes 24 and 26 are provided on the lower main surface of the insulator layer 14e. The external electrodes 24 and 26 are not in contact with the ground conductor layer 28. Therefore, the external electrodes 24 and 26 are located within the opening provided in the ground conductor layer 28.

The external electrode 24 overlaps the right end portion of the first wiring layer 20 when viewed in the vertical direction. The external electrode 26 overlaps the right end portion of the second wiring layer 22 when viewed in the vertical direction. A first high frequency signal is input to or output from the external electrode 24 . A second high frequency signal is input to or output from the external electrode 26 .

The interlayer connection conductor v1 electrically connects the first radiation conductor layer 16 and the first wiring layer 20. More specifically, the interlayer connection conductor v1 vertically penetrates the insulator layers 14a to 14c. The upper end of the interlayer connection conductor v1 is in contact with the first radiation conductor layer 16 at the first feeding point P1. The first feeding point P1 is located closest to the first straight line E1 within the first outer edge EE1. In this embodiment, the first feeding point P1 is located closest to the midpoint of the first straight line E1 in the first straight line E1. The lower end of the interlayer connection conductor v1 is in contact with the left end portion of the first wiring layer 20. Thereby, the first wiring layer 20 is electrically connected to the first radiation conductor layer 16 at the first feeding point P1.

The interlayer connection conductor v2 electrically connects the first radiation conductor layer 16 and the second wiring layer 22. More specifically, the interlayer connection conductor v2 vertically penetrates the insulator layers 14a to 14c. The upper end of the interlayer connection conductor v2 is in contact with the first radiation conductor layer 16 at the second feeding point P2. The second feeding point P2 is located closest to the second straight line E2 within the first outer edge EE1. In this embodiment, the second power feeding point P2 is located closest to the midpoint of the second straight line E2 in the second straight line E2. The lower end of the interlayer connection conductor v2 is in contact with the left end of the second wiring layer 22. Thereby, the second wiring layer 22 is electrically connected to the first radiation conductor layer 16 at the second feeding point P2.

The interlayer connection conductor v3 electrically connects the first wiring layer 20 and the external electrode 24. More specifically, the interlayer connection conductor v3 vertically penetrates the insulator layers 14d and 14e. The upper end of the interlayer connection conductor v3 is in contact with the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v3 is in contact with the external electrode 24.

The interlayer connection conductor v4 electrically connects the second wiring layer 22 and the external electrode 26. More specifically, the interlayer connection conductor v4 vertically penetrates the insulator layers 14d and 14e. The upper end of the interlayer connection conductor v4 is in contact with the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v4 is in contact with the external electrode 26.

The interlayer connection conductors v5 to v8 electrically connect the ground conductor layer 28 and the annular ground conductor layer 30. More specifically, the interlayer connection conductors v5 to v8 vertically penetrate the insulator layers 14a to 14e. The upper ends of the interlayer connection conductors v5 to v8 are in contact with the annular ground conductor layer 30. The lower ends of the interlayer connection conductors v5 to v8 are in contact with the ground conductor layer 28.

The first radiation conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24, 26, the ground conductor layer 28, and the annular ground conductor layer 30 as described above are arranged on top of the insulator layers 14a to 14e. It is formed by patterning metal foil pasted on the surface and the lower main surface. The metal foil is, for example, copper foil. The interlayer connection conductors v1 to v8 are formed by filling conductive paste into through holes vertically penetrating the insulating layers 14a to 14e and solidifying the conductive paste by heating and pressurizing.

The protective layers 15a and 15b have a dielectric constant higher than that of the insulating layers 14a to 14e. The protective layer 15a covers the upper main surface of the insulator layer 14a. Thereby, the protective layer 15a protects the first radiation conductor layer 16 and the annular ground conductor layer 30. The protective layer 15b covers the lower main surface of the insulator layer 14e. Thereby, the protective layer 15b protects the ground conductor layer 28. However, an opening H is provided in the protective layer 15b. Thereby, the external electrodes 24 and 26 are exposed to the outside from the multilayer substrate 10 through the opening H.

In the multilayer substrate 10 as described above, the first radiation conductor layer 16 and the ground conductor layer 28 function as a patch antenna that radiates or receives the first high frequency signal and the second high frequency signal. However, the deflection direction of the first high frequency signal is different from the deflection direction of the second high frequency signal. Specifically, the first feeding point P1 is located near the first straight line E1. The second feeding point P2 is located near the second straight line E2. The first straight line E1 is orthogonal to the second straight line E2. Therefore, the deflection direction of the first high frequency signal is orthogonal to the deflection direction of the second high frequency signal. Note that the deflection directions during reception of the first high frequency signal and the second high frequency signal are also the same as the deflection directions during transmission of the first high frequency signal and the second high frequency signal.

(effect)
According to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are aligned with each other in the radiation conductor layer. It is possible to suppress tilting from the normal direction of the main surface. A multilayer substrate 110 according to a comparative example will be described below as an example. FIG. 4 is a cross-sectional view of the multilayer substrates 10 and 110. 4 is a sectional view taken along B1-B1 in FIG. 2, B2-B2 in FIG. 2, and DD in FIG. 5. FIG. 5 is a top view of the multilayer substrate 110. FIG. 6 is a cross-sectional view of the multilayer substrate 110. FIG. 6 is a sectional view taken along line CC in FIG.

The multilayer substrate 110 shown in FIG. 5 differs from the multilayer substrate 10 in that the first wiring layer 20 is perpendicular to the first straight line E1. In the multilayer substrate 110, the first high frequency signal is supplied to the first radiation conductor layer 16 via the first feeding point P1. As a result, a standing wave is generated on the first straight line E1, and the first high frequency signal is radiated. At this time, electric lines of force e11 are generated from the first straight line E1 to the ground conductor layer 28. The electric force lines e11 extend in a direction perpendicular to the first straight line E1 and downward.

Similarly, the second high frequency signal is supplied to the first radiation conductor layer 16 via the second feeding point P2. As a result, a standing wave is generated on the second straight line E2, and a second high-frequency signal is radiated. At this time, electric lines of force e12 are generated from the second straight line E2 to the ground conductor layer 28. The electric force lines e12 extend in a direction perpendicular to the second straight line E2 and downward.

By the way, the first wiring layer 20 is orthogonal to the first straight line E1. Therefore, the first wiring layer 20 extends long in the direction orthogonal to the first straight line E1. Therefore, the electric force lines e11 are likely to be blocked by the first wiring layer 20, as shown in FIG. In this way, when the electric line of force e11 is blocked by the first wiring layer 20, the radiation direction of the first high-frequency signal is tilted from the vertical direction to the upper right direction.

Further, the second wiring layer 22 is not perpendicular to the second straight line E2. Therefore, the second wiring layer 22 does not extend long in the direction orthogonal to the second straight line E2. Therefore, the electric force lines e12 are not easily blocked by the second wiring layer 22, as shown in FIG. In this way, when the electric force lines e12 are less likely to be blocked by the second wiring layer 22, the radiation direction of the second high-frequency signal is less likely to tilt from the vertical direction. As a result, in the multilayer substrate 110, a difference occurs between the radiation pattern of the first high frequency signal and the radiation pattern of the second high frequency signal.

Therefore, in the multilayer substrate 10, the first wiring layer 20 intersects the first straight line E1 so as not to be orthogonal to the first straight line E1 when viewed in the vertical direction (Z-axis direction). Furthermore, the second wiring layer 22 intersects with the second straight line E2 so as not to be perpendicular to it when viewed in the vertical direction (Z-axis direction). Thereby, the electric force lines e1 are less likely to be blocked by the first wiring layer 20, as shown in FIG. Furthermore, the electric force lines e2 are not easily blocked by the second wiring layer 22, as shown in FIG. As a result, it is possible to suppress the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from tilting from the normal direction (vertical direction) of the main surface of the first radiation conductor layer 16. Furthermore, since the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are prevented from tilting from the vertical direction, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal is reduced. . Note that in this specification, the radiation direction of the high-frequency signal is the central axis of the radiation pattern of the high-frequency signal.

Furthermore, in the multilayer substrate 10, for the same reason as above, the receiving direction of the first high frequency signal and the receiving direction of the second high frequency signal are prevented from being tilted from the vertical direction. The difference with the reception pattern of the high frequency signal becomes smaller.

According to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be reduced for the following reasons. It is possible to suppress the direction from being tilted from the normal direction of the main surface of the radiation electrode. More specifically, the electric lines of force e1 are likely to occur in the first region A1. The electric force lines e2 are likely to occur in the second region A2. Therefore, in the multilayer substrate 10, the first wiring layer 20 straddles the first region A1 and the region outside the first region A1 when viewed in the vertical direction. Further, the second wiring layer 22 straddles the second region A2 and a region outside the second region A2 when viewed in the vertical direction. As a result, the length of the portion of the first wiring layer 20 located in the first region A1 becomes shorter. The length of the portion of the second wiring layer 22 located in the second region A2 becomes shorter. Thereby, the electric force lines e1 are less likely to be blocked by the first wiring layer 20. The electric force lines e2 are not easily blocked by the second wiring layer 22. As a result, according to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are It is possible to suppress tilting from the normal direction of the main surface of the electrode.

According to the multilayer substrate 10, the distance L1, the distance L2, the distance L3, and the distance L4 are equal to each other. As a result, the magnitude of the capacitance generated between the first straight line E1 and the annular ground conductor layer 30, the magnitude of the capacitance generated between the second straight line E2 and the annular ground conductor layer 30, and the magnitude of the capacitance generated between the straight line E101 and the annular ground conductor layer 30 are determined. The magnitude of the capacitance generated between the conductor layer 30 and the capacitance generated between the straight line E102 and the annular ground conductor layer 30 approaches. As a result, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are aligned with the normal to the main surface of the radiation electrode. It is possible to suppress tilting in any direction.

(First modification)
The multilayer substrate 10a according to the first modification will be described below. FIG. 7 is a top view of the multilayer substrate 10a.

The multilayer substrate 10a differs from the multilayer substrate 10 in that it further includes a second radiation conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222.

The second radiation conductor layer 216, the third wiring layer 220, and the fourth wiring layer 222 each have the same structure as the first radiation conductor layer 16, the first wiring layer 20, and the second wiring layer 22. Specifically, the second radiation conductor layer 216 is provided in the stacked body 12. The second radiation conductor layer 216 has a second outer edge EE2 including a third straight line E3, a fourth straight line E4, a straight line E103, and a straight line E104 when viewed in the up-down direction (Z-axis direction). The fourth straight line E4 intersects with the third straight line E3 when viewed in the vertical direction (Z-axis direction). The fourth straight line E4 is perpendicular to the third straight line E3 when viewed in the vertical direction (Z-axis direction). Moreover, the ground conductor layer 28 overlaps with the second radiation conductor layer 216 when viewed in the vertical direction (Z-axis direction).

The third wiring layer 220 is provided in the stacked body 12. The third wiring layer 220 is located below the second radiation conductor layer 216 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The third wiring layer 220 is electrically connected to the second radiation conductor layer 216 at a third feeding point P3 located closest to the third straight line E3 within the second outer edge EE2. The third wiring layer 220 intersects with the third straight line E3 so as not to be perpendicular to it when viewed in the vertical direction (Z-axis direction).

The fourth wiring layer 222 is provided in the stacked body 12. The fourth wiring layer 222 is located below the second radiation conductor layer 216 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The fourth wiring layer 222 is electrically connected to the second radiation conductor layer 216 at a fourth feeding point P4 located closest to the fourth straight line E4 within the second outer edge EE2. The fourth wiring layer 222 intersects the fourth straight line E4 so as not to be orthogonal to it when viewed in the vertical direction (Z-axis direction).

The second radiation conductor layer 216 is located to the right of the first radiation conductor layer 16 (on the positive side of the X axis). Further, the first straight line E1 and the second straight line E2 are located to the right (on the positive side of the X-axis) of the first portion EP1 of the first outer edge EE1 excluding the first straight line E1 and the second straight line E2. The third straight line E3 and the fourth straight line E4 are located to the left (on the negative side of the X-axis) of the second portion EP2 of the second outer edge EE2 excluding the third straight line E3 and the fourth straight line E4. The other structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so the description thereof will be omitted. The multilayer substrate 10a can have the same effects as the multilayer substrate 10.

According to the multilayer substrate 10a, since the first radiation conductor layer 16 and the second radiation conductor layer 216 are prevented from coupling with each other, the gain of the first radiation conductor layer 16 and the second radiation conductor layer 216 is reduced. is suppressed. More specifically, in the first radiation conductor layer 16, the intensity of the electric field is high in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field increases along the straight lines E103 and E104. Therefore, the straight lines E101 and E102 are likely to be electrically coupled to the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are likely to be electrically coupled to the first wiring layer 20 and the second wiring layer 22. Therefore, in the multilayer substrate 10a, the first straight line E1 and the second straight line E2 are located to the right of the first portion EP1 excluding the first straight line E1 and the second straight line E2 within the first outer edge EE1. The third straight line E3 and the fourth straight line E4 are located to the left of the second portion EP2 of the second outer edge EE2 excluding the third straight line E3 and the fourth straight line E4. Thereby, the straight lines E101 and E102 are located far from the third wiring layer 220 and the fourth wiring layer 222. Straight lines E103 and E104 are located far from the first wiring layer 20 and the second wiring layer 22. Therefore, since the first radiation conductor layer 16 and the second radiation conductor layer 216 are prevented from coupling with each other, a decrease in the gains of the first radiation conductor layer 16 and the second radiation conductor layer 216 is suppressed.

(Second modification)
The multilayer substrate 10b according to the second modification will be described below. FIG. 8 is a top view of the multilayer substrate 10b.

The multilayer substrate 10b differs from the multilayer substrate 10a in that it further includes a third radiation conductor layer 316, a fifth wiring layer 320, and a sixth wiring layer 322.

The third radiation conductor layer 316 is provided in the laminate 12 . The third radiation conductor layer 316 has a third outer edge EE3 that includes a fifth straight line E5, a sixth straight line E6, a straight line E105, and a straight line E106 when viewed in the vertical direction (Z-axis direction). The sixth straight line E6 intersects with the fifth straight line E5 when viewed in the vertical direction (Z-axis direction). The sixth straight line E6 is orthogonal to the fifth straight line E5 when viewed in the vertical direction (Z-axis direction). Moreover, the ground conductor layer 28 overlaps with the third radiation conductor layer 316 when viewed in the vertical direction (Z-axis direction).

The fifth wiring layer 320 is provided in the stacked body 12. The third wiring layer 220 is located below the third radiation conductor layer 316 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The fifth wiring layer 320 is electrically connected to the third radiation conductor layer 316 at a fifth feeding point P5 located closest to the fifth straight line E5 in the third outer edge EE3. The fifth wiring layer 320 intersects with the fifth straight line E5 so as not to be perpendicular to it when viewed in the vertical direction (Z-axis direction).

The sixth wiring layer 322 is provided in the stacked body 12. The sixth wiring layer 322 is located below the third radiation conductor layer 316 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The sixth wiring layer 322 is electrically connected to the third radiation conductor layer 316 at a sixth feeding point P6 located closest to the sixth straight line E6 within the third outer edge EE3. The sixth wiring layer 322 intersects with the sixth straight line E6 so as not to be orthogonal to it when viewed in the vertical direction (Z-axis direction).

The third radiation conductor layer 316 is located to the right of the second radiation conductor layer 216 (on the positive side of the X axis). Further, the fifth straight line E5 and the sixth straight line E6 are located to the right (on the positive side of the X-axis) of the third portion EP3 of the third outer edge EE3 excluding the fifth straight line E5 and the sixth straight line E6. The other structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10a, so a description thereof will be omitted. The multilayer substrate 10b can have the same effects as the multilayer substrate 10a.

Further, according to the multilayer substrate 10b, the third wiring layer 220 and the fourth wiring layer 222 are separated from the fifth wiring layer 320 and the sixth wiring layer 322. As a result, coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 is suppressed.

(Third modification)
A multilayer substrate 10c according to a third modification will be described below. FIG. 9 is a top view of the multilayer substrate 10c.

The multilayer substrate 10c differs from the multilayer substrate 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. More specifically, the second radiation conductor layer 216 is located to the right of the first radiation conductor layer 16 (on the positive side of the X axis). The third radiation conductor layer 316 is located to the right of the second radiation conductor layer 216 (on the positive side of the X axis). The first straight line E1, the third straight line E3, and the fifth straight line E5 are parallel to the left-right direction (X-axis). The second straight line E2, the fourth straight line E4, and the sixth straight line E6 overlap each other when viewed in the left-right direction (X-axis direction). The right end (end on the positive side of the X-axis) of the first straight line E1 is connected to the front end (end on the positive side of the Y-axis) of the second straight line E2. The right end (end on the positive side of the X-axis) of the third straight line E3 is connected to the front end (end on the positive side of the Y-axis) of the fourth straight line E4. The right end (end on the positive side of the X-axis) of the fifth straight line E5 is connected to the front end (end on the positive side of the Y-axis) of the sixth straight line E6. The other structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10b, so a description thereof will be omitted.

The multilayer substrate 10c can bring the degree of coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 closer to the degree of coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316. More specifically, in the first radiation conductor layer 16, the intensity of the electric field is high in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field increases along the straight lines E103 and E104. In the third radiation conductor layer 316, the strength of the electric field increases along the straight lines E105 and E106. Therefore, the second straight line E2 and the straight line E103 face each other. The fourth straight line E4 and the straight line E105 face each other. Thereby, the degree of coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 and the degree of coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 can be made closer to each other. As a result, it is possible to suppress the high frequency signal radiated from the entire first radiation conductor layer 16, second radiation conductor layer 216, and third radiation conductor layer 316 from being tilted from the normal direction of the main surface of the radiation conductor layer.

(Fourth modification)
A multilayer substrate 10d according to a fourth modification will be described below. FIG. 10 is a top view of the multilayer substrate 10d.

The multilayer substrate 10d differs from the multilayer substrate 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. More specifically, the second radiation conductor layer 216 is located to the right of the first radiation conductor layer 16 (on the positive side of the X axis). The third radiation conductor layer 316 is located to the right of the second radiation conductor layer 216 (on the positive side of the X axis).

The first straight line E1 and the second straight line E2 are located to the left (on the negative side of the X-axis) of the first portion EP1 of the first outer edge EE1 excluding the first straight line E1 and the second straight line E2. The third straight line E3 and the fourth straight line E4 are located behind the second portion EP2 of the second outer edge EE2 excluding the third straight line E3 and the fourth straight line E4 (on the negative side of the Y-axis). The fifth straight line E5 and the sixth straight line E6 are located to the left (on the negative side of the X-axis) of the third portion EP3 of the third outer edge EE3 excluding the fifth straight line E5 and the sixth straight line E6. The other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10b, so a description thereof will be omitted.

(Fifth modification)
A multilayer substrate 10e according to a fifth modification will be described below. FIG. 11 is an exploded perspective view of the multilayer substrate 10e. FIG. 12 is a top view of the multilayer substrate 10e.

The multilayer substrate 10e differs from the multilayer substrate 10 in that it further includes a second radiation conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222. The second radiation conductor layer 216 is provided in the laminate 12 . The second radiation conductor layer 216 is located below the first radiation conductor layer 16 (on the negative side of the Z axis). The second radiation conductor layer 216 overlaps with the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction). The second radiation conductor layer 216 has a second outer edge EE2 that includes a third straight line E3 and a fourth straight line E4 when viewed in the up-down direction (Z-axis direction).

The right end (end on the positive side of the X-axis) of the third straight line E3 is connected to the right end (end on the positive side of the X-axis) of the fourth straight line E4. The third straight line E3 is parallel to the first straight line E1. The fourth straight line E4 is parallel to the second straight line E2.

The third wiring layer 220 is provided in the stacked body 12. The third wiring layer 220 is located below the second radiation conductor layer 216 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The third wiring layer 220 is electrically connected to the second radiation conductor layer 216 at a third feeding point P3 located closest to the third straight line E3 within the second outer edge EE2. The third wiring layer 220 intersects with the third straight line E3 so as not to be perpendicular to it when viewed in the vertical direction (Z-axis direction).

The fourth wiring layer 222 is provided in the stacked body 12. The fourth wiring layer 222 is located below the second radiation conductor layer 216 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). The fourth wiring layer 222 is electrically connected to the second radiation conductor layer 216 at a fourth feeding point P4 located closest to the fourth straight line E4 in the second outer edge EE2. The fourth wiring layer 222 intersects the fourth straight line E4 so as not to be orthogonal to it when viewed in the vertical direction (Z-axis direction).

Further, the first wiring layer 20 intersects the first straight line E1 and the third straight line E3 so as not to be perpendicular to each other when viewed in the vertical direction (Z-axis direction). The second wiring layer 22 intersects the second straight line E2 and the fourth straight line E4 so as not to be perpendicular to each other when viewed in the vertical direction (Z-axis direction). The other structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so the description thereof will be omitted. The multilayer substrate 10e can have the same effects as the multilayer substrate 10.

According to the multilayer substrate 10e, since the first radiation conductor layer 16 and the second radiation conductor layer 216 are prevented from coupling with each other, the gains of the first radiation conductor layer 16 and the second radiation conductor layer 216 are reduced. is suppressed. More specifically, in the first radiation conductor layer 16, the intensity of the electric field is high in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field increases along the straight lines E103 and E104. Therefore, the straight lines E101 and E102 are likely to be electrically coupled to the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are likely to be electrically coupled to the first wiring layer 20 and the second wiring layer 22.

Therefore, in the multilayer substrate 10e, the first straight line E1 is parallel to the third straight line E3. The second straight line E2 is parallel to the fourth straight line E4. The right end of the first straight line E1 is connected to the right end of the second straight line E2. The right end of the third straight line E3 is connected to the right end of the fourth straight line E4. As a result, the first wiring layer 20 and the second wiring layer 22 are no longer located near the straight lines E103, 104. The third wiring layer 220 and the fourth wiring layer 222 are no longer located near the straight lines E101 and E102. This suppresses mutual coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216, thereby suppressing a decrease in the gain of the first radiation conductor layer 16 and the second radiation conductor layer 216. .

Further, the first wiring layer 20 and the second wiring layer 22 of the second radiation conductor layer 216 are drawn out so as to move away from the straight lines E101 and E102 where the intensity of the electric field generated by the first radiation conductor layer 16 increases. Thereby, coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is suppressed, and decrease in gain of the first radiation conductor layer 16 and the second radiation conductor layer 216 can be reduced.

(Sixth variation)
A multilayer substrate 10f according to a sixth modification will be described below. FIG. 13 is a top view of the multilayer substrate 10f.

The multilayer substrate 10f differs from the multilayer substrate 10c in the arrangement of the second radiation conductor layer 216. More specifically, the rear end (end on the negative side of the Y axis) of the third straight line E3 is connected to the left end (end on the negative side of the X axis) of the fourth straight line E4. The other structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10c, so the description thereof will be omitted.

(Seventh modification)
A multilayer substrate 10g according to a seventh modification will be described below. FIG. 14 is an exploded perspective view of the multilayer substrate 10g. FIG. 15 is a cross-sectional view of the multilayer substrate 10g.

The multilayer board 10g differs from the multilayer board 10 in that it has a rigid part A3 and a flexible part A4, and further includes a first ground conductor layer 128 and interlayer connection conductors v9 to v12.

The rigid portion A3 is a portion whose length in the vertical direction (Z-axis direction) is longer than the length in the vertical direction (Z-axis direction) of the flexible portion A4, as shown in FIGS. 14 and 15. In this modification, the rigid portion A3 overlaps the protective layer 15a when viewed in the up-down direction (Z-axis direction). The length of the flexible portion A4 in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). In this modification, the flexible portion A4 is located to the right of the rigid portion A3. The first wiring layer 20 extends over the rigid section A3 and the flexible section A4. The second wiring layer 22 extends over the rigid section A3 and the flexible section A4. The ground conductor layer 28 extends over the rigid section A3 and the flexible section A4. In the rigid portion A3, no ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28. The external electrodes 24, 26 and the opening H are provided in the flexible portion A4. The rest of the structure of the rigid section A3 is the same as that of the multilayer substrate 10, so a description thereof will be omitted. The structure of the flexible portion A4 will be described in detail below.

In the flexible portion A4, the laminate 12 has a structure in which insulator layers 14c to 14e and protective layers 15b and 15c are stacked in the vertical direction (Z-axis direction). The protective layer 15c, the insulator layers 14c to 14e, and the protective layer 15b are arranged in this order from top to bottom.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14c. The first ground conductor layer 128 has a rectangular shape when viewed in the vertical direction. The long side of the first ground conductor layer 128 extends in the left-right direction. The short side of the first ground conductor layer 128 extends in the front-back direction. The first ground conductor layer 128 overlaps the first wiring layer 20 and the second wiring layer 22 when viewed in the vertical direction. The first ground conductor layer 128 is connected to ground potential.

The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the ground conductor layer 28. More specifically, the interlayer connection conductors v9 to v12 vertically penetrate the insulator layers 14c to 14e. The upper ends of the interlayer connection conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connection conductors v9 to v12 are in contact with the ground conductor layer 28.

The first ground conductor layer 128 is formed by patterning a metal foil attached to the upper main surface of the insulator layer 14c. The metal foil is, for example, copper foil. The interlayer connection conductors v9 to v12 are formed by filling conductive paste into through holes vertically penetrating the insulating layers 14c to 14e and solidifying the conductive paste by heating and pressurizing.

The protective layer 15c has a dielectric constant higher than that of the insulating layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulator layer 14c. Thereby, the protective layer 15c protects the first ground conductor layer 128.

The structures of the external electrodes 24, 26 and the opening H are the same as those of the multilayer substrate 10, so their explanation will be omitted. Further, the other structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so a description thereof will be omitted.

The multilayer substrate 10g can have the same effects as the multilayer substrate 10.

(a) According to the multilayer substrate 10g, bending of the multilayer substrate 10g becomes easy. More specifically, the multilayer substrate 10g has a rigid portion A3 and a flexible portion A4. The length of the flexible portion A4 in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). Therefore, the flexible portion A4 is more easily deformed than the rigid portion A3. That is, the flexible portion A4 is easily bent. Thereby, the multilayer substrate 10g can be easily bent. As a result, the multilayer substrate 10g can be easily bent.

(b) According to the multilayer substrate 10g, the length of the rigid portion A3 in the vertical direction (Z-axis direction) can be shortened. More specifically, in the rigid portion A3, each of the first wiring layer 20 and the second wiring layer 22 is located below the annular ground conductor layer 30 and above the ground conductor layer 28. Therefore, the annular ground conductor layer 30 and the ground conductor layer 28 suppress noise from entering the first wiring layer 20 and the second wiring layer 22, respectively.

(c) According to the multilayer substrate 10g, the capacitance generated between the first radiation conductor layer 16 and the ground conductor is greater than when a ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28. can be suppressed.

(Eighth modification)
A multilayer substrate 10h according to an eighth modification will be described below. FIG. 16 is an exploded perspective view of the multilayer substrate 10h. FIG. 17 is a cross-sectional view of the multilayer substrate 10h.

The multilayer board 10h has a rigid part A3 and a flexible part A4, a seventh wiring layer 120, an eighth wiring layer 122, a first ground conductor layer 128, and interlayer connection conductors v9 to v12, v15, and v16. It is different from the multilayer board 10 in that it further includes an interlayer connection conductor v13, and an interlayer connection conductor v14.

The rigid part A3 is a part whose length in the vertical direction (Z-axis direction) is longer than the length in the vertical direction (Z-axis direction) of the flexible part A4, as shown in FIGS. 16 and 17. In this modification, the rigid portion A3 overlaps the protective layer 15a when viewed in the up-down direction (Z-axis direction). The length of the flexible portion A4 in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). In this modification, the flexible portion A4 is located to the right of the rigid portion A3. First, the structure of the rigid section A3 will be explained in detail. Next, the structure of the flexible portion A4 will be explained in detail.

In the rigid portion A3, the laminate 12 has a structure in which insulator layers 14a to 14f and protective layers 15a and 15b are stacked in the vertical direction (Z-axis direction). The protective layer 15a, the insulator layers 14a to 14f, and the protective layer 15b are arranged in this order from top to bottom. The material of the insulator layer 14f is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 12 has flexibility.

In this modification, the first wiring layer 20 and the second wiring layer 22 are located on the upper main surface of the insulator layer 14b. The interlayer connection conductors v1 and v2 vertically penetrate the insulator layer 14a. The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14f. The protective layer 15b covers the lower main surface of the insulator layer 14f. Thereby, the protective layer 15b protects the ground conductor layer 28.

The seventh wiring layer 120 is provided in the stacked body 12. The seventh wiring layer 120 is located below the first wiring layer 20 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). In this modification, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 14e. Moreover, the seventh wiring layer 120 has a linear shape extending in the left-right direction when viewed in the up-down direction. The seventh wiring layer 120 straddles the rigid section A3 and the flexible section A4. Further, the seventh wiring layer 120 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction.

The eighth wiring layer 122 is provided in the stacked body 12. The eighth wiring layer 122 is located below the second wiring layer 22 (on the negative side of the Z axis) and above the ground conductor layer 28 (on the positive side of the Z axis). In this modification, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 14e. Further, the eighth wiring layer 122 is located after the seventh wiring layer 120 when viewed in the vertical direction. The eighth wiring layer 122 has a linear shape extending in the horizontal direction when viewed in the vertical direction. The eighth wiring layer 122 straddles the rigid section A3 and the flexible section A4. Furthermore, the eighth wiring layer 122 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction.

The interlayer connection conductor v13 electrically connects the first wiring layer 20 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v13 vertically penetrates the insulator layers 14b to 14d. The upper end of the interlayer connection conductor v13 is in contact with the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v13 is in contact with the left end of the seventh wiring layer 120. Thereby, the seventh wiring layer 120 is electrically connected to the first wiring layer 20.

The interlayer connection conductor v14 electrically connects the second wiring layer 22 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v14 vertically penetrates the insulator layers 14b to 14d. The upper end of the interlayer connection conductor v14 is in contact with the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v14 is in contact with the left end of the eighth wiring layer 122. Thereby, the eighth wiring layer 122 is electrically connected to the second wiring layer 22.

The interlayer connection conductors v13 and v14 are formed by filling conductive paste into through holes vertically penetrating the insulating layers 14b to 14d and solidifying the conductive paste by heating and pressurizing.

The ground conductor layer 28 extends over the rigid section A3 and the flexible section A4. The external electrodes 24, 26 and the opening H are provided in the flexible portion A4. The rest of the structure of the rigid section A3 is the same as that of the multilayer substrate 10, so a description thereof will be omitted. The structure of the flexible portion A4 will be described in detail below.

In the flexible portion A4, the laminate 12 has a structure in which insulator layers 14d to 14f and protective layers 15b and 15c are stacked in the vertical direction (Z-axis direction). The protective layer 15c, the insulator layers 14d to 14f, and the protective layer 15b are arranged in this order from top to bottom.

In the flexible portion A4, the first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14d. The first ground conductor layer 128 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the vertical direction. The other structure of the first ground conductor layer 128 is the same as that of the multilayer substrate 10g, so a description thereof will be omitted.

In the flexible portion A4, the interlayer connection conductors v9 to v12 vertically penetrate the insulator layers 14d to 14f. The other structures of the interlayer connection conductors v9 to v12 are the same as those of the multilayer board 10g, so the explanation will be omitted.

The interlayer connection conductor v15 electrically connects the seventh wiring layer 120 and the external electrode 24. More specifically, the interlayer connection conductor v15 vertically penetrates the insulator layers 14e and 14f. The upper end of the interlayer connection conductor v15 is in contact with the right end portion of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 is in contact with the external electrode 24.

The interlayer connection conductor v16 electrically connects the eighth wiring layer 122 and the external electrode 26. More specifically, the interlayer connection conductor v16 vertically penetrates the insulator layers 14e and 14f. The upper end of the interlayer connection conductor v16 is in contact with the right end of the eighth wiring layer 122. The lower end of the interlayer connection conductor v16 is in contact with the external electrode 26.

The interlayer connection conductors v15 and v16 are formed by filling conductive paste into through holes vertically penetrating the insulating layers 14e and 14f, and solidifying the conductive paste by heating and pressurizing.

The protective layer 15c has a dielectric constant higher than that of the insulating layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulator layer 14d. Thereby, the protective layer 15c protects the first ground conductor layer 128.

The external electrodes 24 and 26 are provided on the lower main surface of the insulator layer 14f. The other structures of the external electrodes 24 and 26 are the same as those of the multilayer substrate 10, so a description thereof will be omitted.

The structure of the opening H is the same as that of the multilayer substrate 10, so a description thereof will be omitted. Further, the other structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10, so the description thereof will be omitted.

The multilayer substrate 10h can have the same effects as the multilayer substrate 10. Further, according to the multilayer substrate 10h, the effects (a) to (c) can be achieved.

(d) According to the multilayer board 10h, by adjusting the length (width) of each of the first wiring layer 20 and the second wiring layer 22 in the direction perpendicular to the vertical direction, the distance between the first wiring layer 20 and the second wiring layer 22 can be adjusted. The characteristic impedance can be matched depending on the position. This makes it possible to supply reflected waves to the first radiation conductor layer 16 while reducing loss.

(9th modification)
A multilayer substrate 10i according to a ninth modification will be described below. FIG. 18 is a top view of the multilayer substrate 10i.

The multilayer substrate 10i differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include matching portions PMC. In this modification, the length of the matching portion PMC of the first wiring layer 20 in the front-back direction is longer than the length of the portion of the first wiring layer 20 other than the matching portion PMC in the front-back direction. Further, the length of the matching portion PMC of the second wiring layer 22 in the front-back direction is longer than the length of the portion of the second wiring layer 22 other than the matching portion PMC in the front-back direction. The matching portion PMC does not overlap the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction).

The multilayer substrate 10i can have the same effects as the multilayer substrate 10. Moreover, according to the multilayer substrate 10i, coupling between the matching portion PMC and the first radiation conductor layer 16 is suppressed. More specifically, by providing the matching part PMC at a position close to the first radiation conductor layer 16, reflected waves can be supplied to the first radiation conductor layer 16 while reducing loss. It is preferable to provide the first wiring layer 20 and the second wiring layer 22. Here, the matching portion PMC does not overlap with the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction). Therefore, the matching part PMC can be located far from the first radiation conductor layer 16. As a result, according to the multilayer substrate 10i, coupling between the matching portion PMC and the first radiation conductor layer 16 is suppressed.

(10th modification)
A multilayer substrate 10j according to a tenth modification will be described below. FIG. 19 is a top view of the multilayer substrate 10j.

The multilayer substrate 10j differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include stub portions ST. In this modification, the stub portion ST is an open stub that is not connected to the ground potential. The stub portion ST has a linear shape extending in the front-rear direction when viewed in the up-down direction. The stub portion ST does not overlap the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction).

The multilayer substrate 10j can have the same effects as the multilayer substrate 10. Furthermore, according to the multilayer substrate 10j, coupling between the stub portion ST and the first radiation conductor layer 16 is suppressed. More specifically, by providing the stub portion ST at a position close to the first radiation conductor layer 16, reflected waves can be supplied to the first radiation conductor layer 16 while reducing loss. It is preferable to provide the first wiring layer 20 and the second wiring layer 22. Here, the stub portion ST does not overlap with the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction). Therefore, the stub portion ST can be located far from the first radiation conductor layer 16. As a result, according to the multilayer substrate 10i, coupling between the stub portion ST and the first radiation conductor layer 16 is suppressed.

(11th modification)
A multilayer substrate 10k according to an eleventh modification will be described below. FIG. 20 is a top view of the multilayer substrate 10k.

The multilayer substrate 10k differs from the multilayer substrate 10h in that the seventh wiring layer 120 is orthogonal to the first straight line E1 when viewed in the vertical direction (Z-axis direction). The rest of the structure of the multilayer substrate 10k is the same as that of the multilayer substrate 10h, so a description thereof will be omitted.

The multilayer substrate 10k can have the same effects as the multilayer substrate 10h. Further, according to the multilayer substrate 10k, the distance between the seventh wiring layer 120 and the first radiation conductor layer 16 is greater than the distance between the first wiring layer 20 and the first radiation conductor layer 16. Therefore, the first wiring layer 20 intersects with the first straight line E1 not perpendicularly when viewed in the vertical direction (Z-axis direction), and the second wiring layer 22 crosses the first straight line E1 in the vertical direction (Z-axis direction). The seventh wiring layer 120 may intersect orthogonally with the first straight line E1 when viewed in the vertical direction (Z-axis direction), as long as it intersects with the second straight line E2 in a manner that is not perpendicular to the second straight line E2.

(e) According to the multilayer board 10k, the degree of freedom in wiring layout is improved. More specifically, the seventh wiring layer 120 may be orthogonal to the first straight line E1 when viewed in the vertical direction (Z-axis direction). Note that the eighth wiring layer 122 may be orthogonal to the second straight line E2 when viewed in the vertical direction (Z-axis direction).

(12th modification)
An antenna module 100 according to a twelfth modification will be described below. FIG. 21 is a cross-sectional view of the antenna module 100. FIG. 22 is an exploded perspective view of the multilayer substrate 210.

The antenna module 100 is used, for example, in a wireless communication terminal such as a smartphone. The antenna module 100 includes a multilayer substrate 10 and a multilayer substrate 210.

As shown in FIG. 21, the multilayer substrate 210 is located below the multilayer substrate 10 (on the negative side of the Z axis). The multilayer substrate 210 has a region AR1 that overlaps with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction), and a region AR2 that does not overlap with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction). . The structure of the multilayer substrate 210 will be described in detail below.

The multilayer substrate 210 includes a laminate 112, a seventh wiring layer 120, an eighth wiring layer 122, external electrodes 124 to 127, a first ground conductor layer 128, a second ground conductor layer 129, and interlayer connection conductors v9 to v12, v15 to Equipped with v18. The seventh wiring layer 120, the eighth wiring layer 122, the external electrodes 124 to 127, the first ground conductor layer 128, the second ground conductor layer 129, and the interlayer connection conductors v9 to v12, v15 to v18 are shown in FIG. As shown in FIG. The multilayer substrate 10 corresponds to the "first substrate" of the present invention. The multilayer substrate 210 corresponds to the "second substrate" of the present invention. The laminate 12 corresponds to the "first laminate" of the present invention. The laminate 112 corresponds to the "second laminate" of the present invention.

The laminate 112 has a plate shape. The laminate 112 has a rectangular shape when viewed in the vertical direction. The laminate 112 has a structure in which insulator layers 114a to 114c and protective layers 115a and 115b are stacked in the vertical direction (Z-axis direction). The length of the stacked body 112 in the vertical direction is shorter than the length of the stacked body 12 in the vertical direction. As a result, the length of the multilayer substrate 210 in the vertical direction (Z-axis direction) is shorter than the length of the multilayer substrate 10 in the vertical direction (Z-axis direction). The protective layer 115a, the insulator layers 114a to 114c, and the protective layer 115b are arranged in this order from top to bottom. The material of the insulating layers 114a to 114c is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 112 has flexibility. Multilayer substrate 210 has flexibility. The protective layers 115a and 115b will be described later.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14a. The first ground conductor layer 128 has a rectangular shape when viewed in the vertical direction. The long side of the first ground conductor layer 128 extends in the left-right direction. The short side of the first ground conductor layer 128 extends in the front-back direction. The first ground conductor layer 128 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the vertical direction. The first ground conductor layer 128 is connected to ground potential.

External electrodes 124 and 126 are provided on the upper main surface of insulator layer 114a. The external electrodes 124 and 126 are not in contact with the first ground conductor layer 128. Therefore, the external electrodes 124 and 126 are located within the opening provided in the first ground conductor layer 128. Further, the external electrode 124 overlaps with the left end portion of the seventh wiring layer 120 when viewed in the vertical direction. Further, the external electrode 126 overlaps with the left end portion of the eighth wiring layer 122 when viewed in the vertical direction.

The seventh wiring layer 120 is located below the first ground conductor layer 128 and above the second ground conductor layer 129. In this modification, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 114b. The seventh wiring layer 120 has a linear shape extending in the horizontal direction when viewed in the vertical direction. As shown in FIG. 21, in the antenna module 100, the left end of the seventh wiring layer 120 overlaps with the first wiring layer 20 when viewed in the vertical direction. In the antenna module 100, the right end of the seventh wiring layer 120 does not overlap with the first wiring layer 20. The seventh wiring layer 120 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction. Further, the distance between the seventh wiring layer 120 and the first radiation conductor layer 16 is greater than the distance between the first wiring layer 20 and the first radiation conductor layer 16.

The eighth wiring layer 122 is located below the first ground conductor layer 128 and above the second ground conductor layer 129, as shown in FIG. In this modification, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 114b. Further, the eighth wiring layer 122 is located after the seventh wiring layer 120 when viewed in the vertical direction. The eighth wiring layer 122 has a linear shape extending in the horizontal direction when viewed in the vertical direction. As shown in FIG. 21, in the antenna module 100, the left end of the eighth wiring layer 122 overlaps with the second wiring layer 22 when viewed in the vertical direction. In the antenna module 100, the right end of the eighth wiring layer 122 does not overlap with the second wiring layer 22. The eighth wiring layer 122 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction. Further, the distance between the eighth wiring layer 122 and the first radiation conductor layer 16 is greater than the distance between the second wiring layer 22 and the first radiation conductor layer 16.

As shown in FIG. 22, the second ground conductor layer 129 is provided on the lower main surface of the insulator layer 114c. Therefore, the second ground conductor layer 129 is located below the seventh wiring layer 120 and the eighth wiring layer 122 (on the negative side of the Z axis). The second ground conductor layer 129 has a rectangular shape when viewed in the vertical direction. The long sides of the second ground conductor layer 129 extend in the left-right direction. The short side of the second ground conductor layer 129 extends in the front-back direction. The second ground conductor layer 129 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the vertical direction (Z-axis direction). Further, as shown in FIG. 21, the second ground conductor layer 129 overlaps with the first radiation conductor layer 16 when viewed in the vertical direction (Z-axis direction). That is, the second ground conductor layer 129 straddles a region AR1 that overlaps with the multilayer substrate 10 and a region AR2 that does not overlap with the multilayer substrate 10. The second ground conductor layer 129 is connected to ground potential. Note that the second ground conductor layer 129 corresponds to the "ground conductor layer" of the present invention.

External electrodes 125 and 127 are provided on the lower main surface of insulator layer 114c. External electrodes 125 and 127 are not in contact with second ground conductor layer 129. Therefore, the external electrodes 125 and 127 are located within the opening provided in the second ground conductor layer 129. Further, the external electrode 125 overlaps with the right end portion of the seventh wiring layer 120 when viewed in the vertical direction. Further, the external electrode 127 overlaps with the right end portion of the eighth wiring layer 122 when viewed in the vertical direction.

The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the second ground conductor layer 129. More specifically, the interlayer connection conductors v9 to v12 vertically penetrate the insulator layers 114a to 114c. The upper ends of the interlayer connection conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connection conductors v9 to v12 are in contact with the second ground conductor layer 129.

The interlayer connection conductor v15 electrically connects the external electrode 124 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v15 vertically penetrates the insulator layer 114a. The upper end of the interlayer connection conductor v15 is in contact with the external electrode 124. The lower end of the interlayer connection conductor v15 is in contact with the left end of the seventh wiring layer 120.

The interlayer connection conductor v16 electrically connects the external electrode 126 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v16 vertically penetrates the insulator layer 114a. The upper end of the interlayer connection conductor v16 is in contact with the external electrode 126. The lower end of the interlayer connection conductor v16 is in contact with the left end of the eighth wiring layer 122.

The interlayer connection conductor v17 electrically connects the seventh wiring layer 120 and the external electrode 125. More specifically, the interlayer connection conductor v17 vertically penetrates the insulator layers 114b and 114c. The upper end of the interlayer connection conductor v17 is in contact with the right end portion of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 is in contact with the external electrode 125.

The interlayer connection conductor v18 electrically connects the eighth wiring layer 122 and the external electrode 127. More specifically, the interlayer connection conductor v18 vertically penetrates the insulator layers 114b and 114c. The upper end of the interlayer connection conductor v18 is in contact with the right end of the eighth wiring layer 122. The lower end of the interlayer connection conductor v18 is in contact with the external electrode 127.

The protective layers 115a and 115b have a dielectric constant higher than that of the insulating layers 114a to 114c. The protective layer 115a covers the upper main surface of the insulator layer 114a. Thereby, the protective layer 115a protects the first ground conductor layer 128. However, the protective layer 115b is provided with an opening h1. Thereby, the external electrodes 124 and 126 are exposed to the outside from the multilayer substrate 210 via the opening h1. Furthermore, the protective layer 115b covers the lower main surface of the insulator layer 114c. Thereby, the protective layer 115b protects the second ground conductor layer 129. However, the protective layer 115b is provided with an opening h2. Thereby, the external electrodes 125 and 127 are exposed to the outside from the multilayer substrate 210 via the opening h2.

Multilayer substrate 210 is mounted on multilayer substrate 10. Specifically, the external electrode 124 is fixed to the external electrode 24 with solder S. Thereby, the seventh wiring layer 120 is electrically connected to the first wiring layer 20. Therefore, the first high frequency signal is input to or output from the external electrode 125. Further, the external electrode 126 is fixed to the external electrode 26 by solder S. Thereby, the eighth wiring layer 122 is electrically connected to the second wiring layer 22. Therefore, the second high frequency signal is input to or output from the external electrode 127.

The antenna module 100 can have the same effects as the multilayer substrate 10. Moreover, according to the antenna module 100, the effects (d) and (e) can be achieved.

(f) According to the antenna module 100, bending of the antenna module 100 is facilitated. More specifically, the multilayer substrate 210 has an area AR1 that overlaps with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction), and an area AR2 that does not overlap with the multilayer substrate 10 when viewed in the up-down direction (Z-axis direction). have. Further, the length of the multilayer substrate 210 in the vertical direction (Z-axis direction) is shorter than the length of the multilayer substrate 10 in the vertical direction (Z-axis direction). Therefore, the region AR2 of the multilayer substrate 210 is more easily deformed than the multilayer substrate 10. That is, the region AR2 of the multilayer substrate 210 is easily bent. Thereby, the antenna module 100 can be easily bent. As a result, bending of the antenna module 100 becomes easier.

(13th modification)
An antenna module 100a according to a thirteenth modification will be described below. FIG. 23 is a cross-sectional view of the antenna module 100a.

The antenna module 100a differs from the antenna module 100 in that it includes a multilayer substrate 10l and a multilayer substrate 210a. The multilayer substrate 10l differs from the multilayer substrate 10 in that it does not include a ground conductor layer 28 and interlayer connection conductors v5 to v8.

The multilayer substrate 210a differs from the multilayer substrate 210 in that, as shown in FIG. 23, the first ground conductor layer 128 is located only in the region AR2 when viewed in the vertical direction. The first ground conductor layer 128 does not overlap the first radiation conductor layer 16 when viewed in the vertical direction. In this modification, the first ground conductor layer 128 is not located in the region AR1 when viewed in the vertical direction. In this modification, the rest of the structure of the antenna module 100a is the same as that of the antenna module 100, so a description thereof will be omitted. In the antenna module 100a as described above, the first radiation conductor layer 16 and the second ground conductor layer 129 function as a patch antenna that radiates or receives the first high frequency signal and the second high frequency signal.

The antenna module 100a can have the same effects as the antenna module 100.

(g) According to the antenna module 100a, the length of the region AR1 in the vertical direction (Z-axis direction) can be shortened. More specifically, the first ground conductor layer 128 facing the first radiation conductor layer 16 does not exist. The capacitance generated between the first radiation conductor layer 16 and the ground conductor is dominated by the capacitance generated between the first radiation conductor layer 16 and the second ground conductor layer 129. Therefore, when forming a desired capacitance, the length of the region AR1 in the vertical direction (Z-axis direction) can be shortened.

(Other embodiments)
The multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10k, and can be modified within the scope of the gist. Furthermore, the structures of the multilayer substrates 10, 10a to 10k may be combined arbitrarily.

The antenna module according to the present invention is not limited to the antenna modules 100 and 100a, and can be modified within the scope of the gist. Furthermore, the structures of the antenna modules 100 and 100a may be combined arbitrarily. Further, the antenna module 100 may include multilayer substrates 10a to 10l.

Note that the annular ground conductor layer 30 is not an essential component.

Note that the first wiring layer 20 and the second wiring layer 22 do not have to be parallel. The third wiring layer 220 and the fourth wiring layer 222 do not have to be parallel. The fifth wiring layer 320 and the sixth wiring layer 322 do not have to be parallel.

In addition, in the multilayer substrate 10a, the first straight line E1 and the second straight line E2 are to the left (on the negative side of the X axis) of the first portion EP1 excluding the first straight line E1 and the second straight line E2 of the first outer edge EE1. and the third straight line E3 and the fourth straight line E4 are located to the right (on the positive side of the X axis) of the second portion EP2 excluding the third straight line E3 and the fourth straight line E4 of the second outer edge EE2 You can leave it there.

The second straight line E2 only needs to intersect with the first straight line E1 when viewed in the vertical direction, and does not need to be perpendicular to the first straight line E1. The fourth straight line E4 only needs to intersect with the third straight line E3 when viewed in the vertical direction, and does not need to be orthogonal to the third straight line E3. The sixth straight line E6 only needs to intersect with the fifth straight line E5 when viewed in the vertical direction, and does not need to be orthogonal to the fifth straight line E5.

Note that the first straight line E1 and the second straight line E2 do not need to intersect when viewed in the vertical direction.

Note that the first power feeding point P1 may be located closest to a point on the first straight line E1 other than the midpoint of the first straight line E1.

Note that the second power feeding point P2 may be located closest to a point on the second straight line E2 other than the midpoint of the second straight line E2.

Note that the third power feeding point P3 may be located closest to a point other than the midpoint of the third straight line E3 in the third straight line E3.

Note that the fourth power feeding point P4 may be located closest to a point other than the midpoint of the fourth straight line E4 in the fourth straight line E4.

Note that the fifth power feeding point P5 may be located closest to a point other than the midpoint of the fifth straight line E5 in the fifth straight line E5.

Note that the sixth power feeding point P6 may be located closest to a point other than the midpoint of the sixth straight line E6 in the sixth straight line E6.

Note that the rigid portion A3 does not need to overlap the protective layer 15a when viewed in the vertical direction (Z-axis direction).

Note that the first ground conductor layer 128 is not an essential component.

Note that each of the seventh wiring layer 120 and the eighth wiring layer 122 may overlap the first radiation conductor layer 16 when viewed in the vertical direction. However, by increasing the distance between each of the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16, the distance between each of the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16 can be increased. Since coupling with the conductor layer 16 is suppressed, it is preferable that each of the seventh wiring layer 120 and the eighth wiring layer 122 do not overlap with the first radiation conductor layer 16 when viewed in the vertical direction.

Note that the matching portion PMC may be included in the seventh wiring layer 120 and the eighth wiring layer 122.

Note that even in the case where the matching part PMC is provided separately from the first wiring layer 20, the second wiring layer 22, the seventh wiring layer 120, and the eighth wiring layer 122, the matching part PMC, when viewed in the vertical direction, It is sufficient that it does not overlap with the first radiation conductor layer 16. In this case, the matching part PMC may be formed of, for example, an electronic component such as a chip capacitor that constitutes a matching circuit for matching characteristic impedances.

Note that the stub portion ST may be included in the seventh wiring layer 120 and the eighth wiring layer 122. Further, the stub portion ST may be a short stub connected to a ground potential.

The present invention includes the following structure.

(1)
A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
a ground provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer, and overlapping with the first radiation conductor layer when viewed in the Z-axis direction; a conductor layer;
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a first feeding point located closest to the first straight line, and is not orthogonal to the first straight line when viewed in the Z-axis direction. The first wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a second feeding point located closest to the second straight line, and is not orthogonal to the second straight line when viewed in the Z-axis direction. The second wiring layer intersects as shown in FIG.
It is equipped with
Multilayer board.

(2)
A region through which the first straight line passes when the first straight line is moved in a direction perpendicular to the first straight line when viewed in the Z-axis direction is defined as a first region,
The first wiring layer straddles the first region and a region outside the first region when viewed in the Z-axis direction,
A region through which the second straight line passes when the second straight line is moved in a direction perpendicular to the second straight line when viewed in the Z-axis direction is defined as a second region,
The second wiring layer straddles the second region and a region outside the second region when viewed in the Z-axis direction.
The multilayer substrate according to (1).

(3)
a second radiation conductor layer provided on the laminate and having a second outer edge including a third straight line and a fourth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a third feeding point located closest to the third straight line, and is not orthogonal to the third straight line when viewed in the Z-axis direction. The third wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a fourth feeding point located closest to the fourth straight line, and is not orthogonal to the fourth straight line when viewed in the Z-axis direction. The fourth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to (1) or (2).

(4)
The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The first straight line and the second straight line are located on the positive side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the X-axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The multilayer substrate according to (3).

(5)
a third radiation conductor layer provided in the laminate and having a third outer edge including a fifth straight line and a sixth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the third radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the third outer edge; is electrically connected to the third radiation conductor layer at a fifth feeding point located closest to the fifth straight line, and is not orthogonal to the fifth straight line when viewed in the Z-axis direction. The fifth wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the third radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the third outer edge; is electrically connected to the third radiation conductor layer at a sixth feeding point located closest to the sixth straight line, and is not orthogonal to the sixth straight line when viewed in the Z-axis direction. The sixth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the third radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to (3) or (4).

(6)
The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The first straight line and the second straight line are located on the positive side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the X-axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The fifth straight line and the sixth straight line are located on the positive side of the X-axis from a third portion of the third outer edge excluding the fifth straight line and the sixth straight line,
The multilayer substrate according to (5).

(7)
The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line, the third straight line, and the fifth straight line are parallel to the X-axis,
The second straight line, the fourth straight line, and the sixth straight line overlap each other when viewed in the X-axis direction,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the Y-axis,
An end of the third straight line on the positive side of the X-axis is connected to an end of the fourth straight line on the positive side of the Y-axis,
The end of the fifth straight line on the positive side of the X-axis is connected to the end of the sixth straight line on the positive side of the Y-axis.
The multilayer substrate according to (5).

(8)
The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line, the fourth straight line, and the fifth straight line are parallel to the X-axis,
The second straight line, the third straight line, and the sixth straight line overlap each other when viewed in the X-axis direction,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the Y-axis,
An end of the third straight line on the negative side of the Y axis is connected to an end of the fourth straight line on the negative side of the X axis,
The end of the fifth straight line on the positive side of the X-axis is connected to the end of the sixth straight line on the positive side of the Y-axis.
The multilayer substrate according to (5).

(9)
The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line and the second straight line are located on the negative side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the Y axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The fifth straight line and the sixth straight line are located on the negative side of the X-axis from a third portion of the third outer edge excluding the fifth straight line and the sixth straight line,
The multilayer substrate according to (5).

(10)
The multilayer substrate includes:
is provided in the laminate, is located on the negative side of the Z-axis from the first radiation conductor layer, and overlaps with the first radiation conductor layer when viewed in the Z-axis direction, and , a second radiation conductor layer having a second outer edge including a third straight line and a fourth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a third feeding point located closest to the third straight line, and is not orthogonal to the third straight line when viewed in the Z-axis direction. The third wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a fourth feeding point located closest to the fourth straight line, and is not orthogonal to the fourth straight line when viewed in the Z-axis direction. The fourth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction,
the first straight line is parallel to the third straight line,
the second straight line is parallel to the fourth straight line,
The X-axis is perpendicular to the Z-axis,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the X-axis,
An end of the third straight line on the positive side of the X-axis is connected to an end of the fourth straight line on the positive side of the X-axis,
The first wiring layer intersects the first straight line and the third straight line in a non-perpendicular manner when viewed in the Z-axis direction,
The second wiring layer intersects the second straight line and the fourth straight line in a non-perpendicular manner when viewed in the Z-axis direction.
The multilayer substrate according to (1) or (2).

(11)
The multilayer substrate comprises:
an annular ground conductor layer provided on the laminate and positioned on the positive side of the ground conductor layer along the Z axis,
In addition,
The annular ground conductor layer has a ring shape surrounding the first radiation conductor layer when viewed in the Z-axis direction.
A multilayer substrate according to any one of (1) to (10).

(12)
The first radiation conductor layer includes the first straight line, the second straight line, the seventh straight line, and the eighth straight line when viewed in the Z-axis direction, and has a rectangular shape when viewed in the Z-axis direction. It has
In a direction perpendicular to the first straight line, a distance from the center of the first straight line to the annular ground conductor layer is defined as a first distance,
In a direction perpendicular to the second straight line, a distance from the center of the second straight line to the annular ground conductor layer is defined as a second distance,
In the direction perpendicular to the seventh straight line, the distance from the center of the seventh straight line to the annular ground conductor layer is defined as a third distance,
In the direction perpendicular to the eighth straight line, the distance from the center of the eighth straight line to the annular ground conductor layer is defined as a fourth distance,
the first distance, the second distance, the third distance, and the fourth distance are equal to each other;
The multilayer substrate according to (11).

(13)
The first wiring layer and the second wiring layer include matching portions,
The matching portion does not overlap the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to any one of (1) to (12).

(14)
The first wiring layer and the second wiring layer include a stub portion,
The stub portion does not overlap the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to any one of (1) to (12).

(15)
The multilayer substrate includes:
rigid part,
a flexible part;
It has
The length of the flexible part in the Z-axis direction is shorter than the length of the rigid part in the Z-axis direction.
The multilayer substrate according to any one of (1) to (14).

(16)
The multilayer substrate includes:
An annular ground conductor layer provided in the laminate and located on the positive side of the Z axis from the ground conductor layer,
Furthermore, we are equipped with
The annular ground conductor layer has a ring shape surrounding the first radiation conductor layer when viewed in the Z-axis direction,
In the rigid portion, no ground conductor is provided between the annular ground conductor layer and the ground conductor layer.
The multilayer substrate according to (15).

(17)
is provided in the laminate, is located on the negative side of the Z-axis from the first wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first wiring layer. a seventh wiring layer connected to
is provided in the laminate, is located on the negative side of the Z-axis from the second wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second wiring layer. an eighth wiring layer connected to
Furthermore, it is equipped with
The multilayer substrate according to (15) or (16).

(18)
The seventh wiring layer and the eighth wiring layer do not overlap with the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to (17).

(19)
a first substrate;
a second substrate having flexibility;
It is equipped with
The first substrate is
a first laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the first laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
is provided in the first laminate, is located on the negative side of the Z-axis from the first radiation conductor layer, and is located closest to the first straight line within the first outer edge. a first wiring layer that is electrically connected to the first radiation conductor layer at a first feeding point located at a first feeding point, and that intersects the first straight line in a non-perpendicular manner when viewed in the Z-axis direction; ,
Provided in the first laminate, located on the negative side of the Z axis from the first radiation conductor layer, and located closest to the second straight line within the first outer edge. a second wiring layer that is electrically connected to the first radiation conductor layer at a second feeding point that is connected to the second line and that intersects the second straight line in a non-perpendicular manner when viewed in the Z-axis direction; and,
It contains
The second substrate is
a second laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a seventh wiring layer provided in the second laminate and electrically connected to the first wiring layer;
an eighth wiring layer provided in the second laminate and electrically connected to the second wiring layer;
The first layer is provided in the second laminate, is located on the negative side of the Z-axis from the seventh wiring layer and the eighth wiring layer, and is located on the negative side of the Z-axis when viewed in the Z-axis direction. a radiation conductor layer, a ground conductor layer overlapping with the seventh wiring layer and the eighth wiring layer;
It contains
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction,
The second substrate is located on the negative side of the Z-axis from the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.
antenna module.

10, 10a to 10j, 210, 210a: Multilayer substrates 12, 112: Laminated bodies 14a to 14f, 114a to 114c: Insulator layers 15a to 15c, 115a, 115b: Protective layer 16: First radiation conductor layer 20: First Wiring layer 22: Second wiring layer 24, 26, 124-127: External electrode 28: Ground conductor layer 30: Annular ground conductor layer 100, 100a: Antenna module 120: Seventh wiring layer 122: Eighth wiring layer 128: No. 1 ground conductor layer 129: 2nd ground conductor layer 216: 2nd radiation conductor layer 220: 3rd wiring layer 222: 4th wiring layer 316: 3rd radiation conductor layer 320: 5th wiring layer 322: 6th wiring layer A1 : First area A2: Second area A3: Rigid part A4: Flexible part E1: First straight line E2: Second straight line E3: Third straight line E4: Fourth straight line E5: Fifth straight line E6: Sixth straight line EE1: 1st outer edge EE2: 2nd outer edge EE3: 3rd outer edge EP1: 1st portion EP2: 2nd portion EP3: 3rd portion H, h1, h2: Opening P1: 1st feeding point P2: 2nd feeding point P3: 1st 3rd feeding point P4: 4th feeding point P5: 5th feeding point P6: 6th feeding point S: Solder ST: Stub parts v1 to v18: Interlayer connection conductor

Claims (19)

A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
a ground provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer, and overlapping with the first radiation conductor layer when viewed in the Z-axis direction; a conductor layer;
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a first feeding point located closest to the first straight line, and is not orthogonal to the first straight line when viewed in the Z-axis direction. The first wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the first radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the first outer edge; is electrically connected to the first radiation conductor layer at a second feeding point located closest to the second straight line, and is not orthogonal to the second straight line when viewed in the Z-axis direction. The second wiring layer intersects as shown in FIG.
It is equipped with
Multilayer board. A region through which the first straight line passes when the first straight line is moved in a direction perpendicular to the first straight line when viewed in the Z-axis direction is defined as a first region,
The first wiring layer straddles the first region and a region outside the first region when viewed in the Z-axis direction,
A region through which the second straight line passes when the second straight line is moved in a direction perpendicular to the second straight line when viewed in the Z-axis direction is defined as a second region,
The second wiring layer straddles the second region and a region outside the second region when viewed in the Z-axis direction.
The multilayer substrate according to claim 1. a second radiation conductor layer provided on the laminate and having a second outer edge including a third straight line and a fourth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a third feeding point located closest to the third straight line, and is not orthogonal to the third straight line when viewed in the Z-axis direction. The third wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a fourth feeding point located closest to the fourth straight line, and is not orthogonal to the fourth straight line when viewed in the Z-axis direction. The fourth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The first straight line and the second straight line are located on the positive side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the X-axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The multilayer substrate according to claim 3. a third radiation conductor layer provided in the laminate and having a third outer edge including a fifth straight line and a sixth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the third radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the third outer edge. is electrically connected to the third radiation conductor layer at a fifth feeding point located closest to the fifth straight line, and is not orthogonal to the fifth straight line when viewed in the Z-axis direction. The fifth wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the third radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the third outer edge. is electrically connected to the third radiation conductor layer at a sixth feeding point located closest to the sixth straight line, and is not perpendicular to the sixth straight line when viewed in the Z-axis direction. The sixth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the third radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 3. The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The first straight line and the second straight line are located on the positive side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the X-axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The fifth straight line and the sixth straight line are located on the positive side of the X-axis from a third portion of the third outer edge excluding the fifth straight line and the sixth straight line,
The multilayer substrate according to claim 5. The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line, the third straight line, and the fifth straight line are parallel to the X-axis,
The second straight line, the fourth straight line, and the sixth straight line overlap each other when viewed in the X-axis direction,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the Y-axis,
An end of the third straight line on the positive side of the X-axis is connected to an end of the fourth straight line on the positive side of the Y-axis,
The end of the fifth straight line on the positive side of the X-axis is connected to the end of the sixth straight line on the positive side of the Y-axis.
The multilayer substrate according to claim 5. The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line, the fourth straight line, and the fifth straight line are parallel to the X-axis,
The second straight line, the third straight line, and the sixth straight line overlap each other when viewed in the X-axis direction,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the Y-axis,
An end of the third straight line on the negative side of the Y axis is connected to an end of the fourth straight line on the negative side of the X axis,
The end of the fifth straight line on the positive side of the X-axis is connected to the end of the sixth straight line on the positive side of the Y-axis.
The multilayer substrate according to claim 5. The second radiation conductor layer is located on the positive side of the X axis of the first radiation conductor layer,
The X-axis is orthogonal to the Z-axis,
The Y-axis is orthogonal to the X-axis and the Z-axis,
The third radiation conductor layer is located on the positive side of the X axis of the second radiation conductor layer,
The first straight line and the second straight line are located on the negative side of the X-axis from a first portion of the first outer edge excluding the first straight line and the second straight line,
The third straight line and the fourth straight line are located on the negative side of the Y axis from a second portion of the second outer edge excluding the third straight line and the fourth straight line,
The fifth straight line and the sixth straight line are located on the negative side of the X-axis from a third portion of the third outer edge excluding the fifth straight line and the sixth straight line,
The multilayer substrate according to claim 5. The multilayer substrate includes:
is provided in the laminate, is located on the negative side of the Z-axis from the first radiation conductor layer, and overlaps with the first radiation conductor layer when viewed in the Z-axis direction, and , a second radiation conductor layer having a second outer edge including a third straight line and a fourth straight line when viewed in the Z-axis direction;
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a third feeding point located closest to the third straight line, and is not orthogonal to the third straight line when viewed in the Z-axis direction. The third wiring layer intersects like this,
provided in the laminate, located on the negative side of the Z-axis from the second radiation conductor layer and on the positive side of the Z-axis from the ground conductor layer, and within the second outer edge. is electrically connected to the second radiation conductor layer at a fourth feeding point located closest to the fourth straight line, and is not orthogonal to the fourth straight line when viewed in the Z-axis direction. The fourth wiring layer intersects like this,
Furthermore, it is equipped with
The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction,
the first straight line is parallel to the third straight line,
the second straight line is parallel to the fourth straight line,
The X-axis is perpendicular to the Z-axis,
An end of the first straight line on the positive side of the X-axis is connected to an end of the second straight line on the positive side of the X-axis,
An end of the third straight line on the positive side of the X-axis is connected to an end of the fourth straight line on the positive side of the X-axis,
The first wiring layer intersects the first straight line and the third straight line in a non-perpendicular manner when viewed in the Z-axis direction,
The second wiring layer intersects the second straight line and the fourth straight line in a non-perpendicular manner when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The multilayer substrate includes:
An annular ground conductor layer provided in the laminate and located on the positive side of the Z axis from the ground conductor layer,
Furthermore, we are equipped with
The annular ground conductor layer has an annular shape surrounding the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The first radiation conductor layer includes the first straight line, the second straight line, the seventh straight line, and the eighth straight line when viewed in the Z-axis direction, and has a rectangular shape when viewed in the Z-axis direction. It has
In a direction perpendicular to the first straight line, a distance from the center of the first straight line to the annular ground conductor layer is defined as a first distance,
In a direction perpendicular to the second straight line, a distance from the center of the second straight line to the annular ground conductor layer is defined as a second distance,
In the direction perpendicular to the seventh straight line, the distance from the center of the seventh straight line to the annular ground conductor layer is defined as a third distance,
In the direction perpendicular to the eighth straight line, the distance from the center of the eighth straight line to the annular ground conductor layer is defined as a fourth distance,
the first distance, the second distance, the third distance, and the fourth distance are equal to each other;
The multilayer substrate according to claim 11. The first wiring layer and the second wiring layer include matching portions,
The matching portion does not overlap the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The first wiring layer and the second wiring layer include a stub portion,
The stub portion does not overlap the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The multilayer substrate includes:
rigid part,
a flexible part;
It has
The length of the flexible part in the Z-axis direction is shorter than the length of the rigid part in the Z-axis direction.
The multilayer substrate according to claim 1 or claim 2. The multilayer substrate includes:
An annular ground conductor layer provided in the laminate and located on the positive side of the Z axis from the ground conductor layer,
Furthermore, we are equipped with
The annular ground conductor layer has a ring shape surrounding the first radiation conductor layer when viewed in the Z-axis direction,
In the rigid portion, no ground conductor is provided between the annular ground conductor layer and the ground conductor layer.
The multilayer substrate according to claim 15. is provided in the laminate, is located on the negative side of the Z-axis from the first wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first wiring layer. a seventh wiring layer connected to
is provided in the laminate, is located on the negative side of the Z-axis from the second wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second wiring layer. an eighth wiring layer connected to
Furthermore, it is equipped with
The multilayer substrate according to claim 15. The seventh wiring layer and the eighth wiring layer do not overlap with the first radiation conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 17. a first substrate;
a second substrate having flexibility;
It is equipped with
The first substrate is
a first laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a first radiation conductor layer provided in the first laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;
is provided in the first laminate, is located on the negative side of the Z-axis from the first radiation conductor layer, and is located closest to the first straight line within the first outer edge. a first wiring layer that is electrically connected to the first radiation conductor layer at a first feeding point located at a first feeding point, and that intersects the first straight line in a non-perpendicular manner when viewed in the Z-axis direction; ,
Provided in the first laminate, located on the negative side of the Z axis from the first radiation conductor layer, and located closest to the second straight line within the first outer edge. a second wiring layer that is electrically connected to the first radiation conductor layer at a second feeding point that is connected to the second line and that intersects the second straight line in a non-perpendicular manner when viewed in the Z-axis direction; and,
It contains
The second substrate is
a second laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction;
a seventh wiring layer provided in the second laminate and electrically connected to the first wiring layer;
an eighth wiring layer provided in the second laminate and electrically connected to the second wiring layer;
The first layer is provided in the second laminate, is located on the negative side of the Z-axis from the seventh wiring layer and the eighth wiring layer, and is located on the negative side of the Z-axis when viewed in the Z-axis direction. a radiation conductor layer, a ground conductor layer overlapping with the seventh wiring layer and the eighth wiring layer;
It contains
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction,
The second substrate is located on the negative side of the Z-axis from the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.
antenna module.

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