JP2024037291A - Industrial machinery and wiring methods in industrial machinery - Google Patents

Abstract

[Problem] To provide a wiring structure and wiring method that can be laid out in a space-saving manner in industrial machinery. [Solution] An injection molding machine (100) includes a servo amplifier (143), motors (151-154), and wiring (180) arranged in at least a part of a path connecting the servo amplifier and the motor. The wiring (180) has a substrate structure in which a conductive portion (182) is arranged on at least one insulating layer (181). [Selected Figure] Figure 3

Description

The present disclosure relates to an industrial machine and a wiring method in the industrial machine, and more particularly to a wiring method between devices provided in the industrial machine.

JP 2018-008397A (Patent Document 1) discloses that each device, such as a mold clamping device that clamps a mold and an injection device that melts and injects resin into the mold, is operated by a servo motor. An electric injection molding machine configured to do this is disclosed. In the injection molding machine disclosed in Japanese Unexamined Patent Publication No. 2018-008397 (Patent Document 1), servo motors that drive each device are driven by a servo amplifier.

JP2018-008397A

The motor used in the above electric injection molding machine may be supplied with a relatively large drive current from a servo amplifier in order to output a large drive force. Therefore, the power supply path from the servo amplifier to the motor is generally made of heat-resistant cables such as flame-retardant polyflex cables (MLFC), or copper or aluminum to withstand the heat generated by the drive current. A shaped busbar is used.

On the other hand, MLFCs and busbars have relatively large volumes to ensure heat resistance. Therefore, when configuring a power supply path using MLFCs or bus bars, a large space is required to place these components inside the device and/or control panel, which may restrict the placement of equipment or cable installation. obtain.

The present disclosure has been made to solve such problems, and its purpose is to provide a wiring structure and a wiring method that can be laid in an industrial machine in a space-saving manner.

An industrial machine according to an aspect of the present disclosure includes a first device, a second device, and wiring arranged on at least a portion of a path connecting the first device and the second device. The wiring has a substrate structure in which a conductive portion is arranged on at least one insulating layer.

A wiring method according to another aspect of the present disclosure relates to a wiring method within an industrial machine including a first device and a second device. The wiring method includes (a) preparing a wiring having a substrate structure in which a conductive part is arranged on at least one insulating layer, (b) arranging the wiring on a structural member of an industrial machine, and (c) and connecting the first device and the second device using the wiring.

In the industrial machine according to the present disclosure, wiring having a board structure is used as part of the connection between devices provided in the industrial machine. As a result, the space occupied by the wiring within the industrial machine can be reduced, and space for placing other equipment can be secured.

1 is a diagram for explaining the configuration of an injection molding machine that is an example of an industrial machine according to an embodiment. FIG. 3 is a diagram for explaining a wiring route of a motor in an injection molding machine. FIG. 3 is a diagram showing a cross-sectional structure of board wiring. It is a figure which shows the top view of board wiring of a modification. It is a figure which shows the 1st example of the laying method of board wiring. It is a figure which shows the 2nd example of the laying method of board wiring. It is a flowchart for explaining the wiring method in industrial machinery. FIG. 3 is a diagram showing an example in which board wiring is applied to wiring within a servo amplifier.

Embodiments of the present disclosure will be described in detail below with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated.

[Embodiment]
(Configuration of injection molding machine)
FIG. 1 is a diagram for explaining the configuration of an injection molding machine 100, which is an example of an industrial machine according to an embodiment. For convenience of explanation, the floor surface on which the injection molding machine 100 is arranged is assumed to be the XY plane, and the direction perpendicular to the floor surface is assumed to be the Z-axis direction. The positive direction of the Z-axis is sometimes referred to as the upper side or upper side, and the negative direction is sometimes referred to as the lower side or lower side. Although the injection molding machine 100 in the first embodiment is shown as a horizontal injection molding machine, it is not limited to the horizontal type, and may be a vertical injection molding machine. Further, in the following description, an example will be described in which the industrial machine is an injection molding machine, but the features of the present disclosure are applicable to, for example, a machine tool, a press device, an extrusion molding machine, a laser processing machine, and/or an industrial machine. It is also applicable to other industrial machines such as industrial robots.

Referring to FIG. 1, an injection molding machine 100 includes a mold clamping device 110 for clamping a mold, an injection device 120 for melting and injecting injection material, an operation panel 130, and a control device 140. It is composed of: In FIG. 1, the mold clamping device 110 is arranged on the negative side of the X-axis with respect to the injection device 120.

The mold clamping device 110 includes a bed 111, a fixed platen 112, a mold clamping housing 113, a movable platen 114, a tie bar 115, a mold clamping mechanism 116, molds 117 and 118, and a ball screw 119. The bed 111 is arranged on the floor, and equipment such as a fixed platen 112, a mold clamping housing 113, a movable platen 114, etc. are mounted on the upper surface of the bed 111.

The fixed platen 112 is fixed to the end of the bed 111 on the side closer to the injection device 120 (that is, in the positive direction of the X-axis). The mold clamping housing 113 is disposed on the bed 111 at the end in the negative direction of the X-axis. The fixed platen 112 and the mold clamping housing 113 are connected by a tie bar 115 including a plurality of bars. The mold clamping housing 113 is movable on the bed 111 in the X-axis direction.

The movable platen 114 is arranged on the bed 111 between the fixed platen 112 and the mold clamping housing 113. The movable platen 114 is configured to be movable in the X-axis direction. The mold clamping housing 113 and the movable platen 114 are connected by a mold clamping mechanism 116. The mold clamping mechanism 116 has a toggle mechanism. A ball screw 119 is connected to the toggle mechanism, and by driving a servo motor 151 disposed in the mold clamping housing 113 to rotate the ball screw 119, the movable platen 114 is moved relative to the mold clamping housing 113. It can be relatively moved in the X-axis direction. Note that a direct-acting cylinder driven by hydraulic pressure may be used as the mold clamping mechanism 116.

Molds 117 and 118 are arranged on the movable platen 114 and the fixed platen 112, respectively. The mold 117 and the mold 118 are arranged opposite to each other between the movable platen 114 and the fixed platen 112. By moving the mold 117 in the X-axis direction using the mold clamping mechanism 116, the molds 117 and 118 can be brought into close contact with each other, or the mold 117 can be separated from the mold 118. In the following description, the process of moving the molds 117 and 118 from a state where they are separated to a state where they are in close contact with each other will be referred to as "mold clamping." Further, the process of moving the molds 117 and 118 from a state in which they are in close contact to a state in which they are separated from each other is referred to as "mold opening."

With the molds 117 and 118 in close contact with each other in the mold clamping process, a molten material (resin) is filled inside the mold and cooled to solidify, thereby molding a product into a desired shape. can. After molding the product, with the mold 117 separated from the mold 118 during the mold opening process, a protrusion mechanism (not shown) disposed on the movable platen 114 is operated to remove the molded product from the mold. It can be taken out from 117. The ejection mechanism is driven by a servo motor 152 located on the movable platen 114. Note that the process of taking out the product using the ejecting mechanism is referred to as the "ejecting" process.

Injection device 120 includes a base 121, a heating cylinder 122, a drive device 124, a hopper 125, a nozzle touch device 127, and a temperature sensor 128. The base 121 is arranged on the floor surface of the bed 111 on the positive side of the X-axis, and the drive device 124 is mounted on the upper surface thereof. Servo motors 153 and 154 are arranged in the drive device 124.

A heating cylinder 122 extending in the X-axis direction is arranged in the drive device 124. The heating cylinder 122 includes a heater (not shown) for heating the inside, a screw 123, and an injection nozzle 126. The screw 123 is driven by a servo motor 153 in the drive device 124, and is configured to be rotatable about the X-axis direction as a rotation axis. Further, the screw 123 is configured to be movable in the X-axis direction by a servo motor 154. The injection nozzle 126 is arranged at the end of the heating cylinder 122 on the mold clamping device 110 side (that is, the end in the negative direction of the X-axis). The heating cylinder 122 heats and melts the bead-shaped resin material introduced from the hopper 125 and kneads it using the screw 123 to generate a molten material. The process of melting the resin material in this way is called a "plasticization" process.

The nozzle touch device 127 is configured by, for example, a mechanism using a hydraulic cylinder or a mechanism using a ball screw, and connects the drive device 124 and the fixed platen 112 of the mold clamping device 110. When the nozzle touch device 127 is configured by a mechanism using a ball screw, the nozzle touch device 127 is driven by the drive device 124 and moves the drive device 124 and the heating cylinder 122 in the X-axis direction. The injection nozzle 126 is brought into contact with the sprue bush of the mold 118 in the mold clamping device 110 by the nozzle touch device 127, and the molten material is injected from the injection nozzle 126, thereby filling the cavities of the molds 117 and 118 with the molten material. be done. The servo motor 154 applies pressure to the molten material by moving the screw 123 in the heating cylinder 122 in the negative direction of the Maintain constant material pressure.

Note that the configuration of the nozzle touch mechanism is not limited to the configuration in which the entire injection device is moved by a ball screw disposed between the fixed platen 112 and the drive device 124 as described above, and other configurations are also possible. good. For example, the apparatus frame and the fixing member at the rear of the heating cylinder may be connected using a ball screw, and the heating cylinder itself may be moved toward the mold. Alternatively, the slide base on which the injection device is mounted and the device frame may be connected using a ball screw, and the injection device may be moved together with the slide base to bring the injection nozzle into contact with the mold.

Note that the process of injecting the molten material into the molds 117 and 118 is referred to as an "injection" process. Further, after the injection process, the process of cooling the molten material filled in the molds 117 and 118 by maintaining it at a constant pressure is referred to as a "holding pressure" process.

Temperature sensor 128 is located near injection nozzle 126 in heating cylinder 122 . Temperature sensor 128 detects the temperature of the molten material inside heating cylinder 122 and outputs it to control device 140 . The control device 140 controls the heater based on the detected value of the temperature sensor 128 to adjust the temperature of the molten material to a desired temperature.

When the holding pressure step is completed, a mold opening step and an ejection step are performed to take out the molded product.

The injection molding machine 100 can continuously form products by cyclically repeating a mold clamping process, an injection process, a pressure holding process, a plasticizing process, a mold opening process, and an ejection process.

The control device 140 is housed inside the base 121. Control device 140 includes a CPU (Central Processing Unit) 141, a memory 142, and a servo amplifier 143 for driving servo motors 151 to 154. The control device 140 acquires detection values of various sensors arranged in the injection molding machine 100 and controls the injection molding machine 100 in an integrated manner.

The operation panel 130 is a device for an operator to operate the injection molding machine 100, and includes a display device such as a liquid crystal display and an input device such as a keyboard. The operation panel 130 is connected to the control device 140 and can acquire and display the status of the injection molding machine 100 and can output user operation signals from the input device to the control device 140. The operation panel 130 may be a touch panel in which a display device and an input device are integrated. Furthermore, the operation panel 130 may be attached to the bed 111 or the base 121 of the injection molding machine 100, or may be arranged at a position independent of the injection molding machine 100.

FIG. 2 is a diagram for explaining the wiring route of the motor in the injection molding machine 100. As described above, the injection molding machine 100 includes the servo motor 151 for driving the toggle mechanism, the servo motor 152 for driving the ejection mechanism, the servo motor 153 for rotating the screw 123, and the screw 123. A servo motor 154 is provided for movement in the X-axis direction. These servo motors 151 to 154 are supplied with power from a servo amplifier 143 disposed within the control device 140. Drive power is supplied through power supply paths 171 to 174, respectively.

A relatively large drive current of tens of amperes or more may be supplied from the servo amplifier to the servo motor, so from the viewpoint of heat resistance against heat generated by the drive current, this power supply path should include a heat-resistant cable such as MLFC, Alternatively, a bus bar made of copper or aluminum is generally used.

On the other hand, MLFCs and busbars have relatively large volumes to ensure heat resistance. Therefore, when configuring a power supply path using MLFCs or bus bars, a large space is required to place these components inside the device and/or control panel, which may restrict the placement of equipment or the installation of cables. obtain. Alternatively, the size of the injection molding machine body may be increased in order to secure space for laying the cable.

Therefore, in this embodiment, a configuration is provided in which the space required for the power supply path is reduced by using thin wiring having a substrate structure (hereinafter also referred to as "substrate wiring") as a part of the power supply path. Adopt. Here, the problem of heat generation also occurs when board wiring is used, but the board wiring is not connected to structural members such as frames that support the main body of the injection molding machine, casings that cover the equipment, and/or other equipment. The Joule heat generated by the drive current can be dissipated by laying it in contact with a cooler or the like for cooling the drive current. With such a configuration, it is possible to construct a power supply path in a space-saving manner while efficiently dissipating heat.

(Structure of board wiring)
FIG. 3 is a diagram showing a cross-sectional configuration of substrate wiring 180 used in this embodiment. The substrate wiring 180 has a band-shaped structure including at least two insulating layers 181 and at least one conductive part 182 disposed between the insulating layers 181. In the example of FIG. 3, the direction in which the insulating layer 181 and the conductive portion 182 are stacked is the Z-axis direction, and the direction in which the board wiring 180 extends is the X-axis direction. The substrate wiring 180 shown in FIG. 3 has a configuration in which five insulating layers 181 and four conductive parts 182 are alternately stacked in the Z-axis direction in the figure. The number is not limited to this.

The insulating layer 181 is made of resin such as phenol, epoxy, glass epoxy, polyimide, or polyester. The insulating layer 181 may be a rigid substrate without flexibility, or may be a flexible substrate that has flexibility and can be bent. For the conductive portion 182, a metal member such as copper or aluminum is used.

Although an AC motor or a DC motor is used as the servo motor, the board wiring 180 may be used individually for each phase of the power supply path, or the insulated conductive portion 182 within one board wiring 180 may be used for each phase. may be assigned. Furthermore, in order to ensure current capacity, multiple layers of conductive portions 182 within the substrate wiring 180 may be assigned as paths for the same phase.

Further, in the substrate wiring 180, a heat transfer member 183 having a larger heat transfer coefficient than the insulating layer 181 is arranged on the outer surface of the outermost insulating layer 181. As the heat transfer member 183, a metal member such as copper can be used, but it is electrically insulated from the conductive portion 182 inside the board wiring 180. By providing the heat transfer member 183, when the substrate wiring 180 is placed on a structural member, the heat generated in the conductive portion 182 can be efficiently transferred to the structural member. Note that the heat transfer member 183 is not an essential structure, and if the amount of heat generated is small, the structure may be such that the heat transfer member 183 is not provided and the insulating layer 181 is brought into direct contact with a structural member or the like. Further, when the heat transfer member 183 is disposed, it is sufficient that it is disposed at least on the side of the outermost insulating layer 181 that comes into contact with a structural member or the like.

Further, when a conductive material such as metal is used as the heat transfer member 183, the heat transfer member 183 can also function as an electromagnetic shield by connecting the heat transfer member 183 to a ground potential. In this way, it is possible to reduce the influence on the outside caused by electromagnetic waves caused by the drive current. Furthermore, the influence of external electromagnetic noise on the servo motor can also be reduced.

Although not shown in FIG. 3, a connection terminal or lead wire is provided at the end of the substrate wiring 180 for electrically connecting the internal conductive portion 182 to the outside. Connections to the connection terminals of the servo amplifier 143 and servo motors 151 to 154 (FIGS. 1 and 2), as well as connections between different board wirings, can be made using the above lead wires, or by connecting both connection terminals to each other using the MLFC. This is done using other cables such as

In the example of FIG. 3, the insulating layer 181 is arranged on both sides of the conductive part 182 in the stacking direction, and the conductive part 182 is covered with the insulating layer 181, but the outermost insulating layer A configuration may be adopted in which one of the conductive parts 181 is not provided and the conductive part 182 is exposed. In this case, it is attached so that the surface on which the outermost insulating layer 181 is placed is in contact with the structural member or the like. That is, it is sufficient that at least one insulating layer 181 is disposed on the substrate wiring 180.

Note that in the above example, the "servo amplifier 143" corresponds to the "first device" of the present disclosure, and each of the "servo motors 151 to 154" corresponds to the "second device" of the present disclosure.

FIG. 4 is a diagram showing a plan view of a modified example of board wiring 180A. In the substrate wiring 180A, two conductive parts 182A and 182B are arranged in parallel in the same layer along the wiring extending direction (X-axis direction in the figure). Note that although the conductive part 182A and the conductive part 182B are arranged in the same layer, they are electrically insulated from each other.

(Example of laying board wiring)
5 and 6 are diagrams showing an example of laying the board wiring 180 as described above. FIG. 5 is a diagram showing an example of a case where board wiring 180 is laid on a structural member of the injection molding machine 100. In FIG. 5, a channel base 200, which is a base portion of the frame of the injection molding machine 100, and a post 210 extending vertically from the channel base 200 are illustrated as structural members. Since the substrate wiring 180 basically has a flat plate shape, it is placed in contact with the flat portions of the channel base 200 and the post 210. If there is a difference in level and/or if the extension direction is bent from the vertical direction to the horizontal direction as shown in FIG. Connected using Note that when the board wiring 180 is formed of a flexible substrate, the same wiring may be used for the stepped portion and the bent portion.

FIG. 6 is a diagram showing an example in which the board wiring 180 is installed in the cooling pipe 250 inside the injection molding machine 100. The injection molding machine 100 includes a cooling medium such as cooling water, for example, to reduce the influence of heat from the heating cylinder 122 (FIG. 1) or to cool the molds 117, 118 (FIG. 1). Flowing cooling piping 250 may be provided. When such a cooling pipe 250 is arranged, the heat dissipation effect can be further improved by arranging the board wiring 180 in contact with the cooling pipe 250. Note that the board wiring 180 is connected at its end to other board wiring or each device such as a servo amplifier or a servo motor using a flexible cable 186 or a bus bar.

(Wiring method)
FIG. 7 is a flowchart for explaining a wiring method for injection molding machine 100 using board wiring 180 according to this embodiment. In FIG. 7, an example will be described in which the board wiring 180 is used as a part of the wiring path connecting the servo amplifier and the servo motor as described above.

Referring to FIG. 7, in step S10, board wiring 180 that conforms to specifications such as the rated current that can be output from the servo amplifier is prepared. Next, in step S20, a wiring route is considered based on the arrangement of the equipment (servo amplifier/servo motor) arranged in the injection molding machine 100, and the wiring route is examined to connect the structural members, casing, and/or cooling piping of the injection molding machine 100 to the substrate. Lay the wiring 180. Then, in step S30, the servo amplifier and the servo motor are connected using the board wiring 180 in part of the wiring route and using cables and/or bus bars in other parts.

In addition, in the above description, the case where the board wiring 180 is used as a part of the power wiring for connecting the servo amplifier and the servo motor was explained as an example, but for example, the power supply wiring to a hydraulic pump unit (not shown), Alternatively, the board wiring 180 may be used as part of other power wiring, such as power supply wiring to a heater. Furthermore, the board wiring 180 may be used not only for power wiring but also for control wiring that transmits control signals between sensors and/or devices.

The substrate wiring of this embodiment is not only used as wiring for connecting devices within an injection molding machine, but also can be applied to wiring used within the device. FIG. 8 is a diagram showing an example in which board wiring 180 is applied to wiring within the servo amplifier 143. In FIG. 8, an example is shown in which substrate wiring 180 is used as a wiring path connecting the power semiconductor in the servo amplifier 143 and the connection terminal.

(Example of application to internal wiring of equipment)
Referring to FIG. 8, board wiring 180 is arranged on cooling fins 350 for heat radiation within servo amplifier 143. A semiconductor 300 is arranged via a heat spreader 310 formed of a metal plate such as a copper plate or an aluminum plate. Although not shown in FIG. 8, the semiconductor 300 and the substrate wiring 180 are electrically connected by wire bonding or the like. Further, a connection terminal 190 is arranged on the board wiring 180, and other equipment in the servo amplifier 143 and the semiconductor 300 are connected using a cable 187 or a bus bar.

With this configuration, instantaneous heat generated in the semiconductor 300 can be absorbed by the heat spreader 310, and the heat of the semiconductor 300 and the board wiring 180 can be radiated by the cooling fins 350. By using the board wiring 180, a portion of the cables and bus bars within the servo amplifier 143 can be eliminated, and space within the servo amplifier 143 can be secured.

In the example of FIG. 8, the "semiconductor 300" corresponds to the "first device" of the present disclosure, and the "connection terminal 190" corresponds to the "second device" of the present disclosure. Further, "cooling fins 350" corresponds to the "cooling section" in the present disclosure.
[Mode]
(Section 1) An industrial machine according to one embodiment includes a first device, a second device, and wiring arranged on at least a portion of a path connecting the first device and the second device. The wiring has a substrate structure in which a conductive portion is arranged on at least one insulating layer.

(Section 2) In the industrial machine described in Item 1, the wiring is a power wiring that transmits motive power using a conductive portion.

(Section 3) In the industrial machine according to Item 1 or 2, the wiring further includes a heat transfer member disposed outside the outermost insulating layer of at least one insulating layer. The heat transfer member has a higher heat transfer coefficient than the at least one insulating layer.

(Section 4) In the industrial machine according to Item 3, the heat transfer member is connected to ground potential.

(Section 5) In the industrial machine according to any one of Items 1 to 4, the wiring is arranged in contact with a structural member within the industrial machine.

(Section 6) The industrial machine according to any one of Items 1 to 4 further includes a cooling pipe through which a cooling medium flows to cool the inside of the apparatus. The wiring is placed in contact with the cooling pipe.

(Section 7) In the industrial machine according to any one of Items 1 to 6, the first device is a servo amplifier, and the second device is driven by electric power supplied from the servo amplifier. It's a motor.

(Section 8) The industrial machine according to any one of Items 1 to 5 further includes a servo amplifier including a semiconductor, a connection terminal, and a cooling section for cooling the semiconductor. The first device is a semiconductor, and the second device is a connection terminal. The wiring is placed in contact with the cooling section.

(Section 9) The industrial machine according to any one of Items 1 to 8 is an injection molding machine.
(Section 10) In the industrial machine according to Item 9, the wiring is arranged in contact with a structural member within the industrial machine.

(Section 11) The industrial machine according to Item 9 further includes a cooling pipe through which a cooling medium flows to cool the inside of the apparatus. The wiring is placed in contact with the cooling pipe.

(Section 12) In the industrial machine described in Item 9, the first device is a servo amplifier, and the second device is a motor driven by electric power supplied from the servo amplifier.

(Section 13) The industrial machine according to Item 9 further includes a servo amplifier including a semiconductor, a connection terminal, and a cooling section for cooling the semiconductor. The first device is a semiconductor, and the second device is a connection terminal. The wiring is placed in contact with the cooling section.

(Section 14) A wiring method according to one embodiment relates to a wiring method within an industrial machine including a first device and a second device. The wiring method includes the following steps:
(a) preparing a wiring having a substrate structure in which a conductive part is arranged in at least one insulating layer;
(b) placing the wiring on a structural member of the industrial machine;
(c) Connecting the first device and the second device using wiring.

The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive.

100 injection molding machine, 110 mold clamping device, 111 bed, 112 fixed platen, 113 mold clamping housing, 114 movable platen, 115 tie bar, 116 mold clamping mechanism, 117, 118 mold, 119 ball screw, 120 injection device, 121 base stand, 122 heating cylinder, 123 screw, 124 drive device, 125 hopper, 126 injection nozzle, 127 nozzle touch device, 128 temperature sensor, 130 operation panel, 140 control device, 141 CPU, 142 memory, 143 servo amplifier, 151 to 154 Servo motor, 171-174 Power supply route, 180, 180A Board wiring, 181 Insulating layer, 182, 182A, 182B Conductive part, 183 Heat transfer member, 185-187 Cable, 190 Connection terminal, 200 Channel base, 210 Post, 250 Cooling Piping, 300 Semiconductor, 310 Heat spreader, 350 Cooling fin.

Claims (14)

a first device;
a second device;
Wiring arranged on at least a part of a path connecting the first device and the second device,
The wiring has a substrate structure in which a conductive part is arranged on at least one insulating layer. The industrial machine according to claim 1, wherein the wiring is a power wiring that transmits motive power using the conductive part. The industrial machine according to claim 1, wherein the wiring further includes a heat transfer member disposed outside the outermost insulating layer of the at least one insulating layer and having a larger heat transfer coefficient than the at least one insulating layer. . The industrial machine according to claim 3, wherein the heat transfer member is connected to ground potential. The industrial machine according to any one of claims 1 to 4, wherein the wiring is placed in contact with a structural member within the industrial machine. It further includes a cooling pipe through which a cooling medium flows to cool the inside of the device,
The industrial machine according to claim 1, wherein the wiring is placed in contact with the cooling pipe. The first device is a servo amplifier,
The industrial machine according to claim 1, wherein the second device is a motor driven by electric power supplied from the servo amplifier. Further comprising a servo amplifier including a semiconductor, a connection terminal, and a cooling section for cooling the semiconductor,
The first device is the semiconductor,
The second device is the connection terminal,
The industrial machine according to any one of claims 1 to 4, wherein the wiring is placed in contact with the cooling section. The industrial machine according to any one of claims 1 to 4, wherein the industrial machine is an injection molding machine. The industrial machine according to claim 9, wherein the wiring is arranged in contact with a structural member within the industrial machine. It further includes a cooling pipe through which a cooling medium flows to cool the inside of the device,
The industrial machine according to claim 9, wherein the wiring is placed in contact with the cooling pipe. The first device is a servo amplifier,
The industrial machine according to claim 9, wherein the second device is a motor driven by electric power supplied from the servo amplifier. Further comprising a servo amplifier including a semiconductor, a connection terminal, and a cooling section for cooling the semiconductor,
The first device is the semiconductor,
The second device is the connection terminal,
The industrial machine according to claim 9, wherein the wiring is placed in contact with the cooling section. A method of wiring within an industrial machine including a first device and a second device, comprising the following steps:
(a) preparing a wiring having a substrate structure in which a conductive part is arranged in at least one insulating layer;
(b) placing the wiring on a structural member of the industrial machine;
(c) Connecting the first device and the second device using the wiring.

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