JP2024031857A5 - - Google Patents
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- Publication number
- JP2024031857A5 JP2024031857A5 JP2023129552A JP2023129552A JP2024031857A5 JP 2024031857 A5 JP2024031857 A5 JP 2024031857A5 JP 2023129552 A JP2023129552 A JP 2023129552A JP 2023129552 A JP2023129552 A JP 2023129552A JP 2024031857 A5 JP2024031857 A5 JP 2024031857A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- disposed
- electronic device
- inlet pipe
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002826 coolant Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000002159 abnormal effect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023135642A JP2024031929A (ja) | 2022-08-26 | 2023-08-23 | 温度センサモジュールおよびそれを用いた電子装置 |
| PCT/JP2023/030741 WO2024043336A1 (ja) | 2022-08-26 | 2023-08-25 | 温度センサモジュールおよびそれを用いた電子装置 |
| PCT/JP2023/030740 WO2024043335A1 (ja) | 2022-08-26 | 2023-08-25 | 電子装置 |
| EP23857444.6A EP4580029A4 (en) | 2022-08-26 | 2023-08-25 | TEMPERATURE SENSOR MODULE, AND ELECTRONIC DEVICE IMPLEMENTING IT |
| CN202380061577.0A CN119790587A (zh) | 2022-08-26 | 2023-08-25 | 温度传感器模块以及使用了该温度传感器模块的电子装置 |
| US19/039,278 US20250172434A1 (en) | 2022-08-26 | 2025-01-28 | Temperature sensor module and electronic device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022135105 | 2022-08-26 | ||
| JP2022135105 | 2022-08-26 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023135642A Division JP2024031929A (ja) | 2022-08-26 | 2023-08-23 | 温度センサモジュールおよびそれを用いた電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024031857A JP2024031857A (ja) | 2024-03-07 |
| JP2024031857A5 true JP2024031857A5 (enExample) | 2024-12-05 |
Family
ID=90106305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023129552A Pending JP2024031857A (ja) | 2022-08-26 | 2023-08-08 | 電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2024031857A (enExample) |
-
2023
- 2023-08-08 JP JP2023129552A patent/JP2024031857A/ja active Pending
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