JP2024020937A - processing equipment - Google Patents

Abstract

An object of the present invention is to provide a processing device that efficiently discards wafers and improves productivity while preventing contamination of a production site. A processing apparatus 1 includes a holding part 2 that holds a tape 202 of a wafer unit 200 in an upwardly exposed state, and is configured to be openable and closable so as to cover the wafer unit 200 held by the holding part 2 from above. The lid part 3 includes an ultraviolet ray irradiation part 33 that irradiates the tape 202 of the wafer unit 200 held in the holding part 2 with ultraviolet rays to cure the tape 202 in the closed state. , a tape cutting unit 32 that separates the annular frame 203 and the wafer 201 by cutting the tape 202 between the inner peripheral edge of the annular frame 203 and the outer peripheral edge of the wafer 201 into an annular shape, and the annular frame 203 By separating the tape 202 from the annular frame 203, the tape 202 can be easily peeled off from the annular frame 203. [Selection diagram] Figure 1

Description

The present invention relates to a processing device.

As a method for converting semiconductor wafers into chips, there is a cutting device that divides the workpiece by rotating a cutting blade and abutting the workpiece along the dividing line and moving the workpiece and the cutting blade relative to each other. Are known.

The cutting blade used in such processing equipment optimizes the sharpening state of the abrasive grains by pre-processing (pre-cutting) a sharpening board, dummy wafer, etc. before actual processing (for example, see Patent Document 1) .

Patent No. 2628256

The dummy wafer used for pre-cutting is supported by a frame via tape. Therefore, when disposing of the dummy wafer after use, the frame must be peeled off from the tape, and after curing the adhesive layer of the tape by irradiating it with ultraviolet light using an ultraviolet irradiation device, it is attached to the frame. The tape was peeled off and discarded.

However, if there is no ultraviolet irradiation device nearby, it takes time to move to the ultraviolet irradiation device, which reduces productivity. Furthermore, when the tape is manually peeled off from the frame, there is a risk that the wafer will crack and debris will be scattered, leading to the risk of contaminating the production site.

The present invention has been made in view of the above facts, and aims to provide a processing device that efficiently discards wafers and improves productivity while preventing contamination of the production site.

In order to solve the above-mentioned problems and achieve the objects, the processing apparatus of the present invention is a processing apparatus for processing a wafer unit in which a wafer is supported via an ultraviolet curing tape in the opening of an annular frame having an opening in the center. a holding part that holds the ultraviolet curing tape of the wafer unit in an upwardly exposed state; and a lid part configured to be openable and closable so as to cover the wafer unit held by the holding part from above. and an ultraviolet irradiation unit for curing the ultraviolet curable tape by irradiating the ultraviolet curable tape of the wafer unit held by the holding unit with ultraviolet rays when the lid is in the closed state; a tape cutting unit that separates the annular frame from the wafer by annularly cutting the ultraviolet curable tape between the inner peripheral edge of the annular frame and the outer peripheral edge of the wafer; By separating the frame and the wafer, the ultraviolet curable tape can be easily peeled off from the annular frame.

In the processing apparatus, the holding section includes a frame holding section that holds the annular frame of the wafer unit, and an opening that allows the wafer separated from the annular frame by the tape cutting unit to freely fall, and is attached to any storage container. It may be possible to collect wafers by installing the device on top of the device.

In the processing apparatus, the ultraviolet irradiation unit may be disposed at a position opposite to a region of the annular frame to which the ultraviolet curable tape is attached.

The present invention has the advantage of being able to efficiently dispose of wafers and improve productivity while preventing contamination of the production site.

FIG. 1 is a cross-sectional view schematically showing a configuration example of a processing apparatus according to a first embodiment. FIG. 2 is a schematic perspective view of a wafer unit to be processed by the processing apparatus shown in FIG. FIG. 3 is a cross-sectional view schematically showing the processing apparatus shown in FIG. 1 during processing. FIG. 4 is a cross-sectional view schematically showing a configuration example of a processing device according to the second embodiment. FIG. 5 is a cross-sectional view schematically showing the processing apparatus shown in FIG. 4 during processing.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
DESCRIPTION OF THE PREFERRED EMBODIMENTS A processing device according to a first embodiment of the present invention will be described based on the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration example of a processing apparatus according to a first embodiment. FIG. 2 is a schematic perspective view of a wafer unit to be processed by the processing apparatus shown in FIG. FIG. 3 is a cross-sectional view schematically showing the processing apparatus shown in FIG. 1 during processing.

The processing apparatus 1 shown in FIG. 1 according to the first embodiment is an apparatus for processing the wafer unit 200 shown in FIG. 2. The wafer unit 200 to be processed by the processing apparatus 1 shown in FIG. 1 includes a wafer 201, a tape 202 that is an ultraviolet curable tape, and an annular frame 203, as shown in FIG.

The wafer 201 is a disk-shaped semiconductor wafer, an optical device wafer, or the like having a substrate 204 of silicon, sapphire, gallium, or the like. As shown in FIG. 2, the wafer 201 has a plurality of dividing lines 206 that intersect with each other on the surface 205, and devices 207 are formed in areas partitioned by the dividing lines 206.

The device 207 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device), or a CMOS (Complementary Metal Oxide Semiconductor), or a memory (semiconductor storage device). ).

The tape 202 is formed into a disk shape with an outer diameter larger than the outer diameter of the wafer 201 . The tape 202 has a base material layer made of a flexible and non-adhesive resin, and an adhesive layer laminated on the base material layer and made of a flexible and adhesive resin. There is. Further, the adhesive layer is made of a resin that hardens and loses adhesive strength when irradiated with ultraviolet rays 38 (shown in FIG. 3).

The tape 202 is a so-called ultraviolet curable tape whose adhesive layer is made of a resin that hardens and loses adhesive strength when irradiated with ultraviolet rays 38 . The annular frame 203 is made of a hard material such as resin or metal, and is formed into a disk shape in which the inner diameter of the inner opening 208 is larger than the outer diameter of the wafer 201 .

The wafer unit 200 has a central part of a tape 202 attached to a back surface 209 on the back side of a front surface 205 of a wafer 201, an annular frame 203 attached to an outer edge of the tape 202, and an annular frame 203 having an opening 208 in the center. A wafer 201 is supported inside the opening 208 with a tape 202 interposed therebetween. In the first embodiment, the wafer 201 of the wafer unit 200 is pre-cut by a cutting blade.

Note that pre-cutting refers to cutting the wafer 201 with the cutting blade in order to optimize the sharpness of the abrasive grains of the cutting blade before the cutting blade divides the wafer 201 into individual devices 207. Note that in the present invention, the wafer 201 may be a so-called dummy wafer in which the device 207 is not formed on the surface 205.

(processing equipment)
The processing apparatus 1 according to the first embodiment is an apparatus that separates the annular frame 203 of the wafer unit 200 and the wafer 201 as a process. The processing device 1 includes a holding section 2 and a lid section 3, as shown in FIG.

The holding section 2 holds the tape 202 of the wafer unit 200 in an upwardly exposed state. The holding part 2 includes a frame holding part 21 and an opening 22. The frame holding part 21 is formed into an annular shape whose inner and outer diameters are equal to the inner and outer diameters of the annular frame 203, and holds the annular frame 203 of the wafer unit 200 by placing the annular frame 203 of the wafer unit 200 on the upper surface. . The holding section 2 holds the wafer unit 200 with the tape 202 exposed upward by the frame holding section 21 holding the annular frame 203.

Moreover, the frame holding part 21 is installed on the upper part of any container 4. In the first embodiment, the storage container 4 is a container provided with an opening 5 at the top. The storage container 4 is formed into a cylindrical shape with an upper part whose inner and outer diameters are equal to the inner and outer diameters of the annular frame 203 and the frame holding part 21, and whose bottom is closed.

The opening 22 is a space inside the frame holding part 21 and allows the wafer 201 separated from the annular frame 203 of the wafer unit 200 to freely fall into the container 4 .

The lid part 3 is configured to be openable and closable so as to cover the wafer unit 200 held by the holding part 2 from above. The lid section 3 includes a lid main body 31, a tape cutting unit 32, and an ultraviolet irradiation section 33.

The lid main body 31 is formed into a disk shape with an outer diameter equal to the outer diameter of the frame holding portion 21 . The lid main body 31 is installed on the frame holding part 21 holding the annular frame 203 of the wafer unit 200, covers the upper part of the wafer unit 200 held by the holding part 2, and closes the opening 22 of the holding part 2. . Further, the lid main body 31 is removed from above the frame holding part 21 holding the annular frame 203 of the wafer unit 200, and the opening 22 of the holding part 2 is opened.

When the lid main body 31 is installed on or removed from the frame holder 21 , the lid 3 opens and closes the opening 22 of the holder 2 . In the first embodiment, the lid main body 31 is installed on the frame holding part 21 so as to overlap the positioning member 23 provided on the frame holding part 21 .

The tape cutting unit 32 separates the annular frame 203 and the wafer 201 by cutting the tape 202 between the inner peripheral edge of the annular frame 203 and the outer peripheral edge of the wafer 201 into an annular shape. The tape cutting unit 32 includes a disc-shaped unit main body 34 rotatably supported around an axis on the lower surface of the lid main body 31, and is provided at the outer edge of the unit main body 34, and the inner circumferential edge of the annular frame 203 of the tape 202. and a handle 36 that is attached to the unit body 34 and rotates the unit body 34 around the axis relative to the lid body 31.

The unit main body 34 has an outer diameter larger than the outer diameter of the annular frame 203 and smaller than the outer diameter of the lid main body 31, for example. The unit main body 34 is arranged coaxially with the lid main body 31. The unit main body 34 is rotatably supported around the axis with respect to the lid main body 31. The unit main body 34 is rotated around the axis relative to the lid main body 31 when the handle 36 is held by an operator or the like.

The cutting blade 35 is installed on the frame holding part 21 holding the annular frame 203 of the wafer unit 200, and the cutting blade 35 cuts the annular frame 203 of the tape 202 in the closed state where the opening 22 of the holding part 2 is closed. A cut is made between the inner peripheral edge and the outer peripheral edge of the wafer 201. The cutting blade 35 cuts between the inner peripheral edge of the annular frame 203 of the tape 202 and the outer peripheral edge of the wafer 201, and the unit main body 34 is rotated around the axis relative to the lid main body 31, thereby cutting the tape cutting unit 32. cuts the tape 202 between the inner peripheral edge of the annular frame 203 and the outer peripheral edge of the wafer 201 into an annular shape.

The ultraviolet irradiation section 33 irradiates the tape 202 of the wafer unit 200 held by the holding section 2 with ultraviolet rays 38 to harden the adhesive layer of the tape 202 . The ultraviolet irradiation section 33 includes a plurality of ultraviolet lamps 37 attached to the outer peripheral side of the unit body 34 than the cutting blade 35. The ultraviolet lamp 37 irradiates the tape 202 of the wafer unit 200 held by the holding portion 2 with ultraviolet rays 38 . The ultraviolet irradiation unit 33 is arranged at a position facing the area 210 of the annular frame 203 to which the tape 202 is attached by attaching the ultraviolet lamp 37 to the outer circumferential side of the unit body 34 rather than the cutting blade 35. becomes.

In the processing apparatus 1 according to the first embodiment, the holding section 2 is installed on the upper part of the storage container 4, and the annular frame 203 of the wafer unit 200 is held on the frame holding section 21 of the holding section 2. In the processing apparatus 1, the lid body 31 of the lid part 3 is installed on the frame holding part 21 holding the annular frame 203 of the wafer unit 200 with the ultraviolet lamp 37 of the UV irradiation part 33 turned off. The opening 22 is closed in the closed state. Then, as shown in FIG. 3, when the lid part 3 is in the closed state, the cutting blade 35 of the tape cutting unit 32 cuts the tape 202 between the inner peripheral edge of the annular frame 203 and the outer peripheral edge of the wafer 201. Furthermore, when the processing apparatus 1 according to the first embodiment is brought into the closed state in which the opening 22 is closed by the lid 3, the ultraviolet lamp 37 of the ultraviolet irradiation unit 33 is turned on, as shown in FIG. Then, the ultraviolet irradiation unit 33 irradiates at least the area 210 of the tape 202 of the wafer unit 200 with ultraviolet rays 38, and the adhesive force of the adhesive layer in at least the area 210 decreases.

In the processing apparatus 1, the unit main body 34 of the tape cutting unit 32 is rotated one or more rotations around the axis relative to the lid main body 31 to separate the annular frame 203 and the wafer 201. The separated wafers 201 freely fall inside the opening 22 and are collected into the storage container 4 .

In this way, the holding unit 2 of the processing apparatus 1 is installed on the upper part of the storage container 4, so that the wafer 201 can be collected into the storage container 4. Further, since the processing apparatus 1 separates the annular frame 203 of the wafer unit 200 from the wafer 201 by irradiating the tape 202 with ultraviolet rays 38, the tape 202 can be easily peeled off from the annular frame 203.

The processing apparatus 1 according to the first embodiment described above holds the annular frame 203 of the wafer unit 200 with the frame holding part 21 of the holding part 2, closes the opening part 22 with the lid part 3, and then irradiates it with ultraviolet rays. The ultraviolet lamp 37 of the section 33 is turned on, and the tape cutting unit 32 cuts the tape 202 into an annular shape between the inner circumferential edge of the annular frame 203 and the outer circumferential edge of the wafer 201. For this purpose, the processing apparatus 1 according to the first embodiment irradiates at least the region 210 of the tape 202 of the wafer unit 200 with ultraviolet rays 38 and then cuts the tape 202 between the wafer 201 and the annular frame 203 with the cutting blade 35. It is structured as follows.

As described above, the processing apparatus 1 according to the first embodiment has a simple configuration including the holding part 2 installed on the upper part of the storage container 4 and the lid part 3, so that it can be formed into a portable size. It is possible and can be used by installing it on the top of the existing storage container 4 or the like.

Therefore, the processing apparatus 1 according to the first embodiment does not need to move to the installation location of the ultraviolet irradiation device in order to discard the wafer 201, and can efficiently discard the wafer 201, improving productivity. Furthermore, since the processing apparatus 1 according to the first embodiment collects the wafers 201 into the storage container 4, there is no fear that debris of the wafers 201 will be scattered when the tape 202 is peeled off from the annular frame 203, thereby preventing contamination of the production site. It becomes possible to prevent this.

As a result, the processing apparatus 1 according to the first embodiment has the effect of being able to efficiently discard the wafers 201 and improve productivity while preventing contamination of the production site.

[Embodiment 2]
A processing device according to a second embodiment will be described based on the drawings. FIG. 4 is a cross-sectional view schematically showing a configuration example of a processing device according to the second embodiment. FIG. 5 is a cross-sectional view schematically showing the processing apparatus shown in FIG. 4 during processing. In addition, in FIGS. 4 and 5, the same parts as in Embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.

The processing device 1-2 according to the second embodiment has the following features, except that the frame holding part 21 of the holding part 2 and the lid main body 31 of the lid part 3 are connected by a hinge 6, as shown in FIGS. 4 and 5. This is the same as the first embodiment. The hinge 6 includes a pair of flat plate parts 61 attached to the frame holding part 21 and the lid main body 31, and a connecting shaft 62 that rotatably connects the flat plate parts 61 to each other.

As shown in FIG. 4, in the processing apparatus 1-2 according to the second embodiment, the holding part 2 is installed on the upper part of the storage container 4, and the frame of the holding part 2 is placed in a state where the lid main body 31 is separated from the frame holding part 21. The annular frame 203 of the wafer unit 200 is held on the holding part 21 . In the processing apparatus 1-2 according to the second embodiment, the lid main body 31 of the lid section 3 is placed on the frame holding section 21 holding the annular frame 203 of the wafer unit 200 with the ultraviolet lamp 37 of the ultraviolet irradiation section 33 turned off. Once installed, the opening 22 is closed with the lid 3 to be in a closed state. Then, the cutting blade 35 of the tape cutting unit 32 cuts between the inner peripheral edge of the annular frame 203 of the tape 202 and the outer peripheral edge of the wafer 201. Furthermore, when the processing apparatus 1-2 according to the second embodiment is placed in the closed state in which the opening 22 is closed with the lid 3, the ultraviolet lamp 37 of the ultraviolet irradiation unit 33 is turned on as shown in FIG. Then, the region 210 of the tape 202 is irradiated with ultraviolet light 38, and the adhesive strength of the adhesive layer at least in the region 210 is reduced.

In the processing apparatus 1-2 according to the second embodiment, the unit body 34 of the tape cutting unit 32 is rotated one or more rotations around the axis relative to the lid body 31 to separate the annular frame 203 and the wafer 201. The separated wafers 201 freely fall inside the opening 22 and are collected into the storage container 4 .

The processing apparatus 1-2 according to the second embodiment holds the annular frame 203 of the wafer unit 200 with the frame holding part 21 of the holding part 2, closes the opening 22 with the lid part 3, and then closes the opening 22 with the ultraviolet irradiation part. 33 is turned on, and the tape cutting unit 32 cuts the tape 202 into an annular shape between the inner circumferential edge of the annular frame 203 and the outer circumferential edge of the wafer 201. As a result, similar to the first embodiment, the processing apparatus 1-2 according to the second embodiment has the effect of being able to efficiently dispose of the wafers 201 and improve productivity while preventing contamination of the production site. play.

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention. For example, in Embodiments 1 and 2, the present invention turns on the ultraviolet lamp 37 of the ultraviolet irradiation unit 33 with the lid 3 opening the opening 22, and then closes the opening 22 with the lid 3. It may be considered as a state.

1,1-2 Processing device 2 Holding section 3 Lid section 4 Container 21 Frame holding section 22 Opening section 32 Tape cutting unit 33 Ultraviolet irradiation section 38 Ultraviolet light 200 Wafer unit 201 Wafer 202 Tape (UV curing tape)
203 Annular frame 208 Opening 210 Area

Claims (3)

A processing device for processing a wafer unit in which a wafer is supported via an ultraviolet curable tape in the opening of an annular frame having an opening in the center,
a holding part that holds the ultraviolet curable tape of the wafer unit in an upwardly exposed state;
a lid portion configured to be openable and closable so as to cover the wafer unit held by the holding portion from above;
When the lid is closed,
an ultraviolet irradiation unit that irradiates the ultraviolet curable tape of the wafer unit held by the holding unit with ultraviolet rays to cure the ultraviolet curable tape;
a tape cutting unit that separates the annular frame and the wafer by cutting the ultraviolet curable tape between the inner peripheral edge of the annular frame and the outer peripheral edge of the wafer into an annular shape;
A processing apparatus characterized in that by separating the annular frame and the wafer, the ultraviolet curing tape can be easily peeled off from the annular frame. The holding part is
a frame holding part that holds the annular frame of the wafer unit;
an opening for freely falling the wafer separated from the annular frame by the tape cutting unit;
The processing apparatus according to claim 1, wherein the processing apparatus can collect wafers by installing it on the upper part of any storage container. 3. The processing apparatus according to claim 1, wherein the ultraviolet irradiation unit is disposed at a position opposite to a region of the annular frame to which the ultraviolet curable tape is attached.

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