JP2024015619A - Impact prevention structure for electronic equipment - Google Patents

Abstract

To provide an impact prevention structure for electronic equipment capable of absorbing an impact force in an event of dropping off a device, and thereby, preventing breakage of the equipment.SOLUTION: An impact prevention structure for electronic equipment comprises a printed board 3 fixed in a housing 2 of electronic equipment 1. The impact prevention structure comprises a suspension member 4 that has a plate-like component mounting part 31 opposed to the printed board 3 in a thickness direction of the printed board 3 at a predetermined interval, being fixed to the housing 2 at one end part and the other end part of the component mounting part 31. The impact prevention structure comprises a spacer 35 provided on the component mounting part 31 so as to protrude toward the printed board 3. A portion opposed to the spacer 35 in the printed board 3 is configured by a non-circuit part 22 with no wiring pattern formed. A gap d having an interval L2 is formed between the spacer 35 and the non-circuit part 22 of the printed board 3.SELECTED DRAWING: Figure 4

Description

The present invention provides impact protection for electronic devices that prevents the board inside the electronic device or the electronic components on the board from colliding with parts displaced by the impact of the drop and being damaged when the device is accidentally dropped. Regarding structure.

As shown in Patent Document 1 and Patent Document 2, conventional electronic devices include a board fixed inside the electronic device, and a plate-shaped assembly based on a board or plate material other than this board. Some are arranged in layers. Patent Document 1 and Patent Document 2 describe electronic devices in which a plate-like assembly is mounted above a substrate via spacers and ribs.

Such spacers and ribs are attached to locations on the board where wiring patterns are not arranged or where electronic components are not mounted. Therefore, when installing spacers and ribs on the substrate, it is necessary to provide empty space. However, since it is difficult to create a large empty space, spacers and ribs are often attached at the minimum necessary locations.

JP 2020-80033 Publication Japanese Patent Application Publication No. 2007-12951

As mentioned above, if an electronic device with a structure in which a board and a plate-like assembly are arranged in layers is accidentally dropped, the plate-like assembly provided in the upper layer may be bent and displaced by the impact of the drop. There are things to do. If the plate-like assembly located on the upper layer is displaced and collides with the electronic component on the substrate located on the lower layer, this electronic component may be damaged.

In addition, if the plate-shaped assembly is firmly fastened to the board or electronic device casing using highly rigid spacers or ribs to prevent the plate-shaped assembly from displacing when it is dropped, the plate-shaped assembly may be damaged by the impact of the fall. damage to the assembly. The magnitude of the impact force at the time of a fall and the direction in which the impact is applied vary depending on the attitude of the electronic device at the time of the fall. Therefore, depending on the attitude of the electronic device when it is dropped, the impact upon the fall may not be fully absorbed by the casing of the electronic device and may be applied directly to the plate-like assembly from the board via the spacers and ribs. In such a case, excessive stress may be generated at a portion of the plate-like assembly that is fixed by the spacer or rib, and this portion may be damaged.

An object of the present invention is to provide a shock prevention structure for electronic equipment that can absorb the impact force and prevent damage to the equipment even when an unexpected impact such as a drop of the equipment is applied. be.

In order to achieve this object, the impact prevention structure for an electronic device according to the present invention includes a substrate fixed inside a casing of an electronic device, and a substrate facing the substrate at a predetermined distance in the thickness direction of the substrate. a suspension member fixed to the housing at one end and the other end of the component mounting portion; and a spacer provided on the component mounting portion to protrude toward the board. and a portion of the substrate facing the spacer is constituted by a non-circuit portion on which a wiring pattern is not formed, and a gap of a predetermined interval is provided between the spacer and the non-circuit portion of the substrate. It is being formed.

The present invention provides the impact prevention structure for electronic equipment, wherein the board is fixed to the casing by a fixing screw passing through the non-circuit portion of the board, and the gap is formed between the head of the fixing screw and the board. It may be formed between the spacer and the spacer.

In the shock prevention structure of the electronic device according to the present invention, the distance between the gaps may be smaller than the distance between the electronic component mounted on the substrate and the component mounting section.

In the present invention, when the component mounting portion of the suspension member is displaced toward the board due to impact during a fall, the spacer approaches the non-circuit portion of the board. When the spacer comes into contact with the non-circuit portion, further displacement of the component mounting portion is restricted. Therefore, collision between the electronic components on the board and the component mounting section can be avoided. Furthermore, the structure for fixing the suspension member to the casing of the electronic device may be elastically deformable and load-distributed.
Therefore, according to the present invention, even if an electronic device is dropped and a shock is applied to the electronic device, a shock prevention structure for an electronic device is provided that can absorb the impact force and prevent damage to the device. can be provided.

FIG. 1 is a perspective view of an electronic device that employs an impact prevention structure according to the present invention. FIG. 2 is an exploded perspective view of the electronic device. FIG. 3 is a cross-sectional view of the electronic device. FIG. 4 is a perspective sectional view of essential parts. FIG. 5 is a perspective view of the suspension member. FIG. 6 is a sectional view showing the impact prevention structure. FIG. 7 is a sectional view showing a modification of the impact prevention structure. FIG. 8 is a perspective sectional view showing the mounting structure of one end of the suspension member. FIG. 9 is a perspective sectional view showing the mounting structure of the other end of the suspension member.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a shock prevention structure for an electronic device according to the present invention will be described in detail below with reference to FIGS. 1 to 9.
The electronic device 1 shown in FIG. 1 includes a casing 2 formed in the shape of a rectangular parallelepiped, a printed circuit board 3 housed inside the casing 2, a suspension member 4, and the like.
The housing 2 includes a box-shaped main body 5 that supports a printed circuit board 3, and a lid 6 that closes an opening of the main body 5. The main body 5 and the lid 6 according to this embodiment are formed by bending a metal plate into a predetermined shape.

The main body 5 includes a bottom wall 5a that is rectangular in plan view, and vertical walls 5b to 5d that stand up from three sides of the bottom wall 5a. In the following, when describing the components of the electronic device 1 and indicating directions, one side of the bottom wall 5a where the vertical walls 5b to 5d are not provided is referred to as the front, and the electronic device 1 is viewed from the front. I will explain in the direction of time. That is, in FIG. 1, the lower left side is the front side, the upper right side is the rear side, the upper left side is the left side, and the lower right side is the right side. Therefore, in the following, among the three vertical walls 5b to 5d of the main body 5, the vertical wall 5b located on the left side is referred to as the left wall 5b, the vertical wall 5c located in the center is referred to as the rear wall 5c, and the vertical wall 5b located on the right side is referred to as the rear wall 5c. The vertical wall 5d is called the right side wall 5d. The right side wall 5d shown in FIG. 1 is partially cut away.
The lid body 6 is formed into an L-shaped cross section by a ceiling wall 6a facing the bottom wall 5a, and a front wall 6b overlapping one side of the bottom wall 5a where no vertical wall is provided.

The printed circuit board 3 constitutes a "substrate" in the present invention, and is formed in a rectangular shape that is long in the left-right direction when viewed from above. A large number of electronic components 7 (only one representative electronic component is shown in FIG. 1) are mounted on the printed circuit board 3. The electronic component 7 shown in FIG. 1 protrudes from the printed circuit board 3 at a higher height than other electronic components. Hereinafter, the electronic component 7 on the printed circuit board 3 will be referred to as a "first electronic component 7" to distinguish it from the electronic component of the suspension member 4, which will be described later. The first electronic component 7 is positioned between the printed circuit board 3 and a suspension member 4, which will be described later.

This printed circuit board 3 is attached to the bottom wall 5a of the main body 5 at five locations, namely, four corners and a center section in the left and right direction on the rear side, with first to fifth support members 11 to 15 (see FIG. 2). ). Among the five mounting parts of the printed circuit board 3, the four corner parts are attached to the first to fourth support members 11 to 14, and the center part of the rear side of the printed circuit board 3 in the left and right direction is attached to the fifth mounting part. It is attached to the support member 15.

The first to fifth support members 11 to 15 are formed in a cylindrical shape and are erected on the bottom wall 5a. The first to fifth support members 11 to 15 have the same structure. Here, the fifth support member 15 will be explained in detail with reference to FIGS. 3 and 4. The fracture position in FIG. 3 is the position indicated by the two-dot chain imaginary line A in FIG.
The first to fifth support members 11 to 15 are fixed to the bottom wall 5a by press-fitting one end of the first to fifth support members 11 to 15 into the through hole 16 (see FIG. 4) of the bottom wall 5a. It is being done.

A fixing screw 17 is screwed onto the other ends (tips) of the first to fifth support members 11 to 15. As shown in FIG. 4, the fixing screws 17 are passed through through holes 18 formed in the printed circuit board 3 and screwed into screw holes 19 of the first to fifth support members 11 to 15. A flat washer 20 and a spring washer 21 are sandwiched between the head 17a of the fixing screw 17 and the printed circuit board 3.
The periphery of the through hole 18 of the printed circuit board 3 is constituted by a non-circuit portion 22 in which no wiring pattern is formed.

The suspension member 4 is for mounting a second electronic component 23 different from the first electronic component 7 on the printed circuit board 3 above the printed circuit board 3 (in the opposite direction from the bottom wall 5a). . The suspension member 4 according to this embodiment is formed by bending a metal plate material having a substantially rectangular shape in plan view into a predetermined shape, and as shown in FIG. It is constituted by first and second attachment parts 32 and 33 connected to both longitudinal ends of 31.
The component mounting portion 31 is formed in a rectangular shape that is long in the left-right direction of the housing 2 when viewed from above. A second electronic component 23 is mounted on the upper surface of this component mounting section 31, that is, the surface opposite to the printed circuit board 3. In addition, this component mounting section 31 is printed in the thickness direction of the printed circuit board 3 as shown in FIG. It is arranged to face the substrate 3 with an interval L1 therebetween.

As shown in FIG. 3, at the rear side of the component mounting section 31 and at the center in the left-right direction (longitudinal direction), a spacer 35 that constitutes a part of the impact prevention structure 34 according to the present invention is provided. . The impact prevention structure 34 includes a printed circuit board 3, a suspension member 4, a spacer 35, and the like.
The spacer 35 is formed in a cylindrical shape with a bottom, and is provided protruding from the component mounting section 31 toward the printed circuit board 3 with the bottom connected to the component mounting section 31 . A portion of the printed circuit board 3 facing the spacer 35 is constituted by a non-circuit portion 22 in which no wiring pattern is formed. The position where the spacer 35 according to this embodiment is attached is on the same axis as the fifth support member 15, as shown in FIG.
The spacer 35 is fixed to the component mounting section 31 by press-fitting one end (bottom) of the spacer 35 into the through hole 36 of the component mounting section 31.

As shown in FIG. 6, a gap d having a distance L2 is formed between the tip of the spacer 35 and the head 17a of the fixing screw 17 screwed into the fifth support member 15. Note that the spacer 35 may be attached at a position spaced apart from the first to fifth support members 15 in the left-right direction and the front-back direction, as shown in FIG. In this case, the spacer 35 is opposed to the non-circuit portion 22 of the printed circuit board 3 on which the wiring pattern is not formed, and a gap d having a distance L2 is formed between the non-circuit portion 22 and the spacer 35. The distance L2 is smaller than the distance L3 between the first electronic component 7 and the component mounting section 31, as shown in FIG.

As shown in FIG. 8, the first mounting portion 32 of the suspension member 4 is formed in a plate shape parallel to the component mounting portion 31, and has a first mounting portion 32 extending from the component mounting portion 31 in the opposite direction to the printed circuit board 3. It is connected to the component mounting section 31 via the step portion 37 of 1, and is formed so as to be located on the opposite side (upper side) of the printed circuit board 3 with respect to the component mounting section 31.
This first mounting portion 32 is fixed to a bracket 38 provided on the left side wall 5b of the housing 2 with a fixing screw 39. A flat washer 40 and a spring washer 41 are sandwiched between the head 39a of the fixing screw 39 and the first mounting portion 32.

As shown in FIG. 9, the second attachment part 33 of the suspension member 4 is formed in a plate shape parallel to the component mounting part 31, and has a second mounting part 33 extending from the component mounting part 31 in a direction approaching the printed circuit board 3. It is connected to the component mounting section 31 via the step portion 42 of No. 2, and is formed so as to be biased towards the printed circuit board 3 side (lower side) with respect to the component mounting section 31. The second mounting portion 33 is formed parallel to the component mounting portion 31. This second mounting portion 33 is fixed by fixing screws 45 to sixth and seventh support members 43 and 44 (see FIGS. 1 and 2) vertically provided on the bottom wall 5a of the housing 2. 6. It is fixed to the bottom wall 5a via seventh support members 43 and 44.

The sixth and seventh support members 43 and 44 are equivalent to the first to fifth support members 11 to 15. A flat washer 46 and a spring washer 47 are sandwiched between the head 45a of the fixing screw 45 and the second attachment portion 33. As shown in FIG. 5, a plurality of through holes 48 are formed in the second stepped portion 42 according to this embodiment in order to reduce the weight.
Here, the lengths of the first stepped portion 37 and the second stepped portion 42 in the thickness direction of the component mounting portion 31 will be explained. The first step portion 37 and the second step portion 42 are provided to position the component mounting portion 31 at a position where the above-mentioned gap d is formed. In the following, the position of the component mounting section 31 when a gap d is formed between the head 17a of the fixing screw 17 fixing the printed circuit board 3 to the fifth support member 15 and the spacer 35 will be described as ""Reference mounting position".

The length of the first stepped portion 37 is set to such a length that the first mounting portion 32 can be stacked on the bracket 38. That is, when the component mounting section 31 is installed closer to the printed circuit board 3 from the reference mounting position, the first stepped section 37 becomes longer.
The length of the second stepped portion 42 is set to correspond to the lengths of the fifth support member 15 and the spacer 35. Since the fifth support member 15 and the spacer 35 are ready-made products, their lengths are determined in advance. Note that the fifth support member 15 is sold in a plurality of types with different lengths, so it is possible to select the length to a certain extent.

While using the fifth support member 15 and the spacer 35 whose lengths are determined in this way, the distance L2 between the fixing screw 17 and the spacer 35 that is desired to be the final value can be obtained ( The length of the second stepped portion 42 is set so that a gap d with a desired distance L2 is formed. In other words, components are mounted using the second stepped portion 42 so that the component mounting portion 31 is positioned at the standard mounting position using the ready-made fifth column 15 and spacer 35 whose total length is determined. The position of the portion 31 in the thickness direction is adjusted.

If the electronic device 1 equipped with the shock prevention structure 34 configured as described above is accidentally dropped, the casing 2 will collide with the floor, and a shock will be applied to the suspension member 4. Since the suspension member 4 is fixed to the casing 2 at the first and second mounting portions 32 and 33, which are both ends in the longitudinal direction, both ends in the longitudinal direction are elastically deformed by the impact when the suspension member 4 is dropped. The central part (component mounting part 31) in the direction is displaced. At this time, if the component mounting portion 31 of the suspension member 4 is displaced toward the printed circuit board 3 due to the impact of the fall, the spacer 35 approaches the fixing screw 17 on the printed circuit board 3 side in this embodiment. By the spacer 35 coming into contact with the head 17a of the fixing screw 17, further displacement of the component mounting section 31 is restricted, and a collision between the first electronic component 7 on the printed circuit board 3 and the component mounting section 31 is prevented. can be avoided.

The first and second mounting parts 32 and 33 are formed into plate shapes parallel to the printed circuit board 3 and the component mounting part 31. Therefore, both ends of the suspension member 4 can be elastically deformed in the thickness direction of the component mounting section 31. That is, the structure for fixing the suspension member 4 to the casing 2 of the electronic device 1 is elastically deformable, and the suspension member 4 is freely deformed in the direction in which the load is applied, thereby distributing the load. There is. In this embodiment, first and second step portions 37 and 42 are provided between the first and second mounting portions 32 and 33 and the component mounting portion 31, and are provided at both ends of the suspension member 4. Since the bent portion is formed, the above-mentioned elastic deformation becomes easier and the load is distributed more widely.
Therefore, according to this embodiment, even if an electronic device is dropped and a shock is applied to the electronic device, the impact force is absorbed and damage to the device can be prevented. structure can be provided.

The printed circuit board 3 according to this embodiment is fixed to the main body 5 of the casing 2 by fixing screws 17 passing through the non-circuit portion 22 of the printed circuit board 3. A gap d, which is the distance L2, is formed between the head 17a of the fixing screw 17 and the spacer 35. Therefore, when the component mounting portion 31 is displaced due to the impact of falling, the spacer 35 hits the head 17a of the fixing screw 17, so the printed circuit board 3 is not damaged due to the collision of the spacer 35.

The distance L2 of the gap d between the spacer 35 and the fixing screw 17 and the gap d between the spacer 35 and the non-circuit part 22 of the printed circuit board 3 according to this embodiment is the same as that of the spacer 35 and the fixing screw 17. It is smaller than the distance L3 between the electronic component 7 of No. 1 and the component mounting section 31. Therefore, the spacer 35 hits the fixing screw 17 and the non-circuit part 22 before the component mounting part 31 hits the first electronic component 7, so the first electronic component 7 can be reliably protected.

DESCRIPTION OF SYMBOLS 1... Electronic device, 2... Housing, 3... Printed circuit board (board), 4... Suspension member, 5... Main body, 6... Lid body, 17... Fixing screw, 17a... Head, 21... Non-circuit part, 31 ...component mounting section, 35...spacer, d...gap, L2, L3...interval.

Claims (3)

A board fixed inside the housing of an electronic device,
A suspension member having a plate-shaped component mounting portion facing the substrate at a predetermined distance in the thickness direction of the substrate, and fixed to the casing at one end and the other end of the component mounting portion. and,
The component mounting portion includes a spacer protruding toward the substrate,
A portion of the substrate facing the spacer is constituted by a non-circuit portion on which a wiring pattern is not formed,
A shock prevention structure for an electronic device, wherein a gap having a predetermined interval is formed between the spacer and the non-circuit portion of the substrate. The impact prevention structure for electronic equipment according to claim 1,
The board is fixed to the housing by a fixing screw passing through the non-circuit part of the board,
A shock prevention structure for an electronic device, wherein the gap is formed between the head of the fixing screw and the spacer. The impact prevention structure for electronic equipment according to claim 1 or 2,
The impact prevention structure for electronic components, wherein the distance between the gaps is smaller than the distance between the electronic component mounted on the board and the component mounting portion.

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