JP2024010913A - Environment test device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress occurrence of temperature unevenness between the vicinity of an introduction inlet and the vicinity of a derivation outlet within a test area at a time of low temperature exposing.

SOLUTION: An environment test device 10 comprises: a test tank 12 that has a test area TA; a high temperature tank 14; a low temperature tank 16; an airflow generation unit 33 that generates an airflow in the test area TA from a low temperature introduction inlet 22a introducing cooling air to the test area TA from the low temperature tank 16 toward a low temperature derivation outlet 22b deriving air to the low temperature tank 16 from the test area TA; and a gas jacket 35 that flows a cooling gas so that an area closer to the low temperature derivation outlet 22b than the low temperature introduction inlet 22a of a wall surface 37a defining the test area TA is more cooled in comparison with an area closer to the low temperature introduction inlet 22a than the low temperature derivation outlet 22b.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to an environmental testing device equipped with a test chamber, a high temperature chamber, and a low temperature chamber.

Conventionally, as disclosed in Patent Document 1 below, a high temperature exposure method includes a test tank having a test area, a high temperature tank that generates hot air, and a low temperature tank that generates cold air, and exposes a sample to a high temperature environment. 2. Description of the Related Art Environmental testing devices are known that can perform low-temperature exposure in which a sample is exposed to a low-temperature environment. In this type of environmental test apparatus, as shown in FIG. 9, a high temperature chamber 92 is adjacent to one side of a test chamber 91 having a test area TA in which a sample is placed, and a low temperature chamber 93 is adjacent to the other side of the test chamber 91. are doing. During high-temperature exposure, air is heated in the high-temperature bath 92 and the heated air is circulated between the space within the high-temperature bath 92 and the test area TA, and during low-temperature exposure, the air is heated in the low-temperature bath 93. While cooling, cooling air is circulated between the space inside the cryostat 93 and the test area TA. Thereby, the samples placed in the test area TA can be placed alternately in a high temperature environment and a low temperature environment.

Japanese Patent Application Publication No. 1-274039

A heat insulating wall 94 that partitions the low temperature chamber 93 and the test chamber 91 has an inlet 94a for introducing low temperature air from the low temperature chamber 93, and an outlet 94b for introducing air into the low temperature chamber 93 from the test area TA. During low temperature exposure, an airflow is formed in the test area TA from the inlet 94a to the outlet 94b. Therefore, within the test area TA during low-temperature exposure, there is a possibility that temperature unevenness may occur between the vicinity of the inlet 94a and the vicinity of the outlet 94b.

Therefore, the present invention has been made in view of the above-mentioned prior art, and its purpose is to prevent temperature unevenness from occurring between the vicinity of the inlet and the vicinity of the outlet in the test area during low temperature exposure. It is about restraining.

In order to achieve the above object, an environmental test device according to the present invention includes a test tank having a test area, a high temperature tank that heats air for heating the test area, and a high temperature tank that heats air for heating the test area. an airflow is generated in the test area from an inlet that introduces cooling air from the cryostat into the test area to an outlet that leads air from the test area to the cryostat. Among the wall surfaces that partition the airflow generation unit and the test area, an area closer to the outlet than the inlet is cooled more than an area closer to the inlet than the outlet. and wall cooling means for flowing cooling gas.

In the environmental test device according to the present invention, the airflow generated by the airflow generation section is an airflow in a direction from the inlet to the outlet in the test area. Therefore, during low-temperature exposure in which cooling air is introduced into the test area from the cryostat, the cooling air introduced into the test area from the inlet flows from the inlet toward the outlet. Therefore, if there is no wall cooling means, in the test area, the area near the inlet is more likely to be cooled than the area near the outlet. Therefore, among the wall surfaces that partition the test area, a wall surface cooling means that flows the cooling gas so that the area closer to the outlet than the inlet is cooled more than the area closer to the inlet than the outlet. By providing this, it is possible to suppress a difference in the degree of cooling between the area near the outlet and the area near the inlet in the test area. Moreover, since the wall surface cooling means cools the wall surface of the test area, the air within the test area is also cooled accordingly as the wall surface is cooled. Therefore, it is possible to suppress unevenness in the temperature of the air within the test area during low temperature exposure.

The wall cooling means may be configured to flow the cooling gas in a direction from the outlet toward the inlet along the wall that partitions the test area.

In this aspect, the wall cooling means flows the cooling gas in the direction from the outlet to the inlet along the wall that partitions the test area, so the cooling gas that has cooled the area near the outlet on the wall is introduced. Cools the area near the mouth. Therefore, even if the cooling air introduced into the test area from the inlet flows from the inlet toward the outlet during low-temperature exposure, the area near the outlet of the wall surface is cooled more than the area near the inlet. Therefore, it is possible to suppress unevenness in the temperature of the air in the test area during low-temperature exposure.

The wall cooling means may include a gas jacket disposed around the test area at least in a region closer to the outlet than the inlet, and through which the cooling gas flows.

In this embodiment, as the cooling gas flows inside the gas jacket, the area of the wall that partitions the test area closer to the outlet than the inlet is smaller than the area closer to the inlet than the outlet. Cooler.

The gas jacket may have an inlet that allows the cooling gas to flow into the gas jacket. In this case, the inlet may be located closer to the outlet than the inlet.

In this embodiment, the cooling gas before cooling the wall surface flows into the gas jacket through the inlet that is closer to the outlet than the inlet. Therefore, of the wall surfaces that partition the test area, the area closer to the outlet than the inlet is cooled more.

The gas jacket may have an outlet that allows the cooling gas to flow out from within the gas jacket to the test area. In this case, the outlet may be located at least closer to the inlet than the outlet.

In this aspect, when the cooling gas flows inside the gas jacket from the inlet to the outlet, the cooling gas flows from the outlet side to the inlet side. Therefore, of the wall surfaces that partition the test area, the area closer to the outlet than the inlet is cooled more.

The wall surface cooling means may include a baffle plate that allows the cooling gas to flow along the wall surface in a direction from the outlet to the inlet.

In this embodiment, due to the presence of the baffle plate, the cooling gas flows in the direction from the outlet to the inlet along the wall that partitions the test area. The gas cools the area near the inlet. Therefore, the region of the wall surface near the outlet can be cooled more than the region near the inlet, so it is possible to suppress unevenness in the temperature of the air in the test area during low-temperature exposure.

The wall cooling means may include a heat exchanger tube that is arranged to be in thermal contact with the wall surface or along the wall surface at least in a region closer to the outlet than the inlet, and to circulate the cooling gas. .

In this aspect, as the cooling gas flows through the heat transfer tube, the area of the wall that partitions the test area that is closer to the outlet than the inlet is smaller than the area that is closer to the inlet than the outlet. Cooler.

The test area may be provided with an outlet for discharging air in the test area to the outside by using the cooling gas.

In this embodiment, the air temperature in the test area is high due to high temperature exposure in which heated air obtained from a high temperature bath is introduced into the test area, and then low temperature exposure is performed in which cooled air obtained in a low temperature bath is introduced into the test area. During the transition, high-temperature air can be discharged from the exhaust port by cooling gas. Therefore, compared to a configuration in which high-temperature air flows into the cryostat when low-temperature exposure is started, the cooling load on the cryostat can be reduced.

The outlet is opened between high-temperature exposure for introducing heated air obtained in the high-temperature bath into the test area and low-temperature exposure for introducing cooled air obtained in the low-temperature bath into the test area. Good too.

In this aspect, the high-temperature air in the test area during high-temperature exposure is discharged to the outside before low-temperature exposure, so the time required to transition from high-temperature exposure to low-temperature exposure can be shortened.

The wall cooling means may spray the cooling gas onto a region of the wall defining the test area that is closer to the outlet than the inlet.

In this aspect, the cooling gas is sprayed onto a region of the wall surface that partitions the test area that is closer to the outlet than the inlet, so that the region is cooled by the cooling gas. Therefore, even if the cooling air introduced into the test area from the inlet flows from the inlet toward the outlet during low-temperature exposure, it is possible to prevent a situation in which the region of the wall surface near the outlet is difficult to cool. As a result, it is possible to suppress unevenness in the temperature of the air within the test area during low temperature exposure.

As described above, according to the present invention, it is possible to suppress the occurrence of temperature unevenness between the vicinity of the inlet and the vicinity of the outlet in the test area during low temperature exposure.

FIG. 1 is a diagram schematically showing an environmental test device according to a first embodiment. FIG. 3 is a diagram for explaining the flow of cooling gas in the environmental test apparatus according to the first embodiment. FIG. 3 is a diagram schematically showing an environmental test device according to a modification of the first embodiment. FIG. 2 is a diagram schematically showing an environmental test device according to a second embodiment. FIG. 7 is a diagram schematically showing an environmental test device according to a third embodiment. FIG. 7 is a diagram schematically showing an environmental test device according to a fourth embodiment. It is a figure showing roughly an environmental test device concerning a 5th embodiment. It is a figure showing roughly an environmental test device concerning a 6th embodiment. FIG. 1 is a diagram showing a conventional environmental test device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

(First embodiment)
As shown in FIG. 1, the environmental test apparatus 10 according to the present embodiment includes a test tank 12 that partitions a test area TA, a high temperature tank 14 that heats the inside of the test area TA, and a high temperature tank 14 that keeps the inside of the test area TA at a low temperature. It is equipped with a low-temperature chamber 16 for cooling. The environmental test device 10 is configured as a thermal shock test device that alternately exposes a sample placed in a test area TA to low-temperature air and high-temperature air to apply a thermal load to the sample.

The high temperature tank 14 is adjacent to the upper side of the test area TA, and the low temperature tank 16 is adjacent to the lower side of the test area TA, but the positional relationship of the high temperature tank 14, test area TA, and low temperature tank 16 is limited to this. isn't it. In short, the high temperature tank 14 and the low temperature tank 16 only need to be adjacent to the test area TA.

The test tank 12, the high temperature tank 14, and the low temperature tank 16 are formed into hollow shapes with heat insulating walls. The heat insulating wall includes a high temperature side partition wall 21 that partitions between the high temperature chamber 14 and the test chamber 12, and a low temperature side partition wall 22 that partitions between the low temperature chamber 16 and the test chamber 12. That is, the high temperature side partition wall 21 is a heat insulating wall that forms one surface (top surface) of the test chamber 12, and the low temperature side partition wall 22 forms the other surface of the test chamber 12 that is opposite to the one surface. It is an insulating wall that forms the (bottom surface).

The high temperature side partition wall 21 is provided with an inlet (high temperature inlet 21a) and an outlet (high temperature outlet 21b) for communicating the test area TA and the space inside the high temperature tank 14 with each other. The high temperature inlet 21a and the high temperature outlet 21b are opened and closed by dampers 24, respectively. Note that although FIG. 1 shows a configuration in which the damper 24 is placed within the high temperature tank 14, the damper 24 may be placed in the test area TA.

The low-temperature side partition wall 22 is provided with an inlet (low-temperature inlet 22a) and an outlet (low-temperature outlet 22b) for communicating the test area TA and the space inside the low-temperature chamber 16. The low temperature inlet 22a and the low temperature outlet 22b are opened and closed by dampers 24, respectively. Note that although FIG. 1 shows a configuration in which the damper 24 is placed within the low temperature chamber 16, the damper 24 may be placed in the test area TA.

Inside the high temperature tank 14, a heater 26 for heating air and a blower 27 for circulating the heated air between the inside of the high temperature tank 14 and the test area TA are provided. The cryostat 16 includes a cooler 28 for cooling the air, an auxiliary heater 29, a dehumidifier 30, and a cooler for circulating the cooled air between the cryostat 16 and the test area TA. A blower 31 is provided. When the blower 31 of the cryostat 16 operates, the cooling air in the cryochamber 16 is blown out from the cryointake port 22a to the test area TA, and within the test area TA, airflow flows from the cryointake port 22a toward the cryooutlet port 22b. occurs. That is, the blower 31 disposed in the low temperature chamber 16 functions as an airflow generating section 33 that generates an airflow flowing from the low temperature inlet 22a toward the low temperature outlet 22b within the test area TA.

The test area TA is provided with a gas jacket 35 that forms a circulation space FS through which cooling gas flows. The gas jacket 35 is arranged within the test area TA along a heat insulating wall 37 that partitions the test area TA. That is, the gas jacket 35 is arranged around the test area TA.

The gas jacket 35 forms a circulation space FS between the gas jacket 35 and the heat insulating wall 37. That is, the gas jacket 35 is arranged so as to form a gap with a predetermined width between the gas jacket 35 and the heat insulating wall 37. Therefore, when the cooling gas flows through the circulation space FS, the cooling gas flows through the circulation space FS while contacting the heat insulating wall 37.

The gas jacket 35 is formed into a rectangular box shape with one side open. Specifically, the gas jacket 35 is formed along the top surface, the bottom surface, the left and right side surfaces, and the back side surface of the wall surface 37a facing the test area TA of the heat insulating wall 37 that partitions the test area TA. There is. On the other hand, the gas jacket 35 does not extend along the front side of the wall surface 37a that partitions the test area TA, where an unillustrated door for opening and closing the test area TA is provided. That is, since a door that opens the test area TA for loading and unloading the sample is provided on the front side, which is the front side in FIG. I don't have it. In addition, when a door is provided only in a part of the front, the gas jacket 35 may be provided in a part other than the door on the side wall on the front side.

The gas jacket 35 is provided with communication holes 35a at positions corresponding to the high-temperature inlet 21a, the high-temperature outlet 21b, the low-temperature inlet 22a, and the low-temperature outlet 22b so as not to block them. A communication hole 35a corresponding to the high temperature introduction port 21a passes through the gas jacket 35 in the thickness direction so as to communicate the test area TA and the high temperature introduction port 21a with each other. The other communication holes 35a are similarly formed to penetrate the gas jacket 35 in the thickness direction.

A gas source 39 is connected to the gas jacket 35 for introducing cooling gas into the circulation space FS. The gas source 39 includes a tank 39a storing cooling gas, a pipe 39b connected to the tank 39a, and a valve 39c provided on the pipe 39b. As the cooling gas, for example, liquid nitrogen gas or liquid carbon dioxide gas is used. Note that during high-temperature exposure, in which high-temperature air is supplied from the high-temperature tank 14 to expose the sample to high temperatures, if the test area TA is heated to a temperature much higher than room temperature, air may be used as a cooling gas. may be used. In this case, the gas source 39 only needs to have a pipe 39b connected to the gas jacket 35 and a blower (not shown) that sends air into the pipe 39b.

The pipe 39b penetrates the heat insulating wall 37 that partitions the test area TA, and the tip of the pipe 39b opens into the circulation space FS. The open end of the pipe 39b serves as an inlet 35b through which cooling gas flows into the gas jacket 35. This inlet 35b is located closer to the low temperature outlet 22b than the low temperature inlet 22a. More specifically, the inlet 35b is located in the heat insulating wall 37 that constitutes the left side of the test area TA in FIG. Note that a plurality of inflow ports 35b through which the cooling gas flows into the gas jacket 35 may be provided. Further, the inflow port 35b may not be provided in the heat insulating wall 37 forming the left side surface in FIG. That is, the inlet 35b allows the cooling gas to flow inside the gas jacket 35, so that the area closer to the outlets 21b, 22b than the inlets 21a, 22a of the wall surface 37a that partitions the test area TA is It suffices if the arrangement is such that areas closer to the inlets 21a, 22a are preferentially cooled than the outlets 21b, 22b.

Further, the gas jacket 35 is provided with an outlet 35c through which the cooling gas flowing through the circulation space FS flows out into the test area TA. The outlet 35c is located closer to the low temperature inlet 22a than the low temperature outlet 22b. More specifically, the outflow port 35c is located on the right side surface in FIG. 1 of the wall surface 37a that partitions the test area TA, that is, on the side surface opposite to the side surface where the inflow port 35b is arranged. In the circulation space FS, the cooling gas flows from the inlet 35b toward the outlet 35c.

Note that the outflow port 35c is not only disposed on the right side of the wall surface 37a in FIG. 1, but may also be formed on the top surface, the bottom surface, and the back side surface. In addition, if the outlet 35c is located closer to the low temperature inlet 22a than the low temperature outlet 22b, the outlet 35c is not located on the right side, but on the top, bottom, and back side. You may do so. Further, the number of outlet ports 35c is not limited to one, and a plurality of outlets may be provided. Further, the outlet 35c does not need to open into the test area TA, and may be opened so as to discharge the cooling gas to the outside of the test chamber 12 through the heat insulating wall 37, for example.

The cooling gas is introduced into the circulation space FS, for example, during low-temperature exposure in which cooling air obtained in the low-temperature tank 16 is introduced into the test area TA. That is, the valve 39c of the gas source 39 is opened during low temperature exposure. During low-temperature exposure, as shown in FIG. The cooling air blown out from the blower 31 is introduced into the test area TA through the low-temperature inlet 22a, and the cooling air flows from the area on the right side of the figure where the low-temperature inlet 22a is located to the area on the right side of the figure where the low-temperature outlet 22b is located. Flows towards the area on the left. Therefore, in the low-temperature side partition wall 22 and the high-temperature side partition wall 21, the left side of the figure tends to be slightly less cold than the right side of the figure.

On the other hand, the cooling gas supplied from the gas source 39 to the circulation space FS in the gas jacket 35 flows within the circulation space FS in a direction from the inlet 35b to the outlet 35c. Since the inlet 35b is located near the low-temperature outlet 22b, and the outlet 35c is located near the low-temperature inlet 22a, the cooling gas flows through the wall surface 37a (high-temperature side partition wall 21) that partitions the test area TA. and along the low-temperature side partition wall 22), it flows in a direction from the outlet ports 21b, 22b toward the inlet ports 21a, 22a. At this time, since the cooling gas flows while cooling the wall surface 37a, the temperature gradually increases. Thereby, in the low-temperature side partition wall 22, a region closer to the low-temperature outlet 22b than the low-temperature inlet 22a is cooled more than a region closer to the low-temperature inlet 22a than the low-temperature outlet 22b. Further, since the positional relationship between the low temperature inlet 22a and the low temperature outlet 22b is the same as the positional relationship between the high temperature inlet 21a and the high temperature outlet 21b, the high temperature side partition wall 21 also has a higher temperature than the high temperature inlet 21a. Also, the region closer to the high temperature outlet 21b is cooled more than the region closer to the high temperature inlet 21a than the high temperature outlet 21b. Therefore, it is possible to suppress unevenness in the temperature of the air within the test area TA during low temperature exposure. That is, of the wall surface 37a that partitions the test area TA, the gas jacket 35 has a region closer to the low temperature outlet 22b than the low temperature inlet 22a than a region closer to the low temperature inlet 22a than the low temperature outlet 22b. Thus, it functions as a wall surface cooling means 41 through which cooling gas flows to further cool the wall surface.

Note that the cooling gas may be introduced at the stage of transition from high-temperature exposure in which heated air obtained in the high-temperature tank 14 is introduced into the test area TA to low-temperature exposure. During this transition, both dampers 24 are closed, so no airflow is generated within the test area TA. However, during the subsequent low-temperature exposure, in the low-temperature side partition wall 22 and the high-temperature side partition wall 21, the left side of the figure tends to be slightly less cold than the right side of the figure, so the outlet ports 21b, 22b By preferentially cooling the side area, it is possible to suppress the occurrence of temperature unevenness in the air within the test area TA during low temperature exposure.

As explained above, in this embodiment, the airflow generated by the blower 31 of the cryostat 16 is an airflow in the direction from the inlet ports 21a, 22a toward the outlet ports 21b, 22b in the test area TA. Therefore, during low-temperature exposure in which cooling air is introduced from the low-temperature tank 16 into the test area TA, the cooling air introduced into the test area TA from the low-temperature inlet 22a is directed from the low-temperature inlet 22a toward the low-temperature outlet 22b. flows. Therefore, without the wall cooling means 41, in the test area TA, the area near the inlet ports 21a and 22a is more likely to be cooled than the area near the outlet ports 21b and 22b. Therefore, by providing the wall cooling means 41, it is possible to suppress a difference in the degree of cooling between the area near the outlet ports 21b, 22b and the area near the inlet ports 21a, 22a in the test area TA. be able to. Furthermore, since the wall surface cooling means 41 cools the wall surface 37a of the test area TA, the air within the test area TA is also cooled accordingly as the wall surface 37a is cooled. Therefore, it is possible to suppress the occurrence of temperature unevenness in the air within the test area TA during low temperature exposure.

Moreover, in this embodiment, the wall surface cooling means 41 flows the cooling gas in the direction from the outlet ports 21b, 22b toward the inlet ports 21a, 22a along the wall surface 37a that partitions the test area TA. The cooling gas that has cooled the area near the outlet ports 21b and 22b cools the area near the inlet ports 21a and 22a. Therefore, even if the cooling air introduced into the test area TA from the low-temperature inlet 22a flows from the low-temperature inlet 22a toward the low-temperature outlet 22b during low-temperature exposure, the portion of the wall surface 37a near the inlets 21a and 22a Since the region near the outlet ports 21b and 22b can be cooled more than the region, it is possible to suppress the occurrence of temperature unevenness in the air in the test area TA during low temperature exposure.

In addition, in this embodiment, as the cooling gas flows inside the gas jacket 35, the areas of the wall surface 37a that partition the test area TA that are closer to the outlet ports 21b and 22b than the inlet ports 21a and 22a are The region closer to the inlet ports 21a, 22a than the outlet ports 21b, 22b is cooled more.

Note that in this embodiment, the positional relationship between the low-temperature inlet 22a and the low-temperature outlet 22b is the same as the positional relationship between the high-temperature inlet 21a and the high-temperature outlet 21b, but the low-temperature inlet 22a and the low-temperature outlet The positional relationship between the high temperature inlet 21a and the high temperature outlet 21b may be opposite to the positional relationship between the high temperature inlet 21a and the high temperature outlet 21b. That is, the high temperature inlet 21a may be located on the left side in FIG. 1, and the high temperature outlet 21b may be located on the right side in FIG. Even in this case, since the cooling gas flows inside the gas jacket 35 from the low temperature outlet 22b side to the low temperature inlet 22a side, the area near the low temperature outlet 22b in the low temperature side partition wall 22 and the high temperature side partition wall 21 , which can be more cooled.

In this embodiment, the gas jacket 35 is provided over the entirety of the low-temperature side partition wall 22 and the high-temperature side partition wall 21, but the structure is not limited to this. For example, as shown in FIG. 3, the gas jacket 35 may be arranged in the vicinity of the low temperature outlet 22b, but may be formed in a size that does not extend to the vicinity of the low temperature inlet 22a. In this case, the outflow port 35c opens toward the side surface of the test chamber 12 on the low temperature introduction port 22a side at the end of the gas jacket 35 on the low temperature introduction port 22a side. Therefore, the cooling gas that has flowed through the circulation space FS in the gas jacket 35 flows along the wall surface 37a in the direction in which the low temperature inlet 22a is located. Even in this case, the regions of the low-temperature side partition wall 22 and the high-temperature side partition wall 21 near the outlet ports 21b, 22b can be cooled more than the regions near the inlet ports 21a, 22a. Note that the outflow port 35c does not need to open toward the side of the test chamber 12 on the low-temperature inlet 22a side, but rather opens toward the center of the test area TA at the end of the gas jacket 35 on the low-temperature inlet 22a side. It may be left open.

(Second embodiment)
FIG. 4 shows a second embodiment of the invention. Here, the same components as in the first embodiment are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

The environmental test apparatus 10 of the second embodiment differs from the first embodiment in that the test tank 12 is provided with a discharge port 43. The discharge port 43 is an opening for discharging the air in the test area TA to the outside of the test chamber 12, and is an opening for discharging the air in the test area TA to the outside of the test chamber 12. It is provided in the constituting heat insulating wall 37. Therefore, when the cooling gas flows out from the gas jacket 35 into the test area TA, the cooling gas causes the air in the test area TA to be exhausted to the outside.

Therefore, in this embodiment, the cooled air obtained in the low temperature tank 16 is transferred to the test area from a state where the temperature in the test area TA is high due to high temperature exposure in which the heated air obtained in the high temperature tank 14 is introduced into the test area TA. When transitioning to low-temperature exposure introduced into the TA, high-temperature air can be discharged to the outside from the discharge port 43 by the cooling gas. Therefore, the cooling load on the low temperature chamber 16 can be reduced compared to a configuration in which high temperature air flows into the low temperature chamber 16 when starting low temperature exposure.

In addition, in FIG. 4, the pipe 39b connected to the tank 39a has a configuration in which it branches into two, but the configuration is not limited to this, and the pipe 39b branches into two as in the first embodiment. Alternatively, it may be connected to the gas jacket 35.

Although the description of other configurations, operations, and effects will be omitted, the description of the first embodiment can be applied to the second embodiment.

(Third embodiment)
FIG. 5 shows a third embodiment of the invention. Here, the same components as in the first embodiment are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

In the first embodiment, a gas supplied from a gas source 39 separate from the cooling air obtained in the cryostat 16 is used as the cooling gas, whereas in the third embodiment, the cooling air obtained in the cryostat 16 is used as a cooling gas. This embodiment differs from the first embodiment in that the cooled air is used as cooling gas. Since the cooling air is used as the cooling gas, the timing at which the cooling gas flows into the circulation space FS of the gas jacket 35 is at the stage of transition from high-temperature exposure to low-temperature exposure.

The gas jacket 35 is formed into a rectangular tube shape so as to form a space (flow space FS) between the high temperature side partition wall 21 and the low temperature side partition wall 22, and has a gas jacket at one end in the cylinder axis direction. The outlet 35c of the jacket 35 is open. The outflow port 35c is located closer to the inlet ports 21a, 22a than the outlet ports 21b, 22b in the high temperature side partition wall 21 and the low temperature side partition wall 22. The inlet 35b of the gas jacket 35 is located closer to the outlet ports 21b, 22b than the inlet ports 21a, 22a in the high temperature side partition wall 21 and the low temperature side partition wall 22. Also provided is a damper 45 that opens and closes the inlet 35b. Note that when the gas jacket 35 extends to the side surface of the test chamber 12 on the low-temperature inlet 22a side, the outlet 35c is located on the inlet ports 21a and 22a side of the test chamber 12, as in the configuration shown in FIG. It may be provided at a position adjacent to the side surface of. Further, an auxiliary blower 46 is provided at the inlet 35b to assist the flow of air, but the auxiliary blower 46 can be omitted.

In this configuration, the cooling air (cooling gas) sent out from the blower 31 in the low temperature chamber 16 flows into the circulation space FS of the gas jacket 35 through the inlet 35b located near the low temperature outlet 22b, and then The water flows out into the test area TA through an outlet 35c located near 21a and 22a. Thereby, of the wall surface 37a that partitions the test area TA, regions closer to the outlet ports 21b and 22b than to the inlet ports 21a and 22a can be cooled preferentially. Moreover, unlike the first embodiment, the gas source 39 is not required.

Although the description of other configurations, operations, and effects will be omitted, the description of the first and second embodiments can be applied to the third embodiment.

(Fourth embodiment)
FIG. 6 shows a fourth embodiment of the invention. Here, the same components as in the first embodiment are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

In the first embodiment, the wall cooling means 41 includes a gas jacket 35 that forms a circulation space FS through which cooling gas flows, whereas in the fourth embodiment, the wall cooling means 41 has a clear circulation space FS. Although it does not form the space FS, it is provided with a baffle plate 48 that guides the cooling gas in a predetermined direction. The baffle plate 48 guides the cooling gas introduced into the test area TA through the inlet 37b, which is opened at the tip of the pipe 39b in the heat insulating wall 37.

The baffle plate 48 is made of a plate-shaped member bent into a predetermined shape, and is configured to introduce cooling gas into the test area TA from the pipe 39b of the gas source 39 through the inlet 37b. It has a low temperature side guide part 48a that guides the cooling gas toward the outlet 22b. Further, the baffle plate 48 has a high temperature side guide portion 48b that guides the cooling gas from the inlet 37b toward the high temperature outlet 21b of the high temperature side partition wall 21.

Due to the presence of the low-temperature side guide portion 48a, a portion of the cooling gas flows from the low-temperature outlet 22b side toward the low-temperature inlet 22a side along the low-temperature side partition wall 22 in the test area TA. Furthermore, due to the presence of the high-temperature side guide portion 48b, the other part of the cooling gas flows from the high-temperature outlet 21b side toward the high-temperature inlet 21a side along the high-temperature side partition wall 21 in the test area TA.

Note that holes may be formed in the low-temperature side guide portion 48a of the baffle plate 48 so as not to prevent air in the test area TA from moving toward the low-temperature outlet 22b during low-temperature exposure. Further, holes may be formed in the high temperature side guide portion 48b of the baffle plate 48 so as not to inhibit the air in the test area TA from flowing toward the high temperature outlet 21b during high temperature exposure.

In this embodiment, due to the presence of the baffle plate 48, the cooling gas flows from the outlet ports 21b, 22b toward the inlet ports 21a, 22a along the wall surface 37a that partitions the test area TA. The cooling gas that has cooled the area near the outlet ports 21b and 22b cools the area near the inlet ports 21a and 22a. Therefore, it is possible to cool the area near the outlet ports 21b and 22b more than the area near the inlet ports 21a and 22a on the wall surface 37a, thereby suppressing uneven temperature of the air in the test area TA during low temperature exposure. can.

Although the description of other configurations, operations, and effects will be omitted, the description of the first to third embodiments can be applied to the fourth embodiment.

(Fifth embodiment)
FIG. 7 shows a fifth embodiment of the invention. Here, the same components as in the first embodiment are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

In the fifth embodiment, the wall cooling means 41 includes heat transfer tubes 50 through which cooling gas flows. The heat exchanger tubes 50 are placed on the heat insulating wall 37 that partitions the top, bottom, back side (inner side in FIG. 7), and left and right sides (left and right sides in FIG. 7) of the test area TA. It is in thermal contact with a wall surface 37a that partitions area TA. That is, the heat exchanger tube 50 is made to extend inside the heat insulating wall 37 along a wall surface 37a that partitions the test area TA. Note that a portion of the heat exchanger tube 50 does not need to be in thermal contact with the wall surface 37a.

The heat exchanger tube 50 is connected to the pipe 39b at the heat insulating wall 37 near the low temperature outlet 22b, and at the heat insulating wall 37 near the low temperature inlet 22a, a flow for causing the cooling gas to flow out into the test area TA is provided. It opens as an outlet 50a. The connection port between the heat exchanger tube 50 and the piping 39b functions as an inlet 50b through which cooling gas flows into the heat exchanger tube 50. Note that the outlet 50a does not need to open into the test area TA; in this case, the heat transfer tube 50 is drawn out of the test chamber 12 through the heat insulating wall 37, and the cooling gas is supplied to the test chamber 12. It may be configured to be discharged to the outside.

The heat exchanger tube 50 is formed in a meandering manner on the top surface, the bottom surface, and the side surface on the back side. Therefore, while the cooling gas meandering toward the front and back in FIG. It flows inside the heat exchanger tube 50 toward a region close to 22a. Therefore, as the cooling gas flows through the heat transfer tube 50, the area of the wall surface 37a that partitions the test area TA, which is closer to the outlet ports 21b and 22b than the inlet ports 21a and 22a, is The area is cooled more than the area near the introduction ports 21a and 22a.

Note that, as shown in FIG. 7, the heat exchanger tubes 50 are provided along the wall surface 37a excluding the front side surface, but it is not necessary to provide them all over the wall surface 37a. For example, the heat exchanger tube 50 extends along the left side surface where the inlet 50b is provided, and also includes a wall surface 37a in an area closer to the outlet ports 21b, 22b than the inlet ports 21a, 22a among the top surface, bottom surface, and back side surface. It may be placed in That is, the heat exchanger tube 50 may be disposed at least in a region of the wall surface 37a that partitions the test area TA that is closer to the outlet ports 21b, 22b than the inlet ports 21a, 22a. The heat exchanger tubes 50 do not need to be meandering. For example, the upper edge, lower edge, and back edge of the left side surface where the inlet 50b is provided are branched into a plurality of parts, and the plurality of heat transfer tubes 50 extend along the top surface, the bottom surface, and the back side surface. Good too.

Moreover, the heat exchanger tubes 50 may not be provided within the heat insulating wall 37 but may be arranged outside the heat insulating wall 37 (within the test area TA) along the wall surface 37a. When the heat exchanger tube 50 is placed in the test area TA, it is desirable that the heat exchanger tube 50 be in thermal contact with the wall surface 37a, but it is preferable that some or all of the heat exchanger tube 50 be in thermal contact with the wall surface 37a. You don't have to.

Although descriptions of other configurations, operations, and effects will be omitted, the descriptions of the first to fourth embodiments can be applied to the fifth embodiment.

(Sixth embodiment)
FIG. 8 shows a sixth embodiment of the invention. Here, the same components as in the first embodiment are denoted by the same reference numerals, and detailed explanation thereof will be omitted.

The sixth embodiment differs from the first to fifth embodiments in that the wall cooling means 41 includes a nozzle 52 that sprays cooling gas.

The piping 39b of the gas source 39 penetrates the heat insulating wall 37 of the test tank 12 and extends into the test area TA. A nozzle 52 is provided at the tip of this pipe 39b. The nozzle 52 is arranged so as to spray cooling gas to a region of the low temperature side partition wall 22 that is closer to the low temperature outlet 22b than the low temperature inlet 22a.

Note that the nozzle 52 may be arranged so as to blow out the cooling gas from a region close to the low temperature outlet 22b to a region close to the low temperature inlet 22a. Further, although not shown in the figure, a nozzle 52 for spraying cooling gas onto the high temperature side partition wall 21 may be added.

In this embodiment, the cooling gas is sprayed onto a region of the wall surface 37a that partitions the test area TA that is closer to the low temperature outlet 22b than the low temperature inlet 22a, so that the region is cooled by the cooling gas. That is, the wall surface cooling means 41 is configured to cool the region of the wall surface 37a closer to the outlet ports 21b and 22b more than the region closer to the inlet ports 21a and 22a. Therefore, even if the cooling air introduced into the test area TA from the low-temperature inlet 22a flows from the low-temperature inlet 22a toward the low-temperature outlet 22b during low-temperature exposure, the area near the low-temperature outlet 22b on the wall surface 37a This makes it difficult for people to get cold easily. As a result, it is possible to suppress unevenness in the temperature of the air within the test area TA during low temperature exposure.

Although the description of other configurations, operations, and effects will be omitted, the description of the first to fifth embodiments can be applied to the sixth embodiment. In the first to fifth embodiments, a plurality of inflow ports 35b, 37b, and 50b may be provided. In this case, the flow rate of the cooling gas flowing to each inlet 35b, 37b, and 50b may be controlled. In that case, a temperature sensor may be provided to detect the temperature of the wall surface 37a, and the flow rate may be controlled according to the detected value of this temperature sensor.

10: Environmental test device 12: Test tank 14: High temperature chamber 16: Low temperature chamber 21a: High temperature inlet 21b: High temperature outlet 22a: Low temperature inlet 22b: Low temperature outlet 33: Air flow generation section 35: Gas jacket 35b: Inlet 35c: Outlet 37: Heat insulating wall 37a: Wall surface 41: Wall surface cooling means 43: Discharge port 48: Air guide plate 50: Heat transfer tube TA: Test area

Claims (10)

a test tank having a test area;
a high temperature tank that heats air for heating the test area;
a cryostat for cooling air for cooling the test area;
an airflow generation unit that generates an airflow in the test area from an inlet that introduces cooling air from the cryostat to the test area toward an outlet that draws air from the test area to the cryostat;
Cooling gas is supplied so that, of the wall surface that partitions the test area, an area closer to the outlet than the inlet is cooled more than an area closer to the inlet than the outlet. wall cooling means for flowing
Equipped with environmental test equipment. The environmental test device according to claim 1, wherein the wall surface cooling means is configured to flow the cooling gas in a direction from the outlet port toward the inlet port along the wall surface that partitions the test area. . 3. The wall surface cooling means includes a gas jacket disposed around the test area at least in a region closer to the outlet than the inlet and through which the cooling gas flows. environmental testing equipment. The gas jacket has an inlet that allows the cooling gas to flow into the gas jacket,
The environmental test device according to claim 3, wherein the inlet is located closer to the outlet than the inlet. The gas jacket has an outlet that allows the cooling gas to flow out from inside the gas jacket to the test area,
The environmental test device according to claim 4, wherein the outlet is located at least closer to the inlet than the outlet. The environmental test device according to claim 1 or 2, wherein the wall surface cooling means includes a baffle plate that causes the cooling gas to flow in a direction from the outlet port toward the inlet port along the wall surface. The wall surface cooling means is provided with a heat exchanger tube that is arranged to be in thermal contact with or along the wall surface at least in a region closer to the outlet than the inlet, and to flow the cooling gas. The environmental test device according to claim 1 or 2. 3. The environmental test apparatus according to claim 1, wherein the test area is provided with an outlet for discharging air in the test area to the outside by the cooling gas. The outlet is opened between high-temperature exposure for introducing heated air obtained in the high-temperature tank into the test area and low-temperature exposure for introducing cooled air obtained in the low-temperature bath into the test area. , The environmental test device according to claim 8. 2. The environmental test apparatus according to claim 1, wherein the wall surface cooling means sprays the cooling gas to a region of the wall surface that partitions the test area that is closer to the outlet port than the inlet port.