JP2024000842A - High frequency induction heating device - Google Patents
High frequency induction heating device Download PDFInfo
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- JP2024000842A JP2024000842A JP2022099788A JP2022099788A JP2024000842A JP 2024000842 A JP2024000842 A JP 2024000842A JP 2022099788 A JP2022099788 A JP 2022099788A JP 2022099788 A JP2022099788 A JP 2022099788A JP 2024000842 A JP2024000842 A JP 2024000842A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 31
- 230000006698 induction Effects 0.000 title claims abstract description 31
- 230000004907 flux Effects 0.000 claims abstract description 41
- 230000002093 peripheral effect Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000498 cooling water Substances 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- General Induction Heating (AREA)
Abstract
Description
本発明は、各種、電子部品の端子等に、半田付けを行うための高周波誘導加熱装置に関する。 The present invention relates to a high-frequency induction heating device for soldering various types of electronic component terminals and the like.
この種、高周波誘導加熱装置は、いわゆる半田ごてを用いた半田付け装置とは異なり、電子部品の端子自体を発熱させて半田付けを行うので、半田付け時間を短縮化出来る。
すなわち、半田ごてを用いた半田付け装置は、半田ごてを電子部品の端子に当接させ、この端子を、半田ごてからの熱伝導で加熱し、その後、半田付けを行うので、半田付け時間が長くなる。
これに対して、高周波誘導加熱装置では、電子部品の端子を磁気ギャップに配置し、端子自体を磁束にて自己発熱させるので、半田付け時間を短縮化出来る。
このような高周波誘導加熱装置の一例である特開２０２２－５９１６４号公報（特許文献１）には、コア体と、このコア体に磁束を供給するコイルとを備え、前記コア体は、第１のサブコア体と、第２のサブコア体の、それぞれの一方側を重ね合わせ、この一方側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他方側には、これら第１、第２のサブコアの他方間の隙間による磁気ギャップを形成した構成とし、前記コア体の表面側には、保護板（表面側磁気シールド体にもなる）を設け、前記コア体の裏面側には、熱伝導部材（裏面側磁気シールド体にもなる）を設けた高周波誘導加熱装置が開示されている。
すなわち、磁気ギャップに電子部品の端子などを配置し、端子を高周波誘導加熱により発熱させ、その部分に半田を供給することで、半田付けが短時間で行えるようにしている。
また、前記コア体の表面側には、保護板（表面側磁気シールド体にもなる）を設け、前記コア体の裏面側には、熱伝導部材（裏面側磁気シールド体にもなる）を設けることで、コア体の冷却、外部衝撃からのコア体保護、および、コア体表裏面方向への磁束漏洩抑制を図っている。
Unlike a soldering apparatus using a so-called soldering iron, this type of high-frequency induction heating apparatus performs soldering by generating heat from the terminals of electronic components themselves, so that the soldering time can be shortened.
In other words, in a soldering device using a soldering iron, the soldering iron is brought into contact with the terminal of an electronic component, the terminal is heated by heat conduction from the soldering iron, and then soldering is performed. The application time will be longer.
On the other hand, in high-frequency induction heating devices, the terminals of electronic components are placed in the magnetic gap and the terminals themselves generate heat using magnetic flux, so the soldering time can be shortened.
Japanese Unexamined Patent Publication No. 2022-59164 (Patent Document 1), which is an example of such a high-frequency induction heating device, includes a core body and a coil that supplies magnetic flux to the core body, and the core body has a first The sub-core body and the second sub-core body are stacked on one side, and the overlapped portion on one side is pivotally supported by an opening/closing shaft, and on the other side of the first and second sub-cores, A magnetic gap is formed between the other of the first and second sub-cores, and a protective plate (also serving as a front-side magnetic shield) is provided on the front side of the core body, and a protection plate (also serving as a front-side magnetic shield) is provided on the front side of the core body, and A high-frequency induction heating device is disclosed in which a heat conductive member (which also serves as a magnetic shield on the back side) is provided on the side.
That is, the terminals of electronic components are arranged in the magnetic gap, the terminals are heated by high-frequency induction heating, and solder is supplied to the parts, so that soldering can be performed in a short time.
Further, a protection plate (which also serves as a front side magnetic shield) is provided on the front side of the core body, and a heat conductive member (which also serves as a back side magnetic shield) is provided on the back side of the core body. This is intended to cool the core body, protect the core body from external impacts, and suppress magnetic flux leakage in the direction of the front and back surfaces of the core body.
前記先行の特許文献１では、前記コア体の表面側には、保護板（表面側磁気シールド体にもなる）を設け、前記コア体の裏面側には、熱伝導部材（裏面側磁気シールド体にもなる）を設け、コア体の冷却、外部衝撃からのコア体保護、コア体表裏面方向への磁束漏洩抑制を、図っている。
半田付けの効率化を図るためには、コイルに流す電流を大きくすることが求められているが、大きな電流を流して、コア体に磁束密度の高い状態の磁束を導入すると、コア体から漏洩する磁束が問題となることが有る。
すなわち、コイルからコア体に導入した磁束の大半は、磁気ギャップ部において、電子部品の端子の発熱に活用されるのであるが、一部の磁束がコア体から漏洩し、半田付け部近傍の他の物品に流入し、悪影響を与える場合がある。
そこで、上記先行文献では、コア体の表面側に、保護板（表面側磁気シールド体にもなる）を設け、前記コア体の裏面側に、熱伝導部材（裏面側磁気シールド体にもなる）を設け、コア体からの磁束漏洩による影響を抑制している。
発明者らの検討によれば、コア体からの磁束漏洩が、コア体の表裏面方向だけでなく、コア体の外周方向にも発生し、この外周方向への磁気漏洩が課題視される場合が有るという事が判明した。
例えば、配線基板に実装された電子部品の半田付けを、高周波誘導加熱装置で行う場合で、配線基板の半田付け部分の近傍に、コイル部品（フィルター等）が存在する場合には、このコイル部品が磁気コアを備えていることがあるので、その場合には、前記磁気コアに、前記コア体の外周方向に漏洩する磁束の一部が流入し、問題を発生させる場合もある。
そこで、本発明は、コア体の外周方向に漏洩する磁束による問題が発生するのを防止することを目的とする。
In the preceding Patent Document 1, a protective plate (which also serves as a front side magnetic shield) is provided on the front side of the core body, and a heat conductive member (which also serves as a front side magnetic shield body) is provided on the back side of the core body. ) is provided to cool the core body, protect the core body from external impact, and suppress magnetic flux leakage in the direction of the front and back surfaces of the core body.
In order to improve the efficiency of soldering, it is necessary to increase the current flowing through the coil, but when a large current is passed and magnetic flux with high magnetic flux density is introduced into the core body, leakage from the core body occurs. The magnetic flux caused by this may become a problem.
In other words, most of the magnetic flux introduced from the coil into the core body is used to heat the terminals of electronic components in the magnetic gap, but some magnetic flux leaks from the core body and is distributed to other parts near the soldering part. may flow into other products and have a negative impact.
Therefore, in the above-mentioned prior document, a protective plate (which also serves as a front side magnetic shield) is provided on the front side of the core body, and a heat conductive member (which also serves as a back side magnetic shield) is provided on the back side of the core body. is provided to suppress the effects of magnetic flux leakage from the core body.
According to the inventors' studies, magnetic flux leakage from the core body occurs not only in the front and back directions of the core body, but also in the outer circumferential direction of the core body, and when this magnetic leakage in the outer circumferential direction is considered as an issue. It turned out that there is.
For example, when soldering electronic components mounted on a wiring board using a high-frequency induction heating device, if a coil component (filter, etc.) is present near the soldered part of the wiring board, this coil component may include a magnetic core, in which case a part of the magnetic flux leaking in the direction of the outer circumference of the core body may flow into the magnetic core, causing problems.
Therefore, an object of the present invention is to prevent problems caused by magnetic flux leaking in the direction of the outer circumference of the core body.
そして、この目的を達成するために本発明の高周波誘導加熱装置は、コア体と、このコア体に磁束を供給するコイルとを備え、前記コア体は、第１のサブコア体と、第２のサブコア体の、それぞれの一方側を重ね合わせ、この一方側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他方側には、これら第１、第２のサブコアの他方間の隙間による磁気ギャップを形成した構成とし、前記コア体の表面側には、表面側磁気シールド体を設け、前記コア体の裏面側には、裏面側磁気シールド体を設け、前記コア体の外周側には、外周側磁気シールド体を設けた構成とした。
また、本発明の高周波誘導加熱装置は、前記外周側磁気シールド体の板厚を、表面側磁気シールド体の板厚、および、裏面側磁気シールド体の板厚よりも薄くしてもよい。
さらに、本発明の高周波誘導加熱装置は、前記コア体の外周面と、前記外周側磁気シールド体の内周面との間に隙間を設けてもよい。
また、本発明の高周波誘導加熱装置は、前記外周側磁気シールド体の前記第１、第２のサブコアの他方側は、前記コア体の磁気ギャップ部よりも、前記開閉軸とは反対側に延長した構造でもよい。
さらに、本発明の高周波誘導加熱装置は、前記コア体を構成する第１、第２のサブコア体の一方を略Ｃの字状とし、他方を略逆Ｃの字状とし、前記略Ｃの字状の第１のサブコア体のＣ字開口部を前記第２のサブコア体側に向け、前記略逆Ｃの字状の第２のサブコア体の逆Ｃ字開口部を前記第１のサブコア体側に向けた状態で、これら第１、第２のサブコア体の一端側を重ね合わせ、この一端側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他端側には、これら第１、第２のサブコア体間の隙間による磁気ギャップを形成した構成としてもよい。
また、本発明の高周波誘導加熱装置は、前記第１、第２のサブコア体は、フェライト材により形成し、前記表面側磁気シールド体、裏面側磁気シールド体、外周側磁気シールド体を、銅材、またはアルミニウム材により形成してもよい。
さらに、本発明の高周波誘導加熱装置は、前記表面側磁気シールド体と裏面側磁気シールド体の一方の外周部には、前記外周側磁気シールド体を設けて容器状体とし、この容器状体の開口部に、前記表面側磁気シールド体と裏面側磁気シールド体の他方を装着し、前記コア体の表面側、裏面側、外周側を、前記表面側磁気シールド体、裏面側磁気シールド体、外周側磁気シールド体で覆った構成にするのが好ましい。
In order to achieve this object, the high-frequency induction heating device of the present invention includes a core body and a coil that supplies magnetic flux to the core body, and the core body includes a first sub-core body and a second sub-core body. One side of each of the sub-core bodies is overlapped, the overlapping part of this one side is supported by an opening/closing shaft, and the other side of the first and second sub-cores is provided with the first and second sub-cores. A magnetic gap is formed by a gap between the other core bodies, a front side magnetic shield body is provided on the front side of the core body, a back side magnetic shield body is provided on the back side of the core body, and the core body An outer magnetic shield is provided on the outer circumferential side.
Moreover, in the high frequency induction heating device of the present invention, the thickness of the outer circumferential side magnetic shield body may be made thinner than the plate thickness of the front side magnetic shield body and the plate thickness of the back side magnetic shield body.
Furthermore, in the high frequency induction heating device of the present invention, a gap may be provided between the outer circumferential surface of the core body and the inner circumferential surface of the outer circumferential magnetic shield body.
Further, in the high-frequency induction heating device of the present invention, the other side of the first and second sub-cores of the outer peripheral side magnetic shield body extends beyond the magnetic gap portion of the core body to the opposite side of the opening/closing axis. It may have a similar structure.
Further, in the high-frequency induction heating device of the present invention, one of the first and second sub-core bodies constituting the core body has a substantially C-shape, the other has a substantially inverted C-shape, and the substantially C-shape A C-shaped opening of the first sub-core body having a shape is directed toward the second sub-core body, and an inverted C-shaped opening of the second sub-core body having a substantially inverted C shape is directed toward the first sub-core body. In this state, one end sides of the first and second sub-core bodies are overlapped, and the overlapping part on the one end side is pivotally supported by an opening/closing shaft, and the other end side of the first and second sub-core bodies is A configuration may be adopted in which a magnetic gap is formed by a gap between these first and second sub-core bodies.
Further, in the high frequency induction heating device of the present invention, the first and second sub-core bodies are formed of a ferrite material, and the front side magnetic shield body, the back side magnetic shield body, and the outer peripheral side magnetic shield body are made of copper material. , or may be formed from an aluminum material.
Furthermore, in the high frequency induction heating device of the present invention, the outer circumferential side magnetic shielding body is provided on the outer circumference of one of the front side magnetic shielding body and the back side magnetic shielding body to form a container-like body. The other of the front side magnetic shield body and the back side magnetic shield body is attached to the opening, and the front side, back side, and outer circumferential side of the core body are attached to the front side magnetic shield body, the back side magnetic shield body, and the outer periphery. It is preferable to have a structure covered with a side magnetic shield.
以上のように本発明の高周波誘導加熱装置は、コア体と、このコア体に磁束を供給するコイルとを備え、前記コア体は、第１のサブコア体と、第２のサブコア体の、それぞれの一方側を重ね合わせ、この一方側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他方側には、これら第１、第２のサブコアの他方間の隙間による磁気ギャップを形成した構成とし、前記コア体の表面側には、表面側磁気シールド体を設け、前記コア体の裏面側には、裏面側磁気シールド体を設け、前記コア体の外周側には、外周側磁気シールド体を設けた構成としたので、コア体の外周方向に漏洩する磁束による問題が発生するのを防止することができる。
また、本発明では、前記コア体の外周側に、外周側磁気シールド体を設けたので、コア体の磁気ギャップ部の側方から他の部品がぶつかるのを防止するガードとしても活用することができる。
As described above, the high-frequency induction heating device of the present invention includes a core body and a coil that supplies magnetic flux to the core body, and the core body includes a first sub-core body and a second sub-core body, respectively. The overlapped portion on one side is supported by an opening/closing shaft, and the other side of the first and second sub-cores is provided with a gap between the other of these first and second sub-cores. A magnetic gap is formed, a front magnetic shield is provided on the front side of the core body, a back magnetic shield is provided on the back side of the core body, and a magnetic shield is provided on the outer peripheral side of the core body. Since the structure includes the outer magnetic shield, it is possible to prevent problems caused by magnetic flux leaking in the outer circumferential direction of the core body.
Moreover, in the present invention, since the outer circumferential magnetic shield body is provided on the outer circumferential side of the core body, it can also be used as a guard to prevent other parts from colliding with the magnetic gap portion of the core body from the side. can.
（実施の形態）
本実施形態の高周波誘導加熱装置の高周波誘導加熱ヘッド１は、図１～図７に示すように、（特許文献１）と同じ様に、箱状の本体ケース２を備えている。
本体ケース２の上面２ａ、下面２ｂ、４枚の外周面２ｃの、合計六面は、何れも樹脂で形成され、この本体ケース２の上面２ａには、ＩＨ出力接続コネクター２Ａと、２個の冷却水接続コネクター３が設けられている。
また、本体ケース２の下方には、コア体４と、このコア体４に磁束を供給するコイル５が配置されている。
本実施形態の高周波誘導加熱ヘッド１は、後述するように、コア体４部分に特徴があり、それ以外は、基本的には、（特許文献１）と同様の構成としている。
すなわち、ＩＨ出力接続コネクター２Ａからの電源供給を行うと、コンデンサとコイルによる共振が発生し、この共振電流が、コイル５に供給され、このコイル５から磁束が発生する状態となる 。
また、このコイル５は、内部に水路が形成された銅パイプによってＵ字状に形成されたものである。
つまり、冷却装置（図示せず）で作られた、例えば、２５℃の冷却水が、図６に示す、一方の冷却水接続コネクター３を介して、コイル５の一端側から、このコイル５内に流入させられ、その後、コイル５の他端、図６に示す、他方の冷却水接続コネクター３を介し、冷却装置へと循環する。
この冷却水の循環により、コイル５とコア体４は冷却されることになる。
本体ケース２に固定された熱伝導板６には、コイル５の熱伝導部５ａが固定されており、また、この熱伝導板６には、図５に示すネジ７で、コア体４が固定されている。
これにより、コア体４も、熱伝導部５ａ、熱伝導板６を介して水冷されることになる。
コア体４の冷却は、風冷で行う事も出来るが、その場合には、熱伝導板６を風冷することになる。
コア体４の構成について、詳細に説明する。
コア体４は、図９、図１０から理解されるように、フェライト材よりなる略Ｃの字状のサブコア体４ａと、略逆Ｃの字状のサブコア体４ｂを有する。
そして、前記略Ｃの字状のサブコア体４ａのＣ字開口部を、サブコア体４ｂ側に向け、前記略逆Ｃの字状のサブコア体４ｂの逆Ｃ字開口部をサブコア体４ａ側に向けた状態で、これらサブコア体４ａ、４ｂの上端側（一端側）を重ね合わせ、この一端側の重ね合わせ部を開閉軸８で軸支し、前記サブコア４ａ、４ｂの下端側（他端側）には、これらサブコア体４ａ、４ｂ間の隙間による磁気ギャップ９を形成した構成とした。
つまり、開閉軸８で軸支されたサブコア４ａ、４ｂの下端側（他端側）を開閉操作すれば、サブコア体４ａ、４ｂ間の隙間による磁気ギャップ９の幅を調整することができ、その後、開閉軸８を締め付ければ、調整済みの磁気ギャップ９の幅を保持できる。
前記コア体４の表面側には、図８～図１０に示す、表面側磁気シールド体１０を設け、前記コア体４の裏面側には、裏面側磁気シールド体１１を設けている。
裏面側磁気シールド体１１は、図８～図１０から理解されるように、その上端は、上方の熱伝導板６側に延長された取付部１２となっており、この取付部１２のネジ孔１３に、図５のごとくネジ７を貫通させ、熱伝導板６に固定する。これにより、裏面側磁気シールド体１１は熱伝導板６を介して水冷されることになる。
裏面側磁気シールド体１１の下方で、コア体４の外周部分には、図９、図１１に示すように、コア体４の外周を覆うように、外周側磁気シールド体１４を設けて容器状体としている。
つまり、裏面側磁気シールド体１１の下方で、コア体４の外周部分には、図９、図１１に示すように、コア体４の外周を覆うように、外周側磁気シールド体１４を一体に設けて容器状体としている。
容器状体とは、表面側磁気シールド体１０側に開口部を有し、この開口部からコア体４を外周側磁気シールド体１４内に収容する構成を言う。
なお、図１１は図９において表面側磁気シールド体１０を装着していない状態を示している。
図１１のように、容器状体の外周側磁気シールド体１４内に、コア体４を収容させた状態で、外周側磁気シールド体１４の開口部を覆う様に、表面側磁気シールド体１０が装着され、ネジ１５で裏面側磁気シールド体１１のネジ穴１６部分へと固定される。
このネジ１５をネジ穴１６部分へと、ねじ締めする前には、磁気ギャップ９の距離調整を行い、その後、開閉軸８を裏面側磁気シールド体１１のネジ穴１７に固定する。
つまり、開閉軸８の裏面側磁気シールド体１１側の端部にはネジ溝が形成され、これをネジ穴１７にねじ込むことで、コア体４を、容器状体の外周側磁気シールド体１４内に収納させた状態で、裏面側磁気シールド体１１側に固定する。
そして、この開閉軸８のねじ締めで、サブコア体４ａ、４ｂの上端側（一端側）の重ね合わせ部が密接し、また、前記サブコア４ａ、４ｂの下端側（他端側）の磁気ギャップ９の間隔寸法が設定された状態となる。
その後、表面側磁気シールド体１０をネジ１５で裏面側磁気シールド体１１に固定する。
表面側磁気シールド体１０をネジ１５で裏面側磁気シールド体１１に固定した状態では、表面側磁気シールド体１０は裏面側磁気シールド体１１側に密接し、表面側磁気シールド体１０も裏面側磁気シールド体１１、熱伝導板６を介して水冷されることになる。
このような構成において、表面側磁気シールド体１０、裏面側磁気シールド体１１、外周側磁気シールド体１４は、銅材、またはアルミニウム材によって形成している。
また、ネジ１５による表面側磁気シールド体１０の裏面側磁気シールド体１１への固定時には、表面側磁気シールド体１０の背面はコア体４の表面に接触し、裏面側磁気シールド体１１の表面はコア体４の裏面に接触している。
このため、コア体４は、熱伝導板６を介して温度が下げられた表面側磁気シールド体１０と裏面側磁気シールド体１１によって冷却される。
また、表面側磁気シールド体１０と裏面側磁気シールド体１１は、前記コア体４よりも比透磁率が低く、かつ、前記コア体４よりも電気抵抗値が低い金属材によって構成した。
具体的には、コア体４はフェライト材により形成し、前記表面側磁気シールド体１０と裏面側磁気シールド体１１は銅材、あるいはアルミニウム材により形成した。
コア体４を構成するフェライト材の比透磁率が５０～５０００であるのに対して、表面側磁気シールド体１０と裏面側磁気シールド体１１を銅材やアルミニウム材で構成した場合は、その比透磁率は略１であるので、コイル５で発生し、コア体４を流れる磁束は、専らコア体４内を流れ、表面側磁気シールド体１０と裏面側磁気シールド体１１側、つまり、コア体４の表裏面側へと漏洩することは少ない。
しかしながら、例えば、コイル５に１００Ａ程度の大きな電流を流すと、漏れ磁束が磁気ギャップ９を流れる磁束量に比較して十分に少なくても、コア体４表裏面側近傍の構成体（例えば、基板に実装された部品）を十分に加熱、高温化させてしまう場合もある。
これに対して本実施形態では、コア体４から漏れ出した磁束が、前記コア体４よりも比
透磁率が低い表面側磁気シールド体１０と裏面側磁気シールド体１１を通過すると、前記磁束の通過により表面側磁気シールド体１０と裏面側磁気シールド体１１部分に、渦電流が流れ、この渦電流で、前記表面側磁気シールド体１０と裏面側磁気シールド体１１を通過する磁束とは反対方向の磁束を発生させ、その結果として、前記コア体４から表面側磁気シールド体１０と裏面側磁気シールド体１１を介して漏れ出す磁束量が減少し、これによって、コア体４の表裏面側近傍の他の構成体（例えば、基板に実装された部品）を不用意に加熱することが無くなる。
本実施形態の最も大きな特徴は、裏面側磁気シールド体１１のコア体４外周部において、表面側に延びる外周側磁気シールド体１４を一体形成したことである。
この外周側磁気シールド体１４とコア体４の関係は、図１１に詳細に表現されている。
つまり、外周側磁気シールド体１４の内周部分と、コア体４の外周部分との間には隙間Ｓが形成されている。
これは、磁気ギャップ９の幅調整の為に、サブコア体４ａ、４ｂを左右に開閉させる必要が有るからである。また、コア体４の冷却は、コア体４の表裏面に、表面側磁気シールド体１０と裏面側磁気シールド体１１を密接させることで行っており、外周側磁気シールド体１４で、コア体４の冷却を積極的に行う必要が無いからである。
本実施形態では、コア体４の外周側に、外周側磁気シールド体１４を設けたことを特徴としており、この外周側磁気シールド体１４により、コア体４の外周方向に漏洩する磁束による問題が発生を防止することができる。
つまり、コイル５への電流をさらに高めた場合（例えば１５０Ａ）や、半田付け部近傍にコイル部品が存在す時には、前記（特許文献１）では問題とならなかった事象が発生する虞が有るという課題を見出し、本発明実施形態に至ったものである。
コイル体４の外周方向への漏れ磁束は微小で、今までは問題にはならなかったが、コイル５への電流を、例えば１５０Ａと高めた場合には、当然のことながら外周方向への漏れ磁束も大きくなり、課題となる場合が有る。
一例として、半田付け近傍に、熱負荷に弱い他の電子部品が存在する場合や、コイル部品が存在する場合には、問題となることがある。
特に、コイル部品では、発熱だけでなく、コイル部品が保有するコイルに誘導電圧が発生し、それに接続された回路に不用意な電流が流れてしまう場合もある。
そこで、本実施形態では、コア体４の外周に外周側磁気シールド体１４を設けた。
この外周側磁気シールド体１４は、上述のごとく、裏面側磁気シールド体１１と一体成形しており、前記コア体４よりも比透磁率が低く、かつ、前記コア体４よりも電気抵抗値が低い金属材によって構成した状態となっている。
具体的には、コア体４はフェライト材により形成し、前記外周側磁気シールド体１４は銅材、あるいはアルミニウム材により形成した。
その結果、本実施形態では、コア体４の外周へと漏れ出した磁束が、前記コア体４よりも比透磁率が低い外周側磁気シールド体１４を通過すると、前記磁束の通過により外周側磁気シールド体１４部分に、渦電流が流れ、この渦電流で、前記外周側磁気シールド体１４を通過する磁束とは反対方向の磁束を発生させ、その結果として、前記コア体４の外周方向に漏れ出す磁束量が減少し、これによって、コア体４の外周方向での漏れ磁束弊害を抑制することができる。
また、本実施形態では、表面側磁気シールド体１０、裏面側磁気シールド体１１の下端と、外周側磁気シールド体１４の下端の関係には、大きな差異を設けている。
具体的には、表面側磁気シールド体１０、裏面側磁気シールド体１１の下端は、コア体４の磁気ギャップ９よりも上方までとしているが、外周側磁気シールド体１４の下端は、図１１のように、磁気ギャップ９よりも下方（開閉軸８とは反対側）まで延長している。
このため、磁気ギャップ９外周においては、より回路基板に近い位置まで、コア体４の外周方向への漏洩磁束による問題発生を防止することが出来る。
また、コア体４の外周方向への漏洩磁束を防止する状況では、外周側磁気シールド体１４には渦電流による発熱が発生しているが、この外周側磁気シールド体１４に発生する熱は磁気ギャップ９の両側において、磁気ギャップ９部分、および磁気ギャップ９部分近傍の回路基板の温度を上昇させることに活用され、その結果として、半田付けが効率的に行えることになる。
つまり、表面側磁気シールド体１０、裏面側磁気シールド体１１も磁気遮蔽時の渦電流で発熱するが、これらの表面側磁気シールド体１０、裏面側磁気シールド体１１の下端は磁気ギャップ９よりも上方に位置しているので、磁気ギャップ９部の温度を高めることに活用することが出来ない。
この点を、さらに説明すると、磁気ギャップ９には、半田付けのための端子などが進入してくる状態となるので、表面側磁気シールド体１０、裏面側磁気シールド体１１の下端が、磁気ギャップ９よりも下方に存在すると、端子を磁気ギャップ９に進入させることが出来なくなる。
そこで、表面側磁気シールド体１０、裏面側磁気シールド体１１の下端は磁気ギャップ９よりも上方に配置することになる。
このため、表面側磁気シールド体１０、裏面側磁気シールド体１１の発熱を、磁気ギャップ９部の温度を高めることに活用することが出来ない。
これに対して、磁気ギャップ９の外周に存在する外周側磁気シールド体１４の下端は、図１１のように磁気ギャップ９よりも下方（開閉軸８とは反対側）まで延長しても、半田付け時の端子の進入を阻害することは無い。
このため、外周側磁気シールド体１４が磁気遮蔽時に発生する熱を、磁気ギャップ９の両側において、磁気ギャップ９部、およびその近傍部分の回路基板部分の温度を高めることに活用することが出来、その結果として、半田付けなどが効率的に行えることになるのである。
ここで、本実施形態のさらに重要な点について説明する。
本実施形態においては、外周側磁気シールド体１４の板厚を、表面側磁気シールド体１０の板厚、および、裏面側磁気シールド体１１の板厚よりも薄くした。
つまり、表面側磁気シールド体１０、および、裏面側磁気シールド体１１は、上述のごとく、コア体４の表裏面に接し、コア体４の冷却を行う必要があるので、コア体４からの熱移動のためにも、十分な板厚を有する構成としている。
これに対して外周側磁気シールド体１４は、磁気ギャップ９の幅調整の為に、サブコア体４ａ、４ｂを左右に開閉させる必要が有るので、コア体４の外周側磁気シールド体１４の内周部分と、コア体４の外周部分との間には隙間Ｓが形成されている。
つまり、外周側磁気シールド体１４は、コア体４とは非接触状態となっている。
また、外周側磁気シールド体１４の板厚を、表面側磁気シールド体１０の板厚、および、裏面側磁気シールド体１１の板厚よりも薄くしたので、コア体４の外周方向に漏洩する磁束による渦電流で、この外周側磁気シールド体１４は、表面側磁気シールド体１０や裏面側磁気シールド体１１よりも温度が高くなる。
そこで、この外周側磁気シールド体１４の下方側（開閉軸８とは反対側）を、表面側磁気シールド体１０と裏面側磁気シールド体１１の下方側（開閉軸８とは反対側）よりも下方に（開閉軸８とは反対側）に延ばしておけば、半田付け部分の温度を高くする作用を奏することになる。
これは、半田付け作業において有益な効果となる。
本実施形態は、その効果をさらに高めるために、外周側磁気シールド体１４のサブコア４ａ、４ｂの他方側を、前記コア体4の磁気ギャップ９部よりも、下方側（開閉軸８とは反対側）にまで延長したので、基板部分の温度を積極的に高めることになり、これは半田付け作業において有益な効果となる。
また、外周側磁気シールド体１４の下方側（開閉軸８とは反対側）を、表面側磁気シールド体１０と裏面側磁気シールド体１１の下方側（開閉軸８とは反対側）よりも下方に（開閉軸８とは反対側）に延ばしておけば、コア体４の磁気ギャップ９部に、外周方向から、他の部品がぶつかるのを防止するガードとしても活用することができる。
また、外周側磁気シールド体１４の下方側（開閉軸８とは反対側）を、表面側磁気シールド体１０と裏面側磁気シールド体１１の下方側（開閉軸８とは反対側）よりも下方に（開閉軸８とは反対側）に延ばしておけば、必要に応じ、敢えて、回路基板と、前記外周側磁気シールド体１４の下端（ガード部）と、を当接させることで、基板と磁気ギャップ９との距離を一定に保つ位置決め部材としても活用することができる。
さらに、本実施形態では、裏面側磁気シールド体１１のコア体４外周部において、表面側に延びる外周側磁気シールド体１４を一体形成し、容器状体としたので、コア体４の装着時には、仮置き場としても活用でき、作業性の良いものとなる。
なお、本実施形態では、外周側磁気シールド体１４を、裏面側磁気シールド体１１に一体成形し、容器状体としたが、表面側磁気シールド体１０のコア体４外周部に一体成形しても良い。
(Embodiment)
As shown in FIGS. 1 to 7, the high frequency induction heating head 1 of the high frequency induction heating apparatus of this embodiment includes a box-shaped main body case 2, as in (Patent Document 1).
A total of six surfaces, the upper surface 2a, the lower surface 2b, and the four outer peripheral surfaces 2c, of the main body case 2 are formed of resin, and the upper surface 2a of the main body case 2 has an IH output connection connector 2A and two A cooling water connection connector 3 is provided.
Further, below the main body case 2, a core body 4 and a coil 5 that supplies magnetic flux to the core body 4 are arranged.
The high-frequency induction heating head 1 of this embodiment has a feature in the core body 4 portion, as will be described later, and other than that, it basically has the same structure as that of (Patent Document 1).
That is, when power is supplied from the IH output connector 2A, resonance occurs between the capacitor and the coil, this resonance current is supplied to the coil 5, and the coil 5 generates magnetic flux.
The coil 5 is formed into a U-shape by a copper pipe with a water channel formed inside.
In other words, cooling water of, for example, 25° C. produced by a cooling device (not shown) is supplied from one end of the coil 5 to the inside of the coil 5 via one cooling water connection connector 3 shown in FIG. It is then circulated to the cooling device via the other end of the coil 5, the other cooling water connection connector 3 shown in FIG.
The coil 5 and core body 4 are cooled by this circulation of cooling water.
The heat conduction part 5a of the coil 5 is fixed to the heat conduction plate 6 fixed to the main body case 2, and the core body 4 is fixed to the heat conduction plate 6 with screws 7 shown in FIG. has been done.
Thereby, the core body 4 is also water-cooled via the heat conduction portion 5a and the heat conduction plate 6.
The core body 4 can also be cooled by air, but in that case, the heat conductive plate 6 will be cooled by air.
The configuration of the core body 4 will be explained in detail.
As understood from FIGS. 9 and 10, the core body 4 includes a substantially C-shaped sub-core body 4a made of ferrite material and a substantially inverted C-shaped sub-core body 4b.
Then, the C-shaped opening of the substantially C-shaped sub-core body 4a is directed toward the sub-core body 4b, and the inverted C-shaped opening of the substantially inverted-C-shaped sub-core body 4b is directed toward the sub-core body 4a. In this state, the upper end sides (one end side) of these sub-core bodies 4a, 4b are overlapped, and the overlapping part on the one end side is pivotally supported by an opening/closing shaft 8, and the lower end side (other end side) of the sub-core bodies 4a, 4b is In this configuration, a magnetic gap 9 is formed by a gap between these sub-core bodies 4a and 4b.
In other words, by opening and closing the lower ends (other ends) of the sub-cores 4a and 4b supported by the opening-closing shaft 8, the width of the magnetic gap 9 created by the gap between the sub-core bodies 4a and 4b can be adjusted. By tightening the opening/closing shaft 8, the adjusted width of the magnetic gap 9 can be maintained.
A front side magnetic shield 10 shown in FIGS. 8 to 10 is provided on the front side of the core body 4, and a back side magnetic shield 11 is provided on the back side of the core body 4.
As can be understood from FIGS. 8 to 10, the back magnetic shield 11 has a mounting portion 12 at its upper end that extends toward the upper heat conduction plate 6, and a screw hole of this mounting portion 12. 13, as shown in FIG. Thereby, the back side magnetic shield body 11 is water-cooled via the heat conductive plate 6.
As shown in FIGS. 9 and 11, an outer magnetic shield 14 is provided on the outer periphery of the core body 4 below the back side magnetic shield 11 so as to cover the outer periphery of the core body 4. It is my body.
That is, below the back magnetic shield 11, the outer magnetic shield 14 is integrally attached to the outer periphery of the core body 4 so as to cover the outer periphery of the core body 4, as shown in FIGS. 9 and 11. It is provided as a container-like body.
The container-shaped body has an opening on the front side magnetic shielding body 10 side, and refers to a configuration in which the core body 4 is accommodated in the outer peripheral side magnetic shielding body 14 through this opening.
Note that FIG. 11 shows a state in which the front side magnetic shield body 10 is not attached in FIG.
As shown in FIG. 11, with the core body 4 accommodated in the outer magnetic shield 14 of the container-shaped body, the front magnetic shield 10 is placed so as to cover the opening of the outer magnetic shield 14. It is attached and fixed to the screw hole 16 portion of the back side magnetic shield body 11 with the screw 15.
Before tightening the screw 15 into the screw hole 16, the distance of the magnetic gap 9 is adjusted, and then the opening/closing shaft 8 is fixed to the screw hole 17 of the back magnetic shield 11.
That is, a screw groove is formed at the end of the opening/closing shaft 8 on the back side magnetic shield body 11 side, and by screwing this groove into the screw hole 17, the core body 4 is inserted into the outer peripheral side magnetic shield body 14 of the container-shaped body. It is fixed to the back side magnetic shielding body 11 side in a state where it is stored in the magnetic shield body 11 side.
By tightening the opening/closing shaft 8, the overlapping portions on the upper end side (one end side) of the sub-core bodies 4a, 4b are brought into close contact, and the magnetic gap 9 on the lower end side (other end side) of the sub-core bodies 4a, 4b is brought into close contact. The interval dimension of is now set.
Thereafter, the front side magnetic shield body 10 is fixed to the back side magnetic shield body 11 with screws 15.
When the front side magnetic shield body 10 is fixed to the back side magnetic shield body 11 with the screws 15, the front side magnetic shield body 10 is in close contact with the back side magnetic shield body 11 side, and the front side magnetic shield body 10 is also attached to the back side magnetic shield body 11. It is water-cooled via the shield body 11 and the heat conductive plate 6.
In such a configuration, the front magnetic shield 10, the back magnetic shield 11, and the outer magnetic shield 14 are made of copper or aluminum.
Furthermore, when the front side magnetic shield body 10 is fixed to the back side magnetic shield body 11 with the screws 15, the back side of the front side magnetic shield body 10 comes into contact with the surface of the core body 4, and the surface of the back side magnetic shield body 11 It is in contact with the back surface of the core body 4.
Therefore, the core body 4 is cooled by the front side magnetic shield body 10 and the back side magnetic shield body 11 whose temperature is lowered through the heat conduction plate 6.
Further, the front side magnetic shield body 10 and the back side magnetic shield body 11 are made of a metal material having a lower relative magnetic permeability than the core body 4 and a lower electric resistance value than the core body 4.
Specifically, the core body 4 was formed of a ferrite material, and the front side magnetic shield body 10 and the back side magnetic shield body 11 were formed of a copper material or an aluminum material.
While the relative magnetic permeability of the ferrite material constituting the core body 4 is 50 to 5000, when the front side magnetic shield body 10 and the back side magnetic shield body 11 are made of copper material or aluminum material, the ratio is Since the magnetic permeability is approximately 1, the magnetic flux generated in the coil 5 and flowing through the core body 4 flows exclusively within the core body 4 and flows between the front side magnetic shield body 10 and the back side magnetic shield body 11 side, that is, the core body Leakage to the front and back sides of 4 is rare.
However, for example, when a large current of about 100 A is passed through the coil 5, even if the leakage magnetic flux is sufficiently small compared to the amount of magnetic flux flowing through the magnetic gap 9, the structure near the front and back sides of the core body 4 (for example, the substrate (components mounted on the device) may be sufficiently heated to a high temperature.
On the other hand, in this embodiment, when the magnetic flux leaking from the core body 4 passes through the front side magnetic shield body 10 and the back side magnetic shield body 11, which have a lower relative magnetic permeability than the core body 4, the magnetic flux is As a result of the passage, an eddy current flows through the front side magnetic shield 10 and the back side magnetic shield 11, and this eddy current causes the magnetic flux to flow in the opposite direction to the magnetic flux passing through the front side magnetic shield 10 and the back side magnetic shield 11. As a result, the amount of magnetic flux leaking from the core body 4 through the front side magnetic shield body 10 and the back side magnetic shield body 11 is reduced, thereby causing This eliminates the possibility of inadvertently heating other components (for example, components mounted on the board).
The most significant feature of this embodiment is that an outer magnetic shield 14 extending toward the front surface is integrally formed on the outer periphery of the core body 4 of the back magnetic shield 11.
The relationship between the outer circumferential magnetic shield body 14 and the core body 4 is expressed in detail in FIG. 11.
That is, a gap S is formed between the inner circumferential portion of the outer circumferential magnetic shield body 14 and the outer circumferential portion of the core body 4.
This is because in order to adjust the width of the magnetic gap 9, it is necessary to open and close the sub-core bodies 4a and 4b from side to side. Further, the core body 4 is cooled by bringing the front side magnetic shield body 10 and the back side magnetic shield body 11 into close contact with the front and back surfaces of the core body 4. This is because there is no need to actively cool the air.
This embodiment is characterized in that an outer magnetic shield 14 is provided on the outer circumferential side of the core body 4, and this outer magnetic shield 14 prevents problems caused by magnetic flux leaking in the outer circumferential direction of the core body 4. Occurrence can be prevented.
In other words, if the current to the coil 5 is further increased (for example, 150 A) or if there are coil components near the soldered part, there is a possibility that a phenomenon that did not pose a problem in the above (Patent Document 1) may occur. The problem was discovered and the embodiments of the present invention were developed.
The leakage magnetic flux toward the outer circumference of the coil body 4 is minute and has not been a problem until now, but when the current to the coil 5 is increased to 150 A, for example, leakage toward the outer circumference naturally occurs. The magnetic flux also increases, which may become a problem.
For example, a problem may arise if there are other electronic components that are susceptible to heat load or coil components in the vicinity of the soldering.
In particular, coil components not only generate heat but also generate induced voltage in the coils of the coil components, which may cause an inadvertent current to flow in circuits connected to the coils.
Therefore, in this embodiment, an outer magnetic shield 14 is provided on the outer periphery of the core body 4.
As described above, the outer magnetic shield 14 is integrally molded with the back magnetic shield 11, and has a lower relative magnetic permeability than the core 4 and a lower electrical resistance than the core 4. It is made of low-quality metal material.
Specifically, the core body 4 was formed from a ferrite material, and the outer peripheral magnetic shield body 14 was formed from a copper material or an aluminum material.
As a result, in this embodiment, when the magnetic flux leaking to the outer periphery of the core body 4 passes through the outer circumferential side magnetic shield body 14 whose relative magnetic permeability is lower than that of the core body 4, the outer circumferential side magnetic An eddy current flows in the shield body 14 portion, and this eddy current generates a magnetic flux in the opposite direction to the magnetic flux passing through the outer magnetic shield body 14, and as a result, leakage toward the outer circumference of the core body 4 occurs. The amount of magnetic flux emitted is reduced, thereby suppressing the adverse effects of magnetic flux leakage in the outer circumferential direction of the core body 4.
Further, in this embodiment, there is a large difference in the relationship between the lower ends of the front side magnetic shield body 10, the back side magnetic shield body 11, and the lower ends of the outer peripheral side magnetic shield body 14.
Specifically, the lower ends of the front magnetic shield 10 and the back magnetic shield 11 are above the magnetic gap 9 of the core body 4, but the lower ends of the outer magnetic shield 14 are as shown in FIG. As such, it extends below the magnetic gap 9 (to the side opposite to the opening/closing shaft 8).
Therefore, on the outer periphery of the magnetic gap 9, problems caused by magnetic flux leakage toward the outer periphery of the core body 4 can be prevented up to a position closer to the circuit board.
In addition, in a situation where magnetic flux leakage toward the outer circumference of the core body 4 is prevented, heat is generated in the outer magnetic shield 14 due to eddy current; however, the heat generated in the outer magnetic shield 14 is This is used to raise the temperature of the magnetic gap 9 portion and the circuit board near the magnetic gap 9 portion on both sides of the gap 9, and as a result, soldering can be performed efficiently.
In other words, the front magnetic shield 10 and the back magnetic shield 11 also generate heat due to eddy currents during magnetic shielding, but the lower ends of the front magnetic shield 10 and the back magnetic shield 11 are lower than the magnetic gap 9. Since it is located above, it cannot be used to increase the temperature of the magnetic gap 9 portion.
To further explain this point, since terminals for soldering and the like enter the magnetic gap 9, the lower ends of the front side magnetic shield body 10 and the back side magnetic shield body 11 are placed in the magnetic gap 9. If the terminal is located below the magnetic gap 9, the terminal cannot enter the magnetic gap 9.
Therefore, the lower ends of the front side magnetic shield body 10 and the back side magnetic shield body 11 are arranged above the magnetic gap 9.
Therefore, the heat generated by the front side magnetic shield 10 and the back side magnetic shield 11 cannot be utilized to increase the temperature of the magnetic gap 9 portion.
On the other hand, even if the lower end of the outer magnetic shield 14 existing on the outer periphery of the magnetic gap 9 extends below the magnetic gap 9 (on the opposite side of the opening/closing shaft 8) as shown in FIG. It does not obstruct the entry of the terminal during attachment.
Therefore, the heat generated when the outer magnetic shield body 14 is magnetically shielded can be used to increase the temperature of the magnetic gap 9 portion and the circuit board portion in its vicinity on both sides of the magnetic gap 9. As a result, soldering and the like can be done more efficiently.
Here, more important points of this embodiment will be explained.
In this embodiment, the thickness of the outer magnetic shield 14 is made thinner than the thickness of the front magnetic shield 10 and the back magnetic shield 11.
In other words, as described above, the front side magnetic shield body 10 and the back side magnetic shield body 11 are in contact with the front and back surfaces of the core body 4, and it is necessary to cool the core body 4. The structure is designed to have sufficient plate thickness for movement.
On the other hand, in order to adjust the width of the magnetic gap 9, the outer magnetic shield body 14 needs to open and close the sub-core bodies 4a and 4b from side to side. A gap S is formed between this portion and the outer peripheral portion of the core body 4.
That is, the outer magnetic shield body 14 is in a non-contact state with the core body 4.
In addition, since the thickness of the outer magnetic shield 14 is made thinner than the thickness of the front magnetic shield 10 and the back magnetic shield 11, magnetic flux leaks toward the outer circumference of the core body 4. Due to the eddy current caused by this, the temperature of the outer magnetic shield 14 becomes higher than that of the front magnetic shield 10 and the back magnetic shield 11.
Therefore, the lower side of the outer magnetic shield body 14 (the side opposite to the opening/closing shaft 8) is set to If it is extended downward (to the side opposite to the opening/closing shaft 8), it will have the effect of increasing the temperature of the soldered part.
This has a beneficial effect in soldering work.
In this embodiment, in order to further enhance the effect, the other side of the sub-cores 4a and 4b of the outer magnetic shield body 14 is positioned below the magnetic gap 9 portion of the core body 4 (opposite to the opening/closing shaft 8). Since it extends to the side), it actively increases the temperature of the board part, which is a beneficial effect during soldering work.
In addition, the lower side of the outer magnetic shield 14 (opposite to the opening/closing shaft 8) is positioned lower than the lower side (opposite to the opening/closing shaft 8) of the front magnetic shield 10 and the back magnetic shield 11. If it is extended to the opposite side from the opening/closing shaft 8, it can also be used as a guard to prevent other parts from hitting the magnetic gap 9 portion of the core body 4 from the outer circumferential direction.
In addition, the lower side of the outer magnetic shield 14 (opposite to the opening/closing shaft 8) is positioned lower than the lower side (opposite to the opening/closing shaft 8) of the front magnetic shield 10 and the back magnetic shield 11. (on the opposite side of the opening/closing shaft 8), if necessary, the circuit board and the lower end (guard portion) of the outer magnetic shield 14 can be brought into contact with each other. It can also be used as a positioning member to keep the distance from the magnetic gap 9 constant.
Furthermore, in this embodiment, the outer circumferential side magnetic shielding body 14 extending toward the front side is integrally formed on the outer circumferential portion of the core body 4 of the back side magnetic shielding body 11 to form a container-shaped body, so that when the core body 4 is attached, It can also be used as a temporary storage area and has good workability.
In this embodiment, the outer magnetic shielding body 14 is integrally molded with the back magnetic shielding body 11 to form a container-shaped body. Also good.
１ 高周波誘導加熱ヘッド
２ 本体ケース
２ａ 上面
２ｂ 下面
２ｃ 外周面
２Ａ ＩＨ出力接続コネクター
３ 冷却水接続コネクター
４ コア体
４ａ サブコア体
４ｂ サブコア体
５ コイル
５ａ 熱伝導部
６ 熱伝導板
７ ネジ
８ 開閉軸
９ 磁気ギャップ
１０ 表面側磁気シールド体
１１ 裏面側磁気シールド体
１２ 取付部
１３ ネジ孔
１４ 外周側磁気シールド体
１５ ネジ
１６ ネジ穴
１７ ネジ穴
1 High frequency induction heating head 2 Main body case 2a Top surface 2b Bottom surface 2c Outer surface 2A IH output connection connector 3 Cooling water connection connector 4 Core body 4a Sub-core body 4b Sub-core body 5 Coil 5a Heat conduction part 6 Heat conduction plate 7 Screw 8 Opening/closing shaft 9 Magnetic gap 10 Front magnetic shield 11 Back magnetic shield 12 Mounting part 13 Screw hole 14 Outer magnetic shield 15 Screw 16 Screw hole 17 Screw hole
Claims (7)
前記コア体は、第１のサブコア体と、第２のサブコア体の、それぞれの一方側を重ね合わせ、この一方側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他方側には、これら第１、第２のサブコアの他方間の隙間による磁気ギャップを形成した構成とし、
前記コア体の表面側には、表面側磁気シールド体を設け、
前記コア体の裏面側には、裏面側磁気シールド体を設け、
前記コア体の外周側には、外周側磁気シールド体を設けたことを特徴とする高周波誘導加熱装置。 Comprising a core body and a coil that supplies magnetic flux to the core body,
The core body overlaps one side of each of the first sub-core body and the second sub-core body, and pivotally supports the overlapping portion of the one side by an opening/closing shaft, and the first and second sub-core bodies On the other side, a magnetic gap is formed by a gap between the other of these first and second sub-cores,
A surface-side magnetic shield is provided on the surface side of the core body,
A back side magnetic shielding body is provided on the back side of the core body,
A high-frequency induction heating device characterized in that an outer magnetic shield is provided on the outer circumferential side of the core body.
前記略Ｃの字状の第１のサブコア体のＣ字開口部を前記第２のサブコア体側に向け、前記略逆Ｃの字状の第２のサブコア体の逆Ｃ字開口部を前記第１のサブコア体側に向けた状態で、これら第１、第２のサブコア体の一端側を重ね合わせ、この一端側の重ね合わせ部を開閉軸で軸支し、前記第１、第２のサブコアの他端側には、これら第１、第２のサブコア体間の隙間による磁気ギャップを形成した構成としたことを特徴とする請求項４に記載の高周波誘導加熱装置。 One of the first and second sub-core bodies constituting the core body has a substantially C-shape, and the other has a substantially inverted C-shape,
The C-shaped opening of the substantially C-shaped first sub-core body faces the second sub-core body, and the inverted C-shaped opening of the substantially inverted-C-shaped second sub-core body faces the first sub-core body. One end side of these first and second sub-core bodies is overlapped with the first and second sub-core bodies facing toward the side of the sub-core body, and the overlapping portion of this one end side is pivotally supported by an opening/closing shaft, and other than the first and second sub-core bodies are 5. The high-frequency induction heating device according to claim 4, wherein a magnetic gap is formed on the end side by a gap between the first and second sub-core bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022099788A JP2024000842A (en) | 2022-06-21 | 2022-06-21 | High frequency induction heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022099788A JP2024000842A (en) | 2022-06-21 | 2022-06-21 | High frequency induction heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2024000842A true JP2024000842A (en) | 2024-01-09 |
Family
ID=89451686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022099788A Pending JP2024000842A (en) | 2022-06-21 | 2022-06-21 | High frequency induction heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2024000842A (en) |
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2022
- 2022-06-21 JP JP2022099788A patent/JP2024000842A/en active Pending
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