JP2023552920A - オフセット冷却技術を含むデータセンタのための冷却システム - Google Patents
オフセット冷却技術を含むデータセンタのための冷却システム Download PDFInfo
- Publication number
- JP2023552920A JP2023552920A JP2023554277A JP2023554277A JP2023552920A JP 2023552920 A JP2023552920 A JP 2023552920A JP 2023554277 A JP2023554277 A JP 2023554277A JP 2023554277 A JP2023554277 A JP 2023554277A JP 2023552920 A JP2023552920 A JP 2023552920A
- Authority
- JP
- Japan
- Prior art keywords
- cooling system
- heat exchanger
- offset
- support structure
- electronics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063118293P | 2020-11-25 | 2020-11-25 | |
| US63/118,293 | 2020-11-25 | ||
| PCT/US2021/072581 WO2022115852A1 (en) | 2020-11-25 | 2021-11-23 | Cooling system for a data center that includes an offset cooling technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023552920A true JP2023552920A (ja) | 2023-12-19 |
| JP2023552920A5 JP2023552920A5 (cg-RX-API-DMAC7.html) | 2024-11-29 |
Family
ID=79021062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554277A Pending JP2023552920A (ja) | 2020-11-25 | 2021-11-23 | オフセット冷却技術を含むデータセンタのための冷却システム |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US11758695B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4252500A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2023552920A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022115852A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9313927B2 (en) * | 2010-11-08 | 2016-04-12 | Chatsworth Products, Inc. | Header panel assembly for preventing air circulation above electronic equipment enclosure |
| EP4252500A1 (en) | 2020-11-25 | 2023-10-04 | Digital Porpoise, LLC | Cooling system for a data center that includes an offset cooling technology |
| US11849535B2 (en) * | 2021-07-30 | 2023-12-19 | Baidu Usa Llc | Data center architecture with contained aisle design |
| US11963332B2 (en) * | 2021-09-08 | 2024-04-16 | Baidu Usa Llc | Containment solution for phase change systems |
| US12349313B2 (en) | 2021-11-05 | 2025-07-01 | Rochester Institute Of Technology | Cooling device having a boiling chamber with submerged condensation and method |
| US20230156973A1 (en) * | 2021-11-17 | 2023-05-18 | Critical Project Services, LLC | Systems and methods for air cooling of equipment in data center campuses |
| USD1096672S1 (en) * | 2022-08-16 | 2025-10-07 | Bitmain Technologies Inc. | Heat dissipation device |
| USD1096154S1 (en) * | 2022-08-16 | 2025-10-07 | Bitmain Technologies Inc. | Container |
| US12477680B2 (en) * | 2022-10-20 | 2025-11-18 | Dell Products L.P. | Over-rack component track system for modular data centers |
| WO2024098110A1 (en) * | 2022-11-10 | 2024-05-16 | Firmus Metal Technologies Singapore Pte Ltd | Systems for cooling of computing devices using liquid immersion |
| US20250020418A1 (en) * | 2023-07-13 | 2025-01-16 | Caterpillar Inc. | Modularized thermal management |
| CN118540916B (zh) * | 2024-07-24 | 2024-11-26 | 苏州元脑智能科技有限公司 | 一种液冷二次侧环网系统、液冷微模块及溶液置换方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100307716A1 (en) * | 2009-06-03 | 2010-12-09 | American Power Conversion Corporation | Hot aisle containment cooling unit and method for cooling |
| JP2011134803A (ja) * | 2009-12-22 | 2011-07-07 | Chuo Electronics Co Ltd | 電子機器収納ラック群の冷却装置及び方法 |
| WO2020189001A1 (ja) * | 2019-03-18 | 2020-09-24 | 日本電気株式会社 | データセンタの空調制御装置、方法、非一時的なコンピュータ可読媒体、および空調システム |
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| US6034873A (en) | 1998-06-02 | 2000-03-07 | Ericsson Inc | System and method for separating air flows in a cooling system |
| US6557624B1 (en) | 2000-08-09 | 2003-05-06 | Liebert Corporation | Configurable system and method for cooling a room |
| US6644384B2 (en) | 2001-09-21 | 2003-11-11 | Liebert Corporation | Modular low profile cooling system |
| US6938433B2 (en) | 2002-08-02 | 2005-09-06 | Hewlett-Packard Development Company, Lp. | Cooling system with evaporators distributed in series |
| US20040020225A1 (en) | 2002-08-02 | 2004-02-05 | Patel Chandrakant D. | Cooling system |
| EP1579155B1 (en) | 2002-12-06 | 2011-06-01 | General Electric Company | Method and system for cooling high power density devices |
| US7170745B2 (en) * | 2003-04-30 | 2007-01-30 | Hewlett-Packard Development Company, L.P. | Electronics rack having an angled panel |
| US7112131B2 (en) * | 2003-05-13 | 2006-09-26 | American Power Conversion Corporation | Rack enclosure |
| CN101523119B (zh) | 2006-06-01 | 2012-12-19 | 埃克弗洛普公司 | 用于向电子设备提供冷却的空气的系统及方法 |
| US10182516B2 (en) * | 2006-06-15 | 2019-01-15 | Valan R. Martini | Energy saving system and method for cooling computer data center and telecom equipment |
| US7716939B1 (en) * | 2006-09-26 | 2010-05-18 | Amazon Technologies, Inc. | Method and apparatus for cooling electronic components |
| US9301432B2 (en) | 2007-05-23 | 2016-03-29 | Oracle America, Inc. | Method and apparatus for cooling electronic equipment |
| US7430118B1 (en) | 2007-06-04 | 2008-09-30 | Yahoo! Inc. | Cold row encapsulation for server farm cooling system |
| US8523643B1 (en) | 2007-06-14 | 2013-09-03 | Switch Communications Group LLC | Electronic equipment data center or co-location facility designs and methods of making and using the same |
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| US8184435B2 (en) | 2009-01-28 | 2012-05-22 | American Power Conversion Corporation | Hot aisle containment cooling system and method |
| US8174829B1 (en) | 2009-01-29 | 2012-05-08 | Hewlett-Packard Development Company, L.P. | Cooling electronic devices provided in rows of racks |
| US10212858B2 (en) | 2009-04-21 | 2019-02-19 | Excalibur Ip, Llc | Cold row encapsulation for server farm cooling system |
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| WO2010144677A1 (en) * | 2009-06-10 | 2010-12-16 | Blackrock, Inc. | Cooling system for a computer server cabinet in a data center |
| US8286442B2 (en) | 2009-11-02 | 2012-10-16 | Exaflop Llc | Data center with low power usage effectiveness |
| US9723759B2 (en) | 2009-11-30 | 2017-08-01 | Facebook, Inc. | Cooling servers in a data center using fans external to servers |
| US9032742B2 (en) | 2010-12-30 | 2015-05-19 | Munters Corporation | Methods for removing heat from enclosed spaces with high internal heat generation |
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| EP2532217B1 (en) | 2011-04-15 | 2013-11-27 | Carrier Corporation | Data center cooling |
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| US9648784B2 (en) | 2013-03-15 | 2017-05-09 | Inertech Ip Llc | Systems and assemblies for cooling server racks |
| WO2014174607A1 (ja) * | 2013-04-24 | 2014-10-30 | 株式会社日立システムズ | 空調設備を備えたコンテナ型データセンター |
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-
2021
- 2021-11-23 EP EP21830581.1A patent/EP4252500A1/en active Pending
- 2021-11-23 JP JP2023554277A patent/JP2023552920A/ja active Pending
- 2021-11-23 WO PCT/US2021/072581 patent/WO2022115852A1/en not_active Ceased
- 2021-11-23 US US17/456,288 patent/US11758695B2/en active Active
-
2023
- 2023-08-10 US US18/448,041 patent/US12041758B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100307716A1 (en) * | 2009-06-03 | 2010-12-09 | American Power Conversion Corporation | Hot aisle containment cooling unit and method for cooling |
| JP2011134803A (ja) * | 2009-12-22 | 2011-07-07 | Chuo Electronics Co Ltd | 電子機器収納ラック群の冷却装置及び方法 |
| WO2020189001A1 (ja) * | 2019-03-18 | 2020-09-24 | 日本電気株式会社 | データセンタの空調制御装置、方法、非一時的なコンピュータ可読媒体、および空調システム |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022115852A1 (en) | 2022-06-02 |
| EP4252500A1 (en) | 2023-10-04 |
| US12041758B2 (en) | 2024-07-16 |
| US11758695B2 (en) | 2023-09-12 |
| US20240147672A1 (en) | 2024-05-02 |
| US20220167523A1 (en) | 2022-05-26 |
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