JP2023550357A5 - - Google Patents

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Publication number
JP2023550357A5
JP2023550357A5 JP2023528948A JP2023528948A JP2023550357A5 JP 2023550357 A5 JP2023550357 A5 JP 2023550357A5 JP 2023528948 A JP2023528948 A JP 2023528948A JP 2023528948 A JP2023528948 A JP 2023528948A JP 2023550357 A5 JP2023550357 A5 JP 2023550357A5
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JP
Japan
Prior art keywords
purging
ring
outlet
gas
process chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023528948A
Other languages
English (en)
Japanese (ja)
Other versions
JP7794823B2 (ja
JP2023550357A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/056339 external-priority patent/WO2022108707A1/en
Publication of JP2023550357A publication Critical patent/JP2023550357A/ja
Publication of JP2023550357A5 publication Critical patent/JP2023550357A5/ja
Priority to JP2025265414A priority Critical patent/JP2026048895A/ja
Application granted granted Critical
Publication of JP7794823B2 publication Critical patent/JP7794823B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023528948A 2020-11-23 2021-10-22 パージリングを介した局所的なプラズマアークの防止 Active JP7794823B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025265414A JP2026048895A (ja) 2020-11-23 2025-12-18 パージリングを介した局所的なプラズマアークの防止

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063117404P 2020-11-23 2020-11-23
US63/117,404 2020-11-23
PCT/US2021/056339 WO2022108707A1 (en) 2020-11-23 2021-10-22 Localized plasma arc prevention via purge ring

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025265414A Division JP2026048895A (ja) 2020-11-23 2025-12-18 パージリングを介した局所的なプラズマアークの防止

Publications (3)

Publication Number Publication Date
JP2023550357A JP2023550357A (ja) 2023-12-01
JP2023550357A5 true JP2023550357A5 (https=) 2024-10-28
JP7794823B2 JP7794823B2 (ja) 2026-01-06

Family

ID=81709602

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023528948A Active JP7794823B2 (ja) 2020-11-23 2021-10-22 パージリングを介した局所的なプラズマアークの防止
JP2025265414A Pending JP2026048895A (ja) 2020-11-23 2025-12-18 パージリングを介した局所的なプラズマアークの防止

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025265414A Pending JP2026048895A (ja) 2020-11-23 2025-12-18 パージリングを介した局所的なプラズマアークの防止

Country Status (6)

Country Link
US (1) US20230402259A1 (https=)
JP (2) JP7794823B2 (https=)
KR (1) KR20230112537A (https=)
CN (1) CN115702486A (https=)
TW (1) TW202240732A (https=)
WO (1) WO2022108707A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202417684A (zh) * 2022-08-31 2024-05-01 荷蘭商Asm Ip私人控股有限公司 基座環總成、反應器系統、及用於氣體注入之方法
CN117276043A (zh) * 2023-10-10 2023-12-22 江苏天芯微半导体设备有限公司 一种用于预清洁腔室的衬环、预清洁腔室
CN117344286A (zh) * 2023-10-17 2024-01-05 拓荆科技(上海)有限公司 一种吹扫管路和吹扫方法和薄膜沉积设备
US20250266270A1 (en) * 2024-02-15 2025-08-21 Applied Materials, Inc. System and method for near substrate gas delivery

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040011A (en) 1998-06-24 2000-03-21 Applied Materials, Inc. Substrate support member with a purge gas channel and pumping system
JP4433614B2 (ja) 2001-01-17 2010-03-17 ソニー株式会社 エッチング装置
US8097120B2 (en) 2006-02-21 2012-01-17 Lam Research Corporation Process tuning gas injection from the substrate edge
JP4800991B2 (ja) 2007-03-26 2011-10-26 日本碍子株式会社 半導体製造装置用サセプタ
US8048226B2 (en) * 2007-03-30 2011-11-01 Tokyo Electron Limited Method and system for improving deposition uniformity in a vapor deposition system
CN101552182B (zh) * 2008-03-31 2010-11-03 北京北方微电子基地设备工艺研究中心有限责任公司 一种用于半导体制造工艺中的边缘环机构
JP2009302324A (ja) 2008-06-13 2009-12-24 Tokyo Electron Ltd ガスリング、半導体基板処理装置および半導体基板処理方法
JP2012049376A (ja) 2010-08-27 2012-03-08 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
US10410832B2 (en) 2016-08-19 2019-09-10 Lam Research Corporation Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
KR102336497B1 (ko) * 2017-12-08 2021-12-08 주식회사 원익아이피에스 기판 지지 어셈블리 및 이를 포함하는 기판 처리 장치

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