JP2023544176A - マイクロリソグラフィ用適応光学素子 - Google Patents
マイクロリソグラフィ用適応光学素子 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0825—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a flexible sheet or membrane, e.g. for varying the focus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70025—Production of exposure light, i.e. light sources by lasers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
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Abstract
Description
10 投影露光装置
12 露光放射源
14 露光放射
16 照明光学ユニット
18 フォトマスク
20 マスク変位ステージ
22 投影レンズ
24 基板
26 基板変位ステージ
28 露光ビーム経路
30-1、30-2、30-3、30-4、30-6、30-7、30-8 光学素子
30-5 適応光学素子
32 アクティブ光学面
34 支持素子
36 マニピュレータ
38 ミラー素子
40 制御装置
42 制御信号
44 波面測定装置
46 波面偏差
48 誘電体媒体
48a アクティブボリューム(Active volume)
48b 非アクティブボリューム(Inactive volume)
49 表面
50 作用電極
51 電極スタック
52 測定電極
54 電気回路
56 作用電極の配線
58 調整可能な作用電極の電圧源
60 電気的アース
62 測定電極の配線
64 抵抗測定器
66 直流電源
68 電圧計
69 電流計
70 抵抗値
72 評価器
74 温度値
76 制御ユニット
78 電圧値
80 目標伸び値
82 インピーダンス
84 スイッチ
86 インピーダンス測定器
87 抵抗/インピーダンス複合測定器
88 交流電圧源
90 オペアンプ
92 抵抗器
94 交流電圧振幅
96 評価器
98 歪み状態
110 投影露光装置
112 露光放射源
114 露光放射
116 ビーム成形・照明システム
118 フォトマスク
122 投影レンズ
123 光軸
124 基板
126 基板変位ステージ
130 光学素子
130-1、130-4、130-5 レンズ素子
130-2 適応光学素子
130-3 ミラー
131 液体媒体
132 アクティブ光学ミラー面
Claims (17)
- マイクロリソグラフィ用の適応光学素子であって、当該適応光学素子の光学面の形状を変化させるための少なくとも1つのマニピュレータを含み、当該マニピュレータは、
電界によって変形可能な誘電体媒体と、
前記誘電体媒体に電界を発生させるための作用電極と、
温度測定の役割を果たし、前記誘電体媒体に直接的に組み付けられた、温度依存性の抵抗を有する測定電極と、
を含む、適応光学素子。 - 前記測定電極は、少なくとも1mm2の面積にわたって誘電体媒体に直接的に組み付けられている、請求項1に記載の適応光学素子。
- 前記測定電極は、直接的な組み付けにおいて、少なくとも2つの側面が前記誘電体媒体によって囲まれている、請求項1又は2に記載の適応光学素子。
- 前記測定電極は、前記誘電体媒体の表面に印刷されている、請求項1又は2に記載の適応光学素子。
- 前記測定電極は、複数の屈曲部を有するライン状である、請求項1から4のいずれか一項に記載の適応光学素子。
- 前記測定電極は、長さと幅の比が少なくとも2:1である平らな形状を有する、請求項1から4のいずれか一項に記載の適応光学素子。
- 前記作用電極は、少なくとも3つの電極からなるスタック構造であり、前記測定電極は、前記スタック構造の外側に配置される、請求項1から6のいずれか一項に記載の適応光学素子。
- 前記誘電体媒体は、一体的に形成されている、請求項1から7のいずれか一項に記載の適応光学素子。
- 電気回路をさらに含み、前記電気回路を用いて前記測定電極の電気抵抗が測定可能である、請求項1から8のいずれか一項に記載の適応光学素子。
- 前記電気回路は、さらに、前記測定電極と前記作用電極の1つとの間のインピーダンスを測定するように構成される、請求項9に記載の適応光学素子。
- 前記電気回路は、抵抗測定とインピーダンス測定とを切り替えるための少なくとも1つのスイッチを有する、請求項10に記載の適応光学素子。
- 前記電気回路は、周波数制御可能な交流電圧源を含み、この交流電圧源は、低い交流電圧周波数で抵抗測定を、高い交流電圧周波数でインピーダンス測定を、それぞれ行うことができるように接続される、請求項10に記載の適応光学素子。
- 前記測定電極の領域に配置され、インピーダンスの測定のために前記測定電極に印加される交流電圧の振幅に対するインピーダンスの依存性から前記誘電体媒体の歪み状態を判定する評価器をさらに含む、請求項10から12のいずれか一項に記載の適応光学素子。
- 前記マニピュレータのようなマニピュレータ(36)を複数含み、それぞれが測定電極(52)を有し、前記測定電極が直流電源(66)に直列に接続されている、請求項9から13のいずれか一項に記載の適応光学素子。
- 前記光学面(32)は、EUV放射を反射するように構成される、請求項1から14のいずれか一項に記載の適応光学素子。
- 前記光学面(32)は、DUV放射を反射するように構成される、請求項1から15のいずれか一項に記載の適応光学素子。
- 請求項1から16のいずれか一項に記載の適応光学素子(30-5;130-2)を少なくとも1つ含む、マイクロリソグラフィ投影露光装置(10;110)。
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Application Number | Priority Date | Filing Date | Title |
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DE102020212743.3 | 2020-10-08 | ||
DE102020212743.3A DE102020212743A1 (de) | 2020-10-08 | 2020-10-08 | Adaptives optisches Element für die Mikrolithographie |
PCT/EP2021/077485 WO2022074023A1 (de) | 2020-10-08 | 2021-10-06 | Adaptives optisches element für die mikrolithographie |
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JP2023544176A true JP2023544176A (ja) | 2023-10-20 |
JP7482323B2 JP7482323B2 (ja) | 2024-05-13 |
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US (1) | US20230229091A1 (ja) |
JP (1) | JP7482323B2 (ja) |
DE (1) | DE102020212743A1 (ja) |
WO (1) | WO2022074023A1 (ja) |
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DE102021205425A1 (de) * | 2021-05-27 | 2022-12-01 | Carl Zeiss Smt Gmbh | Optikvorrichtung, Verfahren zur Einstellung einer Soll-Deformation und Lithografiesystem |
DE102022210244A1 (de) * | 2022-09-28 | 2024-03-28 | Carl Zeiss Smt Gmbh | Spiegelvorrichtung, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage, und Verfahren zum Messen der Temperatur eines Spiegels |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2001013297A (ja) * | 1999-06-30 | 2001-01-19 | Nikon Corp | 反射光学素子および露光装置 |
JP2004363429A (ja) | 2003-06-06 | 2004-12-24 | Murata Mfg Co Ltd | チップ状圧電素子 |
JP2008040299A (ja) | 2006-08-09 | 2008-02-21 | Funai Electric Co Ltd | 形状可変ミラー及び形状可変ミラーの製造方法 |
DE102008049616B4 (de) * | 2008-09-30 | 2012-03-29 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Mikrolithographie zur Herstellung von Halbleiterbauelementen |
JP5178770B2 (ja) | 2010-04-13 | 2013-04-10 | 三菱電機株式会社 | 可変形状鏡 |
DE102010030442A1 (de) * | 2010-06-23 | 2011-12-29 | Endress + Hauser Wetzer Gmbh + Co Kg | Widerstandstemperatursensor |
WO2012013748A1 (en) | 2010-07-30 | 2012-02-02 | Carl Zeiss Smt Gmbh | Euv exposure apparatus |
DE102015213275A1 (de) | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Spiegelanordnung für eine Lithographiebelichtungsanlage und Spiegelanordnung umfassendes optisches System |
LU100594B1 (en) | 2017-12-22 | 2019-06-28 | Luxembourg Inst Science & Tech List | Piezoelectric device with a sensor and method for measuring the behaviour of said peizoelectric device |
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2020
- 2020-10-08 DE DE102020212743.3A patent/DE102020212743A1/de not_active Ceased
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- 2021-10-06 JP JP2023520338A patent/JP7482323B2/ja active Active
- 2021-10-06 WO PCT/EP2021/077485 patent/WO2022074023A1/de active Application Filing
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US20230229091A1 (en) | 2023-07-20 |
WO2022074023A1 (de) | 2022-04-14 |
JP7482323B2 (ja) | 2024-05-13 |
DE102020212743A1 (de) | 2022-04-14 |
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