JP2023532277A5 - - Google Patents
Info
- Publication number
- JP2023532277A5 JP2023532277A5 JP2022579932A JP2022579932A JP2023532277A5 JP 2023532277 A5 JP2023532277 A5 JP 2023532277A5 JP 2022579932 A JP2022579932 A JP 2022579932A JP 2022579932 A JP2022579932 A JP 2022579932A JP 2023532277 A5 JP2023532277 A5 JP 2023532277A5
- Authority
- JP
- Japan
- Prior art keywords
- station
- substrate
- processing system
- back surface
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025007417A JP2025063224A (ja) | 2020-06-25 | 2025-01-20 | 裏面処理のためのステーション可変支持フィーチャを備えたマルチステーション処理ツール |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062705411P | 2020-06-25 | 2020-06-25 | |
| US62/705,411 | 2020-06-25 | ||
| PCT/US2021/038215 WO2021262585A1 (en) | 2020-06-25 | 2021-06-21 | Multi-station processing tools with station-varying support features for backside processing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025007417A Division JP2025063224A (ja) | 2020-06-25 | 2025-01-20 | 裏面処理のためのステーション可変支持フィーチャを備えたマルチステーション処理ツール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023532277A JP2023532277A (ja) | 2023-07-27 |
| JP2023532277A5 true JP2023532277A5 (https=) | 2024-06-26 |
| JP7624460B2 JP7624460B2 (ja) | 2025-01-30 |
Family
ID=79281720
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579932A Active JP7624460B2 (ja) | 2020-06-25 | 2021-06-21 | 裏面処理のためのステーション可変支持フィーチャを備えたマルチステーション処理ツール |
| JP2025007417A Pending JP2025063224A (ja) | 2020-06-25 | 2025-01-20 | 裏面処理のためのステーション可変支持フィーチャを備えたマルチステーション処理ツール |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025007417A Pending JP2025063224A (ja) | 2020-06-25 | 2025-01-20 | 裏面処理のためのステーション可変支持フィーチャを備えたマルチステーション処理ツール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230352279A1 (https=) |
| JP (2) | JP7624460B2 (https=) |
| KR (2) | KR102943016B1 (https=) |
| CN (1) | CN115989573A (https=) |
| WO (1) | WO2021262585A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022544221A (ja) | 2019-08-16 | 2022-10-17 | ラム リサーチ コーポレーション | ウエハ内の様々な反りを補償するために空間を調整する堆積 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060137609A1 (en) | 2004-09-13 | 2006-06-29 | Puchacz Jerzy P | Multi-single wafer processing apparatus |
| US8137465B1 (en) * | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
| US8951351B2 (en) * | 2006-09-15 | 2015-02-10 | Applied Materials, Inc. | Wafer processing hardware for epitaxial deposition with reduced backside deposition and defects |
| KR20090118676A (ko) * | 2008-05-14 | 2009-11-18 | (주)퓨전에이드 | 기판처리장치 |
| JP4794685B1 (ja) * | 2010-10-19 | 2011-10-19 | ミクロ技研株式会社 | 基板処理装置及び基板処理方法 |
| KR101258602B1 (ko) * | 2011-03-15 | 2013-04-26 | (주)세미머티리얼즈 | 수직배치형 증착장치 및 수직배치형 증착방법 |
| KR102014279B1 (ko) * | 2014-02-27 | 2019-08-26 | 주식회사 원익아이피에스 | 기판 처리 장치 |
| US9881788B2 (en) * | 2014-05-22 | 2018-01-30 | Lam Research Corporation | Back side deposition apparatus and applications |
| US10541117B2 (en) * | 2015-10-29 | 2020-01-21 | Lam Research Corporation | Systems and methods for tilting a wafer for achieving deposition uniformity |
| US10301718B2 (en) * | 2016-03-22 | 2019-05-28 | Lam Research Corporation | Asymmetric pedestal/carrier ring arrangement for edge impedance modulation |
| US10553465B2 (en) * | 2016-07-25 | 2020-02-04 | Lam Research Corporation | Control of water bow in multiple stations |
| US11024531B2 (en) * | 2017-01-23 | 2021-06-01 | Lam Research Corporation | Optimized low energy / high productivity deposition system |
| US10851457B2 (en) * | 2017-08-31 | 2020-12-01 | Lam Research Corporation | PECVD deposition system for deposition on selective side of the substrate |
| KR102404061B1 (ko) * | 2017-11-16 | 2022-05-31 | 삼성전자주식회사 | 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치 |
| WO2020031778A1 (ja) * | 2018-08-09 | 2020-02-13 | 東京エレクトロン株式会社 | 成膜装置及び成膜方法 |
| JP7527928B2 (ja) * | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板処理装置、基板処理方法 |
| US20240096605A1 (en) * | 2022-09-16 | 2024-03-21 | Applied Materials, Inc. | Backside deposition for wafer bow management |
-
2021
- 2021-06-21 KR KR1020237003165A patent/KR102943016B1/ko active Active
- 2021-06-21 KR KR1020227020424A patent/KR102494202B1/ko active Active
- 2021-06-21 WO PCT/US2021/038215 patent/WO2021262585A1/en not_active Ceased
- 2021-06-21 CN CN202180052569.0A patent/CN115989573A/zh active Pending
- 2021-06-21 JP JP2022579932A patent/JP7624460B2/ja active Active
- 2021-06-21 US US18/002,289 patent/US20230352279A1/en active Pending
-
2025
- 2025-01-20 JP JP2025007417A patent/JP2025063224A/ja active Pending
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