JP2023520290A - Electronic coil and electronic expansion valve having the same - Google Patents

Electronic coil and electronic expansion valve having the same Download PDF

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JP2023520290A
JP2023520290A JP2022549182A JP2022549182A JP2023520290A JP 2023520290 A JP2023520290 A JP 2023520290A JP 2022549182 A JP2022549182 A JP 2022549182A JP 2022549182 A JP2022549182 A JP 2022549182A JP 2023520290 A JP2023520290 A JP 2023520290A
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coil
circuit board
electronic
waterproof
connection portion
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勇好 陳
利峰 鄭
積友 張
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Zhejiang Dunan Artificial Environment Co Ltd
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Zhejiang Dunan Artificial Environment Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2823Wires
    • H01F27/2828Construction of conductive connections, of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/02Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/06Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/02Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/06Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
    • F16K31/0675Electromagnet aspects, e.g. electric supply therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/04Arrangements of electric connections to coils, e.g. leads
    • H01F2005/046Details of formers and pin terminals related to mounting on printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electromagnets (AREA)
  • Electrically Driven Valve-Operating Means (AREA)

Abstract

電子コイル及びそれを有する電子膨張弁であって、電子コイルは、コイル本体(10)と、コイル本体(10)に設けられ、ピン(23)が設けられたコイル接続部(21)及びコイル接続部(21)を覆うように設けられたハウジング(22)を含むパッチコード部(20)と、ピン(23)に挿設された回路基板(30)と、コイル接続部(21)に設けられ、回路基板(30)の少なくとも一部に密着して設けられ、コイル接続部(21)と回路基板(30)との間に隙間が形成されるように回路基板(30)を支持するために用いられる支持部(40)と、を含む。この技術態様は、従来の技術における電子コイルの回路基板の溶接性能が比較的悪い技術課題を解決することができる。【選択図】 図1An electronic coil and an electronic expansion valve having the same, wherein the electronic coil comprises a coil body (10), a coil connection (21) provided in the coil body (10), and a coil connection (21) provided with a pin (23). A patch cord section (20) including a housing (22) provided to cover the section (21), a circuit board (30) inserted into a pin (23), and a coil connection section (21) provided with , is provided in close contact with at least a part of the circuit board (30), and supports the circuit board (30) so that a gap is formed between the coil connecting portion (21) and the circuit board (30). a support (40) used. This technical aspect can solve the technical problem that the welding performance of the circuit board of the electronic coil in the prior art is relatively poor. [Selection diagram] Fig. 1

Description

本出願は、2020年4月10日付で中国国家知識産権局に提出された、出願番号が202010281609.6であり、発明の名称が「電子コイル及びそれを有する電子膨張弁」である特許出願の優先権を主張する。 This application is a patent application with application number 202010281609.6 and titled "Electronic Coil and Electronic Expansion Valve Having the Same" filed with the State Intellectual Property Office of China on April 10, 2020. claim priority of

本出願は電子コイルの技術分野に関し、具体的には、電子コイル及びそれを有する電子膨張弁に関する。 The present application relates to the technical field of electronic coils, and more particularly to electronic coils and electronic expansion valves having the same.

現在、電磁コイルは、複数の技術分野に適用することができ、例えば、冷却システムの電子膨張弁のコイル、ステッピングモータのステータ部分とすることができる。電磁コイルを電子膨張弁内に適用する場合、電磁コイルの通電によって発生される磁場が弁体装置の弁芯の移動を連動して、弁口の開閉を制御する。従来の電子コイルにおける回路基板は、コイル接続部に設けられ、通常コイル接続部に密着されている。 At present, electromagnetic coils can be applied in several technical fields, for example, they can be coils of electronic expansion valves in cooling systems, stator parts of stepping motors. When the electromagnetic coil is applied in the electronic expansion valve, the magnetic field generated by the energization of the electromagnetic coil interlocks with the movement of the valve core of the valve body device to control the opening and closing of the valve port. A circuit board in a conventional electronic coil is provided at the coil connection portion and is usually in close contact with the coil connection portion.

しかし、このような構造設計を採用すると、コイル接続部と回路基板との間に十分な隙間が形成できず、回路基板をコイル接続部のピンに溶接する際に半田液が回路基板の他側へ流れにくくなり、溶接効果に影響を与える。 However, when such a structural design is adopted, a sufficient gap cannot be formed between the coil connection part and the circuit board, and when the circuit board is welded to the pin of the coil connection part, the solder liquid does not flow to the other side of the circuit board. It becomes difficult to flow to and affects the welding effect.

本出願は、主に、従来の技術における電子コイルの回路基板の溶接性能が比較的悪い技術課題を解決するための電子コイル及びそれを有する電子膨張弁を提供することを目的とする。 The main purpose of the present application is to provide an electronic coil and an electronic expansion valve having the same to solve the technical problem that the welding performance of the circuit board of the electronic coil in the prior art is relatively poor.

上記の目的を実現するために、本出願の一態様によれば、コイル本体と、コイル本体に設けられ、ピンが設けられたコイル接続部及びコイル接続部を覆うように設けられたハウジングを含むパッチコード部と、ピンに挿設された回路基板と、コイル接続部に設けられ、回路基板の少なくとも一部に密着して設けられ、コイル接続部と回路基板との間に隙間が形成されるように回路基板を支持するために用いられる支持部と、を含む電子コイルを提供する。 In order to achieve the above object, according to one aspect of the present application, the present application includes a coil body, a coil connection portion provided in the coil body and provided with a pin, and a housing provided to cover the coil connection portion. The patch cord portion, the circuit board inserted into the pin, and the coil connecting portion are provided in close contact with at least a part of the circuit board, and a gap is formed between the coil connecting portion and the circuit board. and a support used to support the circuit board.

更に、支持部は間隔をおいて設けられた複数の支持柱を含む。 Further, the support includes a plurality of spaced support posts.

更に、支持柱の断面は円形又は矩形である。 Furthermore, the cross-section of the support post is circular or rectangular.

更に、支持部の高さがhで1mm≦h≦4mmである。 Furthermore, the height h of the supporting portion is 1 mm≦h≦4 mm.

更に、コイル接続部は、ハウジング接続部及び導線接続部を含み、導線接続部はハウジング接続部から突出して設けられ、ハウジングはハウジング接続部に設けられ、ピンは導線接続部に設けられており、導線接続部には環状構造である防水構造が更に設けられており、ピンが環状構造内に設けられている。 Furthermore, the coil connection portion includes a housing connection portion and a wire connection portion, the wire connection portion is provided so as to protrude from the housing connection portion, the housing is provided on the housing connection portion, and the pin is provided on the wire connection portion, The wire connecting portion is further provided with a waterproof structure, which is a ring structure, and a pin is provided in the ring structure.

更に、防水構造は防水溝である。 Further, the waterproof structure is a waterproof groove.

更に、防水構造は防水リブである。 Furthermore, the waterproof structure is a waterproof rib.

更に、防水構造の断面は三角形又は矩形である。 Furthermore, the cross-section of the waterproof structure is triangular or rectangular.

更に、防水構造は、防水溝及び防水リブを含み、防水溝と防水リブとは、囲んで環状構造を形成するように接続される。 Further, the waterproof structure includes a waterproof groove and a waterproof rib, and the waterproof groove and the waterproof rib are connected to form a surrounding annular structure.

本出願の別の態様によれば、上記で提供される電子コイルを含む電子膨張弁を提供する。 According to another aspect of the present application, there is provided an electronic expansion valve including the electronic coil provided above.

本出願の技術態様を適用すると、コイル接続部に支持部を設け、回路基板をピンに挿設した後、支持部との密着位置に設けて、支持部が回路基板を支持することにより、コイル接続部と回路基板との間に隙間が形成される。回路基板とピンとを溶接するとき、半田液を回路基板の一側から他側に流すことができ、これにより回路基板とピンとの溶接の堅牢度を向上させ、更に溶接性能を向上させることができる。従って、本出願で提供される技術態様によって、従来の技術における電子コイルの回路基板の溶接性能が比較的悪い技術課題を解決することができる。 When the technical aspect of the present application is applied, a support portion is provided in the coil connection portion, and after the circuit board is inserted into the pin, the support portion is provided at a position in close contact with the support portion, and the support portion supports the circuit board, whereby the coil A gap is formed between the connecting portion and the circuit board. When welding the circuit board and the pins, the solder liquid can flow from one side of the circuit board to the other side, thereby improving the robustness of the welding between the circuit board and the pins, and further improving the welding performance. . Therefore, the technical aspects provided in the present application can solve the technical problem that the welding performance of the circuit board of the electronic coil in the prior art is relatively poor.

本出願の一部を構成する明細書の図面は本出願に対する更なる理解を提供するためのものであり、本出願の模式的な実施例及びその説明は本出願を解釈するためのもので、本出願を不当に限定するものではない。 The drawings in the specification, which form part of this application, are intended to provide a further understanding of the application, and the schematic examples of the application and their descriptions are for interpretation of the application. It is not intended to unduly limit this application.

本出願の実施例1に基づいて提供される電子コイルの正面図を示す。1 shows a front view of an electronic coil provided according to Example 1 of the present application; FIG. 本出願の実施例1に基づいて提供される電子コイルの上面図を示す。1 shows a top view of an electronic coil provided according to Example 1 of the present application; FIG. 本出願の実施例1に基づいて提供される電子コイルの構造模式図を示す。1 shows a structural schematic diagram of an electronic coil provided according to Embodiment 1 of the present application; FIG. 本出願の実施例1に基づいて提供されるコイル本体及びコイル接続部の構造模式図を示す。FIG. 2 shows a structural schematic diagram of a coil body and a coil connection provided according to Embodiment 1 of the present application; 本出願の実施例1に基づいて提供されるハウジングの構造模式図を示す。1 shows a structural schematic diagram of a housing provided according to Embodiment 1 of the present application; FIG.

ここで、上記の図面には以下の符号が含まれる。
10 コイル本体、20 パッチコード部、21 コイル接続部、211 ハウジング接続部、212 導線接続部、22 ハウジング、23 ピン、30 回路基板、40 支持部、50 防水構造。
Here, the above drawings include the following reference numerals.
10 coil body, 20 patch cord portion, 21 coil connection portion, 211 housing connection portion, 212 wire connection portion, 22 housing, 23 pin, 30 circuit board, 40 support portion, 50 waterproof structure.

留意すべきこととして、矛盾がない限り、本出願における実施例及び実施例における特徴は互いに組み合わされてもよい。以下、図面とともに実施例を参照して本出願を詳細に説明する。 It should be noted that the examples in this application and the features in the examples may be combined with each other unless there is a contradiction. The present application will now be described in detail with reference to examples together with the drawings.

図1から図5に示すように、本出願の実施例1は、コイル本体10と、コイル本体10に設けられ、ピン23が設けられたコイル接続部21及びコイル接続部21を覆うように設けられたハウジング22を含むパッチコード部20と、回路基板30と、支持部40とを含む電子コイルを提供する。回路基板30をピン23に挿設し、支持部40は、コイル接続部21に設けられ、回路基板30の少なくとも一部に密着して設けられ、回路基板30を支持するために用いられ、コイル接続部21と回路基板30との間に隙間が形成されるように支持部40の支持面が回路基板30に当接している。 As shown in FIGS. 1 to 5, the first embodiment of the present application includes a coil body 10, a coil connection portion 21 provided in the coil body 10 and provided with a pin 23, and a coil connection portion 21 provided to cover the coil connection portion 21. An electronic coil is provided which includes a patch cord portion 20 including a mounted housing 22 , a circuit board 30 and a support portion 40 . The circuit board 30 is inserted into the pin 23, and the support part 40 is provided in the coil connection part 21, is provided in close contact with at least a part of the circuit board 30, and is used to support the circuit board 30, and the coil The support surface of the support portion 40 is in contact with the circuit board 30 such that a gap is formed between the connection portion 21 and the circuit board 30 .

具体的には、本実施例における回路基板30には貫通孔が設けられており、貫通孔はピン23に挿設されており、ピン23と支持部40とは間隔をおいて設けられている。このように、回路基板30をピン23に挿設した後、支持部40との密着位置に移動させて、支持部40によって回路基板30を支持し、支持部40の長さが回路基板30とコイル接続部21との間の隙間になる。隙間が存在することで、回路基板30とピン23部を接続するために、貫通孔において溶接が行われ、回路基板30の一側で溶接処理され、半田液が回路基板30の一側から他側に流れ込み、このようにして回路基板30とピン23との溶接の信頼性を確保することができる。従って、本実施例で提供される電子コイルにより、従来の技術における電子コイルの回路基板30とピン23との溶接信頼性が比較的悪い技術課題を解決することができる。 Specifically, the circuit board 30 in this embodiment is provided with a through-hole, the through-hole is inserted into the pin 23, and the pin 23 and the support portion 40 are provided with a space therebetween. . After the circuit board 30 is inserted into the pins 23 in this manner, the circuit board 30 is moved to a position in close contact with the support part 40 , and the circuit board 30 is supported by the support part 40 . It becomes a gap between the coil connection portion 21 and the coil connection portion 21 . Due to the presence of the gap, welding is performed in the through hole to connect the circuit board 30 and the pin 23 portion, the welding process is performed on one side of the circuit board 30, and the solder liquid flows from one side of the circuit board 30 to the other. In this way, the reliability of the welding between the circuit board 30 and the pins 23 can be ensured. Therefore, the electronic coil provided in this embodiment can solve the technical problem of the relatively poor welding reliability between the circuit board 30 and the pin 23 of the electronic coil in the prior art.

本実施例において、支持部40は間隔をおいて設けられた複数の支持柱を含む。このような構造設計を採用すると、支持の安定性を向上させて、回路基板30とコイル接続部21との間の隙間を安定して確保することができ、回路基板30の一側の半田液が貫通孔とピン23との間の隙間を介して回路基板30の他側に流れ込まれることをより良好に確保し、更に溶接の堅牢度を効果的に確保する。具体的には、本実施例における支持柱は4つであってもよく、4つの支持柱は平行四辺形の4つの頂角に位置し、このような構造設計を採用すると、支持の安定性を向上させることができる。具体的には、ピン23は複数であり、2つの支持柱は複数のピン23の上側に位置し、2つの支持柱は複数ピン23の下側に位置する。 In this embodiment, the support 40 includes a plurality of spaced support posts. By adopting such a structural design, it is possible to improve the stability of the support, to stably secure the gap between the circuit board 30 and the coil connection part 21, and to prevent the solder liquid on one side of the circuit board 30. flow into the other side of the circuit board 30 through the gap between the through-hole and the pin 23, and effectively ensure the fastness of welding. Specifically, there may be four supporting columns in this embodiment, and the four supporting columns are located at the four vertices of the parallelogram. can be improved. Specifically, there are a plurality of pins 23 , two support columns are positioned above the plurality of pins 23 , and two support columns are positioned below the plurality of pins 23 .

具体的には、支持柱の断面は円形又は矩形であり、即ち支持柱は円柱構造又は多角柱構造であってもよい。 Specifically, the cross-section of the support column may be circular or rectangular, ie, the support column may have a columnar structure or a polygonal columnar structure.

回路基板30とコイル接続部21との間に十分な隙間を設けるために、本実施例において、支持部40の高さがhで1mm≦h≦4mmである。具体的には、支持部40の高さが1mm未満である場合、回路基板30とコイル接続部21との間の隙間が小さすぎて、半田液が回路基板30の一側から他側へ流れにくくなる。支持部40の高さが4mmを超えると、回路基板30とコイル接続部21との間の隙間が大きすぎて、構造全体の小型化に不利となる。 In order to provide a sufficient gap between the circuit board 30 and the coil connection portion 21, the height h of the support portion 40 is 1 mm≦h≦4 mm in this embodiment. Specifically, when the height of the support portion 40 is less than 1 mm, the gap between the circuit board 30 and the coil connection portion 21 is too small, and the solder liquid flows from one side of the circuit board 30 to the other side. become difficult. If the height of the support portion 40 exceeds 4 mm, the gap between the circuit board 30 and the coil connection portion 21 is too large, which is disadvantageous in reducing the size of the entire structure.

本実施例において、コイル接続部21は、ハウジング接続部211及び導線接続部212を含み、導線接続部212はハウジング接続部211から突出して設けられ、ハウジング22はハウジング接続部211に設けられ、ピン23は導線接続部212に設けられている。導線接続部212には環状構造である防水構造50が更に設けられており、ピン23が環状構造内に設けられている。このような設計を採用すると、環状構造が複数ピン23を囲んで設けられ、通常、ハウジング22とコイル接続部21との間に封止材(封止材は、通常エポキシ樹脂である)を充填して封止する。環状構造は主に封止材との接触面積を増加させるために用いられ、この部分の封止性能を向上させることで、封止材とコイル接続部21とに脱落が発生する現象をより良好に回避することができ、これにより防水作用をより良好に果たして、水がピン23部分に流れ込むことを回避する。具体的には、導線接続部212に取り付け面を有し、支持部40は取り付け面から突出して設けて、支持部40によって回路基板30を上昇させる。 In this embodiment, the coil connection portion 21 includes a housing connection portion 211 and a wire connection portion 212, the wire connection portion 212 is provided protruding from the housing connection portion 211, the housing 22 is provided on the housing connection portion 211, and the pin 23 is provided in the conductor connection portion 212 . The wire connecting portion 212 is further provided with a waterproof structure 50 having an annular structure, and the pin 23 is provided within the annular structure. With such a design, an annular structure is provided around the pins 23 and typically filled with an encapsulant (the encapsulant is typically an epoxy resin) between the housing 22 and the coil connection 21. and seal. The annular structure is mainly used to increase the contact area with the sealing material, and by improving the sealing performance of this part, the phenomenon that the sealing material and the coil connection part 21 come off can be improved. to avoid the water from flowing into the pin 23 part, thereby achieving a better waterproof effect. Specifically, the wire connecting portion 212 has an attachment surface, the support portion 40 is provided so as to protrude from the attachment surface, and the circuit board 30 is lifted by the support portion 40 .

具体的には、防水構造50は防水溝であってもよい。このような設計を採用すると、ハウジング22とコイル接続部21との間に封止材を充填するとき、平面構造に比べて、環状防水溝が存在するので、封止材とこの部分の接触面積を増加させることができ、これにより封止性能を向上させる。 Specifically, the waterproof structure 50 may be a waterproof groove. With such a design, when the sealing material is filled between the housing 22 and the coil connection part 21, the contact area between the sealing material and this portion is reduced due to the presence of the annular waterproof groove compared to the planar structure. can be increased, which improves sealing performance.

具体的には、防水構造50は防水リブであってもよい。このような設計を採用すると、ハウジング22とコイル接続部21との間に封止材を充填するとき、平面構造に比べて、環状防水リブが存在するので、封止材とこの部分の接触面積を増加させることができ、これにより封止性能を向上させる。 Specifically, the waterproof structure 50 may be a waterproof rib. With such a design, when the sealing material is filled between the housing 22 and the coil connection part 21, the contact area between the sealing material and this part is reduced due to the presence of the annular waterproof rib compared to the planar structure. can be increased, which improves sealing performance.

具体的には、防水構造50の断面は三角形又は矩形である。実際のコイル本体10の内部の構造形状に応じて適切な防水構造50の断面形状を選択して、内部構造を最適化することができる。 Specifically, the cross section of the waterproof structure 50 is triangular or rectangular. An appropriate cross-sectional shape of the waterproof structure 50 can be selected according to the actual internal structural shape of the coil body 10 to optimize the internal structure.

具体的には、防水構造50は、防水溝及び防水リブを含み、防水溝と防水リブとは、囲むように環状構造を形成するように接続されてもよい。このような設計を採用すると、防水溝と防水リブとの組み合わせにより、この部分のコイル接続部21と封止材との接触面積を増加させることもでき、これにより封止性能をより良好に向上させる。 Specifically, the waterproof structure 50 may include waterproof grooves and waterproof ribs, and the waterproof grooves and waterproof ribs may be connected to form a surrounding annular structure. By adopting such a design, the combination of the waterproof grooves and waterproof ribs can increase the contact area between the coil connection portion 21 and the sealing material at this portion, thereby improving the sealing performance. Let

具体的には、防水溝の深さ及び防水リブの高さを適切に設定することにより、防水構造50と封止材との接触面積を調整して、実際の需要に応じて封止性能をより良好に向上させることが容易になる。 Specifically, by appropriately setting the depth of the waterproof groove and the height of the waterproof rib, the contact area between the waterproof structure 50 and the sealing material can be adjusted, and the sealing performance can be adjusted according to the actual demand. It becomes easy to improve better.

本出願の実施例2は、実施例1で提供される電子コイルを含む電子膨張弁を提供する。 Example 2 of the present application provides an electronic expansion valve including the electronic coil provided in Example 1.

以上の説明からわかるように、本出願の上記の実施例は、回路基板とピン部との溶接の堅牢度を向上させ、パッチコード部の封止性能を向上させる技術的効果を実現できた。 As can be seen from the above description, the above-described examples of the present application have achieved the technical effect of improving the robustness of welding between the circuit board and the pin portion and improving the sealing performance of the patch cord portion.

注意すべきこととして、ここで用いられる用語は具体的な実施形態を説明するためのものにすぎず、本出願による例示的な実施形態を限定することを意図するものではない。ここで用いられるように、文脈において別途に明確に指摘していない限り、単数形式も複数形式を含むことを意図し、更に、理解すべきこととして、本明細書において「包含する」及び/又は「含む」という用語が用いられる場合、特徴、ステップ、操作、デバイス、アセンブリ及び/又はそれらの組み合わせが存在することを意味する。 It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, unless the context clearly indicates otherwise, singular forms are also intended to include plural forms and, furthermore, it should be understood that herein "includes" and/or When the term "comprising" is used, it means that features, steps, operations, devices, assemblies and/or combinations thereof are present.

別途に具体的に説明していない限り、これらの実施例に記載された部材及びステップの相対的な配置、数式及び数値は、本出願の範囲を限定するものではない。同時に、説明の便宜上、図面に示された各部分の寸法は実際の比率関係で描かれたものではないことを理解すべきである。当業者に既知の技術、方法及び機器については詳細な説明を省略する場合があるが、必要に応じて、この技術、方法及び機器は、承認された明細書の一部としてみなされるべきである。ここで提案し、且つ説明した全ての例は、いずれの具体的な値も例示的なものにすぎず、限定するためのものではないと解釈すべきである。従って、例示的な実施例の他の例は、異なる値を有してもよい。類似した符号及び文字は、以下の図面において類似したものを表すため、あるものが1つの図面において定義されると、その後の図面においては、それについて更に説明する必要がないことに注意すべきである。 Unless specifically stated otherwise, the relative arrangements, formulas and numerical values of the members and steps described in these examples are not intended to limit the scope of this application. At the same time, it should be understood that for convenience of explanation, the dimensions of the parts shown in the drawings are not drawn to scale. Techniques, methods and equipment known to those skilled in the art may not be described in detail, but where appropriate, such techniques, methods and equipment should be considered part of the accepted specification. . All examples suggested and described herein should be construed as illustrative only and not limiting of any specific values. Accordingly, other examples of the illustrative embodiment may have different values. It should be noted that similar symbols and letters represent similar things in the following drawings, so that once something is defined in one drawing, it need not be further described in subsequent drawings. be.

本出願の説明において、理解すべきこととして、通常、「前、後、上、下、左、右」、「横方向、縦方向、垂直、水平」及び「頂、底」等のような方位用語で指示する方位又は位置関係は、図面に示す方位又は位置関係に基づくものであり、本出願の説明を容易にし、且つ簡潔にするためのものにすぎず、逆の説明がない場合、これらの方位用語は、示された装置又は素子が必ずしも特定の方位を有するか又は特定の方位で構成されて操作されることを指示且つ暗示するものではないため、本出願の保護範囲を限定するものとして理解すべきではなく、「内、外」という方位用語は、各部材自体の輪郭に対する内、外である。 In the description of this application, it should generally be understood that orientations such as "front, back, top, bottom, left, right", "lateral, longitudinal, vertical, horizontal" and "top, bottom", etc. Orientation or positional relationships indicated in terms are based on the orientations or positional relationships shown in the drawings and are merely for the purpose of facilitating and simplifying the description of the present application, unless otherwise stated. do not indicate and imply that the indicated device or element necessarily has a particular orientation or is configured and operated in a particular orientation, and thus limits the scope of protection of this application. Instead, the azimuth terms "in, out" are in, out relative to the contours of each member itself.

説明の便宜上、ここでは「…の上に」、「…の上方に」、「…の上面に」、「上側の」等のような空間相対用語を、図面に示すような1つのデバイス又は特徴と他のデバイス又は特徴との空間位置関係を説明するために用いることができる。理解すべきこととして、空間相対用語は、デバイスの図面に記載された方位以外の、使用又は操作中の異なる方位を包含することを意図するものである。例えば、図面中のデバイスの上下が倒置されると、「他のデバイス又は構造の上方」又は「他のデバイス又は構造の上」のデバイスと説明した後「他のデバイス又は構造の下方に」又は「他のデバイス又は構造の下に」と位置決められることになる。よって、例示的な用語「…の上方に」は、「…の上方に」及び「…の下方に」の2つの方位を含むことができる。このデバイスは、他の異なる方法で位置決めし(90度回転するか、他の方位に位置する)、且つここで用いられる空間の相対的な説明について対応する解釈を行うこともできる。 For convenience of description, spatially relative terms such as "on", "above", "on top of", "above", etc., are herein used to refer to one device or feature as shown in the drawings. can be used to describe the spatial relationship between a device and other devices or features. It should be understood that spatially relative terms are intended to encompass different orientations in use or operation other than the orientation depicted in the drawings of the device. For example, when a device in a drawing is turned upside down, a device “above another device or structure” or “above another device or structure” is described, and then “below another device or structure” or It will be positioned "under other devices or structures". Thus, the exemplary term "above" can include the two orientations "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or positioned in other orientations) and corresponding interpretations of the relative spatial descriptions used herein can be made.

更に、説明すべきこととして、「第1」、「第2」等の用語を用いて部品を限定することは、対応する部品を容易に区別するためのものにすぎず、特に説明がない限り、上記の用語は特別な意味を持たないため、本出願の保護範囲を限定するものとして理解すべきではない。 Further, it should be noted that the use of terms such as "first," "second," etc. to define components is merely for the purpose of readily distinguishing corresponding components, unless otherwise stated. , the above terms have no special meaning and should not be understood as limiting the scope of protection of this application.

以上の説明は本出願の好ましい実施例にすぎず、本出願を限定するためのものではなく、当業者は本出願に対して各種の修正及び変更を行ってもよい。本出願の主旨及び原則内でなされた任意の修正、同等の置換、改良等は、いずれも本出願の保護範囲内に包含されるべきである。 The above descriptions are only preferred embodiments of the present application and are not intended to limit the present application, and those skilled in the art may make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall all fall within the protection scope of this application.

Claims (10)

コイル本体(10)と、
前記コイル本体(10)に設けられ、ピン(23)が設けられたコイル接続部(21)及び前記コイル接続部(21)を覆うように設けられたハウジング(22)を含むパッチコード部(20)と、
前記ピン(23)に挿設された回路基板(30)と、
前記回路基板(30)の少なくとも一部に密着して前記コイル接続部(21)に設けられ、前記コイル接続部(21)と前記回路基板(30)との間に隙間が形成されるように前記回路基板(30)を支持するために用いられる支持部(40)と、を含む電子コイル。
a coil body (10);
A patch cord part (20) provided in the coil body (10) and including a coil connection part (21) provided with a pin (23) and a housing (22) provided so as to cover the coil connection part (21) )and,
a circuit board (30) inserted into the pin (23);
It is provided on the coil connection portion (21) in close contact with at least a part of the circuit board (30) so that a gap is formed between the coil connection portion (21) and the circuit board (30). a support (40) used to support the circuit board (30).
前記支持部(40)は間隔をおいて設けられた複数の支持柱を含む、請求項1に記載の電子コイル。 The electronic coil of claim 1, wherein the support (40) comprises a plurality of spaced support posts. 前記支持柱の断面は円形又は矩形である、請求項2に記載の電子コイル。 3. The electronic coil of claim 2, wherein the cross section of the support post is circular or rectangular. 前記支持部(40)の高さhは、1mm≦h≦4mmである、請求項1に記載の電子コイル。 Electronic coil according to claim 1, wherein the height h of the support (40) is 1 mm ≤ h ≤ 4 mm. 前記コイル接続部(21)は、ハウジング接続部(211)及び導線接続部(212)を含み、前記導線接続部(212)は、前記ハウジング接続部(211)から突出して設けられ、前記ハウジング(22)は、前記ハウジング接続部(211)に設けられ、前記ピン(23)は、前記導線接続部(212)に設けられており、前記導線接続部(212)には環状構造である防水構造(50)が更に設けられており、前記ピン(23)は前記環状構造内に設けられている、請求項1に記載の電子コイル。 The coil connection portion (21) includes a housing connection portion (211) and a conductor connection portion (212), and the conductor connection portion (212) is provided so as to protrude from the housing connection portion (211). 22) is provided at the housing connecting portion (211), the pin (23) is provided at the conducting wire connecting portion (212), and the conducting wire connecting portion (212) has a waterproof structure having a ring structure. 2. The electronic coil of claim 1, further comprising (50), said pin (23) being provided within said annular structure. 前記防水構造(50)は防水溝である、請求項5に記載の電子コイル。 Electronic coil according to claim 5, wherein the waterproof structure (50) is a waterproof groove. 前記防水構造(50)は防水リブである、請求項5に記載の電子コイル。 Electronic coil according to claim 5, wherein the waterproof structure (50) is a waterproof rib. 前記防水構造(50)の断面は、三角形又は矩形である、請求項5に記載の電子コイル。 6. The electronic coil of claim 5, wherein the waterproof structure (50) has a triangular or rectangular cross-section. 前記防水構造(50)は、防水溝及び防水リブを含み、前記防水溝と前記防水リブとは、囲むように前記環状構造を形成するように接続される、請求項5に記載の電子コイル。 6. The electronic coil of claim 5, wherein the waterproof structure (50) comprises a waterproof groove and a waterproof rib, the waterproof groove and the waterproof rib being connected to form the annular structure in a surrounding manner. 請求項1から9のいずれか一項に記載の電子コイルを含む電子膨張弁。 An electronic expansion valve comprising an electronic coil according to any one of claims 1-9.
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