JP2023514050A - 選択的予洗浄のための高速応答二重ゾーンペダルアセンブリ - Google Patents
選択的予洗浄のための高速応答二重ゾーンペダルアセンブリ Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/0002—Cooling of furnaces
- F27D2009/0018—Cooling of furnaces the cooling medium passing through a pattern of tubes
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Abstract
Description
Claims (20)
- シャフトに接続可能な基板支持ペデスタルであって、
熱伝導性の本体;
前記熱伝導性の本体の外側ゾーン内に配置された第1の流体チャネル;
前記熱伝導性の本体の内側ゾーン内に配置された第2の流体チャネル;
電源から前記外側ゾーンにある第1のヒータ素子に電力を供給するように構成された第1の給電;
前記電源から前記内側ゾーンの第2のヒータ素子に電力を供給するように構成された第2の給電;
前記内側ゾーンに埋め込まれた熱電対;及び
前記第1の給電に結合された抵抗測定器
を含み、前記第1の流体チャネル及び前記第2の流体チャネルが、互いに流体連結しておらず、かつ前記基板支持ペデスタル内の熱バリアによって互いに熱的に隔離されている、基板支持ペデスタル。 - 前記熱伝導性の本体がアルミニウムを含む、請求項1に記載の基板支持ペデスタル。
- 前記熱伝導性の本体の上面のセラミックコーティング
をさらに含み、
前記基板支持ペデスタルが、該基板支持ペデスタルの前記上面上で処理される基板を支持するように構成されている、
請求項1に記載の基板支持ペデスタル。 - 前記セラミックコーティングが酸化アルミニウムを含む、請求項3に記載の基板支持ペデスタル。
- (削除)
- 前記熱伝導性の本体全体にパージ流体を循環させるように構成された複数のパージチャネル
をさらに含み、
前記複数のパージチャネルがそれぞれ、前記基板支持ペデスタル内に形成された出口と流体連結している、
請求項1に記載の基板支持ペデスタル。 - 基板支持ペデスタルアセンブリであって、
第1の冷却管対と第2の冷却管対とを含むシャフトであって、前記第1の冷却管対が第1の加熱流体源に流体連結するように構成されており、前記第2の冷却管対が第2の加熱流体源に流体連結するように構成されている、シャフト;及び
前記シャフトに結合した基板支持ペデスタルであって、
前記第1の冷却管対と流体連結している第1の流体チャネル;
前記第2の冷却管対と流体連結している第2の流体チャネル;
電源から外側ゾーンの第1のヒータ素子に電力を供給するように構成された第1の給電;
前記電源から内側ゾーンの第2のヒータ素子に電力を供給するように構成された第2の給電;
前記内側ゾーンに埋め込まれた熱電対;及び
前記第1の給電に結合された抵抗測定器
を含む、基板支持ペデスタル
を含み、ここで、
前記第1の流体チャネルが、前記基板支持ペデスタルの外側ゾーンにおいて第1の熱交換流体を第1の温度で循環させるように構成されており、かつ
前記第2の流体チャネルが、前記外側ゾーン内に配置された前記基板支持ペデスタルの内側ゾーンにおいて第2の熱交換流体を前記第1の温度とは異なる第2の温度で循環させるように構成されている、
基板支持ペデスタルアセンブリ。 - 前記基板支持ペデスタルが熱伝導性の本体を含む、請求項7に記載の基板支持ペデスタルアセンブリ。
- 前記熱伝導性の本体がアルミニウムを含む、請求項8に記載の基板支持ペデスタルアセンブリ。
- 前記基板支持ペデスタルの上面のセラミックコーティング
をさらに含み、
前記基板支持ペデスタルが、該基板支持ペデスタルの前記上面上で処理される基板を支持するように構成されている、
請求項7に記載の基板支持ペデスタルアセンブリ。 - 前記セラミックコーティングが酸化アルミニウムを含む、請求項10に記載の基板支持ペデスタルアセンブリ。
- (削除)
- 前記基板支持ペデスタルが、
前記基板支持ペデスタル全体にパージ流体を循環させる複数のパージチャネル
をさらに含み、ここで、
前記複数のパージチャネルがそれぞれ、前記シャフト内に配置された冷却管及び前記基板支持ペデスタル内に形成された出口と流体連結している、
請求項7に記載の基板支持ペデスタルアセンブリ。 - 処理チャンバであって、
チャンバ本体;
前記チャンバ本体内に配置されたシャフトであって、該シャフトが第1の冷却管対と第2の冷却管対とを含み、前記第1の冷却管対が第1の加熱流体源に流体連結するように構成され、前記第2の冷却管対が第2の加熱流体源に流体連結するように構成されている、シャフト;
前記チャンバ本体内に配置され、前記シャフトに結合された基板支持ペデスタルであって、該基板支持ペデスタルの外側ゾーン内に配置され前記第1の冷却管対と流体連結している第1の流体チャネルと、前記基板支持ペデスタルの内側ゾーン内に配置され前記第2の冷却管対と流体連結している第2の流体チャネルとを含み、ここで、
前記第1の流体チャネルが、前記基板支持ペデスタルの外側ゾーンにおいて第1の熱交換流体を第1の温度で循環させるように構成されており、かつ
前記第2の流体チャネルが、前記外側ゾーン内に配置された前記基板支持ペデスタルの内側ゾーンにおいて第2の熱交換流体を前記第1の温度とは異なる第2の温度で循環させるように構成されている、
基板支持ペデスタル;及び
コントローラであって、
前記基板支持ペデスタルの前記外側ゾーン及び前記内側ゾーンの温度を決定し、かつ
前記基板支持ペデスタルの前記外側ゾーン及び前記内側ゾーンの前記決定された温度に基づいて前記第1の温度及び前記第2の温度を調整する
ように構成された、コントローラ
を含む、処理チャンバ。 - 前記基板支持ペデスタルが、ともにろう付けされた複数の熱伝導性のプレートを含む、請求項14に記載の処理チャンバ。
- 前記複数の熱伝導性のプレートがアルミニウムを含む、請求項15に記載の処理チャンバ。
- 前記基板支持ペデスタルの上面のセラミックコーティング
をさらに含み、
前記基板支持ペデスタルが、該基板支持ペデスタルの前記上面上で処理される基板を支持するように構成されている、
請求項14に記載の処理チャンバ。 - 前記セラミックコーティングが酸化アルミニウムを含む、請求項17に記載の処理チャンバ。
- 前記基板支持ペデスタルが、
前記基板支持ペデスタルの前記外側ゾーン内に配置された第1の加熱素子;及び
前記基板支持ペデスタルの前記内側ゾーン内に配置された第2の加熱素子
をさらに含む、請求項14に記載の処理チャンバ。 - 前記基板支持ペデスタルが、
前記基板支持ペデスタル全体にパージ流体を循環させる複数のパージチャネル
をさらに含み、
前記複数のパージチャネルがそれぞれ、前記シャフト内に配置された冷却管及び前記基板支持ペデスタル内に形成された出口と流体連結している、
請求項14に記載の処理チャンバ。
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CN115003856A (zh) | 2022-09-02 |
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