JP2023181576A - Protective member forming apparatus and method for calculating supply amount of liquid resin - Google Patents

Abstract

To provide a protective member forming apparatus for automatically calculating and adjusting a supply amount of a liquid resin according to a wafer having bumps, and a method for calculating the supply amount of the liquid resin.SOLUTION: A protective member forming apparatus for forming a protective member for protecting one surface of a wafer having bumps on the one surface includes a supply amount calculator for calculating volume of a protruding part of a resin on the basis of a width of the protruding part of the resin protruding outward from an outer periphery of the wafer and a distance between a sheet holding table and a wafer holding table according to a pickup image captured by a camera to calculate a supply amount of the liquid resin to be supplied to an upper surface of a first sheet from the next time.SELECTED DRAWING: Figure 1

Description

The present invention relates to a protective member forming apparatus and a method for calculating the supply amount of liquid resin.

When grinding a wafer having bumps on one surface, a protective member is formed to protect the entire surface of the wafer. As disclosed in Patent Document 1, the protective member forming device brings a sheet into close contact with one surface on which bumps are to be formed, supplies a liquid resin onto the sheet, and further applies a liquid resin to the sheet held by a sheet holding table. The liquid resin is pressed against the resin to spread the liquid resin over the entire surface of one side of the wafer and harden to form a protective member.

JP2019-029543A

When forming a protective member on a surface of a wafer that has bumps, if the liquid resin is spread out and the amount of liquid resin is large, the resin will protrude from the edge of the wafer. The amount of resin that protrudes varies depending on the number and height of bumps and the gaps between bumps. In other words, it is necessary to adjust the amount of liquid resin supplied depending on the type of wafer having bumps. Therefore, it is desired that the protective member forming apparatus automatically calculate and adjust the amount of liquid resin supplied depending on the wafer provided with bumps.

The present invention has been made in view of the above, and provides a protective member forming apparatus that automatically calculates and adjusts the amount of liquid resin supplied depending on the wafer having bumps, and a method for calculating the amount of liquid resin supplied. The purpose is to provide

The protective member forming apparatus of the present invention is a protective member forming apparatus that forms a protective member that protects one side of a wafer having bumps on one side, the protective member forming apparatus covers one side of the wafer and extends from the outer periphery of the wafer. a wafer holding table that holds the other side of the wafer in which a first sheet capable of forming an annular protruding portion is in close contact with the entire surface of the one side and the outer side of the wafer; a liquid resin supply unit that supplies liquid resin to the upper surface of one sheet; a sheet holding table that holds a second sheet having an area that can cover one side of the wafer above the wafer holding table; Expansion means for bringing the table and the wafer holding table close to each other at a preset distance to spread the liquid resin supplied to the upper surface of the first sheet and causing the liquid resin to protrude beyond the outer periphery of the wafer, and for holding the sheet. An ultraviolet irradiation unit is arranged on the table and irradiates the liquid resin with ultraviolet rays from the second sheet side, and the liquid resin receives the reflected light of the ultraviolet rays reflected by the hardened resin, and at least removes the protruding resin. Calculate the volume of the resin protruding from the camera that takes the image, the width of the resin protruding from the outer periphery of the wafer according to the image taken by the camera, and the distance between the sheet holding table and the wafer holding table. and a liquid resin supply amount calculation unit that calculates the supply amount of the liquid resin to be subsequently supplied to the upper surface of the first sheet.

In one aspect of the present invention, the supply amount calculation unit calculates the amount of liquid resin that formed the overflowing resin by dividing the shrinkage rate of the liquid resin by the volume of the overflowing resin. The amount of the liquid resin is initially subtracted from the amount of the liquid resin supplied to the first sheet, and then the amount of the liquid resin supplied to the upper surface of the first sheet is calculated.

The method of calculating the supply amount of liquid resin of the present invention is to supply a predetermined amount of liquid resin to spread and harden the liquid resin over the entire surface of a wafer having bumps on one surface to form a protective member. A method for setting the supply amount of liquid resin, wherein a first sheet that covers one side of a wafer and can form an annular protruding portion outward from the outer periphery of the wafer is brought into close contact with the entire surface of the one side and the outer surface. a wafer holding step in which a wafer holding table holds the other side of the wafer; a liquid resin supply step in which a liquid resin is supplied to the top surface of the first sheet of the wafer held by the wafer holding table; a sheet holding step in which the second sheet is held, and the sheet holding table and the wafer holding table are brought close to each other at a preset distance to spread the liquid resin supplied on the top surface of the first sheet to a point beyond the outer periphery of the wafer. an expansion step in which the liquid resin is pushed out, a curing step in which the liquid resin is irradiated with ultraviolet rays from the second sheet side and cured, and the reflected light of the ultraviolet rays reflected by the cured resin with a camera. an imaging step of receiving light and capturing an image of at least the protruding resin, the width of the protruding resin from the outer periphery of the wafer, and the distance between the sheet holding table and the wafer holding table according to the image taken by the camera; a protrusion amount calculation step of calculating the protruding volume of the resin from the distance; and subtracting the protrusion amount of the resin calculated in the protrusion amount calculation step from the supply amount of the liquid resin supplied in the liquid resin supply step; Next, a supply amount calculation step of calculating a supply amount by which the liquid resin supply section supplies the liquid resin to the upper surface of the first sheet is provided.

In one aspect of the present invention, the supply amount calculation step calculates the amount of the liquid resin that formed the resin that has protruded from the wafer by dividing the shrinkage rate when the liquid resin is cured by the amount of the resin that has protruded. The amount of liquid resin calculated in the liquid resin amount calculation step is subtracted from the amount of the liquid resin supplied in the liquid resin supply step, and then the liquid resin supply section calculates the amount of liquid resin. Calculate the amount of liquid resin supplied to the top surface of one sheet.

According to the protective member forming apparatus and the method for calculating the supply amount of liquid resin of the present invention, the supply amount of liquid resin can be automatically calculated and adjusted depending on the wafer having bumps.

FIG. 1 is a perspective view showing a protective member forming apparatus according to the present embodiment. It is a sectional view of a part of a protection member forming device. It is an explanatory view showing a liquid resin supply process in a protection member forming device. It is an explanatory view showing a spreading process (expansion process) and an imaging process in a protection member forming device.

Hereinafter, a protective member forming apparatus and a method for calculating the supply amount of liquid resin according to the present embodiment will be described with reference to the accompanying drawings. FIGS. 1 and 2 show the whole and a part of the protective member forming apparatus according to this embodiment. 3 to 4 are diagrams illustrating each process performed by the protective member forming apparatus.

The X-axis direction, Y-axis direction, and Z-axis direction shown in each figure are perpendicular to each other. The X-axis direction and the Y-axis direction are substantially horizontal directions, and the Z-axis direction is an up-down direction (vertical direction). In each figure, of the double arrows indicating the X-axis direction, the side marked with the letter X is the left side, and the side without the letter X is the right side. Of the double arrows indicating the Y-axis direction, the side marked with the letter Y is defined as the front, and the side without the letter Y is defined as the rear. Of the double arrows indicating the Z-axis direction, the side marked with the letter Z is defined as the upper side, and the side without the letter Z is defined as the lower side.

The protective member forming apparatus 1 shown in FIG. 1 is an example of an apparatus that forms a protective member by applying an external stimulus to a liquid resin that has been spread over the entire surface of one side of a wafer 90 to harden it. In FIG. 1, the outer casing 10 of the protective member forming apparatus 1 is indicated by broken lines, and components inside the outer casing 10 are shown in a transparent state. The surface of the wafer 90 that faces upward during processing in the protective member forming apparatus 1 is referred to as an upper surface 900, and the surface that faces downward is referred to as a lower surface 904.

Although details will be described later, in the protective member forming apparatus 1, a wafer 90 is placed on the protective member forming stage 16, and liquid resin 31 (see FIGS. 3 and 4) is supplied onto the placed wafer 90 to form a sheet. The holding unit 20 operates to press the held second sheet 30 onto the liquid resin 31 from above the protective member forming stage 16 . This operation spreads the liquid resin 31 between the wafer 90 and the second sheet 30 and brings it into an expanded state on the wafer 90. In this state, an external stimulus is applied to the liquid resin 31 to cause it to harden, and the cured resin and the second sheet 30 form a protective member.

Such a series of operations is performed under the control of the control unit 60 (FIG. 1) that generally controls the protective member forming apparatus 1. Regarding the operation of each section described below, if the main body of control is not specified, it is assumed that the operation is controlled by a control signal sent from the control section 60.

The wafer 90 is, for example, a disk-shaped as-sliced wafer cut from a cylindrical ingot of silicon or the like. Note that the wafer 90 is not limited to an as-sliced wafer before device formation, but may also be a device wafer after device formation.

On the upper surface 900 of the wafer 90 , devices 902 such as ICs and LSIs are formed in a plurality of lattice-like regions defined by a plurality of dividing lines 901 . A plurality of bumps (protruding electrodes) 903 are provided on the surface of each device 902 . The bump 903 made of copper or the like is set to have a height of, for example, approximately several tens of μm.

A top surface 900 of the wafer 90 is covered with a first sheet 905. The first sheet 905 is adhered to the entire top surface 900 of the wafer 90 in a state in which it is in close contact with the entire surface. The first sheet 905 has an area capable of forming an annular protruding portion 906 outward from the outer periphery of the wafer 90 . By having the protruding portion 906, the amount of the protruding resin 31 can be calculated in the liquid resin calculation method described later.

Further, the first sheet 905 is in close contact with the entire surface of the upper surface 900 of the wafer 90 and is further adhered in a state of being in close contact with the outer surface 907 of the wafer 90 to form an annular protruding portion 906 outward from the outer periphery of the wafer 90. It's okay. Thereby, in the liquid resin calculation method described later, the amount of the liquid resin 31 that has protruded can be calculated more accurately.

The first sheet 905 is made of a translucent material. As the first sheet 905, for example, a film made of polyethylene terephthalate or the like can be used. Note that materials other than these may also be used.

The first sheet 905 may be carried into the protective member forming apparatus 1 in a state of being attached to the upper surface 900 of the wafer 90 in advance.

Further, a mechanism for pasting the first sheet 905 may be provided in the protective member forming device 1, or a device for pasting the first sheet 905 may be provided outside the protective member forming device 1. In this case, the wafer 90 without the first sheet 905 is carried into a mechanism or device for pasting the first sheet 905 at an arbitrary timing in the protective member forming process, and the first sheet 905 is pasted on the wafer 90. .

The protective member forming device 1 includes a cassette accommodating portion 11 at one end (left end) of the external housing 10 in the X-axis direction. A housing space 112 is formed in the cassette housing section 11 . Each cassette 106 can accommodate a plurality of wafers W.

A temporary storage table 13 and a sheet cutting table 14 are provided on the right side of the cassette accommodating portion 11 in the X-axis direction. A temporary table 13 is located on the upper side, and a sheet cutting table 14 is located on the lower side. The temporary table 13 is provided with a wafer detection unit 131 that detects the center position and orientation of the wafer 90 before the protection member is formed. The sheet cut table 14 is provided with a sheet cutter that cuts the second sheet 30 attached to the wafer 90 along the outer shape of the wafer 90.

A first transport mechanism 12 for loading and unloading wafers 90 into and out of the cassette 106 is provided on the front side in the Y-axis direction with respect to the temporary storage table 13 and the sheet cutting table 14 . The first transport mechanism 12 includes a robot hand 122 supported on a pedestal 121, and the pedestal 121 is movably supported along a pair of guide rails 123 extending in the Y-axis direction. The pedestal 121 includes a threaded portion (not shown) that threads into a ball screw 124 extending in the Y-axis direction. When the ball screw 124 is rotated by the driving force of the motor, the pedestal 121 moves in the Y-axis direction.

The first transport mechanism 12 transports the wafer 90 between the cassette storage section 11, the temporary storage table 13, and the sheet cutting table 14 by moving the pedestal 121 in the Y-axis direction and by operating the robot hand 122. conduct. More specifically, the first transport mechanism 12 can transport the wafer 90 before the protective member is formed from the cassette 106 in the storage space 112 and place it on the temporary storage table 13. Further, the first transport mechanism 12 can transport the wafer 90 on which the protective member has been formed from the sheet cutting table 14 and into the cassette 106 within the storage space 112.

The protective member forming apparatus 1 includes a base 15 on the right side in the X-axis direction with respect to the temporary placing table 13 and the sheet cutting table 14. A protection member forming stage 16 is provided on the base 15 . The protection member forming stage 16 is formed into a disk shape. The upper surface of the protective member forming stage 16 is a wafer holding table 161.

It includes a sheet conveying table 40 that conveys the second sheet 30 to the sheet holding table 201 of the sheet holding section 20, and a horizontal movement mechanism 41 that moves the second sheet 30 in the horizontal direction. The horizontal movement mechanism 41 includes an electric slider (not shown) disposed within the base 15.

A sheet arrangement mechanism 8 is provided on the base 402 and is capable of pulling out the band-shaped second sheet 30, positioning it on the sheet conveyance table 40, and cutting the second sheet 30 into a rectangular shape. The sheet arrangement mechanism 8 includes, for example, a sheet supply unit 80 that includes a rotating shaft, a motor, a plurality of rotating rollers, etc., and an outer periphery (outer periphery in the X direction) of a band-shaped second sheet 30 fed from the sheet supply unit 80 ); a gripping section moving section 82 that moves the second sheet 30 gripped by the sheet gripping section 81 so as to pull it out in the horizontal direction (X direction); a sheet cutting section 83 that cuts the rear end side of the second sheet 30 to form a rectangular second sheet 30.

The conveyance table 40 includes a dome forming mechanism 42 that inflates the center of the held sheet 30 (the sheet 30 after being cut into a rectangular shape) upward. As shown in FIG. 2, the dome forming mechanism 42 is housed in, for example, a circular recess 432 formed at the center of the upper surface 431 of the transport frame 43 of the transport table 40 and having a smaller diameter than the wafer 90, and in the present embodiment, the circular recess 432. and an elastic member 421 whose upper portion protrudes from the upper surface 431 of the transport frame 43.

The second sheet 30 is made of a translucent material. As the second sheet 30, for example, a film made of polyethylene terephthalate or the like can be used. Note that the second sheet 30 made of a material other than this may also be used.

As shown in FIGS. 2 to 4, the wafer holding table 161 of the protection member forming stage 16 is provided with a disc-shaped porous member 162 on the lower surface side of the wafer holding table 161. The surface of the porous member 162 is a wafer holding surface 163. Porous member 162 is connected to a suction source 164. By operating the suction source 164, the wafer 90 placed on the wafer holding table 161 is held by suction on the wafer holding table 161.

A liquid resin supply unit 18 is provided near the protection member forming stage 16 for supplying a predetermined amount of liquid resin 31 onto the first sheet 905 of the wafer 90 on the wafer holding table 161. The liquid resin supply unit 18 includes a dispenser 181 connected to a tank 184 provided in the base 15, and a resin supply nozzle 183 connected to a connecting pipe 182 extending from the dispenser 181. The resin supply nozzle 183 is rotatable about an axis pointing in the Z-axis direction, and there are two states: positioning the resin supply nozzle 183 above the protection member forming stage 16 and retracting the resin supply nozzle 183 from above the protection member formation stage 16. can be brought into a state of

Liquid resin 31 stored in tank 184 is sent by dispenser 181 via connecting pipe 182, and liquid resin 31 is dripped downward from resin supply nozzle 183. The amount of liquid resin 31 supplied from the resin supply nozzle 183 can be adjusted by the dispenser 181.

The liquid resin 31 has the property of being hardened by external stimulation. In this embodiment, an ultraviolet curing resin that is cured by irradiation with ultraviolet light is used.

A column 19 that projects upward from the base 15 is provided at a position on the left side of the protection member forming stage 16 in the X-axis direction. The column 19 is provided with an elevating mechanism (expansion means) 21 that moves the sheet holding section 20 in the Z-axis direction toward and away from the protective member forming stage 16. The elevating mechanism (expansion means) 21 includes a pair of guide rails 211 extending in the Z-axis direction, an elevating table 212 supported movably in the Z-axis direction with respect to the pair of guide rails 211, and a lifting table 212 extending in the Z-axis direction. It includes a ball screw 213 that is screwed into the threaded portion of the lifting table 212. When the ball screw 213 is rotated by the driving force of the motor 214, the elevating table 212 moves in the Z-axis direction along the pair of guide rails 211. When the ball screw 213 is rotated in the first direction, the elevating table 212 moves downward, and when the ball screw 213 is rotated in the second direction, the elevating table 212 moves upward.

The sheet holding section 20 is supported by a lifting table 212, and the sheet holding section 20 is moved in the Z-axis direction along with the lifting table 212. The sheet holding section 20 includes a disk-shaped sheet holding table 201.

As shown in FIGS. 2 to 4, the sheet holding table 201 is provided with a disk-shaped glass plate 202. As shown in FIGS. The surface of the glass plate 202 is a sheet holding surface 203. The sheet holding surface 203 has a plurality of suction holes (not shown) formed therein. The suction hole is connected to a suction source (not shown). By operating the suction source and applying suction force to the suction holes, the second sheet 30 is suction-held onto the sheet holding surface 203.

With the second sheet 30 being sucked and held on the sheet holding surface 203 of the sheet holding section 20 (FIG. 3), the elevating mechanism (expansion means) 21 lowers the sheet holding section 20 holding the second sheet 30. Then, the second sheet 30 comes into contact with the liquid resin 31 supplied onto the first sheet 905 of the wafer 90, and the liquid resin 31 is spread out by the force of lowering the second sheet 30.

Although not shown, the sheet holding section 20 may include a load detection section. The spread state of the liquid resin 31 on the wafer 90 may be determined based on the output of the load detection section.

A curing mechanism 23 is provided inside the sheet holding section 20 to apply an external stimulus to the liquid resin 31 dropped onto the wafer 90 on the wafer holding table 161 to harden it. The curing mechanism 23 includes a plurality of ultraviolet irradiation units 231 capable of emitting ultraviolet rays (see FIG. 4), and irradiates the liquid resin 31 with ultraviolet rays through the first sheet 905 and the second sheet 30 having translucency. Irradiate and harden. The light source used for the ultraviolet irradiation section 231 may be an LED.

Further, a camera 24 is provided inside the sheet holding section 20 to take an image in the direction of the wafer holding table 161. The camera 24 is configured with a lens and an image sensor, and covers the entire surface of the liquid resin 31 spread on the second sheet 30 on the wafer holding table 161 and the entire surface of the wafer 90 on which the liquid resin 31 is spread. It has an imaging range that allows imaging from above the holding table 201. Further, it is preferable that the camera 24 receives reflected light (fluorescence) of ultraviolet rays reflected from the cured liquid resin 31 and images at least the liquid resin 31 protruding from the outer periphery of the wafer 90 .

As shown in FIG. 1, a second transport mechanism 25 is provided on the front side of the base 15 in the Y-axis direction. The second transport mechanism 25 includes a robot hand 252 supported on a pedestal 251, and the pedestal 251 is movably supported along a pair of guide rails 253 extending in the X-axis direction. The pedestal 251 includes a threaded portion (not shown) that threads into a ball screw 254 extending in the X-axis direction. When the ball screw 254 is rotated by the driving force of the motor, the pedestal 251 moves in the X-axis direction.

The second transport mechanism 25 transports the wafer 90 between the temporary storage table 13 and sheet cutting table 14 and the wafer holding table 161 by moving the pedestal 251 in the X-axis direction and operating the robot hand 252. conduct. More specifically, the second transport mechanism 25 can receive the wafer 90 on which the protection member is not formed from the temporary holding table 13, transport it, and deliver it to the wafer holding table 161. Further, the second transport mechanism 25 can collect the wafer 90 on which the protective member has been formed from the wafer holding table 161 and transport it to the sheet cutting table 14 .

The protective member forming apparatus 1 is centrally controlled by a control section 60 (FIG. 1). The control unit 60 includes a processor that executes various processes, and a storage unit (memory) that stores various parameters, programs, and the like. The storage unit of the control unit 60 stores the supply amount of liquid resin. Furthermore, the storage section of the control section 60 stores, as part of the control program for the protective member forming apparatus 1, a program for calculating the supply amount of the liquid resin 31 based on an image taken by the camera 24, which will be described later.

A supply amount calculation unit 61 is included as one of the functional blocks of the control unit 60. The supply amount calculation unit 61 calculates the amount of liquid resin 31 based on the image captured by the camera 24 by receiving the reflected light (fluorescence) of the ultraviolet rays emitted by the ultraviolet irradiation unit 231 on the cured liquid resin 31. Calculate the supply amount of

The supply amount calculation unit 61 calculates the amount of liquid resin 31 based on the width of the liquid resin 31 protruding from the outer circumference of the wafer 90 according to the image taken by the camera 24 and the distance between the sheet holding table 201 and the wafer holding table 161. The protruding volume is calculated, and then the amount of liquid resin to be supplied to the upper surface of the first sheet 905 is calculated.

In addition, the supply amount calculating unit 61 calculates the amount of the liquid resin 31 that has protruded by dividing the volume of the liquid resin 31 that has protruded by the shrinkage rate of the liquid resin 31, and calculates the amount of the liquid resin 31 that has protruded from the initial volume. The amount of liquid resin 31 supplied to one sheet 905 is subtracted from the amount of liquid resin 31 supplied to the next sheet 905, and the amount of liquid resin supplied to the upper surface of the first sheet 905 is calculated.

Note that the function of the supply amount calculation section 61 is realized by the operation of the processor, memory, etc. that constitute the control section 60, and this does not mean that the supply amount calculation section 61 is composed of independent electronic components. It's not that I'm doing it. Further, although FIGS. 2 to 4 schematically show only the connection relationship between the supply amount calculation unit 61 and the camera 24, the control unit 60 controls each part of the protective member forming apparatus 1 other than the camera 24. However, they are connected so that they can send and receive signals.

A method of calculating and setting the amount of liquid resin 31 supplied by the protective member forming apparatus 1 configured as described above will be described.

In this embodiment, the protective member forming apparatus 1 automatically calculates the amount of liquid resin to be supplied when the number of bumps or the size of the bumps changes.

The wafer loading process will be explained using FIG. The first transport mechanism 12 takes out one wafer 90 from the cassette 106 and transports it onto the temporary table 13 . The wafer is detected on the temporary holding table 13 , and the second transport mechanism 25 carries out the wafer 90 by suctioning and holding it, and places the wafer 90 on the wafer holding table 161 . On the wafer holding table 161, the suction source 164 is operated to apply suction force to the porous member 162, and the lower surface 904 of the wafer 90 is suctioned and held on the wafer holding surface 163.

As shown in FIG. 2, the wafer 90 is placed on the wafer holding table 161. At this time, it is preferable that the protruding portion 906 of the first sheet 905 be brought into close contact with the upper surface of the wafer holding table. Thereby, in the liquid resin calculation method described later, the amount of the protruding resin 31 can be calculated more accurately.

The sheet loading process will be explained using FIG. 2. The sheet supply unit 80 feeds out the leading end of the belt-shaped sheet 30 horizontally in the X direction. The sheet gripping portion 81 is moved by the gripping portion moving portion 82, and the sheet gripping portion 81 grips the tip of the belt-shaped sheet 30.

In parallel with the feeding of the second sheet 30 by the sheet supply unit 80, the conveyance table 40 is positioned by the horizontal movement mechanism 41 at a position to receive the second sheet 30. The sheet 30 gripped by the sheet gripping section 81 is positioned above the upper surface 431 of the transport frame 43 of the transport table 40 and the upper surface of the elastic member 421.

The band-shaped second sheet 30 pulled out to a predetermined length by the sheet gripping section 81 is cut into a predetermined length by the sheet cutting section 83 while covering the entire upper surface of the elastic member 421 . As a result, the second sheet 30 is placed on the elastic member 421. Here, it is preferable that the predetermined length of the second sheet 30 has an area that can cover the upper surface 900 of the wafer 90.

Next, the sheet holding process will be explained. The conveyance table 40 on which the second sheet 30 is placed further moves in the X direction and is positioned directly below the sheet holding table 201. The sheet holding table 201 is lowered by the elevating mechanism (expansion means) 21, and the sheet holding surface 203 of the glass plate 202 comes into contact with the sheet 30 on the elastic member 421. At this time, the sheet 30 is suction-held on the sheet holding table 201 by a suction hole connected to a suction source (not shown). The second sheet 30 is transferred to the sheet holding table 201, and the conveyance table 40 is removed. Thereby, the sheet holding table 201 is in a state where the second sheet 30 having an area that can cover the upper surface 900 of the wafer 90 is held above the wafer holding table 161.

The liquid resin supply process will be explained using FIG. 4. The resin supply nozzle 183 of the liquid resin supply unit 18 is positioned above the wafer 90 placed on the wafer holding table 161 in the previous sheet carrying process. Then, the dispenser 181 is controlled to send out the liquid resin 31 to the resin supply nozzle 183, and the liquid resin 31 is dripped from the resin supply nozzle 183 toward the first sheet 905 of the wafer 90. The resin supply nozzle 183 is positioned above the center of the protective member forming stage 16, and the liquid resin 31 dropped from the resin supply nozzle 183 is applied to the first sheet 905 of the wafer 90 in an area narrower than the area of the wafer 90. It accumulates near the center of the top surface.

The control unit 60 causes the liquid resin supply unit 18 to supply a predetermined amount of liquid resin 31 to the wafer 90 . When the supply of a predetermined amount of liquid resin 31 is completed, the resin supply nozzle 183 is rotated to be removed from above the protection member forming stage 16, and the liquid resin supply process is completed. Further, when calculating the supply amount of the liquid resin 31, it is preferable to supply a large amount of the liquid resin to the extent that it protrudes from the wafer 90.

Note that at least a part of the wafer holding process may be performed in parallel (simultaneously) with the sheet loading process and the liquid resin supplying process.

When the second sheet 30 held by the sheet holding unit 20 is positioned facing above the liquid resin 31 on the wafer 90 (FIG. 3), the pushing and spreading process (expansion process) shown in FIG. move on. In the spreading step (expansion step), the motor 214 is operated by the elevating mechanism (expansion means) 21 to lower the elevating table 212 and the sheet holding section 20 at a predetermined feeding speed.

As shown in FIG. 4, as the sheet holding section 20 descends, the second sheet 30 approaches the protective member forming stage 16 and comes into contact with the liquid resin 31. Then, the liquid resin 31 is pressed by the second sheet 30, and the liquid resin 31 is spread out in the radial direction of the wafer 90. The liquid resin 31 before contacting the second sheet 30 is located near the center of the second sheet 30, and by being pressed by the second sheet 30, the liquid resin 31 is directed toward the outer edge side of the wafer 90. It spreads.

In this embodiment, as shown in FIG. 4, when the liquid resin 31 protrudes beyond the outer periphery of the wafer 90, the supply amount of the liquid resin 31, which will be described later, is calculated. In the spreading process (expansion process), the elevating mechanism (expansion means) 21 brings the sheet holding table 201 and the wafer holding table 161 close to each other at a preset distance, and the liquid resin 31 supplied to the upper surface of the first sheet 905 The liquid resin 31 is pushed out beyond the outer periphery of the wafer 90.

In addition, when determining the spreading state of the liquid resin 31, it may be detected by a load detection section (not shown), or an image captured by the camera 24 may be referred to.

When the spreading process (expansion process) is completed and the liquid resin 31 completely covers the first sheet 905 of the wafer 90, the process proceeds to the curing process shown in FIG. 4. In the curing process, UV rays strong enough to cure the liquid resin 31 are irradiated from the ultraviolet irradiation unit 231 of the curing mechanism 23 toward the wafer holding table 161 . The ultraviolet rays emitted from the ultraviolet irradiator 231 pass through the transparent glass plate 202 and the second sheet 30, reach the liquid resin 31, and harden the liquid resin 31, which is an ultraviolet curable resin. When the liquid resin 31 is determined to be sufficiently cured, the UV irradiation from the curing mechanism 23 is terminated.

Subsequently, in the imaging step, reflected light (fluorescence) of the ultraviolet rays reflected by the cured liquid resin 31 is received, and at least the liquid resin 31 protruding beyond the outer periphery of the wafer 90 is imaged.

The supply amount calculation unit 61 calculates the supply amount of the liquid resin 31 based on the captured image taken in the imaging process. The process of calculating the supply amount will be explained.

In this embodiment, the height of the liquid resin 31 when it is pushed out (expanded) can be determined from the value of the encoder of the motor 214 of the elevating mechanism (expansion means) 21, and the image taken in the imaging process From the image, the width by which the liquid resin 31 protrudes from the outer periphery of the wafer 90 can be seen. Based on this information, the amount of liquid resin 31 that has protruded from the outer periphery of wafer 90 is calculated. Based on the calculated amount of the liquid resin 31 that has protruded, it is possible to calculate a new accurate liquid resin supply amount that will prevent the liquid resin 31 from protruding from the edge of the wafer 90 from the initially set liquid resin supply amount.

The supply amount of the liquid resin 31 supplied to the first sheet 905 at the beginning is assumed to be V1. Further, the supply amount V1 is the initially set supply amount of the liquid resin 31, and the supply amount V1 is the volume.

The protrusion amount calculation process will be explained. The protrusion amount calculation step is based on the width of the liquid resin 31 protruding from the outer periphery of the wafer 90 according to the captured image taken by the camera 24 and the distance between the sheet holding table 201 and the wafer holding table 161. Calculate the volume.

The volume of liquid resin 31 protruding from wafer 90 is calculated. As shown in FIG. 4, the radius r of the wafer 90, the width R of the liquid resin 31 protruding from the outer periphery of the wafer 90, and the relationship between the sheet holding surface 203 of the sheet holding table 201 and the wafer holding surface 163 of the wafer holding table 161. The explanation will be made assuming a distance H and a volume Va of the liquid resin 31 that has protruded to the outer periphery of the wafer 90. Moreover, the width R is the radius from the center of the wafer 90 to the outer periphery of the liquid resin 31 that has protruded. Further, the distance H may be the distance between the pressing surface 311 of the second sheet 30 and the wafer holding surface 163 of the wafer holding table 161, taking into account the thickness of the second sheet 30.

In the protrusion amount calculation step, the protruding volume Va of the liquid resin 31 protruding to the outer periphery of the wafer 90 is calculated, for example, according to Equation 1. Pi is assumed to be π.
(R ² ×H×π)−(r ² ×H×π)=Va...(Formula 1)

The supply amount calculation process will be explained. In the supply amount calculation step, the amount of liquid resin 31 that has protruded out calculated in the amount of protrusion calculation step has been subtracted from the amount of liquid resin 31 that has been supplied in the liquid resin supply step, and then the liquid resin supply portion has been applied to the upper surface of the first sheet 905. Calculate the supply amount of liquid resin.

In the supply amount calculation step, first a liquid resin amount calculation step is performed. In the liquid resin amount calculation step, the amount VA of the liquid resin that formed the protruding liquid resin 31 is calculated by dividing the protruding volume Va of the liquid resin 31 calculated in the protruding amount calculation step by the shrinkage rate X% of the liquid resin 31. . Note that the amount VA of liquid resin is the volume.

Further, the shrinkage rate X is a characteristic that the liquid resin 31 has, and may be set with reference to known literature or the like, or an arbitrary value may be set by the operator of the protective member forming apparatus 1.

In the liquid resin amount calculation step, for example, according to Equation 2, the amount VA of the liquid resin that formed the protruding liquid resin 31 is calculated.
Va/(X/100)=VA...(Formula 2)

After the liquid resin amount calculation step, the calculated amount VA of the liquid resin 31 is subtracted from the supply amount V1 of the liquid resin 31 initially supplied to the first sheet 905, and the amount is applied to the upper surface of the first sheet 905 from the next protective member formation. The supply amount V2 of the liquid resin to be supplied is calculated.

For example, according to Equation 3, the supply amount V2 of the liquid resin to be supplied to the upper surface of the first sheet 905 from the next formation of the protective member is calculated.
V1-VA=V2...(Formula 3)

Information on the calculated supply amount V2 is transmitted to the control unit 60, and is set as an accurate supply amount of the liquid resin 31 so that the liquid resin 31 does not protrude from the edge of the wafer 90.

By calculating the supply amount V2, it is possible to calculate an accurate supply amount of the liquid resin so that the liquid resin 31 does not protrude from the edge of the wafer 90. Thereby, when the number of bumps 903 on the wafer 90 and the size of the bumps 903 change, the amount of liquid resin supplied can be automatically calculated and adjusted depending on the wafer with bumps.

After the step of calculating the supply amount of the liquid resin 31 is completed, the suction holding of the wafer 90 on the wafer holding table 161 of the protection member forming stage 16 is released.

The wafer used to calculate the amount of liquid resin is transferred from the wafer holding table 161 to the second transport mechanism 25.

Thereafter, the protective member may be transported to a device or mechanism that peels off the protective member, and the protective member may be peeled off and subjected to a process of forming a protective member again.

Alternatively, the desired protection member is formed by transporting the protection member to the sheet cutting table 14 and cutting the outer peripheral portion of the hardened resin when calculating the amount of liquid resin, without transporting the protection member to a peeling device or mechanism. The wafer 90 may also be a different wafer.

As described above, the protective member forming apparatus according to the present embodiment can automatically calculate and adjust the supply amount of liquid resin depending on the wafer having bumps.

Note that the embodiments of the present invention are not limited to the above-described embodiments and modified examples, and may be variously changed, replaced, and modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in a different manner due to advances in technology or other derived technologies, it may be implemented using that method. Accordingly, the claims cover all embodiments that may be included within the spirit of the invention.

As described above, the protective member forming apparatus of the present invention can automatically calculate and adjust the supply amount of liquid resin depending on the wafer having bumps. Therefore, it is possible to form a wafer on which a desired protection member is formed, and this method is particularly useful in the field of manufacturing semiconductors and the like, which includes a process of forming a protection member on one side of a wafer.

1: Protective member forming device 8: Sheet arrangement mechanism 10: External housing 11: Cassette storage section 12: First transport mechanism 13: Temporary storage table 14: Sheet cutting table 15: Base 16: Protective member forming stage 18: Liquid Resin supply section 19: Column 20: Sheet holding section 23: Curing mechanism 24: Camera 25: Second transport mechanism 30: Second sheet 31: Liquid resin 40: Sheet transport table 41: Horizontal movement mechanism 42: Dome forming mechanism 43: Conveyance frame 60: Control section 61: Supply amount calculation section 80: Sheet supply section 81: Sheet gripping section 82: Gripping section moving section 83: Sheet cutting section 90: Wafer 103: Support base 106: Cassette 112: Accommodation space 121: Pedestal 122: Robot hand 123: Guide rail 124: Ball screw 131: Wafer detection unit 141: Sheet cutter 161: Wafer holding table 162: Porous member 163: Wafer holding surface 164: Suction source 181: Dispenser 182: Connection tube 183: Resin Supply nozzle 184 : Tank 201 : Sheet holding table 202 : Glass plate 203 : Sheet holding surface 211 : Guide rail 212 : Elevating table 213 : Ball screw 214 : Motor 231 : Ultraviolet irradiation part 251 : Pedestal 252 : Robot hand 253 : Guide rail 254 : Ball screw 402 : Base 421 : Elastic member 431 : Top surface 432 : Circular recess 900 : Top surface 901 : Planned dividing line 902 : Device 903 : Bump 904 : Bottom surface 905 : First sheet 906 : Extrusion part 907 : Outer surface

Claims (4)

A protective member forming apparatus for forming a protective member for protecting one side of a wafer having bumps on one side,
a wafer holding table that holds the other side of the wafer and has a first sheet that covers one side of the wafer and can form an annular protruding portion outward from the outer periphery of the wafer in close contact with the entire surface of the one side and the outer side; ,
a liquid resin supply unit that supplies liquid resin to the upper surface of the first sheet of the wafer held by the wafer holding table;
a sheet holding table that holds a second sheet having an area that can cover one side of the wafer above the wafer holding table;
expanding means for bringing the sheet holding table and the wafer holding table close to each other at a preset distance to spread the liquid resin supplied to the upper surface of the first sheet and causing the liquid resin to protrude beyond the outer periphery of the wafer;
an ultraviolet irradiation unit disposed on the sheet holding table and irradiating the liquid resin with ultraviolet rays from the second sheet side;
a camera that receives reflected light of the ultraviolet rays reflected by the cured liquid resin and images at least the protruding resin;
The volume of the protruding resin is calculated from the width of the protruding resin from the outer periphery of the wafer according to the image taken by the camera and the distance between the sheet holding table and the wafer holding table, and the following steps are taken: A protection member forming apparatus comprising: a liquid resin supply amount calculation unit that calculates a supply amount of liquid resin to be supplied to the upper surface of the first sheet from the liquid resin. The supply amount calculation unit calculates the amount of liquid resin that formed the overflowing resin by dividing the shrinkage rate of the liquid resin by the volume of the overflowing resin, and calculates the calculated amount of the liquid resin as an initial value. 2. The protective member forming apparatus according to claim 1, wherein the amount of the liquid resin that is supplied to the first sheet is subtracted from the amount of the liquid resin that is supplied to the first sheet to calculate the amount of the liquid resin that is then supplied to the upper surface of the first sheet. A method for setting a supply amount of liquid resin for supplying a predetermined amount of liquid resin to spread and harden the liquid resin over the entire surface of a wafer having bumps on one surface, the method comprising:
A wafer holding table holds the other side of the wafer with a first sheet that covers one side of the wafer and can form an annular protruding portion outward from the outer periphery of the wafer in close contact with the entire surface of the one side and the outer side. a wafer holding process;
a liquid resin supplying step of supplying liquid resin onto the upper surface of the first sheet of the wafer held by the wafer holding table;
a sheet holding step of holding a second sheet on a sheet holding table;
an expansion step of bringing the sheet holding table and the wafer holding table close to each other at a preset distance to spread the liquid resin supplied to the upper surface of the first sheet and causing the liquid resin to protrude beyond the outer periphery of the wafer; ,
a curing step of curing the liquid resin by irradiating the liquid resin with ultraviolet rays from the second sheet side;
an imaging step of receiving, with a camera, the reflected light of the ultraviolet rays reflected by the hardened liquid resin and imaging at least the protruding resin;
Protrusion amount calculation that calculates the volume of the resin protruding from the width of the resin protruding from the outer periphery of the wafer according to the image taken by the camera and the distance between the sheet holding table and the wafer holding table. process and
Subtracting the protrusion amount of the resin calculated in the protrusion amount calculation step from the supply amount of the liquid resin supplied in the liquid resin supply step, and then the liquid resin supply unit supplies the liquid resin to the upper surface of the first sheet. A method for calculating a supply amount of liquid resin, comprising: a supply amount calculation step of calculating a supply amount. The supply amount calculation step includes calculating the amount of liquid resin in which the shrinkage rate when the liquid resin is cured is divided by the amount of the resin protruding to calculate the amount of the liquid resin that formed the resin that has protruded from the wafer. subtracting the amount of the liquid resin calculated in the liquid resin amount calculation step from the amount of the liquid resin supplied in the liquid resin supply step, and then supplying the liquid resin supply section to the top surface of the first sheet. 4. The method for calculating the supply amount of liquid resin according to claim 3, wherein the supply amount of the liquid resin is calculated.

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