JP2023173295A - Component mounting system - Google Patents

Abstract

To provide a component mounting system capable of loading a component at a loading target position on a substrate with a proper push-in amount.SOLUTION: In a printer 1, a pre-printing loading height H1 corresponding to a loading target position 61 in a component loading region 6 and a pre-printing reference height H2 corresponding to a reference position 64 out of the component loading region 6 are measured regarding a substrate 5 before the printing of a printing material 621. In a component mounting machine 2, a post-printing reference height H3 corresponding to the reference position 64 is measured regarding the substrate 5 after the printing of the printing material 621. In the component mounting machine 2, a mounting control unit 30 calculates a post-printing loading height H4 corresponding to the loading target position 61 in the substrate 5 after the printing of the printing material 621 based on the pre-printing loading height H1, the pre-printing reference height H2 and the post-printing reference height H3 and controls a component loading operation of a loading head 251 based on a calculation result.SELECTED DRAWING: Figure 6

Description

The present invention relates to a component mounting system that includes a component mounting machine that mounts components on a board.

2. Description of the Related Art Conventionally, component mounting systems have been known that include a component mounting machine that mounts electronic components (hereinafter simply referred to as "components") on a substrate such as a printed circuit board to produce a component mounting board. A component mounting machine in this type of component mounting system includes a mounting head that holds a component and mounts the held component onto a board. The mounting head performs a component mounting operation of mounting the held component onto a target mounting position on the substrate by moving downward to a preset height position.

If the board is deformed such as warping or tilting, the height position of the target mounting position on the top surface of the board may differ depending on the target mounting position. For example, when a component is placed by the mounting head in response to a mounting target position located at a height above the reference on the board, the component held by the mounting head that moves downward will move against the board. There is a risk of damage due to excessive pressure. Therefore, before the component mounting operation is performed, the height of the top surface of the board is measured, and based on the measurement result, the component mounting operation of the mounting head is controlled so that the component is mounted with the appropriate amount of push into the board. It has been proposed (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2016-111298

By the way, a printing material such as solder paste is printed on a board on which components are mounted in a component mounting machine. That is, in the component mounting machine, the mounting head mounts the component at the target mounting position on the board on which the printing material is printed. In this case, in order to mount the component with an appropriate push amount to the target mounting position on the board, it is necessary to It is necessary to control the loading operation. However, it is difficult to accurately measure the height of the upper surface of the mounting target position on the substrate where the printing material is located nearby. For this reason, it is difficult to mount the component with an appropriate pushing amount to the target mounting position on the board.

An object of the present invention is to provide a component mounting system that can mount a component with an appropriate pushing amount to a target mounting position on a board.

A component mounting system according to one aspect of the present invention includes a print head that prints printing material at a plurality of print target points within a component mounting area including a target mounting position indicating a target position for mounting a component on an upper surface of a board. The present invention includes a printing machine and a component mounting machine having a mounting head that performs a component mounting operation to mount a component at the target mounting position on the upper surface of the substrate after printing the printing material. The printing machine determines, on the upper surface of the substrate before printing the printing material by the print head, a pre-printing loading height indicating a height of the upper surface of the substrate at the target loading position within the component loading area, and a height outside the component loading area. The apparatus further includes a printing-side measuring unit that measures a pre-printing reference height indicating the height of the top surface of the substrate at a predetermined reference position. The component mounter includes a mounting side measurement unit that measures a post-printing reference height indicating the height of the top surface of the board at the reference position on the top surface of the board after printing the printing material; Based on the pre-printing reference height and the post-printing reference height, calculate a post-printing mounting height indicating the height of the top surface of the board at the mounting target position on the top surface of the substrate after printing the printing material, and The apparatus further includes a control unit that controls the component mounting operation of the mounting head based on the mounting height after printing.

According to this component mounting system, the mounting head in the component mounting machine mounts the component at the target mounting position on the board on which the printing material is printed in the printing machine. In the printing machine, the pre-printing mounting height corresponding to the mounting target position within the component mounting area and the pre-printing reference height corresponding to the reference position outside the component mounting area are measured on the printing side for the board before printing the printing material. Measured by unit. On the other hand, in the component mounting machine, the mounting-side measurement unit measures the post-printing reference height corresponding to the reference position outside the component mounting area for the board after printing the printing material. In the component mounting machine, the control unit determines the post-printing mounting height corresponding to the mounting target position of the printing material on the board after printing, based on the pre-printing mounting height, the pre-printing reference height, and the post-printing reference height. Then, the component mounting operation of the mounting head is controlled based on the post-printing mounting height.

The post-printing mounting height is the pre-printing mounting height and pre-printing reference height measured on the substrate before printing of the printing material, and the post-printing reference height measured on the substrate after printing of the printing material. Calculated based on. Therefore, the post-printing mounting height serves as an index that accurately indicates the height of the top surface of the substrate corresponding to the mounting target position on the substrate after printing the printing material. Therefore, by controlling the component mounting operation of the mounting head based on the mounting height after printing by the control unit, it is possible to mount the component with an appropriate pushing amount to the mounting target position on the board where the printing material is nearby. I can do it.

In the above component mounting system, the component mounter may further include a communication unit that acquires information regarding the pre-print mounting height and the pre-print reference height.

In this aspect, the pre-printing mounting height and the pre-printing reference height, which are used when the control unit calculates the post-printing mounting height in the component mounting machine, can be acquired by the communication unit.

In the above component mounting system, the control unit may calculate the post-print mounting height based on a difference between the pre-print mounting height and the pre-print reference height, and the post-print reference height. .

In this aspect, in the component mounting machine, the control unit calculates the difference between the pre-print mounting height measured on the board before printing the printing material and the pre-print reference height, and the difference measured on the board after printing the printing material. The mounting height after printing can be easily calculated based on the reference height after printing.

In the above component mounting system, the printing-side measurement unit is configured to set the pre-printing reference height at first reference positions located on both sides of the component mounting area on the upper surface of the substrate before printing the printing material. A first pre-printing reference height and a second pre-printing reference height, which respectively indicate the height of the upper surface of the substrate at the second reference position, may be measured. In this case, the mounting-side measurement unit indicates, as the post-printing reference height, heights of the top surface of the substrate at the first reference position and the second reference position on the top surface of the substrate after printing the printing material. The reference height after the first printing and the reference height after the second printing are measured. The control unit is configured to control the pre-printing mounting height, the first pre-printing reference height, the second pre-printing reference height, the first post-printing reference height, and the second post-printing reference height. Based on this, the post-printing mounting height on the upper surface of the substrate after printing of the printing material is calculated, and the component mounting operation of the mounting head is controlled based on the post-printing mounting height.

In this aspect, the printing-side measurement unit in the printing machine measures the pre-printing mounting height corresponding to the mounting target position within the component mounting area and the height of the pre-printing mounting height corresponding to the mounting target position within the component mounting area and the height of the substrate before printing the printing material, which is located on both sides of the component mounting area. A first pre-printing reference height and a second pre-printing reference height corresponding to the first reference position and the second reference position are measured. On the other hand, in the component mounting machine, the mounting side measuring unit measures the printed board after printing the printing material by measuring the first post-printing reference height corresponding to the first reference position and the second reference position located on both sides of the component mounting area. Measure the height and reference height after the second printing. In the component mounter, the control unit controls the mounting height based on the pre-printing mounting height, the first pre-printing reference height, the second pre-printing reference height, the first post-printing reference height, and the second post-printing reference height. Then, a post-printing mounting height corresponding to a mounting target position on the board after printing of the printing material is calculated, and the component mounting operation of the mounting head is controlled based on the post-printing mounting height.

The mounting height after printing is the mounting height before printing, the first reference height before printing, and the second reference height before printing, which are measured on the substrate before printing the printing material, and the mounting height after printing the substrate after printing the printing material. It is calculated based on the first post-printing reference height and the second post-printing reference height measured on the object. Therefore, the post-printing mounting height is an index that more accurately indicates the height of the top surface of the substrate corresponding to the mounting target position on the substrate after printing the printing material. Therefore, by controlling the component mounting operation of the mounting head based on the mounting height after printing by the control unit, the component can be mounted with a more appropriate pushing amount to the mounting target position on the board where the printing material is nearby. be able to.

In the above component mounting system, the printing-side measuring unit and the mounting-side measuring unit may be a laser length measuring device that irradiates the upper surface of the substrate with a laser beam. The mounting target position within the component mounting area on the top surface of the substrate is located between the two printing target points, and the interval between the two printing target points is set on the top surface of the substrate. It is smaller than the spot diameter of the spot formed by the laser beam.

If the distance between the two printing target points sandwiching the mounting target position in the component mounting area on the board is smaller than the spot diameter of the laser beam spot irradiated from the laser length measuring device, the printing material will not reach the printing target point. We believe that it is difficult to accurately measure the mounting height corresponding to the target mounting position using a laser length measuring device when the laser beam is printed, due to factors such as the presence of printing material on the optical path of the laser beam. It will be done. Therefore, for the board before printing the printing material, the mounting target position within the component mounting area and the reference position outside the component mounting area are measured by the printing side measurement unit, and for the board after printing the printing material, the mounting target position is measured by the printing side measuring unit. The position is not the measurement target of the mounting side measurement unit, but only the reference position is the measurement target. In this case, the post-printing mounting height corresponding to the mounting target position on the board after printing of the printing material is determined by the pre-printing mounting height and pre-printing reference height measured by the printing-side measurement unit and the mounting-side measurement unit. The height can be calculated based on the post-printing reference height.

As described above, according to the present invention, it is possible to provide a component mounting system that can mount a component with an appropriate pushing amount to a target mounting position on a board.

1 is a diagram schematically showing the configuration of a component mounting system according to an embodiment of the present invention. FIG. 2 is a plan view showing the configuration of a printing machine included in the component mounting system. FIG. 3 is a diagram illustrating processing performed by a print control unit of a printing press. FIG. 2 is a plan view showing the configuration of a component mounting machine provided in the component mounting system. FIG. 3 is an enlarged view showing the mounting head unit of the component mounting machine. FIG. 3 is a diagram illustrating processing performed by a mounting control unit of a component mounting machine. FIG. 7 is a diagram illustrating a modified example of processing performed by a printing control unit of a printing press. FIG. 7 is a diagram illustrating a modification of the processing performed by the mounting control unit of the component mounting machine.

Hereinafter, a component mounting system according to an embodiment of the present invention will be described based on the drawings. Note that the directional relationship will be described below using XY orthogonal coordinates that are orthogonal to each other on a horizontal plane. Further, the vertical up-down direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Y-axis direction.

[Overall configuration of component mounting system]
As shown in FIG. 1, a component mounting system 100 according to the present embodiment includes a printing machine 1 and a component mounting machine 2 connected in a line, and a management device MU. The management device MU is configured by, for example, a personal computer, and is connected to the printing machine 1 and the component mounting machine 2 so as to be capable of data communication. The management device MU receives information output from the printing machine 1 and transmits the received information to the component mounting machine 2.

Note that the component mounting system 100 does not need to include the management device MU. In this case, the printing machine 1 and the component mounting machine 2 are connected to enable data communication. Further, in the component mounting system 100, the number of component mounters 2 to be installed is not particularly limited, and one component mounter 2 may be installed, or two or more component mounters 2 may be installed. It's okay. In the component mounting system 100, a print inspection device is provided downstream of the printing machine 1, a coating device is provided downstream of the print inspection device, a coating inspection device is provided downstream of the coating device, and a mounting inspection device is provided downstream of the component mounter 2. , a reflow apparatus may be installed downstream of the mounting inspection apparatus, and a reflow inspection apparatus may be installed downstream of the reflow apparatus.

[About the printing machine]
The printing press 1 included in the component mounting system 100 will be described with reference to FIGS. 2 and 3. The printing machine 1 is a device that prints a printing material 621 at a plurality of printing target points 62 within the component mounting area 6 on the upper surface of the board 5 . The structure of the printing machine 1 is not particularly limited as long as it can print the printing material 621 on the printing target point 62 on the substrate 5. The printing machine 1 is, for example, a screen printing machine that prints the printing material 621 on the printing target points 62 on the substrate 5 using a mask in which printing pattern holes are formed. Note that illustration of the mask is omitted in FIGS. 2 and 3. The printing material 621 is for fixing the component to the printing target point 62 on the substrate 5, and includes, for example, a conductive paste such as solder paste. Further, if a coating device is installed downstream of the printing machine 1 and upstream of the component mounting machine 2, the coating device fixes the components in the component mounting area 6 on the board 5. Apply a coating material such as adhesive. The component mounting area 6 on the upper surface of the board 5 is an area surrounding a plurality of target mounting positions 61, and within the component mounting area 6, there are a plurality of target mounting positions 61, a plurality of printing target points 62, and a silk part 63. etc. are set. Each target mounting position 61 indicates a target position for mounting a component on the upper surface of the board 5. Print target points 62 are set so as to sandwich each mounting target position 61 . That is, each mounting target position 61 is located between two printing target points 62. The printing target point 62 indicates a position where the printing material 621 is printed, and is, for example, a land such as a copper foil to which a terminal electrode of a component is connected. The silk portion 63 is a portion formed by silk printing.

As shown in FIG. 2, the printing press 1 includes a main body frame 11, a conveyor 12, a print head unit 13, a print control unit 17, and a print communication unit 18.

The main body frame 11 is a structure in which various parts constituting the printing press 1 are arranged, and is formed into a substantially rectangular shape when viewed from above in the Z-axis direction. The conveyor 12 extends in the X-axis direction and is arranged on the main body frame 11. The conveyor 12 is a transport section that transports the substrate 5 in a transport direction along the X-axis direction. The substrate 5 is conveyed on the conveyor 12 and positioned at a predetermined working position (a printing position where the printing material 621 is printed on each printing target point 62 on the substrate 5). The conveyor 12 transports the substrate 5 so that the substrate 5 is positioned at the printing position.

The print head unit 13 is arranged on a moving frame 14 . The moving frame 14 extends in the X-axis direction and is supported by the main body frame 11 so as to be movable in the Y-axis direction. The moving frame 14 is moved in the Y-axis direction by the first drive mechanism 15. The first drive mechanism 15 includes, for example, a drive motor, a ball screw shaft extending in the Y-axis direction and connected to the drive motor, and a ball nut disposed on the moving frame 14 and screwed into the ball screw shaft. It consists of: The first drive mechanism 15 having such a configuration moves the movable frame 14 in the Y-axis direction by moving the ball nut back and forth along the ball screw shaft as the drive motor rotates the ball screw shaft.

The print head unit 13 is disposed on a movable frame 14 so as to be movable in the X-axis direction. That is, the print head unit 13 is movable in the Y-axis direction as the movable frame 14 moves, and is also movable in the X-axis direction along the movable frame 14. The print head unit 13 is moved along the moving frame 14 by a second drive mechanism 16 . Like the first drive mechanism 15, the second drive mechanism 16 includes, for example, a drive motor, a ball screw shaft extending in the X-axis direction and connected to the drive motor, and a ball screw shaft disposed in the print head unit 13 and connected to the drive motor. It includes a ball nut that is screwed into the shaft. The second drive mechanism 16 having such a configuration moves the print head unit 13 in the X-axis direction by moving the ball nut back and forth along the ball screw shaft as the drive motor rotates the ball screw shaft.

The print head unit 13 performs a printing operation of printing the printing material 621 on each print target point 62 by moving to each print target point 62 on the substrate 5 . The print head unit 13 includes a print head 131. The print head 131 has a squeegee 1311 provided at its tip side (lower part). The print head 131 supplies the print material 621 to the upper surface of a mask (not shown) placed above the substrate 5 by discharging the print material 621. The print head unit 13 moves so that the squeegee 1311 provided on the print head 131 slides on the top surface of the mask while the printing material 621 is supplied to the top surface of the mask. As a result, the printing material 621 supplied from the printing head 131 to the upper surface of the mask passes through the printing pattern holes of the mask and is printed at the printing target points 62 on the substrate 5. That is, in the print head unit 13, the print head 131 prints the print material 621 on the print target point 62 on the substrate 5 through the print pattern hole of the mask by discharging the print material 621. The print head 131 is movable in the Z-axis direction with respect to the frame of the print head unit 13. The printing head 131 is placed at a printing reference position located above the printing target point 62 on the substrate 5, and moves downward until the tip of the squeegee 1311 reaches a predetermined height position to remove the printing material. A printing operation is performed in which the printing material 621 is discharged and the printing material 621 is printed on the printing target point 62. After printing the printing material 621, the print head 131 moves upward toward the printing reference position.

A print side measurement unit 132 is attached to the print head unit 13 . As shown in FIG. 3, the printing side measuring unit 132 measures the pre-printing mounting height H1 and the pre-printing reference height H2 on the upper surface of the substrate 5 before the printing material 621 is printed by the print head 131. The pre-printing mounting height H1 indicates the substrate top surface height of the mounting target position 61 within the component mounting area 6 on the substrate 5 before printing of the printing material 621. The pre-printing mounting height H1 is the reference height of the printing head 131 when the printing head 131 is placed at the printing reference position such that the printing side measurement unit 132 is located above the mounting target position 61 on the substrate 5. This is a measured value indicating the distance along the Z-axis direction from the portion A1 to the mounting target position 61 on the board 5. The pre-printing reference height H2 indicates the substrate top surface height of a predetermined reference position 64 outside the component mounting area 6 on the substrate 5 before printing the printing material 621. The pre-printing reference height H2 is defined as the reference height portion of the printing head 131 when the printing head 131 is placed at the printing reference position such that the printing-side measurement unit 132 is located above the reference position 64 on the substrate 5. This is a measured value indicating the distance along the Z-axis direction from A1 to the reference position 64 on the substrate 5.

In this embodiment, the printing side measurement unit 132 is a laser length measuring device that measures the pre-print mounting height H1 and the pre-print reference height H2 by irradiating the upper surface of the substrate 5 with laser light LB. In this case, the printing side measuring unit 132 irradiates the upper surface of the substrate 5 with the laser beam LB and receives the reflected light from the upper surface of the substrate 5, thereby determining the pre-printing mounting height H1 and the pre-printing reference height. Measure H2.

The distance between the two printing target points 62 sandwiching the mounting target position 61 in the component mounting area 6 on the substrate 5 is the spot SP formed on the substrate 5 by the laser beam LB irradiated from the printing side measurement unit 132. smaller than the spot diameter. In this case, in a state where the printing material 621 is printed at the printing target point 62, the printing material 621 exists on the optical path of the laser beam LB, and the mounting height corresponding to the mounting target position 61 is measured by the printing side measurement unit. It is considered difficult to measure accurately using 132. Therefore, the printing side measurement unit 132 measures the target mounting position 61 within the component mounting area 6 and the reference position 64 outside the component mounting area 6 on the substrate 5 before printing the printing material 621.

The printing communication unit 18 transmits information regarding the pre-printing mounting height H1 and the pre-printing reference height H2 measured by the printing side measurement unit 132 to the component mounting machine 2.

The print control unit 17 is composed of a CPU (Central Processing Unit), a storage area such as an HDD (Hard Disk Drive) or flash memory that stores a control program, and a RAM (Random Access Memory) used as a work area for the CPU. ing. The print control unit 17 performs the height measurement process and print process shown in FIG. 3 by the CPU executing a control program stored in the HDD or flash memory.

The print control unit 17 performs a height measurement process when the print-side measurement unit 132 measures the pre-print mounting height H1 and the pre-print reference height H2. When the printing side measuring unit 132 measures the pre-printing mounting height H1, the printing control unit 17 moves the printing head unit 13 toward the mounting target position 61 in the component mounting area 6 on the substrate 5 before printing the printing material 621. The moving operation of the print head unit 13 is controlled so that the print head unit 13 moves. When the print head 131 is placed at the printing reference position such that the printing side measuring unit 132 is located above the mounting target position 61 on the substrate 5, the printing control unit 17 measures the pre-printing mounting height H1. The printing side measurement unit 132 is controlled to. Similarly, when the printing side measuring unit 132 measures the pre-printing reference height H2, the printing control unit 17 directs the printing head toward the reference position 64 outside the component mounting area 6 on the substrate 5 before printing the printing material 621. The moving operation of the print head unit 13 is controlled so that the unit 13 moves. When the print head 131 is placed at the printing reference position such that the printing side measuring unit 132 is located above the reference position 64 on the substrate 5, the printing control unit 17 measures the pre-printing reference height H2. Controls the printing side measurement unit 132.

The print control unit 17 performs printing processing when the print head 131 discharges the print material 621 and prints the print material 621 on the print target point 62 on the substrate 5 through the print pattern hole of the mask. Note that in FIG. 3, illustration of the mask is omitted. The print control unit 17 controls the movement operation of the print head unit 13 so that the print head unit 13 moves toward a print target point 62 within the component mounting area 6 on the substrate 5 before printing the print material 621. When the print head 131 is placed at a print reference position located above a mask (not shown) placed above the substrate 5, the print control unit 17 adjusts the tip of the squeegee 1311 based on the pre-print mounting height H1. The print head 131 is moved downward until it reaches a predetermined height position. When the tip of the squeegee 1311 reaches a predetermined height position, the print control unit 17 causes the print head 131 to eject the printing material 621 toward the mask, and controls the print head unit so that the squeegee 1311 slides on the top surface of the mask. Move 13. Thereby, the printing material 621 discharged from the print head 131 and supplied to the upper surface of the mask is printed on the printing target point 62 on the substrate 5 through the printing pattern hole of the mask. When the printing material 621 is printed on the printing target point 62 on the substrate 5, the printing control unit 17 moves the printing head 131 upward toward the printing reference position.

[About the component mounter]
The board 5 on which the printing material 621 has been printed in the printing machine 1 is carried into the component mounting machine 2. This component mounter 2 will be explained with reference to FIGS. 4 to 6. The component mounting machine 2 is a device that produces a component mounting board by mounting the component 7 at a mounting target position 61 within the component mounting area 6 on the upper surface of the board 5 after printing the printing material 621. Note that when a coating device is installed downstream of the printing machine 1, the component mounter 2 is installed on the board after printing the printing material 621 and after applying a coating material such as adhesive by the coating device. The component 7 is mounted at a target mounting position 61 within the component mounting area 6 on the upper surface of the board 5 to produce a component mounting board. As shown in FIG. 4, the component mounting machine 2 includes a main body frame 21, a conveyor 23, a component supply unit 24, a mounting head unit 25, a board support unit 28, a mounting control unit 30, and a mounting communication unit. 31.

The main body frame 21 is a structure in which each part constituting the component mounter 2 is arranged, and is formed into a substantially rectangular shape when viewed from above in the Z-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 conveys the substrate 5 after printing the printing material 621 in the X-axis direction. The board 5 transported on the conveyor 23 stops at a predetermined work position (component mounting position where the parts 7 are mounted on the board 5), and is positioned by the board support unit 28. The substrate support unit 28 positions the substrate 5 on the conveyor 23 by supporting the substrate 5 from below.

The component supply units 24 are arranged in respective regions of both ends of the main body frame 21 in the Y-axis direction, with the conveyor 23 interposed therebetween. The component supply unit 24 is an area in the main body frame 21 in which a plurality of feeders 24F are installed in parallel, and for each component 7 to be held by a mounting head 251 provided in a mounting head unit 25, which will be described later. The set position of each feeder 24F is divided. The feeder 24F is detachably attached to the component supply unit 24. The feeder 24F holds a plurality of parts 7 and supplies the held parts 7 to a predetermined parts supply position set within the feeder. The feeder 24F is not particularly limited in its parts supply method as long as it is configured to be able to supply the parts 7. Examples of the feeder 24F include a tape feeder that feeds the parts 7 using tape as a carrier, a tray feeder that feeds the parts 7 by moving a tray on which the parts 7 are placed, and a feeder that is stored in a cylindrical stick. It is possible to employ a stick feeder or the like that feeds the processed parts 7 while extruding them from the stick.

The mounting head unit 25 is held by a moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotationally driven by a Y-axis servo motor 263 are disposed on the main body frame 21 . The moving frame 27 is arranged on a fixed rail 261, and a nut portion 271 provided on the moving frame 27 is screwed onto a ball screw shaft 262. Further, the moving frame 27 is provided with a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274. The mounting head unit 25 is movably held by this guide member 272, and a nut portion provided on this mounting head unit 25 is screwed onto a ball screw shaft 273. The moving frame 27 is moved in the Y-axis direction by the operation of the Y-axis servo motor 263, and the mounting head unit 25 is moved in the X-axis direction with respect to the moving frame 27 by the operation of the X-axis servo motor 274. That is, the mounting head unit 25 is movable in the Y-axis direction as the movable frame 27 moves, and is also movable in the X-axis direction along the movable frame 27. The mounting head unit 25 is movable between the component supply unit 24 and the substrate 5 supported by the substrate support unit 28. The mounting head unit 25 executes a component mounting operation of mounting the component 7 on the board 5 by moving between the component supply unit 24 and the board 5 .

As shown in FIG. 5, the mounting head unit 25 includes a plurality of mounting heads 251. Each mounting head 251 has a holding nozzle 2511 attached to its tip (lower end). The holding nozzle 2511 holds the component 7 fed by the feeder 24F. The holding nozzle 2511 is a nozzle that can suck and hold the component 7 supplied by the feeder 24F. The holding nozzle 2511 performs a component suction operation to suction the component 7 . The holding nozzle 2511 is capable of communicating with either the negative pressure generator, the positive pressure generator, or the atmosphere via an electric switching valve. That is, by supplying negative pressure to the holding nozzle 2511, the holding nozzle 2511 can suck and hold the component 7, and then, by supplying positive pressure, the suction and holding of the component 7 is released. Each mounting head 251 performs a component mounting operation of mounting the component 7 sucked and held by the holding nozzle 2511 onto the board 5, corresponding to each of the plurality of target mounting positions 61 within the component mounting area 6 on the board 5. . Each mounting head 251 obtains a component mounting board by performing a component mounting operation on the board 5.

The mounting head 251 is movable in the Z-axis direction with respect to the frame of the mounting head unit 25. The mounting head 251 moves downward while being placed at a mounting reference position located above the mounting target position 61 on the substrate 5 after printing the printing material 621, thereby removing the component held by the holding nozzle 2511. 7 at the target mounting position 61 on the board 5. After mounting the component 7, the mounting head 251 moves upward toward the mounting reference position.

As shown in FIG. 4, a first imaging section 291 is installed on the main body frame 21 between the component supply unit 24 and the conveyor 23, and a second imaging section 292 is installed on the mounting head unit 25. The first imaging unit 291 and the second imaging unit 292 are imaging cameras equipped with imaging elements such as CMOS (complementary metal-oxide-semiconductor) and CCD (charged-coupled device). The first imaging unit 291 captures the component 7 held by the holding nozzle 2511 of the mounting head 251 while the mounting head unit 25 is moving from the component supply unit 24 toward the board 5 supported by the board support unit 28. is imaged from the lower side to obtain a component recognition image. The component recognition image is used to image recognize the posture of the component 7 held by the holding nozzle 2511, the amount of deviation of the holding position of the component 7 with respect to the holding nozzle 2511, and the like. In order to recognize various marks attached to the upper surface of the board 5 supported by the board support unit 28, the second imaging unit 292 scans the marks from above, before the mounting head 251 performs the component mounting operation. Take an image. By recognizing the marks on the substrate 5 by the second imaging unit 292, the amount of positional deviation of the substrate 5 with respect to the origin coordinates is detected.

Furthermore, a mounting side measurement unit 293 is attached to the mounting head unit 25 . As shown in FIG. 6, the mounting-side measurement unit 293 measures the post-printing reference height H3 on the upper surface of the substrate 5 after printing the printing material 621. The post-printing reference height H3 indicates the height of the top surface of the substrate at a predetermined reference position 64 outside the component mounting area 6 on the substrate 5 after printing the printing material 621. The post-printing reference height H3 is the reference height portion of the mounting head 251 when the mounting head 251 is placed at the mounting reference position such that the mounting side measurement unit 293 is located above the reference position 64 on the board 5. This is a measured value indicating the distance along the Z-axis direction from A2 to the reference position 64 on the substrate 5.

In this embodiment, the mounting side measurement unit 293 is a laser length measuring device that measures the reference height H3 after printing by irradiating the upper surface of the board 5 with laser light LB. In this case, the mounting side measurement unit 293 measures the post-printing reference height H3 by irradiating the upper surface of the substrate 5 with the laser beam LB and receiving the reflected light from the upper surface of the substrate 5.

As mentioned above, the distance between the two printing target points 62 sandwiching the mounting target position 61 in the component mounting area 6 on the board 5 is determined by the distance between the two printing target points 62 on the board 5 by the laser beam LB irradiated from the mounting side measuring unit 293. It is smaller than the spot diameter of the spot SP to be formed. In this case, in a state where the printing material 621 is printed at the printing target point 62, the mounting height corresponding to the mounting target position 61 is determined by the mounting side measurement unit because the printing material 621 exists on the optical path of the laser beam LB. It is considered difficult to measure accurately using H.293. Therefore, the mounting side measurement unit 293 measures only the reference position 64 outside the component mounting area 6 without measuring the mounting target position 61 within the component mounting area 6 on the board 5 after printing the printing material 621. Measurement target.

The mounting communication unit 31 receives and acquires information regarding the pre-print mounting height H1 and the pre-print reference height H2 transmitted from the printing communication unit 18 of the printing press 1.

The mounting control unit 30 includes a CPU, a storage area such as an HDD or flash memory that stores a control program, and a RAM used as a work area for the CPU. The mounting control unit 30 performs the height measurement process and component mounting process shown in FIG. 6 by the CPU executing a control program stored in the HDD or flash memory.

The mounting control unit 30 performs height measurement processing when the mounting side measurement unit 293 measures the post-printing reference height H3. When the mounting side measuring unit 293 measures the post-printing reference height H3, the mounting control unit 30 moves the mounting head unit 25 toward the reference position 64 outside the component mounting area 6 on the printed board 5 after printing the printing material 621. The moving operation of the mounting head unit 25 is controlled so that the mounting head unit 25 moves. When the mounting head 251 is placed at the mounting reference position such that the mounting side measurement unit 293 is located above the reference position 64 on the board 5, the mounting control unit 30 measures the reference height H3 after printing. Controls the mounting side measurement unit 293.

The mounting control unit 30 performs a component mounting process when the mounting head 251 mounts the component 7 on the mounting target position 61 on the board 5 . In this case, in order to mount the component 7 with an appropriate pushing amount to the mounting target position 61 on the board 5, it is necessary to Therefore, it is necessary to control the component mounting operation of the mounting head 251. However, it is difficult to accurately measure the height of the upper surface of the mounting target position 61 on the substrate 5 where the printing material 621 is located nearby. For example, the distance between two printing target points 62 sandwiching the mounting target position 61 in the component mounting area 6 on the board 5 is larger than the spot diameter of the spot SP of the laser beam LB irradiated from the mounting side measurement unit 293. If the printing material 621 is printed on the printing target point 62, if the printing material 621 is printed on the printing target point 62, the printing material 621 is present on the optical path of the irradiation optical path toward the substrate 5 of the laser beam LB and the optical path of the reflected optical path from the substrate 5. It is considered difficult to accurately measure the mounting height corresponding to the target position 61 using the mounting side measurement unit 293. Therefore, it is difficult to mount the component 7 on the target mounting position 61 on the board 5 with an appropriate pushing amount.

Therefore, the mounting control unit 30 uses the pre-printing mounting height H1 and the pre-printing reference height H2 acquired by the mounting communication unit 31 and the post-printing reference height H3 measured by the mounting side measurement unit 293. , calculate the mounting height H4 after printing. The post-printing mounting height H4 indicates the height of the board top surface of the mounting target position 61 within the component mounting area 6 on the board 5 after printing the printing material 621. The post-printing mounting height H4 is a calculated value indicating the distance along the Z-axis direction from the reference height portion A2 of the mounting head 251 to the mounting target position 61 on the substrate 5. The post-printing mounting height H4 corresponding to the mounting target position 61 on the board 5 after printing of the printing material 621 is determined by the pre-printing mounting height H1 and the pre-printing reference height H2 measured by the printing side measurement unit 132, and the mounting height H4. It can be calculated based on the post-printing reference height H3 measured by the side measurement unit 293.

Specifically, the mounting control unit 30 performs post-printing mounting based on the difference between the pre-printing mounting height H1 and the pre-printing reference height H2 and the post-printing reference height H3 according to the following formula (1). Calculate the height H4.
H4=H3-(H2-H1)...(1)

Thereby, the mounting control unit 30 calculates the difference between the pre-printing mounting height H1 and the pre-printing reference height H2 measured on the substrate 5 before printing the printing material 621 and the substrate after printing the printing material 621. The post-print mounting height H4 can be easily calculated based on the post-print reference height H3 measured for No. 5.

The post-printing mounting height H4 is the pre-printing mounting height H1 and pre-printing reference height H2 measured on the substrate 5 before printing the printing material 621, and the pre-printing reference height H2 measured on the substrate 5 after printing the printing material 621. It is calculated based on the measured post-printing reference height H3. Therefore, the post-printing mounting height H4 serves as an index that accurately indicates the height of the top surface of the substrate corresponding to the mounting target position 61 on the substrate 5 after printing the printing material 621.

When the post-printing mounting height H4 is calculated, the mounting control unit 30 controls the mounting head unit 25 to move toward the mounting target position 61 within the component mounting area 6 on the board 5 after printing the printing material 621. , controls the movement operation of the mounting head unit 25. When the mounting head 251 is placed at the mounting reference position such that the holding nozzle 2511 holding the component 7 is positioned above the mounting target position 61 on the board 5, the mounting control unit 30 adjusts the calculated mounting height after printing. The component mounting operation of the mounting head 251 is controlled based on H4, and the mounting head 251 is moved downward so that the component 7 held by the holding nozzle 2511 is mounted at the target mounting position 61 on the substrate 5. When the component 7 is mounted on the mounting target position 61 on the board 5, the mounting control unit 30 moves the mounting head 251 upward toward the mounting reference position.

The mounting control unit 30 controls the component mounting of the mounting head 251 based on the post-printing mounting height H4, which is an index that accurately indicates the height of the top surface of the board corresponding to the mounting target position 61 on the board 5 after printing the printing material 621. Control behavior. Thereby, the mounting head 251 can mount the component 7 by an appropriate pushing amount onto the mounting target position 61 on the substrate 5 where the printing material 621 is present nearby. This prevents the component 7 held by the mounting head 251 moving downward during the component mounting operation from being excessively pressed against the substrate 5 and being damaged.

Although the component mounting system 100 according to the embodiment of the present invention has been described above, the present invention is not limited to this, and for example, the following modified embodiments can be adopted.

In the above embodiment, the printing side measurement unit 132 in the printing machine 1 measures the pre-printing reference height H2 corresponding to one reference position 64 outside the component mounting area 6 on the board 5, and The configuration in which the mounting-side measuring unit 293 measures the reference height H3 after printing has been described. However, the configuration is not limited to this.

A modified embodiment will be described with reference to FIGS. 7 and 8. In the modified embodiment, as shown in FIG. 7, in the printing machine 1, the printing side measurement unit 132 measures the pre-printing position of the substrate 5 before printing the printing material 621 corresponding to the mounting target position 61 in the component mounting area 6. The mounting height H1 and a first pre-printing reference height H21 and a second pre-printing reference height H22 as the pre-printing reference height H2 are measured. The first pre-printing reference height H21 and the second pre-printing reference height H22 are a first reference position 641 and a second reference position located on both sides of the component mounting area 6 on the substrate 5 before printing of the printing material 621. The height of the top surface of the substrate at position 642 is shown. The first pre-printing reference height H21 indicates the height of the top surface of the substrate corresponding to the first reference position 641, and the second reference height H22 before printing indicates the height of the top surface of the substrate corresponding to the second reference position 642.

On the other hand, as shown in FIG. 8, the mounting side measurement unit 293 in the component mounting machine 2 measures the first post-printing reference height H31 as the post-printing reference height H3 and the printed board 5 after printing the printing material 621. After the second printing, the reference height H32 is measured. The first post-printing reference height H31 and the second post-printing reference height H32 are a first reference position 641 and a second reference position located on both sides of the component mounting area 6 on the substrate 5 after printing the printing material 621. The height of the top surface of the substrate at position 642 is shown. The first post-printing reference height H31 indicates the height of the top surface of the substrate corresponding to the first reference position 641, and the second reference height H32 after printing indicates the height of the top surface of the substrate corresponding to the second reference position 642.

Then, in the component mounter 2, the mounting control unit 30 determines the mounting height H1 before printing, the first reference height H21 before printing, and the second reference height H22 before printing, which are measured by the printing side measuring unit 132, and the mounting side Based on the first post-printing reference height H31 and the second post-printing reference height H32 measured by the measurement unit 293, the post-printing mounting height corresponding to the mounting target position 61 on the printed substrate 5 of the printing material 621 is determined. Calculate H4.

Specifically, the mounting control unit 30 sets the pre-printing mounting height H1, the first pre-printing reference height H21, the second pre-printing reference height H22, and the first post-printing reference height according to the following formula (2). Based on H31 and the second post-printing reference height H32, the post-printing mounting height H4 is calculated.
H4=H31+(H32-H31)×(H1-H21)/(H22-H21)
...(2)

The post-printing mounting height H4 is an index that more accurately indicates the height of the top surface of the substrate corresponding to the mounting target position 61 on the substrate 5 after printing the printing material 621.

Then, the mounting control unit 30 controls the component mounting operation of the mounting head 251 based on the calculated post-printing mounting height H4, and the component 7 held by the holding nozzle 2511 is mounted at the mounting target position 61 on the board 5. The mounting head 251 is moved downward so that the mounting head 251 is moved downward.

The mounting control unit 30 controls the component mounting of the mounting head 251 based on the post-printing mounting height H4, which is an index that accurately indicates the height of the top surface of the board corresponding to the mounting target position 61 on the board 5 after printing the printing material 621. Control behavior. Thereby, the mounting head 251 can mount the component 7 by an appropriate pushing amount onto the mounting target position 61 on the substrate 5 where the printing material 621 is present nearby.

1 Printing machine 13 Printing head unit 131 Printing head 132 Printing side measuring unit 2 Component mounting machine 25 Mounting head unit 251 Mounting head 293 Mounting side measuring unit 30 Mounting control unit 31 Mounting communication unit 5 Board 6 Component mounting area 61 Mounting target position 62 Printing target point 621 Printing material 64 Reference position 641 First reference position 642 Second reference position 7 Component 100 Component mounting system H1 Pre-printing mounting height H2 Pre-printing reference height H21 First pre-printing reference height H22 Second pre-printing Reference height H3 Reference height after printing H31 Reference height after first printing H32 Reference height after second printing H4 Mounting height after printing

Claims (5)

a printing machine having a print head that prints printing material at a plurality of printing target points within a component mounting area including a mounting target position indicating a target position for mounting a component on an upper surface of a substrate;
a component mounting machine having a component mounting head that performs a component mounting operation to mount a component at the target mounting position on the upper surface of the substrate after printing the printing material;
The printing machine includes:
On the upper surface of the substrate before printing the printing material by the print head, a pre-printing loading height indicating the height of the upper surface of the substrate at the target loading position within the component loading area, and a predetermined reference position outside the component loading area. further comprising a pre-printing reference height indicating the height of the top surface of the substrate, and a printing-side measuring unit for measuring the
The component mounting machine is
a mounting-side measurement unit that measures a post-printing reference height indicating a height of the upper surface of the substrate at the reference position on the upper surface of the substrate after printing the printing material;
Post-printing that indicates the height of the top surface of the substrate at the target mounting position on the top surface of the substrate after printing of the printing material, based on the pre-printing mounting height, the pre-printing reference height, and the post-printing reference height. A component mounting system further comprising: a control unit that calculates a mounting height and controls the component mounting operation of the mounting head based on the post-printing mounting height. The component mounting system according to claim 1, wherein the component mounter further includes a communication unit that acquires information regarding the pre-print mounting height and the pre-print reference height. The component mounting system according to claim 1, wherein the control unit calculates the post-print mounting height based on the difference between the pre-print mounting height and the pre-print reference height, and the post-print reference height. . The printing-side measurement unit determines the pre-printing reference height by measuring a substrate at a first reference position and a second reference position located on both sides of the substrate with the component mounting area in between, on the upper surface of the substrate before printing the printing material. Measuring a first pre-printing reference height and a second pre-printing reference height indicating the top surface height,
The mounting-side measuring unit is configured to perform a first printing that indicates, as the post-printing reference height, heights of the top surface of the substrate at the first reference position and the second reference position, respectively, on the top surface of the substrate after printing the printing material. Measuring the post-printing reference height and the second post-printing reference height;
The control unit is configured based on the pre-print mounting height, the first pre-print reference height, the second pre-print reference height, the first post-print reference height, and the second post-print reference height. According to claim 1, the post-printing mounting height on the upper surface of the substrate after printing of the printing material is calculated, and the component mounting operation of the mounting head is controlled based on the post-printing mounting height. The described component mounting system. The printing side measurement unit and the mounting side measurement unit are laser length measuring devices that irradiate the upper surface of the substrate with laser light,
The target mounting position within the component mounting area on the upper surface of the substrate is located between the two printing target points,
5. The component mounting system according to claim 1, wherein an interval between the two printing target points is smaller than a spot diameter of a spot formed by the laser beam on the upper surface of the substrate.

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