JP2023172598A - Motor compressor and manufacturing method of the same - Google Patents

Abstract

To provide a motor compressor which can avoid complexity in the manufacturing process and inhibit increase in the number of components to contribute to improvement in productivity and achieve size reduction while securing heat dissipating performance and aseismic performance of a circuit for driving an electric motor, and to provide a method for manufacturing the motor compressor.SOLUTION: A motor compressor 1 comprises: a housing 2 which contains a motor 3; a circuit board 8; and a filter circuit part 7 provided in a predetermined region of the circuit board 8. The circuit board 8 is assembled to the housing 2 so that the filter circuit part 7 is accommodated inside the housing 2. The filter circuit part 7 has: a filter circuit component 70 mounted on the circuit board 8; and an insulating resin part 73 which integrally fixes the filter circuit component 70 to the circuit board 8 by means of injection molding.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electric compressor in which an inverter circuit unit that supplies power to a motor and a filter circuit unit that absorbs high frequency components of switching current are installed in a casing in which the motor is housed, and a method for manufacturing the same.

BACKGROUND ART Conventionally, as an electric compressor used in an air conditioner for a vehicle, an inverter-integrated electric compressor has been used, in which an inverter circuit section and a filter circuit section are attached to a casing in which a motor is housed.

In the filter circuit section of an inverter-integrated electric compressor, various proposals have been made regarding cooling structures for electronic components (filter element components) and seismic reinforcement structures (for example, see Patent Documents 1 and 2).

In the electric compressor described in Patent Document 1, a metal plate is provided on a resin holder that holds a filter element, and an insulating potting resin for the metal plate is interposed between the metal plate and the housing. The heat generated from the resistor connected to the housing is radiated to the housing via the metal plate and the potting resin for the metal plate.

Furthermore, in the electric compressor described in Patent Document 2, the support member that accommodates the electrical components of the filter circuit section is cast, and the support member is filled with a thermosetting resin, so that the filter circuit board and the support member are cast. The members (electrical parts) are integrated, and the support member is fixed to the housing with bolts.

JP 2021-116787 Publication Japanese Patent Application Publication No. 2019-143606

However, for example, in the configuration described in Patent Document 1, the number of parts increases, the manufacturing process becomes complicated (complicated), and the cost of parts also increases. Further, in the configuration described in Patent Document 2, electronic components are molded in resin by casting, but it takes time to harden the thermosetting resin, so it is not suitable for mass production. As described above, in all conventional electric compressors, there is a limit to productivity improvement.

In view of these circumstances, the present invention aims to provide an electric compressor by ensuring the heat dissipation performance and seismic performance of the circuit that drives the electric motor, while avoiding the complication of the manufacturing process, and suppressing the increase in the number of parts. It is an object of the present invention to provide an electric compressor and a method for manufacturing the same that can not only improve productivity but also be downsized.

The present invention includes a housing in which a compression mechanism and a motor for driving the compression mechanism are built, a circuit board, and a filter circuit section provided in a predetermined area of the circuit board, and the filter circuit section is connected to the housing. The electric compressor has the circuit board assembled into the housing so as to be housed inside the electric compressor, and the filter circuit section includes a plurality of filter circuit parts mounted on the circuit board, and a plurality of filter circuit parts mounted on the circuit board, and a filter circuit part formed by injection molding. The present invention relates to an electric compressor characterized by having an insulating resin part that integrates a circuit component and the circuit board.

The present invention also includes a step of mounting a plurality of filter circuit components on a circuit board, and a step of interposing an insulating resin between the plurality of filter circuit components and the circuit board by injection molding to integrate the two. , a method for manufacturing an electric compressor, comprising the step of removably assembling the circuit board to a housing in which a compression mechanism and a motor for driving the compression mechanism are built.

According to the electric compressor of the present invention, the electric compressor can secure the heat dissipation performance and seismic performance of the circuit that drives the electric motor, avoid complicating the manufacturing process, and suppress the increase in the number of parts. In addition to improving productivity, it is possible to provide an electric compressor and a manufacturing method thereof that can realize downsizing, which is an excellent effect.

1 is a vertical cross-sectional view showing an outline of an electric compressor according to an embodiment of the present invention. FIG. 1 is a circuit block diagram of an electric compressor according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing an electric circuit section of the present embodiment. FIG. 2 is a diagram illustrating an inverter circuit section of the present embodiment, and includes (A) an external perspective view, (B) a schematic cross-sectional view taken along the line AA in (A), and (C) a schematic cross-sectional view of a power semiconductor element. FIG. 2 is an external perspective view illustrating a method of manufacturing an inverter circuit section according to the present embodiment. FIG. 3 is a schematic cross-sectional diagram illustrating a method of manufacturing an inverter circuit section according to the present embodiment. 2A and 2B are diagrams illustrating a method of manufacturing the filter circuit section of the present embodiment, and are (A) and (B) plan views, and (C) to (F) external perspective views. FIG. 2 is an external perspective view illustrating a method of assembling the electric circuit section of the present embodiment. FIG. 2 is an external perspective view illustrating a method of assembling the electric compressor of the present embodiment.

Embodiments of the present invention will be described below with reference to FIGS. 1 to 9. FIGS. 1 to 9 are examples of embodiments of the present invention, and in the drawings, parts given the same reference numerals represent the same configurations. Further, in each figure, some components are omitted as appropriate to simplify the drawings. Further, in each figure, the shapes and dimensions of some structures are appropriately exaggerated.

<Overall configuration of electric compressor>
With reference to FIG. 1, the overall configuration of an electric compressor 1 of this embodiment will be described. This figure is a vertical cross-sectional view showing an outline of the electric compressor 1 according to the present embodiment, and for convenience of explanation, only the main components are schematically shown.

The electric compressor 1 of this embodiment is a so-called inverter-integrated electric compressor, and constitutes a part of a refrigerant circuit of a vehicle air conditioner that air-conditions the interior of a vehicle (not shown). The electric compressor 1 includes a housing 2, a motor 3 built into the housing 2, a compression mechanism 5 driven by a rotating shaft 4 of the motor 3, an electric circuit section 9, and the like. The electric circuit section 9 has a function as an inverter, and specifically includes a circuit board (printed circuit board) 8, an inverter circuit section 6 for driving the motor 3, and a filter circuit for absorbing high frequency components of the switching current. 7, a motor control circuit section 16, and the like.

The case 2 includes, for example, a housing 21, a circuit housing section 22, and a lid member 25 that covers the circuit housing section 22. The housing 21 houses the motor 3, the rotating shaft 4, and the compression mechanism 5, and the circuit housing part 22 houses the electric circuit part 9 (the inverter circuit part 6, the filter circuit part 7, and the motor control circuit part 16). . The circuit housing section 22 has a first space 221 and a second space 222. The first space 221 is a space adjacent to the housing 21 via the partition wall 23 at one end in the axial direction of the rotating shaft 4 of the motor 3, and accommodates the inverter circuit section 6. The second space 222 is a space that protrudes outward in the stator radial direction of the motor 3 from the housing 21, and accommodates the filter circuit section 7. As will be described in detail later, in this embodiment, the inverter circuit section 6 and the filter circuit section 7 are configured on one circuit board 8, and the inverter circuit section 6 and the filter circuit section 7 are installed inside the housing 2 (circuit housing section 22). A circuit board 8 is removably assembled into the housing 2 so that the circuit board 8 is accommodated in the housing 2. The circuit accommodating portion 22 has an opening 24 on the opposite surface of the partition wall 23, and is closed by a lid member 25 so as to be openable and closable. Note that although the electric compressor 1 is shown in each figure in this embodiment with the circuit housing part 22 facing upward, in reality, as a vehicle air conditioner, it is placed horizontally so that the circuit housing part 22 is on one side. placed in the direction. In this embodiment, for convenience of explanation, the directions in the electric compressor 1 are defined as the circuit housing part 22 side is upward and the motor 3 side is downward, and the length of the motor 3 in each configuration in the axial direction is referred to as "height". do.

The motor 3 is composed of a three-phase synchronous motor (brushless DC motor), and the compression mechanism 5 is, for example, a scroll type compression mechanism. The compression mechanism 5 is driven by the rotating shaft 4 of the motor 3, compresses the refrigerant, and discharges it into the refrigerant circuit. A low-temperature gas refrigerant drawn from an evaporator (also referred to as a heat absorber), which also constitutes a part of the refrigerant circuit, flows through the housing 21 . Therefore, the inside of the housing 21 is cooled, and accordingly, the partition wall 23 forming a part of the lower part (bottom) 22B of the circuit housing part 22 is also cooled by the low-temperature gas refrigerant.

The base plate 56 of the inverter circuit section 6 is in close contact with the upper surface of the partition wall 23 (the bottom 22B of the circuit housing section 22 on the side of the first space 221) with a heat dissipating material (for example, heat dissipating grease) 101 interposed therebetween. The insulating resin portion 73 of the filter circuit portion 7 is in close contact with the upper surface of the bottom portion 22B of the circuit accommodating portion 22 on the second space 222 side with a heat dissipating material (for example, an insulating sheet) 102 interposed therebetween.

The circuit board 8 is fixed to the housing 2 (bottom portion 22B of the circuit housing portion 22) with bolts 85.

FIG. 2 is a circuit diagram schematically showing an electric circuit for controlling the motor drive of the electric compressor 1. As shown in FIG. The electric circuit section 9 includes a circuit board (not shown in FIG. 2), an inverter circuit section 6, and a filter circuit section 7. The inverter circuit section 6 includes a plurality of power semiconductor elements 63 (here, as an example, three sets of power semiconductor elements 63 in total) each consisting of a switching element (for example, an IGBT) 61 and a free wheel diode 62. Further, the filter circuit section 7 includes a filter circuit component 70. In this example, the filter circuit component 70 includes a smoothing capacitor 71 that smoothes the power supplied to the inverter circuit section 6, and a coil and a capacitor that constitute a noise filter 72.

Electric power from a power source 12 is supplied to the electric circuit section 9 via a high-power connector 13, and is supplied to the inverter circuit section 6 via a noise filter 72 and a smoothing capacitor 71.

Further, low voltage power is supplied from the vehicle air conditioning control device 18 to the motor control circuit section 16 via the control signal connector 19. The motor control circuit section 16 connects (mounts) circuit components such as a microcomputer to the circuit board 8 and controls switching of each power semiconductor element 63 of the inverter circuit section 6 based on an external command. The motor control circuit section 16 also has a function of transmitting the driving state of the motor 3 to the outside.

In the inverter circuit section 6, the direct current from the power source 12 is converted into pseudo three-phase alternating current, which is output from the electric circuit section 9. This output is supplied to each winding 3a of the motor 3 via the motor-side connection terminal 11, whereby the motor 3 is rotationally driven and compression by the compression mechanism 5 is performed.

<Electrical circuit section (inverter)>
FIG. 3 is a schematic diagram showing the electric circuit section 9 extracted from FIG. 1. As shown in FIG. The electric circuit section 9 is configured such that each electronic component constituting the inverter circuit section 6 and the filter circuit section 7 is mounted on a circuit board (printed board) 8 or electrically connected. In this embodiment, an inverter circuit section 6 and a filter circuit section 7 are provided on one circuit board 8. Specifically, electronic components constituting the motor control circuit section 16 are directly mounted (mounted) on the first surface Sf1 of the circuit board 8 and electrically connected. The inverter circuit section 6 is provided in the first region 81 of the second surface Sf2 of the circuit board 8, and the filter circuit section 7 is provided in the second region 82 of the same second surface Sf2. In the inverter circuit section 6, a power semiconductor element 63 constituting the inverter circuit section 6 is placed on a base plate 56 separate from the circuit board 8, and a terminal 63C of the power semiconductor element 63 is electrically connected to the circuit board 8. The filter circuit section 7 is electrically connected to the circuit board 8 by directly mounting (mounting) the noise filter 72 and the smoothing capacitor 71 on the circuit board 8 .

<Inverter circuit section>
The configuration of the inverter circuit section 6 will be explained with reference to FIG. 4. 4A and 4B are diagrams for explaining the inverter circuit section 6. FIG. 4A is a perspective view of the external appearance, FIG. ) is a schematic cross-sectional view of the power semiconductor element 63.

As shown in FIGS. 4(A) to 4(C), the inverter circuit unit 6 includes six power semiconductor elements 63 that constitute arms of each phase of a three-phase inverter circuit, and these are mounted integrally. The power semiconductor element 63 has a base plate 56 and an insulating resin part 67 that covers at least a portion of the power semiconductor element 63 and integrates the power semiconductor element 63 and the base plate 56.

As shown in FIG. 2C, each power semiconductor element 63 has a semiconductor chip 63S connected to a switching element (for example, IGBT) 61 and a freewheeling diode 62 (see FIG. 2) on one side of a heat sink 64. This is a molded power semiconductor element placed on the surface side and housed in one resin package 63P. The resin package 63P has a substantially rectangular parallelepiped outer shape, and in the following description, the two surfaces that are parallel (horizontal) to the base plate 56 when placed on the base plate 56 are referred to as the upper surface US and the lower surface DS of the power semiconductor element 63, The remaining four surfaces are referred to as side surfaces SS.

The three terminals 63C of the power semiconductor element 63 are led out from the side surface SS of the resin package 63P in a direction parallel to the heat sink 64, and are bent upward into a substantially L-shape in cross-sectional view. The other surface of the heat sink 64 is exposed on the lower surface DS of the resin package 63P. Note that this embodiment employs a conventionally known power semiconductor element 63, and the resin package 63P is provided with a fixing hole 63H that penetrates from the upper surface US to the lower surface DS. The fixing hole 63H is a hole that has conventionally been used as a screw insertion hole when screwing the power semiconductor element 63 to a circuit board or other board, and the heat sink 64 is also attached to the fixing hole 63H. It is correspondingly hollowed out in a circular shape.

The base plate 56 is, for example, a substantially rectangular flat plate made of a highly heat dissipating metal (for example, aluminum), and six power semiconductor elements 63 are mounted in two rows of three on one surface (mounting surface) Sf3. be placed. The terminals 63C of the power semiconductor elements 63 in each row are adjacent to each other approximately in the center of the base plate 56. The power semiconductor elements 63 for each row are integrated (molded) with the insulating resin portion 67 and also integrated with the base plate 56. More specifically, the insulating resin portion 67 is made of a resin material that can be injection molded, for example, and here, as an example, it is a thermoplastic resin material. In this embodiment, a set of three power semiconductor elements 63 is formed by injection molding (hot melt) of a thermoplastic resin material, and is integrated so as to cover at least a portion of the three power semiconductor elements 63 to form a power semiconductor element group 631, 632. At the same time, these are fixed to the base plate 56. Alternatively, the base plate 56 is fixed to the power semiconductor element groups 631, 632 (power semiconductor elements 63). In this case, "fixing" (fixing with a resin material) means that when the softened (or liquefied) resin hardens, it contacts (interposes) both the power semiconductor element 63 and the base plate 56 to integrate them. Say something. That is, at least four side surfaces SS of the power semiconductor element 63 are surrounded by resin that collectively constitutes the insulating resin portion 67, and the resin continues up to the base plate 56. In this embodiment, the three power semiconductor elements 63 constituting each of the power semiconductor element groups 631 and 632 are surrounded by resin that collectively constitutes the insulating resin part 67 at least four side surfaces SS of each other, and the resin is Although the power semiconductor elements 63 are continuous up to the base plate 56, the plurality of power semiconductor elements 63 do not need to be integrated. That is, any configuration is sufficient as long as at least one power semiconductor element 63 is integrated with the base plate 56.

Furthermore, as shown in FIG. 4B, a resin insulating sheet 69 (for example, a silicone resin sheet) is interposed between the power semiconductor element groups 631 and 632 and the base plate 56. The heat sink 64 exposed on the lower surface DS of the resin package 63P of each power semiconductor element 63 comes into contact with the resin insulation sheet 69, and through this, comes into close contact with the base plate 56, which has good flatness. In addition, a portion of the terminal 63C of each power semiconductor element 63 including the lead-out portion from the resin package 63P is covered with the insulating resin portion 67, but other portions including the tip portion are exposed from the insulating resin portion 67.

Further, as shown in FIG. 4(B) and FIG. 1, bolts for fixing the inverter circuit section 6 to the casing 2 are installed at multiple locations (four locations in this example) around the base plate 56. Bolt insertion holes 57 that can be inserted are provided, and sleeve components 65 that communicate with each bolt insertion hole 57 are erected. The sleeve component 65 is also integrated with the power semiconductor element 63 and the base plate 56 by an insulating resin portion 67. The sleeve component 65 is a cylindrical member made of metal (for example, aluminum), and it is preferable that the sleeve component 65 is a cylindrical member made of metal (for example, aluminum), and its surface is textured so that it has high adhesion to the insulating resin portion 67. Further, the heights (axial lengths) of the sleeve components 65 in the inverter circuit section 6 are the same, and they are arranged at a distance from each other around the base plate 56 (in this case, approximately at the four corners). The sleeve component 65 is arranged so that its axial direction is parallel to the direction of the rotating shaft 4 of the motor 3, and the height H1 of the sleeve component 65 is higher than the power semiconductor element group 631, 632 (or the resin package 63P of the power semiconductor element 63). ) is higher than the height H2.

In this embodiment, a plurality of power semiconductor elements 63, a base plate 56, and a sleeve component 65 are integrally fixed to each other by, for example, injection molding of thermoplastic resin to form a single electronic component (power semiconductor module). An inverter circuit section 6 is configured. Then, as shown in FIG. 3, the sleeve component 65 of the inverter circuit section 6 is electrically connected to the circuit board 8 while being in contact with the circuit board 8 so as to close the upper end (opening) thereof. As a result, the base plate 56 faces the circuit board 8 with the greatest distance therebetween, and the upper surface US of the semiconductor element 63 (the upper surface of the insulating resin part) is arranged so as to face the circuit board 8 without contacting (separated from) and in close proximity to it. Ru. The circuit board 8 is provided with a terminal insertion hole 83 at a position corresponding to the terminal 63C of the power semiconductor element 63. is led out to the first surface Sf1 side, and electrically connected to wiring (not shown) provided on the circuit board 8 by soldering or the like as appropriate.

As described above, according to the present embodiment, the plurality of power semiconductor elements 63 can be integrally fixed to the base plate 56 by molding using the insulating resin portion 67 (in this example, injection molding using a thermoplastic resin material). The base plate 56 is a flat metal plate with good flatness. The base plate 56 is placed on the partition wall 23 of the casing 2, which serves as a cooling surface, via a heat dissipating material (for example, heat dissipating grease) 101 (see FIG. 1). Injection molding has higher molding precision and better surface flatness (smoothness) than, for example, thermosetting resin casting.

In other words, by forming the insulating resin part 67 in close contact with the base plate 56 by injection molding of a thermoplastic resin material, the flatness between the heat sink 64 of the power semiconductor element 63, the base plate 56, and the partition wall 23 serving as a cooling surface can be improved. (Smoothness) is improved, and the precision of the parallel level to the cooling surface (partition wall 23) can be improved. Thereby, heat dissipation performance can be improved compared to the case of thermosetting resin.

However, it is complicated to adjust and manage the shape (flatness) of the insulating resin portion 67 by injection molding alone so as to satisfy the high insulation performance required as the voltage of electric vehicles increases. Therefore, in this embodiment, a resin insulating sheet 69 (for example, a silicone resin sheet) is placed between the power semiconductor element 63 and the base plate 56, and the power semiconductor element 63 is fixed to the base plate 56 by injection molding. As a result, the heat dissipation plate 64 of the power semiconductor element 63, the resin insulating sheet 69, and the Adhesion with the base plate 56 can be improved. The entire surface of the heat dissipating plate 64 is in close contact with the base plate 56 with the resin insulating sheet 69 interposed therebetween. This can improve insulation performance. In addition, since the contact area (heat radiation area) can be increased compared to the case of screw fastening, it is possible to further improve heat radiation performance and stabilize the heat radiation performance (variation) between devices. .

Further, in this example, the resin insulating sheet 69 is a rectangular sheet that follows the shape of the lower surface of the power semiconductor element groups 631 and 632 (see FIG. 5(A)). The lower opening is completely closed. Further, an insulating resin portion 67 (a resin material forming the same) is embedded inside the fixing hole portion 63H. That is, the resin insulating sheet 69 or the insulating resin part 67 is interposed between the lower opening of the fixing hole 63H and the base plate 56, so that the space is completely closed and insulated. Thereby, creeping discharge between them can be suppressed (avoided) and insulation performance can be improved.

Further, the screw fastening structure using the fixing hole 63H, which has been conventionally employed as a means for fixing the power semiconductor element (switching element) to the installation plate, is no longer necessary.

Conventionally, due to the presence of screws inserted into the fixing holes 63H, a predetermined insulation performance can be achieved between the heat sink of the power semiconductor element (switching element) and the installation plate (or housing) to which the screws are fastened. It is necessary to secure the creepage distance, which causes problems such as an increase in the number of parts and an impediment to miniaturization of the device. Specifically, it is necessary to insert a resin coating material between the switching element and the screw, and also to insert a resin coating material between the switching element and the screw. etc.) were necessary. In addition, with the recent increase in the voltage of electric vehicles, conventional screw fastening structures have had the problem of not being able to secure desired insulation performance due to the close proximity of the screws and switching elements. Furthermore, since gaps are created between the switching element and the resin-covered screw, or in the counterbore, thermal resistance tends to increase, and there is a limit to the improvement of heat dissipation.

In this embodiment, since the screw fastening structure is not required, the insulation performance can be improved as described above, and the number of parts related to the screw fastening structure can be reduced. Moreover, unnecessary gaps due to the screw fastening structure are not generated, thermal resistance is suppressed, and heat dissipation performance can be improved.

Further, the base plate 56 is provided with a bolt insertion hole 57 into which a bolt can be inserted, but no thread groove is formed therein. In other words, it is not necessary to ensure a plate thickness that allows the formation of thread grooves in the base plate 56, which contributes to miniaturization (thinning) of the inverter circuit section 6 and, by extension, miniaturization of the electric compressor 1. Further, the number of parts related to the screw fastening structure can be reduced, and the cost of the electric compressor 1 can thereby be reduced.

In addition, resin injection molding makes it possible to optimize the usage cost of the insulating resin portion 67 for locations that require insulation, which also allows the electric compressor 1 to be made lighter and less costly.

<Manufacturing method of inverter circuit section>
An example of a method for manufacturing the inverter circuit section 6 will be described with reference to FIGS. 5 and 6. 5(A) to 5(D) are external perspective views showing an example of a method for manufacturing the inverter circuit section 6, and FIGS. 6(A) to 6(C) show the power semiconductor element 63 portion extracted. FIG.

First, as shown in FIG. 5(A), a resin insulating sheet 69 is placed in a predetermined area of the mounting surface Sf3 of the base plate 56, and a plurality of (six in this case) power semiconductor elements 63 are placed on it. They are placed in two rows as one set (FIG. 5(B)). Then, an insulating resin part 67 that integrates the three power semiconductor elements 63 and the base plate 56 is formed, for example, by injection molding of a thermoplastic resin material. Each of the three power semiconductor elements 63 (power semiconductor element groups 631, 632) in each row is surrounded by a resin that collectively constitutes the insulating resin part 67 at four side surfaces SS, and the resin continues up to the base plate 56, Thereby, the three power semiconductor elements 63 are fixed to the base plate 56 as a power semiconductor element group 631, 632. A portion of the terminal 63C of the power semiconductor element 63 including the tip is exposed from the insulating resin portion 67 (FIG. 5(C)). Further, the sleeve component 65 is also integrated with the power semiconductor element 63 and the base plate 56 by the insulating resin portion 67 . In the power semiconductor element 63, an insulating resin portion 67 is also embedded inside the fixing hole 63H (see FIG. 6(A)).

The inverter circuit section 6 manufactured in this way is connected to the circuit board 8. That is, as shown in FIG. 5(D), the mounting surface Sf3 of the base plate 56 is opposed to the second surface Sf2 of the circuit board 8. Here, the inverter circuit section 6 has a positioning and fixing means 68 for fixing itself to a predetermined position of the circuit board 8 (second region 82 of the second surface Sf2). As shown in FIGS. 5(C) and 6(A), the positioning and fixing means 68 is integrally molded with the insulating resin part 67, and extends from, for example, a truncated conical pedestal part 681 provided on the upper surface of the insulating resin part 67. It has a shape in which a cylindrical locking portion 682 projects upward. The height H3 from the mounting surface Sf3 of the base plate 56 to the tip end 683 in the protruding direction is set higher than the height H1 of the sleeve component 65. In this example, one positioning and fixing means 68 is provided for each power semiconductor element group 631, 632 (two in total). Further, a positioning hole 88 is provided at a predetermined position of the circuit board 8, through which the locking portion 682 of the positioning and fixing means 68 can be inserted (FIG. 5(D), FIG. 6(A)).

Then, as shown in FIG. 6(B), the locking part 682 of the positioning and fixing means 68 is inserted into the positioning hole 88 of the circuit board 8, and the upper end of the sleeve component 65 is inserted into the second surface of the circuit board 8. When brought into contact with Sf2, the inverter circuit section 6 is positioned at a predetermined position on the circuit board 8. That is, as shown in FIG. 6(B), the tip portion 683 of the positioning and fixing means 68 protrudes from the positioning hole 88 of the circuit board 8 toward the first surface Sf1, and each terminal 63C of the power semiconductor element 63 is connected to the circuit board 8. is inserted into the terminal insertion hole 83, and its tip protrudes toward the first surface Sf1 side.

In the example of this embodiment, six power semiconductor elements 63 are used and the number of terminals 63C is 18, but the two positioning and fixing means 68 are used to connect the 18 terminals 63C to the corresponding terminal insertion holes 83. This improves alignment accuracy and makes assembly work more efficient.

The circuit board 8 also has a bolt insertion hole 84 through which a bolt 85 (see FIGS. 6(C) and 5(D)) can be inserted to fix the circuit board 8 to the housing 2 (partition wall 23) in a later process. have. This bolt 85 is also inserted through the sleeve component 65 of the inverter circuit section 6 and fastened to the housing 2. By inserting the tip end 683 of the positioning fixing means 68 into the positioning hole 88, the bolt insertion hole is inserted. 84 and sleeve component 65 are also positioned and can communicate with each other.

Then, as shown in FIG. 6C, the tip portion 683 of the positioning and fixing means 68 protruding from the first surface Sf1 of the circuit board 8 is fixed to the circuit board 8 by heat caulking. In this state (with the upper end of the sleeve component 65 in contact with the second surface Sf2 of the circuit board 8), the wiring (not shown) provided on the circuit board 8 and the Each terminal 63C) led out to the first surface Sf1 side is electrically connected, for example, by soldering. At this time, the 18 terminals 63C can be soldered using the sleeve component 65 as a pedestal, so the assembly work can be performed efficiently. In addition, other electrical connections are made as appropriate, and the inverter circuit section 6 is manufactured.

Thereafter, the circuit board 8 connected to the inverter circuit section 6 is housed in the circuit housing section 22 of the casing 2 . Specifically, as shown in FIG. 6(C) and FIG. The inverter circuit section 6 is housed in the circuit housing section 22 so that the inverter circuit section 6 is in close contact with the bottom section 22B (partition wall 23). The heat dissipation material 101 is, for example, heat dissipation grease. Then, from the first surface Sf1 side of the circuit board 8, the bolt 85 is inserted into the bolt insertion hole 84 and the sleeve component 65, and fastened to the thread groove 26 formed in the casing 2 (partition wall 23), and fixed. do. In this way, the inverter circuit section 6 including the circuit board 8 is removably fixed to the housing 2.

In this embodiment, since the inverter circuit section 6 including the circuit board 8 is removably fixed to the housing 2 by bolts 85, for example, a part of the housing 2 may be cast to directly mold the electronic components of the inverter circuit section. Compared to a configuration in which the inverter circuit section 6 is fixed to the housing (resin molded), the inverter circuit section 6 can be easily removed from the circuit board 8, improving maintainability in the event that an electronic component breaks down.

Furthermore, in this embodiment, the second surface Sf2 of the circuit board 8 is brought into contact with the upper end of the sleeve component 65 provided around the base plate 56, that is, the circuit board 8 is supported by the base plate 56 and the sleeve component 65. In this state, the terminal 63C of the power semiconductor element 63 and the wiring of the circuit board 8 are connected (soldered). After the manufacture of the inverter circuit section 6, particularly the soldering of the circuit board 8 and the terminals 63C, is completed in advance (on a sub-line), the inverter circuit section 6 is housed in the casing 2 and connected. Preheating is required when soldering the circuit board 8 and the terminals 63C. At this time, if the soldering process is performed after the inverter circuit unit 6 and the circuit board 8 are housed in the housing 2 (circuit housing unit 22), the entire electric compressor 1 including the motor 3 must be preheated. Otherwise, workability will deteriorate. In this embodiment, since the base plate 56 and the sleeve component 65 serve as a pedestal for supporting the circuit board 8, the inverter circuit section 6 and the circuit board 8 can be soldered before being housed in the housing 2, and preheating is not required. Workability is improved because only a minimum range is required.

Further, since the circuit board 8 is supported by the four sleeve parts 65, the circuit board 8 can be maintained horizontally with respect to the base plate 56. The base plate 56 is a flat metal plate, and is placed on the circuit housing portion 22 (partition wall 23). That is, when the circuit board 8 is housed in the circuit housing part 22, the circuit board 8 is maintained horizontally with respect to the partition wall 23 as a result. Therefore, the ease of assembly when fastening the circuit board 8 and the casing 2 using the bolts 85 is improved, work efficiency is improved, and variations in the assembly state between the electric compressors 1 can be avoided.

Further, in this embodiment, the circuit board 8 and the sleeve component 65 are not directly fixed, and the inverter circuit section 6 (base plate 56) is fixed to the circuit board 8 by soldering the terminals 63C and thermally caulking the positioning and fixing means 68. It is fixed (connected) to. The upper surface of the insulating resin part 67 and the circuit board 8 are spaced apart, and the inverter circuit part 6 hangs down from the circuit board 8. Therefore, when supporting the inverter circuit part 6 only by soldering the terminals 63C, A load is applied to the connected part. In this embodiment, since the inverter circuit section 6 can also be supported by the positioning and fixing means 68, the load on the connection portion of the terminal 63C can be reduced.

Further, the tip portion 683 of the positioning and fixing means 68 must be thermally caulked while holding the circuit board 8. Therefore, in this embodiment, the tip portion 683 is thermally caulked before the terminal 63C is soldered to reduce the load on the connection portion of the terminal 63C.

Further, as shown in FIG. 6(C), the circuit board 8 is fixed to the housing 2 (partition wall 23) with bolts 85. The bolt 85 is fastened to a threaded groove 26 provided in the housing 2, and the bolt 85 is only inserted through the bolt insertion hole 84 of the circuit board 8 and the sleeve component 65. In other words, the base plate 56 does not require a screw groove, and the base plate 56 is a minimum board that can support the plurality of power semiconductor elements 63 and provide flatness at the interface with the power semiconductor elements 63 and the interface with the partition wall 23. Since the thickness may be increased, the size of the circuit housing portion 22 in the height direction can be reduced compared to, for example, a configuration in which the power semiconductor element 63 is fixed to the base plate 56 by screwing.

Furthermore, compared to a configuration in which a part of the casing 2 is used as a casting mold and the inverter circuit section is directly resin-molded onto the casing 2, the degree of freedom in the layout of the inverter circuit section 6 can be increased, and the casing It is also possible to reduce the size of the body 2 and thereby the weight of the electric compressor 1.

Note that the insulating resin part 67 may be one that integrates a plurality of (three) power semiconductor elements 63 and fixes them to the base plate 56, and as shown in FIG. 6(C), the power semiconductor elements 63 A part of the power semiconductor element 63 may be exposed, or the power semiconductor element 63 may be entirely covered with the insulating resin part 67 except for a part of the terminal 63C.
Further, the insulating resin portion 67 of the inverter circuit portion 6 may be made of thermosetting resin.

<Filter circuit section>
Next, the filter circuit section 7 will be explained with reference to FIG. 3 again. The filter circuit section 7 includes a filter circuit component 70 mounted on a predetermined region of the circuit board 8 (second region 82 on the second surface Sf2 of the circuit board 8), and a circuit between the filter circuit component 70 and the circuit by injection molding. It has an insulating resin part 73 that integrates the substrate 8. The insulating resin section 73 of the filter circuit section 7 is made of thermoplastic resin material.

Filter circuit component 70 includes a smoothing capacitor 71, a noise filter 72, and a coil (not shown in FIG. 3). These filter circuit components 70 are larger, heavier, and higher in height from the board mounting surface than the electronic components that make up the motor control circuit section 16 and the inverter circuit section 6, and are susceptible to engine vibrations and compressor vibrations. Easily affected by its own vibrations. For this reason, the filter circuit components 70 are collectively mounted in the second area 82 of the circuit board 8. Further, in order to strengthen the filter circuit components 70 against earthquakes, they are integrally covered with an insulating resin portion 73 and fixed to the circuit board 8. “Fixing” (fixing with resin material) in this case is also the same as in the case of the inverter circuit section 6. That is, when the softened resin hardens, it contacts (interposes) both the filter circuit components 70 and the circuit board 8 to integrate them. In other words, the filter circuit component 70 includes the smoothing capacitor 71, the noise filter 72, and the coil, which are arranged in a concentrated manner, and at least the outer periphery of the filter circuit component 70 is surrounded by resin that collectively constitutes the insulating resin portion 73. continues up to the circuit board 8. Furthermore, the filter circuit part 7 is made of insulating resin without exposing the filter circuit component 70 even at the end farthest from the circuit board 8 (distal end) in the vertical direction (extending direction of the rotating shaft 4 of the motor 3). 73. That is, the lower surface of the filter circuit portion 7 is the bottom portion 73B of the insulating resin portion 73.

The insulating resin part 73 is, for example, a resin material that can be injection molded, and here, as an example, it is a thermoplastic resin material. In this embodiment, the filter circuit component 70 is integrally covered (molded) by injection molding (hot melt) of a thermoplastic resin material, and it is fixed to the circuit board 8 (or the circuit board 8 (fixed to the filter circuit component 70) to constitute the filter circuit section 7. Each of the filter circuit components 70 is electrically connected to wiring (not shown) provided on the circuit board 8 as appropriate. This constitutes the filter circuit section 7.

The filter circuit section 7 has a sleeve component 75 through which a bolt 85 for fixing the circuit board 8 to the housing 2 passes, as shown in FIGS. 3 and 1. The sleeve component 75 is also integrated with the filter circuit component 70 and the circuit board 8 by injection molding of the insulating resin portion 73. The sleeve component 75 is a cylindrical member made of metal (for example, aluminum), and it is preferable that the sleeve component 75 is a cylindrical member made of metal (for example, aluminum), and its surface is textured so that it has high adhesion to the insulating resin portion 73. The sleeve component 75 is exposed and open at the upper and lower surfaces of the insulating resin portion 73. A bolt insertion hole 86 communicating with the internal space of the sleeve component 75 is provided at a position of the circuit board 8 corresponding to the sleeve component 75 .

Referring to FIG. 1, filter circuit portion 7 is housed in circuit housing portion 22 such that its bottom (bottom portion 73B of insulating resin portion 73) faces circuit housing portion 22 (see FIG. 1). A heat dissipation material 102 (a sheet having heat dissipation properties) is disposed between the bottom portion 73B of the insulating resin portion 73 and the circuit housing portion 22. The heat dissipation material 102 is, for example, a silicone resin sheet. In the filter circuit section 7, the bottom part (distal end) farthest from the circuit board 8 is covered with an insulating resin part 73, and the distal end is connected to the casing 2 (bottom part 22B of the circuit housing part 22) through the heat dissipation material 102. ) and serves as a heat dissipation surface. The heat dissipation surface has a large contact area with the inside of the circuit accommodating portion 22, and it is desirable that the adhesiveness is high because better heat dissipation characteristics can be obtained. Since the insulating resin part 73 of this embodiment is formed by injection molding, the flatness (smoothness) of the heat dissipation surface (bottom part 73B of the insulating resin part 73) is better than, for example, molding by thermoplastic resin casting. In addition, the accuracy of the parallel (horizontal) level between the bottom portion 73B and the bottom portion 22B of the circuit board 8 or the circuit housing portion 22 is improved. Therefore, the adhesion with the bottom portion 22B of the circuit accommodating portion 22 through the heat dissipating material 102 is increased, and the uniformity of contact is also increased, so that heat dissipation can be further improved.

Furthermore, since variations in the gap between the casing 2 (bottom 22B of the circuit housing section 22) and the bottom 73B of the insulating resin section 73 are suppressed, the thickness of the heat dissipation material (heat dissipation sheet) placed between the two can be reduced. It becomes possible to make it thinner. In other words, even if the thickness of the heat dissipation material (heat dissipation sheet) is reduced, the adhesion is enhanced, the heat dissipation performance can be improved (or maintained), and the device can be made smaller. When a silicone resin sheet, for example, is used as the heat dissipation sheet, the thickness can be reduced, and thus cost reduction can also be achieved.

Furthermore, as shown in FIG. 1, a guide portion 76 is formed at the edge of the insulating resin portion 73. The guide portion 76 secures the insulation distance between the power source side connecting terminal 31 and the filter circuit portion 7 while regulating the positional shift when the power source side connecting terminal 31 is electrically connected to the circuit board 8 .

<Manufacturing method of filter circuit section>
An example of a method for manufacturing the filter circuit section 7 will be described with reference to FIG. 7 and continued to FIG. 3. FIG. 7 is a diagram of the circuit board 8 viewed from the second surface Sf2 side, and FIGS. 7(A) and 7(B) are a plan view of the second surface Sf2 viewed from below, and FIG. ), (D) is a perspective view of the second surface Sf2 viewed from below, and (E) and (F) are perspective views in the direction of arrow V in (D). . 7(A) and 7(C) show the state before the insulating resin part 73 is formed, and FIGS. 7(B), 7(D) to 7(F) show the state after the insulating resin part 73 is formed. It is. Moreover, FIG. 7(E) is a diagram showing the vicinity of the guide part 76, and FIG. 7(F) is a diagram showing the vicinity of the guide part 76 in a state where the power supply side connection terminal 31 is attached.

First, as shown in FIGS. 7A and 7C, the filter circuit component 70 is mounted on the second region 82 of the second surface Sf2 of the circuit board 8. The filter circuit component 70 here includes at least a smoothing capacitor 71 and a capacitor 721 and coils 722 and 723 that constitute a noise filter 72. A terminal insertion hole 80 (see FIG. 3) through which the terminal 70C of the smoothing capacitor 71 and the noise filter 72 can be inserted is provided at a predetermined position of the circuit board 8. and is led out to the first surface Sf1 side of the circuit board 8. It is electrically connected to the wiring of the circuit board 8 by soldering or the like as appropriate.

Then, the sleeve component 75 is placed at a predetermined position around the filter circuit component 70. The sleeve component 75 is arranged at a position where its internal space communicates with a bolt insertion hole 86 provided in the circuit board 8 (FIG. 3). Then, an insulating resin portion 73 that integrates the filter circuit component 70 (smoothing capacitor 71 and noise filter 72), sleeve component 75, and circuit board 8 is formed by injection molding (hot melt) of thermoplastic resin (see FIG. 7). B), Figure 7(D)). The insulating resin portion 73 is formed into a case shape, and the filter circuit component 70 is accommodated therein. Furthermore, if there is a gap between the filter circuit components 70, the resin constituting the insulating resin portion 73 is also embedded in the gap, and the filter circuit components 70 are integrated. The insulating resin portion 73 also comes into contact with the circuit board 8, and the filter circuit component 70 is sealed by the circuit board and the insulating resin portion 73. At the same time, the sleeve component 75 is held by the insulating resin portion 73 around the filter circuit component 70 and is integrally fixed with the filter circuit component 70 and the circuit board 8. Further, as shown in FIGS. 7(E) and 7(F), a guide portion 76 is formed by recessing a portion of the periphery of the insulating resin portion 73 inward.

Then, the circuit board 8 provided with the filter circuit section 7 is housed in the circuit housing section 22 of the housing 2 . Specifically, as shown in FIG. 1, a heat dissipating material 102 is placed on the bottom 22B of the circuit housing section 22, so that the bottom 73B of the insulating resin section 73 comes into close contact with the bottom 22B via the heat dissipating material 102. The filter circuit section 7 is housed in the circuit housing section 22 . Then, the bolt 85 is inserted into the bolt insertion hole 86 and the sleeve component 75 from the first surface Sf1 side of the circuit board 8, and is fastened to the thread groove 26 provided in the casing 2 and fixed. In this way, the filter circuit section 7 including the circuit board 8 is removably fixed to the housing 2. Further, the power supply side connection terminal 31 connected to the high power connector 13 is inserted into the connection terminal insertion hole 87 of the circuit board 8 along the guide portion 76 while ensuring an insulation distance from the filter circuit portion 7 .

Conventionally, when fixing the filter circuit component 70 to a circuit board by casting thermosetting resin (epoxy resin), thermosetting takes time, and there is a limit to productivity improvement. In this embodiment, an insulating resin part 73 that integrally covers the filter circuit component 70 and is fixed to the circuit board 8 is formed by injection molding of a thermoplastic resin material. As a result, compared to resin molding by casting, molding can be performed in a shorter time and productivity is improved.

Moreover, since the bolt 85 is inserted into the sleeve component 75 integrally molded with the insulating resin part 73 and fixed to the housing 2, the vibration suppressing power of the insulating resin part 73 is increased, and the earthquake resistance can be improved. Furthermore, since the sleeve component 75 is integrally molded, heat dissipation is improved. Note that if there is no problem with earthquake resistance, the sleeve component 75 may not be provided integrally. That is, instead of inserting the bolt 85 into the sleeve component 75 and fastening it to the housing 2, the circuit board 8 may be directly fastened to the housing 2 with the bolt 85.

<Manufacturing method of electric compressor>
With reference to FIGS. 8 and 9, a method for manufacturing the electric compressor 1, particularly a method for assembling the electric circuit section 9 in the electric compressor 1, and a method for attaching the electric circuit section 9 to the housing 2 will be described. FIG. 8 is a perspective view illustrating a method of assembling the electric circuit section 9, and FIG. 9 is a perspective view illustrating a method of attaching the electric circuit section 9 to the housing 2. The details of the inverter circuit section 6 and the filter circuit section 7 are as described above, and a description of some of the overlapping parts will be omitted below.

As described above, in this embodiment, the inverter circuit section 6, the motor control circuit section 16, and the filter circuit section 7 are mounted on one circuit board 8, or electrically connected to each other to form an electric circuit section (inverter module) 9. is configured.

First, the filter circuit component 70 is mounted on the second region 82 of the second surface Sf2 of the circuit board 8, as shown in FIG. 8(A). Each terminal 70C of the filter circuit component 70 is led out to the first surface Sf1 side through a terminal insertion hole 80 provided in the circuit board 8, and connected to wiring (not shown) provided in the circuit board 8 by soldering, etc. make an electrical connection. Thereafter, the filter circuit component 70 is integrally covered by injection molding of an insulating resin portion (thermoplastic resin material) 73 and integrated with the circuit board 8 . Filter circuit component 70 is sealed with insulating resin portion 73 and circuit board 8 . At the same time, the sleeve component 75 is also integrated with the filter circuit component 70 and the circuit board 8 by the insulating resin portion 73, and a guide portion 76 is formed. Further, on the first surface Sf1 of the circuit board 8, predetermined electronic components such as the motor control circuit section 16 are mounted.

Thereafter, the inverter circuit section 6 separately manufactured by the method described above is fixed to the first region 81 of the second surface Sf2 of the circuit board 8. That is, the mounting surface Sf3 of the base plate 56 is opposed to the second surface Sf2 of the circuit board 8, and while inserting the tip portions 683 of the positioning and fixing means 68 at two locations into the positioning holes 88 of the circuit board 8, the sleeve component is inserted. 65 is brought into contact with the second surface Sf2 of the circuit board 8. As a result, the 18 terminals 63C of the six power semiconductor elements 63 are accurately aligned with the corresponding terminal insertion holes 83, and are inserted into the first surface Sf1 through the terminal insertion holes 83 provided in the circuit board 8. derived to the side. Furthermore, the bolt insertion holes 84 provided in the circuit board 8 and the sleeve component 65 of the inverter circuit section 6 are also aligned with high precision. Thereafter, the tip portion 683 of the positioning and fixing means 68 is heat caulked on the first surface Sf1 of the circuit board 8 and fixed to the circuit board 8 (FIG. 8(B)).
.

Then, each terminal 63C led out to the first surface Sf1 side of the circuit board 8 through the terminal insertion hole 83 and a wiring (not shown) provided on the circuit board 8 are electrically connected by soldering or the like. . At this time, since the circuit board 8 can be supported using the four sleeve components 65 of the inverter circuit section 6 as a pedestal, the assembly work of soldering the 18 terminals 63C can be performed efficiently. Further, the circuit board 8 can be maintained horizontally with respect to the base plate 56, and in turn, the circuit board 8 can be maintained horizontally with respect to the partition wall 23.

As shown in FIG. 2, the inverter circuit unit 6 converts the DC power supplied from the vehicle's power supply 12 into three-phase AC power and supplies the power to the winding 3a of the motor 3. Therefore, among the terminals 63C, a terminal 63C that draws out the connection point CP between the switching element 61 on the upper arm side and the switching element 61 on the lower arm side of each phase is provided on the circuit board 8 shown in FIG. 8(B). Wire it so that it is connected to the motor side connection terminal 11.

In this way, as shown in FIGS. 8(B) and 8(C), the motor control circuit section 16, the inverter circuit section 6, and the filter circuit section 7 are mounted and/or electrically connected on one circuit board 8. The electrical circuit section 9 is manufactured.

Thereafter, as shown in FIG. 9A, the circuit board 8 to which the inverter circuit section 6, motor control circuit section 16, and filter circuit section 7 are connected is housed in the circuit housing section 22 of the housing 2. Specifically, a heat dissipation material 101 (for example, heat dissipation grease), not shown here, is placed (applied) on the bottom 22B (top surface of the partition wall 23) of the first space 221 of the circuit housing section 22, and the heat dissipation material 101 is The inverter circuit part 6 is housed in the circuit housing part 22 so that the lower surface of the base plate 56 is in close contact with the bottom part 22B of the circuit housing part 22 (see FIG. 1). At the same time, a heat dissipation material (for example, a heat dissipation sheet), which is not shown in FIG. The filter circuit part 7 is housed in the circuit housing part 22 so as to be in close contact with the bottom part 22B of the circuit housing part 22 (see FIG. 1).

The circuit housing portion 22 is provided with a pull-out terminal 30 that penetrates the partition wall 23 and is connected to the winding 3a in the housing 21, and a high-power connector 13 that is connected to a power source via a power harness (not shown). It is being The circuit board 8 is housed in the circuit accommodating part 22, and the pull-out terminal 30 that penetrates the circuit board 8 and protrudes toward the first surface Sf1 is connected to the motor side connection terminal 11 of the electric circuit part 9. In addition, the power supply side connection terminal 31 led out to the first surface Sf1 side through the connection terminal insertion hole 87 provided in the circuit board 8 is connected to the power supply (collector) terminal among the terminals 63C of the inverter circuit section 6. and the ground (emitter) terminal.

The circuit board 8 is provided with bolt insertion holes 84, 86, and 89. The bolt insertion hole 84 is a hole that communicates with the internal space of the sleeve component 65 of the inverter circuit section 6, the bolt insertion hole 86 is a hole that communicates with the internal space of the sleeve component 75 of the filter circuit section 7, and the bolt insertion hole 89 is a hole that communicates with the internal space of the sleeve component 75 of the filter circuit section 7. is a hole provided at a position offset from the sleeve parts 65, 75. A bolt 85 is inserted from the first surface Sf1 of the circuit board 8 into the bolt insertion hole 84 and the sleeve component 65 of the inverter circuit section 6, and is fastened to the thread groove 26 provided in the partition wall 23 (FIG. 6(C), FIG. reference). Further, the bolt 85 is inserted from the first surface Sf1 of the circuit board 8 into the bolt insertion hole 86 and the sleeve component 75 of the filter circuit section 7, and is fastened to the thread groove 26 provided in the bottom section 22B of the circuit housing section 22 (Fig. (see 1). Further, the bolt 85 is inserted into the bolt insertion hole 89 from the first surface Sf1 of the circuit board 8, and fastened to the thread groove 26 provided in the bottom portion 22B of the circuit housing portion 22. In this way, as shown in FIG. 9(B), the electric circuit section 9 including the circuit board 8 is removably fixed to the housing 2.

Finally, the lid member 25 is removably attached to the opening 24 of the circuit accommodating portion 22 to open and close it.

As shown in FIG. 1, in the inverter circuit section 6, the base plate 56 comes into contact with the partition wall 23 via the heat dissipation material 101, so the power semiconductor element 63 is inserted into the partition wall 23 via the heat dissipation plate 14, the base plate 56, and the heat dissipation material 101. There is a heat exchange relationship between the two, and it is cooled by a low-temperature gas refrigerant.

Further, in the filter circuit part 7, since the insulating resin part 73 contacts the partition wall 23 via the heat dissipation material (heat dissipation sheet) 102, the filter circuit component 70 can be attached to the partition wall via the heat dissipation material 102 while maintaining earthquake resistance. 23, and is cooled by a low-temperature gas refrigerant.

In this embodiment, the inverter circuit section 6, filter circuit section 7, and motor control circuit section 16 are provided on one circuit board 8, and the circuit board 8 is removably fixed to the housing 2 with bolts 85. Compared to a configuration in which at least a portion of the circuit section 6, filter circuit section 7, and motor control circuit section 16 are individually attached to the housing 2, the work efficiency of assembly and maintenance is improved. In particular, if a part of the casing 2 is cast and the inverter circuit section 6 and filter circuit section 7 are attached to the casing 2 using a thermosetting resin material, it may be very difficult to remove the circuit in the event of a circuit failure. Become. According to the present embodiment, the electric circuit section 9 (circuit board 8) can be easily removed from the housing 2 by releasing the bolts 85, thereby improving maintainability.

Furthermore, compared to, for example, a configuration in which the inverter circuit section 6 and the filter circuit section 7 are connected to separate (independent) circuit boards, the number of parts can be reduced, and costs can be reduced.

Further, the guide portion 76 provided in the filter circuit portion 7 by injection molding prevents the positional displacement of each power supply side connection terminal 31, so that the workability of tightening the bolt 85 is improved, and each power supply side connection terminal 31 An insulating distance between them is also ensured. Furthermore, the device can be made smaller and lower in cost.

Furthermore, since the base plate 56 is a metal flat plate and is placed on the circuit housing section 22 (partition wall 23), when the circuit board 8 is housed in the circuit housing section 22, the circuit board 8 is horizontal with respect to the partition wall 23. will be maintained. Further, with the sleeve parts 65 and 75 in contact with the housing 2 (with the sleeve parts 65 and 75 as supporting members), the bolt 85 can be inserted and fastened and fixed. Therefore, the ease of assembly when fastening the circuit board 8 and the casing 2 is improved, work efficiency is improved, and variations in the assembly state between the electric compressors 1 can be avoided.

Further, after manufacturing the electric circuit section 9 in advance, it can be attached to the housing 2. Preheating is required when soldering the circuit board 8 and the terminals 63C, 70C, etc. In other words, if the soldering process is performed after the circuit board 8 including the electric circuit section 9 is housed in the housing 2 (circuit housing section 22), the entire electric compressor 1 including the motor 3 must be preheated. This will result in poor workability. In this embodiment, the inverter circuit section 6, the filter circuit section 7, and the motor control circuit section 16 can be soldered to the circuit board 8 before being housed in the casing 2, and preheating is required to a minimum extent. , work efficiency is improved.

It should be noted that the electric compressor 1 of the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.

INDUSTRIAL APPLICABILITY The present invention can be used in the field of electric compressors.

1 Electric compressor 2 Housing 3 Motor 3a Winding 4 Rotating shaft 5 Compression mechanism 6 Inverter circuit section 7 Filter circuit section 8 Circuit board (printed board)
9 Electric circuit section 11 Motor side connection terminal 12 Power supply 13 High power connector 14 Heat sink 16 Motor control circuit section 19 Control signal connector 21 Housing 22 Circuit housing section 22 Housing 2 (circuit housing section 22B lower part (bottom)
22B Bottom part 23 Partition wall 30 Output terminal 31 Power supply side connection terminal 56 Base plate 57 Bolt insertion hole 61 Switching element 62 Free wheel diode 63 Power semiconductor element 63C Terminal 63C, 70C Terminal 63H Fixing hole 63P Resin package 63S Semiconductor chip 64 Heat sink 65, 75 Sleeve parts 67, 73 Insulating resin part 68 Positioning and fixing means 69 Resin insulating sheet 70 Filter circuit part 71 Smoothing capacitor 72 Noise filter 73 Insulating resin part 73B Bottom part 76 Guide parts 80, 83 Terminal insertion hole 81 First area 82 Second Areas 84, 86, 89 Bolt insertion hole 85 Bolt 87 Connection terminal insertion hole 101, 102 Heat dissipation material

Claims (9)

a housing in which a compression mechanism and a motor for driving the compression mechanism are built;
a circuit board;
comprising a filter circuit section provided in a predetermined area of the circuit board,
An electric compressor, wherein the circuit board is assembled to the casing so that the filter circuit section is housed inside the casing,
The filter circuit section includes a plurality of filter circuit components mounted on the circuit board, and an insulating resin section that integrates the filter circuit components and the circuit board by injection molding.
An electric compressor characterized by: The insulating resin part is made of a thermoplastic resin material.
The electric compressor according to claim 1, characterized in that: The casing has a circuit housing part,
The filter circuit part is housed in the circuit housing part such that the insulating resin part faces the circuit housing part,
A sheet having heat dissipation properties is arranged between the insulating resin part and the circuit housing part,
The electric compressor according to claim 1, characterized in that: a sleeve component through which a bolt for fixing the circuit board to the housing passes;
The sleeve component is integrated with the filter circuit component by the insulating resin part,
The electric compressor according to claim 1, characterized in that: An inverter circuit section and a motor control circuit section are configured in other areas of the circuit board.
The electric compressor according to claim 1, characterized in that: The circuit board is removably assembled to the housing,
The electric compressor according to claim 1, characterized in that: The inverter circuit section has a plurality of semiconductor elements electrically connected to the circuit board, and another insulating resin section that integrates the plurality of semiconductor elements by injection molding,
A part of the terminal of the semiconductor element is covered with the other insulating resin part, and another part of the terminal is connected to the circuit board.
The electric compressor according to claim 5, characterized in that: a distal end of the filter circuit section from the circuit board is covered with the insulating resin section;
The electric compressor according to claim 1, characterized in that: a step of mounting a plurality of filter circuit components on a circuit board;
integrating an insulating resin between the plurality of filter circuit components and the circuit board by injection molding;
a step of removably assembling the circuit board into a housing in which a compression mechanism and a motor for driving the compression mechanism are built;
A method of manufacturing an electric compressor, characterized by:

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