JP2023156835A - Wiring board and image display device - Google Patents

Abstract

To provide a wiring board and an image display device that make a mesh wiring layer less visible.SOLUTION: A wiring board 10 has: a substrate 11 including a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a; a primer layer 15 disposed on the first surface 11a of the substrate 11; a mesh wiring layer 20 disposed on the primer layer 15; and a dark layer 18 covering the mesh wiring layer 20. The substrate 11 has transparency. The mesh wiring layer 20 has: a first metal layer 21a disposed on the primer layer 15; and a second metal layer 21b disposed on the first metal layer 21a. A surface roughness Ra of the dark layer 18 is 5 nm or more and 100 nm or less.SELECTED DRAWING: Figure 5

Description

Embodiments of the present disclosure relate to a wiring board and an image display device.

Currently, mobile terminal devices such as smartphones and tablets are becoming more sophisticated, smaller, thinner, and lighter. Since these mobile terminal devices use multiple communication bands, multiple antennas are required depending on the communication bands. For example, mobile terminal devices include telephone antennas, WiFi (Wireless Fidelity) antennas, 3G (Generation) antennas, 4G (Generation) antennas, LTE (Long Term Evolution) antennas, and Bluetooth (registered trademark) antennas. , multiple antennas such as NFC (Near Field Communication) antennas are installed. However, as mobile terminal devices become smaller, the mounting space for antennas is limited, and the degree of freedom in antenna design is narrowed. Furthermore, since the antenna is built into a limited space, the radio wave sensitivity is not necessarily satisfactory.

For this reason, film antennas that can be mounted in the display area of mobile terminal devices have been developed. This film antenna is a transparent antenna in which an antenna pattern is formed on a transparent base material. It is formed by a conductive mesh layer.

JP2011-66610A

By the way, for example, in a conventional film antenna, one or more mesh antennas are mounted on a transparent base material, but on the transparent base material, there are areas where an antenna pattern is formed and areas where no antenna pattern is formed. Both exist. In this case, since there is a region where the antenna pattern is not formed, the region where the antenna pattern is formed becomes easier to see. Therefore, it is required to make wiring patterns such as antenna patterns difficult to visually recognize.

This embodiment provides a wiring board and an image display device that can make a mesh wiring layer difficult to see.

A first aspect of the present disclosure is a wiring board including a first surface and a second surface located on the opposite side of the first surface, and a wiring board disposed on the first surface of the substrate. The substrate includes a primer layer, a mesh wiring layer disposed on the primer layer, and a dark layer covering the mesh wiring layer, the substrate is transparent, and the mesh wiring layer is disposed on the primer layer. The wiring board has a first metal layer arranged on the first metal layer and a second metal layer arranged on the first metal layer, and the dark layer has a surface roughness Ra of 5 nm or more and 100 nm or less.

A second aspect of the present disclosure is that in the wiring board according to the first aspect described above, the first metal layer and the second metal layer may have different crystal properties from each other, and the second metal layer may have crystal properties different from each other. The metal layer may have crystal properties such that the diffraction angle 2θ of the (111) plane measured using CuKα rays as an X-ray source is less than 43.4°.

In a third aspect of the present disclosure, in the wiring board according to the above-described first aspect or the above-described second aspect, the dielectric loss tangent of the substrate may be 0.002 or less.

A fourth aspect of the present disclosure is a wiring board according to each of the first aspect to the third aspect described above, in which the wiring board is bent 180 degrees along the circumference of a cylinder having a diameter of 1 mm and then stretched. When the process is repeated 100 times, the amount of increase in the resistance value of the mesh wiring layer may be 20% or less.

A fifth aspect of the present disclosure is a wiring board according to each of the first aspect to the fourth aspect described above, wherein the wiring board may have a millimeter wave transmission/reception function, and the mesh wiring layer may function as an array antenna.

A sixth aspect of the present disclosure is a wiring board according to each of the first aspect to the fifth aspect described above, in which a dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer. may be provided.

In a seventh aspect of the present disclosure, in the wiring board according to the sixth aspect described above, a plurality of the dummy wiring layers may be provided, and the aperture ratio of the mesh wiring layer and the dummy wiring layer is The size may increase stepwise from the wiring layer toward the dummy wiring layer that is far from the mesh wiring layer.

An eighth aspect of the present disclosure includes a wiring board according to each of the first aspect to the seventh aspect described above, and a display device laminated on the wiring substrate.

According to the embodiment of the present disclosure, the mesh wiring layer can be made difficult to visually recognize.

FIG. 1 is a plan view showing an image display device according to an embodiment. FIG. 2 is a cross-sectional view (cross-sectional view taken along line II-II in FIG. 1) showing an image display device according to one embodiment. FIG. 3 is a plan view showing a wiring board according to one embodiment. FIG. 4 is an enlarged plan view showing a mesh wiring layer of a wiring board according to one embodiment. FIG. 5 is a cross-sectional view (cross-sectional view taken along the line VV in FIG. 4) showing a wiring board according to one embodiment. FIG. 6 is a cross-sectional view (cross-sectional view taken along line VI-VI in FIG. 4) showing a wiring board according to one embodiment. 7(a)-(i) are cross-sectional views showing a method of manufacturing a wiring board according to one embodiment. FIG. 8 is a plan view showing a wiring board according to a first modification. FIG. 9 is an enlarged plan view showing a wiring board according to a first modification. FIG. 10 is a plan view showing a wiring board according to a second modification. FIG. 11 is an enlarged plan view showing a wiring board according to a second modification. FIG. 12 is a plan view showing a wiring board according to a third modification.

First, one embodiment will be described with reference to FIGS. 1 to 7. 1 to 7 are diagrams showing this embodiment.

Each figure shown below is a schematic view. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. In addition, the present invention can be modified and implemented as appropriate without departing from the technical concept. In each figure shown below, the same parts are given the same reference numerals, and some detailed explanations may be omitted. Further, the numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and the present invention is not limited thereto, and can be appropriately selected and used. In this specification, terms that specify shapes and geometrical conditions, such as terms such as parallel, orthogonal, and perpendicular, are interpreted not only in their strict meanings but also to include substantially the same state.

In the following embodiments, the "X direction" is a direction parallel to one side of the image display device. The "Y direction" is a direction perpendicular to the X direction and parallel to the other side of the image display device. The "Z direction" is a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the image display device. "Surface" refers to the surface on the positive side in the Z direction, the light emitting surface side of the image display device, and the surface facing the viewer. The "back surface" refers to the surface on the negative side in the Z direction, and the surface opposite to the light emitting surface of the image display device and the surface facing the viewer. In this embodiment, a case will be explained in which the mesh wiring layer 20 is a mesh wiring layer having a radio wave transmission/reception function (that is, a function as an antenna); however, the mesh wiring layer 20 has a radio wave transmission/reception function. You don't have to.

The configuration of the image display device according to this embodiment will be described with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, an image display device 60 according to the present embodiment includes a wiring board 10 and a display device 61 stacked on the wiring board 10. The wiring board 10 constitutes the laminate 70 for an image display device together with the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

The wiring board 10 includes a substrate 11 , a primer layer 15 , a mesh wiring layer 20 , a dark layer 18 , and a power supply section 40 . As shown in FIG. 2, the substrate 11 includes a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. Primer layer 15 is arranged on first surface 11a of substrate 11. Primer layer 15 is arranged on first surface 11a of substrate 11. The mesh wiring layer 20 is arranged on the primer layer 15. The mesh wiring layer 20 is covered with a dark layer 18. Furthermore, a power supply unit 40 is electrically connected to the mesh wiring layer 20 . Furthermore, a communication module 63 is arranged on the negative side of the display device 61 in the Z direction. The image display device laminate 70, the display device 61, and the communication module 63 are housed in a housing 62.

In the image display device 60 shown in FIGS. 1 and 2, radio waves of a predetermined frequency can be transmitted and received via the communication module 63, and communication can be performed. The communication module 63 includes any one of a millimeter wave antenna, a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, etc. It may be included. Examples of such an image display device 60 include mobile terminal devices such as a smartphone and a tablet.

As shown in FIG. 2, the image display device 60 has a light emitting surface 64. The image display device 60 includes a wiring board 10 located on the light emitting surface 64 side (i.e., the positive side in the Z direction) with respect to the display device 61, and a wiring board 10 located on the opposite side of the light emitting surface 64 with respect to the display device 61 (i.e., the negative side in the Z direction). A communication module 63 located on the side).

The display device 61 is, for example, an organic EL (Electro Luminescence) display device. The display device 61 may include, for example, a metal layer, a support base material, a resin base material, a thin film transistor (TFT), and an organic EL layer (not shown). A touch sensor (not shown) may be arranged on the display device 61. Further, the wiring board 10 is arranged on the display device 61 with a second transparent adhesive layer 96 interposed therebetween. Note that the display device 61 is not limited to an organic EL display device. For example, the display device 61 may be another display device that itself has a function of emitting light, or may be a micro LED display device including micro LED elements. Further, the display device 61 may be a liquid crystal display device including liquid crystal.

A cover glass 75 is placed on the wiring board 10 with a first transparent adhesive layer 95 in between. Note that a decorative film and a polarizing plate (not shown) may be placed between the first transparent adhesive layer 95 and the cover glass 75.

The first transparent adhesive layer 95 is an adhesive layer that adheres the wiring board 10 to the cover glass 75 directly or indirectly. This first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11. The first transparent adhesive layer 95 has optical transparency and may be an OCA (Optical Clear Adhesive) layer. The OCA layer is a layer produced, for example, as follows. First, a liquid curable adhesive layer composition containing a polymerizable compound is applied onto a release film such as polyethylene terephthalate (PET). Next, an OCA sheet is obtained by curing this using, for example, ultraviolet (UV) light. After bonding this OCA sheet to an object, the release film is peeled off and removed to obtain the OCA layer. The material of the first transparent adhesive layer 95 may be acrylic resin, silicone resin, urethane resin, or the like. In particular, the first transparent adhesive layer 95 may contain acrylic resin. In this case, it is preferable that the second transparent adhesive layer 96 contains acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and reduces visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Reflections can be suppressed more reliably.

The first transparent adhesive layer 95 may have a visible light transmittance of 85% or more, preferably 90% or more. Note that there is no particular upper limit to the visible light transmittance of the first transparent adhesive layer 95, but it may be, for example, 100% or less. By setting the visible light transmittance of the first transparent adhesive layer 95 within the above range, the transparency of the image display device laminate 70 can be increased, and the display device 61 of the image display device 60 can be easily recognized. Note that visible light refers to light having a wavelength of 400 nm or more and 700 nm or less. In addition, visible light transmittance of 85% or more means that when measuring the absorbance of the member to be measured (for example, the first transparent adhesive layer 95), it This means that the transmittance is 85% or more. The absorbance can be measured using a known spectrophotometer (eg, spectrometer V-670 manufactured by JASCO Corporation).

As described above, the wiring board 10 is arranged on the light emitting surface 64 side with respect to the display device 61. In this case, the wiring board 10 is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. More specifically, a partial area of the substrate 11 of the wiring board 10 is arranged in a partial area between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. In this case, the first transparent adhesive layer 95, the second transparent adhesive layer 96, the display device 61, and the cover glass 75 each have a larger area than the substrate 11 of the wiring board 10. In this way, by arranging the substrate 11 of the wiring board 10 not over the entire surface of the image display device 60 in plan view but in a partial area, the overall thickness of the image display device 60 can be reduced.

As described above, the wiring board 10 includes a transparent substrate 11, a primer layer 15 disposed on the first surface 11a of the substrate 11, a mesh wiring layer 20 disposed on the primer layer 15, and a mesh It has a dark layer 18 that covers the wiring layer 20. A power supply unit 40 is electrically connected to the mesh wiring layer 20 . The power supply unit 40 is electrically connected to the communication module 63 via a power supply line (not shown). Further, a part of the wiring board 10 is not placed between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, but is placed between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. It protrudes outward (that is, to the negative side in the Y direction). Specifically, a region of the wiring board 10 where the power feeding section 40 is provided protrudes outward. Thereby, electrical connection between the power supply unit 40 and the communication module 63 can be easily established. On the other hand, the region of the wiring board 10 where the mesh wiring layer 20 is provided is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Note that details of the wiring board 10 will be described later.

The second transparent adhesive layer 96 is an adhesive layer that adheres the display device 61 to the wiring board 10 directly or indirectly. This second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11. The second transparent adhesive layer 96 has optical transparency like the first transparent adhesive layer 95, and may be an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 may be acrylic resin, silicone resin, urethane resin, or the like. In particular, the second transparent adhesive layer 96 may contain acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and reduces visible light at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Reflections can be suppressed more reliably.

The second transparent adhesive layer 96 may have a transmittance of visible light (that is, light having a wavelength of 400 nm or more and 700 nm or less) of 85% or more, and preferably 90% or more. Note that there is no particular upper limit to the visible light transmittance of the second transparent adhesive layer 96, but it may be, for example, 100% or less. By setting the visible light transmittance of the second transparent adhesive layer 96 within the above range, the transparency of the image display device laminate 70 can be increased, and the display device 61 of the image display device 60 can be easily recognized.

In such a laminate 70 for an image display device, the difference between the refractive index of the primer layer 15 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, preferably 0.05 or less. . Further, the difference between the refractive index of the primer layer 15 and the refractive index of the substrate 11 is 0.1 or less, preferably 0.05 or less. Here, the refractive index refers to an absolute refractive index, and can be determined based on method A of JIS K-7142. For example, when the material of the first transparent adhesive layer 95 is an acrylic resin (refractive index 1.49), the refractive index of the primer layer 15 is set to 1.39 or more and 1.59 or less. Examples of such materials include fluororesins, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, cellulose resins, and the like.

In this way, by suppressing the difference between the refractive index of the primer layer 15 and the refractive index of the first transparent adhesive layer 95 to 0.1 or less, the difference at the interface B1 between the primer layer 15 and the first transparent adhesive layer 95 is reduced. Reflection of visible light is suppressed, and the substrate 11 provided with the primer layer 15 can be made difficult to visually recognize with the naked eye of an observer. Furthermore, by suppressing the difference between the refractive index of the primer layer 15 and the refractive index of the substrate 11 to 0.1 or less, reflection of visible light at the interface B2 between the primer layer 15 and the substrate 11 is suppressed, and the substrate 11 is It can be difficult to see with the naked eye of an observer.

Further, in the laminate 70 for an image display device, the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, preferably 0.05 or less. Further, the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 is 0.1 or less, preferably 0.05 or less. Further, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, more preferably 0.05 or less. For example, when the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are acrylic resin (refractive index 1.49), the refractive index of the substrate 11 is set to 1.39 or more and 1.59 or less. do. Examples of such materials include, as described above, fluororesins, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, cellulose resins, and the like.

In this way, by suppressing the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 to 0.1 or less, visible light at the interface B3 between the second transparent adhesive layer 96 and the substrate 11 is reduced. It is possible to suppress the reflection of the substrate 11 and make it difficult for the observer to visually recognize the substrate 11 with the naked eye. Furthermore, by suppressing the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the difference between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 is reduced. By suppressing the reflection of visible light at the interface B4, it is possible to make it difficult for an observer to visually recognize the first transparent adhesive layer 95 and the second transparent adhesive layer 96 with the naked eye.

In particular, it is preferable that the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are the same material. Thereby, the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 is made smaller, and visible light is reflected at the interface B4 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. can be suppressed.

In FIG. 2, at least one of the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 may be 1.5 times or more the thickness T ₁ of the substrate 11. It is preferably 2 times or more, and more preferably 2.5 times or more. In this way, by making the thickness T ₃ of the first transparent adhesive layer ₉₅ or the thickness T ₄ of the second transparent adhesive layer 96 sufficiently thick with respect to the thickness T 1 of the substrate 11, the first The transparent adhesive layer 95 or the second transparent adhesive layer 96 deforms in the thickness direction and absorbs the thickness of the substrate 11. Thereby, it is possible to suppress the occurrence of a step in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for an observer to recognize the presence of the substrate 11.

The thickness of at least one of the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 is preferably 10 times or less, and preferably 5 times or less, the thickness T ₁ of the substrate 11. More preferably. Thereby, the thickness T ₃ of the first transparent adhesive layer 95 or the thickness T ₄ of the second transparent adhesive layer 96 does not become too thick, and the overall thickness of the image display device 60 can be reduced.

In FIG. 2, the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 may be the same. In this case, the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 may be 1.5 times or more, and 2.0 times or more, the thickness T ₁ of the substrate 11, respectively. It is preferable that That is, the sum of the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 (ie, T ₃ +T ₄ ) is three times or more the thickness T ₁ of the substrate 11. In this way, by making the sum of the thicknesses T _{3 and} T ₄ of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 sufficiently thick with respect to the thickness T 1 of the substrate 11, the area overlapping with the substrate 11 can be , the first transparent adhesive layer 95 and the second transparent adhesive layer 96 deform (shrink) in the thickness direction. As a result, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 absorb the thickness of the substrate 11. Therefore, it is possible to suppress the formation of a step in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for an observer to recognize the presence of the substrate 11.

When the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 are the same, the thickness T ₃ of the first transparent adhesive layer 95 and the thickness T ₄ of the second transparent adhesive layer 96 are the same. may be 5 times or less, and preferably 3 times or less, respectively, than the thickness T1 of the substrate ₁₁ . Thereby, the thicknesses T ₃ and T ₄ of both the first transparent adhesive layer 95 and the second transparent adhesive layer 96 do not become too thick, and the overall thickness of the image display device 60 can be reduced.

Specifically, the thickness T ₁ of the substrate 11 may be, for example, 2 μm or more, 10 μm or more, and preferably 15 μm or more. By setting the thickness T ₁ of the substrate 11 to 2 μm or more, the strength of the wiring board 10 can be maintained, and the first direction wiring 21 and the second direction wiring 22, which will be described later, of the mesh wiring layer 20 can be made difficult to deform. Further, the thickness T ₁ of the substrate 11 may be, for example, 200 μm or less, 50 μm or less, and preferably 25 μm or less. By setting the thickness T ₁ of the substrate 11 to 200 μm or less, the formation of a step between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, and the presence of the substrate 11 can be prevented from being recognized by the observer. It can be made difficult. Furthermore, by setting the thickness T ₁ of the substrate 11 to 50 μm or less, the formation of a step between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be further suppressed, and the presence of the substrate 11 can be made clear to the observer. can be made more difficult to recognize.

The thickness T ₃ of the first transparent adhesive layer 95 may be, for example, 15 μm or more, and preferably 20 μm or more. The thickness T ₃ of the first transparent adhesive layer 95 may be, for example, 500 μm or less, preferably 300 μm or less, and more preferably 250 μm or less. The thickness T ₄ of the second transparent adhesive layer 96 may be, for example, 15 μm or more, and preferably 20 μm or more. The thickness T ₄ of the second transparent adhesive layer 96 may be, for example, 500 μm or less, preferably 300 μm or less, and more preferably 250 μm or less.

Referring again to FIG. 2, the cover glass 75 is disposed directly or indirectly on the first transparent adhesive layer 95. This cover glass 75 is a glass member that transmits light. The cover glass 75 has a plate shape, and the shape of the cover glass 75 may be rectangular in plan view. The thickness of the cover glass 75 may be, for example, 200 μm or more and 1000 μm or less, and preferably 300 μm or more and 700 μm or less. The length of the cover glass 75 in the longitudinal direction (that is, the Y direction) may be, for example, 20 mm or more and 500 mm or less, preferably 100 mm or more and 200 mm or less. The length of the cover glass 75 in the lateral direction (that is, the X direction) may be 20 mm or more and 500 mm or less, preferably 50 mm or more and 100 mm or less.

As shown in FIG. 1, the shape of the image display device 60 is generally rectangular in plan view, with its longitudinal direction parallel to the Y direction, and its transversal direction parallel to the X direction. . The length _L4 of the image display device 60 in the longitudinal direction (that is, the Y direction) can be selected, for example, from 20 mm to 500 mm, preferably from 100 mm to 200 mm. The length _L5 of the image display device 60 in the lateral direction (that is, the X direction) can be selected, for example, from 20 mm to 500 mm, preferably from 50 mm to 100 mm. Note that the planar shape of the image display device 60 may be a rectangle with rounded corners.

Next, the configuration of the wiring board will be described with reference to FIGS. 3 to 6. 3 to 6 are diagrams showing the wiring board according to this embodiment.

As shown in FIG. 3, the wiring board 10 according to this embodiment is a board used in the above-described image display device 60 (see FIGS. 1 and 2). The wiring board 10 may be placed closer to the light emitting surface 64 than the display device 61 and between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. As described above, such a wiring board 10 includes a transparent substrate 11, a primer layer 15 disposed on the substrate 11, a mesh wiring layer 20 disposed on the primer layer 15, and a mesh wiring layer. 20 and a dark-colored layer 18 covering the surface. Furthermore, a power supply unit 40 is electrically connected to the mesh wiring layer 20 .

The shape of the substrate 11 is approximately rectangular in plan view. The substrate 11 is transparent, has a substantially flat plate shape, and has a substantially uniform thickness as a whole. The length _L1 of the substrate 11 in the first direction (that is, the Y direction) can be selected within a range of, for example, 3 mm or more and 300 mm or less. The length L 2 (see FIG. ₁ ) of the substrate 11 in the second direction (that is, the X direction) can be selected, for example, in a range of 3 mm or more and 300 mm or less. Note that the planar shape of the substrate 11 may be a rectangle with rounded corners.

The material of the substrate 11 may be any material as long as it has transparency in the visible light region and electrical insulation. As the material for the substrate 11, it is preferable to use, for example, an organic insulating material such as polyester resin, acrylic resin, polycarbonate resin, polyimide resin, polyolefin resin, cellulose resin, or fluororesin material. The polyester resin may be polyethylene terephthalate or the like. The acrylic resin may be polymethyl methacrylate or the like. The polyolefin resin may be a cycloolefin polymer or the like. The cellulose resin may be triacetylcellulose or the like. The fluororesin material may be PTFE, PFA, or the like. For example, as the material for the substrate 11, an organic insulating material such as a cycloolefin polymer (for example, ZF-16 manufactured by Nippon Zeon Co., Ltd.) or a polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.) may be used. Further, as the material of the substrate 11, glass, ceramics, or the like may be appropriately selected depending on the purpose. Although the substrate 11 is illustrated as being composed of a single layer, it is not limited thereto, and may have a structure in which a plurality of base materials or layers are laminated. Further, the substrate 11 may be a film-like member or a plate-like member.

The dielectric loss tangent of the substrate 11 may be 0.002 or less, and preferably 0.001 or less. Note that the lower limit of the dielectric loss tangent of the substrate 11 is not particularly limited, but may be greater than 0. By setting the dielectric loss tangent of the substrate 11 within the above range, especially when the electromagnetic waves (for example, millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency, loss of gain (i.e., decrease in sensitivity) accompanying transmission and reception of electromagnetic waves can be avoided. Can be made smaller.

The dielectric constant of the substrate 11 is not particularly limited, but is preferably 2 or more and 10 or less. Since the dielectric constant of the substrate 11 is 2 or more, there are many choices for the material of the substrate 11. Further, since the dielectric constant of the substrate 11 is 10 or less, gain loss accompanying transmission and reception of electromagnetic waves can be reduced. That is, when the dielectric constant of the substrate 11 increases, the influence of the thickness of the substrate 11 on the propagation of electromagnetic waves increases. Further, if there is an adverse effect on the propagation of electromagnetic waves, the dielectric loss tangent of the substrate 11 may increase, and gain loss accompanying transmission and reception of electromagnetic waves may increase. On the other hand, since the dielectric constant of the substrate 11 is 10 or less, the influence of the thickness of the substrate 11 on the propagation of electromagnetic waves can be reduced. Therefore, gain loss associated with transmission and reception of electromagnetic waves can be reduced. Particularly when the electromagnetic waves (for example, millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency waves, the gain loss accompanying the transmission and reception of electromagnetic waves can be reduced.

The dielectric loss tangent and dielectric constant of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test piece is prepared by cutting out a portion of the substrate 11 where the mesh wiring layer 20 is not formed. Alternatively, the substrate 11 on which the mesh wiring layer 20 is formed may be cut out, and the mesh wiring layer 20 may be removed by etching or the like. The dimensions of the test piece shall be a width of 10 mm or more and 20 mm or less, and a length of 50 mm or more and 100 mm or less. Next, the dielectric loss tangent or dielectric constant is measured in accordance with IEC 62562. The dielectric loss tangent and dielectric constant of the substrate 11 may be measured in accordance with ASTM D150.

In this embodiment, the substrate 11 has transparency. As used herein, "having transparency" means that the transmittance of visible light (that is, light having a wavelength of 400 nm or more and 700 nm or less) is 85% or more. The substrate 11 may have a visible light transmittance of 85% or more, preferably 90% or more. Note that there is no particular upper limit to the visible light transmittance of the substrate 11, but it may be, for example, 100% or less. By setting the visible light transmittance of the substrate 11 within the above range, the transparency of the wiring board 10 can be increased and the display device 61 of the image display device 60 can be easily recognized.

Next, the primer layer 15 will be explained. The primer layer 15 serves to improve the adhesion between the mesh wiring layer 20 and the substrate 11. In this embodiment, the primer layer 15 is provided over substantially the entire first surface 11a of the substrate 11. This eliminates the need for patterning the primer layer 15. Therefore, the number of process steps can be reduced. Note that the primer layer 15 may be provided only in the region of the first surface 11a of the substrate 11 where the mesh wiring layer 20 is provided.

This primer layer 15 contains a polymer material. Thereby, the adhesion between the mesh wiring layer 20 and the substrate 11 can be effectively improved. In this case, as the material for the primer layer 15, a colorless and transparent polymeric material can be used.

It is preferable that the primer layer 15 contains an acrylic resin or a polyester resin. Thereby, the adhesion between the mesh wiring layer 20 and the substrate 11 can be improved more effectively. When the primer layer 15 contains an acrylic resin, examples of the acrylic resin include polymers containing acrylic acid, methacrylic acid, and derivatives thereof as monomer components. Examples of acrylic resins include acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methacrylic acid, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl acrylate, and acrylamide. , acrylonitrile, hydroxyl acrylate, etc. as main components, and a monomer copolymerizable with these (for example, styrene, divinylbenzene, acrylonitrile, etc.) may be used. In addition to the above monomers, a dimer having two acrylic or methacrylic groups per molecule, or a polyfunctional urethane acrylate, etc. may be added to the resin as the main component, and one molecule of epoxy group may be added to the resin. An organic molecule having two or more molecules may be added to the resin as the main component. Thereby, by crosslinking the acrylic resin, the resin can be cured and the primer layer 15 can be formed. The cured primer layer has excellent adhesion. It is also possible to exhibit excellent functions such as water resistance, acid resistance, alkali resistance, solvent resistance, or a combination thereof. Therefore, it is possible to suppress the adhesion between the mesh wiring layer 20 and the substrate 11 from decreasing during wiring formation or over time.

Further, when the primer layer 15 contains a polyester resin, the primer layer 15 can be formed by, for example, curing the hydroxyl group-containing polyester resin by crosslinking it with a curing agent that reacts with the hydroxyl group. Examples of the hydroxyl group-containing polyester resin include polyester polyols, and examples of the curing agent include polyisocyanates and/or polyisocyanate prepolymers. The primer layer 15 formed by curing polyester polyol and polyisocyanate and/or polyisocyanate prepolymer has excellent adhesion. It is also possible to exhibit excellent functions such as water resistance, acid resistance, alkali resistance, solvent resistance, or a combination thereof. Therefore, it is possible to suppress the adhesion between the mesh wiring layer 20 and the substrate 11 from decreasing over time. Further, the primer layer 15 formed by curing polyester polyol and polyisocyanate and/or polyisocyanate prepolymer has excellent heat resistance. Therefore, the primer layer 15 is less susceptible to the effects of heat generated in each film forming process performed after the formation of the primer layer 15, and the generation of whitening or cracks in the primer layer 15 due to heat can be suppressed.

Moreover, examples of preferable polyisocyanates and/or polyisocyanate prepolymers include IPDI-based, XDI-based, and HDI-based polyisocyanates and/or polyisocyanate prepolymers. By using these, yellowing of the primer layer 15 can be suppressed. Here, the IPDI system means isophorone diisocyanate and its modified form, the XDI system means xylylene diisocyanate and its modified form, and the HDI system means hexameletine diisocyanate and its modified form. . Examples of modified forms include trimethylolpropane (TMP) adducts, isocyanurate forms, biuret forms, allophanate forms, and the like.

The polymer material of the primer layer 15 is cured by crosslinking by irradiating the polymer material with visible light, ultraviolet rays, X-rays, electron beams, alpha rays, beta rays, gamma rays, etc. Also good. Thereby, the scratch resistance and heat resistance of the primer layer 15 can be improved.

Further, the transmittance of the primer layer 15 for visible light (light having a wavelength of 400 nm or more and 700 nm or less) may be 85% or more, and preferably 90% or more. Note that there is no particular upper limit to the visible light transmittance of the primer layer 15, but it may be, for example, 100% or less. By setting the visible light transmittance of the primer layer 15 within the above range, the transparency of the wiring board 10 can be increased and the display device 61 of the image display device 60 can be easily recognized.

The thickness T ₂ (length in the Z direction, see FIG. 5) of the primer layer 15 is preferably 0.05 μm or more and 0.5 μm or less. When the thickness T ₂ of the primer layer 15 is 0.05 μm or more, the adhesion between the mesh wiring layer 20 and the substrate 11 can be effectively improved. Further, since the thickness T ₂ of the primer layer 15 is 0.5 μm or less, the transparency of the wiring board 10 can be ensured.

In this embodiment, the mesh wiring layer 20 consists of an antenna pattern that functions as an antenna. This mesh wiring layer 20 functions as an array antenna. In this manner, when the mesh wiring layer 20 functions as an array antenna, the performance of the millimeter wave antenna for transmitting and receiving highly straight millimeter waves can be improved. Note that an array antenna is an antenna in which a plurality of antenna elements (radiating elements) are regularly arranged, and the amplitude and phase of excitation of the elements can be independently controlled.

Three mesh wiring layers 20 are formed on the substrate 11 (see FIG. 1). Furthermore, as shown in FIG. 3, the mesh wiring layer 20 may not exist over the entire surface of the substrate 11, but may exist only in a partial area on the substrate 11. Each mesh wiring layer 20 may have the same shape. In this case, each mesh wiring layer 20 has an error in its length (that is, length in the Y direction) _La and width (length in the X direction) W _a within 10%. preferable. Thereby, the performance of the millimeter wave antenna can be effectively improved.

This mesh wiring layer 20 corresponds to a predetermined frequency band. That is, the length (length in the Y direction) _La of the mesh wiring layer 20 corresponds to a specific frequency band. Note that the lower the corresponding frequency band is, the longer the length _La of the mesh wiring layer 20 becomes. In addition to millimeter wave antennas, the mesh wiring layer 20 can also be used for telephone antennas, WiFi antennas, 3G antennas, 4G antennas, 5G antennas, LTE antennas, Bluetooth (registered trademark) antennas, NFC antennas, etc. It may correspond to either one. Note that the plurality of mesh wiring layers 20 may have different lengths and correspond to different frequency bands. Alternatively, if the wiring board 10 does not have a radio wave transmission/reception function, each mesh wiring layer 20 may perform functions such as a hovering function, fingerprint authentication, a heater, and a noise cut (shield). Note that the hovering function is a function that allows the user to operate the display without directly touching it.

The mesh wiring layer 20 has a base end portion 20a on the power feeding unit 40 side, and a distal end portion 20b connected to the base end portion 20a. The base end portion 20a is connected to the power feeding section 40. The shape of the proximal end portion 20a and the shape of the distal end portion 20b are each substantially rectangular in plan view. In this case, the length of the distal end portion 20b (i.e., the distance in the Y direction) is longer than the length of the proximal end portion 20a (i.e., the distance in the Y direction), and the width of the distal end portion 20b (i.e., the distance in the X direction) is wider than the width of the proximal portion 20a (ie, the distance in the X direction).

The mesh wiring layer 20 has its longitudinal direction parallel to the Y direction, and its transversal direction parallel to the X direction. The length _La of the mesh wiring layer 20 in the longitudinal direction (that is, the Y direction) can be selected within a range of, for example, 3 mm or more and 100 mm or less. The width _Wa of the tip side portion 20b of the mesh wiring layer 20 in the transverse direction (that is, the X direction) can be selected, for example, in the range of 1 mm or more and 10 mm or less. In particular, the mesh wiring layer 20 may be a millimeter wave antenna. When the mesh wiring layer 20 is a millimeter wave antenna, the length _La of the mesh wiring layer 20 can be selected in the range of 1 mm or more, more preferably 1.5 mm or more. When the mesh wiring layer 20 is a millimeter wave antenna, the length _La of the mesh wiring layer 20 can be selected within a range of 10 mm or less, more preferably 5 mm or less.

Each mesh wiring layer 20 has a pattern shape in which metal wires are arranged in a grid or mesh pattern. This pattern shape is repeatedly arranged in the X direction and the Y direction. That is, the mesh wiring layer 20 includes a portion extending in the first direction (for example, the Y direction) (i.e., the first direction wiring 21) and a portion extending in the second direction (for example, the X direction) (i.e., the second direction wiring 22). ).

As shown in FIG. 4, the mesh wiring layer 20 has two or more wirings. Specifically, the mesh wiring layer 20 includes a plurality of first direction wirings 21 that function as antennas and a plurality of second direction wirings 22 that connect the plurality of first direction wirings 21. The plurality of first direction wirings 21 and the plurality of second direction wirings 22 are integrated as a whole to form a lattice-like or mesh-like shape. Each first direction wiring 21 extends linearly in the longitudinal direction of the mesh wiring layer 20 (ie, the Y direction). Each second direction wiring 22 extends linearly in the width direction of the mesh wiring layer 20 (ie, the X direction). The first direction wiring 21 mainly functions as an antenna by having a length L _a (see FIG. 3) corresponding to a predetermined frequency band. Here, the length L _a is the length of the mesh wiring layer 20 described above. On the other hand, the second direction wiring 22 connects these first direction wirings 21 to each other, so that the first direction wiring 21 is disconnected or the first direction wiring 21 and the power feeding part 40 are not electrically connected. It plays a role in suppressing problems that may occur.

In the mesh wiring layer 20, a plurality of openings 23 are formed by being surrounded by first direction wirings 21 adjacent to each other and second direction wirings 22 adjacent to each other. Further, the first direction wiring 21 and the second direction wiring 22 are arranged at equal intervals from each other. That is, the plurality of first direction wirings 21 are arranged at regular intervals, and the pitch _P1 thereof can be, for example, in a range of 0.01 mm or more and 1 mm or less. Further, the plurality of second direction wirings 22 are arranged at regular intervals, and the pitch _P2 thereof can be, for example, in a range of 0.01 mm or more and 1 mm or less. As described above, since the plurality of first direction wirings 21 and the plurality of second direction wirings 22 are arranged at equal intervals, there is no variation in the size of the openings 23 within the mesh wiring layer 20, and the mesh The wiring layer 20 can be made difficult to see with the naked eye. Furthermore, the pitch P ₁ of the first direction wiring 21 is equal to the pitch P ₂ of the second direction wiring 22 . Therefore, each opening 23 has a substantially square shape in plan view, and the transparent primer layer 15 and substrate 11 are exposed from each opening 23. Therefore, by increasing the area of each opening 23, the transparency of the wiring board 10 as a whole can be improved. Note that the length _L3 of one side of each opening 23 can be in the range of, for example, 0.01 mm or more and 1 mm or less. Note that, although each first direction wiring 21 and each second direction wiring 22 are orthogonal to each other, the present invention is not limited thereto, and they may intersect each other at an acute angle or an obtuse angle. Further, the shape of the opening 23 is preferably the same shape and size over the entire surface, but it may not be uniform over the entire surface, such as changing depending on the location.

As shown in FIG. 5, each first direction wiring 21 has a shape in which a cross section perpendicular to the longitudinal direction (that is, a cross section in the X direction) is approximately rectangular or approximately square. In this case, the cross-sectional shape of the first direction wiring 21 is substantially uniform along the longitudinal direction of the first direction wiring 21 (ie, the Y direction). As shown in FIG. 6, each second direction wiring 22 has a shape in which a cross section perpendicular to the longitudinal direction (i.e., Y direction cross section) is approximately rectangular or approximately square, and the first direction wiring described above It has substantially the same shape as the cross-sectional shape of 21 (that is, the cross-sectional shape in the X direction). In this case, the cross-sectional shape of the second direction wiring 22 is substantially uniform along the longitudinal direction (ie, the X direction) of the second direction wiring 22. The cross-sectional shape of the first direction wiring 21 and the cross-sectional shape of the second direction wiring 22 do not necessarily have to be approximately rectangular or approximately square. For example, the cross-sectional shape of the first direction wiring 21 and the cross-sectional shape of the second direction wiring 22 are approximately trapezoidal in which the front side (i.e., the positive side in the Z direction) is narrower than the back side (i.e., the negative side in the Z direction), or , the side surfaces located on both sides in the width direction may be curved.

In this embodiment, the line width W ₁ (see FIG. 5) of the first direction wiring 21 and the line width W ₂ (see FIG. 6) of the second direction wiring 22 are not particularly limited, and are appropriately selected depending on the application. can. Here, the line width W ₁ of the first direction wiring 21 is the width in a cross section perpendicular to its longitudinal direction (that is, the length in the X direction), and the line width W ₂ of the second direction wiring 22 is the width in the cross section perpendicular to its longitudinal direction. It is the width in a cross section perpendicular to the direction (that is, the length in the Y direction). For example, the line width W ₁ of the first direction wiring 21 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and preferably 0.2 μm or more and 2.0 μm or less. Further, the line width W ₂ of the second direction wiring 22 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and preferably 0.2 μm or more and 2.0 μm or less.

The height H ₁ (see FIG. 5) of the first direction wiring 21 and the height H ₂ (see FIG. 6) of the second direction wiring 22 are not particularly limited, and can be appropriately selected depending on the application. Here, the height H ₁ of the first direction wiring 21 and the height H ₂ of the second direction wiring 22 are each a length in the Z direction. The height H 1 of the first direction wiring ₂₁ and the height H ₂ of the second direction wiring 22 can each be selected within a range of, for example, 60 nm or more and 5.0 μm or less.

Here, as shown in FIGS. 5 and 6, the mesh wiring layer 20 includes first metal layers 21a and 22a disposed on the primer layer 15, and second metal layers 21a and 22a disposed on the first metal layers 21a and 22a. It has metal layers 21b and 22b. That is, the first direction wiring 21 has a first metal layer 21a placed on the primer layer 15 and a second metal layer 21b placed on the first metal layer 21a. Further, the second direction wiring 22 includes a first metal layer 22a disposed on the primer layer 15 and a second metal layer 22b disposed on the first metal layer 22a.

Among these, the first metal layers 21a and 22a play a role of improving the adhesion between the substrate 11 and the mesh wiring layer 20. Further, the first metal layers 21a and 22a serve as seed layers when forming the second metal layers 21b and 22b by electrolytic plating. The first metal layers 21a and 22a are preferably formed by a sputtering method or a vapor deposition method, and particularly preferably by a sputtering method.

The thicknesses d _1a and d _2a of the first metal layers 21a and 22a may be 10 nm or more and 1000 nm or less, preferably 30 nm or more and 500 nm or less, and more preferably 50 nm or more and 300 nm or less. Since the thicknesses d _1a and d _2a of the first metal layers 21a and 22a are 10 nm or more, when forming the second metal layers 21b and 22b on the first metal layers 21a and 22a, the second metal layer 21b, 22b can be effectively supported. Further, since the thicknesses d _1a and d _2a of the first metal layers 21a and 22a are 1000 nm or less, the time for forming the mesh wiring layer 20 can be shortened.

The second metal layers 21b and 22b serve to increase the height _H1 of the first direction wiring 21 and the height _H2 of the second direction wiring 22. Thereby, the resistance values of the first direction wiring 21 and the second direction wiring 22 can be reduced. The second metal layers 21b and 22b are preferably formed by a plating method or the like, and particularly preferably by an electrolytic plating method.

The thicknesses d _1b and d _2b of the second metal layers 21b and 22b may be 50 nm or more and 4990 nm or less, preferably 100 nm or more and 2000 nm or less, and more preferably 200 nm or more and 1800 nm or less. Since the thicknesses d _1b and d _2b of the second metal layers 21b and 22b are 50 nm or more, the height H ₁ of the first direction wiring 21 and the height H ₂ of the second direction wiring 22 can be increased. The resistance values of the wiring 21 and the second direction wiring 22 can be reduced. By setting the thicknesses d _1b and d _2b of the second metal layers 21b and 22b to be 4990 nm or less, the time for forming the mesh wiring layer 20 can be shortened.

The first metal layers 21a, 22a and the second metal layers 21b, 22b may have different crystal properties. The first metal layers 21a, 22a and the second metal layers 21b, 22b may differ from each other in at least one of crystal fraction, crystal structure, crystallite size, and crystal plane spacing. For example, the diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22a measured using CuKα rays as an X-ray source is greater than the diffraction angle 2θ of the (111) plane of the second metal layers 21b and 22b. It can also be large. For example, the first metal layers 21a and 22a may have crystal properties such that the diffraction angle 2θ of the (111) plane measured using CuKα rays as an X-ray source is 43.430° or less. Thereby, the adhesion between the substrate 11 and the first metal layers 21a and 22a can be improved. In this case, the above-mentioned diffraction angle 2θ is preferably 43.420° or less, more preferably 43.410° or less. Further, the lower limit of the diffraction angle 2θ mentioned above is not particularly limited, but may be 43.250° or more, preferably 43.300° or more, and more preferably 43.350° or more. Note that the diffraction angle can be measured using an X-ray diffraction device (manufactured by Rigaku Co., Ltd., Smart Lab, 9kW type). The diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22a and the diffraction angle 2θ of the (111) plane of the second metal layers 21b and 22b are each measured in the power feeding unit 40. As will be described later, the power supply unit 40 is configured by a part of the first metal film 51 forming the first metal layers 21a and 22a and a part of the second metal film 52 forming the second metal layers 21b and 22b. The first metal layers 21a, 22a and the second metal layers 21b, 22b are formed simultaneously. Therefore, in the power feeding section 40, the diffraction angle 2θ of the (111) plane of the first metal layers 21a and 22a and the diffraction angle 2θ of the (111) plane of the second metal layers 21b and 22b can be measured. In this case, in the mesh wiring layer 20 where the line widths W ₁ and W ₂ are relatively narrow, the first metal layer It is possible to accurately measure the diffraction angle 2θ of the (111) plane of 21a and 22a. The measurement conditions are shown below.
Measurement mode: 2θ/θ measurement (Out-Plane)
X-ray source: Cu-Kα 45kV-50mA
Optical system: Concentration method Incidence side optical system 1: Solar slit 5deg
Incidence side optical system 2: variable slit (IS) 1deg
Longitudinal limit slit: 10mm
Receiving side optical system 1: variable slit (RS1) 1deg, (RS2) 0.3mm
Receiving side optical system 2: PSA OPEN/Solar slit 5deg
Detector: Scintillation counter Measurement range: 35-80deg
Step: 0.02deg
Measurement time: 2.0deg/min

The second metal layers 21b and 22b may have crystal properties such that the diffraction angle 2θ of the (111) plane measured using CuKα rays as an X-ray source is less than 43.4°. Thereby, when forming the second metal layers 21b, 22b by etching, the formability of the second metal layers 21b, 22b can be improved. The diffraction angle 2θ of the (111) plane of the second metal layers 21b and 22b may be 43.390° or less, preferably 43.380° or less, and more preferably 43.370° or less. preferable.

The first direction wiring 21 and the second direction wiring 22 may be made of any metal material as long as it has conductivity. That is, the first metal layers 21a, 22a and the second metal layers 21b, 22b may be made of any metal material that has conductivity. In this embodiment, the material of the first direction wiring 21 and the second direction wiring 22 is copper, but is not limited thereto. As the material of the first direction wiring 21 and the second direction wiring 22, for example, a metal material such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or an alloy containing these metals can be used.

The overall aperture ratio At of the mesh wiring layer 20 may be in a range of, for example, 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring layer 20 within this range, the conductivity and transparency of the wiring board 10 can be ensured. The overall aperture ratio At of the mesh wiring layer 20 is preferably 95% or more and less than 100%. Thereby, the transparency of the wiring board 10 can be increased while ensuring the conductivity of the wiring board 10. Note that the aperture ratio refers to the ratio (%) of the area of the open area to the unit area of a predetermined area (for example, the entire area of the mesh wiring layer 20). The open area refers to an area where metal parts such as the first direction wiring 21 and the second direction wiring 22 are not present and the substrate 11 is exposed.

By the way, when a bending resistance test is performed on the wiring board 10, the amount of increase in the resistance value of the mesh wiring layer 20 may be 20% or less, or may be 10% or less. The bending resistance test is a test in which the wiring board 10 is bent 180° along the circumference of a cylinder with a diameter of 1 mm and then stretched 100 times using a cylindrical mandrel bending tester.

Specifically, the test is conducted as follows. First, the electrical resistance value between both longitudinal ends of the mesh wiring layer 20 is measured. The resistance value at this time is R0 (Ω). Next, the wiring board 10 is wound around the cylinder of a cylindrical mandrel bending tester so that both longitudinal ends of the wiring board 10 face 180 degrees in opposite directions. Thereafter, the wiring board 10 is removed from the cylinder and stretched flat. Repeat this operation 100 times. After that, the electrical resistance value between both longitudinal ends of the mesh wiring layer 20 is measured again. The resistance value at this time is R ₁ (Ω). At this time, the value obtained by ((R ₁ -R ₀ )/R ₀ )×100(%) is defined as the amount of increase in the resistance value. When the amount of increase in the resistance value is 20% or less, the durability of the wiring board 10 can be improved when the wiring board 10 is used in a curved or bent manner.

Next, the dark layer 18 will be explained. As shown in FIGS. 5 and 6, a dark layer (blackened layer) 18 is formed on the mesh wiring layer 20 of the wiring board 10. This dark layer 18 is a layer for making the mesh wiring layer 20 difficult to see with the naked eye by suppressing the reflection of visible light by the mesh wiring layer 20. The dark layer 18 covers the entire area of the mesh wiring layer 20. This dark layer 18 may cover the entire area of the power feeding section 40.

The dark layer 18 may be a dark layer such as black. Moreover, the dark layer 18 may be a layer with a roughened surface.

The surface roughness Ra of the dark layer 18 is 5 nm or more and 100 nm or less. When the surface roughness Ra of the dark layer 18 is 5 nm or more, reflection of visible light on the surface of the dark layer 18 can be suppressed. Therefore, the mesh wiring layer 20 covered with the dark-colored layer 18 can be difficult to see with the naked eye of an observer. By setting the surface roughness Ra of the dark layer 18 to 100 or less, the haze value of the dark layer 18 can be prevented from becoming too high. This makes it difficult for the viewer to recognize the presence of the dark layer 18. Therefore, the mesh wiring layer 20 covered with the dark-colored layer 18 can be difficult to see with the naked eye of an observer. In this case, the surface roughness Ra is determined based on JIS B 0601:2013 using a laser microscope (manufactured by Keyence Corporation, VK-X250 (control unit), VK-X260 (measurement unit), laser wavelength 408 nm). You can ask for it.

The dark layer 18 is formed by, for example, performing a darkening process (blackening process) on a part of the metal material that makes up the mesh wiring layer 20 or the power feeding part 40, thereby forming a part of the mesh wiring layer 20 or the power feeding part 40. It may be formed from. In this case, the dark layer 18 may be formed as a layer made of metal oxide or metal sulfide. Further, the dark layer 18 may be formed on the surface of the mesh wiring layer 20 or the power supply section 40 as a coating film of a dark material or a plating layer of nickel, chromium, or the like. Further, the dark layer 18 may be formed by roughening the surface of the mesh wiring layer 20 or the power feeding section 40.

Although not shown, a protective layer may be formed on the primer layer 15 to cover the mesh wiring layer 20 and the dark layer 18. The protective layer protects the mesh wiring layer 20 and is formed to cover at least the mesh wiring layer 20 of the substrate 11 . Materials for the protective layer include acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate, modified resins and copolymers thereof, polyvinyl resins such as polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, and polyvinyl butyral. Colorless and transparent insulating resins such as and copolymers thereof, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin can be used.

Referring to FIG. 3 again, a power supply section 40 is electrically connected to the mesh wiring layer 20. This power supply section 40 is made of a substantially rectangular conductive thin plate member. The longitudinal direction of the power feeding section 40 is parallel to the X direction, and the lateral direction of the power feeding section 40 is parallel to the Y direction. Further, the power feeding unit 40 is arranged at the longitudinal end of the substrate 11 (that is, the negative end in the Y direction). As the material of the power supply unit 40, for example, metal materials such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or alloys containing these metals can be used. This power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 via a power supply line (not shown) when the wiring board 10 is incorporated into the image display device 60 (see FIGS. 1 and 2). . Note that although the power feeding section 40 is provided on the first surface 11a of the substrate 11, the present invention is not limited thereto, and part or all of the power feeding section 40 may be located outside the periphery of the substrate 11. Further, by forming the power supply unit 40 flexibly, the power supply unit 40 may be configured to wrap around the side or back surface of the image display device 60. In this case, the power supply unit 40 may be electrically connected to the communication module 63 on the side or back side of the image display device 60.

Next, a method for manufacturing the wiring board 10 according to this embodiment will be described with reference to FIGS. 7(a) to 7(i).

First, as shown in FIG. 7A, a substrate 11 including a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a is prepared. The substrate 11 has transparency.

Next, as shown in FIG. 7(b), a primer layer 15 is formed on the substrate 11. At this time, the primer layer 15 may be formed over substantially the entire first surface 11a of the substrate 11. Methods for forming the primer layer 15 include roll coating, gravure coating, gravure reverse coating, microgravure coating, slot die coating, die coating, knife coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, and flexography. Printing may also be used.

Next, a mesh wiring layer 20 including a plurality of first direction wirings 21 and a plurality of second direction wirings 22 connecting the plurality of first direction wirings 21 is formed on the primer layer 15.

At this time, first, as shown in FIG. 7(c), a first metal film 51 is laminated over substantially the entire surface of the primer layer 15. The first metal film 51 may be formed by, for example, a sputtering method. The thickness of the first metal film 51 may be greater than or equal to 10 nm and less than or equal to 1000 nm. In this embodiment, the first metal film 51 may contain copper.

Next, as shown in FIG. 7D, a second metal film 52 is laminated on the first metal film 51. The second metal film 52 may be formed using an electrolytic plating method using the first metal film 51 as a seed layer. The thickness of the second metal film 52 may be greater than or equal to 50 nm and less than or equal to 4990 nm. In this embodiment, the second metal film 52 may contain copper.

Next, as shown in FIG. 7E, a photocurable insulating resist 53 is applied to substantially the entire surface of the second metal film 52. Then, as shown in FIG. Examples of this photocurable insulating resist 53 include organic resins such as acrylic resins and epoxy resins.

Subsequently, as shown in FIG. 7(f), an insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 53 is patterned by photolithography to form an insulating layer 54 (ie, a resist pattern). At this time, the insulating layer 54 is formed so that the second metal film 52 corresponding to the first direction wiring 21 and the second direction wiring 22 is exposed.

Next, as shown in FIG. 7G, the second metal film 52 and the first metal film 51 located on the first surface 11a of the substrate 11 in a portion not covered with the insulating layer 54 are removed. At this time, the substrate 11 is treated by wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or a combination thereof. The second metal film 52 and the first metal film 51 are etched so that the first surface 11a is exposed.

Subsequently, as shown in FIG. 7(h), the insulating layer 54 is removed. In this case, the insulating layer on the second metal film 52 can be formed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or a dry treatment using oxygen plasma. 54 is removed.

Next, as shown in FIG. 7(i), a dark layer 18 is formed. In this case, the dark layer 18 may be formed by subjecting a portion of the first metal film 51 and the second metal film 52 to a darkening process (blackening process). Further, the dark layer 18 may be formed on the surfaces of the first metal film 51 and the second metal film 52 as a coating film of a dark material or a plating layer of nickel, chromium, or the like. Furthermore, the dark layer 18 may be formed by roughening the surfaces of the first metal film 51 and the second metal film 52.

In this way, the substrate 11, the primer layer 15 provided on the first surface 11a of the substrate 11, the mesh wiring layer 20 disposed on the primer layer 15, and the dark layer 18 covering the mesh wiring layer 20 are formed. A wiring board 10 having the following is obtained. In this case, the mesh wiring layer 20 includes a first direction wiring 21 and a second direction wiring 22. At this time, the power feeding section 40 may be formed by a portion of the first metal film 51 and the second metal film 52.

Thereafter, by laminating the display device 61 on the wiring board 10 via the first transparent adhesive layer 95 and the second transparent adhesive layer 96, the wiring board 10 and the display device 61 laminated on the wiring board 10 are separated. An image display device 60 is obtained.

Next, the operation of this embodiment having such a configuration will be described.

As shown in FIGS. 1 and 2, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40 . In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

According to this embodiment, the mesh wiring layer 20 includes the first metal layers 21a and 22a disposed on the primer layer 15 and the second metal layers 21b and 22b disposed on the first metal layers 21a and 22a. It has Thereby, the height _H1 of the first direction wiring 21 and the height _H2 of the second direction wiring 22 can be effectively increased. Therefore, the resistance values of the first direction wiring 21 and the second direction wiring 22 can be reduced.

Further, according to the present embodiment, the surface roughness Ra of the dark layer 18 is 5 nm or more and 100 nm or less. Thereby, reflection of visible light on the surface of the dark layer 18 can be suppressed. Furthermore, the haze value of the dark layer 18 can be prevented from becoming too high, making it difficult for an observer to recognize the presence of the dark layer 18. Therefore, the mesh wiring layer 20 covered with the dark-colored layer 18 can be difficult to see with the naked eye of an observer.

Further, according to the present embodiment, the wiring board 10 includes the board 11, the primer layer 15 disposed on the board 11, the mesh wiring layer 20 disposed on the primer layer 15, and the mesh wiring layer 20. A covering dark layer 18 is provided. Further, the substrate 11 has transparency. Further, the mesh wiring layer 20 has a conductor portion as a forming portion of an opaque conductor layer and a mesh pattern formed of a large number of openings 23. Therefore, the transparency of the wiring board 10 is ensured. Thereby, when the wiring board 10 is placed on the display device 61, the display device 61 can be viewed through the opening 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not hindered.

Next, a modification of the wiring board will be described.

8 and 9 show a first modification of the wiring board. The modified example shown in FIGS. 8 and 9 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, and the other configurations are similar to those shown in FIGS. 1 to 7 described above. are the same. In FIGS. 8 and 9, the same parts as those in the form shown in FIGS. 1 to 7 are given the same reference numerals, and detailed explanations will be omitted.

In the wiring board 10 shown in FIG. 8, a dummy wiring layer 30 is provided along the periphery of the mesh wiring layer 20. The dummy wiring layer 30 may be covered with the dark layer 18. This dummy wiring layer 30, unlike the mesh wiring layer 20, does not substantially function as an antenna.

As shown in FIG. 9, the dummy wiring layer 30 is composed of repeated dummy wirings 30a having a predetermined unit pattern shape. That is, the dummy wiring layer 30 includes a plurality of dummy wirings 30a having the same shape, and each dummy wiring 30a is electrically connected to the mesh wiring layer 20 (i.e., the first direction wiring 21 and the second direction wiring 22). is independent. Further, the plurality of dummy wirings 30a are regularly arranged throughout the dummy wiring layer 30. The plurality of dummy wirings 30a are spaced apart from each other in the plane direction and are arranged to protrude above the substrate 11. That is, each dummy wiring 30a is electrically independent from the mesh wiring layer 20, the power supply section 40, and other dummy wiring 30a. The shape of each dummy wiring 30a is approximately L-shaped when viewed from above.

In this case, the dummy wiring 30a has a shape in which a part of the unit pattern shape (see FIG. 4) of the mesh wiring layer 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the dummy wiring layer 30, and makes it difficult to see the mesh wiring layer 20 disposed on the substrate 11.

As shown in FIG. 9, the dummy wiring 30a extends parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a includes a first portion 31a extending parallel to the first direction wiring 21 and a second portion 32a extending parallel to the second direction wiring 22. The first portion 31a has a shape in which a portion of the first direction wiring 21 is missing. Further, the second portion 32a has a shape in which a part of the second direction wiring 22 is missing. Note that the other configurations of the first portion 31a and the second portion 32a are similar to the configurations of the first direction wiring 21 and the second direction wiring 22, so detailed description thereof will be omitted here. In this way, by extending the dummy wiring 30a in parallel to the first direction wiring 21 or the second direction wiring 22, the mesh wiring layer 20 disposed on the substrate 11 can be made more difficult to see. The aperture ratio of the dummy wiring layer 30 may be the same as or different from the aperture ratio of the mesh wiring layer 20, but it is preferably close to the aperture ratio of the mesh wiring layer 20.

In this way, by providing the dummy wiring layer 30 that is electrically independent from the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made unclear. This makes it difficult to see the mesh wiring layer 20 on the surface of the image display device 60, and makes it difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

10 and 11 show a second modification of the wiring board. The modified examples shown in FIGS. 10 and 11 differ in that two or more dummy wiring layers 30A and 30B having different aperture ratios are provided around the mesh wiring layer 20, and the other configurations are as described above. This is substantially the same as the configuration shown in FIGS. 1 to 9. In FIGS. 10 and 11, the same parts as those in the form shown in FIGS. 1 to 9 are given the same reference numerals, and detailed explanations will be omitted.

In the wiring board 10 shown in FIG. 10, a plurality of (two in this case) dummy wiring layers 30A and 30B (i.e., a first dummy wiring layer 30A and a second A dummy wiring layer 30B) is provided. Specifically, a first dummy wiring layer 30A is arranged along the periphery of the mesh wiring layer 20, and a second dummy wiring layer 30B is arranged along the periphery of the first dummy wiring layer 30A. The dummy wiring layers 30A and 30B may be covered with the dark layer 18. The dummy wiring layers 30A and 30B, unlike the mesh wiring layer 20, do not substantially function as an antenna.

As shown in FIG. 11, the first dummy wiring layer 30A is composed of repeated dummy wirings 30a1 having a predetermined unit pattern shape. Further, the second dummy wiring layer 30B is composed of repeating dummy wirings 30a2 having a predetermined unit pattern shape. That is, each of the dummy wiring layers 30A and 30B includes a plurality of dummy wirings 30a1 and 30a2 having the same shape, and each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring layer 20, respectively. Furthermore, the dummy wirings 30a1 and 30a2 are regularly arranged throughout the dummy wiring layers 30A and 30B, respectively. The dummy wirings 30a1 and 30a2 are spaced apart from each other in the plane direction, and are arranged so as to protrude above the substrate 11. Each dummy wiring 30a1, 30a2 is electrically independent from the mesh wiring layer 20, the power supply section 40, and other dummy wirings 30a1, 30a2, respectively. The shape of each dummy wiring 30a1 and 30a2 is approximately L-shaped when viewed from above.

In this case, the dummy wirings 30a1 and 30a2 have a shape in which a part of the unit pattern shape (see FIG. 4) of the mesh wiring layer 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the first dummy wiring layer 30A, and the difference between the first dummy wiring layer 30A and the second dummy wiring layer 30B. The mesh wiring layer 20 can be made less visible. As shown in FIG. 11, the dummy wirings 30a1 and 30a2 extend parallel to the first direction wiring 21 or the second direction wiring 22. Specifically, the dummy wiring 30a1 includes a first portion 31a1 extending parallel to the first direction wiring 21 and a second portion 32a1 extending parallel to the second direction wiring 22. The dummy wiring 30a2 includes a first portion 31a2 extending parallel to the first direction wiring 21 and a second portion 32a2 extending parallel to the second direction wiring 22.

Note that the area of each dummy wiring 30a1 of the first dummy wiring layer 30A is larger than the area of each dummy wiring 30a2 of the second dummy wiring layer 30B. In this case, the line width of each dummy interconnect 30a1 is the same as the line width of each dummy interconnect 30a2, but the line width of each dummy interconnect 30a1 may be thicker than the line width of each dummy interconnect 30a2. . Note that the other configurations of the dummy wirings 30a1 and 30a2 are the same as the configuration of the dummy wiring 30a in the first modification, so detailed explanations will be omitted here.

In this modification, the aperture ratio of the mesh wiring layer 20 and the two or more dummy wiring layers 30A, 30B gradually increases from the mesh wiring layer 20 toward the dummy wiring layers 30A, 30B that are far from the mesh wiring layer 20. It is preferable that the In other words, it is preferable that the aperture ratio of each dummy wiring layer gradually increases from those closer to the mesh wiring layer 20 to those farther from the mesh wiring layer 20. In this case, the aperture ratio of the first dummy wiring layer 30A is preferably larger than the aperture ratio of the mesh wiring layer 20. It is preferable that the aperture ratio of the second dummy wiring layer 30B is larger than that of the first dummy wiring layer 30A. Thereby, the outer edges of the mesh wiring layer 20 and the dummy wiring layers 30A and 30B can be further obscured. Therefore, the mesh wiring layer 20 can be made even less visible on the surface of the image display device 60.

By arranging the dummy wiring layers 30A and 30B that are electrically independent from the mesh wiring layer 20 in this manner, the outer edge of the mesh wiring layer 20 can be made more unclear. This makes it difficult to see the mesh wiring layer 20 on the surface of the image display device 60, and makes it difficult for the user of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye. Note that three or more dummy wiring layers having mutually different aperture ratios may be provided around the mesh wiring layer 20.

FIG. 12 shows a third modification of the wiring board. The modification shown in FIG. 12 differs in the planar shape of the mesh wiring layer 20, and the other configurations are substantially the same as those shown in FIGS. 1 to 11 described above. In FIG. 12, the same parts as those in the form shown in FIGS. 1 to 11 are given the same reference numerals, and detailed explanations will be omitted.

FIG. 12 is an enlarged plan view showing a mesh wiring layer 20 according to a third modification. In FIG. 12, the first direction wiring 21 and the second direction wiring 22 intersect obliquely (that is, at a non-perpendicular angle), and the shape of each opening 23 is rhombic in plan view. The first direction wiring 21 and the second direction wiring 22 are not parallel to either the X direction or the Y direction, but one of the first direction wiring 21 and the second direction wiring 22 is parallel to the X direction or the Y direction. It may be parallel to .

It is also possible to appropriately combine the plurality of components disclosed in the above embodiment and each modification as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiment and each modification.

Claims (8)

A wiring board,
a substrate including a first surface and a second surface located on the opposite side of the first surface;
a primer layer disposed on the first surface of the substrate;
a mesh wiring layer disposed on the primer layer;
and a dark layer covering the mesh wiring layer,
The substrate has transparency,
The mesh wiring layer is
a first metal layer disposed on the primer layer;
a second metal layer disposed on the first metal layer,
The wiring board, wherein the dark layer has a surface roughness Ra of 5 nm or more and 100 nm or less. The first metal layer and the second metal layer have different crystal properties, and the second metal layer has a diffraction angle 2θ of the (111) plane measured using CuKα rays as an X-ray source. The wiring board according to claim 1, wherein the wiring board has crystal characteristics such that the angle is less than 43.4°. The wiring board according to claim 1, wherein the dielectric loss tangent of the board is 0.002 or less. 2. The mesh wiring layer according to claim 1, wherein when the wiring board is bent 180 degrees along the circumference of a cylinder having a diameter of 1 mm and then stretched 100 times, the amount of increase in the resistance value of the mesh wiring layer is 20% or less. wiring board. The wiring board according to claim 1, wherein the wiring board has a millimeter wave transmission/reception function, and the mesh wiring layer functions as an array antenna. The wiring board according to claim 1, further comprising a dummy wiring layer electrically independent from the mesh wiring layer provided around the mesh wiring layer. A plurality of the dummy wiring layers are provided, and the aperture ratio of the mesh wiring layer and the dummy wiring layer increases stepwise from the mesh wiring layer toward the dummy wiring layer that is far from the mesh wiring layer. , The wiring board according to claim 6. The wiring board according to any one of claims 1 to 7,
An image display device comprising: a display device laminated on the wiring board.

Images