JP2023150370A - Endoscope imaging device and endoscope - Google Patents

Abstract

To provide an endoscope imaging device and an endoscope whose sizes are small.SOLUTION: An endoscope imaging device acquires an image of an object to be observed, and comprises: a lens barrel internally provided with an imaging lens; an imaging element for receiving light passed through the imaging lens, and performing photoelectric conversion; a circuit board to which the imaging element is electrically connected; and a signal cable electrically connected to the imaging element. The circuit board comprises at least a first flat surface part, a second flat surface part connected to the first flat surface part by a first bent part, and a third flat surface part connected to the second flat surface part by a second bent part. The first flat surface part and the third flat surface part are parallel to an optical axis of the imaging lens. The second flat surface part is inclined with respect to the optical axis. The signal cable is electrically connected to a back surface of the third flat surface part opposed to the second flat surface part.SELECTED DRAWING: Figure 2

Description

The present invention relates to an endoscope imaging device and an endoscope that acquire images of an observation target, and particularly to an endoscope imaging device and an endoscope with a bent circuit board.

In recent years, diagnosis and the like using an endoscope system including an endoscope light source device, an endoscope (endoscope scope), and a processor device have been widely performed.
It has an insertion section that is inserted into the body of a subject, and the illumination light from the endoscope light source device is irradiated onto the observation target through the insertion section. An endoscope generates an image signal by capturing an image of an observation target irradiated with illumination light using an image sensor. The processor device performs image processing on image signals generated by the endoscope and generates observation images to be displayed on a monitor. The image sensor is electrically connected to a signal cable via a circuit board made of a flexible wiring board or the like, and the signal cable is electrically connected to a processor device. Since the physical burden on the subject is small, the endoscope is required to have a thin insertion section that is inserted into the body of the subject.

For example, the endoscope of Patent Document 1 includes an observation optical system, a solid-state image sensor that photoelectrically converts images from the observation optical system, a flexible circuit board electrically connected to the solid-state image sensor, and a flexible circuit board that is electrically connected to the solid-state image sensor. an imaging device comprising: a plurality of electronic components and a plurality of signal cables electrically connected to a digital circuit board; a first resin that seals the electronic components; and a second resin that seals a connection portion of the signal cables. Has equipment.
In the imaging device, the plurality of signal cables and the flexible circuit board are bent so that the first resin and the second resin are arranged between the flexible circuit boards, and the first resin and the flexible circuit board are bent. A second resin is adhesively fixed to the flexible circuit board.

Japanese Patent Application Publication No. 2010-069231

In the endoscope imaging device of Patent Document 1 mentioned above, the size is reduced by bending the flexible circuit board, but there is currently a demand for further size reduction.
An object of the present invention is to provide an endoscopic imaging device and an endoscope that are small in size.

In order to achieve the above-mentioned object, one aspect of the present invention is an endoscope imaging device that acquires an image of an observation target, the lens barrel having an imaging lens provided therein, and an endoscope imaging device that acquires an image of an observation target. The circuit board includes an image sensor that receives light and performs photoelectric conversion, a circuit board to which the image sensor is electrically connected, and a signal cable that is electrically connected to the image sensor. It has a flat part, a second flat part connected to the first flat part by the first bent part, and a third flat part connected to the second flat part by the second bent part. , the first plane part and the third plane part are parallel to the optical axis of the imaging lens, the second plane part is inclined with respect to the optical axis, and the second plane part of the third plane part is parallel to the optical axis of the imaging lens. The present invention provides an endoscope imaging device in which a signal cable is electrically connected to the back surface facing the portion.

It is preferable that electronic components are mounted on the back surface of the second plane section that faces the first plane section.
On the back surface of the second flat part facing the first flat part, the electronic component mounted on the second bent part side is higher than the electronic component mounted on the first bent part side. is preferred.
It is preferable that the first bent part and the second bent part have curved surfaces, and the radius of curvature of the first bent part and the radius of curvature of the second bent part are different.
It is preferable that an image sensor is mounted on the surface of the first plane part facing the second plane part, and that a prism is disposed between the lens barrel and the image sensor.
The prism is disposed on the light-receiving surface of the image sensor, and has a slope facing the second bent part, and when viewed from a direction perpendicular to the light-receiving surface of the image sensor, the circuit board is placed on the slope of the prism. It is preferable that at least a portion of the second bent portions of the two parts overlap.

A part of the slope of the prism and a part of the second bent part are connected with a photocurable adhesive, and a part of the first bent part and/or a part of the second flat part are connected to each other of the signal cable. It is preferable that the part and/or the third plane part be connected with a photocurable adhesive.
The circuit board has a third bent part provided on the opposite side of the first bent part of the first flat part, and a fourth flat part connected to the first flat part by the third bent part. However, it is preferable that an image sensor is mounted on the fourth plane part, and that the light-receiving surface of the image sensor is perpendicular to the optical axis.
A part of the fourth plane part and a part of the second bending part are connected with a photocurable adhesive, and a part of the first bending part and/or a part of the second plane part and a signal It is preferable that a part of the cable and/or the third plane part be connected with a photocurable adhesive.

The thickness of the first plane part, the second plane part, and the third plane part is preferably thicker than the thickness of the first bending part and the second bending part.
The thickness of the first plane part, the second plane part, the third plane part and the fourth plane part is thicker than the thickness of the first bending part, the second bending part and the third bending part. is preferred.
It is preferable that the angle between the first plane part and the second plane part differs depending on the size of the imaging lens.
It is preferable that the maximum width of the second plane part is narrower than the maximum width of the first plane part.
It is preferable that the maximum width of the third plane part is narrower than the maximum width of the second plane part.
It has a holder that holds the lens barrel and a connecting member that connects the holder and the signal cable, and the maximum width part of the first flat part and the maximum width part of the second flat part are connected. It is preferable that the side surface of the third plane part is exposed from the member and is included in the connecting member.
Further, one aspect of the present invention provides an endoscope including the endoscopic imaging device of the present invention.

According to the present invention, it is possible to provide an endoscope imaging device and an endoscope that are small in size.

1 is a schematic diagram showing an example of an endoscope system according to an embodiment of the present invention. FIG. 1 is a schematic perspective view showing a first example of an endoscopic imaging device according to an embodiment of the present invention. FIG. 2 is a schematic perspective view showing a connecting member of a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 1 is a schematic side view showing a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 1 is a schematic side view showing a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 1 is a schematic top view showing a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 1 is a schematic plan view showing an example of a circuit board of a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 1 is a schematic side sectional view showing an example of a circuit board of a first example of an endoscope imaging device according to an embodiment of the present invention. FIG. 3 is a schematic side view showing a second example of the endoscopic imaging device according to the embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An endoscope imaging device and an endoscope according to the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings.
Note that the figures described below are illustrative for explaining the present invention, and the present invention is not limited to the figures shown below.
In addition, in the following, "~" indicating a numerical range includes the numerical values written on both sides. For example, when ε is a numerical value ε _α to a numerical value ε _β , the range of ε is a range that includes the numerical value α and the numerical value β, and expressed in mathematical symbols as ε _α ≦ε≦ε _β .
In the following description, "parallel", "perpendicular", "perpendicular", etc. include error ranges generally allowed in the relevant technical field.

[Endoscope system]
An endoscope system irradiates an observation site within the body of a subject with illumination light (not shown), images the observation site, and displays the observation site based on the image signal obtained by imaging. It generates an image and displays the display image.
FIG. 1 is a schematic diagram showing an example of an endoscope system according to an embodiment of the present invention.
The endoscope system 10 includes an endoscope 12, a light source device 14, and a processor device 16. The endoscope system 10 has the same configuration as a general endoscope except for the endoscope imaging device 20 (see FIG. 2) of the endoscope 12, which will be described later.

The endoscope 12 has an endoscopic imaging device. Although not shown in detail, the endoscope 12 includes an insertion section inserted into the subject, an operation section connected to the insertion section, and a universal cord extending from the operation section. , a curved part that continues to the tip, and a flexible part that connects the curved part and the operating part. The endoscopic imaging device will be described later.

At the distal end of the endoscope 12, there is an endoscope imaging device 20 (see FIG. ) is provided. The bending portion is configured to be able to bend in a direction perpendicular to the longitudinal axis of the insertion portion, and the bending operation of the bending portion is operated by the operating portion. Further, the flexible portion is configured to be relatively flexible enough to be deformable following the shape of the insertion path of the insertion portion.

The operation section is provided with a button for operating the imaging operation of the endoscope imaging device 20 (see FIG. 2) at the distal end, a knob for operating the bending operation of the bending section, and the like. In addition, the operation section is provided with an introduction port through which a treatment tool such as an electric scalpel is introduced, and the inside of the insertion section is provided with a treatment tool such as forceps that reaches the tip from the introduction port and is inserted through the insertion port. There is a tool channel.

A connector is provided at the end of the universal cord, and the endoscope 12 connects, via the connector, a light source device 14 that generates illumination light emitted from an illumination optical system at the distal end, and an endoscope imaging device at the distal end. 20 (see FIG. 2).

The processor device 16 processes the input video signal to generate video data of the observed region, and displays the generated video data on a monitor (not shown) or records it on a storage medium such as a hard disk. Note that the processor device 16 may be configured by a processor such as a personal computer.

The light source device 14 emits red light (R), in order to image the observation target region in the body cavity with the endoscope imaging device 20 (see FIG. 2) of the endoscope 12 and obtain an image signal of the observation target. Illumination light such as white light or specific wavelength light consisting of three primary color lights such as green light (G) and blue light (B) is generated and supplied to the endoscope 12, and a light guide in the endoscope 12 is generated. etc., and is emitted from the illumination optical system at the distal end of the insertion section of the endoscope 12 to illuminate the observation target site within the body cavity.

A light guide or a group of electric wires (signal cable) is accommodated inside the insertion section, the operation section, and the universal cord. The illumination light generated by the light source device 14 is guided to the illumination optical system at the distal end via the light guide, and is also transmitted between the endoscope imaging device 20 (see FIG. 2) at the distal end and the processor device 16. At least one of the signal and the power is transmitted via the wire group.

Furthermore, the endoscope system 10 may further include a water supply tank that stores cleaning water and the like, a suction pump that suctions the aspirate (including the supplied cleaning water, etc.) in the body cavity, and the like. Furthermore, a supply pump or the like may be provided for supplying cleaning water in the water supply tank or external gas such as air to a conduit (not shown) within the endoscope.

[First example of endoscopic imaging device]
FIG. 2 is a schematic perspective view showing a first example of the endoscopic imaging device according to the embodiment of the present invention, and FIG. 3 is a connecting member of the first example of the endoscopic imaging device according to the embodiment of the present invention. FIG. 4 and 5 are schematic side views showing a first example of an endoscope imaging device according to an embodiment of the present invention. Note that FIG. 5 shows the endoscope imaging device 20 of FIG. 4 with the connecting member 40 removed.
The endoscope imaging device 20 shown in FIG. 2 is mounted on the distal end of the endoscope 12 of the endoscope system 10 shown in FIG. The endoscope imaging device 20 is also referred to as a camera head.

The endoscope imaging device 20 shown in FIG. 2 is for acquiring images of an observation target. The endoscopic imaging device 20 includes, for example, an imaging lens 23, a lens barrel 22 that holds the imaging lens 23, a holder 24, an imaging element 25, a circuit board 26, a prism 27, and a signal cable 28. Furthermore, the endoscope imaging device 20 includes a connecting member 40.
Here, the direction parallel to the optical axis C of the imaging lens 23 is defined as the X direction. Of the two directions perpendicular to the optical axis C, one is defined as the Y direction, and the remaining directions are defined as the Z direction. The Y direction corresponds to the width direction of the endoscopic imaging device 20, and the Z direction corresponds to the height direction of the endoscopic imaging device 20.

An image sensor 25 and electronic components 30 and 30a are mounted on the circuit board 26. Note that "mounted" means electrically connected.
As shown in FIG. 5, the circuit board 26 includes at least a first plane part 26a, a second plane part 26c connected to the first plane part 26a and a first bent part 26b, and a second plane part 26c. It has a portion 26c and a third flat portion 26e connected by a second bent portion 26d.
The first plane part 26a and the third plane part 26e are parallel to the optical axis C of the imaging lens 23, and the second plane part 26c is inclined with respect to the optical axis C. That is, the second plane part 26c is inclined at an angle with respect to the optical axis C of the imaging lens 23, and the second plane part 26c is not parallel to the optical axis C. For example, the second flat portion 26c is inclined such that the second bent portion 26d is located above the first bent portion 26b in the Z direction.
A signal cable 28 is electrically connected to the back surface 26h of the third plane section 26e, which faces the second plane section 26c. More specifically, the circuit board 26 is provided with a plurality of connection terminals (not shown) on the back surface 26h through which signals or power to and from the image sensor 25 and the electronic components 30 and 30a are inputted and outputted. A signal line 28a of the signal cable 28 is electrically connected to the connection terminal.
By configuring the circuit board 26 as described above, the height of the endoscope imaging device 20 in the Z direction can be reduced, and the endoscope imaging device 20 can be miniaturized. Furthermore, as will be described later, the space of the endoscope imaging device 20 can be effectively utilized.

The prism 27 is, for example, a right-angled prism in which an entrance surface 27a and an exit surface 27b are perpendicular to each other. Further, the prism 27 has a slope 27c connecting the entrance surface 27a and the exit surface 27b. The slope 27c is the reflective surface of the prism 27. The prism 27 is an example of an optical member disposed between the lens barrel 22 and the image sensor 25, and the optical member is not limited to the prism 27. Note that the arrangement of the prism 27 is not particularly limited either. Further, the prism 27 is not necessarily necessary depending on the position where the image sensor 25 is arranged, and a configuration in which another optical member is arranged may be used.

The imaging lens 23 is an optical element that forms an image of the light incident on the imaging lens 23 on the light receiving surface 25a of the imaging element 25. The imaging lens 23 is held by the lens barrel 22.

The lens barrel 22 is a cylindrical member that holds one or more imaging lenses 23 therein. The lens barrel 22 holds the imaging lens 23 so that the optical axis C of the imaging lens 23 is perpendicular to the entrance surface 27a of the prism 27 (see FIG. 5). The endoscope imaging device 20 has, for example, three imaging lenses 23 and is held by a lens barrel 22.

The configurations of the imaging lens 23 and the lens barrel 22 are not particularly limited. For example, the configuration may include one imaging lens 23, or may include two, four or more imaging lenses 23. Moreover, each imaging lens 23 may be a convex lens or a concave lens.

The image sensor 25 is an image sensor that captures an image by converting the light imaged by the imaging lens 23 into an electrical signal through photoelectric conversion. The image sensor 25 is a conventionally known image sensor, and can be a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

The image sensor 25 is arranged on the opposite side of the lens barrel 22 with respect to the holder 24. As shown in FIG. 4, the image sensor 25 is electrically connected to the surface 26f of the first plane portion 26a of the circuit board 26 via, for example, conductive bumps 34. Further, as shown in FIG. 4, the image sensor 25 is mounted on the circuit board 26 so that the light-receiving surface 25a is parallel to the optical axis C of the imaging lens 23. Note that "mounted" means electrically connected.
An underfill layer (not shown) can also be provided between the image sensor 25 and the circuit board 26 in order to firmly connect the image sensor 25 and the circuit board 26.

Bump 34 is made of metal or alloy. More specifically, bump 34 is made of solder. The bumps 34 formed of solder are also called solder balls. Note that the bumps 34 are not limited to solder or the like as long as they can electrically connect the image sensor 25 and the circuit board 26. Further, the image sensor 25 and the circuit board 26 may be directly electrically connected.
In addition, the underfill layer relieves stress that is generated at the joint between the image sensor 25 and the circuit board 26, such as the bump 34, due to the difference in thermal expansion coefficient between the image sensor 25 and the circuit board 26. . The underfill layer firmly connects the image sensor 25 and the circuit board 26, increasing the reliability of the electrical connection and providing a highly reliable endoscopic imaging device 20.
The underfill agent constituting the underfill layer is not particularly limited, and any material used as a sealing resin between the image sensor 25 and the circuit board 26 can be used as appropriate. For example, a one-component heat-curable epoxy resin is used as the underfill agent. In this case, after supplying the underfill agent, the underfill layer is formed by heating and holding at a predetermined temperature.

The circuit board 26 is a board on which the image sensor 25 is mounted. Further, in addition to the image sensor 25, electronic components 30 and 30a, for example, are mounted on the circuit board 26. The electronic components 30 and 30a are for driving the image sensor 25, and include, but are not particularly limited to, a voltage regulator, a resistor, a capacitor, and the like. The voltage regulator is a device that stabilizes the voltage applied to the image sensor 25, and outputs a constant voltage to the image sensor 25.
The circuit board 26 is made of, for example, a flexible board, and is made of, for example, a flexible printed board.

The first bent portion 26b and the second bent portion 26d of the circuit board 26 are both formed of curved surfaces. The radius of curvature of the first bent portion 26b and the second bent portion 26d may be the same or different. As shown in FIG. 5, the first bent portion 26b has a larger radius of curvature than the second bent portion 26d. By adjusting the radius of curvature of the first bent part 26b and the second bent part 26d, the space between the first flat part 26a and the second flat part 26c and the space between the second flat part 26c and the second flat part 26c can be adjusted. The space between the flat part 26e and the flat part 26e of No. 3 can be adjusted.
The first bent portion 26b and the second bent portion 26d are not limited to being made only of curved surfaces as long as they have a curved surface. For example, they may have a structure that has a flat surface and a curved surface. .
The radius of curvature is obtained as follows. First, an image of the circuit board 26 from the side is acquired. Using the acquired image, a corresponding location corresponding to the radius of curvature of the first bent portion 26b and the second bent portion 26d is specified. Fit a curve to the relevant location and measure the radius of curvature of the curve using a ruler. The measured value is the radius of curvature.
Note that in order to measure the radius of curvature described above, the acquired image of the circuit board 26 may be imported into a computer and the radius of curvature of the first bent portion 26b and the second bent portion 26d may be measured using software. included. Fitting a curve to a corresponding location corresponding to the radius of curvature and measuring the radius of curvature of the curve using a ruler also includes performing it on a computer using software.

The image sensor 25 is mounted on the surface 26f of the first flat section 26a, as shown in FIG. Further, an electronic component 30 is also mounted on the surface 26f of the first plane portion 26a.
Electronic components 30, 30a are mounted on the back surface 26g of the second plane section 26c, which is opposite to the front surface 26f of the first plane section 26a. Since the second plane part 26c is inclined with respect to the first plane part 26a, a wide area is created between the first plane part 26a and the second plane part 26c. Therefore, a large-sized electronic component 30a can be mounted. For example, on the back surface 26g of the second flat portion 26c, the electronic component 30a mounted on the second bent portion 26d side is higher than the electronic component 30 mounted on the first bent portion 26b side. In this way, electronic components of various sizes can be mounted, and the space of the endoscope imaging device 20 can be effectively utilized.
Note that, as described above, a connection terminal (not shown) is provided on the back surface 26h of the third plane portion 26e, which faces the second plane portion 26c. An electronic component 30 is mounted on the surface 26i of the third plane portion 26e. The arrangement of the image sensor 25, electronic components 30, 30a, connection terminals, etc. on the circuit board 26 is not particularly limited.

The signal line 28a (see FIG. 4) of the signal cable 28 is electrically connected to the connection terminal provided on the back surface 26h (see FIG. 5) of the third flat portion 26e of the circuit board 26, and the image sensor 25 and the signal cable 28 are electrically connected. The image sensor 25 converts the light into an electrical signal, and this electrical signal is transmitted via the signal cable 28. The signal cable 28 is inserted through the insertion section, operation section, universal cord, etc. of the endoscope, and is electrically connected to the processor device 16 (see FIG. 1).

The signal cable 28 is not particularly limited as long as it has a signal line 28a and an outer sheath 28d forming an outer periphery. For example, as shown in FIG. 5, the signal cable 28 includes a plurality of signal wires 28a, a covering layer 28b covering each signal wire 28a, and a covering layer 28b covering the entire periphery of the plurality of signal wires 28a. It has a shield conductor 28c and an outer skin 28d that covers the shield conductor 28c. The signal cable 28 is a multicore cable in which a plurality of signal lines 28a are bundled, a shield conductor 28c is provided around the periphery, and the signal cable 28 is housed in a cylindrical outer sheath 28d.
As described above, the outer skin 28d constitutes the outer periphery of the signal cable 28. The covering layer 28b, the shield conductor 28c, and the outer skin 28d have, for example, a cylindrical shape. Further, the shield conductor 28c of the signal cable 28 is referred to as a shield. The signal cable 28 has, for example, five signal lines 28a. The number of signal lines 28a depends on the configuration of the endoscope imaging device 20 and is not particularly limited, and may be two, three, four, or six or more.

The prism 27 is arranged between the lens barrel 22 and the image sensor 25 with a cover glass 31 interposed therebetween. The prism 27 guides the light that has passed through the imaging lens 23 to the light receiving surface 25a of the imaging element 25. The prism 27 bends the light that has passed through the imaging lens 23 held in the lens barrel 22 by, for example, 90 degrees at a slope 27c, that is, a reflective surface, to change the optical path, and directs the light to the light-receiving surface 25a of the image sensor 25. lead. The transmitted light that has passed through the imaging lens 23 enters the prism 27, is reflected by the slope 27c of the prism 27, that is, the reflective surface, and enters the light-receiving surface 25a of the imaging element 25.
For example, the prism 27 is arranged with the entrance surface 27a facing the base end side surface of the lens barrel 22. Further, the prism 27 is arranged with its output surface 27b facing the light receiving surface 25a of the image sensor 25. In this case, the prism 27 is placed on the cover glass 31 with its exit surface 27b facing the cover glass 31.
The cover glass 31 is placed on the light-receiving surface 25a of the image sensor 25 to protect the light-receiving surface 25a. The prism 27 and the cover glass 31 are bonded together using, for example, a photocurable adhesive. Note that a configuration without the cover glass 31 may be used.

The holder 24 is a member that holds the lens barrel 22 and the prism 27. The holder 24 is a substantially cylindrical member, into which the lens barrel 22 is fitted and holds the lens barrel 22 . The inner surface of the holder 24 and the outer peripheral surface of the lens barrel 22 are adhesively fixed.
As the adhesive for bonding the holder 24 and the lens barrel 22, various known adhesives used in conventional endoscopes can be used. The same applies to adhesives used to bond other members together.

The holder 24 has a polygonal flange portion 24b on the proximal end surface of the mounting cylinder portion 24a. Regulating members 24d are provided at both ends of the flange portion 24b in the Y direction, respectively. The regulating member 24d is, for example, a convex member. The regulating member 24d has, for example, a rectangular outer shape. As will be described later, the arm portion 40c of the connecting member 40 is engaged with the regulating member 24d.
The prism 27 is disposed between the regulating members 24d, and the entrance surface 27a is brought into contact with the flange portion 24b while being sandwiched between the regulating members 24d. Thereby, the prism 27 is positioned in the X direction. The holder 24 holds the lens barrel 22 and the prism 27 in a predetermined position, thereby controlling the relative position of the lens barrel 22 and the prism 27, that is, the relative position of the lens barrel 22 and the light receiving surface 25a of the image sensor 25. Fix the relative position of. The exit surface 27b of the prism 27 and the image sensor 25 face each other.
Here, the lens barrel 22 is adhesively fixed to the holder 24 with the relative position of the imaging lens 23 in the optical axis C direction with respect to the holder 24 adjusted so that the light receiving surface 25a of the image sensor 25 is in focus. be done. The optical axis C direction is the direction in which the optical axis C of the imaging lens 23 extends. The optical axis C direction of the imaging lens 23 is parallel to the X direction.

The connecting member 40 connects the holder 24 and the signal cable 28. Connecting member 40 retains signal cable 28 therein. The connecting member 40 is, for example, a member formed by curving a single plate, as shown in FIG. 3 . Specifically, the connecting member 40 has a shape in which one plate is bent at two bending portions extending in the optical axis C direction. Therefore, the connecting member 40 has a substantially C-shaped cross section perpendicular to the optical axis C direction.

For example, as shown in FIG. 3, the connecting member 40 has a planar bottom portion 40a formed by bending one plate, and a planar holding portion 40b continuous with the bottom portion 40a. In the connecting member 40, the holding portion 40b side is the base end 41a. The signal cable 28 is held inside the holding part 40b.
An arm portion 40c is provided on each of the flat plate-shaped holding portions 40b that face each other across the opening in the holding portion 40b. The connecting member 40 has a pair of arm portions 40c. The arm portion 40c is bent outward from the holding portion 40b on the base end 41a side, and then extends linearly. Therefore, the distance between the pair of arm portions 40c is wider at the distal end 41b than at the base end 41a, and this distance is appropriately determined in accordance with the regulating member 24d of the holder 24 shown in FIG. Further, each arm portion 40c is provided with an opening portion 40d at the tip 41b.

The opening 40d of the arm portion 40c engages with the regulating member 24d of the holder 24. The opening 40d is formed by, for example, cutting a part of the arm 40c into a rectangular shape.
Note that the opening 40d may have the same size and shape as the outer shape of the regulating member 24d. Here, the expression that the shape of the opening 40d is the same in size and shape as the outer shape of the regulating member 24d includes an error range generally allowed in the relevant technical field. Therefore, the opening 40d and the regulating member 24d may fit into any of a so-called clearance fit, an intermediate fit, and an interference fit.
Note that in the following description, "the size and shape are the same" includes the error range generally allowed in the relevant technical field, as described above.

Further, each arm portion 40c has, for example, an edge 40e parallel to the second plane portion 26c of the circuit board 26. The edge 40e is located above the second flat portion 26c in the Z direction, and when the connecting member 40 covers the circuit board 26 from above, the second flat portion 26c of the circuit board 26 is exposed.
Further, each arm portion 40c is provided with, for example, a cover portion 40f. As shown in FIG. 6, the cover parts 40f are not connected in the Y direction, and there is a gap 40g. Further, the cover portion 40f is partially provided in the X direction, and has an opening 40h on the tip 41b side of the cover portion 40f. Further, the cover portion 40f is a member disposed on the surface 26i of the third plane portion 26e of the circuit board 26. Since the cover portion 40f has the gap 40g and the opening 40h, contact with the electronic component 30 disposed on the surface 26i of the third plane portion 26e is avoided.
The connecting member 40 covers a part of the third plane portion 26e of the circuit board 26 and the tips of the prism 27 and the signal cable 28, and also serves as a cover member for the circuit board 26, the prism 27, and the signal cable 28. ing. Furthermore, the connecting member 40 also functions as a protecting member for the circuit board 26, prism 27, and signal cable 28.
Note that in the case of a configuration in which the electronic component 30 is not disposed on the surface 26i of the third flat portion 26e, the connecting member 40 does not need to provide the gap 40g and the opening 40h. It may be configured to have a cover part (not shown) that covers the entire surface.

As described above, due to the configuration including the engaging portion 41 that engages the opening 40d of the pair of arm portions 40c and the regulating member 24d of the holder 24, the opening 40d fits into the convex regulating member 24d. , the length of the endoscope imaging device 20 in the Y direction orthogonal to the optical axis C can be shortened, and an increase in the size of the endoscope imaging device 20 can be suppressed. Moreover, firm fixation between the holder 24 and the connecting member 40 can be achieved.
Note that by matching the thickness of the arm portion 40c with the height of the regulating member 24d, when the openings 40d of the pair of arm portions 40c are respectively engaged with the regulating member 24d of the holder 24, the endoscope imaging device The length of the endoscope 20 in the Y direction orthogonal to the optical axis C can be made shorter, and with this configuration, the endoscope imaging device 20 can be made more compact.

In the connecting member 40, it is preferable that the pair of arm parts 40c are bent so that the distal ends 41b of the arm parts 40c are closer to each other than the base ends 41a of the arm parts 40c. That is, it is preferable that the pair of arm portions 40c be bent in the closing direction. Thereby, by once expanding the arm portion 40c, the opening 40d of the arm portion 40c can be fitted into the regulating member 24d of the holder 24, and assembly can be easily performed.
As described above, it is preferable that the pair of arm parts 40c are bent so that the distal ends 41b of the arm parts 40c are closer to each other than the base ends 41a, but this is the state of the parts before assembly. Good too.
Further, although the arm portion 40c is provided with an opening 40d that passes through the arm portion 40c, the present invention is not limited to this, and may be a concave portion that does not penetrate but has a bottom.
The connecting member 40 is held with the signal cable 28 attached to the inside of the holding part 40b. Note that the method for attaching the signal cable 28 is not particularly limited as long as the signal cable 28 does not come off from the holding part 40b and the signal wire 28a does not come off when the endoscope is used. It is attached to the connecting member 40 using adhesive.

In addition, in the holder 24, the two regulating members 24d have the same size and shape, that is, are congruent, as described above, but may have different sizes and shapes.
Further, in the holder 24, the shape of the regulating member 24d (convex portion) is not particularly limited to the above-mentioned quadrangle, but may be a circle, an ellipse, or a polygon such as a triangle, pentagon, or hexagon. The shape may be a combination of shapes. Furthermore, instead of having only one shape, it may be a plurality of the same shapes arranged or a specific pattern.
In the engaging portion 41, one convex portion and one concave portion are engaged at one portion, but the engaging portion is not limited to one, and a plurality of portions are engaged with one convex portion. A structure having parts may be used.

Note that the size of the convex portion of the holder 24 is preferably large enough to cover at least a portion of the side surface 27d of the prism 27, for example. By making the convex portion large enough to cover at least a portion of the side surface 27d of the prism 27, the prism 27 can be more stably clamped and fixed, and stable position regulation can be achieved. Furthermore, it can be used to position the prism in the Y direction with respect to the holder during assembly.
The upper limit of the size of the convex portion of the holder 24 can be set to a size that completely covers the side surface 27d of the prism 27.
Furthermore, in the holder 24, by providing two regulating members 24d facing each other, the prism 27 and the circuit board 26 are surrounded by the arm portion 40c. Thereby, the engagement between the holder 24 and the connecting member 40 is stabilized, and the prism 27 and the circuit board 26 can also be protected.
Although the holder 24 is configured to include two regulating members 24d, the present invention is not limited to this as long as the size is not increased, and three or more convex portions may be provided. That is, the number of engaging parts can also be three or more.

Furthermore, by connecting the holder 24 and the signal cable 28 to each other, the connection member 40 connects the connection terminal on the circuit board 26 and the signal line 28a of the signal cable 28 when the signal cable 28 is pulled. This prevents the connection between the connection terminal and the signal line 28a from being broken due to the connection between the connection terminal and the signal line 28a being pulled.
The metal material forming the connecting member 40 is not particularly limited, but a metal material with high thermal conductivity is preferable. In consideration of workability, availability, strength, etc., stainless steel and copper alloy are preferable for the connecting member 40.

The arm portion 40c of the connecting member 40 and the regulating member 24d of the holder 24, as well as the holding portion 40b of the connecting member 40 and the outer cover 28d of the signal cable 28, are adhesively fixed using, for example, an adhesive. When adhesively fixed, the adhesive is in a cured state. Note that as long as the holding portion 40b of the connecting member 40 and the outer skin 28d of the signal cable 28 can be fixed, the method is not limited to adhesive fixing using an adhesive.
For example, an epoxy resin adhesive, a silicone adhesive, or an acrylic adhesive can be used as the adhesive.

Further, a fixing member 35 may be provided on the outer skin 28d of the signal cable 28. The fixing member 35 is provided on the outer sheath 28d of the signal cable 28, and is tightened to fix the outer sheath 28d to the signal line 28a of the signal cable 28. The fixing member 35 is, for example, an annular member, and the outer cover 28d is fixed to the signal line 28a of the signal cable 28 by tightening the fixing member 35 by caulking.
The fixing member 35 is not limited to an annular shape, but may be a polygonal annular member as long as the outer cover 28d can be fixed to the signal line 28a of the signal cable 28. Moreover, the fixing member 35 may not be annular, but may have a structure having a gap without continuing around the circumference, for example, may be in the shape of a C ring. In this case, by caulking the distant ends, the distant ends approach each other, the opening of the fixing member 35 becomes smaller, and the outer cover 28d is fixed to the signal line 28a of the signal cable 28. be done. Furthermore, the fixing member 35 is made of, for example, metal or an alloy.

Furthermore, as described above, the signal cable 28 used in the endoscope imaging device 20 has a structure in which a plurality of signal lines 28a are bundled with an outer sheath 28d. 28d or the connecting member 40 requires protection. The connecting member 40 is made of metal or the like, and the rigidity of the rear end surface 40j of the connecting member 40 rapidly changes, so that the load on the signal cable 28 is largely concentrated. Therefore, if the signal line 28a is exposed outside the connecting member 40 due to the bending movement of the endoscope or sliding with other contents and the outer cover 28d is displaced, the signal line 28a may be damaged near the rear end surface 40j of the connecting member 40. occurs.
However, by fixing the outer sheath 28d of the signal cable 28 with the fixing member 35, the fixing strength of the outer sheath 28d of the signal cable 28 can be increased. When the signal cable 28 is fixed so as to overlap the connecting member 40, the adhesion area of the outer cover 28d of the signal cable 28 is reduced, but this reduced amount can be compensated for by the fixing strength of the fixing member 35. Thereby, the strength of the connection of the signal cable 28 is high, and the reliability of the connection of the signal cable 28 can be increased.

In the endoscope imaging device 20, an observation image captured by the imaging element 25 from the imaging lens 23 is focused on the light receiving surface 25a of the imaging element 25 and converted into an electrical signal, and this electrical signal is transmitted via the signal cable 28. The observed image is outputted to the processor device 16 (see FIG. 1), converted into a video signal, and displayed on a monitor connected to the processor device 16.

In the endoscopic imaging device 20, as shown in FIG. 5, the slope 27c of the prism 27 faces the second bent portion 26d. At least a portion of the second bent portion 26d of the circuit board 26 overlaps the slope 27c of the prism 27 when viewed from the direction perpendicular to the light receiving surface 25a of the image sensor 25, which is the Z direction in FIG. preferable. As a result, the second bent portion 26d enters into the space on the slope 27c side of the prism 27, and the space on the slope 27c side of the prism 27 is effectively utilized to move the endoscope imaging device 20 in the optical axis C direction. The length can be shortened, and the endoscope imaging device 20 can be downsized in the optical axis C direction.

In the endoscopic imaging device 20, a portion of the slope 27c of the prism 27 and a portion of the second bent portion 26d of the circuit board 26 are connected with a photocuring adhesive (not shown), and the first bent portion A portion of the portion 26b and/or a portion of the second plane portion 26c and a portion of the signal cable 28 and/or the third plane portion 26e are connected with a photocurable adhesive (not shown). It is preferable that Thereby, the shape of the circuit board 26 can be maintained, and the manufacturing time of the endoscope imaging device 20 can be shortened.
The photocurable adhesive is, for example, an adhesive that is cured by ultraviolet light having a wavelength of about 100 to 400 nm, visible light having a wavelength of more than 400 nm and less than 780 nm, or infrared light having a wavelength of about 780 nm to 1 mm. The photocurable adhesive is, for example, an epoxy resin photocurable adhesive, an acrylic resin photocurable adhesive, or a silicone photocurable adhesive. Alternatively, the adhesive may be a combination of photocuring and thermosetting. This photocurable adhesive can also be used to bond the prism 27 and the cover glass 31 described above.

Here, FIG. 7 is a schematic plan view showing an example of a circuit board of the first example of the endoscopic imaging device according to the embodiment of the present invention, and FIG. 8 is a schematic plan view showing an example of the circuit board of the endoscopic imaging device according to the embodiment of the present invention. It is a typical side sectional view showing an example of the circuit board of the 1st example. Note that in FIGS. 7 and 8, the same components as those of the endoscopic imaging device 20 shown in FIGS. 2 and 4 to 6 are denoted by the same reference numerals, and detailed explanation thereof will be omitted.
7 and 8 show the circuit board 26 before being bent, and show the circuit board 26 in an unfolded state.

The circuit board 26 shown in FIG. 7 has a first bending area 43a and a second bending area 43b. Further, the circuit board 26 is provided with a recess 45 on the surface 42a of the tip 42c.
Between the tip 42c and the first bending region 43a is a region 42e that becomes the first flat portion 26a. The image sensor 25 is mounted in the region 42e.
Between the first bending region 43a and the second bending region 43b is a region 42f that becomes the second plane portion 26c. A plurality of electronic components 30a and 30 are mounted in the region 42f.
A region 42g that is closer to the rear end 42d than the second bending region 43b is the third flat portion 26e. A plurality of electronic components 30 are mounted in the region 42g.
The first bent region 43a is the region that becomes the first bent portion 26b, and the second bent region 43b is the region that becomes the second bent portion 26d.

In the circuit board 26, for example, a thin portion 44a is provided in the first bending region 43a, and a thin portion 44b is provided in the second bending region 43b. By providing the above-mentioned thin parts 44a and 49 on the circuit board 26, the first bending area 43a and the second bending area 43b can be easily bent, and the first bending part 26b and the second bending part 26d can be easily bent. A predetermined radius of curvature can be achieved more reliably. This does not affect the connection state of the electronic component 30 near the first bending portion 26b and the electronic component 30a near the second bending portion 26d, and improves the connection state of the electronic components 30, 30a. Can be done.
The thin portions 44a and 44b described above are formed by, for example, making the circuit board 26 itself thin. More specifically, for example, when the circuit board 26 has a ground layer, the thin portions 44a and 44b are formed by removing the resist layer formed on the ground layer.
The sizes of the thin parts 44a and 44b are appropriately determined depending on the sizes of the first bending area 43a and the second bending area 43b, respectively. The thin portion 44a may be formed in the entire area or in a portion of the first bending region 43a. The end of the thin portion 44a may be aligned with the first bent portion 26b.

Furthermore, the thin portion 44b may be formed over the entire area or only partially within the second bending region 43b. The end of the thin portion 44b may be aligned with the end of the bent portion.
Note that the present invention is not limited to the configuration in which the thin portions 44a and 44b are provided, but may be a configuration in which the thin portions 44a and 44b are not provided. However, as described above, it is preferable to provide the thin portions 44a and 44b because the first bent portion 26b and the second bent portion 26d can more reliably have a predetermined radius of curvature.
When the thin parts 44a and 44b are provided, the thickness T ₁ (see FIG. 8) of the first flat part 26a, the second flat part 26c, and the third flat part 26e is the same as that of the first bent part 26b and the third flat part 26e. ₂ (see FIG. 8). As a result, the thickness T ₁ (see FIG. 8) of the first bent portion 26b and the second bent portion 26d is relatively smaller than that of the first bent portion 26b, the second bent portion 26d, and the third bent portion. This is preferable because it is thinner than the thickness T ₂ (see FIG. 8) of 26j, and the first bent portion 26b and the second bent portion 26d can be made to have a predetermined radius of curvature more reliably.
The thickness T ₁ (see FIG. 8) of the first plane part 26a, the second plane part 26c, and the third plane part 26e, and the thickness T ₂ ( (see FIG. 8), the corresponding location on the circuit board 26 can be measured using a caliper or a micrometer.

In the circuit board 26 shown in FIG. 7 and FIG. Bend so that the back surfaces 42b are facing each other. As a result, the circuit board 26 has a first bent portion 26b and a second bent portion 26d, as shown in FIG. When bending the first bending region 43a, it is bent based on the first bending surface _Lb1 . When bending the second bending region 43b, it is bent based on the second bending surface _Lb2 . In this way, the circuit board 26 is folded at multiple folding regions. In FIG. 8, the first bending surface Lb ₁ and the second bending surface Lb ₂ are parallel, but are not limited to this, and may not be parallel. Note that since the first bending surface Lb ₁ is provided in the first bending region 43a and the second bending surface Lb ₂ is provided in the second bending region 43b, the first bending surface Lb ₁ and the second bending surface Lb 1 are It is not perpendicular to the bending surface _Lb2 .
It is preferable that the circuit boards 26 are all bent in the same direction. As a result, unlike the first bent portion 26b and the second bent portion 26d, there is no bending region in the Y direction of the endoscopic imaging device 20, and there is no bending region in the internal space of the endoscopic imaging device 20. The proportion can be reduced.

Further, in the circuit board 26, if the maximum width _W2 of the second plane part 26c is narrower than the maximum width _W1 of the first plane part 26a, the first bending area 43a is easy to bend, and the first bending part This is preferable since it is easy to form 26b. Furthermore, the closer to the image sensor 25 the more complex the circuit becomes and _the larger the mounting area is required. ₂ is preferably narrower. That is, it is preferable that the maximum width W ₁ of the first plane portion 26a is wider than the maximum width W ₂ of the second plane portion 26c.
Further, if the maximum width W ₃ of the third flat portion 26e is narrower than the maximum width W ₂ of the second flat portion 26c, it is easier to bend the second bending region 43b and form the second bent portion 26d. Therefore, it is preferable. Similar to the first flat part 26a, the closer to the image sensor 25 the more complex the circuit becomes, and _{a larger} mounting area is required. It is preferable that the maximum width _W3 of the flat portion 26e is narrower. That is, it is preferable that the maximum width W ₂ of the second plane portion 26c is wider than the maximum width W ₃ of the third plane portion 26e.
The maximum width W ₁ of the first plane portion 26a, the maximum width W ₂ of the second plane portion 26c, and the maximum width W ₃ of the third plane portion 26e described above are all based on the corresponding portion of the circuit board 26. Obtained by measuring using calipers or micrometers.

The maximum width portion of the first flat portion 26a and the maximum width portion of the second flat portion 26c of the circuit board 26 are exposed from the connecting member 40, and the side surface of the third flat portion 26e is exposed from the connecting member 40. Preferably, it is included in In this state, the length of the endoscope imaging device 20 in the Y direction, that is, the width of the endoscope imaging device 20 can be reduced.
Note that the maximum width portion of the first plane portion 26a of the circuit board 26 refers to the portion of the above-mentioned maximum width _W1 of the first plane portion 26a. The maximum width portion of the second flat portion 26c of the circuit board 26 refers to the portion having the maximum width _W2 of the second flat portion 26c described above.

The recess 45 holds an underfill agent for forming an underfill layer (not shown). The recess 45 becomes a liquid reservoir of the underfill agent, and the underfill agent does not flow out from the circuit board 26. The recess 45 allows the underfill agent to be efficiently supplied between the image sensor 25 and the circuit board 26.
After the underfill agent is supplied to the recess 45, the underfill agent is supplied between the imaging element 25 and the circuit board 26 due to capillary action. Thereafter, for example, the underfill agent is maintained at a temperature depending on the underfill agent, and the underfill agent is cured to form an underfill layer. Providing the recess 45 makes it easier to supply the underfill agent between the image sensor 25 and the circuit board 26.

[Second example of endoscopic imaging device]
The endoscopic imaging device 20 is not limited to the configuration shown in FIGS. 2 to 5. A second example of the endoscopic imaging device will be described below.
FIG. 9 is a schematic side view showing a second example of the endoscopic imaging device according to the embodiment of the present invention. In FIG. 9, the same components as those of the endoscope imaging device 20 shown in FIG. 2 and FIGS. 4 to 6 are denoted by the same reference numerals, and detailed explanation thereof will be omitted. Further, in FIG. 9, illustration of the connecting member is omitted.

The endoscopic imaging device 20a shown in FIG. 9 is different from the endoscopic imaging device 20 shown in FIGS. 2 and 4 to 6 in the arrangement of the imaging element 25 and the configuration of the circuit board 46, The other configuration is the same as that of the endoscope imaging device 20 shown in FIG. 2 and FIGS. 4 to 6.
In the endoscope imaging device 20a, the light receiving surface 25a of the imaging element 25 is arranged perpendicularly to the optical axis C. A cover glass 31 is arranged on the light receiving surface 25a of the image sensor 25.
The circuit board 46 has the same configuration as the above-described circuit board 26 except that it has a fourth plane part connected to the first plane part 26a and the third bent part 26j. The image sensor 25 is mounted on the surface 26m of the fourth flat portion 26k on the opposite side of the second bent portion 26d. A conductive bump 34 is provided between the image sensor 25 and the surface 26m of the fourth plane portion 26k. Note that the image sensor 25 is mounted on the surface 26m, and since it is preferable that the light receiving surface 25a be perpendicular to the optical axis C, it is preferable that the surface 26m be parallel to the Z direction.
The endoscopic imaging device 20a can obtain the same effects as the above-described endoscopic imaging device 20 even if the arrangement of the imaging element 25 and the configuration of the circuit board 46 are different from those of the endoscopic imaging device 20. .

Also in the endoscopic imaging device 20a, a part of the slope 27c of the prism 27 and a part of the second bent part 26d are connected with a photocurable adhesive, and a part of the first bent part 26b and/or the second bent part 26d are It is preferable that a part of the second flat part 26c and a part of the signal cable 28 and/or the third flat part 26e are connected with a photocurable adhesive. Thereby, the shape of the circuit board 46 can be maintained, and the manufacturing time of the endoscope imaging device 20a can be shortened.
Further, the thicknesses (not shown) of the first plane part 26a, the second plane part 26c, the third plane part 26e, and the fourth plane part 26k are the same as those of the first bending part 26b and the second bending part. 26d and the third bent portion 26j (not shown). As a result, the thicknesses of the first bent portion 26b, the second bent portion 26d, and the third bent portion 26j are relatively smaller than those of the first bent portion 26b, the second bent portion 26d, and the third bent portion 26j. It is preferable because it becomes thinner than the thickness of , and as described above, the first bent part 26b, the second bent part 26d, and the third bent part 26j can be more reliably made to have a predetermined radius of curvature. .

Note that in the endoscopic imaging device 20 and the endoscopic imaging device 20a described above, the angle formed by the first plane portion 26a and the second plane portion 26c differs depending on the size of the imaging lens 23. For example, when the diameter of the imaging lens 23 is large, the size in the Z direction increases, so the range in which the second plane part 26c can be tilted becomes wider, and as a result, the angle of inclination of the second plane part 26c becomes larger. On the other hand, when the diameter of the imaging lens 23 is small, the size in the Z direction becomes small, so the range in which the second plane part 26c can be tilted becomes narrow, and as a result, the inclination angle of the second plane part 26c becomes small.
The angle formed by the first plane part 26a and the second plane part 26c varies depending on the size of the prism 27 as well as the imaging lens 23. Similar to the above-described imaging lens 223, if the prism 27 is large, for example, if the length of the entrance surface 27a in the Z direction is long, the angle formed by the first plane part 26a and the second plane part 26c will become large. As a result, the inclination angle of the second plane portion 26c increases. On the other hand, if the prism 27 is small, for example if the length of the incident surface 27a in the Z direction is short, the angle between the first plane part 26a and the second plane part 26c becomes small, and as a result, the second The angle of inclination of the flat portion 26c becomes smaller.
For this reason, for example, if the optical systems such as the imaging lens 23 and the prism 27 are different, the angle between the first plane part 26a and the second plane part 26c will be different, and as a result, the angle between the first plane part 26a and the second plane part 26c will be different. The inclination angle of 26c is also different. The angle formed by the first plane part 26a and the second plane part 26c and the inclination angle of the second plane part 26c may differ depending on the model of the endoscope imaging device.

The angle between the first plane part 26a and the second plane part 26c is obtained as follows. First, images of the circuit boards 26 and 46 from the side are acquired. Using the acquired image, the first plane part 26a and the second plane part 26c are specified, and the angle between the first plane part 26a and the second plane part 26c is specified. Next, measure the angle of the specified angle using a protractor. The measured value is the angle formed by the first plane part 26a and the second plane part 26c.
Note that in order to measure the angle formed by the first plane part 26a and the second plane part 26c, the acquired images of the circuit boards 26, 46 are imported into a computer, and software is used to measure the angle formed by the first plane part 26a and the second plane part 26c. It also includes measuring the angle formed by the portion 26a and the second flat portion 26c. Measuring the angle of a specified angle using a protractor also includes performing it on a computer using software.

The present invention is basically constructed as described above. Although the endoscopic imaging device and endoscope of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements and changes can be made without departing from the spirit of the present invention. Of course you can.

10 Endoscope system 12 Endoscope 14 Light source device 16 Processor device 20, 20a Endoscope imaging device 22 Lens barrel 23 Imaging lens 24 Holder 24a Mounting cylinder portion 24b Flange portion 24d Regulating member 25 Image sensor 25a Light receiving surface 26 Circuit board 26a First plane part 26b First bent part 26c Second plane part 26d Second bent part 26e Third plane part 26f, 26i Front surface 26g, 26h Back surface 26j Third bent part 26k Fourth Plane part 26m Surface 27 Prism 27a Incident surface 27b Output surface 27c Slope 27d Side surface 28 Signal cable 28a Signal line 28b Covering layer 28c Shield conductor 28d Outer skin 30, 30a Electronic components 31 Cover glass 34 Bump 35 Fixing member 40 Connecting member 40a Bottom 40 b retention Part 40c Arm part 40d, 40h Opening part 40e Edge 40f Cover part 40g Gap 41 Engagement part 41a Base end 41b, 42c Tip 42a Front surface 42b Back surface 42d Rear end 42e, 42f, 42g Region 43a First bending region 43b Second bending region Bending area 44a, 44b Thin wall portion 45 Recessed portion 46 Circuit board 49 Thin wall portion C Optical axis Lb ₁ First bending surface Lb ₂ Second bending surface T ₁ , T ₂ Thickness W ₁ , W ₂ , W ₃ Maximum width

Claims (16)

An endoscopic imaging device that acquires images of an observation target,
a lens barrel with an imaging lens installed inside;
an imaging element that receives light that has passed through the imaging lens and photoelectrically converts it;
a circuit board to which the image sensor is electrically connected;
and a signal cable electrically connected to the image sensor,
The circuit board includes at least a first plane part, a second plane part connected to the first plane part by a first bent part, and connected to the second plane part by a second bent part. and a third plane portion,
The first plane part and the third plane part are parallel to the optical axis of the imaging lens, and the second plane part is inclined with respect to the optical axis,
An endoscope imaging device, wherein the signal cable is electrically connected to a back surface of the third plane section that faces the second plane section. The endoscope imaging device according to claim 1, wherein electronic components are mounted on a back surface of the second plane portion that faces the first plane portion. On the back surface of the second planar portion facing the first planar portion, the electronic components mounted on the second bent portion side are higher than the electronic components mounted on the first bent portion side. The endoscopic imaging device according to claim 2, wherein the imaging device has a high intensity. The first bent part and the second bent part have curved surfaces,
The endoscopic imaging device according to claim 1, wherein a radius of curvature of the first bent portion and a radius of curvature of the second bent portion are different. The imaging device is mounted on a surface of the first planar portion facing the second planar portion, and a prism is disposed between the lens barrel and the imaging device. 4. The endoscopic imaging device according to any one of 4. The prism is disposed on the light-receiving surface of the image sensor, and has a slope facing the second bent portion,
The device according to claim 5, wherein at least a portion of the second bent portion of the circuit board overlaps the slope of the prism when viewed from a direction perpendicular to the light receiving surface of the image sensor. Endoscope imaging device. The prism is disposed on the light-receiving surface of the image sensor, and has a slope facing the second bent portion,
A part of the slope of the prism and a part of the second bent part are connected with a photocurable adhesive,
A part of the first bent part and/or a part of the second flat part and a part of the signal cable and/or the third flat part are connected with the photocurable adhesive. The endoscopic imaging device according to claim 5 or 6. The circuit board includes a third bent portion on the opposite side of the first bent portion of the first flat portion, and a fourth bent portion connected to the first flat portion by the third bent portion. It has a flat part of
The endoscopic imaging device according to any one of claims 1 to 3, wherein the imaging device is mounted on the fourth plane portion, and a light receiving surface of the imaging device is perpendicular to the optical axis. . A part of the fourth plane part and a part of the second bent part are connected with a photocurable adhesive,
A part of the first bent part and/or a part of the second flat part and a part of the signal cable and/or the third flat part are connected with the photocurable adhesive. The endoscopic imaging device according to claim 8. The thickness of the first plane part, the second plane part, and the third plane part is thicker than the thickness of the first bending part and the second bending part, according to claims 1 to 7. The endoscopic imaging device according to any one of the items. The thickness of the first plane part, the second plane part, the third plane part, and the fourth plane part are the same as the thickness of the first plane part, the second plane part, and the third plane part. The endoscopic imaging device according to claim 8 or 9, wherein the endoscope imaging device is thicker than the thickness of the portion. The endoscopic imaging device according to any one of claims 1 to 11, wherein the angle formed by the first plane part and the second plane part differs depending on the size of the imaging lens. The endoscopic imaging device according to any one of claims 1 to 12, wherein the maximum width of the second plane part is narrower than the maximum width of the first plane part. The endoscopic imaging device according to any one of claims 1 to 13, wherein the maximum width of the third plane part is narrower than the maximum width of the second plane part. a holder for holding the lens barrel;
a connecting member connecting the holder and the signal cable;
The maximum width part of the first plane part and the maximum width part of the second plane part are exposed from the connection member, and the side surface of the third plane part is included in the connection member. The endoscopic imaging device according to any one of claims 1 to 14. An endoscope comprising the endoscopic imaging device according to any one of claims 1 to 15.