JP2023142423A5 - - Google Patents
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- Publication number
- JP2023142423A5 JP2023142423A5 JP2022049333A JP2022049333A JP2023142423A5 JP 2023142423 A5 JP2023142423 A5 JP 2023142423A5 JP 2022049333 A JP2022049333 A JP 2022049333A JP 2022049333 A JP2022049333 A JP 2022049333A JP 2023142423 A5 JP2023142423 A5 JP 2023142423A5
- Authority
- JP
- Japan
- Prior art keywords
- surface portion
- lead wire
- board
- component
- degrees
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 75
- 239000003990 capacitor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049333A JP7610135B2 (ja) | 2022-03-25 | 2022-03-25 | 遊技機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049333A JP7610135B2 (ja) | 2022-03-25 | 2022-03-25 | 遊技機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023142423A JP2023142423A (ja) | 2023-10-05 |
| JP2023142423A5 true JP2023142423A5 (enExample) | 2024-07-24 |
| JP7610135B2 JP7610135B2 (ja) | 2025-01-08 |
Family
ID=88205795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022049333A Active JP7610135B2 (ja) | 2022-03-25 | 2022-03-25 | 遊技機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7610135B2 (enExample) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284830A (ja) * | 1997-04-11 | 1998-10-23 | Sony Corp | マルチディスペンサ型ハンダ塗布装置及びハンダ処理方法 |
| JP2000208933A (ja) * | 1999-01-19 | 2000-07-28 | Sony Corp | 部品分離装置 |
| JP5669282B1 (ja) * | 2013-10-24 | 2015-02-12 | 山佐株式会社 | 制御装置、遊技機、及び制御装置の組付け方法 |
| JP2018166983A (ja) * | 2017-03-30 | 2018-11-01 | 京楽産業．株式会社 | 遊技機 |
| JP7525797B2 (ja) * | 2022-03-25 | 2024-07-31 | サミー株式会社 | 遊技機 |
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2022
- 2022-03-25 JP JP2022049333A patent/JP7610135B2/ja active Active