JP2023142416A5 - - Google Patents

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Publication number
JP2023142416A5
JP2023142416A5 JP2022049326A JP2022049326A JP2023142416A5 JP 2023142416 A5 JP2023142416 A5 JP 2023142416A5 JP 2022049326 A JP2022049326 A JP 2022049326A JP 2022049326 A JP2022049326 A JP 2022049326A JP 2023142416 A5 JP2023142416 A5 JP 2023142416A5
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JP
Japan
Prior art keywords
surface portion
lead wire
board
component
degrees
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JP2022049326A
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English (en)
Japanese (ja)
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JP7610132B2 (ja
JP2023142416A (ja
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Priority to JP2022049326A priority Critical patent/JP7610132B2/ja
Priority claimed from JP2022049326A external-priority patent/JP7610132B2/ja
Publication of JP2023142416A publication Critical patent/JP2023142416A/ja
Publication of JP2023142416A5 publication Critical patent/JP2023142416A5/ja
Application granted granted Critical
Publication of JP7610132B2 publication Critical patent/JP7610132B2/ja
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JP2022049326A 2022-03-25 2022-03-25 遊技機 Active JP7610132B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022049326A JP7610132B2 (ja) 2022-03-25 2022-03-25 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022049326A JP7610132B2 (ja) 2022-03-25 2022-03-25 遊技機

Publications (3)

Publication Number Publication Date
JP2023142416A JP2023142416A (ja) 2023-10-05
JP2023142416A5 true JP2023142416A5 (cg-RX-API-DMAC7.html) 2024-07-24
JP7610132B2 JP7610132B2 (ja) 2025-01-08

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ID=88205770

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JP2022049326A Active JP7610132B2 (ja) 2022-03-25 2022-03-25 遊技機

Country Status (1)

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JP (1) JP7610132B2 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284830A (ja) * 1997-04-11 1998-10-23 Sony Corp マルチディスペンサ型ハンダ塗布装置及びハンダ処理方法
JP2000208933A (ja) 1999-01-19 2000-07-28 Sony Corp 部品分離装置
JP5669282B1 (ja) * 2013-10-24 2015-02-12 山佐株式会社 制御装置、遊技機、及び制御装置の組付け方法
JP2018166983A (ja) 2017-03-30 2018-11-01 京楽産業．株式会社 遊技機
JP7525797B2 (ja) 2022-03-25 2024-07-31 サミー株式会社 遊技機

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