JP2023137833A - Piezoelectric transducer and oscillator - Google Patents

Abstract

To provide a piezoelectric transducer capable of securing a measurement accuracy of an oscillatory frequency and an oscillator.SOLUTION: A piezoelectric transducer 10 comprises: a package 2 having a chip mounting region 40; and a piezoelectric vibration piece. The chip mounting region 40 has a shape having a long direction L and a short direction W. In the chip mounting region 40, motor terminals 41 and 42, chip electrodes 61 to 66, and connection wirings 71 to 76 are formed. Each of the monitor terminals 41 and 42 is provided so that a position is different to the long direction L. Each of side edges 41a and 42a of the monitor terminals 41 and 42 is opposite to each connection wiring. When comparing a first half region 40A and a second half region 40B which become a center shaft o1 of the chip mounting region 40, a total area of the chip electrode in the first half region 40A and each connection wiring is smaller than a total area of the chip electrode in the second half region 40B and each connection wiring. A center of gravity of at least one of the monitor terminals 41 and 42 is in the first half region 40A.SELECTED DRAWING: Figure 5

Description

The present invention relates to a piezoelectric vibrator and an oscillator.

For example, oscillators equipped with piezoelectric vibrators using crystals are used in electronic devices such as mobile phones. The piezoelectric vibrator includes a piezoelectric vibrating piece and a package that hermetically seals the piezoelectric vibrating piece. An integrated circuit chip that processes signals from the piezoelectric vibrator is mounted on the lower surface (chip mounting surface) of the package.

A monitor terminal for measuring the oscillation frequency and other wiring are formed on the chip mounting surface (see, for example, Patent Documents 1 and 2). When manufacturing a piezoelectric vibrator, a contact probe pin (measuring terminal) of a measuring device is brought into contact with a monitor terminal, and the piezoelectric vibrating piece is vibrated to measure the frequency.

Patent No. 3715481 Patent No. 3403159

In recent years, there has been a demand for smaller piezoelectric vibrators. As piezoelectric vibrators become smaller, the area of the chip mounting surface becomes smaller. Therefore, the distance between the monitor terminal and other wiring may become small. When bringing a contact probe pin into contact with a monitor terminal to measure the oscillation frequency, there is a possibility that the contact probe pin may accidentally come into contact with the wiring. In that case, the measurement accuracy of the oscillation frequency may be affected.

One aspect of the present disclosure aims to provide a piezoelectric vibrator and an oscillator that can ensure measurement accuracy of oscillation frequency.

In order to solve the above problems, the piezoelectric vibrator and oscillator of the present disclosure employ the configuration shown below.

[1] A piezoelectric vibrator according to one aspect of the present disclosure includes a vibrator package having a chip mounting area in which an integrated circuit chip is mounted, and a piezoelectric vibrating piece mounted on the vibrator package, The chip mounting area has a shape having a longitudinal direction and a lateral direction in a plan view, and a pair of monitor terminals for measuring the oscillation frequency of the piezoelectric vibrating piece and the integrated circuit chip are provided in the chip mounting area. A plurality of chip electrodes to which the terminals of the chip electrodes are connected, and a plurality of connection wirings connected to the chip electrodes are formed, and the pair of monitor terminals are provided at different positions in the longitudinal direction, and the pair of monitor terminals are provided at different positions in the longitudinal direction. Both side edges of the monitor terminal in the short direction are opposed to the connection wiring, and have a first half region on one side and a first half region on the other side with the central axis along the longitudinal direction of the chip mounting area as a boundary. In comparison with the second half area, the total area of the chip electrode and the connection wiring in the first half area is smaller than the total area of the chip electrode and the connection wiring in the second half area. At least one of the monitor terminals has a center of gravity in the first half region.

According to the piezoelectric vibrator of this embodiment, since the center of gravity of the monitor terminal is located in the first half area where the total area of the chip electrodes and connection wiring is small, the monitor terminal and the conductive part (chip electrode and connection wiring) are Easy to maintain distance. Therefore, even if the contact probe pin of the measuring device is misaligned when the contact probe pin is brought into contact with the monitor terminal, the contact probe pin is less likely to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

[2] In the piezoelectric vibrator according to the aspect of [1] above, the distance between one side edge of the monitor terminal and the connection wiring opposite thereto, and the distance between the other side edge of the monitor terminal and the connection wiring opposite thereto. It is preferable that the distance from the connection wiring is equal.

According to the piezoelectric vibrator of this aspect, the distance between one side edge and the connection wiring is equal to the distance between the other side edge and the connection wiring, so it is easy to ensure the distance between the monitor terminal and the connection wiring. Therefore, the contact probe pin becomes difficult to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

[3] In the piezoelectric vibrator according to the aspect [1] or [2] above, the side edge of the monitor terminal and the connection wiring facing the side edge have a distance of 50 μm or more from each other. It is preferable to have.

According to the piezoelectric vibrator of this aspect, even if the contact probe pin of the measuring device is misaligned when the contact probe pin is brought into contact with the monitor terminal, the contact probe pin is less likely to come into contact with the connection wiring.

[4] In the piezoelectric vibrator according to any one of the aspects [1] to [3] above, at least a part of the side edge of the monitor terminal is in contact with the connection wiring facing the side edge. is preferred.

According to the piezoelectric vibrator of this embodiment, it is easy to ensure a distance between the monitor terminal and the connection wiring. Therefore, it is possible to make it difficult for the contact probe pin to come into contact with the connection wiring, and to increase the area of the monitor terminal.

[5] In the piezoelectric vibrator according to the aspect [4] above, at least one of the pair of monitor terminals has a rectangular shape in a plan view, and a part of the side edge is connected to four of the rectangular monitor terminals. A linear chamfer is formed on at least one of the corners, and a part of the connection wiring may be formed parallel to the chamfer.

According to the piezoelectric vibrator of this embodiment, it is easy to ensure a distance between the monitor terminal and the connection wiring. Therefore, it is possible to make it difficult for the contact probe pin to come into contact with the connection wiring, and to increase the area of the monitor terminal.

[6] An oscillator according to one aspect of the present disclosure includes the piezoelectric vibrator according to any one of the aspects [1] to [5] above, and the integrated circuit chip mounted in the chip mounting area.

According to the oscillator of this aspect, since it includes the piezoelectric vibrator according to the present disclosure described above, it is easy to ensure a distance between the monitor terminal and the conductive part (chip electrode and connection wiring). Therefore, even if the contact probe pin of the measuring device is misaligned when the contact probe pin is brought into contact with the monitor terminal, the contact probe pin is less likely to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

According to one aspect of the present disclosure, it is possible to provide a piezoelectric vibrator and an oscillator that can ensure measurement accuracy of oscillation frequency.

FIG. 2 is an external perspective view of the oscillator in the first embodiment. FIG. 3 is a plan view showing the oscillator in the first embodiment with the sealing plate removed. 3 is a cross-sectional view corresponding to line II in FIG. 2. FIG. FIG. 2 is an exploded perspective view of the oscillator in the first embodiment. FIG. 3 is a schematic bottom view of the piezoelectric vibrator in the first embodiment. FIG. 7 is a schematic bottom view of a piezoelectric vibrator in a second embodiment. FIG. 7 is a schematic bottom view of a piezoelectric vibrator in a third embodiment. FIG. 7 is a schematic bottom view of a piezoelectric vibrator in a fourth embodiment.

Hereinafter, embodiments of a vibrator package, a piezoelectric vibrator, and an oscillator of the present disclosure will be listed, and their configurations will be described with appropriate reference to the drawings. Note that each drawing used in the following description may show characteristic portions in an enlarged manner for convenience. The dimensional ratio of each component may differ from the actual one. The materials, dimensions, etc. illustrated in the following description are just examples. The present disclosure can be implemented with appropriate changes without changing the gist thereof.

FIG. 1 is an external perspective view of the oscillator in the first embodiment. FIG. 2 is a plan view showing the oscillator in the first embodiment with the sealing plate removed. FIG. 3 is a cross-sectional view corresponding to line II in FIG. 2. FIG. 4 is an exploded perspective view of the oscillator in the first embodiment. FIG. 5 is a schematic bottom view of the piezoelectric vibrator in the first embodiment.

In the following description, structures having the same or similar functions are given the same reference numerals, and descriptions of parts common to these structures may be omitted.

<Oscillator>
As shown in FIGS. 1 to 4, the oscillator 100 includes the piezoelectric vibrator 10 of the first embodiment and an integrated circuit chip 20.
The oscillator 100 can be applied to, for example, a single-function oscillator for a watch. The oscillator 100 can be applied to a timing control device that controls operation timing. The oscillator 100 can be applied to devices that provide time, calendar, etc.

<Piezoelectric vibrator> (first embodiment)
The piezoelectric vibrator 10 is a so-called ceramic package type surface-mounted vibrator.
The piezoelectric vibrator 10 includes a package 2 (a vibrator package) and a piezoelectric vibrating piece 3.

The piezoelectric vibrator 10 has a rectangular parallelepiped shape. In this embodiment, the longitudinal direction of the piezoelectric vibrator 10 is referred to as a longitudinal direction L when viewed from above. The lateral direction is referred to as the width direction W. The direction perpendicular to the longitudinal direction L and the width direction W is referred to as the thickness direction T. Planar view refers to viewing from the thickness direction T.

The package 2 includes a package body 4, a sealing plate 5, and a conductive part 6.
The package body 4 includes a first base substrate 2a, a second base substrate 2b, a third base substrate 2c, and a seal ring 2d.

The first base substrate 2a is a ceramic substrate having the same outer shape as the second base substrate 2b in plan view. The first base substrate 2a is integrally joined to the lower surface of the second base substrate 2b by sintering or the like. As shown in FIGS. 3 and 4, a first penetrating portion 2e that penetrates the first base substrate 2a in the thickness direction T is formed in the first base substrate 2a. The first penetrating portion 2e has a rounded rectangular shape in plan view.

The integrated circuit chip 20 is accommodated in the first penetration portion 2e. The first through portion 2e surrounds the integrated circuit chip 20 in a plan view. The surface of the first base substrate 2a opposite to the second base substrate 2b in the thickness direction T (hereinafter referred to as the lower surface 2a1) is a surface on which external connection terminals 30 to 33, which are part of the conductive portion 6, are formed ( Terminal forming surface 34).

The second base substrate 2b is a ceramic substrate having a rectangular shape in plan view. The upper surface 2b1 of the second base substrate 2b constitutes the bottom of the cavity C.

The third base substrate 2c is a ceramic substrate having the same external shape as the second base substrate 2b in plan view. The third base substrate 2c is stacked on the upper surface of the second base substrate 2b. The third base substrate 2c is integrally joined to the upper surface of the second base substrate 2b by sintering or the like. As shown in FIGS. 2 to 4, a second penetrating portion 2f that penetrates the third base substrate 2c in the thickness direction T is formed in the third base substrate 2c. The second penetrating portion 2f has a rounded rectangular shape in plan view.

Mounting portions (mounting portion 2g and mounting portion 2h) that protrude inward in the width direction W are formed on the inner surface of the second penetration portion 2f at portions located on both sides in the width direction W.
A first electrode pad 51 and a second electrode pad 52, which are part of the conductive portion 6, are formed on the mounting portion 2g and the mounting portion 2h. A first electrode pad 51 is formed on the mounting portion 2g. A second electrode pad 52 is formed on the mounting portion 2h. The piezoelectric vibrating piece 3 is bonded to the first electrode pad 51 and the second electrode pad 52 .

Examples of ceramic materials used for the first base substrate 2a, second base substrate 2b, and third base substrate 2c include HTCC (High Temperature Co-Fired Ceramic) made of alumina, and LTCC (Low Temperature Co-Fired Ceramic) made of glass ceramic. Fired Ceramic) etc.
Cutouts 2i are formed at the four corners of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c.

As shown in FIG. 3 and the like, an integrated circuit chip 20 is arranged on the lower surface side of the second base substrate 2b (first base substrate 2a side). A piezoelectric vibrating piece 3 is arranged on the upper surface side of the second base substrate 2b (on the third base substrate 2c side).
Note that "upper" and "lower" in the lower surface 2a1, the upper surface 2b1, the lower surface 2b2, and the upper surface 2c1 indicate directions for convenience of explanation, and do not limit the posture of the oscillator 100 during use.

The seal ring 2d is a conductive frame-shaped member smaller than the outer dimensions of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c. The seal ring 2d is bonded to the upper surface of the third base substrate 2c. The inner surface of the seal ring 2d constitutes the inner surface of the cavity C together with the inner surface of the third base substrate 2c (second penetrating portion 2f). Examples of the material for the seal ring 2d include nickel-based alloys.

The sealing plate 5 is a conductive substrate. The sealing plate 5 is joined to the upper surface of the seal ring 2d. The sealing plate 5 hermetically seals the opening of the seal ring 2d. The cavity C is a space defined by the seal ring 2d, the sealing plate 5, the second base substrate 2b, and the third base substrate 2c. Cavity C is an airtightly sealed space.

As shown in FIGS. 2 to 4, the piezoelectric vibrating piece 3 is housed in a cavity C of a package 2 that is hermetically sealed. The piezoelectric vibrating piece 3 includes a piezoelectric plate 3a made of, for example, crystal. The piezoelectric plate 3a has a pair of vibrating arms (a first vibrating arm 3b and a second vibrating arm 3c) and a pair of supporting arms (a first supporting arm 3d and a second supporting arm 3e). . The piezoelectric vibrating piece 3 is mounted on the package 2 by supporting arm parts 3d and 3e supported by mounting parts 2g and 2h. The support arms 3d and 3e are bonded to the electrode pads 51 and 52 using a conductive adhesive. The piezoelectric vibrating piece 3 is supported with the first vibrating arm part 3b and the second vibrating arm part 3c floating from the second base substrate 2b. The outer surfaces of the first vibrating arm 3b and the second vibrating arm 3c have two systems that vibrate the pair of first vibrating arm 3b and second vibrating arm 3c when a predetermined voltage is applied. An excitation electrode (not shown) is provided.
The piezoelectric plate is not limited to crystal, and may be made of, for example, aluminum nitride (AlN), lead zirconate titanate (PZT), or the like.

As shown in FIG. 5, an area of the lower surface 2b2 of the second base substrate 2b surrounded by the first base substrate 2a in plan view is a chip mounting area 40 including a place where the integrated circuit chip 20 is mounted. .
The chip mounting area 40 has a pair of long sides 40a and 40b (a first long side 40a and a second long side 40b) and a pair of short sides 40c and 40d (a first short side 40c and a second short side 40b). It has a rectangular shape (rectangular shape) having side portions 40d). The lengths of the long sides 40a and 40b are larger (longer) than the lengths of the shorter sides 40c and 40d. The long sides 40a, 40b and the short sides 40c, 40d are defined by the inner peripheral edge of the first base substrate 2a.

The long sides 40a and 40b extend in the longitudinal direction L. The longitudinal direction L is the longitudinal direction of the chip mounting area 40. The short sides 40c and 40d are along the width direction W. The width direction W is the lateral direction of the chip mounting area 40. The first long side portion 40a and the second long side portion 40b are parallel and have the same length. The first short side portion 40c and the second short side portion 40d are parallel and have the same length.

The direction from the first short side portion 40c to the second short side portion 40d (rightward direction in FIG. 5) is the “+L direction”. The direction opposite to the +L direction is the "-L direction." The direction from the second long side portion 40b toward the first long side portion 40a (upward direction in FIG. 5) is the “+W direction”. The direction opposite to the +W direction is the "-W direction."

A central axis (first central axis) O1 along the longitudinal direction L is set. The central axis O1 passes through the center of the chip mounting area 40 in the width direction W. The chip mounting area 40 can be divided into a first half area 40A on the +W direction side (one side) and a second half area 40B on the -W direction side (the other side) with the central axis O1 as a boundary. The chip mounting area 40 has a symmetrical shape with the central axis O1 as the symmetrical axis. The area of the first half region 40A and the area of the second half region 40B are equal.
At the same time, a central axis (second central axis) O2 along the width direction W is set. The central axis O2 passes through the center of the chip mounting area 40 in the longitudinal direction L.

The conductive portion 6 serves as a conduction path for power supply and signals in the package 2 . The conductive portion 6 is formed by, for example, sputtering, vapor deposition, or the like. The conductive portion 6 may be a single layer film made of a single metal, or may be a laminated film made of different metals.

The conductive portion 6 includes not only the electrode pads 51, 52 and external connection terminals 30 to 33 described above, but also terminals and wiring formed on the lower surface 2b2 of the second base substrate 2b. The terminals and wiring formed on the lower surface 2b2 will be described below.

The chip mounting area 40 includes a pair of monitor terminals 41 and 42 (first monitor terminal 41 and second monitor terminal 42), first to sixth chip electrodes 61 to 66, and first to sixth connection wiring 71. .about.76, and monitor connection wires 81 and 82 (first monitor connection wire 81 and second monitor connection wire 82) are formed.

The chip electrodes 61 to 66 are examples of "a plurality of chip electrodes". The number of chip electrodes may be any number greater than or equal to 2. The connection wires 71 to 76 are examples of "a plurality of connection wires". The number of connection wires may be any number greater than or equal to two.

The first monitor terminal 41 is connected to the first electrode pad 51 via, for example, a first monitor connection wiring 81 and other connection wiring (not shown). The second monitor terminal 42 is electrically connected to the second electrode pad 52 via, for example, a second monitor connection wiring 82 and other connection wiring (not shown).

The first monitor terminal 41 has a rectangular shape having a pair of side edges 41a and a pair of end edges 41b. The pair of side edges 41a are both side edges of the first monitor terminal 41 in the width direction W. The side edge 41a is along the longitudinal direction L. The pair of edges 41b are both edges of the first monitor terminal 41 in the longitudinal direction L. The edge 41b extends in the width direction W.

A part of the side edge 41a on the -W direction side is a chamfered portion 41c. Of the four corners of the first monitor terminal 41, the chamfered portion 41c is formed at the corner formed by the side edge 41a on the −W direction side and the edge 41b on the +L direction side. The chamfered portion 41c is inclined with respect to the longitudinal direction L and the width direction W. The chamfered portion 41c has a linear shape that is inclined so as to move from the +L direction to the +W direction. The chamfered portion 41c has a C-chamfered shape.

Among the four corners of the first monitor terminal 41, a chamfer 41d is also formed at a corner diagonally opposite the corner where the chamfer 41c is formed.
In the illustrated example of the first monitor terminal 41, chamfered portions 41c and 41d are formed at two of the four corners, but the number of chamfered portions is not particularly limited. The chamfer may not be provided, or it may be formed at one or more of the four corners.
The side edge 41a of the first monitor terminal 41 on the +W direction side is an example of "one side edge". The side edge 41a of the first monitor terminal 41 on the -W direction side is an example of the "other side edge."

The second monitor terminal 42 has a rectangular shape having a pair of side edges 42a and a pair of end edges 42b. Both side edges 42a of the second monitor terminal 42 in the width direction W are along the longitudinal direction L. The edge 42b extends in the width direction W. A part of the side edge 42a on the +W direction side is a chamfered portion 42c.
In the illustrated example of the second monitor terminal 42, a chamfered portion 42c is formed at one of the four corners, but the chamfered portion may not be provided, or one or more of the four corners may be formed with a chamfered portion 42c. may be formed.
The side edge 42a of the second monitor terminal 42 on the +W direction side is an example of "one side edge." The side edge 42a of the second monitor terminal 42 on the -W direction side is an example of "the other side edge."

The dimension in the longitudinal direction L of the first monitor terminal 41 and the dimension in the longitudinal direction L of the second monitor terminal 42 are the same (or substantially the same). The dimension in the width direction W of the first monitor terminal 41 and the dimension in the width direction W of the second monitor terminal 42 are the same (or substantially the same). Therefore, the area of the first monitor terminal 41 and the area of the second monitor terminal 42 are approximately equal.

The first monitor terminal 41 and the second monitor terminal 42 are formed at different positions in the longitudinal direction L. The first monitor terminal 41 and the second monitor terminal 42 are separated in the longitudinal direction L. The first monitor terminal 41 is located on the −L direction side (the left half region in FIG. 5) with respect to the central axis O2. The second monitor terminal 42 is located on the +L direction side (the right half region in FIG. 5) with respect to the central axis O2.

The center of gravity G1 of the first monitor terminal 41 in plan view and the center of gravity G2 of the second monitor terminal 42 in plan view are located in the first half area 40A. The position of the center of gravity G1 of the first monitor terminal 41 in the width direction W and the position of the center of gravity G2 of the second monitor terminal 42 in the width direction W are the same. The distance from the center axis O1 to the center of gravity G1 is equal to the distance from the center axis O1 to the center of gravity G2. The center of gravity position line GL passing through the center of gravity G1 and the center of gravity G2 is parallel to the longitudinal direction L. The center of gravity position line GL is located on the +W direction side from the central axis O1.

In the manufacturing process of the piezoelectric vibrator 10, in order to check the oscillation frequency of the piezoelectric vibrating piece 3, each of the two contact probe pins (measuring terminals) of the measuring device is brought into contact with the monitor terminals 41 and 42, and the piezoelectric vibrator is Vibrate piece 3 and measure the oscillation frequency.

The oscillation frequency can be adjusted based on the measurements. To adjust the oscillation frequency, for example, a weight metal film for frequency adjustment is formed on the vibrating arms 3b, 3c by vapor deposition or the like, and the weight metal film is trimmed by laser processing.

The first to sixth chip electrodes 61 to 66 are, for example, external power supply electrodes, signal output electrodes, first vibrating piece electrodes, second vibrating piece electrodes, ground connection electrodes, switch electrodes, and the like.
The external power supply electrode is an electrode to which the power input terminal of the integrated circuit chip 20 is connected. The signal output electrode is an electrode to which the signal output terminal of the integrated circuit chip 20 is connected. The first vibrating piece electrode is an electrode to which a terminal of the integrated circuit chip 20 electrically connected to the piezoelectric vibrating piece 3 via the first electrode pad 51 is bonded. The second vibrating piece electrode is an electrode to which a terminal of the integrated circuit chip 20 electrically connected to the piezoelectric vibrating piece 3 via the second electrode pad 52 is bonded. The ground connection electrode is an electrode to which the ground terminal of the integrated circuit chip 20 is connected. The switch electrode is an electrode to which a switch signal input terminal of the integrated circuit chip 20 is connected.
The first to sixth chip electrodes 61 to 66 are connected to the integrated circuit chip 20 via, for example, flip chip bonding or bonding wires.

The first chip electrode 61 is located at a position opposite to the edge 41b of the first monitor terminal 41 on the +L direction side. The first chip electrode 61 is separated from the edge 41b of the first monitor terminal 41 on the +L direction side in the +L direction. The second chip electrode 62 is located at a position opposite to the edge 41b of the second monitor terminal 42 on the −L direction side. The second chip electrode 62 is spaced apart in the -L direction from the edge 41b of the second monitor terminal 42 on the -L direction side. The first chip electrode 61 and the second chip electrode 62 are located in the first half region 40A.

The third chip electrode 63 is located at a position opposite to the edge 41b of the first monitor terminal 41 on the +L direction side. The first chip electrode 61 is separated from the edge 41b of the first monitor terminal 41 on the +L direction side in the +L direction. The third chip electrode 63 is spaced apart from the first chip electrode 61 in the -W direction. A part of the third chip electrode 63 is located in the first half region 40A. The other part of the third chip electrode 63 is located in the second half region 40B.

The fourth chip electrode 64, the fifth chip electrode 65, and the sixth chip electrode 66 are located in the second half region 40B. The fourth chip electrode 64, the fifth chip electrode 65, and the sixth chip electrode 66 are formed at different positions in the longitudinal direction L. The fifth chip electrode 65 is spaced apart from the fourth chip electrode 64 in the +L direction. The sixth chip electrode 66 is spaced apart from the fifth chip electrode 65 in the +L direction.

The first to sixth connection wirings 71 to 76 are connected to the first to sixth chip electrodes 61 to 66, respectively.
The first connection wiring 71 has an L-shape including a first extension part 71A and a second extension part 71B. The first extending portion 71A extends from the first chip electrode 61 in the +W direction. The second extending portion 71B extends in the −L direction from the tip of the first extending portion 71A. A portion of the second extending portion 71B in the length direction faces the side edge 41a of the first monitor terminal 41 on the +W direction side. Conversely, the side edge 41a of the first monitor terminal 41 on the +W direction side faces the second extending portion 71B. The second extending portion 71B is parallel to the side edge 41a of the first monitor terminal 41 on the +W direction side. The second extending portion 71B is spaced apart from the first monitor terminal 41 in the +W direction.

The second connection wiring 72 has an L-shape including a first extension part 72A and a second extension part 72B. The first extending portion 72A extends from the second chip electrode 62 in the +W direction. The second extending portion 72B extends in the +L direction from the tip of the first extending portion 72A. A portion of the second extending portion 72B in the length direction faces the side edge 42a of the second monitor terminal 42 on the +W direction side. Conversely, the side edge 42a of the second monitor terminal 42 on the +W direction side faces the second extending portion 72B. The second extending portion 72B is parallel to the side edge 42a of the second monitor terminal 42 on the +W direction side. The second extending portion 72B is spaced apart from the second monitor terminal 42 in the +W direction.

The third connection wiring 73 has a first extension part 73A, a second extension part 73B, and a third extension part 73C. The first extending portion 73A extends from the third chip electrode 63 at an angle so as to move from the -L direction to the -W direction. The first extending portion 73A faces the chamfered portion 41c of the first monitor terminal 41. The first extending portion 73A is parallel to the chamfered portion 41c. The first extending portion 73A is apart from the chamfered portion 41c.

The second extending portion 73B extends in the −L direction from the tip of the first extending portion 73A. The second extending portion 73B faces the side edge 41a of the first monitor terminal 41 on the −W direction side. The second extending portion 73B is parallel to the side edge 41a of the first monitor terminal 41 on the −W direction side.
The third extending portion 73C extends from the tip of the second extending portion 73B at an angle so as to move in the −L direction toward the −W direction.

The first extending portion 73A, the second extending portion 73B, and the third extending portion 73C face the side edge 41a of the first monitor terminal 41 on the −W direction side. The first extending portion 73A, the second extending portion 73B, and the third extending portion 73C are spaced apart in the −W direction from the side edge 41a of the first monitor terminal 41 on the −W direction side.

The fourth connection wiring 74 extends from the fourth chip electrode 64 at an angle so as to move in the -L direction toward the -W direction.
The fifth connection wiring 75 extends from the fifth chip electrode 65 approximately in the -W direction. The line width of the fifth connection wiring 75 increases in the extending direction.

The sixth connection wiring 76 has a first extending portion 76A and a second extending portion 76B. The first extending portion 76A extends from the sixth chip electrode 66 at an angle so as to move toward the +L direction and toward the −W direction. The second extending portion 76B extends in the +L direction from the tip of the first extending portion 76A. The second extending portion 76B is parallel to the side edge 42a of the second monitor terminal 42 on the −W direction side. The sixth connection wiring 76 faces the side edge 42a of the second monitor terminal 42 on the −W direction side. The sixth connection wiring 76 is spaced apart in the -W direction from the side edge 42a of the second monitor terminal 42 on the -W direction side.

The total area of the chip electrodes and connection wires in the first half region 40A in plan view is smaller than the total area of the chip electrodes and connection wires in the second half region 40B in plan view. Therefore, when comparing the first half region 40A and the second half region 40B, the conductive parts (chip electrodes and connection wiring) in the second half region 40B are formed more densely than the conductive parts in the first half region 40A. It can be said that this has been done.

The total area of the chip electrodes and connection wiring in the first half region 40A is the first chip electrode 61, the first connection wiring 71, the second chip electrode 62, the second connection wiring 72, and the third chip electrode 61, the first connection wiring 71, the second chip electrode 62, the second connection wiring 72, and the third chip electrode 61, the first connection wiring 71, This is the total area including a part of the electrode 63.
The total area of the chip electrodes and connection wiring in the second half region 40B is the other part of the third chip electrode 63, the third connection wiring 73, the fourth chip electrode 64, the fourth connection wiring 74, This is the total area of the fifth chip electrode 65, the fifth connection wiring 75, the sixth chip electrode 66, and the sixth connection wiring 76.

It is desirable that the side edges 41a, 42a of the monitor terminals 41, 42 and the connection wiring facing thereto have a distance of 50 μm or more from each other. This makes it difficult for the contact probe pins to contact the connection wiring even if the contact probe pins of the measuring device are misaligned when they are brought into contact with the monitor terminals 41, 42.
It is desirable that the side edges 41a, 42a of the monitor terminals 41, 42 and the connection wiring facing thereto have a distance of, for example, 500 μm or less from each other.

Monitor connection wires 81 and 82 are connected to monitor terminals 41 and 42, respectively. The first monitor connection wiring 81 extends from the first monitor terminal 41 in the −L direction. The second monitor connection wiring 82 extends from the second monitor terminal 42 in the +L direction.

The integrated circuit chip 20 generates and outputs an output signal including a frequency component by performing various arithmetic processing on the electrical signal input from the piezoelectric vibrator 10 (see FIGS. 3 to 5). Integrated circuit chip 20 is mounted in chip mounting area 40 .

Although not shown in the drawings, the conductive portion 6 includes connection wires that connect the external connection terminals 30 to 33 and the connection wires 71 to 76. The conductive portion 6 includes connection wires that connect the electrode pads 51 and 52 and the connection wires 71 to 76. The conductive part 6 includes connection wiring that connects the monitor terminals 41 and 42 and the electrode pads 51 and 52.

<Effects produced by the piezoelectric vibrator and oscillator of the first embodiment>
In the piezoelectric vibrator 10, the centers of gravity G1 and G2 of the monitor terminals 41 and 42 are located in the first half region 40A where the total area of the chip electrodes and connection wiring is small. and connection wiring). Therefore, even if the contact probe pins of the measuring device are misaligned when they are brought into contact with the monitor terminals 41 and 42, the contact probe pins are less likely to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

For example, if a contact probe pin is incorrectly connected to a ground connection wire, it may become difficult to detect oscillation. If the contact probe pin is incorrectly connected to other wiring, the detected frequency may shift due to stray capacitance.

The side edge 41a of the first monitor terminal 41 on the +W direction side and the second extension portion 71B of the first connection wiring 71 are parallel. The side edge 41a of the first monitor terminal 41 on the −W direction side and the second extension portion 73B of the third connection wiring 73 are parallel. The side edge 42a of the second monitor terminal 42 on the +W direction side and the second extending portion 72B of the second connection wiring 72 are parallel. The side edge 42a of the second monitor terminal 42 on the −W direction side and the second extending portion 76B of the sixth connection wiring 76 are parallel. In this way, at least a portion of the side edges 41a, 42a of the monitor terminals 41, 42 are parallel to the opposing connection wiring. Therefore, it is easy to ensure a distance between the monitor terminals 41, 42 and the connection wiring. Therefore, it is possible to make it difficult for the contact probe pin to come into contact with the connection wiring, and to increase the area of the monitor terminals 41 and 42.

In the piezoelectric vibrator 10, a chamfered portion 41c is formed on a part of the side edge 41a of the first monitor terminal 41, and the first extending portion 73A of the third connection wiring 73 is parallel to the chamfered portion 41c. . Therefore, it is easy to ensure a distance between the first monitor terminal 41 and the third connection wiring 73. Therefore, it is possible to make it difficult for the contact probe pin to come into contact with the third connection wiring 73, and to increase the area of the monitor terminals 41 and 42.

Since the oscillator 100 includes the piezoelectric vibrator 10, it has the same effects as the piezoelectric vibrator 10.

<Piezoelectric vibrator> (Second embodiment)
A piezoelectric vibrator according to a second embodiment will be described.
In the piezoelectric vibrator 10 of the first embodiment shown in FIG. 5, the centers of gravity G1, G2 of the two monitor terminals 41, 42 are both located in the first half area 40A; , either one may be located in the first half region 40A. Therefore, it is sufficient that the center of gravity of at least one of the monitor terminals 41 and 42 is located in the first half area 40A.

FIG. 6 is a schematic bottom view of the piezoelectric vibrator 110 in the second embodiment. In FIG. 6, illustration of the monitor connection wirings 81 and 82 is omitted.
As shown in FIG. 6, the piezoelectric vibrator 110 differs from the piezoelectric vibrator 10 of the first embodiment (see FIG. 5) in that it includes a second monitor terminal 142 instead of the second monitor terminal 42.
The second monitor terminal 142 has a larger dimension in the width direction W than the first monitor terminal 41 . The center of gravity G102 of the second monitor terminal 142 is on the central axis O1. Therefore, in the piezoelectric vibrator 110, among the centers of gravity G1 and G102 of the two monitor terminals 41 and 142, only the center of gravity G1 of the first monitor terminal 41 is located in the first half area 40A.

In the piezoelectric vibrator 110, as in the first embodiment, it is easy to ensure a distance between the monitor terminal 41 and the conductive part (chip electrode and connection wiring). Therefore, when the contact probe pin of the measuring device is brought into contact with the monitor terminal 41, the contact probe pin becomes difficult to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

<Piezoelectric vibrator> (Third embodiment)
A piezoelectric vibrator according to a third embodiment will be described.
In the piezoelectric vibrator 10 of the first embodiment shown in FIG. 5, the centers of gravity G1 and G2 of the two monitor terminals 41 and 42 are at the same position in the width direction W, but the center of gravity G1 of the two monitor terminals 41 and 42 is , G2 may be located at different positions in the width direction W.

FIG. 7 is a schematic bottom view of the piezoelectric vibrator 210 in the third embodiment. In FIG. 7, illustration of the monitor connection wirings 81 and 82 is omitted.
As shown in FIG. 7, the piezoelectric vibrator 210 differs from the piezoelectric vibrator 10 of the first embodiment (see FIG. 5) in that it includes a second monitor terminal 242 instead of the second monitor terminal 42.
The second monitor terminal 242 has a larger dimension in the width direction W than the first monitor terminal 41. The center of gravity G202 of the second monitor terminal 142 is located in the first half area 40A, but is closer to the center axis O1 than the center of gravity G1 of the first monitor terminal 41.

In the piezoelectric vibrator 210, as in the first embodiment, it is easy to ensure a distance between the monitor terminals 41, 242 and the conductive parts (chip electrodes and connection wiring). Therefore, when the contact probe pins of the measuring device are brought into contact with the monitor terminals 41, 242, the contact probe pins are less likely to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

<Piezoelectric vibrator> (4th embodiment)
A piezoelectric vibrator according to a fourth embodiment will be described.
FIG. 8 is a schematic bottom view of the piezoelectric vibrator 310 in the fourth embodiment. In FIG. 8, illustration of the monitor connection wirings 81 and 82 is omitted.
As shown in FIG. 8, the distance between the side edge 41a of the first monitor terminal 41 on the +W direction side and the first connection wiring 71 facing the side edge 41a is referred to as "S1". The distance between the side edge 41a of the first monitor terminal 41 in the −W direction and the third connection wiring 73 facing the side edge 41a is referred to as “S2”. The distance S1 and the distance S2 are equal.

The distance between the side edge 342a of the second monitor terminal 342 on the +W direction side and the second connection wiring 72 opposing this is referred to as "S3". The distance between the side edge 342a of the second monitor terminal 342 on the side in the -W direction and the sixth connection wiring 76 facing the side edge 342a is referred to as "S4". The distance S3 and the distance S4 are equal.

In the piezoelectric vibrator 310, the distance between the monitor terminals 41 and 342 from one side edge to the connection wiring is equal to the distance between the other side edge and the connection wiring, so the distance from the connection wiring to the two side edges is the same. There is no bias. Therefore, it is easy to ensure a distance between the monitor terminals 41, 342 and the connection wiring. Therefore, the contact probe pin is less likely to come into contact with the connection wiring. Therefore, it is possible to measure the oscillation frequency with high accuracy.

<Other forms of the present disclosure>
Although the preferred embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the specific embodiments described above, and is within the scope of the gist of the present disclosure as described within the scope of the claims. Various modifications, substitutions, and changes can be made within.

As described above, the piezoelectric vibrator of the present disclosure can ensure measurement accuracy of the oscillation frequency. Therefore, an oscillator including this piezoelectric vibrator is suitable as a device used, for example, as a time source, a timing source for control signals, a reference signal source, etc. in electronic devices such as mobile phones and personal digital assistants.

2...Package (package for vibrator), 3...Piezoelectric vibrating piece, 10, 110, 210, 310...Piezoelectric vibrator, 20...Integrated circuit chip, 40...Chip mounting area, 40A...First half area, 40B...th 2 half area, 41...first monitor terminal (monitor terminal), 41a...side edge, 41c...chamfered portion, 42, 142, 242, 342...second monitor terminal (monitor terminal), 42a, 342a...side edge, 61-66... Chip electrode, 71-76... Connection wiring, 100... Oscillator, G1, G2, G102, G202... Center of gravity, L... Longitudinal direction, O1... Central axis, W... Width direction (short side direction)

Claims (6)

a resonator package having a chip mounting area in which an integrated circuit chip is mounted;
a piezoelectric vibrating piece mounted in the vibrator package,
The chip mounting area has a shape having a longitudinal direction and a transverse direction in a plan view,
In the chip mounting area,
a pair of monitor terminals for measuring the oscillation frequency of the piezoelectric vibrating piece;
a plurality of chip electrodes to which terminals of the integrated circuit chip are connected;
A plurality of connection wirings connected to the chip electrode are formed,
The pair of monitor terminals are provided at different positions in the longitudinal direction,
Both side edges of the monitor terminal in the short direction respectively face the connection wiring,
Comparing the first half region on one side with the central axis along the longitudinal direction of the chip mounting region as a boundary and the second half region on the other side, it is found that the chip electrode and the connection wiring in the first half region is smaller than the total area of the chip electrode and the connection wiring in the second half region,
At least one of the pair of monitor terminals has a center of gravity in the first half region;
Piezoelectric vibrator. The distance between one side edge of the monitor terminal and the connection wiring facing it is equal to the distance between the other side edge of the monitor terminal and the connection wiring facing it,
The piezoelectric vibrator according to claim 1. The side edge of the monitor terminal and the connection wiring facing the side edge have a distance of 50 μm or more from each other,
A piezoelectric vibrator according to claim 1 or 2. At least a portion of the side edge of the monitor terminal is parallel to the connection wiring facing the side edge;
A piezoelectric vibrator according to any one of claims 1 to 3. At least one of the pair of monitor terminals is rectangular in plan view,
A portion of the side edge is a linear chamfer formed at at least one of the four corners of the rectangular monitor terminal,
A portion of the connection wiring is formed parallel to the chamfered portion,
The piezoelectric vibrator according to claim 4. A piezoelectric vibrator according to any one of claims 1 to 5,
the integrated circuit chip mounted in the chip mounting area;
An oscillator comprising:

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