JP2023135912A - Non-contact information medium - Google Patents

Abstract

To provide a non-contact information medium in which capacitance of a capacitor or inductance of an inductor can be easily adjusted.SOLUTION: A non-contact information medium comprises: a board having a first surface and a second surface; a coil antenna arranged on the first surface or the second surface; a capacitor which includes a first electrode arranged on the first surface and a second electrode arranged on the second surface and facing the first surface and is electrically connected to the coil antenna; and a first cover member which has a first concave part covering the first electrode and forms a first cavity between the first concave part and the first electrode.SELECTED DRAWING: Figure 2

Description

One embodiment of the present invention relates to a contactless information medium.

Non-contact information medium communication systems enable non-contact communication between a non-contact information medium and a reader/writer, are highly convenient, and are in increasing demand.

In a contactless information medium communication system, a contactless information medium and a reader/writer communicate wirelessly using each other's antennas, and send and receive information to and from each other. A contactless information medium has a coil antenna that receives radio waves, an IC chip that processes information contained in the radio waves, a capacitor, and an inductor, and operates using electric power generated by electromagnetic induction using radio waves received from a reader/writer. do. For example, by adjusting the capacitance of a capacitor, a non-contact information medium can efficiently receive radio waves (see Patent Document 1).

Japanese Patent Application Publication No. 2007-233703

A method for adjusting the capacitance of a capacitor for efficiently receiving radio waves involves, for example, cutting the capacitor (see Patent Document 1), selecting and mounting the capacitor, and the adjustment is not easy. Further, there is a risk that the non-contact information medium may be damaged due to cutting of the capacitor, selection of the capacitor, and mounting of the capacitor.

One of the objects of the embodiments of the present invention is to provide a non-contact information medium in which the capacitance of a capacitor or the inductance of an inductor can be easily adjusted, and a non-contact information medium communication system having the non-contact information medium. . Further, one of the problems of the embodiments of the present invention is to provide a non-contact information medium that can suppress damage when adjusting the capacitance of a capacitor or the inductance of an inductor, and a non-contact information medium communication system having the non-contact information medium. It is to provide.

A non-contact information medium according to an embodiment of the present invention includes a substrate having a first surface and a second surface, a coil antenna disposed on the first surface or the second surface, and a coil antenna disposed on the first surface or the second surface. a capacitor electrically connected to the coil antenna; A first cover member having a first recess that covers the first electrode and forming a first gap between the first recess and the first electrode.

The non-contact information medium may include a protection member that covers the first cover member, and the protection member may be a different member from the first cover member.

The non-contact information medium has an inductor disposed on the first surface and electrically connected to the coil antenna and the first electrode, and a second recess covering the inductor, a second cover member that forms a second gap between the recessed portion of the inductor and the inductor; It may be in contact with the substrate.

A material having a dielectric constant different from that of the first upper cover member may be disposed in the first gap.

A material having a different magnetic permeability than the second upper cover member may be disposed in the second gap.

A first distance between the first electrode and the first cover member may be different from a second distance between the inductor and the second cover member.

The number of turns of the coil antenna may be one turn.

The device may include an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor.

The non-contact information medium includes an inductor disposed on the first surface and electrically connected to the first electrode and the coil antenna, and the first cover member includes an inductor that is electrically connected to the first electrode and the coil antenna. A second recess may be provided to cover the inductor, and a second gap may be formed between the second recess and the inductor.

The non-contact information medium includes a second cover member having a third recess covering the second electrode and forming a third gap between the third recess and the second electrode. May have.

A material having a dielectric constant different from that of the second cover member may be disposed in the third gap.

The third interval between the third recess and the second electrode is the first interval between the first electrode and the first cover member, or the third interval between the inductor and the first cover member. The interval may be different from 2.

The first cover member may include an assembly portion at a peripheral edge of the first cover member, and the assembly portion may be in contact with a peripheral edge of the second cover member.

The non-contact information medium has a metal ring having a cut, the first cover member includes an assembly part at a peripheral edge of the first cover member, and the assembly part is attached to the second cover member. The metal ring may be in contact with a peripheral edge of the first cover member and a peripheral edge of the second cover member.

In plan view, the cut is located on an extension line connecting the position where the IC chip is placed and the position where the capacitor is placed, and on the opposite side of the IC chip from the position where the capacitor is placed. It's okay.

The non-contact information medium may include a protection member disposed to cover the first cover member, the second cover member, and the metal ring.

The first cover member has a fourth recess, covers the IC chip with the fourth recess, and includes a fourth gap between the fourth recess and the IC chip. may be placed.

According to one embodiment of the present invention, it is possible to provide a non-contact information medium in which the capacitance of a capacitor or the inductance of an inductor can be easily adjusted, and a non-contact information medium communication system having the non-contact information medium. Further, according to an embodiment of the present invention, there is provided a non-contact information medium capable of suppressing damage when adjusting the capacitance of a capacitor or the inductance of an inductor, and a non-contact information medium communication system having the non-contact information medium. be able to.

FIG. 1 is a plan view schematically showing a non-contact information medium according to a first embodiment. 2(A) is an end cross-sectional view of the cross-sectional structure taken along the line A1-A2 shown in FIG. 1, and FIG. 2(B) is a plan view showing the first recess shown in FIG. 1, 2(C) is a plan view showing the third recess shown in FIG. 1, FIG. 2(D) is a plan view showing the second recess shown in FIG. 1, and FIG. 2(E) is a plan view showing the second recess shown in FIG. FIG. 2(F) is an enlarged view of the first recess and third recess of FIG. 2(A), and FIG. 2(F) is an enlarged view of the second recess of FIG. 2(A). FIG. 2 is a block diagram showing the configuration of an IC chip of the non-contact information medium according to the first embodiment. 4(A) and 4(B) are circuit diagrams of the non-contact information medium according to the first embodiment. FIG. 1 is a plan view schematically showing a non-contact information medium according to a first embodiment. 6 is an end cross-sectional view of the cross-sectional structure taken along the line B1-B2 shown in FIG. 5. FIG. FIG. 1 is a plan view schematically showing a non-contact information medium according to a first embodiment. FIG. 8(A) is an end cross-sectional view showing a cross-sectional structure for explaining the manufacturing method for arranging the cover member, and FIG. 8(B) is an end cross-sectional view showing the cross-sectional structure along the C1-C2 line shown in FIG. FIG. 3 is a flowchart showing a method for manufacturing a non-contact information medium according to the first embodiment. FIG. 1 is a block diagram showing the configuration of a contactless information medium communication system according to a first embodiment. FIG. 7 is a plan view schematically showing a non-contact information medium according to a second embodiment. 12(A) is an end sectional view of the cross-sectional structure taken along the line D1-D2 shown in FIG. 11, and FIG. 12(B) is a plan view showing the fourth recess shown in FIG. 11, FIG. 12(C) is an enlarged view of the fourth recess shown in FIG. 12(A). FIG. 7 is a plan view schematically showing a non-contact information medium according to a second embodiment. 14 is an end cross-sectional view of the cross-sectional structure taken along the line E1-E2 shown in FIG. 13. FIG. FIG. 7 is a plan view schematically showing a non-contact information medium according to a second embodiment. FIG. 16(A) is an end cross-sectional view showing a cross-sectional structure for explaining the manufacturing method for arranging the cover member, and FIG. 16(B) is an end cross-sectional view of the cross-sectional structure taken along the F1-F2 line shown in FIG. It is an end sectional view. FIG. 7 is a plan view schematically showing a non-contact information medium according to a second embodiment. 18(A) is an end cross-sectional view showing the cross-sectional structure shown in FIG. 14 and the cross-sectional structure of the metal ring, and FIG. 18(B) is the cross-sectional structure taken along the line G1-G2 shown in FIG. 17. FIG. It is a flowchart which shows the manufacturing method of the non-contact information medium based on 2nd Embodiment.

Each embodiment of the present invention will be described below with reference to the drawings. However, the present invention can be implemented in various forms without departing from the scope thereof, and should not be construed as being limited to the contents described in the embodiments exemplified below.

In order to make the explanation more clear, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual aspect, but these are merely examples and do not limit the interpretation of the present invention. It's not something you do. In addition, in this specification and each drawing, elements having the same functions as those described with respect to the existing drawings may be denoted by the same reference numerals, and redundant explanation may be omitted.

In this specification and the drawings, when referring to a plurality of identical or similar configurations as a whole, the same reference numerals or the same reference numerals may be indicated with capital letters attached. When a plurality of parts of one configuration are to be expressed separately, the same code may be used, and a hyphen and a natural number may also be used.

In this specification, characters such as "first," "second," or "third" appended to each configuration are convenient marks used to distinguish each configuration, and special explanations are not provided. Unless there is, it has no further meaning.

In this specification, with reference to the substrate included in the non-contact information medium, the surface of the substrate on which the IC chip is provided will be referred to as the "top surface", and the surface of the substrate opposite to the top surface will be referred to as the "bottom surface". Also, a surface that intersects the top surface and the bottom surface will be referred to as a "side surface."

In this specification, "near" includes not only a case where a plurality of non-contact information media are close to each other with a space, but also a case where a plurality of non-contact information media are in direct contact with each other. Furthermore, "close" includes a state in which a plurality of non-contact information media overlap each other.

1. First embodiment 1-1. Configuration of the non-contact information medium 10 FIG. 1 is a plan view schematically showing the non-contact information medium 10, and FIG. 2(A) is a cross section of the non-contact information medium 10 shown in FIG. 1 along the line A1-A2. FIG. 3 is an end cross-sectional view of the structure. The configuration of the non-contact information medium 10 will be explained with reference to FIG. 1 or FIG. 2(A). As shown in FIG. 1 or FIG. 2(A), the non-contact information medium 10 includes a substrate 20 and a protection member 90. The substrate 20 is located inside the non-contact information medium 10 and is covered by a protection member 90.

The protective member 90 forms the external shape of the non-contact information medium 10. Furthermore, the protection member 90 protects the substrate 20 from external impacts. In the non-contact information medium 10, it is preferable that the substrate 20 is completely covered by the protective member 90. The protection member 90 is a member made of resin. The resin is, for example, a thermosetting resin or a thermoplastic resin. Specifically, the resin is acrylonitrile butadiene styrene, polycarbonate, polyphthalamide, polyoxymethylene, polymethyl methacrylate, polyethylene, polypropylene, polybutylene terephthalate, or vinyl chloride.

In plan view, the shape of the non-contact information medium 10 is circular and flat, but the shape of the non-contact information medium 10 is not limited to the shape shown in FIG. 1. The shape of the non-contact information medium 10 may be, for example, an elliptical flat plate or a polygonal flat plate.

The contactless information medium 10 is, for example, a chip (coin or token) used in a casino or an amusement facility, but the use of the contactless information medium 10 is not limited to the example shown here. The non-contact information medium 10 may be used, for example, as a tag for article management.

As shown in FIG. 1, substrate 20 has a top surface 22 and a bottom surface 24. A coil antenna 30, an IC chip 40, a first capacitor 50, a first inductor 60, a first cover member 70, a second cover member 80, and connection parts 102 and 104 are arranged on the substrate 20. . The substrate 20 is a base material that supports the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, the first cover member 70, the second cover member 80, and the connecting parts 102 and 104. . The substrate 20 is, for example, a paper phenol substrate, a paper epoxy substrate, a glass epoxy substrate, a composite base epoxy substrate, a glass composite substrate, a glass polyimide substrate, a BT substrate, a Teflon (registered trademark) substrate, or a PPO substrate. Note that the top surface 22 may be called a first surface, and the bottom surface 24 may be called a second surface. Additionally, the top surface 22 may be referred to as a second surface, and the bottom surface 24 may be referred to as a first surface.

The coil antenna 30 is arranged on the upper surface 22 of the substrate 20 (see FIG. 2(A)), and is also arranged outside the IC chip 40. One end of the coil antenna 30 is electrically connected to the connecting portion 102, and the other end of the coil antenna 30 is electrically connected to the first inductor 60. The coil antenna 30 transmits and receives radio waves through wireless communication with an antenna (see FIG. 10) included in the reader/writer 202 (see FIG. 10). Radio waves include, for example, electrical signals, and electrical signals include information. The information includes, for example, a request from the reader/writer 202, identification information unique to the non-contact information medium 10, and the like. Note that the coil antenna 30 may be placed on the bottom surface 24 of the substrate 20. A through hole (not shown) is formed in the substrate 20 to penetrate the substrate 20 and connect the top surface 22 and the bottom surface 24 . Further, a conductive film (not shown) is formed in the through hole. In the first embodiment, the coil antenna 30 disposed on the top surface 22 is electrically connected to the member disposed on the bottom surface 24 using the conductive film formed in the through hole, and the coil antenna 30 disposed on the bottom surface 24 is electrically connected to the member disposed on the bottom surface 24. Antenna 30 is electrically connected to a member disposed on top surface 22.

In the first embodiment, the number of turns of the coil of the coil antenna 30 is preferably one or more and three or less, particularly preferably two. As an example, in the non-contact information medium 10 shown in FIG. 1, the number of turns of the coil of the coil antenna 30 is one. Compared to conventional coil antennas, the number of turns of the coil in coil antenna 30 is significantly smaller. Further, the coil antenna 30 is formed in a predetermined shape on the substrate 20 using, for example, printing, coating, or etching. The material forming the coil antenna 30 is a conductive material. The conductive material is, for example, copper or aluminum.

Although the details will be described later, the IC chip 40 is placed on the upper surface 22 of the substrate 20 (see FIG. 2(A)), and is electrically connected in parallel with the first capacitor 50 between the connecting portion 102 and the connecting portion 104. It is connected to the. Note that, similarly to the coil antenna 30, the IC chip 40 may be placed on the bottom surface 24 of the substrate 20, and the IC chip 40 may be placed on the top surface 22 using a conductive film formed in a through hole connecting the top surface 22 and the bottom surface 24. The IC chip 40 is electrically connected to a member placed on the bottom surface 24, and the IC chip 40 placed on the bottom surface 24 is electrically connected to a member placed on the top surface 22.

The first capacitor 50 has a first electrode 56A disposed on the top surface 22 of the substrate 20, a second electrode 56B disposed on the bottom surface 24 of the substrate 20, a first electrode 56A, and a second electrode 56B. It is constructed using sandwiched substrates 20 (see FIG. 2(A)). In the non-contact information medium 10, for example, the first electrode 56A is formed on the same layer as the coil antenna 30 using the same material and the same method, and the second electrode 56B is formed on the same layer as the coil antenna 30. are formed using similar materials and different processes using similar methods. Note that, similarly to the coil antenna 30, the first electrode 56A may be arranged on the bottom surface 24 of the substrate 20, and the second electrode 56B may be arranged on the top surface 22 of the substrate 20, connecting the top surface 22 and the bottom surface 24. Using the conductive film formed in the through hole, the first electrode 56A disposed on the top surface 22 is electrically connected to the member disposed on the bottom surface 24, and the second electrode 56B disposed on the bottom surface 24 is electrically connected to the member disposed on the bottom surface 24. is electrically connected to a member disposed on the top surface 22, a first electrode 56A disposed on the bottom surface 24 is electrically connected to a member disposed on the top surface 22, and a second electrode 56A disposed on the top surface 22 is electrically connected to a member disposed on the top surface 22. The electrode 56B is electrically connected to a member disposed on the bottom surface 24.

The first electrode 56A is electrically connected to the connection portion 102, for example. For example, a through hole (not shown) that penetrates the substrate 20 and connects the top surface 22 and the bottom surface 24 is formed in the substrate 20 . The second electrode 56B is electrically connected to the connection portion 104 using, for example, a conductive film formed in a through hole connecting the top surface 22 and the bottom surface 24. Note that the first electrode 56A and the second electrode 56B may be replaced.

The first inductor 60 is arranged on the upper surface 22 of the substrate 20 (see FIG. 2(A)), and is electrically connected in series with the coil antenna 30. One end of the first inductor 60 is electrically connected to the other end of the coil antenna 30, and the other end of the first inductor 60 is electrically connected to the connection portion 104. The first inductor 60 is in a form that can be mounted on the substrate 20 (chip inductor). Note that, similarly to the coil antenna 30, the first inductor 60 may be placed on the bottom surface 24 of the substrate 20, and the first inductor 60 may be placed on the top surface 22 using a conductive film formed in a through hole connecting the top surface 22 and the bottom surface 24. The first inductor 60 placed on the bottom surface 24 is electrically connected to the member placed on the bottom surface 24, and the first inductor 60 placed on the bottom surface 24 is electrically connected to the member placed on the top surface 22.

The connecting portions 102 and 104 are formed in the same layer as the coil antenna 30 and the first electrode 56A using the same material and the same method.

The first cover member 70 includes a first upper cover member 72 disposed on the top surface 22 (see FIG. 2(A)), and a first lower cover member 74 disposed on the bottom surface 24 (see FIG. 2(A)). (see). The first recess 59 (see FIG. 2(A)) of the first upper cover member 72 and the third recess 58 (see FIG. 2(A)) of the first lower cover member 74 are connected to the first capacitor. It is holding 50. Although details will be described later, the first cover member 70 has a function of adjusting the capacitance of the non-contact information medium 10, and the second capacitor 52 (FIG. 4) with the adjusted capacitance of the non-contact information medium 10 A). Note that the capacitance of the first capacitor 50 is capacitance Ca, and the capacitance of the second capacitor 52 is capacitance Cb. Further, the first cover member 70 has a function of protecting the first capacitor 50 from the outside.

The shape of the first upper cover member 72 is, for example, quadrilateral, and has a first recess 59 (see FIG. 2(A)) in the center, and the first recess 59 is located near each of the four corners. Has a small recess. Further, the shape of the first lower cover member 74 is, for example, a quadrilateral, and has a third recess (see FIG. 2A) at the center and a convex portion near each of the four corners. Each of the convex portions at the four corners of the first lower cover member 74 corresponds to each of the concave portions at the four corners of the first upper cover member 72 on a one-to-one basis. Each of the convex portions at the four corners of the first lower cover member 74 is inserted into the first through hole 54 (see FIG. 2(A)) formed in the substrate 20, and is inserted into the first through hole 54 (see FIG. 2(A)) of the first upper cover member 72. They are respectively inserted into corresponding recesses. Note that the first upper cover member 72 may be disposed on the bottom surface 24 and the first lower cover member 74 may be disposed on the top surface 22. That is, the first upper cover member 72 and the first lower cover member 74 may be interchanged.

The second cover member 80 includes a second upper cover member 82 disposed on the top surface 22 (see FIG. 2(A)), and a second lower cover member 84 disposed on the bottom surface 24 (see FIG. 2(A)). (see). The second recess 69 (see FIG. 2A) of the second upper cover member 82 and the second lower cover member 84 sandwich the first inductor 60. Although the details will be described later, the second cover member 80 has a function of adjusting the inductance of the non-contact information medium 10, and the second inductor 62 (FIG. 4) in which the inductance of the non-contact information medium 10 is adjusted is A). Note that the inductance of the first inductor 60 is inductance La, and the inductance of the second inductor 62 is inductance Lb. Further, the second cover member 80 has a function of protecting the first inductor 60 from the outside.

The shape of the second upper cover member 82 and the shape of the second lower cover member 84 are similar to the shape of the first upper cover member 72 and the shape of the first lower cover member 74. The second upper cover member 82 has a quadrilateral shape, has a second recess 69 (see FIG. 2(A)) in the center, has recesses near each of the four corners, and has a second recess 69 in the center (see FIG. 2(A)). The member 84 has a quadrilateral shape and has convex portions near each of the four corners. Each of the convex portions at the four corners of the second lower cover member 84 corresponds to each of the concave portions at the four corners of the second upper cover member 82 on a one-to-one basis. Each of the convex portions at the four corners of the second lower cover member 84 is inserted into the second through hole 64 (see FIG. 2(A)) formed in the substrate 20, and the second upper cover member 82 is inserted into the second through hole 64 (see FIG. 2(A)). They are respectively inserted into corresponding recesses.

The shapes of the first upper cover member 72, the first lower cover member 74, the second upper cover member 82, and the second lower cover member 84 are, for example, made of the same material as the protective member 90, and are made by injection molding. Formed by molding.

Note that the first upper cover member 72, first lower cover member 74, second upper cover member 82, and second lower cover member 84 are not limited to the configuration described in the first embodiment. The first cover member 70 (the first upper cover member 72 and the first lower cover member 74) has a function of adjusting the capacitance Cb of the second capacitor 52, and also has the function of adjusting the capacitance Cb of the second capacitor 52. It suffices if it is configured to have a protection function. For example, the first upper cover member 72 and the first lower cover member 74 may be circular, and may have at least two or more recesses or protrusions inside the circular periphery. The first upper cover member 72 and the first lower cover member 74 may be configured to be able to be assembled to each other using recesses or protrusions. Further, the second upper cover member 82 and the second lower cover member 84 have a function of adjusting the inductance Lb of the second inductor 62 and a function of protecting the first inductor 60 from the outside. The first upper cover member 72 and the first lower cover member 74 may have the same structure as the first upper cover member 72 and the first lower cover member 74 so that they can be assembled to each other.

1-2. Configuration of IC Chip 40 FIG. 3 is a block diagram showing the configuration of IC chip 40 of non-contact information medium 10. The configuration of the IC chip 40 will be described with reference to FIG. 3. Regarding the configuration of the IC chip 40, explanations may be omitted for configurations that are the same as or similar to those in FIGS. 1 and 2(A).

As shown in FIG. 3, the IC chip 40 includes a control section 42, a communication section 44, and a storage section 46. The communication unit 44 processes radio waves received from the reader/writer 202 (see FIG. 10) via the coil antenna 30. The control unit 42 controls the operations of the communication unit 44 and the storage unit 46. For example, the control unit 42 receives information included in the processed electrical signal from the communication unit 44 and extracts information included in the processed electrical signal from the storage unit 46. Further, the control unit 42 generates an electrical signal corresponding to the extracted information, and transmits the generated electrical signal to the communication unit 44. Furthermore, the communication unit 44 transmits the generated electrical signal to the reader/writer 202 via the coil antenna 30 on radio waves. The storage unit 46 stores various information. As described above, the various information includes, for example, a request from the reader/writer 202, identification information specific to the contactless information medium 10 for identifying the contactless information medium 10, and the like.

Although details will be described later, in the non-contact information medium 10, a resonant circuit 100 (see FIG. 4(A)) is configured using a second capacitor 52 and a second inductor 62. The resonant circuit 100 uses radio waves received from the reader/writer 202 to generate electric power through electromagnetic induction. When the power generated using the resonant circuit 100 is equal to or higher than a threshold voltage value (operable voltage value), the IC chip 40 starts operating.

1-3. Electrical Characteristics of Non-Contact Information Medium 10 FIG. 2(B) is a plan view showing the first recess 59 shown in FIG. 1, and FIG. 2(C) is a plan view showing the third recess 58 shown in FIG. FIG. 2(D) is a plan view showing the second recess 69 shown in FIG. 1, and FIG. 2(E) is a plan view of the first recess 59 and the third recess shown in FIG. 2(A). FIG. 2F is an enlarged view of the recess 58, and FIG. 2F is an enlarged view of the second recess 69 shown in FIG. 2A. FIG. 4(A) is an equivalent circuit diagram of the non-contact information medium 10 after adjusting capacitance and inductance, and FIG. 4(B) is an equivalent circuit diagram of the non-contact information medium 12 before adjusting capacitance and inductance. The non-contact information medium 10 before capacitance and inductance adjustment is referred to as a non-contact information medium 12. The electrical characteristics of the non-contact information medium 10 will be explained with reference to FIGS. 2(A) to 2(F), FIG. 4(A), and FIG. 4(B). Regarding the electrical characteristics of the non-contact information medium 10, explanations may be omitted regarding configurations that are the same as or similar to those in FIGS. 1 and 3.

As shown in FIG. 4(A), in the non-contact information medium 10, the second inductor 62 is electrically connected in series between the connecting portion 104 and the connecting portion 102, and the second inductor 62 is electrically connected in series between the connecting portion 104 and the connecting portion 102, and The capacitor 52 is electrically connected in parallel between the connecting portion 104 and the connecting portion 102, and the second capacitor 52 and the second inductor 62 form a closed circuit. The closed circuit formed using the second inductor 62 and the second capacitor 52 is a so-called resonant circuit 100. Note that the second capacitor 52 includes the first capacitor 50 , and the second inductor 62 includes the coil antenna 30 and the first inductor 60 .

As shown in FIG. 4(B), in the non-contact information medium 12, the coil antenna 30 and the first inductor 60 are electrically connected in series between the connecting portion 104 and the connecting portion 102, and the IC chip 40 and the second capacitor 52 are electrically connected in parallel between the connecting portion 104 and the connecting portion 102, and the coil antenna 30, the first capacitor 50, and the first inductor 60 form a closed circuit. . A closed circuit formed using the coil antenna 30, the first capacitor 50, and the first inductor 60 is a resonant circuit 100A.

The second capacitor 52 will be explained using FIG. 2(A), FIG. 2(B), FIG. 2(C), FIG. 2(E), and FIG. 4(A). As described above, the second capacitor 52 is a capacitor in which the capacitance of the non-contact information medium 10 is adjusted. The second capacitor 52 is configured using at least the first cover member 70 (the first upper cover member 72 and the first lower cover member 74) and the first capacitor 50. The first capacitor 50 is sandwiched between the first recess 59 and the third recess 58 and is covered. In the first upper cover member 72, a part facing the upper surface 22 is in contact with the upper surface 22, except for the small recesses at least at the four corners and the first recess 59, and in the first lower cover member 74, at least the four corners are in contact with the upper surface 22. Except for the convex portion and the third recessed portion 58, a portion facing the bottom surface 24 is in contact with the bottom surface 24.

In the first embodiment, the first recess 59, the first electrode 56A, and the space surrounded by the upper surface 22 other than where the first electrode 56A and the upper surface 22 are in contact form the first void 51, and the first The distance between the recess 59 and the upper surface of the first electrode 56A is called a first distance H1. The first interval H1 may be, for example, the distance (length) between the upper surface of the first electrode 56A and the first recess 59 at the closest point, or the distance (length) at the closest point extending perpendicularly from the substrate 20 ( length). For example, when the thickness of the first electrode 56A is thinner than the substrate 20 and the first gap H1, the size of the first gap 51 is smaller than the first gap H1 and the first recess 59 in a top view. It can be approximated using the size (width W1 x width W2).

Moreover, air may enter the first gap 51, and the first member 55 may be arranged as shown in FIG. 2(E). The first member 55 may be formed using a material having the same dielectric constant as the first upper cover member 72, or may be formed using a material having a different dielectric constant from the first upper cover member 72. Good too.

Similar to the first gap 51, in the first embodiment, the space surrounded by the third recess 58, the second electrode 56B, and the bottom surface 24 other than the one where the second electrode 56B and the bottom surface 24 are in contact with each other is The gap 53 between the third recess 58 and the upper surface of the second electrode 56B is called a third gap H3. The third interval H3 may be, for example, the distance (length) between the upper surface of the second electrode 56B and the third recess 58, which is the closest point, or the distance (length) between the closest point extending perpendicularly from the substrate 20 ( length). For example, when the thickness of the second electrode 56B is thinner than the substrate 20 and the third gap H3, the size of the third gap 53 is the third gap H3 and the third recess 58 in a top view. It can be approximated using the size (width W3 x width W4). Note that in the first embodiment, the width W1, the width W2, the width W3, and the width W4 are the same or approximately the same, but the width W1, the width W2, the width W3, and the width W4 do not have to be the same or approximately the same. good. Further, the first interval H1 may be the same or approximately the same as the third interval H3, or may be different.

Moreover, air may enter the third gap 53, and a third member 57 may be arranged as shown in FIG. 2(E). The third member 57 may be formed using a material having the same dielectric constant as the first lower cover member 74, or may be formed using a material having a different dielectric constant from the first lower cover member 74. Good too.

Here, as described above, for example, the capacitance of the first capacitor 50 is capacitance Ca, and the capacitance of the second capacitor 52 is capacitance Cb. Capacitance Cb includes capacitance Ca. The capacitance Cb can be adjusted by changing the size of the first gap 51 and the size of the third gap 53. Further, the capacitance Cb can be adjusted by changing the material arranged in the first gap 51 and the material arranged in the third gap 53.

Next, the second inductor 62 will be explained using FIG. 2(D) and FIG. 4(A). As described above, the second inductor 62 is an inductor in which the inductance of the non-contact information medium 10 is adjusted. The second inductor 62 is configured using at least the coil antenna 30, the second cover member 80 (the second upper cover member 82 and the second lower cover member 84), and the first inductor 60. . The first inductor 60 is sandwiched and covered by the second recess 69 and the second lower cover member 84. In the second upper cover member 82 , a portion facing the upper surface 22 is in contact with the upper surface 22 , excluding at least the second recess 69 , and the second lower cover member 84 is in contact with the bottom surface 24 .

In the first embodiment, the second recess 69 and the space surrounded by the upper surface 22 other than where the first inductor 60 and the upper surface 22 are in contact form the second void 61, and the second recess 69 and the The distance between the upper surfaces of the first inductor 60 is called a second distance H2. The second interval H2 may be, for example, the distance (length) between the upper surface of the first inductor 60 and the second recess 69, and the distance (length) between the closest point extending perpendicularly from the substrate 20 ( length). For example, when the thickness of the first inductor 60 is thinner than the substrate 20 and the second gap H2, the size of the second gap 61 is smaller than the second gap H2 and the second recess 69 in a top view. It can be approximated using the size (width W5 x width W6). Note that in the first embodiment, the width W5 and the width W6 are the same or substantially the same, but the width W5 and the width W6 do not have to be the same or substantially the same. Further, the second interval H1 may be the same or approximately the same as the first interval H1 or the third interval H3, or may be different.

Moreover, air may enter the second gap 61, and a second member 63 may be arranged as shown in FIG. 2(F). The second member 63 may be formed using a material that has the same magnetic permeability as the second upper cover member 82, or may be formed using a material that has a different magnetic permeability than the second upper cover member 82. Good too.

In the first embodiment, as an example, the shapes of the first recess 59, the second recess 69, and the third recess 58 are rectangular recesses facing the upper surface 22 of the substrate 20. The shapes of the first recess 59, the second recess 69, and the third recess 58 are not limited to the shapes shown here. The first recess 59, the second recess 69, and the third recess 58 may have, for example, a concave shape that is a curved surface facing the upper surface 22 of the substrate 20.

Here, as described above, for example, the inductance of the first inductor 60 is the inductance La, and the inductance of the second inductor 62 is the inductance Lb. Further, the inductance of the coil antenna 30 is the inductance Lc. Inductance Lb includes inductance Lc and inductance La. The second inductance Lb can be adjusted, for example, by changing the size of the second gap 61. Further, the second inductance Lb can be adjusted, for example, by changing the material placed in the second gap 61.

The resonant frequency fr of the resonant circuit 100 configured using the second capacitor 52 and the second inductor 62 is determined as follows using the capacitance Cb of the second capacitor 52 and the inductance Lb of the second inductor 62. It is expressed by the equation (1).

When the resonant frequency fr of the resonant circuit 100 matches the frequency (predetermined frequency) fc of the radio waves transmitted from the reader/writer 202 (FIG. 10), the resonant circuit 100 uses the radio waves of the frequency fc received from the reader/writer 202. The greatest amount of power can be generated by electromagnetic induction.

In the first embodiment, using the non-contact information medium 12, the resonant frequency fra before adjusting the capacitance and inductance of the non-contact information medium 10 can be determined. That is, the resonant frequency fra of the non-contact information medium 12 can be determined using the non-contact information medium 12 in a state before the first cover member 70 and the second cover member 80 are placed on the substrate 20. . The non-contact information medium 12 includes, for example, a resonant circuit 100A as shown in FIG. 4(B). The resonance frequency fra is expressed by the following equation (2) using the capacitance Ca of the first capacitor 50, the inductance La of the first inductor 60, and the inductance Lc of the coil antenna 30.

In the first embodiment, the capacitance Cb of the second capacitor 52 or the inductance Lb of the second inductor 62 is adjusted so that the resonance frequency fr matches or substantially matches the frequency fc of the radio waves transmitted from the reader/writer 202. can do.

For example, in the first cover member 70, at least one of the first interval H1, the width W1, the width W2, the third interval H3, the width W3, and the width W4 is adjusted. Thereby, the capacitance Cb of the second capacitor 52 can be adjusted to match or substantially match the frequency fc of the radio waves transmitted from the reader/writer 202. In the non-contact information medium 10, by using the first cover member 70 and the second cover member 80, the capacitance Cb of the second capacitor 52 is reduced so as to suppress variations in the characteristics or performance of the first capacitor 50. can be adjusted.

Further, in the second cover member 80, at least one of the second interval H2, the width W5, and the width W6 is adjusted so that it matches or substantially matches the frequency fc of the radio waves transmitted from the reader/writer 202. , the inductance Lb of the second inductor 62 may be adjusted. In the non-contact information medium 10, by using the second cover member 80, the inductance Lb of the second inductor 62 is adjusted so as to suppress variations in the characteristics or performance of the first inductor 60 or the coil antenna 30. be able to. Note that in the non-contact information medium 10, both the capacitance Cb and the inductance Lb may be adjusted.

For example, in adjusting the resonance frequency fr, a plurality of first cover members 70 adjusted to mutually different capacitances Cb and a plurality of second cover members 80 adjusted to mutually different inductances Lb are prepared in advance. put. One first cover is selected from the plurality of first cover members 70 and the plurality of second cover members 80 so that the resonance frequency fr matches or substantially matches the frequency fc of the radio waves transmitted from the reader/writer 202. member 70 and one second cover member 80 are selected. In the first embodiment, by mounting the selected first cover member 70 and second cover member 80 on the non-contact information medium 12, the resonance frequency fr is the frequency of the radio waves transmitted from the reader/writer 202. It matches or substantially matches fc, and an optimal non-contact information medium 10 can be formed.

Further, as described above, the first inductor 60 is a chip inductor. Therefore, the size of the first inductor 60 is sufficiently smaller than the coil antenna 30, and the first inductor 60 can also be called a lumped constant type inductor that can be made into a lumped constant. In the non-contact information medium 10, the number of turns of the coil of the coil antenna 30 is smaller than that of the conventional non-contact information medium, and the inductance Lc of the coil antenna 30 is smaller than the inductance La of the first inductor 60. In the non-contact information medium 10, the inductance of the resonant circuit 100 is increased by increasing the inductance La of the first inductor 60, and the inductance Lb of the second inductor 62 is adjusted using the second cover member 80. can do.

Furthermore, in the non-contact information medium 10, even if the inductance Lc of the coil antenna 30 is small at the design stage, the inductance Lb of the first inductor 60, which is a chip inductor, can be increased after the design. Since the resonant frequency fr can be adjusted by adjusting the inductance Lb of the first inductor 60 after design, there is no need to make the capacitance Ca of the first capacitor 50 larger than necessary at the design stage. Therefore, the capacitance Ca of the first capacitor 50 can be the same or approximately the same as the conventional capacitance. Furthermore, in the non-contact information medium 10, the capacitance Cb of the second capacitor 52 is independently controlled using the first cover member 70, and the inductance Lb of the second inductor 62 is independently controlled using the second cover member 80. Adjustable.

Therefore, the non-contact information medium 10 can be downsized without increasing the size of the first capacitor 50, and the resonance frequency fr can be adjusted. Furthermore, in the non-contact information medium 10, there is no need to increase the capacitance Ca of the first capacitor 50, so there is no need to charge and discharge a large capacitance. Therefore, in the non-contact information medium 10, the load of charging and discharging the capacitance Ca of the first capacitor 50 is suppressed, and the resonance frequency fr closely matches or almost matches the frequency fc of the radio wave transmitted from the reader/writer 202. Therefore, the large power generated using the resonant circuit 100 is sufficiently supplied to the IC chip 40. As a result, in the non-contact information medium 10, malfunctions of the IC chip 40 due to power shortage can be suppressed. Therefore, the non-contact information medium 10 can perform stable wireless communication with the reader/writer 202.

1-4. Method of Manufacturing Non-Contact Information Medium 10 FIG. 5 is a plan view schematically showing the non-contact information medium 10. As shown in FIG. FIG. 6 is an end sectional view of the cross-sectional structure of the non-contact information medium 10 shown in FIG. 5 taken along the line B1-B2. FIG. 7 is a plan view schematically showing the non-contact information medium 10 for explaining a method of manufacturing the non-contact information medium 10. As shown in FIG. FIG. 8(A) shows a cross-sectional structure for explaining a manufacturing method for arranging a first upper cover member 72, a first lower cover member 74, a second upper cover member 82, and a second lower cover member 84. FIG. 8B is an end sectional view showing the cross-sectional structure of the non-contact information medium 10 shown in FIG. 7 along line C1-C2. FIG. 9 is a flowchart showing a method for manufacturing the non-contact information medium 10.

A method of manufacturing the non-contact information medium 10 will be described with reference to FIGS. 1 and 5 to 9. In the method for manufacturing the non-contact information medium 10, descriptions of structures similar to or similar to those in FIGS. 2(A) to 2(D), FIG. 3, FIG. 4(A), and FIG. 4(B) may be omitted. be. The non-contact information medium 10 is manufactured by the manufacturing method of steps S30 to S34 shown in FIG. The manufacturing method of the non-contact information medium 10 is not limited to the manufacturing method shown in FIG. 9, and may include other steps.

First, step S30 shown in FIG. 9 will be explained with reference to FIGS. 5 and 6. In step S30, the IC chip 40 and the first inductor 60 are mounted on the substrate 20 on which the coil antenna 30 having a predetermined shape, the connecting portions 102 and 104, and the first capacitor 50 are formed. In step S30, the first inductor 60 is electrically connected between the coil antenna 30 and the connection section 104, and the IC chip 40 is electrically connected between the connection section 102 and the connection section 104. As a result, the coil antenna 30, the connecting parts 102 and 104, the first capacitor 50, the first inductor 60, and the IC chip 40 are electrically connected, and the first cover member 70 and the second cover member 80 are electrically connected. A non-contact information medium 12 is formed in a state before being placed on a substrate 20. Further, a closed circuit is formed using the coil antenna 30, the first capacitor 50, the first inductor 60, and the IC chip 40, and the coil antenna 30, the first capacitor 50, and the first inductor 60 form a closed circuit. , a resonant circuit 100A (FIG. 4(B)) is constructed.

Next, in step S31 shown in FIG. 9, the resonance frequency is adjusted using the non-contact information medium 12. For example, information such as the communication distance, the resonant frequency, the capacitance Ca of the first capacitor 50, and the inductance La of the first inductor 60 is obtained in advance using the reader/writer 202 and the plurality of non-contact information media 12, A table is prepared in which communication distance, resonant frequency, capacitance Ca of the first capacitor 50, inductance La of the first inductor 60, etc. are linked. The formed non-contact information medium 12 is wirelessly communicated with the reader/writer 202, and the communication distance is measured. For example, the resonance frequency is determined using the measured communication distance and the table. Using the obtained resonance frequency, one is selected from the plurality of first cover members 70 and the plurality of second cover members 80 so as to match or substantially match the frequency fc of the radio waves transmitted from the reader/writer 202. One first cover member 70 and one second cover member 80 are selected.

Next, step S32 shown in FIG. 9 will be explained with reference to FIGS. 7, 8(A), and 8(B). In step S32, the first cover member 70 and the second cover member 80 selected in step S31 are mounted on the non-contact information medium 12.

Specifically, each of the convex portions of the first lower cover member 74 is inserted into the first through hole 54 and into the corresponding recessed portion of the first upper cover member 72, respectively. As a result, the first capacitor 50 is sandwiched between the first recess 59 of the first upper cover member 72 and the third recess 58 of the first lower cover member 74, and 72 and the third recess 58 of the first lower cover member 74 .

Further, each of the convex portions at the four corners of the second lower cover member 84 is inserted into the second through hole 64, and is also inserted into the corresponding recessed portion of the second upper cover member 82, respectively. As a result, the first inductor 60 is sandwiched between the second recess 69 of the second upper cover member 82 and the second lower cover member 84, and the second recess 69 of the second upper cover member 82 69 and a second lower cover member 84 .

As a result, in step S32, the second capacitor 52 and the second inductor 62 are formed, and the resonant circuit 100 (FIG. 4(A)) is configured using the second capacitor 52 and the second inductor 62. .

Finally, in step S34 shown in FIG. 9, the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, and the first cover member are arranged on the substrate 20 using injection molding. 70 and a protective member 90 that covers the second cover member 80 is molded. Specifically, by injecting resin onto the substrate 20 placed in a mold and molding the resin under a predetermined temperature and pressure, the coil antenna 30, IC chip 40, and A protective member 90 that covers the first capacitor 50, the first inductor 60, the first cover member 70, and the second cover member 80 is molded. At this time, between the coil antenna 30 and the IC chip 40, between the coil antenna 30 and the first cover member 70, between the coil antenna 30 and the second cover member 80, and between the IC chip 40 and the first cover The protection member 90 contacts the substrate 20 between the IC chip 40 and the second cover member 80 , between the IC chip 40 and the second cover member 80 , and between the first cover member 70 and the second cover member 80 . Further, for example, the material forming the protection member 90 is different from the material forming the first cover member 70 and the material forming the second cover member 80.

The non-contact information medium 10 is manufactured using the manufacturing method described above. Further, in the non-contact information medium 10, the capacitor and the inductor are protected using the protection member 90, the first cover member 70, and the second cover member 80. Therefore, in the non-contact information medium 10, the capacitance of the capacitor and the inductance of the inductor can be easily adjusted without damaging the capacitor and inductor. Further, the non-contact information medium 10 is protected by the protection member 90, the first cover member 70, and the second cover member 80, and has high impact resistance.

1-5. Configuration of non-contact information medium communication system 200 FIG. 10 is a block diagram showing the configuration of the non-contact information medium communication system 200. The contactless information medium communication system 200 will be explained using FIG. 10. In the non-contact information medium communication system 200, descriptions of structures that are the same or similar to those in FIGS. 1 to 9 may be omitted.

As shown in FIG. 10, the contactless information medium communication system 200 includes a contactless information medium group 120 including a plurality of contactless information media 10, and a reader/writer 202. In the first embodiment, wireless communication between the contactless information medium group 120 and the reader/writer 202 will be described. Good too.

The reader/writer 202 includes an input section 204, a processing section 206, an output section 208, and an antenna 210. The antenna 210 has the function of supplying power to the contactless information medium 10 and transmitting and receiving electrical signals containing information to and from the contactless information medium 10, for example, via radio waves of a predetermined frequency. The input unit 204 has a function of inputting instruction information that instructs the operation of the reader/writer 202, for example. The processing unit 206 has a function of, for example, processing radio waves received from the non-contact information medium 10 via the antenna 210 and operating the reader/writer 202 using information included in the processed electrical signal. The output unit 208 has a function of outputting an electrical signal including information processed by the processing unit 206, for example. The reader/writer 202 has an anti-collision function and can receive information from each of the plurality of non-contact information media 10 of the non-contact information media group 120.

As explained in "1-3. Electrical characteristics of the non-contact information medium 10", the non-contact information medium 10 has a resonant frequency of the resonant circuit 100 configured using the second capacitor 52 and the second inductor 62. fr is adjusted to match or substantially match the frequency fc of radio waves transmitted from the reader/writer 202.

Here, a conventional non-contact information medium that does not have the second inductor 62 will be explained. In a conventional non-contact information medium that does not include the second inductor 62, the resonant frequency fr is adjusted by increasing the inductance of the antenna, for example, by increasing the number of turns of the antenna coil. When antennas with a large number of coil turns are placed close to each other, mutual interference between the coils occurs. The resonant frequency was changing. As a result, the power generated by electromagnetic induction using the resonant circuit changes, and the contactless information media group, including the conventional contactless information medium, is not supplied with sufficient power. It has been difficult to perform accurate wireless communication between the contact information media group and the reader/writer.

The shape of the coils also affects mutual interference between the coils. For example, in a group of non-contact information media including conventional non-contact information media, the larger the shape of the coil, the more the area where the coils overlap increases. As a result, mutual interference between the coils is likely to occur.

On the other hand, as described above, in the non-contact information medium 10, by using the first cover member 70 and the second cover member 80, the second capacitor 50 is The capacitance Cb of the capacitor 52 can be adjusted. In addition, in the non-contact information medium 10, by using the second cover member 80, the inductance Lb of the second inductor 62 is adjusted so as to suppress variations in the characteristics or performance of the first inductor 60 or the coil antenna 30. Can be adjusted.

Further, in the non-contact information medium 10, the number of turns of the coil of the coil antenna 30 is one, which is significantly smaller than the number of turns of the coil of the antenna of a conventional non-contact information medium. Therefore, even if the non-contact information medium group 120 including a plurality of non-contact information media 10 are close to each other, mutual interference between the coils caused by the coil antenna 30 is unlikely to occur.

Therefore, in the non-contact information medium communication system 200, even when the non-contact information medium group 120 including a plurality of non-contact information media 10 are close to each other, the coil-to-coil interference caused by the second inductor 62 including the first inductor 60 Mutual interference is unlikely to occur.

Therefore, in the non-contact information medium communication system 200, mutual interference between the coils in the non-contact information medium group 120 including the plurality of non-contact information media 10 is suppressed. As a result, in the non-contact information medium communication system 200, even when the non-contact information medium group 120 including the plurality of non-contact information media 10 is close to each other, each of the plurality of non-contact information media 10 is Since power is efficiently supplied, operation can start smoothly. Therefore, in the non-contact information medium communication system 200, accurate wireless communication can be performed between the non-contact information medium group 120 including the plurality of non-contact information media 10 and the reader/writer 202.

2. Second Embodiment Compared to the non-contact information medium 10 according to the first embodiment, a non-contact information medium 10A according to the second embodiment has a first upper cover member 72 and a second upper cover member 82 integrated. The second capacitor 52 and the second inductor are manufactured by using the first cover member 78 that is integrated with the first cover member 78 and the second cover member 88 that is the first lower cover member 74 and the second lower cover member 84 integrated. 62 and that it has a metal ring. Furthermore, in comparison with the non-contact information medium 10, the non-contact information medium 10A has a metal ring attached to it after the substrate 20 is sandwiched between the first cover member 78 and the second cover member 88, and the metal ring is attached in that state. The difference is that it is covered with a protective member. In the non-contact information medium 10A, the other configurations are the same as the non-contact information medium 10, so in the description of the non-contact information medium 10A, the points that are different from the non-contact information medium 10 will be mainly explained.

2-1. Configuration of non-contact information medium 10A FIG. 11 is a plan view schematically showing the non-contact information medium 10A. 12(A) is an end sectional view of the cross-sectional structure of the non-contact information medium 10A shown in FIG. 11 taken along the line D1-D2, and FIG. 12(B) is an end sectional view of the fourth recess 49 shown in FIG. FIG. 12(C) is an enlarged view of the fourth recess 49 shown in FIG. 12(A). The configuration of the non-contact information medium 10A will be described with reference to FIG. 11 and FIGS. 12(A) to 12(C). In the configuration of the non-contact information medium 10A, explanations may be omitted for configurations that are the same as or similar to those in FIGS. 1 to 10.

As shown in FIG. 11 or FIG. 12(A), the non-contact information medium 10A includes a substrate 20, a metal ring 110, and a protection member 90. The shape and use of the non-contact information medium 10A are similar to those of the non-contact information medium 10.

A coil antenna 30 similar to the non-contact information medium 10, an IC chip 40, a first capacitor 50, a first inductor 60, and connection parts 102 and 104 are arranged on the substrate 20. Further, a first cover member 78 and a second cover member 88 are arranged on the substrate 20. The substrate 20 is a base material that supports the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, the first cover member 78, the second cover member 88, and the connecting portions 102 and 104. be.

The protection member 90 covers the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110, and forms the external shape of the non-contact information medium 10A. Furthermore, the protection member 90 protects the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110 from external impacts. In the non-contact information medium 10A, it is preferable that the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110 are completely covered by the protection member 90. The protective member 90 of the non-contact information medium 10A is formed using the same material as the protective member 90 of the non-contact information medium 10.

In the non-contact information medium 10A, the configurations of the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, and the connecting parts 102 and 104 are the same as those of the non-contact information medium 10, so the following description will be made here. Now, the explanation will be omitted. Here, the first cover member 78 and the second cover member 88 will be mainly explained.

The first cover member 78 is formed by integrating the first upper cover member 72 and the second upper cover member 82, and includes a first recess 59 and a second recess 69. The first cover member 78 also includes a fourth recess 49 . In the first cover member 78 excluding the first recess 59 , the second recess 69 , and the fourth recess 49 , the surface facing the upper surface 22 of the substrate 20 is in contact with the upper surface 22 of the substrate 20 . The first recess 59 covers the first electrode 56A of the first capacitor 50, the second recess 69 covers the first inductor 60, and the fourth recess 49 covers the IC chip 40.

Furthermore, in plan view, the first cover member 78 has a circular flat plate shape as shown in FIG. 11, similar to the non-contact information medium 10A. Furthermore, in plan view, the diameter of first cover member 78 is larger than the diameter of substrate 20, and in cross-sectional view, the peripheral edge portion 76 of first cover member 78 is located outside the side surface of substrate 20 (Fig. 12(A)).

Furthermore, the first cover member 78 (first recess 59) has a function of adjusting the capacitance of the non-contact information medium 10A, and together with the second cover member 88 (third recess 58), the non-contact information A second capacitor 52 is configured in which the capacitance of the medium 10A is adjusted. Further, the first cover member 78 (second recess 69) has a function of adjusting the inductance of the non-contact information medium 10A, and constitutes a second inductor 62 in which the inductance of the non-contact information medium 10A is adjusted. do.

Further, the space surrounded by the fourth recess 49 of the first cover member 78, the IC chip 40, and the upper surface 22 other than where the IC chip 40 and the upper surface 22 are in contact forms a fourth gap 41, The distance between the recess 49 and the top surface of the IC chip 40 is called a fourth distance H4 (see FIG. 12(A)). The fourth interval H4 may be, for example, the distance (length) between the top surface of the IC chip 40 and the fourth recess 49 that is closest to each other, or the distance (length) that is the closest distance that extends perpendicularly from the substrate 20. ). For example, when the thickness of the IC chip 40 is thinner than the substrate 20 and the fourth gap H4, the volume of the fourth gap 41 is the fourth gap H4 and the size of the fourth recess 49 in top view ( (width W7×width W8) (see FIGS. 12(A) to 12(C)).

Moreover, air may enter the fourth gap 41, and a fourth member 47 may be arranged as shown in FIG. 12(C). The fourth member 47 may be formed using a material having the same dielectric constant as the first cover member 78, or may be formed using a material having a dielectric constant different from that of the first upper cover member 72. good. Further, the fourth member 47 may be formed using a material that has the same magnetic permeability as the first cover member 78, or may be formed using a material that has a different magnetic permeability than the first upper cover member 72. It's okay.

In the second embodiment, as an example, the shape of the first recess 59, the shape of the second recess 69, and the shape of the fourth recess 49 are rectangular recesses facing the upper surface 22 of the substrate 20, The shape of the third recess 58 is a rectangular recess facing the bottom surface 24 of the substrate 20 . Similar to the first embodiment, the shapes of the first recess 59, the second recess 69, and the third recess 58 are not limited to the shapes shown here. Furthermore, the shape of the fourth recess 49 is not limited to the shape shown here. The first recess 59, the second recess 69, the third recess 58, and the fourth recess 49 may have, for example, a recessed shape that is a curved surface facing the upper surface 22 of the substrate 20.

As described above, the first cover member 78 covers the IC chip 40, the first capacitor 50, and the first inductor 60, and covers the IC chip 40, the first capacitor 50, and the first inductor 60. It has the function of protecting from the outside.

The second cover member 88 is integrated with the first lower cover member 74 and the second lower cover member 84 and includes the third recess 58 . In the second cover member 88 excluding the third recess 58 , the surface facing the bottom surface 24 of the substrate 20 is in contact with the bottom surface 24 . The third recess 58 covers the second electrode 56B of the first capacitor 50.

Further, in a plan view, the second cover member 88 has a circular flat plate shape similarly to the non-contact information medium 10A. Furthermore, in plan view, the diameter of the second cover member 88 is larger than the diameter of the substrate 20 and is the same or approximately the same as the first cover member 78.

Furthermore, like the first cover member 78, the second cover member 88 has a function of adjusting the capacitance of the non-contact information medium 10A, and constitutes the second capacitor 52, as well as the first capacitor 50. It has the function of protecting from the outside. Further, like the first cover member 78, the second cover member 88 has a function of adjusting the inductance of the non-contact information medium 10A, and constitutes the second inductor 62.

As shown in FIG. 12(A), the peripheral edge portion 86 of the second cover member 88 is located outside the side surface of the substrate 20 in a cross-sectional view. The first through hole 54 and the second through hole 64 according to the first embodiment are not formed in the substrate 20, and the substrate 20 has a second cover member 88 and a first cover member in cross-sectional view. It overlaps with 78. The second cover member 88 and the first cover member 78 are arranged such that the assembly portion 79 of the first cover member 78 is connected to the peripheral edge 86 of the second cover member 88 and the peripheral edge 76 of the first cover member 78 . They are assembled to the substrate 20 using the two screws, and the substrate 20 is held between them. As a result, the second cover member 88 and the first cover member 78 have the function of covering the substrate 20 and protecting the substrate 20 from the outside.

Similar to the shapes of the first upper cover member 72, the first lower cover member 74, and the second upper cover member 82 and the second lower cover member 84 according to the first embodiment, the first cover member 78 The second cover member 88 is molded, for example, by injection molding using the same material as the protection member 90.

Note that the first cover member 78 and the second cover member 88 are not limited to the configuration described in the second embodiment. The first cover member 78 and the second cover member 88 have a function of adjusting the capacitance and inductance of the non-contact information medium 10, and also have the function of adjusting the capacitance and inductance of the non-contact information medium 10. It suffices if it is configured to have a function of protecting from the outside.

As described above, the second capacitor 52 according to the second embodiment uses at least the first cover member 78 (first recess 59) and the second cover member 88 (third recess 58). It consists of Further, the second inductor 62 according to the second embodiment is configured using at least the first cover member 78 (second recess 69). The second capacitor 52 and the second inductor 62 according to the second embodiment are the same as the second capacitor 52 and the second inductor 62 according to the first embodiment described in "1-3. Electrical characteristics of the non-contact information medium 10". It has the same configuration as the inductor 62 of . Therefore, description of the second capacitor 52 and second inductor 62 according to the second embodiment will be omitted here.

Furthermore, in the non-contact information medium 10A, a resonant circuit 100 (see FIG. 4(A)) is configured using a second capacitor 52 and a second inductor 62. The resonant circuit 100 of the non-contact information medium 10A has the same configuration as the resonant circuit 100 of the non-contact information medium 10 described in "1-3. Electrical characteristics of the non-contact information medium 10". Therefore, the explanation of the resonant circuit 100 of the non-contact information medium 10A will be omitted here.

The metal ring 110 is inscribed in the peripheral edge 76 of the first cover member 78 and the peripheral edge 86 of the second cover member 88, and is attached to a portion (the first It has a function of closing the connecting portion of the cover member 78 and the second cover member 88), and can also function as a weight member that adds weight to the non-contact information medium 10. The material for forming the metal ring 110 can be, for example, brass, aluminum, or the like. The shape of the metal ring 110 is annular or substantially annular, and includes a cut 112 where a part of the metal ring 110 is cut (see FIG. 11). In other words, the metal ring 110 has a C-shape including the cut 112. By including the cut 112 in the metal ring 110, generation of eddy current due to radio waves transmitted from the reader/writer 202 can be suppressed. As a result, by including the metal ring 110 including the cut 112, the non-contact information medium 10 can suppress power loss due to eddy current, and can perform stable wireless communication with the reader/writer 202.

The inner diameter of the metal ring 110 is the same or approximately the same as the diameters of the first cover member 78 and the second cover member 88. In plan view, the cut 112 is on the extension line 114 connecting the position where the IC chip 40 is placed and the position where the second capacitor 52 is placed, and the second capacitor 52 is placed with respect to the IC chip 40. It is located on the opposite side from where it is. With this configuration, the cut 112 is placed away from the IC chip 40 and the second capacitor, and a portion of the metal ring 110 without the cut 112 is placed near the IC chip 40 and the second capacitor, so that the IC chip 40 and the second capacitor are protected by the sides of metal ring 110. As a result, even if the non-contact information medium 10A is subjected to an external impact, the impact is absorbed by the metal ring 110, so that the impact transmitted to the IC chip 40 and the second capacitor can be alleviated. Note that since the first inductor 60 is placed near the IC chip 40 and the second capacitor, the first inductor 60 is also protected by the metal ring 110.

As explained above, in the non-contact information medium 10A, the members (the first cover member 78 and the second This can be adjusted using a cover member 88). Therefore, in the non-contact information medium 10A, the capacitance and inductance can be adjusted more easily. As a result, in the non-contact information medium 10A, by using the first cover member 78 and the second cover member 88, variations in the characteristics or performance of both the first capacitor 50 and the first inductor 60 are suppressed. Thus, capacitance Cb and inductance Lb can be adjusted.

In addition, in the non-contact information medium 10A, the upper surface 22 of the substrate 20 other than where the first recess 59, the second recess 69, and the fourth recess 49 are arranged is in contact with the first cover member 78. At the same time, it is covered with a first cover member 78 . In the bottom surface 24 of the substrate 20 , the bottom surface 24 other than where the third recess 58 is arranged is in contact with the second cover member 88 and is covered by the second cover member 88 . Therefore, the first cover member 78 and the second cover member 88 can protect the substrate 20 and reinforce the substrate 20. Further, the peripheral edges of the first cover member 78 and the second cover member 88 are also protected by the metal ring 110. As a result, the strength of the non-contact information medium 10A increases, and the non-contact information medium 10A has higher impact resistance.

2-2. Method of manufacturing the non-contact information medium 10A A method of manufacturing the non-contact information medium 10A will be described with reference to FIGS. 11 and 13 to 19. In the method for manufacturing the non-contact information medium 10A, descriptions of structures that are the same or similar to those in FIGS. 1 to 10 may be omitted.

FIG. 19 is a flowchart showing a method for manufacturing the non-contact information medium 10A. The non-contact information medium 10A is manufactured by the manufacturing method shown in steps S40 to S44. The manufacturing method of the non-contact information medium 10A is not limited to the manufacturing method shown in FIG. 19, and may include other steps.

First, step S40 shown in FIG. 19 will be explained with reference to FIGS. 13 and 14. Since step S40 is a manufacturing method similar to step S30 shown in FIG. 9, detailed explanation here will be omitted. In the second embodiment, in step S40, the non-contact information medium 12A is formed in a state before the first cover member 78 and the second cover member 88 are placed on the substrate 20.

Next, in step S41 shown in FIG. 19, the resonance frequency is adjusted using the non-contact information medium 12A. Since step S41 is a manufacturing method similar to step S31 shown in FIG. 9, detailed explanation here will be omitted. In the second embodiment, the plurality of first cover members 78 and One first cover member 78 and one second cover member 88 are selected from the plurality of second cover members 88.

Next, step S42 shown in FIG. 19 will be explained with reference to FIGS. 17, 16(A), and 16(B). In step S42, the first cover member 78 and second cover member 88 selected in step S41 are mounted on the non-contact information medium 12A. Specifically, the second cover member 88 and the first cover member 78 are arranged at the peripheral edge 86 of the second cover member 88 and the peripheral edge 76 of the first cover member 78 . Using the assembly portion 79, they are assembled to the substrate 20 and the substrate 20 is held between them.

The first capacitor 50 is sandwiched between the first recess 59 of the first cover member 78 and the third recess 58 of the second cover member 88, and 59 and the third recess 58 of the first cover member 78 . Further, the first inductor 60 is sandwiched between the second recess 69 of the first cover member 78 and the second cover member 88, and is covered by the first cover member 78. Further, the IC chip 40 is sandwiched between the fourth recess 49 of the first cover member 78 and the second cover member 88, and is covered by the first cover member 78.

As a result, in step S42, the second capacitor 52 and the second inductor 62 are formed, and the resonant circuit 100 (FIG. 4(A)) is configured using the second capacitor 52 and the second inductor 62. . Further, the second cover member 88 and the first cover member 78 cover the substrate 20, so that the substrate 20 is protected from the outside and the IC chip 40 is also protected.

Next, step S43 shown in FIG. 19 will be explained with reference to FIGS. 17, 18(A), and 18(B). In step S43, the metal ring 110 is mounted. Specifically, the metal ring 110 is arranged so as to be inscribed in the peripheral edge 76 of the first cover member 78 and the peripheral edge 86 of the second cover member 88 . At this time, the cut 112 is placed on an extension line 114 that connects the position where the IC chip 40 is placed and the position where the first capacitor 50 is placed.

Finally, in step S44 shown in FIG. 19, a protective member 90 that covers the first cover member 78 and second cover member 88 disposed on the substrate 20 and the metal ring 110 is molded using injection molding. . Specifically, resin is injected onto the first cover member 78 and the second cover member 88 placed on the substrate 20 placed in the mold, and onto the metal ring 110, and the resin is injected under a predetermined temperature and pressure. By molding resin, a protective member 90 that covers the first cover member 78 and the second cover member 88 disposed on the substrate 20 and the metal ring 110 is molded.

At this time, since the part (connection part of the first cover member 78 and second cover member 88) that is assembled to the substrate 20 using the assembly part 79 is closed by the metal ring 110, the coil Members or elements such as the antenna 30, the first capacitor 50 and the first inductor 60, the first cover member 78 and the second cover member 88 are protected from the pressure of the resin during injection molding.

The non-contact information medium 10A is manufactured using the manufacturing method described above. Further, as explained above, in the non-contact information medium 10A, the capacitor and inductor are protected using the protection member 90, the first cover member 78, and the second cover member 88. Therefore, in the non-contact information medium 10A, the capacitance of the capacitor and the inductance of the inductor can be easily adjusted without damaging the capacitor and inductor. Further, the non-contact information medium 10A has higher impact resistance by including the metal ring 110.

The non-contact information medium, the method for manufacturing a non-contact information medium, and the non-contact information medium communication system described above as embodiments of the present invention can be implemented in appropriate combinations as long as they do not contradict each other. Moreover, additions, deletions, or design changes of constituent elements based on each embodiment by those skilled in the art are also included in the scope of the present invention, as long as they have the gist of the present invention.

Further, even if there are other effects that are different from those brought about by each of the embodiments described above, those that are obvious from the description of this specification or that can be easily predicted by a person skilled in the art will naturally be explained. It is understood that this is provided by the present invention.

10: non-contact information medium, 10A: non-contact information medium, 12: non-contact information medium, 12A: non-contact information medium, 20: substrate, 22: top surface, 24: bottom surface, 30: coil antenna, 40: IC chip, 41: fourth gap, 42: control unit, 44: communication unit, 46: storage unit, 47: fourth member, 49: fourth recess, 50: first capacitor, 51: first gap, 52: second capacitor, 53: third gap, 55: first member, 56A: first electrode, 54: first through hole, 56B: second electrode, 57: third member, 58: third recess, 59: first recess, 60: first inductor, 61: second gap, 62: second inductor, 63: second member, 64: second through hole, 69: Second recess, 70: First cover member, 72: First upper cover member, 74: First lower cover member, 76: Periphery, 78: First cover member, 79: Assembly part, 80: second cover member, 82: second upper cover member, 84: second lower cover member, 86: peripheral portion, 88: second cover member, 90: protection member, 100: resonant circuit , 100A: Resonant circuit, 102, 104: Connection part, 110: Metal ring, 112: Cut, 114: Extension line, 120: Non-contact information media group, 200: Non-contact information media communication system, 202: Reader/writer, 204 : input section, 206: processing section, 208: output section, 210 antenna

Claims (20)

a substrate having a first surface and a second surface;
a coil antenna disposed on the first surface or the second surface;
A capacitor electrically connected to the coil antenna, the capacitor including a first electrode disposed on the first surface and a second electrode disposed on the second surface facing the first surface. and,
a first cover member having a first recess that covers the first electrode and forming a first gap between the first recess and the first electrode;
A contactless information medium with a protective member that covers the first cover member;
The protection member is a member different from the first cover member,
The non-contact information medium according to claim 1. an inductor disposed on the first surface and electrically connected to the coil antenna and the first electrode;
a second cover member having a second recess that covers the inductor and forming a second gap between the second recess and the inductor;
has
The protection member contacts the substrate between the first cover member and the second cover member,
The non-contact information medium according to claim 2. A material having a dielectric constant different from that of the first cover member is disposed in the first gap;
The non-contact information medium according to claim 1. A material having a different magnetic permeability than the second cover member is disposed in the second gap;
The non-contact information medium according to claim 3. a first distance between the first electrode and the first cover member is different from a second distance between the inductor and the second cover member;
The non-contact information medium according to claim 3. The number of turns of the coil antenna is 1 turn,
The non-contact information medium according to claim 6. an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor;
The non-contact information medium according to claim 3. an inductor disposed on the first surface and electrically connected to the first electrode and the coil antenna;
The first cover member has a second recess that covers the inductor, and forms a second gap between the second recess and the inductor.
The non-contact information medium according to claim 1. a second cover member having a third recess that covers the second electrode and forming a third gap between the third recess and the second electrode;
The non-contact information medium according to claim 9. A material having a dielectric constant different from that of the first cover member is disposed in the first gap;
The non-contact information medium according to claim 9. A material having a magnetic permeability different from that of the first cover member is disposed in the second gap.
The non-contact information medium according to claim 9. A material having a dielectric constant different from that of the second cover member is disposed in the third gap,
The non-contact information medium according to claim 10. The third interval between the third recess and the second electrode is the first interval between the first electrode and the first cover member, or the third interval between the inductor and the first cover member. Different from the interval of 2,
The non-contact information medium according to claim 10. The number of turns of the coil antenna is 1 turn,
The non-contact information medium according to claim 14. an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor;
The non-contact information medium according to claim 14. has a metal ring with a cut;
The first cover member includes an assembly portion at a peripheral edge of the first cover member,
The assembly portion is in contact with a peripheral edge of the second cover member,
The metal ring is in contact with a peripheral edge of the first cover member and a peripheral edge of the second cover member,
The non-contact information medium according to claim 16. In plan view, the cut is located on an extension line connecting the position where the IC chip is placed and the position where the capacitor is placed, and on the opposite side of the IC chip from the position where the capacitor is placed. Ru,
The non-contact information medium according to claim 17. The non-contact information medium according to claim 18, further comprising a protection member arranged to cover the first cover member, the second cover member, and the metal ring. the first cover member has a fourth recess, and forms a fourth gap between the fourth recess and the IC chip;
The non-contact information medium according to claim 19.

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