JP2023133857A - Sensor device, robot hand, and glove - Google Patents

Abstract

To provide a sensor device, a robot hand, and a glove that can increase the sensitivity of detecting a temperature.SOLUTION: The sensor device includes: a first substrate having a first surface; a first electrode layer formed on the first surface; a second electrode layer formed on the first surface, the second electrode layer being electrically insulated from the first electrode layer; and a temperature sensing material formed on the first surface, the temperature sensing material containing a conductive element inside and having an electric resistance variable according to temperature change. The temperature sensing material has a first region connected to the first electrode layer and a second region connected to the second electrode layer.SELECTED DRAWING: Figure 1

Description

The present invention relates to a sensor device, a robot hand, and a glove.

With the advancement of the Internet of Things (IoT), there is a demand for sensors to be attached to all kinds of things, and in particular, there is a growing need for sheet-like multi-point detection sensors suitable for object (state) recognition.

Furthermore, there is a need to simultaneously detect multiple types of physical quantities (for example, temperature and pressure). Therefore, a sensor sheet has been proposed in which multi-point temperature sensors and pressure sensors are stacked to simultaneously detect temperature distribution and pressure distribution (for example, Patent Document 1). Such a sensor sheet is called a multimodal sensor sheet.

In conventional sensor devices such as sensor sheets, there is room for consideration in increasing the sensitivity of temperature detection.

An object of the present invention is to provide a sensor device, a robot hand, and a glove that can improve temperature detection sensitivity.

According to one aspect of the disclosed technology, a sensor device includes a first substrate having a first surface, a first electrode layer formed on the first surface, and a first electrode layer formed on the first surface. a second electrode layer formed on the first surface and electrically insulated from the first electrode layer; and a temperature sensitive electrode formed on the first surface, containing a conductive element therein, and having an electrical resistance that changes with temperature changes. The temperature-sensitive material has a first region connected to the first electrode layer and a second region connected to the second electrode layer.

According to the disclosed technology, temperature detection sensitivity can be improved.

It is a top view showing the sensor device concerning a 1st embodiment. FIG. 2 is a top view showing a unit sensor sheet included in the sensor device according to the first embodiment. FIG. 2 is a top view showing a wiring board included in the sensor device according to the first embodiment. FIG. 1 is a cross-sectional view (part 1) showing the sensor device according to the first embodiment. FIG. 2 is a cross-sectional view (Part 2) showing the sensor device according to the first embodiment. FIG. 3 is a perspective view showing a configuration example of a first sensor layer. FIG. 7 is a top view showing a sensor device according to a second embodiment. It is a figure showing an example of a two-dimensional map. FIG. 7 is a top view showing a unit sensor sheet included in a sensor device according to a third embodiment. It is a top view showing the unit sensor sheet included in the sensor device concerning a 4th embodiment. It is a top view showing the wiring board included in the sensor device concerning a 5th embodiment. It is a figure showing the robot hand concerning a 6th embodiment. It is a figure which shows the glove based on 7th Embodiment.

The embodiment will be described below. Note that the same members and the like are given the same reference numerals and explanations are omitted. In this application, the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction are defined as mutually orthogonal directions. In addition, the plane including the X1-X2 direction and the Y1-Y2 direction is described as the XY plane, the plane including the Y1-Y2 direction and the Z1-Z2 direction is described as the YZ plane, and the Z1-Z2 direction and the X1-X2 direction The including plane is described as the ZX plane.

(First embodiment)
A first embodiment will be described. The first embodiment relates to a sensor device. FIG. 1 is a top view showing a sensor device according to a first embodiment. FIG. 2 is a top view showing a unit sensor sheet included in the sensor device according to the first embodiment. FIG. 3 is a top view showing a wiring board included in the sensor device according to the first embodiment. 4 and 5 are cross-sectional views showing the sensor device according to the first embodiment. 4 corresponds to a cross-sectional view taken along line AA in FIG. 1, and FIG. 5 corresponds to a cross-sectional view taken along line BB in FIG.

As shown in FIGS. 1, 4, and 5, the sensor device 1 according to the first embodiment includes a unit sensor sheet 20 and a wiring board 30. The sensor device 1 is configured in a sheet shape.

As shown in FIG. 2, the unit sensor sheet 20 has a substrate 21 having a square or rectangular planar shape. A plurality of first electrode layers 22 are provided on one surface 21A (first surface) of the substrate 21 and are formed long along the Y1-Y2 direction. The plurality of first electrode layers 22 are arranged in the X1-X2 direction. A second sensor layer 24 is formed on the first electrode layer 22, covering a portion of the first electrode layer 22. The second sensor layer 24 crosses the first electrode layer 22 in the width direction of the first electrode layer 22 . As the second sensor layer 24, a layer whose electrical characteristics (electrical resistance, capacitance, etc.) change when external stimulation (pressure, heat, light, etc.) is applied is used. In tactile sensing and the like, for example, a pressure-sensitive material whose electrical resistance changes depending on pressure is particularly preferably used as the second sensor layer 24. A second electrode layer 23 that is not in contact with the first electrode layer 22 is formed on the surface 21A of the substrate 21 . A first sensor layer 25 is formed so as to straddle the first electrode layer 22 and the second electrode layer 23 . The first sensor layer 25 has a first region 25S connected to the first electrode layer 22 and a second region 25T connected to the second electrode layer 23. As the first sensor layer 25, for example, a layer whose electrical characteristics (electrical resistance, capacitance, etc.) change when heat is applied from the outside is used. In tactile sensing and the like, for example, a temperature-sensitive material whose electrical resistance changes depending on temperature is particularly preferably used as the first sensor layer 25. The substrate 21 is an example of a first substrate, and the surface 21A is an example of the first surface.

As shown in FIG. 3, the wiring board 30 includes a board 31 having a square or rectangular planar shape. A plurality of third electrode layers 32 are provided on one surface 31A of the substrate 31 and are elongated along the X1-X2 direction. The plurality of third electrode layers 32 are arranged in the Y1-Y2 direction. A fourth electrode layer 33 that is not in contact with the third electrode layer 32 is formed on the surface 31A of the substrate 31. In this way, the wiring board 30 is configured to be connectable to the unit sensor sheet 20. In the present disclosure, "connected" means a state in which electricity can be applied, and therefore, "connecting the unit sensor sheet 20" means that the unit sensor sheet 20 is in a state in which electricity can be applied. The shape of the end of the third electrode layer 32 on the X2 side has a wiring pattern that can be connected to the drive circuit so that a drive signal can be input from the drive circuit (not shown) to the third electrode layer 32. It is 34. Similarly, the shape of the Y2 side end of the fourth electrode layer 33 is such that it can be connected to a drive circuit so that a drive signal can be input from a drive circuit (not shown) to the fourth electrode layer 33. The wiring pattern 35 is as follows. The substrate 31 is an example of a second substrate, and the surface 31A is an example of the second surface.

Note that FIG. 1 shows a state where the wiring board 30 is on the upper side and the unit sensor sheet 20 is on the lower side, and the light is transmitted through the substrate 31 of the wiring board 30. FIG. 3 also shows a state where the light is transmitted through the substrate 31 of the wiring board 30.

In the sensor device 1, the surface 21A of the substrate 21 and the surface 31A of the substrate 31 are perpendicular to the first electrode layer 22 and the third electrode layer 32 in plan view, and the second sensor is disposed at least at the intersection point. The layers 24 are arranged facing each other. In this state, the first electrode layer 22 and the fourth electrode layer 33 are electrically connected by the conductive bonding member 41, and the second electrode layer 23 and the third electrode layer 32 are electrically connected. They are electrically connected by a joining member 42. In this state, for example, the second sensor layer 24 of the unit sensor sheet 20 and the third electrode layer 32 of the wiring board 30 are in contact with each other.

Next, the constituent materials of each part in the first embodiment will be explained.

Although the substrate 21 and the substrate 31 may be made of glass, resin, or the like, a flexible resin film is preferable. For example, a resin film such as PEN (polyethylene naphthalate), polyimide, or PET (polyethylene terephthalate) having a thickness of 50 μm to 200 μm or a stretchable resin film is suitably used.

The first electrode layer 22, the second electrode layer 23 of the unit sensor sheet 20, and the third electrode layer 32 and fourth electrode layer 33 of the wiring board 30 are formed by screening a conductive paste containing silver or copper, for example. It is formed by printing by printing, inkjet, etc. and sintering.

A pressure-sensitive layer particularly suitable for use in tactile sensing and the like as the second sensor layer 24 of the unit sensor sheet 20 is made of an elastic material such as silicone rubber and a plurality of conductive materials such as conductive carbon added to the elastic material. It is formed by a pressure-sensitive conductor containing particles. By applying pressure, the contact resistance between the second sensor layer 24 and the third electrode layer 32 changes depending on the applied pressure, and the detected current value changes. This allows pressure detection to be performed.

A temperature-sensitive layer particularly suitably used for tactile sensing and the like as the first sensor layer 25 is formed of a thermistor (NTC: negative temperature coefficient) made of an inorganic or organic semiconductor, a polymer PTC (positive temperature coefficient), or the like. Polymer PTC is a material containing a thermally expandable insulating resin and a plurality of conductive particles. By applying heat, the insulating resin thermally expands, and the distance between the conductive particles in the insulating resin increases, which increases resistance (reduces the detected current value). Temperature detection is performed using this phenomenon. It can be carried out. The insulating resin is not particularly limited, and any known resin used in general polymer PTC can be used. Specific examples include thermosetting resins such as silicone resins, polyimide resins, and epoxy resins, and thermoplastic resins such as acrylic resins, polyamideimide resins, polyethylene terephthalate resins, and fluorocarbon resins. Further, specific examples of conductive particles include carbon-based particles such as graphite and conductive carbon. The second sensor layer 24 and the first sensor layer 25 are formed by screen printing, inkjet printing, or the like.

The conductive bonding members 41 and 42 are formed of a conductive bonding material such as an anisotropic conductive film (ACF), a conductive bump, or a copper core solder ball.

When using conductive bumps or copper core solder balls, an insulating resin may be provided around them to improve bonding strength. When the second sensor layer 24 is a pressure sensitive layer, it is desirable that the thickness of the conductive bonding members 41 and 42 is equal to or greater than the thickness of the second sensor layer 24. If the thickness of the conductive bonding members 41 and 42 is smaller than the thickness of the second sensor layer 24, a force will act to compress the second sensor layer 24 after bonding, and the output value will decrease even in the initial state without external pressure applied. This is because harmful effects may occur, such as being detected (becoming background noise), or the restoring force of the second sensor layer 24 acting on the joint, reducing the joint strength. Since the pressure sensitive layer is relatively thick, about several tens of micrometers, conductive bumps or copper core solder balls are more suitable than anisotropic conductive films. Since the manufacturing process is simple, conductive bumps can be particularly preferably used.

Here, regarding the current path of the first sensor layer 25 (current for detecting resistance change by applying a constant voltage), the four first sensor layers 25 (25a, 25b, 25c, 25d), the first sensor layer 25a will be described as a representative example. Wiring patterns 34b and 35d are electrically connected to the first sensor layer 25a. When the voltage applied to the wiring pattern 34b is set higher than the voltage applied to the wiring pattern 35d, current flows from the wiring pattern 34b to the third electrode layer 32, the conductive bonding member 42, the second electrode layer 23, and the third electrode layer 32. The liquid flows in the order of the first sensor layer 25a, the first electrode layer 22, the conductive bonding member 41, and the fourth electrode layer 33, and flows into the drive circuit (not shown) from the wiring pattern 35d. At this time, since the current flows in the in-plane direction within the first sensor layer 25a between the second electrode layer 23 and the first electrode layer 22, the sensitivity of the first sensor layer 25a is increased. be able to.

Here, the relationship between the current path and the sensitivity will be explained using polymer PTC, which is suitably used as the first sensor layer 25, as an example. As mentioned above, polymer PTC performs temperature detection based on the principle that when the temperature rises, the resin expands and the distance between the conductive particles increases, thereby increasing the resistance. FIGS. 6A and 6B are perspective views showing a configuration example of the first sensor layer 25. FIG. Here, the first sensor layer 25 has, for example, a rectangular parallelepiped shape in which the planar shape is a rectangle with two orthogonal sides having lengths a and b, respectively, and a thickness c. Further, lengths a and b are sufficiently longer than thickness c. Typically, the length a is designed to be several 100 μm to several mm, the length b to be several 100 μm, and the thickness c to be several 10 μm. FIG. 6(A) shows a configuration example of the first sensor layer 25 when the current path P is in the film thickness direction, and FIG. 6(B) shows the first sensor layer 25 when the current path P is in the in-plane direction. An example of the configuration of the sensor layer 25 is shown.

When the current path P in the first sensor layer 25 is in the film thickness direction, the cross-sectional area (a x b) perpendicular to the current path P is large, as shown in FIG. is short. Therefore, it is necessary to lower the concentration of the conductive particles 251 in the insulating resin 252 to prevent overcurrent from flowing. In this case, the margin for density control is narrow. Furthermore, since the effective thickness of the insulating resin 252 per cross-sectional area in the direction of the conductive path is small, it is impossible to increase the change in resistance due to temperature, making it difficult to achieve high sensitivity.

On the other hand, when the current path P in the first sensor layer 25 is in the in-plane direction, the cross-sectional area (b×c) perpendicular to the current path P is small and the conductive path ( a) is long. That is, the length of the current path P is greater than the film thickness of the first sensor layer 25, and the cross-sectional area of the current path P is smaller than the area of the first sensor layer 25 on the surface 21A. Therefore, the concentration of conductive particles 251 in insulating resin 252 can be increased. Therefore, a wide margin for density control can be secured. Furthermore, since the effective thickness of the insulating resin 252 per cross-sectional area in the direction of the conductive path is large, the change in resistance due to temperature can be increased, that is, the sensitivity can be increased.

(Second embodiment)
A second embodiment will be described. The second embodiment relates to a sensor device. FIG. 7 is a top view showing the sensor device according to the second embodiment. Similar to FIG. 1, FIG. 7 shows a state where the wiring board 30 is on the upper side and the unit sensor sheet 20 is on the lower side, and the light is transmitted through the substrate 31 of the wiring board 30.

As shown in FIG. 7, in the sensor device 2 according to the second embodiment, four unit sensor sheets 20 (20A, 20B, 20C, 20D) are connected to one wiring board 30. Unit sensor sheets 20A and unit sensor sheets 20B are lined up in the Y1-Y2 direction, and unit sensor sheets 20C and unit sensor sheets 20D are lined up in the Y1-Y2 direction. The unit sensor sheet 20A is located on the Y1 side of the unit sensor sheet 20B, and the unit sensor sheet 20C is located on the Y1 side of the unit sensor sheet 20D. Unit sensor sheet 20A and unit sensor sheet 20C are lined up in the X1-X2 direction, and unit sensor sheet 20B and unit sensor sheet 20D are lined up in the X1-X2 direction. The unit sensor sheet 20A is on the X1 side of the unit sensor sheet 20C, and the unit sensor sheet 20B is on the X1 side of the unit sensor sheet 20D. Each unit sensor sheet 20 and wiring board 30 are connected similarly to the first embodiment (see FIGS. 1, 4, and 5).

The third electrode layer 32 provided on one surface 31A of the substrate 31 is formed so as to straddle the X2 side of the unit sensor sheets 20A and 20B and the X1 side of the unit sensor sheets 20C and 20D in plan view. . Further, the fourth electrode layer 33 provided on one surface 31A of the substrate 31 is formed so as to straddle the Y2 side of the unit sensor sheets 20A and 20C and the Y1 side of the unit sensor sheets 20B and 20D in plan view. ing. This enables matrix driving using drive signals applied to the wiring patterns 34 and 35. Specifically, a two-dimensional map of output values can be generated by applying selection signals line-by-line to the wiring pattern 34 and reading output values (current values) at the time of selection from the wiring pattern 35. Note that the number of unit sensor sheets 20 is not limited to four, and the arrangement of the unit sensor sheets 20 is not limited to a rectangular shape, but may be an irregular arrangement. In that case, it is desirable that the wiring pattern of the wiring board 30 is routed so that matrix driving is possible.

Here, an example of a two-dimensional map obtained in the second embodiment will be explained. FIG. 8 is a diagram showing an example of a two-dimensional map. For example, output values of 64 points (8 rows and 8 columns) are obtained from the sensor device 2 according to the second embodiment, and among the 64 points, 16 points are the output values of the first sensor layer 25, and the remaining 48 points are the output values of the second sensor layer 24. The two-dimensional map shown in FIG. 8 shows the distribution of output values, with white circles representing the positions of the output values of the second sensor layer 24 and black circles representing the positions of the output values of the first sensor layer 25. There is. The quantitative ratio and arrangement of the second sensor layer 24 and the first sensor layer 25 can be appropriately selected depending on the sensor type and the purpose of detection. In the case of tactile sensing in which the second sensor layer 24 is a pressure-sensitive layer and the first sensor layer 25 is a temperature-sensitive layer, human skin sensory ability (pain points that feel pressure and hot/cold points that feel temperature) According to the above, it is preferable that the former number is 3 to 5 times the latter number. Note that the number of unit sensor sheets 20 and the sensing point within the unit sensor sheet 20 (the point where the first electrode layer 22 of the unit sensor sheet 20 and the third electrode layer 32 of the wiring board 30 intersect perpendicularly in plan view) The number is not limited to the example of this embodiment, and can be changed as appropriate. Even in that case, a two-dimensional map of output values can be obtained using the same driving method.

(Third embodiment)
A third embodiment will be described. The third embodiment differs from the first embodiment mainly in the configuration of the unit sensor sheet. FIG. 9 is a top view showing a unit sensor sheet included in the sensor device according to the third embodiment.

As shown in FIG. 9, a unit sensor sheet 20 included in the sensor device according to the third embodiment has an insulating layer 26. Further, a part of the second electrode layer 23 intersects with the first electrode layer 22 in plan view. The insulating layer 26 is provided at least between the first electrode layer 22 and the second electrode layer 23 that intersect in plan view.

The other configurations are the same as in the first embodiment.

According to the third embodiment, the first sensor layer 25 can be arranged so as to be connected to a first electrode layer 22 different from the first electrode layer 22 at the X1 side end or the X2 side end. can. In other words, even if there is a portion where the first electrode layer 22 and the second electrode layer 23 overlap in plan view, the insulating layer 26 is provided between them, so that the first electrode layer 22 and the second electrode layer 23 overlap. 22 and the second electrode layer 23 can be prevented from shorting. Therefore, the degree of freedom in arranging the first sensor layer 25 can be improved.

The material for the insulating layer 26 is not particularly limited, and inorganic or organic insulating materials known as general interlayer insulating layers can be used, but it can be easily formed by screen printing, inkjet printing, etc. Organic insulating materials are particularly suitable because they can be formed.

(Fourth embodiment)
A fourth embodiment will be described. The fourth embodiment differs from the third embodiment mainly in the configuration of the unit sensor sheet. FIG. 10 is a top view showing a unit sensor sheet included in the sensor device according to the fourth embodiment.

As shown in FIG. 10, a unit sensor sheet 20 included in the sensor device according to the fourth embodiment has a spacer layer 27. The spacer layer 27 is provided around the first sensor layer 25 and has a thickness equal to or greater than the thickness of the first sensor layer 25.

Other configurations are similar to the third embodiment.

When the second sensor layer 24 is a pressure sensitive layer, the thickness of the first sensor layer 25 is set to a second value so that pressure is preferentially applied to the second sensor layer 24 when pressure is applied to the sensor device. The thickness of the sensor layer 24 is preferably smaller than the thickness of the sensor layer 24 . However, even if the thickness of the first sensor layer 25 is smaller than the thickness of the second sensor layer 24, depending on the distance between the second sensor layer 24 and the first sensor layer 25 and the material of the substrate 21, In this case, there is a possibility that unexpected pressure may be applied to the first sensor layer 25 as well. If the first sensor layer 25 is a temperature-sensitive layer, and in particular is made of polymer PTC, the output value of the first sensor layer 25 may be affected by pressure. On the other hand, if a spacer layer 27 having a thickness equal to or greater than the thickness of the first sensor layer 25 is provided around the first sensor layer 25, pressure is applied to the first sensor layer 25. This can be reliably prevented from occurring. Therefore, highly accurate sensing is possible.

The material for the spacer layer 27 is not particularly limited, and any known inorganic or organic insulating material may be used; however, since it can be easily formed by screen printing, inkjet printing, etc., organic insulating materials are preferred. Particularly suitable are soft materials.

(Fifth embodiment)
A fifth embodiment will be described. The fifth embodiment differs from the first embodiment mainly in the configuration of the wiring board. FIG. 11 is a top view showing a wiring board included in the sensor device according to the fifth embodiment. Similar to FIG. 3, FIG. 11 shows a state where the wiring board 30 is seen through the substrate 31.

As shown in FIG. 11, the wiring board 30 included in the sensor device according to the fifth embodiment has a third sensor layer 36. The third sensor layer 36 is formed to cover a portion of the third electrode layer 32. The third sensor layer 36 crosses the third electrode layer 32 in the width direction of the third electrode layer 32 . The third sensor layer 36 is constructed from the same material as the second sensor layer 24, for example a pressure sensitive material. In the sensor device according to the fifth embodiment, the third sensor layer 36 and the second sensor layer 24 directly overlap.

The other configurations are the same as in the first embodiment.

As described above, when the second sensor layer 24 is a pressure sensitive layer, the first sensor layer 25 is configured such that when pressure is applied to the sensor device, pressure is preferentially applied to the second sensor layer 24. Preferably, the thickness is smaller than the thickness of the second sensor layer 24. However, depending on the required specifications for the material, it may be difficult to form the first sensor layer 25 so that the thickness thereof is smaller than the thickness of the second sensor layer 24. Even in that case, if the third sensor layer 36 is provided so as to cross the third electrode layer 32 in the width direction of the third electrode layer 32, the second sensor layer 24 and the third electrode layer 32 Since the laminate of the two sensor layers can function as one pressure sensitive layer, the thickness of the first sensor layer 25 may be formed to be smaller than the total thickness of the second sensor layer 24 and the third sensor layer 36. Therefore, the manufacturing margin can be widened.

Note that for the above purpose, the third sensor layer 36 is formed at a position overlapping the second sensor layer 24 in plan view.

The unit sensor sheet 20 of the third embodiment or the fourth embodiment may be applied to the second embodiment, and the wiring board 30 of the fifth embodiment may be applied to the second embodiment. Further, the unit sensor sheet 20 of the third embodiment or the fourth embodiment may be applied to the second embodiment, and the wiring board 30 of the fifth embodiment may be applied to the second embodiment. Further, the unit sensor sheet 20 of the third embodiment or the fourth embodiment may be combined with the wiring board 30 of the fifth embodiment.

(Sixth embodiment)
A sixth embodiment will be described. The sixth embodiment relates to a robot hand. FIG. 12 is a diagram showing a robot hand according to the sixth embodiment.

As shown in FIG. 12, the robot hand 6 according to the sixth embodiment includes a gripper 511 and a sensor device 510. The sensor device 510 is a sensor device according to any of the first to fifth embodiments. The sensor device 510 is attached inside the gripper 511 near its tip. The gripper 511 is configured so that the bellows on its back expand and contract using air pressure, allowing it to grip and release objects. The sensor device 510 attached inside near the tip of the gripper 511 makes it possible to detect the pressure and temperature when the robot hand 6 grips an object (tactile sensing).

Note that an end of the wiring pattern of the wiring board constituting the sensor device 510 is connected to a drive circuit (not shown) via a flexible wiring board (not shown) or the like.

(Seventh embodiment)
A seventh embodiment will be described. The seventh embodiment relates to gloves. FIG. 13 is a diagram showing a glove according to the seventh embodiment.

As shown in FIG. 13, the glove 7 according to the seventh embodiment includes a sensor device 610. The sensor device 610 includes a wiring board 630 and a plurality of unit sensor sheets 620. Similar to the second embodiment, a plurality of unit sensor sheets 620 are connected to one wiring board 630. The wiring board 630 has the same configuration as the wiring board 30 of the first or fifth embodiment. The unit sensor sheet 620 has the same configuration as the unit sensor sheet 20 of the first, third, or fourth embodiment. The wiring board 630 has a wiring pattern 634 having the same configuration as the wiring pattern 34 and a wiring pattern 635 having the same configuration as the wiring pattern 35. The sensor device 610 is installed on the palm side of the glove 7, and is capable of detecting pressure and temperature when an object or the like is gripped by the glove 7 (tactile sensing).

Note that the ends of the wiring patterns 634 and 635 of the wiring board 630 are connected to a drive circuit (not shown) via a flexible wiring board (not shown) or the like. In FIG. 13, eight unit sensor sheets 620 are driven in a matrix of X=2 and Y=4 by routing the wiring on the wiring board 630. The actual number of drive matrices is the number of unit sensor sheets multiplied by the number of first electrode layers and the number of third electrode layers per each unit sensor sheet 620.

Although the preferred embodiments have been described in detail above, they are not limited to the embodiments described above, and various modifications may be made to the embodiments described above without departing from the scope of the claims. Variations and substitutions can be made.

1, 2, 510, 610 sensor device 6 robot hand 7 glove 20, 620 unit sensor sheet 21 substrate 21A surface 22 first electrode layer 23 second electrode layer 24 second sensor layer 25 first sensor layer 25S 1 region 25T second region 26 insulating layer 27 spacer layer 30, 630 wiring board 31 substrate 31A surface 32 third electrode layer 33 fourth electrode layer 36 third sensor layer

Japanese Patent Application Publication No. 2016-118552

Claims (10)

a first substrate having a first surface;
a first electrode layer formed on the first surface;
a second electrode layer formed on the first surface and electrically insulated from the first electrode layer;
a temperature-sensitive material formed on the first surface, containing a conductive element therein, and having an electrical resistance that changes with temperature changes;
including;
The temperature-sensitive material is
a first region connected to the first electrode layer;
a second region connected to the second electrode layer;
A sensor device comprising: The sensor device according to claim 1, wherein the length of the current path from the first region to the second region is greater than the film thickness of the temperature-sensitive material. The sensor device according to claim 1, wherein a cross-sectional area of a current path from the first region to the second region is smaller than an area on the first surface of the temperature-sensitive material. . having a plurality of the first electrode layers,
the first region is connected to one of the plurality of first electrode layers,
The second electrode layer intersects with another one of the plurality of first electrode layers in a plan view,
4. The method according to claim 1, further comprising an insulating layer provided between the second electrode layer and another one of the plurality of first electrode layers. sensor device. a second substrate having a second surface opposite to the first surface;
a third electrode layer formed on the second surface and intersecting the first electrode layer in plan view;
A first electrode layer that is provided between the first electrode layer and the third electrode layer, and that changes the conduction state between the first electrode layer and the third electrode layer by external stimulation. materials and
The sensor device according to any one of claims 1 to 4, characterized in that it has: 6. The sensor device according to claim 5, wherein the first material is a pressure-sensitive material whose electrical resistance changes with changes in pressure. Claim 5, further comprising a spacer layer provided around the temperature-sensitive material between the first substrate and the second substrate and having a thickness equal to or greater than the thickness of the temperature-sensitive material. Or the sensor device according to 6. Provided between the first material and the third electrode layer, and conduction between the first electrode layer and the third electrode layer due to external stimulation of the same type as the first material. A sensor device according to any one of claims 5 to 7, characterized in that it has a second material that changes state. A robot hand comprising the sensor device according to any one of claims 1 to 8. A glove comprising the sensor device according to any one of claims 1 to 8.

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