JP2023129608A - Component mounting system and component mounting method - Google Patents

Abstract

To provide a component mounting system and the like capable of preventing components from being mounted wastefully.SOLUTION: A component mounting system is configured to detect whether a code indicating a defect (bad mark) is attached in each of the multiple patterns (first pattern P1) formed on one surface (first surface S1), and each of the multiple patterns (second pattern P2) formed on the other surface (second surface S2) on a substrate KB on which multiple patterns are formed on both sides in correspondence with one side and the other side. Subsequently, the component mounting system determines a pattern corresponding to a pattern formed on one side that is detected as having a mark among the multiple patterns formed on the other side as a pattern not to be mounted with a component on the basis of defect pattern data indicating which patterns are defective. No component is mounted on a pattern which is determined that is determined as the pattern not to be mounted with a component on the other side and a pattern formed on the other surface detected as having a mark by a second detection unit.SELECTED DRAWING: Figure 3

Description

The present invention relates to a component mounting system and a component mounting method for mounting components on patterns formed on each of the front and back sides of a board.

2. Description of the Related Art Conventionally, component mounting systems have been known that produce mounted boards by mounting components on a pattern (electrode pattern) formed on a board. A component mounting system usually has a solder printing section, an inspection section, and a component mounting section arranged in this order. After the solder printing section applies solder to the pattern on the board, the inspection section applies solder to each pattern. Inspect for defects in condition. Then, the component mounting section mounts components on each pattern except for the pattern in which the solder application state is determined to be defective by the inspection section.

Among the mounting boards produced by such a component mounting system, there is a board called a multi-panel board. A multi-panel board is a board in which a plurality of boards (referred to as individual boards) that are separated after component mounting are connected to each other, and a plurality of individual boards can be efficiently produced together. In addition, some mounting boards have patterns formed on both the first side and the second side of the front and back of the board, and the boards on which components are mounted on both sides are so-called double-sided mounting. It is known as a type of board. When producing such a double-sided mounting type board, the board is passed through the component mounting system twice, the first time the components are mounted on the first side, the front and back are reversed, and the second time the components are mounted on the second side. Components are mounted on the device (for example, see Patent Document 1 below).

Japanese Patent Application Publication No. 2011-124329

In addition, in the production of multi-panel boards mentioned above, even if a defective part is detected in the pattern of some individual boards, if the individual board with the defective part is discarded and no components are mounted, production can be improved. It can increase efficiency. However, even if the multi-panel board is a double-sided mounting type, and even if it is an individual board where a defective part was found in the pattern on the first side and no components were mounted, after the board is turned over, If the pattern on the second surface side of the individual board is good, the component will be mounted on that individual board. As a result, components may be wasted on individual boards that are to be disposed of, leading to an increase in production costs.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component mounting system and a component mounting method that can prevent unnecessary mounting of components.

In the component mounting system of the present invention, a defect is detected in each of the plurality of patterns formed on one surface of a substrate in which a plurality of patterns are formed on both surfaces in correspondence with one surface and the other surface. a first detection device that detects whether a code is attached to each of the plurality of patterns formed on the other surface of the substrate; and a second detection device that detects whether or not the code is attached to each of the plurality of patterns formed on the other surface of the substrate. a detection device, which pattern formed on the one surface was detected to have the code by the first detection device, and which pattern formed on the other surface by the second detection device; a storage device that stores defective pattern data indicating whether a pattern is detected to have the code; and a plurality of patterns formed on the other surface based on the defective pattern data stored in the storage device. a determination device that determines a pattern corresponding to the pattern formed on the one surface that is detected as having the code by the first detection device to be a pattern that does not need to be mounted; A mounting device that does not mount components on a pattern formed on the other surface that is determined to be an unnecessary pattern and a pattern formed on the other surface that is detected as having the code by the second detection device. and.

In the component mounting method of the present invention, a defect is detected in each of the plurality of patterns formed on one surface of a board in which a plurality of patterns are formed on both surfaces in correspondence with one surface and the other surface. a first detection step of detecting whether or not a code is attached; and a second detection step of detecting whether or not the code is attached to each of the plurality of patterns formed on the other surface of the substrate. a detection step, which pattern formed on the one surface was detected to have the code in the first detection step, and which pattern formed on the other surface in the second detection step; a storage step of storing defective pattern data indicating whether the pattern is detected to have the code; and a plurality of patterns formed on the other surface based on the defective pattern data stored in the storage step. a determination step of determining a pattern corresponding to the pattern formed on the one surface that is detected as having the code in the first detection step as a pattern that does not need to be mounted; A mounting process in which components are not mounted on a pattern formed on the other surface that is determined to be an unnecessary pattern and a pattern formed on the other surface that is detected as having the code by the second detection device. and, including.

According to the present invention, it is possible to prevent unnecessary mounting of components.

Configuration diagram of a component mounting system according to an embodiment of the present invention (a) A plan view of the first surface viewed from above of a board on which components are mounted by the component mounting system according to an embodiment of the present invention (b) A plan view of the second surface viewed from above A diagram showing the flow of double-sided mounting on a board by a component mounting system according to an embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting system 1 in one embodiment of the present invention. The component mounting system 1 is for producing a mounted board by mounting a component BH on a board KB, and solder coatings are arranged in order from the upstream side in the transport direction of the board KB (direction from left to right in FIG. 1). The present invention includes a solder printing device 11 as a section, an inspection device 12 as an inspection section, a component mounting device 13 as a component mounting section, and a management device 14 as a management section.

The board KB on which components are mounted in the component mounting system 1 is a so-called multi-sided board consisting of a plurality of individual boards KK that can be separated from each other, as shown in FIGS. 2(a) and 2(b). Each of the plurality of individual boards KK included in this board KB is a double-sided mounting type, and a pattern ( electrode pattern). In this embodiment, the pattern on the first surface S1 side of each individual substrate KK is referred to as a first pattern P1, and the pattern on the second surface S2 side is referred to as a second pattern P2.

In this embodiment, as shown in FIGS. 2(a) and 2(b), six individual boards KK (KK1, KK2, KK3, KK4, KK5, KK6) are provided. A first pattern P1 is formed on the first surface S1 side of each of (KK1, KK2, KK3, KK4, KK5, KK6), and a second pattern P2 is formed on the second surface S2 side. However, this is just an example, and the number and arrangement of the individual boards KK included in the board KB are not particularly limited.

In FIGS. 2(a) and 2(b), each of the first surface S1 and second surface S2 of the board KB is provided with an identification code mark KC for identifying the board KB from other boards KB. . The identification code marks KC provided on both the front and back surfaces of the board KB are those marked on the first surface S1 (designated as KC1) and those marked on the second surface S2 (designated as KC2). ), and by reading these identification code marks KC from above, it is possible to identify whether the surface of the board KB facing upward is the first surface S1 or the second surface S2. I can do it.

In FIG. 1, the solder printing apparatus 11 includes a printing apparatus transport section 21, a mask 22, a substrate lifting section 23, and a squeegee 24. The printing device transport unit 21 receives the substrate KB input from the upstream side and positions it at a predetermined position. The mask 22 has pattern holes (not shown) corresponding to the patterns formed on the substrate KB. In this embodiment, the mask 22 includes a first mask having pattern holes corresponding to the first pattern P1 and a second mask having pattern holes corresponding to the second pattern P2. A first mask is installed when applying solder to the first pattern P1, and a second mask is installed when applying solder to the second pattern P2. The substrate lifting section 23 lifts the substrate KB placed at a predetermined position by the printing device transport section 21 and brings the upper surface of the substrate KB into contact with the lower surface of the mask 22 . The squeegee 24 is slid on the mask 22 that is in contact with the substrate KB, and scrapes paste-like solder (not shown) on the mask 22. As a result, solder (not shown) is pushed out to the lower surface side of the mask 22 through the pattern holes and applied to the surface of the pattern.

In FIG. 1, the inspection apparatus 12 includes an inspection apparatus transport section 31, an inspection head 32, and an inspection head moving mechanism 33. The inspection device transport unit 31 receives the board KB from the solder printing device 11 and positions it at a predetermined inspection position. The inspection head 32 includes an imaging section whose imaging field of view is directed downward, and a mark engraving section. The inspection head moving mechanism 33 moves the inspection head 32 above the substrate KB, and the inspection head 32 inspects each pattern on the upper surface (the surface facing upward) of the substrate KB using an imaging section. Specifically, each pattern on the top surface of the board KB is imaged by the imaging unit of the inspection head 32, and when a pattern with a defective part is found, the inspection head 32 is placed near the pattern with the defective part. A bad mark BM (mark, code) is attached by the mark engraving part (FIG. 2(a)).

In FIG. 1, the component mounting apparatus 13 includes a mounting apparatus transport section 41, a component supply section 42, a mounting head 43, a camera 44, and a mounting head moving mechanism 45. The mounting device transport section 41 receives the board KB sent from the inspection device 12 and positions it at a predetermined position. The component supply unit 42 includes, for example, a plurality of tape feeders, each of which supplies the component BH to a predetermined component supply position. The mounting head 43 includes a nozzle (not shown) extending downward, and a camera 44 is attached to the mounting head 43 so that its imaging field of view is directed downward. The mounting head moving mechanism 45 moves the mounting head 43 within a horizontal plane. The component mounting apparatus 13 supplies the component BH from the component supply section 42, moves the mounting head 43 using the mounting head moving mechanism 45, and causes the nozzle to adsorb (pick up) the component BH supplied by the component supply section 42. A series of operations (mounting turns) for mounting each pattern are repeatedly performed.

In FIG. 1, a management device 14 is a device that integrally manages the operations of the solder printing device 11, the inspection device 12, and the component mounting device 13. The solder printing device 11, the inspection device 12, and the component mounting device 13 can mutually transmit data through the management device 14. As shown in FIG. 1, the management device 14 includes a storage section (storage device) 14M, a pattern detection section 14K, and an unnecessary pattern setting section 14J.

The storage unit 14M of the management device 14 stores detailed data (board data) of the boards KB handled by the component mounting system 1 for each type of board KB. The substrate data includes pattern correspondence data indicating the correspondence between the first surface S1 and the second surface S2, that is, the correspondence between each of the plurality of first patterns P1 and the plurality of second patterns P2, as well as the first pattern P1 and the second surface S2. Coordinate data based on the board KB of each of the two patterns P2 is included.

Next, a procedure (component mounting method) for performing double-sided mounting on the board KB using the component mounting system 1 having such a configuration will be described. In this embodiment, in order to mount the component BH on both the first pattern P1 on the first surface S1 side and the second pattern P2 on the second surface S2 side of the board KB, the board KB is subjected to the component mounting system 1 twice. Passed. Specifically, first, the board KB is loaded into the component mounting system 1 with the first surface S1 facing upward. After the component BH is mounted on the first surface S1 of the board KB, the board KB is turned over and placed into the component mounting system 1 again with the second surface S2 facing upward. When the component BH is thus mounted on the second surface S2 of the board KB, double-sided mounting on the board KB is completed.

Hereinafter, the operation of the component mounting system 1 for one board KB will be explained in order. First, the operator installs the mask 22 (first mask) corresponding to the first surface S1 on the solder printing device 11. Then, the board KB is placed into the solder printing device 11 with the first surface S1 facing upward.

When a board KB with the first surface S1 facing upward is input, the solder printing device 11 contacts the mask 22 (first mask) with the board KB, and presses a squeegee 24 over the mask 22 supplied with solder. By sliding the substrate KB, solder is applied to the first surface S1 of the substrate KB (that is, the first pattern P1 of each of the plurality of individual substrates KK) (first solder application step). After the solder printing device 11 finishes applying solder to the first surface S1 of the board KB, it sends out the board KB to the inspection device 12.

When the inspection device 12 receives the board KB from the solder printing device 11, the inspection device 12 images the identification code mark KC provided on the upwardly facing surface of the board KB (here, the first surface S1) using the inspection head 32. The image is taken depending on the area. As a result, the inspection device 12 understands that the surface facing upward is the first surface S1, and then inspects each pattern (the first pattern P1 of each of the plurality of individual substrates KK) on the first surface S1 side. Inspect (first inspection step). In this first inspection step, the inspection device 12 moves the inspection head 32 above the substrate KB, and images each pattern (first pattern P1) on the first surface S1 of the substrate KB from above using the imaging unit. It is determined whether or not there is a first pattern P1 having a defective portion.

In the first inspection process, when the first pattern P1 having a defective part is found on the first surface S1, the inspection apparatus 12 detects the first pattern P1 having the defective part on the substrate KB corresponding to the first pattern P1 having the defective part. A bad mark BM is attached (marked) at a position (for example, within the region of the first surface S1 of the individual substrate KK including the first pattern P1 having a defective part) by the mark marking section of the inspection head 32. After the inspection device 12 finishes inspecting the pattern on the first surface S1 side of the board KB (the first pattern P1 of each of the plurality of individual boards KK), the inspection device 12 sends the board KB to the component mounting device 13.

When the component mounting device 13 receives the board KB from the inspection device 12, it uses the camera 44 to image the identification code mark KC provided on the upwardly facing surface of the board KB (here, the first surface S1). . As a result, the component mounting device 13 understands that the surface facing upward is the first surface S1, and from the board data stored in the storage section 14M of the management device 14, The pattern, that is, the coordinate data of the first pattern P1 of each of the plurality of individual substrates KK is read out.

After reading the coordinate data of the first pattern P1 of each of the plurality of individual boards KK, the component mounting device (first detection device) 13 images the entire first surface S1 of the board KB with the camera 44 of the mounting head 43. . Then, when a bad mark BM is found on the first surface S1 of the board KB, the position data of the found bad mark BM on the board KB is converted into "first surface side bad mark position data DTp". The information is stored in the storage unit 14M of the management device 14 (FIG. 3).

When the first side bad mark position data DTp is stored in the storage unit 14M, the pattern detection unit 14K of the management device 14 detects the first side bad mark position data DTp stored in the storage unit 14M (that is, the inspection unit A defective pattern on the first surface side, which is the first pattern P1 having a defective portion, is detected based on the position of a mark made by a certain inspection device 12) and the board data stored in the storage unit 14M. For example, as shown in FIG. 2(a), if the bad mark BM is within the area of the individual board KK with the code KK3, and if the bad mark BM is found, the individual board KK with the code KK3 The first pattern P1 included in the image forming apparatus is detected as a defective pattern on the first surface side.

After detecting the first-side defective pattern, the pattern detection unit 14K converts the position data of the detected first-side defective pattern on the board KB into “first-side defective pattern position data DTa (defective pattern data).” is obtained and stored in the storage unit 14M (FIG. 3). After the first side defective pattern position data DTa is stored in the storage section 14M, the component mounting apparatus 13 reads the first side defective pattern position data DTa from the storage section 14M (FIG. 3).

Further, when the first side defective pattern position data DTa is stored in the storage section 14M, the implementation-unnecessary pattern setting section (determination device) 14J of the management device 14 selects the first side defective pattern stored in the storage section 14M. Based on the position data DTa and the board data (pattern correspondence data) stored in the storage unit 14M, a second pattern P2 corresponding to the defective pattern on the first surface side is detected, and the detected second pattern P2 is A pattern that does not require mounting of the component BH (mounting-free pattern) is set (mounting-free pattern setting step). Then, the position data of the set unnecessary pattern on the board KB is stored in the storage unit 14M as "unnecessary pattern position data DTf" (FIG. 3). As a result, for example, if the first pattern P1 of the individual board KK with the code KK3 is detected as a defective pattern on the first side, the second pattern P2 of the individual board KK with the code KK3 is set as a pattern that does not require mounting. , the position data of the unnecessary pattern is stored in the storage unit 14M as unnecessary pattern position data DTf.

After reading the coordinate data of the first pattern P1 of each of the plurality of individual boards KK and the first side defective pattern position data DTa, the component mounting apparatus 13 reads each pattern on the first side S1 side, that is, of each individual board KK. Component mounting (first component mounting) is performed on the first pattern P1 (first component mounting step). In this first component mounting (first component mounting process), components are mounted based on the coordinate data of the first pattern P1 of each of the plurality of individual boards KK, and the No components are mounted on the first side defective pattern (the first pattern P1 having a defective location) whose position is required.

Therefore, after the first component mounting by the component mounting apparatus 13 is completed, the first pattern P1 excluding the first pattern P1 having a defective part among the first patterns P1 of the plurality of individual boards KK included in the board KB is Component BH is now mounted. After the component mounting device 13 finishes mounting components on the first surface S1 side of the board KB (first component mounting), the component mounting device 13 transports the board KB to the downstream side using the mounting device transport section 41.

In this manner, in the component mounting system 1 according to the present embodiment, the component mounting device 13, which is the component mounting section, performs the first mounting of the component BH on each of the plurality of first patterns P1 on the first surface S1 side of the board KB. Before component mounting is performed, each of the plurality of first patterns P1 is inspected to detect the first pattern P1 having a defective part as a first-side defective pattern, and to correspond to the detected first-side defective pattern. The component BH is not mounted on the first pattern P1.

When the component mounting device 13 finishes mounting components (first component mounting) on the first surface S1 side of the board KB (the first pattern P1 of the plurality of individual boards KK), the operator The installed mask 22 is replaced with a second mask corresponding to the second surface S2. Then, the board KB taken out from the component mounting device 13 is turned upside down so that the second surface S2 faces upward, and then the board KB is put into the solder printing device 11 again (as indicated by the arrow in FIG. 3). P).

When the board KB with the second surface S2 facing upward is input, the solder printing device 11 brings the board KB into contact with the mask 22 (second mask), and presses the squeegee 24 over the mask 22 supplied with solder. By sliding the solder, solder is applied to the second surface S2 of the board KB (that is, the second pattern P2 of each of the plurality of individual boards KK) (second solder application step). After the solder printing device 11 finishes applying solder to the second surface S2 of the board KB, the solder printing device 11 sends the board KB to the inspection device 12.

When the inspection device 12 receives the board KB from the solder printing device 11, the inspection device 12 images the identification code mark KC provided on the upwardly facing surface of the board KB (here, the second surface S2) using the inspection head 32. The image is taken depending on the area. As a result, the inspection device 12 understands that the surface facing upward is the second surface S2, and then inspects each pattern on the second surface S2 side (the second pattern P2 of each of the plurality of individual substrates KK). Inspect (second inspection step). In this second inspection step, the inspection device 12 moves the inspection head 32 above the substrate KB, and images each pattern (second pattern P2) on the second surface S2 of the substrate KB from above using the imaging unit. It is checked whether there is a second pattern P2 having a defective part.

In the second inspection step, when the inspection device 12 finds a second pattern P2 having a defective portion on the second surface S2, the inspection device 12 detects a second pattern P2 on the substrate KB corresponding to the second pattern P2 having the defective portion. A bad mark BM is attached (marked) at a position (for example, within the region of the second surface S2 of the individual substrate KK including the second pattern P2 having a defective part) by the mark marking section of the inspection head 32. After the inspection device 12 finishes inspecting the pattern on the second surface S2 side of the board KB (the second pattern P2 of each of the plurality of individual boards KK), the inspection device 12 sends the board KB to the component mounting device 13.

When the component mounting device 13 receives the board KB from the inspection device 12, it uses the camera 44 to image the identification code mark KC provided on the upwardly facing surface of the board KB (here, the second surface S2). . As a result, the component mounting device 13 understands that the surface facing upward is the second surface S2, and uses the board data stored in the storage section 14M of the management device 14 to determine whether the surface facing upward is the second surface S2. The pattern, that is, the coordinate data of the second pattern P2 of each of the plurality of individual substrates KK is read out.

After reading the coordinate data of the second pattern P2 of each of the plurality of individual boards KK, the component mounting device (second detection device) 13 images the entire second surface S2 of the board KB with the camera 44 of the mounting head 43. . Then, when a bad mark BM is found on the second surface S2 of the board KB, the position data of the found bad mark BM on the board KB is stored as "second surface side bad mark position data DTq". The information is stored in the storage unit 14M of the management device 14 (FIG. 3).

When the second side bad mark position data DTq is stored in the storage unit 14M, the pattern detection unit 14K of the management device 14 stores the second side bad mark position data DTq stored in the storage unit 14M (that is, the inspection unit A defective pattern on the second surface side, which is a second pattern P2 having a defective portion, is detected based on the position of a mark made by a certain inspection device 12) and the board data stored in the storage unit 14M. After detecting the second side defective pattern, the pattern detection unit 14K converts the position data of the detected second side defective pattern on the board KB into “second side defective pattern position data DTb (defective pattern data)”. )” and stored in the storage unit 14M (FIG. 3). When the second surface side defective pattern position data DTb is stored in the storage section 14M, the component mounting apparatus 13 reads out the second surface side defective pattern position data DTb from the storage section 14M (FIG. 3), and also reads out the mounting unnecessary pattern position data. Read DTf (Figure 3).

After reading the coordinate data of the second pattern P2 of each of the plurality of individual boards KK, the second surface side defective pattern position data DTb, and the mounting unnecessary pattern position data DTf, the component mounting apparatus 13 reads each of the second patterns P2 on the second surface S2 side. Component mounting (second component mounting) is performed on the pattern, that is, the second pattern P2 of each individual board KK (second component mounting step). In this second component mounting (second component mounting process), components are mounted based on the coordinate data of the second pattern P2 of each of the plurality of individual boards KK, and the second surface side defective pattern position data DTb is used to perform component mounting. A defective pattern on the second surface side whose position is determined (second pattern P2 having a defective part) and an unnecessary pattern whose position is determined from the mounting unnecessary pattern position data DTf (a second pattern corresponding to the first pattern P1 having a defective part) Component mounting is not performed in pattern 2 P2).

Therefore, after the second component mounting by the component mounting apparatus 13 is completed, among the second patterns P2 of the plurality of individual boards KK included in the board KB, the second pattern P2 having the defective part and the second pattern P2 having the defective part are separated. The component BH is mounted on the second pattern P2 excluding the second pattern P2 corresponding to the first pattern P1. When the component mounting device 13 finishes mounting the components on the second surface S2 side of the board KB (second component mounting), the component mounting device 13 transports the board KB to the downstream side using the mounting device transport section 41.

In this way, in the component mounting system 1 according to the present embodiment, the component mounting device 13, which is the component mounting section, performs the second mounting of the component BH on each of the plurality of second patterns P2 on the second surface S2 side of the board KB. Before component mounting is performed, each of the plurality of second patterns P2 is inspected to detect the second pattern P2 having a defective part as a second-side defective pattern, and to correspond to the first pattern P1 having a defective part. The second pattern P2 is set as a pattern that does not require implementation. Then, the component BH is not mounted on the second pattern P2 corresponding to the detected defective pattern on the second surface side and the second pattern P2 corresponding to the set non-mounting pattern.

As described above, in the component mounting system 1 according to the present embodiment, before performing component mounting (first component mounting) on the first surface S1 side of the board KB, the pattern on the first surface S1 side (first pattern P1) is inspected, and the first pattern P1 having a defective portion is detected as a defective pattern on the first surface side. Then, the component BH is not mounted on the detected defective pattern on the first surface side.

In addition, before performing component mounting (second component mounting) on the second surface S2 side of the board KB, the pattern (second pattern P2) on the second surface S2 side is inspected, and the second pattern P2 having a defective part is inspected. is detected as a defective pattern on the second surface side. Then, the component BH is not mounted on the detected defective pattern on the second surface side.

Further, the position data of the detected first side defective pattern (first side defective pattern position data DTa) is stored in the storage unit 14M, and based on the stored first side defective pattern position data DTa, , the second pattern P2 corresponding to the defective pattern on the first side is set as a pattern that does not require mounting. Then, the position data of the set unnecessary pattern (mounting unnecessary pattern position data DTf) is stored in the storage unit 14M, and read out when performing the second component mounting on the second surface S2 side of the board KB. In the second component mounting, components BH are not mounted on patterns that do not require mounting. Therefore, in the component mounting system 1 (component mounting method) according to the present embodiment, an individual board KK having a pattern (first pattern P1 and second pattern P2) having a defective part, that is, an individual board to be discarded. The component BH is not mounted on the KK, and the component BH is not wasted.

As described above, in the component mounting system 1 (component mounting method) according to the present embodiment, the first component BH is mounted on each of the plurality of first patterns P1 formed on the first surface S1 of the board KB. Before mounting, each of the plurality of first patterns P1 is inspected to detect a first pattern P1 having a defective part, and a second pattern P2 corresponding to the first pattern P1 having the detected defective part is detected. It is now set to a pattern that does not require implementation. Then, when performing the second component mounting of mounting the component BH on each of the plurality of second patterns P2 formed on the second surface S2 of the board KB, the second pattern P2 corresponding to the set non-mounting pattern is BH is not implemented. Therefore, it is possible to prevent the component BH from being wasted on the individual board KK that will be disposed of, and it is possible to suppress an increase in production costs.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described embodiments, and various modifications and the like are possible. For example, in the above-described embodiment, the component mounting section was composed of one component mounting device 13, but this is just an example, and it may be composed of a plurality of component mounting devices 13.

Furthermore, in the above-described embodiment, the board KB is passed through one component mounting system 1 twice, but two component mounting systems 1 (the first component mounting system 1 and the second component mounting system 1) The substrate KB may be passed through the mounting apparatus 1) once at a time. In this case, the inspection device 12 of the first component mounting system 1 and the inspection device 12 of the second component mounting system 1 correspond to the inspection section, and the component mounting device 13 of the first component mounting system 1 and the second component mounting system 1 correspond to the inspection section. The component mounting device 13 of the component mounting system 1 corresponds to a component mounting section.

Further, a configuration may be provided in which a mounting inspection device is provided downstream of the component mounting device 13 to determine whether the mounting state of the component BH by the component mounting device 13 is good or bad. In this case, if the mounting condition of the component BH mounted on the board KB is found to be defective by the mounting inspection device and the board KB is to be disposed of, the mounting condition is determined to be defective. By also handling the second pattern P2 corresponding to the first pattern P1 as a pattern that does not require mounting, it is possible to more reliably prevent the component BH from being wasted on the individual board KK that will be discarded.

To provide a component mounting system and a component mounting method that can prevent components from being mounted in vain.

1 Component mounting system 11 Solder printing device 12 Inspection device (inspection department)
13 Component mounting device (component mounting section, first detection device, second detection device)
14 Management device 14K Pattern detection section 14J Unnecessary pattern setting section (judgment device)
KB Board KK Individual board S1 1st side (one side)
S2 2nd side (other side)
P1 1st pattern P2 2nd pattern BM Bad mark (mark)

Claims (5)

Whether a code indicating a defect is attached to each of the plurality of patterns formed on one side of a substrate in which a plurality of patterns are formed on both sides in correspondence with one side and the other side. a first detection device that detects;
a second detection device that detects whether the code is attached to each of the plurality of patterns formed on the other surface of the substrate;
Which pattern formed on the one surface was detected to have the code by the first detection device, and which pattern formed on the other surface by the second detection device was detected to have the code. a storage device that stores defective pattern data indicating whether it is detected that the defective pattern is attached;
the one surface that is detected by the first detection device to have the code, among the plurality of patterns formed on the other surface, based on the defective pattern data stored in the storage device; a determination device that determines a pattern corresponding to the pattern formed in the pattern as a pattern that does not require implementation;
A pattern formed on the other surface that was determined to be a pattern that does not require mounting by the determination device and a pattern formed on the other surface that was detected as having the code by the second detection device are parts. A component mounting system comprising: a mounting device that does not mount; 2. The component mounting system according to claim 1, wherein the storage device stores identification information for the one side of the board and identification information for the other side of the board in association with each other. The storage device stores identification information of a first pattern formed on the one surface and identification information of a second pattern formed on the other surface and associated with the first pattern. The component mounting system according to claim 2, wherein the component mounting system is The determination device determines, based on the data stored in the storage device, a pattern formed on the one surface that is detected to have the code attached by the first detection device as a pattern that does not need to be mounted. The component mounting system according to claim 1, wherein the mounting device does not mount a component on a pattern formed on the one surface that is determined by the determining device to be a pattern that does not require mounting. Whether a code indicating a defect is attached to each of the plurality of patterns formed on one side of a substrate in which a plurality of patterns are formed on both sides in correspondence with one side and the other side. a first detection step of detecting;
a second detection step of detecting whether the code is attached to each of the plurality of patterns formed on the other surface of the substrate;
Which pattern formed on the one surface was detected to have the code in the first detection step, and which pattern formed on the other surface in the second detection step was detected to have the code. a storage step of storing defective pattern data indicating whether it has been detected that the defective pattern is attached;
The one surface that is detected to have the code in the first detection step among the plurality of patterns formed on the other surface based on the defective pattern data stored in the storage step. a determination step of determining a pattern corresponding to the pattern formed in the pattern as an unnecessary pattern to be mounted;
The pattern formed on the other surface that was determined to be a pattern that does not need to be mounted in the determination step and the pattern formed on the other surface that was detected as having the code by the second detection device are parts. A mounting process that does not involve mounting, and a component mounting method that includes.

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