JP2023123752A5 - - Google Patents
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- JP2023123752A5 JP2023123752A5 JP2023107546A JP2023107546A JP2023123752A5 JP 2023123752 A5 JP2023123752 A5 JP 2023123752A5 JP 2023107546 A JP2023107546 A JP 2023107546A JP 2023107546 A JP2023107546 A JP 2023107546A JP 2023123752 A5 JP2023123752 A5 JP 2023123752A5
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- JP
- Japan
- Prior art keywords
- optical waveguide
- waveguide module
- module according
- output end
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 239000012792 core layer Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
Description
本開示の光導波路モジュールは、上面と、該上面に接続する側面と、を有する基板と、電子部品を搭載するための凹部を有し、前記基板の上面に位置するとともに、クラッド層と、および前記クラッド層内に位置するコア層と、を備え、を有し、前記コア層は、前記凹部に露出する第1入射端面と、前記凹部と対向する位置においての出射端面が前記クラッド層からの外方に露出する出射端面と、有し光導波路と、前記側面は、前記出射端面側に位置する第1面を有しており、前記第1面は、前記出射端面よりも突出している。An optical waveguide module of the present disclosure includes a substrate having an upper surface and a side surface connected to the upper surface, a recess for mounting an electronic component, located on the upper surface of the substrate, and a cladding layer; a core layer located within the cladding layer, the core layer having a first incident end face exposed in the recess and an exit end face at a position facing the recess from the cladding layer. The optical waveguide has an output end surface exposed to the outside, and the side surface has a first surface located on the output end surface side, and the first surface projects beyond the output end surface.
Claims (9)
電子部品を搭載するための凹部を有し、前記基板の上面に位置するクラッド層と、
前記クラッド層内に位置するコア層と、を備え、
前記コア層は、前記凹部に露出する第1入射端面と、前記凹部と対向する位置において前記クラッド層から露出する出射端面と、有し、
前記側面は、前記出射端面側に位置する第1面を有しており、
前記第1面は、前記出射端面よりも突出している、光導波路モジュール。 a substrate having a top surface and a side surface connected to the top surface ;
a cladding layer located on the upper surface of the substrate and having a recess for mounting electronic components ;
a core layer located within the cladding layer ,
The core layer has a first incident end face exposed in the recess, and an output end face exposed from the cladding layer at a position facing the recess,
The side surface has a first surface located on the output end surface side,
In the optical waveguide module, the first surface protrudes beyond the output end surface .
前記第1面の表面粗さは、前記出射側面の表面粗さよりも粗い、請求項1又は2に記載の光導波路モジュール。 The cladding has an output side surface on which the output end surface is located,
The optical waveguide module according to claim 1 or 2 , wherein the first surface has a surface roughness rougher than that of the output side surface .
前記クラッド層は、凹部を有し、
前記発光素子は、前記凹部内に位置しており、
前記コア層は、前記凹部に露出している、請求項1~6のいずれか1つに記載の光導波路モジュール。 Further comprising a light emitting element,
The cladding layer has a recess,
The light emitting element is located within the recess,
The optical waveguide module according to claim 1 , wherein the core layer is exposed in the recess .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023107546A JP2023123752A (en) | 2019-11-28 | 2023-06-29 | optical waveguide module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019215839A JP2021086050A (en) | 2019-11-28 | 2019-11-28 | Optical waveguide module |
JP2023107546A JP2023123752A (en) | 2019-11-28 | 2023-06-29 | optical waveguide module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019215839A Division JP2021086050A (en) | 2019-11-28 | 2019-11-28 | Optical waveguide module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023123752A JP2023123752A (en) | 2023-09-05 |
JP2023123752A5 true JP2023123752A5 (en) | 2024-03-15 |
Family
ID=76087559
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019215839A Pending JP2021086050A (en) | 2019-11-28 | 2019-11-28 | Optical waveguide module |
JP2023107546A Pending JP2023123752A (en) | 2019-11-28 | 2023-06-29 | optical waveguide module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019215839A Pending JP2021086050A (en) | 2019-11-28 | 2019-11-28 | Optical waveguide module |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP2021086050A (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8417911D0 (en) * | 1984-07-13 | 1984-08-15 | British Telecomm | Connecting waveguides |
JP2004151416A (en) * | 2002-10-31 | 2004-05-27 | Dainippon Screen Mfg Co Ltd | Optical element unit |
JP2006011119A (en) * | 2004-06-28 | 2006-01-12 | Fujikura Ltd | Optical component, wavelength multiplexer/demultiplexer, and method of manufacturing optical component |
JP2006178382A (en) * | 2004-11-29 | 2006-07-06 | Konica Minolta Holdings Inc | Optical element, optical element holding structure, optical element lens-barrel and optical communication module |
JP5028503B2 (en) * | 2010-02-04 | 2012-09-19 | 日本電信電話株式会社 | Optical module |
JP6268011B2 (en) * | 2013-03-25 | 2018-01-24 | 日本碍子株式会社 | Connection structure between optical input member holding component and optical waveguide component |
US20180003906A1 (en) * | 2016-07-01 | 2018-01-04 | Cisco Technology, Inc. | Coupling optical fiber array with waveguides of photonic subassembly |
CN207601363U (en) * | 2017-11-15 | 2018-07-10 | 烽火通信科技股份有限公司 | A kind of WDM optical component |
-
2019
- 2019-11-28 JP JP2019215839A patent/JP2021086050A/en active Pending
-
2023
- 2023-06-29 JP JP2023107546A patent/JP2023123752A/en active Pending
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