JP2023123076A - Laser device for solder processing - Google Patents

Abstract

To provide a laser device for solder processing which enables solder processing with excellent quality, even if a solder processing part is irradiated with a plurality of laser beams of different wavelengths.SOLUTION: A laser device for solder processing includes: a plurality of first laser elements for emitting a first laser beam of an infrared wavelength region; a plurality of second laser beams for emitting a second laser beam of a blue wavelength range; a condensing optical system which makes both of the first and second laser beams incident thereon; a light source module mounted with the first and second laser elements, and the condensing optical system; an optical fiber which is connected to the light source module, and makes both the first and second laser beams passing through the condensing optical system incident thereon; an irradiation head which makes the first and second laser beams propagated through the optical fiber incident thereon; an irradiation optical system which is stored inside the irradiation head and guides the first and second laser beams; and an irradiation port which irradiates a solder processing part with the first and second laser beams guided through the irradiation optical system.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laser device used for soldering.

As a soldering process, a soldering method using laser light irradiation (also referred to as “laser soldering”) is known. When soldering electronic components to a printed circuit board, laser soldering has the advantage of being able to perform soldering without contacting the circuit board, compared to the conventional method using a soldering iron.

A conventional method of soldering electronic components to a printed circuit board using laser light will now be described with reference to FIGS. 10A-10D. FIG. 10A uses a lead 52 extending from an electronic component 53 to a terminal 51 formed on a printed circuit board 50, a laser beam L10 emitted from an irradiation head 55, and a linear solder 54 supplied from a solder supply unit 56. FIG. 10 is a drawing schematically showing a state in which soldering is carried out. This detailed procedure will be described with reference to FIGS. 10B-10D.

First, as shown in FIG. 10B, the terminal 51 and the lead 52 are preheated by irradiating the terminal 51 and the lead 52 with the laser beam L10. Next, as shown in FIG. 10C, the linear solder 54 is melted by the laser beam L10 while being supplied to the soldering portion P10, and the melted solder (molten solder) 54a is diffused over the entire soldering portion P10. After that, as shown in FIG. 10D, by heating the diffused molten solder 54a with the laser beam L10, an alloy layer is formed at the junction between the terminal 51 and the lead 52 and the solder. This completes the soldering process.

The wavelength of the laser light L10 is generally selected in accordance with the materials of the terminals 51 and the leads 52 and the laser light absorption rate of the linear solder 54 . By using the laser light L10 having a wavelength at which the terminal 51, the lead 52, or the linear solder 54 has a high absorption rate, the heating rate of the soldering portion P10 is increased, so that the time required for soldering can be shortened. If the time required for soldering can be shortened, damage to printed circuit boards and electronic components due to heating can be minimized, and the quality of soldering can be expected to improve.

The main material of the terminals 51 and leads 52, which constitute the soldered portion P10, is generally copper or gold. Also, the main material of the solder (54, 54a) is tin. FIG. 11 is a graph showing the absorptance of copper, gold, and tin according to light wavelength. As shown in FIG. 11, in the case of copper and gold, the absorptivity of laser light in the blue wavelength range of 400 nm to 500 nm is much higher than that of infrared laser light of 800 nm to 1000 nm. On the other hand, in the case of tin, the dependence of the absorptivity on wavelength is smaller than that of copper and gold, and heating using laser light in the infrared wavelength range is sufficiently possible. For this reason, laser light in the blue wavelength range is sometimes used together with laser light in the infrared wavelength range in soldering.

For example, Patent Document 1 below discloses a solder processing apparatus that uses laser light in both the infrared wavelength region and the blue wavelength region.

JP 2013-103263

However, as a result of intensive research, the present inventor found that when soldering is performed using a laser beam in the infrared wavelength region and a laser beam in the blue wavelength region as in Patent Document 1, the quality of the soldering treatment is reduced. I have noticed that it tends to go down. On the other hand, it was confirmed that if the irradiation dose of the laser beam is increased in order to improve the quality of the soldering process, damage to the substrate is more likely to occur.

As a result of further studies on this point, the present inventors found that the irradiation positions of the laser light in the infrared wavelength range and the laser light in the blue wavelength range are likely to be displaced, and as a result, the quality of the soldering process is likely to deteriorate. I guessed that. The terminals and leads are preheated with laser light in the blue wavelength range and then heated together with the diffused molten solder with laser light in the infrared wavelength range to form an alloy layer at the junction with the solder. Therefore, if there is a large deviation in the irradiation positions of these laser beams, even if one laser beam can be heated to a satisfactory degree, the other laser beam is not sufficiently heated, or conversely, the heating is excessive. problem is likely to occur. As a result, according to the conventional method, it may not be possible to achieve high-quality soldering.

SUMMARY OF THE INVENTION Based on the above circumstances, it is an object of the present invention to provide a soldering laser apparatus capable of performing high-quality soldering even when a plurality of laser beams having different wavelengths are irradiated onto a soldering portion.

The laser device for soldering according to the present invention comprises:
a plurality of first laser elements that emit first laser light in an infrared wavelength range;
a plurality of second laser elements that emit second laser light in the blue wavelength range;
a condensing optical system capable of receiving both the first laser beam and the second laser beam;
a light source module equipped with the first laser element, the second laser element, and the condensing optical system;
an optical fiber connected to the light source module and capable of receiving both the first laser beam and the second laser beam that have passed through the condensing optical system;
an irradiation head capable of receiving the first laser beam and the second laser beam propagated through the optical fiber;
an irradiation optical system that is housed inside the irradiation head and guides the first laser beam and the second laser beam;
and an irradiation port for irradiating the first laser beam and the second laser beam guided through the irradiation optical system toward a solder processing portion positioned outside the irradiation head.

Causes of deviation in the irradiation position of the laser light include deviation in the connection position of the optical fiber that propagates the laser light from the light source module to the irradiation head, and deviation in the arrangement of the optical system that guides the laser light to the irradiation site. be done. If the first laser element and the second laser element are mounted on separate light source modules, optical fibers for propagating laser light from the light source modules to the irradiation head are required, respectively. There is a high probability that deviations will occur in On the other hand, according to the above configuration, since the optical fiber that propagates the first laser beam and the second laser beam is shared, the influence of the misalignment of the connection position of the optical fiber can be made smaller than in the conventional case. Therefore, it is possible to perform high-quality soldering without causing deviation of the irradiation position of the laser beam. It should be noted that the description of "a condensing optical system that allows both the first laser beam and the second laser beam to enter" means that the first laser beam and the second laser beam "simultaneously It is not limited to the case of incidence, but includes the case where only the first laser beam is incident under the same timing, but only the second laser beam is incident under different timing.

In addition, when laser soldering is performed on a printed circuit board, it is required to improve work efficiency as well as soldering with good quality. Therefore, it is preferable to operate the irradiation head as fast as possible when performing soldering continuously on a plurality of soldering portions on the printed circuit board. On the other hand, as integrated circuits become more sophisticated in recent years, circuit patterns on printed circuit boards have become more complicated and finer, and the operation of irradiation heads has also become faster and more precise. Therefore, there is a concern that the influence of vibration due to the operation of the irradiation head is accumulated, the position of the optical system in the irradiation head is shifted, and the irradiation position of the laser light is shifted. However, according to the above configuration, a common irradiation optical system in the irradiation head can be used for the first laser beam and the second laser beam. is suppressed, the deviation of the irradiation positions of the respective laser beams is less likely to occur, and high-quality soldering can be performed.

Furthermore, since the irradiation optical system in the irradiation head is common to each laser beam, the irradiation head can be designed compactly.

Further, when considering the maintenance of the laser device and the replacement of consumables, when attaching the optical system and the optical fiber, it is necessary to take the utmost care to prevent the above-described misalignment of the arrangement. According to the above configuration, since the optical fiber and the irradiation optical system in the irradiation head are common for the first laser beam and the second laser beam, it is possible to reduce the work load in replacement work such as maintenance.

In the soldering laser device, the spot diameter of the second laser beam may be smaller than the spot diameter of the first laser beam on the irradiation surface.

As described above, it is assumed that the laser light in the infrared wavelength range will irradiate the entire soldered portion including the solder, and the laser light in the blue wavelength range will irradiate the terminals and leads. In general, a substrate resist applied to a printed circuit board has a high absorptivity in the blue wavelength range, so that when the printed circuit board is irradiated with laser light in the blue wavelength range, the printed circuit board is likely to deteriorate. Therefore, the spot diameter of the laser light in the blue wavelength region is made small so that it is difficult to irradiate areas other than the terminals and leads, and the spot diameter of the laser light in the infrared wavelength region that is irradiated to the entire soldering area is is preferably increased. That is, by making the spot diameter of the second laser beam smaller than the spot diameter of the first laser beam on the irradiated surface, it is possible to perform high-quality soldering.

Note that the spot diameter of the laser beam is determined based on the result of measurement using a beam profiler or the like, for example. Typically, the spot diameter may be the position where the light intensity is 1/e ² of the maximum intensity.

In the soldering laser device, in the light source module, the number of rows of the first laser elements is larger than the number of rows of the second laser elements when the direction in which the laser elements of the same wavelength range are arranged is defined as rows. It doesn't matter if there are many.

In the light source module, laser light emitted from a laser element is condensed by a condensing optical system and enters an optical fiber. As will be described in detail later, when the laser light is distributed over a large area on the incident surface when the laser light is incident on the condensing optical system, the spot diameter of the laser light emitted from the irradiation head increases. If the number of rows of laser elements is increased, the area in which the laser light is distributed on the incident surface of the condensing optical system can be increased. Therefore, if the number of rows of the first laser element is larger than the number of rows of the second laser element, the spot diameter of the first laser beam is larger than that of the second laser beam on the irradiated surface. It is possible to perform high-quality soldering.

In the soldering laser device, the optical path length of the first laser light from the first laser element to the optical fiber is longer than the optical path length of the second laser light from the second laser element to the optical fiber. It may be short.

The solder processing laser device further comprises an imaging optical system arranged in the irradiation head and branched and communicated with the irradiation optical system,
The irradiation optical system comprises first infrared light belonging to a first infrared wavelength band including the same wavelength as the first laser light, blue light belonging to a blue wavelength band including the same wavelength as the second laser light, and A first wavelength separation optical system that selectively separates non-blue visible light belonging to a wavelength band longer than blue light and shorter than the first infrared light,
The imaging optical system includes an imaging element at a position subsequent to the first wavelength separation optical system on the optical path,
Both the first laser light and the second laser light incident from the optical fiber are guided to the irradiation port when incident on the first wavelength separation optical system,
The non-blue visible light included in the visible light incident from the irradiation port may be guided to the imaging device in the imaging optical system when incident on the first wavelength separating optical system.

As a method for confirming the quality of soldering, a method of observing the shape of solder during or after soldering is known. In general, the quality of soldering can be qualitatively judged by checking whether or not there is a curved surface with a smooth bottom spread at the boundary where terminals and leads are in contact with solder. Therefore, by performing the soldering process while observing the state of the soldering process, it is possible to quickly correct the irradiation conditions and perform the soldering process with high quality.

The laser device for soldering according to the present invention includes, as an irradiation optical system, a first infrared light having the same wavelength as the first laser light, a blue light having the same wavelength as the second laser light, and a longer wavelength than the blue light. including a first wavelength separation optical system that selectively separates non-blue visible light having a wavelength shorter than that of the first infrared light; An imaging element is included in the rear stage. As a result, both the first laser beam and the second laser beam that have entered from the optical fiber are guided to the irradiation port when entering the first wavelength separating optical system. Further, the non-blue visible light contained in the visible light derived from the external ambient light incident from the irradiation port is guided to the imaging element in the imaging optical system when incident on the first wavelength separation optical system, and the soldered portion can be observed. Here, a dichroic mirror, a bandpass filter, or the like can be used for the wavelength separation optical system.

Note that "selectively separated" means that when light a1 belonging to a certain wavelength band A1 and light a2 belonging to another wavelength band A2 are mixed and entered, the transmittance for the light a1 is 70% or more. and the reflectance is less than 30%, while the transmittance for the light a2 is less than 30% and the reflectance is 70% or more. More preferably, the transmittance for the light a1 is 80% or more and the reflectance is less than 20%, while the transmittance for the light a2 is less than 20% and the reflectance is 80% or more. .

The first wavelength separation optical system may be a dichroic mirror that transmits the first infrared light and the blue light and reflects the non-blue visible light.

The imaging optical system selectively separates the first infrared light, the blue light, and the non-blue visible light at a position on an optical path between the first wavelength separation optical system and the imaging device. having a second wavelength separation optical system for
The non-blue visible light that has passed through the second wavelength separation optical system may be guided to the imaging device.

As described above, the first wavelength separation optical system includes the first infrared light having the same wavelength as the first laser light, the blue light having the same wavelength as the second laser light, and the It selectively separates non-blue visible light having a shorter wavelength than the first infrared light. However, it may be difficult to completely separate the two lights only by the first wavelength separation optical system such as a dichroic mirror. That is, it is assumed that part of the blue light is not completely separated from the non-blue visible light and enters the imaging device together with the non-blue visible light. In this way, when the blue light derived from the second laser beam is incident on the imaging device, halation may occur in the imaging device, and the observed image may become white and blurry, hindering observation of the soldered portion. Therefore, in the above configuration, the first infrared light, the blue light, and the non-blue visible light are selectively separated at a position on the optical path between the first wavelength separation optical system and the imaging device. A second wavelength separation optical system is arranged. Even if both the first wavelength separation optical system and the second wavelength separation optical system cannot completely separate the incident light of multiple wavelength bands, for example, it can pass through multiple dichroic mirrors. By doing so, it is possible to greatly reduce the proportion of blue light mixed on the side where non-blue visible light travels. As a result, the non-blue visible light that has passed through the second wavelength separation optical system is guided to the imaging device, thereby reducing blue light incident on the imaging device, suppressing halation, and observing the soldered portion. can be done.

The solder processing laser device further comprises a temperature measurement optical system arranged in the irradiation head and branched and communicated with the irradiation optical system,
The irradiation optical system comprises first infrared light belonging to a first infrared wavelength band including the same wavelength as the first laser light, blue light belonging to a blue wavelength band including the same wavelength as the second laser light, and including a first wavelength separation optical system that selectively separates the second infrared light belonging to the second infrared wavelength band having a longer wavelength than the first infrared light,
The temperature measurement optical system includes a radiation temperature sensor at a position subsequent to the first wavelength separation optical system on the optical path,
Both the first laser light and the second laser light incident from the optical fiber are guided to the irradiation port when incident on the first wavelength separation optical system,
The second infrared light emitted from the soldered portion that is incident from the irradiation port is guided to the radiation temperature sensor in the temperature measurement optical system when the second infrared light is incident on the first wavelength separation optical system. I don't mind.

The quality of soldering is affected by the temperature of the soldered portion during soldering (hereinafter referred to as "soldering temperature" for convenience). Also, the appropriate soldering temperature differs depending on the melting point of the solder used and the heat resistance of the printed circuit board. Therefore, by performing the soldering while measuring the soldering temperature, it is possible to quickly correct the irradiation conditions, etc., and perform the soldering with high quality.

The laser device for soldering according to the present invention includes, as an irradiation optical system, first infrared light having the same wavelength as the first laser light, blue light having the same wavelength as the second laser light, and the first infrared light. A first wavelength separation optical system that selectively separates the second infrared light having a longer wavelength than the first wavelength separation optical system. Including sensors. As a result, both the first laser beam and the second laser beam that have entered from the optical fiber are guided to the irradiation port when entering the first wavelength separating optical system. In addition, the second infrared light emitted from the soldered portion that is incident from the irradiation port is guided to the radiation temperature sensor when it is incident on the first wavelength separation optical system, and the soldering temperature can be measured. Become.

It is assumed that the irradiation head exhibits an external shape in which the width becomes narrower as the irradiation port is approached in the vicinity of the irradiation port when the irradiation port side is viewed from the location where the optical fiber is connected. I don't mind.

According to the soldering laser apparatus according to the present invention, even when a plurality of laser beams having different wavelengths are irradiated onto a soldering portion, it is possible to perform soldering with high quality.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing the configuration of a first embodiment of a soldering laser device according to the present invention, and is a cross-sectional view of an irradiation head; It is a schematic diagram which shows the structure inside a light source module. FIG. 2B is a schematic diagram when FIG. 2A is viewed in the X direction; It is a schematic diagram which shows the optical path of the 1st laser beam in a light source module. It is a schematic diagram which shows the optical path of the 2nd laser beam in a light source module. FIG. 3B is a conceptual diagram showing the distribution of the first laser light on the incident surface of the condenser lens indicated by the dotted line D1 in FIG. 3A. FIG. 3C is a conceptual diagram showing the distribution of the second laser light on the incident surface of the condenser lens indicated by the dotted line D1 in FIG. 3B. It is a schematic diagram which shows the optical path of a laser beam by enlarging an irradiation head part of FIG. FIG. 2 is a schematic diagram showing an optical path of visible light derived from ambient light by enlarging the irradiation head portion of FIG. 1 ; FIG. 2 is a schematic diagram showing the configuration of a second embodiment of a soldering laser apparatus according to the present invention, and is a diagram showing a section of an irradiation head. FIG. 4 is a schematic diagram showing the configuration of a modified example of the first embodiment of the solder processing laser apparatus according to the present invention, and is a diagram showing a cross section of an irradiation head. FIG. 4 is a schematic diagram showing the configuration of another modified example of the first embodiment of the soldering laser device according to the present invention, and is a diagram showing the irradiation head in cross section. It is a schematic diagram which shows roughly the method of soldering an electronic component to a printed circuit board using a laser beam. It is a schematic diagram which shows roughly the method of soldering an electronic component to a printed circuit board using a laser beam. It is a schematic diagram which shows roughly the method of soldering an electronic component to a printed circuit board using a laser beam. It is a schematic diagram which shows roughly the method of soldering an electronic component to a printed circuit board using a laser beam. 4 is a graph showing absorptivity of copper, gold, and tin according to wavelength of light.

Hereinafter, a laser device for soldering according to the present invention will be described with reference to the drawings. It should be noted that the following drawings are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily match the actual dimensional ratios and numbers.

[overall structure]
FIG. 1 is a schematic diagram showing the configuration of an embodiment of a soldering laser apparatus 1 according to the present invention, and is a cross-sectional view of an irradiation head. A solder processing laser device 1 includes a light source module 2 , an optical fiber 3 , an irradiation head 4 and an irradiation port 5 .

In the light source module 2, a plurality of first laser elements, a plurality of second laser elements, and a condensing optical system, which will be described later with reference to FIG. 2, are mounted. The optical fiber 3 is connected to the light source module 2, and both the first laser light emitted by the first laser element and the second laser light emitted by the second laser element can enter. The first laser beam and the second laser beam propagated through the optical fiber 3 enter the irradiation head 4 . An irradiation optical system 20, which will be described later, is accommodated in the irradiation head 4, and the first laser beam and the second laser beam guided through the irradiation optical system 20 are emitted from the irradiation port 5 to the outside of the irradiation head 4. is irradiated to

[Light source module]
The internal configuration of the light source module 2 will be described with reference to FIGS. 2A and 2B. FIG. 2A is a schematic diagram showing the internal configuration of the light source module 2. FIG. In each figure below, an XYZ coordinate system is required in which the direction in which the laser element emits laser light is the Z direction, and the directions that are orthogonal to the Z direction and are orthogonal to each other are the X direction and the Y direction, respectively. are listed as appropriate. Using this definition, FIG. 2B is a schematic diagram of FIG. 2A viewed in the X direction. In addition, in FIGS. 2A and 2B, modes of progress of part of the laser light are schematically illustrated by dashed-dotted lines. The same applies to the following drawings.

In the following description, when distinguishing between positive and negative directions when expressing directions, positive and negative signs are added, such as “+X direction” and “−X direction”. Moreover, when expressing a direction without distinguishing between positive and negative directions, it is simply described as “X direction”. That is, in the present specification, the term “X direction” includes both “+X direction” and “−X direction”. The same applies to the Y direction and Z direction.

As shown in FIG. 2A, the light source module 2 includes a plurality of first laser elements 11 that emit first laser light L1 in the infrared wavelength range, and a plurality of second laser elements that emit second laser light L2 in the blue wavelength range. 12 are mounted. The wavelength range of the peak wavelength of the first laser light L1 is preferably 800 nm to 1000 nm, more preferably 800 nm to 815 nm, 870 nm to 890 nm, or 970 nm to 990 nm. On the other hand, the wavelength range of the peak wavelength of the second laser beam L2 is preferably 400 nm to 500 nm, more preferably 440 nm to 470 nm.

In FIG. 2A, a mode of progress of part of the laser light is schematically illustrated by a dashed line, but the mode of progress of the laser light will be described later in detail with reference to FIGS. 3A and 3B. be. In this embodiment, an example in which fourteen first laser elements 11 and four second laser elements 12 are mounted is shown. Further, when the direction in which the laser elements of the same wavelength range are arranged, that is, the X direction is defined as rows, in this embodiment, the number of rows of the first laser elements 11 is two, and the number of rows of the second laser elements 12 is one. A line example is shown.

The light source module 2 is equipped with a condensing optical system 13 into which both the first laser beam L1 and the second laser beam L2 can be incident. Further, as shown in FIG. 2A, the light source module 2 may include a dichroic mirror 17 into which the first laser beam L1 and the second laser beam L2 are incident. For example, the dichroic mirror 17 transmits the first laser beam L1 and reflects the second laser beam L2. The light L<b>2 travels in the common optical axis direction (+Y direction) and enters the condensing optical system 13 . FIG. 2A shows an example in which the condensing optical system 13 includes the plano-concave lens 16, the collimator lens 15, and the condensing lens 14, but it is optional whether or not the plano-concave lens 16 and the collimator lens 15 are provided. .

As shown in FIG. 2A, the light source module 2 may comprise reflective mirrors 18a, 18b, 18c. For example, the reflecting mirrors 18a and 18b are provided to direct the traveling directions of the first laser beams L1 emitted from the respective first laser elements 11 toward the dichroic mirror 17 in the +Y direction. Further, the reflecting mirror 18c is provided to direct the traveling directions of the second laser beams L2 emitted from the respective second laser elements 12 toward the dichroic mirror 17 in a state of being unified in the -X direction.

The light source module 2 may also include a reflective mirror 19, as shown in FIG. 2B. The reflecting mirror 19 is arranged, for example, in a stepped pattern, and is provided for the purpose of directing laser beams of the same wavelength band emitted from different laser elements toward the dichroic mirror 17 while narrowing the distance between the laser beams. .

The optical path along which the first laser beam L1 travels will be described in more detail with reference to FIG. 3A. FIG. 3A is a schematic diagram showing the optical path of the first laser beam L1 within the light source module. The first laser beam L1 emitted from the first laser element 11 in the +Z direction is incident on the reflection mirror 19 and travels in the +Y direction, as shown in FIGS. 2B and 3A. Of the two rows in which the first laser elements 11 are arranged, the first laser light L1 emitted from the first laser element 11 belonging to the row on the -X side enters the reflecting mirror 19 and travels in the +Y direction, It enters the dichroic mirror 17 and enters the plano-concave lens 16 . On the other hand, of the two rows in which the first laser elements 11 are arranged, the first laser light L1 emitted from the first laser element 11 belonging to the row on the +X side enters the reflecting mirror 19 and travels in the +Y direction. , is reflected in the −X direction by the reflecting mirror 18 a , is further reflected in the +Y direction by the reflecting mirror 18 b , enters the dichroic mirror 17 , and enters the plano-concave lens 16 . The reflecting mirror 18b is arranged at a position not overlapping the optical path of the first laser light L1 emitted from the first laser element 11 belonging to the row on the -X side.

Similarly, the optical path along which the second laser beam L2 travels will be described in more detail with reference to FIG. 3B. FIG. 3B is a schematic diagram showing the optical path of the second laser beam L2 within the light source module. As shown in FIG. 3b, the second laser beam L2 emitted from the second laser element 12 in the +Z direction is incident on the reflecting mirror 19, travels in the +Y direction, and is reflected in the -X direction by the reflecting mirror 18c. After that, the light enters the dichroic mirror 17 , is reflected in the +Y direction, and enters the plano-concave lens 16 .

The first laser beam L1 and the second laser beam L2 incident on the plano-concave lens 16 are diverged by the plano-concave lens 16, enter the collimator lens 15, and are again substantially parallelized into light traveling in the +Y direction. After that, they enter the condenser lens 14 and are condensed toward the optical fiber 3, and both the first laser beam L1 and the second laser beam L2 enter the optical fiber 3 (see FIGS. 3A and 3B).

FIG. 4A is a conceptual diagram showing the distribution of the first laser beam L1 on the incident surface of the condenser lens 14 indicated by the dotted line D1 in FIG. 3A. Similarly, FIG. 4B is a conceptual diagram showing the distribution of the second laser beam L2 on the incident surface of the condenser lens 14 indicated by the dotted line D1 in FIG. 3B. Comparing FIG. 4A and FIG. 4B, the area over which the second laser beam L2 is distributed is smaller than the area over which the first laser beam L1 is distributed. This is because the number of rows of the first laser elements 11 is larger than the number of rows of the second laser elements 12 . The first laser beam L1 and the second laser beam L2 are incident on the optical fiber 3 via the condenser lens 14, propagated to the irradiation head 4, guided by the irradiation optical system 20 described later, and then delivered to the soldering portion. P1 is irradiated. Therefore, the size relationship between the spot diameters of the first laser beam L1 and the second laser beam L2 on the irradiation surface of the soldering portion P1 is the same as that on the incident surface of the condenser lens 14. depends on the magnitude of the area over which is distributed. Therefore, the spot diameter of the second laser beam L2 on the irradiated surface when irradiated from the irradiation port 5 is smaller than the spot diameter of the first laser beam L1. In this manner, by increasing the number of rows of the first laser elements 11 than the number of rows of the second laser elements 12, the spot diameter of the second laser beam L2 irradiated from the irradiation port 5 on the irradiation surface is increased to It can be made smaller than the spot diameter of one laser beam L1.

In the light source module 2, the first laser beam L1 and the second laser beam L2 are appropriately changed in their traveling directions by the reflecting mirror 18 as described above, enter the dichroic mirror 17, and enter the condenser lens 14. and the like into the optical fiber 3 (see FIGS. 3A and 3B). Here, for the first laser light L1 emitted from the first laser element 11 belonging to the row located on the -X side among the rows constituted by the first laser elements 11, the reflecting mirror 19 reflects the first laser light L1. is reflected in the Y direction, it enters the dichroic mirror 17 without being changed in its traveling direction by the reflecting mirror 18 . Further, the traveling direction of the first laser light L1 emitted from the first laser element 11 belonging to the row located on the +X side among the rows constituted by the first laser elements 11 is changed by the reflecting mirrors 18a and 18b. Although modified, it passes through the inner side of the second laser light L2 emitted from the second laser element 12 belonging to the row located on the +X side of the row in which the first laser elements 11 are arranged, and reaches the dichroic mirror 17. Incident. That is, the optical path length of the first laser light L1 from the first laser element 11 to the optical fiber 3 is arranged to be shorter than the optical path length of the second laser light L2 from the second laser element 12 to the optical fiber 3. be.

In general, it is assumed that more first laser elements 11 than second laser elements 12 are arranged to emit the first laser light L1 that irradiates the entire soldering portion P1. As mentioned above, tin, which is the main material of solder, has a small difference in absorbance for light in the infrared wavelength range and blue wavelength range. is also large. Therefore, if the optical path length of the second laser light L2 from the second laser element 12 to the optical fiber 3 is shorter than the optical path length of the first laser light L1 from the first laser element 11 to the optical fiber 3, If arranged, the number of parts required to make the first laser beam L1 incident on the dichroic mirror 17 from the +X side increases. Therefore, by arranging them as described above, it is possible to reduce the number of components of the condensing optical system 13 that guides the first laser beam L1 and the second laser beam L2, and to configure the light source module 2 in a small size. Become.

[Irradiation optical system]
Next, the irradiation optical system 20 housed inside the irradiation head 4 will be described. As shown in FIG. 1, the irradiation optical system 20 includes a collimator lens 21 into which the first laser beam L1 and the second laser beam L2 propagated from the optical fiber 3 to the irradiation head 4 enter. Further, the irradiation optical system 20 includes a first dichroic mirror 22, which will be described later, at a position subsequent to the collimator lens 21 on the optical path, and further has a condensing lens 23 at a subsequent stage. Although FIG. 1 shows an example in which the irradiation optical system 20 includes the collimator lens 21 and the first dichroic mirror 22, it is optional whether or not the collimator lens 21 and the first dichroic mirror 22 are included.

In this embodiment, the first dichroic mirror 22 is an example of the first wavelength separating optical system. For example, the first dichroic mirror 22 receives the first infrared light in the first infrared wavelength range including the peak wavelength of the first laser light L1 and the blue light in the blue wavelength range including the peak wavelength of the second laser light L2. while substantially reflecting at least part of the light in the visible range, which has a longer wavelength than the blue wavelength range.

As a specific example, the first dichroic mirror 22 transmits light in the first infrared wavelength range belonging to the wavelength range of 800 nm to 1000 nm and light in the blue wavelength range belonging to the wavelength range of 400 to 500 nm. I don't mind. More specifically, the wavelength range of the light in the first infrared wavelength band may be, for example, 800 nm to 815 nm, 870 nm to 890 nm, or 970 nm to 990 nm. Furthermore, the wavelength range of the light in the blue wavelength range may be 440 nm to 470 nm. Further, the transmittance of the first dichroic mirror 22 for light in the first infrared wavelength region and light in the blue wavelength region is preferably 70% or more, more preferably 80% or more, and still more preferably 85% or more. is. Furthermore, the first dichroic mirror 22 preferably has a reflectance of 70% or more, more preferably 80% or more, and still more preferably 85%, with respect to light in the non-blue visible range of 500 nm to 800 nm. That's it. However, the non-blue visible light reflected by the first dichroic mirror 22 is guided to the imaging optical system 30 and used as imaging light, as will be described later. For this reason, the wavelength range of the light reflected by the first dichroic mirror 22 may be any wavelength range that can be used as imaging light, and it is necessary to reflect all light in the visible range with wavelengths longer than the blue wavelength range. no. In other words, the wavelength range substantially reflected by the first dichroic mirror 22 should be at least within the range of 500 nm to 800 nm. As the wavelength range to be reflected becomes narrower, the amount of light guided to the imaging optical system 30 decreases. Therefore, the wavelength range to be reflected may be appropriately selected within the range that can be used as imaging light. . Further, for the light in the blue wavelength range, when the wavelength range of the light that the first dichroic mirror 22 exhibits the above transmittance is 440 nm to 470 nm, the first dichroic mirror 22 has a blue wavelength range of 400 nm to 440 nm. and for light in the non-blue wavelength range of 470 nm to 800 nm, the above reflectance may be exhibited.

FIG. 5 is a schematic diagram showing the optical path of the laser beam by enlarging the irradiation head 4 portion of FIG. The first laser beam L<b>1 and the second laser beam L<b>2 that enter the irradiation head 4 from the optical fiber 3 enter the collimator lens 21 and are substantially parallelized, and then enter the first dichroic mirror 22 . As described above, the first dichroic mirror 22 transmits the first laser beam L1 and the second laser beam L2, so the first laser beam L1 and the second laser beam L2 travel straight. After that, the first laser beam L1 and the second laser beam L2 enter the condenser lens 23, are condensed toward the irradiation port 5, and are irradiated from the irradiation port 5 to the external soldering portion P1.

[Imaging optical system]
Further, as shown in FIG. 1, an imaging optical system 30 branched and communicated with the irradiation optical system 20 is arranged inside the irradiation head 4 . The imaging optical system 30 has a second dichroic mirror 31, which will be described later, at a position subsequent to the first dichroic mirror 22 on the optical path. Further, the imaging optical system 30 has a reflecting mirror 34 and a condensing lens 32 behind the second dichroic mirror 31 , and further has an imaging element 33 behind the second dichroic mirror 31 .

In this embodiment, the second dichroic mirror 31 is an example of a second wavelength separating optical system. For example, the second dichroic mirror 31 has a first infrared light belonging to a first infrared wavelength range including the peak wavelength of the first laser light L1 and a blue light belonging to a blue wavelength range including the peak wavelength of the second laser light L2. While substantially reflecting light, it substantially transmits at least part of the light in the visible range, which has a longer wavelength than the blue wavelength range.

As a specific example, the second dichroic mirror 31 reflects light in the first infrared wavelength range belonging to the wavelength range of 800 nm to 1000 nm and light in the blue wavelength range belonging to the wavelength range of 400 nm to 500 nm. I don't mind. More specifically, the wavelength range of the light in the first infrared wavelength band may be, for example, 800 nm to 815 nm, 870 nm to 890 nm, or 970 nm to 990 nm. Furthermore, the wavelength range of the light in the blue wavelength range may be 440 nm to 470 nm. Further, the reflectance of the second dichroic mirror 31 with respect to the light in the first infrared wavelength region and the light in the blue wavelength region is preferably 70% or more, more preferably 80% or more, and still more preferably 85% or more. is. In addition, the second dichroic mirror 31 preferably has a transmittance of 70% or more, more preferably 80% or more, and still more preferably 85% for light in the non-blue visible range of 500 nm to 800 nm. That's it. The wavelength range substantially transmitted by the second dichroic mirror 31 may be set in the same manner as the wavelength range substantially reflected by the first dichroic mirror 22 . Further, for the light in the blue wavelength range, when the wavelength range of the light that the second dichroic mirror 31 exhibits the above reflectance is 440 nm to 470 nm, the second dichroic mirror 31 has a blue wavelength range of 400 nm to 440 nm. and for light in the non-blue wavelength range of 470 nm to 800 nm, the above transmittance may be exhibited.

The optical path of the visible light L3 originating from the external ambient light entering from the irradiation port 5 will be described with reference to FIG. FIG. 6 is a schematic diagram showing an optical path of visible light L3 derived from ambient light by enlarging the irradiation head 4 of FIG. The visible light L3 originating from ambient light enters the first dichroic mirror 22 via the condenser lens 23 after entering from the irradiation port 5 . As described above, the first dichroic mirror 22 belongs to the first infrared wavelength region including the same wavelength as the first laser beam L1 and the blue wavelength region including the same wavelength as the second laser beam L2. It transmits blue light and reflects non-blue visible light belonging to a wavelength range longer than the blue light and shorter than the first infrared light. Therefore, the non-blue visible light L4 is selectively reflected out of the visible light L3 originating from the ambient light. The non-blue visible light L4 then enters the second dichroic mirror 31 . As described above, the second dichroic mirror 31 reflects the first infrared light and the blue light and transmits the non-blue visible light. pass through. After that, the non-blue visible light L4 is reflected by the reflecting mirror 34 , enters the condenser lens 32 , is condensed toward the imaging device 33 , and enters the imaging device 33 . In this way, it is possible to observe the soldered portion P1 using the non-blue visible light L4 incident on the imaging device 33 .

On the other hand, the first laser beam (not shown) and the second laser beam (not shown) reflected at the soldering portion P1 are also incident from the irradiation port 5 . These laser beams also enter the first dichroic mirror 22 via the condenser lens 23 in the same manner as the visible light L3. Here, it is assumed that some of the first laser light (not shown) and second laser light (not shown) are not completely separated from the non-blue visible light L4. However, these laser beams and the non-blue visible light L4 are incident on the second dichroic mirror 31, where the first laser beam (not shown) and the second laser beam (not shown) ) are reflected, it is possible to greatly reduce the ratio of these laser beams mixed on the traveling side of the non-blue visible light L4. By arranging the second dichroic mirror 31 in this way, it is possible to prevent halation in the imaging device 33 caused by the blue light derived from the second laser beam being incident on the imaging device 33 .

[External shape of irradiation head]
As shown in FIG. 1, when the irradiation head 4 faces the irradiation port 5 side from the side where the optical fiber 3 is connected, the width near the irradiation port 5 becomes narrower as it approaches the irradiation port 5. shape. With such a shape, it is possible to reduce the first laser beam (not shown) and the second laser beam (not shown) that are reflected at the soldered portion P1 and enter the irradiation port 5. Halation of the element 33 can be reduced. However, especially when the soldering laser device 1 does not include the imaging optical system 30, the shape is not limited to such a shape.

[Action]
As described above, according to the soldering laser device 1 according to the present invention, since the optical fiber 3 that propagates the first laser beam L1 and the second laser beam L2 is common, the connection position of the optical fiber 3 Since the influence of displacement can be reduced compared to the conventional case, the irradiation positions of the respective laser beams are less likely to be displaced. In addition, since a common irradiation optical system 20 in the irradiation head 4 can be used for the first laser beam L1 and the second laser beam L2, the influence of vibration due to the operation of the irradiation head 4 as described above is suppressed. This makes it difficult for the irradiation positions of the respective laser beams to be displaced. In this way, since the irradiation position of each laser beam is less likely to shift, even when a plurality of laser beams (L1, L2) having different wavelengths are irradiated to the soldering portion P1, it is possible to perform soldering with high quality. Become. Further, if necessary, it is possible to make the spot diameter of the second laser beam L2 smaller than the spot diameter of the first laser beam L1, observe the soldered portion P1, and measure the soldering temperature. , which enables better quality soldering.

[Second embodiment]
The configuration of the second embodiment of the soldering laser apparatus 1 of the present invention will be described, focusing on the points different from the first embodiment.

FIG. 7 is a schematic diagram showing the configuration of a second embodiment of the soldering laser device 1 following FIG. 1, and is a cross-sectional view of the irradiation head. The soldering laser apparatus 1 of this embodiment differs from that of the first embodiment in that a temperature measurement optical system 40 is provided in place of the imaging optical system 30 .

That is, as shown in FIG. 7, inside the irradiation head 4, a temperature measuring optical system 40 branched and communicated with the irradiation optical system 20 is arranged. The temperature measurement optical system 40 has a reflecting mirror 42 and then a condenser lens 41 at positions subsequent to the first dichroic mirror 22 on the optical path, and further has a radiation temperature sensor 43 at a position subsequent thereto. .

Further, in the present embodiment, the first dichroic mirror 22 included in the irradiation optical system 20 includes the first infrared light belonging to the first infrared wavelength region including the peak wavelength of the first laser light L1 and the second laser light L2. It is the same as the first embodiment in that it substantially transmits blue light belonging to the blue wavelength region including the peak wavelength of . On the other hand, the first dichroic mirror 22 of the present embodiment substantially reflects at least a portion of the second infrared light having a longer wavelength than the first infrared wavelength region, compared to the first embodiment. points are different.

That is, the transmission wavelength range of the first dichroic mirror 22 can be set in the same manner as in the first embodiment. On the other hand, the reflection wavelength range of the first dichroic mirror 22 can be, for example, 8 μm to 14 μm. More specifically, the first dichroic mirror 22 has a reflectance of 70% or more, preferably 80% or more, more preferably 80% or more, with respect to light in the second infrared wavelength range of 8 μm to 14 μm. 85% or more. However, the second infrared light reflected by the first dichroic mirror 22 is guided to the temperature measurement optical system 40 and used as temperature measurement light. For this reason, the wavelength range of the light reflected by the first dichroic mirror 22 may be any wavelength range that can be used as temperature measurement light. It is not necessary to reflect light in the wavelength range. In other words, the wavelength range that is substantially reflected by the first dichroic mirror 22 should be within the range of 8 μm to 14 μm, preferably at least 10 μm.

The soldered portion P1 is heated by the irradiation of the first laser beam L1 and the second laser beam L2, and when it reaches a high temperature, it emits the second infrared light having a longer wavelength than the first infrared wavelength region. Although not shown, this second infrared light enters the irradiation head 4 from the irradiation port 5 in the same manner as the visible light L3 and the non-blue visible light L4 described with reference to FIG. 22 and enters the radiation temperature sensor 43 via the condensing lens 41 and the like (see FIGS. 6 and 7). Thus, it is possible to measure the soldering temperature using the second infrared light incident on the radiation temperature sensor 43 .

[Modification]
<1>
In the first embodiment described above with reference to FIGS. 1, 5 and 6, the first dichroic mirror 22 transmits the first laser beam L1 and the second laser beam L2 incident from the optical fiber 3, The non-blue visible light L4 contained in the visible light L3 originating from the ambient light incident from the mouth 5 is to be reflected. However, these transmission and reflection may be reversed.

FIG. 8 is a schematic diagram showing a configuration of a modification of the solder processing laser device 1 following FIG. 1, and is a diagram showing a cross section of the irradiation head. As shown in FIG. 8, the first laser beam L1 and the second laser beam L2 incident on the irradiation head 4 from the optical fiber 3 are guided to the irradiation port 5 using the reflecting mirror 24 and the first dichroic mirror 22. can also In this case, in the first dichroic mirror 22, transmission and reflection in the first dichroic mirror 22 of the first embodiment are reversed. That is, the first dichroic mirror 22 of this modified example has the first infrared light belonging to the first infrared wavelength range including the same wavelength as the first laser light L1 and the blue wavelength range including the same wavelength as the second laser light L2. and transmits non-blue visible light belonging to a wavelength band having a longer wavelength than the blue light and a shorter wavelength than the first infrared light. On the other hand, the second dichroic mirror 31 of this modified example reflects the first infrared light and the blue light and transmits the non-blue visible light, like the second dichroic mirror 31 of the first embodiment. and is arranged between the imaging device 33 and the first dichroic mirror 22 .

Although the detailed description is omitted, the light transmitted and the light reflected by the first dichroic mirror 22 may be reversed in the second embodiment by arranging the optical system in the same manner as in FIG. do not have. That is, the first dichroic mirror 22 reflects the first laser beam L1 and the second laser beam L2 incident from the optical fiber 3, while the first dichroic mirror 22 reflects the first laser beam L1 and the second laser beam L2 incident from the irradiation port 5, which is derived from the radiation light from the object to be heated. It may be one that transmits two infrared rays.

<2>
The solder processing laser device 1 may include both the imaging optical system 30 and the temperature measuring optical system 40 . FIG. 9 is a schematic diagram showing the configuration of another modification of the soldering laser device 1 following FIG. 1, and is a cross-sectional view of the irradiation head. In this case, temperature measurement optical system 40 includes third dichroic mirror 44 . The third dichroic mirror 44 emits first infrared light belonging to a first infrared wavelength band including the same wavelength as the first laser beam L1, blue light belonging to a blue wavelength band including the same wavelength as the second laser beam L2, and the Transmits non-blue visible light belonging to a wavelength band longer than blue light and shorter than the first infrared light, and belongs to a second infrared wavelength band longer than the first infrared light It is composed of a material that reflects the second infrared light. Thus, according to this modification, it is possible to observe the soldered portion P1 and measure the soldering temperature during soldering.

In FIG. 9, the imaging optical system 30 and the temperature measuring optical system 40 are shown so as to sandwich the irradiation optical system 20 from the same direction, but this is for convenience of illustration only. However, it is not limited to such an arrangement. For example, when the irradiation optical system 20 is used as a reference, the imaging optical system 30 and the temperature measurement optical system 40 may be arranged at positions rotated by 90 degrees from each other.

<3>
In the above description, the solder processing laser device 1 is described as having the imaging optical system 30 and the temperature measuring optical system 40 inside the irradiation head 4 . The imaging optical system 30 is employed for the purpose of observing the soldered portion P1, and the temperature measuring optical system 40 is employed for the purpose of measuring the soldering temperature. However, if such observation and measurement are not required, the soldering laser apparatus 1 does not necessarily need to include the imaging optical system 30 and the temperature measuring optical system 40 . In this case, the first dichroic mirror 22 included in the irradiation optical system 20 is also unnecessary. Such a case includes, for example, a case where setting of laser light irradiation conditions and laser light irradiation locations during soldering is automated by a program or the like.

<4>
In the above description, the light source module 2 has 14 first laser elements 11 and 4 second laser elements 12 mounted therein. The number and ratio are selected according to the output required for soldering the soldering portion P1, and are not limited to the above number and ratio.

<5>
Furthermore, in the above description, the number of rows of the first laser elements 11 in the light source module 2 is two, and the number of rows of the second laser elements 12 is one. The number of rows of the laser elements 12 is selected according to the output required for soldering the soldering portion P1, and is not limited to the above number of rows. Further, as described above, by making the number of rows of the first laser elements 11 larger than the number of rows of the second laser elements 12, the spot diameter of the second laser beam L2 irradiated from the irradiation port 5 is can be made smaller than the spot diameter of the first laser beam L1. However, if such control is not necessary, the number of rows of the first laser elements 11 may be equal to the number of rows of the second laser elements 12, or the number of rows of the second laser elements 12 may be greater. good too. Such a case includes, for example, a case where the substrate resist applied to the printed circuit board to be soldered has a low absorptance of blue light, and the printed circuit board is unlikely to deteriorate due to irradiation with blue light.

<6>
A similar argument can be made for the spot diameters of the second laser beam L2 and the first laser beam L1 on the irradiated surface. In the above description, the spot diameter of the second laser beam L2 on the irradiation surface is smaller than the spot diameter of the first laser beam L1. , the spot diameter of the second laser beam L2 may be larger than the spot diameter of the first laser beam L1, or both spot diameters may be equal.

<7>
Further, in the above description, the optical path length of the first laser light L1 from the first laser element 11 to the optical fiber 3 in the light source module 2 is equal to that of the second laser light L2 from the second laser element 12 to the optical fiber 3. It has been described as being shorter than the optical path length. However, if the number of components of the condensing optical system 13 in the light source module 2 and the size of the light source module 2 are not considered, the configuration is not limited to the above. The optical path length of the light L<b>1 may be longer than the optical path length of the second laser light L<b>2 from the second laser element 12 to the optical fiber 3 .

REFERENCE SIGNS LIST 1: Laser device for soldering 2: Light source module 3: Optical fiber 4: Irradiation head 5: Irradiation port 11: First laser element 12: Second laser element 13: Condensing optical system 14: Condensing lens 15: Collimator lens 16: Plano-concave lens 17: Dichroic mirror 18, 18a, 18b, 18c: Reflecting mirror 19: Reflecting mirror 20: Irradiation optical system 21: Collimator lens 22: First dichroic mirror 23: Collecting lens 24: Reflecting mirror 30: Imaging optics System 31: Second dichroic mirror 32: Condensing lens 33: Imaging element 34: Reflecting mirror 40: Temperature measurement optical system 41: Condensing lens 42: Reflecting mirror 43: Radiation temperature sensor 44: Third dichroic mirror 50: Printed circuit board 51: Terminal 52: Lead 53: Electronic component 54: Linear solder 54a: Molten solder 55: Irradiation head 56: Solder supply unit L1: First laser beam L2: Second laser beam L3: Visible light L4: Non-blue visible light P1, P10: soldered parts

Claims (9)

a plurality of first laser elements that emit first laser light in an infrared wavelength range;
a plurality of second laser elements that emit second laser light in the blue wavelength range;
a condensing optical system capable of receiving both the first laser beam and the second laser beam;
a light source module equipped with the first laser element, the second laser element, and the condensing optical system;
an optical fiber connected to the light source module and capable of receiving both the first laser beam and the second laser beam that have passed through the condensing optical system;
an irradiation head capable of receiving the first laser beam and the second laser beam propagated through the optical fiber;
an irradiation optical system that is housed inside the irradiation head and guides the first laser beam and the second laser beam;
and an irradiation port for irradiating the first laser beam and the second laser beam guided through the irradiation optical system toward a solder processing portion located outside the irradiation head. A laser device for soldering. 2. The solder processing laser device according to claim 1, wherein the spot diameter of said second laser beam is smaller than the spot diameter of said first laser beam on the irradiated surface. In the light source module, the number of rows of the first laser elements is larger than the number of rows of the second laser elements when the direction in which the laser elements of the same wavelength range are arranged is defined as rows. Item 2. A laser device for soldering according to item 1. The optical path length of the first laser light from the first laser element to the optical fiber is shorter than the optical path length of the second laser light from the second laser element to the optical fiber. Item 2. A laser device for soldering according to item 1. further comprising an imaging optical system arranged in the irradiation head and branched and communicated with the irradiation optical system;
The irradiation optical system comprises a first infrared light belonging to a wavelength band including the same wavelength as the first laser light, a blue light belonging to a wavelength band including the same wavelength as the second laser light, and a wavelength longer than the blue light. A first wavelength separation optical system that selectively separates non-blue visible light belonging to a wavelength band having a wavelength and a wavelength shorter than that of the first infrared light,
The imaging optical system includes an imaging element at a position subsequent to the first wavelength separation optical system on the optical path,
Both the first laser light and the second laser light incident from the optical fiber are guided to the irradiation port when incident on the first wavelength separation optical system,
wherein the non-blue visible light included in the visible light incident from the irradiation port is guided to the imaging element in the imaging optical system when incident on the first wavelength separating optical system; 5. The laser device for soldering according to any one of items 1 to 4. 6. The soldering process according to claim 5, wherein the first wavelength separation optical system is a dichroic mirror that transmits the first infrared light and the blue light and reflects the non-blue visible light. laser device. The imaging optical system selectively separates the first infrared light, the blue light, and the non-blue visible light at a position on an optical path between the first wavelength separation optical system and the imaging element. having a second wavelength separation optical system for
6. The soldering laser device according to claim 5, wherein the non-blue visible light that has passed through the second wavelength separation optical system is guided to the imaging device. further comprising a temperature measurement optical system arranged in the irradiation head and branched and communicated with the irradiation optical system;
The irradiation optical system comprises first infrared light belonging to a wavelength band containing the same wavelength as the first laser light, blue light belonging to a wavelength band containing the same wavelength as the second laser light, and the first infrared light including a first wavelength separation optical system that selectively separates the second infrared light belonging to a wavelength band longer than the
The temperature measurement optical system includes a radiation temperature sensor at a position subsequent to the first wavelength separation optical system on the optical path,
Both the first laser light and the second laser light incident from the optical fiber are guided to the irradiation port when incident on the first wavelength separation optical system,
The second infrared light emitted from the soldered portion that is incident from the irradiation port is guided to the radiation temperature sensor in the temperature measurement optical system when the second infrared light is incident on the first wavelength separation optical system. A laser device for soldering according to any one of claims 1 to 4, characterized in that. The irradiation head has an external shape in which, when the irradiation port side is viewed from the portion where the optical fiber is connected, the width in the vicinity of the irradiation port narrows as the irradiation port is approached. A laser device for soldering according to any one of claims 1 to 4, characterized in that.

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