JP2023112242A - Semi-aromatic polyamide resin composition and molding including the same - Google Patents
Semi-aromatic polyamide resin composition and molding including the same Download PDFInfo
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- 229920006012 semi-aromatic polyamide Polymers 0.000 title claims abstract description 24
- 239000011342 resin composition Substances 0.000 title claims abstract description 23
- 238000000465 moulding Methods 0.000 title description 11
- -1 aliphatic diamine Chemical class 0.000 claims abstract description 35
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 20
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 14
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 14
- 125000003118 aryl group Chemical group 0.000 claims abstract description 14
- 239000004698 Polyethylene Substances 0.000 claims description 13
- 229920000573 polyethylene Polymers 0.000 claims description 13
- 229920013716 polyethylene resin Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- 229920002292 Nylon 6 Polymers 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 abstract description 21
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- 238000005453 pelletization Methods 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920006119 nylon 10T Polymers 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- WLQXEFXDBYHMRG-UPHRSURJSA-N (z)-4-(oxiran-2-ylmethoxy)-4-oxobut-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OCC1CO1 WLQXEFXDBYHMRG-UPHRSURJSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XDRAKJQFCQVBMP-UHFFFAOYSA-N 2-but-2-enyl-3-methylbutanedioic acid Chemical compound CC=CCC(C(O)=O)C(C)C(O)=O XDRAKJQFCQVBMP-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000004209 oxidized polyethylene wax Substances 0.000 description 1
- 235000013873 oxidized polyethylene wax Nutrition 0.000 description 1
- TXRPLFBVYIKTSU-UHFFFAOYSA-N pentadecane-1,15-diamine Chemical compound NCCCCCCCCCCCCCCCN TXRPLFBVYIKTSU-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- MSVPBWBOFXVAJF-UHFFFAOYSA-N tetradecane-1,14-diamine Chemical compound NCCCCCCCCCCCCCCN MSVPBWBOFXVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- BPSKTAWBYDTMAN-UHFFFAOYSA-N tridecane-1,13-diamine Chemical compound NCCCCCCCCCCCCCN BPSKTAWBYDTMAN-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Abstract
Description
本発明は、低摩耗性および押出加工性に優れる半芳香族ポリアミド樹脂組成物およびそれを用いた成形品に関する。 TECHNICAL FIELD The present invention relates to a semi-aromatic polyamide resin composition having excellent low abrasion properties and extrusion processability, and a molded article using the same.
近年、自動車や電気・電子機器におけるギヤ・軸受等の摺動部材として半芳香族ポリアミドが使用されている。その中でも各種ギヤや軸受けのような摺動部材用途では、継続的または断続的な摩擦力に曝されることから、相手材と摺動した際の低摩耗性が必要となる。近年では高温、高荷重といった過酷な環境下でも高寿命化を実現する部材が求められており、従来よりも高度な低摩耗性が必要となってきている。 In recent years, semi-aromatic polyamides have been used as sliding members such as gears and bearings in automobiles and electrical/electronic equipment. Among them, sliding member applications such as various gears and bearings are exposed to continuous or intermittent frictional force, and therefore require low wear properties when sliding against mating members. In recent years, there has been a demand for components that can achieve a long life even in harsh environments such as high temperatures and high loads, and a higher degree of wear resistance than ever before is required.
摺動性を有する半芳香族ポリアミド樹脂組成物としては、例えば、特許文献1にはポリアミド10T(テレフタル酸および1,10-デカンジアミンからなるポリアミド)に摺動性付与材を含有させた樹脂組成物が開示されているが、高荷重といった過酷な環境下の低摩耗性が不十分である。特許文献2にはMXD6(アジピン酸およびメタキシレンジアミンからなるポリアミド)に摺動性付与材および脂肪族ポリアミドを含有させた樹脂組成物が開示されているが、低摩耗性が不十分である。 As a semi-aromatic polyamide resin composition having slidability, for example, Patent Document 1 discloses a resin composition in which polyamide 10T (a polyamide composed of terephthalic acid and 1,10-decanediamine) is incorporated with a slidability imparting agent. However, low wear properties under severe environments such as high loads are insufficient. Patent Document 2 discloses a resin composition containing MXD6 (polyamide composed of adipic acid and meta-xylenediamine) containing a slidability imparting material and an aliphatic polyamide, but the low wear property is insufficient.
本発明の目的は、低摩耗性および押出加工性に優れる半芳香族ポリアミド樹脂組成物およびそれを用いた成形品を提供することにある。 An object of the present invention is to provide a semi-aromatic polyamide resin composition which is excellent in low wear and extrusion processability, and a molded article using the same.
本発明者らは上述の課題を解決するべく鋭意検討を重ねた結果、テレフタル酸を主成分とする芳香族ジカルボン酸成分およびデカンジアミンを主成分とする脂肪族ジアミン成分からなる半芳香族ポリアミド、脂肪族ポリアミドおよびポリエチレン系摺動性付与材を特定の割合で配合することにより、上記目的を達成することを見出し本発明に至った。 As a result of intensive studies by the present inventors to solve the above-mentioned problems, a semi-aromatic polyamide composed of an aromatic dicarboxylic acid component mainly composed of terephthalic acid and an aliphatic diamine component mainly composed of decanediamine, The present inventors have found that the above object can be achieved by blending an aliphatic polyamide and a polyethylene-based slidability imparting material in a specific ratio, and have completed the present invention.
すなわち、上記課題は、(A)テレフタル酸を主成分とする芳香族ジカルボン酸成分およびデカンジアミンを主成分とする脂肪族ジアミン成分からなる半芳香族ポリアミド(A成分)100重量部に対して、(B)脂肪族ポリアミド(B成分)を0.1重量部以上3重量部未満および(C)ポリエチレン系摺動性付与材(C成分)を1~20重量部含むことを特徴とする半芳香族ポリアミド樹脂組成物により達成される。 That is, the above-mentioned problem is to solve the following problems with respect to 100 parts by weight of a semi-aromatic polyamide (component A) composed of (A) an aromatic dicarboxylic acid component containing terephthalic acid as a main component and an aliphatic diamine component containing decanediamine as a main component, (B) 0.1 parts by weight or more and less than 3 parts by weight of an aliphatic polyamide (component B) and (C) 1 to 20 parts by weight of a polyethylene-based slidability imparting material (component C). This is achieved by a group polyamide resin composition.
以下、本発明の詳細について説明する。 The details of the present invention will be described below.
(A成分:半芳香族ポリアミド)
本発明のA成分は、芳香族ジカルボン酸成分と脂肪族ジアミン成分とを構成成分として含有し、芳香族ジカルボン酸成分はテレフタル酸を主成分とし、脂肪族ジアミン成分はデカンジアミンを主成分とするものである。テレフタル酸の含有量は、耐熱性の観点から、芳香族ジカルボン酸成分中、80モル%以上であることが好ましく、100モル%であることがより好ましい。デカンジアミンの含有量は、機械的特性の向上の観点から、脂肪族ジアミン成分中、80モル%以上であることが好ましく、100モル%であることがより好ましい。A成分の具体例としては、PA10Tが挙げられる。
(A component: semi-aromatic polyamide)
The A component of the present invention contains an aromatic dicarboxylic acid component and an aliphatic diamine component as constituent components, the aromatic dicarboxylic acid component is mainly composed of terephthalic acid, and the aliphatic diamine component is mainly composed of decanediamine. It is. From the viewpoint of heat resistance, the content of terephthalic acid is preferably 80 mol % or more, more preferably 100 mol %, in the aromatic dicarboxylic acid component. From the viewpoint of improving mechanical properties, the content of decanediamine is preferably 80 mol % or more, more preferably 100 mol %, in the aliphatic diamine component. A specific example of the A component is PA10T.
芳香族ジカルボン酸成分は、テレフタル酸以外の芳香族ジカルボン酸を含有してもよい。テレフタル酸以外の芳香族ジカルボン酸としては、フタル酸、イソフタル酸、ナフタレンジカルボン酸等が挙げられる。テレフタル酸以外の芳香族ジカルボン酸は、原料モノマーの総モル数に対し、20モル%以下とすることが好ましく、実質的に含まないことがより好ましい。 The aromatic dicarboxylic acid component may contain aromatic dicarboxylic acids other than terephthalic acid. Examples of aromatic dicarboxylic acids other than terephthalic acid include phthalic acid, isophthalic acid, and naphthalenedicarboxylic acid. Aromatic dicarboxylic acids other than terephthalic acid are preferably contained in an amount of 20 mol% or less, more preferably substantially absent, relative to the total number of moles of the raw material monomers.
脂肪族ジアミン成分は、デカンジアミン以外の他の脂肪族ジアミンを含有してもよい。他の脂肪族ジアミンとしては、例えば、1,2-エタンジアミン、1,3-プロパンジアミン、1,4-ブタンジアミン、1,5-ペンタンジアミン、1,6-ヘキサンジアミン、1,7-ヘプタンジアミン、1,8-オクタンジアミン、1,9-ノナンジアミン、1,11-ウンデカンジアミン、1,12-ドデカンジアミン、1,13-トリデカンジアミン、1,14-テトラデカンジアミン、1,15-ペンタデカンジアミン等が挙げられる。デカンジアミン成分以外の脂肪族ジアミンは、原料モノマーの総モル数に対し、20モル%以下とすることが好ましく、実質的に含まないことがより好ましい。 The aliphatic diamine component may contain other aliphatic diamines than decanediamine. Other aliphatic diamines include, for example, 1,2-ethanediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptane Diamine, 1,8-octanediamine, 1,9-nonanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 1,13-tridecanediamine, 1,14-tetradecanediamine, 1,15-pentadecanediamine etc. Aliphatic diamines other than the decanediamine component are preferably contained in an amount of 20 mol % or less, more preferably substantially absent, relative to the total number of moles of the raw material monomers.
本発明におけるA成分は、300℃より高い融点を有することが好ましく、それにより耐熱性をより向上させることができる場合がある。融点を複数有する場合や、2種以上の半芳香族ポリアミドを用いる場合には、300℃以下の融点を有してもよい。 The A component in the present invention preferably has a melting point higher than 300°C, which may improve the heat resistance. When it has multiple melting points, or when two or more semi-aromatic polyamides are used, it may have a melting point of 300° C. or lower.
ここで、本発明におけるA成分の融点とは、半芳香族ポリアミドのペレットを約10mg採取して、示差走査熱量計を用いて、窒素雰囲気下で、溶融状態から20℃/分の降温速度で20℃まで降温して5分間保持した後、20℃/分の昇温速度で昇温した際に現れる吸熱ピークの温度を指す。但し、吸熱ピークが2つ以上検出される場合には、最も温度の高いピークを融点とする。 Here, the melting point of component A in the present invention means that approximately 10 mg of semi-aromatic polyamide pellets are sampled and measured using a differential scanning calorimeter under a nitrogen atmosphere at a rate of 20° C./min from the molten state. It refers to the temperature of the endothermic peak that appears when the temperature is lowered to 20°C and held for 5 minutes, and then the temperature is raised at a rate of 20°C/min. However, when two or more endothermic peaks are detected, the peak with the highest temperature is taken as the melting point.
A成分は、従来から知られている加熱重合法や溶液重合法の方法を用いて製造することができる。工業的に有利である点から、加熱重合法が好ましく用いられる。加熱重合法としては、芳香族ジカルボン酸成分と脂肪族ジアミン成分とから反応生成物を得る工程(i)と、得られた反応生成物を重合する工程(ii)とからなる方法が挙げられる。 The A component can be produced using a conventionally known thermal polymerization method or solution polymerization method. A heat polymerization method is preferably used because it is industrially advantageous. Examples of the heat polymerization method include a method comprising step (i) of obtaining a reaction product from an aromatic dicarboxylic acid component and an aliphatic diamine component, and step (ii) of polymerizing the obtained reaction product.
工程(i)としては、例えば、芳香族ジカルボン酸粉末とモノカルボン酸とを混合し、予め脂肪族ジアミンの融点以上、かつ芳香族ジカルボン酸の融点以下の温度に加熱し、この温度の芳香族ジカルボン酸粉末とモノカルボン酸とに、芳香族ジカルボン酸の粉末の状態を保つように、実質的に水を含有させずに、脂肪族ジアミンを添加する方法が挙げられる。あるいは、別の方法としては、溶融状態の脂肪族ジアミンと固体の芳香族ジカルボン酸とからなる懸濁液を攪拌混合し、混合液を得た後、最終的に生成する半芳香族ポリアミドの融点未満の温度で、芳香族ジカルボン酸と脂肪族ジアミンとモノカルボン酸の反応による塩の生成反応と、生成した塩の重合による低重合物の生成反応とをおこない、塩および低重合物の混合物を得る方法が挙げられる。この場合、反応をさせながら破砕をおこなってもよいし、反応後に一旦取り出してから破砕をおこなってもよい。工程(i)としては、反応生成物の形状の制御が容易な前者の方が好ましい。 As the step (i), for example, an aromatic dicarboxylic acid powder and a monocarboxylic acid are mixed, heated in advance to a temperature higher than the melting point of the aliphatic diamine and lower than the melting point of the aromatic dicarboxylic acid, and A method of adding an aliphatic diamine to a dicarboxylic acid powder and a monocarboxylic acid without substantially containing water so as to maintain the state of the aromatic dicarboxylic acid powder can be mentioned. Alternatively, as another method, a suspension consisting of a molten aliphatic diamine and a solid aromatic dicarboxylic acid is stirred and mixed to obtain a mixed liquid, and then the melting point of the finally produced semi-aromatic polyamide At a temperature of less than 100°C, a reaction of aromatic dicarboxylic acid, an aliphatic diamine and a monocarboxylic acid to form a salt and a reaction of polymerizing the produced salt to form a low polymer are performed to form a mixture of the salt and the low polymer. method to obtain. In this case, the crushing may be performed while reacting, or the crushing may be performed after taking out once after the reaction. As the step (i), the former is preferable because the shape of the reaction product can be easily controlled.
工程(ii)としては、例えば、工程(i)で得られた反応生成物を、最終的に生成する半芳香族ポリアミドの融点未満の温度で固相重合し、所定の分子量まで高分子量化させ、半芳香族ポリアミドを得る方法が挙げられる。固相重合は、重合温度180~270℃、反応時間0.5~10時間で、窒素等の不活性ガス気流中でおこなうことが好ましい。 In step (ii), for example, the reaction product obtained in step (i) is solid-phase polymerized at a temperature below the melting point of the semi-aromatic polyamide to be finally produced to increase the molecular weight to a predetermined molecular weight. , to obtain semi-aromatic polyamides. Solid state polymerization is preferably carried out at a polymerization temperature of 180 to 270° C. for a reaction time of 0.5 to 10 hours in an inert gas stream such as nitrogen.
工程(i)および工程(ii)の反応装置としては、特に限定されず、公知の装置を用いればよい。工程(i)と工程(ii)を同じ装置で実施してもよいし、異なる装置で実施してもよい。 The reaction apparatus for steps (i) and (ii) is not particularly limited, and a known apparatus may be used. Step (i) and step (ii) may be performed in the same device or in different devices.
A成分の製造において、重合の効率を高めるため重合触媒を用いてもよい。重合触媒としては、例えば、リン酸、亜リン酸、次亜リン酸またはそれらの塩が挙げられる。重合触媒の添加量は、通常、半芳香族ポリアミドを構成する全モノマーに対して、2モル%以下で用いることが好ましい。 In the production of component A, a polymerization catalyst may be used to increase the efficiency of polymerization. Polymerization catalysts include, for example, phosphoric acid, phosphorous acid, hypophosphorous acid, or salts thereof. The addition amount of the polymerization catalyst is usually preferably 2 mol % or less with respect to the total monomers constituting the semi-aromatic polyamide.
(B成分:脂肪族ポリアミド)
本発明でB成分として用いられる脂肪族ポリアミドとしては、ポリε-カプラミド(PA6)、ポリテトラメチレンアジパミド(PA46)、ポリヘキサメチレンアジパミド(PA66)、ポリヘキサメチレンセバカミド(PA610)、ポリヘキサメチレンドデカミド(PA612)、ポリウンデカメチレンアジパミド(PA116)、ポリウンデカナミド(PA11)、ポリドデカナミド(PA12)およびこれらのうち少なくとも2種類の異なったポリアミド成分を含むポリアミド共重合体、あるいは、これらの混合物などがあげられる。中でも構成単位の炭素数が6以下であるポリアミドが好ましく、PA6(ナイロン6)、PA66(ナイロン66)が、経済性の観点から好ましい。脂肪族ポリアミドを用いることで、成形品の低摩耗性を向上させることができる。
(B component: aliphatic polyamide)
Aliphatic polyamides used as component B in the present invention include poly ε-capramide (PA6), polytetramethylene adipamide (PA46), polyhexamethylene adipamide (PA66), polyhexamethylene sebacamide (PA610 ), polyhexamethylenedodecanamide (PA612), polyundecamethyleneadipamide (PA116), polyundecanamide (PA11), polydodecanamide (PA12) and polyamide copolyamides containing at least two different polyamide components of these. Polymers, mixtures thereof, and the like are mentioned. Among them, polyamides having 6 or less carbon atoms in the structural unit are preferred, and PA6 (nylon 6) and PA66 (nylon 66) are preferred from the viewpoint of economy. By using an aliphatic polyamide, it is possible to improve the wear resistance of the molded product.
脂肪族ポリアミドの相対粘度は、特に限定されず、目的に応じて適宜設定すればよい。例えば、成形加工が容易な樹脂組成物を得るには、脂肪族ポリアミドは、相対粘度が1.9~4.0であることが好ましく、2.0~3.5であることがより好ましい。脂肪族ポリアミドの相対粘度が1.9未満であると、成形品によっては靱性が不足し、機械的特性の低下を招く場合がある。また、脂肪族ポリアミドの相対粘度が4.0を超えると、樹脂組成物は、成形加工が困難となり、得られる成形品は、外観が劣る場合がある。 The relative viscosity of the aliphatic polyamide is not particularly limited, and may be appropriately set according to the purpose. For example, in order to obtain a resin composition that is easy to mold, the aliphatic polyamide preferably has a relative viscosity of 1.9 to 4.0, more preferably 2.0 to 3.5. If the relative viscosity of the aliphatic polyamide is less than 1.9, the toughness of some molded articles may be insufficient, resulting in deterioration of mechanical properties. On the other hand, when the relative viscosity of the aliphatic polyamide exceeds 4.0, the resin composition may be difficult to mold, and the resulting molded article may have poor appearance.
B成分の含有量は、A成分100重量部に対して、0.1重量部以上3重量部未満であり、好ましくは0.3~2.5重量部、より好ましくは0.5~2重量部である。含有量が0.1重量部未満の場合および3重量部以上の場合、摺動時の摩耗量が増加する。 The content of component B is 0.1 parts by weight or more and less than 3 parts by weight, preferably 0.3 to 2.5 parts by weight, more preferably 0.5 to 2 parts by weight, relative to 100 parts by weight of component A. Department. If the content is less than 0.1 parts by weight or more than 3 parts by weight, the amount of wear during sliding increases.
(C成分:ポリエチレン系摺動性付与材)
本発明でC成分として用いられるポリエチレン系摺動性付与材としては、それ自体公知のものを用いることができる。ポリエチレン系摺動性付与材を用いることで、成形品の低摩耗性を向上させることができる。ポリエチレン系摺動性付与材を製造する際の出発物質として使用されるポリエチレンとしては、例えば粘度平均分子量が数万以上の高密度ポリエチレン、低密度ポリエチレン、超高分子量ポリエチレンや粘度平均分子量が数万以下のポリエチレンワックスおよびこれらの1種もしくは2種以上の混合物が例示される。ポリエチレンを変性する方法としては、従来公知の種々の方法が採用でき、例えば上記ポリエチレンを140~180℃の溶融状態で空気を導入することで酸化反応による官能基導入を行う方法や、上記ポリエチレンを溶媒に懸濁させ、あるいは溶解させて、通常、80~200℃の温度で、変性用単量体とラジカル重合開始剤等を添加混合してグラフト共重合させる方法、あるいは融点以上、例えば、180~300℃の温度で溶融混練下に変性用単量体とラジカル重合開始剤とを接触させる方法などが挙げられる。変性用単量体としては、例えばアクリル酸、メタクリル酸、マレイン酸、フマル酸、イタコン酸、シトラコン酸、クロトン酸、ナジック酸(エンドシス-ビシクロ〔2,2〕ヘプト-5-エン-2,3-ジカルボン酸)等が挙げられ、またその誘導体としては、酸ハライド、エステル、アミド、イミド、無水物等が挙げられ、例えば、塩化マレニル、マレイミド、アクリル酸アミド、メタクリル酸アミド、グリシジルメタクリレート、無水マレイン酸、無水シトラコン酸、マレイン酸モノメチル、マレイン酸ジメチル、グリシジルマレエート等が挙げられる。この中でもマレイン酸、無水マレイン酸またはこれらの混合物で変性された変性ポリエチレン樹脂が好ましく、無水マレイン酸で変性された変性ポリエチレン樹脂が特に好ましい。これらの好ましい変性ポリエチレン樹脂を用いることで、成形品の低摩耗性をより向上できる場合がある。
(Component C: polyethylene-based slidability imparting material)
As the polyethylene-based slidability imparting material used as the C component in the present invention, those known per se can be used. By using the polyethylene-based slidability-imparting material, it is possible to improve the wear resistance of the molded product. Examples of polyethylene used as a starting material for producing a polyethylene-based slidability imparting material include high-density polyethylene, low-density polyethylene, ultra-high molecular weight polyethylene, and viscosity-average molecular weight of tens of thousands or more. The following polyethylene waxes and mixtures of one or more thereof are exemplified. As a method for modifying polyethylene, various conventionally known methods can be employed, for example, a method of introducing a functional group by oxidation reaction by introducing air into the polyethylene in a molten state of 140 to 180 ° C., and a method of introducing a functional group by an oxidation reaction. Suspending or dissolving in a solvent, usually at a temperature of 80 to 200 ° C., adding and mixing a modifying monomer and a radical polymerization initiator etc. for graft copolymerization, or melting point or higher, for example, 180 A method of contacting a modifying monomer and a radical polymerization initiator under melt-kneading at a temperature of up to 300° C. may be mentioned. Examples of modifying monomers include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, crotonic acid, nadic acid (endocis-bicyclo[2,2]hept-5-ene-2,3 -dicarboxylic acid), etc., and its derivatives include acid halides, esters, amides, imides, anhydrides, etc., for example, malenyl chloride, maleimide, acrylic acid amide, methacrylic acid amide, glycidyl methacrylate, anhydrous Maleic acid, citraconic anhydride, monomethyl maleate, dimethyl maleate, glycidyl maleate and the like. Among these, modified polyethylene resins modified with maleic acid, maleic anhydride or a mixture thereof are preferred, and modified polyethylene resins modified with maleic anhydride are particularly preferred. By using these preferred modified polyethylene resins, it may be possible to further improve the abrasion resistance of molded articles.
C成分の粘度平均分子量(Mv)の好ましい範囲としては100,000~1,000,000であり、さらに好ましくは200,000~900,000であり、特に好ましくは300,000~800,000である。この範囲のポリエチレン樹脂を用いることで、成形品の低摩耗性をより向上できる場合がある。C成分の粘度平均分子量は、135℃のデカリン酸溶媒中で測定される極限粘度[η]を用いて下記一般式(1)より求められる。
Mv=5.37×104[η]1.37 ・・・(1)
C成分の含有量は、A成分100重量部に対して、1~20重量部であり、好ましくは3~18重量部、より好ましくは5~15重量部である。含有量が1重量部未満の場合、摺動時の摩耗量が増加する。20重量部を超える場合、押出加工性が低下する。
The preferred range of viscosity average molecular weight (Mv) of component C is 100,000 to 1,000,000, more preferably 200,000 to 900,000, and particularly preferably 300,000 to 800,000. be. By using a polyethylene resin within this range, it may be possible to further improve the abrasion resistance of the molded product. The viscosity-average molecular weight of component C is obtained from the following general formula (1) using the intrinsic viscosity [η] measured in a decalinic acid solvent at 135°C.
Mv=5.37×10 4 [η] 1.37 (1)
The content of component C is 1 to 20 parts by weight, preferably 3 to 18 parts by weight, more preferably 5 to 15 parts by weight, per 100 parts by weight of component A. If the content is less than 1 part by weight, the amount of wear during sliding increases. If it exceeds 20 parts by weight, the extrusion workability will be deteriorated.
(その他の添加剤について)
また、本発明の樹脂組成物には、本発明の趣旨に反しない範囲で、他の熱可塑性樹脂を配合し、必要に応じて酸化防止剤、衝撃改質剤、可塑剤、有機、無機充填剤、難燃剤、色材、光安定剤、熱安定剤、帯電防止剤、ブロッキング防止剤、C成分を除く滑材、分散剤、流動改質剤、結晶核剤等の各添加材を含むことが出来る。
(About other additives)
In addition, the resin composition of the present invention may be blended with other thermoplastic resins within the scope of the present invention, and if necessary, antioxidants, impact modifiers, plasticizers, organic or inorganic fillers. Additives such as additives, flame retardants, colorants, light stabilizers, heat stabilizers, antistatic agents, antiblocking agents, lubricants other than component C, dispersants, flow modifiers, crystal nucleating agents, etc. can be done.
(樹脂組成物の製造)
本発明の樹脂組成物を製造するには、任意の方法が採用される。例えば各成分、並びに任意に他の成分を予備混合し、その後溶融混練し、ペレット化する方法を挙げることができる。予備混合の手段としては、ナウターミキサー、V型ブレンダー、ヘンシェルミキサー、メカノケミカル装置、押出混合機などを挙げることができる。予備混合においては場合により押出造粒器やブリケッティングマシーンなどにより造粒を行うこともできる。予備混合後、ベント式二軸押出機に代表される溶融混練機で溶融混練、およびペレタイザー等の機器によりペレット化する。溶融混練機としては他にバンバリーミキサー、混練ロール、恒熱撹拌容器などを挙げることができるが、ベント式ニ軸押出機が好ましい。他に、各成分、並びに任意に他の成分を予備混合することなく、それぞれ独立に二軸押出機に代表される溶融混練機に供給する方法も取ることもできる。
(Manufacture of resin composition)
Any method may be employed to produce the resin composition of the present invention. For example, a method of premixing each component and optionally other components, followed by melt-kneading and pelletizing can be mentioned. Means for premixing include a Nauta mixer, a V-type blender, a Henschel mixer, a mechanochemical device, an extrusion mixer, and the like. In the pre-mixing, granulation can be performed by an extrusion granulator, a briquetting machine, or the like. After pre-mixing, the mixture is melt-kneaded by a melt-kneader typified by a vented twin-screw extruder, and pelletized by a device such as a pelletizer. Other examples of the melt-kneader include a Banbury mixer, a kneading roll, a constant temperature stirring vessel and the like, but a vented twin-screw extruder is preferred. Alternatively, each component and, optionally, other components may be supplied independently to a melt-kneader typified by a twin-screw extruder without being premixed.
(成形品について)
上記の如く得られた本発明の樹脂組成物は通常前記の如く製造されたペレットを射出成形、押出成形して各種製品を製造することができる。更にペレットを経由することなく、押出機で溶融混練された樹脂を直接シート、フィルム、異型押出成形品および射出成形品にすることも可能である。射出成形においては、通常の成形方法だけでなく、適宜目的に応じて、射出圧縮成形、射出プレス成形、ガスアシスト射出成形、発泡成形(超臨界流体の注入によるものを含む)、インサート成形、インモールドコーティング成形、断熱金型成形、急速加熱冷却金型成形、二色成形、サンドイッチ成形、および超高速射出成形などの射出成形法を用いて成形品を得ることができる。これら各種成形法の利点は既に広く知られるところである。また成形はコールドランナー方式およびホットランナー方式のいずれも選択することができる。また本発明の樹脂組成物は、押出成形により各種異形押出成形品、シートを成形することも可能である。押出成形においては、丸棒を押出成形しその後円盤状に切削加工することにより成形品を得る方法や、厚肉シートを押出成形しその後所定の形状に打ち抜き加工することにより成形品を得ることができる。
(About molded products)
The resin composition of the present invention obtained as described above can be produced into various products by injection molding or extrusion molding of the pellets produced as described above. Further, it is also possible to directly form a sheet, film, profile extrusion molded product, and injection molded product from the resin melt-kneaded in an extruder without going through pellets. In injection molding, not only ordinary molding methods but also injection compression molding, injection press molding, gas-assisted injection molding, foam molding (including injection of supercritical fluid), insert molding, injection molding, etc. Molded articles can be obtained using injection molding methods such as mold coating molding, adiabatic molding, rapid heat and cool molding, two-color molding, sandwich molding, and ultra-high speed injection molding. The advantages of these various molding methods are already widely known. For molding, either cold runner method or hot runner method can be selected. Moreover, the resin composition of the present invention can also be molded into various shaped extruded products and sheets by extrusion molding. In extrusion molding, a molded product can be obtained by extruding a round bar and then cutting it into a disk shape, or by extruding a thick sheet and then punching it into a predetermined shape. can.
本発明によれば、低摩耗性および押出加工性に優れる半芳香族ポリアミド樹脂組成物およびそれを用いた成形品を提供することができ、本発明の樹脂組成物より得られる成形品は、例えば電気電子、半導体、自動車、産業機械、OA機器および建築分野で用いられる摺動部材に好適に使用することができる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a semi-aromatic polyamide resin composition excellent in low wear and extrusion processability and a molded article using the same. It can be suitably used for sliding members used in electric/electronics, semiconductors, automobiles, industrial machinery, OA equipment and construction fields.
本発明を実施するための形態は、前記の各要件の好ましい範囲を集約したものとなるが、例えば、その代表例を下記の実施例中に記載する。もちろん本発明はこれらの形態に限定されるものではない。 The mode for carrying out the present invention summarizes the preferable range of each of the above requirements, and for example, the representative examples are described in the following examples. Of course, the present invention is not limited to these forms.
以下、実施例により本発明を実施する形態を説明する。なお、諸物性の評価は以下の方法により実施した。 Hereinafter, embodiments for carrying out the present invention will be described with reference to examples. In addition, evaluation of various physical properties was implemented by the following method.
[樹脂組成物の評価]
押出加工性の評価として押出時の安定性を、低摩耗性の評価として比摩耗量をそれぞれ下記の方法で測定した。
(1)押出加工性
押出時の安定性に関して、以下の基準で評価を実施した。
押出時のストランドが安定している。:〇
押出時のストランドが不安定であり、ペレット化が困難である。:×
(2)比摩耗量
下記の方法で得られたペレットを130℃で6時間乾燥した後に射出成形機(東芝機械(株)製 EC130SXII―4Y)によりシリンダー温度330℃、金型温度130℃にてJIS K7218A法に準拠し、外径25.6mm、内径20mm、高さ15mmの中空円筒試験片を得た。該試験片をJIS K7218A法に準拠し、炭素鋼材(S45C)でできた同様の形状の試験片と面圧0.75MPa、滑り速度500mm/s、滑り距離3000mの条件で摩擦摩耗試験機(EFM-3-G、(株)オリエンテック製)を用いて摺動させた。摺動後の試験片の重量減少を電子天秤を用いて0.1mg単位まで秤量し、JIS K7218A法に記載の計算式を用いて比摩耗量を算出した。試験は3回行い、それらの平均値をその組成物の比摩耗量とした。比摩耗量は2.0×10-6mm3/N・m以下であることが必要である。
[Evaluation of Resin Composition]
As evaluation of extrusion processability, stability during extrusion was measured, and as evaluation of low wear property, specific abrasion loss was measured by the following methods.
(1) Extrusion Processability Stability during extrusion was evaluated according to the following criteria.
Strands are stable during extrusion. : O The strand during extrusion is unstable and pelletization is difficult. : ×
(2) Specific wear amount After drying the pellets obtained by the following method at 130 ° C. for 6 hours, using an injection molding machine (EC130SXII-4Y manufactured by Toshiba Machine Co., Ltd.) at a cylinder temperature of 330 ° C. and a mold temperature of 130 ° C. A hollow cylindrical test piece having an outer diameter of 25.6 mm, an inner diameter of 20 mm and a height of 15 mm was obtained according to the JIS K7218A method. According to the JIS K7218A method, the test piece was subjected to a friction and wear tester (EFM) under the conditions of a test piece of the same shape made of carbon steel (S45C) and a surface pressure of 0.75 MPa, a sliding speed of 500 mm / s, and a sliding distance of 3000 m. -3-G, manufactured by Orientec Co., Ltd.). The weight loss of the test piece after sliding was weighed to the nearest 0.1 mg using an electronic balance, and the specific wear amount was calculated using the formula described in JIS K7218A method. The test was conducted three times, and the average value thereof was taken as the specific wear amount of the composition. The specific wear amount must be 2.0×10 −6 mm 3 /N·m or less.
[実施例1-8、比較例1-4]
表1で示した添加量に従って、A成分、B成分およびC成分を第1供給口より別々に二軸押出機に供給した。ここで第1供給口とは根元の供給口のことである。押出は、径30mmΦのベント式二軸押出機((株)日本製鋼所製:TEX30α-31.5BW-3V)を使用し、スクリュー回転数200rpm、吐出量20kg/h、ベントの真空度3kPaにて溶融混錬しペレットを得た。なお、押出温度は330℃にて行った。
[Example 1-8, Comparative Example 1-4]
According to the addition amount shown in Table 1, A component, B component and C component were separately supplied to the twin-screw extruder from the first supply port. Here, the first supply port is the root supply port. Extrusion is performed using a vented twin-screw extruder with a diameter of 30 mmΦ (manufactured by Japan Steel Works, Ltd.: TEX30α-31.5BW-3V), screw rotation speed of 200 rpm, discharge rate of 20 kg / h, vent vacuum degree of 3 kPa. It was melted and kneaded to obtain pellets. The extrusion temperature was 330°C.
(A成分)
A-1:半芳香族ポリアミド:PA10T(ユニチカ(株)製:ゼコットXP500)
(B成分)
B-1:脂肪族ポリアミド:PA6(宇部興産(株)製:UBEナイロン1011FB)
B-2:脂肪族ポリアミド:PA66(宇部興産(株)製:UBEナイロン2015B)
(A component)
A-1: Semi-aromatic polyamide: PA10T (manufactured by Unitika Ltd.: Zecot XP500)
(B component)
B-1: Aliphatic polyamide: PA6 (manufactured by Ube Industries, Ltd.: UBE nylon 1011FB)
B-2: Aliphatic polyamide: PA66 (manufactured by Ube Industries, Ltd.: UBE Nylon 2015B)
(C成分)
C-1:製造例1で得られた無水マレイン酸変性ポリエチレン樹脂
<製造例1>
135℃のデカリン酸溶媒中で測定される極限粘度が31dl/gである超高分子量ポリエチレン(三井化学(株)製 ハイゼックスミリオン630M)15重量%および135℃のデカリン酸溶媒中で測定される極限粘度が2dl/gであるポリエチレン((株)プライムポリマー製ハイゼックス2200J)85重量%からなるポリエチレン樹脂混合物100重量部、無水マレイン酸1重量部および有機過酸化物(日本油脂(株)製パーヘキシン―25B)0.07重量部をナウターミキサーにて混合し、得られた混合物を250℃に設定した一軸押出機(いすず化工機(株)製EXT40m/m押出機)で溶融混練を行いC-1成分を得た。得られた変性ポリエチレン樹脂の135℃のデカリン酸中で測定される極限粘度[η]は5.5dl/gであり、粘度平均分子量Mvは550,000であった。
(C component)
C-1: Maleic anhydride-modified polyethylene resin obtained in Production Example 1 <Production Example 1>
15% by weight of ultra-high molecular weight polyethylene (Hi-Zex Million 630M manufactured by Mitsui Chemicals, Inc.) with an intrinsic viscosity of 31 dl/g measured in a decalic acid solvent at 135°C and a limit measured in a decalic acid solvent at 135°C 100 parts by weight of a polyethylene resin mixture consisting of 85% by weight of polyethylene (Hi-Zex 2200J manufactured by Prime Polymer Co., Ltd.) having a viscosity of 2 dl/g, 1 part by weight of maleic anhydride and an organic peroxide (perhexin manufactured by NOF Corporation) 25B) 0.07 part by weight was mixed with a Nauta mixer, and the resulting mixture was melt-kneaded with a single-screw extruder (EXT 40 m / m extruder manufactured by Isuzu Kakoki Co., Ltd.) set at 250 ° C. C- One component was obtained. The resulting modified polyethylene resin had an intrinsic viscosity [η] measured in decalinic acid at 135°C of 5.5 dl/g and a viscosity average molecular weight Mv of 550,000.
C-2:製造例2で得られたポリエチレン樹脂
<製造例2>
135℃のデカリン酸溶媒中で測定される極限粘度が31dl/gである超高分子量ポリエチレン(三井化学(株)製 ハイゼックスミリオン630M)15重量%および135℃のデカリン酸溶媒中で測定される極限粘度が2dl/gであるポリエチレン((株)プライムポリマー製ハイゼックス2200J)85重量%からなるポリエチレン樹脂混合物100重量部をナウターミキサーにて混合し、得られた混合物を250℃に設定した一軸押出機(いすず化工機(株)製EXT40m/m押出機)で溶融混練を行いC-2成分を得た。得られたポリエチレン樹脂の135℃のデカリン酸中で測定される極限粘度[η]は5.5dl/gであり、粘度平均分子量Mvは550,000であった。
C-3:酸化ポリエチレンワックス:ハイワックス310MP(製品名)(三井化学(株)製、粘度平均分子量約3,000)
C-2: Polyethylene resin obtained in Production Example 2 <Production Example 2>
15% by weight of ultra-high molecular weight polyethylene (Hi-Zex Million 630M manufactured by Mitsui Chemicals, Inc.) with an intrinsic viscosity of 31 dl/g measured in a decalic acid solvent at 135°C and a limit measured in a decalic acid solvent at 135°C 100 parts by weight of a polyethylene resin mixture containing 85% by weight of polyethylene (Hi-Zex 2200J manufactured by Prime Polymer Co., Ltd.) having a viscosity of 2 dl/g was mixed in a Nauta mixer, and the resulting mixture was subjected to uniaxial extrusion at 250°C. (EXT40m/m extruder manufactured by Isuzu Kakoki Co., Ltd.) to obtain a C-2 component. The intrinsic viscosity [η] of the resulting polyethylene resin measured in decalinic acid at 135° C. was 5.5 dl/g, and the viscosity average molecular weight Mv was 550,000.
C-3: Oxidized polyethylene wax: Hi-Wax 310MP (product name) (manufactured by Mitsui Chemicals, Inc., viscosity average molecular weight of about 3,000)
<実施例1~8>
本請求の範囲内にある樹脂組成物であるため、低摩耗性および押出加工性に優れる結果であった。
<Examples 1 to 8>
Since the resin composition is within the scope of the present claims, the result was excellent in low wear and extrusion processability.
<比較例1>
B成分の含有量が下限未満であるため、比摩耗量が大きい結果であった。
<比較例2>
B成分の含有量が上限を上回るため、比摩耗量が大きい結果であった。
<比較例3>
C成分の含有量が下限未満であるため、比摩耗量が大きい結果であった。
<比較例4>
C成分の含有量が上限を上回るため、ペレット化ができなかった。
<Comparative Example 1>
Since the content of the B component was less than the lower limit, the specific wear amount was large.
<Comparative Example 2>
Since the content of the B component exceeded the upper limit, the specific wear amount was large.
<Comparative Example 3>
Since the content of the C component was less than the lower limit, the specific wear amount was large.
<Comparative Example 4>
Pelletization was not possible because the content of component C exceeded the upper limit.
Claims (4)
A molded article made of the semi-aromatic polyamide resin composition according to any one of claims 1 to 3.
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