JP2023109093A - Apparatus for manufacturing mask device, mask and method for manufacturing mask device - Google Patents

Abstract

To provide an apparatus and method for manufacturing a mask device, capable of accurately vapor-depositing a vapor deposition material on a substrate.SOLUTION: An apparatus 40 for manufacturing a mask device includes: a mask 20 having a longitudinal direction and a transverse direction; and a clamping device 50 for holding the mask. The mask includes a pair of mask end parts 30 positioned on both sides in the longitudinal direction D2 and a mask intermediate part positioned between the pair of mask end parts and including a plurality of open holes; the mask end part includes a notch 32 having the notched mask end part and a plurality of grip parts 35 projected in the transverse direction and the longitudinal direction through the notch; the clamping device includes a plurality of clamps 51 holding the corresponding grip part; the size of the grip part in the transverse direction is 10 mm or more; and the ratio of the size of the grip part in the transverse direction to that of the clamp in the transverse direction is 1 or less.SELECTED DRAWING: Figure 9

Description

An embodiment of the present disclosure relates to a mask device manufacturing apparatus, a mask, and a mask device manufacturing method.

The market demands high-definition display devices for electronic devices such as smartphones and tablet PCs. The display device has a pixel density such as, for example, 400 ppi or more, or 800 ppi or more.

As such a display device, an organic EL display device having good responsiveness and/or high contrast is attracting attention. As a method of forming pixels of an organic EL display device, a method of forming pixels in a desired pattern on a substrate using a mask having through holes arranged in a desired pattern is known. More specifically, first, a vapor deposition apparatus is prepared. Next, the substrate is held in the vapor deposition apparatus, and the mask is brought into close contact with the substrate. Then, a deposition step is performed to deposit a vapor deposition material such as an organic material and/or an inorganic material on the substrate.

A vapor deposition apparatus that performs a vapor deposition process includes a mask device that includes a mask and a frame that supports the mask. In mask devices, the mask is fixed to the frame by welding. The frame supports the mask under tension so as to restrain the mask from bending. In the manufacturing process of the mask device, first, the end portion of the mask mounted on the mounting table is clamped by the clamp device, and the mask is pulled in the planar direction to apply tension. Next, while the mask is being pulled by the clamping device, the mask is transported onto the frame by the transporting device. Then, the mask is welded and fixed to the frame by a welding device.

JP 2020-84306 A

In order to precisely manufacture an organic EL display device having a high pixel density, it is required to vapor-deposit vapor deposition materials on a substrate with high precision. However, in the manufacturing process of the mask device, when the mask is pulled, sufficient tension cannot be applied to the mask, and wrinkles may occur in the mask. In this case, in the vapor deposition process, the positions of the through holes of the mask may deviate from the designed positions, and the positional accuracy of the vapor deposition may deteriorate. Moreover, in the manufacturing process of the mask device, the edge of the mask may be bent and deformed. In this case, the end of the mask cannot be clamped by the clamping device, and there is a risk of manufacturing defects in the mask device.

An embodiment of the present disclosure is a mask device manufacturing apparatus comprising:
a mask having a longitudinal direction and a lateral direction;
and a clamping device that clamps the mask,
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The dimension of the grip portion in the lateral direction is 10 mm or more,
In the mask device manufacturing apparatus, a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less.

According to an embodiment of the present disclosure, it is possible to improve the reliability of the mask device.

FIG. 1 is a cross-sectional view showing an example of a vapor deposition apparatus. FIG. 2 is a plan view showing an example of a mask device. 3 is a plan view showing an enlarged mask of the mask device of FIG. 2. FIG. 4 is a cross-sectional view showing a through hole of the mask of FIG. 3. FIG. FIG. 5 is a plan view showing an enlarged mask edge of the mask of FIG. FIG. 6 is a plan view showing an example of a mask device manufacturing apparatus. 7 is a plan view showing a mask mounted on a mounting table of the mask device manufacturing apparatus of FIG. 6. FIG. 8 is a cross-sectional view taken along line AA of FIG. 7. FIG. 9 is a plan view showing an enlarged mask end portion of the mask of FIG. 7. FIG. FIG. 10 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing a step of forming a resist pattern on the metal plate. FIG. 11 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing a step of etching the metal plate from the first metal surface. FIG. 12 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing a step of etching the metal plate from the second metal surface. FIG. 13 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing a step of removing the resin and the resist pattern from the metal plate. FIG. 14 is a diagram for explaining the method of manufacturing the mask device, and is a plan view showing the step of forming the mask end portion of the mask. FIG. 15 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing the process of conveying the mask. FIG. 16 is a diagram for explaining the method of manufacturing the mask device, and is a cross-sectional view showing the process of fixing the mask to the frame. FIG. 17 is a diagram for explaining the method of manufacturing an organic device, and is a cross-sectional view showing a step of preparing a vapor deposition apparatus. FIG. 18 is a diagram for explaining the method of manufacturing an organic device, and is a cross-sectional view showing a step of holding a substrate. FIG. 19 is a diagram for explaining the method of manufacturing an organic device, and is a cross-sectional view showing a step of bringing the mask into close contact with the substrate. FIG. 20 is a cross-sectional view showing an example of an organic device manufactured using a vapor deposition apparatus. FIG. 21 is a plan view showing an enlarged mask end portion of a mask in a mask device manufacturing apparatus according to a comparative example. FIG. 22 is a plan view showing an enlarged mask end portion of a mask in a mask device manufacturing apparatus according to another comparative example. FIG. 23 is a plan view showing an enlarged mask end portion of a mask in a mask device manufacturing apparatus according to still another comparative example. FIG. 24 is a plan view showing an enlarged mask end portion of a mask in a mask device manufacturing apparatus according to still another comparative example. FIG. 25 is a plan view showing an enlarged mask end portion of a mask in a mask device manufacturing apparatus according to a modified example. FIG. 26 is a diagram showing evaluation results of a mask device manufacturing apparatus according to an example. FIG. 27 is a diagram showing evaluation results of a mask device manufacturing apparatus according to another embodiment.

In this specification and the drawings, unless otherwise specified, the term "substrate", "base material", "plate", "sheet", "film", etc., which means a material that is the basis of a certain configuration, , are not distinguished from each other on the basis of nomenclature alone.

In this specification and drawings, the term “planar view” means that when the target plate-shaped member is viewed as a whole and broadly, it is viewed from the normal direction perpendicular to the plane direction of the plate-shaped member. refers to the state. For example, a plate-like member "has a rectangular shape in plan view" means that the member has a rectangular shape when viewed from the normal direction.

In this specification and drawings, unless otherwise specified, terms specifying shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular" and values of lengths and angles, etc. is interpreted to include the extent to which similar functions can be expected without being bound by a strict meaning.

In this specification and the drawings, unless otherwise specified, a feature such as a member or region is "above" or "below" another feature, such as another member or region; References to "above" or "below" or "above" or "below" include when one feature is in direct contact with another feature. Furthermore, it includes the case where another configuration is included between one configuration and another configuration, that is, the case where they are in direct contact with each other. Also, unless otherwise specified, the terms "upper", "upper" and "upper", or "lower", "lower" and "lower" may be reversed.

In this specification and the drawings, unless otherwise specified, the same parts or parts having similar functions are denoted by the same reference numerals or similar reference numerals, and repeated explanations thereof may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation, and some of the configurations may be omitted from the drawings.

Unless otherwise specified, the present specification and drawings may be combined with other embodiments and modifications as long as there is no contradiction. Further, other embodiments may be combined with each other, and other embodiments and modifications may be combined within a range that does not cause contradiction. Moreover, modifications may be combined within a range that does not cause contradiction.

In this specification and drawings, unless otherwise specified, when a plurality of steps are disclosed for a method such as a manufacturing method, other undisclosed steps are performed between the disclosed steps. may Also, the order of the disclosed steps is arbitrary as long as there is no contradiction.

In this specification and drawings, unless otherwise specified, the numerical range represented by the symbol "~" includes the numerical values placed before and after the symbol "~". For example, the numerical range defined by the expression "34 to 38% by mass" is the same as the numerical range defined by the expression "34% by mass or more and 38% by mass or less".

In one embodiment of this specification, an example will be described in which the mask is a vapor deposition mask used for patterning an organic material on a substrate in a desired pattern when manufacturing an organic EL display device. However, the use of the mask is not particularly limited, and the present embodiment can be applied to masks used for various uses. For example, the mask of the present embodiment may be used to manufacture a device for displaying or projecting images or videos for expressing virtual reality (VR) or augmented reality (AR).

A first aspect of the present disclosure is a mask device manufacturing apparatus comprising:
a mask having a longitudinal direction and a lateral direction;
and a clamping device that clamps the mask,
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The dimension of the grip portion in the lateral direction is 10 mm or more,
In the mask device manufacturing apparatus, a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less.

A second aspect of the present disclosure is the mask device manufacturing apparatus according to the first aspect described above,
The clamp may clamp an edge of the mask at least in the lateral direction.

A third aspect of the present disclosure is a mask device manufacturing apparatus according to each of the first aspect and the second aspect described above,
The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. a semicircular portion; and
The clamp may clamp the grip portion at a position closer to the edge than the semicircular portion.

A fourth aspect of the present disclosure is the mask device manufacturing apparatus according to the third aspect described above,
The clamp may clamp the grip portion at a position closer to the edge than a central position of the linear portion in the longitudinal direction.

A fifth aspect of the present disclosure is a mask device manufacturing apparatus according to each of the first aspect to the fourth aspect described above,
The grip portion may include a clamping region clamped by the clamp,
A dimension of the clamping region in the lateral direction may be larger than a dimension of the clamping region in the longitudinal direction.

A sixth aspect of the present disclosure is a mask device manufacturing apparatus comprising:
a mask having a longitudinal direction and a lateral direction;
and a clamping device that clamps the mask,
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The grip portion includes a clamping region that is clamped by the clamp,
In the mask device manufacturing apparatus, the dimension of the clamping region in the lateral direction is larger than the dimension of the clamping region in the longitudinal direction.

A seventh aspect of the present disclosure is a mask having a longitudinal direction and a lateral direction and being clamped by a clamping device, comprising:
a pair of mask end portions located on both sides in the longitudinal direction;
a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes;
The mask edge includes a notch formed by notching the mask edge and a plurality of grip portions arranged in the lateral direction via the notch and protruding in the longitudinal direction. a grip portion clamped by corresponding clamps of the device;
The dimension of the grip portion in the lateral direction is 10 mm or more,
In the mask, a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less.

An eighth aspect of the present disclosure is the mask according to the seventh aspect described above,
The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. and a semi-circular portion.

A ninth aspect of the present disclosure is a method for manufacturing a mask device, comprising:
providing a mask having a longitudinal direction and a lateral direction;
a step of clamping the mask with a clamp device;
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The dimension of the grip portion in the lateral direction is 10 mm or more,
In the mask device manufacturing method, a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less.

A tenth aspect of the present disclosure is a method for manufacturing a mask device according to the above-described ninth aspect,
In the step of clamping the mask, the clamp may clamp at least an edge of the mask in the lateral direction.

An eleventh aspect of the present disclosure is a mask device manufacturing method according to each of the above-described ninth aspect and the above-described tenth aspect, comprising:
The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. a semicircular portion; and
In the step of clamping the mask, the clamp may clamp the grip portion at a position closer to the edge than the semicircular portion.

A twelfth aspect of the present disclosure is a method for manufacturing a mask device according to the above-described eleventh aspect,
In the step of clamping the mask, the clamp may clamp the grip portion at a position closer to the edge than a central position of the linear portion in the longitudinal direction.

A thirteenth aspect of the present disclosure is a mask device manufacturing method according to each of the above-described ninth to twelfth aspects, comprising:
In the step of sandwiching the mask, the sandwiching region of the grip may be sandwiched by the clamp,
A dimension of the clamping region in the lateral direction may be larger than a dimension of the clamping region in the longitudinal direction.

A fourteenth aspect of the present disclosure is a method for manufacturing a mask device, comprising:
providing a mask having a longitudinal direction and a lateral direction;
a step of clamping the mask with a clamp device;
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
In the step of pinching the mask, the pinching region of the grip portion is pinched by the clamp,
In the manufacturing method of the mask device, the dimension of the clamping region in the lateral direction is larger than the dimension of the clamping region in the longitudinal direction.

An embodiment of the present disclosure will be described in detail below with reference to the drawings. In addition, the embodiment shown below is an example of the embodiment of the present disclosure, and the present disclosure is not interpreted as being limited to only these embodiments.

First, the vapor deposition apparatus 1 will be described with reference to FIG. The vapor deposition device 1 is a device for performing a vapor deposition process of vapor-depositing a vapor deposition material 7 onto an object.

As shown in FIG. 1, the vapor deposition device 1 may include a vapor deposition source 6, a heater 8, and a mask device 10. As shown in FIG. A vapor deposition source 6 , a heater 8 and a mask device 10 are arranged inside the vapor deposition device 1 . In addition, although not shown, the vapor deposition apparatus 1 may include exhaust means for creating a vacuum atmosphere inside the vapor deposition apparatus 1 . The vapor deposition source 6 is, for example, a crucible containing a vapor deposition material 7 such as an organic light emitting material. A heater 8 heats the deposition source 6 to evaporate the deposition material 7 under a vacuum atmosphere. The mask device 10 is arranged so as to face the vapor deposition source 6 .

As shown in FIG. 1, mask apparatus 10 may include frame 15 and mask 20 . The frame 15 supports the mask 20 while pulling it in its plane direction so as to suppress the bending of the mask 20 . Mask 20 may be fixed to frame 15 . The mask 20 may include a first mask surface 20a and a second mask surface 20b. The first mask surface 20a is located on the substrate 110 side. The second mask surface 20b is located on the side opposite to the first mask surface 20a. The frame 15 may also include a first frame surface 15a and a second frame surface 15b. The first frame surface 15a faces and is in contact with the second mask surface 20b. The second frame surface 15b is located on the side opposite to the first frame surface 15a.

As shown in FIG. 1, the mask device 10 may be arranged in the vapor deposition apparatus 1 such that the mask 20 faces and is in contact with the substrate 110 to which the vapor deposition material 7 is deposited. Mask 20 includes a plurality of through holes 25 through which vapor deposition material 7 coming from vapor deposition source 6 passes.

As shown in FIG. 1, vapor deposition apparatus 1 may include a substrate holder 2 that holds substrate 110 . The substrate holder 2 may be movable in the thickness direction of the substrate 110, that is, in the up-down direction (vertical direction). Further, the substrate holder 2 may be movable in a first direction D1 (see FIG. 2), which is the lateral direction of the mask 20, and a second direction D2 (see FIG. 2), which is the longitudinal direction of the mask 20. Here, the thickness direction of the substrate 110 is also referred to as the third direction D3. The first direction D1, the second direction D2 and the third direction D3 may be orthogonal to each other.

As shown in FIG. 1, the vapor deposition apparatus 1 may include a mask holder 3 that holds a mask device 10. The mask holder 3 may be a mask holder. The mask holder 3 may be movable in the third direction D3. Also, the mask holder 3 may be movable in the first direction D1 and the second direction D2.

By moving at least one of the substrate holder 2 and the mask holder 3, the position of the mask 20 of the mask device 10 with respect to the substrate 110 can be adjusted.

As shown in FIG. 1, vapor deposition device 1 may include magnet 5 . The magnet 5 may be arranged above the substrate holder 2 . As shown in FIG. 1 , the magnet 5 may be positioned on the surface of the substrate holder 2 opposite to the mask device 10 . The magnet 5 can draw the mask 20 of the mask device 10 toward the substrate 110 by magnetic force. As a result, the mask 20 can be brought into close contact with the substrate 110 and the formation of a gap between the mask 20 and the substrate 110 can be suppressed. Therefore, the generation of shadows in the vapor deposition process can be suppressed, and the dimensional accuracy and positional accuracy of the vapor deposition material 7 adhering to the substrate 110 can be improved. Here, the shadow refers to a phenomenon in which the vapor deposition material 7 enters the gap between the mask 20 and the substrate 110 and the thickness of the vapor deposition material 7 adhering to the substrate 110 becomes uneven.

Next, the mask device 10 will be described in detail with reference to FIGS. 2 to 5. FIG.

As mentioned above, mask device 10 includes frame 15 . As shown in FIG. 2, the frame 15 is formed in a rectangular frame shape in plan view. An opening 15 d is formed inside the frame 15 . The opening 15d penetrates from the first frame surface 15a to the second frame surface 15b. In the vapor deposition process, vapor deposition material 7 evaporated from vapor deposition source 6 passes through opening 15 d of frame 15 and adheres to substrate 110 . Here, planar view means viewing the mask device 10 along the normal direction of the first frame surface 15 a of the frame 15 or the normal direction of the first mask surface 20 a of the mask 20 .

As shown in FIG. 2, frame 15 may include alignment marks 15 e for aligning mask 20 with respect to frame 15 . The alignment mark 15e is provided in the frame 15 at a position not overlapping the mask 20 in plan view. As shown in FIG. 2 , one alignment mark 15 e may be provided at each of the four corners of the frame 15 . This can prevent the alignment marks 15 e from being hidden by the mask 20 when positioning the mask 20 . Therefore, alignment of the mask 20 can be easily performed.

The mask device 10 also includes a mask 20, as described above. As shown in FIG. 2, mask device 10 may include multiple masks 20 . The mask 20 may have a lateral direction in the first direction D1 and a longitudinal direction in a second direction D2 orthogonal to the first direction D1. In other words, the mask 20 has an elongated shape, the first direction D1 is specified as the lateral direction of the mask 20 and the second direction D2 is specified as the longitudinal direction of the mask 20 . As shown in FIG. 2, the multiple masks 20 may be arranged in the first direction D1. In the illustrated example, ten masks 20 are arranged in the first direction D1.

In FIG. 2, reference W1 represents the dimension (width dimension) of the mask 20 in the first direction D1. The dimension W1 may be, for example, 30 mm or more, 50 mm or more, or 80 mm or more. The dimension W1 may be, for example, 100 mm or less, 150 mm or less, or 180 mm or less. The range of dimension W1 may be defined by a first group consisting of 30 mm, 50 mm and 80 mm and/or a second group consisting of 100 mm, 150 mm and 180 mm. The range of dimension W1 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension W1 may be defined by a combination of any two of the values included in the first group above. The range of dimension W1 may be defined by a combination of any two of the values included in the second group above. For example, it may be 30 mm or more and 180 mm or less, 30 mm or more and 150 mm or less, 30 mm or more and 100 mm or less, 30 mm or more and 80 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 180 mm or less, or 50 mm or more and 150 mm or less. , 50 mm or more and 100 mm or less, 50 mm or more and 80 mm or less, 80 mm or more and 180 mm or less, 80 mm or more and 150 mm or less, 80 mm or more and 100 mm or less, 100 mm or more and 180 mm or less, 100 mm or more and 150 mm or less, It may be 150 mm or more and 180 mm or less.

In FIG. 2, reference L1 represents the dimension (length dimension) of the mask 20 in the second direction D2. The dimension L1 may be, for example, 1000 mm or more, 1200 mm or more, or 1400 mm or more. The dimension L1 may be, for example, 1600 mm or less, 2200 mm or less, or 2800 mm or less. The range of dimensions L1 may be defined by a first group consisting of 1000 mm, 1200 mm and 1400 mm and/or a second group consisting of 1600 mm, 2200 mm and 2800 mm. The range of dimension L1 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension L1 may be defined by a combination of any two of the values included in the first group above. The range of dimension L1 may be defined by a combination of any two of the values included in the second group above. For example, it may be 1000 mm or more and 2800 mm or less, 1000 mm or more and 2200 mm or less, 1000 mm or more and 1600 mm or less, 1000 mm or more and 1400 mm or less, 1000 mm or more and 1200 mm or less, 1200 mm or more and 2800 mm or less, or 1200 mm or more and 2200 mm or less. , 1200 mm or more and 1600 mm or less, 1200 mm or more and 1400 mm or less, 1400 mm or more and 2800 mm or less, 1400 mm or more and 2200 mm or less, 1400 mm or more and 1600 mm or less, 1600 mm or more and 2800 mm or less, 1600 mm or more and 2200 mm or less, 2200 mm or more and 2800 mm or less may be sufficient.

As shown in FIG. 2 , the mask 20 includes a pair of mask edge portions 30 and a mask middle portion 21 located between the pair of mask edge portions 30 .

First, the mask intermediate portion 21 will be described. The mask intermediate portion 21 is a portion of the mask 20 positioned between the pair of mask end portions 30 . Mask intermediate portion 21 includes an effective area 22 and a peripheral area 23 . The surrounding area 23 is an area located around the effective area 22 . As shown in FIG. 2, the mask intermediate portion 21 may include multiple active areas 22 . The multiple effective areas 22 may be arranged in the second direction D2. In the illustrated example, five effective areas 22 are arranged in the second direction D2. Also, as shown in FIG. 2, the surrounding area 23 may surround a plurality of effective areas 22 . The peripheral area 23 may be an area for supporting the active area 22 and may not be an area through which the deposition material 7 intended to be deposited onto the substrate 110 passes. On the other hand, the effective area 22 may be the area of the mask 20 that faces the display area of the substrate 110 .

As shown in FIG. 2, the active area 22 may have a rectangular contour in plan view. Although not shown, the effective area 22 may have contours of various shapes according to the shape of the display area of the organic EL display device. For example, the active area 22 may have a circular or elliptical contour, or may have a polygonal contour such as a hexagon or octagon. In addition, the plurality of effective areas 22 may have different contours, such as circular, elliptical, and polygonal contours.

As shown in FIG. 3 , the effective area 22 of the mask intermediate portion 21 includes a plurality of through holes 25 . The plurality of through-holes 25 may be arranged regularly at a predetermined pitch along the first direction D1 and the second direction D2 in the effective region 22 . Vapor deposition material 7 passing through each through-hole 25 of mask intermediate portion 21 adheres to substrate 110 .

When an organic device such as an organic EL display device is manufactured using the mask 20, one effective area 22 may correspond to a display area of one organic EL display device. Therefore, according to the mask device 10 shown in FIG. 2, multi-surface vapor deposition of the organic EL display device is possible. Note that one effective area 22 may correspond to a plurality of display areas. Moreover, although not shown, in one mask 20, a plurality of effective regions 22 may be arranged in the first direction D1.

As shown in FIG. 4, the plurality of through holes 25 penetrate from the first mask surface 20a to the second mask surface 20b. Through hole 25 may include first recess 202 and second recess 203 . The first recess 202 is located on the first mask surface 20a. The second recess 203 is located on the second mask surface 20b. The first recess 202 and the second recess 203 are connected to each other. The first concave portion 202 may be formed by etching the metal plate 200, which is the base material of the mask 20, from the first metal surface 200a. The second recess 203 may be formed by etching the metal plate 200 from the second metal surface 200b.

As shown in FIG. 4 , the wall surface 202 a of the first recess 202 and the wall surface 203 a of the second recess 203 may be connected via a circumferential connecting portion 205 . The connection portion 205 may define a through portion 206 that minimizes the opening area of the through hole 25 in plan view.

As shown in FIG. 4, two adjacent first recesses 202 may be spaced apart from each other. Similarly, two adjacent second recesses 203 may also be spaced apart from each other. That is, the second metal surface 200b of the metal plate 200 may remain between two adjacent second recesses 203 . In the following description, the portion of the second metal surface 200b of the metal plate 200 that remains unetched between the two adjacent second recesses 203 is also referred to as a top portion 207. As shown in FIG. By fabricating the mask 20 so that such a top portion 207 remains, the strength of the mask 20 can be given. This can prevent the mask 20 from being deformed or damaged during transportation, for example. In FIG. 4, the width of the top portion 207 is indicated by β. If the width β of the top portion 207 is too large, shadows may occur in the deposition process, which may reduce the utilization efficiency of the deposition material 7 . Therefore, the width β of the top portion 207 is determined so as not to be excessively large.

Although not shown, the etching may be performed so that two adjacent second recesses 203 are connected. That is, the second metal surface 200b of the metal plate 200 does not have to remain between the two adjacent second recesses 203 . Also, although not shown, the second metal surface 200b of the metal plate 200 may be etched over the entire area so that two adjacent second recesses 203 are connected.

FIG. 4 shows the symbol α. Symbol α represents the width of the portion of the first metal surface 200a of the metal plate 200 that remains unetched between two adjacent first recesses 202 . Such portions are also referred to as rib portions. FIG. 4 also shows the symbol r. Symbol r is the dimension (inner diameter dimension) of the penetrating portion 206 . The width α of the rib portion and the dimension r of the through portion 206 are appropriately determined according to the dimensions of the organic device to be manufactured, the number of display pixels, and the like.

During the deposition process, the first mask surface 20a faces and contacts the substrate 110 . The second mask surface 20 b faces the vapor deposition source 6 holding the vapor deposition material 7 . The deposition material 7 passes through the second recesses 203 and the first recesses 202 and adheres to the substrate 110 .

As indicated by the arrow pointing from the second mask surface 20b side to the first mask surface 20a side in FIG. , but also in directions oblique to the normal direction. At this time, if the thickness T of the mask 20 is large, the deposition material 7 moving in the inclined direction is likely to be caught on the top portion 207, the wall surface 203a of the second recess 203, and/or the wall surface 202a of the first recess 202. As a result, the proportion of the vapor deposition material 7 that cannot pass through the through holes 25 increases. Therefore, the thickness T of the mask 20 may be reduced in order to improve the utilization efficiency of the vapor deposition material 7 . In this case, the height of the wall surface 203a of the second recess 203 may be reduced, and the height of the wall surface 202a of the first recess 202 may be reduced. The thickness T of the mask 20 may be made as small as possible within the range where the strength of the mask 20 can be ensured.

The thickness T of the mask 20 may be 5 μm or more and 50 μm or less. When the thickness T of the mask 20 is 5 μm or more, the strength of the mask 20 can be ensured, and damage and deformation of the mask 20 can be suppressed. By setting the thickness T of the mask 20 to 50 μm or less, the ratio of the vapor deposition material 7 caught on the wall surface 203 a of the through hole 25 before passing through the through hole 25 can be reduced. Thereby, the utilization efficiency of the vapor deposition material 7 can be improved. Here, the thickness T is the thickness of a portion of the mask 20 where the first concave portion 202 and the second concave portion 203 are not formed. Therefore, it can also be said that the thickness T is the thickness of the metal plate 200 .

The thickness T of the mask 20 may be, for example, 5 μm or more, 10 μm or more, or 15 μm or more. The thickness T of the mask 20 may be, for example, 20 μm or less, 35 μm or less, or 50 μm or less. The range of thickness T of mask 20 may be defined by a first group consisting of 5 μm, 10 μm and 15 μm and/or a second group consisting of 20 μm, 35 μm and 50 μm. The range of the thickness T of the mask 20 may be determined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. . The range of thickness T of mask 20 may be defined by a combination of any two of the values included in the first group above. The range of thickness T of mask 20 may be defined by a combination of any two of the values included in the second group above. For example, it may be 5 μm or more and 50 μm or less, 5 μm or more and 35 μm or less, 5 μm or more and 20 μm or less, 5 μm or more and 15 μm or less, 5 μm or more and 10 μm or less, 10 μm or more and 50 μm or less, or 10 μm or more and 35 μm or less. , 10 μm or more and 20 μm or less, 10 μm or more and 15 μm or less, 15 μm or more and 50 μm or less, 15 μm or more and 35 μm or less, 15 μm or more and 20 μm or less, 20 μm or more and 50 μm or less, 20 μm or more and 35 μm or less, It may be 35 μm or more and 50 μm or less.

As a method for measuring the thickness T of the mask 20, a contact measurement method may be adopted. As the contact type measuring method, a length gauge HEIDENHAIN-METRO "MT1271" manufactured by HEIDENHAIN Co., which has a ball bush guide type plunger may be used.

Next, the pair of mask end portions 30 will be described. The mask end portions 30 are portions of the mask 20 located on both sides in the second direction D2. The mask edge 30 does not have to overlap the opening 15d of the frame 15 in plan view. In this case, the mask edge 30 can be defined as the portion of the mask 20 outside the opening 15 d of the frame 15 . Here, the "outside" is the side away from the center line CL of the mask 20 in the second direction D2, as indicated by arrow A in FIG. The center line CL of the mask 20 is a straight line extending in the first direction D1 and passing through the center point C (see FIG. 2) of the mask 20 in the second direction D2.

As shown in FIG. 2, the mask edge 30 includes a joint 31 that is joined to the first frame surface 15a of the frame 15. As shown in FIG. The mask 20 may be fixed to the frame 15 by welding the second mask surface 20 b of the mask 20 to the first frame surface 15 a of the frame 15 at the joint 31 . For example, mask 20 may be spot welded to frame 15 at joints 31 . In this case, weld marks may be formed on the joint 31 . The joint portion 31 may include a plurality of dot-like welding marks aligned in the first direction D1. However, it is not limited to this, and the arrangement and shape of the weld marks are arbitrary. For example, a plurality of weld marks may be arranged in the second direction D2, or the weld marks may extend linearly in the first direction D1 and/or the second direction D2. Further, for example, the weld marks may include both dotted weld marks and linear weld marks.

Also, as shown in FIG. 5, the mask edge 30 includes a notch 32 . The notch portion 32 is formed by notching the mask end portion 30 . The notch 32 may be formed in the center of the mask 20 in the first direction D1. The notch 32 is positioned outside the frame 15 . Therefore, the notch 32 does not overlap the frame 15 in plan view.

As shown in FIG. 5, the edge 32e of the notch 32 may have a substantially U shape in plan view. In this case, the notch 32 may include a linear portion 32a and a semicircular portion 32b. The linear portion 32a is a portion linearly extending in the second direction D2 from the edge 30e of the mask edge portion 30 in the second direction D2. The semicircular portion 32b is a semicircular portion adjacent to the linear portion 32a on the side opposite to the edge 30e of the mask end portion 30 in the second direction D2. The semicircular portion 32b is located inside the linear portion 32a and is continuous with the linear portion 32a. Here, the "inner side" is the side closer to the center line CL of the mask 20 shown in FIG. The position in the first direction D1 of the center O of the circle forming the semicircular portion 32b may coincide with the center position in the first direction D1 of the linear portion 32a.

In FIG. 5, reference W2 represents the dimension (width dimension) of the linear portion 32a in the first direction D1. Dimension W2 may be equal to the diameter of the circle forming semi-circular portion 32b. The dimension W2 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W2 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of dimension W2 may be defined by a first group consisting of 10 mm, 20 mm and 40 mm and/or a second group consisting of 30 mm, 50 mm and 60 mm. The range of dimension W2 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension W2 may be defined by a combination of any two of the values included in the first group above. The range of dimension W2 may be defined by a combination of any two of the values included in the second group above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, or 20 mm or more and 50 mm or less. , 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 60 mm or less may be sufficient.

In FIG. 5, L2 represents the dimension (length dimension) of the linear portion 32a in the second direction D2. The dimension L2 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension L2 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of dimensions L2 may be defined by a first group consisting of 10 mm, 20 mm and 40 mm and/or a second group consisting of 30 mm, 50 mm and 60 mm. The range of dimension L2 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension L2 may be defined by a combination of any two of the values included in the first group above. The range of dimension L2 may be defined by a combination of any two of the values included in the second group above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, or 20 mm or more and 50 mm or less. , 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 60 mm or less may be sufficient.

In FIG. 5, L3 represents the dimension (length dimension) of the semicircular portion 32b in the second direction D2. That is, the dimension L3 represents the radius of the circle forming the semicircular portion 32b. Dimension L3 may be half the dimension of dimension W2. The dimension L3 may be, for example, 5 mm or more, 10 mm or more, or 20 mm or more. The dimension L3 may be, for example, 15 mm or less, 25 mm or less, or 30 mm or less. The range of dimensions L3 may be defined by a first group consisting of 5 mm, 10 mm and 20 mm and/or a second group consisting of 15 mm, 25 mm and 30 mm. The range of dimension L3 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension L3 may be defined by a combination of any two of the values included in the first group above. The range of dimension L3 may be defined by a combination of any two of the values included in the second group above. For example, it may be 5 mm or more and 30 mm or less, 5 mm or more and 25 mm or less, 5 mm or more and 15 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, or 10 mm or more and 25 mm or less. , 10 mm or more and 15 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 25 mm or less, 20 mm or more and 15 mm or less, 15 mm or more and 30 mm or less, 15 mm or more and 25 mm or less, 25 mm or more and 30 mm or less may be sufficient.

The edge portion 32e of the notch portion 32 may have other shapes other than the substantially U shape, such as a substantially V shape, a substantially semicircular shape, and a substantially U shape.

By forming the notch portion 32 in the mask end portion 30 in this manner, grip portions 35 are formed on both sides of the notch portion 32 of the mask end portion 30 as shown in FIG. That is, the mask end portion 30 includes a plurality of grip portions 35 arranged in the first direction D1 via the cutout portions 32 . In the present embodiment, the plurality of grips 35 includes first grips 35a and second grips 35b. The first grip portion 35a is positioned on one side (left side in FIG. 5) in the first direction D1, and the second grip portion 35b is positioned on the other side (right side in FIG. 5) in the first direction D1. In the following description, the term “grip portion 35” and reference numerals are used when describing the configuration common to the first grip portion 35a and the second grip portion 35b among the configurations of the grip portions.

As shown in FIG. 5, the grip portion 35 protrudes in the second direction D2. That is, the grip portion 35 is formed to protrude outward from the base portion 33 in the second direction D2. The grip portion 35 is formed by an edge portion 20s of the mask 20 in the first direction D1, an edge portion 30e of the mask edge portion 30 in the second direction D2, and a portion (half) of an edge portion 32e of the notch portion 32. defined. The grip portion 35 is a portion held between corresponding clamps 51 of a clamp device 50 to be described later. Grip portion 35 may include a clamping region 36 that is clamped by clamps 51 . More specifically, the first grip portion 35a may include a first clamping region 36a that is clamped by a first clamp 51a described later, and the second grip portion 35b is clamped by a second clamp 51b that will be described later. A second clamping region 36b may be included (see FIG. 9).

In FIG. 5, reference W3 represents the dimension (width dimension) of the first grip portion 35a in the first direction D1. The dimension W3 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W3 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of dimension W3 may be defined by a first group consisting of 10 mm, 20 mm and 40 mm and/or a second group consisting of 30 mm, 50 mm and 60 mm. The range of dimension W3 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension W3 may be defined by a combination of any two of the values included in the first group above. The range of dimension W3 may be defined by a combination of any two of the values included in the second group above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, or 20 mm or more and 50 mm or less. , 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 60 mm or less may be sufficient.

In FIG. 5, reference W4 represents the dimension (width dimension) of the second grip portion 35b in the first direction D1. The dimension W4 may be equal to the dimension W3 of the first grip portion 35a in the first direction D1. However, the dimension W4 is not limited to this, and may be smaller or larger than the dimension W3. The extent of dimension W4 may be similar to the extent of dimension W3.

Next, materials for the mask 20 and the frame 15 will be described. An iron alloy containing nickel may be used as the main material of the mask 20 and the frame 15 . The iron alloy may further contain cobalt in addition to nickel. For example, as the material of the metal plate 200 of the mask 20, an iron alloy having a total nickel and cobalt content of 28% by mass or more and 54% by mass or less and a cobalt content of 0% by mass or more and 6% by mass or less. may be used. Thereby, the difference between the thermal expansion coefficients of the mask 20 and the frame 15 and the thermal expansion coefficient of the substrate 110 containing glass can be reduced. Therefore, it is possible to suppress deterioration in the dimensional accuracy and positional accuracy of the vapor deposition material 7 adhering to the substrate 110 due to thermal expansion of the mask 20, the frame 15, the substrate 110, and the like.

The total content of nickel and cobalt in metal plate 200 may be 28% by mass or more and 38% by mass or less. In this case, specific examples of the iron alloy containing nickel or nickel and cobalt include Invar material, Super Invar material, Ultra Invar material, and the like. The Invar material is an iron alloy containing 34% by mass or more and 38% by mass or less of nickel, the balance being iron and unavoidable impurities. The Super Invar material is an iron alloy containing 30% by mass or more and 34% by mass or less of nickel, cobalt, and the balance of iron and unavoidable impurities. The Ultra Invar material contains 28% by mass or more and 34% by mass or less of nickel, 2% by mass or more and 7% by mass or less of cobalt, 0.1% by mass or more and 1.0% by mass or less of manganese, and 0.10% by mass. It is an iron alloy containing the following silicon, not more than 0.01% by mass of carbon, and the balance iron and unavoidable impurities.

The total content of nickel and cobalt in metal plate 200 may be 38% by mass or more and 54% by mass or less. In this case, as a specific example of the iron alloy containing nickel or nickel and cobalt, a low thermal expansion Fe--Ni plated alloy or the like can be mentioned. The low thermal expansion Fe--Ni plating alloy is an iron alloy containing 38% by mass or more and 54% by mass or less of nickel, the balance being iron and unavoidable impurities.

If the temperatures of the mask 20, the frame 15 and the substrate 110 do not reach a high temperature during the vapor deposition process, the thermal expansion coefficients of the mask 20 and the frame 15 should be equal to the thermal expansion coefficient of the substrate 110. good too. In this case, a material other than the iron alloy described above may be used as the material forming the mask 20 . For example, an iron alloy other than the nickel-containing iron alloy described above, such as an iron alloy containing chromium, may be used. As an iron alloy containing chromium, for example, an iron alloy called so-called stainless steel can be used. Alloys other than iron alloys, such as nickel and nickel-cobalt alloys, may also be used.

Next, a manufacturing apparatus 40 (hereinafter referred to as a manufacturing apparatus 40) for the mask device 10 will be described with reference to FIGS. 6 to 9. FIG.

As shown in FIG. 6, the manufacturing apparatus 40 may include a mask 20, a mounting table 45, a clamping device 50, a conveying device 60, and a welding device 70 (see FIG. 16).

The mounting table 45 is a table on which the mask 20 is mounted. As shown in FIG. 6 , the mounting table 45 is arranged at a position separated from the frame 15 . The mask 20 mounted on the mounting table 45 is sequentially conveyed by the clamping device 50 and the conveying device 60 and fixed to the frame 15 .

As shown in FIGS. 6-8, the mounting table 45 may include a flat tray 46, an adhesive member 47, and guide pins 48. As shown in FIGS. The tray 46 may have a substantially rectangular shape in plan view. A top surface 46 a of tray 46 contacts second mask surface 20 b of mask 20 . The adhesive member 47 is positioned on the upper surface 46 a of the tray 46 . The adhesive member 47 extends in the first direction D1 and may be positioned near both ends of the mask 20 in the second direction D2. Note that the arrangement and number of adhesive members 47 are arbitrary. The adhesive member 47 temporarily fixes the mask 20 on the tray 46 by adhering to the second mask surface 20 b of the mask 20 . The guide pin 48 protrudes from the upper surface 46 a of the tray 46 . The guide pins 48 may be positioned near the adhesive members 47 respectively. The arrangement and number of guide pins 48 are arbitrary. The guide pin 48 guides the mask 20 to a predetermined position on the tray 46 by contacting the edge 20s of the mask 20 so that the position of the mask 20 does not shift.

The clamp device 50 is a device that clamps the mask 20 . As shown in FIGS. 6-8, the clamping device 50 includes a first clamping device 50A and a second clamping device 50B located on the opposite side of the first clamping device 50A with the mask 20 interposed therebetween. In other words, the clamping device 50 has a first clamping device 50A that clamps the grip portion 35 of one of the pair of mask end portions 30 of the mask 20 and the grip portion 35 of the other mask end portion 30. and a second clamping device 50B for clamping. In the following description, the term "clamping device 50" and reference numerals are used when describing the configuration common to the first clamping device 50A and the second clamping device 50B among the configurations of the clamping device.

As shown in FIGS. 6-9, clamping device 50 includes a plurality of clamps 51 that clamp corresponding grip portions 35 of mask 20 . In the present embodiment, the multiple clamps 51 include a first clamp 51a and a second clamp 51b. The first clamp 51 a clamps the first grip portion 35 a of the mask 20 and the second clamp 51 b clamps the second grip portion 35 b of the mask 20 . In the following description, the term "clamp 51" and reference numerals will be used when describing a configuration common to the first clamp 51a and the second clamp 51b among the configurations of the clamps.

As shown in FIG. 8, the clamps 51 include a pair of clamps 51. As shown in FIG. One clamp 51 of the pair of clamps 51 is positioned above the mask 20 and the other clamp 51 is positioned below. The clamp device 50 clamps the mask 20 by clamping the grip portion 35 between the pair of clamps 51 with a predetermined pressing force. The clamp device 50 supports the mask 20 by clamping the corresponding grip portion 35 of the mask 20 with each clamp 51 . The clamping device 50 can apply tension to the mask 20 by pulling the mask 20 opposite to each other in the second direction D2 with each clamp 51 .

Clamping device 50 may be driven by drive device 53 . The driving device 53 may be, for example, an air cylinder, a hydraulic cylinder, a servomotor, or the like. The clamp 51 may be controlled by a drive device 53 and movable in a first direction D1, a second direction D2 and a third direction D3. Also, the plurality of clamps 51 may be controlled by corresponding driving devices 53 and movable independently of each other. Note that the plurality of clamps 51 may be controlled in conjunction with one driving device 53 .

The clamp 51 may have a rectangular shape in plan view. Moreover, the clamp 51 may be configured by a flat plate-like member. The clamp 51 may, for example, consist of a flat metal plate. A non-slip member such as silicon rubber may be arranged on the surface of the metal plate on the mask 20 side.

In FIG. 9, reference W5 represents the dimension (width dimension) of the first clamp 51a in the first direction D1. The dimension W5 may be greater than or equal to the dimension W3 (see FIG. 5) of the first grip portion 35a in the first direction D1. The dimension W5 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W5 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of dimension W5 may be defined by a first group consisting of 10 mm, 20 mm and 40 mm and/or a second group consisting of 30 mm, 50 mm and 60 mm. The range of dimension W5 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension W5 may be defined by a combination of any two of the values included in the first group above. The range of dimension W5 may be defined by a combination of any two of the values included in the second group above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, or 20 mm or more and 50 mm or less. , 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 60 mm or less may be sufficient.

When the ratio of the dimension W3 of the first grip portion 35a in the first direction D1 to the dimension W5 of the first clamp 51a in the first direction D1 is W3/W5, W3/W5 may be, for example, 0.3 or more. It may be 0.4 or more, or 0.5 or more. W3/W5 may be, for example, 0.6 or less, 0.8 or less, or 1 or less. The W3/W5 range may be defined by a first group consisting of 0.3, 0.4 and 0.5 and/or a second group consisting of 0.6, 0.8 and 1. The range of W3/W5 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of W3/W5 may be defined by a combination of any two of the values included in the first group above. The range of W3/W5 may be defined by a combination of any two of the values included in the second group above. For example, it may be 0.3 or more and 1 or less, 0.3 or more and 0.8 or less, 0.3 or more and 0.6 or less, 0.3 or more and 0.5 or less, or 0.3 or more and 0.3 or less. 4 or less, 0.4 or more and 1 or less, 0.4 or more and 0.8 or less, 0.4 or more and 0.6 or less, 0.4 or more and 0.5 or less, or 0.5 0.5 to 0.8; 0.5 to 0.6; 0.6 to 1; 0.6 to 0.8; It may be 8 or more and 1 or less.

In FIG. 9, reference W6 represents the dimension (width dimension) of the second clamp 51b in the first direction D1. The dimension W6 may be greater than or equal to the dimension W4 (see FIG. 5) of the second grip portion 35b in the first direction D1. The dimension W6 may be equal to the dimension W5 of the first clamp 51a in the first direction D1. However, the dimension W6 is not limited to this, and may be smaller or larger than the dimension W5. The extent of dimension W6 may be similar to the extent of dimension W5.

W4/W6, which is the ratio of the dimension W4 of the second grip portion 35b in the first direction D1 to the dimension W6 of the second clamp 51b in the first direction D1, is the first dimension to the dimension W5 of the first clamp 51a in the first direction D1. It may be equal to W3/W5, which is the ratio of the dimension W3 of the first grip portion 35a in the direction D1. However, it is not limited to this, and W4/W6 may be smaller or larger than W3/W5. The range of W4/W6 may be similar to the range of W3/W5.

As shown in FIG. 9, the clamp 51 may clamp the edge 20s of the mask 20 in at least the first direction D1. That is, the clamp 51 may overlap the edge 20s of the mask 20 in a plan view while the clamp 51 holds the grip portion 35 therebetween. In the example shown in FIG. 9, the clamp 51 reaches a position beyond the edge 20s of the mask 20, that is, a position protruding from the grip 35 to the opposite side of the notch 32 in the first direction D1. there is However, it is not limited to this, and the clamp 51 does not have to extend beyond the edge 20 s of the mask 20 .

Further, as shown in FIG. 9, the clamp 51 may clamp the grip portion 35 without overlapping the notch portion 32 in plan view. That is, in a state where the clamp 51 clamps the grip portion 35, the clamp 51 and the notch portion 32 do not have to overlap in plan view. In addition, as shown in FIG. 9, the clamp 51 and the edge 32e of the notch 32 may overlap in plan view. However, it is not limited to this, and the clamp 51 and the edge 32e of the notch 32 may not overlap in plan view.

9, the clamp 51 clamps the grip portion 35 at a position closer to the edge 30e of the mask edge portion 30 in the second direction D2 than the semicircular portion 32b of the notch portion 32. good too. That is, the clamp 51 may clamp the grip portion 35 at a position overlapping the linear portion 32a of the notch portion 32 and not overlapping the semicircular portion 32b in the second direction D2. In other words, in a state where the clamp 51 clamps the grip portion 35, the clamp 51 may be positioned outside the semicircular portion 32b in plan view.

In this case, as shown in FIG. 9, the clamp 51 clamps the grip portion 35 at a position closer to the edge 30e of the mask edge 30 in the second direction D2 than the central position 32c of the linear portion 32a in the second direction D2. may be sandwiched. In other words, in a state where the clamp 51 clamps the grip portion 35, the clamp 51 may be positioned outside the central position 32c of the linear portion 32a in the second direction D2 in plan view.

In FIG. 9, reference W7 represents the dimension (width dimension) of the first clamping region 36a in the first direction D1. As shown in FIG. 9, the dimension W7 may be equal to the dimension W3 (see FIG. 5) of the first grip portion 35a in the first direction D1. However, it is not limited to this, and dimension W7 may be smaller than dimension W3. Reference L7 represents the dimension (length dimension) of the first clamping region 36a in the second direction D2. As shown in FIG. 9, the dimension W7 of the first pinching area 36a in the first direction D1 may be larger than the dimension L7 of the first pinching area 36a in the second direction D2. That is, the first sandwiching region 36a may have a shape in which the width dimension in the first direction D1 is larger than the length dimension in the second direction D2.

The dimension W7 may be, for example, 10 mm or more, 20 mm or more, or 40 mm or more. The dimension W7 may be, for example, 30 mm or less, 50 mm or less, or 60 mm or less. The range of dimension W7 may be defined by a first group consisting of 10 mm, 20 mm and 40 mm and/or a second group consisting of 30 mm, 50 mm and 60 mm. The range of dimension W7 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension W7 may be defined by a combination of any two of the values included in the first group above. The range of dimension W7 may be defined by a combination of any two of the values included in the second group above. For example, it may be 10 mm or more and 60 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 40 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 60 mm or less, or 20 mm or more and 50 mm or less. , 20 mm or more and 30 mm or less, 20 mm or more and 40 mm or less, 40 mm or more and 60 mm or less, 40 mm or more and 50 mm or less, 40 mm or more and 30 mm or less, 30 mm or more and 60 mm or less, 30 mm or more and 50 mm or less, 50 mm or more and 60 mm or less may be sufficient.

The dimension L7 may be, for example, 5 mm or more, 10 mm or more, or 20 mm or more. The dimension L7 may be, for example, 15 mm or less, 25 mm or less, or 30 mm or less. The range of dimension L7 may be defined by a first group consisting of 5 mm, 10 mm and 20 mm and/or a second group consisting of 15 mm, 25 mm and 30 mm. The range of dimension L7 may be defined by a combination of any one of the values included in the first group described above and any one of the values included in the second group described above. The range of dimension L7 may be defined by a combination of any two of the values included in the first group above. The range of dimension L7 may be defined by a combination of any two of the values included in the second group above. For example, it may be 5 mm or more and 30 mm or less, 5 mm or more and 25 mm or less, 5 mm or more and 15 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, or 10 mm or more and 25 mm or less. , 10 mm or more and 15 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 30 mm or less, 20 mm or more and 25 mm or less, 20 mm or more and 15 mm or less, 15 mm or more and 30 mm or less, 15 mm or more and 25 mm or less, It may be 25 mm or more and 30 mm or less.

In FIG. 9, reference W8 represents the dimension (width dimension) of the second clamping region 36b in the first direction D1. As shown in FIG. 9, the dimension W8 may be equal to the dimension W4 (see FIG. 5) of the second grip portion 35b in the first direction D1. However, it is not limited to this, and dimension W8 may be smaller than dimension W4. Reference L8 represents the dimension (length dimension) of the second clamping region 36b in the second direction D2. As shown in FIG. 9, the dimension W8 of the second pinching area 36b in the first direction D1 may be larger than the dimension L8 of the second pinching area 36b in the second direction D2. That is, the second holding region 36b may have a shape such that the width dimension in the first direction D1 is larger than the length dimension in the second direction D2.

The dimension W8 of the second pinching area 36b in the first direction D1 may be equal to the dimension W7 of the first pinching area 36a in the first direction D1. However, the dimension W8 is not limited to this, and may be smaller or larger than the dimension W7. The extent of dimension W8 may be similar to the extent of dimension W7. Also, the dimension L8 of the second pinching region 36b in the second direction D2 may be equal to the dimension L7 of the first pinching region 36a in the second direction D2. However, it is not limited to this, and the dimension L8 may be smaller or larger than the dimension L7. The extent of dimension L8 may be similar to the extent of dimension L7.

The transport device 60 is a device that transports the mask 20 . The conveying device 60 conveys the mask 20 clamped by the clamping device 50 . As shown in FIG. 6, the transport device 60 may extend in the first direction D1. The conveying device 60 may be configured to linearly move the clamping device 50 and the driving device 53 in the first direction D1. The conveying device 60 can convey the mask 20 clamped by the clamping device 50 from the mounting table 45 to a corresponding position on the frame 15 by linearly moving the clamping device 50 and the driving device 53 in the first direction D1. may be configured to

The welding device 70 is a device that welds and joins the mask 20 to the frame 15 . The welding device 70 welds the mask end portion 30 of the mask 20 transported to a predetermined position on the frame 15 by the transport device 60 to the first frame surface 15a of the frame 15 at the joining portion 31 (see FIG. 16). Welding device 70 may join mask 20 to frame 15 by spot welding. Also, the welding device 70 may be a laser device that irradiates the laser beam L. As shown in FIG. In this case, as the laser light L, for example, a YAG laser light (fundamental wavelength of 1064 nm) generated by a YAG laser device may be used. As the YAG laser device, for example, one having a crystal obtained by adding Nd (neodymium) to YAG (yttrium aluminum garnet) as an oscillation medium may be used. Alternatively, as the laser light L, for example, fiber laser light (wavelength 1070 nm) generated by a Yb fiber laser device may be used.

Next, a method for manufacturing the mask device 10 will be described with reference to FIGS. 10 to 16. FIG.

The method of manufacturing the mask device 10 may include a preparation process, a clamping process, a conveying process, and a fixing process.

First, a preparatory step is performed. The preparation process may include a frame preparation process and a mask preparation process.

In the frame preparation step, first, a metal plate (not shown) is prepared. Next, by subjecting the metal plate to machining such as cutting, the frame 15 including the opening 15d can be obtained. Note that the frame 15 may be produced using a mold or a 3D printer.

In the mask preparation process, the mask 20 described above is prepared. Here, a large number of through-holes 25 corresponding to a plurality of masks 20 are formed in the metal plate 200 . In other words, a plurality of masks 20 are laid out on the metal plate 200 . After that, a portion 210 of the metal plate 200 in which a plurality of through holes 25 corresponding to one mask 20 are formed is separated from the metal plate 200 . In this manner, a sheet-shaped mask 20 can be obtained.

More specifically, first, a resist film containing a photosensitive resist material is formed on the first metal surface 200 a and the second metal surface 200 b of the metal plate 200 . Subsequently, the resist film is exposed and developed. Thereby, as shown in FIG. 10, a first resist pattern 201a is formed on the first metal surface 200a of the metal plate 200, and a second resist pattern 201b is formed on the second metal surface 200b of the metal plate 200. be able to.

Subsequently, as shown in FIG. 11, a first etching step is performed in which a region of the first metal surface 200a of the metal plate 200 not covered with the first resist pattern 201a is etched using a first etchant. . As a result, a large number of first recesses 202 are formed in the first metal surface 200a of the metal plate 200. As shown in FIG. As the first etchant, for example, a ferric chloride solution and a solvent containing hydrochloric acid may be used.

Next, as shown in FIG. 12, a second etching step is performed to etch a region of the second metal surface 200b of the metal plate 200 that is not covered with the second resist pattern 201b using a second etchant. . As a result, a large number of second recesses 203 are formed on the second metal surface 200b of the metal plate 200. As shown in FIG. The second etching process is performed until the first recess 202 and the second recess 203 are connected to form the through hole 25 . As the second etchant, a solvent containing, for example, a ferric chloride solution and hydrochloric acid may be used in the same manner as the first etchant described above. During the second etching step, as shown in FIG. 12, the first concave portion 202 may be covered with a resin 204 that is resistant to the second etchant.

Subsequently, as shown in FIG. 13, the resin 204 is removed from the metal plate 200. Then, as shown in FIG. The resin 204 can be removed by using, for example, an alkaline remover. When an alkaline remover is used, as shown in FIG. 13, the resin 204 and the resist patterns 201a and 201b can be removed at the same time. After removing the resin 204 , the resist patterns 201 a and 201 b may be removed separately from the resin 204 using a stripping solution different from the stripping solution for stripping the resin 204 .

Then, a portion 210 of the metal plate 200 in which a plurality of through holes 25 corresponding to one mask 20 are formed is separated from the metal plate 200 .

After that, as shown in FIG. 14, a mask end portion 30 of the mask 20 is formed. More specifically, the end portion 215 of the portion 210 corresponding to one mask 20 of the metal plate 200 is cut using a cutting device (not shown) along the dashed line DL as shown in FIG. Metal piece 208 is removed. Thereby, the mask end portion 30 including the notch portion 32 and the grip portion 35 (the first grip portion 35a and the second grip portion 35b) can be formed.

In this way, mask 20 can be obtained. The prepared mask 20 is mounted on the mounting table 45 (see FIGS. 6 to 8).

A mask inspection process for inspecting the mask 20 may be performed after the mask edge 30 is formed. In the mask inspection process, for example, it is inspected whether or not the surface of the mask 20 has local deformation or the like.

After the preparation process, the sandwiching process is performed. In the clamping step, the mask 20 is clamped by the clamp device 50 . More specifically, as shown in FIG. 8, the plurality of clamps 51 of the clamping device 50 clamp the corresponding grip portions 35 of the mask 20 mounted on the mounting table 45 . Then, each clamp 51 pulls the mask 20 in the opposite direction to each other in the second direction D2 to apply tension to the mask 20 .

A conveying process is implemented after the clamping process. In the transporting step, the transporting device 60 transports the mask 20 . The transporting process may include a moving process, a position adjusting process, and a contacting process.

First, in the moving step, the clamp device 50 is moved. More specifically, the conveying device 60 linearly moves the clamping device 50 and the driving device 53 in the first direction D1 while the mask 20 is clamped by the clamping device 50 . Then, the mask 20 is conveyed from the mounting table 45 to the corresponding position on the frame 15, and the mask end portion 30 of the mask 20 faces the first frame surface 15a of the frame 15 as shown in FIG. .

Subsequently, the position of the mask 20 with respect to the frame 15 is adjusted in the position adjusting process. More specifically, the position of the mask 20 with respect to the frame 15 is adjusted using the alignment marks 15e of the frame 15 as a reference. Position adjustment is performed by translating the clamping device 50 in the horizontal plane by the conveying device 60 while the clamping device 50 applies tension to the mask 20 .

Next, the mask 20 is brought into contact with the frame 15 in the contacting step. More specifically, the clamping device 50 is moved downward by the conveying device 60 , and with the clamping device 50 applying tension to the mask 20 , the mask edge 30 of the mask 20 is placed against the first frame surface 15 a of the frame 15 . come into contact with

In this manner, the mask 20 can be transferred from the mounting table 45 to the frame 15 .

A fixing process is implemented after a conveying process. In the fixing step, the mask 20 is fixed to the frame 15 . More specifically, as shown in FIG. 16 , while the clamping device 50 is applying tension to the mask 20 , the mask end 30 of the mask 20 is held by the welding device 70 to the first portion of the frame 15 at the joint 31 . It is fixed by welding to the frame surface 15a. If the welding device 70 is a laser device, the mask 20 may be joined to the frame 15 by spot welding using the laser light L.

Each clamp 51 of the clamping device 50 then releases the mask 20 . After the fixing step, a portion of the mask end portion 30 of the mask 20 outside the joint portion 31 may be cut and removed by a cutting device (not shown).

By successively performing such a holding process, a transporting process, and a fixing process for each mask 20, a mask device 10 in which a plurality of masks 20 are fixed to a frame 15 as shown in FIG. 2 can be obtained. .

Next, a method for manufacturing an organic device will be described with reference to FIGS. 17 to 20. FIG. An organic device is manufactured using the vapor deposition apparatus 1 including the mask apparatus 10 described above.

The method for manufacturing an organic device may include a preparation process, a holding process, an adhesion process, and a vapor deposition process.

First, a preparatory step is performed. In the preparation step, as shown in FIG. 17, the vapor deposition apparatus 1 including the vapor deposition source 6 containing the vapor deposition material 7, the heater 8 and the mask device 10 is prepared. The mask device 10 can be obtained by the mask device manufacturing method described above. Here, the mask device 10 is held by the mask holder 3 so as to be positioned above the vapor deposition source 6 .

After the preparation process, a holding process is performed. In the holding step, the substrate 110 is held by the substrate holder 2, as shown in FIG. More specifically, the substrate 110 is held inside the vapor deposition apparatus 1 so as to face the first mask surface 20a of the mask 20 . At this time, the substrate holder 2 may be moved to adjust the position of the substrate 110 with respect to the mask 20 . For example, the position is adjusted by moving the substrate 110 so that the alignment mark (not shown) of the mask 20 or the alignment mark 15e (see FIG. 2) of the frame 15 and the alignment mark (not shown) of the substrate 110 overlap. may be performed.

After the holding process, the close contact process is performed. In the adhesion process, the mask 20 is brought into close contact with the substrate 110 by the magnetic force of the magnet 5 . More specifically, as shown in FIG. 19, the magnet 5 is arranged on the surface of the substrate holder 2 opposite to the mask device 10 . As a result, the mask 20 is drawn toward the substrate 110 by the magnetic force of the magnet 5 , and the first mask surface 20 a of the mask 20 is brought into close contact with the substrate 110 .

After the adhesion process, a vapor deposition process is performed. In the vapor deposition process, the vapor deposition material 7 is vapor-deposited on the substrate 110 . At this time, first, the inside of the vapor deposition apparatus 1 is evacuated by an exhaust means (not shown) so that the inside of the vapor deposition apparatus 1 is in a high vacuum state. Next, the heater 8 heats the evaporation source 6 to evaporate the evaporation material 7 . Then, the vapor deposition material 7 evaporated from the vapor deposition source 6 and reaches the mask device 10 passes through the opening 15 d of the frame 15 and the through hole 25 of the mask 20 and adheres to the substrate 110 .

Thus, the deposition material 7 is deposited on the substrate 110 in a desired pattern corresponding to the positions of the through holes 25 of the mask 20 . As a result, an organic device 100 in which the vapor deposition material 7 adheres to the substrate 110 as shown in FIG. 20 can be obtained.

If the organic device 100 is an organic EL display device, the vapor deposition material 7 corresponding to each color can be deposited on the substrate 110 by repeating the above steps. In this case, a mask device 10 including a mask 20 having through holes 25 corresponding to patterns of each color is used.

Further, in the organic device 100 shown in FIG. 20, other constituent elements including electrodes for applying a voltage to pixels including the vapor deposition material 7 are omitted. Therefore, the organic device 100 shown in FIG. 20 can also be called an intermediate of an organic device.

Next, the effects of this embodiment will be described.

In a general mask device manufacturing apparatus 140, for example, as shown in FIG. The dimensions W13, W14 of the grip portion 135b) may be smaller than 10 mm. In this case, when the mask end portion 130 of the mask 120 is formed during the manufacture of the mask device, the grip portion 135 may be bent and deformed by the force of the cutting device. For this reason, the clamps 151 (the first clamp 151a and the second clamp 151b) of the clamp device 150 may not be able to clamp the corresponding grip portion 135 of the mask 120, which may cause manufacturing defects of the mask device. be.

On the other hand, in another general mask device manufacturing apparatus 240, for example, as shown in FIG. W23/W25 and W24/W26, which are ratios of dimensions W23 and W24 of the grip part 235 (the first grip part 235a and the second grip part 235b) in the first direction D1 to the dimensions W25 and W26 of the second clamp 251b), are 1 may be greater than In this case, during manufacturing of the mask device, when the clamp device 250 pulls the mask 220 in opposite directions in the second direction D2 while the clamps 251 clamp the corresponding grip portions 235 of the mask 220, the mask 220 It may not be possible to apply sufficient tension to the As a result, the mask 220 is wrinkled, and the position of the through-hole of the mask 220 is shifted from the designed position in the vapor deposition process, which may reduce the positional accuracy of the vapor deposition.

On the other hand, according to the present embodiment, in the manufacturing apparatus 40, the dimensions W3 and W4 of the grip portion 35 in the first direction D1 are 10 mm or more, and the dimensions W5 and W6 of the clamp 51 in the first direction D1 are equal to or greater than the dimensions W5 and W6. Ratios W3/W5 and W4/W6 of dimensions W3 and W4 of the grip portion 35 in one direction D1 are 1 or less (see FIGS. 5 and 9). Since the dimensions W3 and W4 of the grip portion 35 in the first direction D1 are 10 mm or more, deformation of the grip portion 35 when forming the mask end portion 30 of the mask 20 during manufacturing of the mask device 10 can be prevented. can be suppressed. Therefore, the occurrence of manufacturing defects in the mask device 10 can be suppressed. Further, the ratios W3/W5 and W4/W6 of the dimensions W3 and W4 of the grip portion 35 in the first direction D1 to the dimensions W5 and W6 of the clamp 51 in the first direction D1 are 1 or less, so that the mask device 10 can be manufactured. At times, sufficient tension may be applied to the mask 20 as the clamping device 50 pulls the mask 20 through each clamp 51 . Therefore, wrinkles on the mask 20 can be suppressed. As a result, it is possible to prevent the positions of the through-holes 25 of the mask 20 from deviating from the designed positions, and to prevent the positional accuracy of deposition from being lowered. Thus, according to this embodiment, the reliability of the mask device 10 can be improved.

Further, in still another general mask device manufacturing apparatus 340, for example, as shown in FIG. When holding 335 (the first grip portion 335a and the second grip portion 335b), the edge portion 320s of the mask 320 in the first direction D1 may not be held. In this case, when the mask device is manufactured, the edge 320s of the mask 320 in the first direction D1 is turned up by the pressing force of each clamp 351 while the corresponding grip portion 335 is held by each clamp 351. can be transformed into For this reason, when welding the mask end portion 330 of the mask 320 to the frame, the adhesion between the mask 320 and the frame may deteriorate, resulting in poor welding.

In contrast, according to the present embodiment, the clamp 51 clamps at least the edge 20s of the mask 20 in the first direction D1 (see FIG. 9). As a result, when the mask device 10 is manufactured, the edge 20s of the mask 20 in the first direction D1 is deformed by the pressing force of each clamp 51 while the corresponding grip portion 35 is held by each clamp 51. can be suppressed. Therefore, the occurrence of welding defects can be suppressed. As a result, the reliability of the mask device 10 can be improved.

Further, in still another general mask device manufacturing apparatus 440, for example, as shown in FIG. The corresponding grip portion 435 (first grip portion 435a and second grip portion 435b) is sandwiched at a position overlapping the semicircular portion 432b of the notch portion 432 or at a position inside the semicircular portion 432b. Sometimes. In this case, due to the pressing force of each clamp 451, wrinkles may occur in a region R4 (see FIG. 24) of the mask 420 between the first clamp 451a and the second clamp 451b in the first direction D1. If the wrinkles extend to the effective area of the mask 420, the position of the through-holes in the mask 420 may deviate from the design position in the vapor deposition process, and the positional accuracy of vapor deposition may be lowered.

In contrast, according to the present embodiment, the clamp 51 clamps the grip portion 35 at a position closer to the edge 30e of the mask edge portion 30 in the second direction D2 than the semicircular portion 32b of the notch portion 32. (See FIG. 9). As a result, during the manufacturing of the mask device 10, it is possible to prevent the mask 20 from wrinkling due to the pressing force of each clamp 51 while the corresponding grip portion 35 is held by each clamp 51. can. Therefore, it is possible to prevent the positions of the through-holes 25 of the mask 20 from deviating from the designed positions, and to prevent the positional accuracy of deposition from being lowered.

In particular, according to the present embodiment, the clamp 51 holds the grip portion 35 at a position closer to the edge 30e of the mask edge portion 30 in the second direction D2 than the central position 32c of the linear portion 32a in the second direction D2. It is sandwiched (see FIG. 9). As a result, it is possible to more effectively suppress wrinkles in the mask 20 . Therefore, it is possible to further suppress the deviation of the positions of the through-holes 25 of the mask 20 from the designed positions, and to further suppress the deterioration of positional accuracy of vapor deposition.

Further, according to the present embodiment, the dimensions W7 and W8 of the pinching areas 36a and 36b in the first direction D1 are larger than the dimensions L7 and L8 of the pinching areas 36a and 36b in the second direction D2 (see FIG. 9). . Since the clamping regions 36a and 36b are wide in this manner, sufficient tension can be applied to the mask 20 when the mask 20 is pulled by the clamps 51 of the clamping device 50 during manufacturing of the mask device 10. It is possible to prevent the mask 20 from wrinkling. In addition, since the clamping regions 36a and 36b are short in this way, while each clamp 51 clamps the corresponding grip portion 35, the mask 20 is wrinkled by the pressing force of each clamp 51. can be suppressed. Therefore, it is possible to prevent the positions of the through-holes 25 of the mask 20 from deviating from the designed positions, and to prevent the positional accuracy of deposition from being lowered.

In addition, in the embodiment described above, an example in which the plurality of grip portions 35 includes the first grip portion 35a and the second grip portion 35b has been described. However, the present invention is not limited to this, and the number of grip portions 35 is arbitrary. For example, as shown in FIG. 25, the plurality of grip portions 35 may include a first grip portion 35a, a second grip portion 35b, and a third grip portion 35c.

In the example shown in FIG. 25, mask edge 30 includes a plurality of notches 32 . The plurality of cutouts 32 include a first cutout 32X and a second cutout 32Y. The plurality of grip portions 35 are arranged in the first direction D1 via these notch portions 32 . More specifically, the first grip portion 35a and the second grip portion 35b are arranged in the first direction D1 via the first notch portion 32X, and the second grip portion 35b and the third grip portion 35c are arranged in the second direction D1. They are arranged in the first direction D1 via the notch 32Y.

Also, in the example shown in FIG. 25, the plurality of clamps 51 includes a first clamp 51a, a second clamp 51b, and a third clamp 51c. A plurality of clamps 51 clamp corresponding grip portions 35 of mask 20 . More specifically, the first clamp 51a clamps the first grip portion 35a of the mask 20, the second clamp 51b clamps the second grip portion 35b of the mask 20, and the third clamp 51c clamps the mask 20. The third grip portion 35c of is sandwiched.

Even in such a case, since the dimension of the grip part 35 in the first direction D1 is 10 mm or more, deformation of the grip part 35 can be suppressed during manufacturing of the mask device 10, and the mask can be The occurrence of manufacturing defects in the device 10 can be suppressed. In addition, since the ratio of the dimension of the grip portion 35 in the first direction D1 to the dimension of the clamp 51 in the first direction D1 is 1 or less, wrinkles in the mask 20 are suppressed when the mask device 10 is manufactured. be able to. Therefore, it is possible to prevent the positions of the through-holes 25 of the mask 20 from deviating from the designed positions, and to prevent the positional accuracy of deposition from being lowered. As a result, the reliability of the mask device 10 can be improved.

It should be noted that the plurality of grips 35 may include more grips 35 such as a fourth grip and a fifth grip without being limited to the example described above. In this case, the plurality of cutouts 32 may also include more cutouts 32 such as a third cutout and a fourth cutout. Moreover, the plurality of clamps 51 may also include more clamps 51 such as a fourth clamp, a fifth clamp, or the like.

Next, the embodiment of the present disclosure will be described in more detail with reference to an example, but the embodiment of the present disclosure is not limited to the description of the example below as long as it does not exceed the gist thereof.

First, as an example, the deformation of the grip portion 35 and the positional accuracy of the through hole 25 were evaluated when the width dimensions W3 and W4 of the grip portion 35 were changed.

More specifically, first, a plurality of masks 20 were prepared. In each mask 20, the length dimension L1 (see FIG. 2) of the mask 20 was 1200 mm. The width dimension W1 (see FIG. 2) of the mask 20 was changed within the range of 28 mm or more and 200 mm or less. The thickness T of each mask 20 was 30 μm.

A notch 32 was formed in the mask edge 30 of each mask 20 . As shown in FIG. 5, an edge portion 32e of the notch portion 32 has a substantially U-shape in plan view, and the notch portion 32 has a linear portion 32a and a semicircular portion 32b. was In each mask 20, the width dimension W2 of the linear portion 32a was 20 mm. The length dimension L2 of the linear portion 32a was 10 mm. The length dimension L3 of the semicircular portion 32b was 10 mm.

By forming the notch portion 32 in the mask end portion 30 of each mask 20, as shown in FIG. 2 grip portion 35b) was formed. In each mask 20, the width dimension W3 of the first grip portion 35a was changed within the range of 4 mm or more and 90 mm or less (see FIG. 26). The width dimension W4 of the second grip portion 35b is the same as the width dimension W3 of the first grip portion 35a.

Subsequently, as shown in FIG. 9, the corresponding grip portion 35 of each mask 20 was clamped by the clamp 51 of the clamp device 50 . That is, the first grip portion 35a of each mask 20 was clamped by the first clamp 51a, and the second grip portion 35b of each mask 20 was clamped by the second clamp 51b. The width dimension W5 of the first clamp 51a was 30 mm. The width dimension W6 of the second clamp 51b was 30 mm, like the width dimension W5 of the first clamp 51a.

Since the width dimension W5 of the first clamp 51a is 30 mm, when the width dimension W3 (see FIG. 5) of the first grip portion 35a is smaller than 30 mm, the width dimension W7 of the first clamping region 36a is equal to that of the first grip portion. It was the same as the width dimension W3 of 35a. Further, when the width dimension W3 (see FIG. 5) of the first grip portion 35a was 30 mm or more, the width dimension W7 of the first holding region 36a was 30 mm. The length dimension L7 of the first pinching area 36a was 8 mm. The width dimension W8 of the second clamping region 36b was the same as the width dimension W7 of the first clamping region 36a. The length dimension L8 of the second clamping region 36b was 8 mm, like the length dimension L7 of the second clamping region 36b. Further, when the grip portion 35 is clamped by the clamp 51, at least the edge portion 20s of the mask 20 in the first direction D1 is clamped (see FIG. 9).

First, each mask 20 was evaluated as to whether or not the grip portion 35 was deformed. FIG. 26 shows evaluation results of deformation of the grip portion 35 with respect to the width dimension W3 of the grip portion 35 of each mask 20 . In the column of evaluation items for “deformation of grip portion” in FIG. 26, “◯” indicates that no deformation was observed, and “△” indicates that deformation was observed although clamping was possible. , "X" indicates that a large deformation was observed that made it impossible to clamp with a clamp.

As shown in FIG. 26, when the width dimension W3 of the grip portion 35 is 7.5 mm or less, the grip portion 35 is deformed, and when the width dimension W3 of the grip portion 35 is 6 mm or less, the grip portion 35 was deformed to the extent that clamping by the clamp 51 was impossible. On the other hand, when the width dimension W5 of the grip portion 35 was 10 mm or more, the grip portion 35 was not deformed.

Next, each mask 20 that could be clamped by the clamp 51 (the mask 20 whose width W5 of the grip part 35 is 7 mm or more) was fixed to the frame 15 to obtain the mask device 10 corresponding to each mask 20. . More specifically, first, each clamp 51 pulled the mask 20 to the opposite sides in the second direction D2 to apply tension to the mask 20 . Then, while tension was applied to the mask 20 by the clamp device 50 , the mask 20 was transferred onto the frame 15 by the transfer device 60 , and the mask edge 30 of the mask 20 was welded to the frame 15 by the welding device 70 .

After that, the positional accuracy of the through-holes 25 of the mask 20 in each mask device 10 was evaluated. More specifically, the position of the through hole 25 of each mask 20 fixed to the frame 15 was measured, and the positional deviation amount was calculated from the difference between the measured position and the designed position. Nine evaluation points were set for one effective region 22 of each mask 20 at arbitrary positions of through-holes 25 within the effective region 22 . The amount of positional deviation was calculated as the standard deviation of the variation in the difference between the measured position and the design position at all evaluation points.

FIG. 26 shows evaluation results of positional accuracy of the through holes 25 of each mask 20 . FIG. 26 shows each value of W3/W5, which is the ratio of the width dimension W3 of the grip portion 35 to the width dimension W5 of the clamp 51, and the evaluation result of the positional accuracy of the through hole 25 with respect to each W3/W5. there is In the column of evaluation items for "positional accuracy of through-holes" in FIG. It shows that it was within ±5 micrometers, and "x" has shown that the positional deviation amount was larger than ±5 micrometers.

As shown in FIG. 26, when W3/W5 is 1.07 or more, the positional deviation amount is greater than ±3 μm, and when W3/W5 is 1.27 or more, the positional deviation is greater than ±5 μm. The amount of deviation is shown. On the other hand, when W3/W5 was 1 or less, the positional deviation amount was within ±3 μm.

As another example, the deformation of the mask 20 was evaluated when the clamping position of the clamp 51 was changed.

More specifically, first, a plurality of masks 20 having the same dimensions were prepared. Subsequently, for each mask 20, the grip portion 35 was held by the clamp 51 while changing the dimension ΔW (see FIG. 23) between the clamp 51 and the edge 20s of the mask 20 in the first direction D1. Next, tension was applied to the mask 20 by the clamp 51 and the mask 20 was transported onto the frame 15 by the transport device 60 . Then, an attempt was made to weld the mask end portion 30 of each mask 20 to the frame 15 using the welding device 70 . At that time, for each mask 20 whose clamping position was changed, it was evaluated whether or not the edge 20s of the mask 20 was deformed so as to be turned up, and whether or not the mask 20 could be normally welded to the frame 15 was evaluated. .

Here, in each mask 20, the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 was changed in increments of 1 mm within a range of −3 mm or more and 3 mm or less (see FIG. 27). The dimension ΔW being “− (minus)” means that the clamp 51 clamps the edge 20s of the mask 20 and extends beyond the edge 20s of the mask 20 . For example, a dimension ΔW of “−3 mm” means that the position of the clamp 51 exceeds the edge 20s of the mask 20 by 3 mm in the first direction D1.

In each mask 20, the length dimension L1 (see FIG. 2) of the mask 20 was 1200 mm. The width dimension W1 (see FIG. 2) of the mask 20 was 80 mm. The thickness T of each mask 20 was 30 μm. The width dimension W2 (see FIG. 5) of the linear portion 32a of the notch portion 32 was 20 mm. The length dimension L2 (see FIG. 5) of the linear portion 32a of the notch portion 32 was 10 mm. The length L3 (see FIG. 5) of the semicircular portion 32b of the notch 32 was 10 mm. The width dimensions W3 and W4 (see FIG. 5) of the grip portion were 30 mm. Moreover, the width dimensions W5 and W6 (see FIG. 9) of the clamp 51 were 30 mm. The length dimensions L7 and L8 (see FIG. 9) of the clamping area 36 were 8 mm.

FIG. 27 shows the deformation of the edge 20s of the mask 20 with respect to the dimension ΔW (see FIG. 23) between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 and whether the mask 20 can be welded to the frame 15. Evaluation results are shown. In the column of evaluation items for "edge deformation" in FIG. 27, "no" indicates that the edge 20s of the mask 20 was not deformed, and "yes" indicates that the edge 20s of the mask 20 was turned up. It shows that such deformation was observed. In addition, in the column of evaluation items for "welding", "o" indicates that the mask 20 was normally welded to the frame 15, and "x" indicates that welding failure occurred between the mask 20 and the frame 15. is shown.
As shown in FIG. 27, when the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 is 1 mm or more, the edge 20s of the mask 20 is deformed to be turned up. , a welding defect occurred between the mask 20 and the frame 15 . On the other hand, when the dimension ΔW between the clamp 51 and the edge 20s of the mask 20 in the first direction D1 is 0 mm or less, that is, when the clamp 51 clamps at least the edge 20s of the mask 20, No deformation was observed in the edge 20s of the mask 20, and the mask 20 could be normally welded to the frame 15.

Claims (14)

A manufacturing apparatus for a mask device,
a mask having a longitudinal direction and a lateral direction;
and a clamping device that clamps the mask,
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The dimension of the grip portion in the lateral direction is 10 mm or more,
The apparatus for manufacturing a mask device, wherein a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less. 2. The apparatus for manufacturing a mask device according to claim 1, wherein said clamp clamps at least an edge of said mask in said lateral direction. The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. a semi-circular portion;
3. The apparatus for manufacturing a mask device according to claim 1, wherein said clamp clamps said grip portion at a position closer to said edge than said semicircular portion. 4. The apparatus for manufacturing a mask device according to claim 3, wherein said clamp clamps said grip portion at a position closer to said edge than a central position of said linear portion in said longitudinal direction. The grip portion includes a clamping region that is clamped by the clamp,
5. The apparatus for manufacturing a mask device according to claim 1, wherein a dimension of said clamping region in said lateral direction is larger than a dimension of said clamping region in said longitudinal direction. A manufacturing apparatus for a mask device,
a mask having a longitudinal direction and a lateral direction;
and a clamping device that clamps the mask,
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The grip portion includes a clamping region that is clamped by the clamp,
The apparatus for manufacturing a mask device, wherein a dimension of the clamping region in the lateral direction is larger than a dimension of the clamping region in the longitudinal direction. A mask having a longitudinal direction and a lateral direction and clamped by a clamping device,
a pair of mask end portions located on both sides in the longitudinal direction;
a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes;
The mask edge includes a notch formed by notching the mask edge and a plurality of grip portions arranged in the lateral direction via the notch and protruding in the longitudinal direction. a grip portion clamped by corresponding clamps of the device;
The dimension of the grip portion in the lateral direction is 10 mm or more,
The mask, wherein a ratio of the dimension of the grip portion in the lateral direction to the dimension of the clamp in the lateral direction is 1 or less. The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. 8. The mask of claim 7, comprising a semi-circular portion. A method for manufacturing a mask device,
providing a mask having a longitudinal direction and a lateral direction;
a step of clamping the mask with a clamp device;
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
The dimension of the grip portion in the lateral direction is 10 mm or more,
A method of manufacturing a mask device, wherein a ratio of a dimension of the grip portion in the lateral direction to a dimension of the clamp in the lateral direction is 1 or less. 10. The method of manufacturing a mask device according to claim 9, wherein in the step of clamping the mask, the clamp clamps at least an edge of the mask in the lateral direction. The notch portion includes a linear portion extending linearly in the longitudinal direction from an edge of the mask end portion in the longitudinal direction, and adjacent to the linear portion on the side opposite to the edge in the longitudinal direction. a semi-circular portion;
11. The method of manufacturing a mask device according to claim 9, wherein in the step of clamping the mask, the clamp clamps the grip portion at a position closer to the edge than to the semicircular portion. 12. The method of manufacturing a mask device according to claim 11, wherein in the step of clamping the mask, the clamp clamps the grip portion at a position closer to the edge than a central position of the linear portion in the longitudinal direction. . In the step of pinching the mask, the pinching region of the grip portion is pinched by the clamp,
13. The method of manufacturing a mask device according to claim 9, wherein a dimension of said clamping region in said lateral direction is larger than a dimension of said clamping region in said longitudinal direction. A method for manufacturing a mask device,
providing a mask having a longitudinal direction and a lateral direction;
a step of clamping the mask with a clamp device;
The mask includes a pair of mask end portions located on both sides in the longitudinal direction, and a mask intermediate portion located between the pair of mask end portions and including a plurality of through holes,
The mask end includes a notch formed by notching the mask end, and a plurality of grips arranged in the lateral direction via the notch and protruding in the longitudinal direction,
The clamping device includes a plurality of clamps that clamp the corresponding grips,
In the step of pinching the mask, the pinching region of the grip portion is pinched by the clamp,
The method of manufacturing a mask device, wherein the width of the clamping region in the lateral direction is larger than the dimension of the clamping region in the longitudinal direction.