JP2023107769A - Resin sheet, method for using resin sheet, and method for manufacturing curable sealed body with curable resin layer - Google Patents

Abstract

To provide a resin sheet which improves productivity and enables manufacture of a curable sealed body with a curable resin layer that suppresses warpage and has a flat surface.SOLUTION: A resin sheet has a base material, and a thermosetting resin layer formed of a thermosetting resin composition containing a polymerizable component (A) and a thermosetting component (B), in this order, has a storage elastic modulus E' at 23°C of the curable resin layer obtained by thermosetting the thermosetting resin layer of 1.0×107 to 1.0×1013 Pa, and is used in manufacture of a curable sealed body which includes: mounting a sealing object on the surface of the thermosetting resin layer; covering the sealing object and the surface of the thermosetting resin layer in at least the peripheral part of the sealing object with a sealing material; thermosetting the sealing material into a curable sealed body containing the sealing object; thermosetting the thermosetting resin layer into a curable resin layer; and removing the curable sealed body with the curable resin layer from the base material after the thermosetting the sealing material and the thermosetting resin layer.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a resin sheet, a method for using the resin sheet, and a method for manufacturing a cured sealing body with a cured resin layer using the resin sheet.

In recent years, with the miniaturization and sophistication of electronic devices, further miniaturization, sophistication, and improved reliability have been demanded of semiconductor packages.
Wafer level package (WLP) technology, which is one of the technologies that can meet such demands, forms external electrodes and the like on the chip circuit formation surface before singulating by dicing, and finally the chip It is a technology for realizing a surface-mountable chip scale package (CSP) that can be miniaturized to the same scale as a semiconductor chip by dicing a package containing

WLP is divided into Fan-In type and Fan-Out type.
In the Fan-Out type WLP, a semiconductor chip, which is an object to be sealed, is covered with a sealing material so as to have a region larger than the size of the semiconductor chip to form a semiconductor chip sealing body, and then the semiconductor chip sealing body is formed again. Wiring layers and external electrodes are formed not only on the circuit surface of the semiconductor chip but also on the surface region of the sealing material.

For example, in Patent Document 1, a plurality of semiconductor chips separated from a semiconductor wafer are surrounded by a molding member, which is a sealing resin, to form an extended wafer, leaving the circuit forming surface thereof, and forming a semiconductor chip. A method of manufacturing a semiconductor package is described in which a rewiring pattern is formed by extending it to a region outside the chip.
In addition, in the manufacturing method described in Patent Document 1, the silicon wafer is attached to a wafer mount tape for dicing and subjected to a dicing process. After that, it is replaced with a wafer mount tape for expansion, and subjected to a tape expansion step of extending the wafer mount tape (support tape) to increase the distance between the plurality of silicon chips.

WO2010/058646

By the way, in the manufacture of a Fan-Out type WLP as described in Patent Document 1, a semiconductor chip, which is an object to be sealed, is covered with a sealing material, and the sealing material is thermally cured by heating. It is common to have a step of sealing to form a cured seal.
However, when the cured sealing body obtained by thermosetting the sealing material is separated from the adhesive tape such as the wafer mount tape that is fixed to the support, the cured sealing body after separation is caused by heat shrinkage. Warpage may occur.
A hardened sealing body that is warped and has an uneven surface tends to cause problems such as cracking when the hardened sealing body is ground in the next step. When the body is transported by the device, problems are likely to occur when the hardened sealing body is delivered by the arm.

Further, in some cases, a resin film is further provided on one surface of the cured sealing body to form a cured sealing body with a resin film.
In order to manufacture such a cured sealing body with a resin film, a separately prepared resin film forming sheet is usually attached to one surface of the formed cured sealing body, and the resin film forming sheet is cured. It is necessary to go through a step of forming a resin film by allowing the
In addition, as described above, the cured sealing body is likely to warp during manufacturing. There is also concern about a decrease in the adhesion between the resin film and the cured sealant.
Furthermore, in some cases, the resulting cured sealing body with a resin film may be warped further, which may cause various problems in the next step.

The present invention provides a resin sheet used for manufacturing a cured sealing body, which suppresses warpage and has a flat surface, and which can be manufactured with improved productivity. The purpose is to

The present inventors prepared a resin sheet having a thermosetting resin layer formed from a thermosetting resin composition containing a polymerizable component and a thermosetting component, and placed an object to be sealed on the surface of the thermosetting resin layer. The present inventors have found that the above problems can be solved by placing, covering with a sealing material, curing, and using it for manufacturing a cured sealing body containing an object to be sealed.

That is, the present invention relates to the following [1] to [9].
[1] having a thermosetting resin layer formed from a thermosetting resin composition containing a polymerizable component (A) and a thermosetting component (B),
An object to be sealed is placed on the surface of the thermosetting resin layer, and the object to be sealed and at least the surface of the thermosetting resin layer in the periphery of the object to be sealed are covered with a sealing material. and thermosetting the encapsulating material to obtain a cured encapsulant containing the object to be sealed.
[2] The resin sheet according to [1] above, wherein the thermosetting resin layer is also cured to form a cured resin layer when the sealing material is cured.
[3] The resin sheet according to [1] or [2] above, wherein the content of the colorant in the thermosetting resin composition is less than 8% by mass.
[4] The above [1], wherein the cured resin layer obtained by thermosetting the thermosetting resin layer has a storage elastic modulus E′ at 23° C. of 1.0×10 ⁷ to 1.0×10 ¹³ Pa. The resin sheet according to any one of [3].
[5] The resin sheet according to any one of [1] to [4] above, wherein the thermosetting resin layer has a thickness of 1 to 500 μm.
[6] A method for using the resin sheet according to any one of [1] to [5] above,
placing an object to be sealed on the surface of the thermosetting resin layer;
covering the object to be sealed and the surface of the thermosetting resin layer at least in the periphery of the object to be sealed with a sealing material;
thermosetting the sealing material to form a cured sealing body containing the sealing object;
How to use the resin sheet.
[7] When the sealing material is thermoset, the thermosetting resin layer is also thermoset to form a cured resin layer to form a cured sealing body with a thermosetting resin layer, above [6] A method of using the resin sheet described in .
[8] A method for producing a cured sealing body with a cured resin layer using the resin sheet according to any one of [1] to [5] above, comprising the following steps (i) to (iii): A method for producing a cured sealing body with a cured resin layer.
• Step (i): placing an object to be sealed on a portion of the surface of the thermosetting resin layer of the resin sheet.
• Step (ii): a step of covering the object to be sealed and at least the surface of the thermosetting resin layer in the periphery of the object to be sealed with a sealing material.
- Step (iii): thermosetting the sealing material to form a cured sealing body containing the sealing object, and also thermosetting the thermosetting resin layer to form a cured resin layer; A step of obtaining a cured sealing body with a cured resin layer.

By using the resin sheet of the present invention for manufacturing a cured sealant, it is possible to manufacture a cured sealant having a flat surface by suppressing warpage with improved productivity.

1 is a schematic cross-sectional view of a resin sheet, showing the configuration of the resin sheet of one embodiment of the present invention; FIG. It is a cross-sectional schematic diagram which showed the process of manufacturing the cured sealing body with a cured resin layer using the resin sheet 1d shown in FIG.1(d).

As used herein, the term “active ingredient” refers to the components contained in the target composition, excluding the diluent solvent.
In the present specification, the mass average molecular weight (Mw) is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically a value measured based on the method described in Examples. is.
In this specification, for example, "(meth)acrylic acid" indicates both "acrylic acid" and "methacrylic acid", and the same applies to other similar terms.
In this specification, for preferred numerical ranges (for example, ranges of content etc.), the lower and upper limits described stepwise can be independently combined. For example, from the statement "preferably 10 to 90, more preferably 30 to 60", combining "preferred lower limit (10)" and "more preferred upper limit (60)" to "10 to 60" can also

[Structure of resin sheet]
The resin sheet of the present invention has a thermosetting resin layer formed from a thermosetting resin composition containing a polymerizable component (A) and a thermosetting component (B).
The resin sheet of one embodiment of the present invention may be a sheet having a single-layer structure consisting only of a thermosetting resin layer, or a multi-layer structure having a layer other than the thermosetting resin layer together with the thermosetting resin layer. It may be a sheet of

FIG. 1 is a schematic cross-sectional view of the resin sheet, showing the structure of the resin sheet of one embodiment of the present invention.
A resin sheet of one embodiment of the present invention includes a resin sheet 1a having a substrate 20 and a thermosetting resin layer 10, as shown in FIG. 1(a). By using a resin sheet having a base material like the resin sheet 1a, the self-supporting property can be improved and the handleability can be improved.

Further, in order to improve the adhesion between the base material 20 and the thermosetting resin layer 10, the base material 20, the adhesive layer 30, and the thermosetting resin are used as in the resin sheet 1b shown in FIG. A resin sheet in which the layers 10 are laminated in this order may be used.
The resin sheet 1b may have a configuration in which a release material is further laminated on the adhesive surface of the adhesive layer 30 .

Moreover, as a resin sheet according to another aspect of the present invention, there is a resin sheet 1c having a thermosetting resin layer 10 and an adhesive layer 30, as shown in FIG. 1(c).
By having the adhesive layer 30 like the resin sheet 1c, the resin sheet can be sufficiently fixed to a support or the like, and workability in the sealing process can be improved.

In addition, as in the resin sheet 1d shown in FIG. good too.
By adopting a configuration like the resin sheet 1d, the resin sheet can be sufficiently fixed to a support or the like, and the adhesion between the substrate 20 and the thermosetting resin layer 10 can be improved. Workability in the sealing step can be improved.
The resin sheet 1 d may have a configuration in which a release material is further laminated on the adhesive surface of the second adhesive layer 32 .

From the viewpoint of protecting the surface of the thermosetting resin layer, the resin sheet of one embodiment of the present invention may further have a release material on the surface of the thermosetting resin layer.
For example, the resin sheet of one embodiment of the present invention may have a configuration in which a thermosetting resin layer is sandwiched between two release materials. A release material may be further laminated on the exposed surface of the flexible resin layer 10 .
This release material is provided to protect the surface of the thermosetting resin layer, and is removed when the resin sheet is used.

[Uses of resin sheets]
In the resin sheet of the present invention, a sealing object is placed on the surface of the thermosetting resin layer, and the sealing object and the surface of the thermosetting resin layer at least around the sealing object is coated with a sealing material, the sealing material is thermally cured, and a cured sealed body including the sealing object is used for manufacturing a cured sealed body.
In addition, a specific aspect regarding the production of a cured sealing body using the resin sheet of the present invention is as described later.

For example, as used in the manufacturing method described in Patent Document 1, after placing the sealing object on the adhesive surface of an adhesive sheet such as a general wafer mount tape, the sealing object and its peripheral part Consider the case where the adhesive surface of is coated with a sealing material and the sealing material is thermally cured to produce a cured sealed body.
When the encapsulating material is thermally cured, stress acts to cause the encapsulating material to shrink, but since the adhesive sheet is fixed to the support, the stress of the encapsulating material is suppressed.
However, it is difficult to suppress the shrinkage stress of the cured sealing body obtained by separating from the support and the pressure-sensitive adhesive sheet. In the cured sealing body after separation, since the amount of the sealing material differs between the surface side on which the sealing object exists and the opposite surface side, a difference in shrinkage stress is likely to occur. The difference in shrinkage stress causes warping of the cured encapsulant.
Moreover, from the viewpoint of productivity, the cured sealing body after heating is generally separated from the support and the pressure-sensitive adhesive sheet while being heated to some extent. Therefore, even after the separation, the curing of the sealing material progresses and shrinkage occurs due to natural cooling, so that the cured sealing body is more likely to warp.

On the other hand, when the resin sheet of the present invention is used, it is possible to obtain a cured sealing body that effectively suppresses warping for the following reasons.
That is, when an object to be sealed is placed on the surface of the thermosetting resin layer of the resin sheet of the present invention, covered with a sealing material, and the sealing material is thermally cured, the thermosetting resin layer is also Heat hardens. At this time, since the thermosetting resin layer is provided on the surface side of the object to be sealed, which is considered to have less shrinkage stress due to curing of the sealing material because the amount of the sealing material is small. , contraction stress due to thermosetting of the thermosetting resin layer acts.
As a result, it is thought that the difference in shrinkage stress between the two surfaces of the cured sealing body can be reduced, and a cured sealing body in which warpage is effectively suppressed can be obtained.

In addition, the thermosetting resin layer that contributes to suppressing the warp of the hardened sealing body can be turned into a hardened resin layer by thermosetting. This cured resin layer has a function as a protective film.
That is, by using the resin sheet of the present invention and going through the above-described sealing step, a cured resin layer can be formed on one surface of the cured sealing body at the same time, so that the cured resin layer is formed. It is possible to omit the process for the above, which also contributes to the improvement of productivity.

Each layer included in the resin sheet of one embodiment of the present invention is described below.

<Thermosetting resin layer>
The resin sheet of the present invention has a thermosetting resin layer formed from a thermosetting resin composition containing a polymerizable component (A) and a thermosetting component (B).
The thermosetting resin layer is thermally cured together with the sealing material when the sealing material is thermally cured to reduce the difference in shrinkage stress between the two surfaces of the cured sealing body, resulting in a cured sealing body. Contributes to suppressing warpage that can occur in
Also, the thermosetting resin layer is thermoset to become a cured resin layer. The cured resin layer is formed on one surface of the resulting cured sealing body and has a function as a protective film.

From the viewpoint of suppressing warping and making it possible to manufacture a cured sealing body having a flat surface, the storage elastic modulus E' at 23 ° C. of the cured resin layer obtained by thermosetting the thermosetting resin layer is preferably 1.0×10 ⁷ Pa or more, more preferably 1.0×10 ⁸ Pa or more, still more preferably 1.0×10 ⁹ Pa or more, still more preferably 5.0×10 ⁹ Pa or more, Also, the pressure is preferably 1.0×10 ¹³ Pa or less, more preferably 1.0×10 ¹² Pa or less, still more preferably 5.0×10 ¹¹ Pa or less, and even more preferably 1.0×10 ¹¹ Pa or less. be.
In addition, in this specification, storage elastic modulus E' means the value measured based on the method as described in an Example.

Since the object to be sealed is placed on the surface of the thermosetting resin layer, the surface of the thermosetting resin layer may have adhesiveness from the viewpoint of good adhesion to the object to be sealed. preferable.
Also, regarding the surface of the thermosetting resin layer opposite to the side on which the sealing object is placed, the adhesiveness to the support, etc. From the viewpoint of improving the adhesion to the material, it is preferable to have adhesiveness.

The adhesive force on the surface of the thermosetting resin layer at room temperature (23° C.) is preferably 0.01 to 5 N/25 mm, more preferably 0.05 to 4 N/25 mm, still more preferably 0.1 to 3 N/ 25 mm.
In addition, in this specification, the adhesive force on the surface of the thermosetting resin layer means a value measured by the method described in Examples.

In the resin sheet of one aspect of the present invention, the thermosetting resin layer preferably has a thickness of 1 to 500 μm, more preferably 5 to 300 μm, even more preferably 10 to 200 μm, still more preferably 15 to 100 μm.

In the present invention, the thermosetting resin layer is a layer formed from a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B).
However, the thermosetting resin composition may further contain one or more selected from a coloring agent (C), a coupling agent (D), and an inorganic filler (E), which suppresses warping. At least the inorganic filler (E) is preferably contained from the viewpoint of making the resin sheet capable of producing a cured sealing body having a flat surface.

(Polymer component (A))
The polymer component (A) contained in the thermosetting resin composition means a compound having a mass average molecular weight of 20,000 or more and having at least one type of repeating unit.
By containing the polymerizable component (A), the thermosetting resin composition can impart flexibility and film-forming properties to the thermosetting resin layer to be formed, and can improve sheet property retention. can.
The mass average molecular weight (Mw) of the polymer component (A) is preferably 20,000 or more, more preferably 20,000 to 3,000,000, still more preferably 50,000 to 2,000,000, even more preferably 100,000 to 1,500,000, and more It is more preferably 200,000 to 1,000,000.

The content of the polymer component (A) is preferably 5 to 50% by mass, more preferably 8 to 40% by mass, more preferably 8 to 40% by mass, relative to the total amount (100% by mass) of the active ingredients of the thermosetting resin composition. is 10 to 30% by mass.

Examples of the polymer component (A) include acrylic polymers, polyesters, phenoxy resins, polycarbonates, polyethers, polyurethanes, polysiloxanes, rubber polymers and the like.
These polymer components (A) may be used alone or in combination of two or more.
In this specification, the acrylic polymer having an epoxy group and the phenoxy resin having an epoxy group have thermosetting properties. Any compound having a repeating unit of is included in the concept of the polymer component (A).

Among these, the polymer component (A) preferably contains the acrylic polymer (A1).
The content of the acrylic polymer (A1) in the polymer component (A) is preferably 60 to 60% with respect to the total amount (100% by mass) of the polymer component (A) contained in the thermosetting resin composition. 100 mass %, more preferably 70 to 100 mass %, still more preferably 80 to 100 mass %, still more preferably 90 to 100 mass %.

(Acrylic polymer (A1))
The mass average molecular weight (Mw) of the acrylic polymer (A1) is preferably 20,000 to 3,000,000, more preferably 10,000, from the viewpoint of imparting flexibility and film-forming properties to the thermosetting resin layer to be formed. 10,000 to 1,500,000, more preferably 150,000 to 1,200,000, and even more preferably 250,000 to 1,000,000.

The glass transition temperature (Tg) of the acrylic polymer (A1) is the viewpoint of imparting good adhesiveness to the surface of the thermosetting resin layer to be formed, and the cured resin layer produced using the resin sheet. From the viewpoint of improving the reliability of the cured sealing body with a be.

Examples of the acrylic polymer (A1) include polymers containing an alkyl (meth)acrylate as a main component, specifically an alkyl (meth)acrylate (a1′) having an alkyl group having 1 to 18 carbon atoms. (hereinafter also referred to as "monomer (a1')") is preferably an acrylic polymer containing a structural unit (a1) derived from the structural unit (a1) together with a functional group-containing monomer (a2') (hereinafter referred to as "monomer ( a2′)”) is more preferred.
The acrylic polymer (A1) may be used alone or in combination of two or more.
When the acrylic polymer (A1) is a copolymer, the form of the copolymer may be block copolymer, random copolymer, alternating copolymer, or graft copolymer. good.

The number of carbon atoms in the alkyl group of the monomer (a1') is preferably 1 to 18, more preferably 1 to 12, from the viewpoint of imparting flexibility and film-forming properties to the thermosetting resin layer to be formed. , more preferably 1-8. The alkyl group may be a straight-chain alkyl group or a branched-chain alkyl group.
These monomers (a1') may be used alone or in combination of two or more.

From the viewpoint of improving the reliability of a cured sealant with a cured resin layer produced using a resin sheet, the monomer (a1′) contains an alkyl (meth)acrylate having an alkyl group having 1 to 3 carbon atoms. is preferred, and more preferably contains methyl (meth)acrylate.
From the above viewpoint, the content of the structural unit (a11) derived from an alkyl (meth)acrylate having an alkyl group having 1 to 3 carbon atoms is based on the total structural units (100% by mass) of the acrylic polymer (A1). , preferably 1 to 80% by mass, more preferably 5 to 80% by mass, still more preferably 10 to 80% by mass.

In addition, from the viewpoint of increasing the gloss value of the cured resin layer formed by thermosetting the formed thermosetting resin layer and improving the suitability for laser marking, the monomer (a1′) contains an alkyl group having 4 or more carbon atoms. It preferably contains an alkyl (meth)acrylate having an alkyl group having 4 to 6 carbon atoms, more preferably contains an alkyl (meth)acrylate having an alkyl group of 4 to 6 carbon atoms, and still more preferably contains a butyl (meth)acrylate.
From the above viewpoint, the content of the structural unit (a12) derived from an alkyl (meth)acrylate having an alkyl group having 4 or more carbon atoms (preferably 4 to 6, more preferably 4) is the acrylic polymer (A1) is preferably from 1 to 70% by mass, more preferably from 5 to 65% by mass, and still more preferably from 10 to 60% by mass, relative to the total structural units (100% by mass).

The content of the structural unit (a1) is preferably 50% by mass or more, more preferably 50 to 99% by mass, still more preferably 55% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1). to 90% by mass, more preferably 60 to 90% by mass.

The monomer (a2') is preferably one or more selected from hydroxyl group-containing monomers and epoxy group-containing monomers.
The monomer (a2') may be used alone or in combination of two or more.

Examples of hydroxy group-containing monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl ( hydroxyalkyl (meth)acrylates such as meth)acrylate and 4-hydroxybutyl (meth)acrylate; and unsaturated alcohols such as vinyl alcohol and allyl alcohol.
Among these, the hydroxy group-containing monomer is preferably hydroxyalkyl (meth)acrylate, more preferably 2-hydroxyethyl (meth)acrylate.

Examples of epoxy-containing monomers include glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, and 3-epoxycyclo-2-hydroxypropyl (meth)acrylate. epoxy group-containing (meth)acrylates such as; glycidyl crotonate, allyl glycidyl ether, and the like;
Among these, the epoxy-containing monomer is preferably epoxy group-containing (meth)acrylate, more preferably glycidyl (meth)acrylate.

The content of the structural unit (a2) is preferably 1 to 50% by mass, more preferably 5 to 45% by mass, still more preferably 10 to 40% by mass, more preferably 10 to 30% by mass.

The acrylic polymer (A1) may have structural units derived from monomers other than the above structural units (a1) and (a2) as long as the effects of the present invention are not impaired.
Other monomers include, for example, vinyl acetate, styrene, ethylene, α-olefins and the like.

<Thermosetting component (B)>
The thermosetting component (B) is a compound having a mass-average molecular weight of less than 20,000, and serves to thermoset the formed thermosetting resin layer to form a hard cured resin layer.
The weight average molecular weight (Mw) of the curable component (B) is preferably 10,000 or less, more preferably 100 to 10,000.

The thermosetting component (B) includes an epoxy compound (B1), which is a compound having an epoxy group, and a thermosetting resin sheet from the viewpoint of suppressing warpage and producing a cured sealing body having a flat surface. It preferably contains an agent (B2), and more preferably contains a curing accelerator (B3) together with the epoxy compound (B1) and the thermosetting agent (B2).

Examples of the epoxy compound (B1) include polyfunctional epoxy resins, bisphenol A diglycidyl ether and hydrogenated products thereof, ortho-cresol novolak epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, and bisphenol A type epoxy resins. , bisphenol F-type epoxy resins, phenylene skeleton type epoxy resins, and other epoxy compounds having at least two functionalities in the molecule and having a weight average molecular weight of less than 20,000.
The epoxy compound (B1) may be used alone or in combination of two or more.

The content of the epoxy compound (B1) is the polymer component (A ) to 100 parts by mass, preferably 1 to 500 parts by mass, more preferably 3 to 300 parts by mass, still more preferably 10 to 150 parts by mass, and even more preferably 20 to 120 parts by mass.

The thermosetting agent (B2) functions as a curing agent for the epoxy compound (B1).
The thermosetting agent (B2) is preferably a compound having two or more functional groups capable of reacting with epoxy groups in one molecule.
Such functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups, acid anhydrides, and the like. Among these, a phenolic hydroxyl group, an amino group, or an acid anhydride is preferable from the viewpoint of suppressing warpage and producing a curable sealing body with a cured resin film having a flat surface and producing an adhesive laminate. A phenolic hydroxyl group or an amino group is more preferred, and an amino group is even more preferred.

Examples of phenolic thermosetting agents having phenolic groups include polyfunctional phenolic resins, biphenols, novolak phenolic resins, dicyclopentadiene phenolic resins, Zyloc phenolic resins, and aralkylphenolic resins.
Examples of the amine-based thermosetting agent having an amino group include dicyandiamide (DICY).
These thermosetting agents (B2) may be used alone or in combination of two or more.

The content of the thermosetting agent (B2) is 100 mass of the epoxy compound (B1) from the viewpoint of suppressing warping and making it an adhesive laminate capable of producing a cured sealing body with a cured resin film having a flat surface. part, preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass.

The curing accelerator (B3) is a compound having a function of increasing the speed of thermosetting when thermosetting the thermosetting resin layer to be formed.
Examples of the curing accelerator (B3) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, imidazoles such as 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; tributylphosphine, diphenylphosphine, triphenylphosphine and the like organic phosphines; tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate;
These curing accelerators (B3) may be used alone or in combination of two or more.

The content of the curing accelerator (B3) is the amount of the epoxy compound (B1) and the heat curing agent (B2) from the viewpoint of suppressing warping and making it possible to produce a cured sealing body having a flat surface. It is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 6 parts by mass, and still more preferably 0.3 to 4 parts by mass, relative to the total amount of 100 parts by mass.

<Colorant (C)>
The thermosetting resin composition used in one aspect of the present invention may further contain a coloring agent (C).
When the thermosetting resin layer formed from the thermosetting resin composition containing the coloring agent (C) is thermally cured to form a cured resin layer, the cured resin layer absorbs infrared rays and the like generated from surrounding devices. It can be shielded to prevent malfunction of the sealing object (semiconductor chip, etc.).

Organic or inorganic pigments and dyes can be used as the colorant (C).
Any dyes such as acid dyes, reactive dyes, direct dyes, disperse dyes, and cationic dyes can be used as dyes.
Moreover, the pigment is not particularly limited, and can be appropriately selected from known pigments and used.
Among these, black pigments are preferable from the viewpoint of good shielding properties against electromagnetic waves and infrared rays, and from the viewpoint of further improving identifiability by a laser marking method.
Examples of black pigments include carbon black, iron oxide, manganese dioxide, aniline black, and activated carbon. Carbon black is preferred from the viewpoint of increasing the reliability of semiconductor chips.
These coloring agents (C) may be used alone or in combination of two or more.

However, in the thermosetting resin composition used in one aspect of the present invention, the content of the colorant (C) is 8% by mass with respect to the total amount (100% by mass) of the active ingredients in the thermosetting resin composition. It is preferably less than
When the content of the coloring agent (C) is less than 8% by mass, it is possible to obtain a resin sheet in which the presence or absence of cracks on the surface of the chips and chipping can be visually confirmed.
From the above viewpoint, in the thermosetting resin composition used in one aspect of the present invention, the content of the colorant (C) is preferably based on the total amount (100% by mass) of the active ingredients in the thermosetting resin composition. is less than 5% by weight, more preferably less than 2% by weight, even more preferably less than 1% by weight, even more preferably less than 0.5% by weight.

In addition, from the viewpoint of exhibiting a shielding effect against infrared rays and the like in the cured resin layer formed by thermosetting the thermosetting resin layer to be formed, the content of the coloring agent (C) is the active ingredient of the thermosetting resin composition. With respect to the total amount (100% by mass) of preferably 0.01% by mass or more, more preferably 0.05% by mass or more, still more preferably 0.10% by mass or more, still more preferably 0.15% by mass or more is.

<Coupling agent (D)>
The thermosetting resin composition used in one aspect of the present invention may further contain a coupling agent (D).
A thermosetting resin layer formed from a thermosetting resin composition containing a coupling agent (D) can improve adhesion to an object to be sealed when the object to be sealed is placed. A cured resin layer obtained by thermosetting a thermosetting resin layer can also improve water resistance without impairing heat resistance.

The coupling agent (D) is preferably a compound that reacts with the functional groups possessed by the polymerizable component (A) or the thermosetting component (B), and specifically, is preferably a silane coupling agent.
Silane coupling agents include, for example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl). ethyltrimethoxysilane, 3-(methacryloxypropyl)trimethoxysilane, 3-aminopropyltrimethoxysilane, N-6-(aminoethyl)-3-aminopropyltrimethoxysilane, N-6-(aminoethyl)- 3-aminopropylmethyldiethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-tri ethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane and the like.
These coupling agents (D) may be used alone or in combination of two or more.

The molecular weight of the coupling agent (D) is preferably 100 to 15,000, more preferably 125 to 10,000, more preferably 150 to 5,000, still more preferably 175 to 3,000, still more preferably 200. ~2,000.

The content of the coupling agent (D) is preferably 0.01 to 10% by mass, more preferably 0.05 to 7% by mass, relative to the total amount (100% by mass) of the active ingredients of the thermosetting resin composition. %, more preferably 0.10 to 4% by mass, and even more preferably 0.15 to 2% by mass.

<Inorganic filler (E)>
The thermosetting resin composition used in one aspect of the present invention further contains an inorganic filler (E) from the viewpoint of forming a resin sheet capable of suppressing warpage and producing a cured sealing body having a flat surface. preferably.
By forming the thermosetting resin layer from the thermosetting resin composition containing the inorganic filler (E), when the sealing material is thermally cured, the shrinkage stress between the two surfaces of the cured sealing body The degree of thermosetting of the thermosetting resin layer can be adjusted so that the difference becomes small. As a result, it becomes possible to manufacture a cured sealing body having a flat surface while suppressing warpage.
Moreover, the thermal expansion coefficient of the cured resin layer formed by thermosetting the thermosetting resin layer formed can be adjusted to an appropriate range, and the reliability of the sealing object can be improved. Also, the moisture absorption rate of the cured resin layer can be reduced.

Examples of the inorganic filler (E) include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, beads obtained by spheroidizing these powders, single crystal fibers, glass fibers, and the like. Non-thermally expandable particles are included.
These inorganic fillers (E) may be used alone or in combination of two or more.
Among these, silica or alumina is preferable from the viewpoint of forming a resin sheet capable of suppressing warpage and producing a cured sealing body having a flat surface.

The average particle size of the inorganic filler (E) is preferably 0.3 to 50 μm, more preferably 0, from the viewpoint of improving the gloss value of the cured resin film formed by thermosetting the thermosetting resin layer to be formed. 0.5 to 30 μm, more preferably 0.7 to 10 μm.

The content of the inorganic filler (E) is the total amount of the active ingredients of the thermosetting resin composition (100 %), preferably 25 to 80% by mass, more preferably 30 to 70% by mass, still more preferably 40 to 65% by mass, and even more preferably 45 to 60% by mass.

<Other additives>
The thermosetting resin composition used in one aspect of the present invention further includes the above-described polymerizable component (A), thermosetting component (B), colorant (C), Other additives than the coupling agent (D) and the inorganic filler (E) (hereinafter referred to as components (A) to (E)) may be contained.
Additives other than components (A) to (E) include, for example, cross-linking agents, leveling agents, plasticizers, antistatic agents, antioxidants, ion trapping agents, gettering agents, chain transfer agents, and the like. mentioned.
The total content of other additives other than components (A) to (E) is preferably 0 to 20% by mass, more than It is preferably 0 to 10% by mass, more preferably 0 to 5% by mass.

<Base material>
The resin sheet of one embodiment of the present invention may have a base material together with the thermosetting resin layer.
The thickness of the substrate used in one aspect of the present invention is preferably 10-500 μm, more preferably 15-300 μm, and even more preferably 20-200 μm.

Examples of the base material used in one embodiment of the present invention include a sheet-shaped material composed of one or more selected from paper materials, resins, metals, and the like, and a resin base material containing a resin is preferable.
Examples of the paper material include thin paper, medium quality paper, fine paper, impregnated paper, coated paper, art paper, parchment paper, and glassine paper.
Examples of the resin constituting the resin substrate include polyolefin resins such as polyethylene and polypropylene; vinyl-based resins such as polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl acetate copolymer, and ethylene-vinyl alcohol copolymer. Resin; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polystyrene; acrylonitrile-butadiene-styrene copolymer; cellulose triacetate; polyether ether ketone; polyether sulfone; polyphenylene sulfide; polyimide-based resins such as polyetherimide and polyimide; polyamide-based resins; acrylic resins;
Examples of metals include aluminum, tin, chromium, and titanium.

In addition to the resins described above, the resin substrate may contain substrate additives such as ultraviolet absorbers, light stabilizers, antioxidants, antistatic agents, slip agents, antiblocking agents, and colorants. .

The substrate used in the present invention may be made of one kind of material, or may be made of two or more kinds of materials.
Examples of the base material formed from two or more materials include those obtained by laminating a paper material with a thermoplastic resin such as polyethylene, and those obtained by forming a metal film on the surface of a resin base material containing a resin. .
As a method for forming the metal layer, for example, a method of depositing the above metal by a PVD method such as vacuum deposition, sputtering, or ion plating, or a method of attaching a metal foil made of the above metal using a general adhesive. and the like.

In addition, as in the resin sheet 1a shown in FIG. 1(a), when the thermosetting resin layer is laminated on the base material, the adhesion between the base material and the thermosetting resin layer is improved. Therefore, the surface of the base material may be subjected to a surface treatment such as an oxidation method or roughening method, an easy-adhesion treatment, or a primer treatment.

<Adhesive layer>
The resin sheet of one embodiment of the present invention may further have an adhesive layer.
In one aspect of the present invention, the adhesive strength of the pressure-sensitive adhesive layer is preferably 0.10 to 10.0 N/25 mm, more preferably 0.15 to 8.0 N/25 mm, still more preferably 0.20 to 6.0 N /25 mm, more preferably 0.25 to 4.0 N/25 mm.
In addition, in this specification, adhesive strength means the value measured by the method as described in an Example.
Further, for example, when the resin sheet 1d shown in FIG. It is preferably within the above range.

In one aspect of the present invention, the thickness of the adhesive layer is preferably 1-100 μm, more preferably 3-50 μm, and even more preferably 5-25 μm.

The adhesive layer can be formed from an adhesive composition containing an adhesive resin.
The adhesive resin used in one embodiment of the present invention may be a polymer that has adhesiveness by itself and has a mass average molecular weight (Mw) of 10,000 or more. Examples of adhesive resins include acrylic resins, urethane resins, rubber resins such as polyisobutylene resins, polyester resins, olefin resins, silicone resins, and polyvinyl ether resins.
These adhesive resins may be used alone or in combination of two or more.

The mass average molecular weight (Mw) of the adhesive resin used in one aspect of the present invention is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000, and still more preferably 30,000 to 30,000, from the viewpoint of improving adhesive strength. 1 million.

Moreover, the pressure-sensitive adhesive composition may further contain additives for pressure-sensitive adhesives depending on the type of pressure-sensitive adhesive resin used.
Examples of such adhesive additives include cross-linking agents, tackifiers, polymerizable compounds, polymerization initiators, antioxidants, softeners (plasticizers), rust inhibitors, pigments, dyes, retarders, Examples include reaction accelerators (catalysts), ultraviolet absorbers, antistatic agents, and the like.

The content of the adhesive resin is preferably 35% by mass or more, more preferably 50% by mass or more, still more preferably 60% by mass or more, relative to the total amount (100% by mass) of the active ingredients of the adhesive composition. More preferably, it is 70% by mass or more.

The pressure-sensitive adhesive layer of the resin sheets having configurations such as resin sheets 1b, 1c, and 1d in FIG. 1 is an energy-ray-curable pressure-sensitive adhesive composition containing an energy-ray-curable adhesive resin and a photopolymerization initiator It may be a layer formed from
By forming a pressure-sensitive adhesive layer formed from such an energy ray-curable pressure-sensitive adhesive composition, after forming a cured resin layer and a cured sealing body, an energy ray is irradiated to reduce the adhesive force. , can be easily separated between the adhesive layer and the cured resin layer.
In addition, although an ultraviolet-ray and an electron beam are mentioned as an energy ray, an ultraviolet-ray is preferable.

The energy ray-curable pressure-sensitive adhesive composition is a composition containing an energy ray-curable pressure-sensitive adhesive resin obtained by introducing a polymerizable functional group such as a (meth)acryloyl group or a vinyl group into the side chain of the above pressure-sensitive adhesive resin. or a composition containing a monomer or oligomer having a polymerizable functional group.
These compositions preferably further contain a photopolymerization initiator.

Examples of photopolymerization initiators include 1-hydroxy-cyclohexyl-phenyl-ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzylphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyrol. nitrile, dibenzyl, diacetyl, 8-chloroanthraquinone and the like.
These photopolymerization initiators may be used alone or in combination of two or more.
The content of the photopolymerization initiator is preferably 0.01 to 10 parts by mass, more preferably 0, per 100 parts by mass of the energy ray-curable adhesive resin or 100 parts by mass of the monomer or oligomer having a polymerizable functional group. 0.03 to 5 parts by mass, more preferably 0.05 to 2 parts by mass.

[How to use the adhesive laminate]
By using the resin sheet of the present invention for producing a cured sealant, it is possible to produce a cured sealant having a flat surface by suppressing warping with improved productivity.
Therefore, the present invention can also provide a method for using a resin sheet shown in [I] below.
[I] A method for using the resin sheet of the present invention described above,
placing an object to be sealed on the surface of the thermosetting resin layer;
covering the object to be sealed and the surface of the thermosetting resin layer at least in the periphery of the object to be sealed with a sealing material;
A method of using a resin sheet, wherein the sealing material is thermally cured to form a cured sealing body containing the sealing object.

In the method of use described in [I] above, when the sealing material is thermally cured, the thermosetting resin layer is also thermally cured to form a cured resin layer. A sealed body is preferable.
By using the resin sheet of the present invention described above, it is possible to produce a cured sealing body (a cured sealing body with a cured resin film) having a flat surface while suppressing warpage, with improved productivity.
In the method of use described in [I] above, the preferred structure of the resin sheet is as described above. , "Method for producing cured sealing body with cured resin layer".

[Method for producing cured sealing body with cured resin film]
A method for producing a cured sealant with a cured resin film using the resin sheet of the present invention includes a method comprising the following steps (i) to (iii).
• Step (i): A step of placing an object to be sealed on a part of the surface of the thermosetting resin layer of the resin sheet.
• Step (ii): a step of covering the object to be sealed and at least the surface of the thermosetting resin layer in the periphery of the object to be sealed with a sealing material.
- Step (iii): thermosetting the sealing material to form a cured sealing body containing the sealing object, and also thermosetting the thermosetting resin layer to form a cured resin layer; A step of obtaining a cured sealing body with a cured resin layer.
FIG. 2 is a schematic cross-sectional view showing a process of manufacturing a cured sealing body with a cured resin layer using the resin sheet 1d shown in FIG. 1(d). Each of the above steps will be described below with appropriate reference to FIG.

<Step (i)>
Step (i) is a step of placing an object to be sealed on a portion of the surface of the thermosetting resin layer of the resin sheet.
In FIG. 2(a), the adhesive surface of the second adhesive layer 32 of the resin sheet 1d is attached to the support 100, and the sealing object 60 is placed on part of the surface of the thermosetting resin layer 10. It shows the state of
2(a) shows an example using the resin sheet 1d shown in FIG. 1(d). ), the support, the resin sheet, and the object to be sealed are laminated or placed in this order.

It should be noted that step (i) is preferably carried out at a temperature at which the thermosetting resin layer is not thermally cured, and the specific temperature condition for step (i) is usually 10 to 80°C.

When using a resin sheet having a second pressure-sensitive adhesive layer on the support side, as in the resin sheet 1d of FIG. It is preferably attached.
Therefore, the support is preferably plate-like.
In this case, the area of the adhesive surface of the second adhesive layer and the surface of the support on the side to be attached is preferably equal to or greater than the area of the adhesive surface of the second adhesive layer, as shown in FIG. .

The material that constitutes the support is selected according to the type of sealing object and the type of sealing material used in step (ii), taking into consideration the required properties such as mechanical strength and heat resistance. Selected as appropriate.
Specific materials constituting the support include, for example, metallic materials such as SUS; nonmetallic inorganic materials such as glass and silicon wafers; epoxy resins, ABS resins, acrylic resins, engineering plastics, super engineering plastics, polyimide resins, Resin materials such as polyamide-imide resins; composite materials such as glass epoxy resins; among these, SUS, glass, and silicon wafers are preferred.
Engineering plastics include nylon, polycarbonate (PC), and polyethylene terephthalate (PET).
Super engineering plastics include polyphenylene sulfide (PPS), polyethersulfone (PES), polyetheretherketone (PEEK), and the like.

The thickness of the support is appropriately selected according to the type of the sealing object, the type of sealing material used in step (ii), etc., but is preferably 20 μm or more and 50 mm or less, more preferably It is 60 μm or more and 20 mm or less.

On the other hand, the objects to be sealed placed on part of the surface of the thermosetting resin layer include, for example, semiconductor chips, semiconductor wafers, compound semiconductors, semiconductor packages, electronic parts, sapphire substrates, displays, and panel substrates. etc.

For example, when the object to be sealed is a semiconductor chip, a semiconductor chip with a cured resin layer can be produced by using the resin sheet of the present invention.
A conventionally known semiconductor chip can be used, and an integrated circuit composed of circuit elements such as transistors, resistors, and capacitors is formed on the circuit surface.
The semiconductor chip is preferably placed so that the back surface opposite to the circuit surface is covered with the surface of the thermosetting resin layer. In this case, after the mounting, the circuit surface of the semiconductor chip is exposed.
A known device such as a flip chip bonder or a die bonder can be used for mounting the semiconductor chip.
The layout of arrangement of semiconductor chips, the number of arrangement, etc. may be appropriately determined according to the form of the intended package, the production volume, and the like.

Here, as in FOWLP, FOPLP, etc., a semiconductor chip is covered with a sealing material in an area larger than the chip size, and a rewiring layer is formed not only on the circuit surface of the semiconductor chip but also on the surface area of the sealing material. It is preferably applied to packages that
Therefore, the semiconductor chips are placed on a portion of the surface of the thermosetting resin layer, and a plurality of semiconductor chips are placed on the surface in a state of being aligned at regular intervals. More preferably, a plurality of semiconductor chips are mounted on the surface in a state of being arranged in a matrix of multiple rows and multiple columns at regular intervals.
The distance between the semiconductor chips may be appropriately determined according to the form of the intended package.

<Step (ii)>
Step (ii) is a step of covering the object to be sealed and the surface of the thermosetting resin layer at least around the object to be sealed with a sealing material.
The sealing material also fills the gaps between the plurality of semiconductor chips while covering the entire exposed surface of the sealing object.
FIG. 2B shows a state in which the sealing material 70 covers the entire surface of the sealing object 60 and the thermosetting resin layer 10 .
In this step, as shown in FIG. 2B , the surface of the thermosetting resin layer 10 may be covered with a sealing material 70 so as to cover the entire surface, which is the periphery of the sealing object 60 . A portion of the surface of the thermosetting resin layer 10 may be covered with the sealing material 70 .

The encapsulant has the function of protecting the object to be sealed and the elements associated therewith from the external environment.
The sealing material used in the manufacturing method of the present invention is a thermosetting sealing material containing a thermosetting resin.
Further, the sealing material may be in the form of granules, pellets, film, or the like at room temperature, or may be in the form of a liquid composition. A sealing resin film, which is the sealing material of the above, is preferable.

As the coating method, it is possible to appropriately select and apply from among the methods applied to the conventional sealing process according to the type of the sealing material, for example, roll lamination method, vacuum press method, vacuum lamination method , a spin coating method, a die coating method, a transfer molding method, a compression molding method, and the like can be applied.

<Step (iii)>
In the step (iii), the sealing material is thermally cured to form a cured sealing body containing the sealing object, and the thermosetting resin layer is also thermally cured to form a cured resin layer. It is a step of obtaining a hardened sealed body with a .
In addition, the step (iii) may be carried out separately from the preceding step (ii), or may be carried out simultaneously.
For example, when the sealing material is heated in the preceding step (ii), the present step may also be performed by the heating, and the sealing material may be thermally cured as it is.

As shown in FIG. 2C, in this step, the sealing material is thermally cured to form a cured sealing body 71 including the sealing object 60, and the thermosetting resin layer is also thermally cured, A cured resin layer 11 is formed.
In this process, the thermosetting resin layer is thermally cured together with the sealing material, so the difference in shrinkage stress between the two surfaces of the cured sealing body can be reduced, and the warpage that occurs in the cured sealing body can be effectively reduced. can be suppressed to

The temperature conditions in step (iii) may be at or above the temperature at which the sealing material and the thermosetting resin layer are thermally cured. , which is set appropriately, is usually 120 to 220°C.

After that, as shown in FIG. 2D, the cured resin layer formed by thermosetting the thermosetting resin layer is separated at the interface between the first adhesive layer 31 and the cured resin layer 11, A cured sealing body 80 with a cured resin layer having a cured sealing body 71 including the sealing object 60 can be obtained.
Here, when the first pressure-sensitive adhesive layer 31 is a layer formed from an energy ray-curable pressure-sensitive adhesive composition, it can be easily separated by irradiating it with an energy ray.

After separation from the support, when a general adhesive sheet is used, the cured encapsulant may warp. However, since the cured sealing body with the cured resin layer obtained using the resin sheet of the present invention has the cured resin layer, it is possible to effectively suppress warpage that may occur in the cured sealing body.

The cured encapsulant with the cured resin layer thus obtained is then subjected to a step of grinding the cured encapsulant until the circuit surface of the semiconductor chip is exposed, and performing rewiring on the circuit surface. , forming an external electrode pad, and connecting the external electrode pad and the external terminal electrode.
Moreover, after the external terminal electrodes are connected to the hardening sealing body, the hardening sealing body can be separated into individual pieces to manufacture semiconductor devices.

The present invention will be specifically described by the following examples, but the present invention is not limited to the following examples. The physical property values in the production examples and examples below are values measured by the following methods.

<Mass average molecular weight (Mw)>
Using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name “HLC-8020”), measurement was performed under the following conditions, and the values measured in terms of standard polystyrene were used.
(Measurement condition)
・ Column: "TSK guard column HXL-L", "TSK gel G2500HXL", "TSK gel G2000HXL", "TSK gel G1000HXL" (both manufactured by Tosoh Corporation) are sequentially connected ・Column temperature: 40 ° C.
・Developing solvent: tetrahydrofuran ・Flow rate: 1.0 mL/min

<Measurement of thickness of each layer>
It was measured using a constant pressure thickness measuring instrument manufactured by Teclock Co., Ltd. (model number: “PG-02J”, standard specifications: JIS K6783, Z1702, Z1709).

<Storage elastic modulus E′ of cured resin layer after thermosetting of thermosetting resin layer>
After laminating the thermosetting resin layer to a thickness of 200 μm, put it in an oven in an air atmosphere and heat it at 130 ° C. for 2 hours to heat-harden the thermosetting resin layer with a thickness of 200 μm. A cured resin layer was formed.
Using a dynamic viscoelasticity measuring device (manufactured by TA Instruments, product name “DMAQ800”), the test start temperature is 0 ° C., the test end temperature is 300 ° C., the temperature increase rate is 3 ° C./min, the frequency is 11 Hz, and the amplitude is 20 μm. The storage elastic modulus E' of the formed cured resin layer was measured at 23°C under the conditions of .

<Measurement of adhesive strength>
A 50 μm-thick PET film (manufactured by Toyobo Co., Ltd., product name “Cosmoshine A4100”) was laminated on the surface of the adhesive layer or thermosetting resin layer formed on the release film.
Then, the release film is removed, and the surface of the exposed adhesive layer or thermosetting resin layer is attached to a stainless steel plate (SUS304, 360 polishing) as an adherend. ) under the same environment for 24 hours, the adhesive force at 23° C. was measured at a pulling speed of 300 mm/min by a 180° peeling method in accordance with JIS Z0237:2000.

The release materials used in the following production examples are as follows.
<Release material>
· Heavy release film: manufactured by Lintec Corporation, product name "SP-PET382150", a polyethylene terephthalate (PET) film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 µm.
· Light release film: product name “SP-PET381031” manufactured by Lintec Corporation, a PET film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 μm.

Production example 1
(1) Preparation of thermosetting resin composition Each component of the type and amount shown below (both "active ingredient ratio") is blended, further diluted with methyl ethyl ketone, stirred uniformly, and the solid content concentration ( A solution of a thermosetting resin composition having an active ingredient concentration of 61% by mass was prepared.
Acrylic polymer: Amount = 26.07 parts by mass Acrylic obtained by copolymerizing 10 parts by mass of n-butyl acrylate, 70 parts by mass of methyl acrylate, 5 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate based polymer (mass average molecular weight: 400,000, glass transition temperature: -1°C), corresponding to component (A1) above.
Epoxy compound (1): amount = 10.4 parts by mass Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER828”, epoxy equivalent = 184 to 194 g / eq), equivalent to the above component (B1) .
Epoxy compound (2): Amount = 5.2 parts by mass Dicyclopentadiene type epoxy resin (manufactured by DIC Corporation, product name “Epiclon HP-7200HH”, epoxy equivalent = 255 to 260 g / eq), the above component (B1 ).
Epoxy compound (3): amount = 1.7 parts by mass Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER1055”, epoxy equivalent = 800 to 900 g / eq), equivalent to the above component (B1) .
・Heat curing agent: Amount = 0.42 parts by mass Dicyandiamide (manufactured by ADEKA, product name “ADEKA HARDNER EH-3636AS”, active hydrogen content = 21 g/eq), equivalent to component (B2) above.
Curing accelerator: Amount = 0.42 parts by mass 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., product name “Curesol 2PHZ”), equivalent to the component (B3) above.
Colorant: Amount = 0.20 parts by mass Carbon black (manufactured by Mitsubishi Chemical Corporation, product name “#MA650”, average particle size = 28 nm), equivalent to component (C) above.
・ Silane coupling agent: amount = 0.09 parts by mass 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name “KBM403”), molecular weight = 236.64, to the above component (D) Equivalent.
- Inorganic filler: amount = 55.5 parts by mass Silica filler (manufactured by Admatechs, product name "SC2050MA", average particle size = 0.5 µm), equivalent to component (E) above.

(2) Formation of thermosetting resin layer A solution of the thermosetting resin composition prepared in (1) above is applied to the release-treated surface of the light release film to form a coating film, and the coating film is formed. It was dried at 120° C. for 2 minutes to form a thermosetting resin layer with a thickness of 25 μm.
The adhesive strength of the formed thermosetting resin layer was 0.5 N/25 mm.
Moreover, the storage elastic modulus E' at 23°C of the cured resin layer obtained by thermosetting the thermosetting resin layer was 6.5 x ^109Pa .

Production example 2
(1) Preparation of adhesive composition To 100 parts by mass of the following acrylic copolymer (i) solid content, which is an adhesive resin, 5.0 parts by mass of the following isocyanate cross-linking agent (i) (solid content ratio) was blended, diluted with toluene, and uniformly stirred to prepare a pressure-sensitive adhesive composition having a solid content concentration (active ingredient concentration) of 25% by mass.
-Acrylic copolymer (i): 2-ethylhexyl acrylate (2EHA)/2-hydroxyethyl acrylate (HEA) = 80.0/20.0 (mass ratio) having structural units derived from raw material monomers, Acrylic copolymer with a mass average molecular weight of 600,000.
· Isocyanate cross-linking agent (i): manufactured by Tosoh Corporation, product name "Coronate L", solid content concentration: 75% by mass.

(2) Formation of adhesive layer The adhesive composition prepared in (1) above is applied to the surface of the release layer of the light release film to form a coating film, and the coating film is heated at 100 ° C. for 60 seconds. It was dried to form a first pressure-sensitive adhesive layer with a thickness of 5 μm.
Also, a second pressure-sensitive adhesive layer having a thickness of 5 μm was formed in the same manner on the surface of the release agent layer of the heavy release film.
The adhesive strength of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer measured based on the above method was 0.3 N/25 mm for both.

Example 1
The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer formed in Production Example 2 are formed on both sides of a base material, a polyethylene terephthalate (PET) film having a thickness of 50 μm (manufactured by Toyobo Co., Ltd., product name “Cosmoshine A4100”). affixed to each.
Then, the light release film laminated on the first adhesive layer is removed, and the exposed adhesive surface of the first adhesive layer is bonded to the surface of the thermosetting resin layer formed in Production Example 1. , heavy release film/second pressure-sensitive adhesive layer/substrate/first pressure-sensitive adhesive layer/thermosetting resin layer/light release film were laminated in this order to obtain a resin sheet.

Example 2
A cured sealing body with a cured resin layer was produced by the following procedure.
(1) Placement of Semiconductor Chip The heavy release film of the resin sheet prepared in Example 1 was removed, and the exposed adhesive surface of the second adhesive layer was attached to a support (glass).
Then, the light release film of the resin sheet is also removed, and nine semiconductor chips (each chip size is 6.4 mm × 6.4 mm, chip thickness is 200 μm) are placed on the surface of the exposed thermosetting resin layer. (#2000)) were placed with a necessary interval so that the back surface of each semiconductor chip opposite to the circuit surface was in contact with the surface.

(2) Formation of Cured Encapsulant and Cured Resin Layer The nine semiconductor chips and the surface of the thermosetting resin layer on at least the periphery of the semiconductor chips are sealed with a thermosetting sealant, which is a sealing material. The sealing resin film was coated with a sealing resin film, and the sealing resin film was thermally cured using a vacuum heating and pressurizing laminator (manufactured by ROHM and HAAS, "7024HP5") to prepare a cured sealing body.
In addition, sealing conditions are as follows.
・Preheating temperature: 100°C for both table and diaphragm
・Evacuation: 60 seconds ・Dynamic press mode: 30 seconds ・Static press mode: 10 seconds ・Sealing temperature: 180°C
- Sealing time: 60 minutes The thermosetting resin layer was also cured under the above environment together with the thermosetting of the sealing resin film to form a cured resin layer.

(3) Separation of the cured resin layer and the first adhesive layer After the above (2), the cured resin layer formed by thermosetting the thermosetting resin layer and the first adhesive layer are separated at the interface, A cured sealing body with a cured resin layer was obtained.
The obtained cured sealing body with the cured resin layer was cooled to room temperature (25° C.), but no warpage was observed.

The resin sheet of the present invention is obtained by placing an object to be sealed such as a semiconductor chip on the surface of the thermosetting resin layer, covering it with a sealing material and curing it, and obtaining a cured sealing body containing the object to be sealed. It can be used for the production of Then, it is possible to manufacture a cured sealing body with a cured resin film, which suppresses warpage and has a flat surface, with improved productivity.

1a, 1b, 1c, 1d Resin sheet 10 Thermosetting resin layer 11 Cured resin layer 20 Base material 30, 31, 32 Adhesive layer 60 Sealing object 70 Sealing material 71 Cured sealing body 80 Curing with cured resin layer Sealing body 100 Support body

Claims (14)

a substrate;
a thermosetting resin layer formed from a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B) in this order;
The cured resin layer obtained by thermosetting the thermosetting resin layer has a storage elastic modulus E′ at 23° C. of 1.0×10 ⁷ to 1.0×10 ¹³ Pa,
An object to be sealed is placed on the surface of the thermosetting resin layer, and the object to be sealed and at least the surface of the thermosetting resin layer in the periphery of the object to be sealed are covered with a sealing material. Then, the sealing material is thermally cured to form a cured sealing body containing the sealing object, the thermosetting resin layer is thermally cured to form a cured resin layer, the sealing material and the thermosetting resin A resin sheet used for manufacturing a cured encapsulant, wherein the cured encapsulant with a cured resin layer is removed from the base material after the layer is thermally cured. 2. The resin sheet according to claim 1, wherein the thermosetting resin layer is also cured when the sealing material is cured to form a cured resin layer. The resin sheet according to claim 1 or 2, wherein the content of the coloring agent in the thermosetting resin composition is less than 8% by mass. The resin sheet according to any one of claims 1 to 3, wherein the thermosetting resin layer has a thickness of 1 to 500 µm. A method for using a resin sheet having a substrate and a thermosetting resin layer formed from a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B) in this order, ,
placing an object to be sealed on the surface of the thermosetting resin layer;
covering the object to be sealed and the surface of the thermosetting resin layer at least in the periphery of the object to be sealed with a sealing material;
The sealing material is thermally cured to form a cured sealing body containing the sealing object,
thermosetting the thermosetting resin layer to form a cured resin layer;
A method of using a resin sheet, wherein after thermosetting the sealing material and the thermosetting resin layer, the cured sealing body with the cured resin layer is removed from the base material. 6. The resin according to claim 5, wherein when the sealing material is thermoset, the thermosetting resin layer is also thermoset to form a cured resin layer to form a cured sealing body with a thermosetting resin layer. How to use the sheet. The method of using the resin sheet according to claim 5 or 6, wherein the content of the colorant in the thermosetting resin composition is less than 8% by mass. 8. Any one of claims 5 to 7, wherein the cured resin layer obtained by thermosetting the thermosetting resin layer has a storage elastic modulus E′ at 23° C. of 1.0×10 ⁷ to 1.0×10 ¹³ Pa. or a method of using the resin sheet according to item 1. The method of using the resin sheet according to any one of claims 5 to 8, wherein the thermosetting resin layer has a thickness of 1 to 500 µm. Using a resin sheet having a substrate and a thermosetting resin layer formed from a thermosetting resin composition containing a polymer component (A) and a thermosetting component (B) in this order, a cured resin A method for producing a cured sealing body with a layer, comprising the following steps.
- A step of placing an object to be sealed on the surface of the thermosetting resin layer; A step of thermally curing the sealing material to form a cured sealing body containing the sealing object, and a step of thermally curing the thermosetting resin layer to form a cured resin layer. a step of obtaining a cured sealing body with a cured resin layer and a step of removing the cured sealing body with the cured resin layer from the base material 11. The method for manufacturing a cured sealing body with a cured resin layer according to claim 10, wherein the thermosetting resin layer is also cured to form a cured resin layer when the sealing material is cured. 12. The method for producing a cured sealant with a cured resin layer according to claim 10 or 11, wherein the content of the colorant in the thermosetting resin composition is less than 8% by mass. 13. Any one of claims 10 to 12, wherein the cured resin layer obtained by thermosetting the thermosetting resin layer has a storage elastic modulus E′ at 23° C. of 1.0×10 ⁷ to 1.0×10 ¹³ Pa. The method for producing a cured sealing body with a cured resin layer according to any one of items. 14. The method for producing a cured sealant with a cured resin layer according to any one of claims 10 to 13, wherein the thermosetting resin layer has a thickness of 1 to 500 µm.